WO2020004219A1 - Dispositif de réglage de température d'appareil - Google Patents

Dispositif de réglage de température d'appareil Download PDF

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Publication number
WO2020004219A1
WO2020004219A1 PCT/JP2019/024488 JP2019024488W WO2020004219A1 WO 2020004219 A1 WO2020004219 A1 WO 2020004219A1 JP 2019024488 W JP2019024488 W JP 2019024488W WO 2020004219 A1 WO2020004219 A1 WO 2020004219A1
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WIPO (PCT)
Prior art keywords
heat
refrigerant
condenser
heat medium
return pipe
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Application number
PCT/JP2019/024488
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English (en)
Japanese (ja)
Inventor
功嗣 三浦
康光 大見
義則　毅
竹内　雅之
Original Assignee
株式会社デンソー
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Publication of WO2020004219A1 publication Critical patent/WO2020004219A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K11/00—Arrangement in connection with cooling of propulsion units
    • B60K11/02—Arrangement in connection with cooling of propulsion units with liquid cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes

Definitions

  • the present disclosure relates to a device temperature controller.
  • an evaporator for cooling a battery and a condenser provided above the evaporator are provided.
  • the evaporator and the condenser are connected in a ring shape by two pipes, and a refrigerant is provided therein.
  • a refrigerant is provided therein.
  • One of the two pipes forms a liquid-phase refrigerant passage through which the liquid-phase refrigerant flows from the condenser to the evaporator.
  • the other of the two pipes, other than the one forms a gas-phase refrigerant passage through which the gas-phase refrigerant flows from the evaporator to the condenser.
  • thermosiphon circuit when the battery generates heat, the liquid refrigerant in the evaporator absorbs heat from the battery and boils, and the battery is cooled by the latent heat of evaporation at that time.
  • the gas-phase refrigerant generated by the evaporator flows into the condenser through the gas-phase refrigerant passage.
  • the gas-phase refrigerant is cooled by the condenser and condensed.
  • the liquid-phase refrigerant generated in the condenser flows into the evaporator through the liquid-phase refrigerant passage by gravity.
  • the battery is cooled by circulating the refrigerant between the evaporator and the condenser.
  • the cross-sectional area of the gas-phase refrigerant passage in the gas-phase refrigerant passage through which the gas-phase refrigerant flows decreases. For this reason, pressure loss generated when the gas-phase refrigerant flows from the evaporator to the condenser through the gas-phase refrigerant passage increases. Therefore, the gas-phase refrigerant hardly rises inside the gas-phase refrigerant passage, and the gas-phase refrigerant hardly flows into the condenser.
  • the head difference is a difference between the refrigerant liquid level in the evaporator and the refrigerant liquid level in the liquid-phase refrigerant passage (or the condenser).
  • bubbles are generated from inside the liquid-phase refrigerant in the evaporator with the boiling of the refrigerant, and when the pressure loss inside the gas-phase refrigerant passage increases, the refrigerant liquid level in the evaporator decreases and Since the refrigerant liquid level in the liquid-phase refrigerant passage rises, the head difference increases.
  • the present disclosure aims to provide a cooling device with a reduced head difference.
  • an apparatus temperature controller includes an apparatus heat exchanger configured to be capable of exchanging heat between a target apparatus and a heat medium such that a heat medium evaporates when the target apparatus is cooled; A condenser that condenses the heat medium evaporated by the heat exchanger, a forward pipe that leads the heat medium condensed by the condenser to the heat exchanger for equipment, and a heat medium evaporated by the heat exchanger for equipment to the condenser And a heating unit for heating the heat medium flowing through the return pipe.
  • the heat medium flowing through the return pipe is vaporized by the heating unit, and the pressure loss inside the gas-phase refrigerant passage is reduced, so that the head difference can be reduced.
  • FIG. 3 is a Mollier diagram showing a state of a refrigerant for a refrigeration cycle of the device temperature controller of the first embodiment. It is the figure which showed the structure of the apparatus temperature control apparatus which does not have the conventional heating part.
  • FIG. 3 is a diagram for explaining the arrangement of Peltier elements. It is a figure showing composition of an apparatus temperature control device concerning an 11th embodiment. It is the figure which showed the cooler and secondary battery of the apparatus temperature control apparatus which concerns on 12th Embodiment. It is a figure showing a cooler and a secondary battery of a device temperature controller according to a thirteenth embodiment. It is the figure which showed the cooler and secondary battery of the apparatus temperature control apparatus which concern on 14th Embodiment. It is a figure for explaining arrangement of a heating part. It is a figure for explaining arrangement of a heating part.
  • FIGS. 1 An apparatus temperature controller according to a first embodiment will be described with reference to FIGS. 1 is mounted on a vehicle such as an electric vehicle or a hybrid vehicle. Then, in the present embodiment, the device temperature controller cools the secondary batteries 12a and 12b shown in FIG. That is, the objects to be cooled by the device temperature controller of the present embodiment are the secondary batteries 12a and 12b mounted on the electric vehicle.
  • the arrow DR1 indicates the up-down direction. In the arrow DR1, the up arrow indicates the upper side in the up-down direction of the vehicle, and the down arrow indicates the lower side in the up-down direction of the vehicle.
  • a cooling device for maintaining the secondary batteries 12a and 12b at a predetermined temperature or lower is required.
  • the battery temperature rises not only while the vehicle is running but also during parking in summer.
  • the power storage device is often arranged under the floor of the vehicle, under a trunk room, or the like, and although the amount of heat given to the secondary batteries 12a and 12b per unit time is small, the battery temperature gradually rises by leaving the battery for a long time. .
  • the life of the secondary batteries 12a, 12b is greatly reduced. Therefore, the battery temperature is maintained at a low temperature by cooling the secondary batteries 12a, 12b even while the vehicle is left. It is desired.
  • the secondary batteries 12a and 12b of the present embodiment are configured as an assembled battery in which a plurality of battery cells 13 are stacked in the traveling direction of the vehicle. The deterioration is biased, and the performance of the power storage device is reduced.
  • the input / output characteristics of the power storage device are determined according to the characteristics of the battery cell 13 that has deteriorated the most. Therefore, in order for the power storage device to exhibit desired performance over a long period of time, it is important to equalize the temperature to reduce temperature variations among the plurality of battery cells 13.
  • the secondary batteries 12a and 12b are cooled by the sensible heat of the air, so that the temperature difference between the upstream and downstream of the air flow becomes large, and the temperature variation between the battery cells 13 cannot be sufficiently suppressed. .
  • air cooling using cold air generated in a refrigeration cycle, or water cooling using cold water has a high cooling capacity, but the heat exchange part with the battery cell 13 is sensible heat cooling in either air cooling or water cooling. Temperature variation between the battery cells 13 cannot be sufficiently suppressed.
  • thermosiphon system in which the refrigerant for thermosiphon is cooled using a refrigeration cycle and the secondary batteries 12a and 12b are cooled by natural circulation of the refrigerant for thermosiphon. Has been adopted.
  • the device temperature controller of the present embodiment includes a thermosiphon 10 and a refrigeration cycle 20, as shown in FIG.
  • the thermosiphon 10 includes a cooler 14, a condenser 16, a heating unit 180, and a first circulation circuit 100 that circulates a thermosiphon refrigerant as a first heat medium. Then, the temperature of the secondary batteries 12a and 12b as target devices is adjusted by the phase change between the liquid phase and the gas phase of the thermosyphon refrigerant.
  • the first circulation circuit 100 has an outgoing pipe 101 and a return pipe 102.
  • the condenser 16 has a primary side circuit 16a and a secondary side circuit 16b.
  • the primary circuit 16a of the condenser 16 is provided with a condenser inlet 161 for flowing the thermosiphon refrigerant into the primary circuit 16a and a condenser outlet 162 for discharging the thermosiphon refrigerant from the primary circuit 16a.
  • the secondary circuit 16b of the condenser 16 has an inlet 163 through which the refrigerant for the refrigeration cycle flows into the secondary circuit 16b, and an outlet 134 from which the refrigerant for the refrigeration cycle flows out from the secondary circuit 16b. Have been.
  • the primary circuit 16a of the condenser 16, the outgoing pipe 101, the cooler 14, and the return pipe 102 are connected in a ring shape to form a thermosiphon circuit in which a refrigerant for thermosiphon circulates.
  • the first circulation circuit 100 of the present embodiment is filled with a thermosiphon refrigerant.
  • the thermosiphon refrigerant naturally circulates through the first circulation circuit 100, and the device temperature controller adjusts the temperature of the secondary batteries 12a and 12b by a phase change between the liquid phase and the gas phase of the thermosiphon refrigerant.
  • the secondary batteries 12a and 12b are cooled by the phase change of the refrigerant for the thermosiphon.
  • the refrigerant charged in the first circulation circuit 100 is, for example, a chlorofluorocarbon-based refrigerant such as HFO-1234yf or HFC-134a.
  • a chlorofluorocarbon-based refrigerant such as HFO-1234yf or HFC-134a
  • various working fluids other than the chlorofluorocarbon-based refrigerant such as water and ammonia may be used as the refrigerant.
  • the cooler 14 is disposed between the secondary batteries 12a and 12b.
  • the cooler 14 corresponds to an equipment heat exchanger.
  • the cooler 14 cools the secondary batteries 12a and 12b by exchanging heat between the heat of the secondary batteries 12a and 12b and the heat of the thermosiphon refrigerant.
  • the cooler 14 has a main body 143 made of, for example, a metal having high thermal conductivity.
  • the main body 143 of the cooler 14 has an inlet 141 through which the thermosyphonic refrigerant flows and an outlet 142 through which the thermosiphonic refrigerant flows out.
  • the outlet 142 is arranged above the inlet 141 in the up-down direction.
  • the outward pipe 101 connects between a condenser outlet 162 formed in the primary circuit 16 a of the condenser 16 and an inflow port 141 formed in the main body 143 of the cooler 14.
  • the return pipe 102 connects between an outlet 142 formed in the main body 143 of the cooler 14 and a condenser inlet 161 formed in the primary circuit 16 a of the condenser 16.
  • the heating unit 180 is arranged in the return pipe 102 and exchanges heat between the refrigerant for the refrigeration cycle flowing out of the condenser 21 of the refrigeration cycle 20 and the refrigerant for the thermosiphon flowing into the return pipe 102 from the cooler 14 of the thermosiphon 10. Heat the refrigerant for thermosiphon.
  • the gaseous refrigerant flows from the outlet 142 through the return pipe 102 to the condenser.
  • the refrigerant flows into the primary circuit 16a of the condenser 16 from the 16 condenser inlets 161.
  • thermosyphon refrigerant flowing into the primary circuit 16a is condensed by heat exchange with the refrigeration cycle refrigerant inside the secondary circuit 16b of the condenser 16 to become a liquid-phase refrigerant. Then, the air flows into the main body 143 of the cooler 14 from the inlet 141 formed in the main body 143 of the cooler 14 from the condenser outlet 162 of the primary circuit 16 a of the condenser 16 through the outward pipe 101.
  • the refrigeration cycle 20 includes a second circulation circuit 200 that circulates a refrigeration cycle refrigerant as a second heat medium, and a compressor 23 that compresses and discharges the refrigeration cycle refrigerant in the second circulation circuit 200.
  • the refrigeration cycle 20 includes a condenser 21 for exchanging heat between the refrigeration cycle refrigerant discharged from the compressor 23 and the outside air to radiate the refrigeration cycle refrigerant discharged from the compressor 23.
  • an expansion valve 22 is provided for reducing the pressure of the refrigerant for the refrigeration cycle flowing out of the condenser 21 and flowing the refrigerant into the secondary circuit 16 b of the condenser 16.
  • the condenser 21 corresponds to a radiating heat exchanger that exchanges heat between the refrigeration cycle refrigerant discharged from the compressor 23 and air and radiates heat of the refrigeration cycle refrigerant. Between the condenser 21 and the expansion valve 22, a heating unit 180 that heats the liquid-phase refrigeration cycle refrigerant flowing from the cooler 14 of the thermosiphon 10 into the return pipe 102 is arranged.
  • the circulation circuit 200 connects the compressor 23, the condenser 21, the heating section 180 of the thermosiphon 10, the expansion valve 22, and the primary circuit 16a of the condenser 16 in a ring shape.
  • the circulation circuit 200 has a first connection pipe 201 that supplies the refrigerant for the refrigeration cycle flowing out of the condenser 21 to the secondary circuit 16 b of the condenser 16. Further, a second connection pipe 202 for supplying the refrigerant for the refrigeration cycle flowing out of the secondary circuit 16b of the condenser 16 to the condenser 21 is provided.
  • the secondary circuit 16b of the condenser 16 acts as an evaporator of the refrigeration cycle 20, and cools the thermosiphon refrigerant in the first circulation circuit 100.
  • the first connection pipe 201 connects between an outlet 212 formed in the condenser 21 and an inlet 163 formed in the secondary circuit 16 b of the condenser 16.
  • the second connection pipe 202 connects between an outlet 164 formed in the secondary circuit 16 b of the condenser 16 and an inlet 211 formed in the condenser 21.
  • the compressor 23 is provided in the middle of the second connection pipe 202.
  • the condenser 16 is housed in a front storage room or a trunk room.
  • the front storage room is a room that is disposed on the front side in the vehicle traveling direction with respect to the vehicle interior of the vehicle and houses a traveling engine and a traveling electric motor.
  • the trunk room is a storage room that is disposed rearward in the vehicle traveling direction with respect to the vehicle interior of the vehicle and stores luggage and the like.
  • the processing of the ECU 50 according to the present embodiment will be described.
  • the ECU 50 of the present embodiment operates the compressor 23 and periodically executes the processing shown in FIG.
  • the ECU 50 determines whether the required cooling capacity is large. Note that a signal indicating the temperature of the batteries 12a and 12b is input to the ECU 50. Here, the ECU 50 determines whether the temperature of the batteries 12a, 12b is higher than a predetermined temperature based on a signal indicating the temperature of the batteries 12a, 12b.
  • the ECU 50 determines that the required cooling capacity is large when the temperature of the batteries 12a and 12b is higher than the predetermined temperature, and determines that the required cooling capacity is small when the temperature of the batteries 12a and 12b is lower than the predetermined temperature.
  • the determination in S100 is YES, and the ECU 50 determines in S104 that refrigerant is supplied to the heating unit 180. Specifically, the flow path switching valve 36 is controlled to be in a closed state, and the flow path switching valve 37 is controlled to be in an open state, and the process returns to the main routine.
  • the refrigerant for the refrigeration cycle compressed by the compressor 23 is heat-exchanged with the outside air in the refrigeration cycle 20, and then supplied to the heating unit 180.
  • the siphon refrigerant is heated.
  • the gas-phase refrigerant in the cooler 14 generated by the boiling of the liquid-phase refrigerant in the cooler 14 by the heat generated from the batteries 12a and 12b rises and simultaneously pushes up a part of the liquid-phase refrigerant.
  • Part of the liquid-phase refrigerant flows into the return pipe 102 through the outlet 142.
  • the gas-phase refrigerant and the liquid-phase refrigerant including bubbles form a gas-liquid mixed flow.
  • the liquid-phase thermosiphon refrigerant flowing into the return pipe 102 is heated by the heating unit 180 and flows into the condenser 16 as a gas refrigerant. Therefore, an increase in pressure loss inside the return pipe 102 is suppressed, and the head difference between the refrigerant liquid level in the cooler 14 and the refrigerant liquid level in the outward pipe 101 (or the condenser 16) is reduced.
  • the refrigerant for the refrigeration cycle flowing out of the heating unit 180 is decompressed by the expansion valve 22 and then condensed by the condenser 16.
  • the determination in S100 becomes NO, and the ECU 50 turns off the supply of the refrigerant to the heating unit 180 in S102. Specifically, the flow path switching valve 36 is controlled to be in the open state, the flow path switching valve 37 is controlled to be in the closed state, and the process returns to the main routine.
  • the refrigerant for the refrigeration cycle flowing out of the condenser 21 flows into the condenser 16 through the expansion valve 22 without passing through the heating unit 180, and is condensed in the condenser 16.
  • the refrigerating cycle 60 including the compressor 61, the condenser 62, and the expansion valve 63 can improve the condensation capacity of the condenser 16.
  • the heating unit 18 heats the refrigerant flowing through the return pipe 102 without using the heat of the refrigerant in the refrigeration cycle 60.
  • the heat amount required for the condenser 16 to condense the refrigerant is Qc
  • the heat amount required for cooling the refrigerant in the cooler 14 is Qe.
  • the amount of heat for heating the refrigerant by the heating unit 18 is Qh
  • the heating unit 180 uses the heat of the refrigerant in the refrigeration cycle 20 to heat the refrigerant flowing through the return pipe 102.
  • the cooling capacity of the cooler 14 can be expressed as Qe ′
  • the heating capacity of the heating unit 180 can be expressed as Qh
  • the device temperature control device of the present embodiment has a configuration in which the heating unit 180 heats the refrigerant flowing through the return pipe 102 by using the heat of the refrigerant in the refrigeration cycle 20, and the capacity of the condenser 16 is Qc From 'Qc' + Qh). Therefore, it is not necessary to increase the rotation speed of the compressor 61 of the refrigeration cycle 60 in order to improve the capacity of the condenser 16 as in the device temperature controller of the comparative example.
  • FIG. 6 is a Mollier chart showing the state of the refrigerant for the refrigeration cycle of the device temperature controller of the present embodiment.
  • the gas-phase refrigerant whose pressure and enthalpy have been increased from the point PA to the point PB with the compression by the compressor 23 is radiated by the condenser 21 and condensed. If the refrigerant for the refrigeration cycle flowing out of the condenser 21 is in the state shown at the PC point, the refrigerant for the refrigeration cycle that has been supercooled by the heat exchange with the refrigerant for the thermosiphon in the heating unit 180 is further moved to the PD point.
  • the vertical axis represents the head difference
  • the horizontal axis represents the cooling capacity [KW]
  • Ga is a graph showing the head difference of the apparatus temperature controller of the present embodiment
  • Gb is the head difference of the conventional apparatus temperature controller.
  • the head difference of the device temperature control device of the present embodiment is smaller than the head difference of the conventional device temperature control device.
  • the difference between the head difference of the conventional device temperature control device and the head difference of the device temperature control device of the present embodiment increases as the cooling capacity increases. That is, based on the head difference of the conventional device temperature control device, it can be seen that the head difference of the device temperature control device of the present embodiment can be significantly reduced as the cooling capacity increases.
  • the device temperature controller of the present embodiment allows the target device and the thermosiphon refrigerant to exchange heat so that the thermosiphon refrigerant evaporates when the batteries 12a and 12b as the target devices are cooled.
  • It has a cooler 14 configured.
  • a condenser 16 for condensing the thermosiphon refrigerant evaporated by the cooler 14 is provided.
  • an outgoing pipe 101 for guiding the thermosiphon refrigerant condensed by the condenser 16 to the cooler 14 is provided.
  • the return pipe 102 for guiding the refrigerant for the thermosiphon evaporated by the cooler 14 to the condenser 16 and the heating unit 180 for heating the refrigerant for the thermosiphon flowing through the return pipe 102 are provided.
  • the heat medium flowing through the return pipe is vaporized by the heating unit 180, and the pressure loss inside the gas-phase refrigerant passage is reduced, so that the head difference can be reduced.
  • the head difference can be reduced, it is not necessary to install the condenser at a higher position with respect to the evaporator, and the mountability can be improved.
  • the liquid-phase thermosiphon refrigerant may flow into the condenser 16 through the return pipe 102.
  • the liquid-phase thermosiphon refrigerant does not significantly contribute to the heat exchange of the condenser 16. That is, the refrigerant that does not contribute to the condensation is circulated, and wasteful energy is used.
  • the device temperature controller of the present embodiment does not include the heating unit 180 because the heating medium flowing through the return pipe is vaporized by the heating unit 180 and the liquid-phase thermosiphon refrigerant does not flow into the condenser 16.
  • the efficiency can be improved as compared with.
  • the device temperature controller of the present embodiment includes the second circulation circuit 200 for circulating the refrigerant for the refrigeration cycle. Further, a compressor 23 for compressing and discharging the refrigerant for the refrigeration cycle inside the second circulation circuit 200 is provided. Further, a condenser 21 is provided for exchanging heat between the refrigerant for the refrigeration cycle discharged from the compressor 23 and the air to radiate the heat of the refrigerant for the refrigeration cycle. Further, an expansion valve 22 for reducing the pressure of the refrigeration cycle refrigerant flowing out of the condenser 21 is provided.
  • the heating unit 180 heats the refrigerant for thermosiphon flowing through the return pipe 102 with the heat of the refrigerant for the refrigeration cycle discharged from the compressor 23 and before flowing into the expansion valve 22.
  • the heating unit 180 can heat the thermosiphon refrigerant flowing through the return pipe 102 with the heat of the refrigeration cycle refrigerant discharged from the compressor 23 and before flowing into the expansion valve 22.
  • the heating unit according to the present embodiment includes an electric heater 181 that generates heat when energized.
  • the electric heater 181 is connected to a power supply (not shown) that operates according to the control of the ECU 50, and generates heat according to the electric power supplied from the power supply.
  • the electric heater 181 is disposed so as to be in contact with the return pipe 102 via an insulating member (not shown).
  • the heating unit of the present embodiment includes a hot water circulation circuit 182 that circulates circulating water heated by waste heat.
  • the hot water circulation circuit 182 includes a pipe 182a for circulating circulating water, a waste heat recovery unit 182b for collecting waste heat and warming the circulating water, a water pump 182c for circulating the circulating water, and a heat exchange unit 182d. I have.
  • the water pump 182c operates according to an instruction from an ECU (not shown).
  • the waste heat recovery unit 182b recovers waste heat discharged from an inverter, a motor, a DC-DC converter, a charger, and the like mounted on the vehicle, and warms the circulating water with the recovered heat.
  • the circulating water warmed by the waste heat recovery unit 182b is circulated through the pipe 182a by the water pump 182c.
  • the liquid-phase refrigeration cycle refrigerant flowing from the cooler 14 into the return pipe 102 is heated by the heat of the circulating water circulating in the pipe 182 a, and the vaporized refrigeration cycle refrigerant is introduced into the condenser 16.
  • the heat exchange unit 182d heats the thermosiphon refrigerant by heat exchange between the circulating water warmed by the waste heat recovery unit 182b and the thermosiphon refrigerant flowing out of the cooler 14.
  • the heating unit heats the refrigerant for the thermosiphon flowing through the return pipe 102 with the waste heat of the device that generates heat. Therefore, the refrigerant for thermosiphon flowing through the return pipe 102 can be efficiently heated.
  • the heating unit of the present embodiment includes a heat conduction heating unit 183 that collects waste heat and heats the thermosiphon refrigerant with the collected waste heat.
  • the heat conduction heating unit 183 has a waste heat recovery unit 183a that recovers waste heat, and a heat transfer member 183b that transfers the heat recovered by the waste heat recovery unit 183a to the return pipe 102.
  • the waste heat recovery unit 183a recovers waste heat discharged from the relay and the compressor 23, and warms the heat transfer member 183b with the recovered heat.
  • the heat transfer member 183b is disposed so as to contact the waste heat recovery part 183a and also contact the return pipe 102 through which the thermosiphon refrigerant flowing out of the cooler 14 flows.
  • the heat conduction heating unit 183 is made of a member having high heat conductivity such as aluminum and copper.
  • the heating unit heats the refrigerant for the thermosiphon flowing through the return pipe 102 with the waste heat of the device that generates heat. Therefore, the refrigerant for thermosiphon flowing through the return pipe 102 can be efficiently heated.
  • a device temperature controller according to a fifth embodiment will be described with reference to FIG.
  • the heating section of the present embodiment is configured by a waste heat heating section 184 that heats the thermosiphon refrigerant with air warmed by waste heat.
  • the waste heat heating unit 184 includes a waste heat recovery unit 184a, a blower 184b, and a heat exchange unit 184c.
  • the waste heat recovery unit 184a recovers waste heat discharged from an inverter, a motor, a DC-DC converter, a charger, and the like mounted on the vehicle, and warms the air with the recovered heat.
  • the blower 184b blows the air warmed by the waste heat recovery unit 184a toward the heat exchange unit 184c.
  • the blower 184b operates according to an instruction from an ECU (not shown).
  • the heat exchanger 182d heats the thermosiphon refrigerant flowing through the return pipe 102 by heat exchange between the hot air blown by the blower 184b and the thermosiphon refrigerant flowing out of the cooler 14.
  • the air warmed by the waste heat recovery unit 184a is sent to the heat exchange unit 182d.
  • the heat exchange section 182d heats the thermosiphon refrigerant flowing through the return pipe 102 by heat exchange between the warm air blown by the blower 184b and the thermosiphon refrigerant flowing out of the cooler 14.
  • the refrigerant for the thermosiphon flowing through the return line 102 is heated, and the vaporized refrigerant for the refrigeration cycle is introduced into the condenser 16.
  • the waste heat heating unit 184 heats the refrigerant for the thermosiphon flowing through the return pipe 102 with the waste heat of the device that generates heat. Therefore, the refrigerant for thermosiphon flowing through the return pipe 102 can be efficiently heated.
  • a device temperature controller according to a sixth embodiment will be described with reference to FIG.
  • the heating unit of the present embodiment is configured by the heat exchange unit 185 through which the refrigerant for the refrigeration cycle of the refrigeration cycle 300 used in the vehicle air conditioner flows.
  • the refrigerating cycle 300 includes a compressor 301, a condenser 302, flow path switching valves 306 and 307, an expansion valve 303, an evaporator 304, and a blower 305.
  • the compressor 301 compresses the refrigerant for the refrigeration cycle.
  • the condenser 302 performs heat exchange between the refrigeration cycle refrigerant compressed by the compressor 301 and air.
  • the flow path switching valves 306 and 307 switch between introducing and not introducing the refrigeration cycle refrigerant flowing out of the condenser 302 into the heat exchange unit 185 in accordance with an instruction from an ECU (not shown).
  • the expansion valve 303 decompresses the refrigeration cycle refrigerant flowing out of the condenser 302.
  • the evaporator 304 cools the air by exchanging heat between the refrigeration cycle refrigerant depressurized by the expansion valve 303 and the air.
  • the blower 305 sends air toward the evaporator 304.
  • the same effects as those achieved by the configuration common to the first embodiment can be obtained in the same manner as in the first embodiment.
  • the enthalpy of the refrigerant for the refrigeration cycle is reduced by the heat amount Qh in the heat exchange unit 185 before the pressure is reduced by the expansion valve 303 as in the first embodiment, the performance of the evaporator 304 is improved. Can be.
  • An apparatus temperature controller according to a seventh embodiment will be described with reference to FIG.
  • the equipment temperature controller of the present embodiment is different from the sixth embodiment in that a water-refrigerant heat exchanger 308 and a water circuit 209 are provided instead of the evaporator 304 and the blower 305 of the refrigeration cycle 300.
  • the water-refrigerant heat exchanger 308 is connected to a cooling target device (not shown) via a water circuit 209 through which cooling water flows.
  • the water-refrigerant heat exchanger 308 cools the cooling water by exchanging heat between the refrigeration cycle refrigerant depressurized by the expansion valve 22 and the cooling water supplied via the water circuit 209.
  • the cooling water cooled by the water-refrigerant heat exchanger 308 flows through the water circuit 209 toward the device to be cooled. Then, the cooling target device is cooled by the cooling water.
  • the same effects as those achieved by the configuration common to the first embodiment can be obtained in the same manner as in the first embodiment.
  • the enthalpy of the refrigerant for the refrigeration cycle is reduced by the heat amount Qh in the heat exchange unit 185 before the pressure is reduced by the expansion valve 303, so that the performance of the water-refrigerant heat exchanger 308 is reduced. Can be improved.
  • the device temperature control device of the present embodiment is different from the device temperature control device of the first embodiment in the configuration of the capacitor 21.
  • the condenser 21 of the present embodiment has a gas-liquid separator 210 for gas-liquid separation of the refrigerant, and is configured as a subrule condenser for further cooling the liquid refrigerant once gas-liquid separated by the gas-liquid separator 210.
  • the heating unit 180 is disposed downstream of the gas-liquid separator 210 of the condenser 21 in the refrigerant flow direction of the refrigerant for the refrigeration cycle.
  • a subrule condenser having the gas-liquid separator 210 can be employed as the condenser 21.
  • FIG. 1 A device temperature controller according to a ninth embodiment will be described with reference to FIG.
  • the refrigerant for the refrigeration cycle compressed by the compressor 23 exchanges heat with air in the condenser 21 and then flows into the heating unit 180.
  • the refrigerant for the refrigeration cycle compressed by the compressor 23 flows directly into the heating unit 180. That is, the heating unit 180 is disposed in the second connection pipe 202 that connects between the compressor 23 and the condenser 21.
  • the refrigerant for the refrigeration cycle compressed by the compressor 23 may directly flow into the heating unit 180.
  • the heating unit of the present embodiment is configured by the Peltier element 186.
  • the Peltier element 186 has a heat generating portion 1861 that generates heat when energized, and a heat absorbing portion 1862 that absorbs heat.
  • the Peltier element 186 When the Peltier element 186 is energized in a predetermined energizing direction, the Peltier element 186 generates a heat absorbing action at the heat absorbing portion 1862 and generates a heat generating action at the heat generating portion 1861.
  • the heat generating part 1861 is arranged to be in contact with the return pipe 102, and the heat absorbing part 1862 is arranged to be in contact with the outward pipe 101.
  • the energization of the Peltier element 186 is controlled by an ECU (not shown).
  • thermosiphon flowing out of the cooler 14 is heated by the heat generated by the heat generating portion 1861.
  • the refrigerant for the thermosiphon flowing through the return line 102 is heated, and the vaporized refrigerant for the refrigeration cycle is introduced into the condenser 16.
  • the heat absorbing portion 1862 of the Peltier element 186 is arranged within the range indicated by the arrow X. Specifically, the heat absorbing portion 1862 is located on the downstream side of the fluid flow of the thermosyphonic refrigerant from the heat generating portion 1861 of the return pipe 102, and at the highest point of the return pipe 102, and at the connection between the outward pipe 101 and the cooler 14. Placed between.
  • the heating unit includes the Peltier element 186 having the heat generating unit 1861 that generates heat and the heat absorbing unit 1862 that absorbs heat. Then, the heat generated by the heat generating portion 1861 heats the thermosiphon refrigerant flowing through the return pipe 102. Thus, the refrigerant for the thermosiphon flowing through the return line 102 is heated, and the vaporized refrigerant for the refrigeration cycle is introduced into the condenser 16.
  • the heat absorbing portion 1862 of the Peltier element 186 is located downstream of the heat generating portion 1861 of the outgoing pipe 101 at the fluid flow of the thermosyphonic refrigerant and at the highest point of the inbound pipe 102, and the connecting portion between the outgoing pipe 101 and the cooler 14. It is preferable to arrange between these.
  • the device temperature controller according to the eleventh embodiment will be described with reference to FIG. As shown in FIG. 19, in the device temperature controller of the present embodiment, the condenser 16 is arranged at the same height as the cooler 14. Thus, the condenser 16 and the cooler 14 can be arranged at the same height.
  • the cooler 14 of the present embodiment has a heat exchange core 14a and tanks 14b and 14c.
  • the tank 14c is connected to the outbound piping 101, and the tank 14b is connected to the inbound piping 102.
  • Heat exchange core 14a is arranged between batteries 12a and 12b.
  • Battery 12a and battery 12b have terminals T1 and T2, respectively.
  • terminals T1 and T2 are arranged on the side surfaces of the batteries 12a and 12b.
  • Thermosyphon refrigerant is introduced from the condenser 16 into the tank 14c via the return pipe 102.
  • the heat exchange core 14a cools the batteries 12a and 12b by exchanging heat between the refrigerant for the refrigeration cycle and the refrigerant for the thermosiphon.
  • the refrigerant for the thermosiphon evaporates inside the heat exchange core 14a, and the evaporated refrigerant for the thermosiphon is introduced into the condenser 16 via the return pipe 102.
  • a device temperature controller according to a thirteenth embodiment will be described with reference to FIG.
  • terminals T1 and T2 are arranged on the side surfaces of the batteries 12a and 12b.
  • terminals T1 and T2 are arranged on the upper surfaces of the batteries 12a and 12b.
  • the heat exchange core 14a of the cooler 14 is arranged on the lower surfaces of the batteries 12a and 12b. That is, the battery 12a and the battery 12b are arranged only on one surface of the heat exchange core 14a.
  • the cooler 14 is arranged between the secondary batteries 12a and 12b as shown in FIG. 2, but the arrangement is not limited to this.
  • the heating unit 180 is arranged at a position relatively close to the cooler 14 in the return pipe 102, but is not limited to such an arrangement. As shown in FIG. 23, the heating unit 180 may be arranged at the center of the return pipe 102, or as shown in FIG. 24, may be arranged at a position relatively close to the condenser 16. That is, the heating unit 180 can be disposed at any position of the return pipe 102 connecting the cooler 14 and the condenser 16.
  • the ECU 50 determines whether or not the required cooling capacity is large in S100. If the ECU 50 determines that the required cooling capacity is large, the ECU 50 closes the flow path switching valve 36 in S104. The valve state was controlled, and the flow path switching valve 37 was controlled to the open state.
  • the ECU 50 may determine whether it is necessary to improve the cooling performance of the cooler 14. When it is determined that the cooling performance of the cooler 14 needs to be improved, the electric heater 181 can be controlled so that the heater 181 heats the heat medium flowing through the return pipe 102. Further, when controlling the electric heater 181, the electric power applied to the electric heater may be controlled according to the magnitude of the cooling performance to be improved. For example, when the required cooling performance increases, the power applied to the electric heater may be increased.
  • the ECU 50 determines that the required cooling capacity is lower than the predetermined value based on whether the temperature of the batteries 12a and 12b as the target devices is higher than the predetermined temperature. It was determined whether it was large. On the other hand, for example, the ECU 50 may determine whether the required cooling capacity is larger than a predetermined value based on whether the heat generation amount of the target device is larger than a predetermined value. For example, since the load on the batteries 12a and 12b increases when climbing a hill, it is detected whether or not the vehicle is climbing a hill, and when it is detected that the vehicle is climbing a hill, the required cooling capacity is larger than a predetermined value. May be determined. When the vehicle speed is higher than a predetermined value, or when the accelerator opening is higher than a predetermined value, it may be determined that the required cooling capacity is higher than the predetermined value.
  • the device temperature control device allows the target device and the heat medium to exchange heat so that the heat medium evaporates when the target device is cooled. It is provided with a configured equipment heat exchanger. Further, a condenser for condensing the heat medium evaporated by the heat exchanger for equipment is provided. Heating the heat medium flowing through the return pipe, the forward pipe that guides the heat medium condensed by the condenser to the heat exchanger for equipment, the return pipe that guides the heat medium evaporated by the heat exchanger for equipment to the condenser, And a heating unit.
  • the heating unit heats the heat medium flowing through the return pipe with the waste heat of the device that generates heat. Therefore, the heat medium flowing through the return pipe can be efficiently heated.
  • the heat medium is the first heat medium
  • the device temperature controller has a second circulation circuit for circulating the second heat medium.
  • a compressor for compressing and discharging the second heat medium in the second circulation circuit; and a heat radiator for exchanging heat between the second heat medium discharged from the compressor and air to radiate heat of the second heat medium.
  • Heat exchanger Further, it has an expansion valve for reducing the pressure of the second heat medium flowing out from the heat exchanger for heat radiation.
  • the heating unit heats the heat medium discharged from the compressor and flowing through the return pipe with heat of the second heat medium before flowing into the expansion valve.
  • the heating section can heat the heat medium discharged from the compressor and flowing through the return pipe with the heat of the second heat medium before flowing into the expansion valve.
  • the heating section includes a Peltier element having a heat generating section that generates heat and a heat absorbing section that absorbs heat, and heats the heat medium flowing through the return pipe with heat generated by the heat generating section.
  • the heat medium flowing through the return pipe can be heated by the heat generated by the heat generating portion of the Peltier element.
  • the heat absorbing portion of the Peltier element is located on the downstream side of the heat generating portion of the return pipe in the fluid flow direction of the heat medium, and at the highest point of the return pipe, and at the connection between the forward pipe and the cooler. It is located between.
  • the heat medium flowing between the heat-generating portion of the return pipe and the fluid flow of the heat medium downstream of the heat-generating section of the return pipe, and the highest portion of the return pipe and the connection between the outward pipe and the cooler are connected. It can also be cooled.
  • the device temperature control device includes the determination unit that determines whether the cooling performance of the cooler needs to be improved. Further, when the determination unit determines that it is necessary to improve the cooling performance of the cooler, the heating unit includes a heating unit control unit that controls the heating unit to perform heating of the heat medium flowing through the return pipe. .
  • the heating unit controls the heating unit to heat the heat medium flowing through the return pipe. That is, wasteful energy can be prevented from being used as compared with the case where the heating unit always controls the heating unit to heat the heat medium flowing through the return pipe.
  • the target device is a battery mounted on a vehicle.
  • the battery can be cooled with the battery mounted on the vehicle as the target device.
  • process of S100 corresponds to the determination unit
  • process of S104 corresponds to the heating unit control unit.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Transportation (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling, Air Intake And Gas Exhaust, And Fuel Tank Arrangements In Propulsion Units (AREA)
  • Air-Conditioning For Vehicles (AREA)

Abstract

La présente invention concerne un dispositif de réglage de la température d'un appareil, le dispositif comprenant : un échangeur de chaleur (14) destiné à des appareils, l'échangeur de chaleur (14) étant conçu pour permettre un échange de chaleur entre des appareils cibles (12a, 12b) et un agent caloporteur, de sorte que l'agent caloporteur est vaporisé pendant le refroidissement des appareils cibles (12a, 12b) ; un condenseur (16) destiné à condenser l'agent caloporteur vaporisé par les échangeurs de chaleur des appareils ; un tuyau de sortie (101) destiné à guider l'agent caloporteur, condensé par le condenseur, vers l'échangeur de chaleur pour les appareils ; un tuyau de retour (102) destiné à guider l'agent caloporteur, vaporisé par l'échangeur de chaleur pour les appareils, vers le condenseur ; et des parties chauffantes (180-186) destinées à chauffer l'agent caloporteur coulant à travers le tuyau de retour.
PCT/JP2019/024488 2018-06-29 2019-06-20 Dispositif de réglage de température d'appareil WO2020004219A1 (fr)

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JP2018124859A JP2020003173A (ja) 2018-06-29 2018-06-29 機器温調装置

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11576281B1 (en) * 2020-12-02 2023-02-07 Amazon Technologies, Inc. Dynamic regulation of two-phase thermal management systems for servers
US11665865B1 (en) 2020-12-02 2023-05-30 Amazon Technologies, Inc. Dynamic control of two-phase thermal management systems for servers

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7505452B2 (ja) 2021-06-21 2024-06-25 トヨタ自動車株式会社 電池冷却装置
KR102630473B1 (ko) * 2022-03-28 2024-01-29 현대로템 주식회사 열원공급장치를 이용한 발열체용 상변화 열관리시스템

Citations (2)

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Publication number Priority date Publication date Assignee Title
WO2016046882A1 (fr) * 2014-09-22 2016-03-31 三菱電機株式会社 Dispositif à cycle de réfrigération
WO2018055926A1 (fr) * 2016-09-23 2018-03-29 株式会社デンソー Appareil de réglage de température de dispositif

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016046882A1 (fr) * 2014-09-22 2016-03-31 三菱電機株式会社 Dispositif à cycle de réfrigération
WO2018055926A1 (fr) * 2016-09-23 2018-03-29 株式会社デンソー Appareil de réglage de température de dispositif

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11576281B1 (en) * 2020-12-02 2023-02-07 Amazon Technologies, Inc. Dynamic regulation of two-phase thermal management systems for servers
US11665865B1 (en) 2020-12-02 2023-05-30 Amazon Technologies, Inc. Dynamic control of two-phase thermal management systems for servers

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