WO2020001557A1 - Grid error measurement method and measurement device, and optical equipment - Google Patents

Grid error measurement method and measurement device, and optical equipment Download PDF

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Publication number
WO2020001557A1
WO2020001557A1 PCT/CN2019/093367 CN2019093367W WO2020001557A1 WO 2020001557 A1 WO2020001557 A1 WO 2020001557A1 CN 2019093367 W CN2019093367 W CN 2019093367W WO 2020001557 A1 WO2020001557 A1 WO 2020001557A1
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Prior art keywords
grid
position information
alignment measurement
degrees
measurement mark
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PCT/CN2019/093367
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French (fr)
Chinese (zh)
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宋涛
徐兵
李煜芝
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上海微电子装备(集团)股份有限公司
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Publication of WO2020001557A1 publication Critical patent/WO2020001557A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/002Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points

Definitions

  • Embodiments of the present application relate to a position measurement technology, for example, to a method for measuring a grid error, a measurement device, and an optical device.
  • Position measuring equipment or precision motion equipment in the exposure machine an interferometer or a grating measuring system will be arranged on each measuring axis for positioning control and measurement of the motion table.
  • the position measurement system itself also has measurement errors, which can cause deviations between the actual position and the ideal position of the motion table, resulting in inaccurate measurements.
  • the grid error (the deviation of the actual deformation of a certain point horizontally from its ideal position is connected to form a checkered grid arranged in space) to represent the position measurement system's measurement of the horizontal error.
  • Grid errors need to be compensated or calibrated using certain methods and methods to make the final position measurement or movement position accurate.
  • the application provides a grid error measurement method, a measurement device, and an optical device.
  • the grid error is calculated, and the measurement position of the position measurement system is calibrated to make the final position measurement or movement position accurate.
  • an embodiment of the present application provides a method for measuring a grid error, including: obtaining first actual position information of a preset alignment measurement mark on a substrate through a position measurement system in an optical device, wherein, The substrate is provided with a plurality of alignment measurement marks arranged in an array along the first direction and the second direction to form a measurement grid.
  • the substrate is horizontally adsorbed on the substrate adsorption table of the optical device at a first angle.
  • the first direction and the second direction are perpendicular to each other; and acquiring the second actual position information of the preset alignment measurement mark through the position measurement system, wherein the substrate is horizontally adsorbed on the second angle at a second angle.
  • the second angle is different from the first angle; and is calculated based on the first actual position information, the second actual position information, and standard position information of the preset alignment measurement mark.
  • the grid error of the position measurement system including: obtaining first actual position information of a preset alignment measurement mark on a substrate through a position measurement system in an optical device,
  • an embodiment of the present application further provides a device for measuring a grid error, including: a first actual position information module configured to obtain a preset alignment measurement mark on a substrate through a position measurement system in an optical device; The first actual position information, wherein the substrate is provided with a plurality of alignment measurement marks arranged in an array along the first direction and the second direction to form a measurement grid, and the substrate is horizontally adsorbed at a first angle on the substrate.
  • an embodiment of the present application further provides an optical device including the grid error measuring device according to the second aspect.
  • FIG. 1 is a schematic structural diagram of a position measurement device according to an embodiment of the present application.
  • FIG. 2 is a flowchart of a method for measuring a grid error according to an embodiment of the present application
  • FIG. 3 is a schematic diagram of a base structure provided by an embodiment of the present application.
  • FIG. 4 is a graphic structure of several alignment measurement marks according to an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a rotation error provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a non-orthogonality error provided by an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a translation error provided by an embodiment of the present application.
  • FIG. 8 is a flowchart of another method for measuring a grid error provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of a rotation error provided by an embodiment of the present application.
  • FIG. 10 is a flowchart of another method for measuring a grid error according to an embodiment of the present application.
  • FIG. 11 is a schematic diagram of a non-orthogonality error provided by an embodiment of the present application.
  • FIG. 12 is a flowchart of another raster error measurement method according to an embodiment of the present application.
  • FIG. 13 is a schematic diagram of a translation error provided by an embodiment of the present application.
  • FIG. 14 is a structural block diagram of a raster error measuring device according to an embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of a position measurement device according to an embodiment of the present application. It should be noted that the position measurement device in FIG. 1 is only a specific example provided by this embodiment, and is not a limitation on the present application.
  • the position measuring device may include: a complete machine air bath constant temperature control system 1, which includes a temperature measurement sensor and a temperature controlled air bath unit to ensure the stability of the internal environment of the whole machine; a complete machine protection frame 2 for providing protection And thermal insulation function; optical measurement stage 3, used to carry optical measurement sensors and perform horizontal X and vertical Z motion control, wherein the optical measurement stage 3 is equipped with a coarse position measurement sensor 7, precise position measurement and graphics Coarse measurement sensor 8, precise position measurement and graphic precise measurement sensor 9, first height measurement sensor 10 is installed on position precise measurement and graphic coarse measurement sensor 8, second height measurement sensor 11 is installed on position precise measurement and graphic measurement sensor 9 Upper; optical measurement stage movement guide 4 and guide rail support 5; X-direction interferometer measurement system 6 for measuring the movement position of the optical measurement stage; base stage 12 for carrying the measurement base and performing horizontal Y-direction motion control ; Substrate adsorption stage 13 for adsorption measurement substrate, with a substrate constant temperature cooling system; substrate carrier movement guide 14; Y-direction interfer
  • the substrate needs to be horizontally adsorbed on the substrate adsorption table 13 at different angles (for example, 0 degrees, 90 degrees, and 180 degrees).
  • the substrate 100 may be circular or square. By nature, it can be cut by a microtome.
  • the side length of the substrate 100 can be set to be shorter than or equal to the short side of the substrate stage 12 to ensure that the substrate 100 is within the range of the substrate stage 12.
  • FIG. 2 is a flowchart of a method for measuring a grid error according to an embodiment of the present application. This method is suitable for professional measurement equipment that requires position measurement calibration, such as the above-mentioned position measurement equipment.
  • a method for measuring a grid error according to the first embodiment of the present application includes steps S110 to S130.
  • step S110 the first actual position information of the preset alignment measurement mark on the substrate is acquired through a position measurement system in the optical device, wherein a plurality of array arrangements are arranged on the substrate along the first direction and the second direction.
  • the measurement marks are aligned to form a measurement grid.
  • the substrate is horizontally adsorbed on the substrate adsorption table of the optical device at a first angle, and the first direction is perpendicular to the second direction.
  • the optical equipment may be a lithography machine, an exposure machine, or other professional measurement equipment that requires position measurement calibration.
  • the position measurement system in the optical equipment can perform positioning control and measurement on the motion table.
  • the position measurement system is an interferometer measurement system, a laser triangle, or a laser displacement sensor.
  • Position measurement systems can also be other structures, such as precision motion equipment in exposure machines.
  • the movement direction of the optical measurement stage frame in the position measurement system can be defined as the X direction, the direction perpendicular to the X direction on the horizontal plane is the Y direction, and the vertical direction is the Z direction, and an XYZ three-dimensional coordinate system is established.
  • the first direction is parallel to the X axis in the preset coordinate system
  • the second direction is parallel to the Y axis in the preset coordinate system; or the first direction is parallel to Y in the preset coordinate system.
  • Axis, the second direction is parallel to the X axis in the preset coordinate system.
  • FIG. 3 is a schematic diagram of a base structure provided by an embodiment of the present application.
  • a plurality of alignment measurement marks 200 arranged in an array along the first direction and the second direction may be provided on the substrate 100 to form a measurement grid.
  • the intervals between the plurality of alignment measurement marks 200 arranged along the first direction (or the second direction) are the same, but the intervals between the alignment measurement marks 200 arranged along the first direction are the same as those along the first
  • the spacing between the alignment measurement marks 200 arranged in two directions is different.
  • the alignment alignment mark 200 is a center-symmetrical shape. .
  • the alignment measurement marks 200 are arranged in an array along the first direction and the second direction, and the spacing between the plurality of alignment measurement marks 200 arranged along the first direction or the second direction may be the same or Can be different.
  • the spacing between the alignment measurement marks 200 can be set according to the actual situation. In one embodiment, the spacing can be set at about 4-8 mm.
  • This application does not limit the alignment positions of the alignment measurement marks 200 in the first direction and the second direction.
  • each alignment measurement mark 200 may be set to be center-rotationally distributed around the center of the substrate 100.
  • FIG. 4 is a graphic structure of several alignment measurement marks provided in the embodiment of the present application.
  • the alignment measurement marks 200 can be set to be distributed symmetrically at 180 ° and 90 ° centers.
  • the alignment measurement mark 200 can be made by exposure with an exposure machine.
  • the substrate 100 is set to be horizontally adsorbed on the substrate adsorption table 13 of the optical device at a first angle, and a preset alignment measurement on the substrate is obtained through the position measurement system in the optical device. Marked first actual position information.
  • step S120 the second actual position information of the preset alignment measurement mark is acquired by the position measurement system, wherein the substrate is horizontally adsorbed on the substrate adsorption table at a second angle, and the second angle is different from the first angle.
  • the movement stage of most position measurement equipment generally can only set a single degree of freedom movement, correlation data of multiple degrees of freedom cannot be obtained. Therefore, in this embodiment, it is only required that the substrate is adsorbed on the substrate at different angles in the horizontal direction. It can be mounted on the adsorption table, it is easy to operate, and it has low requirements on the degree of freedom of the position measuring equipment. It is suitable for the grid error measurement of various position measuring equipment.
  • step S130 the grid error of the position measurement system is calculated according to the first actual position information, the second actual position information, and the standard position information of the preset alignment measurement mark.
  • the grid error is a measurement error caused by the position measurement system itself. Therefore, the standard position information of the alignment measurement mark can be recorded in advance, and only the preset alignment measurement mark used in the calculation of the grid error can be recorded.
  • the standard position information can also record the standard position information of all the alignment measurement marks set on the substrate.
  • the grid error characterizes the horizontal measurement error of the position measurement system. Considering that the movement stage of most position measurement systems can only set a single degree of freedom movement, in order to avoid collecting correlation data of multiple degrees of freedom
  • the substrate is set to be horizontally adsorbed on the substrate adsorption table at different angles, and the actual position information of the alignment measurement marks at different adsorption angles is collected, and the actual position information at different angles is calculated by a preset algorithm to obtain a position measurement system.
  • Grid error is
  • the method for measuring the grid error does not require a large mask plate, and the calculation method is simple.
  • the measurement position of the position measurement system can be calibrated to make the final position measurement or the movement position accurate, and it is not necessary to collect the motion table.
  • a large range of position data under different attitudes are mathematically fitted and calculated, which avoids the situation that the position model cannot be solved because correlation data of multiple degrees of freedom cannot be obtained.
  • the rotation error is caused by an installation error of a position measurement system (for example, an interferometer measurement system), which may have an impact on position measurement or motion positioning.
  • the rotation error is that the optical measurement stage has a certain offset in that direction during the movement in the first direction (or the second direction), and the value of the offset changes linearly.
  • FIG. 5 is a schematic diagram of a rotation error provided by an embodiment of the present application.
  • the stage optical measurement stage or base stage
  • the rotation amount Rz of the actual position of the stage 301 relative to the expected position 302 of the stage at the same Y position is The linear change will cause the actual position 201 of the alignment measurement mark 200 to have a linear change offset dy in the Y direction relative to its standard position 202, which is an error of the rotation degree of the table grid Y direction.
  • the rotation error will cause the position measurement or movement to be positioned linearly relative to the standard position 202 of each alignment measurement mark 200 in the X direction. s position.
  • the non-orthogonal error is caused by the non-vertical guide rails of the moving table, which will affect the position measurement.
  • the non-orthogonality error is that the optical measurement stage has a certain offset in another direction during the movement in the first direction (or the second direction), and the value of the offset changes linearly.
  • FIG. 6 is a schematic diagram of a non-orthogonality error provided by an embodiment of the present application.
  • the actual position 201 of the alignment measurement mark 200 relative to its standard position 202 has an offset dx that changes linearly in the X direction. Is the non-orthogonality error of the moving table grid Y direction.
  • the non-orthogonality error in the X direction will cause the position measurement or movement to be positioned at an offset in the Y direction relative to the standard position 202 of each alignment measurement mark 200. The position where dy changes linearly.
  • the translation error is mainly caused by the unevenness of the moving guide or the mirror surface in the position measurement system.
  • the unevenness of the plane mirror of the interferometer will affect the position measurement.
  • the translation error is that during the movement of the carrier in the first direction (or the second direction), the same offset value is obtained in the same direction in the other direction, and the offset value varies and is irregular when the value is different.
  • FIG. 7 is a schematic diagram of a translation error provided by an embodiment of the present application.
  • the actual position 201 of the alignment measurement mark 200 has the same offset dx at the same Y position relative to its standard position 202, but The offset dx at different Y positions varies and is irregular.
  • the translation error in the X direction will cause the position measurement to have the same offset dy at the same X position relative to the standard position 202 of each alignment measurement mark 200.
  • the offset dy of different X positions varies and is irregular.
  • FIG. 8 is a flowchart of another method for measuring a grid error according to an embodiment of the present application. Referring to FIG. 8, when the measured grid error is a rotation error, the method for measuring the grid error includes steps S210, S220, S231, S232, and S233.
  • step S210 the first actual position information of the preset alignment measurement mark on the substrate is acquired through a position measurement system in the optical device, wherein the substrate is horizontally adsorbed on the substrate adsorption table of the optical device at a first angle, and the preset The alignment measurement marks include at least two columns of alignment measurement marks in the second direction.
  • the rotation error is the offset that the carrier changes linearly in a certain direction during the movement of the stage in a certain direction
  • at least two columns of alignment measurement marks along the Y direction may be selected, and the offsets corresponding to the alignment measurement marks in different columns (that is, different X values) when the same Y value is calculated are selected.
  • the shift amount dy is used to calculate the respective shift amount dy for each Y value, thereby obtaining the rotation error in the Y direction.
  • At least two rows of alignment measurement marks in the X direction may be selected.
  • step S220 the second actual position information of the preset alignment measurement mark is acquired by the position measurement system, wherein the substrate is horizontally adsorbed on the substrate adsorption table at a second angle, the first angle is 0 degree, and the second angle is 180 degree.
  • the substrate is set to be adsorbed on the substrate adsorption table at 0 degrees and 180 degrees, and the substrate is adsorbed at 0 degrees and 180 degrees, respectively.
  • the measurement result of time is the superposition of the rotation error between the two, and the rotation error in the position measurement system can be calculated more accurately based on the calculation results of the two.
  • step S231 according to the first actual position information and the standard position information of the preset alignment measurement mark, a first grid rotation degree of the measurement grid is determined when the substrate is adsorbed on the substrate adsorption table at a level of 0 degrees.
  • step S232 according to the second actual position information and the standard position information of the preset alignment measurement mark, a second grid rotation degree of the measurement grid is determined when the substrate is adsorbed on the substrate adsorption table at a 180-degree level.
  • step S233 a grid rotation error in the second direction of the position measurement system is calculated based on the first grid rotation and the second grid rotation.
  • Pos_yj_0 is the first actual position of the second alignment measurement mark in the alignment measurement mark pair at 0 degrees.
  • the coordinate value of the information in the first direction xi is the coordinate value of the standard position information of the first alignment measurement mark in the second direction
  • xj is the standard position information of the second alignment measurement mark in the second direction.
  • Coordinate value, dRotyn_0 is the fitted residual at 0 degrees.
  • Step S232 includes: calculating a second rotation amount of the alignment measurement mark pair according to the second actual position information and the standard position information of the alignment measurement mark pair.
  • the coordinate values of the first actual position information of the second alignment measurement mark pair in the first direction in the alignment measurement mark pair described below; according to the second rotation amount and Standard position information, linear fitting to calculate the second grid rotation, wherein the linear fitting formula satisfies: Rotyn_180 K180 ⁇ (-yi-yj) / 2 + dRotyn_180, K180 is the second grid rotation, dRotyn_180 is the fitting residual at 180
  • FIG. 9 is a schematic diagram of a rotation error provided by an embodiment of the present application.
  • the Y is measured by the above grid error measurement method. Rotation to grid error.
  • At least two columns of alignment measurement marks in the Y direction are selected as preset alignment measurement marks, and the standard position information 202 of each preset alignment measurement mark can be recorded in advance.
  • Mark1 and Mark2 are in the X direction.
  • Mark3 and Mark4 are another pair of alignment measurement mark pairs of the same Y value in the X direction.
  • the standard position information of Mark1 is recorded as (x1, y1).
  • the standard position information is (x2, y2), and the standard position information for sequentially recording a plurality of different alignment measurement mark pairs is (x3, y3), (x4, y4), ... (xN, yN).
  • the substrate is adsorbed on the substrate adsorption table of the optical device at a level of 0 degrees, and the first actual position information of the preset alignment measurement mark is sequentially measured.
  • the first actual position information of Mark1 is recorded as (pos_x1_0, pos_y1_0)
  • the first actual position information of Mark2 is (pos_x2_0, pos_y2_0)
  • the first actual position information of multiple different alignment measurement mark pairs are sequentially recorded.
  • Rotyn_0 (pos_yj_0-pos_yi_0) / (xj-xi), calculate the first rotation amount Rotyn_0 corresponding to each alignment measurement mark pair:
  • Roty12_0 (pos_y2_0-pos_y1_0) / (x2-x1);
  • Roty34_0 (pos_y4_0-pos_y3_0) / (x4-x3);
  • N_0 (pos_yN_0-pos_y (N-1) _0) / (xN-x (N-1));
  • N is an even number. According to the obtained N / 2 rotation amounts and the position of y in the standard position information, a linear fitting is performed to calculate the first grid rotation degree Rotyn_0 at 0 degrees:
  • Rotyn_0 K0 ⁇ yn_0 + dRotyn_0;
  • Rotyn_0 takes Roty12_0, Roty34_0, ... or Roty (N-1) N_0; yn_0 takes (y1 + y2) / 2, (y3 + y4) / 2, ... or (y (N-1) + yN) / 2 , DRotyn_0 is the fitted residual;
  • Roty12_0 K0 ⁇ (y1 + y2) / 2 + dRoty12_0;
  • Roty34_0 K0 ⁇ (y3 + y4) / 2 + dRoty34_0;
  • Roty (N-1) N_0 K0 ⁇ (y (N-1) + yN) / 2 + dRoty (N-1) N_0;
  • K0 (K_ws_y + K_plate_y);
  • K_ws_y is the grid rotation error of the motion table
  • K_plate_y is the grid rotation error of the measurement base itself.
  • the substrate is adsorbed on the substrate adsorption table of the optical device at a 180-degree level, and the second actual position information of the preset alignment measurement mark is sequentially measured.
  • the second actual position information of Mark1 is recorded as (pos_x1_180, pos_y1_180)
  • the second actual position information of Mark2 is (pos_x2_180, pos_y2_180
  • the second actual position information of multiple different alignment measurement mark pairs is sequentially recorded as (pos_x3_180, pos_y3_180), (pos_x4_180, pos_y4_180) ... (pos_xN_180, pos_yN_180).
  • Rotyn_180 (pos_yj_0-pos_yi_0) / (-xj + xi), calculate the first rotation amount Rotyn_180 corresponding to each alignment measurement mark pair:
  • Roty12_180 (pos_y2_180-pos_y1_180) / (-x2 + x1);
  • Roty34_180 (pos_y4_180-pos_y3_180) / (-x4 + x3);
  • N_180 (pos_yN_180-pos_y (N-1) _180) / (-xN + x (N-1));
  • Rotyn_180 K180 ⁇ yn_180 + dRotyn_180;
  • Rotyn_180 takes Roty12_180, Roty34_180 ... or Roty (N-1) N_180; yn_180 takes-(y1 + y2) / 2,-(y3 + y4) / 2 ... or-(y (N-1) + yN) / 2, dRotyn_180 is the fitting residual;
  • Roty12_180 -(y1 + y2) / 2 ⁇ K180 + dRoty12_180;
  • Roty34_180 -(y3 + y4) / 2 ⁇ K180 + dRoty34_180;
  • Roty (N-1) N_180 -(y (N-1) + yN) / 2 ⁇ K180 + dRoty (N-1) N_180;
  • K180 -(K_ws_y-K_plate_y).
  • the Y-axis grid rotation error K_ws_y of the substrate carrier can be obtained:
  • K_ws_y (K0-K180) / 2.
  • the grid error measurement method calculates the grid rotation error of the position measurement system by calculating the actual position and standard position information of the substrate adsorbed on the substrate carrier at different angles.
  • the calculation method is simple, and The measurement position of the position measurement system is calibrated to make the final position measurement or movement position accurate, and it is not necessary to collect a large range of position data of the motion table in different attitudes (including rotation, tilt, etc.) for mathematical fitting calculations, avoiding Circumstances where multiple degrees of freedom correlation data cannot be obtained and the position model cannot be solved.
  • FIG. 10 is a flowchart of another method for measuring grid errors according to an embodiment of the present application.
  • the method for measuring the grid error includes steps S310, S320, S331, S332, and S333.
  • step S310 the first actual position information of the preset alignment measurement mark on the substrate is acquired through a position measurement system in the optical device, wherein the substrate is horizontally adsorbed on the substrate adsorption table of the optical device at a first angle, and the preset
  • the alignment measurement marks include at least one row of alignment measurement marks in a first direction and at least one column of alignment measurement marks in a second direction.
  • the moving table has a linearly changing X-direction offset during the movement in the Y direction. Since there may be non-orthogonal errors in the moving table grid and the measuring base's own grid, according to 0 degrees and 90 Degree measurement results, and calculate the non-orthogonality error.
  • step S320 the second actual position information of the preset alignment measurement mark is acquired by the position measurement system, wherein the substrate is horizontally adsorbed on the substrate adsorption table at a second angle, the first angle is 0 degree, and the second angle is 90 degrees.
  • step S331 the first non-orthogonality error Orth_0 of the measurement grid is fitted and calculated when the substrate is adsorbed on the substrate adsorption table at a level of 0 degrees.
  • pos_xm_0 Tx_0 + xm ⁇ Sx_0-ym ⁇ Rzy_0 + Res_xm_0;
  • pos_ym_0 Ty_0 + ym ⁇ Sy_0 + xm ⁇ Rzx_0 + Res_ym_0;
  • Orth_0 Rzy_0-Rzx_0;
  • pos_xm_0 is the coordinate value of the first actual position information of any of the alignment measurement marks at 0 degrees in the second direction
  • pos_ym_0 is the alignment value of any of the alignment measurement marks at 0 degrees
  • xm is the coordinate value of the standard position information of any alignment measurement mark in the second direction
  • ym is the standard position information of any alignment measurement mark at
  • Tx_0 is the translation of the entire alignment measurement mark at 0 degrees in the first direction
  • Ty_0 is the translation of the entire alignment measurement mark at 0 degrees in the second direction
  • Sx_0 is 0 degrees
  • Sy_0 is the zoom magnification in the second direction at 0 degrees
  • Rzx_0 represents the rotation around a coordinate axis parallel to the first direction at 0 degrees
  • Rzy_0 represents the rotation parallel to the first direction at 0 degrees Rotation of the coordinate axis of the two directions; Res
  • step S332 the second non-orthogonality error Orth_90 of the measurement grid is fitted and calculated when the substrate is adsorbed on the substrate adsorption table at a level of 90 degrees.
  • pos_xm_90 Tx_90 + xm ⁇ Sx_90-ym ⁇ Rzy_90 + Res_xm_90;
  • pos_ym_90 Ty_90 + ym ⁇ Sy_90 + xm ⁇ Rzx_90 + Res_ym_90;
  • Orth_90 Rzy_90-Rzx_90
  • pos_xm_90 is the coordinate value of the second actual position information of any alignment measurement mark at 90 degrees in the second direction
  • pos_ym_90 is the second actual position information of any alignment measurement mark at 90 degrees at the first
  • Tx_90 is the translation of the entire measurement mark in the first direction at 90 degrees
  • Ty_90 is the translation of the entire measurement mark in the second direction at 90 degrees
  • Sx_90 is the 90 °
  • Sy_90 is the magnification in the second direction at 90 degrees
  • Rzx_90 represents the rotation around a coordinate axis parallel to the first direction at 90 degrees
  • Rzy_90 represents the rotation parallel to the second direction at 90 degrees
  • Res_xm_90 is the position residual of any alignment measurement mark at 90 degrees in the first direction
  • Res_ym_90 is the position residual of any alignment measurement mark at 90 degrees in the second direction.
  • step S333 the grid non-orthogonality error Orth_ws of the position measurement system is calculated according to the first non-orthogonality error and the second non-orthogonality error.
  • Orth_ws (Orth_0 + Orth_90) / 2.
  • FIG. 11 is a schematic diagram of a non-orthogonality error provided by an embodiment of the present application. Referring to FIG. 11, for example, taking the first direction as the X direction and the second direction as the Y direction as an example, the grid non-orthogonality error is measured by the above grid error measurement method.
  • the standard position information of each preset alignment measurement mark can be recorded in advance, for example, the standard position information of Mark1 is recorded. Is (x1, y1), the standard position information of Mark2 is (x2, y2), and the standard position information of multiple different alignment measurement mark pairs recorded in sequence is (x3, y3), (x4, y4) ... (xM , YM).
  • the substrate is adsorbed on the substrate adsorption table of the optical device at a level of 0 degrees, and the first actual position information of the preset alignment measurement mark is sequentially measured.
  • the first actual position information of Mark1 is recorded as (pos_x1_0, pos_y1_0)
  • the first actual position information of Mark2 is (pos_x2_0, pos_y2_0)
  • the first actual position information of multiple different alignment measurement mark pairs are sequentially recorded.
  • the first non-orthogonality error Orth_0 of the measurement grid at 0 degrees is fitted and calculated:
  • pos_x1_0 Tx_0 + x1 ⁇ Sx_0-y1 ⁇ Rzy_0 + Res_x1_0;
  • pos_y1_0 Ty_0 + y1 ⁇ Sy_0 + x1 ⁇ Rzx_0 + Res_y1_0;
  • pos_x2_0 Tx_0 + x2 ⁇ Sx_0-y2 ⁇ Rzy_0 + Res_x2_0;
  • pos_y2_0 Ty_0 + y2 ⁇ Sy_0 + x2 ⁇ Rzx_0 + Res_y2_0;
  • pos_xm_0 Tx_0 + xm ⁇ Sx_0-ym ⁇ Rzy_0 + Res_xm_0;
  • pos_ym_0 Ty_0 + ym ⁇ Sy_0 + xm ⁇ Rzx_0 + Res_ym_0;
  • Orth_0 Rzy_0-Rzx_0.
  • Orth_0 (Orth_ws + Orth_plate)
  • Orth_ws is the grid non-orthogonality error of the motion table
  • Orth_plate is the grid non-orthogonality error of the measurement base itself.
  • the substrate is adsorbed on the substrate adsorption table of the optical device at a 90-degree level, and the second actual position information of the preset alignment measurement mark is sequentially measured.
  • the second actual position information of Mark1 is recorded as (pos_x1_90, pos_y1_90)
  • the second actual position information of Mark2 is (pos_x2_90, pos_y2_90)
  • the second actual position information of a plurality of different alignment measurement mark pairs is sequentially recorded.
  • pos_x1_90 Tx_90 + x1 ⁇ Sx_90-y1 ⁇ Rzy_90 + Res_x1_90;
  • pos_y1_90 Ty_90 + y1 ⁇ Sy_90 + x1 ⁇ Rzx_90 + Res_y1_90;
  • pos_x2_90 Tx_90 + x2 ⁇ Sx_90-y2 ⁇ Rzy_90 + Res_x2_90;
  • pos_y2_90 Ty_90 + y2 ⁇ Sy_90 + x2 ⁇ Rzx_90 + Res_y2_90;
  • pos_xm_90 Tx_90 + xm ⁇ Sx_90-ym ⁇ Rzy_90 + Res_xm_90;
  • pos_ym_90 Ty_90 + ym ⁇ Sy_90 + xm ⁇ Rzx_90 + Res_ym_90;
  • Orth_90 Rzy_90-Rzx_90.
  • Orth_ws (Orth_0 + Orth_90) / 2.
  • the grid error measurement method provided in this embodiment calculates the grid non-orthogonality error of the position measurement system by calculating the actual position and standard position information of the substrate adsorbed on the substrate carrier at different angles, and the calculation method is simple.
  • the measurement position of the position measurement system can be calibrated to make the final position measurement or movement position accurate, and it is not necessary to collect a large range of position data of the motion table under different attitudes (including rotation, tilt, etc.) for mathematical fitting calculations. It avoids the situation where the correlation data of multiple degrees of freedom cannot be obtained and the position model cannot be solved.
  • FIG. 12 is a flowchart of another method for measuring a grid error according to an embodiment of the present application. Referring to FIG. 12, when the measured grid error is a translation error, the method for measuring the grid error includes steps S410, S420, S431, S432, and S433.
  • step S410 the first actual position information of the preset alignment measurement mark on the substrate is acquired through a position measurement system in the optical device, wherein the substrate is horizontally adsorbed on the substrate adsorption table of the optical device at a first angle, and the preset The alignment measurement mark includes at least one column of alignment measurement marks in the second direction.
  • step S420 the second actual position information of the preset alignment measurement mark is acquired by the position measurement system, wherein the substrate is horizontally adsorbed on the substrate adsorption table at a second angle, the first angle is 0 degree, and the second angle is 180 degree.
  • step S431 the first translation error Res_xp_0 of the measurement grid is calculated by fitting and calculating when the substrate is adsorbed on the substrate adsorption table at a level of 0 degrees.
  • pos_xp_0 Tx_0 + xp ⁇ Sx_0-yp ⁇ Rzy_0 + Res_xp_0;
  • pos_xp_0 is the coordinate value of the first actual position information of any alignment measurement mark in the preset alignment measurement mark at 0 degrees in the second direction
  • Xp is the coordinate value of the standard position information of any alignment measurement mark in the second direction
  • yp is the coordinate value of the standard position information of any alignment measurement mark in the first direction
  • Tx_0 is at 0 degrees Align the entire measurement mark in the first direction
  • Sx_0 is the zoom factor in the first direction at 0 degrees
  • Rzy_0 represents the rotation around a coordinate axis parallel to the second direction at 0 degrees;
  • step S432 the second translation error Res_xp_180 of the measurement grid is fitted and calculated when the substrate is adsorbed on the substrate adsorption table at the 180 degree level.
  • pos_xp_180 Tx_180 + xp ⁇ Sx_180-yp ⁇ Rzy_180 + Res_xp_180; where pos_xp_180 is the coordinate value of the second actual position information of any alignment measurement mark at 180 degrees in the second direction, and Tx_180 is aligned at 180 degrees Measure the translation of the marker in the first direction as a whole.
  • Sx_180 is the magnification in the first direction at 180 degrees
  • Rzy_180 represents the rotation around a coordinate axis parallel to the second direction at 180 degrees.
  • step S433 the grid translation error Res_xp_ps of the position measurement system with respect to any alignment measurement mark in the first direction is calculated according to the first translation error and the second translation error.
  • Res_xp_ps (Res_xp_0 + Res_xp_180) / 2.
  • FIG. 13 is a schematic diagram of a translation error provided by an embodiment of the present application. Referring to FIG. 13, for example, taking the first direction as the X direction and the second direction as the Y direction as an example, the X-axis grid translation error is measured by the above-mentioned grid error measurement method.
  • the substrate is adsorbed on the substrate adsorption table of the optical device at a level of 0 degrees, and the first actual position information of the preset alignment measurement mark is sequentially measured.
  • the first actual position information of Mark1 is recorded as (pos_x1_0, pos_y1_0)
  • the first actual position information of Mark2 is (pos_x2_0, pos_y2_0)
  • the first actual position information of multiple different alignment measurement mark pairs are sequentially recorded.
  • pos_x1_0 Tx_0 + x1 ⁇ Sx_0-y1 ⁇ Rzy_0 + Res_x1_0;
  • pos_x2_0 Tx_0 + x2 ⁇ Sx_0-y2 ⁇ Rzy_0 + Res_x2_0;
  • pos_xp_0 Tx_0 + xp ⁇ Sx_0-yp ⁇ Rzy_0 + Res_xp_0;
  • Res_xp_0 is the position residual in the X direction, that is, the first translation residual in the X direction of the measurement grid at 0 degrees.
  • the first translation residual Res_xp_0 is the superposition of the grid translation errors of the two;
  • Res_xp_0 Res_xp_ws + Res_xp_plate
  • Res_xp_ps is the X translation residual of the grid of the kinematic table at the p point
  • Res_xp_plate is the X translation residual of the grid itself at the p point.
  • the substrate is adsorbed on the substrate adsorption table of the optical device at a 180-degree level, and the second actual position information of the preset alignment measurement mark is sequentially measured.
  • the second actual position information of Mark1 is recorded as (pos_x1_180, pos_y1_180)
  • the second actual position information of Mark2 is (pos_x2_180, pos_y2_180)
  • the second actual position information of multiple different alignment measurement mark pairs are recorded in sequence. It is (pos_x3_180, pos_y3_180), (pos_x4_180, pos_y4_180) ... (pos_xN_180, pos_yN_180).
  • pos_x1_180 Tx_180 + x1 ⁇ Sx_180-y1 ⁇ Rzy_180 + Res_x1_180;
  • pos_x2_180 Tx_180 + x2 ⁇ Sx_180-y2 ⁇ Rzy_180 + Res_x2_180;
  • pos_xp_180 Tx_180 + xp ⁇ Sx_180-yp ⁇ Rzy_180 + Res_xp_180;
  • Res_xp_180 is the position residual in the X direction, that is, the second translation residual in the X direction of the measurement grid at 180 degrees.
  • Res_xp_180 Res_xp_ws-Res_xp_plate.
  • the X-axis grid translation error of the substrate carrier can be obtained.
  • Res_xp_ps (Res_xp_0 + Res_xp_180) / 2.
  • the method for measuring the Y-grid translation error of the substrate stage Y Res_yp_ps is similar to the measurement method provided in the foregoing embodiment.
  • One column (or multiple columns) of marks on the substrate in the Y direction is selected for 0-degree and 180-degree measurement calibration, such as Figures 13 (c) and 13 (d).
  • the grid error measurement method calculates the grid translation error of the position measurement system by calculating the actual position and standard position information of the substrate adsorbed on the substrate carrier at different angles.
  • the calculation method is simple, and the position can be calculated.
  • the measurement position of the measurement system is calibrated to make the final position measurement or movement position accurate, and it is not necessary to collect a large range of position data of the motion table under different attitudes (including rotation, tilt, etc.) for mathematical fitting calculations, which prevents the A case where multiple degrees of freedom correlation data are obtained and the position model cannot be solved.
  • An embodiment of the present application further provides a device for measuring a grid error.
  • FIG. 14 is a structural block diagram of a raster error measuring device according to an embodiment of the present application.
  • the raster error measurement device includes a first actual position information module 51 configured to obtain first actual position information of a preset alignment measurement mark on a substrate through a position measurement system in an optical device,
  • the substrate is provided with a plurality of alignment measurement marks arranged in an array along the first direction and the second direction to form a measurement grid.
  • the substrate is horizontally adsorbed on a substrate adsorption table of an optical device at a first angle.
  • the direction is perpendicular to the second direction;
  • the second actual position information acquisition module 52 is configured to obtain the second actual position information of a preset alignment measurement mark through a position measurement system, wherein the substrate is horizontally adsorbed on the substrate by a second angle On the stage, the second angle is different from the first angle;
  • the grid error calculation module 53 is configured to calculate the position of the position measurement system based on the first actual position information, the second actual position information, and standard position information of a preset alignment measurement mark. Raster error.
  • the first direction is parallel to the X axis in the preset coordinate system
  • the second direction is parallel to the Y axis in the preset coordinate system; or, the first direction is parallel to the Y axis in the preset coordinate system, The second direction is parallel to the X axis in the preset coordinate system.
  • the grid error measuring device can measure different kinds of grid errors in the position measurement system by using the grid error measuring method in the above embodiment, and obtain a preset by adsorbing a substrate on a substrate adsorption table at different adsorption angles. Align the actual position information of the measurement marks at different adsorption angles and calculate the grid error of the position measurement system.
  • the calculation method is simple.
  • the measurement position of the position measurement system can be calibrated to make the final position measurement or movement position accurate. And it is not necessary to collect a large range of position data of the motion table under different attitudes (including rotation, tilt, etc.) for mathematical fitting calculations, avoiding the situation that the position model cannot be solved because correlation data of multiple degrees of freedom cannot be obtained.
  • the preset alignment measurement mark includes at least two columns of the alignment measurement marks in the second direction, the first angle is 0 degrees, and the second angle is 180 degrees .
  • the grid error calculation module includes a first grid rotation degree determination unit, a second grid rotation degree determination unit, and a grid rotation degree error calculation unit.
  • the first grid rotation degree determining unit is configured to determine, according to the first actual position information and standard position information of a preset alignment measurement mark, a first grid of the measurement grid when the substrate is adsorbed on the substrate adsorption table at a level of 0 degrees. Grid rotation.
  • the second grid rotation degree determining unit is configured to determine, according to the second actual position information and standard position information of a preset alignment measurement mark, a second grid for measuring the grid when the substrate is adsorbed on the substrate adsorption platform at a 180-degree level. Grid rotation.
  • the grid rotation degree error calculation unit is configured to calculate a grid rotation degree error in a second direction of the position measurement system according to the first grid rotation degree and the second grid rotation degree.
  • the first grid rotation degree determination unit includes a first rotation amount calculation sub-unit and a first grid rotation degree fitting sub-unit.
  • the coordinate value in the first direction of the first actual position information of the first alignment measurement mark in the alignment measurement mark pair, and pos_yj_0 is the second alignment measurement mark in the alignment measurement mark pair at 0 degrees
  • xi is the coordinate value of the standard position information of the first alignment measurement mark in the second direction
  • xj is the standard position information of the second alignment measurement mark.
  • the first grid rotation degree fitting sub-unit is configured to calculate the first grid rotation degree according to the first rotation amount and standard position information of a plurality of different alignment measurement mark pairs, wherein the linear fitting
  • the second grid rotation degree determination unit includes a second rotation amount calculation sub-unit and a second grid rotation degree fitting sub-unit.
  • the second rotation amount calculation subunit is configured to calculate a second rotation amount of the alignment measurement mark pair according to the second actual position information and the standard position information of the alignment measurement mark pair.
  • Pos_yj_180 is the coordinate value of the first actual position information of the second alignment measurement mark in the alignment measurement mark pair at 180 degrees in the first direction.
  • K_ws_z (K0-K180) / 2.
  • the preset alignment measurement mark includes at least one row of alignment measurement marks in the first direction and at least one column of alignment measurement marks in the second direction.
  • the first angle is 0 degrees, the first The two angles are 90 degrees.
  • the grid error calculation module includes a first non-orthogonality fitting unit, a second non-orthogonality fitting unit, and a grid non-orthogonality error calculating unit.
  • the first non-orthogonality fitting unit is configured to fit the first non-orthogonality error Orth_0 of the measurement grid when the calculation substrate is adsorbed on the substrate adsorption platform at the 0 degree level:
  • pos_xm_0 Tx_0 + xm ⁇ Sx_0-ym ⁇ Rzy_0 + Res_xm_0;
  • pos_ym_0 Ty_0 + ym ⁇ Sy_0 + xm ⁇ Rzx_0 + Res_ym_0;
  • Orth_0 Rzy_0-Rzx_0;
  • pos_xm_0 is the coordinate value of the first actual position information of any of the alignment measurement marks preset at 0 degrees in the second direction
  • pos_ym_0 is any alignment measurement at 0 degrees
  • xm is the coordinate value of the standard position information of any alignment measurement mark in the second direction
  • ym is the standard position of any alignment measurement mark.
  • Tx_0 is the translation of the entire measurement mark in the first direction at 0 degrees
  • Ty_0 is the translation of the entire measurement mark in the second direction at 0 degrees
  • Sx_0 is Magnification in the first direction at 0 degrees
  • Sy_0 is the magnification in the second direction at 0 degrees
  • Rzx_0 represents rotation around a coordinate axis parallel to the first direction at 0 degrees
  • Rzy_0 represents parallel rotation at 0 degrees Rotation of the coordinate axis in the second direction
  • Res_xm_0 is the position residual of any alignment measurement mark at 0 degrees in the first direction
  • Res_ym_0 is the alignment error of any alignment measurement mark at 0 degrees in the second direction Location residuals.
  • the second non-orthogonal fitting unit is set to fit the second non-orthogonality error Orth_90 of the measurement grid when the substrate is adsorbed on the substrate adsorption platform at a 90 degree level:
  • pos_xm_90 Tx_90 + xm ⁇ Sx_90-ym ⁇ Rzy_90 + Res_xm_90;
  • pos_ym_90 Ty_90 + ym ⁇ Sy_90 + xm ⁇ Rzx_90 + Res_ym_90;
  • Orth_90 Rzy_90-Rzx_90
  • pos_xm_90 is the coordinate value of the second actual position information of any alignment measurement mark at 90 degrees in the second direction
  • pos_ym_90 is the second actual position information of any alignment measurement mark at 90 degrees at the first
  • Tx_90 is the translation of the entire measurement mark at 90 degrees in the first direction
  • Ty_90 is the translation of the entire measurement mark at 90 degrees in the second direction
  • Sx_90 is 90 degrees
  • Sy_90 is the zoom ratio in the second direction at 90 degrees
  • Rzx_90 represents the rotation around a coordinate axis parallel to the first direction at 90 degrees
  • Rzy_90 represents the rotation parallel to the first direction at 90 degrees Rotation of coordinate axes in two directions
  • Res_xm_90 is the residual position of any alignment measurement mark at 90 degrees in the first direction
  • Res_ym_90 is the residual position of any alignment measurement mark at 90 degrees in the second direction difference.
  • the preset alignment measurement mark includes at least one column of alignment measurement marks in the second direction, the first angle is 0 degrees, and the second angle is 180 degrees.
  • the grid error calculation module includes a first translation error fitting unit, a second translation error fitting unit, and a grid translation error calculation unit.
  • the first translation error fitting unit is configured to fit and calculate the first translation error Res_xp_0 of the measurement grid when the substrate is adsorbed on the substrate adsorption platform at a level of 0 degrees:
  • pos_xp_0 Tx_0 + xp ⁇ Sx_0-yp ⁇ Rzy_0 + Res_xp_0; where pos_xp_0 is the coordinate value of the first actual position information of any alignment measurement mark in the preset alignment measurement mark at 0 degrees in the second direction , Xp is the coordinate value of the standard position information of any alignment measurement mark in the second direction, yp is the coordinate value of the standard position information of any alignment measurement mark in the first direction, Tx_0 is at 0 degrees The translation of the alignment measurement mark as a whole in the first direction, Sx_0 is the zoom factor in the first direction at 0 degrees, and Rzy_0 represents the rotation around a coordinate axis parallel to the second direction at 0 degrees.
  • the second translation error fitting unit is configured to fit and calculate the second translation error Res_xp_180 of the measurement grid when the substrate is adsorbed on the substrate adsorption platform at a 180-degree level:
  • pos_xp_180 Tx_180 + xp ⁇ Sx_180-yp ⁇ Rzy_180 + Res_xp_180; where pos_xp_180 is the coordinate value of the second actual position information of any alignment measurement mark at 180 degrees in the second direction, and Tx_180 is aligned at 180 degrees Measure the translation of the marker in the first direction as a whole.
  • Sx_180 is the magnification in the first direction at 180 degrees
  • Rzy_180 represents the rotation around a coordinate axis parallel to the second direction at 180 degrees.
  • the grid translation error calculation unit is configured to calculate the grid translation error Res_xp_ps of the first direction of the position measurement system relative to any alignment measurement mark according to the first translation error and the second translation error:
  • Res_xp_ps (Res_xp_0 + Res_xp_180) / 2.
  • An embodiment of the present application further provides an optical device, and the optical device includes a grid error measuring device provided by any of the foregoing embodiments.
  • the optical device includes a lithography machine.
  • the optical device provided in this embodiment calculates the grid error of the position measurement system by calculating the actual position and standard position information of the substrate adsorbed on the substrate stage at different angles.
  • the calculation method is simple, and the measurement position of the position measurement system can be measured. Perform calibration to make the final position measurement or movement position accurate, and do not need to collect a large range of position data of the motion table under different attitudes (including rotation, tilt, etc.) for mathematical fitting calculations, avoiding the inability to obtain multiple degrees of freedom The situation that the position model cannot be solved.

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Abstract

A grid error measurement method and a measurement device, and optical equipment. The grid error measurement method comprises: acquiring first actual position information about a preset alignment measurement mark on a substrate by means of a position measurement system in optical equipment, the substrate being horizontally adsorbed on a substrate adsorbing table of the optical equipment at a first angle, and a first direction being perpendicular to the second direction (S110); acquiring second actual position information about the preset alignment measurement mark by means of the position measurement system, the substrate being horizontally absorbed on the substrate adsorbing table at a second angle, and the second angle being different from the first angle (S120); and calculating the grid error of the position measurement system according to the first actual position information, the second actual position information, and the standard position information of the preset alignment measurement mark (S130).

Description

一种栅格误差的测量方法、测量装置以及光学设备Method, device and optical equipment for measuring grid error
本申请要求在2018年06月28日提交中国专利局、申请号为201810688910.1的中国专利申请的优先权,该申请的全部内容通过引用结合在本申请中。This application claims priority from a Chinese patent application filed with the Chinese Patent Office on June 28, 2018 with application number 201810688910.1, the entire contents of which are incorporated herein by reference.
技术领域Technical field
本申请实施例涉及位置测量技术,例如涉及一种栅格误差的测量方法、测量装置以及光学设备。Embodiments of the present application relate to a position measurement technology, for example, to a method for measuring a grid error, a measurement device, and an optical device.
背景技术Background technique
位置测量设备或曝光机中的精密运动设备,在各测量轴会配置干涉仪或者光栅尺测量***进行运动台定位控制和测量。然而位置测量***本身也会存在测量误差,会导致运动台实际位置和理想位置存在偏差,带来测量不准确。Position measuring equipment or precision motion equipment in the exposure machine, an interferometer or a grating measuring system will be arranged on each measuring axis for positioning control and measurement of the motion table. However, the position measurement system itself also has measurement errors, which can cause deviations between the actual position and the ideal position of the motion table, resulting in inaccurate measurements.
通常,用栅格误差(水平向某个点的实际形变相对于其理想位置的偏差,将这些点连接起来形成空间排列的棋盘式网格)来表征位置测量***测量水平向误差情况。栅格误差需要使用一定的手段和方法进行补偿或校准,使最终位置量测或运动位置准确。Generally, the grid error (the deviation of the actual deformation of a certain point horizontally from its ideal position is connected to form a checkered grid arranged in space) to represent the position measurement system's measurement of the horizontal error. Grid errors need to be compensated or calibrated using certain methods and methods to make the final position measurement or movement position accurate.
目前,市场上位置量测设备,大多使用大掩模版或基准版进行栅格校正,但是,一是校准使用和维护不便,需多次手动上载掩模版在运动台上不同位置,逐个校准局部误差,且掩模版也需要单独维护;二是随着行业发展,特别是平板显示领域中基底尺寸也在增大,后续掩模版的制作尺寸需要同步增大,成本必然增加,存在局限性。另一种栅格校准方案使用位置测量***(干涉仪、光栅尺)的位置模型,需要采集运动台在不同姿态下(包括旋转、倾斜等)较大范围的位置数据进行数学拟合计算,然而大多数位置测量设备的运动台一般只能设置单个自由度的运动,多个自由度的相关性数据无法获取,导致位置模型无法求解,因此,也无法计算得出栅格误差并进行校准。At present, most of the position measurement equipment on the market uses large mask plates or reference plates for grid correction. However, the first is the inconvenience of calibration use and maintenance. It is necessary to manually upload the mask plates at different positions on the motion table multiple times to calibrate local errors one by one. And the mask also needs to be maintained separately. Second, as the industry develops, especially in the field of flat panel display, the size of the substrate is also increasing. The size of subsequent masks needs to increase simultaneously, and the cost will inevitably increase. There are limitations. Another grid calibration scheme uses the position model of the position measurement system (interferometer, grating ruler). It needs to collect a large range of position data of the motion table under different attitudes (including rotation, tilt, etc.) for mathematical fitting calculations. However, The motion stage of most position measurement equipment generally can only set a single degree of freedom motion. Correlation data of multiple degrees of freedom cannot be obtained, resulting in a position model that cannot be solved. Therefore, grid errors cannot be calculated and calibrated.
发明内容Summary of the invention
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。The following is an overview of the topics detailed in this article. This summary is not intended to limit the scope of protection of the claims.
本申请提供一种栅格误差的测量方法、测量装置以及光学设备,计算得出栅格误差,对位置测量***的测量位置进行校准,使最终位置量测或运动位置准确。The application provides a grid error measurement method, a measurement device, and an optical device. The grid error is calculated, and the measurement position of the position measurement system is calibrated to make the final position measurement or movement position accurate.
第一方面,本申请实施例提供了一种栅格误差的测量方法,包括:通过光学设备中的位置测量***获取基底上预设对准量测标记的第一实际位置信息,其中,所述基底上设置有多个沿第一方向和第二方向呈阵列排布的对准量测标记,形成测量栅格,所述基底以第一角度水平吸附在所述光学设备的基底吸附台上,所述第一方向和所述第二方向相垂直;通过所述位置测量***获取所述预设对准量测标记的第二实际位置信息,其中,所述基底以第二角度水平吸附在所述基底吸附台上,所述第二角度不同于所述第一角度;根据所述第一实际位置信息、所述第二实际位置信息和所述预设对准量测标记的标准位置信息计算所述位置测量***的栅格误差。In a first aspect, an embodiment of the present application provides a method for measuring a grid error, including: obtaining first actual position information of a preset alignment measurement mark on a substrate through a position measurement system in an optical device, wherein, The substrate is provided with a plurality of alignment measurement marks arranged in an array along the first direction and the second direction to form a measurement grid. The substrate is horizontally adsorbed on the substrate adsorption table of the optical device at a first angle. The first direction and the second direction are perpendicular to each other; and acquiring the second actual position information of the preset alignment measurement mark through the position measurement system, wherein the substrate is horizontally adsorbed on the second angle at a second angle. On the substrate adsorption table, the second angle is different from the first angle; and is calculated based on the first actual position information, the second actual position information, and standard position information of the preset alignment measurement mark. The grid error of the position measurement system.
第二方面,本申请实施例还提供了一种栅格误差的测量装置,包括:第一实际位置信息 模块,设置为通过光学设备中的位置测量***获取基底上预设对准量测标记的第一实际位置信息,其中,所述基底上设置有多个沿第一方向和第二方向呈阵列排布的对准量测标记,形成测量栅格,所述基底以第一角度水平吸附在所述光学设备的基底吸附台上,所述第一方向和所述第二方向相垂直;第二实际位置信息获取模块,设置为通过所述位置测量***获取所述预设对准量测标记的第二实际位置信息,其中,所述基底以第二角度水平吸附在所述基底吸附台上,所述第二角度不同于所述第一角度;栅格误差计算模块,设置为根据所述第一实际位置信息、所述第二实际位置信息和所述预设对准量测标记的标准位置信息计算所述位置测量***的栅格误差。In a second aspect, an embodiment of the present application further provides a device for measuring a grid error, including: a first actual position information module configured to obtain a preset alignment measurement mark on a substrate through a position measurement system in an optical device; The first actual position information, wherein the substrate is provided with a plurality of alignment measurement marks arranged in an array along the first direction and the second direction to form a measurement grid, and the substrate is horizontally adsorbed at a first angle on the substrate. The first direction is perpendicular to the second direction on the substrate adsorption stage of the optical device; a second actual position information acquisition module is configured to acquire the preset alignment measurement mark through the position measurement system The second actual position information, wherein the substrate is horizontally adsorbed on the substrate adsorption table at a second angle, the second angle is different from the first angle; the grid error calculation module is configured to be based on the The first actual position information, the second actual position information, and the standard position information of the preset alignment measurement mark calculate a grid error of the position measurement system.
第三方面,本申请实施例还提供了一种光学设备,包括上述第二方面所述的栅格误差的测量装置。According to a third aspect, an embodiment of the present application further provides an optical device including the grid error measuring device according to the second aspect.
可以在阅读并理解了附图和详细描述后,可以明白其他方面。Other aspects can be understood after reading and understanding the accompanying drawings and detailed description.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1是本申请实施例提供的一种位置测量设备的结构示意图;FIG. 1 is a schematic structural diagram of a position measurement device according to an embodiment of the present application; FIG.
图2是本申请实施例提供的一种栅格误差的测量方法的流程图;2 is a flowchart of a method for measuring a grid error according to an embodiment of the present application;
图3是本申请实施例提供的一种基底结构示意图;3 is a schematic diagram of a base structure provided by an embodiment of the present application;
图4是本申请实施例提供的几种对准量测标记的图形结构;FIG. 4 is a graphic structure of several alignment measurement marks according to an embodiment of the present application; FIG.
图5是本申请实施例提供的一种旋转度误差的示意图;5 is a schematic diagram of a rotation error provided by an embodiment of the present application;
图6是本申请实施例提供的一种非正交性误差的示意图;6 is a schematic diagram of a non-orthogonality error provided by an embodiment of the present application;
图7是本申请实施例提供的一种平移误差的示意图;7 is a schematic diagram of a translation error provided by an embodiment of the present application;
图8是本申请实施例提供的另一种栅格误差的测量方法的流程图;8 is a flowchart of another method for measuring a grid error provided by an embodiment of the present application;
图9是本申请实施例提供的一种旋转度误差的示意图;FIG. 9 is a schematic diagram of a rotation error provided by an embodiment of the present application; FIG.
图10是本申请实施例提供的另一种栅格误差的测量方法的流程图;FIG. 10 is a flowchart of another method for measuring a grid error according to an embodiment of the present application; FIG.
图11是本申请实施例提供的一种非正交性误差的示意图;11 is a schematic diagram of a non-orthogonality error provided by an embodiment of the present application;
图12是本申请实施例提供的另一种栅格误差的测量方法的流程图;FIG. 12 is a flowchart of another raster error measurement method according to an embodiment of the present application; FIG.
图13是本申请实施例提供的一种平移误差的示意图;13 is a schematic diagram of a translation error provided by an embodiment of the present application;
图14是本申请实施例提供的一种栅格误差的测量装置的结构框图。FIG. 14 is a structural block diagram of a raster error measuring device according to an embodiment of the present application.
具体实施方式detailed description
下面结合附图和实施例对本申请作进一步的详细说明。可以理解的是,此处所描述的具体实施例仅仅用于解释本申请,而非对本申请的限定。另外还需要说明的是,为了便于描述,附图中仅示出了与本申请相关的部分而非全部结构。The following describes the present application in detail with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present application, rather than limiting the present application. It should also be noted that, for convenience of description, the drawings only show a part of the structure related to the present application, but not the entire structure.
图1是本申请实施例提供的一种位置测量设备的结构示意图。需要说明的是,图1中的位置测量设备仅是本实施例提供的一个具体示例,并非对本申请的限制。FIG. 1 is a schematic structural diagram of a position measurement device according to an embodiment of the present application. It should be noted that the position measurement device in FIG. 1 is only a specific example provided by this embodiment, and is not a limitation on the present application.
参见图1,位置测量设备可以包括:整机气浴恒温控制***1,其包括温度测量传感器、温度控制气浴单元,以保证整机内部环境的稳定;整机防护框架2,用于提供防护和保温功能;光学测量载台3,用于承载光学测量传感器并进行水平X向、垂向Z的运动控制,其中,光学测量载台3上安装有位置粗测量传感器7,位置精测量和图形粗测量传感器8,位置精测量和图形精测量传感器9,第一高度测量传感器10安装在位置精测量和图形粗测量传感器8 上,第二高度测量传感器11安装在位置精测量和图形测量传感器9上;光学测量载台运动导轨4和导轨支架5;X向干涉仪测量***6,用于测量光学测量载台运动位置;基底载台12,用于承载测量基底,并进行水平Y向运动控制;基底吸附台13,用于吸附测量基底,并带有基底恒温冷却***;基底载台运动导轨14;Y向干涉仪测量***15,用于测量基底载台运动位置;大理石支撑台16,用于支撑基底载台,并减弱测量过程中基底载台的运动冲量;减震***17,用于提供测量过程中载台运动的震动消除作用。Referring to FIG. 1, the position measuring device may include: a complete machine air bath constant temperature control system 1, which includes a temperature measurement sensor and a temperature controlled air bath unit to ensure the stability of the internal environment of the whole machine; a complete machine protection frame 2 for providing protection And thermal insulation function; optical measurement stage 3, used to carry optical measurement sensors and perform horizontal X and vertical Z motion control, wherein the optical measurement stage 3 is equipped with a coarse position measurement sensor 7, precise position measurement and graphics Coarse measurement sensor 8, precise position measurement and graphic precise measurement sensor 9, first height measurement sensor 10 is installed on position precise measurement and graphic coarse measurement sensor 8, second height measurement sensor 11 is installed on position precise measurement and graphic measurement sensor 9 Upper; optical measurement stage movement guide 4 and guide rail support 5; X-direction interferometer measurement system 6 for measuring the movement position of the optical measurement stage; base stage 12 for carrying the measurement base and performing horizontal Y-direction motion control ; Substrate adsorption stage 13 for adsorption measurement substrate, with a substrate constant temperature cooling system; substrate carrier movement guide 14; Y-direction interferometer Measurement system 15 for measuring the movement position of the substrate carrier; marble support table 16 for supporting the substrate carrier and reducing the momentum of the substrate carrier during the measurement process; shock absorption system 17 for providing the carrier during the measurement process The vibration elimination effect of the movement.
可以理解的是,考虑到后续需要基底需要以不同的角度(例如,0度、90度和180度)水平吸附在基底吸附台13上,为了方便测量,基底100可以为圆形或者正方形,示例性地,可通过切片机切割。当基底100为正方形时,可以设置其边长小于或等于基底载台12的短边,以确保基底100在基底载台12的范围内。It can be understood that, in consideration of subsequent requirements, the substrate needs to be horizontally adsorbed on the substrate adsorption table 13 at different angles (for example, 0 degrees, 90 degrees, and 180 degrees). In order to facilitate measurement, the substrate 100 may be circular or square. By nature, it can be cut by a microtome. When the substrate 100 is square, the side length of the substrate 100 can be set to be shorter than or equal to the short side of the substrate stage 12 to ensure that the substrate 100 is within the range of the substrate stage 12.
图2是本申请实施例提供的一种栅格误差的测量方法的流程图。该方法适用于需要位置测量校准的专业量测设备,如上述位置测量设备。参见图2,本申请实施例一的一种栅格误差的测量方法,包括步骤S110至步骤S130。FIG. 2 is a flowchart of a method for measuring a grid error according to an embodiment of the present application. This method is suitable for professional measurement equipment that requires position measurement calibration, such as the above-mentioned position measurement equipment. Referring to FIG. 2, a method for measuring a grid error according to the first embodiment of the present application includes steps S110 to S130.
在步骤S110中,通过光学设备中的位置测量***获取基底上预设对准量测标记的第一实际位置信息,其中,基底上设置有多个沿第一方向和第二方向呈阵列排布的对准量测标记,形成测量栅格,基底以第一角度水平吸附在光学设备的基底吸附台上,第一方向和第二方向相垂直。In step S110, the first actual position information of the preset alignment measurement mark on the substrate is acquired through a position measurement system in the optical device, wherein a plurality of array arrangements are arranged on the substrate along the first direction and the second direction. The measurement marks are aligned to form a measurement grid. The substrate is horizontally adsorbed on the substrate adsorption table of the optical device at a first angle, and the first direction is perpendicular to the second direction.
其中,光学设备可以是光刻机、曝光机或者其他需要位置测量校准的专业量测设备。光学设备中位置测量***可以对运动台进行定位控制和测量。The optical equipment may be a lithography machine, an exposure machine, or other professional measurement equipment that requires position measurement calibration. The position measurement system in the optical equipment can perform positioning control and measurement on the motion table.
本申请中对位置测量***的具体结构不做限制,在一实施例中,位置测量***为干涉仪测量***、激光三角尺或激光位移传感器。位置测量***也可以是其他结构,如曝光机中的精密运动设备。The specific structure of the position measurement system is not limited in this application. In one embodiment, the position measurement system is an interferometer measurement system, a laser triangle, or a laser displacement sensor. Position measurement systems can also be other structures, such as precision motion equipment in exposure machines.
继续参见图1,可以定义该位置测量***中光学测量载台框架的运动方向为X向,在水平面上垂直于X向的方向为Y向,竖直方向为Z向,建立XYZ三维坐标系。Continuing to refer to FIG. 1, the movement direction of the optical measurement stage frame in the position measurement system can be defined as the X direction, the direction perpendicular to the X direction on the horizontal plane is the Y direction, and the vertical direction is the Z direction, and an XYZ three-dimensional coordinate system is established.
在一实施例中,第一方向平行于预设坐标系中的X轴,第二方向平行于所述预设坐标系中的Y轴;或者,第一方向平行于预设坐标系中的Y轴,第二方向平行于所述预设坐标系中的X轴。In an embodiment, the first direction is parallel to the X axis in the preset coordinate system, and the second direction is parallel to the Y axis in the preset coordinate system; or the first direction is parallel to Y in the preset coordinate system. Axis, the second direction is parallel to the X axis in the preset coordinate system.
图3是本申请实施例提供的一种基底结构示意图。参见图3,可以在基底100上设置多个沿第一方向和第二方向呈阵列排布的对准量测标记200,形成测量栅格。其中,沿第一方向(或第二方向)排布的多个对准量测标记200之间的间距相同,但是沿第一方向排布的对准量测标记200之间的间距与沿第二方向排布的对准量测标记200之间的间距不同。FIG. 3 is a schematic diagram of a base structure provided by an embodiment of the present application. Referring to FIG. 3, a plurality of alignment measurement marks 200 arranged in an array along the first direction and the second direction may be provided on the substrate 100 to form a measurement grid. Wherein, the intervals between the plurality of alignment measurement marks 200 arranged along the first direction (or the second direction) are the same, but the intervals between the alignment measurement marks 200 arranged along the first direction are the same as those along the first The spacing between the alignment measurement marks 200 arranged in two directions is different.
为了测量准确,避免基底在以不同角度吸附在基底吸附台13时,因对准量测标记200的图形形状造成测量误差,在一实施例中,对准量测标记200的图形为中心对称图形。In order to measure accurately, to avoid measurement errors caused by the shape of the alignment measurement mark 200 when the substrate is adsorbed on the substrate adsorption table 13 at different angles, in one embodiment, the alignment alignment mark 200 is a center-symmetrical shape. .
需要说明的是,对准量测标记200沿第一方向和第二方向呈阵列排布,沿第一方向或第二方向排布的多个对准量测标记200之间的间距可以相同也可以不同。对准量测标记200之间的间距可以根据实际情况进行设置,在一实施例中,可以设置间距在4-8mm左右。本申请对对准测量标记200的沿第一方向和第二方向的排列位置不做限制,例如,可以设置各个对准量测标记200以基底100的中心呈中心旋转对称分布。It should be noted that the alignment measurement marks 200 are arranged in an array along the first direction and the second direction, and the spacing between the plurality of alignment measurement marks 200 arranged along the first direction or the second direction may be the same or Can be different. The spacing between the alignment measurement marks 200 can be set according to the actual situation. In one embodiment, the spacing can be set at about 4-8 mm. This application does not limit the alignment positions of the alignment measurement marks 200 in the first direction and the second direction. For example, each alignment measurement mark 200 may be set to be center-rotationally distributed around the center of the substrate 100.
图4是本申请实施例提供的几种对准量测标记的图形结构。参见图4,可以设置对准量 测标记200自身呈180度和90度中心旋转对称分布。可以通过曝光机曝光制作对准量测标记200。FIG. 4 is a graphic structure of several alignment measurement marks provided in the embodiment of the present application. Referring to FIG. 4, the alignment measurement marks 200 can be set to be distributed symmetrically at 180 ° and 90 ° centers. The alignment measurement mark 200 can be made by exposure with an exposure machine.
以图1提供的位置测量设备作为光学设备为例,设置基底100以第一角度水平吸附在光学设备的基底吸附台13上,通过光学设备中的位置测量***获取基底上预设对准量测标记的第一实际位置信息。Taking the position measuring device provided in FIG. 1 as an optical device as an example, the substrate 100 is set to be horizontally adsorbed on the substrate adsorption table 13 of the optical device at a first angle, and a preset alignment measurement on the substrate is obtained through the position measurement system in the optical device. Marked first actual position information.
在步骤S120中,通过位置测量***获取预设对准量测标记的第二实际位置信息,其中,基底以第二角度水平吸附在基底吸附台上,第二角度不同于第一角度。In step S120, the second actual position information of the preset alignment measurement mark is acquired by the position measurement system, wherein the substrate is horizontally adsorbed on the substrate adsorption table at a second angle, and the second angle is different from the first angle.
考虑到大多数位置测量设备的运动台一般只能设置单个自由度的运动,多个自由度的相关性数据无法获取,因此,本实施例中仅需要基底在水平方向以不同的角度吸附在基底吸附台上即可,操作简单,对位置测量设备自由度要求较低,适用于多种位置测量设备的栅格误差的测量。Considering that the movement stage of most position measurement equipment generally can only set a single degree of freedom movement, correlation data of multiple degrees of freedom cannot be obtained. Therefore, in this embodiment, it is only required that the substrate is adsorbed on the substrate at different angles in the horizontal direction. It can be mounted on the adsorption table, it is easy to operate, and it has low requirements on the degree of freedom of the position measuring equipment. It is suitable for the grid error measurement of various position measuring equipment.
在步骤S130中,根据第一实际位置信息、第二实际位置信息和预设对准量测标记的标准位置信息计算位置测量***的栅格误差。In step S130, the grid error of the position measurement system is calculated according to the first actual position information, the second actual position information, and the standard position information of the preset alignment measurement mark.
其中,栅格误差为位置测量***本身导致的测量误差,因此,可以提前记录对准测量标记的标准位置信息,其中,可以只记录计算栅格误差过程中用到的预设对准量测标记的标准位置信息,也可以记录基底上设置的所有的对准量测标记的标准位置信息。Among them, the grid error is a measurement error caused by the position measurement system itself. Therefore, the standard position information of the alignment measurement mark can be recorded in advance, and only the preset alignment measurement mark used in the calculation of the grid error can be recorded. The standard position information can also record the standard position information of all the alignment measurement marks set on the substrate.
需要说明的是,栅格误差表征的是位置测量***测量水平向误差情况,考虑到大部分位置测量***的运动台只能设置单个自由度的运动,为了避免采集多个自由度的相关性数据,本申请设置基底以不同的角度水平吸附在基底吸附台上,并采集不同吸附角度时对准量测标记的实际位置信息,通过预设算法计算不同角度下的实际位置信息,得到位置测量***的栅格误差。It should be noted that the grid error characterizes the horizontal measurement error of the position measurement system. Considering that the movement stage of most position measurement systems can only set a single degree of freedom movement, in order to avoid collecting correlation data of multiple degrees of freedom In this application, the substrate is set to be horizontally adsorbed on the substrate adsorption table at different angles, and the actual position information of the alignment measurement marks at different adsorption angles is collected, and the actual position information at different angles is calculated by a preset algorithm to obtain a position measurement system. Grid error.
本实施例提供的栅格误差的测量方法,无需大掩膜板,计算方法简单,可以对位置测量***的测量位置进行校准,使最终位置量测或运动位置准确,且不需要采集运动台在不同姿态下(包括旋转、倾斜等)较大范围的位置数据进行数学拟合计算,避免了无法获取多个自由度的相关性数据而使位置模型无法求解的情况。The method for measuring the grid error provided by this embodiment does not require a large mask plate, and the calculation method is simple. The measurement position of the position measurement system can be calibrated to make the final position measurement or the movement position accurate, and it is not necessary to collect the motion table. A large range of position data under different attitudes (including rotation, tilt, etc.) are mathematically fitted and calculated, which avoids the situation that the position model cannot be solved because correlation data of multiple degrees of freedom cannot be obtained.
目前,栅格误差主要有以下三种:旋转度误差、非正交性误差和平移误差。Currently, there are three main types of grid errors: rotation errors, non-orthogonal errors, and translation errors.
首先,旋转度误差是由于位置测量***(例如,干涉仪测量***)的安装误差引起的,对位置测量或运动定位可能会产生影响。旋转度误差为光学测量载台在沿第一方向(或第二方向)运动过程中在该方向上具有一定的偏移量,并且该偏移量的值呈线性变化。First, the rotation error is caused by an installation error of a position measurement system (for example, an interferometer measurement system), which may have an impact on position measurement or motion positioning. The rotation error is that the optical measurement stage has a certain offset in that direction during the movement in the first direction (or the second direction), and the value of the offset changes linearly.
图5是本申请实施例提供的一种旋转度误差的示意图。参见图5,示例性地,当载台(光学测量载台或基底载台)在沿Y向运动过程中,载台实际位置301相对于同一Y位置的载台期望位置302的旋转量Rz呈线性变化,会导致对准量测标记200的实际位置201相对于其标准位置202在沿Y向具有呈线性变化的偏移量dy,此为运动台栅格Y向旋转度误差。同理,当光学测量载台在沿X向运动过程,旋转度误差会使位置量测或运动定位在相对各个对准量测标记200的标准位置202沿X向的偏移量dx呈线性变化的位置。FIG. 5 is a schematic diagram of a rotation error provided by an embodiment of the present application. Referring to FIG. 5, for example, when the stage (optical measurement stage or base stage) moves in the Y direction, the rotation amount Rz of the actual position of the stage 301 relative to the expected position 302 of the stage at the same Y position is The linear change will cause the actual position 201 of the alignment measurement mark 200 to have a linear change offset dy in the Y direction relative to its standard position 202, which is an error of the rotation degree of the table grid Y direction. Similarly, when the optical measurement stage is moving in the X direction, the rotation error will cause the position measurement or movement to be positioned linearly relative to the standard position 202 of each alignment measurement mark 200 in the X direction. s position.
其次,非正交性误差由于运动台的导轨不垂直导致,会对位置测量产生影响。非正交性误差为光学测量载台在沿第一方向(或第二方向)运动过程中在另一方向上具有一定的偏移量,并且该偏移量的值呈线性变化。Secondly, the non-orthogonal error is caused by the non-vertical guide rails of the moving table, which will affect the position measurement. The non-orthogonality error is that the optical measurement stage has a certain offset in another direction during the movement in the first direction (or the second direction), and the value of the offset changes linearly.
图6是本申请实施例提供的一种非正交性误差的示意图。参见图6,示例性地,当载台 在沿Y向运动过程中,对准量测标记200的实际位置201相对于其标准位置202在沿X向具有呈线性变化的偏移量dx,此为运动台栅格Y向非正交性误差。同理,当光学测量载台在沿X向运动过程,X向非正交性误差会使位置量测或运动定位在相对各个对准量测标记200的标准位置202沿Y向的偏移量dy呈线性变化的位置。FIG. 6 is a schematic diagram of a non-orthogonality error provided by an embodiment of the present application. Referring to FIG. 6, for example, when the stage moves in the Y direction, the actual position 201 of the alignment measurement mark 200 relative to its standard position 202 has an offset dx that changes linearly in the X direction. Is the non-orthogonality error of the moving table grid Y direction. Similarly, when the optical measurement stage is moving in the X direction, the non-orthogonality error in the X direction will cause the position measurement or movement to be positioned at an offset in the Y direction relative to the standard position 202 of each alignment measurement mark 200. The position where dy changes linearly.
最后,平移误差主要由位置测量***中运动导轨或镜面不平整导致,例如,干涉仪平面镜不平整,会对位置测量产生影响。平移误差为载台在沿第一方向(或第二方向)运动过程中,在另一方向上同一数值时具有相同的偏移量,不同数值时偏移量变化且无规律。Finally, the translation error is mainly caused by the unevenness of the moving guide or the mirror surface in the position measurement system. For example, the unevenness of the plane mirror of the interferometer will affect the position measurement. The translation error is that during the movement of the carrier in the first direction (or the second direction), the same offset value is obtained in the same direction in the other direction, and the offset value varies and is irregular when the value is different.
图7是本申请实施例提供的一种平移误差的示意图。参见图7,示例性地,在光学测量载台在沿Y向运动过程中,对准量测标记200的实际位置201相对于其标准位置202在同一Y位置具有相同的偏移量dx,但在不同的Y位置的偏移量dx变化且无规律。同理,当光学测量载台在沿X向运动过程,X向平移误差会使位置量测在相对各个对准量测标记200的标准位置202同一X位置具有相同的偏移量dy,但在不同的X位置的偏移量dy变化且无规律。FIG. 7 is a schematic diagram of a translation error provided by an embodiment of the present application. Referring to FIG. 7, for example, during the movement of the optical measurement stage in the Y direction, the actual position 201 of the alignment measurement mark 200 has the same offset dx at the same Y position relative to its standard position 202, but The offset dx at different Y positions varies and is irregular. Similarly, when the optical measurement stage is moving in the X direction, the translation error in the X direction will cause the position measurement to have the same offset dy at the same X position relative to the standard position 202 of each alignment measurement mark 200. The offset dy of different X positions varies and is irregular.
在上述实施例的基础上,本实施例提供了另一种栅格误差的测量方法。图8是本申请实施例提供的另一种栅格误差的测量方法的流程图。参见图8,当测量的栅格误差为旋转度误差时,该栅格误差的测量方法包括步骤S210,步骤S220,步骤S231,步骤S232以及步骤S233。Based on the above embodiments, this embodiment provides another method for measuring grid errors. FIG. 8 is a flowchart of another method for measuring a grid error according to an embodiment of the present application. Referring to FIG. 8, when the measured grid error is a rotation error, the method for measuring the grid error includes steps S210, S220, S231, S232, and S233.
在步骤S210中,通过光学设备中的位置测量***获取基底上预设对准量测标记的第一实际位置信息,其中,基底以第一角度水平吸附在光学设备的基底吸附台上,预设对准量测标记包括在第二方向上的至少两列对准量测标记。In step S210, the first actual position information of the preset alignment measurement mark on the substrate is acquired through a position measurement system in the optical device, wherein the substrate is horizontally adsorbed on the substrate adsorption table of the optical device at a first angle, and the preset The alignment measurement marks include at least two columns of alignment measurement marks in the second direction.
需要说明的是,由于旋转度误差为载台在沿某一方向运动过程中,在该方向中出现线性变化的偏移量,因此需要计算多组沿该方向的偏移量。示例性地,为了测量Y向的旋转度误差,可以选择沿Y向上的至少两列对准量测标记,计算同一Y值时不同列(即不同X值)的对准量测标记对应的偏移量dy,计算各个Y值时各自对应的偏移量dy,以此得到Y向的旋转度误差。It should be noted that, since the rotation error is the offset that the carrier changes linearly in a certain direction during the movement of the stage in a certain direction, it is necessary to calculate a plurality of sets of offsets along the direction. For example, in order to measure the rotation error in the Y direction, at least two columns of alignment measurement marks along the Y direction may be selected, and the offsets corresponding to the alignment measurement marks in different columns (that is, different X values) when the same Y value is calculated are selected. The shift amount dy is used to calculate the respective shift amount dy for each Y value, thereby obtaining the rotation error in the Y direction.
同理,为了测量X向的旋转度误差可以选着沿X方向上的至少两行对准量测标记。Similarly, in order to measure the rotation error in the X direction, at least two rows of alignment measurement marks in the X direction may be selected.
在步骤S220中,通过位置测量***获取预设对准量测标记的第二实际位置信息,其中,基底以第二角度水平吸附在基底吸附台上,第一角度为0度,第二角度为180度。In step S220, the second actual position information of the preset alignment measurement mark is acquired by the position measurement system, wherein the substrate is horizontally adsorbed on the substrate adsorption table at a second angle, the first angle is 0 degree, and the second angle is 180 degree.
需要说明的是,由于运动台栅格和测量基底自身的栅格都有可能存在旋转度误差,设置基底分别以0度和180度吸附在基底吸附台上,在基底以0度和180度吸附时的测量结果,是两者旋转度误差的叠加,可以根据二者的计算结果更加准确的计算出该位置测量***中的旋转度误差。It should be noted that since there may be rotation errors between the grid of the moving table and the grid of the measuring substrate itself, the substrate is set to be adsorbed on the substrate adsorption table at 0 degrees and 180 degrees, and the substrate is adsorbed at 0 degrees and 180 degrees, respectively. The measurement result of time is the superposition of the rotation error between the two, and the rotation error in the position measurement system can be calculated more accurately based on the calculation results of the two.
在步骤S231中,根据第一实际位置信息和预设对准量测标记的标准位置信息,确定基底以0度水平吸附在基底吸附台上时测量栅格的第一栅格旋转度。In step S231, according to the first actual position information and the standard position information of the preset alignment measurement mark, a first grid rotation degree of the measurement grid is determined when the substrate is adsorbed on the substrate adsorption table at a level of 0 degrees.
在步骤S232中,根据第二实际位置信息和预设对准量测标记的标准位置信息,确定基底以180度水平吸附在基底吸附台上时测量栅格的第二栅格旋转度。In step S232, according to the second actual position information and the standard position information of the preset alignment measurement mark, a second grid rotation degree of the measurement grid is determined when the substrate is adsorbed on the substrate adsorption table at a 180-degree level.
在步骤S233中,根据第一栅格旋转度和第二栅格旋转度计算位置测量***的第二方向的栅格旋转度误差。In step S233, a grid rotation error in the second direction of the position measurement system is calculated based on the first grid rotation and the second grid rotation.
需要说明的是,需要对基底在不同角度下的偏移量和栅格旋转度进行计算,并通过两次测量的栅格旋转度确定该栅格旋转度误差。It should be noted that it is necessary to calculate the offset and grid rotation of the substrate at different angles, and determine the grid rotation error by measuring the grid rotation twice.
在一实施例中,步骤S231,包括:根据对准量测标记对的第一实际位置信息及标准位置信息,计算对准量测标记对的第一旋转量,其中,对准量测标记对包括在第一方向上的位于同一行的两个对准量测标记,任一第一旋转量Rotyn_0满足:Rotyn_0=(pos_yj_0-pos_yi_0)/(xj-xi),pos_yi_0为0度下对准量测标记对中第一对准量测标记的第一实际位置信息在第一方向上的坐标值,pos_yj_0为0度下对准量测标记对中第二对准量测标记的第一实际位置信息在第一方向上的坐标值,xi为第一对准量测标记的标准位置信息在第二方向上的坐标值,xj为第二对准量测标记的标准位置信息在第二方向上的坐标值;根据多个不同对准量测标记对的第一旋转量及标准位置信息,线性拟合计算出所述第一栅格旋转度,其中,线性拟合公式满足:Rotyn_0=K0×(yi+yj)/2+dRotyn_0,K0为所述第一栅格旋转度,yi为所述第一对准量测标记的标准位置信息在所述第一方向上的坐标值,yj为所述第二对准量测标记的标准位置信息在所述第一方向上的坐标值,dRotyn_0为0度下的拟合残差。In an embodiment, step S231 includes: calculating a first rotation amount of the alignment measurement mark pair according to the first actual position information and the standard position information of the alignment measurement mark pair, wherein the alignment measurement mark pair Including two alignment measurement marks located in the same row in the first direction, any first rotation amount Rotyn_0 satisfies: Rotyn_0 = (pos_yj_0-pos_yi_0) / (xj-xi), and pos_yi_0 is the alignment amount at 0 degrees The coordinate value of the first actual position information of the first alignment measurement mark in the measurement mark pair in the first direction. Pos_yj_0 is the first actual position of the second alignment measurement mark in the alignment measurement mark pair at 0 degrees. The coordinate value of the information in the first direction, xi is the coordinate value of the standard position information of the first alignment measurement mark in the second direction, and xj is the standard position information of the second alignment measurement mark in the second direction. Coordinate value according to the first rotation amount and standard position information of a plurality of different alignment measurement mark pairs, and the first grid rotation degree is calculated by linear fitting, wherein the linear fitting formula satisfies: Rotyn_0 = K0 × (yi + yj) / 2 + dRotyn_0, K0 is the first grid rotation , Yi is the coordinate value of the standard position information of the first alignment measurement mark in the first direction, and yj is the standard position information of the second alignment measurement mark in the first direction. Coordinate value, dRotyn_0 is the fitted residual at 0 degrees.
步骤S232,包括:根据对准量测标记对的第二实际位置信息及标准位置信息,计算对准量测标记对的第二旋转量,任一所述第二旋转量Rotyn_180满足:Rotyn_180=(pos_yj_180-pos_yi_180)/(-xj+xi),pos_yi_180为180度下对准量测标记对中第一对准量测标记的第一实际位置信息在第一方向上的坐标值,pos_yj_180为180度下所述对准量测标记对中第二对准量测标记的第一实际位置信息在所述第一方向上的坐标值;根据多个不同对准量测标记对的第二旋转量及标准位置信息,线性拟合计算出第二栅格旋转度,其中,线性拟合公式满足:Rotyn_180=K180×(-yi-yj)/2+dRotyn_180,K180为所述第二栅格旋转度,dRotyn_180为180度下的拟合残差;相应的,S233中第二方向的栅格旋转度误差K_ws_z满足以下公式:K_ws_z=(K0-K180)/2。Step S232 includes: calculating a second rotation amount of the alignment measurement mark pair according to the second actual position information and the standard position information of the alignment measurement mark pair. Any of the second rotation amounts Rotyn_180 satisfies: Rotyn_180 = ( pos_yj_180-pos_yi_180) / (-xj + xi), pos_yi_180 is the coordinate value in the first direction of the first actual position information of the first alignment measurement mark in the alignment measurement mark pair at 180 degrees, and pos_yj_180 is 180 degrees The coordinate values of the first actual position information of the second alignment measurement mark pair in the first direction in the alignment measurement mark pair described below; according to the second rotation amount and Standard position information, linear fitting to calculate the second grid rotation, wherein the linear fitting formula satisfies: Rotyn_180 = K180 × (-yi-yj) / 2 + dRotyn_180, K180 is the second grid rotation, dRotyn_180 is the fitting residual at 180 degrees; correspondingly, the grid rotation error K_ws_z in the second direction in S233 satisfies the following formula: K_ws_z = (K0-K180) / 2.
图9是本申请实施例提供的一种旋转度误差的示意图。参见图9,例如,以第一方向为X向(第一方向平行于X轴),第二方向为Y向为例(第二方向平行于Y轴),通过上述栅格误差测量方法测量Y向栅格误差旋转度。FIG. 9 is a schematic diagram of a rotation error provided by an embodiment of the present application. Referring to FIG. 9, for example, taking the first direction as the X direction (the first direction is parallel to the X axis) and the second direction as the Y direction as an example (the second direction is parallel to the Y axis), the Y is measured by the above grid error measurement method. Rotation to grid error.
首先,选择在Y向上的至少两列对准量测标记为预设对准量测标记,可以提前记录各个预设对准量测标记的标准位置信息202,例如,Mark1和Mark2为X方向上同一Y值的一对对准量测标记对,Mark3和Mark4为X方向上另一个同一Y值的一对对准量测标记对,记录Mark1的标准位置信息为(x1,y1),Mark2的标准位置信息为(x2,y2),依次记录多个不同对准量测标记对的标准位置信息为(x3,y3)、(x4,y4)……(xN,yN)。First, at least two columns of alignment measurement marks in the Y direction are selected as preset alignment measurement marks, and the standard position information 202 of each preset alignment measurement mark can be recorded in advance. For example, Mark1 and Mark2 are in the X direction. A pair of alignment measurement mark pairs of the same Y value. Mark3 and Mark4 are another pair of alignment measurement mark pairs of the same Y value in the X direction. The standard position information of Mark1 is recorded as (x1, y1). The standard position information is (x2, y2), and the standard position information for sequentially recording a plurality of different alignment measurement mark pairs is (x3, y3), (x4, y4), ... (xN, yN).
其次,参见图9(a),使基底以0度水平吸附在光学设备的基底吸附台上,依次测量预设对准量测标记的第一实际位置信息。示例性地,记录Mark1的第一实际位置信息为(pos_x1_0,pos_y1_0),Mark2的第一实际位置信息为(pos_x2_0,pos_y2_0),依次记录多个不同对准量测标记对的第一实际位置信息为(pos_x3_0,pos_y3_0)、(pos_x4_0,pos_y4_0)......(pos_xN_0,pos_yN_0)。Secondly, referring to FIG. 9 (a), the substrate is adsorbed on the substrate adsorption table of the optical device at a level of 0 degrees, and the first actual position information of the preset alignment measurement mark is sequentially measured. Exemplarily, the first actual position information of Mark1 is recorded as (pos_x1_0, pos_y1_0), the first actual position information of Mark2 is (pos_x2_0, pos_y2_0), and the first actual position information of multiple different alignment measurement mark pairs are sequentially recorded. Are (pos_x3_0, pos_y3_0), (pos_x4_0, pos_y4_0) ... (pos_xN_0, pos_yN_0).
通过Rotyn_0=(pos_yj_0-pos_yi_0)/(xj-xi),计算各个对准量测标记对对应的第一旋转量Rotyn_0:Through Rotyn_0 = (pos_yj_0-pos_yi_0) / (xj-xi), calculate the first rotation amount Rotyn_0 corresponding to each alignment measurement mark pair:
Roty12_0=(pos_y2_0-pos_y1_0)/(x2-x1);Roty12_0 = (pos_y2_0-pos_y1_0) / (x2-x1);
Roty34_0=(pos_y4_0-pos_y3_0)/(x4-x3);Roty34_0 = (pos_y4_0-pos_y3_0) / (x4-x3);
……...
Roty(N-1)N_0=(pos_yN_0-pos_y(N-1)_0)/(xN-x(N-1));Roty (N-1) N_0 = (pos_yN_0-pos_y (N-1) _0) / (xN-x (N-1));
其中,N为偶数。根据得到的N/2个旋转量和标准位置信息中y的位置,线性拟合计算0度下的第一栅格旋转度Rotyn_0:Where N is an even number. According to the obtained N / 2 rotation amounts and the position of y in the standard position information, a linear fitting is performed to calculate the first grid rotation degree Rotyn_0 at 0 degrees:
Rotyn_0=K0×yn_0+dRotyn_0;Rotyn_0 = K0 × yn_0 + dRotyn_0;
其中,Rotyn_0取Roty12_0、Roty34_0、…或Roty(N-1)N_0;yn_0取(y1+y2)/2、(y3+y4)/2、…或(y(N-1)+yN)/2,dRotyn_0为拟合残差;Among them, Rotyn_0 takes Roty12_0, Roty34_0, ... or Roty (N-1) N_0; yn_0 takes (y1 + y2) / 2, (y3 + y4) / 2, ... or (y (N-1) + yN) / 2 , DRotyn_0 is the fitted residual;
即根据:That is according to:
Roty12_0=K0×(y1+y2)/2+dRoty12_0;Roty12_0 = K0 × (y1 + y2) / 2 + dRoty12_0;
Roty34_0=K0×(y3+y4)/2+dRoty34_0;Roty34_0 = K0 × (y3 + y4) / 2 + dRoty34_0;
……...
Roty(N-1)N_0=K0×(y(N-1)+yN)/2+dRoty(N-1)N_0;Roty (N-1) N_0 = K0 × (y (N-1) + yN) / 2 + dRoty (N-1) N_0;
通过补偿各自的拟合残差,线性拟合得出0度时的第一栅格旋转度K0。By compensating the respective fitting residuals, a linear fit yields the first grid rotation K0 at 0 degrees.
由于运动台栅格和测量基底自身的栅格都有可能存在旋转度误差,所以0度是得到的第一栅格旋转度K0,是两者旋转度误差的叠加:Since there may be rotation errors between the grid of the moving table and the grid of the measurement base itself, 0 degrees is the obtained first grid rotation K0, which is the superposition of the rotation errors of the two:
其中,K0=(K_ws_y+K_plate_y);Where K0 = (K_ws_y + K_plate_y);
K_ws_y为运动台的栅格旋转度误差,K_plate_y为测量基底自身的栅格旋转度误差。K_ws_y is the grid rotation error of the motion table, and K_plate_y is the grid rotation error of the measurement base itself.
然后,参见图9(b),使基底以180度水平吸附在光学设备的基底吸附台上,依次测量预设对准量测标记的第二实际位置信息。示例性地,记录Mark1的第二实际位置信息为(pos_x1_180,pos_y1_180),Mark2的第二实际位置信息为(pos_x2_180,pos_y2_180,依次记录多个不同对准量测标记对的第二实际位置信息为(pos_x3_180,pos_y3_180)、(pos_x4_180,pos_y4_180)……(pos_xN_180,pos_yN_180)。Then, referring to FIG. 9 (b), the substrate is adsorbed on the substrate adsorption table of the optical device at a 180-degree level, and the second actual position information of the preset alignment measurement mark is sequentially measured. Exemplarily, the second actual position information of Mark1 is recorded as (pos_x1_180, pos_y1_180), the second actual position information of Mark2 is (pos_x2_180, pos_y2_180, and the second actual position information of multiple different alignment measurement mark pairs is sequentially recorded as (pos_x3_180, pos_y3_180), (pos_x4_180, pos_y4_180) ... (pos_xN_180, pos_yN_180).
通过Rotyn_180=(pos_yj_0-pos_yi_0)/(-xj+xi),计算各个对准量测标记对对应的第一旋转量Rotyn_180:Through Rotyn_180 = (pos_yj_0-pos_yi_0) / (-xj + xi), calculate the first rotation amount Rotyn_180 corresponding to each alignment measurement mark pair:
Roty12_180=(pos_y2_180-pos_y1_180)/(-x2+x1);Roty12_180 = (pos_y2_180-pos_y1_180) / (-x2 + x1);
Roty34_180=(pos_y4_180-pos_y3_180)/(-x4+x3);Roty34_180 = (pos_y4_180-pos_y3_180) / (-x4 + x3);
……...
Roty(N-1)N_180=(pos_yN_180-pos_y(N-1)_180)/(-xN+x(N-1));Roty (N-1) N_180 = (pos_yN_180-pos_y (N-1) _180) / (-xN + x (N-1));
根据得到的N/2个旋转量和标准位置信息中y的位置,线性拟合计算180度下的第二栅格旋转度Rotyn_180:According to the obtained N / 2 rotation amounts and the position of y in the standard position information, a linear fit is performed to calculate the second grid rotation degree Rotyn_180 at 180 degrees:
Rotyn_180=K180×yn_180+dRotyn_180;Rotyn_180 = K180 × yn_180 + dRotyn_180;
其中,Rotyn_180取Roty12_180、Roty34_180...或Roty(N-1)N_180;yn_180取-(y1+y2)/2、-(y3+y4)/2...或-(y(N-1)+yN)/2,dRotyn_180为拟合残差;Among them, Rotyn_180 takes Roty12_180, Roty34_180 ... or Roty (N-1) N_180; yn_180 takes-(y1 + y2) / 2,-(y3 + y4) / 2 ... or-(y (N-1) + yN) / 2, dRotyn_180 is the fitting residual;
即根据:That is according to:
Roty12_180=-(y1+y2)/2×K180+dRoty12_180;Roty12_180 =-(y1 + y2) / 2 × K180 + dRoty12_180;
Roty34_180=-(y3+y4)/2×K180+dRoty34_180;Roty34_180 =-(y3 + y4) / 2 × K180 + dRoty34_180;
……...
Roty(N-1)N_180=-(y(N-1)+yN)/2×K180+dRoty(N-1)N_180;Roty (N-1) N_180 =-(y (N-1) + yN) / 2 × K180 + dRoty (N-1) N_180;
通过补偿各自的拟合残差,线性拟合得出180度时的第二栅格旋转度K180。By compensating the respective fitting residuals, a linear fit yields the second grid rotation K180 at 180 degrees.
其中,K180=-(K_ws_y-K_plate_y)。Among them, K180 =-(K_ws_y-K_plate_y).
根据K0和K180可以得出基底载台Y向栅格旋转度误差K_ws_y:According to K0 and K180, the Y-axis grid rotation error K_ws_y of the substrate carrier can be obtained:
K_ws_y=(K0-K180)/2。K_ws_y = (K0-K180) / 2.
可以理解的是,测量基底载台X向栅格旋转度误差K_ws_x方法与上述实施例提供的测量方法类似,选用基底上X方向上两行(或者多行)标记进行0度和180度测量校准,如图9(c)和9(d)。It can be understood that the method of measuring the rotation error K_ws_x of the X-axis grid of the substrate stage is similar to the measurement method provided in the foregoing embodiment. Two rows (or multiple rows) of marks on the substrate in the X direction are selected for 0-degree and 180-degree measurement calibration. , As shown in Figures 9 (c) and 9 (d).
本实施例提供的栅格误差的测量方法,通过计算基底以不同角度吸附在基底载台上的实际位置和标准位置信息计算所述位置测量***的栅格旋转度误差,计算方法简单,可以对位置测量***的测量位置进行校准,使最终位置量测或运动位置准确,且不需要采集运动台在不同姿态下(包括旋转、倾斜等)较大范围的位置数据进行数学拟合计算,避免了无法获取多个自由度的相关性数据而使位置模型无法求解的情况。The grid error measurement method provided in this embodiment calculates the grid rotation error of the position measurement system by calculating the actual position and standard position information of the substrate adsorbed on the substrate carrier at different angles. The calculation method is simple, and The measurement position of the position measurement system is calibrated to make the final position measurement or movement position accurate, and it is not necessary to collect a large range of position data of the motion table in different attitudes (including rotation, tilt, etc.) for mathematical fitting calculations, avoiding Circumstances where multiple degrees of freedom correlation data cannot be obtained and the position model cannot be solved.
本申请实施例还提供了另一种栅格误差的测量方法。图10是本申请实施例提供的另一种栅格误差的测量方法的流程图。参见图10,当测量的栅格误差为非正交性误差时,该栅格误差的测量方法包括步骤S310,步骤S320,步骤S331,步骤S332,以及步骤S333。The embodiment of the present application also provides another method for measuring grid errors. FIG. 10 is a flowchart of another method for measuring grid errors according to an embodiment of the present application. Referring to FIG. 10, when the measured grid error is a non-orthogonal error, the method for measuring the grid error includes steps S310, S320, S331, S332, and S333.
在步骤S310中,通过光学设备中的位置测量***获取基底上预设对准量测标记的第一实际位置信息,其中,基底以第一角度水平吸附在光学设备的基底吸附台上,预设对准量测标记包括在第一方向上的至少一行对准量测标记以及在第二方向上的至少一列对准量测标记。In step S310, the first actual position information of the preset alignment measurement mark on the substrate is acquired through a position measurement system in the optical device, wherein the substrate is horizontally adsorbed on the substrate adsorption table of the optical device at a first angle, and the preset The alignment measurement marks include at least one row of alignment measurement marks in a first direction and at least one column of alignment measurement marks in a second direction.
需要说明的是,由于非正交性误差为载台在沿某一方向运动过程中,在与其垂直的方向中出现线性变化的偏移量。示例性地,运动台在沿Y向运动过程中有线性变化的X向偏移量,由于运动台栅格、测量基底自身栅格都有可能存在非正交性误差,所以根据0度和90度测量结果,计算该非正交性误差。It should be noted that, due to the non-orthogonal error, the displacement of the carrier linearly changes in a direction perpendicular to the carrier during the movement of the carrier in a certain direction. Exemplarily, the moving table has a linearly changing X-direction offset during the movement in the Y direction. Since there may be non-orthogonal errors in the moving table grid and the measuring base's own grid, according to 0 degrees and 90 Degree measurement results, and calculate the non-orthogonality error.
在步骤S320中,通过位置测量***获取预设对准量测标记的第二实际位置信息,其中,基底以第二角度水平吸附在基底吸附台上,第一角度为0度,第二角度为90度。In step S320, the second actual position information of the preset alignment measurement mark is acquired by the position measurement system, wherein the substrate is horizontally adsorbed on the substrate adsorption table at a second angle, the first angle is 0 degree, and the second angle is 90 degrees.
在步骤S331中,拟合计算基底以0度水平吸附在基底吸附台上时测量栅格的第一非正交性误差Orth_0。In step S331, the first non-orthogonality error Orth_0 of the measurement grid is fitted and calculated when the substrate is adsorbed on the substrate adsorption table at a level of 0 degrees.
pos_xm_0=Tx_0+xm×Sx_0-ym×Rzy_0+Res_xm_0;pos_xm_0 = Tx_0 + xm × Sx_0-ym × Rzy_0 + Res_xm_0;
pos_ym_0=Ty_0+ym×Sy_0+xm×Rzx_0+Res_ym_0;pos_ym_0 = Ty_0 + ym × Sy_0 + xm × Rzx_0 + Res_ym_0;
Orth_0=Rzy_0-Rzx_0;Orth_0 = Rzy_0-Rzx_0;
其中,pos_xm_0为0度下预设对准量测标记中任一对准量测标记的第一实际位置信息在第二方向上的坐标值,pos_ym_0为0度下任一对准量测标记的第一实际位置信息在第一方向上的坐标值,xm为任一对准量测标记的标准位置信息在第二方向上的坐标值,ym为任一对准量测标记的标准位置信息在第一方向上的坐标值,Tx_0为0度下对准量测标记整体在 第一方向上的平移,Ty_0为0度下对准量测标记整体在第二方向上的平移;Sx_0为0度下在第一方向上的缩放倍率,Sy_0为0度下在第二方向上的缩放倍率;Rzx_0表示0度下绕平行于第一方向的坐标轴的旋转,Rzy_0表示0度下绕平行于第二方向的坐标轴的旋转;Res_xm_0为0度下任一对准量测标记在第一方向上的位置残差,Res_ym_0为0度下任一对准量测标记在第二方向上的位置残差;Among them, pos_xm_0 is the coordinate value of the first actual position information of any of the alignment measurement marks at 0 degrees in the second direction, and pos_ym_0 is the alignment value of any of the alignment measurement marks at 0 degrees. The coordinate value of the first actual position information in the first direction, xm is the coordinate value of the standard position information of any alignment measurement mark in the second direction, and ym is the standard position information of any alignment measurement mark at The coordinate value in the first direction, Tx_0 is the translation of the entire alignment measurement mark at 0 degrees in the first direction, Ty_0 is the translation of the entire alignment measurement mark at 0 degrees in the second direction; Sx_0 is 0 degrees The zoom magnification in the first direction, Sy_0 is the zoom magnification in the second direction at 0 degrees; Rzx_0 represents the rotation around a coordinate axis parallel to the first direction at 0 degrees, and Rzy_0 represents the rotation parallel to the first direction at 0 degrees Rotation of the coordinate axis of the two directions; Res_xm_0 is the position residual of any alignment measurement mark at 0 degrees in the first direction, and Res_ym_0 is the position residual of any alignment measurement mark at 0 degrees in the second direction difference;
在步骤S332中,拟合计算基底以90度水平吸附在基底吸附台上时测量栅格的第二非正交性误差Orth_90。In step S332, the second non-orthogonality error Orth_90 of the measurement grid is fitted and calculated when the substrate is adsorbed on the substrate adsorption table at a level of 90 degrees.
pos_xm_90=Tx_90+xm×Sx_90-ym×Rzy_90+Res_xm_90;pos_xm_90 = Tx_90 + xm × Sx_90-ym × Rzy_90 + Res_xm_90;
pos_ym_90=Ty_90+ym×Sy_90+xm×Rzx_90+Res_ym_90;pos_ym_90 = Ty_90 + ym × Sy_90 + xm × Rzx_90 + Res_ym_90;
Orth_90=Rzy_90-Rzx_90;Orth_90 = Rzy_90-Rzx_90;
其中,pos_xm_90为90度下任一对准量测标记的第二实际位置信息在第二方向上的坐标值,pos_ym_90为90度下任一对准量测标记的第二实际位置信息在第一方向上的坐标值,Tx_90为90度下对准量测标记整体在第一方向上的平移,Ty_90为90度下对准量测标记整体在第二方向上的平移;Sx_90为90度下在第一方向上的缩放倍率,Sy_90为90度下在第二方向上的缩放倍率;Rzx_90表示90度下绕平行于第一方向的坐标轴的旋转,Rzy_90表示90度下绕平行于第二方向的坐标轴的旋转;Res_xm_90为90度下任一对准量测标记在第一方向上的位置残差,Res_ym_90为90度下任一对准量测标记在第二方向上的位置残差。Among them, pos_xm_90 is the coordinate value of the second actual position information of any alignment measurement mark at 90 degrees in the second direction, and pos_ym_90 is the second actual position information of any alignment measurement mark at 90 degrees at the first The coordinate value in the direction, Tx_90 is the translation of the entire measurement mark in the first direction at 90 degrees, Ty_90 is the translation of the entire measurement mark in the second direction at 90 degrees; Sx_90 is the 90 ° The magnification in the first direction, Sy_90 is the magnification in the second direction at 90 degrees; Rzx_90 represents the rotation around a coordinate axis parallel to the first direction at 90 degrees, and Rzy_90 represents the rotation parallel to the second direction at 90 degrees The rotation of the coordinate axis; Res_xm_90 is the position residual of any alignment measurement mark at 90 degrees in the first direction, and Res_ym_90 is the position residual of any alignment measurement mark at 90 degrees in the second direction.
在步骤S333中,根据第一非正交性误差和第二非正交性误差计算位置测量***的栅格非正交性误差Orth_ws。In step S333, the grid non-orthogonality error Orth_ws of the position measurement system is calculated according to the first non-orthogonality error and the second non-orthogonality error.
Orth_ws=(Orth_0+Orth_90)/2。Orth_ws = (Orth_0 + Orth_90) / 2.
图11是本申请实施例提供的一种非正交性误差的示意图。参见图11,例如,以第一方向为X向,第二方向为Y向为例,通过上述栅格误差测量方法测量栅格非正交性误差。FIG. 11 is a schematic diagram of a non-orthogonality error provided by an embodiment of the present application. Referring to FIG. 11, for example, taking the first direction as the X direction and the second direction as the Y direction as an example, the grid non-orthogonality error is measured by the above grid error measurement method.
首先,选择一行一列(或多行多列)对准量测标记为预设对准量测标记,可以提前记录各个预设对准量测标记的标准位置信息,例如,记录Mark1的标准位置信息为(x1,y1),Mark2的标准位置信息为(x2,y2),依次记录多个不同对准量测标记对的标准位置信息为(x3,y3)、(x4,y4)……(xM,yM)。First, select one row and one column (or multiple rows and multiple columns) of alignment measurement marks as the preset alignment measurement marks. The standard position information of each preset alignment measurement mark can be recorded in advance, for example, the standard position information of Mark1 is recorded. Is (x1, y1), the standard position information of Mark2 is (x2, y2), and the standard position information of multiple different alignment measurement mark pairs recorded in sequence is (x3, y3), (x4, y4) ... (xM , YM).
其次,参见图11(a),使基底以0度水平吸附在光学设备的基底吸附台上,依次测量预设对准量测标记的第一实际位置信息。示例性地,记录Mark1的第一实际位置信息为(pos_x1_0,pos_y1_0),Mark2的第一实际位置信息为(pos_x2_0,pos_y2_0),依次记录多个不同对准量测标记对的第一实际位置信息为(pos_x3_0,pos_y3_0)、(pos_x4_0,pos_y4_0)……和(pos_xM_0,pos_yM_0)。Secondly, referring to FIG. 11 (a), the substrate is adsorbed on the substrate adsorption table of the optical device at a level of 0 degrees, and the first actual position information of the preset alignment measurement mark is sequentially measured. Exemplarily, the first actual position information of Mark1 is recorded as (pos_x1_0, pos_y1_0), the first actual position information of Mark2 is (pos_x2_0, pos_y2_0), and the first actual position information of multiple different alignment measurement mark pairs are sequentially recorded. Are (pos_x3_0, pos_y3_0), (pos_x4_0, pos_y4_0) ... and (pos_xM_0, pos_yM_0).
根据得到的M个预设对准量测标记的第一实际位置信息和标准位置信息,拟合计算0度下测量栅格的第一非正交性误差Orth_0:According to the obtained first actual position information and standard position information of the M preset alignment measurement marks, the first non-orthogonality error Orth_0 of the measurement grid at 0 degrees is fitted and calculated:
pos_x1_0=Tx_0+x1×Sx_0-y1×Rzy_0+Res_x1_0;pos_x1_0 = Tx_0 + x1 × Sx_0-y1 × Rzy_0 + Res_x1_0;
pos_y1_0=Ty_0+y1×Sy_0+x1×Rzx_0+Res_y1_0;pos_y1_0 = Ty_0 + y1 × Sy_0 + x1 × Rzx_0 + Res_y1_0;
pos_x2_0=Tx_0+x2×Sx_0-y2×Rzy_0+Res_x2_0;pos_x2_0 = Tx_0 + x2 × Sx_0-y2 × Rzy_0 + Res_x2_0;
pos_y2_0=Ty_0+y2×Sy_0+x2×Rzx_0+Res_y2_0;pos_y2_0 = Ty_0 + y2 × Sy_0 + x2 × Rzx_0 + Res_y2_0;
……...
pos_xm_0=Tx_0+xm×Sx_0-ym×Rzy_0+Res_xm_0;pos_xm_0 = Tx_0 + xm × Sx_0-ym × Rzy_0 + Res_xm_0;
pos_ym_0=Ty_0+ym×Sy_0+xm×Rzx_0+Res_ym_0;pos_ym_0 = Ty_0 + ym × Sy_0 + xm × Rzx_0 + Res_ym_0;
根据上述多个公式进行拟合,得出Rzx_0和Rzy_0,并得到第一非正交性误差Orth_0:Orth_0=Rzy_0-Rzx_0。Fit according to the above multiple formulas to obtain Rzx_0 and Rzy_0, and obtain the first non-orthogonal error Orth_0: Orth_0 = Rzy_0-Rzx_0.
由于运动台栅格、测量基底自身栅格都有可能存在非正交性误差,所以0度时得到的第一非正交性误差Orth_0是两者非正交性误差的叠加:Orth_0=(Orth_ws+Orth_plate),Orth_ws为运动台的栅格非正交性误差,Orth_plate为测量基底自身的栅格非正交性误差。Since there may be non-orthogonal errors in the grid of the moving table and the grid of the measurement base itself, the first non-orthogonal error Orth_0 obtained at 0 degrees is the superposition of the non-orthogonal errors of the two: Orth_0 = (Orth_ws + Orth_plate), Orth_ws is the grid non-orthogonality error of the motion table, and Orth_plate is the grid non-orthogonality error of the measurement base itself.
然后,参见图11(b),使基底以90度水平吸附在光学设备的基底吸附台上,依次测量预设对准量测标记的第二实际位置信息。示例性地,记录Mark1的第二实际位置信息为(pos_x1_90,pos_y1_90),Mark2的第二实际位置信息为(pos_x2_90,pos_y2_90),依次记录多个不同对准量测标记对的第二实际位置信息为(pos_x3_90,pos_y3_90)、(pos_x4_90,pos_y4_90)……(pos_xM_90,pos_yM_90)。Then, referring to FIG. 11 (b), the substrate is adsorbed on the substrate adsorption table of the optical device at a 90-degree level, and the second actual position information of the preset alignment measurement mark is sequentially measured. Exemplarily, the second actual position information of Mark1 is recorded as (pos_x1_90, pos_y1_90), the second actual position information of Mark2 is (pos_x2_90, pos_y2_90), and the second actual position information of a plurality of different alignment measurement mark pairs is sequentially recorded. (Pos_x3_90, pos_y3_90), (pos_x4_90, pos_y4_90) ... (pos_xM_90, pos_yM_90).
根据得到的M个第二实际位置信息和标准位置信息,拟合计算90度下测量栅格的第二非正交性误差Orth_90:According to the obtained M second actual position information and standard position information, fit and calculate the second non-orthogonality error Orth_90 of the measurement grid at 90 degrees:
pos_x1_90=Tx_90+x1×Sx_90-y1×Rzy_90+Res_x1_90;pos_x1_90 = Tx_90 + x1 × Sx_90-y1 × Rzy_90 + Res_x1_90;
pos_y1_90=Ty_90+y1×Sy_90+x1×Rzx_90+Res_y1_90;pos_y1_90 = Ty_90 + y1 × Sy_90 + x1 × Rzx_90 + Res_y1_90;
pos_x2_90=Tx_90+x2×Sx_90-y2×Rzy_90+Res_x2_90;pos_x2_90 = Tx_90 + x2 × Sx_90-y2 × Rzy_90 + Res_x2_90;
pos_y2_90=Ty_90+y2×Sy_90+x2×Rzx_90+Res_y2_90;pos_y2_90 = Ty_90 + y2 × Sy_90 + x2 × Rzx_90 + Res_y2_90;
……...
pos_xm_90=Tx_90+xm×Sx_90-ym×Rzy_90+Res_xm_90;pos_xm_90 = Tx_90 + xm × Sx_90-ym × Rzy_90 + Res_xm_90;
pos_ym_90=Ty_90+ym×Sy_90+xm×Rzx_90+Res_ym_90;pos_ym_90 = Ty_90 + ym × Sy_90 + xm × Rzx_90 + Res_ym_90;
根据上述多个公式进行拟合,得出Rzy_90和Rzx_90,并得出第二非正交性误差Orth_90:Orth_90=Rzy_90-Rzx_90。Fit according to the above multiple formulas to obtain Rzy_90 and Rzx_90, and obtain the second non-orthogonality error Orth_90: Orth_90 = Rzy_90-Rzx_90.
根据Orth_0和Orth_90计算位置测量***的栅格非正交性误差Orth_ws:Calculate the grid non-orthogonality error Orth_ws of the position measurement system according to Orth_0 and Orth_90:
Orth_ws=(Orth_0+Orth_90)/2。Orth_ws = (Orth_0 + Orth_90) / 2.
本实施例提供的栅格误差的测量方法,通过计算基底以不同角度吸附在基底载台上的实际位置和标准位置信息计算所述位置测量***的栅格非正交性误差,计算方法简单,可以对位置测量***的测量位置进行校准,使最终位置量测或运动位置准确,且不需要采集运动台在不同姿态下(包括旋转、倾斜等)较大范围的位置数据进行数学拟合计算,避免了无法获取多个自由度的相关性数据而使位置模型无法求解的情况。The grid error measurement method provided in this embodiment calculates the grid non-orthogonality error of the position measurement system by calculating the actual position and standard position information of the substrate adsorbed on the substrate carrier at different angles, and the calculation method is simple. The measurement position of the position measurement system can be calibrated to make the final position measurement or movement position accurate, and it is not necessary to collect a large range of position data of the motion table under different attitudes (including rotation, tilt, etc.) for mathematical fitting calculations. It avoids the situation where the correlation data of multiple degrees of freedom cannot be obtained and the position model cannot be solved.
本申请实施例还提供了另一种栅格误差的测量方法。图12是本申请实施例提供的另一种栅格误差的测量方法的流程图。参见图12,当测量的栅格误差为平移误差时,该栅格误差的测量方法包括步骤S410,步骤S420,步骤S431,步骤S432,以及步骤S433。The embodiment of the present application also provides another method for measuring grid errors. FIG. 12 is a flowchart of another method for measuring a grid error according to an embodiment of the present application. Referring to FIG. 12, when the measured grid error is a translation error, the method for measuring the grid error includes steps S410, S420, S431, S432, and S433.
在步骤S410中,通过光学设备中的位置测量***获取基底上预设对准量测标记的第一实际位置信息,其中,基底以第一角度水平吸附在光学设备的基底吸附台上,预设对准量测标记包括在第二方向上的至少一列对准量测标记。In step S410, the first actual position information of the preset alignment measurement mark on the substrate is acquired through a position measurement system in the optical device, wherein the substrate is horizontally adsorbed on the substrate adsorption table of the optical device at a first angle, and the preset The alignment measurement mark includes at least one column of alignment measurement marks in the second direction.
在步骤S420中,通过位置测量***获取预设对准量测标记的第二实际位置信息,其中,基底以第二角度水平吸附在基底吸附台上,第一角度为0度,第二角度为180度。In step S420, the second actual position information of the preset alignment measurement mark is acquired by the position measurement system, wherein the substrate is horizontally adsorbed on the substrate adsorption table at a second angle, the first angle is 0 degree, and the second angle is 180 degree.
在步骤S431中,拟合计算基底以0度水平吸附在基底吸附台上时测量栅格的第一平移误差Res_xp_0。In step S431, the first translation error Res_xp_0 of the measurement grid is calculated by fitting and calculating when the substrate is adsorbed on the substrate adsorption table at a level of 0 degrees.
pos_xp_0=Tx_0+xp×Sx_0-yp×Rzy_0+Res_xp_0;其中,pos_xp_0为0度下预设对准量测标记中任一对准量测标记的第一实际位置信息在第二方向上的坐标值,xp为任一对准量测标记的标准位置信息在第二方向上的坐标值,yp为任一对准量测标记的标准位置信息在第一方向上的坐标值,Tx_0为0度下对准量测标记整体在第一方向上的平移,Sx_0为0度下在第一方向上的缩放倍率,Rzy_0表示0度下绕平行于第二方向的坐标轴的旋转;pos_xp_0 = Tx_0 + xp × Sx_0-yp × Rzy_0 + Res_xp_0; where pos_xp_0 is the coordinate value of the first actual position information of any alignment measurement mark in the preset alignment measurement mark at 0 degrees in the second direction , Xp is the coordinate value of the standard position information of any alignment measurement mark in the second direction, yp is the coordinate value of the standard position information of any alignment measurement mark in the first direction, Tx_0 is at 0 degrees Align the entire measurement mark in the first direction, Sx_0 is the zoom factor in the first direction at 0 degrees, and Rzy_0 represents the rotation around a coordinate axis parallel to the second direction at 0 degrees;
在步骤S432中,拟合计算基底以所述180度水平吸附在基底吸附台上时测量栅格的第二平移误差Res_xp_180。In step S432, the second translation error Res_xp_180 of the measurement grid is fitted and calculated when the substrate is adsorbed on the substrate adsorption table at the 180 degree level.
pos_xp_180=Tx_180+xp×Sx_180-yp×Rzy_180+Res_xp_180;其中,pos_xp_180为180度下任一对准量测标记的第二实际位置信息在第二方向上的坐标值,Tx_180为180度下对准量测标记整体在第一方向上的平移,Sx_180为180度下在第一方向上的缩放倍率,Rzy_180表示180度下绕平行于第二方向的坐标轴的旋转。pos_xp_180 = Tx_180 + xp × Sx_180-yp × Rzy_180 + Res_xp_180; where pos_xp_180 is the coordinate value of the second actual position information of any alignment measurement mark at 180 degrees in the second direction, and Tx_180 is aligned at 180 degrees Measure the translation of the marker in the first direction as a whole. Sx_180 is the magnification in the first direction at 180 degrees, and Rzy_180 represents the rotation around a coordinate axis parallel to the second direction at 180 degrees.
在步骤S433中,根据第一平移误差和第二平移误差计算位置测量***相对于任一对准量测标记的第一方向的栅格平移误差Res_xp_ps。In step S433, the grid translation error Res_xp_ps of the position measurement system with respect to any alignment measurement mark in the first direction is calculated according to the first translation error and the second translation error.
Res_xp_ps=(Res_xp_0+Res_xp_180)/2。Res_xp_ps = (Res_xp_0 + Res_xp_180) / 2.
图13是本申请实施例提供的一种平移误差的示意图。参见图13,例如,以第一方向为X向,第二方向为Y向为例,通过上述栅格误差测量方法测量X向栅格平移误差。FIG. 13 is a schematic diagram of a translation error provided by an embodiment of the present application. Referring to FIG. 13, for example, taking the first direction as the X direction and the second direction as the Y direction as an example, the X-axis grid translation error is measured by the above-mentioned grid error measurement method.
首先,选择一列(或多列)对准量测标记为预设对准量测标记,如图13(a),可以提前记录各个预设对准量测标记的标准位置信息,例如,记录Mark1的标准位置信息为(x1,y1),Mark2的标准位置信息为(x2,y2),依次记录多个不同对准量测标记对的标准位置信息为(x3,y3)、(x4,y4)……(xP,yP)。First, select one (or more) rows of alignment measurement marks as preset alignment measurement marks. As shown in Figure 13 (a), you can record the standard position information of each preset alignment measurement mark in advance, for example, record Mark1 The standard position information is (x1, y1), the standard position information of Mark2 is (x2, y2), and the standard position information of multiple different alignment measurement mark pairs is sequentially recorded as (x3, y3), (x4, y4) ... (xP, yP).
其次,参见图13(a),使基底以0度水平吸附在光学设备的基底吸附台上,依次测量预设对准量测标记的第一实际位置信息。示例性地,记录Mark1的第一实际位置信息为(pos_x1_0,pos_y1_0),Mark2的第一实际位置信息为(pos_x2_0,pos_y2_0),依次记录多个不同对准量测标记对的第一实际位置信息为(pos_x3_0,pos_y3_0)、(pos_x4_0,pos_y4_0)……和(pos_xP_0,pos_yP_0)。Next, referring to FIG. 13 (a), the substrate is adsorbed on the substrate adsorption table of the optical device at a level of 0 degrees, and the first actual position information of the preset alignment measurement mark is sequentially measured. Exemplarily, the first actual position information of Mark1 is recorded as (pos_x1_0, pos_y1_0), the first actual position information of Mark2 is (pos_x2_0, pos_y2_0), and the first actual position information of multiple different alignment measurement mark pairs are sequentially recorded. Are (pos_x3_0, pos_y3_0), (pos_x4_0, pos_y4_0) ... and (pos_xP_0, pos_yP_0).
根据得到的P个预设对准量测标记的第一实际位置信息和标准位置信息,拟合计算0度下测量栅格的第一平移误差Res_xp_0:According to the obtained first actual position information and standard position information of the P preset alignment measurement marks, fit and calculate the first translation error Res_xp_0 of the measurement grid at 0 degrees:
pos_x1_0=Tx_0+x1×Sx_0-y1×Rzy_0+Res_x1_0;pos_x1_0 = Tx_0 + x1 × Sx_0-y1 × Rzy_0 + Res_x1_0;
pos_x2_0=Tx_0+x2×Sx_0-y2×Rzy_0+Res_x2_0;pos_x2_0 = Tx_0 + x2 × Sx_0-y2 × Rzy_0 + Res_x2_0;
……...
pos_xp_0=Tx_0+xp×Sx_0-yp×Rzy_0+Res_xp_0;pos_xp_0 = Tx_0 + xp × Sx_0-yp × Rzy_0 + Res_xp_0;
其中,Res_xp_0为X向的位置残差,即在0度下测量栅格的X向的第一平移残差。Among them, Res_xp_0 is the position residual in the X direction, that is, the first translation residual in the X direction of the measurement grid at 0 degrees.
由于运动台、测量基底自身都有可能存在栅格平移误差,所以第一平移残差Res_xp_0是两者栅格平移误差的叠加;Since there may be grid translation errors on the moving platform and the measurement base itself, the first translation residual Res_xp_0 is the superposition of the grid translation errors of the two;
Res_xp_0=Res_xp_ws+Res_xp_plate;Res_xp_0 = Res_xp_ws + Res_xp_plate;
其中,Res_xp_ps为运动台在p点处栅格的X平移残差,Res_xp_plate为基底自身在p点处栅格的X平移残差。Among them, Res_xp_ps is the X translation residual of the grid of the kinematic table at the p point, and Res_xp_plate is the X translation residual of the grid itself at the p point.
然后,参见图13(b),使基底以180度水平吸附在光学设备的基底吸附台上,依次测量预设对准量测标记的第二实际位置信息。示例性地,记录Mark1的第二实际位置信息为(pos_x1_180,pos_y1_180),Mark2的第二实际位置信息为(pos_x2_180,pos_y2_180),依次记录多个不同对准量测标记对的第二实际位置信息为(pos_x3_180,pos_y3_180)、(pos_x4_180,pos_y4_180)……(pos_xN_180,pos_yN_180)。Then, referring to FIG. 13 (b), the substrate is adsorbed on the substrate adsorption table of the optical device at a 180-degree level, and the second actual position information of the preset alignment measurement mark is sequentially measured. Exemplarily, the second actual position information of Mark1 is recorded as (pos_x1_180, pos_y1_180), the second actual position information of Mark2 is (pos_x2_180, pos_y2_180), and the second actual position information of multiple different alignment measurement mark pairs are recorded in sequence. It is (pos_x3_180, pos_y3_180), (pos_x4_180, pos_y4_180) ... (pos_xN_180, pos_yN_180).
根据得到的P个预设对准量测标记的第二实际位置信息和标准位置信息,拟合计算0度下测量栅格的第二平移误差Res_xp_180:According to the obtained second actual position information and standard position information of the P preset alignment measurement marks, fit and calculate the second translation error Res_xp_180 of the measurement grid at 0 degrees:
pos_x1_180=Tx_180+x1×Sx_180-y1×Rzy_180+Res_x1_180;pos_x1_180 = Tx_180 + x1 × Sx_180-y1 × Rzy_180 + Res_x1_180;
pos_x2_180=Tx_180+x2×Sx_180-y2×Rzy_180+Res_x2_180;pos_x2_180 = Tx_180 + x2 × Sx_180-y2 × Rzy_180 + Res_x2_180;
……...
pos_xp_180=Tx_180+xp×Sx_180-yp×Rzy_180+Res_xp_180;pos_xp_180 = Tx_180 + xp × Sx_180-yp × Rzy_180 + Res_xp_180;
其中,Res_xp_180为X向的位置残差,即在180度下测量栅格的X向第二平移残差。Among them, Res_xp_180 is the position residual in the X direction, that is, the second translation residual in the X direction of the measurement grid at 180 degrees.
其中,Res_xp_180=Res_xp_ws-Res_xp_plate。Among them, Res_xp_180 = Res_xp_ws-Res_xp_plate.
根据Res_xp_0和Res_xp_180可以得出基底载台X向栅格平移误差.According to Res_xp_0 and Res_xp_180, the X-axis grid translation error of the substrate carrier can be obtained.
Res_xp_ps=(Res_xp_0+Res_xp_180)/2。Res_xp_ps = (Res_xp_0 + Res_xp_180) / 2.
可以理解的是,测量基底载台Y向栅格平移误差Res_yp_ps方法与上述实施例提供的测量方法类似,选用基底上Y方向上一列(或者多列)标记进行0度和180度测量校准,如图13(c)和13(d)。It can be understood that the method for measuring the Y-grid translation error of the substrate stage Y Res_yp_ps is similar to the measurement method provided in the foregoing embodiment. One column (or multiple columns) of marks on the substrate in the Y direction is selected for 0-degree and 180-degree measurement calibration, such as Figures 13 (c) and 13 (d).
本实施例提供的栅格误差的测量方法,通过计算基底以不同角度吸附在基底载台上的实际位置和标准位置信息计算所述位置测量***的栅格平移误差,计算方法简单,可以对位置测量***的测量位置进行校准,使最终位置量测或运动位置准确,且不需要采集运动台在不同姿态下(包括旋转、倾斜等)较大范围的位置数据进行数学拟合计算,避免了无法获取多个自由度的相关性数据而使位置模型无法求解的情况。The grid error measurement method provided in this embodiment calculates the grid translation error of the position measurement system by calculating the actual position and standard position information of the substrate adsorbed on the substrate carrier at different angles. The calculation method is simple, and the position can be calculated. The measurement position of the measurement system is calibrated to make the final position measurement or movement position accurate, and it is not necessary to collect a large range of position data of the motion table under different attitudes (including rotation, tilt, etc.) for mathematical fitting calculations, which prevents the A case where multiple degrees of freedom correlation data are obtained and the position model cannot be solved.
为了采用上述实施例提供的栅格误差测量方法测量位置测量***中的栅格误差。本申请实施例还提供了一种栅格误差的测量装置。In order to measure the grid error in the position measurement system by using the grid error measurement method provided by the foregoing embodiment. An embodiment of the present application further provides a device for measuring a grid error.
图14是本申请实施例提供的一种栅格误差的测量装置的结构框图。如图14所示,该栅格误差的测量装置包括:第一实际位置信息模块51,设置为通过光学设备中的位置测量***获取基底上预设对准量测标记的第一实际位置信息,其中,基底上设置有多个沿第一方向和第二方向呈阵列排布的对准量测标记,形成测量栅格,基底以第一角度水平吸附在光学设备的基底吸附台上,第一方向和第二方向相垂直;第二实际位置信息获取模块52,设置为通过位置测量***获取预设对准量测标记的第二实际位置信息,其中,基底以第二角度水平吸附在基底吸附台上,第二角度不同于第一角度;栅格误差计算模块53,设置为根据第一实际位置信息、第二实际位置信息和预设对准量测标记的标准位置信息计算位置测量***的栅格误差。FIG. 14 is a structural block diagram of a raster error measuring device according to an embodiment of the present application. As shown in FIG. 14, the raster error measurement device includes a first actual position information module 51 configured to obtain first actual position information of a preset alignment measurement mark on a substrate through a position measurement system in an optical device, The substrate is provided with a plurality of alignment measurement marks arranged in an array along the first direction and the second direction to form a measurement grid. The substrate is horizontally adsorbed on a substrate adsorption table of an optical device at a first angle. The direction is perpendicular to the second direction; the second actual position information acquisition module 52 is configured to obtain the second actual position information of a preset alignment measurement mark through a position measurement system, wherein the substrate is horizontally adsorbed on the substrate by a second angle On the stage, the second angle is different from the first angle; the grid error calculation module 53 is configured to calculate the position of the position measurement system based on the first actual position information, the second actual position information, and standard position information of a preset alignment measurement mark. Raster error.
在一实施例中,第一方向平行于预设坐标系中的X轴,第二方向平行于预设坐标系中的Y轴;或者,第一方向平行于预设坐标系中的Y轴,第二方向平行于所述预设坐标系中的X轴。In an embodiment, the first direction is parallel to the X axis in the preset coordinate system, and the second direction is parallel to the Y axis in the preset coordinate system; or, the first direction is parallel to the Y axis in the preset coordinate system, The second direction is parallel to the X axis in the preset coordinate system.
该栅格误差测量装置可以通过上述实施例中的栅格误差测量方法测量位置测量***中的 不同种类的栅格误差,通过将基底以不同的吸附角度吸附在基底吸附台上,并获取预设对准量测标记在不同吸附角度下的实际位置信息,计算得到位置测量***的栅格误差,计算方法简单,可以对位置测量***的测量位置进行校准,使最终位置量测或运动位置准确,且不需要采集运动台在不同姿态下(包括旋转、倾斜等)较大范围的位置数据进行数学拟合计算,避免了无法获取多个自由度的相关性数据而使位置模型无法求解的情况。The grid error measuring device can measure different kinds of grid errors in the position measurement system by using the grid error measuring method in the above embodiment, and obtain a preset by adsorbing a substrate on a substrate adsorption table at different adsorption angles. Align the actual position information of the measurement marks at different adsorption angles and calculate the grid error of the position measurement system. The calculation method is simple. The measurement position of the position measurement system can be calibrated to make the final position measurement or movement position accurate. And it is not necessary to collect a large range of position data of the motion table under different attitudes (including rotation, tilt, etc.) for mathematical fitting calculations, avoiding the situation that the position model cannot be solved because correlation data of multiple degrees of freedom cannot be obtained.
在一实施例中,预设对准量测标记包括在所述第二方向上的至少两列所述对准量测标记,所述第一角度为0度,所述第二角度为180度。In an embodiment, the preset alignment measurement mark includes at least two columns of the alignment measurement marks in the second direction, the first angle is 0 degrees, and the second angle is 180 degrees .
栅格误差计算模块包括第一栅格旋转度确定单元,第二栅格旋转度确定单元以及栅格旋转度误差计算单元。The grid error calculation module includes a first grid rotation degree determination unit, a second grid rotation degree determination unit, and a grid rotation degree error calculation unit.
第一栅格旋转度确定单元,设置为根据第一实际位置信息和预设对准量测标记的标准位置信息,确定基底以0度水平吸附在基底吸附台上时测量栅格的第一栅格旋转度。The first grid rotation degree determining unit is configured to determine, according to the first actual position information and standard position information of a preset alignment measurement mark, a first grid of the measurement grid when the substrate is adsorbed on the substrate adsorption table at a level of 0 degrees. Grid rotation.
第二栅格旋转度确定单元,设置为根据第二实际位置信息和预设对准量测标记的标准位置信息,确定基底以180度水平吸附在基底吸附台上时测量栅格的第二栅格旋转度。The second grid rotation degree determining unit is configured to determine, according to the second actual position information and standard position information of a preset alignment measurement mark, a second grid for measuring the grid when the substrate is adsorbed on the substrate adsorption platform at a 180-degree level. Grid rotation.
栅格旋转度误差计算单元,设置为根据第一栅格旋转度和第二栅格旋转度计算位置测量***的第二方向的栅格旋转度误差。The grid rotation degree error calculation unit is configured to calculate a grid rotation degree error in a second direction of the position measurement system according to the first grid rotation degree and the second grid rotation degree.
在一实施例中,第一栅格旋转度确定单元包括第一旋转量计算子单元和第一栅格旋转度拟合子单元。In an embodiment, the first grid rotation degree determination unit includes a first rotation amount calculation sub-unit and a first grid rotation degree fitting sub-unit.
第一旋转量计算子单元,设置为根据对准量测标记对的第一实际位置信息及标准位置信息,计算对准量测标记对的第一旋转量,其中,对准量测标记对包括在第一方向上的位于同一行的两个所述对准量测标记,任一所述第一旋转量Rotyn_0满足:Rotyn_0=(pos_yj_0-pos_yi_0)/(xj-xi),pos_yi_0为0度下所述对准量测标记对中第一对准量测标记的第一实际位置信息在第一方向上的坐标值,pos_yj_0为0度下对准量测标记对中第二对准量测标记的第一实际位置信息在第一方向上的坐标值,xi为第一对准量测标记的标准位置信息在第二方向上的坐标值,xj为第二对准量测标记的标准位置信息在第二方向上的坐标值。The first rotation amount calculation subunit is configured to calculate a first rotation amount of the alignment measurement mark pair according to the first actual position information and the standard position information of the alignment measurement mark pair, where the alignment measurement mark pair includes The two alignment measurement marks located in the same row in the first direction, and any of the first rotation amounts Rotyn_0 satisfies: Rotyn_0 = (pos_yj_0-pos_yi_0) / (xj-xi), and pos_yi_0 is below 0 degrees The coordinate value in the first direction of the first actual position information of the first alignment measurement mark in the alignment measurement mark pair, and pos_yj_0 is the second alignment measurement mark in the alignment measurement mark pair at 0 degrees The coordinate value of the first actual position information in the first direction, xi is the coordinate value of the standard position information of the first alignment measurement mark in the second direction, and xj is the standard position information of the second alignment measurement mark. The coordinate value in the second direction.
第一栅格旋转度拟合子单元,设置为根据多个不同对准量测标记对的第一旋转量及标准位置信息,线性拟合计算出第一栅格旋转度,其中,线性拟合公式满足:Rotyn_0=K0×(yi+yj)/2+dRotyn_0,K0为所述第一栅格旋转度,yi为第一对准量测标记的标准位置信息在第一方向上的坐标值,yj为第二对准量测标记的标准位置信息在第一方向上的坐标值,dRotyn_0为0度下的拟合残差。The first grid rotation degree fitting sub-unit is configured to calculate the first grid rotation degree according to the first rotation amount and standard position information of a plurality of different alignment measurement mark pairs, wherein the linear fitting The formula satisfies: Rotyn_0 = K0 × (yi + yj) / 2 + dRotyn_0, K0 is the first grid rotation degree, and yi is the coordinate value of the standard position information of the first alignment measurement mark in the first direction, yj is the coordinate value of the standard position information of the second alignment measurement mark in the first direction, and dRotyn_0 is the fitting residual at 0 degrees.
第二栅格旋转度确定单元包括第二旋转量计算子单元和第二栅格旋转度拟合子单元。The second grid rotation degree determination unit includes a second rotation amount calculation sub-unit and a second grid rotation degree fitting sub-unit.
第二旋转量计算子单元,设置为根据对准量测标记对的第二实际位置信息及标准位置信息,计算对准量测标记对的第二旋转量,任一第二旋转量Rotyn_180满足:Rotyn_180=(pos_yj_180-pos_yi_180)/(-xj+xi),pos_yi_180为180度下所述对准量测标记对中第一对准量测标记的第一实际位置信息在第一方向上的坐标值,pos_yj_180为180度下对准量测标记对中第二对准量测标记的第一实际位置信息在第一方向上的坐标值。The second rotation amount calculation subunit is configured to calculate a second rotation amount of the alignment measurement mark pair according to the second actual position information and the standard position information of the alignment measurement mark pair. Any second rotation amount Rotyn_180 satisfies: Rotyn_180 = (pos_yj_180-pos_yi_180) / (-xj + xi), pos_yi_180 is the coordinate value of the first actual position information of the first alignment measurement mark in the alignment measurement mark pair at 180 degrees in the first direction Pos_yj_180 is the coordinate value of the first actual position information of the second alignment measurement mark in the alignment measurement mark pair at 180 degrees in the first direction.
第二栅格旋转度拟合子单元,设置为根据多个不同对准量测标记对的第二旋转量及标准位置信息,线性拟合计算出所述第二栅格旋转度,其中,线性拟合公式满足: Rotyn_180=K180×(-yi-yj)/2+dRotyn_180,K180为第二栅格旋转度,dRotyn_180为180度下的拟合残差。The second grid rotation degree fitting subunit is configured to linearly calculate the second grid rotation degree according to the second rotation amounts and standard position information of a plurality of different alignment measurement mark pairs, where the linearity is The fitting formula satisfies: Rotyn_180 = K180 × (-yi-yj) / 2 + dRotyn_180, K180 is the second grid rotation degree, and dRotyn_180 is the fitting residual at 180 degrees.
相应的,根据第一栅格旋转度和第二栅格旋转度计算位置测量***的第二方向的栅格旋转度误差K_ws_z满足以下公式:K_ws_z=(K0-K180)/2。Correspondingly, the grid rotation error K_ws_z in the second direction of the position measurement system calculated from the first grid rotation and the second grid rotation satisfies the following formula: K_ws_z = (K0-K180) / 2.
在一实施例中,预设对准量测标记包括在第一方向上的至少一行对准量测标记以及在第二方向上的至少一列对准量测标记,第一角度为0度,第二角度为90度。In one embodiment, the preset alignment measurement mark includes at least one row of alignment measurement marks in the first direction and at least one column of alignment measurement marks in the second direction. The first angle is 0 degrees, the first The two angles are 90 degrees.
栅格误差计算模块包括第一非正交性拟合单元,第二非正交性拟合单元,以及栅格非正交性误差计算单元。The grid error calculation module includes a first non-orthogonality fitting unit, a second non-orthogonality fitting unit, and a grid non-orthogonality error calculating unit.
第一非正交性拟合单元,设置为拟合计算基底以所述0度水平吸附在所述基底吸附台上时测量栅格的第一非正交性误差Orth_0:The first non-orthogonality fitting unit is configured to fit the first non-orthogonality error Orth_0 of the measurement grid when the calculation substrate is adsorbed on the substrate adsorption platform at the 0 degree level:
pos_xm_0=Tx_0+xm×Sx_0-ym×Rzy_0+Res_xm_0;pos_xm_0 = Tx_0 + xm × Sx_0-ym × Rzy_0 + Res_xm_0;
pos_ym_0=Ty_0+ym×Sy_0+xm×Rzx_0+Res_ym_0;pos_ym_0 = Ty_0 + ym × Sy_0 + xm × Rzx_0 + Res_ym_0;
Orth_0=Rzy_0-Rzx_0;Orth_0 = Rzy_0-Rzx_0;
其中,pos_xm_0为0度下预设对准量测标记中任一对准量测标记的第一实际位置信息在所述第二方向上的坐标值,pos_ym_0为0度下任一对准量测标记的第一实际位置信息在第一方向上的坐标值,xm为任一对准量测标记的标准位置信息在第二方向上的坐标值,ym为任一对准量测标记的标准位置信息在第一方向上的坐标值,Tx_0为0度下对准量测标记整体在第一方向上的平移,Ty_0为0度下对准量测标记整体在第二方向上的平移;Sx_0为0度下在第一方向上的缩放倍率,Sy_0为0度下在第二方向上的缩放倍率;Rzx_0表示0度下绕平行于第一方向的坐标轴的旋转,Rzy_0表示0度下绕平行于第二方向的坐标轴的旋转;Res_xm_0为0度下任一对准量测标记在第一方向上的位置残差,Res_ym_0为0度下任一对准量测标记在第二方向上的位置残差。Among them, pos_xm_0 is the coordinate value of the first actual position information of any of the alignment measurement marks preset at 0 degrees in the second direction, and pos_ym_0 is any alignment measurement at 0 degrees The coordinate value of the first actual position information of the marker in the first direction, xm is the coordinate value of the standard position information of any alignment measurement mark in the second direction, and ym is the standard position of any alignment measurement mark. The coordinate value of the information in the first direction, Tx_0 is the translation of the entire measurement mark in the first direction at 0 degrees, and Ty_0 is the translation of the entire measurement mark in the second direction at 0 degrees; Sx_0 is Magnification in the first direction at 0 degrees, Sy_0 is the magnification in the second direction at 0 degrees; Rzx_0 represents rotation around a coordinate axis parallel to the first direction at 0 degrees, and Rzy_0 represents parallel rotation at 0 degrees Rotation of the coordinate axis in the second direction; Res_xm_0 is the position residual of any alignment measurement mark at 0 degrees in the first direction, and Res_ym_0 is the alignment error of any alignment measurement mark at 0 degrees in the second direction Location residuals.
第二非正交性拟合单元,设置为拟合计算基底以90度水平吸附在基底吸附台上时测量栅格的第二非正交性误差Orth_90:The second non-orthogonal fitting unit is set to fit the second non-orthogonality error Orth_90 of the measurement grid when the substrate is adsorbed on the substrate adsorption platform at a 90 degree level:
pos_xm_90=Tx_90+xm×Sx_90-ym×Rzy_90+Res_xm_90;pos_xm_90 = Tx_90 + xm × Sx_90-ym × Rzy_90 + Res_xm_90;
pos_ym_90=Ty_90+ym×Sy_90+xm×Rzx_90+Res_ym_90;pos_ym_90 = Ty_90 + ym × Sy_90 + xm × Rzx_90 + Res_ym_90;
Orth_90=Rzy_90-Rzx_90;Orth_90 = Rzy_90-Rzx_90;
其中,pos_xm_90为90度下任一对准量测标记的第二实际位置信息在第二方向上的坐标值,pos_ym_90为90度下任一对准量测标记的第二实际位置信息在第一方向上的坐标值,Tx_90为90度下对准量测标记整体在第一方向上的平移,Ty_90为90度下对准量测标记整体在所述第二方向上的平移;Sx_90为90度下在第一方向上的缩放倍率,Sy_90为90度下在第二方向上的缩放倍率;Rzx_90表示90度下绕平行于第一方向的坐标轴的旋转,Rzy_90表示90度下绕平行于第二方向的坐标轴的旋转;Res_xm_90为90度下任一对准量测标记在第一方向上的位置残差,Res_ym_90为90度下任一对准量测标记在第二方向上的位置残差。Among them, pos_xm_90 is the coordinate value of the second actual position information of any alignment measurement mark at 90 degrees in the second direction, and pos_ym_90 is the second actual position information of any alignment measurement mark at 90 degrees at the first The coordinate value in the direction, Tx_90 is the translation of the entire measurement mark at 90 degrees in the first direction, Ty_90 is the translation of the entire measurement mark at 90 degrees in the second direction; Sx_90 is 90 degrees The zoom ratio in the first direction, Sy_90 is the zoom ratio in the second direction at 90 degrees; Rzx_90 represents the rotation around a coordinate axis parallel to the first direction at 90 degrees, and Rzy_90 represents the rotation parallel to the first direction at 90 degrees Rotation of coordinate axes in two directions; Res_xm_90 is the residual position of any alignment measurement mark at 90 degrees in the first direction, and Res_ym_90 is the residual position of any alignment measurement mark at 90 degrees in the second direction difference.
栅格非正交性误差计算单元,设置为根据第一非正交性和第二非正交性计算位置测量***的栅格非正交性误差Orth_ws:Orth_ws=(Orth_0+Orth_90)/2。The grid non-orthogonality error calculation unit is configured to calculate the grid non-orthogonality error Orth_ws of the position measurement system according to the first non-orthogonality and the second non-orthogonality: Orth_ws = (Orth_0 + Orth_90) / 2.
在一实施例中,预设对准量测标记包括在第二方向上的至少一列对准量测标记,第一角 度为0度,第二角度为180度。In one embodiment, the preset alignment measurement mark includes at least one column of alignment measurement marks in the second direction, the first angle is 0 degrees, and the second angle is 180 degrees.
栅格误差计算模块包括第一平移误差拟合单元,第二平移误差拟合单元,以及栅格平移误差计算单元。The grid error calculation module includes a first translation error fitting unit, a second translation error fitting unit, and a grid translation error calculation unit.
第一平移误差拟合单元,设置为拟合计算基底以0度水平吸附在基底吸附台上时测量栅格的第一平移误差Res_xp_0:The first translation error fitting unit is configured to fit and calculate the first translation error Res_xp_0 of the measurement grid when the substrate is adsorbed on the substrate adsorption platform at a level of 0 degrees:
pos_xp_0=Tx_0+xp×Sx_0-yp×Rzy_0+Res_xp_0;其中,pos_xp_0为0度下预设对准量测标记中任一对准量测标记的第一实际位置信息在第二方向上的坐标值,xp为任一对准量测标记的标准位置信息在第二方向上的坐标值,yp为任一对准量测标记的标准位置信息在第一方向上的坐标值,Tx_0为0度下对准量测标记整体在第一方向上的平移,Sx_0为0度下在第一方向上的缩放倍率,Rzy_0表示0度下绕平行于第二方向的坐标轴的旋转。pos_xp_0 = Tx_0 + xp × Sx_0-yp × Rzy_0 + Res_xp_0; where pos_xp_0 is the coordinate value of the first actual position information of any alignment measurement mark in the preset alignment measurement mark at 0 degrees in the second direction , Xp is the coordinate value of the standard position information of any alignment measurement mark in the second direction, yp is the coordinate value of the standard position information of any alignment measurement mark in the first direction, Tx_0 is at 0 degrees The translation of the alignment measurement mark as a whole in the first direction, Sx_0 is the zoom factor in the first direction at 0 degrees, and Rzy_0 represents the rotation around a coordinate axis parallel to the second direction at 0 degrees.
第二平移误差拟合单元,设置为拟合计算基底以180度水平吸附在基底吸附台上时测量栅格的第二平移误差Res_xp_180:The second translation error fitting unit is configured to fit and calculate the second translation error Res_xp_180 of the measurement grid when the substrate is adsorbed on the substrate adsorption platform at a 180-degree level:
pos_xp_180=Tx_180+xp×Sx_180-yp×Rzy_180+Res_xp_180;其中,pos_xp_180为180度下任一对准量测标记的第二实际位置信息在第二方向上的坐标值,Tx_180为180度下对准量测标记整体在第一方向上的平移,Sx_180为180度下在第一方向上的缩放倍率,Rzy_180表示180度下绕平行于第二方向的坐标轴的旋转。pos_xp_180 = Tx_180 + xp × Sx_180-yp × Rzy_180 + Res_xp_180; where pos_xp_180 is the coordinate value of the second actual position information of any alignment measurement mark at 180 degrees in the second direction, and Tx_180 is aligned at 180 degrees Measure the translation of the marker in the first direction as a whole. Sx_180 is the magnification in the first direction at 180 degrees, and Rzy_180 represents the rotation around a coordinate axis parallel to the second direction at 180 degrees.
栅格平移误差计算单元,设置为根据第一平移误差和第二平移误差计算位置测量***相对于任一对准量测标记的第一方向的栅格平移误差Res_xp_ps:The grid translation error calculation unit is configured to calculate the grid translation error Res_xp_ps of the first direction of the position measurement system relative to any alignment measurement mark according to the first translation error and the second translation error:
Res_xp_ps=(Res_xp_0+Res_xp_180)/2。Res_xp_ps = (Res_xp_0 + Res_xp_180) / 2.
本申请实施例还提供了一种光学设备,该光学设备包括上述任意实施例提供的栅格误差的测量装置。An embodiment of the present application further provides an optical device, and the optical device includes a grid error measuring device provided by any of the foregoing embodiments.
在一实施例中,光学设备包括光刻机。In one embodiment, the optical device includes a lithography machine.
本实施例提供的光学设备,通过计算基底以不同角度吸附在基底载台上的实际位置和标准位置信息计算所述位置测量***的栅格误差,计算方法简单,可以对位置测量***的测量位置进行校准,使最终位置量测或运动位置准确,且不需要采集运动台在不同姿态下(包括旋转、倾斜等)较大范围的位置数据进行数学拟合计算,避免了无法获取多个自由度的相关性数据而使位置模型无法求解的情况。The optical device provided in this embodiment calculates the grid error of the position measurement system by calculating the actual position and standard position information of the substrate adsorbed on the substrate stage at different angles. The calculation method is simple, and the measurement position of the position measurement system can be measured. Perform calibration to make the final position measurement or movement position accurate, and do not need to collect a large range of position data of the motion table under different attitudes (including rotation, tilt, etc.) for mathematical fitting calculations, avoiding the inability to obtain multiple degrees of freedom The situation that the position model cannot be solved.

Claims (16)

  1. 一种栅格误差的测量方法,包括:A method for measuring grid errors, including:
    通过光学设备中的位置测量***获取基底上预设对准量测标记的第一实际位置信息,其中,所述基底上设置有多个沿第一方向和第二方向呈阵列排布的对准量测标记,形成测量栅格,所述基底以第一角度水平吸附在所述光学设备的基底吸附台上,所述第一方向和所述第二方向相垂直;The first actual position information of a preset alignment measurement mark on a substrate is obtained through a position measurement system in an optical device, wherein the substrate is provided with a plurality of alignments arranged in an array along a first direction and a second direction. Measuring the marks to form a measurement grid, the substrate is horizontally adsorbed on a substrate adsorption table of the optical device at a first angle, and the first direction is perpendicular to the second direction;
    通过所述位置测量***获取所述预设对准量测标记的第二实际位置信息,其中,所述基底以第二角度水平吸附在所述基底吸附台上,所述第二角度不同于所述第一角度;The second actual position information of the preset alignment measurement mark is obtained through the position measurement system, wherein the substrate is horizontally adsorbed on the substrate adsorption table at a second angle, and the second angle is different from that Mentioned first angle
    根据所述第一实际位置信息、所述第二实际位置信息和所述预设对准量测标记的标准位置信息计算所述位置测量***的栅格误差。Calculate a grid error of the position measurement system according to the first actual position information, the second actual position information, and standard position information of the preset alignment measurement mark.
  2. 根据权利要求1所述的栅格误差的测量方法,其中,所述第一方向平行于预设坐标系中的X轴,所述第二方向平行于所述预设坐标系中的Y轴;或者,所述第一方向平行于预设坐标系中的Y轴,所述第二方向平行于所述预设坐标系中的X轴。The method for measuring a grid error according to claim 1, wherein the first direction is parallel to an X axis in a preset coordinate system, and the second direction is parallel to a Y axis in the preset coordinate system; Alternatively, the first direction is parallel to the Y axis in the preset coordinate system, and the second direction is parallel to the X axis in the preset coordinate system.
  3. 根据权利要求2所述的栅格误差的测量方法,其中,所述预设对准量测标记包括在所述第二方向上的至少两列所述对准量测标记,所述第一角度为0度,所述第二角度为180度;The method for measuring a grid error according to claim 2, wherein the preset alignment measurement mark includes at least two columns of the alignment measurement marks in the second direction, and the first angle 0 degrees, and the second angle is 180 degrees;
    根据所述第一实际位置信息、所述第二实际位置信息和所述预设对准量测标记的标准位置信息计算所述位置测量***的栅格误差,包括:Calculating a grid error of the position measurement system according to the first actual position information, the second actual position information, and standard position information of the preset alignment measurement mark includes:
    根据所述第一实际位置信息和所述预设对准量测标记的标准位置信息,确定所述基底以所述0度水平吸附在所述基底吸附台上时测量栅格的第一栅格旋转度;Determining, according to the first actual position information and the standard position information of the preset alignment measurement mark, a first grid of a measurement grid when the substrate is adsorbed on the substrate adsorption table at the 0 degree level Degree of rotation
    根据所述第二实际位置信息和所述预设对准量测标记的标准位置信息,确定所述基底以所述180度水平吸附在所述基底吸附台上时测量栅格的第二栅格旋转度;Determining a second grid of a measurement grid when the substrate is adsorbed on the substrate adsorption table at the 180-degree level according to the second actual position information and standard position information of the preset alignment measurement mark Degree of rotation
    根据所述第一栅格旋转度和所述第二栅格旋转度计算所述位置测量***的所述第二方向的栅格旋转度误差。A grid rotation error in the second direction of the position measurement system is calculated according to the first grid rotation and the second grid rotation.
  4. 根据权利要求3所述的栅格误差的测量方法,其中,根据所述第一实际位置信息和所述预设对准量测标记的标准位置信息,确定所述基底以所述0度水平吸附在所述基底吸附台上时测量栅格的第一栅格旋转度,包括:The method for measuring a grid error according to claim 3, wherein, according to the first actual position information and standard position information of the preset alignment measurement mark, determining that the substrate is adsorbed at the 0 degree level Measuring the first grid rotation of the grid when the base is adsorbed on the table includes:
    根据对准量测标记对的第一实际位置信息及标准位置信息,计算所述对准量测标记对的第一旋转量,其中,所述对准量测标记对包括在所述第一方向上的位于同一行的两个所述对准量测标记,任一所述第一旋转量Rotyn_0满足:Rotyn_0=(pos_yj_0-pos_yi_0)/(xj-xi),pos_yi_0为0度下所述对准量测标记对中第一对准量测标记的第一实际位置信息在所述第一方向上的坐标值,pos_yi_0为0度下所述对准量测标记对中第二对准量测标记的第一实际位置信息在所述第一方向上的坐标值,xi为所述第一对准量测标记的标准位置信息在所述第二方向上的坐标值,xj为所述第二对准量测标记的标准位置信息在所述第二方向上的坐标值;Calculating a first rotation amount of the alignment measurement mark pair according to the first actual position information and the standard position information of the alignment measurement mark pair, wherein the alignment measurement mark pair is included in the first party Two of the alignment measurement marks located in the same row upward, any one of the first rotation amounts Rotyn_0 satisfies: Rotyn_0 = (pos_yj_0-pos_yi_0) / (xj-xi), pos_yi_0 is the alignment at 0 degrees The coordinate value of the first actual position information of the first alignment measurement mark in the measurement mark pair in the first direction, and pos_yi_0 is a second alignment measurement mark in the alignment measurement mark pair at 0 degrees. The coordinate value of the first actual position information in the first direction, xi is the coordinate value of the standard position information of the first alignment measurement mark in the second direction, and xj is the second pair A coordinate value of the standard position information of the quasi-measurement mark in the second direction;
    根据多个不同对准量测标记对的第一旋转量及标准位置信息,线性拟合计算出所述第一栅格旋转度,其中,线性拟合公式满足:Rotyn_0=K0×(yi+yj)/2+dRotyn_0,K0为所述第一栅格旋转度,yi为所述第一对准量测标记的标准位置信息在所述第一方向上的坐标值,yj为所述第二对准量测标记的标准位置信息在所述第一方向上的坐标值,dRotyn_0为0度下的拟合残差;According to the first rotation amount and standard position information of a plurality of different alignment measurement mark pairs, the first grid rotation degree is calculated by linear fitting, wherein the linear fitting formula satisfies: Rotyn_0 = K0 × (yi + yj ) / 2 + dRotyn_0, K0 is the rotation degree of the first grid, yi is the coordinate value of the standard position information of the first alignment measurement mark in the first direction, and yj is the second pair A coordinate value of the standard position information of the quasi-measurement mark in the first direction, and dRotyn_0 is a fitting residual at 0 degrees;
    根据所述第二实际位置信息和所述预设对准量测标记的标准位置信息,确定所述基底以 所述180度水平吸附在所述基底吸附台上时测量栅格的第二栅格旋转度,包括:Determining a second grid of a measurement grid when the substrate is adsorbed on the substrate adsorption table at the 180-degree level according to the second actual position information and standard position information of the preset alignment measurement mark Rotation, including:
    根据所述对准量测标记对的第二实际位置信息及标准位置信息,计算所述对准量测标记对的第二旋转量,任一所述第二旋转量Rotyn_180满足:Rotyn_180=(pos_yj_180-pos_yi_180)/(-xj+xi),pos_yi_180为180度下所述对准量测标记对中第一对准量测标记的第一实际位置信息在所述第一方向上的坐标值,pos_yj_180为180度下所述对准量测标记对中第二对准量测标记的第一实际位置信息在所述第一方向上的坐标值;Calculate a second rotation amount of the alignment measurement mark pair according to the second actual position information and the standard position information of the alignment measurement mark pair. Any of the second rotation amounts Rotyn_180 satisfies: Rotyn_180 = (pos_yj_180 -pos_yi_180) / (-xj + xi), pos_yi_180 is the coordinate value in the first direction of the first actual position information of the first alignment measurement mark in the alignment measurement mark pair at 180 degrees, pos_yj_180 A coordinate value of the first actual position information of a second alignment measurement mark in the alignment measurement mark pair at 180 degrees in the first direction;
    根据多个不同对准量测标记对的第二旋转量及标准位置信息,线性拟合计算出所述第二栅格旋转度,其中,线性拟合公式满足:Rotyn_180=K180×(-yi-yj)/2+dRotyn_180,K180为所述第二栅格旋转度,dRotyn_180为180度下的拟合残差;According to the second rotation amount and standard position information of a plurality of different alignment measurement mark pairs, the second grid rotation degree is calculated by linear fitting, wherein the linear fitting formula satisfies: Rotyn_180 = K180 × (-yi- yj) / 2 + dRotyn_180, K180 is the second grid rotation degree, and dRotyn_180 is the fitting residual at 180 degrees;
    根据所述第一栅格旋转度和所述第二栅格旋转度计算所述位置测量***的所述第二方向的栅格旋转度误差K_ws_z满足以下公式:The grid rotation error K_ws_z of the second direction of the position measurement system calculated according to the first grid rotation and the second grid rotation satisfies the following formula:
    K_ws_z=(K0-K180)/2。K_ws_z = (K0-K180) / 2.
  5. 根据权利要求2所述的栅格误差的测量方法,其中,所述预设对准量测标记包括在所述第一方向上的至少一行所述对准量测标记以及在所述第二方向上的至少一列所述对准量测标记,所述第一角度为0度,所述第二角度为90度;The method for measuring a grid error according to claim 2, wherein the preset alignment measurement mark includes at least one row of the alignment measurement mark in the first direction and the alignment measurement mark in the second direction The at least one column of the alignment measurement marks, the first angle is 0 degrees, and the second angle is 90 degrees;
    根据所述第一实际位置信息、所述第二实际位置信息和所述预设对准量测标记的标准位置信息计算所述位置测量***的栅格误差,包括:Calculating a grid error of the position measurement system according to the first actual position information, the second actual position information, and standard position information of the preset alignment measurement mark includes:
    拟合计算所述基底以所述0度水平吸附在所述基底吸附台上时测量栅格的第一非正交性误差Orth_0:The first non-orthogonality error Orth_0 of the measurement grid when the substrate is adsorbed on the substrate adsorption platform at the 0 degree level is calculated by fitting:
    pos_xm_0=Tx_0+xm×Sx_0-ym×Rzy_0+Res_xm_0;pos_xm_0 = Tx_0 + xm × Sx_0-ym × Rzy_0 + Res_xm_0;
    pos_ym_0=Ty_0+ym×Sy_0+xm×Rzx_0+Res_ym_0;pos_ym_0 = Ty_0 + ym × Sy_0 + xm × Rzx_0 + Res_ym_0;
    Orth_0=Rzy_0-Rzx_0;Orth_0 = Rzy_0-Rzx_0;
    其中,pos_xm_0为0度下所述预设对准量测标记中任一对准量测标记的第一实际位置信息在所述第二方向上的坐标值,pos_ym_0为0度下所述任一对准量测标记的第一实际位置信息在所述第一方向上的坐标值,xm为所述任一对准量测标记的标准位置信息在所述第二方向上的坐标值,ym为所述任一对准量测标记的标准位置信息在所述第一方向上的坐标值,Tx_0为0度下所述对准量测标记整体在所述第一方向上的平移,Ty_0为0度下所述对准量测标记整体在所述第二方向上的平移;Sx_0为0度下在所述第一方向上的缩放倍率,Sy_0为0度下在所述第二方向上的缩放倍率;Rzx_0表示0度下绕平行于所述第一方向的坐标轴的旋转,Rzy_0表示0度下绕平行于所述第二方向的坐标轴的旋转;Res_xm_0为0度下所述任一对准量测标记在所述第一方向上的位置残差,Res_ym_0为0度下所述任一对准量测标记在所述第二方向上的位置残差;Wherein, pos_xm_0 is a coordinate value of the first actual position information of any of the preset alignment measurement marks at 0 degrees in the second direction, and pos_ym_0 is any of the values at 0 degrees. The coordinate value of the first actual position information of the alignment measurement mark in the first direction, xm is the coordinate value of the standard position information of any of the alignment measurement marks in the second direction, and ym is The coordinate value of the standard position information of any alignment measurement mark in the first direction, Tx_0 is a translation of the entire alignment measurement mark in the first direction at 0 degrees, and Ty_0 is 0 The translation of the alignment measurement mark as a whole in the second direction; Sx_0 is a zoom ratio in the first direction at 0 degrees, and Sy_0 is a zoom in the second direction at 0 degrees Magnification; Rzx_0 represents rotation around a coordinate axis parallel to the first direction at 0 degrees, Rzy_0 represents rotation around a coordinate axis parallel to the second direction at 0 degrees; Res_xm_0 is any pair described at 0 degrees The position residual of the mark in the first direction is quasi-measured, and Res_ym_0 is any of the alignment amounts at 0 degrees Mark in the second direction, position residuals;
    拟合计算所述基底以所述90度水平吸附在所述基底吸附台上时测量栅格的第二非正交性误差Orth_90:The second non-orthogonality error Orth_90 of the measurement grid when the substrate is adsorbed on the substrate adsorption platform at the 90 degree level is calculated by fitting:
    pos_xm_90=Tx_90+xm×Sx_90-ym×Rzy_90+Res_xm_90;pos_xm_90 = Tx_90 + xm × Sx_90-ym × Rzy_90 + Res_xm_90;
    pos_ym_90=Ty_90+ym×Sy_90+xm×Rzx_90+Res_ym_90;pos_ym_90 = Ty_90 + ym × Sy_90 + xm × Rzx_90 + Res_ym_90;
    Orth_90=Rzy_90-Rzx_90;Orth_90 = Rzy_90-Rzx_90;
    其中,pos_xm_90为90度下所述任一对准量测标记的第二实际位置信息在所述第二方向上的坐标值,pos_ym_90为90度下所述任一对准量测标记的第二实际位置信息在所述第一方向上的坐标值,Tx_90为90度下所述对准量测标记整体在所述第一方向上的平移,Ty_90为90度下所述对准量测标记整体在所述第二方向上的平移;Sx_90为90度下在所述第一方向上的缩放倍率,Sy_90为90度下在所述第二方向上的缩放倍率;Rzx_90表示90度下绕平行于所述第一方向的坐标轴的旋转,Rzy_90表示90度下绕平行于所述第二方向的坐标轴的旋转;Res_xm_90为90度下所述任一对准量测标记在所述第一方向上的位置残差,Res_ym_90为90度下所述任一对准量测标记在所述第二方向上的位置残差;Wherein, pos_xm_90 is the coordinate value of the second actual position information of any of the alignment measurement marks at 90 degrees in the second direction, and pos_ym_90 is the second of the any of the alignment measurement marks at 90 degrees. The coordinate value of the actual position information in the first direction, Tx_90 is the translation of the entire alignment measurement mark in the first direction at 90 degrees, and Ty_90 is the entire alignment measurement mark at 90 degrees. Translation in the second direction; Sx_90 is the zoom magnification in the first direction at 90 degrees, Sy_90 is the zoom magnification in the second direction at 90 degrees; Rzx_90 represents a parallel parallel at 90 degrees For the rotation of the coordinate axis in the first direction, Rzy_90 represents a rotation about a coordinate axis parallel to the second direction at 90 degrees; Res_xm_90 is 90 degrees at any one of the alignment measurement marks on the first side Upward position residual, Res_ym_90 is a position residual of the alignment measurement mark in the second direction at 90 degrees;
    根据所述第一非正交性误差和所述第二非正交性误差计算所述位置测量***的栅格非正交性误差Orth_ws:Calculate the grid non-orthogonality error Orth_ws of the position measurement system according to the first non-orthogonality error and the second non-orthogonality error:
    Orth_ws=(Orth_0+Orth_90)/2。Orth_ws = (Orth_0 + Orth_90) / 2.
  6. 根据权利要求2所述的栅格误差的测量方法,其中,所述预设对准量测标记包括在所述第二方向上的至少一列所述对准量测标记,所述第一角度为0度,所述第二角度为180度;The method for measuring a grid error according to claim 2, wherein the preset alignment measurement mark includes at least one column of the alignment measurement marks in the second direction, and the first angle is 0 degrees, the second angle is 180 degrees;
    根据所述第一实际位置信息、所述第二实际位置信息和所述预设对准量测标记的标准位置信息计算所述位置测量***的栅格误差,包括:Calculating a grid error of the position measurement system according to the first actual position information, the second actual position information, and standard position information of the preset alignment measurement mark includes:
    拟合计算所述基底以所述0度水平吸附在所述基底吸附台上时测量栅格的第一平移误差Res_xp_0:pos_xp_0=Tx_0+xp×Sx_0-yp×Rzy_0+Res_xp_0;其中,pos_xp_0为0度下所述预设对准量测标记中任一对准量测标记的第一实际位置信息在所述第二方向上的坐标值,xp为所述任一对准量测标记的标准位置信息在所述第二方向上的坐标值,yp为所述任一对准量测标记的标准位置信息在所述第一方向上的坐标值,Tx_0为0度下所述对准量测标记整体在所述第一方向上的平移,Sx_0为0度下在所述第一方向上的缩放倍率,Rzy_0表示0度下绕平行于所述第二方向的坐标轴的旋转;The first translation error of the measurement grid Res_xp_0: pos_xp_0 = Tx_0 + xp × Sx_0-yp × Rzy_0 + Res_xp_0; 0 The coordinate value of the first actual position information of any of the preset alignment measurement marks in the second direction, and xp is a standard position of any of the alignment measurement marks. The coordinate value of the information in the second direction, yp is the coordinate value of the standard position information of any of the alignment measurement marks in the first direction, and Tx_0 is the alignment measurement mark at 0 degrees The translation of the whole in the first direction, Sx_0 is a zoom factor in the first direction at 0 degrees, and Rzy_0 represents a rotation around a coordinate axis parallel to the second direction at 0 degrees;
    拟合计算所述基底以所述180度水平吸附在所述基底吸附台上时测量栅格的第二平移误差Res_xp_180:The second translation error Res_xp_180 of the measurement grid when the substrate is adsorbed on the substrate adsorption platform at the 180-degree level is calculated by fitting:
    pos_xp_180=Tx_180+xp×Sx_180-yp×Rzy_180+Res_xp_180;其中,pos_xp_180为180度下所述任一对准量测标记的第二实际位置信息在所述第二方向上的坐标值,Tx_180为180度下所述对准量测标记整体在所述第一方向上的平移,Sx_180为180度下在所述第一方向上的缩放倍率,Rzy_180表示180度下绕平行于所述第二方向的坐标轴的旋转;pos_xp_180 = Tx_180 + xp × Sx_180-yp × Rzy_180 + Res_xp_180; where pos_xp_180 is the coordinate value of the second actual position information of the alignment measurement mark at 180 degrees in the second direction and Tx_180 is 180 The translation of the alignment measurement mark as a whole in the first direction at a degree of degree, Sx_180 is a magnification ratio in the first direction at 180 degree, and Rzy_180 represents a direction parallel to the second direction at 180 degree Rotation of the coordinate axis;
    根据所述第一平移误差和所述第二平移误差计算所述位置测量***相对于所述任一对准量测标记的所述第一方向的栅格平移误差Res_xp_ps:Calculate the grid translation error Res_xp_ps of the first direction of the position measurement system with respect to the alignment measurement mark according to the first translation error and the second translation error:
    Res_xp_ps=(Res_xp_0+Res_xp_180)/2。Res_xp_ps = (Res_xp_0 + Res_xp_180) / 2.
  7. 根据权利要求1-6任一所述的栅格误差的测量方法,其中,所述对准量测标记的图形为中心对称图形。The method for measuring a grid error according to any one of claims 1 to 6, wherein the pattern of the alignment measurement mark is a center-symmetrical pattern.
  8. 根据权利要求1-6任一所述的栅格误差的测量方法,其中,所述位置测量***为干涉仪测量***、激光三角尺或激光位移传感器。The method for measuring a grid error according to any one of claims 1 to 6, wherein the position measurement system is an interferometer measurement system, a laser triangle, or a laser displacement sensor.
  9. 一种栅格误差的测量装置,包括:A grid error measuring device includes:
    第一实际位置信息模块,设置为通过光学设备中的位置测量***获取基底上预设对准量测标记的第一实际位置信息,其中,所述基底上设置有多个沿第一方向和第二方向呈阵列排布的对准量测标记,形成测量栅格,所述基底以第一角度水平吸附在所述光学设备的基底吸 附台上,所述第一方向和所述第二方向相垂直;The first actual position information module is configured to obtain first actual position information of a preset alignment measurement mark on a substrate through a position measurement system in an optical device, wherein the substrate is provided with a plurality of Alignment measurement marks arranged in two directions in an array form a measurement grid. The substrate is horizontally adsorbed on a substrate adsorption table of the optical device at a first angle, and the first direction and the second direction are in phase with each other. vertical;
    第二实际位置信息获取模块,设置为通过所述位置测量***获取所述预设对准量测标记的第二实际位置信息,其中,所述基底以第二角度水平吸附在所述基底吸附台上,所述第二角度不同于所述第一角度;The second actual position information acquisition module is configured to obtain the second actual position information of the preset alignment measurement mark through the position measurement system, wherein the substrate is horizontally adsorbed on the substrate adsorption table at a second angle. The second angle is different from the first angle;
    栅格误差计算模块,设置为根据所述第一实际位置信息、所述第二实际位置信息和所述预设对准量测标记的标准位置信息计算所述位置测量***的栅格误差。The grid error calculation module is configured to calculate a grid error of the position measurement system according to the first actual position information, the second actual position information, and standard position information of the preset alignment measurement mark.
  10. 根据权利要求9所述的栅格误差的测量装置,其中,所述第一方向平行于预设坐标系中的X轴,所述第二方向平行于所述预设坐标系中的Y轴;或者,所述第一方向平行于预设坐标系中的Y轴,所述第二方向平行于所述预设坐标系中的X轴。The apparatus for measuring a grid error according to claim 9, wherein the first direction is parallel to an X axis in a preset coordinate system, and the second direction is parallel to a Y axis in the preset coordinate system; Alternatively, the first direction is parallel to the Y axis in the preset coordinate system, and the second direction is parallel to the X axis in the preset coordinate system.
  11. 根据权利要求10所述的栅格误差的测量装置,其中,所述预设对准量测标记包括在所述第二方向上的至少两列所述对准量测标记,所述第一角度为0度,所述第二角度为180度;The apparatus for measuring a grid error according to claim 10, wherein the preset alignment measurement mark includes at least two columns of the alignment measurement marks in the second direction, and the first angle 0 degrees, and the second angle is 180 degrees;
    所述栅格误差计算模块包括:The grid error calculation module includes:
    第一栅格旋转度确定单元,设置为根据所述第一实际位置信息和所述预设对准量测标记的标准位置信息,确定所述基底以所述0度水平吸附在所述基底吸附台上时测量栅格的第一栅格旋转度;A first grid rotation determining unit, configured to determine that the substrate is adsorbed on the substrate at the 0 degree level according to the first actual position information and standard position information of the preset alignment measurement mark Measure the first grid rotation of the grid when on the stage;
    第二栅格旋转度确定单元,设置为根据所述第二实际位置信息和所述预设对准量测标记的标准位置信息,确定所述基底以所述180度水平吸附在所述基底吸附台上时测量栅格的第二栅格旋转度;A second grid rotation determining unit is configured to determine that the substrate is adsorbed on the substrate at the 180-degree level according to the second actual position information and standard position information of the preset alignment measurement mark. Measuring the second grid rotation of the grid when on the stage;
    栅格旋转度误差计算单元,设置为根据所述第一栅格旋转度和所述第二栅格旋转度计算所述位置测量***的所述第二方向的栅格旋转度误差。The grid rotation degree error calculation unit is configured to calculate a grid rotation degree error in the second direction of the position measurement system according to the first grid rotation degree and the second grid rotation degree.
  12. 根据权利要求11所述的栅格误差的测量装置,其中,所述第一栅格旋转度确定单元包括:The apparatus for measuring a grid error according to claim 11, wherein the first grid rotation determining unit comprises:
    第一旋转量计算子单元,设置为根据对准量测标记对的第一实际位置信息及标准位置信息,计算所述对准量测标记对的第一旋转量,其中,所述对准量测标记对包括在所述第一方向上的位于同一行的两个所述对准量测标记,任一所述第一旋转量Rotyn_0满足:Rotyn_0=(pos_yj_0-pos_yi_0)/(xj-xi),pos_yi_0为0度下所述对准量测标记对中第一对准量测标记的第一实际位置信息在所述第一方向上的坐标值,pos_yj_0为0度下所述对准量测标记对中第二对准量测标记的第一实际位置信息在所述第一方向上的坐标值,xi为所述第一对准量测标记的标准位置信息在所述第二方向上的坐标值,xj为所述第二对准量测标记的标准位置信息在所述第二方向上的坐标值;A first rotation amount calculation subunit configured to calculate a first rotation amount of the alignment measurement mark pair according to the first actual position information and the standard position information of the alignment measurement mark pair, wherein the alignment amount The measurement mark pair includes two of the alignment measurement marks located in the same row in the first direction, and any of the first rotation amounts Rotyn_0 satisfies: Rotyn_0 = (pos_yj_0-pos_yi_0) / (xj-xi) , Pos_yi_0 is the coordinate value of the first actual position information of the first alignment measurement mark in the alignment measurement mark pair at 0 degrees in the first direction, and pos_yj_0 is the alignment measurement at 0 degrees The coordinate value of the first actual position information of the second alignment measurement mark in the mark pair in the first direction, and xi is a standard position information of the first alignment measurement mark in the second direction. A coordinate value, xj is a coordinate value of the standard position information of the second alignment measurement mark in the second direction;
    第一栅格旋转度拟合子单元,设置为根据多个不同对准量测标记对的第一旋转量及标准位置信息,线性拟合计算出所述第一栅格旋转度,其中,线性拟合公式满足:Rotyn_0=K0×(yi+yj)/2+dRotyn_0,K0为所述第一栅格旋转度,yi为所述第一对准量测标记的标准位置信息在所述第一方向上的坐标值,yj为所述第二对准量测标记的标准位置信息在所述第一方向上的坐标值,dRotyn_0为0度下的拟合残差;The first grid rotation degree fitting subunit is configured to linearly calculate the first grid rotation degree according to the first rotation amounts and standard position information of a plurality of different alignment measurement mark pairs, where the linearity is The fitting formula satisfies: Rotyn_0 = K0 × (yi + yj) / 2 + dRotyn_0, K0 is the rotation degree of the first grid, and yi is the standard position information of the first alignment measurement mark in the first The coordinate value in the direction, yj is the coordinate value of the standard position information of the second alignment measurement mark in the first direction, and dRotyn_0 is the fitting residual at 0 degrees;
    所述第二栅格旋转度确定单元包括:The second grid rotation degree determining unit includes:
    第二旋转量计算子单元,设置为根据所述对准量测标记对的第二实际位置信息及标准位置信息,计算所述对准量测标记对的第二旋转量,任一所述第二旋转量Rotyn_180满足: Rotyn_180=(pos_yj_180-pos_yi_180)/(-xj+xi),pos_yi_180为180度下所述对准量测标记对中第一对准量测标记的第一实际位置信息在所述第一方向上的坐标值,pos_yj_180为180度下所述对准量测标记对中第二对准量测标记的第一实际位置信息在所述第一方向上的坐标值;The second rotation amount calculation subunit is configured to calculate a second rotation amount of the alignment measurement mark pair according to the second actual position information and the standard position information of the alignment measurement mark pair. The two rotation amounts Rotyn_180 satisfy: Rotyn_180 = (pos_yj_180-pos_yi_180) / (-xj + xi), where pos_yi_180 is 180 degrees, the first actual position information of the first alignment measurement mark in the alignment measurement mark pair is Said the coordinate value in the first direction, pos_yj_180 is the coordinate value of the first actual position information of the second alignment measurement mark in the alignment measurement mark pair at 180 degrees in the first direction;
    第二栅格旋转度拟合子单元,设置为根据多个不同对准量测标记对的第二旋转量及标准位置信息,线性拟合计算出所述第二栅格旋转度,其中,线性拟合公式满足:Rotyn_180=K180×(-yi-yj)/2+dRotyn_180,K180为所述第二栅格旋转度,dRotyn_180为180度下的拟合残差;The second grid rotation degree fitting subunit is configured to linearly calculate the second grid rotation degree according to the second rotation amounts and standard position information of a plurality of different alignment measurement mark pairs, where the linearity is The fitting formula satisfies: Rotyn_180 = K180 × (-yi-yj) / 2 + dRotyn_180, K180 is the second grid rotation degree, and dRotyn_180 is the fitting residual at 180 degrees;
    根据所述第一栅格旋转度和所述第二栅格旋转度计算所述位置测量***的所述第二方向的栅格旋转度误差K_ws_z满足以下公式:The grid rotation error K_ws_z of the second direction of the position measurement system calculated according to the first grid rotation and the second grid rotation satisfies the following formula:
    K_ws_z=(K0-K180)/2。K_ws_z = (K0-K180) / 2.
  13. 根据权利要求10所述的栅格误差的测量装置,其中,所述预设对准量测标记包括在所述第一方向上的至少一行所述对准量测标记以及在所述第二方向上的至少一列所述对准量测标记,所述第一角度为0度,所述第二角度为90度;The apparatus for measuring a grid error according to claim 10, wherein the preset alignment measurement mark includes at least one row of the alignment measurement mark in the first direction and in the second direction The at least one column of the alignment measurement marks, the first angle is 0 degrees, and the second angle is 90 degrees;
    所述栅格误差计算模块包括:The grid error calculation module includes:
    第一非正交性拟合单元,设置为拟合计算所述基底以所述0度水平吸附在所述基底吸附台上时测量栅格的第一非正交性误差Orth_0:A first non-orthogonality fitting unit, configured to fit and calculate a first non-orthogonality error Orth_0 of the measurement grid when the substrate is adsorbed on the substrate adsorption stage at the 0 degree level:
    pos_xm_0=Tx_0+xm×Sx_0-ym×Rzy_0+Res_xm_0;pos_xm_0 = Tx_0 + xm × Sx_0-ym × Rzy_0 + Res_xm_0;
    pos_ym_0=Ty_0+ym×Sy_0+xm×Rzx_0+Res_ym_0;pos_ym_0 = Ty_0 + ym × Sy_0 + xm × Rzx_0 + Res_ym_0;
    Orth_0=Rzy_0-Rzx_0;Orth_0 = Rzy_0-Rzx_0;
    其中,pos_xm_0为0度下所述预设对准量测标记中任一对准量测标记的第一实际位置信息在所述第二方向上的坐标值,pos_ym_0为0度下所述任一对准量测标记的第一实际位置信息在所述第一方向上的坐标值,xm为所述任一对准量测标记的标准位置信息在所述第二方向上的坐标值,ym为所述任一对准量测标记的标准位置信息在所述第一方向上的坐标值,Tx_0为0度下所述对准量测标记整体在所述第一方向上的平移,Ty_0为0度下所述对准量测标记整体在所述第二方向上的平移;Sx_0为0度下在所述第一方向上的缩放倍率,Sy_0为0度下在所述第二方向上的缩放倍率;Rzx_0表示0度下绕平行于所述第一方向的坐标轴的旋转,Rzy_0表示0度下绕平行于所述第二方向的坐标轴的旋转;Res_xm_0为0度下所述任一对准量测标记在所述第一方向上的位置残差,Res_ym_0为0度下所述任一对准量测标记在所述第二方向上的位置残差;Wherein, pos_xm_0 is a coordinate value of the first actual position information of any of the preset alignment measurement marks at 0 degrees in the second direction, and pos_ym_0 is any of the values at 0 degrees. The coordinate value of the first actual position information of the alignment measurement mark in the first direction, xm is the coordinate value of the standard position information of any of the alignment measurement marks in the second direction, and ym is The coordinate value of the standard position information of any alignment measurement mark in the first direction, Tx_0 is a translation of the entire alignment measurement mark in the first direction at 0 degrees, and Ty_0 is 0 The translation of the alignment measurement mark as a whole in the second direction; Sx_0 is a zoom ratio in the first direction at 0 degrees, and Sy_0 is a zoom in the second direction at 0 degrees Magnification; Rzx_0 represents rotation around a coordinate axis parallel to the first direction at 0 degrees, Rzy_0 represents rotation around a coordinate axis parallel to the second direction at 0 degrees; Res_xm_0 is any pair described at 0 degrees The position residual of the mark in the first direction is quasi-measured, and Res_ym_0 is any of the alignment amounts at 0 degrees Mark in the second direction, position residuals;
    第二非正交性拟合单元,设置为拟合计算所述基底以所述90度水平吸附在所述基底吸附台上时测量栅格的第二非正交性误差Orth_90:The second non-orthogonality fitting unit is configured to fit and calculate a second non-orthogonality error Orth_90 of the measurement grid when the substrate is adsorbed on the substrate adsorption platform at the 90 degree level:
    pos_xm_90=Tx_90+xm×Sx_90-ym×Rzy_90+Res_xm_90;pos_xm_90 = Tx_90 + xm × Sx_90-ym × Rzy_90 + Res_xm_90;
    pos_ym_90=Ty_90+ym×Sy_90+xm×Rzx_90+Res_ym_90;pos_ym_90 = Ty_90 + ym × Sy_90 + xm × Rzx_90 + Res_ym_90;
    Orth_90=Rzy_90-Rzx_90;Orth_90 = Rzy_90-Rzx_90;
    其中,pos_xm_90为90度下所述任一对准量测标记的第二实际位置信息在所述第二方向上的坐标值,pos_ym_90为90度下所述任一对准量测标记的第二实际位置信息在所述第一方向上的坐标值,Tx_90为90度下所述对准量测标记整体在所述第一方向上的平移, Ty_90为90度下所述对准量测标记整体在所述第二方向上的平移;Sx_90为90度下在所述第一方向上的缩放倍率,Sy_90为90度下在所述第二方向上的缩放倍率;Rzx_90表示90度下绕平行于所述第一方向的坐标轴的旋转,Rzy_90表示90度下绕平行于所述第二方向的坐标轴的旋转;Res_xm_90为90度下所述任一对准量测标记在所述第一方向上的位置残差,Res_ym_90为90度下所述任一对准量测标记在所述第二方向上的位置残差;Wherein, pos_xm_90 is the coordinate value of the second actual position information of any of the alignment measurement marks at 90 degrees in the second direction, and pos_ym_90 is the second of the any of the alignment measurement marks at 90 degrees. The coordinate value of the actual position information in the first direction, Tx_90 is the translation of the entire alignment measurement mark in the first direction at 90 degrees, and Ty_90 is the entire alignment measurement mark at 90 degrees. Translation in the second direction; Sx_90 is the zoom magnification in the first direction at 90 degrees, Sy_90 is the zoom magnification in the second direction at 90 degrees; Rzx_90 represents a parallel parallel at 90 degrees For the rotation of the coordinate axis in the first direction, Rzy_90 represents a rotation about a coordinate axis parallel to the second direction at 90 degrees; Res_xm_90 is 90 degrees at any one of the alignment measurement marks on the first side Upward position residual, Res_ym_90 is a position residual of the alignment measurement mark in the second direction at 90 degrees;
    栅格非正交性误差计算单元,设置为根据所述第一非正交性误差和所述第二非正交性误差计算所述位置测量***的栅格非正交性误差Orth_ws:The grid non-orthogonality error calculation unit is configured to calculate the grid non-orthogonality error Orth_ws of the position measurement system according to the first non-orthogonality error and the second non-orthogonality error:
    Orth_ws=(Orth_0+Orth_90)/2。Orth_ws = (Orth_0 + Orth_90) / 2.
  14. 根据权利要求10所述的栅格误差的测量装置,其中,所述预设对准量测标记包括在所述第二方向上的至少一列所述对准量测标记,所述第一角度为0度,所述第二角度为180度;The apparatus for measuring a grid error according to claim 10, wherein the preset alignment measurement mark includes at least one column of the alignment measurement marks in the second direction, and the first angle is 0 degrees, the second angle is 180 degrees;
    所述栅格误差计算模块包括:The grid error calculation module includes:
    第一平移误差拟合单元,设置为拟合计算所述基底以所述0度水平吸附在所述基底吸附台上时测量栅格的第一平移误差Res_xp_0:The first translation error fitting unit is configured to fit and calculate a first translation error Res_xp_0 of the measurement grid when the substrate is adsorbed on the substrate adsorption platform at the 0 degree level:
    pos_xp_0=Tx_0+xp×Sx_0-yp×Rzy_0+Res_xp_0;其中,pos_xp_0为0度下所述预设对准量测标记中任一对准量测标记的第一实际位置信息在所述第二方向上的坐标值,xp为所述任一对准量测标记的标准位置信息在所述第二方向上的坐标值,yp为所述任一对准量测标记的标准位置信息在所述第一方向上的坐标值,Tx_0为0度下所述对准量测标记整体在所述第一方向上的平移,Sx_0为0度下在所述第一方向上的缩放倍率,Rzy_0Rzy_0表示0度下绕平行于所述第二方向的坐标轴的旋转;pos_xp_0 = Tx_0 + xp × Sx_0-yp × Rzy_0 + Res_xp_0; wherein pos_xp_0 is the first actual position information of any alignment measurement mark in the preset alignment measurement mark at 0 degrees in the second direction Xp is the coordinate value of the standard position information of any one alignment measurement mark in the second direction, and yp is the standard position information of any one of the alignment measurement marks in the first direction. Coordinates in one direction, Tx_0 is the translation of the alignment measurement mark in the first direction at 0 degrees, Sx_0 is the zoom factor in the first direction at 0 degrees, and Rzy_0Rzy_0 represents 0 degrees Rotation around a coordinate axis parallel to the second direction;
    第二平移误差拟合单元,设置为拟合计算所述基底以所述180度水平吸附在所述基底吸附台上时测量栅格的第二平移误差Res_xp_180:The second translation error fitting unit is configured to fit and calculate a second translation error Res_xp_180 of the measurement grid when the substrate is adsorbed on the substrate adsorption table at the 180 degree level:
    pos_xp_180=Tx_180+xp×Sx_180-yp×Rzy_180+Res_xp_180;其中,pos_xp_180为180度下所述任一对准量测标记的第二实际位置信息在所述第二方向上的坐标值,Tx_180为180度下所述对准量测标记整体在所述第一方向上的平移,Sx_180为180度下在所述第一方向上的缩放倍率,Rzy_180表示180度下绕平行于所述第二方向的坐标轴的旋转;pos_xp_180 = Tx_180 + xp × Sx_180-yp × Rzy_180 + Res_xp_180; where pos_xp_180 is the coordinate value of the second actual position information of the alignment measurement mark at 180 degrees in the second direction, and Tx_180 is 180 The translation of the alignment measurement mark as a whole in the first direction at a degree of degree, Sx_180 is a magnification ratio in the first direction at 180 degree, and Rzy_180 represents a direction parallel to the second direction at 180 degree. Rotation of the coordinate axis;
    栅格平移误差计算单元,设置为根据所述第一平移误差和所述第二平移误差计算所述位置测量***相对于所述任一对准量测标记的所述第一方向的栅格平移误差Res_xp_ps:A grid translation error calculating unit, configured to calculate, according to the first translation error and the second translation error, a grid translation of the position measurement system with respect to the first direction of the alignment measurement mark in the first direction; Error Res_xp_ps:
    Res_xp_ps=(Res_xp_0+Res_xp_180)/2。Res_xp_ps = (Res_xp_0 + Res_xp_180) / 2.
  15. 一种光学设备,包括如权利要求9-14任一所述的栅格误差的测量装置。An optical device comprising the grid error measuring device according to any one of claims 9-14.
  16. 根据权利要求15所述的光学设备,所述光学设备包括光刻机。The optical apparatus according to claim 15, said optical apparatus comprising a lithography machine.
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Publication number Priority date Publication date Assignee Title
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724526A (en) * 1984-09-11 1988-02-09 Bausch & Lomb Incorporated Apparatus and method for determining object elevation and height from images thereof
CN102109767A (en) * 2009-12-23 2011-06-29 北大方正集团有限公司 Method and system for determining alignment precision matching between lithography machines
CN102264097A (en) * 2011-08-26 2011-11-30 北京铭润创展科技有限公司 Method for positioning GSM (global system for mobile communication) mobile communication network terminal
US20120186088A1 (en) * 2011-01-20 2012-07-26 Trimble Navigation Limited Integrated surveying and leveling
CN104236501A (en) * 2014-09-22 2014-12-24 上海市计量测试技术研究院 Self-calibration method for grid point system error of two-dimensional grid plate
CN105261067A (en) * 2015-11-04 2016-01-20 深圳职业技术学院 Overground and underground integrated modeling method based on true 3D volumetric display technique and system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798947A (en) * 1996-09-25 1998-08-25 The Board Of Trustees Of The Leland Stanford, Jr. University Methods, apparatus and computer program products for self-calibrating two-dimensional metrology stages
US7054007B2 (en) * 2002-02-08 2006-05-30 Koninklijke Philips Electronics N.V. Calibration wafer for a stepper
JP4222926B2 (en) * 2002-09-20 2009-02-12 エーエスエムエル ネザーランズ ビー.ブイ. Device inspection
EP2171394B2 (en) * 2007-07-24 2020-07-15 Hexagon Metrology S.p.A. Method for compensating measurement errors caused by deformations of a measuring machine bed under the load of a workpiece and measuring machine operating according to said method
US8508735B2 (en) * 2008-09-22 2013-08-13 Nikon Corporation Movable body apparatus, movable body drive method, exposure apparatus, exposure method, and device manufacturing method
KR20140068970A (en) * 2011-08-31 2014-06-09 에이에스엠엘 네델란즈 비.브이. A method of determining focus corrections, lithographic processing cell and device manufacturing method
CN103324036A (en) * 2013-07-04 2013-09-25 中国科学院光电技术研究所 Detection device and method for magnification and distortion of projection objective
CN104006777B (en) * 2014-06-10 2017-06-13 清华大学 A kind of two-dimensional large-stroke precision stage measuring system self-calibrating method
WO2016136690A1 (en) * 2015-02-23 2016-09-01 株式会社ニコン Measurement device, lithography system and exposure device, and management method, superposition measurement method and device manufacturing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724526A (en) * 1984-09-11 1988-02-09 Bausch & Lomb Incorporated Apparatus and method for determining object elevation and height from images thereof
CN102109767A (en) * 2009-12-23 2011-06-29 北大方正集团有限公司 Method and system for determining alignment precision matching between lithography machines
US20120186088A1 (en) * 2011-01-20 2012-07-26 Trimble Navigation Limited Integrated surveying and leveling
CN102264097A (en) * 2011-08-26 2011-11-30 北京铭润创展科技有限公司 Method for positioning GSM (global system for mobile communication) mobile communication network terminal
CN104236501A (en) * 2014-09-22 2014-12-24 上海市计量测试技术研究院 Self-calibration method for grid point system error of two-dimensional grid plate
CN105261067A (en) * 2015-11-04 2016-01-20 深圳职业技术学院 Overground and underground integrated modeling method based on true 3D volumetric display technique and system

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