WO2020000182A1 - Heat dissipation device and unmanned aerial vehicle having the heat dissipation device - Google Patents

Heat dissipation device and unmanned aerial vehicle having the heat dissipation device Download PDF

Info

Publication number
WO2020000182A1
WO2020000182A1 PCT/CN2018/092867 CN2018092867W WO2020000182A1 WO 2020000182 A1 WO2020000182 A1 WO 2020000182A1 CN 2018092867 W CN2018092867 W CN 2018092867W WO 2020000182 A1 WO2020000182 A1 WO 2020000182A1
Authority
WO
WIPO (PCT)
Prior art keywords
fan
heat
air
base
aerial vehicle
Prior art date
Application number
PCT/CN2018/092867
Other languages
French (fr)
Chinese (zh)
Inventor
李阳
周震昊
陶冶
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to CN201880017083.1A priority Critical patent/CN110506000A/en
Priority to PCT/CN2018/092867 priority patent/WO2020000182A1/en
Publication of WO2020000182A1 publication Critical patent/WO2020000182A1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
    • B64U20/00—Constructional aspects of UAVs
    • B64U20/90—Cooling
    • B64U20/96—Cooling using air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
    • B64U20/00—Constructional aspects of UAVs
    • B64U20/90—Cooling
    • B64U20/92—Cooling of avionics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
    • B64U10/00—Type of UAV
    • B64U10/10—Rotorcrafts
    • B64U10/13—Flying platforms
    • B64U10/14—Flying platforms with four distinct rotor axes, e.g. quadcopters

Definitions

  • the present disclosure belongs to the technical field of heat dissipation, and particularly relates to a heat dissipation device and an unmanned aerial vehicle having the same.
  • a heat-conducting plate is generally used to introduce heat from electronic components such as chips into the air, and then a fan is used to promote air flow for heat dissipation.
  • the heat transfer plate is usually long and of high quality.
  • to remove all the heat from the heat transfer plate requires a complicated air path design, which causes the quality of the heat dissipation system to be bloated, or it may cause heat accumulation in some places, resulting in higher system temperature. Therefore, the cooling effect is not ideal.
  • An aspect of the present disclosure provides a heat dissipation device including a thermally conductive fan including a base, a housing, and a fan blade;
  • the shell is surrounded by a top surface and four sides, and is fixedly connected to the base to form a cavity.
  • the fan blade is rotatably installed in the cavity.
  • the shell is opposite to the base.
  • a fan inlet is formed on the top surface, a fan outlet is formed on one side, and the base is made of a thermally conductive material.
  • the base is made of copper, copper alloy or aluminum alloy.
  • the heat dissipation device further includes a plurality of heat sinks, and the heat sinks are formed on a substrate and disposed outside the air outlet of the fan.
  • the base is integrally formed with the substrate.
  • the height of the heat sink is equal to or greater than the height of the fan air outlet.
  • the heat sink is made of copper, copper alloy or aluminum alloy.
  • the heat radiating fins extend along the direction of the fan air outlet, and the heat radiating fins are parallel to each other or radial.
  • the heat dissipating device further includes one or more guide fins, the guide fins are formed on a substrate and disposed outside the fan air outlet, and the guide fins form one or more guide air ducts.
  • the heat dissipation device includes one or more drainage fins, and the drainage fins are formed on the substrate and form one or more drainage air ducts.
  • each of the drainage fins is connected to a heat sink, or each of the drainage fins is integrally formed with a heat sink.
  • the plurality of drainage pieces are arranged at intervals to form a plurality of drainage air ducts.
  • an unmanned aerial vehicle including:
  • a housing which includes an accommodation space inside;
  • An electronic device housed in the accommodation space;
  • a heat radiating device which is contained in the accommodating space and used for taking away the heat generated by the electronic device;
  • the heat dissipating device comprises a heat-conducting fan
  • the thermally conductive fan includes a base, a housing, and a fan blade
  • the shell is surrounded by a top surface and four sides, and is fixedly connected to the base to form a cavity.
  • the fan blade is rotatably installed in the cavity.
  • the shell is opposite to the base.
  • a fan inlet is formed on the top surface, a fan outlet is formed on one side, the base is made of a thermally conductive material, and at least a part of the base is attached to the electronic device;
  • An air inlet and an air outlet are formed on the casing, the air inlet is located upstream of the fan air inlet, and the air outlet is located downstream of the fan air outlet.
  • the base is made of copper, copper alloy or aluminum alloy.
  • the heat dissipation device further includes a plurality of heat sinks, and the heat sinks are formed on a substrate and disposed outside the air outlet of the fan.
  • the base is integrally formed with the substrate.
  • the substrate of the heat sink is in direct contact with the electronic device.
  • the height of the heat sink is equal to or greater than the height of the fan air outlet.
  • the heat sink is made of copper, copper alloy or aluminum alloy.
  • the heat radiating fins extend along the direction of the fan air outlet, and the heat radiating fins are parallel to each other or radial.
  • the heat dissipating device includes one or more guide fins, the guide fins are formed on a substrate and disposed outside the fan air outlet, and the guide fins form one or more guide air ducts, The airflow is directed to the air outlet of the casing.
  • the heat dissipation device includes one or more drainage fins, the drainage fins are formed on the substrate and form one or more drainage air ducts for guiding airflow to the air outlet of the casing.
  • the plurality of drainage pieces are arranged at intervals to form a plurality of drainage air ducts.
  • each of the drainage fins is connected to a heat sink, or each of the drainage fins is integrally formed with a heat sink.
  • the air inlet of the casing is disposed at a front portion and / or at least one side portion of the casing. Further, the air outlet of the casing is disposed at a rear portion and / or at least one side portion of the casing. Further, the air outlet of the casing is disposed downstream of the fan air outlet.
  • the disclosure directly introduces the heat generated by the heat source into the fan, and takes the heat away by the wind generated by the fan. Because the direct heat conduction is used, the volume of the heat sink can be reduced, so the structure of the heat sink is compact and the quality is small; Directly blowing the heat source, the air path is relatively simple, can avoid complicated air path design, can effectively avoid heat accumulation, and significantly reduce the temperature.
  • FIG. 1 is a side view of a heat sink in an embodiment of the present disclosure
  • FIG. 2 is a front view of a heat dissipation device in an embodiment of the present disclosure
  • FIG. 3 is a perspective view of a heat sink in an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of a heat dissipation device in another embodiment of the present disclosure.
  • 5A and 5B are bottom views of an unmanned aerial vehicle in an embodiment of the present disclosure.
  • FIG. 6 is a perspective view of an unmanned aerial vehicle in the embodiment of the present disclosure.
  • references to “some embodiments”, “embodiments”, “an embodiment”, “an example”, or “examples” mean: described in conjunction with the embodiments or examples Particular features, structures, or characteristics of are included in at least one embodiment of the present disclosure. Therefore, the terms “in some embodiments”, “in an embodiment”, “an example”, or “example” appearing everywhere in this disclosure do not necessarily all refer to the same embodiment or example. Furthermore, the particular features, structures, or characteristics may be combined in any suitable combination and / or subcombination in one or more embodiments or examples. In addition, those skilled in the art will understand that the term “and / or” used in the present disclosure includes one or more related listed items and all combinations of items.
  • the present disclosure combines a traditional heat-conducting plate with a heat-dissipating fan.
  • the base of the fan is made of a heat-conducting material.
  • the base can conduct the heat generated by the heating components to the vicinity of the fan blades, and send the heat through the airflow generated by the fan blades. Achieve good heat dissipation in a small space.
  • an embodiment of the present disclosure provides a heat dissipation device 100 including a thermally conductive fan 10 including a base 11, a housing 12, and a fan blade 13;
  • the base 11 is made of a thermally conductive material, which can conduct heat generated by the electronic devices attached to the lower surface of the base 11 to the vicinity of the fan blade 13.
  • the thermally conductive material can be copper, copper alloy, or aluminum alloy.
  • the outer shell 12 is surrounded by a top surface and four sides to form a fixed connection with the base 11 to form a cavity.
  • a fan air inlet 14 is formed on the upper surface of the outer shell 12 opposite to the base, and cold air from the outside enters the cavity.
  • the fan blade 13 is rotatably installed in the cavity.
  • the fan blade 13 may be installed in the cavity through a mounting bracket.
  • a fan air outlet 15 is formed on one side of the casing 12. With the rotation of the fan blades 13, cold air can conduct the heat from the base 11 to the vicinity of the fan blades 13 out of the fan air outlets 15, so as to achieve the electronic components. Cooling effect.
  • the heat dissipation device 100 may further include a plurality of heat sinks 16, and a heat dissipation air passage is formed between the heat sinks 16 for airflow to pass through.
  • the heat sink 16 is formed on a substrate 17 and is disposed outside the fan air outlet 15. The heat sink 16 can increase the heat dissipation area, so that the gas flowing out of the heat-conducting fan 10 assists the heat-generating electronic components around the heat sink 16 to dissipate heat.
  • the lower surface of the base 11 is attached to the electronic device 18, and the lower surface of the substrate 17 may be attached to the electronic device 18, or when the area of the electronic device 18 is small, the lower surface of the substrate 17 It may not be bonded to the electronic device 18.
  • the electronic device 18 may include one or more heat-generating electronic devices.
  • the substrate 17 and the heat sink 16 may be integrally formed, or the heat sink 16 may be fixed to the substrate 17 by welding or the like.
  • the substrate 17 and the heat sink 16 may be made of the same or different thermally conductive materials.
  • the substrate 17 and the heat sink 16 can be made of a thermally conductive material such as copper, copper alloy, or aluminum alloy, respectively.
  • the width of the substrate 17 is greater than or equal to the width of the fan air outlet 15, and the number and interval of the heat sinks 16 are determined by the number and heat generation of the electronic devices.
  • the number of the electronic devices 18 is large and the heat generation is high.
  • the number of heat sinks 16 may be appropriately increased or the interval between the heat sinks 16 may be reduced.
  • the height of the heat sink 16 may be greater than or equal to the height of the fan air outlet 15, which may be beneficial to forming a fixed air duct and enhancing the heat dissipation effect.
  • the height of the heat sink 16 may be smaller than the height of the fan outlet 15.
  • the fins 16 extend in the same direction as the fan outlet 15, and the fins 16 are parallel to each other.
  • the heat sink 16 may be provided in other ways.
  • the heat sink 16 may be radial, and the heat sink 16 extends along the direction of the fan air outlet 15.
  • the heat dissipating device 100 includes one or more air guide fins 19 formed on the substrate 17, and the plurality of air guide fins 19 are disposed outside the fan air outlet 15 and form one or more air guide ducts for The airflow discharged from the fan outlet 15 is guided to an appropriate position.
  • the heat dissipating device 100 is provided with a plurality of heat sinks 16 and a plurality of air guide fins 19.
  • the air guide fins 19 form a plurality of air guide ducts for guiding the airflow from the heat radiating ducts to a proper position.
  • the relative positions of the drain fins 19 and the heat sink 16 can be arbitrarily adjusted as needed.
  • the drain fins 19 can be connected to one of the heat sinks 16 at this time. That is, the distal end of the heat sink 16 is extended in a specific direction to form a drain sheet 19.
  • the drain sheet 19 may be spaced a certain distance from the heat sink 16.
  • the number of the drainage pieces 19 is four, and the four drainage pieces are integrally formed with four heat sinks, wherein the drainage pieces 191 and 192 form an air duct, and the drainage pieces are formed integrally.
  • 193 and the deflector 194 form another air duct, and the deflector 192 and the deflector 193 are spaced a certain distance apart to form a third air duct, so that the airflow discharged from the fan outlet 5 is divided into 3 airflows, of which the left and right airflows are They are respectively guided to the left and right sides of the fan outlet 15, and the direction of the intermediate airflow remains unchanged, so as to further dissipate the electronic components in the outflow direction.
  • the deflector 192 and the deflector 193 are formed integrally with the same heat sink 16 respectively, so that two air ducts can be formed, so that the airflow discharged from the fan outlet 15 is divided into two left and right airflows, and two airflows. It is guided to the left and right sides of the fan outlet 15 respectively.
  • the heat dissipating device 100 includes four air diffusing fins 19, but does not include the heat radiating fins 16.
  • the four air deflecting fins 19 are provided on the outside of the fan air outlet 15 to form two air ducts, so that the fan air outlet 15 is discharged.
  • the airflow is divided into left and right airflows, and the two airflows are respectively guided to the left and right sides of the fan outlet 15.
  • the shape of the drainage sheet can be any suitable shape, and can be specifically determined according to the direction of the air outlet with respect to the heat sink, for example, it can be an arc shape, a linear shape, or the like.
  • the base 11 and the substrate 17 are integrally formed.
  • the housing 12 and the heat sink 16 are disposed on the same base 11 (the substrate 17), and the heat sink 16 is disposed on the housing 12
  • the fan outlet 15 on the side extends outside the fan outlet 15.
  • the base 11 (substrate 17) is bonded to the electronic device 18. It should be noted that the bonding in the present disclosure includes a case where the base 11 and the electronic device 18 are bonded through a thermally conductive medium (such as thermally conductive silicone).
  • a thermally conductive medium such as thermally conductive silicone
  • the base 11 and the base plate 17 are separated, the base 11 and the base plate 17 may be fixed together by a screw method, and the base 11 and the base plate 17 are bonded to the electronic device 18.
  • the fan base as a thermally conductive sheet
  • the heat generated by the heating device is transmitted to the vicinity of the fan blade, and then the fan is used to send out the heat, which can reduce the quality of the heat dissipation system and avoid complicated air path design and heat accumulation.
  • the fan base By using a heat-conducting fan and a heat sink, the heat dissipation effect can be enhanced and the temperature of the electronic device can be effectively reduced.
  • the disclosure is particularly suitable for heat dissipation occasions where the heat source is concentrated, the heat dissipation space is small, and the temperature is strictly required.
  • the structure indicated by reference numeral 48 is used to fix the fan and the heat sink as a whole, and the structure indicated by reference numeral 49 locks the heat sink and the fan to the circuit board on which the electronic device is located.
  • an embodiment of the present disclosure provides an unmanned aerial vehicle 200.
  • the unmanned aerial vehicle 200 includes the heat dissipation device 100, and the heat dissipation device 100 includes a heat-conducting fan 10.
  • the aircraft includes a fuselage 01, a plurality of arms 02 extending outward from the fuselage, a plurality of rotors 03 mounted on the plurality of arms, a gimbal 04, a vision sensor 05, and electronic devices located in the fuselage.
  • the electronic device may include one or more heat-generating electronic components; the vision sensor includes a front-view sensor, a down-view sensor, and a rear-view sensor.
  • 33 denotes a front-view bracket
  • 34 denotes a GPS power module
  • 35 denotes GPS
  • 36 denotes a rear-view bracket.
  • the fuselage includes a casing 21, and a receiving space is formed inside the casing 21.
  • An electronic device is disposed in the receiving space.
  • the electronic device is mounted on a circuit board.
  • the heat dissipating device 100 is accommodated in the accommodating space for taking away the heat generated by the electronic device, and at least a part of the base of the heat-conducting fan is attached to the electronic device.
  • the housing 21 is formed with an air inlet 22 and an air outlet 23, and electronic components are concentratedly distributed between the air inlet 22 and the air outlet 23.
  • the air inlet 22 and the air outlet 23 may be independently provided on the top, bottom, front, side, or tail of the casing, respectively.
  • the air inlet 22 is located upstream of the fan air inlet 14, and the air outlet 23 is located downstream of the fan air outlet 15.
  • the air outside the casing 21 enters the casing through the air inlet 22 and then enters the fan inlet 14.
  • the air can conduct the heat from the base 11 to the vicinity of the fan blades 13 through the fan outlet 15 and pass through the outlet of the casing 21. 23
  • the casing is discharged, so that the heat generated by the electronic components in the casing is dissipated to the outside of the casing, and the purpose of cooling the electronic components inside the casing is achieved.
  • FIG. 6 04 denotes a pan / tilt head
  • a front-view binocular (front-view sensor) 51 is provided above
  • a bottom-view binocular (down-view sensor) 52 is provided on the abdomen of the fuselage 01.
  • TOF 54 is provided.
  • the air inlets 221 and 222 of the housing 21 are provided on both sides of the front of the housing, and the air outlet 23 of the housing is provided at the rear of the rear of the housing, and is provided at the fan outlet 5 Downstream.
  • the fan air outlet 5 is close to the air outlet 23 of the casing 21, so that the airflow from the fan air outlet 5 can be quickly discharged from the casing 21.
  • the heat sink 100 further includes a plurality of heat sinks 16 formed on a substrate 17 and disposed outside the fan air outlet 15.
  • a fixed cooling air duct is formed between the fins 16, which can increase the heat dissipation area, so that the airflow discharged from the fan outlet 5 can further dissipate the heat-generating electronic devices near the fins 16.
  • the air inlets 221 and 222 of the housing 21 are provided on both sides of the front portion of the housing, the air outlet 23 of the housing is provided at the rear portion of the rear portion of the housing, and the outlet of the heat dissipation air duct is close to The air outlet 23 of the casing 21 can guide airflow to the air outlet 23 of the casing 21.
  • the heat sink 100 includes a plurality of heat sinks 16 and one or more air guide fins 19 that form one or more air guide ducts for guiding airflow to the housing.
  • the air outlet 23 of 21 allows the airflow to flow regularly in the casing and improves heat dissipation efficiency.
  • the deflectors 9 of the heat dissipation device 100 form three diversion ducts, and the two left and right diversion ducts guide the airflow from the heat dissipation ducts to the air outlets 231 and 232.
  • the middle drainage air duct guides the airflow to the air outlets 233 and 234 at the rear of the casing 21, so that the airflow further dissipates the passing electronic devices during the flow to the outlet.
  • the drainage fins of the heat dissipation device 100 form two drainage air ducts, and the two drainage air ducts guide airflow from the radiation air ducts to the air outlets 231 and 232 on both sides of the casing 21.
  • the heat sink 100 includes a plurality of fins 19 but does not include a fin 16.
  • the plurality of fins 19 form a plurality of air ducts, and the plurality of air ducts direct the airflow from the fan outlet 15 to The air outlet 23 on the casing 21.
  • the heat radiating device 100 can directly introduce the heat generated by the electronic devices in the UAV 200 to the vicinity of the fan blade 13, and take out the heat through the airflow generated by the fan blade 13, and finally the airflow passes through the casing of the UAV The upper air outlet 23 is discharged.
  • a heat sink 16 is further provided at the outlet of the heat-conducting fan 10 to further dissipate the electronic components around the heat sink 16, and the airflow passing through the heat sink 16 is shunted by the flow guide 19 and exits from a plurality
  • the tuyere 23 is discharged from the unmanned aerial vehicle, and further dissipates heat from surrounding electronic devices during the process of flowing out from the deflector.
  • the heat dissipation device of the present disclosure has small mass, avoids complicated air path design and heat accumulation, thereby helping to reduce the overall quality of the unmanned aerial vehicle and effectively lowering the temperature of the unmanned aerial vehicle.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Remote Sensing (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device comprises a heat-conducting fan. The heat-conducting fan comprises a base, a housing, and fan blades. The housing is enclosed by a top surface and four side surfaces, and is fixedly connected to the base to form a cavity. The fan blades are rotatably installed in the cavity. A fan air inlet is formed at the top surface of the housing facing the base. A fan air outlet is formed at one of the side surfaces of the housing. The base is made of a heat-conducting material. In the invention, heat generated by a heat source is directly guided to a fan, such that air generated by the fan transfers the heat. Since the invention employs direct heat conduction, an area of a heat dissipation member can be reduced, thereby providing a heat dissipation device having a compact structure and a small mass. Moreover, since air is directly directed to a heat source, an air path is simpler, thereby preventing a complex air path design, effectively preventing heat accumulation, and significantly lowering a temperature.

Description

散热装置及具有该散热装置的无人机Radiating device and unmanned aerial vehicle having the same 技术领域Technical field
本公开属于散热技术领域，具体涉及一种散热装置及具有该散热装置的无人机。The present disclosure belongs to the technical field of heat dissipation, and particularly relates to a heat dissipation device and an unmanned aerial vehicle having the same.
背景技术Background technique
现有技术中对电子产品进行冷却时，通常利用导热板将热量从芯片等电子器件部分导入到空气中，然后再利用风扇促使空气流动进行散热。导热板通常比较长，并且质量大，而且，要把导热板导出的热量全部带走需要复杂的风路设计，造成散热***质量臃肿，或者部分地方可能造成热积留，导致***温度较高，因此散热效果不甚理想。In the prior art, when electronic products are cooled, a heat-conducting plate is generally used to introduce heat from electronic components such as chips into the air, and then a fan is used to promote air flow for heat dissipation. The heat transfer plate is usually long and of high quality. Moreover, to remove all the heat from the heat transfer plate requires a complicated air path design, which causes the quality of the heat dissipation system to be bloated, or it may cause heat accumulation in some places, resulting in higher system temperature. Therefore, the cooling effect is not ideal.
发明内容Summary of the invention
本公开的一个方面提供了一种散热装置，包括导热式风扇，所述导热式风扇包括底座、外壳和风扇叶片；An aspect of the present disclosure provides a heat dissipation device including a thermally conductive fan including a base, a housing, and a fan blade;
所述外壳由一个顶面和四个侧面围成，并与所述底座固定连接形成一腔体，所述风扇叶片可转动地安装在所述腔体内，所述外壳上与所述底座相对的顶面上形成有风扇入风口，其中一个侧面形成有风扇出风口，所述底座由导热材料制成。The shell is surrounded by a top surface and four sides, and is fixedly connected to the base to form a cavity. The fan blade is rotatably installed in the cavity. The shell is opposite to the base. A fan inlet is formed on the top surface, a fan outlet is formed on one side, and the base is made of a thermally conductive material.
进一步地，所述底座由铜、铜合金或铝合金制成。Further, the base is made of copper, copper alloy or aluminum alloy.
进一步地，所述散热装置还包括多个散热片，所述散热片形成在一基板上并且设置在所述风扇出风口外侧。Further, the heat dissipation device further includes a plurality of heat sinks, and the heat sinks are formed on a substrate and disposed outside the air outlet of the fan.
进一步地，所述底座与所述基板一体形成。Further, the base is integrally formed with the substrate.
进一步地，所述散热片的高度等于或大于所述风扇出风口的高度。Further, the height of the heat sink is equal to or greater than the height of the fan air outlet.
进一步地，所述散热片由铜、铜合金或铝合金制成。Further, the heat sink is made of copper, copper alloy or aluminum alloy.
进一步地，所述散热片沿着所述风扇出风口的方向延伸，所述散热片相互平行或者呈放射状。Further, the heat radiating fins extend along the direction of the fan air outlet, and the heat radiating fins are parallel to each other or radial.
进一步地，所述散热装置还包括一条或多条引流片，所述引流片形成在一基板上并且设置在所述风扇出风口外侧，所述引流片形成一条或多条引流风道。Further, the heat dissipating device further includes one or more guide fins, the guide fins are formed on a substrate and disposed outside the fan air outlet, and the guide fins form one or more guide air ducts.
进一步地，所述散热装置上包括一条或多条引流片，所述引流片形成在所述基板上并形成一条或多条引流风道。Further, the heat dissipation device includes one or more drainage fins, and the drainage fins are formed on the substrate and form one or more drainage air ducts.
进一步地，每个所述引流片与一个散热片互相连接，或者每个所述引流片与一个散热片一体形成。Further, each of the drainage fins is connected to a heat sink, or each of the drainage fins is integrally formed with a heat sink.
进一步地，所述多个引流片间隔设置，形成多条引流风道。Further, the plurality of drainage pieces are arranged at intervals to form a plurality of drainage air ducts.
本公开的另一个方面提供了一种无人飞行器，包括：Another aspect of the present disclosure provides an unmanned aerial vehicle including:
壳体，所述壳体内部包括一容纳空间；A housing, which includes an accommodation space inside;
电子器件，所述电子器件收容于所述容纳空间；以及An electronic device housed in the accommodation space; and
散热装置，所述散热装置收容于所述容纳空间，用于带走所述电子器件产生的热量；A heat radiating device, which is contained in the accommodating space and used for taking away the heat generated by the electronic device;
其特征在于：所述散热装置包括导热式风扇，It is characterized in that the heat dissipating device comprises a heat-conducting fan,
所述导热式风扇包括底座、外壳和风扇叶片；The thermally conductive fan includes a base, a housing, and a fan blade;
所述外壳由一个顶面和四个侧面围成，并与所述底座固定连接形成一腔体，所述风扇叶片可转动地安装在所述腔体内，所述外壳上与所述底座相对的顶面上形成有风扇入风口，其中一个侧面形成有风扇出风口，所述底座由导热材料制成，并且底座的至少一部分与所述电子器件贴合；The shell is surrounded by a top surface and four sides, and is fixedly connected to the base to form a cavity. The fan blade is rotatably installed in the cavity. The shell is opposite to the base. A fan inlet is formed on the top surface, a fan outlet is formed on one side, the base is made of a thermally conductive material, and at least a part of the base is attached to the electronic device;
所述壳体上形成有入风口和出风口，所述入风口位于所述风扇入风口的上游，所述出风口位于所述风扇出风口的下游。An air inlet and an air outlet are formed on the casing, the air inlet is located upstream of the fan air inlet, and the air outlet is located downstream of the fan air outlet.
进一步地，所述底座由铜、铜合金或铝合金制成。Further, the base is made of copper, copper alloy or aluminum alloy.
进一步地，所述散热装置还包括多个散热片，所述散热片形成在一基板上并且设置在所述风扇出风口外侧。Further, the heat dissipation device further includes a plurality of heat sinks, and the heat sinks are formed on a substrate and disposed outside the air outlet of the fan.
进一步地，所述底座与所述基板一体形成。Further, the base is integrally formed with the substrate.
进一步地，所述散热装置的基板的至少一部分与所述电子器件直接接触。Further, at least a part of the substrate of the heat sink is in direct contact with the electronic device.
进一步地，所述散热片的高度等于或大于所述风扇出风口的高度。Further, the height of the heat sink is equal to or greater than the height of the fan air outlet.
进一步地，所述散热片由铜、铜合金或铝合金制成。Further, the heat sink is made of copper, copper alloy or aluminum alloy.
进一步地，所述散热片沿着所述风扇出风口的方向延伸，所述散热片相互平行或者呈放射状。Further, the heat radiating fins extend along the direction of the fan air outlet, and the heat radiating fins are parallel to each other or radial.
进一步地，所述散热装置包括一条或多条引流片，所述引流片形成在一基板上并且设置在所述风扇出风口外侧，所述引流片形成一条或多条引流风道，用于将气流引导至所述壳体的出风口。Further, the heat dissipating device includes one or more guide fins, the guide fins are formed on a substrate and disposed outside the fan air outlet, and the guide fins form one or more guide air ducts, The airflow is directed to the air outlet of the casing.
进一步地，所述散热装置上包括一条或多条引流片，所述引流片形成在所述基板上并形成一条或多条引流风道，用于将气流引导至所述壳体的出风口。Further, the heat dissipation device includes one or more drainage fins, the drainage fins are formed on the substrate and form one or more drainage air ducts for guiding airflow to the air outlet of the casing.
进一步地，所述多个引流片间隔设置，形成多条引流风道。Further, the plurality of drainage pieces are arranged at intervals to form a plurality of drainage air ducts.
进一步地，每个所述引流片与一个散热片互相连接，或者每个所述引流片与一个散热片一体形成。Further, each of the drainage fins is connected to a heat sink, or each of the drainage fins is integrally formed with a heat sink.
进一步地，所述壳体的入风口设置在壳体的前部和/或至少一侧部。进一步地，所述壳体的出风口设置在所述壳体的后部和/或至少一侧部。进一步地，所述壳体的出风口设置在所述风扇出风口的下游。Further, the air inlet of the casing is disposed at a front portion and / or at least one side portion of the casing. Further, the air outlet of the casing is disposed at a rear portion and / or at least one side portion of the casing. Further, the air outlet of the casing is disposed downstream of the fan air outlet.
从上述技术方案可以看出，本公开实施例至少具有以下有益效果：It can be seen from the foregoing technical solutions that the embodiments of the present disclosure have at least the following beneficial effects:
本公开将热源所产生的热直接导入风扇中，通过风扇产生的风将热量带走，由于采用的是直接导热，可以减少散热片的体积，因此散热装置的结构紧凑、质量小；同时，由于直接吹动热源，风路比较简单，可以避免复杂的风路设计，可以有效避免热积留，显著降低温度。The disclosure directly introduces the heat generated by the heat source into the fan, and takes the heat away by the wind generated by the fan. Because the direct heat conduction is used, the volume of the heat sink can be reduced, so the structure of the heat sink is compact and the quality is small; Directly blowing the heat source, the air path is relatively simple, can avoid complicated air path design, can effectively avoid heat accumulation, and significantly reduce the temperature.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
附图是用来提供对本公开的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本公开，但并不构成对本公开的限制。在附图中：The accompanying drawings are used to provide a further understanding of the present disclosure, and constitute a part of the description. Together with the following specific embodiments, the drawings are used to explain the present disclosure, but do not constitute a limitation on the present disclosure. In the drawings:
图1是本公开实施例中的散热装置的侧视图；1 is a side view of a heat sink in an embodiment of the present disclosure;
图2是本公开实施例中的散热装置的正视图；2 is a front view of a heat dissipation device in an embodiment of the present disclosure;
图3是本公开实施例中的散热装置的立体图；3 is a perspective view of a heat sink in an embodiment of the present disclosure;
图4是本公开另一实施例中的散热装置结构示意图；4 is a schematic structural diagram of a heat dissipation device in another embodiment of the present disclosure;
图5A和5B均是本公开实施例中的无人飞行器的仰视图；5A and 5B are bottom views of an unmanned aerial vehicle in an embodiment of the present disclosure;
图6是本公开实施例中的无人飞行器的立体图。FIG. 6 is a perspective view of an unmanned aerial vehicle in the embodiment of the present disclosure.
具体实施方式detailed description
为使本公开的目的、技术方案和优点更加清楚明白，以下结合具体实施例，并参照附图，对本公开进一步详细说明。In order to make the objectives, technical solutions, and advantages of the present disclosure more clear, the present disclosure is further described in detail below with reference to specific embodiments and with reference to the accompanying drawings.
需要说明的是，在本公开中，对于“一些实施例”，“实施例”，“一个实施例”，“一个示例”或“示例”的提及，意味着：结合该实施例或示例描述的特定特征、结构或特性被包含在本公开至少一个实施例中。因此，在本公开中各处出现的用语“在一些实施例中”、“在一个实施例中”，“一个示例”或“示例”不一定都指同一实施例或者示例。此外，可以以任何适当的组合和/或子组合将特定的特征、结构或特性组合在一个或多个实施例或者示例中。此外，本领域技术人员应当理解，本公开所述使用的用语“和/或”包括一个或多个相关列出的项目以及项目的所有组合。It should be noted that in this disclosure, references to "some embodiments", "embodiments", "an embodiment", "an example", or "examples" mean: described in conjunction with the embodiments or examples Particular features, structures, or characteristics of are included in at least one embodiment of the present disclosure. Therefore, the terms "in some embodiments", "in an embodiment", "an example", or "example" appearing everywhere in this disclosure do not necessarily all refer to the same embodiment or example. Furthermore, the particular features, structures, or characteristics may be combined in any suitable combination and / or subcombination in one or more embodiments or examples. In addition, those skilled in the art will understand that the term “and / or” used in the present disclosure includes one or more related listed items and all combinations of items.
本公开将传统的导热板与散热风扇进行结合，风扇的底座由导热材料制备而成，底座可以将发热元器件产生的热量传导至风扇叶片附近，通过风扇叶片产生的气流将热量送出，这样可以在在较小的空间达到良好的散热效果。The present disclosure combines a traditional heat-conducting plate with a heat-dissipating fan. The base of the fan is made of a heat-conducting material. The base can conduct the heat generated by the heating components to the vicinity of the fan blades, and send the heat through the airflow generated by the fan blades. Achieve good heat dissipation in a small space.
参见图1-5所示，本公开实施例提供了一种散热装置100，包括导热式风扇10，该导热式风扇包括底座11、外壳12和风扇叶片13；As shown in FIGS. 1-5, an embodiment of the present disclosure provides a heat dissipation device 100 including a thermally conductive fan 10 including a base 11, a housing 12, and a fan blade 13;
其中底座11由导热材料制成，可以将与底座11的下表面贴合的电子器件产生的热量传导至风扇叶片13附近，导热材料可以是铜、铜合金或铝合金等。The base 11 is made of a thermally conductive material, which can conduct heat generated by the electronic devices attached to the lower surface of the base 11 to the vicinity of the fan blade 13. The thermally conductive material can be copper, copper alloy, or aluminum alloy.
外壳12由一个顶面和四个侧面围成与底座11固定连接，形成腔体，外壳12上与底座相对的顶面上形成有风扇入风口14，外部的冷空气由此进入所述腔体内，风扇叶片13可转动地安装在所述腔体内，例如，风扇叶片13可通过一安装支架安装在所述腔体内。The outer shell 12 is surrounded by a top surface and four sides to form a fixed connection with the base 11 to form a cavity. A fan air inlet 14 is formed on the upper surface of the outer shell 12 opposite to the base, and cold air from the outside enters the cavity. The fan blade 13 is rotatably installed in the cavity. For example, the fan blade 13 may be installed in the cavity through a mounting bracket.
外壳12的一侧部形成有风扇出风口15，在风扇叶片13的旋转作用下，冷空气可以将底座11传导至风扇叶片13附近的热量从风扇出风口15带出，从而达到对电子器件进行降温的效果。A fan air outlet 15 is formed on one side of the casing 12. With the rotation of the fan blades 13, cold air can conduct the heat from the base 11 to the vicinity of the fan blades 13 out of the fan air outlets 15, so as to achieve the electronic components. Cooling effect.
如图4所示，为了增强散热装置100的散热效果，散热装置100还可以包括多个散热片16，散热片16之间形成供气流通过的散热风道。散热片16形成在一基板17上，并且设置在风扇出风口15的外侧。散热片16可以增加散热面积，从而使从导热式风扇10流出的气体辅助散热片16周围的发热电子器件散热。As shown in FIG. 4, in order to enhance the heat dissipation effect of the heat dissipation device 100, the heat dissipation device 100 may further include a plurality of heat sinks 16, and a heat dissipation air passage is formed between the heat sinks 16 for airflow to pass through. The heat sink 16 is formed on a substrate 17 and is disposed outside the fan air outlet 15. The heat sink 16 can increase the heat dissipation area, so that the gas flowing out of the heat-conducting fan 10 assists the heat-generating electronic components around the heat sink 16 to dissipate heat.
如图4所示，底座11的下表面至少有一部分与电子器件18贴合，基板17的下表面也可以与电子器件18贴合，或者在电子器件18的面积较小时，基板17的下表面也可以不与电子器件18贴合。电子器件18可以包括一个或多个发热电子器件。As shown in FIG. 4, at least a part of the lower surface of the base 11 is attached to the electronic device 18, and the lower surface of the substrate 17 may be attached to the electronic device 18, or when the area of the electronic device 18 is small, the lower surface of the substrate 17 It may not be bonded to the electronic device 18. The electronic device 18 may include one or more heat-generating electronic devices.
基板17和散热片16可以一体形成，或者也可以将散热片16通过焊接等方式固定在基板17上，基板17和散热片16可以由相同或不同的导热材料制备而成。例如基板17和散热片16可以分别由铜、铜合金或铝合金等导热材料制备而成。The substrate 17 and the heat sink 16 may be integrally formed, or the heat sink 16 may be fixed to the substrate 17 by welding or the like. The substrate 17 and the heat sink 16 may be made of the same or different thermally conductive materials. For example, the substrate 17 and the heat sink 16 can be made of a thermally conductive material such as copper, copper alloy, or aluminum alloy, respectively.
较佳的，基板17的宽度大于或等于风扇出风口15的宽度，散热片16的数量和间隔由电子器件的数量和发热量确定，例如，在电子器件18的数量较大、发热量较高时，可是适当增加散热片16的数量或减小散热片16的间隔。Preferably, the width of the substrate 17 is greater than or equal to the width of the fan air outlet 15, and the number and interval of the heat sinks 16 are determined by the number and heat generation of the electronic devices. For example, the number of the electronic devices 18 is large and the heat generation is high. In this case, the number of heat sinks 16 may be appropriately increased or the interval between the heat sinks 16 may be reduced.
优选地，散热片16的高度可以大于或等于风扇出风口15的高度，这样可以有利于形成固定风道，增强散热效果。但是在电子器件18的发热量不高的情况下，散热片16的高度也可以小于风扇出风口15的高度。Preferably, the height of the heat sink 16 may be greater than or equal to the height of the fan air outlet 15, which may be beneficial to forming a fixed air duct and enhancing the heat dissipation effect. However, when the amount of heat generated by the electronic device 18 is not high, the height of the heat sink 16 may be smaller than the height of the fan outlet 15.
如图4所示，在该实施例中，散热片16沿着与风扇出风口15相同的方向延伸，散热片16之间相互平行。而在本公开的另一实施例中，散热片16可以以其它方式设置，例如散热片16可以呈放射状，散热片16大体沿着风扇出风口15的方向延伸。As shown in FIG. 4, in this embodiment, the fins 16 extend in the same direction as the fan outlet 15, and the fins 16 are parallel to each other. In another embodiment of the present disclosure, the heat sink 16 may be provided in other ways. For example, the heat sink 16 may be radial, and the heat sink 16 extends along the direction of the fan air outlet 15.
在另一个实施例中，散热装置100包括形成在基板17上的一个或多个引流片19，多个引流片19设置风扇出风口15的外侧，并形成一条或多条引流风道，用于将风扇出风口15排出的气流引导至合适的位置。In another embodiment, the heat dissipating device 100 includes one or more air guide fins 19 formed on the substrate 17, and the plurality of air guide fins 19 are disposed outside the fan air outlet 15 and form one or more air guide ducts for The airflow discharged from the fan outlet 15 is guided to an appropriate position.
在另一个实施例中，散热装置100设置有多个散热片16和多个引流片19，引流片19形成多条引流风道，用于将来自散热风道的气流引导至合适的位置。In another embodiment, the heat dissipating device 100 is provided with a plurality of heat sinks 16 and a plurality of air guide fins 19. The air guide fins 19 form a plurality of air guide ducts for guiding the airflow from the heat radiating ducts to a proper position.
引流片19和散热片16的相对位置可以根据需要任意调整，例如在一个实施例中，引流片19可以与其中一个散热片16互相连接，此时，引流片19可以与该散热片16一体形成，即，将该散热片16的末端沿特定方向延伸而形成引流片19，在另一个实施例中，引流片19可以与散热片16间隔一定的距离。The relative positions of the drain fins 19 and the heat sink 16 can be arbitrarily adjusted as needed. For example, in one embodiment, the drain fins 19 can be connected to one of the heat sinks 16 at this time. That is, the distal end of the heat sink 16 is extended in a specific direction to form a drain sheet 19. In another embodiment, the drain sheet 19 may be spaced a certain distance from the heat sink 16.
如图4所示，在一实施例中，引流片19的数量为四个，四个引流片分别与四个散热片一体形成，其中，引流片191和引流片192形成一条风道，引流片193和引流片194形成另一条风道，引流片192和引流片193间隔一定的距离，形成第三条风道，从而将风扇出风口5排出的气流分成3个气流，其中左右两个气流被分别引导至风扇出风口15的左右两侧，中间气流的方向保持不变，进一步为流出方向上的电子器件进行散热。As shown in FIG. 4, in an embodiment, the number of the drainage pieces 19 is four, and the four drainage pieces are integrally formed with four heat sinks, wherein the drainage pieces 191 and 192 form an air duct, and the drainage pieces are formed integrally. 193 and the deflector 194 form another air duct, and the deflector 192 and the deflector 193 are spaced a certain distance apart to form a third air duct, so that the airflow discharged from the fan outlet 5 is divided into 3 airflows, of which the left and right airflows are They are respectively guided to the left and right sides of the fan outlet 15, and the direction of the intermediate airflow remains unchanged, so as to further dissipate the electronic components in the outflow direction.
在另一个实施例中，引流片192和引流片193分别与同一个散热片16一体形成，如此可形成两条风道，从而将风扇出风口15排出的气流分成左右两个气流，两个气流被分别引导至风扇出风口15的左右两侧。In another embodiment, the deflector 192 and the deflector 193 are formed integrally with the same heat sink 16 respectively, so that two air ducts can be formed, so that the airflow discharged from the fan outlet 15 is divided into two left and right airflows, and two airflows. It is guided to the left and right sides of the fan outlet 15 respectively.
在另一个实施例中，散热装置100包括四个引流片19，但不包括散热片16，四个引流片19设置风扇出风口15的外侧，形成两条风道，从而将风扇出风口15排出的气流分成左右两个气流，两个气流被分别引导至风扇出风口15的左右两侧。In another embodiment, the heat dissipating device 100 includes four air diffusing fins 19, but does not include the heat radiating fins 16. The four air deflecting fins 19 are provided on the outside of the fan air outlet 15 to form two air ducts, so that the fan air outlet 15 is discharged. The airflow is divided into left and right airflows, and the two airflows are respectively guided to the left and right sides of the fan outlet 15.
引流片的形状可以为任意合适的形状，具体可以根据出风口相对于散热片的方向决定，例如可以为弧形、直线形等。The shape of the drainage sheet can be any suitable shape, and can be specifically determined according to the direction of the air outlet with respect to the heat sink, for example, it can be an arc shape, a linear shape, or the like.
为了便于制造所述散热装置，在一个实施例中，底座11与基板17一体形成，此时，外壳12和散热片16设置在同一底座11(基板17) 上，散热片16设置在外壳12一侧的风扇出风口15的外侧，并沿着风扇出风口15的方向延伸。In order to facilitate the manufacture of the heat sink, in one embodiment, the base 11 and the substrate 17 are integrally formed. At this time, the housing 12 and the heat sink 16 are disposed on the same base 11 (the substrate 17), and the heat sink 16 is disposed on the housing 12 The fan outlet 15 on the side extends outside the fan outlet 15.
底座11(基板17)与电子器件18贴合。需要指出的是，本公开中的贴合包括底座11与电子器件18通过导热介质(例如导热硅胶)贴合的情形。The base 11 (substrate 17) is bonded to the electronic device 18. It should be noted that the bonding in the present disclosure includes a case where the base 11 and the electronic device 18 are bonded through a thermally conductive medium (such as thermally conductive silicone).
如图4所示，在另一个实施例中，底座11和基板17为分体式，底座11与基板17可以通过螺钉方式等固定在一起，并且底座11与基板17与电子器件18贴合。As shown in FIG. 4, in another embodiment, the base 11 and the base plate 17 are separated, the base 11 and the base plate 17 may be fixed together by a screw method, and the base 11 and the base plate 17 are bonded to the electronic device 18.
可见，本公开通过将风扇底座作为导热片，将发热器件产生的热量传导到风扇叶片附近，然后利用风扇将热量送出，可以减小散热***的质量，并且避免复杂的风路设计和热积留。而通过配合使用导热式风扇与散热片，可以增强散热效果，有效降低电子器件的温度。本公开尤其适用于热源集中、散热空间小、对温度要求严格的散热场合。It can be seen that by using the fan base as a thermally conductive sheet, the heat generated by the heating device is transmitted to the vicinity of the fan blade, and then the fan is used to send out the heat, which can reduce the quality of the heat dissipation system and avoid complicated air path design and heat accumulation. . By using a heat-conducting fan and a heat sink, the heat dissipation effect can be enhanced and the temperature of the electronic device can be effectively reduced. The disclosure is particularly suitable for heat dissipation occasions where the heat source is concentrated, the heat dissipation space is small, and the temperature is strictly required.
在图4中，标号48所指的结构用于将风扇和散热片固定为一体，标号49所指的结构将散热片和风扇锁定到电子器件所在的电路板上。In FIG. 4, the structure indicated by reference numeral 48 is used to fix the fan and the heat sink as a whole, and the structure indicated by reference numeral 49 locks the heat sink and the fan to the circuit board on which the electronic device is located.
如图5A、图5B和图6所示，本公开一实施例提供一种无人飞行器200，无人飞行器200包括所述散热装置100，所述散热装置100包括导热式风扇10。所述飞行器包括机身01、从机身向外延伸的多个机臂02、安装在多个机臂上的多个旋翼03、云台04、视觉传感器05及位于机身内的电子器件。其中电子器件可包含一个或多个发热电子元器件；视觉传感器包括前视传感器、下视传感器、后视传感器。As shown in FIG. 5A, FIG. 5B and FIG. 6, an embodiment of the present disclosure provides an unmanned aerial vehicle 200. The unmanned aerial vehicle 200 includes the heat dissipation device 100, and the heat dissipation device 100 includes a heat-conducting fan 10. The aircraft includes a fuselage 01, a plurality of arms 02 extending outward from the fuselage, a plurality of rotors 03 mounted on the plurality of arms, a gimbal 04, a vision sensor 05, and electronic devices located in the fuselage. The electronic device may include one or more heat-generating electronic components; the vision sensor includes a front-view sensor, a down-view sensor, and a rear-view sensor.
在图5B中，33表示前视支架，34表示GPS电源模块，35表示GPS，36表示后视支架。In FIG. 5B, 33 denotes a front-view bracket, 34 denotes a GPS power module, 35 denotes GPS, and 36 denotes a rear-view bracket.
在图5A中，机身包括一壳体21，壳体21内部形成有容纳空间。电子器件设置在所述容纳空间内。在一实施例中，所述电子器件安装于电路板。散热装置100收容于所述容纳空间，用于带走所述电子器件产生的热量，其中导热式风扇的底座的至少一部分与所述电子器件贴合。In FIG. 5A, the fuselage includes a casing 21, and a receiving space is formed inside the casing 21. An electronic device is disposed in the receiving space. In one embodiment, the electronic device is mounted on a circuit board. The heat dissipating device 100 is accommodated in the accommodating space for taking away the heat generated by the electronic device, and at least a part of the base of the heat-conducting fan is attached to the electronic device.
壳体21上形成有入风口22和出风口23，电子器件集中分布在所述入风口22和出风口23之间。所述入风口22和出风口23可分别独立地 设置在所述壳体的顶部、底部、前部、侧部或者尾部。入风口22位于所述风扇入风口14的上游，所述出风口23位于风扇出风口15的下游。壳体21外的空气通过入风口22进入壳体内，然后进入风扇入风口14，空气可以将底座11传导至风扇叶片13附近的热量从风扇出风口15带出，并通过壳体21的出风口23排出壳体，从而将壳体内的电子器件产生的热量散发到壳体外，实现对壳体内部的电子器件进行降温的目的。The housing 21 is formed with an air inlet 22 and an air outlet 23, and electronic components are concentratedly distributed between the air inlet 22 and the air outlet 23. The air inlet 22 and the air outlet 23 may be independently provided on the top, bottom, front, side, or tail of the casing, respectively. The air inlet 22 is located upstream of the fan air inlet 14, and the air outlet 23 is located downstream of the fan air outlet 15. The air outside the casing 21 enters the casing through the air inlet 22 and then enters the fan inlet 14. The air can conduct the heat from the base 11 to the vicinity of the fan blades 13 through the fan outlet 15 and pass through the outlet of the casing 21. 23 The casing is discharged, so that the heat generated by the electronic components in the casing is dissipated to the outside of the casing, and the purpose of cooling the electronic components inside the casing is achieved.
在图6中，04表示云台，其上方设置有前视双目(前视传感器)51，在机身01腹部设置有下视双目(下视传感器)52，以及下视补光灯53及TOF 54。In FIG. 6, 04 denotes a pan / tilt head, a front-view binocular (front-view sensor) 51 is provided above, a bottom-view binocular (down-view sensor) 52, and a down-view fill light 53 are provided on the abdomen of the fuselage 01. And TOF 54.
在一个实施例中，所述壳体21的入风口221和222设置在壳体前部的两侧，所述壳体的出风口23设置在壳体后部的尾部，设置在风扇出风口5的下游。风扇出风口5靠近壳体21的出风口23，这样可以将来自风扇出风口5的气流快速排出壳体21。In one embodiment, the air inlets 221 and 222 of the housing 21 are provided on both sides of the front of the housing, and the air outlet 23 of the housing is provided at the rear of the rear of the housing, and is provided at the fan outlet 5 Downstream. The fan air outlet 5 is close to the air outlet 23 of the casing 21, so that the airflow from the fan air outlet 5 can be quickly discharged from the casing 21.
在本公开的另一个实施例中，所述散热装置100还包括多个散热片16，所述散热片16形成在一基板17上并且设置在所述风扇出风口15外侧。散热片16之间形成固定的散热风道，可以增加散热面积，从而可以使风扇出风口5排出的气流对散热片16附近的发热电子器件进行进一步散热。在该实施例中，所述壳体21的入风口221和222设置在壳体前部的两侧，所述壳体的出风口23设置在壳体后部的尾部，散热风道的出口靠近壳体21的出风口23，从而可以将气流引导至所述壳体21的出风口23。In another embodiment of the present disclosure, the heat sink 100 further includes a plurality of heat sinks 16 formed on a substrate 17 and disposed outside the fan air outlet 15. A fixed cooling air duct is formed between the fins 16, which can increase the heat dissipation area, so that the airflow discharged from the fan outlet 5 can further dissipate the heat-generating electronic devices near the fins 16. In this embodiment, the air inlets 221 and 222 of the housing 21 are provided on both sides of the front portion of the housing, the air outlet 23 of the housing is provided at the rear portion of the rear portion of the housing, and the outlet of the heat dissipation air duct is close to The air outlet 23 of the casing 21 can guide airflow to the air outlet 23 of the casing 21.
在本公开的实施例中，散热装置100包括多个散热片16和一条或多条引流片19，所述引流片19形成一条或多条引流风道，用于将气流引导至所述壳体21的出风口23，使气流在壳体内有规律的流动，提高散热效率。如图5A和图6所示，散热装置100的引流片9形成三个引流风道，左右两个引流风道将来自散热风道的气流引导至所述壳体21两侧的出风口231和232，中间的引流风道将气流引导至壳体21尾部的出风口233和234，使得气流在流到出口的过程中进一步对经过的电子器件进行散热。In the embodiment of the present disclosure, the heat sink 100 includes a plurality of heat sinks 16 and one or more air guide fins 19 that form one or more air guide ducts for guiding airflow to the housing. The air outlet 23 of 21 allows the airflow to flow regularly in the casing and improves heat dissipation efficiency. As shown in FIG. 5A and FIG. 6, the deflectors 9 of the heat dissipation device 100 form three diversion ducts, and the two left and right diversion ducts guide the airflow from the heat dissipation ducts to the air outlets 231 and 232. The middle drainage air duct guides the airflow to the air outlets 233 and 234 at the rear of the casing 21, so that the airflow further dissipates the passing electronic devices during the flow to the outlet.
在另一个实施例中，散热装置100的引流片形成两个引流风道，两个引流风道将来自散热风道的气流引导至所述壳体21两侧的出风口231和232。In another embodiment, the drainage fins of the heat dissipation device 100 form two drainage air ducts, and the two drainage air ducts guide airflow from the radiation air ducts to the air outlets 231 and 232 on both sides of the casing 21.
在另一个实施例中，散热装置100包含多个引流片19但不包含散热片16，多个引流片19形成多个引流风道，多个引流风道将来自风扇出风口15的气流引导至所述壳体21上的出风口23。In another embodiment, the heat sink 100 includes a plurality of fins 19 but does not include a fin 16. The plurality of fins 19 form a plurality of air ducts, and the plurality of air ducts direct the airflow from the fan outlet 15 to The air outlet 23 on the casing 21.
通过采用上述结构，散热装置100能够将无人飞行器200中的电子器件产生的热量直接导入到风扇叶片13附近，通过风扇叶片13产生的气流将热量带出，最后气流通过无人飞行器的壳体上的出风口23排出。进一步，为了充分提高散热效率，还在导热式风扇10的出口设置有散热片16，进一步对散热片16周围的电子器件进行散热，经过散热片16的气流由引流片19分流，从多个出风口23排出无人飞行器外，在从引流片流出的过程中进一步对周围的电子器件进行散热。本公开的散热装置质量小，避免了复杂的风路设计和热积留，从而有助于降低无人飞行器的整体质量，并有效降低无人飞行器的温度。By adopting the above structure, the heat radiating device 100 can directly introduce the heat generated by the electronic devices in the UAV 200 to the vicinity of the fan blade 13, and take out the heat through the airflow generated by the fan blade 13, and finally the airflow passes through the casing of the UAV The upper air outlet 23 is discharged. Further, in order to fully improve the heat dissipation efficiency, a heat sink 16 is further provided at the outlet of the heat-conducting fan 10 to further dissipate the electronic components around the heat sink 16, and the airflow passing through the heat sink 16 is shunted by the flow guide 19 and exits from a plurality The tuyere 23 is discharged from the unmanned aerial vehicle, and further dissipates heat from surrounding electronic devices during the process of flowing out from the deflector. The heat dissipation device of the present disclosure has small mass, avoids complicated air path design and heat accumulation, thereby helping to reduce the overall quality of the unmanned aerial vehicle and effectively lowering the temperature of the unmanned aerial vehicle.
以上所述的具体实施例，对本公开的目的、技术方案和有益效果进行了进一步详细说明，应理解的是，以上所述仅为本公开的具体实施例而已，并不用于限制本公开，凡在本公开的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本公开的保护范围之内。The specific embodiments described above further describe the objectives, technical solutions, and beneficial effects of the present disclosure. It should be understood that the above are only specific embodiments of the present disclosure and are not intended to limit the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this disclosure shall be included in the protection scope of this disclosure.

Claims (26)

  1. 一种散热装置，包括导热式风扇，A heat dissipation device includes a thermally conductive fan,
    所述导热式风扇包括底座、外壳和风扇叶片；The thermally conductive fan includes a base, a housing, and a fan blade;
    所述外壳由一个顶面和四个侧面围成，并与所述底座固定连接形成一腔体，所述风扇叶片可转动地安装在所述腔体内，所述外壳上与所述底座相对的顶面上形成有风扇入风口，其中一个侧面形成有风扇出风口，所述底座由导热材料制成。The shell is surrounded by a top surface and four sides, and is fixedly connected to the base to form a cavity. The fan blade is rotatably installed in the cavity. The shell is opposite to the base. A fan inlet is formed on the top surface, a fan outlet is formed on one side, and the base is made of a thermally conductive material.
  2. 根据权利要求1所述的散热装置，所述底座由铜、铜合金或铝合金制成。The heat sink according to claim 1, wherein the base is made of copper, a copper alloy, or an aluminum alloy.
  3. 根据权利要求1所述的散热装置，所述散热装置还包括多个散热片，所述散热片形成在一基板上并且设置在所述风扇出风口外侧。The heat sink according to claim 1, further comprising a plurality of heat sinks, the heat sinks being formed on a substrate and disposed outside the fan air outlet.
  4. 根据权利要求3所述的散热装置，所述底座与所述基板一体形成。The heat sink according to claim 3, wherein the base is integrally formed with the substrate.
  5. 根据权利要求3所述的散热装置，所述散热片的高度等于或大于所述风扇出风口的高度。The heat sink according to claim 3, wherein a height of the heat sink is equal to or greater than a height of the fan air outlet.
  6. 根据权利要求3所述的散热装置，所述散热片由铜、铜合金或铝合金制成。The heat sink according to claim 3, wherein the heat sink is made of copper, a copper alloy, or an aluminum alloy.
  7. 根据权利要求3所述的散热装置，所述散热片沿着所述风扇出风口的方向延伸，所述散热片相互平行或者呈放射状。The heat dissipating device according to claim 3, wherein the heat dissipating fins extend in a direction of the fan outlet, and the heat dissipating fins are parallel to each other or are radial.
  8. 根据权利要求1所述的散热装置，所述散热装置还包括一条或多条引流片，所述引流片形成在一基板上并且设置在所述风扇出风口外侧，所述引流片形成一条或多条引流风道。The heat dissipating device according to claim 1, further comprising one or more deflectors, the deflectors being formed on a substrate and disposed outside the fan air outlet, and the deflectors forming one or more Drainage air duct.
  9. 根据权利要求3所述的散热装置，所述散热装置上包括一条或多条引流片，所述引流片形成在所述基板上并形成一条或多条引流风道。The heat dissipating device according to claim 3, wherein the heat dissipating device comprises one or more flow deflecting fins, and the flow deflecting fins are formed on the substrate and form one or more air guiding ducts.
  10. 根据权利要求9所述的散热装置，每个所述引流片与一个散热片互相连接，或者每个所述引流片与一个散热片一体形成。The heat dissipating device according to claim 9, wherein each of the deflectors and one heat sink are connected to each other, or each of the deflectors is integrally formed with one heat sink.
  11. 根据权利要求8-10任一项所述的散热装置，所述多个引流片间隔设置，形成多条引流风道。The heat dissipation device according to any one of claims 8 to 10, wherein the plurality of drainage fins are arranged at intervals to form a plurality of drainage air ducts.
  12. 一种无人飞行器，包括：An unmanned aerial vehicle includes:
    壳体，所述壳体内部包括一容纳空间；A housing, which includes an accommodation space inside;
    电子器件，所述电子器件收容于所述容纳空间；以及An electronic device housed in the accommodation space; and
    散热装置，所述散热装置收容于所述容纳空间，用于带走所述电子器件产生的热量；A heat radiating device, which is contained in the accommodating space and used for taking away the heat generated by the electronic device;
    其特征在于：所述散热装置包括导热式风扇，It is characterized in that the heat dissipating device comprises a heat-conducting fan,
    所述导热式风扇包括底座、外壳和风扇叶片；The thermally conductive fan includes a base, a housing, and a fan blade;
    所述外壳由一个顶面和四个侧面围成，并与所述底座固定连接形成一腔体，所述风扇叶片可转动地安装在所述腔体内，所述外壳上与所述底座相对的顶面上形成有风扇入风口，其中一个侧面形成有风扇出风口，所述底座由导热材料制成，并且底座的至少一部分与所述电子器件贴合；The shell is surrounded by a top surface and four sides, and is fixedly connected to the base to form a cavity. The fan blade is rotatably installed in the cavity. The shell is opposite to the base. A fan inlet is formed on the top surface, a fan outlet is formed on one side, the base is made of a thermally conductive material, and at least a part of the base is attached to the electronic device;
    所述壳体上形成有入风口和出风口，所述入风口位于所述风扇入风口的上游，所述出风口位于所述风扇出风口的下游。An air inlet and an air outlet are formed on the casing, the air inlet is located upstream of the fan air inlet, and the air outlet is located downstream of the fan air outlet.
  13. 根据权利要求12所述的无人飞行器，所述底座由铜、铜合金或铝合金制成。The unmanned aerial vehicle according to claim 12, wherein the base is made of copper, a copper alloy, or an aluminum alloy.
  14. 根据权利要求12所述的无人飞行器，所述散热装置还包括多个散热片，所述散热片形成在一基板上并且设置在所述风扇出风口外侧。The unmanned aerial vehicle according to claim 12, wherein the heat dissipation device further comprises a plurality of heat sinks, and the heat sinks are formed on a substrate and disposed outside the fan air outlet.
  15. 根据权利要求14所述的无人飞行器，所述底座与所述基板一体形成。The unmanned aerial vehicle according to claim 14, wherein the base is integrally formed with the substrate.
  16. 根据权利要求14所述的无人飞行器，所述散热装置的基板的至少一部分与所述电子器件直接接触。The unmanned aerial vehicle according to claim 14, wherein at least a portion of a substrate of the heat sink is in direct contact with the electronic device.
  17. 根据权利要求14所述的无人飞行器，所述散热片的高度等于或大于所述风扇出风口的高度。The unmanned aerial vehicle according to claim 14, wherein a height of the heat sink is equal to or greater than a height of the fan air outlet.
  18. 根据权利要求14所述的无人飞行器，所述散热片由铜、铜合金或铝合金制成。The unmanned aerial vehicle according to claim 14, wherein the heat sink is made of copper, a copper alloy, or an aluminum alloy.
  19. 根据权利要求14所述的无人飞行器，所述散热片沿着所述风扇出风口的方向延伸，所述散热片相互平行或者呈放射状。The unmanned aerial vehicle according to claim 14, wherein the radiating fins extend along the direction of the fan outlet, and the radiating fins are parallel to each other or radial.
  20. 根据权利要求12所述的无人飞行器，所述散热装置包括一条或多条引流片，所述引流片形成在一基板上并且设置在所述风扇出风口外侧，所述引流片形成一条或多条引流风道，用于将气流引导至所述壳体 的出风口。The unmanned aerial vehicle according to claim 12, wherein the heat dissipating device comprises one or more air guide fins, the air guide fins are formed on a substrate and disposed outside the fan air outlet, and the air guide fins form one or more A drainage air duct is used to guide airflow to the air outlet of the casing.
  21. 根据权利要求14所述的无人飞行器，所述散热装置上包括一条或多条引流片，所述引流片形成在所述基板上并形成一条或多条引流风道，用于将气流引导至所述壳体的出风口。The unmanned aerial vehicle according to claim 14, wherein the heat dissipating device includes one or more air guide fins, the air guide fins are formed on the substrate and form one or more air guide ducts for guiding airflow to An air outlet of the casing.
  22. 根据权利要求21所述的无人飞行器，每个所述引流片与一个散热片互相连接，或者每个所述引流片与一个散热片一体形成。The unmanned aerial vehicle according to claim 21, wherein each of the deflectors is connected to a heat sink, or each of the deflectors is integrally formed with a heat sink.
  23. 根据权利要求20-22任一项所述的无人飞行器，所述多个引流片间隔设置，形成多条引流风道。The unmanned aerial vehicle according to any one of claims 20 to 22, wherein the plurality of drainage pieces are arranged at intervals to form a plurality of drainage air ducts.
  24. 根据权利要求12所述的无人飞行器，所述壳体的入风口设置在壳体的前部和/或至少一侧部。The unmanned aerial vehicle according to claim 12, wherein an air inlet of the casing is provided at a front portion and / or at least one side portion of the casing.
  25. 根据权利要求12所述的无人飞行器，所述壳体的出风口设置在所述壳体的后部和/或至少一侧部。The unmanned aerial vehicle according to claim 12, wherein an air outlet of the casing is provided at a rear portion and / or at least one side portion of the casing.
  26. 根据权利要求25所述的无人飞行器，所述壳体的出风口设置在所述风扇出风口的下游。The unmanned aerial vehicle according to claim 25, wherein the air outlet of the casing is disposed downstream of the fan air outlet.
PCT/CN2018/092867 2018-06-26 2018-06-26 Heat dissipation device and unmanned aerial vehicle having the heat dissipation device WO2020000182A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201880017083.1A CN110506000A (en) 2018-06-26 2018-06-26 Radiator and unmanned plane with the radiator
PCT/CN2018/092867 WO2020000182A1 (en) 2018-06-26 2018-06-26 Heat dissipation device and unmanned aerial vehicle having the heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/092867 WO2020000182A1 (en) 2018-06-26 2018-06-26 Heat dissipation device and unmanned aerial vehicle having the heat dissipation device

Publications (1)

Publication Number Publication Date
WO2020000182A1 true WO2020000182A1 (en) 2020-01-02

Family

ID=68584308

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/092867 WO2020000182A1 (en) 2018-06-26 2018-06-26 Heat dissipation device and unmanned aerial vehicle having the heat dissipation device

Country Status (2)

Country Link
CN (1) CN110506000A (en)
WO (1) WO2020000182A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113093886A (en) * 2020-01-08 2021-07-09 苏州溢博伦光电仪器有限公司 Computer chip heat abstractor with show function

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021189310A1 (en) * 2020-03-25 2021-09-30 深圳市大疆创新科技有限公司 Electronic device and centrifugal fan
CN113543608B (en) * 2021-08-18 2024-03-19 广东美的厨房电器制造有限公司 Fan seat, air duct assembly and cooking utensil
CN113597233B (en) * 2021-09-28 2022-01-04 北京远度互联科技有限公司 Heat abstractor, controlling means and use unmanned aerial vehicle of its control

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023289A2 (en) * 2001-09-07 2003-03-20 Advanced Rotary Systems, Llc Integrated cooler for electronic devices
US20100032136A1 (en) * 2008-08-06 2010-02-11 Kwo Ger Metal Technology, Inc Cooler module
CN103906410A (en) * 2012-12-28 2014-07-02 鸿富锦精密工业（深圳）有限公司 Heat-dissipation module
CN206865924U (en) * 2017-05-19 2018-01-09 深圳市大疆创新科技有限公司 Unmanned plane and radiator structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1696514A (en) * 2004-05-12 2005-11-16 元山科技工业股份有限公司 External pole type heat elimination fan
TWI543693B (en) * 2014-12-04 2016-07-21 Yen Sun Technology Corp Cooling fan frame
KR20180009218A (en) * 2016-07-18 2018-01-26 (주)두영티앤에스 Light having flying device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023289A2 (en) * 2001-09-07 2003-03-20 Advanced Rotary Systems, Llc Integrated cooler for electronic devices
US20100032136A1 (en) * 2008-08-06 2010-02-11 Kwo Ger Metal Technology, Inc Cooler module
CN103906410A (en) * 2012-12-28 2014-07-02 鸿富锦精密工业（深圳）有限公司 Heat-dissipation module
CN206865924U (en) * 2017-05-19 2018-01-09 深圳市大疆创新科技有限公司 Unmanned plane and radiator structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113093886A (en) * 2020-01-08 2021-07-09 苏州溢博伦光电仪器有限公司 Computer chip heat abstractor with show function

Also Published As

Publication number Publication date
CN110506000A (en) 2019-11-26

Similar Documents

Publication Publication Date Title
WO2020000182A1 (en) Heat dissipation device and unmanned aerial vehicle having the heat dissipation device
CN107113997B (en) Cooling mechanism and unmanned vehicle with the cooling mechanism
US6704199B2 (en) Low profile equipment housing with angular fan
US5828549A (en) Combination heat sink and air duct for cooling processors with a series air flow
US6512673B1 (en) Low profile equipment housing with angular fan
CN107211556B (en) Cooling system and aircraft with cooling system
JP6482955B2 (en) Liquid cooling system
JP2006319142A (en) Heat generating body cooling apparatus and heat sink
US20130292105A1 (en) Segmented heat sink for natural-convection cooled systems
JP2006319142A5 (en)
JP6534873B2 (en) Liquid cooling system
JPH09321477A (en) Heat generating body cooling device
WO2022193669A1 (en) Head-mounted display device and heat dissipation mechanism thereof
CN109283777B (en) Projection equipment and projection system
JP2002280779A (en) Cooler for electronic apparatus
WO2018196141A1 (en) Power amplifier
JP2004140061A (en) Cooling module
JPH1012781A (en) Forced cooling heat sink
JP2019110220A (en) Motor control device
JP2002368473A (en) Heat dissipating apparatus for heat generating electronic component, electronic apparatus and electronic device having heat dissipating structure
JPH098484A (en) Cooling structure of electronic device
JP4985390B2 (en) Heat dissipation device for electronic equipment
JP4737067B2 (en) Electronics
JP2002314278A (en) Air-cooling equipment for electronic component
CN213768943U (en) Unmanned aerial vehicle aircraft nose and unmanned aerial vehicle

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18924219

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18924219

Country of ref document: EP

Kind code of ref document: A1