WO2019242743A1 - Printed circuit and preparation method therefor - Google Patents

Printed circuit and preparation method therefor Download PDF

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Publication number
WO2019242743A1
WO2019242743A1 PCT/CN2019/092312 CN2019092312W WO2019242743A1 WO 2019242743 A1 WO2019242743 A1 WO 2019242743A1 CN 2019092312 W CN2019092312 W CN 2019092312W WO 2019242743 A1 WO2019242743 A1 WO 2019242743A1
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Prior art keywords
liquid metal
alloy
tin
gallium
adhesion layer
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PCT/CN2019/092312
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French (fr)
Chinese (zh)
Inventor
国瑞
于洋
刘静
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北京梦之墨科技有限公司
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Publication of WO2019242743A1 publication Critical patent/WO2019242743A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Definitions

  • the invention belongs to the technical field of electronic printing, and particularly relates to a printed circuit and a preparation method thereof.
  • the preparation of electronic circuits often requires a complicated process, and in the process of preparation, waste of resources and environmental pollution are accompanied.
  • the copper plate etching process in the traditional circuit preparation method requires metal copper to be plated on a circuit substrate (generally a glass fiber board) in advance, and then the chemical copper or laser engraving method is used to remove the excess metal copper, and finally formed on the substrate surface Specific shaped copper circuit.
  • This preparation process has a long processing time, a complicated process, and high requirements for manufacturing instruments.
  • the demand for personalized custom products is increasing, but the technical solutions for personal custom electronic circuits are lacking.
  • Liquid metals are a class of metals or alloys with a lower melting point, such as the common metal mercury.
  • Metal mercury is very toxic, making it difficult to use in everyday life.
  • Other types of liquid metals, such as gallium-based alloys and bismuth-based alloys can also remain liquid at lower temperatures, and have the electrical and thermal conductivity of metals. It is important that such alloys have low biological toxicity and can be used. In everyday life.
  • low melting point alloys as conductive materials to make flat printed circuits, and this material is used in the field of metal 3D printing.
  • liquid metal can only be printed on a substrate that is liquid metal-prone, resulting in a problem that the printability of liquid metal is low.
  • an object of the present invention is to provide a method for preparing a printed circuit, so as to solve the problems of high requirements on substrates and low adaptability in the printing of liquid metal in the prior art.
  • the method for preparing a printed circuit includes: coating a polymer organic material on a substrate surface to form a liquid metal adhesion layer; and then using graphite on the liquid metal adhesion layer. Forming a liquid metal non-stick layer with a specific pattern; wherein the size and area of the liquid metal non-stick layer are smaller than the size and area of the liquid metal adhesion layer; the liquid metal is evenly coated on the substrate so that the liquid metal Adhesion is achieved on the liquid metal adhesion layer, and non-adhesion is achieved on the liquid metal non-adhesion layer to obtain a liquid metal circuit; and then the polymer metal material is used to perform encapsulation processing on the liquid metal circuit.
  • the substrate is made of one of the following materials: paper, cloth, metal, plastic, glass, wood, and stone.
  • the polymer organic material is selected from one of the following: PDMS, Ecoflex, polyurethane, silica gel, and acrylic polymer.
  • the liquid metal includes a low-melting metal element, a low-melting metal alloy, or a conductive mixture whose main component is a low-melting metal element / low-melting metal alloy.
  • the liquid metal includes one or any combination of the following: mercury, gallium, indium, elemental tin, gallium indium alloy, gallium indium tin alloy, gallium tin alloy, gallium zinc alloy, gallium indium zinc Alloy, gallium tin zinc alloy, gallium indium tin zinc alloy, gallium tin cadmium alloy, gallium zinc cadmium alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium tin alloy, bismuth indium zinc alloy, bismuth tin zinc alloy, bismuth indium tin zinc Alloys, tin-lead alloys, tin-copper alloys, tin-zinc-copper alloys, tin-silver-copper alloys, and bismuth-lead-tin alloys.
  • the liquid metal is a low-melting-point metal that is liquid at normal temperature, and includes: gallium simple substance and / or gallium-based alloy.
  • the preparation method further includes: separating the substrate from the liquid metal adhesion layer to obtain a flexible printed circuit packaged with the polymer organic material.
  • the coating of the polymer organic material and / or graphite is formed by spraying or printing.
  • Another object of the present invention is to provide a printed circuit based on the method for manufacturing a printed circuit.
  • the printed circuit includes: a liquid metal adhesion layer formed of a high molecular organic material; a liquid metal on the liquid metal adhesion layer and a liquid metal non-stick layer formed of graphite Wherein the liquid metal on the liquid metal adhesion layer constitutes a conductive circuit of a printed circuit; and an encapsulation layer formed of a polymer organic material and covering the liquid metal and a non-stick layer of the liquid metal, the encapsulation layer Cooperate with the liquid metal adhesion layer to achieve packaging of the liquid metal.
  • the liquid metal adhesion layer is attached to a substrate; the substrate includes one of the following: paper, cloth, metal, plastic, glass, wood, stone.
  • the present invention has the following advantages:
  • the present invention can realize the adhesion of liquid metal to the surface of the substrate on which the liquid metal is not adhered, thereby improving the adaptability of liquid metal printing to substrates of various materials.
  • the circuit pattern can be customized according to user requirements to meet the user's custom design requirements and quality requirements.
  • the present invention can use a brushing method to form liquid metal at one time, which effectively improves the preparation efficiency. .
  • FIG. 1 is a flowchart of manufacturing a printed circuit according to an embodiment of the present invention
  • FIG. 2 is a flowchart of manufacturing a printed circuit in the embodiment of the present invention.
  • FIG. 3 is a flowchart of a printed circuit preparation in the embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a printed circuit in an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a printed circuit in an embodiment of the present invention.
  • liquid metal exhibits better adhesion to polymer organic materials. This is because organic polymer materials can provide higher van der Waals forces and form a certain degree of hydrogen bonding interactions, so liquid metals can be evenly coated on The surface of the layer body formed by the high-molecular organic material is stable in form. The wettability of liquid metal to graphite is poor. Liquid metal cannot adhere to graphite, and a small amount of residue is also easy to erase.
  • the inventor modified the printed surface with a high-molecular organic material to improve the adhesion of the printed surface to liquid metal, and then used graphite that does not adhere to liquid metal to form a specific pattern structure. Liquid metal can be adhered to the area not covered by graphite, and liquid metal can not be adhered to the area covered by graphite, thereby obtaining a printed circuit using liquid metal as a conductive line.
  • FIG. 1 shows a flowchart of a method for preparing a printed circuit in an embodiment of the present invention.
  • the present invention discloses a method for preparing a printed circuit, including:
  • Step S11 coating a polymer organic material on the surface of the substrate to form a liquid metal adhesion layer
  • Step S12 Reusing graphite to form a liquid metal non-stick layer with a specific pattern on the liquid metal adhesion layer; wherein the size area of the liquid metal non-stick layer is smaller than the size area of the liquid metal adhesion layer;
  • Step S13 uniformly coating liquid metal on the substrate, so that liquid metal can be adhered on the liquid metal adhesion layer, and non-adhesion can be realized on the liquid metal non-stick layer to obtain a liquid metal circuit;
  • step S14 the liquid metal circuit is encapsulated by using a polymer organic material.
  • the invention can realize the adhesion of liquid metal to the surface of the substrate on which the liquid metal is not adhered, thereby improving the adaptability of the printing of liquid metal to substrates of various materials.
  • the circuit pattern can be customized according to user requirements to meet the user's custom design requirements and quality requirements.
  • the present invention can use a brushing method to form liquid metal at one time, which effectively improves the preparation. effectiveness.
  • a substrate with a rough surface may be used as the substrate in the embodiments of the present invention. Due to the rough interface, the interaction distance between the metal / metal oxide layer and the substrate is increased, and the contact area is greatly reduced. Because of the wettability of the metal and intermolecular forces cannot be formed, the above problems can be effectively solved after the surface modification treatment in step S11.
  • the substrate in the embodiment of the present invention may be a substrate of any material, such as paper, cloth, wood, stone, etc. with a rough surface.
  • the present invention may also use a plastic with a smooth surface, Glass, etc.
  • the polymer organic material is selected from one of the following: PDMS (polydimethylsiloxane), Ecoflex (biodegradable plastic), polyurethane, silica gel, acrylic polymer and other long-chain polymer organic materials .
  • the polymer organic material can be selected from Ecoflex (biodegradable plastic), polyurethane, silica gel or acrylic polymer.
  • Ecoflex biodegradable plastic
  • polyurethane silica gel
  • acrylic polymer Compared with PDMS (polydimethylsiloxane), its air tightness after molding is better. It is not easy for air to penetrate into it and come into contact with the liquid metal, thereby avoiding affecting the electrical properties of the liquid metal due to oxidation.
  • the polymer organic materials in steps S11 and S14 may be selected from different materials, and the same materials may also be selected.
  • the high-molecular organic materials in steps S11 and S14 are selected from the same material, thereby avoiding the problem of delamination that may occur due to different materials.
  • the liquid metal is also called a low-melting-point metal, which includes a low-melting metal element, a low-melting metal alloy, or a conductive nano formed by mixing a liquid metal element / low-melting metal alloy with metal nanoparticles and a fluid dispersant.
  • the fluid dispersant is preferably ethanol, propylene glycol, glycerol, polyvinylpyrrolidone, polydimethylsiloxane, polyethylene glycol, and polymethyl methacrylate. One of them.
  • the low melting point metal alloy composition may include gallium, indium, tin, zinc, bismuth, lead, cadmium, mercury, silver, copper, sodium, potassium, magnesium, aluminum, iron, nickel, cobalt, manganese, titanium Or vanadium, boron, carbon, silicon, or the like.
  • the specific selection range of the liquid metal includes: mercury simple substance, gallium simple substance, indium simple substance, tin simple substance, gallium indium alloy, gallium indium tin alloy, gallium tin alloy, gallium zinc alloy, gallium indium zinc alloy, gallium tin zinc alloy, Gallium indium tin zinc alloy, gallium tin cadmium alloy, gallium zinc cadmium alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium tin alloy, bismuth indium zinc alloy, bismuth tin zinc alloy, bismuth indium tin zinc alloy, tin lead alloy, tin One or more of copper alloy, tin-zinc-copper alloy, tin-silver-copper alloy, and bismuth-lead-tin alloy.
  • the liquid metal is a low-melting-point metal that is liquid at normal temperature, and includes: a gallium element having a melting point of 29 degrees Celsius and / or a gallium-based alloy having a melting point between 10-30 degrees Celsius (its melting point and its proportion Related).
  • the preparation method further includes:
  • Step S15 The substrate and the liquid metal adhesion layer are separated to obtain a flexible printed circuit packaged with the polymer organic material.
  • the efficiency of the flexible printed circuit prepared by the above embodiments is greatly improved, the preparation process is simple, and no processing such as injection molding, slotting, and pouring is required.
  • the coating of the high-molecular organic material in step S11 may be achieved by using a printing technique or a spraying technique, for example, an inkjet printer using a corresponding raw material is directly sprayed with a layer of a high-molecular organic material.
  • a printing technique or a spraying technique for example, an inkjet printer using a corresponding raw material is directly sprayed with a layer of a high-molecular organic material.
  • a printing technique or a spraying technique for example, an inkjet printer using a corresponding raw material is directly sprayed with a layer of a high-molecular organic material.
  • it can also be applied by manual coating or dipping.
  • the coating of the specific pattern of graphite in step S12 can also be achieved by using a printing technique or a spraying technique, such as an inkjet printer, using a designed electronic design drawing to realize the spraying of a specific pattern.
  • Graphite powder used inkjet printer.
  • the packaging of the polymer organic material in step S14 may also be performed by the coating method of the polymer organic material in step S11, and details are not described herein again.
  • the coating of the liquid metal in step S13 may be performed by dipping, brush coating, or the like.
  • the substrate after the surface treatment is placed in a liquid metal bath for dipping. , Take it out after a certain period of time; brush coating, for example, using a brush coating tool (roller, brush, scraper, etc.) to apply liquid metal to the substrate.
  • a brush coating tool roller, brush, scraper, etc.
  • the present invention proposes a specific implementation manner for the above-mentioned preparation method.
  • the materials and equipment used in the preparation method include: substrate 1, organic polymer material 2, inkjet printer 3, graphite 4, roller 5; Liquid metal 6; packaging material 7.
  • the organic polymer material 2 and the packaging material 7 both use organic polymer materials, and their names are only used to distinguish each other.
  • paper is selected as the material of the substrate 1.
  • the organic polymer material 2 is uniformly coated on the surface of the substrate 1 material. After it is cured into a film, graphite 4 is spray-coated on the surface of the substrate 1 coated with the organic polymer material 2 using an inkjet printer 3.
  • the liquid metal 6 is brush-coated on the surface of the substrate 1 treated with the two materials by using the roller 5. Due to the difference in adhesion between the liquid metal 6 on the surface of the graphite 4 and the organic polymer material 2, the liquid metal 6 only adheres to the surface of the organic polymer 2 film not covered by the graphite 4 to form a circuit structure with a specific pattern. Finally, the packaging material 7 is uniformly coated on the surface of the material of the substrate 1, and after it is cured into a film, the liquid metal 6 can be fixed on the surface of the material of the substrate 1 to complete the packaging of the circuit structure.
  • another object of the present invention is to provide a printed circuit based on the method for preparing a printed circuit, including: a liquid metal adhesion layer formed of a polymer organic material 2; and located on the liquid metal adhesion layer The liquid metal 6 on the surface and the liquid metal non-stick layer formed of graphite 4, wherein the liquid metal 6 on the liquid metal adhesion layer constitutes a conductive circuit of a printed circuit; it is formed of a polymer organic material and covers the The encapsulation layer 7 of the liquid metal and the non-stick layer of the liquid metal, and the encapsulation layer 7 cooperates with the liquid metal adhesion layer to realize the encapsulation of the liquid metal.
  • the liquid metal adhesion layer is attached to a substrate.
  • the substrate in the embodiment of the present invention may be a substrate of any material, such as rough-surfaced paper, cloth, wood, and stone.
  • the present invention can also use plastics, glass, and the like with smooth surfaces.
  • the liquid metal is also called a low-melting-point metal, which includes a low-melting metal element, a low-melting metal alloy, or a conductive nano formed by mixing a liquid metal element / low-melting metal alloy with metal nanoparticles and a fluid dispersant.
  • the fluid dispersant is preferably ethanol, propylene glycol, glycerol, polyvinylpyrrolidone, polydimethylsiloxane, polyethylene glycol, and polymethyl methacrylate. One of them.
  • the low melting point metal alloy composition may include gallium, indium, tin, zinc, bismuth, lead, cadmium, mercury, silver, copper, sodium, potassium, magnesium, aluminum, iron, nickel, cobalt, manganese, titanium Or vanadium, boron, carbon, silicon, or the like.
  • the specific selection range of the liquid metal includes: mercury simple substance, gallium simple substance, indium simple substance, tin simple substance, gallium indium alloy, gallium indium tin alloy, gallium tin alloy, gallium zinc alloy, gallium indium zinc alloy, gallium tin zinc alloy, Gallium indium tin zinc alloy, gallium tin cadmium alloy, gallium zinc cadmium alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium tin alloy, bismuth indium zinc alloy, bismuth tin zinc alloy, bismuth indium tin zinc alloy, tin lead alloy, tin One or more of copper alloy, tin-zinc-copper alloy, tin-silver-copper alloy, and bismuth-lead-tin alloy.
  • the liquid metal is a low-melting-point metal that is liquid at normal temperature, and includes: a gallium element having a melting point of 29 degrees Celsius and / or a gallium-based alloy having a melting point between 10-30 degrees Celsius (its melting point and its proportion Related).
  • the polymer organic material is selected from one of the following: PDMS (polydimethylsiloxane), Ecoflex (biodegradable plastic), polyurethane, silica gel, acrylic polymer and other long-chain polymer organic materials .
  • the polymer organic material can be selected from Ecoflex (biodegradable plastic), polyurethane, silica gel or acrylic polymer.
  • Ecoflex biodegradable plastic
  • polyurethane silica gel
  • acrylic polymer Compared with PDMS (polydimethylsiloxane), its air tightness after molding is better. It is not easy for air to penetrate into it and come into contact with the liquid metal, thereby avoiding affecting the electrical properties of the liquid metal due to oxidation.

Abstract

Disclosed are a printed circuit and a preparation method therefor. The preparation method comprises: coating the surface of a substrate (1) with a high-molecular organic material (2) to form a liquid metal adhesion layer; then using graphite (4) to form a liquid metal anti-adhesion layer in a specified pattern on the liquid metal adhesion layer, wherein the size and area of the liquid metal anti-adhesion layer are less than the size and area of the liquid metal adhesion layer; uniformly coating the substrate with liquid metal (6) so that the liquid metal is adhered to the liquid metal adhesion layer and is not adhered to the liquid metal anti-adhesion layer to obtain a liquid metal circuit; and then using the high-molecular organic material to perform encapsulation processing on the liquid metal circuit. In the present invention, improving the surface adhesion force of a printed surface can realize that liquid metal is adhered onto a surface of a substrate to which no liquid metal is adhered, thereby improving the adaptability of liquid metal printing onto substrates of various materials.

Description

一种印刷电路及其制备方法Printed circuit and preparation method thereof
本申请要求在2018年06月22日提交中国专利局、申请号为201810651854.4、发明名称为“一种印刷电路及其制备方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims priority from a Chinese patent application filed with the Chinese Patent Office on June 22, 2018, with an application number of 201810651854.4, and the invention name is "a printed circuit and a method for manufacturing the same", the entire contents of which are incorporated herein by reference. in.
技术领域Technical field
本发明属于电子印刷技术领域，尤其涉及一种印刷电路及其制备方法。The invention belongs to the technical field of electronic printing, and particularly relates to a printed circuit and a preparation method thereof.
背景技术Background technique
在传统的电子印刷领域，电子电路的制备往往需要复杂的过程，并且在制备的过程中伴随着资源的浪费和环境污染。例如，传统电路制备方法中的铜板蚀刻工艺需要事先将金属铜镀在电路基板(一般为玻璃纤维板)上，之后通过化学腐蚀或激光雕刻的方法，去除多余部分的金属铜，最终在基底表面形成特定形状的铜电路。这种制备工艺加工时间长，工艺复杂，对制造仪器的要求较高。当今社会人们对个性化定制产品的需求越来越大，个人定制电子电路的技术方案却乏善可陈。In the traditional electronic printing field, the preparation of electronic circuits often requires a complicated process, and in the process of preparation, waste of resources and environmental pollution are accompanied. For example, the copper plate etching process in the traditional circuit preparation method requires metal copper to be plated on a circuit substrate (generally a glass fiber board) in advance, and then the chemical copper or laser engraving method is used to remove the excess metal copper, and finally formed on the substrate surface Specific shaped copper circuit. This preparation process has a long processing time, a complicated process, and high requirements for manufacturing instruments. In today's society, the demand for personalized custom products is increasing, but the technical solutions for personal custom electronic circuits are lacking.
液态金属是一类熔点较低的金属或合金，如常见的金属汞。金属汞具有很强的毒性，因而很难应用于日常生活领域。其他类型的液态金属，如镓基合金和铋基合金等材料在较低温度下也可以保持液态，而且具有金属的导电性和导热性，重要的是，此类合金生物毒性较低，可以用于日常生活领域。此外，有研究采用低熔点合金作为导电材料，制作平面印刷电路，并且将该种材料用于金属3D打印领域。Liquid metals are a class of metals or alloys with a lower melting point, such as the common metal mercury. Metal mercury is very toxic, making it difficult to use in everyday life. Other types of liquid metals, such as gallium-based alloys and bismuth-based alloys, can also remain liquid at lower temperatures, and have the electrical and thermal conductivity of metals. It is important that such alloys have low biological toxicity and can be used. In everyday life. In addition, there have been studies using low melting point alloys as conductive materials to make flat printed circuits, and this material is used in the field of metal 3D printing.
目前，液态金属只能印制在亲液态金属的基材上，导致液态金属的印制的适应性低的问题。At present, liquid metal can only be printed on a substrate that is liquid metal-prone, resulting in a problem that the printability of liquid metal is low.
发明内容Summary of the Invention
有鉴于此，本发明的一个目的是提出一种印刷电路的制备方法，以解 决现有技术中液态金属的印刷对于基材的要求较高，适应性低的问题。In view of this, an object of the present invention is to provide a method for preparing a printed circuit, so as to solve the problems of high requirements on substrates and low adaptability in the printing of liquid metal in the prior art.
在一些说明性实施例中，所述印刷电路的制备方法，包括：将高分子有机材料涂覆在基底表面上形成一层液态金属粘附层；再利用石墨在所述液态金属粘附层上形成特定图案的液态金属不粘层；其中，所述液态金属不粘层的尺寸面积小于所述液态金属粘附层的尺寸面积；在所述基底上均匀涂覆液态金属，使液态金属在所述液态金属粘附层上实现粘附，以及在所述液态金属不粘层上实现不粘附，得到液态金属电路；再利用高分子有机材料对所述液态金属电路进行封装处理。In some illustrative embodiments, the method for preparing a printed circuit includes: coating a polymer organic material on a substrate surface to form a liquid metal adhesion layer; and then using graphite on the liquid metal adhesion layer. Forming a liquid metal non-stick layer with a specific pattern; wherein the size and area of the liquid metal non-stick layer are smaller than the size and area of the liquid metal adhesion layer; the liquid metal is evenly coated on the substrate so that the liquid metal Adhesion is achieved on the liquid metal adhesion layer, and non-adhesion is achieved on the liquid metal non-adhesion layer to obtain a liquid metal circuit; and then the polymer metal material is used to perform encapsulation processing on the liquid metal circuit.
在一些可选地实施例中，所述基底选用以下之一的材质：纸材、布料、金属、塑料、玻璃、木材、石材。In some optional embodiments, the substrate is made of one of the following materials: paper, cloth, metal, plastic, glass, wood, and stone.
在一些可选地实施例中，所述高分子有机材料选用以下之一：PDMS、Ecoflex、聚氨酯、硅胶和丙烯酸类聚合物。In some optional embodiments, the polymer organic material is selected from one of the following: PDMS, Ecoflex, polyurethane, silica gel, and acrylic polymer.
在一些可选地实施例中，所述液态金属包括熔点在300摄氏度以下的低熔点金属单质、低熔点金属合金或主要成分为低熔点金属单质/低熔点金属合金的导电混合物。In some optional embodiments, the liquid metal includes a low-melting metal element, a low-melting metal alloy, or a conductive mixture whose main component is a low-melting metal element / low-melting metal alloy.
在一些可选地实施例中，所述液态金属包括以下之一或任意组合：汞、镓、铟、锡单质、镓铟合金、镓铟锡合金、镓锡合金、镓锌合金、镓铟锌合金、镓锡锌合金、镓铟锡锌合金、镓锡镉合金、镓锌镉合金、铋铟合金、铋锡合金、铋铟锡合金、铋铟锌合金、铋锡锌合金、铋铟锡锌合金、锡铅合金、锡铜合金、锡锌铜合金、锡银铜合金和铋铅锡合金。In some optional embodiments, the liquid metal includes one or any combination of the following: mercury, gallium, indium, elemental tin, gallium indium alloy, gallium indium tin alloy, gallium tin alloy, gallium zinc alloy, gallium indium zinc Alloy, gallium tin zinc alloy, gallium indium tin zinc alloy, gallium tin cadmium alloy, gallium zinc cadmium alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium tin alloy, bismuth indium zinc alloy, bismuth tin zinc alloy, bismuth indium tin zinc Alloys, tin-lead alloys, tin-copper alloys, tin-zinc-copper alloys, tin-silver-copper alloys, and bismuth-lead-tin alloys.
在一些可选地实施例中，所述液态金属选用常温下呈液态的低熔点金属，包括：镓单质和/或镓基合金。In some optional embodiments, the liquid metal is a low-melting-point metal that is liquid at normal temperature, and includes: gallium simple substance and / or gallium-based alloy.
在一些可选地实施例中，所述制备方法，还包括：分离所述基底与所述液态金属粘附层，得到以所述高分子有机材料封装的柔性印刷电路。In some optional embodiments, the preparation method further includes: separating the substrate from the liquid metal adhesion layer to obtain a flexible printed circuit packaged with the polymer organic material.
在一些可选地实施例中，所述高分子有机材料和/或石墨的涂覆通过喷涂或打印的方式成型。In some optional embodiments, the coating of the polymer organic material and / or graphite is formed by spraying or printing.
本发明的另一个目的在于基于上述印刷电路的制备方法，提出一种印刷电路。Another object of the present invention is to provide a printed circuit based on the method for manufacturing a printed circuit.
在一些说明性实施例中，所述印刷电路，包括：由高分子有机材料形成的液态金属粘附层；位于所述液态金属粘附层上的液态金属与由石墨形 成的液态金属不粘层，其中，位于所述液态金属粘附层上的液态金属构成印刷电路的导电线路；由高分子有机材料形成、并包覆所述液态金属及液态金属不粘层的封装层，所述封装层与所述液态金属粘附层配合实现所述液态金属的封装。In some illustrative embodiments, the printed circuit includes: a liquid metal adhesion layer formed of a high molecular organic material; a liquid metal on the liquid metal adhesion layer and a liquid metal non-stick layer formed of graphite Wherein the liquid metal on the liquid metal adhesion layer constitutes a conductive circuit of a printed circuit; and an encapsulation layer formed of a polymer organic material and covering the liquid metal and a non-stick layer of the liquid metal, the encapsulation layer Cooperate with the liquid metal adhesion layer to achieve packaging of the liquid metal.
在一些说明性实施例中，所述液态金属粘附层附着在基底上；所述基底包括以下之一：纸材、布料、金属、塑料、玻璃、木材、石材。In some illustrative embodiments, the liquid metal adhesion layer is attached to a substrate; the substrate includes one of the following: paper, cloth, metal, plastic, glass, wood, stone.
与现有技术相比，本发明具有如下优势：Compared with the prior art, the present invention has the following advantages:
1.本发明通过改良印制表面的表面附着力，可实现对于不粘附液态金属的基底表面粘附液态金属，从而提高液态金属印制对于各种材质基底的适应性。1. By improving the surface adhesion of the printed surface, the present invention can realize the adhesion of liquid metal to the surface of the substrate on which the liquid metal is not adhered, thereby improving the adaptability of liquid metal printing to substrates of various materials.
2.在实现控制液态金属的粘附与不粘附的条件下，可根据用户要求定制化其电路图案，以满足用户的自定义设计需求及质量要求。2. Under the condition of controlling the adhesion and non-adhesion of liquid metal, the circuit pattern can be customized according to user requirements to meet the user's custom design requirements and quality requirements.
3.相比较传统的电路制备工艺而言，本发明在完成基底上的粘附层和不粘层的涂覆设计后，可利用刷涂的方式一次性成型液态金属，有效的提高了制备效率。3. Compared with the traditional circuit preparation process, after the coating design of the adhesive layer and the non-adhesive layer on the substrate is completed, the present invention can use a brushing method to form liquid metal at one time, which effectively improves the preparation efficiency. .
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1是本发明实施例中印刷电路的制备流程图；FIG. 1 is a flowchart of manufacturing a printed circuit according to an embodiment of the present invention;
图2是本发明实施例中印刷电路的制备流程图；FIG. 2 is a flowchart of manufacturing a printed circuit in the embodiment of the present invention; FIG.
图3是本发明实施例中印刷电路的制备流程图；FIG. 3 is a flowchart of a printed circuit preparation in the embodiment of the present invention; FIG.
图4是本发明实施例中的印刷电路的结构示意图；4 is a schematic structural diagram of a printed circuit in an embodiment of the present invention;
图5是本发明实施例中的印刷电路的结构示意图。FIG. 5 is a schematic structural diagram of a printed circuit in an embodiment of the present invention.
具体实施方式detailed description
以下描述和附图充分地示出本发明的具体实施方案，以使本领域的技术人员能够实践它们。其他实施方案可以包括结构的、逻辑的、电气的、过程的以及其他的改变。实施例仅代表可能的变化。除非明确要求，否则单独的部件和功能是可选的，并且操作的顺序可以变化。一些实施方案的部分和特征可以被包括在或替换其他实施方案的部分和特征。本发明的实施方案的范围包括权利要求书的整个范围，以及权利要求书的所有可获得 的等同物。在本文中，本发明的这些实施方案可以被单独地或总地用术语“发明”来表示，这仅仅是为了方便，并且如果事实上公开了超过一个的发明，不是要自动地限制该应用的范围为任何单个发明或发明构思。The following description and the drawings sufficiently illustrate specific embodiments of the present invention to enable those skilled in the art to practice them. Other implementations may include structural, logical, electrical, procedural, and other changes. The examples represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. The scope of embodiments of the invention includes the entire scope of the claims, and all available equivalents of the claims. Herein, these embodiments of the present invention may be individually or collectively represented by the term "invention", this is for convenience only, and if more than one invention is actually disclosed, it is not intended to automatically limit the application The scope is any single invention or inventive idea.
为了便于更快的理解本发明中的各实施例，在此对本发明的主要思想进行简要说明。In order to facilitate a quicker understanding of the embodiments of the present invention, the main idea of the present invention is briefly described here.
发明人发现液态金属对于不同材料的基底的粘附性差异明显。具体的，液态金属对于高分子有机材料表现较好的粘附性，这是由于有机高分子材料可以提供较高的范德华力以及形成一定程度的氢键相互作用，因此液态金属可均匀涂覆在高分子有机材料形成的层体表面，且形态稳定。而液态金属对于石墨的浸润性表现很差，液态金属无法粘附石墨上，少量残留也极易擦除。发明人通过上述发现，利用高分子有机材料对印制表面进行改性处理，使印制表面对于液态金属的粘附性得到提升，再利用与液态金属不粘附的石墨形成特定图案的结构，可使得石墨未覆盖的区域粘附液态金属，以及石墨覆盖的区域不粘附液态金属，进而得到以液态金属作为导电线路的印制电路。The inventors have found that the adhesion of liquid metals to substrates of different materials differs significantly. Specifically, liquid metal exhibits better adhesion to polymer organic materials. This is because organic polymer materials can provide higher van der Waals forces and form a certain degree of hydrogen bonding interactions, so liquid metals can be evenly coated on The surface of the layer body formed by the high-molecular organic material is stable in form. The wettability of liquid metal to graphite is poor. Liquid metal cannot adhere to graphite, and a small amount of residue is also easy to erase. Based on the above findings, the inventor modified the printed surface with a high-molecular organic material to improve the adhesion of the printed surface to liquid metal, and then used graphite that does not adhere to liquid metal to form a specific pattern structure. Liquid metal can be adhered to the area not covered by graphite, and liquid metal can not be adhered to the area covered by graphite, thereby obtaining a printed circuit using liquid metal as a conductive line.
现在参照图1，图1示出了本发明实施例中的印刷电路的制备方法的流程图，如该流程图所示，本发明公开了一种印刷电路的制备方法，包括：Referring now to FIG. 1, FIG. 1 shows a flowchart of a method for preparing a printed circuit in an embodiment of the present invention. As shown in the flowchart, the present invention discloses a method for preparing a printed circuit, including:
步骤S11、将高分子有机材料涂覆在基底表面上形成一层液态金属粘附层；Step S11: coating a polymer organic material on the surface of the substrate to form a liquid metal adhesion layer;
步骤S12、再利用石墨在所述液态金属粘附层上形成特定图案的液态金属不粘层；其中，所述液态金属不粘层的尺寸面积小于所述液态金属粘附层的尺寸面积；Step S12: Reusing graphite to form a liquid metal non-stick layer with a specific pattern on the liquid metal adhesion layer; wherein the size area of the liquid metal non-stick layer is smaller than the size area of the liquid metal adhesion layer;
步骤S13、在所述基底上均匀涂覆液态金属，使液态金属在所述液态金属粘附层上实现粘附，以及在所述液态金属不粘层上实现不粘附，得到液态金属电路；Step S13: uniformly coating liquid metal on the substrate, so that liquid metal can be adhered on the liquid metal adhesion layer, and non-adhesion can be realized on the liquid metal non-stick layer to obtain a liquid metal circuit;
步骤S14、再利用高分子有机材料对所述液态金属电路进行封装处理。In step S14, the liquid metal circuit is encapsulated by using a polymer organic material.
本发明通过改良印制表面的表面附着力，可实现对于不粘附液态金属的基底表面粘附液态金属，从而提高液态金属印制对于各种材质基底的适应性。其次，在实现控制液态金属的粘附与不粘附的条件下，可根据用户要求定制化其电路图案，以满足用户的自定义设计需求及质量要求。再有， 相比较传统的电路制备工艺而言，本发明在完成基底上的粘附层和不粘层的涂覆设计后，可利用刷涂的方式一次性成型液态金属，有效的提高了制备效率。By improving the surface adhesion of the printed surface, the invention can realize the adhesion of liquid metal to the surface of the substrate on which the liquid metal is not adhered, thereby improving the adaptability of the printing of liquid metal to substrates of various materials. Secondly, under the condition of controlling the adhesion and non-adhesion of liquid metal, the circuit pattern can be customized according to user requirements to meet the user's custom design requirements and quality requirements. Furthermore, compared with the traditional circuit preparation process, after the coating design of the adhesive layer and the non-sticky layer on the substrate is completed, the present invention can use a brushing method to form liquid metal at one time, which effectively improves the preparation. effectiveness.
在一些实施例中，本发明实施例中的基底可选用表面粗糙的材质的基底，这类基底由于粗糙的界面使金属/金属氧化层与基底的作用距离增大，接触面积大大减小，降低了金属的浸润性，并且不能形成分子间作用力，通过步骤S11中的表面改性处理后，可有效的解决上述问题。进而，本发明实施例中的基底可使用任意材质的基底，例如表面粗糙的纸材、布料、木材、石材等，除表面粗糙材质的基底之外，本发明亦可使用表面较光滑的塑料、玻璃等。In some embodiments, a substrate with a rough surface may be used as the substrate in the embodiments of the present invention. Due to the rough interface, the interaction distance between the metal / metal oxide layer and the substrate is increased, and the contact area is greatly reduced. Because of the wettability of the metal and intermolecular forces cannot be formed, the above problems can be effectively solved after the surface modification treatment in step S11. Furthermore, the substrate in the embodiment of the present invention may be a substrate of any material, such as paper, cloth, wood, stone, etc. with a rough surface. In addition to a substrate with a rough surface, the present invention may also use a plastic with a smooth surface, Glass, etc.
在一些实施例中，所述高分子有机材料选用以下之一：PDMS(聚二甲基硅氧烷)、Ecoflex(生物降解塑料)、聚氨酯、硅胶、丙烯酸类聚合物等长链高分子有机材料。优选地，高分子有机材料可选用Ecoflex(生物降解塑料)、聚氨酯、硅胶或丙烯酸类聚合物，相比较PDMS(聚二甲基硅氧烷)而言，其成型后的气密性较好，不易使空气渗入其中，与液态金属接触，从而避免由于氧化影响液态金属的电学性质。其中，步骤S11和步骤S14中的高分子有机材料可选用不同的材料，亦可选用相同的材料。优选地，步骤S11和步骤S14中的高分子有机材料选用同种材料，进而避免由于材料不同可能产生的分层问题。In some embodiments, the polymer organic material is selected from one of the following: PDMS (polydimethylsiloxane), Ecoflex (biodegradable plastic), polyurethane, silica gel, acrylic polymer and other long-chain polymer organic materials . Preferably, the polymer organic material can be selected from Ecoflex (biodegradable plastic), polyurethane, silica gel or acrylic polymer. Compared with PDMS (polydimethylsiloxane), its air tightness after molding is better. It is not easy for air to penetrate into it and come into contact with the liquid metal, thereby avoiding affecting the electrical properties of the liquid metal due to oxidation. Wherein, the polymer organic materials in steps S11 and S14 may be selected from different materials, and the same materials may also be selected. Preferably, the high-molecular organic materials in steps S11 and S14 are selected from the same material, thereby avoiding the problem of delamination that may occur due to different materials.
所述液态金属又称低熔点金属，其包括熔点在300摄氏度以下的低熔点金属单质、低熔点金属合金或由液态金属单质/低熔点金属合金与金属纳米颗粒和流体分散剂混合形成的导电纳米流体。更为具体地，当选用所述导电纳米流体时，流体分散剂优选为乙醇、丙二醇、丙三醇、聚乙烯吡咯烷酮、聚二甲基硅氧烷、聚乙二醇、聚甲基丙烯酸甲酯中的一种。The liquid metal is also called a low-melting-point metal, which includes a low-melting metal element, a low-melting metal alloy, or a conductive nano formed by mixing a liquid metal element / low-melting metal alloy with metal nanoparticles and a fluid dispersant. fluid. More specifically, when the conductive nanofluid is selected, the fluid dispersant is preferably ethanol, propylene glycol, glycerol, polyvinylpyrrolidone, polydimethylsiloxane, polyethylene glycol, and polymethyl methacrylate. One of them.
在一些实施例中，低熔点金属合金成分可包括镓、铟、锡、锌、铋、铅、镉、汞、银、铜、钠、钾、镁、铝、铁、镍、钴、锰、钛、钒、硼、碳、硅等中的一种或多种。In some embodiments, the low melting point metal alloy composition may include gallium, indium, tin, zinc, bismuth, lead, cadmium, mercury, silver, copper, sodium, potassium, magnesium, aluminum, iron, nickel, cobalt, manganese, titanium Or vanadium, boron, carbon, silicon, or the like.
优选地，液态金属具体的选择范围包括：汞单质、镓单质、铟单质、锡单质、镓铟合金、镓铟锡合金、镓锡合金、镓锌合金、镓铟锌合金、镓锡锌合金、镓铟锡锌合金、镓锡镉合金、镓锌镉合金、铋铟合金、铋锡合 金、铋铟锡合金、铋铟锌合金、铋锡锌合金、铋铟锡锌合金、锡铅合金、锡铜合金、锡锌铜合金、锡银铜合金、铋铅锡合金中的一种或几种。Preferably, the specific selection range of the liquid metal includes: mercury simple substance, gallium simple substance, indium simple substance, tin simple substance, gallium indium alloy, gallium indium tin alloy, gallium tin alloy, gallium zinc alloy, gallium indium zinc alloy, gallium tin zinc alloy, Gallium indium tin zinc alloy, gallium tin cadmium alloy, gallium zinc cadmium alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium tin alloy, bismuth indium zinc alloy, bismuth tin zinc alloy, bismuth indium tin zinc alloy, tin lead alloy, tin One or more of copper alloy, tin-zinc-copper alloy, tin-silver-copper alloy, and bismuth-lead-tin alloy.
在一些实施例中，所述液态金属选用常温下呈液态的低熔点金属，包括：熔点为29摄氏度的镓单质和/或熔点处于10–30摄氏度之间的镓基合金(其熔点与其配比相关)。通过选用常温下呈液态的低熔点金属，可降低印刷电路的制备要求与成本。In some embodiments, the liquid metal is a low-melting-point metal that is liquid at normal temperature, and includes: a gallium element having a melting point of 29 degrees Celsius and / or a gallium-based alloy having a melting point between 10-30 degrees Celsius (its melting point and its proportion Related). By selecting a low-melting-point metal that is liquid at normal temperature, the manufacturing requirements and costs of printed circuits can be reduced.
如图2，所述制备方法，还包括：As shown in FIG. 2, the preparation method further includes:
步骤S15、分离所述基底与所述液态金属粘附层，得到以所述高分子有机材料封装的柔性印刷电路。Step S15: The substrate and the liquid metal adhesion layer are separated to obtain a flexible printed circuit packaged with the polymer organic material.
通过上述实施例所制备的柔性印刷电路的效率提得到极大的提升，制备过程简易，无需注模、开槽、灌注等处理。The efficiency of the flexible printed circuit prepared by the above embodiments is greatly improved, the preparation process is simple, and no processing such as injection molding, slotting, and pouring is required.
在一些实施例中，步骤S11中的高分子有机材料的涂覆可利用打印技术或喷涂技术实现，例如使用相应原料的喷墨打印机，直接在基底表面喷涂一层高分子有机材料。除上述打印技术或喷涂技术之外，还可以采用手工涂覆或浸渍处理的方式涂覆。In some embodiments, the coating of the high-molecular organic material in step S11 may be achieved by using a printing technique or a spraying technique, for example, an inkjet printer using a corresponding raw material is directly sprayed with a layer of a high-molecular organic material. In addition to the above-mentioned printing technology or spraying technology, it can also be applied by manual coating or dipping.
在一些实施例中，步骤S12中的石墨的特定图案的涂覆亦可采用打印技术或喷涂技术实现，亦如喷墨打印机，利用设计好的电子设计图，实现特定图案的喷涂，原料可采用石墨粉。In some embodiments, the coating of the specific pattern of graphite in step S12 can also be achieved by using a printing technique or a spraying technique, such as an inkjet printer, using a designed electronic design drawing to realize the spraying of a specific pattern. Graphite powder.
在一些实施例中，步骤S14中的高分子有机材料的封装，亦可通过上述步骤S11中的高分子有机材料的涂覆方式，在此不再赘述。In some embodiments, the packaging of the polymer organic material in step S14 may also be performed by the coating method of the polymer organic material in step S11, and details are not described herein again.
在一些实施例中，步骤S13中的液态金属的涂覆除上述涂覆方式之外，还可选用浸渍、刷涂等方式，浸渍例如将已经过表面处理后的基底放置在液态金属池中浸渍，一定时间后取出；刷涂例如利用刷涂工具(滚轮、刷子、刮子等类似工具)将液态金属刷涂到基底上。In some embodiments, in addition to the above-mentioned coating method, the coating of the liquid metal in step S13 may be performed by dipping, brush coating, or the like. For example, the substrate after the surface treatment is placed in a liquid metal bath for dipping. , Take it out after a certain period of time; brush coating, for example, using a brush coating tool (roller, brush, scraper, etc.) to apply liquid metal to the substrate.
参见图3，本发明针对上述制备方法提出了一种具体实施方式，该制备方法中所使用的材料及设备包括：基底1、有机高分子材料2；喷墨打印机3；石墨4；滚轮5；液态金属6；封装材料7。其中，有机高分子材料2和封装材料7均采用有机高分子材料，其名称仅用于相互区别。该实施例中选用纸张作为基底1材料。首先将有机高分子材料2均匀涂覆在基底1材料表面。待其固化成膜后，使用喷墨打印机3将石墨4喷涂在涂覆 有机高分子材料2的基底1表面。之后使用滚轮5将液态金属6刷涂在经过两种材料处理后的基底1表面。由于液态金属6在石墨4和有机高分子材料2表面的黏附力差异，液态金属6只黏附在没有被石墨4覆盖的有机高分子2膜的表面，从而形成具有特定图案的电路结构。最后，将封装材料7均匀涂覆在基底1材料表面，待其固化成膜后可将液态金属6固定在基底1材料的表面，完成电路结构的封装。Referring to FIG. 3, the present invention proposes a specific implementation manner for the above-mentioned preparation method. The materials and equipment used in the preparation method include: substrate 1, organic polymer material 2, inkjet printer 3, graphite 4, roller 5; Liquid metal 6; packaging material 7. Among them, the organic polymer material 2 and the packaging material 7 both use organic polymer materials, and their names are only used to distinguish each other. In this embodiment, paper is selected as the material of the substrate 1. First, the organic polymer material 2 is uniformly coated on the surface of the substrate 1 material. After it is cured into a film, graphite 4 is spray-coated on the surface of the substrate 1 coated with the organic polymer material 2 using an inkjet printer 3. Then, the liquid metal 6 is brush-coated on the surface of the substrate 1 treated with the two materials by using the roller 5. Due to the difference in adhesion between the liquid metal 6 on the surface of the graphite 4 and the organic polymer material 2, the liquid metal 6 only adheres to the surface of the organic polymer 2 film not covered by the graphite 4 to form a circuit structure with a specific pattern. Finally, the packaging material 7 is uniformly coated on the surface of the material of the substrate 1, and after it is cured into a film, the liquid metal 6 can be fixed on the surface of the material of the substrate 1 to complete the packaging of the circuit structure.
上述实施例是本发明的一种具体实施方式，其内的材料选择、设备选择均可利用本发明上述相关实施例进行替换，以满足不同需求及不同环境下的制备。The above embodiment is a specific implementation of the present invention, and the material selection and equipment selection can be replaced by the above related embodiments of the present invention to meet different requirements and preparations in different environments.
再次参见图3，本发明的另一个目的在于基于上述印刷电路的制备方法，提出一种印刷电路，包括：由高分子有机材料2形成的液态金属粘附层；位于所述液态金属粘附层上的液态金属6与由石墨4形成的液态金属不粘层，其中，位于所述液态金属粘附层上的液态金属6构成印刷电路的导电线路；由高分子有机材料形成、并包覆所述液态金属及液态金属不粘层的封装层7，所述封装层7与所述液态金属粘附层配合实现所述液态金属的封装。Referring again to FIG. 3, another object of the present invention is to provide a printed circuit based on the method for preparing a printed circuit, including: a liquid metal adhesion layer formed of a polymer organic material 2; and located on the liquid metal adhesion layer The liquid metal 6 on the surface and the liquid metal non-stick layer formed of graphite 4, wherein the liquid metal 6 on the liquid metal adhesion layer constitutes a conductive circuit of a printed circuit; it is formed of a polymer organic material and covers the The encapsulation layer 7 of the liquid metal and the non-stick layer of the liquid metal, and the encapsulation layer 7 cooperates with the liquid metal adhesion layer to realize the encapsulation of the liquid metal.
在一些实施例中，所述液态金属粘附层附着在基底上；在一些实施例中，本发明实施例中的基底可使用任意材质的基底，例如表面粗糙的纸材、布料、木材、石材等，除表面粗糙材质的基底之外，本发明亦可使用表面较光滑的塑料、玻璃等。In some embodiments, the liquid metal adhesion layer is attached to a substrate. In some embodiments, the substrate in the embodiment of the present invention may be a substrate of any material, such as rough-surfaced paper, cloth, wood, and stone. For example, in addition to a substrate with a rough surface, the present invention can also use plastics, glass, and the like with smooth surfaces.
所述液态金属又称低熔点金属，其包括熔点在300摄氏度以下的低熔点金属单质、低熔点金属合金或由液态金属单质/低熔点金属合金与金属纳米颗粒和流体分散剂混合形成的导电纳米流体。更为具体地，当选用所述导电纳米流体时，流体分散剂优选为乙醇、丙二醇、丙三醇、聚乙烯吡咯烷酮、聚二甲基硅氧烷、聚乙二醇、聚甲基丙烯酸甲酯中的一种。The liquid metal is also called a low-melting-point metal, which includes a low-melting metal element, a low-melting metal alloy, or a conductive nano formed by mixing a liquid metal element / low-melting metal alloy with metal nanoparticles and a fluid dispersant. fluid. More specifically, when the conductive nanofluid is selected, the fluid dispersant is preferably ethanol, propylene glycol, glycerol, polyvinylpyrrolidone, polydimethylsiloxane, polyethylene glycol, and polymethyl methacrylate. One of them.
在一些实施例中，低熔点金属合金成分可包括镓、铟、锡、锌、铋、铅、镉、汞、银、铜、钠、钾、镁、铝、铁、镍、钴、锰、钛、钒、硼、碳、硅等中的一种或多种。In some embodiments, the low melting point metal alloy composition may include gallium, indium, tin, zinc, bismuth, lead, cadmium, mercury, silver, copper, sodium, potassium, magnesium, aluminum, iron, nickel, cobalt, manganese, titanium Or vanadium, boron, carbon, silicon, or the like.
优选地，液态金属具体的选择范围包括：汞单质、镓单质、铟单质、锡单质、镓铟合金、镓铟锡合金、镓锡合金、镓锌合金、镓铟锌合金、镓 锡锌合金、镓铟锡锌合金、镓锡镉合金、镓锌镉合金、铋铟合金、铋锡合金、铋铟锡合金、铋铟锌合金、铋锡锌合金、铋铟锡锌合金、锡铅合金、锡铜合金、锡锌铜合金、锡银铜合金、铋铅锡合金中的一种或几种。Preferably, the specific selection range of the liquid metal includes: mercury simple substance, gallium simple substance, indium simple substance, tin simple substance, gallium indium alloy, gallium indium tin alloy, gallium tin alloy, gallium zinc alloy, gallium indium zinc alloy, gallium tin zinc alloy, Gallium indium tin zinc alloy, gallium tin cadmium alloy, gallium zinc cadmium alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium tin alloy, bismuth indium zinc alloy, bismuth tin zinc alloy, bismuth indium tin zinc alloy, tin lead alloy, tin One or more of copper alloy, tin-zinc-copper alloy, tin-silver-copper alloy, and bismuth-lead-tin alloy.
在一些实施例中，所述液态金属选用常温下呈液态的低熔点金属，包括：熔点为29摄氏度的镓单质和/或熔点处于10–30摄氏度之间的镓基合金(其熔点与其配比相关)。通过选用常温下呈液态的低熔点金属，可降低印刷电路的制备要求与成本。In some embodiments, the liquid metal is a low-melting-point metal that is liquid at normal temperature, and includes: a gallium element having a melting point of 29 degrees Celsius and / or a gallium-based alloy having a melting point between 10-30 degrees Celsius (its melting point and its proportion Related). By selecting a low-melting-point metal that is liquid at normal temperature, the manufacturing requirements and costs of printed circuits can be reduced.
在一些实施例中，所述高分子有机材料选用以下之一：PDMS(聚二甲基硅氧烷)、Ecoflex(生物降解塑料)、聚氨酯、硅胶、丙烯酸类聚合物等长链高分子有机材料。优选地，高分子有机材料可选用Ecoflex(生物降解塑料)、聚氨酯、硅胶或丙烯酸类聚合物，相比较PDMS(聚二甲基硅氧烷)而言，其成型后的气密性较好，不易使空气渗入其中，与液态金属接触，从而避免由于氧化影响液态金属的电学性质。In some embodiments, the polymer organic material is selected from one of the following: PDMS (polydimethylsiloxane), Ecoflex (biodegradable plastic), polyurethane, silica gel, acrylic polymer and other long-chain polymer organic materials . Preferably, the polymer organic material can be selected from Ecoflex (biodegradable plastic), polyurethane, silica gel or acrylic polymer. Compared with PDMS (polydimethylsiloxane), its air tightness after molding is better. It is not easy for air to penetrate into it and come into contact with the liquid metal, thereby avoiding affecting the electrical properties of the liquid metal due to oxidation.
本领域技术人员还应当理解，结合本文的实施例描述的各种说明性的逻辑框、模块、电路和算法步骤均可以实现成电子硬件、计算机软件或其组合。为了清楚地说明硬件和软件之间的可交换性，上面对各种说明性的部件、框、模块、电路和步骤均围绕其功能进行了一般地描述。至于这种功能是实现成硬件还是实现成软件，取决于特定的应用和对整个***所施加的设计约束条件。熟练的技术人员可以针对每个特定应用，以变通的方式实现所描述的功能，但是，这种实现决策不应解释为背离本公开的保护范围。Those skilled in the art should also understand that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments herein can be implemented as electronic hardware, computer software, or a combination thereof. To clearly illustrate the interchangeability between hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described generally above their functions. Whether such functionality is implemented as hardware or software depends on the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

Claims (10)

  1. 一种印刷电路的制备方法，其特征在于，包括：A method for preparing a printed circuit, comprising:
    将高分子有机材料涂覆在基底表面上形成一层液态金属粘附层；Coating a polymer organic material on the substrate surface to form a liquid metal adhesion layer;
    再利用石墨在所述液态金属粘附层上形成特定图案的液态金属不粘层；其中，所述液态金属不粘层的尺寸面积小于所述液态金属粘附层的尺寸面积；Using graphite to form a liquid metal non-stick layer with a specific pattern on the liquid metal adhesion layer; wherein the size area of the liquid metal non-stick layer is smaller than the size area of the liquid metal adhesion layer;
    在所述基底上均匀涂覆液态金属，使液态金属在所述液态金属粘附层上实现粘附，以及在所述液态金属不粘层上实现不粘附，得到液态金属电路；Uniformly coating liquid metal on the substrate so that liquid metal adheres to the liquid metal adhesion layer and non-adhesion to the liquid metal non-stick layer to obtain a liquid metal circuit;
    再利用高分子有机材料对所述液态金属电路进行封装处理。The polymer metal material is further used for packaging the liquid metal circuit.
  2. 根据权利要求1所述的制备方法，其特征在于，所述基底选用以下之一的材质：纸材、布料、金属、塑料、玻璃、木材、石材。The method according to claim 1, wherein the substrate is made of one of the following materials: paper, cloth, metal, plastic, glass, wood, and stone.
  3. 根据权利要求1所述的制备方法，其特征在于，所述高分子有机材料选用以下之一：PDMS、Ecoflex、聚氨酯、硅胶和丙烯酸类聚合物。The method according to claim 1, wherein the polymer organic material is one of the following: PDMS, Ecoflex, polyurethane, silica gel, and acrylic polymer.
  4. 根据权利要求1所述的制备方法，其特征在于，所述液态金属包括熔点在300摄氏度以下的低熔点金属单质、低熔点金属合金或主要成分为低熔点金属单质/低熔点金属合金的导电混合物。The preparation method according to claim 1, wherein the liquid metal comprises a low-melting metal element, a low-melting metal alloy or a conductive mixture whose main component is a low-melting metal element / low-melting metal alloy with a melting point below 300 degrees Celsius. .
  5. 根据权利要求4所述的制备方法，其特征在于，所述液态金属包括以下之一或任意组合：汞、镓、铟、锡单质、镓铟合金、镓铟锡合金、镓锡合金、镓锌合金、镓铟锌合金、镓锡锌合金、镓铟锡锌合金、镓锡镉合金、镓锌镉合金、铋铟合金、铋锡合金、铋铟锡合金、铋铟锌合金、铋锡锌合金、铋铟锡锌合金、锡铅合金、锡铜合金、锡锌铜合金、锡银铜合金和铋铅锡合金。The preparation method according to claim 4, wherein the liquid metal comprises one or any combination of the following: mercury, gallium, indium, tin simple substance, gallium indium alloy, gallium indium tin alloy, gallium tin alloy, gallium zinc Alloy, gallium indium zinc alloy, gallium tin zinc alloy, gallium indium tin zinc alloy, gallium tin cadmium alloy, gallium zinc cadmium alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium tin alloy, bismuth indium zinc alloy, bismuth tin zinc alloy , Bismuth indium tin zinc alloy, tin lead alloy, tin copper alloy, tin zinc copper alloy, tin silver copper alloy and bismuth lead tin alloy.
  6. 根据权利要求4所述的制备方法，其特征在于，所述液态金属选用常温下呈液态的低熔点金属，包括：镓单质和/或镓基合金。The preparation method according to claim 4, wherein the liquid metal is a low-melting-point metal that is liquid at normal temperature, and includes: gallium simple substance and / or gallium-based alloy.
  7. 根据权利要求1所述的制备方法，其特征在于，所述方法还包括：分离所述基底与所述液态金属粘附层，得到以所述高分子有机材料封装的柔性印刷电路。The method according to claim 1, further comprising: separating the substrate from the liquid metal adhesion layer to obtain a flexible printed circuit packaged with the polymer organic material.
  8. 根据权利要求1所述的制备方法，其特征在于，所述高分子有机 材料和/或石墨的涂覆通过喷涂或打印的方式成型。The preparation method according to claim 1, wherein the coating of the polymer organic material and / or graphite is formed by spraying or printing.
  9. 一种印刷电路，其特征在于，包括：A printed circuit, comprising:
    由高分子有机材料形成的液态金属粘附层；A liquid metal adhesion layer formed of a polymer organic material;
    位于所述液态金属粘附层上的液态金属与由石墨形成的液态金属不粘层，其中，位于所述液态金属粘附层上的液态金属构成印刷电路的液态金属电路；A liquid metal on the liquid metal adhesion layer and a liquid metal non-stick layer formed of graphite, wherein the liquid metal on the liquid metal adhesion layer constitutes a liquid metal circuit of a printed circuit;
    由高分子有机材料形成、并包覆所述液态金属及液态金属不粘层的封装层，所述封装层与所述液态金属粘附层配合实现所述液态金属电路的封装。An encapsulation layer formed of a polymer organic material and covering the liquid metal and the non-stick layer of the liquid metal, and the encapsulation layer cooperates with the liquid metal adhesion layer to realize the encapsulation of the liquid metal circuit.
  10. 根据权利要求9所述的印刷电路，其特征在于，所述液态金属粘附层附着在基底上；所述基底包括以下之一：纸材、布料、金属、塑料、玻璃、木材、石材。The printed circuit according to claim 9, wherein the liquid metal adhesion layer is attached to a substrate; the substrate comprises one of the following: paper, cloth, metal, plastic, glass, wood, stone.
PCT/CN2019/092312 2018-06-22 2019-06-21 Printed circuit and preparation method therefor WO2019242743A1 (en)

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