WO2019232986A1 - 一种导向装置及切割设备 - Google Patents

一种导向装置及切割设备 Download PDF

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Publication number
WO2019232986A1
WO2019232986A1 PCT/CN2018/107406 CN2018107406W WO2019232986A1 WO 2019232986 A1 WO2019232986 A1 WO 2019232986A1 CN 2018107406 W CN2018107406 W CN 2018107406W WO 2019232986 A1 WO2019232986 A1 WO 2019232986A1
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WO
WIPO (PCT)
Prior art keywords
guide
cutting
glass chip
recess
block
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PCT/CN2018/107406
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English (en)
French (fr)
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林健
高军召
齐维滨
朱凯
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北京铂阳顶荣光伏科技有限公司
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Publication of WO2019232986A1 publication Critical patent/WO2019232986A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the invention relates to the technical field of glass chip cutting, in particular to a guide device and a cutting device.
  • the current glass chip cutting equipment of the CIGS thin film solar cell uses a diamond cutting wheel to directly contact the chip surface when cutting the glass chip.
  • the upper surface of the glass chip 101 is pressed by the pressing block 102, and the cutting blade wheel is lowered from the lower surface of the glass chip 102 at the position A.
  • the position A is usually on the glass chip and is away from the edge of the glass chip 2 -4mm, then the cutting blade wheel cuts up and to the right, and then starts the cutting at position B which has not yet reached the edge of the other side of the glass chip.
  • Position A is usually 2-4mm from the edge of the glass chip on the glass chip. position. This makes the cutting distance (ie, the distance from A to B) smaller than the actual glass length, and the cutting is insufficient. In the subsequent slicing process, due to insufficient cutting, and the CIGS glass chip glass undergoes deformation after heat, the surface stress increases, and slicing failure is prone to occur.
  • the present invention provides a guide device for assisting cutting of a glass chip, which can ensure that the glass chip is sufficiently cut under the condition that the knife wheel and the glass edge are not directly contacted when the knife is lowered.
  • the invention provides a guide device for cutting a glass chip, including:
  • a guide block, the guide side of the guide block includes a recess and an outer surface, and when the recess contains a glass chip, the surface of the glass chip is on the same plane as the outer surface, and the outer surface is used to guide cutting The cutting wheel of the glass chip is lowered and raised.
  • the guide pressing block includes at least three sub-pressing blocks arranged in a row, wherein the sub-pressing block that receives the edge of the glass chip includes the recess and the outer surface, and the surfaces of the remaining sub-pressing blocks and The bottom surfaces of the recesses are on the same plane.
  • the material of the guide block includes a material having a Shore hardness of 75 or less.
  • the material of the guide pressure block comprises a nylon material.
  • the invention also provides a cutting device, comprising:
  • a guide block the guide side of the guide block includes a recess and an outer surface, and when the recess receives the glass chip, the surface of the glass chip is on the same plane as the outer surface, and the outer surface is used for Guide the cutting and cutting of the cutting wheel of the glass chip;
  • a cutting blade wheel is used for cutting and lifting off the outer surface of the guide pressure block, and cutting the glass chip accommodated in the concave portion of the guide pressure block.
  • the guide pressing block includes at least three sub-pressing blocks arranged in a row, wherein the sub-pressing block that receives the edge of the glass chip includes the recess and the outer surface, and the surfaces of the remaining sub-pressing blocks and The bottom surfaces of the recesses are on the same plane.
  • the material of the guide block includes a material having a Shore hardness of 75 or less.
  • the guide pressure block includes a guide pressure block made of nylon material.
  • a guide pressing block including a concave portion and an outer surface is used to assist in cutting the glass chip.
  • the concave portion of the guide pressing block accommodates the glass chip
  • the surface of the glass chip is flat with the outer surface of the pressing block.
  • the outer surface of the block starts to cut, achieving a smooth transitional contact from the pressing block to the glass chip, and a smooth transitional contact between the glass chip and the pressing block, so that there is no impact on the glass chip at the moment of the cutting and starting, and also avoiding the cutting of the glass
  • the blind area of the starting knife ensures that the chip is fully cut, that is, the actual distance of the cut is greater than the length of the glass, which avoids the abnormal fragmentation caused by insufficient cutting.
  • FIG. 1 is a schematic diagram of cutting a glass chip in the prior art
  • FIG. 2 is a schematic diagram of a guiding device for cutting a glass chip according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of a guiding device for cutting a glass chip according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a guiding device for cutting a glass chip according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a guiding device for cutting a glass chip according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a guiding device for cutting a glass chip according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of a guiding device for cutting a glass chip according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of a cutting device according to an embodiment of the present invention.
  • FIG. 9 is a schematic diagram of a cutting device according to an embodiment of the present invention.
  • FIG. 2 is a front view of a guide device according to an embodiment of the present invention.
  • the guide device in this embodiment includes a guide pressing block 200, and a guiding side of the guide pressing block 200 includes a recess 201 and an outer surface 202.
  • the recess 201 receives a glass chip
  • the surface of the glass chip is the same as the outer surface 202.
  • the flat surface and the outer surface 202 are used to guide the cutting and cutting of the cutting wheel for cutting the glass chip.
  • FIG. 3 a schematic diagram of the recess 201 of the guide pressing block 200 accommodating the glass chip 301 is shown.
  • the recessed portion 201 includes a bottom surface and a side wall.
  • the recessed portion 201 of the guide block 200 receives the glass chip 301, the corresponding end surface of the glass chip 301 abuts the bottom surface and the side wall of the recessed portion 201.
  • the outer surface 202 of the guide side of the compact is on the same plane.
  • a cutting blade wheel for cutting a glass chip makes a knife (i.e., A ') and a kicker (i.e., B') on the outer surface 202 of the guide block.
  • a guide chip including a recessed portion and an outer surface is used to assist in cutting the glass chip.
  • the surface of the glass chip is flat with the outer surface of the block.
  • the knife is started from the outer surface of the guide block to achieve a smooth transitional contact from the block to the glass chip, and a smooth transitional contact between the glass chip and the block, so that there is no impact on the glass chip when the knife is lowered and the knife is started.
  • the blind area of the lower knife and the lower knife is ensured to ensure that the chip is fully cut, that is, the actual cutting distance is greater than the length of the glass, and the abnormality of the slice caused by insufficient cutting is avoided.
  • the guide pressing block is composed of at least three sub-pressing blocks arranged in a row, wherein the sub-pressing block that receives the edge of the glass chip includes a recess, and the surfaces of the remaining sub-pressing blocks and the inner bottom surface of the recess are located at same plane. Therefore, the length of the guide block can be adjusted according to the length of the glass chip (increasing or decreasing the middle sub block), and the sub blocks at both ends can be adjusted according to the thickness of the glass chip. This increases the flexibility of the use of the guide clamp.
  • the guide pressing block 400 includes four sub-pressing blocks, wherein the sub-pressing block 401 accommodating the edge of the glass chip includes a recess 403, and the surface 405 of the remaining sub-pressing blocks 402 and the recess 403 The bottom faces are in the same plane.
  • FIG. 5 is a front view of the sub-clamp 401 in FIG. 4
  • FIG. 6 is a right side view of the sub-clamp shown in FIG. 5
  • FIG. 7 is a sub-clamp shown in FIG. 5.
  • the guide side of the sub-clamp 401 includes a recess 403 and an outer surface 404.
  • the outer surface 404 is on the same plane as the surface of the glass chip. The outer surface 404 is used for Guide the cutting wheel of the glass chip to lower and lift the knife.
  • the material of the guide block includes a material having a Shore hardness of 75 or less.
  • the guide pressure block with such hardness can hold the glass chip from the opposite side of the glass chip, so that the glass chip remains stationary, and due to the guide pressure
  • the block is not of high hardness, so it can protect the abutted surface from being worn by the guide block when the glass chip is held by the guide block.
  • the material of the guide block may include a nylon material.
  • the present invention also provides a cutting device, as shown in FIG. 8, including:
  • the guiding block 801, the guiding side of the guiding block 801 includes a recessed portion 802 and an outer surface 803.
  • the recessed portion 802 accommodates the glass chip 804
  • the surface of the glass chip 804 is on the same plane as the outer surface 803, and the outer surface 803 is used to guide the cutting of the glass
  • the chip cutter wheel 805 lowers and starts;
  • the cutting blade wheel 805 is used for cutting and lifting off the outer surface 803 of the guide pressing block 801, and cutting the glass chip 804 accommodated in the recess 802 of the guide pressing block 801.
  • the guide pressing block 801 includes at least three sub-pressing blocks 901 and 902 arranged in an array, wherein the sub-pressing block 901 that receives the edge of the glass chip 804 includes a recess 802 and an outer surface 803. The surfaces of the remaining sub-clamps 902 and the bottom surface of the recessed portion 802 are in the same plane.
  • the material of the guide block includes a material having a Shore hardness of 75 or less.
  • the guide block includes a guide block made of nylon material.
  • a guide pressing block including a concave portion and an outer surface is used to assist in cutting the glass chip.
  • the guide pressing block concave portion accommodates the glass chip
  • the surface of the glass chip is flat with the outer surface of the pressing block.
  • the wheel starts to lower the knife from the outer surface of the guide block to achieve a smooth transition contact from the block to the glass chip and a smooth transition contact from the glass chip to the block, so that there is no impact on the glass chip when the knife is lowered and the knife is started. Avoiding the blind area of the lower knife and the lower knife, ensuring that the chip is fully cut, that is, the actual distance of the cut is greater than the length of the glass, and the abnormal fragmentation caused by insufficient cutting is avoided.
  • the embodiments of the present invention may be provided as a method, a system, or a computer program product. Therefore, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

一种导向装置及切割设备，用以实现下刀、起刀瞬间对玻璃芯片无冲击，同时也确保芯片切割充分。其中，导向装置包括：导向压块（200），导向压块（200）的导向侧包括凹部（201）和外表面（202），当凹部（201）容纳玻璃芯片时，玻璃芯片的表面与外表面（202）在同一平面，外表面（202）用于引导切割玻璃芯片的切割刀轮下刀和起刀。

Description

一种导向装置及切割设备
相关申请的交叉参考
本申请基于申请号为201820867244.3、申请日为2018年06月05日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本发明涉及玻璃芯片切割技术领域，特别涉及一种导向装置及切割设备。
背景技术
目前的CIGS薄膜太阳电池的玻璃芯片切割设备在进行玻璃芯片切割时，采用金钢石切割刀轮与芯片表面直接接触。如图1所示，玻璃芯片101的上表面被压块102压住，切割刀轮从玻璃芯片102的下表面位置A处下刀，位置A通常在玻璃芯片上，并且距离玻璃芯片的边缘2-4mm，然后切割刀轮向上、向右进行切割，然后在还未到达玻璃芯片的另一侧的边缘的位置B处起刀，位置A通常在玻璃芯片上距离玻璃芯片的边缘2-4mm的位置。这使得切割距离(即A到B的距离)小于实际玻璃长度，切割不充分。在后继的分片过程由于切割不充分，且CIGS玻璃芯片玻璃经受热后变形，表面应力增加，容易出现分片失败。
发明内容
为解决上述问题，本发明提供了一种用于辅助切割玻璃芯片的导向装置，可以在避免下刀时刀轮与玻璃边缘直接接触的情况下，确保玻璃芯片切割充分。
本发明提供一种用于玻璃芯片切割的导向装置，包括：
导向压块，所述导向压块的导向侧包括凹部和外表面，当所述凹部容纳玻璃芯片时，所述玻璃芯片的表面与所述外表面在同一平面，所述外表面用于引导切割玻璃芯片的切割刀轮下刀和起刀。
可选的，所述导向压块包括排列摆放的至少三个子压块，其中，容纳所述玻璃芯片的边缘的子压块包括所述凹部和所述外表面，其余子压块的表面与所述凹部的底面处于同一平面。
可选的，所述导向压块的材料包括邵氏硬度为75以下的材料。
可选的，所述导向压块的材料包括尼龙材料。
本发明还提供一种切割设备，包括：
导向压块，所述导向压块的导向侧包括凹部和外表面，当所述凹部容纳所述玻璃芯片时，所述玻璃芯片的表面与所述外表面在同一平面，所述外表面用于引导切割玻璃芯片的切割刀轮下刀和起刀；
切割刀轮，用于在所述导向压块的外表面下刀和起刀，对所述导向压块的所述凹部容纳的所述玻璃芯片进行切割。
可选的，所述导向压块包括排列摆放的至少三个子压块，其中，容纳所述玻璃芯片的边缘的子压块包括所述凹部和所述外表面，其余子压块的表面与所述凹部的底面处于同一平面。
可选的，所述导向压块的材料包括邵氏硬度为75以下的材料。
可选的，所述导向压块包括尼龙材料制成的导向压块。
本发明的实施例提供的技术方案可以包括以下有益效果：
本实施例中，使用包括凹部和外表面的导向压块来辅助切割玻璃芯片，导向压块凹部容纳玻璃芯片时，玻璃芯片的表面与压块的外表面持平，此时切割刀轮从导向压块的外表面开始下刀，实现从压块到玻璃芯片的平稳过渡接触、以及玻璃芯片到压块的平稳过渡接触，使得下刀、起刀瞬间对玻璃芯片无冲击，同时也避免了下刀、起刀的盲区，确保芯片切割充分，即切割实际距离大于玻璃长度，避免了由于切割不充分造成的分片异常。
本发明的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本发明而了解。本发明的目的和其他优点可通过在所写的说明书、权利要求书、以及附图中所特别指出的结构来实现和获得。
下面通过附图和实施例，对本发明的技术方案做进一步的详细描述。
附图说明
附图用来提供对本发明的进一步理解，并且构成说明书的一部分，与本发明的实施例一起用于解释本发明，并不构成对本发明的限制。在附图中：
图1为现有技术中的玻璃芯片切割的示意图；
图2为本发明一实施例中的用于玻璃芯片切割的导向装置的示意图；
图3为本发明一实施例中的用于玻璃芯片切割的导向装置的示意图；
图4为本发明一实施例中的用于玻璃芯片切割的导向装置的示意图；
图5为本发明一实施例中的用于玻璃芯片切割的导向装置的示意图；
图6为本发明一实施例中的用于玻璃芯片切割的导向装置的示意图；
图7为本发明一实施例中的用于玻璃芯片切割的导向装置的示意图；
图8为本发明一实施例中的切割设备的示意图；
图9为本发明一实施例中的切割设备的示意图。
具体实施方式
以下结合附图对本发明的优选实施例进行说明，应当理解，此处所描述的优选实施例仅用于说明和解释本发明，并不用于限定本发明。
图2是本发明一实施例提供的导向装置的主视图。参见图2，本实施例中的导向装置包括导向压块200，导向压块200的导向侧包括凹部201和外表面202，当凹部201容纳玻璃芯片时，玻璃芯片的表面与外表面202在同一平面，外表面202用于引导切割玻璃芯片的切割刀轮下刀和起刀。
如图3所示为导向压块200的凹部201容纳玻璃芯片301的示意图。凹部201包括底面和侧壁，当导向压块200的凹部201容纳玻璃芯片301时，玻璃芯片301的相应的端面抵持凹部201的底面和侧壁，玻璃芯片301在凹部中露出的表面与导向压块的导向侧的外表面202在同一平面。用于切割玻璃芯片的切割刀轮在导向压块的外表面202上下刀(即A’)和起刀(即B’)。
本实施例提供的导向装置中，使用包括凹部和外表面的导向压块来辅助切割玻璃芯片，导向压块凹部容纳玻璃芯片时，玻璃芯片的表面与压块的外表面持平，此时刀轮从导向压块的外表面开始下刀，实现从压块到玻璃芯片的平稳过渡接触、以及玻璃芯片到压块的平稳过渡接触，使得下刀、起刀瞬间对玻璃芯片无冲击，同时也避免了下刀、起刀的盲区，确保芯片切割充分，即切割实际距离大于玻璃长度，避免了由于切割不充分造成的分片异常。
在本发明的一实施例中，导向压块由排列摆放的至少三个子压块构成，其中，容纳玻璃芯片的边缘的子压块包括凹部，其余子压块的表面与凹部的内底面处于同一平面。因此，可以根据玻璃芯片的长度来调整导向压块的长度(增加或减少中间的子压块)，以及根据玻璃芯片的厚度调整两端的子压块。这增加了导向压块的使用的灵活性。
如图4所示，在一实施例中，导向压块400包括四个子压块，其中，容纳玻璃芯片的边缘的子压块401包括凹部403，其余子压块402的表面405与凹部403的底面处于同一平面。
如图5所示为图4中的子压块401的主视图，如图6所示为图5所示的子压块的右视图，如图7所示为图5所示的子压块的仰视图。参见图5、图6和图7，子压块401的导向侧包括凹部403和外表面404，当凹部403容纳玻璃芯片时，外表面404与玻璃芯片的表面在同一平面，外表面404用于引导切割玻璃芯片的切割刀轮下刀和起刀。
在本发明的一实施例中，导向压块的材料包括邵氏硬度为75以下的材料。在切割刀轮从玻璃芯片一侧开始进行切割时，具有这种硬度的导向压块可以从玻璃芯片的相对的另一侧抵持住玻璃芯片，使玻璃芯片保持不动，并且，由于导向压块并不是高硬度，因此可以保护玻璃芯片被导向压块抵持时，被抵持的表面不会被导向压块磨损。例如，导向压块的材料可以包括尼龙材料。
本发明还提供一种切割设备，如图8所示，包括：
导向压块801，导向压块801的导向侧包括凹部802和外表面803，当凹部802容纳玻璃芯片804时，玻璃芯片804的表面与外表面803在同一平面，外表面803用于引导切割玻璃芯片的切割刀轮805下刀和起刀；
切割刀轮805，用于在导向压块801的外表面803下刀和起刀，对导向压块801的凹部802容纳的玻璃芯片804进行切割。
在一实施例中，如图9所示，导向压块801包括排列摆放的至少三个子压块901、902，其中，容纳玻璃芯片804的边缘的子压块901包括凹部802和外表面803，其余子压块902的表面与凹部802的底面处于同一平面。
在一实施例中，导向压块的材料包括邵氏硬度为75以下的材料。
在一实施例中，导向压块包括尼龙材料制成的导向压块。
本实施例中，在切割设备中使用包括凹部和外表面的导向压块来辅助切割玻璃芯片，导向压块凹部容纳玻璃芯片时，玻璃芯片的表面与压块的外表面持平，此时切割刀轮从导向压块的外表面开始下刀，实现从压块到玻璃芯片的平稳过渡接触、以及玻璃芯片到压块的平稳过渡接触，使得下刀、起刀瞬间对玻璃芯片无冲击，同时也避免了下刀、起刀的盲区，确保芯片切割充分，即切割实际距离大于玻璃长度，避免了由于切割不充分造成的分片异常。
本领域内的技术人员应明白，本发明的实施例可提供为方法、***、或计算机程序产品。因此，本发明可采用完全硬件实施例、完全软件实施例、或结合软件和硬件方面的实施例的形式。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (8)

  1. 一种导向装置，用于辅助切割玻璃芯片，其特征在于，包括：
    导向压块，所述导向压块的导向侧包括凹部和外表面，当所述凹部容纳玻璃芯片时，所述玻璃芯片的表面与所述外表面在同一平面，所述外表面用于引导切割玻璃芯片的切割刀轮下刀和起刀。
  2. 根据权利要求1所述的导向装置，其特征在于，所述导向压块包括排列摆放的至少三个子压块，其中，容纳所述玻璃芯片的边缘的子压块包括所述凹部和所述外表面，其余子压块的表面与所述凹部的底面处于同一平面。
  3. 根据权利要求1或2所述的导向装置，其特征在于，所述导向压块的材料包括邵氏硬度为75以下的材料。
  4. 根据权利要求3所述的导向装置，其特征在于，所述导向压块的材料包括尼龙材料。
  5. 一种切割设备，其特征在于，包括：
    导向压块，所述导向压块的导向侧包括凹部和外表面，当所述凹部容纳玻璃芯片时，所述玻璃芯片的表面与所述外表面在同一平面，所述外表面用于引导切割玻璃芯片的切割刀轮下刀和起刀；
    切割刀轮，用于在所述导向压块的外表面下刀和起刀，对所述导向压块的凹部容纳的玻璃芯片进行切割。
  6. 根据权利要求5所述的切割设备，其特征在于，
    所述导向压块包括排列摆放的至少三个子压块，其中，容纳所述玻璃芯片的边缘的子压块包括所述凹部和所述外表面，其余子压块的表面与所述凹部的底面处于同一平面。
  7. 根据权利要求5或6所述的切割设备，其特征在于，所述导向压块的材料包括邵氏硬度为75以下的材料。
  8. 根据权利要求7所述的切割设备，其特征在于，所述导向压块包括尼龙材料制成的导向压块。
PCT/CN2018/107406 2018-06-05 2018-09-25 一种导向装置及切割设备 WO2019232986A1 (zh)

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Citations (3)

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JP2002252187A (ja) * 2001-02-27 2002-09-06 Mitsubishi Electric Corp 半導体ウエハの切り出し装置およびこれを用いた半導体ウエハの切り出し方法
CN203225245U (zh) * 2013-05-06 2013-10-02 金杰 优质晶圆环
CN205473337U (zh) * 2016-03-29 2016-08-17 江西鹏飞机电制造有限公司 一种高强度手机玻璃节能高效全自动深加工生产线

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252187A (ja) * 2001-02-27 2002-09-06 Mitsubishi Electric Corp 半導体ウエハの切り出し装置およびこれを用いた半導体ウエハの切り出し方法
CN203225245U (zh) * 2013-05-06 2013-10-02 金杰 优质晶圆环
CN205473337U (zh) * 2016-03-29 2016-08-17 江西鹏飞机电制造有限公司 一种高强度手机玻璃节能高效全自动深加工生产线

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