WO2019228517A1 - Circuit board assembly, photoelectric module, depth camera and electronic device - Google Patents

Circuit board assembly, photoelectric module, depth camera and electronic device Download PDF

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Publication number
WO2019228517A1
WO2019228517A1 PCT/CN2019/089617 CN2019089617W WO2019228517A1 WO 2019228517 A1 WO2019228517 A1 WO 2019228517A1 CN 2019089617 W CN2019089617 W CN 2019089617W WO 2019228517 A1 WO2019228517 A1 WO 2019228517A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
heat dissipation
conductive element
disposed
bearing surface
Prior art date
Application number
PCT/CN2019/089617
Other languages
French (fr)
Chinese (zh)
Inventor
陈楠
陈孝培
陈华
Original Assignee
南昌欧菲生物识别技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201820840260.3U external-priority patent/CN208300114U/en
Priority claimed from CN201810551110.5A external-priority patent/CN110557880A/en
Application filed by 南昌欧菲生物识别技术有限公司 filed Critical 南昌欧菲生物识别技术有限公司
Publication of WO2019228517A1 publication Critical patent/WO2019228517A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N13/20—Image signal generators
    • H04N13/204—Image signal generators using stereoscopic image cameras
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Definitions

  • the present application relates to the field of consumer electronics, and more particularly, to a circuit board assembly, a photoelectric module, a depth camera, and an electronic device.
  • LED Light emitting diode
  • LED emitters of face recognition sensors have large currents / luminous power, so they generate large amounts of heat, especially in digital devices such as mobile phones. Excessive heat will cause the entire machine Problems such as high operating temperature and infrared laser band offset directly affect product performance.
  • Related technology LED lamps and laser emitters for face recognition sensors are bonded to a flexible printed circuit board (FPC) through silver paste, but the FPC contains polyimide, adhesive, solder resist ink, conductive Adhesive film, copper foil and other stacked materials, the average thermal conductivity is only ⁇ 0.38 watts / (meter ⁇ K) (W / (m ⁇ K)), the heat dissipation effect is poor.
  • Embodiments of the present application provide a circuit board assembly, a photoelectric module, a depth camera, and an electronic device.
  • the circuit board assembly includes a heat dissipation substrate, a circuit board, and a heating element.
  • the heat-dissipating substrate includes a bearing surface on which a first conductive element is formed; the circuit board is disposed on the heat-dissipating substrate and is electrically connected to the first conductive element; and the heating element is disposed on the The supporting surface is electrically connected to the circuit board through the first conductive element.
  • a circuit board and a heating element are disposed on a bearing surface of a heat dissipation substrate, and a first conductive element is provided on the heat dissipation substrate and electrically connected to the circuit board, so that the heat dissipation substrate having a strong heat dissipation effect becomes a circuit.
  • the extension of the board quickly conducts and evacuates through the heat-dissipating substrate after the heat generated by the heating element, and the heat-dissipating effect is good.
  • the first conductive element includes at least one pad, and the heating element is disposed on the pad.
  • the first conductive element can be a pad
  • the area of the pad is relatively large compared to the conventional conductive circuit, which is convenient for soldering and the connection is firm; moreover, the contact area between the pad and the heating element is larger, which can be faster Evacuates and absorbs the heat generated by the heating element to improve the heat dissipation effect.
  • the heat dissipation substrate includes an aluminum nitride AlN single-layer board, an aluminum nitride AlN multilayer co-fired circuit board, an aluminum oxide Al2O3 single-layer board, an aluminum oxide Al2O3 multilayer co-fired circuit board, or a low-temperature co-fired circuit board. Burned ceramic multilayer circuit board.
  • the thermal conductivity of aluminum nitride AlN single-layer boards is as high as 170W / (m ⁇ K) and the process is simple; aluminum nitride AlN
  • the thermal conductivity of multilayer co-fired circuit boards is as high as 170W / (m ⁇ K) and can be used for multilayer circuits; the thermal conductivity of aluminum oxide Al2O3 single-layer boards is higher, reaching 24W / (m ⁇ K) for single-layer circuits
  • the board process is simple and the cost is low; the thermal conductivity of the alumina Al2O3 multilayer co-fired circuit board is high, reaching 24W / (m ⁇ K) and the multilayer circuit can be taken, and the sintering process is simple; The conductivity is good, reaching 2.5W / (m ⁇ K), and the process is simple and the cost is low.
  • the heat dissipation substrate includes a copper alloy metal substrate, an aluminum alloy metal substrate, or a stainless steel alloy metal substrate.
  • the high thermal conductivity makes the heat dissipation efficiency high, and it can take single-layer lines, and the process is simple.
  • the aluminum alloy metal substrate has a thermal conductivity of up to 201 W / (m ⁇ K) and can be used for multi-layer lines. There are many traces and high thermal conductivity makes the heat dissipation efficiency high.
  • the stainless steel alloy metal substrate has a high thermal conductivity of 17 W / (m ⁇ K), can take single-layer lines, low cost, simple process, and high heat dissipation efficiency.
  • the thermal conductivity of the heat dissipation substrate is greater than or equal to 2.5 W / (m ⁇ K).
  • the thermal conductivity of the heat dissipation substrate is greater than or equal to 2.5W / (m ⁇ K), the thermal conductivity is higher, and the heat dissipation effect is good .
  • one end of the circuit board is disposed on the bearing surface and is located outside a region where the heating element is located.
  • the circuit board is disposed on the bearing surface and is located outside the area where the heating element is located, which is not only beneficial to reducing the thickness of the circuit board assembly, but also when the heat of the heating element is conducted and evacuated through the heat dissipation substrate, the thermal conductivity of the circuit board is not low. Impact on heat transfer and evacuation.
  • the heat dissipation substrate further includes a connection surface opposite to the bearing surface, the connection surface is provided with a second conductive element, and the heat dissipation substrate is provided with a plurality of through holes.
  • An inner wall is provided with a metal layer, the second conductive element and the first conductive element are electrically connected through a plurality of the metal layers, one end of the circuit board is disposed on the connection surface, and the circuit board covers the The second conductive element is electrically connected to the second conductive element.
  • the heating element cooperates with the metal layer, the first conductive element, and the second conductive element not only to realize the electrical connection with the circuit board, but also to quickly dissipate the heat of the heating element.
  • the circuit board assembly further includes a reinforcing plate, and the reinforcing plate is disposed on a surface of the circuit board opposite to the connection surface.
  • the reinforcing plate is disposed on a surface of the circuit board opposite to the connection surface, so that the strength of the connection area between the circuit board and the heat dissipation substrate can be strengthened.
  • the reinforcing plate is provided with a heat dissipation through hole, and the heat dissipation through hole corresponds to the circuit board and the heating element.
  • the heat dissipation through hole corresponds to the heating element, and can quickly conduct and dissipate the heat generated by the heating element.
  • the circuit board assembly further includes a heat-sensitive element, which is disposed on the bearing surface and is electrically connected to the first conductive element or the second conductive element.
  • the heat-sensitive element is set on the bearing surface, and can detect the temperature of the heat-dissipating substrate in real time, so as to deal with it when the temperature is abnormal, to prevent the circuit board components from being damaged by the high temperature.
  • the optoelectronic module of the present application includes the circuit board assembly according to any one of the above embodiments and an optical assembly provided on the circuit board assembly.
  • the circuit board assembly includes a heat dissipation substrate, a circuit board, and a heating element; the heat dissipation substrate includes a bearing surface on which a first conductive element is formed; and the circuit board is disposed on the heat dissipation substrate and communicates with the heat dissipation substrate.
  • the first conductive element is electrically connected; the heating element is disposed on the bearing surface and is electrically connected to the circuit board through the first conductive element; the optical component corresponds to the circuit board component.
  • the optoelectronic module provides a circuit board and a heating element on a bearing surface of a heat dissipation substrate, and a first conductive element is provided on the heat dissipation substrate and is electrically connected to the circuit board, so that the heat dissipation substrate having a strong heat dissipation effect becomes a circuit.
  • the extension of the board quickly conducts and evacuates through the heat-dissipating substrate after the heat generated by the heating element, and the heat-dissipating effect is good.
  • the depth camera of the present application includes the photoelectric module, the image acquisition device, and the processor according to any one of the foregoing embodiments.
  • the photovoltaic module includes a circuit board assembly and an optical assembly provided on the circuit board assembly, and the optical assembly corresponds to the circuit board assembly;
  • the circuit board assembly includes a heat dissipation substrate, a circuit board, and a heating element;
  • the heat-dissipating substrate includes a bearing surface on which a first conductive element is formed;
  • the circuit board is disposed on the heat-dissipating substrate and is electrically connected to the first conductive element; and the heating element is disposed on the bearing And the first conductive element is electrically connected to the circuit board on the surface;
  • the heating element is a light source and is used for emitting laser light
  • the optical component includes a light beam generator provided on the circuit board component, the light beam A generator corresponds to the light source interval and is used to convert the laser light into a laser pattern.
  • the image acquisition device is
  • the depth camera according to the embodiment of the present application provides a circuit board and a heating element on a bearing surface of a heat dissipation substrate, and a first conductive element is provided on the heat dissipation substrate and is electrically connected to the circuit board, so that the heat dissipation substrate with a strong heat dissipation effect becomes a circuit board. After the heat is generated by the heating element, it is quickly conducted and evacuated through the heat dissipation substrate, and the heat dissipation effect is good.
  • An electronic device includes a casing and the depth camera according to any one of the foregoing embodiments.
  • the depth camera is disposed inside the casing and is exposed from the casing to acquire a depth image.
  • the depth camera includes a photoelectric module, an image collector, and a processor.
  • the photovoltaic module includes a circuit board assembly and an optical assembly provided on the circuit board assembly, and the optical assembly corresponds to the circuit board assembly;
  • the circuit board assembly includes a heat dissipation substrate, a circuit board, and a heating element;
  • the heat-dissipating substrate includes a bearing surface on which a first conductive element is formed;
  • the circuit board is disposed on the heat-dissipating substrate and is electrically connected to the first conductive element;
  • the heating element is disposed on the bearing And the first conductive element is electrically connected to the circuit board on the surface;
  • the heating element is a light source and is used for emitting laser light, and
  • the optical component includes a light beam generator provided on the circuit board component, the light beam
  • the generator corresponds to the light source interval and is used to convert the laser to form a laser pattern;
  • the image collector is used to collect the laser pattern projected by the photoelectric module;
  • the processor is respectively connected to the photoelectric module and the laser module;
  • a circuit board and a heating element are disposed on a bearing surface of a heat dissipation substrate, and a first conductive element is provided on the heat dissipation substrate and electrically connected to the circuit board, so that the heat dissipation substrate having a strong heat dissipation effect becomes a circuit board. After the heat is generated by the heating element, it is quickly conducted and evacuated through the heat dissipation substrate, and the heat dissipation effect is good.
  • FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a depth camera according to an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a photovoltaic module according to an embodiment of the present application.
  • FIG. 4 is a schematic plan view of a circuit board assembly according to an embodiment of the present application.
  • FIG. 5 is a schematic plan view of the circuit board assembly in FIG. 4 from another perspective;
  • FIG. 6 is a schematic plan view of another perspective of the circuit board assembly in FIG. 4;
  • FIG. 7 is a schematic structural diagram of a photovoltaic module according to another embodiment of the present application.
  • FIG. 8 is a schematic plan view of a circuit board assembly according to another embodiment of the present application.
  • FIG. 9 is a schematic plan view of the circuit board assembly in FIG. 8 from another perspective;
  • FIG. 10 is a schematic plan view of another perspective of the circuit board assembly in FIG. 8;
  • FIG. 11 is a schematic structural diagram of a photovoltaic module according to still another embodiment of the present application.
  • FIG. 12 is a schematic structural diagram of a photovoltaic module according to another embodiment of the present application.
  • the first feature "on” or “down” of the second feature may be the first and second features in direct contact, or the first and second features indirectly through an intermediate medium. contact.
  • the first feature is “above”, “above”, and “above” the second feature.
  • the first feature is directly above or obliquely above the second feature, or it only indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature.
  • the first feature may be directly below or obliquely below the second feature, or it may simply indicate that the first feature is less horizontal than the second feature.
  • an electronic device 1000 includes a housing 200 and a depth camera 100.
  • the electronic device 1000 may be a mobile phone, a tablet computer, a laptop computer, a game console, a headset device, an access control system, a teller machine, etc.
  • the embodiment of the present application is described using the electronic device 1000 as a mobile phone. It can be understood that the specific form of the electronic device 1000 It can be other, and there is no limitation here.
  • the depth camera 100 is disposed in the case 200 and exposed from the case 200 to obtain a depth image.
  • the case 200 can provide protection to the depth camera 100 from dust, water, and drop.
  • the case 200 is provided corresponding to the depth camera 100. To allow light to pass through the hole or into the housing 200.
  • the depth camera 100 includes a photoelectric module 10 (in this case, the photoelectric module 10 is a structured light projection module), an image collector 20 and a processor 30.
  • the depth camera 100 may be formed with a projection window 40 corresponding to the photoelectric module 10 and an acquisition window 50 corresponding to the image collector 20.
  • the photoelectric module 10 is configured to project a laser pattern onto a target space through the projection window 40.
  • the laser pattern is coded structured light (a coding pattern composed of a limited set of unique sub-patterns), for example, a two-dimensional coded structured light pattern.
  • the laser pattern is called a reference pattern, and each of the reference patterns is unique.
  • the patterns in the pattern window are unique.
  • the image collector 20 is configured to collect a laser pattern modulated by a target object, that is, an imaging pattern, through an acquisition window 50.
  • the laser light projected by the photoelectric module 10 is infrared light
  • the image collector 20 is an infrared camera.
  • the processor 30 is connected to both the photoelectric module 10 and the image acquisition device 20.
  • the processor 30 is configured to process an imaging pattern to obtain a depth image. Specifically, the processor 30 decodes the encoded imaging pattern to find the correspondence between each pixel in the imaging pattern and the corresponding pixel in the reference pattern, and further obtains a depth image of the laser pattern according to the correspondence.
  • the above-mentioned photoelectric module 10 is a 3D depth-of-field camera module, such as a structured light projection module 10, a time of flight (TOF) imaging module, and the like; of course, the photoelectric module 10 may also be another imaging module, such as a person
  • the face recognition sensor module is specifically a camera module; the photoelectric module 10 may also be a pure light source transmitter, such as an LED, a car lamp, and the like. It can be understood that the specific form of the photovoltaic module 10 may also be other devices, such as any component with a large amount of heat, which is not limited herein.
  • the photoelectric module 10 is a structured light projection module 10.
  • the structured light projection module 10 is configured to project a laser pattern onto a target space.
  • the laser pattern may be a speckle pattern or a coding pattern.
  • a depth image of the target object in the target space can be obtained.
  • the structured light projection module 10 includes a circuit board assembly 11, a lens barrel 12, and an optical assembly 13.
  • the circuit board assembly 11 includes a heat radiating substrate 111, a circuit board 112, a heating element 113, and a thermal element 114.
  • the heat-dissipating substrate 111 includes a bearing surface 1111 on which a first conductive element 1113 is formed.
  • the circuit board 112 is disposed on the heat-dissipating substrate 111 and is electrically connected to the first conductive element 1113.
  • the heating element 113 is disposed on the heat dissipation substrate 111 and is electrically connected to the circuit board 112 through the first conductive element 1113.
  • the heat dissipation substrate 111 includes a bearing surface 1111, a connection surface 1112 opposite to the bearing surface 1111, and a first conductive element 1113 formed on the bearing surface 1111.
  • the supporting surface 1111 of the heat dissipation substrate 111 is used to support the lens barrel 12 and the heating element 113.
  • the first conductive element 1113 includes at least one pad 1114.
  • the heating element 113 is disposed on the pad 1114.
  • the heating element 113 is connected to the heat dissipation substrate 111 through the pad 1114. Since the first conductive element 1113 may be the pad 1114, the pad 1114 Compared with conventional conductive lines, the area is relatively large, which is convenient for soldering and has a strong connection.
  • the contact area between the pad 1114 and the heating element 113 is large, which can more quickly evacuate and absorb the heat generated by the heating element 113 and improve heat dissipation. effect.
  • the heat radiation substrate 111 may be a ceramic substrate or a metal substrate.
  • the ceramic substrate is made of ceramic materials.
  • the ceramic materials include aluminum nitride (AlN) single-layer boards, aluminum nitride (AlN) multilayer co-fired circuit boards, aluminum oxide (Al2O3) single-layer boards, and aluminum oxide (Al2O3) multilayers. Either a co-fired circuit board or a low-temperature co-fired ceramic multilayer circuit board.
  • the thermal conductivity of aluminum (AlN) single-layer boards is relatively high, and the high thermal conductivity results in high heat dissipation efficiency, and the single-layer circuit board has a simple process and low cost
  • the thermal conductivity of aluminum nitride (AlN) multilayer co-fired circuit boards is as high as 170W / (m ⁇ K), high thermal conductivity enables high heat dissipation efficiency, and can be used for multi-layer lines, with more wires
  • aluminum oxide (Al2O3) single-layer board has a higher thermal conductivity, reaching 24W / (m ⁇ K)
  • the high thermal conductivity makes the heat dissipation efficiency high, and the single-layer circuit board has a simple process and
  • the thermal conductivity of the alumina (Al2O3) multilayer co-fired circuit board is high, reaching 24W / (m ⁇ K).
  • the high thermal conductivity makes The heat dissipation efficiency is high, and multi-layer lines can be routed.
  • the low-temperature co-fired ceramic multilayer circuit board has a good thermal conductivity coefficient of 2.5 W / (m ⁇ K), a simple process, low cost, and high heat dissipation efficiency.
  • the metal substrate is made of a metal material, and the metal material includes any one of a copper alloy metal substrate, an aluminum alloy metal substrate, and a stainless steel alloy metal substrate.
  • the aluminum alloy metal substrate has a thermal conductivity of up to 201 W / (m ⁇ K) and can be used for multi-layer lines. There are many traces and high thermal conductivity makes the heat dissipation efficiency high.
  • the stainless steel alloy metal substrate has a high thermal conductivity of 17 W / (m ⁇ K), can take single-layer lines, low cost, simple process, and high heat dissipation efficiency.
  • the first conductive element 1113 can be formed by etching on the bearing surface 1111 of the heat dissipation substrate 111.
  • the heating element 113 is mounted on the pad 1114 through a conductive silver paste. The heat generated by the heating element 113 passes through the pad 1114 and the ceramic.
  • the substrate is evacuated and absorbed; when a metal substrate is used, the heat-dissipating substrate 111 is treated with nickel-palladium gold or chemical nickel-gold to obtain a first conductive element 1113.
  • the heating element 113 is attached to the pad 1114.
  • the heat generated by the heating element 113 is passed through soldering.
  • the disc 1114 and the metal substrate are evacuated and absorbed.
  • other suitable materials can also be used, as long as the thermal conductivity coefficient is required to be greater than or equal to 2.5 W / (m ⁇ K).
  • the material of the heat dissipation substrate 111 according to the embodiment of the present application is a single layer of aluminum nitride (AlN).
  • the circuit board 112 is disposed on the bearing surface 1111 and is located outside the area where the heating element 113 is located, that is, the circuit board 112 and the heating element 113 are both located on the bearing surface 1111 and do not overlap each other.
  • the circuit board 112 is not disposed on the heat dissipation substrate 111.
  • On the connecting surface 1112 not only is it beneficial to reduce the overall thickness of the circuit board assembly 11, and when the heat of the heating element 113 is conducted and evacuated through the heat dissipation substrate 111, the heat conduction and heat dissipation of the circuit board 112 will not be affected. Evacuation affects.
  • the circuit board 112 may be any one of a printed circuit board, a flexible circuit board, and a rigid-flexible board.
  • the circuit board 112 is a flexible circuit board.
  • the circuit board 112 is mounted on the bearing surface 1111 by a hotbar (hot-melt soldering) process.
  • the principle of the hotbar (hot-melt soldering) is to first print a solder paste on the circuit board 112 and then use heat to solder the solder. Melt and connect the two electronic components that need to be connected.
  • the circuit board assembly 11 formed by the Hotbar process is usually a flexible board (FPC) soldered to the circuit board 112, which can not only achieve lightness, thinness, shortness, and smallness, but also because one or two flexible board connectors can be used less ( FPC (connector) and effectively reduce costs.
  • FPC flexible board
  • the heating element 113 may be a light source 113, and the light source 113 may be a laser emitter.
  • the laser emitter may be a vertical cavity surface emitting laser (VCSEL).
  • the VCSEL includes a semiconductor substrate and a light emitting element disposed on the substrate.
  • the substrate may be provided with a single light emitting element or an array laser composed of a plurality of light emitting elements.
  • the plurality of light emitting elements may be arranged on the substrate in the form of a regular or irregular two-dimensional pattern.
  • the heating element 113 may also include other electronic components, such as a photodetector, a temperature sensor, and the like.
  • the thermal element 114 is disposed on the bearing surface 1111 and is electrically connected to the first conductive element 1113.
  • the circuit board 112 is electrically connected to the first conductive element 1113, so that the thermal element 114 is electrically connected to the circuit board 112.
  • the thermal element 114 detects the temperature of the heat dissipation substrate 111 in real time, and the processor 30 controls the working power of the heat generating element 113 (light source 113) according to the temperature condition. For example, the power of the heating element 113 (light source 113) is reduced when the temperature is too high to prevent the circuit board assembly 11 from being damaged by the high temperature.
  • the lens barrel 12 is carried on the circuit board assembly 11 and forms a receiving cavity 121 together with the circuit board assembly 11.
  • One end of the circuit board 112 is disposed on the bearing surface 1111 of the heat dissipation substrate 111 and is located outside the lens barrel 12.
  • the other end of the circuit board 112 and The connector 60 is connected.
  • the connector 60 can connect the structured light projection module 10 to the main board of the electronic device 1000 in the embodiment of FIG. 1.
  • the material of the lens barrel 12 may be plastic, and the light source 113 and the optical component 13 are both contained in the receiving cavity 121.
  • the light source 113 is used to emit laser light.
  • the optical component 13 is used to diffract the laser light to form a laser pattern.
  • the optical component 13 may include a collimation element 131 and a diffractive element 132 (Diffractive Optical Elements).
  • the collimating element 131 is used for converging or collimating the laser light emitted from the light source 113, and a diffraction structure capable of diffracting the laser light after passing through the collimating element 131 is formed on the diffractive element 132.
  • the laser light emitted by the VCSEL passes through the collimating element 131 and the diffractive element 132 in order, and then projects a laser pattern outward.
  • the electronic device 1000, the depth camera 100, the optoelectronic module 10, and the circuit board assembly 11 are arranged on the bearing surface 1111 of the heat dissipation substrate 111 by placing the circuit board 112 and the heating element 113 on the heat dissipation substrate.
  • the first conductive element 1113 is provided on 111 and is electrically connected to the circuit board 112, so that the heat-dissipating substrate 111 having a strong heat dissipation effect is an extension of the circuit board 112. After the heat generating element 113 generates heat, it is quickly conducted and evacuated through the heat-dissipating substrate 111, and the heat dissipation effect is good. .
  • the circuit board assembly 11 in the structured light projection module 10 is not limited to that described in the above embodiment.
  • the structure of the circuit board assembly 11 may also be as follows: the heat dissipation substrate 111 includes a bearing surface 1111, A connection surface 1112 opposite to the bearing surface 1111, a first conductive element 1113 formed on the bearing surface 1111, a second conductive element 1115 formed on the connection surface 1112, and a metal layer 1117.
  • the material of the heat-dissipating substrate 111 is the same as before, and it may be a ceramic substrate or a metal substrate, which is not repeated here.
  • the heat dissipation substrate 111 is provided with a plurality of through holes 1116 penetrating the bearing surface 1111 to the connecting surface 1112.
  • a metal layer 1117 is provided on an inner wall of the through hole 1116.
  • the second conductive element 1115 and the first conductive element 1113 pass through the metal of the plurality of through holes 1116.
  • the layer 1117 is electrically connected, which can realize the electrical connection between the first conductive element 1113 and the second conductive element 1115, and also conduct heat, and the heat emitted from the heating element 113 and conducted to the first conductive element 1113 is conducted to the metal layer 1117.
  • the second conductive element 1115 is thereby evacuated from the heat of the heating element 113.
  • the number of through-holes 1116 is determined according to the heat dissipation requirements.
  • the metal layer 1117 is a material that is both thermally and electrically conductive, such as at least one of metallic iron, copper, and silver.
  • One end of the circuit board 112 is disposed on the connection surface 1112 and covers the second conductive element 1115. Since the circuit board 112 covers the second conductive element 1115, the combined area of the two is large, which can ensure the bonding strength.
  • the second conductive element 1115 includes at least one pad 1118.
  • the circuit board 112 is mounted on the pad 1118 by a Surface Mount Technology (SMT) process. The processing difficulty is low, the bonding yield is high, and automation is easy to implement. .
  • SMT Surface Mount Technology
  • the circuit board 112 is electrically connected to the second conductive element 1115.
  • the second conductive element 1115, the metal layer 1117, and the first conductive element 1113 can be matched to electrically connect the circuit board 112 and the heating element 113.
  • the circuit board assembly 11 may further include a reinforcing plate 115.
  • the reinforcing plate 115 is disposed on the surface of the circuit board 112 opposite to the connecting surface 1112, that is, the circuit board 112 is located between the connecting surface 1112 and the reinforcing plate 115.
  • the reinforcing plate 115 can strengthen the circuit board 112 and The strength of the connection area of the heat radiation substrate 111.
  • the reinforcing plate 115 is provided with a plurality of heat dissipation through holes 1152.
  • the heat dissipation through holes 1152 correspond to the circuit board 112 and the heating element 113, and may correspond to only the area on the circuit board 112 directly facing the heating element 113, or may correspond to the circuit board.
  • the reinforcing plate 115 may only have one heat dissipation through hole 1152, and the circuit board 112 may have vias. At this time, the pads 1118 of the second conductive element of the heat dissipation substrate 111 pass through the vias and the heat dissipation holes of the circuit board 112. The hole 1152 is exposed from the surface of the reinforcing plate 115 away from the circuit board 112.
  • the heat generated during the operation of the heating element 113 can be sequentially dissipated through the first conductive element 1113, the metal layer 1117, and the second conductive element 1115 (including the pad 1118).
  • the reinforcing plate 115 may be a metal, such as copper, iron, or a copper alloy, etc., which is convenient for processing and has good thermal conductivity. Of course, the reinforcing plate 115 may also be other materials, as long as it meets the strength requirements and heat dissipation requirements.
  • the reinforcing plate 115 according to the embodiment of the present application is a copper alloy reinforcing plate.
  • the thermal element 114 is disposed on the bearing surface 1111 and is electrically connected to the second conductive element 1115, and the circuit board 112 is electrically connected to the second conductive element 1115, so that the thermal element 114 is electrically connected to the circuit board 112.
  • the thermal element 114 detects the temperature of the heat dissipation substrate 111 in real time, and the processor 30 controls the working power of the heating element 113 according to the temperature condition. For example, the power of the heating element 113 is reduced when the temperature is too high to prevent the circuit board assembly 11 from being damaged by the high temperature.
  • the structures and working principles of the lens barrel 12 and the optical component 13 are the same as those described above, and are not repeated here.
  • the electronic device 1000, the depth camera 100, the optoelectronic module 10, and the circuit board assembly 11 are provided on the supporting surface 1111 of the heat dissipation substrate 111 by disposing the circuit board 112 and the heating element 113 on the heat dissipation substrate.
  • a first conductive element 1113 is provided on 111 and is electrically connected to the circuit board 112, so that a heat-dissipating substrate with a strong heat dissipation effect is an extension of the circuit board 112. After the heat is generated by the heating element 113, it is quickly conducted and evacuated through the heat-dissipating substrate 111 and the reinforcing plate 115. , Good cooling effect.
  • a thermally conductive material such as a thermally conductive adhesive is disposed inside the through hole 1116 and the heat dissipation through hole 1152. In this way, the speed of heat evacuation can be accelerated, and the heat dissipation effect can be improved.
  • the photoelectric module 10 may be a camera module.
  • the camera module can be a visible light camera module or an infrared camera module.
  • the camera module includes a circuit board assembly 11, a lens barrel 12, and an optical assembly 13.
  • the circuit board assembly 11 may be the circuit board assembly shown in FIG. 4 to FIG. 6 (shown in FIG. 11), or the circuit board assembly shown in FIG. 8 to FIG. 10 (shown in FIG.
  • the heating element 113 may be a complementary metal oxide semiconductor (CMOS, Complementary, Oxide, Semiconductor) image sensor chip or a charge-coupled device (CCD, Charge-coupled device) image sensor
  • CMOS complementary metal oxide semiconductor
  • CCD charge-coupled device
  • the chip and the lens barrel 12 are carried on the circuit board assembly 11 and form a receiving cavity 121 together with the circuit board assembly 11.
  • the connection manner of the lens barrel 12 and the circuit board assembly 11 includes gluing and engaging.
  • Both the image sensor chip 113 and the optical component 13 are housed in the lens barrel 12.
  • the optical component 13 includes a lens 133, and the image sensing chip 113 is disposed on the image side of the lens 133.
  • the optical axis of the optical component 13 coincides with the center normal of the image sensing chip 113.
  • the lens 133 may be a separate lens, which is a convex lens or a concave lens; or a plurality of lenses, each of which may be a convex lens or a concave lens, or part of a convex lens, and part of a concave lens.
  • the optical component 13 further includes a filter 134, such as an infrared cut filter (the optoelectronic module 10 is a visible light camera module at this time), and the filter 134 is used to adjust the imaging
  • the wavelength range of light is specifically used to filter out infrared light in natural light so that it cannot enter the circuit board assembly 11, thereby preventing infrared light from affecting the color and sharpness of the image formed by visible light imaging.
  • the filter 134 can also be an infrared pass filter (the photoelectric module 10 is an infrared camera module at this time).
  • the filter 134 is used to adjust the wavelength range of the imaging light, and is specifically used to allow only infrared light to enter.
  • the circuit board assembly 11 (blocks visible light from entering the circuit board assembly 11) to ensure the color and sharpness of the image formed by infrared light imaging.
  • the filter 134 is received in the receiving cavity 121 and is disposed between the circuit board assembly 11 and the optical assembly 13. When the photoelectric module 10 is operating, the light reflected by the target object enters the photoelectric module 10, passes through the lens 133, the filter 134, and images on the image sensing chip 113 in this order.
  • the present application further provides an electronic device 1000 including the photoelectric module 10 in FIG. 11 or FIG. 12.
  • the optoelectronic module 10 described above as a camera module can also be applied to the electronic device 1000.
  • the photoelectric module 10 may be used to acquire a visible light image or an infrared light image and the like.
  • the electronic device 1000, the optoelectronic module 10, and the circuit board assembly 11 are provided with the circuit board 112 and the heating element 113 on the bearing surface 1111 of the heat dissipation substrate 111, and a first A conductive element 1113 is electrically connected to the circuit board 112, so that the heat-dissipating substrate having a strong heat-dissipating effect becomes an extension of the circuit board 112.
  • the heat-generating element 113 After the heat-generating element 113 generates heat, it is quickly conducted and evacuated through the heat-dissipating substrate 111, and the heat-dissipating effect is good.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality" is at least two, for example, two, three, unless it is specifically and specifically defined otherwise.

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Abstract

A circuit board assembly (11), a photoelectric module (10), a depth camera (100) and an electronic device (1000). The circuit board assembly (11) comprises a heat-radiating substrate (111), a circuit board (112) and a heat-generating element (113), wherein the heat-radiating substrate (111) comprises a bearing surface (1111) and a first conductive element (1113) is formed on the bearing surface (1111); the circuit board (112) is provided on the heat-radiating substrate (111) and is electrically connected to the first conductive element (1113); and the heat-generating element (113) is provided on the bearing surface (1111) and is electrically connected to the circuit board (112) by means of the first conductive element (1113).

Description

电路板组件、光电模组、深度相机和电子装置Circuit board components, optoelectronic modules, depth cameras and electronics
优先权信息Priority information
本申请请求2018年5月31日向中国国家知识产权局提交的专利申请号为201810551110.5的专利申请、及专利申请号为201820840260.3的专利申请的优先权和权益，并且通过参照将其全文并入此处。This application requests the priority and rights of the patent application with the patent application number 201810551110.5 and the patent application with the patent application number 201820840260.3 filed with the State Intellectual Property Office of the People's Republic of China on May 31, 2018, and the entire contents of which are hereby incorporated by reference .
技术领域Technical field
本申请涉及消费性电子领域，更具体而言，涉及一种电路板组件、光电模组、深度相机及电子装置。The present application relates to the field of consumer electronics, and more particularly, to a circuit board assembly, a photoelectric module, a depth camera, and an electronic device.
背景技术Background technique
由于发光二极体(Light Emitting Diode，LED)灯、人脸识别传感器的激光发射器的电流/发光功率大，故发热量大，尤其是在手机等数码，过大的发热量会造成整机工作温度高、红外激光波段偏移等问题，直接影响产品性能。相关技术的LED灯、人脸识别传感器的激光发射器通过银浆固晶与柔性电路板(Flexible Printed Circuit，FPC)贴合，但FPC中含有聚酰亚胺、黏合剂、阻焊油墨、导电胶膜和铜箔等堆叠材料，平均热导系数仅≤0.38瓦特/(米·开)(W/(m·K))，散热效果差。Light emitting diode (LED) lights and laser emitters of face recognition sensors have large currents / luminous power, so they generate large amounts of heat, especially in digital devices such as mobile phones. Excessive heat will cause the entire machine Problems such as high operating temperature and infrared laser band offset directly affect product performance. Related technology LED lamps and laser emitters for face recognition sensors are bonded to a flexible printed circuit board (FPC) through silver paste, but the FPC contains polyimide, adhesive, solder resist ink, conductive Adhesive film, copper foil and other stacked materials, the average thermal conductivity is only ≤ 0.38 watts / (meter · K) (W / (m · K)), the heat dissipation effect is poor.
发明内容Summary of the Invention
本申请实施方式提供一种电路板组件、光电模组、深度相机及电子装置。Embodiments of the present application provide a circuit board assembly, a photoelectric module, a depth camera, and an electronic device.
本申请实施方式的电路板组件包括散热基板、电路板及发热元件。所述散热基板包括承载面，所述承载面上形成有第一导电元件；所述电路板设置在所述散热基板上并与所述第一导电元件电连接；所述发热元件设置在所述承载面上并通过所述第一导电元件与所述电路板电连接。The circuit board assembly according to the embodiment of the present application includes a heat dissipation substrate, a circuit board, and a heating element. The heat-dissipating substrate includes a bearing surface on which a first conductive element is formed; the circuit board is disposed on the heat-dissipating substrate and is electrically connected to the first conductive element; and the heating element is disposed on the The supporting surface is electrically connected to the circuit board through the first conductive element.
本申请实施方式的电路板组件通过将电路板和发热元件设置在散热基板的承载面上，且在散热基板上设置第一导电元件且与电路板电连接，使得散热效果强的散热基板成为电路板的延伸，在发热元件产生热量后通过散热基板快速传导和疏散，散热效果好。In the circuit board assembly according to the embodiment of the present application, a circuit board and a heating element are disposed on a bearing surface of a heat dissipation substrate, and a first conductive element is provided on the heat dissipation substrate and electrically connected to the circuit board, so that the heat dissipation substrate having a strong heat dissipation effect becomes a circuit. The extension of the board quickly conducts and evacuates through the heat-dissipating substrate after the heat generated by the heating element, and the heat-dissipating effect is good.
在某些实施方式中，所述第一导电元件包括至少一个焊盘，所述发热元件设置在所述焊盘上。In some embodiments, the first conductive element includes at least one pad, and the heating element is disposed on the pad.
由于第一导电元件可以是焊盘，焊盘相对于常规的导电线路而言，面积相对较大， 方便焊接且连接比较牢固；而且，焊盘与发热元件的接触面积较大，可以更快速的对发热元件产生的热量疏散和吸收，提升散热效果。Because the first conductive element can be a pad, the area of the pad is relatively large compared to the conventional conductive circuit, which is convenient for soldering and the connection is firm; moreover, the contact area between the pad and the heating element is larger, which can be faster Evacuates and absorbs the heat generated by the heating element to improve the heat dissipation effect.
在某些实施方式中，所述散热基板包括氮化铝AlN单层板、氮化铝AlN多层共烧线路板、氧化铝Al2O3单层板、氧化铝Al2O3多层共烧线路板或低温共烧陶瓷多层线路板。In some embodiments, the heat dissipation substrate includes an aluminum nitride AlN single-layer board, an aluminum nitride AlN multilayer co-fired circuit board, an aluminum oxide Al2O3 single-layer board, an aluminum oxide Al2O3 multilayer co-fired circuit board, or a low-temperature co-fired circuit board. Burned ceramic multilayer circuit board.
相对于常规柔性电路板的热导系数(<＝0.38W/(m·K))，氮化铝AlN单层板的热导系数高达170W/(m·K)且工艺简单；氮化铝AlN多层共烧线路板的热导系数高达170W/(m·K)且可走多层线路；氧化铝Al2O3单层板的热导系数较高，达到24W/(m·K)，单层线路板工艺简单，成本低；氧化铝Al2O3多层共烧线路板热导系数较高，达到24W/(m·K)并可走多层线路，烧结工艺简单；低温共烧陶瓷多层线路板热导系数良，达到2.5W/(m·K)，工艺简单成本低。Relative to the thermal conductivity of conventional flexible circuit boards (<= 0.38W / (m · K)), the thermal conductivity of aluminum nitride AlN single-layer boards is as high as 170W / (m · K) and the process is simple; aluminum nitride AlN The thermal conductivity of multilayer co-fired circuit boards is as high as 170W / (m · K) and can be used for multilayer circuits; the thermal conductivity of aluminum oxide Al2O3 single-layer boards is higher, reaching 24W / (m · K) for single-layer circuits The board process is simple and the cost is low; the thermal conductivity of the alumina Al2O3 multilayer co-fired circuit board is high, reaching 24W / (m · K) and the multilayer circuit can be taken, and the sintering process is simple; The conductivity is good, reaching 2.5W / (m · K), and the process is simple and the cost is low.
在某些实施方式中，所述散热基板包括铜合金金属基板、铝合金金属基板或不锈钢合金金属基板。In some embodiments, the heat dissipation substrate includes a copper alloy metal substrate, an aluminum alloy metal substrate, or a stainless steel alloy metal substrate.
铜合金金属基板热导系数高达385W/(m·K)，相较于传统柔性电路板的热导系数(<＝0.38W/(m·K))，铜合金金属基板的热导系数较高，高导热率使得散热效率高，而且可走单层线路，工艺简单。铝合金金属基板热导系数高达201W/(m·K)且可走多层线路，走线多，高导热率使得散热效率高；不锈钢合金金属基板热导系数较高，达到17W/(m·K)，可走单层线路，成本低且工艺简单，散热效率较高。The thermal conductivity of copper alloy metal substrates is as high as 385W / (m · K), which is higher than that of traditional flexible circuit boards (<= 0.38W / (m · K)). The high thermal conductivity makes the heat dissipation efficiency high, and it can take single-layer lines, and the process is simple. The aluminum alloy metal substrate has a thermal conductivity of up to 201 W / (m · K) and can be used for multi-layer lines. There are many traces and high thermal conductivity makes the heat dissipation efficiency high. The stainless steel alloy metal substrate has a high thermal conductivity of 17 W / (m · K), can take single-layer lines, low cost, simple process, and high heat dissipation efficiency.
在某些实施方式中，所述散热基板的热导系数大于或等于2.5W/(m·K)。In some embodiments, the thermal conductivity of the heat dissipation substrate is greater than or equal to 2.5 W / (m · K).
相对于常规柔性电路板的热导系数(<＝0.38W/(m·K))，散热基板的热导系数大于或等于2.5W/(m·K)，热导系数较高，散热效果好。Relative to the thermal conductivity of a conventional flexible circuit board (<= 0.38W / (m · K)), the thermal conductivity of the heat dissipation substrate is greater than or equal to 2.5W / (m · K), the thermal conductivity is higher, and the heat dissipation effect is good .
在某些实施方式中，所述电路板的一端设置在所述承载面上且位于所述发热元件所在区域之外。In some embodiments, one end of the circuit board is disposed on the bearing surface and is located outside a region where the heating element is located.
电路板设置在承载面上且位于发热元件所在区域之外，不仅有利于减小电路板组件的厚度，且发热元件的热量通过散热基板传导和疏散时，不会因电路板热导系数较低对热量的传导和疏散造成影响。The circuit board is disposed on the bearing surface and is located outside the area where the heating element is located, which is not only beneficial to reducing the thickness of the circuit board assembly, but also when the heat of the heating element is conducted and evacuated through the heat dissipation substrate, the thermal conductivity of the circuit board is not low. Impact on heat transfer and evacuation.
在某些实施方式中，所述散热基板还包括与所述承载面相背的连接面，所述连接面设置有第二导电元件，所述散热基板开设有多个通孔，所述通孔的内壁设置有金属层，所述第二导电元件与所述第一导电元件通过多个所述金属层电连接，所述电路板的一端设置在所述连接面上，所述电路板覆盖所述第二导电元件并与所述第二导电元件电连接。In some embodiments, the heat dissipation substrate further includes a connection surface opposite to the bearing surface, the connection surface is provided with a second conductive element, and the heat dissipation substrate is provided with a plurality of through holes. An inner wall is provided with a metal layer, the second conductive element and the first conductive element are electrically connected through a plurality of the metal layers, one end of the circuit board is disposed on the connection surface, and the circuit board covers the The second conductive element is electrically connected to the second conductive element.
发热元件通过金属层、第一导电元件及第二导电元件配合不仅可以实现与电路板 的电连接，还可以将发热元件的热量快速疏散。The heating element cooperates with the metal layer, the first conductive element, and the second conductive element not only to realize the electrical connection with the circuit board, but also to quickly dissipate the heat of the heating element.
在某些实施方式中，所述电路板组件还包括补强板，所述补强板设置在所述电路板的与所述连接面相背的表面上。In some embodiments, the circuit board assembly further includes a reinforcing plate, and the reinforcing plate is disposed on a surface of the circuit board opposite to the connection surface.
如此，补强板设置在在所述电路板的与所述连接面相背的表面上可以加强电路板与散热基板连接区域的强度。In this way, the reinforcing plate is disposed on a surface of the circuit board opposite to the connection surface, so that the strength of the connection area between the circuit board and the heat dissipation substrate can be strengthened.
在某些实施方式中，所述补强板开设有散热通孔，所述散热通孔与所述电路板及所述发热元件对应。In some embodiments, the reinforcing plate is provided with a heat dissipation through hole, and the heat dissipation through hole corresponds to the circuit board and the heating element.
散热通孔与发热元件对应，可以将发热元件产生的热量快速传导和疏散。The heat dissipation through hole corresponds to the heating element, and can quickly conduct and dissipate the heat generated by the heating element.
在某些实施方式中，所述电路板组件还包括热敏元件，所述热敏元件设置在所述承载面上并与所述第一导电元件或第二导电元件电连接。In some embodiments, the circuit board assembly further includes a heat-sensitive element, which is disposed on the bearing surface and is electrically connected to the first conductive element or the second conductive element.
热敏元件设置在承载面上，可以实时检测散热基板的温度，从而在温度异常时进行相应的处理，防止温度过高损坏电路板组件。The heat-sensitive element is set on the bearing surface, and can detect the temperature of the heat-dissipating substrate in real time, so as to deal with it when the temperature is abnormal, to prevent the circuit board components from being damaged by the high temperature.
本申请的光电模组包括上述任一实施方式的电路板组件和设置在所述电路板组件上的光学组件。所述电路板组件包括散热基板、电路板和发热元件；所述散热基板包括承载面，所述承载面上形成有第一导电元件；所述电路板设置在所述散热基板上并与所述第一导电元件电连接；所述发热元件设置在所述承载面上并通过所述第一导电元件与所述电路板电连接；所述光学组件与所述电路板组件对应。The optoelectronic module of the present application includes the circuit board assembly according to any one of the above embodiments and an optical assembly provided on the circuit board assembly. The circuit board assembly includes a heat dissipation substrate, a circuit board, and a heating element; the heat dissipation substrate includes a bearing surface on which a first conductive element is formed; and the circuit board is disposed on the heat dissipation substrate and communicates with the heat dissipation substrate. The first conductive element is electrically connected; the heating element is disposed on the bearing surface and is electrically connected to the circuit board through the first conductive element; the optical component corresponds to the circuit board component.
本申请实施方式的光电模组通过将电路板和发热元件设置在散热基板的承载面上，且在散热基板上设置第一导电元件且与电路板电连接，使得散热效果强的散热基板成为电路板的延伸，在发热元件产生热量后通过散热基板快速传导和疏散，散热效果好。The optoelectronic module according to the embodiment of the present application provides a circuit board and a heating element on a bearing surface of a heat dissipation substrate, and a first conductive element is provided on the heat dissipation substrate and is electrically connected to the circuit board, so that the heat dissipation substrate having a strong heat dissipation effect becomes a circuit. The extension of the board quickly conducts and evacuates through the heat-dissipating substrate after the heat generated by the heating element, and the heat-dissipating effect is good.
本申请的深度相机包括上述任一实施方式所述的光电模组、图像采集器、及处理器。所述光电模组包括电路板组件和设置在所述电路板组件上的光学组件，所述光学组件与所述电路板组件对应；所述电路板组件包括散热基板、电路板和发热元件；所述散热基板包括承载面，所述承载面上形成有第一导电元件；所述电路板设置在所述散热基板上并与所述第一导电元件电连接；所述发热元件设置在所述承载面上并通过所述第一导电元件与所述电路板电连接；所述发热元件为光源并用于发射激光，所述光学组件包括设置在所述电路板组件上的光束生成器，所述光束生成器与所述光源间隔对应并用于将所述激光转换形成激光图案。所述图像采集器用于采集由所述光电模组投射的激光图案。所述处理器分别与所述光电模组及所述图像采集器连接，所述处理器用于处理所述激光图案以获得深度图像。The depth camera of the present application includes the photoelectric module, the image acquisition device, and the processor according to any one of the foregoing embodiments. The photovoltaic module includes a circuit board assembly and an optical assembly provided on the circuit board assembly, and the optical assembly corresponds to the circuit board assembly; the circuit board assembly includes a heat dissipation substrate, a circuit board, and a heating element; The heat-dissipating substrate includes a bearing surface on which a first conductive element is formed; the circuit board is disposed on the heat-dissipating substrate and is electrically connected to the first conductive element; and the heating element is disposed on the bearing And the first conductive element is electrically connected to the circuit board on the surface; the heating element is a light source and is used for emitting laser light, and the optical component includes a light beam generator provided on the circuit board component, the light beam A generator corresponds to the light source interval and is used to convert the laser light into a laser pattern. The image acquisition device is used to collect a laser pattern projected by the photoelectric module. The processor is respectively connected to the photoelectric module and the image collector, and the processor is configured to process the laser pattern to obtain a depth image.
本申请实施方式的深度相机通过将电路板和发热元件设置在散热基板的承载面 上，且在散热基板上设置第一导电元件且与电路板电连接，使得散热效果强的散热基板成为电路板的延伸，在发热元件产生热量后通过散热基板快速传导和疏散，散热效果好。The depth camera according to the embodiment of the present application provides a circuit board and a heating element on a bearing surface of a heat dissipation substrate, and a first conductive element is provided on the heat dissipation substrate and is electrically connected to the circuit board, so that the heat dissipation substrate with a strong heat dissipation effect becomes a circuit board. After the heat is generated by the heating element, it is quickly conducted and evacuated through the heat dissipation substrate, and the heat dissipation effect is good.
本申请实施方式的电子装置包括壳体及上述任一实施方式所述的深度相机。所述深度相机设置在所述壳体内并从所述壳体暴露以获取深度图像。所述深度相机包括光电模组、图像采集器和处理器。所述光电模组包括电路板组件和设置在所述电路板组件上的光学组件，所述光学组件与所述电路板组件对应；所述电路板组件包括散热基板、电路板和发热元件；所述散热基板包括承载面，所述承载面上形成有第一导电元件；所述电路板设置在所述散热基板上并与所述第一导电元件电连接；所述发热元件设置在所述承载面上并通过所述第一导电元件与所述电路板电连接；所述发热元件为光源并用于发射激光，所述光学组件包括设置在所述电路板组件上的光束生成器，所述光束生成器与所述光源间隔对应并用于将所述激光转换形成激光图案；所述图像采集器用于采集由所述光电模组投射的激光图案；所述处理器分别与所述光电模组及所述图像采集器连接，所述处理器用于处理所述激光图案以获得深度图像。An electronic device according to an embodiment of the present application includes a casing and the depth camera according to any one of the foregoing embodiments. The depth camera is disposed inside the casing and is exposed from the casing to acquire a depth image. The depth camera includes a photoelectric module, an image collector, and a processor. The photovoltaic module includes a circuit board assembly and an optical assembly provided on the circuit board assembly, and the optical assembly corresponds to the circuit board assembly; the circuit board assembly includes a heat dissipation substrate, a circuit board, and a heating element; The heat-dissipating substrate includes a bearing surface on which a first conductive element is formed; the circuit board is disposed on the heat-dissipating substrate and is electrically connected to the first conductive element; and the heating element is disposed on the bearing And the first conductive element is electrically connected to the circuit board on the surface; the heating element is a light source and is used for emitting laser light, and the optical component includes a light beam generator provided on the circuit board component, the light beam The generator corresponds to the light source interval and is used to convert the laser to form a laser pattern; the image collector is used to collect the laser pattern projected by the photoelectric module; the processor is respectively connected to the photoelectric module and the laser module; The image collector is connected, and the processor is configured to process the laser pattern to obtain a depth image.
本申请实施方式的电子装置通过将电路板和发热元件设置在散热基板的承载面上，且在散热基板上设置第一导电元件且与电路板电连接，使得散热效果强的散热基板成为电路板的延伸，在发热元件产生热量后通过散热基板快速传导和疏散，散热效果好。In the electronic device according to the embodiment of the present application, a circuit board and a heating element are disposed on a bearing surface of a heat dissipation substrate, and a first conductive element is provided on the heat dissipation substrate and electrically connected to the circuit board, so that the heat dissipation substrate having a strong heat dissipation effect becomes a circuit board. After the heat is generated by the heating element, it is quickly conducted and evacuated through the heat dissipation substrate, and the heat dissipation effect is good.
本申请的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实施方式的实践了解到。Additional aspects and advantages of the embodiments of the present application will be partially given in the following description, and part of them will become apparent from the following description, or be learned through practice of the embodiments of the present application.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
本申请的上述和/或附加的方面和优点可以从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
图1为本申请实施方式的电子装置的结构示意图；1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
图2为本申请实施方式的深度相机的结构示意图；2 is a schematic structural diagram of a depth camera according to an embodiment of the present application;
图3为本申请实施方式的光电模组的结构示意图；3 is a schematic structural diagram of a photovoltaic module according to an embodiment of the present application;
图4是本申请实施方式的电路板组件的平面示意图；4 is a schematic plan view of a circuit board assembly according to an embodiment of the present application;
图5是图4中电路板组件另一视角的平面示意图；5 is a schematic plan view of the circuit board assembly in FIG. 4 from another perspective;
图6是图4中电路板组件再一视角的平面示意图；6 is a schematic plan view of another perspective of the circuit board assembly in FIG. 4;
图7为本申请另一实施方式的光电模组的结构示意图；7 is a schematic structural diagram of a photovoltaic module according to another embodiment of the present application;
图8是本申请另一实施方式的电路板组件的平面示意图；8 is a schematic plan view of a circuit board assembly according to another embodiment of the present application;
图9是图8中电路板组件另一视角的平面示意图；9 is a schematic plan view of the circuit board assembly in FIG. 8 from another perspective;
图10是图8中电路板组件再一视角的平面示意图；10 is a schematic plan view of another perspective of the circuit board assembly in FIG. 8;
图11为本申请再一实施方式的光电模组的结构示意图；和11 is a schematic structural diagram of a photovoltaic module according to still another embodiment of the present application; and
图12为本申请又一实施方式的光电模组的结构示意图。FIG. 12 is a schematic structural diagram of a photovoltaic module according to another embodiment of the present application.
具体实施方式Detailed ways
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。The embodiments of the present application are further described below with reference to the accompanying drawings. The same or similar reference numerals in the drawings indicate the same or similar elements or elements having the same or similar functions. In addition, the embodiments of the present application described below with reference to the drawings are exemplary, and are only used to explain the embodiments of the present application, and should not be construed as limiting the present application.
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。The embodiments of the present application are further described below with reference to the accompanying drawings. The same or similar reference numerals in the drawings indicate the same or similar elements or elements having the same or similar functions.
另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。In addition, the embodiments of the present application described below with reference to the drawings are exemplary, and are only used to explain the embodiments of the present application, and should not be construed as limiting the present application.
在本申请中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。In this application, unless explicitly stated and limited otherwise, the first feature "on" or "down" of the second feature may be the first and second features in direct contact, or the first and second features indirectly through an intermediate medium. contact. Moreover, the first feature is "above", "above", and "above" the second feature. The first feature is directly above or obliquely above the second feature, or it only indicates that the first feature is higher in level than the second feature. The first feature is “below”, “below”, and “below” of the second feature. The first feature may be directly below or obliquely below the second feature, or it may simply indicate that the first feature is less horizontal than the second feature.
请参阅图1，本申请实施方式的电子装置1000包括壳体200和深度相机100。电子装置1000可以是手机、平板电脑、手提电脑、游戏机、头显设备、门禁***、柜员机等，本申请实施例以电子装置1000是手机为例进行说明，可以理解，电子装置1000的具体形式可以是其他，在此不作限制。深度相机100设置在壳体200内并从壳体200暴露以获取深度图像，壳体200可以给深度相机100提供防尘、防水、防摔等保护，壳体200上开设有与深度相机100对应的孔，以使光线从孔中穿出或穿入壳体200。Referring to FIG. 1, an electronic device 1000 according to an embodiment of the present application includes a housing 200 and a depth camera 100. The electronic device 1000 may be a mobile phone, a tablet computer, a laptop computer, a game console, a headset device, an access control system, a teller machine, etc. The embodiment of the present application is described using the electronic device 1000 as a mobile phone. It can be understood that the specific form of the electronic device 1000 It can be other, and there is no limitation here. The depth camera 100 is disposed in the case 200 and exposed from the case 200 to obtain a depth image. The case 200 can provide protection to the depth camera 100 from dust, water, and drop. The case 200 is provided corresponding to the depth camera 100. To allow light to pass through the hole or into the housing 200.
请参阅图2，深度相机100包括光电模组10(此时，光电模组10为结构光投射模组)、图像采集器20和处理器30。深度相机100上可以形成有与光电模组10对应的投射窗口40，和与图像采集器20对应的采集窗口50。光电模组10用于通过投射窗口40向目标空间投射激光图案。该激光图案为经过编码的结构光(由有限个具有唯一性的子图案的集合组成的编码图案)，例如，二维编码结构光图案，该激光图案称为参考图案，参考图案中每一个唯一的图案窗口中的图案都是唯一的。图像采集器20用于 通过采集窗口50采集被目标物体调制后的激光图案，即成像图案。在一个例子中，光电模组10投射的激光为红外光，图像采集器20为红外摄像头。处理器30与光电模组10及图像采集器20均连接，处理器30用于处理成像图案以获得深度图像。具体地，处理器30通过对编码的成像图案解码，找出该成像图案中各像素点与参考图案中的对应各个像素点的对应关系，再根据该对应关系进一步获得该激光图案的深度图像。Referring to FIG. 2, the depth camera 100 includes a photoelectric module 10 (in this case, the photoelectric module 10 is a structured light projection module), an image collector 20 and a processor 30. The depth camera 100 may be formed with a projection window 40 corresponding to the photoelectric module 10 and an acquisition window 50 corresponding to the image collector 20. The photoelectric module 10 is configured to project a laser pattern onto a target space through the projection window 40. The laser pattern is coded structured light (a coding pattern composed of a limited set of unique sub-patterns), for example, a two-dimensional coded structured light pattern. The laser pattern is called a reference pattern, and each of the reference patterns is unique. The patterns in the pattern window are unique. The image collector 20 is configured to collect a laser pattern modulated by a target object, that is, an imaging pattern, through an acquisition window 50. In one example, the laser light projected by the photoelectric module 10 is infrared light, and the image collector 20 is an infrared camera. The processor 30 is connected to both the photoelectric module 10 and the image acquisition device 20. The processor 30 is configured to process an imaging pattern to obtain a depth image. Specifically, the processor 30 decodes the encoded imaging pattern to find the correspondence between each pixel in the imaging pattern and the corresponding pixel in the reference pattern, and further obtains a depth image of the laser pattern according to the correspondence.
上述光电模组10为3D景深摄像模组，例如结构光投射模组10、飞行时间(Time of Flight，TOF)成像模组等；当然光电模组10也可以是其他的成像模组，例如人脸识别传感器模组，具体为摄像头模组；光电模组10还可以是纯光源发射器，例如LED、汽车灯具等。可以理解，光电模组10的具体形式还可以是其他装置，例如任意发热量大的元件，在此不作限制。The above-mentioned photoelectric module 10 is a 3D depth-of-field camera module, such as a structured light projection module 10, a time of flight (TOF) imaging module, and the like; of course, the photoelectric module 10 may also be another imaging module, such as a person The face recognition sensor module is specifically a camera module; the photoelectric module 10 may also be a pure light source transmitter, such as an LED, a car lamp, and the like. It can be understood that the specific form of the photovoltaic module 10 may also be other devices, such as any component with a large amount of heat, which is not limited herein.
请参阅图3，在一个例子中，光电模组10为结构光投射模组10。结构光投射模组10用于向目标空间投射激光图案，该激光图案可以为散斑图案，也可以为编码图案。通过采集和处理被目标物体调制后的激光图案，能够获得目标空间中的目标物体的深度图像。Please refer to FIG. 3. In one example, the photoelectric module 10 is a structured light projection module 10. The structured light projection module 10 is configured to project a laser pattern onto a target space. The laser pattern may be a speckle pattern or a coding pattern. By acquiring and processing the laser pattern modulated by the target object, a depth image of the target object in the target space can be obtained.
请结合图4至图6，结构光投射模组10包括电路板组件11、镜筒12、及光学组件13。4 to FIG. 6, the structured light projection module 10 includes a circuit board assembly 11, a lens barrel 12, and an optical assembly 13.
电路板组件11包括散热基板111、电路板112、发热元件113和热敏元件114。散热基板111包括承载面1111，承载面1111上形成有第一导电元件1113，电路板112设置在散热基板111上并与第一导电元件1113电连接。发热元件113设置在散热基板111上并通过第一导电元件1113与电路板112电连接。The circuit board assembly 11 includes a heat radiating substrate 111, a circuit board 112, a heating element 113, and a thermal element 114. The heat-dissipating substrate 111 includes a bearing surface 1111 on which a first conductive element 1113 is formed. The circuit board 112 is disposed on the heat-dissipating substrate 111 and is electrically connected to the first conductive element 1113. The heating element 113 is disposed on the heat dissipation substrate 111 and is electrically connected to the circuit board 112 through the first conductive element 1113.
具体地，散热基板111包括承载面1111、与承载面1111相背的连接面1112和形成在承载面1111上的第一导电元件1113。散热基板111的承载面1111用于承载镜筒12和发热元件113。第一导电元件1113包括至少一个焊盘1114，发热元件113设置在焊盘1114上，发热元件113通过焊盘1114与散热基板111连接，由于第一导电元件1113可以是焊盘1114，焊盘1114相对于常规的导电线路而言，面积相对较大，方便焊接且连接比较牢固，且焊盘1114与发热元件113接触面积大，可以更快速的对发热元件113产生的热量疏散和吸收，提升散热效果。Specifically, the heat dissipation substrate 111 includes a bearing surface 1111, a connection surface 1112 opposite to the bearing surface 1111, and a first conductive element 1113 formed on the bearing surface 1111. The supporting surface 1111 of the heat dissipation substrate 111 is used to support the lens barrel 12 and the heating element 113. The first conductive element 1113 includes at least one pad 1114. The heating element 113 is disposed on the pad 1114. The heating element 113 is connected to the heat dissipation substrate 111 through the pad 1114. Since the first conductive element 1113 may be the pad 1114, the pad 1114 Compared with conventional conductive lines, the area is relatively large, which is convenient for soldering and has a strong connection. The contact area between the pad 1114 and the heating element 113 is large, which can more quickly evacuate and absorb the heat generated by the heating element 113 and improve heat dissipation. effect.
散热基板111可以是陶瓷基板或金属基板。陶瓷基板由陶瓷材料制成，陶瓷材料包括氮化铝(AlN)单层板、氮化铝(AlN)多层共烧线路板、氧化铝(Al2O3)单层板、氧化铝(Al2O3)多层共烧线路板、及低温共烧陶瓷多层线路板中的任意一种。其中，氮化铝(AlN)单层板的热导系数高达170W/(m·K)，相较于传统柔性电路板的热导系数(<＝0.38W/(m·K))，氮化铝(AlN)单层板的热导系数较高，高导热率使得散 热效率高，而且单层线路板工艺简单，成本低；氮化铝(AlN)多层共烧线路板的热导系数高达170W/(m·K)，高导热率使得散热效率高，且可走多层线路，走线多；氧化铝(Al2O3)单层板的热导系数较高，达到24W/(m·K)，高导热率使得散热效率高，且单层线路板工艺简单，成本低；氧化铝(Al2O3)多层共烧线路板热导系数较高，达到24W/(m·K)，高导热率使得散热效率高，且可走多层线路，走线多；低温共烧陶瓷多层线路板热导系数良，达到2.5W/(m·K)，工艺简单成本低，散热效率较高。金属基板由金属材料制成，金属材料包括铜合金金属基板、铝合金金属基板、及不锈钢合金金属基板中的任意一种。其中，铜合金金属基板热导系数高达385W/(m·K)，相较于传统柔性电路板的热导系数(<＝0.38W/(m·K))，铜合金金属基板的热导系数较高，高导热率使得散热效率高，而且可走单层线路，工艺简单。铝合金金属基板热导系数高达201W/(m·K)且可走多层线路，走线多，高导热率使得散热效率高；不锈钢合金金属基板热导系数较高，达到17W/(m·K)，可走单层线路，成本低且工艺简单，散热效率较高。采用陶瓷基板时，可通过在散热基板111的承载面1111蚀刻形成第一导电元件1113，发热元件113通过导电银浆贴装在焊盘1114上，发热元件113产生的热量通过焊盘1114及陶瓷基板被疏散和吸收；采用金属基板时，采用镍钯金处理或化学镍金处理散热基板111得到第一导电元件1113，发热元件113贴合在焊盘1114上，发热元件113产生的热量通过焊盘1114及金属基板被疏散和吸收。当然，除了以上陶瓷材料和金属材料之外，还可以采用其他合适的材料，只需要满足热导系数大于或等于2.5W/(m·K)即可。本申请实施方式的散热基板111的材料为氮化铝(AlN)单层板。The heat radiation substrate 111 may be a ceramic substrate or a metal substrate. The ceramic substrate is made of ceramic materials. The ceramic materials include aluminum nitride (AlN) single-layer boards, aluminum nitride (AlN) multilayer co-fired circuit boards, aluminum oxide (Al2O3) single-layer boards, and aluminum oxide (Al2O3) multilayers. Either a co-fired circuit board or a low-temperature co-fired ceramic multilayer circuit board. Among them, the thermal conductivity of aluminum nitride (AlN) single-layer boards is as high as 170W / (m · K), compared with the thermal conductivity of traditional flexible circuit boards (<= 0.38W / (m · K)), nitriding The thermal conductivity of aluminum (AlN) single-layer boards is relatively high, and the high thermal conductivity results in high heat dissipation efficiency, and the single-layer circuit board has a simple process and low cost; the thermal conductivity of aluminum nitride (AlN) multilayer co-fired circuit boards is as high as 170W / (m · K), high thermal conductivity enables high heat dissipation efficiency, and can be used for multi-layer lines, with more wires; aluminum oxide (Al2O3) single-layer board has a higher thermal conductivity, reaching 24W / (m · K) The high thermal conductivity makes the heat dissipation efficiency high, and the single-layer circuit board has a simple process and low cost. The thermal conductivity of the alumina (Al2O3) multilayer co-fired circuit board is high, reaching 24W / (m · K). The high thermal conductivity makes The heat dissipation efficiency is high, and multi-layer lines can be routed. The low-temperature co-fired ceramic multilayer circuit board has a good thermal conductivity coefficient of 2.5 W / (m · K), a simple process, low cost, and high heat dissipation efficiency. The metal substrate is made of a metal material, and the metal material includes any one of a copper alloy metal substrate, an aluminum alloy metal substrate, and a stainless steel alloy metal substrate. Among them, the thermal conductivity of copper alloy metal substrates is as high as 385W / (m · K), compared with the thermal conductivity of traditional flexible circuit boards (<= 0.38W / (m · K)), the thermal conductivity of copper alloy metal substrates Higher heat conductivity makes heat dissipation more efficient, and single-layer lines can be used, and the process is simple. The aluminum alloy metal substrate has a thermal conductivity of up to 201 W / (m · K) and can be used for multi-layer lines. There are many traces and high thermal conductivity makes the heat dissipation efficiency high. The stainless steel alloy metal substrate has a high thermal conductivity of 17 W / (m · K), can take single-layer lines, low cost, simple process, and high heat dissipation efficiency. When a ceramic substrate is used, the first conductive element 1113 can be formed by etching on the bearing surface 1111 of the heat dissipation substrate 111. The heating element 113 is mounted on the pad 1114 through a conductive silver paste. The heat generated by the heating element 113 passes through the pad 1114 and the ceramic. The substrate is evacuated and absorbed; when a metal substrate is used, the heat-dissipating substrate 111 is treated with nickel-palladium gold or chemical nickel-gold to obtain a first conductive element 1113. The heating element 113 is attached to the pad 1114. The heat generated by the heating element 113 is passed through soldering. The disc 1114 and the metal substrate are evacuated and absorbed. Of course, in addition to the above ceramic materials and metal materials, other suitable materials can also be used, as long as the thermal conductivity coefficient is required to be greater than or equal to 2.5 W / (m · K). The material of the heat dissipation substrate 111 according to the embodiment of the present application is a single layer of aluminum nitride (AlN).
电路板112的一端设置在承载面1111上且位于发热元件113所在的区域之外，即电路板112与发热元件113均位于承载面1111上且互不重叠，电路板112不设置在散热基板111的连接面1112上，不仅有利于减小电路板组件11的整体厚度，且发热元件113的热量通过散热基板111传导和疏散时，不会因电路板112热导系数较低对热量的传导和疏散造成影响。电路板112可以是印刷电路板、柔性电路板、软硬结合板中的任意一种。本申请实施方式的电路板112为柔性电路板。其中，电路板112通过Hotbar(热压熔锡焊接)工艺贴装在承载面1111上，Hotbar(热压熔锡焊接)的原理是先把锡膏印刷于电路板112上，然后利用热将焊锡融化并连接导通两个需要连接的电子零组件。Hotbar工艺形成的电路板组件11通常是将软板(FPC)焊接于电路板112上，不仅可以达到轻、薄、短、小目的，还因为可以少用1～2个软板连接器(FPC connector)而有效降低成本。One end of the circuit board 112 is disposed on the bearing surface 1111 and is located outside the area where the heating element 113 is located, that is, the circuit board 112 and the heating element 113 are both located on the bearing surface 1111 and do not overlap each other. The circuit board 112 is not disposed on the heat dissipation substrate 111. On the connecting surface 1112, not only is it beneficial to reduce the overall thickness of the circuit board assembly 11, and when the heat of the heating element 113 is conducted and evacuated through the heat dissipation substrate 111, the heat conduction and heat dissipation of the circuit board 112 will not be affected. Evacuation affects. The circuit board 112 may be any one of a printed circuit board, a flexible circuit board, and a rigid-flexible board. The circuit board 112 according to the embodiment of the present application is a flexible circuit board. Among them, the circuit board 112 is mounted on the bearing surface 1111 by a hotbar (hot-melt soldering) process. The principle of the hotbar (hot-melt soldering) is to first print a solder paste on the circuit board 112 and then use heat to solder the solder. Melt and connect the two electronic components that need to be connected. The circuit board assembly 11 formed by the Hotbar process is usually a flexible board (FPC) soldered to the circuit board 112, which can not only achieve lightness, thinness, shortness, and smallness, but also because one or two flexible board connectors can be used less ( FPC (connector) and effectively reduce costs.
发热元件113可为光源113，光源113可以是激光发射器，激光发射器可为垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser，VCSEL)，VCSEL包括半导体 衬底及设置在衬底上的发光元件，衬底可以设置单个发光元件，也可以设置由多个发光元件组成的阵列激光器，具体地，多个发光元件可以以规则或者不规则的二维图案的形式排布在衬底上。当然，发热元件113也可以包括其他的电子元器件，例如：光检测器、温度传感器等。The heating element 113 may be a light source 113, and the light source 113 may be a laser emitter. The laser emitter may be a vertical cavity surface emitting laser (VCSEL). The VCSEL includes a semiconductor substrate and a light emitting element disposed on the substrate. The substrate may be provided with a single light emitting element or an array laser composed of a plurality of light emitting elements. Specifically, the plurality of light emitting elements may be arranged on the substrate in the form of a regular or irregular two-dimensional pattern. Of course, the heating element 113 may also include other electronic components, such as a photodetector, a temperature sensor, and the like.
热敏元件114设置在承载面1111上并与第一导电元件1113电连接，电路板112与第一导电元件1113电连接，从而使热敏元件114与电路板112的电连接。当发热元件113(光源113)工作产生热量时，热敏元件114实时检测散热基板111的温度情况，处理器30根据温度情况控制发热元件113(光源113)的工作功率。例如，在温度过高时降低发热元件113(光源113)的功率以防止温度过高损坏电路板组件11。The thermal element 114 is disposed on the bearing surface 1111 and is electrically connected to the first conductive element 1113. The circuit board 112 is electrically connected to the first conductive element 1113, so that the thermal element 114 is electrically connected to the circuit board 112. When the heat generating element 113 (light source 113) operates to generate heat, the thermal element 114 detects the temperature of the heat dissipation substrate 111 in real time, and the processor 30 controls the working power of the heat generating element 113 (light source 113) according to the temperature condition. For example, the power of the heating element 113 (light source 113) is reduced when the temperature is too high to prevent the circuit board assembly 11 from being damaged by the high temperature.
镜筒12承载在电路板组件11上并与电路板组件11共同形成收容腔121，电路板112一端设置在散热基板111的承载面1111上并位于镜筒12外部，电路板112的另一端与连接器60连接，连接器60可以将结构光投射模组10连接到图1实施例中的电子装置1000的主板上。镜筒12的材料可以为塑料，光源113与光学组件13均收容在收容腔121内。光源113用于发射激光。光学组件13用于衍射该激光以形成激光图案。光学组件13可以包括准直元件131和衍射元件132(Diffractive Optical Elements，DOE)。准直元件131用于汇聚或准直光源113发出的激光，衍射元件132上形成有能够衍射经过准直元件131后的激光的衍射结构。在光电模组10工作时，VCSEL发出的激光依次经过准直元件131和衍射元件132后，向外投射激光图案。The lens barrel 12 is carried on the circuit board assembly 11 and forms a receiving cavity 121 together with the circuit board assembly 11. One end of the circuit board 112 is disposed on the bearing surface 1111 of the heat dissipation substrate 111 and is located outside the lens barrel 12. The other end of the circuit board 112 and The connector 60 is connected. The connector 60 can connect the structured light projection module 10 to the main board of the electronic device 1000 in the embodiment of FIG. 1. The material of the lens barrel 12 may be plastic, and the light source 113 and the optical component 13 are both contained in the receiving cavity 121. The light source 113 is used to emit laser light. The optical component 13 is used to diffract the laser light to form a laser pattern. The optical component 13 may include a collimation element 131 and a diffractive element 132 (Diffractive Optical Elements). The collimating element 131 is used for converging or collimating the laser light emitted from the light source 113, and a diffraction structure capable of diffracting the laser light after passing through the collimating element 131 is formed on the diffractive element 132. When the optoelectronic module 10 is operating, the laser light emitted by the VCSEL passes through the collimating element 131 and the diffractive element 132 in order, and then projects a laser pattern outward.
综上，本申请实施方式的电子装置1000、深度相机100、光电模组10、及电路板组件11通过将电路板112和发热元件113设置在散热基板111的承载面1111上，且在散热基板111上设置第一导电元件1113且与电路板112电连接，使得散热效果强的散热基板111成为电路板112的延伸，在发热元件113产生热量后通过散热基板111快速传导和疏散，散热效果好。In summary, the electronic device 1000, the depth camera 100, the optoelectronic module 10, and the circuit board assembly 11 according to the embodiments of the present application are arranged on the bearing surface 1111 of the heat dissipation substrate 111 by placing the circuit board 112 and the heating element 113 on the heat dissipation substrate. The first conductive element 1113 is provided on 111 and is electrically connected to the circuit board 112, so that the heat-dissipating substrate 111 having a strong heat dissipation effect is an extension of the circuit board 112. After the heat generating element 113 generates heat, it is quickly conducted and evacuated through the heat-dissipating substrate 111, and the heat dissipation effect is good. .
请一并参阅图7至图10，结构光投射模组10中的电路板组件11并不局限于上述实施方式所描述，电路板组件11的结构还可以如下：散热基板111包括承载面1111、与承载面1111相背的连接面1112、形成在承载面1111上的第一导电元件1113、形成在连接面1112上的第二导电元件1115、和金属层1117。散热基板111材质同前，可以是陶瓷基板或金属基板，在此不再赘述。散热基板111开设有贯穿承载面1111向连接面1112的多个通孔1116，金属层1117设置在通孔1116的内壁，第二导电元件1115和第一导电元件1113通过多个通孔1116的金属层1117电连接，既可以实现第一导电元件1113和第二导电元件1115的电连接，还可以进行导热，将发热元件113发出并传导到第一导电元件1113上的热量通过金属层1117传导到第二导电元件1115上从而 实现发热元件113的热量的疏散。其中，通孔1116的数量根据散热需求来确定。金属层1117为既导热又导电的材料，如金属铁、铜和银中至少一种。电路板112的一端设置在连接面1112上并覆盖第二导电元件1115，由于电路板112覆盖第二导电元件1115，二者结合面积较大，可以保证结合强度。第二导电元件1115包括至少一个焊盘1118，电路板112通过表面贴装技术(Surface Mount Technology,SMT)工艺贴装在焊盘1118上，加工难度较低，贴合良率高且容易实现自动化。电路板112与第二导电元件1115电连接，这样可以通过第二导电元件1115、金属层1117和第一导电元件1113配合从而将电路板112和发热元件113电连接。Please refer to FIGS. 7 to 10 together. The circuit board assembly 11 in the structured light projection module 10 is not limited to that described in the above embodiment. The structure of the circuit board assembly 11 may also be as follows: the heat dissipation substrate 111 includes a bearing surface 1111, A connection surface 1112 opposite to the bearing surface 1111, a first conductive element 1113 formed on the bearing surface 1111, a second conductive element 1115 formed on the connection surface 1112, and a metal layer 1117. The material of the heat-dissipating substrate 111 is the same as before, and it may be a ceramic substrate or a metal substrate, which is not repeated here. The heat dissipation substrate 111 is provided with a plurality of through holes 1116 penetrating the bearing surface 1111 to the connecting surface 1112. A metal layer 1117 is provided on an inner wall of the through hole 1116. The second conductive element 1115 and the first conductive element 1113 pass through the metal of the plurality of through holes 1116. The layer 1117 is electrically connected, which can realize the electrical connection between the first conductive element 1113 and the second conductive element 1115, and also conduct heat, and the heat emitted from the heating element 113 and conducted to the first conductive element 1113 is conducted to the metal layer 1117. The second conductive element 1115 is thereby evacuated from the heat of the heating element 113. The number of through-holes 1116 is determined according to the heat dissipation requirements. The metal layer 1117 is a material that is both thermally and electrically conductive, such as at least one of metallic iron, copper, and silver. One end of the circuit board 112 is disposed on the connection surface 1112 and covers the second conductive element 1115. Since the circuit board 112 covers the second conductive element 1115, the combined area of the two is large, which can ensure the bonding strength. The second conductive element 1115 includes at least one pad 1118. The circuit board 112 is mounted on the pad 1118 by a Surface Mount Technology (SMT) process. The processing difficulty is low, the bonding yield is high, and automation is easy to implement. . The circuit board 112 is electrically connected to the second conductive element 1115. In this way, the second conductive element 1115, the metal layer 1117, and the first conductive element 1113 can be matched to electrically connect the circuit board 112 and the heating element 113.
电路板组件11还可包括补强板115。补强板115设置在电路板112的与连接面1112相背的表面上，也即是说，电路板112位于连接面1112和补强板115之间，补强板115可以加强电路板112与散热基板111连接区域的强度。补强板115开设有多个散热通孔1152，散热通孔1152与电路板112及发热元件113对应，可以仅仅和电路板112上与发热元件113正对的区域相对应，也可以和电路板112与散热基板111连接的整个区域对应，从而将发热元件113产生的热量快速传导和疏散。当然补强板115也可以只开设一个散热通孔1152，且电路板112可开设过孔，此时，散热基板111的第二导电元件的焊盘1118穿过电路板112的过孔及散热通孔1152后从补强板115远离电路板112的表面露出，发热元件113工作时产生的热量可依次经过第一导电元件1113、金属层1117、第二导电元件1115(包括焊盘1118)散掉。补强板115可以是金属，如铜、铁或铜合金等等，方便加工且导热效果好。当然，补强板115也可以是其他材料，只需要满足强度要求及散热要求即可。本申请实施方式的补强板115为铜合金补强板。The circuit board assembly 11 may further include a reinforcing plate 115. The reinforcing plate 115 is disposed on the surface of the circuit board 112 opposite to the connecting surface 1112, that is, the circuit board 112 is located between the connecting surface 1112 and the reinforcing plate 115. The reinforcing plate 115 can strengthen the circuit board 112 and The strength of the connection area of the heat radiation substrate 111. The reinforcing plate 115 is provided with a plurality of heat dissipation through holes 1152. The heat dissipation through holes 1152 correspond to the circuit board 112 and the heating element 113, and may correspond to only the area on the circuit board 112 directly facing the heating element 113, or may correspond to the circuit board. 112 corresponds to the entire area where the heat radiation substrate 111 is connected, so that the heat generated by the heat generating element 113 is quickly conducted and evacuated. Of course, the reinforcing plate 115 may only have one heat dissipation through hole 1152, and the circuit board 112 may have vias. At this time, the pads 1118 of the second conductive element of the heat dissipation substrate 111 pass through the vias and the heat dissipation holes of the circuit board 112. The hole 1152 is exposed from the surface of the reinforcing plate 115 away from the circuit board 112. The heat generated during the operation of the heating element 113 can be sequentially dissipated through the first conductive element 1113, the metal layer 1117, and the second conductive element 1115 (including the pad 1118). . The reinforcing plate 115 may be a metal, such as copper, iron, or a copper alloy, etc., which is convenient for processing and has good thermal conductivity. Of course, the reinforcing plate 115 may also be other materials, as long as it meets the strength requirements and heat dissipation requirements. The reinforcing plate 115 according to the embodiment of the present application is a copper alloy reinforcing plate.
此时，热敏元件114设置在承载面1111上并与第二导电元件1115电连接，电路板112与第二导电元件1115电连接，从而实现热敏元件114与电路板112电连接。当发热元件113工作产生热量时，热敏元件114实时检测散热基板111的温度情况，处理器30根据温度情况控制发热元件113的工作功率。例如，在温度过高时降低发热元件113的功率以防止温度过高损坏电路板组件11。镜筒12与光学组件13的结构及工作原理与前述相同，在此不再赘述。At this time, the thermal element 114 is disposed on the bearing surface 1111 and is electrically connected to the second conductive element 1115, and the circuit board 112 is electrically connected to the second conductive element 1115, so that the thermal element 114 is electrically connected to the circuit board 112. When the heating element 113 generates heat during operation, the thermal element 114 detects the temperature of the heat dissipation substrate 111 in real time, and the processor 30 controls the working power of the heating element 113 according to the temperature condition. For example, the power of the heating element 113 is reduced when the temperature is too high to prevent the circuit board assembly 11 from being damaged by the high temperature. The structures and working principles of the lens barrel 12 and the optical component 13 are the same as those described above, and are not repeated here.
同样地，本申请实施方式的电子装置1000、深度相机100、光电模组10、及电路板组件11通过将电路板112和发热元件113设置在散热基板111的承载面1111上，且在散热基板111上设置第一导电元件1113且与电路板112电连接，使得散热效果强的散热基板成为电路板112的延伸，在发热元件113产生热量后通过散热基板111及补强板115快速传导和疏散，散热效果好。Similarly, the electronic device 1000, the depth camera 100, the optoelectronic module 10, and the circuit board assembly 11 according to the embodiments of the present application are provided on the supporting surface 1111 of the heat dissipation substrate 111 by disposing the circuit board 112 and the heating element 113 on the heat dissipation substrate. A first conductive element 1113 is provided on 111 and is electrically connected to the circuit board 112, so that a heat-dissipating substrate with a strong heat dissipation effect is an extension of the circuit board 112. After the heat is generated by the heating element 113, it is quickly conducted and evacuated through the heat-dissipating substrate 111 and the reinforcing plate 115. , Good cooling effect.
在某些实施方式中，通孔1116和散热通孔1152内部设置有导热材料如导热胶等。 如此，可以加快热量的疏散速度，提升散热效果。In some embodiments, a thermally conductive material such as a thermally conductive adhesive is disposed inside the through hole 1116 and the heat dissipation through hole 1152. In this way, the speed of heat evacuation can be accelerated, and the heat dissipation effect can be improved.
请参阅图11或图12，在其他实施方式中，光电模组10可为摄像头模组。摄像头模组可以为可见光摄像头模组，也可以是红外摄像头模组。摄像头模组包括电路板组件11、镜筒12和光学组件13。电路板组件11可以是图4至图6所示的电路板组件(图11所示)，也可以是图8至图10所示的电路板组件(图12所示)，无论是光电模组10中是哪种电路板组件11，此时，发热元件113可以为互补金属氧化物半导体(CMOS，Complementary Metal Oxide Semiconductor)图像传感芯片或者电荷耦合元件(CCD，Charge-coupled Device)图像传感芯片，镜筒12承载在电路板组件11上并与电路板组件11共同形成收容腔121。镜筒12与电路板组件11的连接方式包括胶合、卡合。图像传感芯片113与光学组件13均收容在镜筒12内。光学组件13包括镜头133，图像传感芯片113设置在镜头133的像侧，具体地，光学组件13的光轴与图像传感芯片113的中心法线重合。在光电模组10工作时，被目标物体反射的光经过光学组件13后在图像传感芯片113上成像。在本实施例中，镜头133可以为单独的透镜，该透镜为凸透镜或凹透镜；或者为多枚透镜，多枚透镜可均为凸透镜或凹透镜，或部分为凸透镜，部分为凹透镜。Please refer to FIG. 11 or FIG. 12. In other embodiments, the photoelectric module 10 may be a camera module. The camera module can be a visible light camera module or an infrared camera module. The camera module includes a circuit board assembly 11, a lens barrel 12, and an optical assembly 13. The circuit board assembly 11 may be the circuit board assembly shown in FIG. 4 to FIG. 6 (shown in FIG. 11), or the circuit board assembly shown in FIG. 8 to FIG. 10 (shown in FIG. 12), whether it is a photovoltaic module What kind of circuit board assembly 11 is 10, at this time, the heating element 113 may be a complementary metal oxide semiconductor (CMOS, Complementary, Oxide, Semiconductor) image sensor chip or a charge-coupled device (CCD, Charge-coupled device) image sensor The chip and the lens barrel 12 are carried on the circuit board assembly 11 and form a receiving cavity 121 together with the circuit board assembly 11. The connection manner of the lens barrel 12 and the circuit board assembly 11 includes gluing and engaging. Both the image sensor chip 113 and the optical component 13 are housed in the lens barrel 12. The optical component 13 includes a lens 133, and the image sensing chip 113 is disposed on the image side of the lens 133. Specifically, the optical axis of the optical component 13 coincides with the center normal of the image sensing chip 113. When the photoelectric module 10 is operating, the light reflected by the target object passes through the optical component 13 and is imaged on the image sensing chip 113. In this embodiment, the lens 133 may be a separate lens, which is a convex lens or a concave lens; or a plurality of lenses, each of which may be a convex lens or a concave lens, or part of a convex lens, and part of a concave lens.
请继续参阅图11及图12，进一步地，光学组件13还包括滤光片134，比如红外截止滤光片(此时光电模组10为可见光摄像头模组)，滤光片134用于调整成像的光线波长区段，具体用于过滤掉自然光中的红外光使其不能进入电路板组件11，从而防止红外光对可见光成像形成的影像色彩与清晰度造成影响。当然，滤光片134还可以是红外通过滤光片(此时光电模组10为红外摄像头模组)，滤光片134用于调整成像的光线波长区段，具体用于仅让红外光进入电路板组件11(阻止可见光进入电路板组件11)，以保证红外光成像形成的影像色彩与清晰度。滤光片134收容在收容腔121内并设置在电路板组件11和光学组件13之间。在光电模组10工作时，被目标物体反射的光进入光电模组10，依次经过镜头133、滤光片134并在图像传感芯片113上成像。Please continue to refer to FIG. 11 and FIG. 12. Further, the optical component 13 further includes a filter 134, such as an infrared cut filter (the optoelectronic module 10 is a visible light camera module at this time), and the filter 134 is used to adjust the imaging The wavelength range of light is specifically used to filter out infrared light in natural light so that it cannot enter the circuit board assembly 11, thereby preventing infrared light from affecting the color and sharpness of the image formed by visible light imaging. Of course, the filter 134 can also be an infrared pass filter (the photoelectric module 10 is an infrared camera module at this time). The filter 134 is used to adjust the wavelength range of the imaging light, and is specifically used to allow only infrared light to enter. The circuit board assembly 11 (blocks visible light from entering the circuit board assembly 11) to ensure the color and sharpness of the image formed by infrared light imaging. The filter 134 is received in the receiving cavity 121 and is disposed between the circuit board assembly 11 and the optical assembly 13. When the photoelectric module 10 is operating, the light reflected by the target object enters the photoelectric module 10, passes through the lens 133, the filter 134, and images on the image sensing chip 113 in this order.
请参阅图1，本申请还提供一种电子装置1000，该电子装置1000包括图11或图12中的光电模组10。换言之，上述为摄像头模组的光电模组10也可应用于电子装置1000。此时，光电模组10可以用于获取可见光图像或红外光图像等等。Referring to FIG. 1, the present application further provides an electronic device 1000 including the photoelectric module 10 in FIG. 11 or FIG. 12. In other words, the optoelectronic module 10 described above as a camera module can also be applied to the electronic device 1000. At this time, the photoelectric module 10 may be used to acquire a visible light image or an infrared light image and the like.
同样地，本申请实施方式的电子装置1000、光电模组10、及电路板组件11通过将电路板112和发热元件113设置在散热基板111的承载面1111上，且在散热基板111上设置第一导电元件1113且与电路板112电连接，使得散热效果强的散热基板成为电路板112的延伸，在发热元件113产生热量后通过散热基板111快速传导和疏散，散 热效果好。Similarly, the electronic device 1000, the optoelectronic module 10, and the circuit board assembly 11 according to the embodiment of the present application are provided with the circuit board 112 and the heating element 113 on the bearing surface 1111 of the heat dissipation substrate 111, and a first A conductive element 1113 is electrically connected to the circuit board 112, so that the heat-dissipating substrate having a strong heat-dissipating effect becomes an extension of the circuit board 112. After the heat-generating element 113 generates heat, it is quickly conducted and evacuated through the heat-dissipating substrate 111, and the heat-dissipating effect is good.
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。In the description of this specification, reference is made to the terms "certain embodiments", "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples" The description means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same implementation or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more implementations or examples.
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个，除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality" is at least two, for example, two, three, unless it is specifically and specifically defined otherwise.
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations on the present application. Those skilled in the art can interpret the above within the scope of the present application. The embodiments are subject to change, modification, replacement, and modification, and the scope of the present application is defined by the claims and their equivalents.

Claims (40)

  1. 一种电路板组件，其特征在于，所述电路板组件包括：A circuit board assembly, characterized in that the circuit board assembly includes:
    散热基板，所述散热基板包括承载面，所述承载面上形成有第一导电元件；A heat dissipation substrate, the heat dissipation substrate comprising a bearing surface, and a first conductive element is formed on the bearing surface;
    电路板，所述电路板设置在所述散热基板上并与所述第一导电元件电连接；及A circuit board disposed on the heat sink substrate and electrically connected to the first conductive element; and
    发热元件，所述发热元件设置在所述承载面上并通过所述第一导电元件与所述电路板电连接。A heating element is disposed on the bearing surface and is electrically connected to the circuit board through the first conductive element.
  2. 根据权利要求1所述的电路板组件，其特征在于，所述第一导电元件包括至少一个焊盘，所述发热元件设置在所述焊盘上。The circuit board assembly according to claim 1, wherein the first conductive element includes at least one pad, and the heating element is disposed on the pad.
  3. 根据权利要求1所述的电路板组件，其特征在于，所述散热基板包括氮化铝单层板、氮化铝多层共烧线路板、氧化铝单层板、氧化铝多层共烧线路板或低温共烧陶瓷多层线路板。The circuit board assembly according to claim 1, wherein the heat-dissipating substrate comprises an aluminum nitride single-layer board, an aluminum nitride multilayer co-fired circuit board, an aluminum oxide single-layer board, and an alumina multilayer co-fired circuit Board or low temperature co-fired ceramic multilayer circuit board.
  4. 根据权利要求1所述的电路板组件，其特征在于，所述散热基板包括铜合金金属基板、铝合金金属基板或不锈钢合金金属基板。The circuit board assembly according to claim 1, wherein the heat dissipation substrate comprises a copper alloy metal substrate, an aluminum alloy metal substrate, or a stainless steel alloy metal substrate.
  5. 根据权利要求1所述的电路板组件，其特征在于，所述散热基板的热导系数大于或等于2.5W/(m·K)。The circuit board assembly according to claim 1, wherein a thermal conductivity of the heat dissipation substrate is greater than or equal to 2.5 W / (m · K).
  6. 根据权利要求1所述的电路板组件，其特征在于，所述电路板的一端设置在所述承载面上且位于所述发热元件所在区域之外。The circuit board assembly according to claim 1, wherein one end of the circuit board is disposed on the bearing surface and is located outside a region where the heating element is located.
  7. 根据权利要求1所述的电路板组件，其特征在于，所述散热基板还包括与所述承载面相背的连接面，所述连接面设置有第二导电元件，所述散热基板开设有多个通孔，所述通孔的内壁设置有金属层，所述第二导电元件与所述第一导电元件通过多个所述金属层电连接，所述电路板的一端设置在所述连接面上，所述电路板覆盖所述第二导电元件并与所述第二导电元件电连接。The circuit board assembly according to claim 1, wherein the heat dissipation substrate further comprises a connection surface opposite to the bearing surface, the connection surface is provided with a second conductive element, and the heat dissipation substrate is provided with a plurality of A through hole, the inner wall of which is provided with a metal layer, the second conductive element and the first conductive element are electrically connected through a plurality of the metal layers, and one end of the circuit board is provided on the connection surface The circuit board covers the second conductive element and is electrically connected to the second conductive element.
  8. 根据权利要求7所述的电路板组件，其特征在于，所述电路板组件还包括补强板，所述补强板设置在所述电路板的与所述连接面相背的表面上。The circuit board assembly according to claim 7, wherein the circuit board assembly further comprises a reinforcing plate, and the reinforcing plate is disposed on a surface of the circuit board opposite to the connection surface.
  9. 根据权利要求8所述的电路板组件，其特征在于，所述补强板开设有散热通孔，所述散热通孔与所述电路板及所述发热元件对应。The circuit board assembly according to claim 8, wherein the reinforcing plate is provided with a heat dissipation through hole, and the heat dissipation through hole corresponds to the circuit board and the heating element.
  10. 根据权利要求7所述的电路板组件，其特征在于，所述电路板组件还包括热敏元件，所述热敏元件设置在所述承载面上并与所述第一导电元件或所述第二导电元件电连接。The circuit board assembly according to claim 7, wherein the circuit board assembly further comprises a heat-sensitive element, the heat-sensitive element being disposed on the bearing surface and in contact with the first conductive element or the first The two conductive elements are electrically connected.
  11. 一种光电模组，其特征在于，包括：A photovoltaic module, comprising:
    电路板组件，所述电路板组件包括散热基板、电路板和发热元件；所述散热基板包括承载面，所述承载面上形成有第一导电元件；所述电路板设置在所述散热基板上并与所述第一导电元件电连接；所述发热元件设置在所述承载面上并通过所述第一导电元件与所述电路板电连接；及A circuit board assembly including a heat dissipation substrate, a circuit board, and a heating element; the heat dissipation substrate includes a bearing surface on which a first conductive element is formed; and the circuit board is disposed on the heat dissipation substrate And is electrically connected to the first conductive element; the heating element is disposed on the bearing surface and is electrically connected to the circuit board through the first conductive element; and
    设置在所述电路板组件上的光学组件，所述光学组件与所述电路板组件对应。An optical component disposed on the circuit board component, the optical component corresponding to the circuit board component.
  12. 根据权利要求11所述的光电模组，其特征在于，所述第一导电元件包括至少一个焊盘，所述发热元件设置在所述焊盘上。The photovoltaic module according to claim 11, wherein the first conductive element includes at least one pad, and the heating element is disposed on the pad.
  13. 根据权利要求11所述的光电模组，其特征在于，所述散热基板包括氮化铝单层板、氮化铝多层共烧线路板、氧化铝单层板、氧化铝多层共烧线路板或低温共烧陶瓷多层线路板。The photovoltaic module according to claim 11, wherein the heat dissipation substrate comprises an aluminum nitride single-layer board, an aluminum nitride multilayer co-fired circuit board, an alumina single-layer board, and an alumina multilayer co-fired circuit Board or low temperature co-fired ceramic multilayer circuit board.
  14. 根据权利要求11所述的光电模组，其特征在于，所述散热基板包括铜合金金属基板、铝合金金属基板或不锈钢合金金属基板。The photovoltaic module according to claim 11, wherein the heat dissipation substrate comprises a copper alloy metal substrate, an aluminum alloy metal substrate or a stainless steel alloy metal substrate.
  15. 根据权利要求11所述的光电模组，其特征在于，所述散热基板的热导系数大于或等于2.5W/(m·K)。The photovoltaic module according to claim 11, wherein a thermal conductivity of the heat dissipation substrate is greater than or equal to 2.5 W / (m · K).
  16. 根据权利要求11所述的光电模组，其特征在于，所述电路板的一端设置在所述承载面上且位于所述发热元件所在区域之外。The photovoltaic module according to claim 11, wherein one end of the circuit board is disposed on the bearing surface and is located outside a region where the heating element is located.
  17. 根据权利要求11所述的光电模组，其特征在于，所述散热基板还包括与所述承载面相背的连接面，所述连接面设置有第二导电元件，所述散热基板开设有多个通 孔，所述通孔的内壁设置有金属层，所述第二导电元件与所述第一导电元件通过多个所述金属层电连接，所述电路板的一端设置在所述连接面上，所述电路板覆盖所述第二导电元件并与所述第二导电元件电连接。The photovoltaic module according to claim 11, wherein the heat dissipation substrate further comprises a connection surface opposite to the bearing surface, the connection surface is provided with a second conductive element, and the heat dissipation substrate is provided with a plurality of A through hole, the inner wall of which is provided with a metal layer, the second conductive element and the first conductive element are electrically connected through a plurality of the metal layers, and one end of the circuit board is provided on the connection surface The circuit board covers the second conductive element and is electrically connected to the second conductive element.
  18. 根据权利要求17所述的光电模组，其特征在于，所述电路板组件还包括补强板，所述补强板设置在所述电路板的与所述连接面相背的表面上。The photovoltaic module according to claim 17, wherein the circuit board assembly further comprises a reinforcing plate, and the reinforcing plate is disposed on a surface of the circuit board opposite to the connection surface.
  19. 根据权利要求18所述的光电模组，其特征在于，所述补强板开设有散热通孔，所述散热通孔与所述电路板及所述发热元件对应。The photovoltaic module according to claim 18, wherein the reinforcing plate is provided with a heat dissipation through hole, and the heat dissipation through hole corresponds to the circuit board and the heating element.
  20. 根据权利要求17所述的光电模组，其特征在于，所述电路板组件还包括热敏元件，所述热敏元件设置在所述承载面上并与所述第一导电元件或所述第二导电元件电连接。The photovoltaic module according to claim 17, wherein the circuit board assembly further comprises a heat-sensitive element, and the heat-sensitive element is disposed on the bearing surface and communicates with the first conductive element or the first The two conductive elements are electrically connected.
  21. 一种深度相机，其特征在于，包括：A depth camera, comprising:
    光电模组，所述光电模组包括电路板组件和设置在所述电路板组件上的光学组件，所述光学组件与所述电路板组件对应；所述电路板组件包括散热基板、电路板和发热元件；所述散热基板包括承载面，所述承载面上形成有第一导电元件；所述电路板设置在所述散热基板上并与所述第一导电元件电连接；所述发热元件设置在所述承载面上并通过所述第一导电元件与所述电路板电连接；所述发热元件为光源并用于发射激光，所述光学组件包括设置在所述电路板组件上的光束生成器，所述光束生成器与所述光源间隔对应并用于将所述激光转换形成激光图案；Photoelectric module, which includes a circuit board component and an optical component provided on the circuit board component, the optical component corresponding to the circuit board component; the circuit board component includes a heat dissipation substrate, a circuit board, and A heating element; the heat dissipation substrate includes a bearing surface, and a first conductive element is formed on the bearing surface; the circuit board is disposed on the heat dissipation substrate and is electrically connected to the first conductive element; Electrically connected to the circuit board on the bearing surface and through the first conductive element; the heating element is a light source and is used for emitting laser light, and the optical component includes a light beam generator provided on the circuit board component , The beam generator corresponds to the interval between the light sources and is used to convert the laser to form a laser pattern;
    图像采集器，所述图像采集器用于采集由所述光电模组投射的激光图案；及An image collector for collecting a laser pattern projected by the photoelectric module; and
    处理器，所述处理器分别与所述光电模组及所述图像采集器连接，所述处理器用于处理所述激光图案以获得深度图像。A processor, which is respectively connected to the photoelectric module and the image collector, and the processor is configured to process the laser pattern to obtain a depth image.
  22. 根据权利要求21所述的深度相机，其特征在于，所述第一导电元件包括至少一个焊盘，所述发热元件设置在所述焊盘上。The depth camera according to claim 21, wherein the first conductive element includes at least one pad, and the heating element is disposed on the pad.
  23. 根据权利要求21所述的深度相机，其特征在于，所述散热基板包括氮化铝单层板、氮化铝多层共烧线路板、氧化铝单层板、氧化铝多层共烧线路板或低温共烧陶瓷多层线路板。The depth camera according to claim 21, wherein the heat-dissipating substrate comprises an aluminum nitride single-layer board, an aluminum nitride multilayer co-fired circuit board, an aluminum oxide single-layer board, and an alumina multilayer co-fired circuit board Or low temperature co-fired ceramic multilayer circuit boards.
  24. 根据权利要求21所述的深度相机，其特征在于，所述散热基板包括铜合金金属基板、铝合金金属基板或不锈钢合金金属基板。The depth camera according to claim 21, wherein the heat dissipation substrate comprises a copper alloy metal substrate, an aluminum alloy metal substrate, or a stainless steel alloy metal substrate.
  25. 根据权利要求21所述的深度相机，其特征在于，所述散热基板的热导系数大于或等于2.5W/(m·K)。The depth camera according to claim 21, wherein a thermal conductivity of the heat dissipation substrate is greater than or equal to 2.5 W / (m · K).
  26. 根据权利要求21所述的深度相机，其特征在于，所述电路板的一端设置在所述承载面上且位于所述发热元件所在区域之外。The depth camera according to claim 21, wherein one end of the circuit board is disposed on the bearing surface and is located outside a region where the heating element is located.
  27. 根据权利要求21所述的深度相机，其特征在于，所述散热基板还包括与所述承载面相背的连接面，所述连接面设置有第二导电元件，所述散热基板开设有多个通孔，所述通孔的内壁设置有金属层，所述第二导电元件与所述第一导电元件通过多个所述金属层电连接，所述电路板的一端设置在所述连接面上，所述电路板覆盖所述第二导电元件并与所述第二导电元件电连接。The depth camera according to claim 21, wherein the heat dissipation substrate further comprises a connection surface opposite to the bearing surface, the connection surface is provided with a second conductive element, and the heat dissipation substrate is provided with a plurality of communication holes. Hole, the inner wall of the through hole is provided with a metal layer, the second conductive element and the first conductive element are electrically connected through a plurality of the metal layers, and one end of the circuit board is provided on the connection surface, The circuit board covers the second conductive element and is electrically connected to the second conductive element.
  28. 根据权利要求27所述的深度相机，其特征在于，所述电路板组件还包括补强板，所述补强板设置在所述电路板的与所述连接面相背的表面上。The depth camera according to claim 27, wherein the circuit board assembly further comprises a reinforcing plate, and the reinforcing plate is disposed on a surface of the circuit board opposite to the connection surface.
  29. 根据权利要求28所述的深度相机，其特征在于，所述补强板开设有散热通孔，所述散热通孔与所述电路板及所述发热元件对应。The depth camera according to claim 28, wherein the reinforcing plate is provided with a heat dissipation through hole, and the heat dissipation through hole corresponds to the circuit board and the heating element.
  30. 根据权利要求27所述的深度相机，其特征在于，所述电路板组件还包括热敏元件，所述热敏元件设置在所述承载面上并与所述第一导电元件或所述第二导电元件电连接。The depth camera according to claim 27, wherein the circuit board assembly further comprises a heat-sensitive element, and the heat-sensitive element is disposed on the bearing surface and communicates with the first conductive element or the second The conductive elements are electrically connected.
  31. 一种电子装置，其特征在于，包括：An electronic device, comprising:
    壳体；及Shell; and
    深度相机，所述深度相机设置在所述壳体内并从所述壳体暴露以获取深度图像；所述深度相机包括：A depth camera disposed in the casing and exposed from the casing to acquire a depth image; the depth camera includes:
    光电模组，所述光电模组包括电路板组件和设置在所述电路板组件上的光学组件，所述光学组件与所述电路板组件对应；所述电路板组件包括散热基板、电路板和发热 元件；所述散热基板包括承载面，所述承载面上形成有第一导电元件；所述电路板设置在所述散热基板上并与所述第一导电元件电连接；所述发热元件设置在所述承载面上并通过所述第一导电元件与所述电路板电连接；所述发热元件为光源并用于发射激光，所述光学组件包括设置在所述电路板组件上的光束生成器，所述光束生成器与所述光源间隔对应并用于将所述激光转换形成激光图案；Photoelectric module, which includes a circuit board component and an optical component provided on the circuit board component, the optical component corresponding to the circuit board component; the circuit board component includes a heat dissipation substrate, a circuit board, and A heating element; the heat dissipation substrate includes a bearing surface, and a first conductive element is formed on the bearing surface; the circuit board is disposed on the heat dissipation substrate and is electrically connected to the first conductive element; Electrically connected to the circuit board on the bearing surface and through the first conductive element; the heating element is a light source and is used for emitting laser light, and the optical component includes a light beam generator provided on the circuit board component , The beam generator corresponds to the interval between the light sources and is used to convert the laser to form a laser pattern;
    图像采集器，所述图像采集器用于采集由所述光电模组投射的激光图案；及An image collector for collecting a laser pattern projected by the photoelectric module; and
    处理器，所述处理器分别与所述光电模组及所述图像采集器连接，所述处理器用于处理所述激光图案以获得深度图像。A processor, which is respectively connected to the photoelectric module and the image collector, and the processor is configured to process the laser pattern to obtain a depth image.
  32. 根据权利要求31所述的电子装置，其特征在于，所述第一导电元件包括至少一个焊盘，所述发热元件设置在所述焊盘上。The electronic device according to claim 31, wherein the first conductive element includes at least one pad, and the heating element is disposed on the pad.
  33. 根据权利要求31所述的电子装置，其特征在于，所述散热基板包括氮化铝单层板、氮化铝多层共烧线路板、氧化铝单层板、氧化铝多层共烧线路板或低温共烧陶瓷多层线路板。The electronic device according to claim 31, wherein the heat dissipation substrate comprises an aluminum nitride single-layer board, an aluminum nitride multilayer co-fired circuit board, an alumina single-layer board, and an alumina multilayer co-fired circuit board Or low temperature co-fired ceramic multilayer circuit boards.
  34. 根据权利要求31所述的电子装置，其特征在于，所述散热基板包括铜合金金属基板、铝合金金属基板或不锈钢合金金属基板。The electronic device according to claim 31, wherein the heat dissipation substrate comprises a copper alloy metal substrate, an aluminum alloy metal substrate, or a stainless steel alloy metal substrate.
  35. 根据权利要求31所述的电子装置，其特征在于，所述散热基板的热导系数大于或等于2.5W/(m·K)。The electronic device according to claim 31, wherein a thermal conductivity of the heat dissipation substrate is greater than or equal to 2.5 W / (m · K).
  36. 根据权利要求31所述的电子装置，其特征在于，所述电路板的一端设置在所述承载面上且位于所述发热元件所在区域之外。The electronic device according to claim 31, wherein one end of the circuit board is disposed on the bearing surface and is located outside a region where the heating element is located.
  37. 根据权利要求31所述的电子装置，其特征在于，所述散热基板还包括与所述承载面相背的连接面，所述连接面设置有第二导电元件，所述散热基板开设有多个通孔，所述通孔的内壁设置有金属层，所述第二导电元件与所述第一导电元件通过多个所述金属层电连接，所述电路板的一端设置在所述连接面上，所述电路板覆盖所述第二导电元件并与所述第二导电元件电连接。The electronic device according to claim 31, wherein the heat dissipation substrate further comprises a connection surface opposite to the bearing surface, the connection surface is provided with a second conductive element, and the heat dissipation substrate is provided with a plurality of communication holes. Hole, the inner wall of the through hole is provided with a metal layer, the second conductive element and the first conductive element are electrically connected through a plurality of the metal layers, and one end of the circuit board is provided on the connection surface, The circuit board covers the second conductive element and is electrically connected to the second conductive element.
  38. 根据权利要求37所述的电子装置，其特征在于，所述电路板组件还包括补强 板，所述补强板设置在所述电路板的与所述连接面相背的表面上。The electronic device according to claim 37, wherein the circuit board assembly further comprises a reinforcing plate, and the reinforcing plate is disposed on a surface of the circuit board opposite to the connection surface.
  39. 根据权利要求38所述的电子装置，其特征在于，所述补强板开设有散热通孔，所述散热通孔与所述电路板及所述发热元件对应。The electronic device according to claim 38, wherein the reinforcing plate is provided with a heat dissipation through hole, and the heat dissipation through hole corresponds to the circuit board and the heating element.
  40. 根据权利要求37所述的电子装置，其特征在于，所述电路板组件还包括热敏元件，所述热敏元件设置在所述承载面上并与所述第一导电元件或所述第二导电元件电连接。The electronic device according to claim 37, wherein the circuit board assembly further comprises a heat-sensitive element, and the heat-sensitive element is disposed on the bearing surface and communicates with the first conductive element or the second The conductive elements are electrically connected.
PCT/CN2019/089617 2018-05-31 2019-05-31 Circuit board assembly, photoelectric module, depth camera and electronic device WO2019228517A1 (en)

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