WO2019227784A1 - Oled显示器封装结构 - Google Patents

Oled显示器封装结构 Download PDF

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Publication number
WO2019227784A1
WO2019227784A1 PCT/CN2018/106578 CN2018106578W WO2019227784A1 WO 2019227784 A1 WO2019227784 A1 WO 2019227784A1 CN 2018106578 W CN2018106578 W CN 2018106578W WO 2019227784 A1 WO2019227784 A1 WO 2019227784A1
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film
oled display
glass substrate
package structure
cover glass
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PCT/CN2018/106578
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English (en)
French (fr)
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方俊雄
吕伯彦
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深圳市华星光电半导体显示技术有限公司
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Priority to US16/098,866 priority Critical patent/US20210083222A1/en
Publication of WO2019227784A1 publication Critical patent/WO2019227784A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Definitions

  • the present invention relates to the field of display technology, and in particular, to an OLED display package structure.
  • OLED Organic Light-Emitting Diode
  • OLED displays can be divided into passive matrix OLED (PMOLED) and active matrix OLED (AMOLED) according to the driving mode, that is, direct addressing and thin film transistor (Thin Film Transistor, TFT). ) Matrix addressing two types.
  • PMOLED passive matrix OLED
  • AMOLED active matrix OLED
  • TFT thin film transistor
  • Matrix addressing two types Matrix addressing two types.
  • AMOLED has pixels arranged in an array, belongs to an active display type, and has high light emitting efficiency, and is generally used as a high-resolution large-sized display device.
  • Electroluminescence (EL) materials in OLED displays are quite sensitive to water and oxygen in the environment. When water and oxygen invade, they can easily oxidize with the cathode or EL materials, causing damage to EL devices or reduced efficiency, so they need to be used.
  • the special packaging material is well isolated from the external environment to contact the EL device.
  • the coffer filling and packaging technology uses high-barrier water and oxygen glue coating. It is arranged around the panel, and the EL display glass substrate and the packaging cover glass are bonded together, and the filling material is filled between the display glass substrate and the packaging cover glass to achieve the effect of blocking water and oxygen. Referring to FIG.
  • FIG. 1 it is a top view of an existing AMOLED display, which uses a cofferdam filling and packaging technology.
  • a glass substrate 1 and a cover glass 2 of the display are bonded together through a dam glue 3.
  • Coffer glue 3 is coated on the peripheral edges of the opposite surfaces of the glass substrate 1 and the cover glass 2.
  • FIG. 2 a cross-sectional view of a conventional AMOLED display is shown.
  • the glass substrate 1 and the cover glass 2 of the display are bonded together by a weir glue 3, which is coated on the peripheral edges of the opposite surfaces of the glass substrate 1 and the cover glass 2, and between the glass substrate 1 and the cover glass 2.
  • the filling fill structure formed by the filling material 4, the coffer glue 3 and the filling material 4 encapsulates the OLED device between the glass substrate 1 and the cover glass 2.
  • the OLED device mainly includes a passivation film 5 , Cathode 6, electroluminescent material 7, and other structures.
  • the width D of the coffer glue 3 must be greater than a few millimeters to delay the time for external environmental water and oxygen to enter the EL device.
  • This packaging method cannot effectively reduce the border width of the display. B, where the boundary width B is the width from the effective display area (AA) to the edge of the glass substrate 1.
  • an object of the present invention is to provide an OLED display package structure and reduce the width of the cofferdam glue.
  • the present invention provides an OLED display package structure, including: a glass substrate, a cover glass, a coffer paste, a filling material, and a water blocking film; the glass substrate and the cover glass are bonded by a coffer.
  • the coffer paste is coated on the peripheral edge of the opposite surface of the glass substrate and the cover glass
  • the filling material is provided on the inner side of the coffer glue and filled between the glass substrate and the cover glass
  • the water blocking film Cover the outer surface of the cofferdam.
  • the water blocking film also extends to cover the peripheral edges of the opposite surfaces of the glass substrate and the cover glass, and the sides of the glass substrate and the cover glass.
  • the water blocking film is an alumina film or a parylene film.
  • the alumina film is a film prepared by an atomic layer deposition technology.
  • the thickness of the alumina film is in the range of 50-200 nm.
  • the parylene film is a film prepared by a thermal cracking coating technology.
  • the film thickness of the parylene film ranges from 100 nm to 1000 nm.
  • the surface of the water blocking film is provided with a UV light curing adhesive.
  • the UV light curing adhesive is sprayed on the surface of the water blocking film using a nozzle printing technology.
  • the cofferdam is a UV light curing type or a heat curing type material.
  • the packaging structure of the OLED display of the present invention can effectively reduce the width of the cofferdam, while maintaining the same packaging effect, and can reduce the boundary width of the display; the UV-curable adhesive can be used to enhance the impact resistance of the display periphery.
  • FIG. 1 is a top view of an existing AMOLED display
  • FIG. 2 is a cross-sectional view of a conventional AMOLED display
  • FIG. 3 is a schematic cross-sectional view of a preferred embodiment of a packaging structure of an OLED display according to the present invention.
  • FIG. 4 is a schematic cross-sectional view of another preferred embodiment of the OLED display package structure of the present invention.
  • the OLED display package structure of the present invention mainly includes: a glass substrate 1, a cover glass 2, a cofferdam 31, a filling material 4, and Water blocking film 8; the glass substrate 1 and the cover glass 2 are bonded together by a weir glue 31, which is coated on the peripheral edge of the opposite surface of the glass substrate 1 and the cover glass 2; The material 4 is provided on the inner side of the weir glue 31 and filled between the glass substrate 1 and the upper cover glass 2.
  • the water blocking film 8 covers the outer surface of the weir glue 31; the water blocking film 8 can further extend to cover the glass The peripheral edges of the opposite surfaces of the substrate 1 and the cover glass 2 and the sides of the glass substrate 1 and the cover glass 2.
  • the water blocking film 8 may be an aluminum trioxide film or a parylene film.
  • the bank glue 31 may be an ultraviolet (UV) light-curing type or a heat-curing type material.
  • the coffer filling filling structure formed by the coffer paste 31 and the filling material 4 encapsulates the OLED device between the glass substrate 1 and the cover glass 2.
  • the OLED device mainly includes a passivation film 5, a cathode 6, an electroluminescent material 7, and the like. structure.
  • the invention is based on the packaging technology framework of Dam & Fill, which strengthens the packaging technology around the panel.
  • ALD Atomic Layer Deposition
  • the thickness of the thickest part of the Al2O3 film can be about 50 ⁇ 200nm, because the ALD technology can perfectly form a thin film according to the undulating shape of the sample, it can better cover the sides of the display glass substrate 1 and the cover glass 2 and perfectly cover the sides of the cofferdam 31
  • the Al2O3 film grown by ALD technology has good water and oxygen barrier capabilities, so it can effectively reduce the width D 'of the coffer paste 31, and still maintain the same packaging effect. Since the width of the coffer paste 31 can be effectively reduced, the boundary width B ′ from the effective display area of the display to the edge of the glass substrate 1 can also be reduced compared to the conventional Dam & Fill packaging method.
  • the present invention can also use thermal cracking coating technology to grow Parylene film as a water blocking film8.
  • Parylene film has the same coating and resistance as ALD technology. Water and oxygen characteristics, so it can be used to replace Al2O3 film, Parylene film thickness range of about 100nm ⁇ 1000nm is more appropriate.
  • FIG. 4 is a schematic cross-sectional view of another preferred embodiment of the packaging structure of the OLED display of the present invention.
  • This preferred embodiment further improves the embodiment shown in FIG. 3, and further includes UV on the surface of the water blocking film 8.
  • Light curing glue 9 As the thickness of the Al2O3 or Parylene film as the water blocking film 8 is thin, it is easy to be scratched by external hard objects, thereby reducing the ability to block water and oxygen. Therefore, after the Al2O3 or Parylene film is formed, a layer of UV light curing glue 9 can be sprayed on the periphery by using nozzle printing technology. The thickness of the thickest part of the UV light curing glue 9 is about 0.2 to 0.5 mm.
  • the border width B 'of the display can also be compared with the traditional Dam & Fill packaging method reduce.
  • the packaging structure of the OLED display of the present invention can effectively reduce the width of the cofferdam, while maintaining the same packaging effect, and can reduce the border width of the display; it can also strengthen the collision resistance of the display by spraying UV light curing adhesive.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种OLED显示器封装结构，该OLED显示器封装结构包括：玻璃基板(1)，上盖玻璃(2)，围堰胶(31)，填充材料(4)，以及阻水膜(8)；所述玻璃基板(1)与上盖玻璃(2)通过围堰胶(31)黏合在一起，所述围堰胶(31)涂布在玻璃基板(1)与上盖玻璃(2)相对表面的周围边缘，所述填充材料(4)设于围堰胶(31)内侧填充于玻璃基板(1)与上盖玻璃(2)之间，所述阻水膜(8)包覆围堰胶(31)的外侧表面。该OLED显示器封装结构能够有效缩减围堰胶(31)的宽度，还能保持相同的封装效果，还可以缩减显示器的边界宽度；还可以通过喷涂UV光固化胶(9)强化显示器周边耐碰撞能力。

Description

OLED显示器封装结构 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED显示器封装结构。
背景技术
在平板显示技术中，有机发光二极管(Organic Light-Emitting Diode，OLED)显示器具有轻薄、主动发光、响应速度快、可视角大、色域宽、亮度高和功耗低等众多优点，逐渐成为继液晶显示器后的第三代显示技术。
OLED显示器按照驱动方式可以分为无源矩阵型OLED(Passive Matrix OLED，PMOLED)和有源矩阵型OLED(Active Matrix OLED，AMOLED)两大类，即直接寻址和薄膜晶体管(Thin Film Transistor，TFT)矩阵寻址两类。其中，AMOLED具有呈阵列式排布的像素，属于主动显示类型，发光效能高，通常用作高清晰度的大尺寸显示装置。
OLED显示器中的电致发光(EL)材料对环境中的水、氧相当敏感,当水、氧侵入后很容易与阴极或是EL材料产生氧化,造成EL器件损坏或是效率下降,因此需要使用特殊的封装材料良好的隔绝外界环境与EL器件接触。传统的封装方式有两种,第一种为围堰填充(Dam & Fill)技术,另一种为面封装(Face seal)技术,围堰填充封装技术是利用高阻隔水、氧的胶材涂布在面板(Panel)四周,将EL显示器玻璃基板与封装盖板玻璃黏合在一起,显示器玻璃基板与封装盖板玻璃中间填入填充(Fill)材料,达到阻挡水、氧的效果。参见图1，其为现有AMOLED显示器上视图，采用了围堰填充封装技术，显示器的玻璃基板(Glass substrate)1与上盖玻璃(Cover glass)2通过围堰(Dam)胶3黏合在一起，围堰胶3涂布在玻璃基板1与上盖玻璃2相对表面的四周边缘。参见图2，其为现有AMOLED显示器剖面图。显示器的玻璃基板1与上盖玻璃2通过围堰胶3黏合在一起，围堰胶3涂布在玻璃基板1与上盖玻璃2相对表面的四周边缘，玻璃基板1与上盖玻璃2之间夹有填充材料4，围堰胶3和填充材料4所形成的围堰填充封装结构将OLED器件封装于玻璃基板1与上盖玻璃2之间，OLED器件主要包括钝化膜(Passivation film)5，阴极6，电致发光材料7等结构。一般为了达到较好的隔绝效果,围堰胶3的宽度D必须大于数毫米,以延迟外界环境水、氧进入EL器件的时间,缺点就是这种封装方式无法有效缩减显示器的边界(Border)宽度B，其中，边界宽度B为有效显示区域(AA)至玻璃 基板1边缘的宽度。
发明内容
因此，本发明的目的在于提供一种OLED显示器封装结构，缩减围堰胶的宽度。
为实现上述目的，本发明提供了一种OLED显示器封装结构，包括：玻璃基板，上盖玻璃，围堰胶，填充材料，以及阻水膜；所述玻璃基板与上盖玻璃通过围堰胶黏合在一起，所述围堰胶涂布在玻璃基板与上盖玻璃相对表面的周围边缘，所述填充材料设于围堰胶内侧填充于玻璃基板与上盖板玻璃之间,所述阻水膜包覆围堰胶的外侧表面。
其中，所述阻水膜还延伸覆盖于玻璃基板和上盖玻璃相对表面的四周边缘及玻璃基板和上盖玻璃的侧边。
其中，所述阻水膜为三氧化二铝薄膜或聚对二甲苯薄膜。
其中，所述三氧化二铝薄膜为采用原子层沉积技术制备的薄膜。
其中，所述三氧化二铝薄膜的膜厚范围为50～200nm。
其中，所述聚对二甲苯薄膜为采用热裂解镀膜技术制备的薄膜。
其中，所述聚对二甲苯薄膜的膜厚范围为100nm～1000nm。
其中，所述阻水膜表面设有UV光固化胶。
其中，所述UV光固化胶采用喷嘴印刷技术喷涂于阻水膜表面。
其中，所述围堰胶为UV光固化型或热固化型的材料。
综上，本发明OLED显示器封装结构能够有效缩减围堰胶的宽度,同时还能保持相同的封装效果，可以缩减显示器的边界宽度；可以通过喷涂UV光固化胶强化显示器周边耐碰撞能力。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其他有益效果显而易见。
附图中，
图1为现有AMOLED显示器上视图；
图2为现有AMOLED显示器剖面图；
图3为本发明OLED显示器封装结构一较佳实施例的剖面示意图；
图4为本发明OLED显示器封装结构又一较佳实施例的剖面示意图。
具体实施方式
参见图3，其为本发明OLED显示器封装结构一较佳实施例的剖面示意图，本发明的OLED显示器封装结构主要包括：玻璃基板1，上盖玻璃2，围堰胶31，填充材料4，以及阻水膜8；所述玻璃基板1与上盖玻璃2通过围堰胶31黏合在一起，所述围堰胶31涂布在玻璃基板1与上盖玻璃2相对表面的周围边缘，所述填充材料4设于围堰胶31内侧填充于玻璃基板1与上盖板玻璃2之间,所述阻水膜8包覆围堰胶31的外侧表面；阻水膜8还可以进一步延伸覆盖于玻璃基板1和上盖玻璃2相对表面的四周边缘及玻璃基板1和上盖玻璃2的侧边。阻水膜8可以为三氧化二铝薄膜或聚对二甲苯薄膜。围堰胶31可以为紫外线(UV)光固化型或热固化型的材料。
围堰胶31和填充材料4所形成的围堰填充封装结构将OLED器件封装于玻璃基板1与上盖玻璃2之间，OLED器件主要包括钝化膜5，阴极6，电致发光材料7等结构。
本发明是基于Dam & Fill的封装技术架构下,加强面板四周方封装的技术。当面板使用Dam & Fill封装之后,可以使用原子层沉积(Atomic Layer Deposition，ALD)技术，在面板四周镀一层Al2O3薄膜作为阻水膜8,Al2O3薄膜最厚处的膜厚范围可以约为50～200nm,因为ALD技术可以依照样品起伏的形貌完美形成一层薄膜,因此可以较好的覆盖显示器玻璃基板1以及上盖玻璃2的侧边,并完美包覆好围堰胶31的侧边,而ALD技术生长的Al2O3薄膜具有很好的水、氧阻隔能力,因此可以有效缩减围堰胶31的宽度D’,还能保持相同的封装效果。由于围堰胶31宽度可以有效缩减,因此显示器有效显示区域至玻璃基板1边缘的边界宽度B’也可以较传统Dam & Fill封装方式缩减。
除了使用ALD技术生长的Al2O3薄膜外,本发明也可以用热裂解镀膜技术来成长聚对二甲苯(Parylene)薄膜作为阻水膜8,Parylene薄膜与ALD技术相同具有较佳的包覆性与阻档水、氧特性,因此可以用来取代Al2O3薄膜,Parylene膜厚范围约为100nm～1000nm较为合适。
参见图4，其为本发明OLED显示器封装结构又一较佳实施例的剖面示意图，此较佳实施例在图3所示实施例上做出进一步改进，在阻水膜8表面进一步设有UV光固化胶9。由于作为阻水膜8的Al2O3或是Parylene薄膜厚度较薄,容易被外界硬物所划伤,进而降低阻挡水、氧能力。因此在Al2O3或是Parylene薄膜形成后,可以利用喷嘴印刷(Nozzle printing)的技术在其***喷涂一层UV光固化胶9,UV光固化胶9最厚处的厚度约为0.2～0.5mm,如此可以有效防止Al2O3或是Parylene薄膜被划伤的风险,同时也能强化显示器周边耐碰撞能力,由于围堰胶31宽度可以有效缩减,因 此显示器的边界宽度B’也可以较传统Dam & Fill封装方式缩减。
综上，本发明OLED显示器封装结构能够有效缩减围堰胶的宽度,同时还能保持相同的封装效果，可以缩减显示器的边界宽度；还可以通过喷涂UV光固化胶强化显示器周边耐碰撞能力。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (10)

  1. 一种OLED显示器封装结构，包括：玻璃基板，上盖玻璃，围堰胶，填充材料，以及阻水膜；所述玻璃基板与上盖玻璃通过围堰胶黏合在一起，所述围堰胶涂布在玻璃基板与上盖玻璃相对表面的周围边缘，所述填充材料设于围堰胶内侧填充于玻璃基板与上盖板玻璃之间,所述阻水膜包覆围堰胶的外侧表面。
  2. 如权利要求1所述的OLED显示器封装结构，其中，所述阻水膜还延伸覆盖于玻璃基板和上盖玻璃相对表面的四周边缘及玻璃基板和上盖玻璃的侧边。
  3. 如权利要求1所述的OLED显示器封装结构，其中，所述阻水膜为三氧化二铝薄膜或聚对二甲苯薄膜。
  4. 如权利要求3所述的OLED显示器封装结构，其中，所述三氧化二铝薄膜为采用原子层沉积技术制备的薄膜。
  5. 如权利要求3所述的OLED显示器封装结构，其中，所述三氧化二铝薄膜的膜厚范围为50～200nm。
  6. 如权利要求3所述的OLED显示器封装结构，其中，所述聚对二甲苯薄膜为采用热裂解镀膜技术制备的薄膜。
  7. 如权利要求3所述的OLED显示器封装结构，其中，所述聚对二甲苯薄膜的膜厚范围为100nm～1000nm。
  8. 如权利要求1所述的OLED显示器封装结构，其中，所述阻水膜表面设有UV光固化胶。
  9. 如权利要求8所述的OLED显示器封装结构，其中，所述UV光固化胶采用喷嘴印刷技术喷涂于阻水膜表面。
  10. 如权利要求1所述的OLED显示器封装结构，其中，所述围堰胶为UV光固化型或热固化型的材料。
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