WO2019224364A1 - Procédé et système de production pour produire un substrat de film - Google Patents

Procédé et système de production pour produire un substrat de film Download PDF

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Publication number
WO2019224364A1
WO2019224364A1 PCT/EP2019/063496 EP2019063496W WO2019224364A1 WO 2019224364 A1 WO2019224364 A1 WO 2019224364A1 EP 2019063496 W EP2019063496 W EP 2019063496W WO 2019224364 A1 WO2019224364 A1 WO 2019224364A1
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WO
WIPO (PCT)
Prior art keywords
chip
substrate
chip module
cavity
antenna
Prior art date
Application number
PCT/EP2019/063496
Other languages
German (de)
English (en)
Inventor
Ulrich Lang
Original Assignee
Ulrich Lang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102018112476.7A external-priority patent/DE102018112476B4/de
Application filed by Ulrich Lang filed Critical Ulrich Lang
Publication of WO2019224364A1 publication Critical patent/WO2019224364A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Definitions

  • the invention relates to a method for producing a film substrate according to the preamble of claim 1 or the preamble of patent claim 5 and a manufacturing plant for carrying out such a method.
  • Such film substrates are used, for example, for producing
  • Transponder inlays used by credit and debit cards, elD cards, security cards, passports, prestige cards, etc.
  • Conventional standard inlays have four layers that are laminated by exposure to pressure and / or temperature for a predetermined lamination time. For receiving a chip module are punched out of the substrate window, in which the chip modules are inserted. For fixing the position
  • Chip modules these can be fixed with a metered into the punching window adhesive or a curing filler, the chip module is supported at the bottom over a bottom side applied overlay.
  • a defined antenna is welded into a core foil by means of a wire laying technique known per se and physically connected to the chip module. This bonding can be done for example by thermocompression welding by means of a tungsten electrode.
  • the punched-out substrate in which a plurality of windows is provided for accommodating chip modules, a further overlay and a cover sheet are then applied after the gluing / pouring.
  • EP 0 826 190 B1 describes the basic structure of a contactless chip card, in which a chip module with a loop antenna is placed in a winding window of a booster antenna.
  • the document US 2014/0263663 A1 discloses a chip card module arrangement in which a recess is formed in a carrier, into which a chip card module is inserted. In this case, a chip card antenna is contactlessly coupled to the chip card module.
  • US 2014/004220 A1 describes a method for producing a chip card, in which a card cavity is provided in a card insert blank into which a chip card module can be inserted.
  • antennas of the chip card module can be inductively coupled to an amplifier antenna coil of the card insert blank.
  • US 2015/0053772 A1 discloses a chip arrangement with a first and a second chip and a booster antenna.
  • the chips have integrated antennas for communicating with an external reader and / or writer, the booster antenna being coupled to the chip-side antennas.
  • US 2012/024272 A1 a solution is described in which in a
  • Substrate a cavity is formed, in which a microcircuit is used. This insertion can be done for example by means of a "pick and place” tool.
  • the invention has for its object to provide a method and a manufacturing plant, by which the production of a film substrate over the conventional solutions with increased reliability is simplified.
  • the method according to the invention is used to produce a transponder film substrate that has a multiplicity of chip modules with a loop antenna (see, for example, FIGS. 5, 6, reference numeral 68) or a "bare" chip, in which the loop antenna is inserted into the silicon chip Structure (see Figure 6, reference numeral 21) is integrated, wherein the loop antenna is placed in each case in a winding window of a booster antenna and inductively coupled.
  • the chip modules with loop antenna and / or the chip with integrated loop antenna are also called electronic data carriers.
  • the patent describes in each case two processes which process two different data carriers. Once the chip module with loop antenna and the second a "bare" chip in which the loop antenna is integrated in one of the layers of the chip structure.
  • booster antenna geometry has a defined
  • booster antennas Winding window in which the electronic data carriers must be used exactly.
  • the various geometries of the booster antennas, or different production methods of booster antennas will not be discussed here.
  • the booster antenna is placed on one side of the substrate, while the chip module is placed with the loop antenna
  • the chip module with the loop antenna is not in one
  • Such a solution has the advantage that the induction is improved over the former solution.
  • transponder inlay with booster antenna and chip module with loop antenna or with a "chip and integrated loop antenna in an electronic field eg a reader in passport controls, or door openers, etc.
  • a transponder inlay with booster antenna and chip module with loop antenna or with a "chip and integrated loop antenna in an electronic field eg a reader in passport controls, or door openers, etc.
  • thermo-compression welding with a tungsten electrode or even a soldering process is completely eliminated.
  • These contacting processes such as thermo-compression welding and soldering, are still a very critical process in transponder manufacturing today.
  • the invention is concerned with the simplification of the production of a
  • Transponder film substrates wherein an inductive coupling of data carrier and booster antennas takes place.
  • the invention eliminates the
  • Chip modules in leadframe form provided. Typically in standardized 35mm tapes with a likewise standardized perforation. Blanke, or "bare" chips with integrated loop antennas in the chip structure are isolated in wafer format and fed to the film substrate.
  • a first method step for processing the chip modules is the processing of the tapes.
  • the chip module leadframe heat-activated adhesive film applied.
  • the heat-activatable adhesive film is located on a silicone-like tape, the so-called release tape.
  • the document EP 2 588 998 B1 describes a processing of the chip module tape in which the adhesive film is applied to the back of the tape, ie on the
  • Patent application and the inventive method is a
  • heat-activated adhesive film applied to the chip side of the chip module.
  • Chip side can also be made the subject of an independent patent application.
  • the adhesive / adhesive film used in each case can be pre-activated by ultrasound, pressure and / or heat. This pre-activation is preferably carried out by means of pressure and short-term direct
  • a cover sheet can be applied to the film substrate.
  • this cover sheet can be fixed by applying temperature or by ultrasound.
  • the cover sheet serves primarily as a protective layer for the booster antenna, wherein winding jumps of the booster antenna are covered.
  • the fixing points of the cover sheet are designed so that the transponder sheet for the next manufacturing step is easy to handle.
  • the winding jumps of the booster antenna can also be sunk into the substrate so that these winding jumps and the entire booster antenna are planar to the substrate surface. This sinking / embedding the
  • Windungssprünge can be done for example via a heated pressing tool or a suitable ultrasonic tool or otherwise.
  • Applicant reserves the right to make independent independent claims as to the arrangement of the booster antenna and the loop antenna on opposite sides of the substrate. Furthermore, it is advantageous if the antennas, in particular the booster antenna, undergo a quality check before inserting the data carrier (chip modules). In this case, for example by means of a network analyzer the
  • Resonance frequency or the Q-factor or other specific parameters of the antenna are checked. In the event that one of these antennas is faulty, no data carriers are placed in the faulty critical antenna accordingly via a suitable control.
  • the leadframe tape preferably consists of three layers: the leadframe, the heat-activatable adhesive film and the release tape.
  • This three-layer leadframe tape for example, supplied to a manufacturing facility and punching the chip modules are isolated from the leadframe and supplied to the films substrates. Shortly before punching, the release tape is removed. The punch punched on the chip side of the chip module and a vacuum applied removal tool positioned the disk in the cavity of the film substrate.
  • the cavity molding is preferably carried out with a mold under vertical force.
  • the molding tool shapes the cavity for the chip module so that the chip module is, for example, flush with the top edge of the film substrate.
  • An ultrasonic tool or other partial softening tool that serves as an anvil briefly heats the material so that embossing of the material can be accomplished more gently.
  • the document EP 2 074 560 B1 likewise describes a cavity molding by means of an ultrasonic punch. By the invention, however, the process is significantly simplified.
  • the ultrasonic tool is preferably a standard tool with standard frequency tuning.
  • the mold used in the invention can be customized without retuning the ultrasonic tool.
  • the mold can also be made of a wear-resistant material, with ultrasound application only certain materials come into question.
  • the manufacturing plant according to the invention which is particularly suitable for carrying out the above-mentioned method, has a substrate feed, wherein the
  • Substrate is preferably supplied in a sheet or endless film form.
  • a first process step is, as described above, the introduction of the cavity by means of a cavity molding tool.
  • the position of the cavity is located, for example, in the corresponding winding window of the booster antenna.
  • the geometry of the booster and loop antennas creates an inductive coupling.
  • the geometry of the winding window of the booster antenna can also have different angular positions, thus the cavities must also follow the angular position analogously. Consequently, the chip module must follow the angular position with a rotatable removal tool.
  • the chip module can then be inserted into the winding window of the booster antenna, so that the loop antenna and the booster antenna are arranged on the same side.
  • it is provided to form the booster antenna on one side of the substrate, while the chip module with the loop antenna or the chip with integrated loop antenna is inserted opposite on the other side of the substrate. The cavity can then overlap with the booster antenna.
  • the chip module can be punched out at the production plant.
  • the chip module is removed, for example, from the punching tool and pressed directly into the cavity.
  • the heat-activatable adhesive film is located on the chip module side.
  • an ultrasonic tool on the opposite side of the cavity, the heat-activatable adhesive film
  • an adhesive film may be used that can be otherwise activated, e.g. B. with pressure and UV light or microwaves, etc.
  • the film substrate with the chip module fixed in the cavity is preferably transported to a curing station. Hot stamp with a defined temperature, Pressure and time then activate the heat-activated adhesive film. In a subsequent step, the chip module is pressed again with cooled pressure punches.
  • Each process step can be controlled by a functional check of the transponder.
  • a cover film or a cover sheet could be applied.
  • this cover sheet is used to cover winding jumps of the booster antenna.
  • these winding jumps of the booster antenna can also be sunk in a suitable manner in the substrate. This sinking, for example, by means of a heated press ram or by means of a
  • This cover sheet or cover sheet can then be fixed in a suitable manner on the core film or the substrate.
  • the fixing can be done for example by means of a heating pin or an ultrasonic tool.
  • transponder film substrate also called transponder inlay
  • transponder inlay is now ready for further processing into the final transponder product.
  • the processing is carried out by a "bare" chip with integrated loop antenna. Only, before the chip is inserted into the cavity, an adhesive is dosed into the cavity. Then the chip is inserted. In turn, to activate an adhesive, various possibilities may be considered. Temperature, pressure, UV light, microwaves, etc.
  • a leadframe carrier is provided with such a chip module. Furthermore, in a conventional manner a Substrate provided with a plurality of booster antennas, said substrate is partially transformed according to the invention, so that a cavity for receiving a chip module is formed. Such a cavity is provided in each case in the region of a booster antenna.
  • Leadframe carrier separated and inserted into the cavity.
  • Process step then takes place the bonding of the chip module in the cavity.
  • the inventive method is characterized by the fact that the use of the above-mentioned chip modules no mechanical connection between the chip module and the booster antenna must be made because the signal transmission from the built-in chip small antenna (loop antenna) on the booster Antenna takes place by means of radio technology or the like. Another advantage is that no window has to be punched out in the substrate, since a cavity for the chip module is produced only by partial forming / embossing.
  • the production plant according to the invention which is particularly suitable for carrying out the abovementioned processes, has a substrate feed, wherein the substrate is preferably fed in sheet or foil form. Furthermore, one is
  • Feeding in particular for the supply of a chip module or a
  • a forming device is provided, wherein the chip module can be inserted into the cavity by means of a pick-and-place station.
  • the manufacturing plant further has an activation device for
  • This adhesive can be applied for example as an adhesive layer or adhesive film on the leadframe. When processing a "bare" chip, it is preferred to introduce the adhesive directly into the cavity. This adhesive can be metered in liquid or else introduced as an adhesive layer in the cavity.
  • the leadframe can be provided on the chip side with an adhesive layer.
  • the adhesive layer be made with a cover layer which is peeled off prior to singulation / separation.
  • the adhesive can be introduced directly into the cavity.
  • the activation or curing of the adhesive or of the adhesive layer takes place, for example, by the action of heat or ultrasound and subsequent cooling.
  • the forming to form the cavity is carried out according to the invention by means of an ultrasonic tool and a mold, wherein the mold preferably on the chip side and the ultrasonic tool preferably act on the side facing away from the chip side of the substrate.
  • Foliensubstrat a cover layer are applied so that winding jumps are covered.
  • the winding jumps can also be sunk into the substrate.
  • the individual layers are preferably processed film or sheet or ribbon.
  • the above-described molding tool is preferably designed such that it approximately corresponds to the contour of the chip module, so that it is reliably fixed in position in the cavity.
  • the production plant can still be designed with one or more test stations for functional testing of the processed chip modules.
  • This test station can be, for example, a reading device for testing the respective chip module.
  • the transponder test station can be designed such that an operating system or a Java applet can be loaded contactlessly onto a flash memory of the chip module by means of transponder technology.
  • the chip module or the chip with integrated loop antenna (at the module or layer level) can also be operated with etched, printed, stamped or otherwise produced antenna types.
  • the patent applicant reserves the right to apply this principle to its own independent claim.
  • Figure 1 shows the basic structure of a first embodiment of a
  • FIG. 2 shows a lead frame feeder of the production plant according to FIG. 1;
  • FIG. 3 shows an ultrasonic tool and a forming tool of the production plant according to FIG. 1;
  • Figure 4 shows another embodiment of an inventive
  • FIG. 5 shows a foil substrate which can be produced with the production plant according to FIG. 4;
  • FIG. 6 shows a variant of the embodiment according to FIG. 5;
  • FIG. 7 shows a diagram to illustrate the differences in the processing of a chip module or a chip with integrated loop antenna
  • FIG. 8 shows a part of a further embodiment of a production plant for processing "bare" chip modules
  • FIG. 9 shows a film substrate which is processed with a production plant according to FIG. 7;
  • FIG. 10 shows an individual representation of a chip module
  • FIG. 11 shows a sheet with such chip modules
  • FIGS 12a, 12b, 12c views of an intermediate in carrying out the method according to the invention
  • FIGS. 13a, 13b a pressing tool for sinking winding jumps
  • Figure 14 shows a variant of the embodiment according to Figures 13a, 13b and
  • Figure 15 is a pressing device with pressing tools according to the figures 13 or 14 in series production.
  • FIG. 1 shows a schematic diagram of a first exemplary embodiment of a production plant 1 for producing a film substrate, as used in the production of transponder layers.
  • the production takes place in sheet or in endless format - in the illustrated embodiment is an endless format with a Width of for example 650 mm used.
  • a Width for example 650 mm used.
  • Embodiment are to be processed chip modules, which are designed as contactless Inductive- Coupling chip modules (chip modules with integrated loop antenna), arranged on a Leadframetape 2, which is fed via a leadframe feed 4 as a band-shaped material.
  • the production plant 1 further has a feed, not shown, for a core film, referred to below as the substrate 6.
  • FIG. 2 shows one of the leadframe preparation station 10 upstream of the production plant 1 shown in FIG. 1, in which the leadframe tape 2 is prepared. It is assumed that the Leadframetape 2 as a band material on a
  • Lead frame memory 12 is wound, wherein already said chip modules are integrated. Details of this leadframe technique are explained, for example, in the initially mentioned EP 2 588 998 B1.
  • this leadframe tape 2 is provided with a heat-activated adhesive layer (HAF) also provided as a roll or strip material.
  • HAF heat-activated adhesive layer
  • This laminating takes place for example by means of a heating plate 16, against which the layer structure with the lead frame tape 2 and the adhesive layer 14 is pressed by means of silicone pressure rollers 18, so that a partial softening and
  • Bonding / laminating of the layers takes place.
  • This masking tape 24 is arranged to the outside, so that the entire adhesive layer is covered.
  • the cover tape 24 may be a silicone tape.
  • This multilayer laminate (Leadframetape 2 with adhesive layer 14 and
  • Masking tape 24 is then fed to a storage roll 22 or directly to the leadframe feeder 4. As shown in Figure 1, the cover tape (release tape) 24 before the
  • the supply of the substrate 6 may be formed, for example, as a roll feed device, over which the core material provided as a roll material (substrate) unwound and along unillustrated guides the other
  • Processing stations can be supplied.
  • the core film can also be supplied as sheet material via a suitable feed.
  • a number of specified booster antennas 8 are applied to the substrate 6 by means of an antenna laying unit in wire laying technology. These are welded into the substrate 6 in a conventional manner.
  • the substrate 6 may consist of a conventional thermoplastic, for example polycarbonate, PVC or of a synthetic paper.
  • the laying and welding of the antenna wire is carried out in a conventional manner via an ultrasonic converter and a laying tool.
  • a cavity is formed by means of a shaping device / embossing device 28, the contour of which is formed on the outer contour of the surface to be processed
  • Chip module 20 is adapted.
  • FIG. This shows an enlarged view of the substrate 6, on which a plurality of booster antennas 8 is arranged.
  • the forming device 28 now forms in a region which is encompassed by the booster antenna 8, the above-described cavity.
  • the forming device 28 has a stamping or molding tool 30 whose contour corresponds to that of the cavity to be formed.
  • the shaping device 28 further has an ultrasonic tool 32, the sonotrode 34 of which is shown in FIG. From this representation, it is apparent that the sonotrode 34 is designed with a flat active surface 36, over which the area of the substrate 6 acted upon by the ultrasound is softened, so that over the Mold 30, the cavity can be formed.
  • the profile 38 of the mold 30 is shown. The end face of this profile 38 corresponds to the base of the cavity to be formed.
  • the mold 30 and the ultrasonic tool 32 are guided movably in the X and Y directions simultaneously.
  • the molding tool 30 is driven in the vertical direction (Z) via an axis system.
  • the ultrasonic tool 32 is fixed in the vertical (Z) below the substrate 6, but movable in the X and Y directions.
  • the mold 30 presses on the substrate 6 with an adjustable or controllable force.
  • heat is produced by which the substrate material is softened so that the shaping of the cavity for the material is stress-free.
  • the embossing of the cavity can be further simplified when the mold 30 is heated.
  • the depth of the cavity is designed so that the chip module 20 can be inserted flush into the cavity. In principle, however, it is also possible to use the chip module with a certain supernatant, this supernatant is then covered accordingly over another layer.
  • the chip modules 20 are separated in a separating station 40 from the leadframe tape 2.
  • the separating station 40 is designed as a punching device.
  • the quality of the booster antennas 8 is checked. This check can be done for example by means of a network analyzer.
  • the specified tolerances of the booster antennas 8 can be freely programmed. If the tolerances are at the limit, a warning appears and no electronic data carriers are placed in the respective faulty, critical antennas.
  • the singulated chip modules 20 with the leadframe tape 2 formed by the internal loop antenna are then by means of a pick-and-place unit 42nd
  • the pick-and-place unit 42 has a rotation design in order to be able to deposit the chip modules 20 into the cavities of the substrate 6 at a freely selectable angle of attack. Such a rotation of the pick-and-place unit 42
  • Chip modules 20 is advantageous because it improves the bending and torsional compatibility of the electronic component provided with the substrate film.
  • the adhesive layer 14 formed, for example, as a HAF film is then activated by means of an activation device 48. This is the concrete solution
  • Activation device 48 is also designed as an ultrasonic tool, which is movably guided in the X and Y directions, so that all cavities can be approached after each other in order to activate the adhesive layer 14 - the chip module 20 is then respectively positively and non-positively secured in the cavity.
  • test station 50 the function of the respective chip modules 20 is then checked.
  • This test station 50 can be embodied, for example, as a transponder reader, via which the chip function can be checked after each process step.
  • a cover sheet 56 can then be applied to the substrate film following the curing of the adhesive.
  • the connection of this cover sheet 56 with the substrate film 6 is then carried out by means of a fuser 58, which may for example also be designed as a heated ultrasonic unit.
  • the Fuser 58 is preferably designed to be movable in the X, Y and Z directions, so that the cover sheet 56, which is attached according to customer requirements, is selectively welded to the core film (substrate 6).
  • cover sheet 56 One task of the cover sheet 56 is to cover the winding jumps of the booster antenna 8 explained in more detail below.
  • the fixing points are to be selected so that the subsequent production steps are not hindered.
  • these winding jumps can also be sunk into the substrate 6 via a suitable tool. In this case, it may be possible to dispense with the cover sheet 56.
  • the production plant 1 according to the invention in the exemplary embodiment shown is additionally provided with one
  • Marking device 60 is provided, via which a bad part marking.
  • This marking device may be, for example, an inkjet printer or the like.
  • the film substrate 6 provided in this way with the chip modules 20 is then sent for further processing.
  • a test station 50 can be provided after each process step, so that a continuous process control is ensured.
  • the UID is also stored in a database prior to stamping, and the respective determined via the test station 50 accordingly
  • FIG. 4 shows a variant of the exemplary embodiment explained in FIG. A difference between the two manufacturing plants 1 is that when
  • Embodiment according to Figure 4 a standard lead frame tape 2 without adhesive layer 14 is used.
  • the adhesive required for fixing the position of the chip module 20 is then introduced via an adhesive metering device 62 directly into the previously formed cavities.
  • the chip module feed may be replaced by a wafer unit. It will, however
  • Figure 5 shows a partial view of the substrate (film substrate) 6, on which the booster antenna 8 is arranged.
  • the cavity 64 was formed in the substrate 6.
  • adhesive 66 is then metered via the adhesive metering device 62.
  • the cavity 64 is preferably centered with respect to
  • Amplifier windings (Windungspar) of the booster antenna 8 is arranged.
  • the chip module 20 is then placed in the cavity 64 and on the adhesive 66 by means of the pick-and-place unit 42 and activated in the manner described above, so that the chip module 20 is fixed in position.
  • 5 shows the integrated into the chip module 20 loop antenna 68. The further processing is analogous to Figure 1, so that more
  • FIG. 6 shows a further variant of the production method according to the invention or a production plant according to the invention.
  • no dosage of an adhesive 66 but it is about a suitable
  • the activation in particular in the case of metering of an adhesive 66 according to FIG. 5, can also be effected by means of UV radiation, which from below, i. from the side facing away from the chip module 20 side of the substrate 6 applied.
  • the chip modules 20 are each arranged on a leadframe tape 2.
  • An embodiment is explained with reference to FIGS. 8 and 9, in which the "naked" chips 21 explained in the introduction, i. not provided with a Leadframetape 2 Chips21, are processed.
  • FIG. 7 shows the said "bare” chip 21 latest design.
  • the loop antenna is integrated into one of the silicon layers of the chip 21, so that practically the chip module with the bonded loop antenna can be dispensed with and the chip 21 requires a much smaller area than the chip module 20.
  • This "bare” chip 21 is then in turn inserted into the winding window (72) of the booster antenna 8, and according to the small dimensions of the chip 21 also less space for the winding window 72 is needed.
  • FIG. 8 shows five main steps of such a production.
  • FIG. 8 shows the substrate 6 with the booster antenna 8 laid thereon.
  • the cavity 64 for receiving the bare chip 21 is first formed via the forming device 28 with the forming tool 30 and the ultrasonic tool 32.
  • adhesive is then metered into this cavity 64 by means of an adhesive metering device 62 and a bare chip 21 is inserted into the cavity 64 by means of the pick-and-place unit 42.
  • the adhesive is then first applied via a heating die 52 during a predetermined period of time with pressure and temperature, so that the adhesive is activated. The bond is then cooled by means of the cooling stamp 54, so that the adhesive cures accordingly.
  • the "naked" chip 21 with the integrated loop antenna is fixed in position in the cavity 64 and positioned relative to the booster antenna 8 of the substrate 6 such that an inductive signal transmission from the loop layer integrated in the chip layer. Antenna to the booster antenna 8 is enabled.
  • the resulting transponder inlay (substrate film) can be formed extremely thin with a thickness of less than 200 pm.
  • the antenna is laid on a thermoplastic substrate / inlay. This has the advantage over an antenna formed by etching on PET that there is no "foreign body" in the complete structure.
  • the processing of such PET substrates is problematic, since usually cards for banking, transport, elD products made of PVC or PC exist and also synthetic paper (Teslin) is included and these materials difficult with PET by lamination or gluing to be processed.
  • the loop antenna 68 is inserted into a winding window 72 of the booster antenna 8. Accordingly, these two antennas are arranged on the same side of the substrate 6.
  • the booster antenna 8 and the loop antenna 68 are arranged on opposite sides of the substrate 6, wherein the windings of the antennas overlap each other at least in sections, so that the induction is improved compared to the solution described above.
  • FIG. 10 again shows an individual representation of a device according to the invention
  • Chip module 20 in which approximately the center of the actual chip 74 is arranged, which is contacted with the loop antenna 68. Whose turns are wrapped around the chip 74, wherein in the illustrated embodiment, approximately rectangular windings are provided, of course, also a different geometry can be formed.
  • FIG. 11 shows a leadframe tape 2 on which a multiplicity of chip modules 20 are arranged. As explained above, this Leadframetape 2 is on a
  • Lead frame memory 12 wound, then during processing the
  • Chip modules 20 are punched out.
  • Figures 12a, 12b, 12c show an intermediate product which is used in the
  • FIG. 12a shows the punched-out, transparently illustrated substrate 6 on whose large area visible in FIG. 12a the booster antenna 8 has been laid.
  • FIG. 12b shows the corner region of the substrate 6 lying at the top right in FIG. 12a, in which the actual booster antenna 8 with the above-described
  • Winding window 72 is formed.
  • the booster antenna 8 is formed with a plurality of turns extending from outside to inside.
  • the end portion of the antenna wire is then placed over the previously laid turns out of the center of the booster antenna 8, so that there is a winding jump 76 in this area, which projects slightly upwards to the viewer and thus represents a potential hazard, since in the further production or in the use of this uneven area can lead to snagging or the like.
  • a corresponding winding jump 78 arises in the area of the other
  • Antennendrahtendes which extends out of the frame formed only by a few large windings, which surrounds the actual booster antenna 8.
  • FIG. 12c shows the rear side of the substrate 6, which is shown as transparent, so that the above-described winding jump 76 is visible.
  • the rear side of the chip module 20 is visible, on which the loop antenna 68 visible in FIG. 12b is formed, which is thus arranged on this rear side of the substrate 6.
  • the turns of the loop antenna 68 overlap in sections with the turns of the booster antenna 8 - while it can
  • the variant according to Figures 11 and 12 are also made more compact, since the loop antenna 68 and booster antenna 8 are arranged opposite to each other and are spaced apart only by the substrate film. As mentioned above, in the substrate film 6, the cavity 64 is formed, in which the chip module 20 is inserted flush.
  • cover sheet 56 serves as previously described
  • Embodiment also to cover the winding jumps 76, 78.
  • FIG. 13a shows a possibility of sinking these turns 30, 76 into the substrate 6 so that they no longer project out of the substrate surface.
  • a pressing tool 80 for pressing in the winding jumps 76, 78 into the substrate 6 is used. The latter is doing with the
  • Booster antenna 8 and formed thereon Windungssprüngen 76, 78 upwards (view of Figure 13a) pointing to a heated pad 82 placed.
  • the Press tool 80 has a likewise heated press plate 84, which is held on an extendable in the direction of the support 82 press head 86.
  • Antenna wire no longer protrude.
  • FIG. 13b shows an enlarged view of the pressing tool 80 according to FIG. 13a. It can be seen clearly in this illustration, the press plate 84 indicative booster antenna 8 and the two Windungssprünge 76, 78, which are then pressed on further lowering of the press plate 84 in the substrate 6, said substrate 6 rests on the support 82.
  • FIG. 14 shows a variant in which the substrate 6 with the booster antenna points to the support 82.
  • the booster antenna 8 then rests on this heated support 82 and the chip module 20 points towards the press plate 84.
  • the two winding jumps 76, 78 are also in this relative position on the support 82, so that when lowering the press plate 34 by the pressure and temperature influence the
  • Windungssprünge 76, 78 are also pressed into the substrate material.
  • FIG. 15 shows one that can be used in series production
  • Pressing device 88 has a plurality of pressing tools 80a to 80i, which are held on a gantry 90 and whose pressing plates 84 (only the pressing plate 84i is provided with a reference numeral) are lowerable towards a substrate sheet on which a plurality of booster antennas are laid.
  • the winding jumps 76, 78 of these booster antennas 8 are then pressed into the substrate by lowering the pressing tools 80a to 80i simultaneously.
  • the processing of the substrate / the transponder layer before or after this pressing device then takes place in the
  • a transponder film substrate preferably consists only of a layer with a shaped cavity for receiving the chip module or the "bare" chip.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

La présente invention concerne un procédé et un système de production permettant de produire un substrat de film de transpondeur. Un module de puce comportant une antenne cadre ou une puce « nue » pourvue d'une antenne cadre intégrée est inséré dans un substrat d'antenne amplificateur. Le substrat de film de transpondeur comprend de préférence uniquement une couche pourvue d'une cavité moulée destinée à recevoir le module de puce ou la puce « nue ».
PCT/EP2019/063496 2018-05-24 2019-05-24 Procédé et système de production pour produire un substrat de film WO2019224364A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018112476.7 2018-05-24
DE102018112476.7A DE102018112476B4 (de) 2017-06-02 2018-05-24 Verfahren und Fertigungsanlage zum Herstellen eines Foliensubstrats

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WO2019224364A1 true WO2019224364A1 (fr) 2019-11-28

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Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0724228A2 (fr) 1995-01-26 1996-07-31 Giesecke & Devrient GmbH Procédé de montage d'un module électronique dans un corps de carte
EP0826190A1 (fr) 1995-05-03 1998-03-04 Siemens Aktiengesellschaft Carte a puce sans contact
DE19645067A1 (de) * 1996-10-09 1998-05-07 Pav Card Gmbh Verfahren und Verbindungsanordnung zum Herstellen einer Chipkarte
DE10110939B4 (de) 2001-03-07 2004-07-08 Mühlbauer Ag Verfahren und Vorrichtung zum Heißpressverbinden eines Chipmoduls mit einem Trägersubstrat
EP2074560A1 (fr) 2007-10-05 2009-07-01 Smartrac IP B.V. Insert pour transpondeur pour un document personnel, et son procédé de fabrication
US20120024272A1 (en) 2010-07-30 2012-02-02 Toyota Jidosha Kabushiki Kaisha Fuel injection amount control system and fuel injection amount control device for multi-cylinder internal combustion engine
EP2588998A1 (fr) 2010-07-01 2013-05-08 Giesecke & Devrient GmbH Procédé de fabrication d'un corps de support de données pour un support de données portatif et corps de support de données
US20140004220A1 (en) 2011-03-23 2014-01-02 Areva Inc. Press with Improved Maintenance
US20140263663A1 (en) 2013-03-18 2014-09-18 Infineon Technologies Ag Smart card module arrangement
US20150053772A1 (en) 2013-08-26 2015-02-26 Infineon Technologies Ag Chip arrangement, analysis apparatus, receiving container, and receiving container system
DE102017100719A1 (de) * 2016-08-22 2018-02-22 Ulrich Lang Verfahren zum Herstellen eines Prelaminats und Fertigungsanlage

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0724228A2 (fr) 1995-01-26 1996-07-31 Giesecke & Devrient GmbH Procédé de montage d'un module électronique dans un corps de carte
EP0826190A1 (fr) 1995-05-03 1998-03-04 Siemens Aktiengesellschaft Carte a puce sans contact
DE19645067A1 (de) * 1996-10-09 1998-05-07 Pav Card Gmbh Verfahren und Verbindungsanordnung zum Herstellen einer Chipkarte
DE10110939B4 (de) 2001-03-07 2004-07-08 Mühlbauer Ag Verfahren und Vorrichtung zum Heißpressverbinden eines Chipmoduls mit einem Trägersubstrat
EP2074560A1 (fr) 2007-10-05 2009-07-01 Smartrac IP B.V. Insert pour transpondeur pour un document personnel, et son procédé de fabrication
EP2588998A1 (fr) 2010-07-01 2013-05-08 Giesecke & Devrient GmbH Procédé de fabrication d'un corps de support de données pour un support de données portatif et corps de support de données
US20120024272A1 (en) 2010-07-30 2012-02-02 Toyota Jidosha Kabushiki Kaisha Fuel injection amount control system and fuel injection amount control device for multi-cylinder internal combustion engine
US20140004220A1 (en) 2011-03-23 2014-01-02 Areva Inc. Press with Improved Maintenance
US20140263663A1 (en) 2013-03-18 2014-09-18 Infineon Technologies Ag Smart card module arrangement
US20150053772A1 (en) 2013-08-26 2015-02-26 Infineon Technologies Ag Chip arrangement, analysis apparatus, receiving container, and receiving container system
DE102017100719A1 (de) * 2016-08-22 2018-02-22 Ulrich Lang Verfahren zum Herstellen eines Prelaminats und Fertigungsanlage

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