WO2019219177A1 - Carrier for an optoelectronic device, method for producing a carrier for an optoelectronic device - Google Patents

Carrier for an optoelectronic device, method for producing a carrier for an optoelectronic device Download PDF

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Publication number
WO2019219177A1
WO2019219177A1 PCT/EP2018/062611 EP2018062611W WO2019219177A1 WO 2019219177 A1 WO2019219177 A1 WO 2019219177A1 EP 2018062611 W EP2018062611 W EP 2018062611W WO 2019219177 A1 WO2019219177 A1 WO 2019219177A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead
connecting material
carrier
recess
lead part
Prior art date
Application number
PCT/EP2018/062611
Other languages
French (fr)
Inventor
Chui Wai CHONG
Seong Tak KOAY
Adelene NG
Long Tat YEW
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Priority to PCT/EP2018/062611 priority Critical patent/WO2019219177A1/en
Publication of WO2019219177A1 publication Critical patent/WO2019219177A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Definitions

  • a carrier for an optoelectronic device is provided.
  • a carrier for an optoelectronic device is provided.
  • the optoelectronic device may be mounted on the carrier.
  • the optoelectronic device may be a semiconductor chip, preferably a light-emitting diode chip. It is also possible that the optoelectronic device may be a radiation detecting chip like a photodiode chip.
  • the carrier has a main extension plane, wherein a vertical direction extends
  • the carrier comprises a first lead.
  • the first lead may comprise a first main surface, which extends in lateral directions.
  • the first main surface may form a first mounting area for the optoelectronic device.
  • the carrier comprises a second lead.
  • the second lead may comprise a second main surface extending in lateral directions.
  • the second main surface may be formed as a mounting area for the
  • the first lead is provided to be contacted to an electrical polarity, which may be opposite to an electrical polarity which may be provided to the second lead.
  • the first lead and the second lead require electrical separation and are separated from each other by an electrically
  • the first lead and the second lead may comprise or consist of a metal material like, for example, at least one of the following materials: copper, silver, aluminum, gold, nickel, palladium and tin.
  • the carrier comprises a connecting material, which is arranged between the first lead and the second lead and which forms the electrically
  • the connecting material connects the first lead and the second lead in a mechanically stable manner.
  • the connecting material is arranged between a side surface of the first lead and a side surface of the second lead facing each other.
  • the connecting material is electrically insulating.
  • the first lead may be contacted to a first electrical potential and the second lead may be contacted to a second electrical potential of opposite polarity.
  • the connecting material may comprise or consist of a plastic material like, for example, at least one of the following materials: PPA (polyphthalamide) , PCT
  • the connecting material is shaped in such a way that is has no mirror symmetry with respect to a sectional plane which extends perpendicular to a main extension plane of the carrier and extends along a direction of largest extent of the connecting material.
  • the connecting material has a width and a length in the main extension plane.
  • the length may extend over an entire area of the main extension plane, thus being the largest extent of the connecting material and thus defining the direction of largest extent of the connecting material.
  • the side face of the first lead and the side face of the second lead facing each other are shaped in such a way that they do not have a mirror symmetry with respect to the sectional plane, either.
  • the connecting material is shaped in such a way that it has a point symmetry with respect to a point which is located in the middle of the separation gap between the first lead and the second lead for every cross sectional plane perpendicular to the direction of largest extent of the connecting material.
  • the middle of the separation gap may be depicted by the point, which is equally distant from a maximal lateral extension as from a maximal vertical extension of the cross sectional plane perpendicular to the largest extent of the connecting material.
  • the point is a virtual point.
  • the carrier for an optoelectronic device comprises a first lead, a second lead, and a
  • connecting material which is arranged between the first lead and the second lead, wherein the connecting material is electrically insulating, and the connecting material is shaped in such a way that it has no mirror symmetry with respect to a sectional plane which extends perpendicular to a main extension plane of the carrier and extends along a direction of largest extent of the connecting material.
  • Carriers which are formed to carry an optoelectronic device may comprise two leads which are spaced apart from each other. The two leads may be connected by means of an
  • One idea of the carrier described here is, inter alia, to use a connecting material connecting the two leads while the connecting material is shaped in such a way that it has no mirror symmetry with respect to a sectional plane which extends perpendicular to a main extension plane of the carrier and extends along a direction of largest extent of the connecting material. This is achieved e.g. by a step-like shape of the connecting material for every cross sectional plane perpendicular to the direction of largest extent of the connecting material.
  • the end parts of the leads facing each other are interlocked without touching each other.
  • the connecting material is in direct contact with the first lead and the second lead.
  • the connecting material has the same shape as the corresponding side surfaces of the fist lead and the second lead.
  • the connecting material provides an adhesion between the first and the second lead, which are thus connected in a mechanically stable manner.
  • the connecting material has at least two side surfaces, wherein a first and a second side surface extend traverse to the main extension plane.
  • the first side surface faces the side surface of the first lead and the second side surface faces the side surface of the second lead. It is possible that the two side surfaces extend parallel to each other.
  • the two side surfaces may be tilted to a direction perpendicular to the first and the second main surfaces by an angle of between and including 30° and 60°, for example about 45°.
  • the at least two side surfaces are curved.
  • the distance between the two side surfaces is equal for all sectional planes extending parallel to the main extension plane.
  • the first side surface may have a concave or convex curvature, while the second side surface may have a curvature which is convex or concave, respectively.
  • the connecting material has a step-like shape for a cross sectional plane
  • the side surface of the first lead and the side surface of the second lead facing each other also show the step-like shape. Such an arrangement of the first and the second leads and the connecting material in between promotes the mechanical stability of the carrier.
  • the first lead and the second lead are overlapping in places in plan view, i.e. viewed in a direction perpendicular to the main extension plane of the carrier on the top side of the carrier.
  • the first lead has a thickness in a region of its side surface which is smaller than a thickness of the first lead remote from the side surface.
  • the second lead has a thickness in a region of its side surface which is smaller than a thickness of the second lead remote from the side surface.
  • These two regions may be at a same lateral position, such that the first lead may be arranged above the second lead, wherein the first lead and the second lead do not touch each other.
  • the sectional plane running perpendicular to a main extension plane of the carrier and extending along the largest extent of the connecting material always cuts the first lead, the second lead and the
  • connecting material in the region where the first lead and the second lead are overlapping in plan view.
  • the first and the second lead are interlocked and do not touch each other because of the connecting material arranged in between.
  • such an arrangement reduces the stress acting on the connecting material due to an external force, and cracks or breakings of the connecting material are prevented .
  • the connecting material has at least four side surfaces, wherein the first, the second, a third and a fourth side surface extend traverse to the main extension plane.
  • the first side surface is arranged opposite to the second side surface and the third surface is arranged opposite to the fourth side surface.
  • a distance between the first and the second side surfaces may be constant, such that the distance between the first and the second side surfaces is equal for all sectional planes extending parallel to the main extension plane.
  • a distance between the third side surface and the fourth side surface may be constant, such that the distance between the third side surface and the fourth side surface is equal for all sectional planes extending parallel to the main extension plane.
  • the first and the third side surfaces are facing the first lead, whereas the second and the fourth side surfaces are facing the second lead.
  • each pair comprising the first and the second side surfaces and the third and the fourth side surfaces may be tilted to a direction perpendicular to the first and the second main surface by an angle of between and including 30° and 60°, for example about 45°.
  • oblique side surfaces reduce the stress at an interface of the first and second leads and the connecting material due to an external force acting on the first or the second lead perpendicular to the main extension plane.
  • first and the third side surfaces may be spaced apart from each other.
  • second and the fourth side surfaces may be spaced apart from each other.
  • the fifth and the sixth side surfaces extend parallel to the main extension plane of the carrier.
  • the first and the third side are parallel to the main extension plane of the carrier.
  • first and the third side surfaces may not overlap with each other in a side view being the cross sectional plane perpendicular to the largest extent of the connecting material.
  • the second and the fourth side surfaces may not overlap with each other in a side view.
  • the points of the first and the third side surfaces being in connection with the fifth side surface may be spaced apart in a direction parallel to the main extension plane.
  • the points of the second and the forth side surfaces being in connection with the sixth side surface may be spaced apart in a direction parallel to the main extension plane.
  • a region of the connecting material between the first and the second side surfaces is spaced apart in a direction parallel to the main extension plane from a region of the connecting material between the third and the fourth side surfaces.
  • solely the fifth and the sixth side surfaces are overlapping in places in plan view.
  • the connecting material may have a thickness in the region between the first side surface and the second side surface, as well as in the region between the third side surface and the fourth side surface, which is smaller than a thickness in the region of the fifth and the sixth side surfaces where they are overlapping.
  • the first and the second lead are
  • the connecting material terminates flush with the first lead and the second lead on a top and/or bottom surface.
  • the top surface is formed by the first and the second main surface of the first and the second lead, respectively.
  • the side surfaces of the connecting material as well as the side surfaces of the first and the second lead connect the top surface with the opposed bottom surface.
  • an area of the top or the bottom surface of the first lead and the second lead is equal.
  • the connecting material is arranged substantially in the middle of the top or the bottom surface.
  • the connecting material separates the top or the bottom surface, so that the areas of the surfaces are equal.
  • the first mounting area and the second mounting area are of equal size.
  • the areas of the top or the bottom surface of the first lead and the second lead are not equal.
  • the area of the top or the bottom surface of the first lead is bigger than the area of the top or the bottom surface of the second lead or vice versa. If an externally applied force acts on a local region on the bigger area, the force may be distributed over the bigger area and thus cracks or breakings of the connecting material are prevented.
  • the connecting material comprises a mold material, in which metallic particles are introduced.
  • the metallic particles may comprise the same metal as the first lead and the second lead or consist thereof.
  • warpage of the carrier may be reduced due to the increased metal ratio within the
  • the metal ratio does not have any effect on the conductivity and is set up such that the connecting material is still electrically insulating.
  • an optoelectronic device is provided.
  • the optoelectronic device may comprise a carrier which is described hereinbefore. All features disclosed in connection with the carrier are therefore also disclosed in connection with the optoelectronic device and vice versa.
  • the optoelectronic device comprises a carrier and an optoelectronic
  • the semiconductor chip comprises a semiconductor body.
  • the semiconductor body is, for example, a semiconductor body grown epitaxially.
  • the semiconductor body may comprise an n-conducting region, an active region provided for generating electromagnetic
  • the semiconductor body is based, for example, on a III-V semiconductor material, preferably on a nitride compound semiconductor material.
  • contact elements may be arranged on the
  • the contact elements may comprise a metal or consist thereof.
  • the contact elements may comprise a metal or consist thereof.
  • the optoelectronic semiconductor chip is electrically connected to the first lead and the second lead.
  • the optoelectronic device may be mounted on the first mounting area and the second mounting area of the first and the second lead.
  • the optoelectronic device may be mounted on the first mounting area or the second mounting area, whereas the optoelectronic device is connected via a wire bond to the second mounting area or the first mounting area.
  • the method produces a carrier described hereinbefore. All features disclosed in connection with the carrier are therefore also disclosed in connection with the method and vice versa.
  • the method comprises the step of providing a first lead part comprising or consisting of a lead material.
  • the lead material comprises a metal or consists of a metal.
  • the lead material may comprise or consist of the following materials: copper, silver, aluminum, gold, nickel, palladium and tin.
  • the first lead part has a first main surface being a main extension plane, wherein a vertical direction extends perpendicular to the main extension plane and lateral directions extend parallel to the main extension plane .
  • the method comprises the step of creating a contiguous recess in the first lead part.
  • the recess does not extend through the first lead part completely in a vertical direction.
  • a bottom part of the recess is formed by the first lead part.
  • the recess extends contiguously along a strip in lateral directions.
  • the strip may have a width and a length, wherein the length may extend over an entire area of the first lead part.
  • the recess extends along a side surface of the first lead part.
  • the material of the first lead part may be removed such that a side surface of the first lead part is removed in places.
  • the recess creates a first side surface and a second side surface in the first lead part extending
  • each of the first and the second side surfaces of the first lead part may be tilted to a direction perpendicular to the main extension plane by an angle of between and including 30° and 60°, for example about 45° .
  • first and the second side surfaces of the first lead part are connected via a third side surface of the first lead part.
  • the third side surface may extend
  • the first lead part may have a thickness in the region of the recess which is smaller than a thickness of the first lead part remote from the recess.
  • the method comprises the step of providing a second lead part, which is arranged opposite to and spaced apart from the side surface of the first lead part having a recess.
  • the second lead part may have a second main surface being parallel to the main
  • the second lead part may have a first side surface facing the recess of the first lead part.
  • the first side surface of the second lead part may extend substantially perpendicular to a main extension plane of the second lead part.
  • the first side surface of the second lead part may be curved or tilted to the main extension plane.
  • the second lead part is arranged remote from the first lead part, such that a gap is present between the side surfaces of the first and the second lead part facing each other.
  • the second lead part may comprise the same material as the lead material of the first lead part or consist thereof.
  • the method comprises the step of filling the recess and a gap between the first lead part and the second lead part with the connecting material.
  • the recess and the gap between the side surfaces of the first and the second lead part facing each other are filled completely with the connecting material.
  • a material of the connecting material is present in a flowable form. In this case, the connecting material is cured after filling.
  • the connecting material protrudes above the recess in places.
  • the connecting material protrudes above the main extension plane in a vertical direction in places.
  • a top surface as well as side surfaces of the connecting material protruding above the main extension plane in a vertical direction may be exposed and freely accessible.
  • a top surface of the connecting material which is not in the region where the connecting material protrudes above the main extension plane may terminate flush with the second main surface of the second lead part, which is also exposed and freely
  • the method comprises the step of plating further lead material on the first lead part.
  • the further lead material is applied using a plating method from a side where the top surface of the connecting material protrudes above the main extension plane in a vertical direction.
  • the further lead material is plated on the first lead part such that the exposed side surface of the connecting material facing the first lead part is completely covered with the further lead material.
  • the lead material on the first lead part terminates flush with the top surface of the connecting material.
  • the further lead material may comprise the same material as the first and/or the second lead part or consist thereof.
  • the method comprises the step of plating further lead material on the second lead part and on the connecting material in places.
  • the further lead material is applied using a plating method from a side where the top or the bottom surface of the connecting material protrudes above the main extension plane in a vertical direction.
  • the further lead material is plated on the second lead part such that the exposed side surface of the connecting material facing the second lead part is completely covered with the further lead material.
  • the further lead material is plated on the top surface of the connecting material in a region where the top surface of the connecting material does not protrude above the main extension plane in a vertical direction.
  • the further lead material on the second lead part terminates flush with the top surface of the connecting material in the region where the connecting material
  • this top surface of the connecting material is free of the lead part.
  • a lead plate is
  • the lead plate may comprise the lead material of the first and/or second lead part or consist thereof.
  • the recess and/or the further recess are/is created using a chemical etching process.
  • the etching process is a chemical wet etching process.
  • the connecting material is filled in the recess and the gap or the further recess using a molding process.
  • the connecting material may be applied using a compression molding process, an injection molding process or lamination process.
  • filling the connecting material in the recess and the gap or the further recess is performed using a suitable application process, which is different to the molding process.
  • the carrier for an optoelectronic device as well as a method for producing a carrier for an
  • Figures 1, 2, 3, 4 and 5 show schematic representations of process steps of an embodiment of a method described herein for producing a carrier
  • FIGS 6, 7, 8, 9 and 10 show schematic representations of embodiments of the carrier described herein.
  • a lead plate 1 is provided.
  • a lead material of the lead plate 1 is copper.
  • a further recess 4 is created penetrating the lead plate 1 completely.
  • the further recess 4 divides the lead plate 1 in a first lead part 2 and a second lead part 3.
  • the first lead part 2 and the second lead part 3 have a first main surface 6 and a second main surface 7, respectively, which are flush with each other.
  • the further recess 4 creates a gap 5 between a side surface of the first lead part 8 and a side surface of the second lead part 9 facing each other.
  • the further recess 4 is created using an etching process, which results in the side surface of the first lead part 8 and the side surface of the second lead part 9
  • a contiguous recess 10 is created in the first lead part 2, as shown in connection with Figure 3.
  • the recess 10 extends along the side surface of the first lead part 8 facing the side surface of the second lead part 9. Further, the recess 10 does not extend through the first lead part 2 completely.
  • the recess 10 extends along the side surface of the first lead part 8.
  • the lead material of the first lead part 2 is removed such that the side surface of the first lead part 8 is removed in places.
  • the recess 10 creates a first side surface 8a and a second side surface 8b in the first lead part extending substantially perpendicular to the first main surface of the first lead part 6.
  • the first side surface and the second side surface of the first lead part 8a, 8b are connected via a third side surface of the first lead part 8c.
  • the third side surface of the first lead part 8c extends substantially parallel to the first main surface of the first lead part 6.
  • the recess 10 and the gap 5 between the first lead part 2 and the second lead part 3 are filled with a connecting material 11.
  • the connecting material 11 protrudes above the recess 10 in places.
  • a top surface of the connecting material 12a and side surfaces of the connecting material 12b protruding above the main extension plane in a vertical direction are exposed and freely accessible. Further, a top surface of the
  • connecting material 12a terminating flush with the second main surface of second lead part 7 is also exposed and freely accessible .
  • a further lead material is plated on the first lead part 2 and the second lead part 3, which is shown in connection with Figure 5.
  • the further lead material is applied from a side where the top surface of the connecting material 12a protrudes above the first main surface of the first lead part 6.
  • the further lead material is plated on the first lead part 2 such that the exposed side surface of the connecting material 12b facing the first lead part 2 is completely covered with the further lead material.
  • the further lead material on the second lead part 3 is applied also on the top surface of the connecting material 12a in the region where the connecting material 11 protrudes above the first main surface of the first lead part 6.
  • the further lead material is plated on the second lead part 3 such that the exposed side surface of the connecting material 12b facing the first lead part 2 is completely covered with the further lead material.
  • the further lead material plated on the first lead part 2 and the second lead part 3 terminates flush with the top surface of the connecting material 12a in the region where the connecting material 11 protrudes above the first main surface of first lead part 6.
  • a carrier 13 for an optoelectronic device is shown.
  • the carrier 13 comprises a first lead 14 and a second lead 15.
  • the connecting material 11 is arranged between the first lead 14 and the second lead 15, separating the first lead 14 and the second lead 15.
  • the first lead 14 has a first main surface 16, which forms a first mounting area for an optoelectronic device which may be mounted on the carrier 13.
  • the second lead 15 has a second main surface 17, which forms a second mounting area for the optoelectronic device.
  • the first main surface of the first lead 16 and the second main surface of the second lead 17 terminate flush with the connecting material 11.
  • the connecting material 11 is shaped in such a way that it has no mirror symmetry with respect to a sectional plane 18 which extends perpendicular to a main extension plane of the carrier 13 and extends along a largest extent of the
  • the sectional plane 18 is a virtual plane being depicted as a dashed line in Figure 6.
  • the connecting material 11 is shaped in such a way that it has a point symmetry with respect to a point 19 which is located halfway between the first lead 14 and the second lead 15. Again, the point is a virtual point and is depicted as a black dot in Figure 6.
  • the connecting material 11 comprises a first 20, a second 21, a third 22 and a fourth 23 side surface. These side surfaces 20, 21, 22, 23 extend perpendicular to the first and the second main surfaces of the first and second leads 16, 17.
  • the first side surface 20 is arranged opposite to the second side surface 21, and the third surface 22 is arranged
  • the connecting material 11 comprises a fifth side surface 24, which connects the first side surface 20 and the third side surface 22, and a sixth side surface 25 connecting the second side surface 21 and the fourth side surface 23.
  • the fifth 24 and the sixth 25 side surfaces extend parallel to the main surfaces 16, 17.
  • the first lead 14 and the second lead 15 are overlapping in a plan view.
  • connecting material 11 is arranged non-symmetrically between the first lead 14 and the second lead 15, as a result of which an area of the first main surface 16, which forms the first mounting area, is bigger than an area of the second main surface 17, which forms the second mounting area.
  • the carrier 13 as shown in connection with Figure 7 has a connecting material 11 being arranged symmetrically between the first lead 14 and the second lead 15.
  • an area of a bottom surface of the first lead 14 opposite of the first main surface 16 is equal to an area of a bottom surface of the second lead 15 opposite of the second main surface 17. It is also possible that the area of the first main surface 16 is equal to the area of the second main surface 17.
  • material 11 of the carrier 13 comprises the first 20, the second 21, the third 22 and the fourth 23 side surfaces extending traverse to the first main surface of the first lead 16 and the second main surface of the second lead 17.
  • the first 20 and the second 21 side surfaces extend parallel to each other.
  • the third 22 and the fourth 23 side surfaces extend parallel to each other.
  • the pairs of side surfaces being opposite and parallel to each other are tilted to a direction perpendicular to the first main surface of the first lead 16 and the second main surface of the second lead 17.
  • the connecting material 11 comprises the first side surface 20 and the second side surface 21 being transverse to the first main surface of the first lead 16 and the second main surface of the second lead 17.
  • the first side surface 20 faces the side surface of the first lead 14 and the second side surface 21 faces the side surface of the second lead 15.
  • the first 20 and the second 21 side surfaces have a
  • first side surface 20 facing the first lead 14 has a convex curvature
  • second side surface 21 facing the second lead 15 has a concave curvature
  • the embodiment in connection with Figure 10 shows the first 20 and the second 21 side surfaces of the connecting material 11 extending parallel to each other.
  • the first 20 and the third 22 side surfaces are tilted to the first main surface of the first lead 16 and the second main surface of the second lead 17.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

A carrier for an optoelectronic device is provided, comprising a first lead, a second lead, and a connecting material, which is arranged between the first lead and the second lead, wherein the connecting material is electrically insulating, and the connecting material is shaped in such a way that it has no mirror symmetry with respect to a sectional plane which extends perpendicular to a main extension plane of the carrier (13) and extends along a direction of largest extent of the connecting material (11).

Description

Description
CARRIER FOR AN OPTOELECTRONIC DEVICE, METHOD FOR PRODUCING A
CARRIER FOR AN OPTOELECTRONIC DEVICE
A carrier for an optoelectronic device is provided.
Furthermore an optoelectronic device and a method for
producing a carrier for an optoelectronic device are
provided .
It is an object of the present application to provide a carrier for an optoelectronic device which shows an improved mechanical stability. It is further intended to provide such an optoelectronic device and a method for producing such a carrier .
A carrier for an optoelectronic device is provided.
Preferably, the optoelectronic device may be mounted on the carrier. The optoelectronic device may be a semiconductor chip, preferably a light-emitting diode chip. It is also possible that the optoelectronic device may be a radiation detecting chip like a photodiode chip. The carrier has a main extension plane, wherein a vertical direction extends
perpendicular to the main extension plane and lateral
directions extend parallel to the main extension plane.
According to at least one embodiment, the carrier comprises a first lead. The first lead may comprise a first main surface, which extends in lateral directions. The first main surface may form a first mounting area for the optoelectronic device.
According to at least one embodiment the carrier comprises a second lead. The second lead may comprise a second main surface extending in lateral directions. The second main surface may be formed as a mounting area for the
optoelectronic device.
For example, the first lead is provided to be contacted to an electrical polarity, which may be opposite to an electrical polarity which may be provided to the second lead. Thus, the first lead and the second lead require electrical separation and are separated from each other by an electrically
insulating gap. The first lead and the second lead may comprise or consist of a metal material like, for example, at least one of the following materials: copper, silver, aluminum, gold, nickel, palladium and tin.
According to at least one embodiment, the carrier comprises a connecting material, which is arranged between the first lead and the second lead and which forms the electrically
insulating gap between the first and the second lead.
Preferably, the connecting material connects the first lead and the second lead in a mechanically stable manner.
Preferably, the connecting material is arranged between a side surface of the first lead and a side surface of the second lead facing each other.
According to at least one embodiment, the connecting material is electrically insulating. Thus, the first lead may be contacted to a first electrical potential and the second lead may be contacted to a second electrical potential of opposite polarity. The connecting material may comprise or consist of a plastic material like, for example, at least one of the following materials: PPA (polyphthalamide) , PCT
(polycyclohexylenedimethylene terephthalate) , WEMC (white epoxy mold compound) . According to at least one embodiment, the connecting material is shaped in such a way that is has no mirror symmetry with respect to a sectional plane which extends perpendicular to a main extension plane of the carrier and extends along a direction of largest extent of the connecting material.
Preferably, the connecting material has a width and a length in the main extension plane. For example, the length may extend over an entire area of the main extension plane, thus being the largest extent of the connecting material and thus defining the direction of largest extent of the connecting material. The side face of the first lead and the side face of the second lead facing each other are shaped in such a way that they do not have a mirror symmetry with respect to the sectional plane, either.
Furthermore, it is possible that the connecting material is shaped in such a way that it has a point symmetry with respect to a point which is located in the middle of the separation gap between the first lead and the second lead for every cross sectional plane perpendicular to the direction of largest extent of the connecting material. The middle of the separation gap may be depicted by the point, which is equally distant from a maximal lateral extension as from a maximal vertical extension of the cross sectional plane perpendicular to the largest extent of the connecting material. Here, the point is a virtual point.
In at least one embodiment, the carrier for an optoelectronic device comprises a first lead, a second lead, and a
connecting material, which is arranged between the first lead and the second lead, wherein the connecting material is electrically insulating, and the connecting material is shaped in such a way that it has no mirror symmetry with respect to a sectional plane which extends perpendicular to a main extension plane of the carrier and extends along a direction of largest extent of the connecting material.
Carriers which are formed to carry an optoelectronic device may comprise two leads which are spaced apart from each other. The two leads may be connected by means of an
insulating mold material between each other. The mold
material between the two leads is a weak point of the carrier and may break due to an applied external force.
One idea of the carrier described here is, inter alia, to use a connecting material connecting the two leads while the connecting material is shaped in such a way that it has no mirror symmetry with respect to a sectional plane which extends perpendicular to a main extension plane of the carrier and extends along a direction of largest extent of the connecting material. This is achieved e.g. by a step-like shape of the connecting material for every cross sectional plane perpendicular to the direction of largest extent of the connecting material. Thus, the end parts of the leads facing each other are interlocked without touching each other.
Advantageously, such an arrangement of the two leads having a broken symmetry reduces the stress acting on the connecting material due to an external force. Therefore, cracks or breakings of the connecting material are prevented.
According to at least one embodiment, the connecting material is in direct contact with the first lead and the second lead. Thus, the connecting material has the same shape as the corresponding side surfaces of the fist lead and the second lead. Furthermore, the connecting material provides an adhesion between the first and the second lead, which are thus connected in a mechanically stable manner.
According to at least one embodiment, the connecting material has at least two side surfaces, wherein a first and a second side surface extend traverse to the main extension plane. The first side surface faces the side surface of the first lead and the second side surface faces the side surface of the second lead. It is possible that the two side surfaces extend parallel to each other. The two side surfaces may be tilted to a direction perpendicular to the first and the second main surfaces by an angle of between and including 30° and 60°, for example about 45°.
According to at least one embodiment, the at least two side surfaces are curved. Preferably, the distance between the two side surfaces is equal for all sectional planes extending parallel to the main extension plane. Thus, the first side surface may have a concave or convex curvature, while the second side surface may have a curvature which is convex or concave, respectively.
According to at least one embodiment, the connecting material has a step-like shape for a cross sectional plane
perpendicular to the direction of largest extent of the connecting material. In particular, the side surface of the first lead and the side surface of the second lead facing each other also show the step-like shape. Such an arrangement of the first and the second leads and the connecting material in between promotes the mechanical stability of the carrier.
According to at least one embodiment, the first lead and the second lead are overlapping in places in plan view, i.e. viewed in a direction perpendicular to the main extension plane of the carrier on the top side of the carrier. For example, the first lead has a thickness in a region of its side surface which is smaller than a thickness of the first lead remote from the side surface. In turn, also the second lead has a thickness in a region of its side surface which is smaller than a thickness of the second lead remote from the side surface. These two regions may be at a same lateral position, such that the first lead may be arranged above the second lead, wherein the first lead and the second lead do not touch each other. Thus, the sectional plane running perpendicular to a main extension plane of the carrier and extending along the largest extent of the connecting material always cuts the first lead, the second lead and the
connecting material in the region where the first lead and the second lead are overlapping in plan view. In this region, the first and the second lead are interlocked and do not touch each other because of the connecting material arranged in between. Advantageously, such an arrangement reduces the stress acting on the connecting material due to an external force, and cracks or breakings of the connecting material are prevented .
According to at least one embodiment, the connecting material has at least four side surfaces, wherein the first, the second, a third and a fourth side surface extend traverse to the main extension plane. The first side surface is arranged opposite to the second side surface and the third surface is arranged opposite to the fourth side surface. Preferably, a distance between the first and the second side surfaces may be constant, such that the distance between the first and the second side surfaces is equal for all sectional planes extending parallel to the main extension plane. Further, a distance between the third side surface and the fourth side surface may be constant, such that the distance between the third side surface and the fourth side surface is equal for all sectional planes extending parallel to the main extension plane. For example, the first and the third side surfaces are facing the first lead, whereas the second and the fourth side surfaces are facing the second lead.
It is also possible, that each pair comprising the first and the second side surfaces and the third and the fourth side surfaces may be tilted to a direction perpendicular to the first and the second main surface by an angle of between and including 30° and 60°, for example about 45°. Advantageously, such oblique side surfaces reduce the stress at an interface of the first and second leads and the connecting material due to an external force acting on the first or the second lead perpendicular to the main extension plane.
According to at least one embodiment a fifth side surface connects the first and the third side surfaces and a sixth side surface connects the second and the fourth side
surfaces. Thus, the first and the third side surfaces may be spaced apart from each other. Further, the second and the fourth side surfaces may be spaced apart from each other.
According to at least one embodiment the fifth and the sixth side surfaces extend parallel to the main extension plane of the carrier. Preferably, the first and the third side
surfaces and the second and the fourth side surfaces are connected via the fifth and the sixth side surfaces,
respectively, such that the first and the third side surfaces may not overlap with each other in a side view being the cross sectional plane perpendicular to the largest extent of the connecting material. Further, the second and the fourth side surfaces may not overlap with each other in a side view. Thus, the points of the first and the third side surfaces being in connection with the fifth side surface may be spaced apart in a direction parallel to the main extension plane. Further, the points of the second and the forth side surfaces being in connection with the sixth side surface may be spaced apart in a direction parallel to the main extension plane.
It is possible that a region of the connecting material between the first and the second side surfaces is spaced apart in a direction parallel to the main extension plane from a region of the connecting material between the third and the fourth side surfaces. Thus, it is possible that solely the fifth and the sixth side surfaces are overlapping in places in plan view.
With such a configuration, the connecting material may have a thickness in the region between the first side surface and the second side surface, as well as in the region between the third side surface and the fourth side surface, which is smaller than a thickness in the region of the fifth and the sixth side surfaces where they are overlapping. In the region where solely the fifth and the sixth side surfaces are overlapping, also the first and the second lead are
overlapping in plan view.
According to at least one embodiment the connecting material terminates flush with the first lead and the second lead on a top and/or bottom surface. For example, the top surface is formed by the first and the second main surface of the first and the second lead, respectively. The side surfaces of the connecting material as well as the side surfaces of the first and the second lead connect the top surface with the opposed bottom surface. Preferably, the connecting material
terminates flush with the top surface. In addition it is possible that the connecting material terminates flush with the bottom surface.
According to at least one embodiment an area of the top or the bottom surface of the first lead and the second lead is equal. For example, the connecting material is arranged substantially in the middle of the top or the bottom surface. Thus, the connecting material separates the top or the bottom surface, so that the areas of the surfaces are equal. In this case, the first mounting area and the second mounting area are of equal size. An externally applied force acting on a local region on each of the areas is advantageously
distributed equally over the entire areas. Thus, the
mechanical stability of the carrier is further improved.
Alternatively, it is also possible that the areas of the top or the bottom surface of the first lead and the second lead are not equal. In this case, the area of the top or the bottom surface of the first lead is bigger than the area of the top or the bottom surface of the second lead or vice versa. If an externally applied force acts on a local region on the bigger area, the force may be distributed over the bigger area and thus cracks or breakings of the connecting material are prevented.
According to at least one embodiment, the connecting material comprises a mold material, in which metallic particles are introduced. The metallic particles may comprise the same metal as the first lead and the second lead or consist thereof. Advantageously, warpage of the carrier may be reduced due to the increased metal ratio within the
connecting material. The metal ratio does not have any effect on the conductivity and is set up such that the connecting material is still electrically insulating.
In addition, an optoelectronic device is provided.
Preferably, the optoelectronic device may comprise a carrier which is described hereinbefore. All features disclosed in connection with the carrier are therefore also disclosed in connection with the optoelectronic device and vice versa.
According to at least one embodiment, the optoelectronic device comprises a carrier and an optoelectronic
semiconductor chip. For example, the semiconductor chip comprises a semiconductor body. The semiconductor body is, for example, a semiconductor body grown epitaxially. The semiconductor body may comprise an n-conducting region, an active region provided for generating electromagnetic
radiation and a p-conducting region.
In the active region of the semiconductor body,
electromagnetic radiation in the spectral range between UV radiation and infrared radiation, in particular in the spectral range of visible light, is generated or detected during operation. For this purpose, the semiconductor body is based, for example, on a III-V semiconductor material, preferably on a nitride compound semiconductor material.
Furthermore, contact elements may be arranged on the
semiconductor body. The contact elements may comprise a metal or consist thereof. For example, the contact elements
comprise the same metal as the first lead and the second lead or consist thereof. According to at least one embodiment, the optoelectronic semiconductor chip is electrically connected to the first lead and the second lead. The optoelectronic device may be mounted on the first mounting area and the second mounting area of the first and the second lead. Alternatively, the optoelectronic device may be mounted on the first mounting area or the second mounting area, whereas the optoelectronic device is connected via a wire bond to the second mounting area or the first mounting area.
Furthermore, a method for producing a carrier for an
optoelectronic device is provided. Preferably, the method produces a carrier described hereinbefore. All features disclosed in connection with the carrier are therefore also disclosed in connection with the method and vice versa.
According to at least one embodiment, the method comprises the step of providing a first lead part comprising or consisting of a lead material. Preferably the lead material comprises a metal or consists of a metal. Particular
preferably, the lead material may comprise or consist of the following materials: copper, silver, aluminum, gold, nickel, palladium and tin. The first lead part has a first main surface being a main extension plane, wherein a vertical direction extends perpendicular to the main extension plane and lateral directions extend parallel to the main extension plane .
According to at least one embodiment, the method comprises the step of creating a contiguous recess in the first lead part. For example, the recess does not extend through the first lead part completely in a vertical direction. Thus a bottom part of the recess is formed by the first lead part. Furthermore, the recess extends contiguously along a strip in lateral directions. In plan view, the strip may have a width and a length, wherein the length may extend over an entire area of the first lead part.
According to at least one embodiment, the recess extends along a side surface of the first lead part. The lead
material of the first lead part may be removed such that a side surface of the first lead part is removed in places. Preferably, the recess creates a first side surface and a second side surface in the first lead part extending
substantially perpendicular to the main extension plane of the first lead part.
Alternatively, it is possible that each of the first and the second side surfaces of the first lead part may be tilted to a direction perpendicular to the main extension plane by an angle of between and including 30° and 60°, for example about 45° .
For example, the first and the second side surfaces of the first lead part are connected via a third side surface of the first lead part. The third side surface may extend
substantially parallel to a main extension plane of the first lead part. Thus, the first lead part may have a thickness in the region of the recess which is smaller than a thickness of the first lead part remote from the recess.
Alternatively, it is possible that the recess extends through the first lead part completely in a vertical direction. In this case, the resulting side surface of the first lead part may be curved or may be tilted to the main extension plane. According to at least one embodiment, the method comprises the step of providing a second lead part, which is arranged opposite to and spaced apart from the side surface of the first lead part having a recess. The second lead part may have a second main surface being parallel to the main
extension plane and being flush with the first main surface. The second lead part may have a first side surface facing the recess of the first lead part. The first side surface of the second lead part may extend substantially perpendicular to a main extension plane of the second lead part. Alternatively, the first side surface of the second lead part may be curved or tilted to the main extension plane.
The second lead part is arranged remote from the first lead part, such that a gap is present between the side surfaces of the first and the second lead part facing each other.
The second lead part may comprise the same material as the lead material of the first lead part or consist thereof.
According to at least one embodiment, the method comprises the step of filling the recess and a gap between the first lead part and the second lead part with the connecting material. Preferably, the recess and the gap between the side surfaces of the first and the second lead part facing each other are filled completely with the connecting material. Preferably, a material of the connecting material is present in a flowable form. In this case, the connecting material is cured after filling.
According to at least one embodiment, the connecting material protrudes above the recess in places. Preferably, the connecting material protrudes above the main extension plane in a vertical direction in places. Thus, a top surface as well as side surfaces of the connecting material protruding above the main extension plane in a vertical direction may be exposed and freely accessible. Further, a top surface of the connecting material which is not in the region where the connecting material protrudes above the main extension plane may terminate flush with the second main surface of the second lead part, which is also exposed and freely
accessible .
According to at least one embodiment, the method comprises the step of plating further lead material on the first lead part. Preferably, the further lead material is applied using a plating method from a side where the top surface of the connecting material protrudes above the main extension plane in a vertical direction. For example, the further lead material is plated on the first lead part such that the exposed side surface of the connecting material facing the first lead part is completely covered with the further lead material. Preferably, the lead material on the first lead part terminates flush with the top surface of the connecting material. In particular, the further lead material may comprise the same material as the first and/or the second lead part or consist thereof.
According to at least one embodiment, the method comprises the step of plating further lead material on the second lead part and on the connecting material in places. Preferably, the further lead material is applied using a plating method from a side where the top or the bottom surface of the connecting material protrudes above the main extension plane in a vertical direction. For example, the further lead material is plated on the second lead part such that the exposed side surface of the connecting material facing the second lead part is completely covered with the further lead material. Further the further lead material is plated on the top surface of the connecting material in a region where the top surface of the connecting material does not protrude above the main extension plane in a vertical direction.
Preferably, the further lead material on the second lead part terminates flush with the top surface of the connecting material in the region where the connecting material
protrudes above the main extension plane. Particularly preferably, this top surface of the connecting material is free of the lead part.
According to at least one embodiment, a lead plate is
provided, in which a further recess is created penetrating the lead plate completely and dividing the lead plate in a first lead part and a second lead part. The lead plate may comprise the lead material of the first and/or second lead part or consist thereof.
According to at least one embodiment, the recess and/or the further recess are/is created using a chemical etching process. Preferably, the etching process is a chemical wet etching process. Alternatively, it is possible to create the further recess via sawing or laser cutting.
According to at least one embodiment, the connecting material is filled in the recess and the gap or the further recess using a molding process. Preferably, the connecting material may be applied using a compression molding process, an injection molding process or lamination process. Alternatively, filling the connecting material in the recess and the gap or the further recess is performed using a suitable application process, which is different to the molding process.
In the following, the carrier for an optoelectronic device as well as a method for producing a carrier for an
optoelectronic device described herein will be discussed in more detail on the basis of exemplary embodiments of the associated figures.
The figures show:
Figures 1, 2, 3, 4 and 5 show schematic representations of process steps of an embodiment of a method described herein for producing a carrier; and
Figures 6, 7, 8, 9 and 10 show schematic representations of embodiments of the carrier described herein.
Identical, similar or identically acting elements are
provided with the same reference signs in the figures. The figures and the size ratios of the elements illustrated in the figures relative to one another are not to be regarded as being drawn to scale. Rather, individual elements may be exaggerated in size for better representation and/or better intelligibility.
With reference to Figures 1, 2, 3, 4 and 5, an exemplary embodiment of a method for the production of the carrier described herein is shown. As shown in Figure 1, a lead plate 1 is provided. Preferably, a lead material of the lead plate 1 is copper.
According to the method step depicted in connection with Figure 2, a further recess 4 is created penetrating the lead plate 1 completely. The further recess 4 divides the lead plate 1 in a first lead part 2 and a second lead part 3. The first lead part 2 and the second lead part 3 have a first main surface 6 and a second main surface 7, respectively, which are flush with each other. The further recess 4 creates a gap 5 between a side surface of the first lead part 8 and a side surface of the second lead part 9 facing each other. Here, the further recess 4 is created using an etching process, which results in the side surface of the first lead part 8 and the side surface of the second lead part 9
extending perpendicular to the first and the second main surface 6, 7 of the first and the second lead part 2, 3, respectively .
In a next step of the method, a contiguous recess 10 is created in the first lead part 2, as shown in connection with Figure 3. The recess 10 extends along the side surface of the first lead part 8 facing the side surface of the second lead part 9. Further, the recess 10 does not extend through the first lead part 2 completely.
The recess 10 extends along the side surface of the first lead part 8. The lead material of the first lead part 2 is removed such that the side surface of the first lead part 8 is removed in places. Thus, the recess 10 creates a first side surface 8a and a second side surface 8b in the first lead part extending substantially perpendicular to the first main surface of the first lead part 6. The first side surface and the second side surface of the first lead part 8a, 8b are connected via a third side surface of the first lead part 8c. The third side surface of the first lead part 8c extends substantially parallel to the first main surface of the first lead part 6.
In a further method step shown in connection with Figure 4 the recess 10 and the gap 5 between the first lead part 2 and the second lead part 3 are filled with a connecting material 11. The connecting material 11 protrudes above the recess 10 in places. A top surface of the connecting material 12a and side surfaces of the connecting material 12b protruding above the main extension plane in a vertical direction are exposed and freely accessible. Further, a top surface of the
connecting material 12a terminating flush with the second main surface of second lead part 7 is also exposed and freely accessible .
In a next step, a further lead material is plated on the first lead part 2 and the second lead part 3, which is shown in connection with Figure 5. The further lead material is applied from a side where the top surface of the connecting material 12a protrudes above the first main surface of the first lead part 6. The further lead material is plated on the first lead part 2 such that the exposed side surface of the connecting material 12b facing the first lead part 2 is completely covered with the further lead material.
The further lead material on the second lead part 3 is applied also on the top surface of the connecting material 12a in the region where the connecting material 11 protrudes above the first main surface of the first lead part 6. The further lead material is plated on the second lead part 3 such that the exposed side surface of the connecting material 12b facing the first lead part 2 is completely covered with the further lead material. Thus, the further lead material plated on the first lead part 2 and the second lead part 3 terminates flush with the top surface of the connecting material 12a in the region where the connecting material 11 protrudes above the first main surface of first lead part 6.
With reference to Figures 6, 7, 8, 9 and 10, exemplary embodiments of carriers 13 are shown.
According to the embodiment shown in connection with Figure 6, a carrier 13 for an optoelectronic device is shown. The carrier 13 comprises a first lead 14 and a second lead 15.
The connecting material 11 is arranged between the first lead 14 and the second lead 15, separating the first lead 14 and the second lead 15.
The first lead 14 has a first main surface 16, which forms a first mounting area for an optoelectronic device which may be mounted on the carrier 13. The second lead 15 has a second main surface 17, which forms a second mounting area for the optoelectronic device. The first main surface of the first lead 16 and the second main surface of the second lead 17 terminate flush with the connecting material 11.
The connecting material 11 is shaped in such a way that it has no mirror symmetry with respect to a sectional plane 18 which extends perpendicular to a main extension plane of the carrier 13 and extends along a largest extent of the
connecting material 11. The sectional plane 18 is a virtual plane being depicted as a dashed line in Figure 6. In particular, the connecting material 11 is shaped in such a way that it has a point symmetry with respect to a point 19 which is located halfway between the first lead 14 and the second lead 15. Again, the point is a virtual point and is depicted as a black dot in Figure 6.
The connecting material 11 comprises a first 20, a second 21, a third 22 and a fourth 23 side surface. These side surfaces 20, 21, 22, 23 extend perpendicular to the first and the second main surfaces of the first and second leads 16, 17.
The first side surface 20 is arranged opposite to the second side surface 21, and the third surface 22 is arranged
opposite to the fourth side surface 23. The distance between the pairs of opposite side surfaces parallel to the main surfaces 16, 17 is constant.
Furthermore, the connecting material 11 comprises a fifth side surface 24, which connects the first side surface 20 and the third side surface 22, and a sixth side surface 25 connecting the second side surface 21 and the fourth side surface 23. The fifth 24 and the sixth 25 side surfaces extend parallel to the main surfaces 16, 17.
In the region of the fifth and the sixth side surfaces 24,
25, the first lead 14 and the second lead 15 are overlapping in a plan view. Thus, the sectional plane 18, which runs perpendicular to the main extension plane of the carrier 13, cuts the first lead 14 and the second lead 15 for every position .
Such an arrangement of the first lead 14 and the second lead 15, interlocked without touching each other, reduces the stress acting on the connecting material due to an external force. Therefore, cracks or breakings of the connecting material are prevented.
Here the connecting material 11 is arranged non-symmetrically between the first lead 14 and the second lead 15, as a result of which an area of the first main surface 16, which forms the first mounting area, is bigger than an area of the second main surface 17, which forms the second mounting area.
Contrary to the embodiment of Figure 6, the carrier 13 as shown in connection with Figure 7 has a connecting material 11 being arranged symmetrically between the first lead 14 and the second lead 15. In this case, an area of a bottom surface of the first lead 14 opposite of the first main surface 16 is equal to an area of a bottom surface of the second lead 15 opposite of the second main surface 17. It is also possible that the area of the first main surface 16 is equal to the area of the second main surface 17.
In contrast to the embodiment of Figure 7, according to the embodiment in connection with Figure 8 the connecting
material 11 of the carrier 13 comprises the first 20, the second 21, the third 22 and the fourth 23 side surfaces extending traverse to the first main surface of the first lead 16 and the second main surface of the second lead 17.
Again, the first 20 and the second 21 side surfaces extend parallel to each other. Further, the third 22 and the fourth 23 side surfaces extend parallel to each other. The pairs of side surfaces being opposite and parallel to each other are tilted to a direction perpendicular to the first main surface of the first lead 16 and the second main surface of the second lead 17. According to the embodiment in connection with Figure 9, the connecting material 11 comprises the first side surface 20 and the second side surface 21 being transverse to the first main surface of the first lead 16 and the second main surface of the second lead 17. The first side surface 20 faces the side surface of the first lead 14 and the second side surface 21 faces the side surface of the second lead 15.
The first 20 and the second 21 side surfaces have a
curvature, while the distance between the first 20 and the second 21 side surfaces is equal for all sectional planes extending parallel to the first main surface of the first lead 16 and the second main surface of the second lead 17. Here, the first side surface 20 facing the first lead 14 has a convex curvature, while the second side surface 21 facing the second lead 15 has a concave curvature.
In contrast to the embodiment of Figure 9, the embodiment in connection with Figure 10 shows the first 20 and the second 21 side surfaces of the connecting material 11 extending parallel to each other. The first 20 and the third 22 side surfaces are tilted to the first main surface of the first lead 16 and the second main surface of the second lead 17.
The description made with reference to exemplary embodiments does not restrict the invention to these embodiments. Rather, the invention encompasses any novel feature and any
combination of features, including in particular any
combination of features in the claims, even if this feature or this combination is not itself explicitly indicated in the claims or exemplary embodiments. References
1 lead plate
2 first lead part
3 second lead part
4 further recess
5 gap
6 first main surface first lead part
7 second main surface second lead part
8 side surface first lead part
8a first side surface first lead part
8b second side surface first lead part 8c third side surface first lead part
9 side surface second lead part
10 recess
11 connecting material
12a top surface connecting material 12b side surface connecting material
13 carrier
14 first lead
15 second lead
16 first main surface first lead
17 second main surface second lead
18 sectional plane
19 point
20 first side surface
21 second side surface
22 third side surface
23 forth side surface
24 fifth side surface
25 sixth side surface

Claims

Claims
1. A carrier (13) for an optoelectronic device comprising
- a first lead (14),
- a second lead (15), and
- a connecting material (11), which is arranged between the first lead (14) and the second lead (15), wherein
- the connecting material (11) is electrically insulating, and
- the connecting material (11) is shaped in such a way that it has no mirror symmetry with respect to a sectional plane which extends perpendicular to a main extension plane of the carrier (13) and extends along a direction of largest extent of the connecting material (11) .
2. The carrier (13) according to the preceding claim, in which the connecting material (11) is in direct contact with the first lead (14) and the second lead (15) .
3. The carrier (13) according to one of the preceding claims, in which the connecting material (11) has at least two side surfaces (20, 21), wherein a first (20) and a second (21) side surface extend traverse to the main extension plane.
4. The carrier (13) according to one of the preceding claims, in which the at least two side surfaces (20, 21) are curved.
5. The carrier (13) according to one of the preceding claims, in which the connecting material (11) has a step-like shape for a cross sectional plane perpendicular to the direction of largest extent of the connecting material (11) .
6. The carrier (13) according to one of the preceding claims, in which the first lead (14) and the second lead (15) are overlapping in places in plan view.
7. The carrier (13) according to one of the preceding claims, in which the connecting material (11) has at least four side surfaces (20, 21, 22, 23), wherein the first (20), the second (21), a third (22) and a fourth (23) side surface extend traverse to the main extension plane.
8. The carrier (13) according the preceding claim, in which a fifth (24) side surface connects the first (20) and the second (21) side surfaces and a sixth (25) side surface connects the third (22) and the fourth (23) side surfaces.
9. The carrier (13) according to the preceding claim, in which the fifth (24) and the sixth (25) side surfaces extend parallel to the main extension plane.
10. The carrier (13) according to one of the preceding claims, in which the connecting material (11) terminates flush with the first lead (14) and the second lead (15) on a top and/or bottom surface.
11. The carrier (13) according to one of the preceding claims, in which an area of the top or the bottom surface of the first lead (14) and the second lead (15) is equal.
12. Carrier (13) according to one of the preceding claims, in which the connecting material (11) comprises a mold material, in which metallic particles are introduced.
13. An optoelectronic device comprising - a carrier (13) according to one of the preceding claims, and
- an optoelectronic semiconductor chip, wherein
- the optoelectronic semiconductor chip is electrically connected to the first lead (14) and the second lead (15) .
14. A method for producing a carrier (13) for an
optoelectronic device comprising the steps of
- providing a first lead part (2) comprising or consisting of a lead material,
- creating a contiguous recess (10) in the first lead part (2), wherein the recess (10) extends along a side surface of the first lead part (8),
- providing a second lead part (3) , which is arranged
opposite to and spaced apart from the side surface of the first lead part (8) having the recess (10),
- filling the recess (10) and a gap (5) between the first lead part (2) and the second lead part (3) with a connecting material (11), wherein the connecting material (11) protrudes above the recess (10) in places,
- plating further lead material on the first lead part (2), and
- plating further lead material on the second lead part (3) and on the connecting material (11) in places.
15. The method according to the preceding claim, wherein a lead plate (1) is provided, in which a further recess (4) is created penetrating the lead plate (1) completely and
dividing the lead plate (1) in the first lead part (2) and the second lead part (3) .
16. The method according to one of preceding claims 14 to 15, wherein the recess (10) and/or the further recess (4) are/is created using a chemical etching process.
17. The method according to one of preceding claims 14 to 16, wherein the connecting material (11) is filled in the recess (10) and the gap (5) or the further recess (4) using a molding process.
18. The method according to one of preceding claims 14 to 17, wherein a carrier (13) according to claims 1 to 12 is
produced .
PCT/EP2018/062611 2018-05-15 2018-05-15 Carrier for an optoelectronic device, method for producing a carrier for an optoelectronic device WO2019219177A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2018/062611 WO2019219177A1 (en) 2018-05-15 2018-05-15 Carrier for an optoelectronic device, method for producing a carrier for an optoelectronic device

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TW201344986A (en) * 2012-04-26 2013-11-01 Advanced Optoelectronic Tech Light emitting diode and method for manufacturing the same
TW201349600A (en) * 2012-05-18 2013-12-01 Advanced Optoelectronic Tech Light emitting diode and method for manufacturing the same
EP2819192A1 (en) * 2013-06-28 2014-12-31 Nichia Corporation Package for light emitting apparatus and light emitting apparatus including the same
WO2017056321A1 (en) * 2015-10-02 2017-04-06 大日本印刷株式会社 Lead frame with resin and manufacturing method for same, led package and manufacturing method for same
CN104659197B (en) * 2013-11-26 2017-11-07 展晶科技(深圳)有限公司 LED encapsulation body

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DE102009036622A1 (en) * 2009-08-07 2011-02-10 Osram Opto Semiconductors Gmbh Opto-electronic semiconductor component, has main housing body surrounding opto-electronic semiconductor chip and made of radiation permeable matrix material, and radiation reflected filling material introduced into body
EP2533314A2 (en) * 2011-05-30 2012-12-12 LG Innotek Co., Ltd. Light emitting device package and lighting system including the same
TW201344986A (en) * 2012-04-26 2013-11-01 Advanced Optoelectronic Tech Light emitting diode and method for manufacturing the same
TW201349600A (en) * 2012-05-18 2013-12-01 Advanced Optoelectronic Tech Light emitting diode and method for manufacturing the same
EP2819192A1 (en) * 2013-06-28 2014-12-31 Nichia Corporation Package for light emitting apparatus and light emitting apparatus including the same
CN104659197B (en) * 2013-11-26 2017-11-07 展晶科技(深圳)有限公司 LED encapsulation body
WO2017056321A1 (en) * 2015-10-02 2017-04-06 大日本印刷株式会社 Lead frame with resin and manufacturing method for same, led package and manufacturing method for same

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