WO2019210702A1 - 阵列基板及其制备方法、显示面板、显示装置 - Google Patents
阵列基板及其制备方法、显示面板、显示装置 Download PDFInfo
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- WO2019210702A1 WO2019210702A1 PCT/CN2019/070061 CN2019070061W WO2019210702A1 WO 2019210702 A1 WO2019210702 A1 WO 2019210702A1 CN 2019070061 W CN2019070061 W CN 2019070061W WO 2019210702 A1 WO2019210702 A1 WO 2019210702A1
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- 239000000758 substrate Substances 0.000 title claims abstract description 114
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 238000000034 method Methods 0.000 claims description 14
- 239000010408 film Substances 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
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- 230000002349 favourable effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
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- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
Definitions
- the present disclosure relates to the field of display technologies, and in particular, to an array substrate, a method for fabricating the same, a display panel, and a display device.
- touch-related leads include leads that are routed in the same layer as the data lines, and the leads are easily shorted to the data lines.
- the lead wires in the same layer as the data lines are easily short-circuited with the data lines, the voltage on the data lines is pulled low, and dark lines are displayed, which affects the quality of the display screen and affects the user experience.
- the plurality of data lines and the plurality of dummy leads are located on the same film layer on the base substrate, and the plurality of data lines and the plurality of dummy lead edges Extending in the first direction;
- At least one of the dummy leads includes: a plurality of wires extending in the first direction and disconnected from each other.
- the method further includes: a plurality of touch electrodes located on the substrate and located on different layers of the data line;
- the plurality of touch electrodes are arranged in an array, and the plurality of touch electrodes comprise a plurality of touch electrode columns, wherein the direction of the touch electrode columns is the first direction, and each of the dummy leads The number of the wires is equal to the number of the touch electrodes in one of the touch electrode columns.
- an orthographic projection of each touch electrode column on the substrate substrate and an orthographic projection of at least one of the dummy leads on the substrate substrate have overlapping regions.
- an orthographic projection of an interval region between two adjacent wires on the substrate substrate falls into each touch electrode.
- a spacer region between two adjacent touch electrodes in the column is in an orthographic projection on the base substrate.
- different lengths of the wires are equal.
- the method further includes: a plurality of touch leads extending along the first direction and arranged along the second direction on the substrate, and arranged in an array Multiple pixels;
- Each of the touch electrodes is connected to at least one of the touch leads;
- the plurality of pixels includes a plurality of pixel columns, the direction of the pixel columns being the first direction;
- the sum of the number of dummy leads and the number of touch leads is equal to the number of the pixel columns.
- the touch lead includes: a first sub-touch lead and a second sub-touch lead that are located in different layers and connected through via holes;
- the second sub-touch lead is disposed in the same layer as the data line.
- the method further includes: a touch virtual lead located on the base substrate and located on the same film layer as the first sub-touch lead;
- An orthographic projection of the touch virtual lead on the base substrate and an orthographic projection of the dummy lead on the base substrate have an overlapping area
- the touch virtual lead includes: a plurality of sub-leads extending along the first direction and disconnected from each other.
- a display panel provided by the embodiment of the present disclosure includes the above array substrate.
- a display device provided by the embodiment of the present disclosure includes the above display panel.
- the method for fabricating the above array substrate includes: forming a pattern of dummy leads and a pattern of data lines on the same substrate layer on the base substrate;
- the forming the pattern of the dummy leads comprises: forming a plurality of patterns of wires extending in the first direction and disconnected from each other by using a mask comprising a plurality of openings extending in the first direction and disconnected from each other.
- FIG. 1 is a schematic structural diagram of an array substrate according to an embodiment of the present disclosure
- FIG. 2 is a schematic diagram of relationship between a pixel unit and a lead position according to an embodiment of the present disclosure
- Figure 3 is a cross-sectional view along line AA' of Figure 2 provided by an embodiment of the present disclosure
- Figure 4 is a cross-sectional view along line BB' of Figure 2, in accordance with an embodiment of the present disclosure
- FIG. 5 is a schematic diagram of a mask used in preparing an array substrate according to an embodiment of the present disclosure.
- An embodiment of the present disclosure provides an array substrate, as shown in FIG. 1 , including:
- Substrate substrate (not shown in Figure 1);
- the plurality of data lines and the plurality of dummy leads 3 are located on the same film layer on the base substrate, and the plurality of data lines and the plurality of lines
- the dummy lead 3 extends in the first direction Y;
- At least one dummy lead 3 includes: a plurality of wires 4 extending in the first direction Y and disconnected from each other.
- the data line and the dummy lead are prone to short circuit.
- the dummy lead includes a plurality of wires extending in the first direction and disconnected from each other, the length of the wire short-circuited with the data line when the dummy lead in the same layer is short-circuited with the data line is compared with when the entire dummy lead is disposed When the voltage is reduced, the voltage drop of the data line is reduced, thereby preventing display dark lines, improving the display effect, and improving the user experience.
- the plurality of data lines and the plurality of dummy leads extend along the first direction Y, and the arrangement of the plurality of data lines and the plurality of dummy leads in the second direction X may be determined according to actual needs, wherein the second The direction X is intersected with the first direction Y, for example, may be vertically intersected or may be crossed at other angles, which is not limited herein.
- each dummy lead 3 is on the same straight line extending along the first direction Y. It can ensure that the dummy leads are evenly arranged in the area where the array substrate is located, thereby further ensuring display uniformity of the product.
- the lengths of the different wires 4 are equal. This ensures that the data line voltage is reduced to the same extent.
- all the wires 4 on the array substrate can be set to the same length.
- the length of the wires 4 can also be set in regions, for example, the lengths of the wires 4 belonging to the same dummy lead 3 can be set.
- the lengths of the wires 4 in the middle of the display area are the same, and the lengths of the wires 4 located at the edge of the display area are the same, which can be set according to actual needs, which is not limited herein.
- the array substrate provided by the embodiment of the present disclosure may further include: a plurality of touch electrodes 5 on the substrate substrate and different from the data lines;
- the plurality of touch electrodes 5 are arranged in an array, and the plurality of touch electrodes 5 include a plurality of touch electrode columns 6.
- the column direction of the touch electrode columns 6 is a first direction Y, and the strips of the wires 4 in each dummy lead 3
- the number is equal to the number of the touch electrodes 5 in the touch electrode array 6. In this way, the structural design of the array substrate is facilitated, and at the same time, the process of forming a plurality of segments of wires is easy to implement.
- the number of the wires 4 in each of the dummy leads 3 is equal to the number of the touch electrodes 5 in the touch electrode row 6 , thereby facilitating the structural design of the array substrate.
- the process of forming a plurality of segments of wires is easy to implement.
- the lengths of the different wires 4 in each of the dummy leads 3 are equal, thereby ensuring the shortest length of each wire and minimizing the voltage drop of the data line.
- each touch electrode column on the substrate substrate there is an overlapping area between the orthographic projection of each touch electrode column on the substrate substrate and the orthographic projection of the at least one dummy lead on the substrate substrate, such that each touch electrode column
- Each of the dummy leads corresponds to at least one dummy lead, so that the dummy leads can be distributed substantially evenly on the substrate.
- each touch electrode corresponds to at least one wire, so that the position of the wire corresponds to the position of the touch electrode, so that the wire of the wire is more uniform, and the display uniformity is further improved.
- the array substrate provided by the embodiment of the present disclosure may further include: a plurality of touch leads extending along the first direction and arranged in the second direction on the substrate, and arranged in an array Pixels
- Each touch electrode is connected to at least one touch lead
- the plurality of pixel units includes a plurality of pixel unit columns, and the direction of the pixel unit columns is the first direction;
- the sum of the number of dummy leads and the number of touch leads is equal to the number of columns of pixel cells.
- the array substrate includes a touch lead 2 connected to the touch electrode 5 , and further includes a driving circuit 7 connected to the touch lead 2 and the dummy lead 3 , and the driving circuit 7 provides a common voltage signal for the touch lead 2 .
- the touch signal in addition, the driving circuit 7 can also provide a common voltage signal for the dummy lead 3 to improve display uniformity.
- the electrical connection position between the touch lead 2 and the touch electrode 5 is the connection area A, and specifically, can be connected.
- the electrical connection between the touch lead 2 and the touch electrode 5 is realized through the via hole at the position of the area A. In FIG. 1 , each touch lead and the touch electrode are electrically connected through two connection areas A.
- each pixel 8 includes three sub-pixels 9.
- each pixel 5 may include a red sub-pixel, a blue sub-pixel, and a green sub-pixel, and may also include more Sub-pixels, not limited here.
- Each of the sub-pixels is divided by a gate line L1 and a data line L2 that intersect each other, and each of the sub-pixel units 9 includes a thin film transistor (TFT) 10 connected to the gate line L1 and the data line L2, and a thin film transistor.
- TFT thin film transistor
- the pixel electrode 11 connected to each pixel 8 corresponds to a dummy lead 3 or a touch lead 2, so that the number of leads (touch leads or dummy leads) is equal to the number of pixel columns, thereby ensuring products. Show uniformity.
- the different wires in each dummy lead do not overlap in the first direction, it is ensured that the leads are evenly arranged in the area where the array substrate is located, thereby further ensuring display uniformity of the product.
- each touch electrode column corresponds to N pixel columns, and each touch electrode column includes M touch electrodes.
- each touch electrode column 6 needs to correspond to M touches.
- Lead 2 when M ⁇ N, and each touch electrode is connected to one touch lead, in order to ensure display uniformity, that is, in order to make the number of pixel columns and the number of leads the same, each touch electrode column coverage area Need to set the NM strip dummy lead.
- FIG. 1 is only an example of an orthographic projection of a dummy lead covering each of the touch electrode columns as an example.
- the number of leads of the electrodes is connected to determine how many dummy leads are required for each touch electrode column.
- the touch electrodes in FIG. 1 are rectangular.
- the touch electrodes may have other shapes.
- the shape of the touch electrodes of the array substrate and the lead arrangement may be selected according to actual needs.
- the touch lead includes: a first sub-touch lead and a second sub-touch lead that are located in different layers and connected through the via;
- the second sub-touch lead is disposed in the same layer as the data line.
- the dummy lead is disposed in the same layer as the second sub-touch lead, and the orthographic projection of the first sub-touch electrode on the base substrate and the orthographic projection of the second sub-touch electrode on the base substrate have overlapping regions, and thus are located differently
- the first sub-touch electrode and the second sub-touch electrode of the layer can be connected through the via hole, so that the resistance of the touch lead can be reduced, and the second sub-touch lead is disposed in the same layer as the data line to simplify the process of fabricating the array substrate.
- FIG. 3 is a cross-sectional view along AA' in FIG. 2, and FIG. 2, the cross-sectional view along BB', as shown in FIG. 3, the upper array substrate includes: a substrate 12, a gate 13, a gate insulating layer 14, an active layer 15, a source 16, a drain 17, and a pixel electrode 11 connected to the drain 17 , a data line 18 and a second sub-touch lead 19 disposed in the same layer as the source 16 and the drain 17 , and a first insulating layer 20 are disposed on the first insulating layer 20 .
- the first sub-touch lead 22 connected to the second sub-touch lead 19, the second insulating layer 23, and the via 21 disposed on the second insulating layer 23 are connected to the first sub-touch lead 22 Touch electrode 5.
- the second sub-touch lead 19 may be referred to as an SDT (Source Data Metal) line
- the first sub-touch lead 22 may be referred to as a TPM (Touch Panel Metal) line, which is disposed in the same layer as the SDT line in the embodiment of the present disclosure.
- a dummy lead can be called a dummy SDT line.
- the touch dummy lead located on the base substrate 12 and located on the same film layer as the first sub-touch lead 22 may be further included. twenty four;
- the front projection of the touch dummy lead 24 on the base substrate 12 has an overlapping area with the orthographic projection of the dummy lead 3 on the base substrate 12;
- the touch virtual lead includes: a plurality of sub-leads (not shown) extending in the first direction Y and disconnected from each other.
- the touch virtual lead can be represented as a dummy TPM line, and the touch virtual lead is also set as a plurality of sub-leads extending in the first direction and disconnected from each other, so that the touch virtual lead and the dummy lead are aligned, which is advantageous.
- the uniformity of the wiring is favorable for display uniformity.
- the setting manner of each sub-lead in the touch virtual lead can refer to the setting of each wire in the dummy lead, and details are not described herein again.
- the array substrate shown in FIG. 4 includes a base substrate 12, a gate electrode 13, a gate insulating layer 14, an active layer 15, a source electrode 16, a drain electrode 17, and a pixel electrode 11 connected to the drain electrode 17.
- the data line 18 and the dummy lead 3, the first insulating layer 20, the touch dummy lead 24, the second insulating layer 23, and the touch electrode 5 are disposed in the same layer as the source 16 and the drain 17.
- an embodiment of the present disclosure provides a display panel including the above array substrate provided by the embodiments of the present disclosure.
- the display panel provided by the embodiment of the present disclosure may be, for example, a touch and display driver integration (TDDI) type display panel, and may be a liquid crystal display panel or an organic light emitting diode display panel. Since the principle of solving the problem of the display panel is similar to that of the foregoing array substrate, the implementation of the display panel can be referred to the implementation of the array substrate, and the repeated description is omitted.
- TDDI touch and display driver integration
- an embodiment of the present disclosure provides a display device including a display panel provided by an embodiment of the present disclosure.
- the display device provided by the embodiment of the present disclosure may be, for example, a device such as a mobile phone or a tablet computer.
- the implementation of the display device can be referred to the implementation of the display panel, and the repeated description is omitted.
- an embodiment of the present disclosure further provides a method for fabricating an array substrate.
- the principle of solving the problem is similar to that of the array substrate. Therefore, the implementation of the preparation method can be referred to the implementation of the array substrate, and the repetition is not Let me repeat.
- the method includes: forming a pattern of dummy leads and a pattern of data lines on the same film layer on a base substrate;
- forming the pattern of the dummy leads comprises: adopting a mask comprising a plurality of openings extending in the first direction and disconnecting from each other, a plurality of patterns of wires extending in the first direction and disconnected from each other.
- the mask plate 25 used in the method for fabricating the array substrate provided by the embodiment of the present disclosure is exemplified.
- the mask plate 25 includes a plurality of openings 26 extending in the first direction Y and disconnected from each other, and The partial openings overlap in the first direction.
- the plurality of openings in the region 27 coincide in the first direction Y.
- a wire that is coincident and disconnected in one direction constitutes a dummy lead.
- a pattern of touch leads and a pattern of data lines may be formed on the substrate; and then a pattern of dummy leads is formed using a mask as shown in FIG. 5.
- the array substrate and the preparation method thereof, the display panel, and the display device provided by the embodiments of the present disclosure, because the dummy leads include a plurality of wires extending in the first direction and disconnected from each other, when the dummy leads and the data lines are located in the same layer
- the dummy leads and the data lines are located in the same layer
- the length of the wire shorted to the data line is reduced, and the voltage drop of the data line is reduced, thereby preventing display dark lines, improving the display effect, and improving the user experience.
- the number of the wires in each of the dummy leads can be set to be equal to the number of the touch electrodes in the touch electrode column, thereby facilitating the structural design of the array substrate and making the process of forming the multi-segment wires easy to implement.
- the lengths of the different wires in each dummy lead are equal, so that the length of each wire can be minimized, and the voltage drop of the data line is minimized.
- the sum of the number of dummy leads and the number of touch leads is equal to the number of columns of pixel cells, so that display uniformity of the product can be ensured.
- the leads are evenly arranged in the area where the array substrate is located, thereby further ensuring display uniformity of the product.
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Abstract
Description
Claims (12)
- 一种阵列基板,其中,包括:衬底基板;多条数据线和多条虚设引线,所述多条数据线和所述多条虚设引线位于所述衬底基板上的同一膜层,且所述多条数据线和所述多条虚设引线沿第一方向延伸;至少一条所述虚设引线,包括:多条沿所述第一方向延伸且相互断开的导线。
- 根据权利要求1所述的阵列基板,其中,还包括:位于所述衬底基板上与所述数据线位于不同膜层的多个触控电极;多个所述触控电极呈阵列分布,多个所述触控电极包括多个触控电极列,所述触控电极列的方向为所述第一方向,每一所述虚设引线中的所述导线的条数与一所述触控电极列中触控电极的个数相等。
- 根据权利要求2所述的阵列基板,其中,每一触控电极列在所述衬底基板上的正投影与至少一条所述虚设引线在所述衬底基板上的正投影存在重叠区域。
- 根据权利要求3所述的阵列基板,其中,每一所述虚设引线中,相邻两条所述导线之间的间隔区域在所述衬底基板上的的正投影,落入每一触控电极列中相邻两个所述触控电极之间的间隔区域在所述衬底基板上的正投影中。
- 根据权利要求1~4任一项所述的阵列基板,其中,每一所述虚设引线中,不同所述导线在沿所述第一方向延伸的同一直线上。
- 根据权利要求1~4任一项所述的阵列基板,其中,不同所述导线的长度相等。
- 根据权利要求2所述的阵列基板,其中,还包括:位于所述衬底基板上的多条沿所述第一方向延伸且沿所述第二方向排列的触控引线,以及呈阵 列排布的多个像素;每一个所述触控电极至少与一条所述触控引线连接;多个所述像素包括多个像素列,所述像素列的方向为所述第一方向;所述虚设引线的数量和所述触控引线的数量之和等于所述像素列的数量。
- 根据权利要求7所述的阵列基板,其中,所述触控引线,包括:位于不同层且通过过孔连接的第一子触控引线和第二子触控引线;所述第二子触控引线与所述数据线同层设置。
- 根据权利要求8所述的阵列基板,其中,还包括:位于所述衬底基板上且与所述第一子触控引线位于同一膜层的触控虚拟引线;所述触控虚拟引线在所述衬底基板上的正投影与所述虚设引线在所述衬底基板上的正投影具有重叠区域;所述触控虚拟引线,包括:多条沿所述第一方向延伸且相互断开的子引线。
- 一种显示面板,其中,包括根据权利要求1~9任一项所述的阵列基板。
- 一种显示装置,其中,包括根据权利要求10所述的显示面板。
- 一种根据权利要求1~9任一项所述的阵列基板的制备方法,其中,包括:在衬底基板上形成位于同一膜层的虚设引线的图案和数据线的图案;其中,所述形成所述虚设引线的图案包括:采用包括多个沿第一方向延伸且相互断开的开口的掩膜板,形成多条沿第一方向延伸且相互断开的导线的图案。
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