WO2019196541A1

WO2019196541A1 - Housing assembly and mobile terminal

Info

Publication number: WO2019196541A1
Application number: PCT/CN2019/073439
Authority: WO
Inventors: 赵斌
Original assignee: Oppo广东移动通信有限公司
Priority date: 2018-04-10
Filing date: 2019-01-28
Publication date: 2019-10-17

Abstract

A housing assembly (100) and a mobile terminal (200). The housing assembly (100) comprises a housing (10) and a support (20) mounted on the housing (10). The housing (10) comprises a first face (11) and a second face (12) facing away from each other, the first face (11) being provided with a first via hole (111) and a second via hole (112) penetrating through the second face (12), a housing accommodating cavity (15) being formed on one side of the second face (12), the housing accommodating cavity (15) corresponding to the first via hole (11). The support (20) comprises a front face (21) and a back face (22) facing away from each other, the back face (22) being provided with a support accommodating cavity (23), the front face (21) being provided with a support through hole (24) corresponding to the support accommodating cavity (23), the front face (21) being provided on the second face (12), the support through hole (24) corresponding to the second via hole (112).

Description

壳体组件和移动终端Housing assembly and mobile terminal

优先权信息Priority information

本申请请求2018年04月10日向中国国家知识产权局提交的、专利申请号为201810320674.8以及201810316729.8的专利申请的优先权和权益，并且通过参照将其全文并入此处。The present application claims the benefit of and the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the disclosure.

技术领域Technical field

本申请涉及消费性电子技术领域，更具体而言，涉及一种壳体组件和移动终端。The present application relates to the field of consumer electronics, and more particularly to a housing assembly and a mobile terminal.

背景技术Background technique

手机上通常配置有多个功能模组以实现多种功能，例如，多个功能模块可用于获取物体的图像信息、深度信息等。然而，现有的手机结构与功能模块的结构不匹配。A plurality of function modules are usually configured on the mobile phone to implement various functions. For example, multiple function modules can be used to acquire image information, depth information, and the like of an object. However, the existing mobile phone structure does not match the structure of the functional modules.

发明内容Summary of the invention

本申请实施方式提供一种壳体组件和移动终端。Embodiments of the present application provide a housing assembly and a mobile terminal.

本申请的一种壳体组件包括壳体及安装在所述壳体上的支架。所述壳体包括相背的第一面及第二面，所述第一面开设有贯穿所述第二面的第一穿孔及第二穿孔，所述第二面所在的一侧形成有壳体收容腔，所述壳体收容腔与所述第一穿孔对应。所述支架包括相背的正面及背面，所述背面开设有支架收容腔，所述正面开设有与所述支架收容腔对应的支架通孔，所述正面设置在所述第二面上，所述支架通孔与所述第二穿孔对应。A housing assembly of the present application includes a housing and a bracket mounted on the housing. The housing includes a first surface and a second surface opposite to each other, the first surface defines a first through hole and a second through hole extending through the second surface, and a side of the second surface is formed with a shell a body receiving cavity, the housing receiving cavity corresponding to the first through hole. The bracket includes opposite front and back sides, the back surface is provided with a bracket receiving cavity, and the front surface is provided with a bracket through hole corresponding to the bracket receiving cavity, and the front surface is disposed on the second surface, The bracket through hole corresponds to the second through hole.

本申请的一种移动终端包括壳体组件，所述壳体组件包括壳体及安装在所述壳体上的支架，所述壳体包括相背的第一面及第二面，所述第一面开设有贯穿所述第二面的第一穿孔及第二穿孔，所述第二面所在的一侧形成有壳体收容腔，所述壳体收容腔与所述第一穿孔对应。所述支架包括相背的正面及背面，所述背面开设有支架收容腔，所述正面开设有与所述支架收容腔对应的支架通孔，所述正面设置在所述第二面上，所述支架通孔与所述第二穿孔对应。A mobile terminal of the present application includes a housing assembly including a housing and a bracket mounted on the housing, the housing including opposite first and second sides, the first A first through hole and a second through hole are formed through the second surface, and a side of the second surface is formed with a housing receiving cavity, and the housing receiving cavity corresponds to the first through hole. The bracket includes opposite front and back sides, the back surface is provided with a bracket receiving cavity, and the front surface is provided with a bracket through hole corresponding to the bracket receiving cavity, and the front surface is disposed on the second surface, The bracket through hole corresponds to the second through hole.

本申请附加的方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。The aspects and advantages of the present invention will be set forth in part in the description which follows.

附图说明DRAWINGS

本申请上述的和/或附加的方面和优点从下面结合附图对实施例的描述中将变得明显和容易理解，其中：The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from

图1是本申请实施方式的移动终端的部分立体分解示意图；1 is a partially exploded perspective view of a mobile terminal according to an embodiment of the present application;

图2是本申请实施方式的壳体组件的支架的立体结构示意图；2 is a schematic perspective structural view of a bracket of a housing assembly according to an embodiment of the present application;

图3是本申请实施方式的移动终端的支架及输入输出模组的立体结构示意图；3 is a schematic perspective structural view of a bracket and an input/output module of a mobile terminal according to an embodiment of the present application;

图4是本申请实施方式的移动终端的部分立体分解示意图；4 is a partially exploded perspective view of a mobile terminal according to an embodiment of the present application;

图5是本申请实施方式的移动终端的部分截面示意图；5 is a partial cross-sectional view of a mobile terminal according to an embodiment of the present application;

图6是本申请另一实施方式的移动终端的部分立体分解示意图；6 is a partially exploded perspective view of a mobile terminal according to another embodiment of the present application;

图7是本申请实施方式的移动终端的部分立体分解示意图；7 is a partially exploded perspective view of a mobile terminal according to an embodiment of the present application;

图8是本申请实施方式的壳体组件的支架的立体结构示意图；8 is a schematic perspective structural view of a bracket of a housing assembly according to an embodiment of the present application;

图9是本申请实施方式的移动终端的支架及输入输出模组的立体结构示意图；9 is a schematic perspective structural view of a bracket and an input/output module of a mobile terminal according to an embodiment of the present application;

图10是本发明实施方式的移动终端的部分立体分解示意图；FIG. 10 is a partially exploded perspective view of a mobile terminal according to an embodiment of the present invention; FIG.

图11是本申请实施方式的移动终端的部分截面示意图；11 is a partial cross-sectional view of a mobile terminal according to an embodiment of the present application;

图12至图15是本申请实施方式的输入输出组件的激光投射模组的部分结构示意图。12 to FIG. 15 are partial structural diagrams of a laser projection module of an input/output assembly according to an embodiment of the present application.

具体实施方式detailed description

以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。The embodiments of the present application are further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings denote the same or similar elements or elements having the same or similar functions.

另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。In addition, the embodiments of the present application, which are described below with reference to the accompanying drawings, are merely illustrative of the embodiments of the present invention, and are not to be construed as limiting.

在本申请中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。In the present application, the first feature "on" or "below" the second feature may be the direct contact of the first and second features, or the first and second features are indirectly through the intermediate medium, unless otherwise explicitly stated and defined. contact. Moreover, the first feature "above", "above" and "above" the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.

请参阅图1至图3，本申请的一种壳体组件100包括壳体10及安装在壳体10上的支架20。壳体10包括相背的第一面11及第二面12，第一面11开设有贯穿第二面12的第一穿孔111及第二穿孔112，第二面12所在的一侧形成有壳体收容腔15，壳体收容腔15与第一穿孔111对应。支架20包括相背的正面21及背面22，背面22开设有支架收容腔23，正面21开设有与支架收容腔23对应的支架通孔24，正面21设置在第二面12上，支架通孔24与第二穿孔112对应。Referring to FIGS. 1 to 3 , a housing assembly 100 of the present application includes a housing 10 and a bracket 20 mounted on the housing 10 . The housing 10 includes a first surface 11 and a second surface 12 opposite to each other. The first surface 11 defines a first through hole 111 and a second through hole 112 extending through the second surface 12, and a side of the second surface 12 is formed with a shell. The body housing cavity 15 has a housing receiving cavity 15 corresponding to the first through hole 111. The bracket 20 includes a front surface 21 and a rear surface 22 opposite to each other. The back surface 22 defines a bracket receiving cavity 23, and the front surface 21 defines a bracket through hole 24 corresponding to the bracket receiving cavity 23, and the front surface 21 is disposed on the second surface 12, and the bracket through hole 24 corresponds to the second through hole 112.

现有的手机结构(例如壳体10)与功能模块(例如待安装的电子元器件)的结构不匹配，从而导致将功能模块(例如待安装的电子元器件)安装到手机上的工艺比较复杂。本申请的壳体组件100中，待安装的电子元器件可先安装在支架20上再与支架20一起安装到壳体10上，从而使待安装的电子元器件安装到壳体10上的工艺比较简单。The existing mobile phone structure (for example, the housing 10) does not match the structure of the functional module (for example, the electronic component to be mounted), so that the process of installing the functional module (for example, the electronic component to be mounted) on the mobile phone is complicated. . In the housing assembly 100 of the present application, the electronic components to be mounted may be first mounted on the bracket 20 and then mounted to the housing 10 together with the bracket 20, thereby mounting the electronic components to be mounted on the housing 10. easier.

请参阅图1至图3，本申请实施方式的壳体组件100包括壳体10及安装在壳体10上的支架20。壳体10包括相背的第一面11及第二面12，第一面11开设有贯穿第二面12的第一穿孔111及第二穿孔 112，第二面12所在的一侧形成有壳体收容腔15，壳体收容腔15与第一穿孔111对应。支架20包括相背的正面21及背面22，背面22开设有支架收容腔23，正面21开设有与支架收容腔23对应的支架通孔24，正面21设置在第二面12上，支架通孔24与第二穿孔112对应并连通。Referring to FIGS. 1 to 3 , the housing assembly 100 of the embodiment of the present application includes a housing 10 and a bracket 20 mounted on the housing 10 . The housing 10 includes a first surface 11 and a second surface 12 opposite to each other. The first surface 11 defines a first through hole 111 and a second through hole 112 extending through the second surface 12, and a side of the second surface 12 is formed with a shell. The body housing cavity 15 has a housing receiving cavity 15 corresponding to the first through hole 111. The bracket 20 includes a front surface 21 and a rear surface 22 opposite to each other. The back surface 22 defines a bracket receiving cavity 23, and the front surface 21 defines a bracket through hole 24 corresponding to the bracket receiving cavity 23, and the front surface 21 is disposed on the second surface 12, and the bracket through hole 24 corresponds to and communicates with the second through hole 112.

壳体收容腔15的数量可以为一个、两个、三个、四个或任意多个，第一穿孔111的数量可以与壳体收容腔15的数量一致并对应连通；或者，第一穿孔111的数量少于壳体收容腔15的数量，每个第一穿孔111与一个壳体收容腔15对应连通。支架收容腔23的数量可以为一个、两个、三个、四个或任意多个，支架通孔24的数量可以与支架收容腔23的数量一致并对应连通；或者，支架通孔24的数量少于支架收容腔23的数量，每个支架通孔24与一个支架收容腔23对应连通。第二穿孔112的数量与支架通孔24的数量一致并对应连通。第一穿孔111与第二穿孔112可间隔设置或连通。壳体收容腔15及支架收容腔23均可用于安装待安装的电子元器件(例如，输入输出模组30)。当待安装的电子元器件的安装精度要求较高时，待安装的电子元器件可直接安装在壳体收容腔15内以完成电子元器件的安装，此时，安装在壳体收容腔15内的电子元器件相对第一面11具有较高的安装精度。当待安装的电子元器件的安装难度较大时，待安装的电子元器件先安装在支架20的支架收容腔23内，然后再与支架20一起安装在壳体10上。由于支架20相较于待安装的电子元器件更容易安装，因此，待安装的电子元器件通过支架20安装到壳体10上的工艺更简单并容易实现。The number of the housing receiving cavities 15 may be one, two, three, four or any number, and the number of the first perforations 111 may be consistent with and corresponding to the number of the housing receiving cavities 15; or, the first perforations 111 The number of the housings 15 is less than the number of housing receiving chambers 15, and each of the first through holes 111 is in communication with a housing receiving cavity 15. The number of the bracket receiving cavities 23 may be one, two, three, four or any number, and the number of the bracket through holes 24 may be consistent with the number of the bracket receiving cavities 23 and correspondingly communicated; or the number of the bracket through holes 24 Less than the number of the bracket receiving cavities 23, each of the bracket through holes 24 is in communication with a bracket receiving cavity 23. The number of second perforations 112 coincides with the number of bracket through holes 24 and is correspondingly communicated. The first through hole 111 and the second through hole 112 may be spaced apart or communicated. Both the housing receiving cavity 15 and the bracket receiving cavity 23 can be used for mounting electronic components to be mounted (for example, the input/output module 30). When the installation precision of the electronic component to be mounted is high, the electronic component to be mounted can be directly installed in the housing receiving cavity 15 to complete the installation of the electronic component. At this time, it is installed in the housing receiving cavity 15 The electronic component has a higher mounting accuracy relative to the first face 11. When the electronic components to be mounted are difficult to install, the electronic components to be mounted are first mounted in the holder receiving cavity 23 of the bracket 20, and then mounted on the housing 10 together with the bracket 20. Since the bracket 20 is easier to mount than the electronic components to be mounted, the process of mounting the electronic components to be mounted to the housing 10 via the bracket 20 is simpler and easier to implement.

本申请实施方式的壳体组件100中，待安装的电子元器件可先安装在支架20上再与支架20一起安装到壳体10上，从而使待安装的电子元器件安装到壳体10上的工艺比较简单。In the housing assembly 100 of the embodiment of the present application, the electronic components to be mounted may be first mounted on the bracket 20 and then mounted to the housing 10 together with the bracket 20, so that the electronic components to be mounted are mounted on the housing 10. The process is relatively simple.

请参阅图1，本申请实施方式的壳体组件100包括壳体10及支架20。Referring to FIG. 1 , the housing assembly 100 of the embodiment of the present application includes a housing 10 and a bracket 20 .

壳体10为一体结构，具体地，壳体10可以是一次性注塑成型的。壳体10包括第一面11、第二面12、顶壁13和底壁14，第一面11与第二面12相背，顶壁13和底壁14均连接第一面11与第二面12，顶壁13位于壳体10的顶部，底壁14位于壳体10的底部。壳体10可以采用不锈钢、铝合金、塑料等材料制成。The housing 10 is of unitary construction, and in particular, the housing 10 can be injection molded at one time. The housing 10 includes a first surface 11, a second surface 12, a top wall 13 and a bottom wall 14. The first surface 11 is opposite to the second surface 12, and the top wall 13 and the bottom wall 14 are connected to the first surface 11 and the second surface Face 12, top wall 13 is located at the top of housing 10, and bottom wall 14 is located at the bottom of housing 10. The housing 10 can be made of stainless steel, aluminum alloy, plastic, or the like.

第一面11开设有贯穿第一面11及第二面12的第一穿孔111及第二穿孔112，第一穿孔111与第二穿孔112间隔设置。第一穿孔111及第二穿孔112均开设在第一面11的靠近顶壁13的一端，也就是说，第一穿孔111及第二穿孔112相较于底壁14更靠近顶壁13。第一穿孔111的中心与第二穿孔112的中线连线与顶壁13平行。The first surface 11 defines a first through hole 111 and a second through hole 112 extending through the first surface 11 and the second surface 12 . The first through hole 111 is spaced apart from the second through hole 112 . The first through hole 111 and the second through hole 112 are both open at one end of the first surface 11 near the top wall 13 , that is, the first through hole 111 and the second through hole 112 are closer to the top wall 13 than the bottom wall 14 . The center of the first through hole 111 and the center line of the second through hole 112 are parallel to the top wall 13.

壳体10还包括自第二面12朝远离第一面11的方向延伸形成的腔体侧壁16，腔体侧壁16呈环状并环绕第一穿孔111。腔体侧壁16与第二面12共同围成壳体收容腔15，壳体收容腔15与第一穿孔111连通。具体地，壳体收容腔15的中心轴线与第一穿孔111的中心轴线重合。第一穿孔111的开口尺寸小于对应的壳体收容腔15的尺寸以形成壳体限位环17，壳体收容腔15由壳体限位环17及环绕壳体限位环17延伸的内壁(也即是腔体侧壁16)形成。在其他实施方式中，壳体收容腔15也可以自第二面12向第一面11的方向凹陷形成。The housing 10 further includes a cavity sidewall 16 extending from the second face 12 in a direction away from the first face 11, the cavity sidewall 16 being annular and surrounding the first through hole 111. The cavity sidewall 16 and the second surface 12 together define a housing receiving cavity 15 that communicates with the first through hole 111. Specifically, the central axis of the housing receiving cavity 15 coincides with the central axis of the first through hole 111. The opening size of the first through hole 111 is smaller than the size of the corresponding housing receiving cavity 15 to form the housing limiting ring 17 , and the housing receiving cavity 15 is defined by the housing limiting ring 17 and the inner wall extending around the housing limiting ring 17 ( That is, the cavity sidewall 16) is formed. In other embodiments, the housing receiving cavity 15 may also be recessed from the second surface 12 toward the first surface 11 .

请参阅图2及图3，支架20能够拆卸地安装在壳体10上。支架20包括正面21、背面22及侧壁26，正面21及背面22位于支架20的相背两侧，侧壁26连接正面21及背面22并环绕正面21及背面22。背面22开设有支架收容腔23，正面21开设有与支架收容腔23对应连通的支架通孔24，支架收容腔23的中心轴线与支架通孔24的中心轴线重合。支架通孔24的开口尺寸小于对应的支架收容腔23的尺寸以形成支架限位环25，支架收容腔23由支架限位环25及环绕支架限位环25延伸的内壁形成。正面21设置在第二面12上，支架通孔24与第二穿孔112对应连通，具体地，支架通孔24的中心轴线与第二穿孔112的中心轴线重合。Referring to Figures 2 and 3, the bracket 20 is detachably mounted to the housing 10. The bracket 20 includes a front surface 21, a back surface 22 and side walls 26. The front surface 21 and the back surface 22 are located on opposite sides of the bracket 20. The side wall 26 connects the front surface 21 and the back surface 22 and surrounds the front surface 21 and the back surface 22. The back surface 22 defines a bracket receiving cavity 23, and the front surface 21 defines a bracket through hole 24 corresponding to the bracket receiving cavity 23, and the central axis of the bracket receiving cavity 23 coincides with the central axis of the bracket through hole 24. The opening size of the bracket through hole 24 is smaller than the size of the corresponding bracket receiving cavity 23 to form a bracket limiting ring 25 formed by the bracket limiting ring 25 and an inner wall extending around the bracket limiting ring 25. The front surface 21 is disposed on the second surface 12, and the bracket through hole 24 is correspondingly communicated with the second through hole 112. Specifically, the central axis of the bracket through hole 24 coincides with the central axis of the second through hole 112.

壳体收容腔15及支架收容腔23均可用于安装待安装的电子元器件(例如，输入输出模组30)，待安装的电子元器件可以向外界发出信号或者接收外界的信号，或者同时具备向外界发出信号和接收外界的信号的功能，其中信号可以是光线信号、声音信号、触摸信号等。安装在壳体收容腔15内的待安装的电子元器件能够通过第一穿孔111从第一面11暴露，第一面11一侧的光线能够穿过第一穿孔111传输到待安装的电子元器件上。安装在支架收容腔23内的待安装的电子元器件能够通过第二穿孔112从第一面11暴露，第一面11一侧的光线能够穿过第二穿孔112及支架通孔24传输到待安装的电子元器件上。The housing receiving cavity 15 and the bracket receiving cavity 23 can be used for mounting electronic components to be mounted (for example, the input/output module 30). The electronic components to be installed can send signals to the outside world or receive external signals, or both. The function of sending a signal to the outside world and receiving an external signal, wherein the signal may be a light signal, a sound signal, a touch signal, or the like. The electronic component to be mounted mounted in the housing receiving cavity 15 can be exposed from the first surface 11 through the first through hole 111, and the light on the side of the first surface 11 can be transmitted through the first through hole 111 to the electronic component to be mounted. On the device. The electronic component to be mounted mounted in the holder receiving cavity 23 can be exposed from the first surface 11 through the second through hole 112, and the light on the side of the first surface 11 can be transmitted through the second through hole 112 and the through hole 24 of the bracket. Installed on the electronic components.

本申请实施方式的壳体组件100中，待安装的电子元器件可先安装在支架20上再与支架20一起安装到壳体10上，从而使待安装的电子元器件安装到壳体10上的工艺比较简单。同时，由于壳体10上形成有壳体限位环17，从而便于待安装的电子元器件通过壳体限位环17定位安装到壳体收容腔15内。再有，支架20形成有支架限位环25从而便于待安装的电子元器件通过支架限位环25定位安装到支架收容腔23内。In the housing assembly 100 of the embodiment of the present application, the electronic components to be mounted may be first mounted on the bracket 20 and then mounted to the housing 10 together with the bracket 20, so that the electronic components to be mounted are mounted on the housing 10. The process is relatively simple. At the same time, since the housing limiting ring 17 is formed on the housing 10, the electronic components to be mounted are conveniently positioned and mounted into the housing receiving cavity 15 through the housing limiting ring 17. Further, the bracket 20 is formed with a bracket limiting ring 25 so that the electronic components to be mounted are conveniently positioned and mounted into the bracket receiving cavity 23 through the bracket limiting ring 25.

请参阅图3，在某些实施方式中，支架20还包括自侧壁26向外(朝远离支架20的中心)凸出的固定凸出27，支架20通过固定凸出27固定在壳体10上。支架20上的固定凸出27的数量可以是单个或多个，当支架20上的固定凸出27的数量是多个时，多个固定凸出27可以从侧壁26的相背的两侧凸出。固定凸出27用于固定支架20，具体地，可以通过紧固件直接将固定凸出27固定在壳体10上，也可以通过紧固件将支架20和主板50共同固定在壳体10上。在如图3所示的实施例中，固定凸出27上开设有固定孔271，壳体10与固定孔271对应的位置开设有安装孔(图未示)，可以通过紧固件(如螺钉)穿过固定孔271并与安装孔结合，以将支架20固定在壳体10上。通过固定凸出27固定支架20，进一步提高支架20安装在壳体10内的稳定性。当支架20不包括自侧壁26向外(朝远离支架20的中心)凸出的固定凸出27时，支架20可以通过焊接、卡合、胶合等方式安装在壳体10上。Referring to FIG. 3 , in some embodiments, the bracket 20 further includes a fixing protrusion 27 protruding outward from the side wall 26 ( away from the center of the bracket 20 ), and the bracket 20 is fixed to the housing 10 by the fixing protrusion 27 . on. The number of the fixing protrusions 27 on the bracket 20 may be single or plural. When the number of the fixing protrusions 27 on the bracket 20 is plural, the plurality of fixing protrusions 27 may be from opposite sides of the side wall 26 Protruding. The fixing protrusion 27 is used for fixing the bracket 20 . Specifically, the fixing protrusion 27 can be directly fixed to the housing 10 by a fastener, or the bracket 20 and the main board 50 can be fixed to the housing 10 by fasteners. . In the embodiment shown in FIG. 3, the fixing protrusion 27 is provided with a fixing hole 271, and the housing 10 is provided with a mounting hole (not shown) corresponding to the fixing hole 271, and can pass through a fastener (such as a screw). Passing through the fixing hole 271 and engaging with the mounting hole to fix the bracket 20 to the housing 10. The fixing of the bracket 20 by the fixing projection 27 further improves the stability of the bracket 20 installed in the housing 10. When the bracket 20 does not include the fixing protrusion 27 that protrudes outward from the side wall 26 (toward the center away from the bracket 20), the bracket 20 may be mounted on the housing 10 by welding, snapping, gluing, or the like.

请参阅图1，在某些实施方式中，第二穿孔112的数量为两个，第一穿孔111的数量为一个，两个第二穿孔112的中心及第一穿孔111的中心位于同一直线上。此时，支架20上的支架收容腔23及支架通孔24的数量均为两个并分别与两个第二穿孔112对应连通。当三个待安装的电子元器件分别安装在两个支架收容腔23内及一个壳体收容腔15内后，三者的中心轴线位于同一平面内，易于三者互相配合工作。Referring to FIG. 1 , in some embodiments, the number of the second through holes 112 is two, and the number of the first through holes 111 is one, and the centers of the two second through holes 112 and the center of the first through holes 111 are on the same line. . At this time, the number of the bracket receiving cavity 23 and the bracket through hole 24 on the bracket 20 is two and respectively communicate with the two second through holes 112. When the three electronic components to be mounted are respectively installed in the two bracket receiving cavities 23 and one of the housing receiving cavities 15, the central axes of the three are in the same plane, so that the three can work together.

请参阅图4及图5，本申请实施方式的移动终端200包括上述任意一实施方式的壳体组件100、输入输出模组30、盖体40、主板50、盖板60及油墨70。Referring to FIG. 4 and FIG. 5 , the mobile terminal 200 of the embodiment of the present application includes the housing assembly 100 , the input/output module 30 , the cover 40 , the main board 50 , the cover 60 , and the ink 70 of any of the above embodiments.

移动终端200可以是手机、平板电脑、手提电脑、游戏机、头显设备、门禁***、柜员机等，本申请实施例以移动终端200是手机为例进行说明。The mobile terminal 200 can be a mobile phone, a tablet computer, a laptop computer, a game machine, a head display device, an access control system, a teller machine, etc., and the mobile terminal 200 is a mobile phone as an example for description.

请结合图1及图2，本实施方式的壳体组件100中的支架20上的支架收容腔23的数量、支架通孔24的数量、及第二穿孔112的数量均为两个，两个支架通孔24分别与两个第二穿孔112对应连通。两个第二穿孔112的中心及第一穿孔111的中心位于同一直线上。Referring to FIG. 1 and FIG. 2, the number of the bracket receiving cavities 23, the number of the bracket through holes 24, and the number of the second through holes 112 on the bracket 20 in the housing assembly 100 of the present embodiment are both two. The bracket through holes 24 are respectively in communication with the two second through holes 112. The centers of the two second through holes 112 and the center of the first through holes 111 are on the same straight line.

请结合图4，主板50安装在第二面12的靠近顶壁13的一端，具体地，主板50可以通过螺合、卡合、胶合等方式固定在壳体10上。主板50设置有线路并可以电性连接移动终端200上的处理芯片、控制芯片等电子元器件。主板50的靠近顶壁13的一端开设有安装口51，安装口51环绕第一穿孔111、第二穿孔112、支架20及腔体侧壁16。主板50的远离第二面12的一侧设置有与线路电性连接的连接座52。Referring to FIG. 4, the main board 50 is mounted on one end of the second surface 12 near the top wall 13. Specifically, the main board 50 can be fixed to the housing 10 by screwing, snapping, gluing or the like. The main board 50 is provided with a circuit and can be electrically connected to electronic components such as a processing chip and a control chip on the mobile terminal 200. A mounting port 51 is defined in an end of the main board 50 adjacent to the top wall 13. The mounting opening 51 surrounds the first through hole 111, the second through hole 112, the bracket 20, and the cavity sidewall 16. A side of the main board 50 remote from the second surface 12 is provided with a connecting base 52 electrically connected to the line.

请结合图1及图3，输入输出模组30的数量为三个，三个输入输出模组30分别安装在一个壳体收容腔15内及两个支架收容腔23内。输入输出模组30包括设置在输入输出模组30的靠近第二面112(或主板50)一侧的连接器34，当输入输出模组30安装在壳体组件100上时，连接器34与连接座52结合(插接)以电性连接输入输出模组30及主板50。输入输出模组30可以向外界发出信号或者接收外界的信号，或者同时具备向外界发出信号和接收外界的信号的功能，其中信号可以是光线信号、声音信号、触摸信号等。可以理解，依据移动终端200的不同功能需求，输入输出模组30的具体种类和每种输入输出模组30的数量可以有所变化。1 and 3, the number of the input and output modules 30 is three, and the three input and output modules 30 are respectively installed in one housing receiving cavity 15 and two bracket receiving cavities 23. The input/output module 30 includes a connector 34 disposed on a side of the input/output module 30 adjacent to the second surface 112 (or the motherboard 50). When the input/output module 30 is mounted on the housing assembly 100, the connector 34 is The connector 52 is coupled (plugged) to electrically connect the input and output module 30 and the main board 50. The input/output module 30 can send a signal to the outside world or receive an external signal, or have the function of sending a signal to the outside world and receiving a signal from the outside, wherein the signal can be a light signal, a sound signal, a touch signal, or the like. It can be understood that the specific types of the input and output modules 30 and the number of each of the input and output modules 30 may vary according to different functional requirements of the mobile terminal 200.

具体地，输入输出模组30包括红外成像模组31、激光投射模组33及可见光成像模组32。红外成像模组31收容在壳体收容腔15内并通过第一穿孔111从第一面11暴露。激光投射模组33及可见光成像模组32分别收容在两个支架收容腔23内并通过支架通孔24及第二穿孔112从第一面11暴露。可见光成像模组32设置在红外成像模组31与激光投射模组33之间。其中，激光投射模组33可用于向移动终端200外的目标物体投射激光图案，激光可以是红外光，红外成像模组31可用于接收外界的红外光信号以生成红外图像，在一个例子中，红外成像模组31可以接收由目标物体反射的激光图案，激光投射模组33和红外成像模组31共同用于获得目标物体的深度信息，此时，红外成像模组31与激光投射模组33之间的间距要大于一个特定的值，以使激光投射模组33和红外成像模组31共同获取得到的深度信息较准确。可见光成像模组32可接收外界的可见光信号以生成彩色图像，可见光成像模组32、红外成像模组31和激光投射模组33可以共同用于获得目标用户的深度图像。当然，光学模组的具体形式还可以有其他，不限于本申请实施例中的举例。在本申请实施方式中，暴露指的是可以从第一面11或从第二面12看到输入输出模组30(包括红外成像模组31、激光投射模组33及可见光成像模组32)，例如，红外成像模组31可以穿过第一面11的第一穿孔111以从第一面11凸出至壳体10的第一面11一侧外；或者，红外成像模组31也可以未穿过第一穿孔111，但通过第一穿孔111可以看到红外成像模组31，此时，红外成像模组31的顶面与第一面11齐平，或者红外成像模组31的顶面位于第一面11的靠近第二面12一侧。Specifically, the input/output module 30 includes an infrared imaging module 31, a laser projection module 33, and a visible light imaging module 32. The infrared imaging module 31 is housed in the housing receiving cavity 15 and exposed from the first surface 11 through the first through hole 111. The laser projection module 33 and the visible light imaging module 32 are respectively received in the two bracket receiving cavities 23 and exposed from the first surface 11 through the bracket through holes 24 and the second through holes 112. The visible light imaging module 32 is disposed between the infrared imaging module 31 and the laser projection module 33. The laser projection module 33 can be used to project a laser pattern to a target object outside the mobile terminal 200. The laser can be infrared light, and the infrared imaging module 31 can be used to receive an infrared signal of the outside to generate an infrared image. In an example, The infrared imaging module 31 can receive the laser pattern reflected by the target object, and the laser projection module 33 and the infrared imaging module 31 are used together to obtain the depth information of the target object. At this time, the infrared imaging module 31 and the laser projection module 33 The spacing between them is greater than a specific value, so that the depth information obtained by the laser projection module 33 and the infrared imaging module 31 is relatively accurate. The visible light imaging module 32 can receive visible light signals from the outside to generate a color image, and the visible light imaging module 32, the infrared imaging module 31, and the laser projection module 33 can be used together to obtain a depth image of the target user. Certainly, the specific form of the optical module may also have other, and is not limited to the examples in the embodiments of the present application. In the embodiment of the present application, the exposure means that the input/output module 30 (including the infrared imaging module 31, the laser projection module 33, and the visible light imaging module 32) can be seen from the first surface 11 or the second surface 12. For example, the infrared imaging module 31 can pass through the first through hole 111 of the first surface 11 to protrude from the first surface 11 to the side of the first surface 11 of the housing 10; or the infrared imaging module 31 can also The infrared imaging module 31 is not visible through the first through hole 111, but the top surface of the infrared imaging module 31 is flush with the first surface 11 or the top of the infrared imaging module 31. The face is located on the side of the first face 11 near the second face 12.

请结合图4，盖体40安装在壳体10上。具体地，盖体40设置在第二面12所在的一侧，输入输出模组30及主板50位于壳体10与盖体40之间。在一个例子中，盖体40安装在壳体10上时，盖体40与输入输出模组30抵持以将输入输出模组30牢固地安装在壳体收容腔15及支架收容腔23内。盖体40可以采用不锈钢、铝合金、塑料等材料制成。Referring to FIG. 4, the cover 40 is mounted on the housing 10. Specifically, the cover 40 is disposed on a side where the second surface 12 is located, and the input/output module 30 and the main board 50 are located between the housing 10 and the cover 40. In one example, when the cover 40 is mounted on the casing 10, the cover 40 abuts against the input/output module 30 to securely mount the input/output module 30 in the housing receiving cavity 15 and the bracket receiving cavity 23. The cover 40 can be made of stainless steel, aluminum alloy, plastic or the like.

请结合图4及图5，盖板60设置在第一面11并覆盖第一穿孔111及第二穿孔112上，盖板60与第一面11结合的表面设置有仅通过红外光的红外透过油墨70，红外透过油墨70遮挡第一穿孔111及与激光投射模组33对应的第二穿孔112。红外透过油墨70对红外光有较高的透过率，例如可达到85％或以上，且对可见光有较高的衰减率，例如可达到70％以上，使得用户在正常使用中，肉眼难以看到移动终端200上被红外透过油墨70覆盖的区域。盖板40的材料可以是透光的玻璃、树脂、塑料等。Referring to FIG. 4 and FIG. 5, the cover plate 60 is disposed on the first surface 11 and covers the first through hole 111 and the second through hole 112. The surface of the cover plate 60 combined with the first surface 11 is provided with infrared light through only infrared light. The ink passes through the ink 70 to block the first through hole 111 and the second through hole 112 corresponding to the laser projection module 33. The infrared transmission ink 70 has a high transmittance for infrared light, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user is difficult to use in normal use. The area of the mobile terminal 200 that is covered by the infrared ray transmission ink 70 is seen. The material of the cover 40 may be light transmissive glass, resin, plastic, or the like.

本申请实施方式的移动终端200中，输入输出模组30可先安装在支架20上再与支架20一起安装到壳体10上，从而使输入输出模组30安装到壳体10上的工艺比较简单。In the mobile terminal 200 of the embodiment of the present application, the input/output module 30 can be first mounted on the bracket 20 and then mounted on the casing 10 together with the bracket 20, so that the process of mounting the input/output module 30 to the casing 10 is compared. simple.

本申请实施方式的移动终端200还具有以下有益效果：第一，两个第二穿孔112的中心及第一穿孔111的中心位于同一直线上，当三个输入输出模组30分别安装在两个支架收容腔23内及一个壳体收容腔15内后，三者的光轴位于同一平面内，易于三者互相配合工作并可以共同用于获得目标用户的深度图像。第二，输入输出模组30上设置有连接器34，主板50上设置有连接座52，从而便于输入输出模组30与主板50通过连接器34与连接座52电性连接在一起。第三，主板50上开设有环绕支架20及腔体侧壁16的安装口51，从而主板50安装到壳体10上时不会与支架20及侧壁16发生干涉，并且便于位于安装口51相对两侧的主板50与壳体10上的其他电子元器件电性连接。第四，可见光成像模组32设置在红外成像模组31与激光投射模组33之间，从而使安装口51的尺寸可以开设得更小，也就是说，位于安装口51相对两侧的主板50的宽度较大并便于主板50与壳体10上的其他电子元器件电性连接。第五，设置在盖板60上的红外透过油墨70遮挡第一穿孔111及与激光投射模组33对应的第二穿孔112，用户难以通过盖板50看到红外成像模组31及激光投射模组33，从而使移动终端200的外观更加美观。The mobile terminal 200 of the embodiment of the present application further has the following beneficial effects: first, the centers of the two second through holes 112 and the center of the first through holes 111 are on the same straight line, and when the three input/output modules 30 are respectively installed in two After the bracket receiving cavity 23 and a housing receiving cavity 15, the optical axes of the three are in the same plane, which is easy for the three to work together and can be used together to obtain a depth image of the target user. Secondly, the input and output module 30 is provided with a connector 34. The main board 50 is provided with a connecting base 52, so that the input/output module 30 and the main board 50 are electrically connected to the connecting base 52 through the connector 34. Thirdly, the main board 50 is provided with a mounting opening 51 surrounding the bracket 20 and the side wall 16 of the cavity, so that the main board 50 does not interfere with the bracket 20 and the side wall 16 when mounted on the housing 10, and is conveniently located at the mounting opening 51. The main board 50 on the opposite sides is electrically connected to other electronic components on the housing 10. Fourth, the visible light imaging module 32 is disposed between the infrared imaging module 31 and the laser projection module 33, so that the size of the mounting opening 51 can be made smaller, that is, the motherboard located on opposite sides of the mounting opening 51. The width of 50 is large and facilitates the electrical connection of the main board 50 to other electronic components on the housing 10. Fifth, the infrared transparent ink 70 disposed on the cover 60 blocks the first through hole 111 and the second through hole 112 corresponding to the laser projection module 33. It is difficult for the user to see the infrared imaging module 31 and the laser projection through the cover 50. The module 33 is such that the appearance of the mobile terminal 200 is more beautiful.

请参阅图6及图7，在某些实施方式中，激光投射模组33收容在壳体收容腔15内并通过第一穿孔111从第一面11暴露。红外成像模组31及可见光成像模组32分别收容在两个支架收容腔23内并通过支架通孔24及第二穿孔112从第一面11暴露。可见光成像模组32设置在红外成像模组31与激光投射模组33之间。Referring to FIG. 6 and FIG. 7 , in some embodiments, the laser projection module 33 is received in the housing receiving cavity 15 and exposed from the first surface 11 through the first through hole 111 . The infrared imaging module 31 and the visible light imaging module 32 are respectively received in the two bracket receiving cavities 23 and exposed from the first surface 11 through the bracket through holes 24 and the second through holes 112. The visible light imaging module 32 is disposed between the infrared imaging module 31 and the laser projection module 33.

请参阅图7至图9，本发明实施方式的移动终端200包括壳体组件100及输入输出模组30。壳体组件100包括壳体10及安装在壳体10上的支架20，壳体10包括相背的第一面11及第二面12，第一面 11开设有贯穿第二面12的第一穿孔111及第二穿孔112，第二面12所在的一侧形成有壳体收容腔15，壳体收容腔15与第一穿孔111对应。支架20包括相背的正面21及背面22，背面22开设有支架收容腔23，正面21开设有与支架收容腔23对应的支架通孔24，正面21设置在第二面12上，支架通孔24与第二穿孔112对应并连通。输入输出模组30包括红外成像模组31及激光投射模组33，激光投射模组33收容在壳体收容腔15内并通过第一穿孔111从第一面11暴露；红外成像模组31收容在支架收容腔23内并通过支架通孔24从第二穿孔112暴露。Referring to FIG. 7 to FIG. 9 , the mobile terminal 200 of the embodiment of the present invention includes a housing assembly 100 and an input and output module 30 . The housing assembly 100 includes a housing 10 and a bracket 20 mounted on the housing 10. The housing 10 includes a first surface 11 and a second surface 12 opposite to each other. The first surface 11 defines a first through surface 12 The through hole 111 and the second through hole 112 are formed on a side of the second surface 12 with a housing receiving cavity 15 corresponding to the first through hole 111. The bracket 20 includes a front surface 21 and a rear surface 22 opposite to each other. The back surface 22 defines a bracket receiving cavity 23, and the front surface 21 defines a bracket through hole 24 corresponding to the bracket receiving cavity 23, and the front surface 21 is disposed on the second surface 12, and the bracket through hole 24 corresponds to and communicates with the second through hole 112. The input and output module 30 includes an infrared imaging module 31 and a laser projection module 33. The laser projection module 33 is received in the housing receiving cavity 15 and exposed from the first surface 11 through the first through hole 111. The infrared imaging module 31 is received. The second through hole 112 is exposed in the holder receiving cavity 23 and through the bracket through hole 24.

壳体收容腔15的数量可以为一个、两个、三个、四个或任意多个，第一穿孔111的数量可以与壳体收容腔15的数量一致并对应连通；或者，第一穿孔111的数量少于壳体收容腔15的数量，每个第一穿孔111与一个壳体收容腔15对应连通。支架收容腔23的数量可以为一个、两个、三个、四个或任意多个，支架通孔24的数量可以与支架收容腔23的数量一致并对应连通；或者，支架通孔24的数量少于支架收容腔23的数量，每个支架通孔24与一个支架收容腔23对应连通。第二穿孔112的数量与支架通孔24的数量一致并对应连通。第一穿孔111与第二穿孔112可间隔设置或连通。壳体收容腔15及支架收容腔23均可用于安装输入输出模组30。输入输出模组30的数量可以少于或等于壳体收容腔15的数量与支架收容腔23的数量之和。输入输出模组30的安装精度要求较高时，输入输出模组30可直接安装在壳体收容腔15内以完成输入输出模组30的安装，此时，安装在壳体收容腔15内的输入输出模组30相对第一面11具有较高的安装精度。当输入输出模组30的安装难度较大时，输入输出模组30先安装在支架20的支架收容腔23内，然后再与支架20一起安装在壳体10上。由于支架20相较于输入输出模组30更容易安装，因此，输入输出模组30通过支架20安装到壳体10上的工艺更简单并容易实现。The number of the housing receiving cavities 15 may be one, two, three, four or any number, and the number of the first perforations 111 may be consistent with and corresponding to the number of the housing receiving cavities 15; or, the first perforations 111 The number of the housings 15 is less than the number of housing receiving chambers 15, and each of the first through holes 111 is in communication with a housing receiving cavity 15. The number of the bracket receiving cavities 23 may be one, two, three, four or any number, and the number of the bracket through holes 24 may be consistent with the number of the bracket receiving cavities 23 and correspondingly communicated; or the number of the bracket through holes 24 Less than the number of the bracket receiving cavities 23, each of the bracket through holes 24 is in communication with a bracket receiving cavity 23. The number of second perforations 112 coincides with the number of bracket through holes 24 and is correspondingly communicated. The first through hole 111 and the second through hole 112 may be spaced apart or communicated. Both the housing receiving cavity 15 and the bracket receiving cavity 23 can be used to mount the input/output module 30. The number of input and output modules 30 may be less than or equal to the sum of the number of housing receiving cavities 15 and the number of bracket receiving cavities 23. When the mounting precision of the input/output module 30 is high, the input/output module 30 can be directly installed in the housing receiving cavity 15 to complete the installation of the input/output module 30. At this time, it is installed in the housing receiving cavity 15. The input and output module 30 has a higher mounting accuracy with respect to the first face 11. When the input/output module 30 is difficult to install, the input/output module 30 is first installed in the bracket receiving cavity 23 of the bracket 20, and then mounted on the housing 10 together with the bracket 20. Since the bracket 20 is easier to install than the input/output module 30, the process of mounting the input/output module 30 to the housing 10 via the bracket 20 is simpler and easier to implement.

本发明实施方式的移动终端200中，输入输出模组30可先安装在支架20上再与支架20一起安装到壳体10上，从而使输入输出模组30安装到壳体10上的工艺比较简单。In the mobile terminal 200 of the embodiment of the present invention, the input/output module 30 can be first mounted on the bracket 20 and then mounted on the casing 10 together with the bracket 20, so that the process of mounting the input/output module 30 to the casing 10 is compared. simple.

请参阅图7、图10及图11，本发明实施方式的移动终端200包括壳体组件100、输入输出模组30、盖体40、主板50、盖板60及油墨70。移动终端200可以是手机、平板电脑、手提电脑、游戏机、头显设备、门禁***、柜员机等，本发明实施例以移动终端200是手机为例进行说明。Referring to FIG. 7 , FIG. 10 and FIG. 11 , the mobile terminal 200 of the embodiment of the present invention includes a housing assembly 100 , an input/output module 30 , a cover 40 , a main board 50 , a cover 60 , and an ink 70 . The mobile terminal 200 can be a mobile phone, a tablet computer, a laptop computer, a game machine, a head display device, an access control system, a teller machine, etc., and the mobile terminal 200 is a mobile phone as an example.

壳体组件100包括壳体10及支架20。The housing assembly 100 includes a housing 10 and a bracket 20.

请参阅图8及图9，支架20能够拆卸地安装在壳体10上。支架20包括正面21、背面22及侧壁26，正面21及背面22位于支架20的相背两侧，侧壁26连接正面21及背面22并环绕正面21及背面22。背面22开设有支架收容腔23，正面21开设有与支架收容腔23对应连通的支架通孔24，支架收容腔23的中心轴线与支架通孔24的中心轴线重合。支架通孔24的开口尺寸小于对应的支架收容腔23的尺寸以形成支架限位环25，支架收容腔23由支架限位环25及环绕支架限位环25延伸的内壁形成。正面21设置在第二面12上，支架通孔24与第二穿孔112对应连通，具体地，支架通孔24的中心轴线与第二穿孔112的中心轴线重合。Referring to Figures 8 and 9, the bracket 20 is detachably mounted to the housing 10. The bracket 20 includes a front surface 21, a back surface 22 and side walls 26. The front surface 21 and the back surface 22 are located on opposite sides of the bracket 20. The side wall 26 connects the front surface 21 and the back surface 22 and surrounds the front surface 21 and the back surface 22. The back surface 22 defines a bracket receiving cavity 23, and the front surface 21 defines a bracket through hole 24 corresponding to the bracket receiving cavity 23, and the central axis of the bracket receiving cavity 23 coincides with the central axis of the bracket through hole 24. The opening size of the bracket through hole 24 is smaller than the size of the corresponding bracket receiving cavity 23 to form a bracket limiting ring 25 formed by the bracket limiting ring 25 and an inner wall extending around the bracket limiting ring 25. The front surface 21 is disposed on the second surface 12, and the bracket through hole 24 is correspondingly communicated with the second through hole 112. Specifically, the central axis of the bracket through hole 24 coincides with the central axis of the second through hole 112.

请结合图7及图8，本实施方式的壳体组件100中的支架20上的支架收容腔23的数量、支架通孔24的数量、及第二穿孔112的数量均为两个，两个支架通孔24分别与两个第二穿孔112对应连通。两个第二穿孔112的中心及第一穿孔111的中心位于同一直线上。Referring to FIG. 7 and FIG. 8 , the number of the bracket receiving cavities 23 , the number of the bracket through holes 24 , and the number of the second through holes 112 on the bracket 20 in the housing assembly 100 of the present embodiment are both two. The bracket through holes 24 are respectively in communication with the two second through holes 112. The centers of the two second through holes 112 and the center of the first through holes 111 are on the same straight line.

请结合图10，主板50安装在第二面12的靠近顶壁13的一端，具体地，主板50可以通过螺合、卡合、胶合等方式固定在壳体10上。主板50设置有线路并可以电性连接移动终端200上的处理芯片、控制芯片等电子元器件。主板50的靠近顶壁13的一端开设有安装口51，安装口51环绕第一穿孔111、第二穿孔112、支架20及腔体侧壁16。主板50的远离第二面12的一侧设置有与线路电性连接的连接座52。Referring to FIG. 10, the main board 50 is mounted on one end of the second surface 12 near the top wall 13. Specifically, the main board 50 can be fixed to the housing 10 by screwing, snapping, gluing or the like. The main board 50 is provided with a circuit and can be electrically connected to electronic components such as a processing chip and a control chip on the mobile terminal 200. A mounting port 51 is defined in an end of the main board 50 adjacent to the top wall 13. The mounting opening 51 surrounds the first through hole 111, the second through hole 112, the bracket 20, and the cavity sidewall 16. A side of the main board 50 remote from the second surface 12 is provided with a connecting base 52 electrically connected to the line.

请结合图7及图9，输入输出模组30的数量为三个，三个输入输出模组30分别安装在一个壳体收容腔15内及两个支架收容腔23内。输入输出模组30包括设置在输入输出模组30的靠近第二面112(或主板50)一侧的连接器34，当输入输出模组30安装在壳体组件100上时，连接器34与连接座52结合(插接)以电性连接输入输出模组30及主板50。输入输出模组30可以向外界发出信号或者接收外界的信号，或者同时具备向外界发出信号和接收外界的信号的功能，其中信号可以是光线信号、声音信号、触摸信号等。可以理解，依据移动终端200的不同功能需求，输入输出模组30的具体种类和每种输入输出模组30的数量可以有所变化。Referring to FIG. 7 and FIG. 9 , the number of the input and output modules 30 is three, and the three input and output modules 30 are respectively installed in one housing receiving cavity 15 and two bracket receiving cavities 23 . The input/output module 30 includes a connector 34 disposed on a side of the input/output module 30 adjacent to the second surface 112 (or the motherboard 50). When the input/output module 30 is mounted on the housing assembly 100, the connector 34 is The connector 52 is coupled (plugged) to electrically connect the input and output module 30 and the main board 50. The input/output module 30 can send a signal to the outside world or receive an external signal, or have the function of sending a signal to the outside world and receiving a signal from the outside, wherein the signal can be a light signal, a sound signal, a touch signal, or the like. It can be understood that the specific types of the input and output modules 30 and the number of each of the input and output modules 30 may vary according to different functional requirements of the mobile terminal 200.

具体地，输入输出模组30包括红外成像模组31、激光投射模组33及可见光成像模组32。激光投射模组33收容在壳体收容腔15内并通过第一穿孔111从第一面11暴露。红外成像模组31及可见光成像模组32分别收容在两个支架收容腔23内并通过支架通孔24及第二穿孔112从第一面11暴露。可见光成像模组32设置在红外成像模组31与激光投射模组33之间。其中，激光投射模组33可用于向移动终端200外的目标物体投射激光图案，激光可以是红外光，红外成像模组31可用于接收外界的红外光信号以生成红外图像，在一个例子中，红外成像模组31可以接收由目标物体反射的激光图案，激光投射模组33和红外成像模组31共同用于获得目标物体的深度信息，此时，红外成像模组31与激光投射模组33之间的间距要大于一个特定的值，以使激光投射模组33和红外成像模组31共同获取得到的深度信息较准确。可见光成像模组32可接收外界的可见光信号以生成彩色图像，可见光成像模组32、红外成像模组31和激光投射模组33可以共同用于获得目标用户的深度图像。当然，光学模组的具体形式还可以有其他，不限于本发明实施例中的举例。Specifically, the input/output module 30 includes an infrared imaging module 31, a laser projection module 33, and a visible light imaging module 32. The laser projection module 33 is housed in the housing receiving cavity 15 and exposed from the first surface 11 through the first through hole 111. The infrared imaging module 31 and the visible light imaging module 32 are respectively received in the two bracket receiving cavities 23 and exposed from the first surface 11 through the bracket through holes 24 and the second through holes 112. The visible light imaging module 32 is disposed between the infrared imaging module 31 and the laser projection module 33. The laser projection module 33 can be used to project a laser pattern to a target object outside the mobile terminal 200. The laser can be infrared light, and the infrared imaging module 31 can be used to receive an infrared signal of the outside to generate an infrared image. In an example, The infrared imaging module 31 can receive the laser pattern reflected by the target object, and the laser projection module 33 and the infrared imaging module 31 are used together to obtain the depth information of the target object. At this time, the infrared imaging module 31 and the laser projection module 33 The spacing between them is greater than a specific value, so that the depth information obtained by the laser projection module 33 and the infrared imaging module 31 is relatively accurate. The visible light imaging module 32 can receive visible light signals from the outside to generate a color image, and the visible light imaging module 32, the infrared imaging module 31, and the laser projection module 33 can be used together to obtain a depth image of the target user. Certainly, the specific form of the optical module may have other, and is not limited to the examples in the embodiments of the present invention.

在本发明实施方式中，暴露指的是可以从第一面11或从第二面12看到输入输出模组30(包括红外成像模组31、激光投射模组33及可见光成像模组32)，例如，激光投射模组33可以穿过第一面11的第一穿孔111以从第一面11凸出至壳体10的第一面11一侧外；或者，激光投射模组33也可以未穿过第一穿孔111，但通过第一穿孔111可以看到激光投射模组33，此时，激光投射模组33的顶面与第一面11齐平，或者激光投射模组33的顶面位于第一面11的靠近第二面12一侧。In the embodiment of the present invention, the exposure means that the input/output module 30 (including the infrared imaging module 31, the laser projection module 33, and the visible light imaging module 32) can be seen from the first surface 11 or the second surface 12. For example, the laser projection module 33 can pass through the first through hole 111 of the first surface 11 to protrude from the first surface 11 to the side of the first surface 11 of the housing 10; or, the laser projection module 33 can also The laser projection module 33 is not visible through the first through hole 111, but the top surface of the laser projection module 33 is flush with the first surface 11 or the top of the laser projection module 33. The face is located on the side of the first face 11 near the second face 12.

请结合图10，盖体40安装在壳体10上。具体地，盖体40设置在第二面12所在的一侧，输入输出模组30及主板50位于壳体10与盖体40之间。在一个例子中，盖体40安装在壳体10上时，盖体40与输入输出模组30抵持以将输入输出模组30牢固地安装在壳体收容腔15及支架收容腔23内。盖体40可以采用不锈钢、铝合金、塑料等材料制成。Referring to FIG. 10, the cover 40 is mounted on the housing 10. Specifically, the cover 40 is disposed on a side where the second surface 12 is located, and the input/output module 30 and the main board 50 are located between the housing 10 and the cover 40. In one example, when the cover 40 is mounted on the casing 10, the cover 40 abuts against the input/output module 30 to securely mount the input/output module 30 in the housing receiving cavity 15 and the bracket receiving cavity 23. The cover 40 can be made of stainless steel, aluminum alloy, plastic or the like.

请结合图10及图11，盖板60设置在第一面11并覆盖第一穿孔111及第二穿孔112上，盖板60与第一面11结合的表面设置有仅通过红外光的红外透过油墨70，红外透过油墨70遮挡第一穿孔111及与红外成像模组31对应的第二穿孔112。红外透过油墨70对红外光有较高的透过率，例如可达到85％或以上，且对可见光有较高的衰减率，例如可达到70％以上，使得用户在正常使用中，肉眼难以看到移动终端200上被红外透过油墨70覆盖的区域。盖板40的材料可以是透光的玻璃、树脂、塑料等。Referring to FIG. 10 and FIG. 11 , the cover plate 60 is disposed on the first surface 11 and covers the first through hole 111 and the second through hole 112 . The surface of the cover plate 60 combined with the first surface 11 is provided with infrared light through only infrared light. The ink passes through the ink 70, and the infrared through ink 70 blocks the first through hole 111 and the second through hole 112 corresponding to the infrared imaging module 31. The infrared transmission ink 70 has a high transmittance for infrared light, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user is difficult to use in normal use. The area of the mobile terminal 200 that is covered by the infrared ray transmission ink 70 is seen. The material of the cover 40 may be light transmissive glass, resin, plastic, or the like.

本发明实施方式的壳体组件100中，输入输出模组30可先安装在支架20上再与支架20一起安装到壳体10上，从而使输入输出模组30安装到壳体10上的工艺比较简单。同时，由于壳体10上形成有壳体限位环17，从而便于输入输出模组30通过壳体限位环17定位安装到壳体收容腔15内。再有，支架20形成有支架限位环25从而便于输入输出模组30通过支架限位环25定位安装到支架收容腔23内。In the housing assembly 100 of the embodiment of the present invention, the input/output module 30 can be first mounted on the bracket 20 and then mounted to the housing 10 together with the bracket 20, so that the input/output module 30 is mounted on the housing 10. easier. At the same time, since the housing limiting ring 17 is formed on the housing 10, the input/output module 30 is conveniently positioned and mounted into the housing receiving cavity 15 through the housing limiting ring 17. Further, the bracket 20 is formed with a bracket limiting ring 25 to facilitate the positioning of the input/output module 30 into the bracket receiving cavity 23 through the bracket limiting ring 25 .

本发明实施方式的移动终端200还具有以下有益效果：第一，两个第二穿孔112的中心及第一穿孔111的中心位于同一直线上，当三个输入输出模组30分别安装在两个支架收容腔23内及一个壳体收容腔15内后，三者的光轴位于同一平面内，易于三者互相配合工作并可以共同用于获得目标用户的深度图像。第二，输入输出模组30上设置有连接器34，主板50上设置有连接座52，从而便于输入输出模组30与主板50通过连接器34与连接座52电性连接在一起。第三，主板50上开设有环绕支架20及腔体侧壁16的安装口51，从而主板50安装到壳体10上时不会与支架20及侧壁16发生干涉，并且便于位于安装口51相对两侧的主板50与壳体10(或移动终端200)上的其他电子元器件电性连接。第四，可见光成像模组32设置在红外成像模组31与激光投射模组33之间，从而使安装口51的尺寸可以开设得更小，也就是说，位于安装口51相对两侧的主板50的宽度较大并便于主板50与壳体10上的其他电子元器件电性连接。第五，设置在盖板60上的红外透过油墨70遮挡第一穿孔111及与红外成像模组31对应的第二穿孔112，用户难以通过盖板50看到红外成像模组31及激光投射模组33，从而使移动终端200的外观更加美观。The mobile terminal 200 of the embodiment of the present invention further has the following beneficial effects: first, the centers of the two second through holes 112 and the center of the first through holes 111 are on the same straight line, and when the three input/output modules 30 are respectively installed in two After the bracket receiving cavity 23 and a housing receiving cavity 15, the optical axes of the three are in the same plane, which is easy for the three to work together and can be used together to obtain a depth image of the target user. Secondly, the input/output module 30 is provided with a connector 34. The main board 50 is provided with a connecting base 52, so that the input/output module 30 and the main board 50 are electrically connected to the connecting base 52 through the connector 34. Thirdly, the main board 50 is provided with a mounting opening 51 surrounding the bracket 20 and the side wall 16 of the cavity, so that the main board 50 does not interfere with the bracket 20 and the side wall 16 when mounted on the housing 10, and is conveniently located at the mounting opening 51. The main board 50 on the opposite sides is electrically connected to other electronic components on the housing 10 (or the mobile terminal 200). Fourth, the visible light imaging module 32 is disposed between the infrared imaging module 31 and the laser projection module 33, so that the size of the mounting opening 51 can be made smaller, that is, the motherboard located on opposite sides of the mounting opening 51. The width of 50 is large and facilitates the electrical connection of the main board 50 to other electronic components on the housing 10. Fifth, the infrared transmission ink 70 disposed on the cover 60 blocks the first through hole 111 and the second through hole 112 corresponding to the infrared imaging module 31. It is difficult for the user to see the infrared imaging module 31 and the laser projection through the cover 50. The module 33 is such that the appearance of the mobile terminal 200 is more beautiful.

请参阅图9，在某些实施方式中，支架20还包括自侧壁26向外(朝远离支架20的中心)凸出的固定凸出27，支架20通过固定凸出27固定在壳体10上。支架20上的固定凸出27的数量可以是单个或多个，当支架20上的固定凸出27的数量是多个时，多个固定凸出27可以从侧壁26的相背的两侧凸出。固定凸出27用于固定支架20，具体地，可以通过紧固件直接将固定凸出27固定在壳体10上，也可以通过紧固件将支架20和主板50共同固定在壳体10上。在如图9所示的实施例中，固定凸出27上开设有固定孔271，壳体10与固定孔271对应的位置开设有安装孔(图未示)，可以通过紧固件(如螺钉)穿过固定孔271并与安装孔结合，以将支架20固定在壳体10上。通过固定凸出27固定支架20，进一步提高支架20安装在壳体10内的稳定性。当支架20不包括自侧壁26向外(朝远离支架20的中心)凸出的固定凸出27时，支架20可以通过焊接、卡合、胶合等方式安装在壳体10上。Referring to FIG. 9 , in some embodiments, the bracket 20 further includes a fixing protrusion 27 protruding outward from the side wall 26 ( away from the center of the bracket 20 ), and the bracket 20 is fixed to the housing 10 by the fixing protrusion 27 . on. The number of the fixing protrusions 27 on the bracket 20 may be single or plural. When the number of the fixing protrusions 27 on the bracket 20 is plural, the plurality of fixing protrusions 27 may be from opposite sides of the side wall 26 Protruding. The fixing protrusion 27 is used for fixing the bracket 20 . Specifically, the fixing protrusion 27 can be directly fixed to the housing 10 by a fastener, or the bracket 20 and the main board 50 can be fixed to the housing 10 by fasteners. . In the embodiment shown in FIG. 9, the fixing protrusion 27 is provided with a fixing hole 271, and the housing 10 is provided with a mounting hole (not shown) corresponding to the fixing hole 271, and can pass through a fastener (such as a screw). Passing through the fixing hole 271 and engaging with the mounting hole to fix the bracket 20 to the housing 10. The fixing of the bracket 20 by the fixing projection 27 further improves the stability of the bracket 20 installed in the housing 10. When the bracket 20 does not include the fixing protrusion 27 that protrudes outward from the side wall 26 (toward the center away from the bracket 20), the bracket 20 may be mounted on the housing 10 by welding, snapping, gluing, or the like.

请参阅图1及图7，在某些实施方式中，第一穿孔111的开口尺寸小于对应的壳体收容腔15的尺寸以形成壳体限位环17，壳体收容腔15由壳体限位环17及环绕壳体限位环17延伸的内壁形成。Referring to FIG. 1 and FIG. 7 , in some embodiments, the opening size of the first through hole 111 is smaller than the size of the corresponding housing receiving cavity 15 to form the housing limiting ring 17 , and the housing receiving cavity 15 is limited by the housing. The bit ring 17 and an inner wall extending around the housing stop ring 17 are formed.

请参阅图1及图7，在某些实施方式中，壳体10包括自第二面12向外延伸形成的腔体侧壁16，腔体侧壁16与第二面12共同围成壳体收容腔15；或，壳体收容腔15自第二面12沿第一面11的方向上开设形成。Referring to FIGS. 1 and 7 , in some embodiments, the housing 10 includes a cavity sidewall 16 extending outwardly from the second face 12 , the cavity sidewall 16 and the second face 12 together enclosing the housing The housing cavity 15 is formed; or the housing receiving cavity 15 is formed from the second surface 12 in the direction of the first surface 11 .

请参阅图2及图8，在某些实施方式中，支架通孔24的开口尺寸小于对应的支架收容腔23的尺寸以形成支架限位环25，支架收容腔23由支架限位环25及环绕支架限位环25延伸的内壁形成。Referring to FIG. 2 and FIG. 8 , in some embodiments, the opening size of the bracket through hole 24 is smaller than the size of the corresponding bracket receiving cavity 23 to form a bracket limiting ring 25 , and the bracket receiving cavity 23 is supported by the bracket limiting ring 25 . An inner wall extending around the bracket limit ring 25 is formed.

请参阅图3及图9，在某些实施方式中，支架20包括连接正面21及背面22的侧壁26、及自侧壁26向外凸出的固定凸出27，支架20通过固定凸出27固定在壳体10上。Referring to FIG. 3 and FIG. 9 , in some embodiments, the bracket 20 includes a side wall 26 connecting the front surface 21 and the back surface 22 , and a fixing protrusion 27 protruding outward from the side wall 26 , and the bracket 20 is fixedly protruded 27 is fixed to the housing 10.

请参阅图1及图7，在某些实施方式中，第二穿孔112的数量为两个，第一穿孔111的数量为一个，两个第二穿孔112的中心及第一穿孔111的中心位于同一直线上。Referring to FIG. 1 and FIG. 7 , in some embodiments, the number of the second through holes 112 is two, the number of the first through holes 111 is one, and the centers of the two second through holes 112 and the center of the first through holes 111 are located. On the same line.

请参阅图1至图3，本申请的一种移动终端200包括壳体组件100包括壳体10及安装在壳体10上的支架20。壳体10包括相背的第一面11及第二面12，第一面11开设有贯穿第二面12的第一穿孔111及第二穿孔112，第二面12所在的一侧形成有壳体收容腔15，壳体收容腔15与第一穿孔111对应。支架20包括相背的正面21及背面22，背面22开设有支架收容腔23，正面21开设有与支架收容腔23对应的支架通孔24，正面21设置在第二面12上，支架通孔24与第二穿孔112对应。Referring to FIGS. 1 to 3 , a mobile terminal 200 of the present application includes a housing assembly 100 including a housing 10 and a bracket 20 mounted on the housing 10 . The housing 10 includes a first surface 11 and a second surface 12 opposite to each other. The first surface 11 defines a first through hole 111 and a second through hole 112 extending through the second surface 12, and a side of the second surface 12 is formed with a shell. The body housing cavity 15 has a housing receiving cavity 15 corresponding to the first through hole 111. The bracket 20 includes a front surface 21 and a rear surface 22 opposite to each other. The back surface 22 defines a bracket receiving cavity 23, and the front surface 21 defines a bracket through hole 24 corresponding to the bracket receiving cavity 23, and the front surface 21 is disposed on the second surface 12, and the bracket through hole 24 corresponds to the second through hole 112.

请参阅图1，在某些实施方式中，移动终端200还包括输入输出模组30，输入输出模组30包括红外成像模组31及激光投射模组33，红外成像模组31收容在壳体收容腔15内并通过第一穿孔111从第一面11暴露；激光投射模组33收容在支架收容腔23内并通过支架通孔24及第二穿孔112从第一面11暴露。Referring to FIG. 1 , in some embodiments, the mobile terminal 200 further includes an input and output module 30. The input and output module 30 includes an infrared imaging module 31 and a laser projection module 33. The infrared imaging module 31 is housed in the housing. The inside of the receiving cavity 15 is exposed from the first surface 11 through the first through hole 111. The laser projection module 33 is received in the bracket receiving cavity 23 and exposed from the first surface 11 through the bracket through hole 24 and the second through hole 112.

请参阅图1，在某些实施方式中，第二穿孔112的数量为两个，第一穿孔111的数量为一个，两个第二穿孔112的中心及第一穿孔111的中心位于同一直线上；输入输出模组30还包括可见光成像模组32，可见光成像模组32收容在支架收容腔23内并通过支架通孔24及第二穿孔112从第一面11暴露。Referring to FIG. 1 , in some embodiments, the number of the second through holes 112 is two, and the number of the first through holes 111 is one, and the centers of the two second through holes 112 and the center of the first through holes 111 are on the same line. The input/output module 30 further includes a visible light imaging module 32. The visible light imaging module 32 is received in the bracket receiving cavity 23 and exposed from the first surface 11 through the bracket through hole 24 and the second through hole 112.

请参阅图4，在某些实施方式中，移动终端200还包括盖体40，盖体40与壳体10结合，输入输出模组30位于壳体10与盖体40之间，盖体40抵持输入输出模组30。Referring to FIG. 4, in some embodiments, the mobile terminal 200 further includes a cover 40. The cover 40 is coupled to the housing 10. The input/output module 30 is located between the housing 10 and the cover 40. The input and output module 30 is held.

请参阅图3及图4，在某些实施方式中，移动终端200还包括主板50，主板50结合在壳体10或盖体40上，输入输出模组30上设置有连接器34，主板50上设置有连接座52，连接器34与连接座52结合以连接输入输出模组30与主板50。Referring to FIG. 3 and FIG. 4 , in some embodiments, the mobile terminal 200 further includes a motherboard 50 , the motherboard 50 is coupled to the housing 10 or the cover 40 , and the input and output module 30 is provided with a connector 34 . A connector 52 is disposed on the connector 34 and the connector 52 is coupled to the input and output module 30 and the motherboard 50.

请参阅图4及图5，在某些实施方式中，移动终端200还包括透光的盖板60，盖板60设置在第一面11并覆盖第一穿孔111及第二穿孔112上，盖板60与第一面11结合的表面设置有仅通过红外光的红外透过油墨70，红外透过油墨70遮挡第一穿孔111及与激光投射模组33对应的第二穿孔112。Referring to FIG. 4 and FIG. 5 , in some embodiments, the mobile terminal 200 further includes a light-transmissive cover 60 disposed on the first surface 11 and covering the first through hole 111 and the second through hole 112 . The surface of the plate 60 combined with the first surface 11 is provided with an infrared transmission ink 70 that passes only infrared light, and the infrared transmission ink 70 blocks the first through hole 111 and the second through hole 112 corresponding to the laser projection module 33.

请参阅图7，在某些实施方式中，移动终端200还包括输入输出模组30包括红外成像模组31及激光投射模组33，激光投射模组33收容在壳体收容腔15内并通过第一穿孔111从第一面11暴露；红外成像模组31收容在支架收容腔23内并通过支架通孔24从第二穿孔112暴露。Referring to FIG. 7 , in some embodiments, the mobile terminal 200 further includes an input and output module 30 including an infrared imaging module 31 and a laser projection module 33. The laser projection module 33 is received in the housing receiving cavity 15 and passes through The first through hole 111 is exposed from the first surface 11; the infrared imaging module 31 is received in the holder receiving cavity 23 and exposed from the second through hole 112 through the bracket through hole 24.

现有的手机结构(例如壳体10)与功能模块(例如输入输出模组30)的结构不匹配，从而导致将功能模块(例如输入输出模组30)安装到手机上的工艺比较复杂。本申请的壳体组件100中，输入输出模组30可先安装在支架20上再与支架20一起安装到壳体10上，从而使输入输出模组30安装到壳体10上的工艺比较简单。The structure of the existing mobile phone structure (for example, the casing 10) does not match the structure of the functional module (for example, the input/output module 30), so that the process of installing the functional module (for example, the input/output module 30) on the mobile phone is complicated. In the housing assembly 100 of the present application, the input/output module 30 can be first mounted on the bracket 20 and then mounted to the housing 10 together with the bracket 20, so that the process of mounting the input/output module 30 to the housing 10 is relatively simple. .

请参阅图7，在某些实施方式中，第二穿孔112的数量为两个，第一穿孔111的数量为一个，两个第二穿孔112的中心及第一穿孔111的中心位于同一直线上；输入输出模组30还包括可见光成像模组32，可见光成像模组32收容在支架收容腔23内并通过支架通孔24从第二穿孔112暴露。Referring to FIG. 7 , in some embodiments, the number of the second through holes 112 is two, the number of the first through holes 111 is one, and the centers of the two second through holes 112 and the center of the first through holes 111 are on the same line. The input/output module 30 further includes a visible light imaging module 32. The visible light imaging module 32 is received in the bracket receiving cavity 23 and exposed from the second through hole 112 through the bracket through hole 24.

请参阅图10，在某些实施方式中，移动终端200还包括盖体40，盖体40与壳体10结合，输入输出模组30位于壳体10与盖体40之间，盖体40抵持输入输出模组30。Referring to FIG. 10, in some embodiments, the mobile terminal 200 further includes a cover 40. The cover 40 is coupled to the housing 10. The input/output module 30 is located between the housing 10 and the cover 40. The input and output module 30 is held.

请参阅图10，在某些实施方式中，移动终端200还包括主板50，主板50结合在壳体10或盖体40上，输入输出模组30上设置有朝向第一面11的连接器34，主板50上设置有朝向第二面12的连接座52，连接器34与连接座52结合以连接输入输出模组30与主板50。Referring to FIG. 10 , in some embodiments, the mobile terminal 200 further includes a motherboard 50 coupled to the housing 10 or the cover 40 . The input/output module 30 is provided with a connector 34 facing the first surface 11 . The main board 50 is provided with a connecting seat 52 facing the second surface 12, and the connector 34 is combined with the connecting base 52 to connect the input/output module 30 and the main board 50.

请参阅图10，在某些实施方式中，主板50形成有安装口51，支架20收容在安装口51内。Referring to FIG. 10, in some embodiments, the main board 50 is formed with a mounting opening 51, and the bracket 20 is received in the mounting opening 51.

请参阅图10及图11，在某些实施方式中，移动终端200还包括透光的盖板60，盖板60设置在第一面11上，盖板60与第一面11结合的表面形成有仅通过红外光的红外透过油墨70，红外透过油墨70遮挡第一穿孔111及与激光投射模组33对应的第二穿孔112。Referring to FIG. 10 and FIG. 11 , in some embodiments, the mobile terminal 200 further includes a light-transmissive cover plate 60 . The cover plate 60 is disposed on the first surface 11 , and the surface of the cover plate 60 combined with the first surface 11 is formed. There is an infrared transmission ink 70 that passes only infrared light, and the infrared transmission ink 70 blocks the first through hole 111 and the second through hole 112 corresponding to the laser projection module 33.

请参阅图12，在某些实施方式中，激光投射模组33包括基板组件331、镜筒332、光源333、准直元件334、衍射光学元件(diffractive optical elements，DOE)335、及保护盖336。Referring to FIG. 12 , in some embodiments, the laser projection module 33 includes a substrate assembly 331 , a lens barrel 332 , a light source 333 , a collimating element 334 , a diffractive optical element (DOE) 335 , and a protective cover 336 . .

基板组件331包括基板3311和电路板3312。电路板3312设置在基板3311上，电路板3312用于连接光源333与终端100的主板40，电路板3312可以是硬板、软板或软硬结合板。The substrate assembly 331 includes a substrate 3311 and a circuit board 3312. The circuit board 3312 is disposed on the substrate 3311. The circuit board 3312 is used to connect the light source 333 with the main board 40 of the terminal 100. The circuit board 3312 may be a hard board, a soft board or a soft and hard board.

镜筒332与基板组件331固定连接，镜筒332形成有容置腔3321，镜筒332包括顶部3322及自顶部3322延伸的环形的周壁3324，周壁3324设置在基板组件331上，顶部3322开设有与容置腔3321连通的通光孔3325。周壁3324可以与电路板3312通过粘胶连接。The lens barrel 332 is fixedly connected to the substrate assembly 331. The lens barrel 332 is formed with a receiving cavity 3321. The lens barrel 332 includes a top portion 3322 and an annular peripheral wall 3324 extending from the top portion 3322. The peripheral wall 3324 is disposed on the substrate assembly 331, and the top portion 3322 is opened. a light passing hole 3325 communicating with the accommodating cavity 3321. The peripheral wall 3324 can be connected to the circuit board 3312 by an adhesive.

保护盖336设置在顶部3322上。保护盖336包括开设有出光通孔3360的挡板3362及自挡板3362延伸的环形侧壁3364。A protective cover 336 is disposed on the top portion 3322. The protective cover 336 includes a baffle 3362 that is provided with a light-emitting through hole 3360 and an annular side wall 3364 that extends from the baffle 3362.

光源333与准直元件334均设置在容置腔3321内，衍射光学元件335安装在镜筒332上，准直元件334与衍射光学元件335依次设置在光源333的发光光路上。准直元件334对光源333发出的激光进行准直，激光穿过准直元件334后再穿过衍射光学元件335以形成激光图案。The light source 333 and the collimating element 334 are both disposed in the accommodating cavity 3321, the diffractive optical element 335 is mounted on the lens barrel 332, and the collimating element 334 and the diffractive optical element 335 are sequentially disposed on the illuminating light path of the light source 333. The collimating element 334 collimates the laser light emitted by the light source 333, and the laser passes through the collimating element 334 and then passes through the diffractive optical element 335 to form a laser pattern.

光源333可以是垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser,VCSEL)或者边发射激光器(edge-emitting laser，EEL)，在如图12所示的实施例中，光源333为边发射激光器，具体地，光源333可以为分布反馈式激光器(Distributed Feedback Laser，DFB)。光源333用于向容置腔3321内发射激光。请结合图13，光源333整体呈柱状，光源333远离基板组件331的一个端面形成发光面3331，激光从发光面3331发出，发光面3331朝向准直元件334。光源333固定在基板组件331上，具体地，光源333可以通过封胶337粘结在基板组件331上，例如光源333的与发光面3331相背的一面粘接在基板组件331上。请结合图12和图14，光源333的侧面3332也可以粘接在基板组件331上，封胶337包裹住四周的侧面3332，也可以仅粘结侧面3332的某一个面与基板组件331或粘结某几个面与基板组件331。此时封胶337可以为导热胶，以将光源333工作产生的热量传导至基板组件331中。The light source 333 may be a Vertical Cavity Surface Emitting Laser (VCSEL) or an edge-emitting laser (EEL). In the embodiment shown in FIG. 12, the light source 333 is an edge emitting laser. The light source 333 can be a Distributed Feedback Laser (DFB). The light source 333 is used to emit laser light into the accommodating cavity 3321. Referring to FIG. 13 , the light source 333 has a column shape as a whole, and the light source 333 forms a light emitting surface 3331 away from one end surface of the substrate assembly 331 . The laser light is emitted from the light emitting surface 3331 , and the light emitting surface 3331 faces the collimating element 334 . The light source 333 is fixed on the substrate assembly 331. Specifically, the light source 333 can be adhered to the substrate assembly 331 by a sealant 337. For example, a side of the light source 333 opposite to the light-emitting surface 3331 is bonded to the substrate assembly 331. Referring to FIG. 12 and FIG. 14, the side surface 3332 of the light source 333 may also be adhered to the substrate assembly 331. The sealing material 337 encloses the surrounding side surface 3332, or may only bond one surface of the side surface 3332 to the substrate assembly 331 or adhere. A plurality of faces and substrate assemblies 331 are bonded. At this time, the sealant 337 may be a thermal conductive adhesive to conduct heat generated by the operation of the light source 333 into the substrate assembly 331.

请参阅图12，衍射光学元件335承载在顶部3322上并收容在保护盖336内。衍射光学元件335的相背两侧分别与保护盖336及顶部3322抵触，挡板3362包括靠近通光孔3325的抵触面3363，衍射光学元件335与抵触面3363抵触。Referring to FIG. 12, the diffractive optical element 335 is carried on the top portion 3322 and housed within the protective cover 336. The opposite sides of the diffractive optical element 335 are respectively in contact with the protective cover 336 and the top portion 3322. The baffle 3362 includes an abutting surface 3363 adjacent to the light passing hole 3325, and the diffractive optical element 335 is in contact with the abutting surface 3363.

具体地，衍射光学元件335包括相背的衍射入射面3352和衍射出射面3354。衍射光学元件335承载在顶部3322上，衍射出射面3354与挡板3362的靠近通光孔3325的表面(抵触面3363)抵触，衍射入射面3352与顶部3322抵触。通光孔3325与容置腔3321对准，出光通孔3360与通光孔3325对准。顶部3322、环形侧壁3364及挡板3362与衍射光学元件335抵触，从而防止衍射光学元件335沿出光方向从保护盖336内脱落。在某些实施方式中，保护盖336通过胶水粘贴在顶部3322上。Specifically, the diffractive optical element 335 includes opposite diffractive incident faces 3352 and diffractive exit faces 3354. The diffractive optical element 335 is carried on the top portion 3322, and the diffraction exit surface 3354 is in contact with the surface of the baffle 3362 near the light-passing hole 3325 (the abutting surface 3363), and the diffractive incident surface 3352 is in contact with the top portion 3322. The light-passing hole 3325 is aligned with the accommodating cavity 3321, and the light-emitting through hole 3360 is aligned with the light-passing hole 3325. The top portion 3322, the annular side wall 3364, and the baffle 3362 are in contact with the diffractive optical element 335, thereby preventing the diffractive optical element 335 from falling out of the protective cover 336 in the light exiting direction. In some embodiments, the protective cover 336 is glued to the top 3322.

上述的激光投射模组33的光源333采用边发射激光器，一方面边发射激光器较VCSEL阵列的温漂较小，另一方面，由于边发射激光器为单点发光结构，无需设计阵列结构，制作简单，激光投射模组33的光源成本较低。The light source 333 of the laser projection module 33 adopts an edge emitting laser. On the one hand, the temperature of the transmitting laser is smaller than that of the VCSEL array. On the other hand, since the edge emitting laser is a single-point light emitting structure, it is not necessary to design an array structure, and the manufacturing is simple. The light source of the laser projection module 33 is low in cost.

分布反馈式激光器的激光在传播时，经过光栅结构的反馈获得功率的增益。要提高分布反馈式激光器的功率，需要通过增大注入电流和/或增加分布反馈式激光器的长度，由于增大注入电流会使得分布反馈式激光器的功耗增大并且出现发热严重的问题，因此，为了保证分布反馈式激光器能够正常工作，需要增加分布反馈式激光器的长度，导致分布反馈式激光器一般呈细长条结构。当边发射激光器的发光面3331朝向准直元件334时，边发射激光器呈竖直放置，由于边发射激光器呈细长条结构，边发射激光器容易出现跌落、移位或晃动等意外，因此通过设置封胶337能够将边发射激光器固定住，防止边发射激光器发生跌落、位移或晃动等意外。When the laser of the distributed feedback laser propagates, the gain of the power is obtained through the feedback of the grating structure. To increase the power of the distributed feedback laser, it is necessary to increase the injection current and/or increase the length of the distributed feedback laser. As the injection current increases, the power consumption of the distributed feedback laser increases and the heat generation is severe. In order to ensure that the distributed feedback laser can work normally, it is necessary to increase the length of the distributed feedback laser, resulting in a distributed feedback laser generally having a slender structure. When the light emitting surface 3331 of the edge emitting laser faces the collimating element 334, the side emitting laser is placed vertically, and since the edge emitting laser has a slender strip structure, the emitting laser is prone to accidents such as dropping, shifting or shaking, and thus setting The sealant 337 can hold the edge emitting laser to prevent accidents such as falling, displacement or shaking of the edge emitting laser.

请参阅图12和图15，在某些实施方式中，光源333也可以采用如图15所示的固定方式固定在基板组件331上。具体地，激光投射模组33包括多个弹性的支撑块338，支撑块338可以固定在基板组件331上，多个支撑块338共同包围光源333，在安装时可以将光源333直接安装在多个支撑块338之间。在一个例子中，多个支撑块338共同夹持光源333，以进一步防止光源333发生晃动。Referring to FIG. 12 and FIG. 15, in some embodiments, the light source 333 can also be fixed to the substrate assembly 331 in a fixed manner as shown in FIG. Specifically, the laser projection module 33 includes a plurality of elastic support blocks 338. The support block 338 can be fixed on the substrate assembly 331. The plurality of support blocks 338 collectively surround the light source 333. The light source 333 can be directly mounted on the plurality of light sources 333 during installation. Between the support blocks 338. In one example, the plurality of support blocks 338 collectively clamp the light source 333 to further prevent the light source 333 from shaking.

在某些实施方式中，保护盖336可以省略，此时衍射光学元件335可以设置在容置腔3321内，衍射光学元件335的衍射出射面3354可以与顶部3322相抵，激光穿过衍射光学元件335后再穿出通光孔3325。如此，衍射光学元件335不易脱落。In some embodiments, the protective cover 336 can be omitted. At this time, the diffractive optical element 335 can be disposed in the accommodating cavity 3321, and the diffraction exit surface 3354 of the diffractive optical element 335 can be opposed to the top 3322, and the laser passes through the diffractive optical element 335. Then, the light passing hole 3325 is passed through. Thus, the diffractive optical element 335 is not easily peeled off.

在某些实施方式中，基板3311可以省去，光源333可以直接固定在电路板3312上以减小激光投射模组33的整体厚度。In some embodiments, the substrate 3311 can be omitted, and the light source 333 can be directly attached to the circuit board 3312 to reduce the overall thickness of the laser projection module 33.

在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。In the description of the present specification, reference is made to the terms "some embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific examples", or "some examples" The description means that specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个，除非另有明确具体的限定。Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include at least one of the features, either explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is at least two, for example two, three, unless specifically defined otherwise.

尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。While the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are illustrative and are not to be construed as limiting the scope of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

一种壳体组件，其特征在于，包括：A housing assembly, comprising:

壳体，所述壳体包括相背的第一面及第二面，所述第一面开设有贯穿所述第二面的第一穿孔及第二穿孔，所述第二面所在的一侧形成有壳体收容腔，所述壳体收容腔与所述第一穿孔对应；及a housing, the housing includes a first surface and a second surface opposite to each other, the first surface defines a first through hole and a second through hole extending through the second surface, and the side on which the second surface is located Forming a housing receiving cavity, the housing receiving cavity corresponding to the first through hole; and

安装在所述壳体上的支架，所述支架包括相背的正面及背面，所述背面开设有支架收容腔，所述正面开设有与所述支架收容腔对应的支架通孔，所述正面设置在所述第二面上，所述支架通孔与所述第二穿孔对应。a bracket mounted on the housing, the bracket includes opposite front and back sides, the back surface is provided with a bracket receiving cavity, and the front surface is provided with a bracket through hole corresponding to the bracket receiving cavity, the front surface The bracket through hole is disposed on the second surface, and the bracket through hole corresponds to the second through hole.
根据权利要求1所述的壳体组件，其特征在于，所述第一穿孔的开口尺寸小于对应的所述壳体收容腔的尺寸以形成壳体限位环，所述壳体收容腔由所述壳体限位环及环绕所述壳体限位环延伸的内壁形成。The housing assembly according to claim 1, wherein the opening of the first through hole is smaller than a size of the corresponding housing receiving cavity to form a housing limiting ring, and the housing receiving cavity is The housing limiting ring and an inner wall extending around the housing limiting ring are formed.
根据权利要求1所述的壳体组件，其特征在于，所述壳体包括自所述第二面向外延伸形成的腔体侧壁，所述腔体侧壁与所述第二面共同围成所述壳体收容腔；或The housing assembly of claim 1 wherein said housing includes a cavity sidewall extending outwardly from said second face, said cavity sidewall being coextensive with said second face The housing receiving cavity; or

所述壳体收容腔自所述第二面沿所述第一面的方向上开设形成。The housing receiving cavity is formed from the second surface in a direction along the first surface.
根据权利要求1所述的壳体组件，其特征在于，所述支架通孔的开口尺寸小于对应的所述支架收容腔的尺寸以形成支架限位环，所述支架收容腔由所述支架限位环及环绕所述支架限位环延伸的内壁形成。The housing assembly of claim 1 , wherein an opening size of the bracket through hole is smaller than a size of the corresponding bracket receiving cavity to form a bracket limiting ring, and the bracket receiving cavity is limited by the bracket A bit ring and an inner wall extending around the bracket limit ring are formed.
根据权利要求1所述的壳体组件，其特征在于，所述支架包括连接所述正面及所述背面的侧壁、及自所述侧壁向外凸出的固定凸出，所述支架通过所述固定凸出固定在所述壳体上。The housing assembly according to claim 1, wherein the bracket includes a side wall connecting the front surface and the back surface, and a fixing protrusion protruding outward from the side wall, the bracket passing The fixing protrusion is fixed to the housing.
根据权利要求1所述的壳体组件，其特征在于，所述第二穿孔的数量为两个，所述第一穿孔的数量为一个，两个所述第二穿孔的中心及所述第一穿孔的中心位于同一直线上。The housing assembly according to claim 1, wherein the number of the second perforations is two, the number of the first perforations is one, the centers of the two second perforations, and the first The centers of the perforations are on the same line.
一种移动终端，其特征在于，包括壳体组件，所述壳体组件包括：A mobile terminal, comprising: a housing assembly, the housing assembly comprising:

壳体，所述壳体包括相背的第一面及第二面，所述第一面开设有贯穿所述第二面的第一穿孔及第二穿孔，所述第二面所在的一侧形成有壳体收容腔，所述壳体收容腔与所述第一穿孔对应；及a housing, the housing includes a first surface and a second surface opposite to each other, the first surface defines a first through hole and a second through hole extending through the second surface, and the side on which the second surface is located Forming a housing receiving cavity, the housing receiving cavity corresponding to the first through hole; and

安装在所述壳体上的支架，所述支架包括相背的正面及背面，所述背面开设有支架收容腔，所述正面开设有与所述支架收容腔对应的支架通孔，所述正面设置在所述第二面上，所述支架通孔与所述第二穿孔对应。a bracket mounted on the housing, the bracket includes opposite front and back sides, the back surface is provided with a bracket receiving cavity, and the front surface is provided with a bracket through hole corresponding to the bracket receiving cavity, the front surface The bracket through hole is disposed on the second surface, and the bracket through hole corresponds to the second through hole.
根据权利要求7所述的移动终端，其特征在于，所述第一穿孔的开口尺寸小于对应的所述壳体收容腔的尺寸以形成壳体限位环，所述壳体收容腔由所述壳体限位环及环绕所述壳体限位环延伸的内壁形成。The mobile terminal according to claim 7, wherein an opening size of the first through hole is smaller than a size of the corresponding housing receiving cavity to form a housing limiting ring, and the housing receiving cavity is A housing retaining ring and an inner wall extending around the housing retaining ring are formed.
根据权利要求7所述的移动终端，其特征在于，所述壳体包括自所述第二面向外延伸形成的腔体侧壁，所述腔体侧壁与所述第二面共同围成所述壳体收容腔；或The mobile terminal of claim 7, wherein the housing comprises a cavity sidewall formed to extend outwardly from the second surface, the cavity sidewall and the second surface together Housing receiving cavity; or

所述壳体收容腔自所述第二面沿所述第一面的方向上开设形成。The housing receiving cavity is formed from the second surface in a direction along the first surface.
根据权利要求7所述的移动终端，其特征在于，所述支架通孔的开口尺寸小于对应的所述支架收容腔的尺寸以形成支架限位环，所述支架收容腔由所述支架限位环及环绕所述支架限位环延伸的内壁形成。The mobile terminal according to claim 7, wherein the opening size of the bracket through hole is smaller than the size of the corresponding bracket receiving cavity to form a bracket limiting ring, and the bracket receiving cavity is limited by the bracket A ring and an inner wall extending around the bracket limit ring are formed.
根据权利要求7所述的移动终端，其特征在于，所述支架包括连接所述正面及所述背面的侧壁、及自所述侧壁向外凸出的固定凸出，所述支架通过所述固定凸出固定在所述壳体上。The mobile terminal according to claim 7, wherein the bracket comprises a side wall connecting the front side and the back side, and a fixing protrusion protruding outward from the side wall, the bracket passing through the bracket The fixing projection is fixed to the housing.
根据权利要求7至11任意一项所述的移动终端，其特征在于，所述移动终端还包括输入输出模组，所述输入输出模组包括：The mobile terminal according to any one of claims 7 to 11, wherein the mobile terminal further comprises an input and output module, and the input and output module comprises:

红外成像模组，所述红外成像模组收容在所述壳体收容腔内并通过所述第一穿孔从所述第一面暴露；及An infrared imaging module, the infrared imaging module being received in the housing receiving cavity and exposed from the first surface through the first through hole; and

激光投射模组，所述激光投射模组收容在所述支架收容腔内并通过所述支架通孔及所述第二穿孔从所述第一面暴露。a laser projection module is received in the bracket receiving cavity and exposed from the first surface through the bracket through hole and the second through hole.
根据权利要求12所述的移动终端，其特征在于，所述第二穿孔的数量为两个，所述第一穿孔的数量为一个，两个所述第二穿孔的中心及所述第一穿孔的中心位于同一直线上；所述输入输出模组还包括可见光成像模组，所述可见光成像模组收容在所述支架收容腔内并通过所述支架通孔及所述第二穿孔从所述第一面暴露。The mobile terminal according to claim 12, wherein the number of the second perforations is two, the number of the first perforations is one, the centers of the two second perforations, and the first perforation The center of the input and output module further includes a visible light imaging module, the visible light imaging module being received in the bracket receiving cavity and passing through the bracket through hole and the second through hole The first side is exposed.
根据权利要求12所述的移动终端，其特征在于，所述移动终端还包括盖体，所述盖体与所述壳体结合，所述输入输出模组位于所述壳体与所述盖体之间，所述盖体抵持所述输入输出模组。The mobile terminal according to claim 12, wherein the mobile terminal further comprises a cover body, the cover body is coupled to the housing, and the input/output module is located in the housing and the cover body The cover body abuts the input and output modules.
根据权利要求14所述的移动终端，其特征在于，所述移动终端还包括主板，所述主板结合在所述壳体或所述盖体上，所述输入输出模组上设置有连接器，所述主板上设置有连接座，所述连接器与所述连接座结合以连接所述输入输出模组与所述主板。The mobile terminal according to claim 14, wherein the mobile terminal further comprises a main board, the main board is coupled to the housing or the cover body, and the input/output module is provided with a connector. The main board is provided with a connecting base, and the connector is combined with the connecting base to connect the input/output module and the main board.
根据权利要求12所述的移动终端，其特征在于，所述移动终端还包括透光的盖板，所述盖板设置在所述第一面并覆盖所述第一穿孔及所述第二穿孔上，所述盖板与所述第一面结合的表面设置有仅通过红外光的红外透过油墨，所述红外透过油墨遮挡所述第一穿孔及与所述激光投射模组对应的所述第二穿孔。The mobile terminal according to claim 12, wherein the mobile terminal further comprises a light-transmissive cover plate, the cover plate is disposed on the first surface and covers the first through hole and the second through hole The surface of the cover plate combined with the first surface is provided with infrared transmission ink only through infrared light, and the infrared transmission ink blocks the first perforation and the corresponding to the laser projection module. The second perforation is described.
根据权利要求7至11任意一项所述的移动终端，其特征在于，所述移动终端还包括输入输出模组，所述输入输出模组包括：The mobile terminal according to any one of claims 7 to 11, wherein the mobile terminal further comprises an input and output module, and the input and output module comprises:

激光投射模组，所述激光投射模组收容在所述壳体收容腔内并通过所述第一穿孔从所述第一面暴露；及a laser projection module, the laser projection module being received in the housing receiving cavity and exposed from the first surface through the first through hole;

红外成像模组，所述红外成像模组收容在所述支架收容腔内并通过所述支架通孔从所述第二穿孔暴露。The infrared imaging module is received in the bracket receiving cavity and exposed from the second through hole through the bracket through hole.
根据权利要求17所述的移动终端，其特征在于，所述第二穿孔的数量为两个，所述第一穿孔的数量为一个，两个所述第二穿孔的中心及所述第一穿孔的中心位于同一直线上；所述输入输出模组还包括可见光成像模组，所述可见光成像模组收容在所述支架收容腔内并通过所述支架通孔从所述第二穿孔暴露。The mobile terminal according to claim 17, wherein the number of the second perforations is two, the number of the first perforations is one, the centers of the two second perforations, and the first perforation. The input and output modules further include a visible light imaging module, and the visible light imaging module is received in the bracket receiving cavity and exposed from the second through hole through the bracket through hole.
根据权利要求18所述的移动终端，其特征在于，所述移动终端还包括盖体，所述盖体与所述壳体结合，所述输入输出模组位于所述壳体与所述盖体之间，所述盖体抵持所述输入输出模组。The mobile terminal according to claim 18, wherein the mobile terminal further comprises a cover body, the cover body is coupled to the housing, and the input/output module is located in the housing and the cover body The cover body abuts the input and output modules.
根据权利要求19所述的移动终端，其特征在于，所述移动终端还包括主板，所述主板结合在所述壳体或所述盖体上，所述输入输出模组上设置有朝向所述第一面的连接器，所述主板上设置有朝向所述第二面的连接座，所述连接器与所述连接座结合以连接所述输入输出模组与所述主板。The mobile terminal according to claim 19, wherein the mobile terminal further comprises a main board, the main board is coupled to the housing or the cover body, and the input/output module is disposed to face the In the first side connector, the main board is provided with a connecting seat facing the second surface, and the connector is combined with the connecting base to connect the input/output module and the main board.
根据权利要求20所述的移动终端，其特征在于，所述主板形成有安装口，所述支架收容在所述安装口内。The mobile terminal according to claim 20, wherein the main board is formed with a mounting opening, and the bracket is received in the mounting opening.
根据权利要求18所述的移动终端，其特征在于，所述移动终端还包括透光的盖板，所述盖板设置在所述第一面上，所述盖板与所述第一面结合的表面形成有仅通过红外光的红外透过油墨，所述红外透过油墨遮挡所述第一穿孔及与所述激光投射模组对应的所述第二穿孔。The mobile terminal according to claim 18, wherein the mobile terminal further comprises a light-transmissive cover plate, the cover plate is disposed on the first surface, and the cover plate is combined with the first surface The surface is formed with an infrared transmission ink that passes only infrared light, and the infrared transmission ink blocks the first perforation and the second perforation corresponding to the laser projection module.