WO2019188476A1 - Tampon de polissage, procédé de production de tampon de polissage et procédé de polissage de surface de matériau optique ou de matériau semi-conducteur - Google Patents

Tampon de polissage, procédé de production de tampon de polissage et procédé de polissage de surface de matériau optique ou de matériau semi-conducteur Download PDF

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Publication number
WO2019188476A1
WO2019188476A1 PCT/JP2019/011087 JP2019011087W WO2019188476A1 WO 2019188476 A1 WO2019188476 A1 WO 2019188476A1 JP 2019011087 W JP2019011087 W JP 2019011087W WO 2019188476 A1 WO2019188476 A1 WO 2019188476A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing pad
glycol
polishing
isocyanate
pad according
Prior art date
Application number
PCT/JP2019/011087
Other languages
English (en)
Japanese (ja)
Inventor
立馬 松岡
栗原　浩
さつき 鳴島
大和 ▲高▼見沢
Original Assignee
富士紡ホールディングス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2018068376A external-priority patent/JP2019177455A/ja
Priority claimed from JP2018068370A external-priority patent/JP7405500B2/ja
Application filed by 富士紡ホールディングス株式会社 filed Critical 富士紡ホールディングス株式会社
Publication of WO2019188476A1 publication Critical patent/WO2019188476A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • [6 ′′] The polishing pad according to any one of [1 ′′] to [5 ′′], wherein the curing agent includes 3,3′-dichloro-4,4′-diaminodiphenylmethane.
  • the curing agent includes 3,3′-dichloro-4,4′-diaminodiphenylmethane.
  • the curable resin composition further comprises fine hollow spheres.
  • [8 "] A method for producing a polishing pad according to any one of [1”] to [7 “], The method comprising the step of forming the polishing layer.
  • [9 "] A method for polishing a surface of an optical material or a semiconductor material, wherein the polishing pad according to any one of [1"] to [7 “] is used.
  • diethylene glycol has high hydrophilicity because it contains an oxygen atom in the molecular chain between two hydroxyl groups, while alkylene glycol having a molecular weight of 50 to 300 has a molecular chain between two hydroxyl groups consisting of carbon atoms and hydrogen. It is presumed that since it is formed only by atoms, it is highly hydrophobic (low hydrophilicity). And it is thought that the isocyanate-terminated prepolymers using these glycols as raw materials have the same characteristics.
  • glycol polyoxyalkylene glycol or alkylene glycol can be used.
  • polyisocyanate component additionally added to the polyurethane resin curable composition
  • the above-mentioned polyisocyanate component can be used without particular limitation, but 4,4′-methylene-bis (cyclohexyl isocyanate) (hydrogenated MDI) Is preferred.
  • Tolylene diisocyanate as the polyisocyanate component polytetramethylene ether glycol having a number average molecular weight of 650 as the polyol component, Urethane prepolymer having an NCO equivalent of 441 containing 1,4-butanediol (1% by weight based on the total prepolymer) and diethylene glycol (1% by weight based on the total prepolymer)
  • the polishing pads of Examples 1 to 3 having a diethylene glycol content of 1% by weight, 2% by weight, or 3% by weight with respect to the entire isocyanate-terminated urethane prepolymer are It was found that good polishing results were obtained with less occurrence.
  • the polishing pad of Comparative Example 1 in which the content of diethylene glycol relative to the entire isocyanate-terminated urethane prepolymer was 5% by weight was found to have more defects.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polyurethanes Or Polyureas (AREA)

Abstract

La présente invention vise à fournir un tampon de polissage qui réduit au minimum des défauts d'un objet poli, est capable d'obtenir une topographie plate, et présente d'excellentes performance de défaut et performance de topographie. L'invention concerne un tampon de polissage ayant une couche de polissage qui contient une résine de polyuréthane, la résine de polyuréthane étant un produit durci d'une composition de résine durcissable comprenant un prépolymère d'uréthane à terminaison isocyanate et un agent de durcissement; le prépolymère d'uréthane à terminaison isocyanate étant un produit de réaction entre un élément de polyisocyanate et un élément de polyol contenant un glycol ayant un poids moléculaire de 50 à 300; et la teneur en glycol étant supérieure à 0 % en poids mais inférieure à 5 % en poids par rapport à la quantité totale du prépolymère d'uréthane à terminaison isocyanate.
PCT/JP2019/011087 2018-03-30 2019-03-18 Tampon de polissage, procédé de production de tampon de polissage et procédé de polissage de surface de matériau optique ou de matériau semi-conducteur WO2019188476A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018-068370 2018-03-30
JP2018068376A JP2019177455A (ja) 2018-03-30 2018-03-30 研磨パッド、研磨パッドの製造方法、及び光学材料又は半導体材料の表面を研磨する方法
JP2018068370A JP7405500B2 (ja) 2018-03-30 2018-03-30 研磨パッド、研磨パッドの製造方法、及び光学材料又は半導体材料の表面を研磨する方法
JP2018-068376 2018-03-30

Publications (1)

Publication Number Publication Date
WO2019188476A1 true WO2019188476A1 (fr) 2019-10-03

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PCT/JP2019/011087 WO2019188476A1 (fr) 2018-03-30 2019-03-18 Tampon de polissage, procédé de production de tampon de polissage et procédé de polissage de surface de matériau optique ou de matériau semi-conducteur

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TW (1) TW201942175A (fr)
WO (1) WO2019188476A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111533870A (zh) * 2020-04-15 2020-08-14 上海抚佳精细化工有限公司 一种双组份聚氨酯结合剂及应用其的砂轮

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11322878A (ja) * 1998-05-13 1999-11-26 Dainippon Ink & Chem Inc 泡含有ポリウレタン成形物の製造方法、泡含有成形物用ウレタン樹脂組成物及びそれを用いた研磨パッド
JP2008252017A (ja) * 2007-03-30 2008-10-16 Toyo Tire & Rubber Co Ltd 研磨パッド
WO2016021317A1 (fr) * 2014-08-05 2016-02-11 Dic株式会社 Composition d'uréthane et matériau de polissage
WO2017217278A1 (fr) * 2016-06-16 2017-12-21 Dic株式会社 Tampon à polir, procédé de production d'un tampon à polir et procédé de polissage

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11322878A (ja) * 1998-05-13 1999-11-26 Dainippon Ink & Chem Inc 泡含有ポリウレタン成形物の製造方法、泡含有成形物用ウレタン樹脂組成物及びそれを用いた研磨パッド
JP2008252017A (ja) * 2007-03-30 2008-10-16 Toyo Tire & Rubber Co Ltd 研磨パッド
WO2016021317A1 (fr) * 2014-08-05 2016-02-11 Dic株式会社 Composition d'uréthane et matériau de polissage
WO2017217278A1 (fr) * 2016-06-16 2017-12-21 Dic株式会社 Tampon à polir, procédé de production d'un tampon à polir et procédé de polissage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111533870A (zh) * 2020-04-15 2020-08-14 上海抚佳精细化工有限公司 一种双组份聚氨酯结合剂及应用其的砂轮

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Publication number Publication date
TW201942175A (zh) 2019-11-01

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