WO2019184100A1 - 一种光模块 - Google Patents

一种光模块 Download PDF

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Publication number
WO2019184100A1
WO2019184100A1 PCT/CN2018/091456 CN2018091456W WO2019184100A1 WO 2019184100 A1 WO2019184100 A1 WO 2019184100A1 CN 2018091456 W CN2018091456 W CN 2018091456W WO 2019184100 A1 WO2019184100 A1 WO 2019184100A1
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WO
WIPO (PCT)
Prior art keywords
chip
ribbon cable
array
ferrule
light
Prior art date
Application number
PCT/CN2018/091456
Other languages
English (en)
French (fr)
Inventor
李宁
张健
杨现文
吴天书
李林科
Original Assignee
武汉联特科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉联特科技有限公司 filed Critical 武汉联特科技有限公司
Priority to US16/349,158 priority Critical patent/US10914903B2/en
Publication of WO2019184100A1 publication Critical patent/WO2019184100A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G02B6/425—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
    • G02B6/4401—Optical cables
    • G02B6/4403—Optical cables with ribbon structure
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate

Definitions

  • the present invention relates to the field of optical modules, and in particular, to an optical module.
  • the 100G MLG2.0 optical module gives a good solution.
  • the module's electrical interface supports 4 channels of 25Gb electrical signals, and the optical port supports 10 channels of 10Gb parallel optical signals, which allows the optical module to be combined with 10 10G SFP+ lights.
  • 10G SFP+ optical modules, 40G QSFP+ optical modules, and 100G QSFP28 optical modules can exchange data, greatly improving the interconnection capability between the old and new devices in the data center, and exerting the maximum performance of the data center, which has great practical significance.
  • the difficulty of the QSFP28 MLG optical module package lies in the high-density integrated package. Due to the integration of multiple chips and multi-channel optical components in the QSFP28 package, this poses a high challenge to the packaging technology.
  • the present invention is implemented as follows:
  • the invention provides an optical module, comprising a tube casing and a circuit board located in the tube casing, wherein the circuit board is provided with a signal rate transmission chip, a laser driver chip, a transimpedance limiting amplifier chip, and a vertical cavity surface emitting laser chip array.
  • the optical module further comprising an optical component and an electrical interface, the optical component comprising an interface end MT ferrule, a light emitting band An optical cable and a light receiving ribbon cable, one end of the light emitting ribbon cable and one end of the light receiving ribbon cable are connected to the interface terminal MT ferrule, and the other end of the light emitting ribbon cable is Vertical cavity surface emitting laser chip arrays are aligned by active coupling, the light receiving ribbon cable and the photodetector chip array Aligned by an active coupling, the electrical interface includes a gold finger disposed on one side of the circuit board, and the gold finger and the signal rate transmission chip are electrically connected by a second microstrip line.
  • the light emitting ribbon cable or the light receiving ribbon cable includes a plurality of sets of independent ribbon cables.
  • the signal rate transmission chip is mounted on the circuit board by SMT.
  • the laser driver chip, the transimpedance limiting amplifier chip, the vertical cavity surface emitting laser chip array, and the photodetector chip array are all mounted on the circuit board and use conductive silver paste or The adhesive or eutectic solder is cured.
  • the transimpedance limiting amplifier chip and the photodetector chip array are electrically connected by a gold wire bonding or a flip chip.
  • a pad is reserved on the first microstrip line, and the pad is connected to the laser driver chip and the transimpedance limiting amplifier chip by a gold wire bonding or flip chip mounting method. Electrical connection.
  • the interface end MT ferrule has two rows of through holes, one end of the light emitting ribbon cable and one end of the light receiving ribbon cable are respectively inserted into the two rows of the through holes and passed through the glue and the The MT end of the interface is fixed.
  • the light emitting ribbon cable or the light receiving ribbon cable has a 45° reflecting surface away from an end of the interface terminal MT ferrule, and the optical component further includes a V slot, and the light emitting ribbon cable Alternatively, one end of the light-receiving ribbon cable adjacent to the 45-degree reflecting surface is fixed in the V-groove and fixed using glue.
  • the optical component further includes an intermediate MT ferrule and a lens array, and the light emitting ribbon cable or the optical receiving ribbon cable is fixed away from the end of the interface terminal MT ferrule and the intermediate MT ferrule
  • the lens array is fixedly coupled to the intermediate MT ferrule, and the lens array has a 45° reflecting surface.
  • the laser driver chip, the vertical cavity surface emitting laser chip array, the transimpedance limiting amplifier chip and the photodetector chip array are all located on the same side of the circuit board, or the laser driver The chip and the vertical cavity surface emitting laser chip array are located on one side of the circuit board, and the transimpedance limiting amplifier chip and the photodetector chip array are located on the other side of the circuit board.
  • the present invention has the following beneficial effects:
  • the optical module provided by the invention integrates a large-size signal rate transmission chip, a laser driver chip, a transimpedance limiting amplifier chip, a vertical cavity surface emitting laser chip array and a photodetector chip array in a casing of the QSFP28 package, which can be realized High-density integrated package requirements for optical modules, optical-emitting ribbon cables and optical-receiving ribbon cables are connected to the same interface-end MT ferrule, using the fewest optical components, achieving high-density optical packaging while optimizing optical path coupling
  • the complexity, less optical components bring better reliability of the optical package; using the optical packaging technology of the invention, the optical path coupling is simple and easy, the coupling efficiency and the coupling yield rate are high, and it is suitable for mass production.
  • FIG. 1 is a schematic structural diagram of an optical module according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic structural view of an optical component according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic diagram of coupling of an optical component and a vertical cavity surface emitting laser chip array according to Embodiment 1 of the present invention
  • FIG. 4 is a schematic diagram of coupling of an optical component and a photodetector chip array according to Embodiment 1 of the present invention
  • FIG. 5 is a schematic structural diagram of an optical component according to Embodiment 2 of the present invention.
  • FIG. 6 is a schematic diagram of coupling of an optical component and a vertical cavity surface emitting laser chip array according to Embodiment 2 of the present invention.
  • FIG. 7 is a schematic diagram of coupling of an optical component and a photodetector chip array according to Embodiment 2 of the present invention.
  • the first embodiment of the present invention provides an optical module, which is a QSFP28 MLG optical module, which is based on a COB (Chip on Board) process, including a package (not shown) and a tube.
  • the circuit board 1 in the casing further comprises an optical component and an electrical interface, the optical port supports 10 10G optical transmitting signals and 10 10G optical receiving signals, the electrical interface supports 4 25G electrical signals, and the circuit board 1 is provided with a signal.
  • the signal rate transmission chip 2 is mounted on the circuit board 1 by SMT, the laser driver chip 3, the transimpedance limiting amplifier chip 5, the vertical cavity surface emitting laser chip array 4, and the The photodetector chip array 6 is mounted on the circuit board 1 and cured using a conductive silver paste.
  • the curing mode is not limited to the curing of the conductive silver paste, and may also be cured or used with a glue adhesive.
  • the chip board position is reserved on the circuit board 1 (not shown in the figure), and is used for the alignment reference of the chip patch.
  • the alignment reference can make the patch work without using the high-precision placement machine. In the case, higher alignment accuracy can still be obtained.
  • the cross-blocking limiting amplifier chip 5 and the photodetector chip array 6 are electrically connected by a gold wire bonding manner. In other embodiments, the method is not limited to the gold wire bonding. Electrical connections can also be made using flip-chips or the like.
  • the signal rate transmission chip 2 is electrically connected to the laser driver chip 3 and the transimpedance limiting amplifier chip 5 through a first microstrip line (not shown), and the first microstrip line is reserved a pad electrically connected to the laser driver chip 3 and the transimpedance limiting amplifier chip 5 by gold wire bonding. In other embodiments, it is not limited to gold wire bonding. In this way, you can also use the flip chip to achieve electrical connection.
  • the optical component includes an interface terminal MT ferrule 10, a light emitting ribbon cable 8 connected to the interface terminal MT ferrule 10, a light receiving ribbon cable 9 and two V slots 7.
  • the interface terminal MT ferrule 10 adopts a standard 24-core male MT ferrule
  • the light-emitting ribbon cable 8 and the light-receiving ribbon cable 9 each adopt a 12-core tape with a 45° reflecting surface 11 Cable.
  • the interface terminal MT ferrule 10 Refining the connection manner of the interface terminal MT ferrule 10 with the light emitting ribbon cable 8 and the light receiving ribbon cable 9, the interface terminal MT ferrule 10 having two rows of through holes, any adjacent The distance between the two through holes is 250 um, and one end of the light emitting ribbon cable 8 and one end of the light receiving ribbon cable 9 are respectively inserted into the two rows of the through holes to complete the ferrule 10 with the interface terminal MT.
  • the ribbon cable is fixed to the interface terminal MT ferrule 10 by glue.
  • the light emitting ribbon cable 8 and the light receiving ribbon cable 9 have a 45° reflecting surface 11 away from one end of the interface terminal MT ferrule 10, and each of the V slots 7 has 12 rows of V-shaped channels.
  • the spacing between any two adjacent V-shaped channels is 250 um, and the ends of the light-emitting ribbon cable 8 and the light-receiving ribbon cable 9 near the 45-degree reflecting surface 11 are respectively placed in the V corresponding to the two V-grooves 7
  • the alignment of the V-groove 7 is completed in the shaped channel and fixed using glue.
  • the interface terminal MT ferrule 10 is not limited to 24 cores, and 20 to 24 cores are all within the scope of the present patent application.
  • the light emitting ribbon cable 8 and the light receiving ribbon cable 9 are not. It is limited to 12 cores, and 10 to 12 cores are all within the scope of the present patent application.
  • the light-emitting ribbon cable 8 and the light-receiving ribbon cable 9 are not limited to a group of ribbon cables, respectively, and may also be respectively used in multiple groups.
  • a separate ribbon cable, such as the light-emitting ribbon cable 8 and the light-receiving ribbon cable 9, uses two sets of 5-core ribbon cables. When the ribbon cables are of other numbers, the number of corresponding V-grooves 7 is also Change with it.
  • the light emitting ribbon cable 8 is aligned with the vertical cavity surface emitting laser chip array 4 by means of active coupling, and the optical path principle of the aligned coupling is shown in FIG. 3; the light receiving ribbon cable 9 and the The photodetector chip arrays 6 are aligned by active coupling, and the principle of the aligned coupling optical paths is shown in FIG. After the alignment is completed, the light-emitting ribbon cable 8 or the light-receiving ribbon cable 9 is fixed to the circuit board 1 using glue.
  • the electrical interface includes a gold finger (not shown) disposed on a side of the circuit board 1 , and the gold finger and the signal rate transmission chip 2 are electrically connected by a second microstrip line (not shown) ,.
  • the laser driver chip 3, the vertical cavity surface emitting laser chip array 4, the transimpedance limiting amplifier chip 5, and the photodetector chip array 6 are all located in the same circuit board 1.
  • the laser driver chip 3 and the vertical cavity surface emitting laser chip array 4 may be disposed on one side of the circuit board 1, the transimpedance limiting amplifier chip 5 and the The photodetector chip array 6 is located on the other side of the circuit board 1, and the position of the V-groove 7 can also be changed according to actual needs.
  • the signal rate transmission chip 2 and the laser driver chip 3, the vertical cavity surface emitting laser chip array 4, the transimpedance limiting amplifier chip 5, and the photodetector chip array 6 are both Located on the same side of the circuit board 1, in other embodiments, the signal rate transmission chip 2 can also be disposed on the reverse side of the circuit board 1.
  • the working principle of the optical module provided by the present invention is as follows:
  • the external 4-way parallel 25G electrical signal is loaded onto the signal rate transmission chip 2 by the golden finger, and the signal rate transmission chip 2 converts 4 parallel 25G electrical signals into 10 10G parallel electrical signals; 10 channels output from the signal rate transmission chip 2
  • the 10G electrical signal is loaded on the laser driver chip 3, and the laser driver chip 3 drives the vertical cavity surface emitting laser chip array 4 to convert 10 parallel electrical signals into 10 10G parallel optical signals; 10 10G parallel optical signals are actively coupled
  • the method is completed with the light-emitting ribbon cable 8 with the 45° reflecting surface 11 , and the optical signal coupled into the light-emitting ribbon cable 8 finally completes the output of 10 10G parallel optical signals through the port of the interface terminal MT ferrule 10 . .
  • the external 10 channels of 10G parallel optical signals enter the array of optical receiving ribbon cables 9 with 45° reflecting surfaces through the interface terminal MT ferrule 10 ports, and 10 10G parallel optical signals coming out from the optical receiving ribbon cable 9 are actively coupled.
  • the manner is completed with the photodetector chip array 6.
  • the photodetector chip array 6 After receiving the optical signal, the photodetector chip array 6 converts it into 10 10G parallel electrical signals and outputs them through the transimpedance limiting amplifier chip 5;
  • the electrical signal outputted by the transimpedance limiting amplifier chip 5 is loaded on the signal rate transmission chip 2, and the signal rate transmission chip 2 converts 10 10G parallel electrical signals into 4 25G parallel electrical signals and passes through the gold on the side of the circuit board 1
  • the finger transmits four 25G parallel electrical signals to the external system.
  • Embodiment 2 of the present invention provides an optical module, which is different from the optical module provided by Embodiment 1 of the present invention only in the structure of the optical component, and the other components are identical in structure, and details are not described herein again.
  • the optical component includes an interface terminal MT ferrule 10, a light emitting ribbon cable 8 connected to the interface terminal MT ferrule 10, a light receiving ribbon cable 9, a V slot 7, and a set of intermediate MTs.
  • the combination of the ferrule 12 and the lens array 13, the structure of the interface terminal MT ferrule 10 in the present embodiment, and the connection manner thereof with the light-emitting ribbon cable 8 and the light-receiving ribbon cable 9 and embodiments 1 is the same and will not be described here.
  • the light-emitting ribbon cable 8 and the light-receiving ribbon cable 9 are different from Embodiment 1 in that one of the ribbon cables without a 45° reflection surface and the 45° reflection surface is The intermediate MT ferrule 12 and the lens array 13 are connected and fixed, and the other ribbon optical cable with a 45° reflecting surface is fixedly connected to the V-groove 7 in the same manner as in the first embodiment. It is shown in Fig. 5 that the light-emitting ribbon cable 8 has a 45° reflecting surface, and the light-receiving ribbon cable 9 does not have a 45° reflecting surface, and the two can be reversed.
  • the strip-shaped optical cable without the 45° reflecting surface is fixed away from the intermediate MT ferrule 12 at one end of the ferrule 10 of the interface end, and the end of the lens array 13 and the intermediate MT ferrule 12
  • the connection is fixed, the lens array 13 has a 45° reflection surface 14, and the coupling optical path of the lens array 13 and the optical chip is shown in FIGS. 6 and 7.
  • the intermediate MT ferrule 12 has two alignment holes, and the lens array 13 has two positioning posts. After the lens array 13 is actively coupled with the associated optical chip, the two positioning posts on the lens array 13 are respectively inserted.
  • the alignment of the lens array 13 and the intermediate MT ferrule 12 is completed in the two alignment holes of the intermediate MT ferrule 12.
  • the lens array 13 is located at one end of the intermediate MT ferrule 12 away from the ferrule 10 of the interface end MT.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)

Abstract

本发明提供了一种光模块，包括电路板、光学组件和电接口，电路板上设有信号速率变速器芯片、激光驱动器芯片、跨阻限幅放大器芯片、垂直腔面发射激光器芯片阵列以及光探测器芯片阵列，信号速率变速器芯片通过第一微带线与激光驱动器芯片和跨阻限幅放大器芯片电连接，光学组件包括接口端MT插芯以及与接口端MT插芯连接的光发射带状光缆和光接收带状光缆，光发射带状光缆与垂直腔面发射激光器芯片阵列之间耦合对准，光接收带状光缆与光探测器芯片阵列之间耦合对准，电接口包括设于电路板一侧的金手指，金手指与信号速率变速器芯片之间通过第二微带线电连接。本发明获得了高密度的光学封装的同时优化了光路耦合的复杂性。

Description

一种光模块 技术领域
本发明涉及光模块领域，尤其涉及一种光模块。
背景技术
随着大数据、云计算以及云存储的发展越来越快，对数据中心处理数据流量的带宽要求越来越高，这就促使数据中心需要及时地更新换代以及升级现有设备***，升级现有***是一个循序渐进的过程，不可能一下子把现有设备全部更换掉，这需要承担很大的财力成本，同时也造成了资源的浪费。升级一部分现有***，又会引入一个新的问题，新的设备如何和老的设备进行互联，使得能最大效能的发挥数据中心的潜力。100G MLG2.0光模块给出了一个很好的解决方案，该模块电接口支持4路25Gb电信号，光口支持10路10Gb并行光信号，这就使得该光模块可以和10个10G SFP+光模块或者1个40G QSFP+光模块外加6个10G SFP+光模块或者2个40G QSFP+光模块外加2个10G SFP+光模块进行互联，同时该光模块可以同100G QSFP28光模块进行电信号的交换，这就最终使得10G SFP+光模块、40G QSFP+光模块以及100G QSFP28光模块可以进行数据交换，大大提升了数据中心新旧设备的之间的互联能力，发挥了数据中心最大的效能，具有很大的现实意义。
QSFP28 MLG光模块封装的难点在于高密度集成封装，由于要在QSFP28大小封装的管壳内集成多路芯片以及多路光学组件，这就对封装技术提出了较高的挑战。
发明内容
本发明的目的在于提供一种光模块，旨在用于解决要在QSFP28大小封装的管壳内集成多路芯片以及多路光学组件难度较大的问题。
本发明是这样实现的：
本发明提供一种光模块，包括管壳以及位于管壳内的电路板，所述电路板上设有信号速率变速器芯片、激光驱动器芯片、跨阻限幅放大器芯片、垂直腔面发射激光器芯片阵列以及光探测器芯片阵列，所述激光驱动器芯片与所述垂直腔面发射激光器芯片阵列电连接，所述跨阻限幅放大器芯片与所述光探测器芯片阵列电连接，所述信号速率变速器芯片通过第一微带线与所述激光驱动器芯片和所述跨阻限幅放大器芯片电连接，该光模块还包括光学组件和电接口，所述光学组件包括接口端MT插芯、光发射带状光缆和光接收带状光缆，所述光发射带状光缆的一端和所述光接收带状光缆的一端均与所述接口端MT插芯连接，所述光发射带状光缆的另一端与所述垂直腔面发射激光器芯片阵列之间通过有源耦合的方式对准，所述光接收带状光缆与所述光探测器芯片阵列之间通过有源耦合的方式对准，所述电接口包括设于所述电路板一侧的金手指，所述金手指与所述信号速率变速器芯片之间通过第二微带线电连接。
进一步地，所述光发射带状光缆或者所述光接收带状光缆包括多组独立的带状光缆。
进一步地，所述信号速率变速器芯片通过SMT方式贴装在所述电路板上。
进一步地，所述激光驱动器芯片、所述跨阻限幅放大器芯片、所述垂直腔面发射激光器芯片阵列以及所述光探测器芯片阵列均贴装在所述电路板上并使用导电银浆或者粘合剂或者共晶焊料固化。
进一步地，所述激光驱动器芯片与所述电路板之间、所述跨阻限幅放大器芯片与所述电路板之间、所述激光驱动器芯片与所述垂直腔面发射激光器芯片 阵列之间、所述跨阻限幅放大器芯片与所述光探测器芯片阵列之间均通过金丝键合或倒装贴片的方式电连接。
进一步地，所述第一微带线上预留有焊盘，所述焊盘与所述激光驱动器芯片和所述跨阻限幅放大器芯片之间通过金丝键合或倒装贴片的方式电连接。
进一步地，所述接口端MT插芯具有两排通孔，所述光发射带状光缆的一端和所述光接收带状光缆的一端分别***两排所述通孔内并通过胶水与所述接口端MT插芯固定。
进一步地，所述光发射带状光缆或者所述光接收带状光缆远离所述接口端MT插芯的一端具有45°反射面，所述光学组件还包括V槽，所述光发射带状光缆或者所述光接收带状光缆靠近45°反射面的一端固定于所述V槽中并使用胶水固定。
进一步地，所述光学组件还包括中间MT插芯以及透镜阵列，所述光发射带状光缆或者所述光接收带状光缆远离所述接口端MT插芯的一端与所述中间MT插芯固定，所述透镜阵列与所述中间MT插芯连接固定，所述透镜阵列具有45°反射面。
进一步地，所述激光驱动器芯片、所述垂直腔面发射激光器芯片阵列、所述跨阻限幅放大器芯片和所述光探测器芯片阵列均位于所述电路板的同一面，或者所述激光驱动器芯片和所述垂直腔面发射激光器芯片阵列位于所述电路板其中一面，所述跨阻限幅放大器芯片和所述光探测器芯片阵列位于所述电路板另一面。
与现有技术相比，本发明具有以下有益效果：
本发明提供的这种光模块，在QSFP28封装的外壳中集成大尺寸信号速率变速器芯片、激光驱动器芯片、跨阻限幅放大器芯片、垂直腔面发射激光器芯 片阵列以及光探测器芯片阵列，可以实现光模块的高密度集成封装要求，光发射带状光缆和光接收带状光缆与同一个接口端MT插芯连接，使用了最少的光学元器件，获得了高密度的光学封装的同时优化了光路耦合的复杂性，更少的光学元器件带来了光学封装更好的可靠性；采用发明的光学封装技术，光路耦合简单易行，耦合效率以及耦合良品率高，适用于大批量生产。
附图说明
图1为本发明实施例1提供的一种光模块的结构示意图；
图2为本发明实施例1提供的光学组件的结构示意图；
图3为本发明实施例1提供的光学组件与垂直腔面发射激光器芯片阵列耦合示意图；
图4为本发明实施例1提供的光学组件与光探测器芯片阵列耦合示意图；
图5为本发明实施例2提供的光学组件的结构示意图；
图6为本发明实施例2提供的光学组件与垂直腔面发射激光器芯片阵列耦合示意图；
图7为本发明实施例2提供的光学组件与光探测器芯片阵列耦合示意图。
附图标记说明：1-电路板、2-信号速率变速器芯片、3-激光驱动器芯片、4-垂直腔面发射激光器芯片阵列、5-跨阻限幅放大器芯片、6-光探测器芯片阵列、7-V槽、8-光发射带状光缆、9-光接收带状光缆、10-接口端MT插芯、11-光缆45°反射面、12-中间MT插芯、13-透镜阵列、14-透镜45°反射面。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是 全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
实施例1：
如图1所示，本发明实施例1提供一种光模块，该光模块为QSFP28 MLG光模块，基于COB(Chip on board，板上芯片)工艺，包括管壳(未图示)以及位于管壳内的电路板1，还包括光学组件和电接口，光口支持10路10G光发射信号和10路10G光接收信号，电接口支持4路25G电信号，所述电路板1上设有信号速率变速器芯片2、激光驱动器芯片3、跨阻限幅放大器芯片5、垂直腔面发射激光器芯片阵列4以及光探测器芯片阵列6。
所述信号速率变速器芯片2通过SMT方式贴装在所述电路板1上，所述激光驱动器芯片3、所述跨阻限幅放大器芯片5、所述垂直腔面发射激光器芯片阵列4以及所述光探测器芯片阵列6均贴装在所述电路板1上并使用导电银浆固化，在其他实施例中，固化方式不局限于导电银浆固化，还可以使用胶水粘合剂固化或者使用共晶焊料焊接固定芯片的方式。所述电路板1上预留有芯片贴片位置对位点(图中未显示)，用于芯片贴片时的对位基准，对位基准可以使得贴片作业在不使用高精度贴片机的情况下，仍能获得较高的对位精度。所述激光驱动器芯片3与所述电路板1之间、所述跨阻限幅放大器芯片5与所述电路板1之间、所述激光驱动器芯片3与所述垂直腔面发射激光器芯片阵列4之间、所述跨阻限幅放大器芯片5与所述光探测器芯片阵列6之间均通过金丝键合的方式电连接，在其他实施例中，不局限于金丝键合的方式，还可以使用倒装贴片等方式实现电连接。所述信号速率变速器芯片2通过第一微带线(未图示)分别与所述激光驱动器芯片3和所述跨阻限幅放大器芯片5电连接，所述第一微带线上预留有焊盘，所述焊盘与所述激光驱动器芯片3和所述跨阻限幅放大 器芯片5之间通过金丝键合的方式电连接，在其他实施例中，不局限于金丝键合的方式，还可以使用倒装贴片等方式实现电连接。
如图2所示，所述光学组件包括接口端MT插芯10、与所述接口端MT插芯10连接的光发射带状光缆8和光接收带状光缆9以及两个V槽7，本实施例中所述接口端MT插芯10采用标准24芯公头MT插芯，所述光发射带状光缆8和所述光接收带状光缆9均采用带有45°反射面11的12芯带状光缆。细化所述接口端MT插芯10与所述光发射带状光缆8和所述光接收带状光缆9的连接方式，所述接口端MT插芯10具有两排通孔，任意相邻的两个通孔的间距为250um，所述光发射带状光缆8的一端和所述光接收带状光缆9的一端分别***两排所述通孔内完成与所述接口端MT插芯10的对位组装，带状光缆与所述接口端MT插芯10之间通过胶水固定。所述光发射带状光缆8和所述光接收带状光缆9远离所述接口端MT插芯10的一端具有45°反射面11，每个所述V槽7上有12排V型通道，任意相邻的两个V型通道的间距为250um，所述光发射带状光缆8和所述光接收带状光缆9靠近45°反射面11的一端分别放置在两个V槽7对应的V形通道内完成与所述V槽7的对位组装，并使用胶水进行固定。在其他实施例中，所述接口端MT插芯10不限于24芯，20～24芯均在本专利申请的范围内，所述光发射带状光缆8和所述光接收带状光缆9不限于12芯，10～12芯均在本专利申请的范围内，所述光发射带状光缆8和所述光接收带状光缆9不限于分别为一组带状光缆，还可以分别采用多组独立的带状光缆，例如所述光发射带状光缆8和所述光接收带状光缆9均采用两组5芯带状光缆，当带状光缆为其它数量时，相应的V槽7数量也随之改变。
所述光发射带状光缆8与所述垂直腔面发射激光器芯片阵列4之间通过有源耦合的方式对准，对准耦合的光路原理见图3；所述光接收带状光缆9与所述 光探测器芯片阵列6之间通过有源耦合的方式对准，对准耦合的光路原理见图4。对准完成后使用胶水将所述光发射带状光缆8或者所述光接收带状光缆9固定在所述电路板1上。
所述电接口包括设于所述电路板1一侧的金手指(未图示)，所述金手指与所述信号速率变速器芯片2之间通过第二微带线(未图示)电连接，。
本实施例中，所述激光驱动器芯片3、所述垂直腔面发射激光器芯片阵列4、所述跨阻限幅放大器芯片5和所述光探测器芯片阵列6均位于所述电路板1的同一面，在其他实施例中，还可以设置为所述激光驱动器芯片3和所述垂直腔面发射激光器芯片阵列4位于所述电路板1其中一面，所述跨阻限幅放大器芯片5和所述光探测器芯片阵列6位于所述电路板1另一面，V槽7的的位置也可以根据实际需求进行改变。本实施例中，所述信号速率变速器芯片2与所述激光驱动器芯片3、所述垂直腔面发射激光器芯片阵列4、所述跨阻限幅放大器芯片5和所述光探测器芯片阵列6均位于所述电路板1的同一面，在其他实施例中，所述信号速率变速器芯片2还可以设置在所述电路板1的反面。
本发明提供的这种光模块的工作原理如下：
外部4路并行25G电信号通过金手指加载到信号速率变速器芯片2上，信号速率变速器芯片2将4路并行25G电信号转换成10路10G并行电信号；从信号速率变速器芯片2输出的10路10G电信号加载在激光驱动器芯片3上，激光驱动器芯片3驱动垂直腔面发射激光器芯片阵列4将10路并行电信号转成10路10G并行光信号；10路10G并行光信号通过有源耦合的方式与带有45°反射面11的光发射带状光缆8完成对准，耦合进光发射带状光缆8的光信号最后通过接口端MT插芯10的端口完成10路10G并行光信号的输出。
外部10路10G并行光信号通过接口端MT插芯10端口进入带有45°反射 面的光接收带状光缆9阵列，从光接收带状光缆9出来的10路10G并行光信号通过有源耦合的方式与光探测器芯片阵列6完成对准，光探测器芯片阵列6接收到光信号后，将其转换成10路10G并行电信号并经过跨阻限幅放大器芯片5进行放大后输出；从跨阻限幅放大器芯片5输出的电信号加载在信号速率变速器芯片2上，信号速率变速器芯片2将10路10G并行电信号转换成4路25G并行电信号，并通过电路板1一侧的金手指将4路25G并行电信号传递给外部***。
实施例2：
如图5所示，本发明实施例2提供一种光模块，其与本发明实施例1提供的一种光模块的区别仅仅在于光学组件的结构，其他部分结构相同，在此不再赘述。
本实施例中，所述光学组件包括接口端MT插芯10、与所述接口端MT插芯10连接的光发射带状光缆8和光接收带状光缆9、一个V槽7以及一组中间MT插芯12加透镜阵列13的组合，本实施例中所述接口端MT插芯10的结构以及其与所述光发射带状光缆8和所述光接收带状光缆9的连接方式与实施例1是相同的，在此不再赘述。所述光发射带状光缆8和所述光接收带状光缆9与实施例1的区别在于其中一个不带有45°反射面，且该不带有45°反射面的带状光缆与所述中间MT插芯12以及所述透镜阵列13连接固定，而另外一个带有45°反射面的带状光缆与所述V槽7连接固定，连接方式与实施例1相同。图5中示出的是所述光发射带状光缆8带有45°反射面，所述光接收带状光缆9不带有45°反射面，二者也可以反过来。所述不带有45°反射面的带状光缆远离所述接口端MT插芯10的一端与所述中间MT插芯12固定，所述透镜阵列13与所述中间MT插芯12的端部连接固定，所述透镜阵列13具有45°反射 面14，透镜阵列13与光芯片的耦合光路见图6与图7。所述中间MT插芯12具有两个对位孔，所述透镜阵列13具有两个定位柱，透镜阵列13与相关光芯片完成有源耦合后，将透镜阵列13上的两个定位柱分别***中间MT插芯12的两个对位孔中完成透镜阵列13与中间MT插芯12的对位组装。本实施例中，所述透镜阵列13位于所述中间MT插芯12远离所述接口端MT插芯10的一端。
上述实施例2中，相当于将实施例1的其中一个V槽7替换成中间MT插芯12加透镜阵列13的组合，在另外一个实施例中，还可以将实施例1的两个V槽7都替换成实施例2中的中间MT插芯12加透镜阵列13的组合，其具体实施方式在此不再赘述。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种光模块，包括管壳以及位于管壳内的电路板，其特征在于：所述电路板上设有信号速率变速器芯片、激光驱动器芯片、跨阻限幅放大器芯片、垂直腔面发射激光器芯片阵列以及光探测器芯片阵列，所述激光驱动器芯片与所述垂直腔面发射激光器芯片阵列电连接，所述跨阻限幅放大器芯片与所述光探测器芯片阵列电连接，所述信号速率变速器芯片通过第一微带线与所述激光驱动器芯片和所述跨阻限幅放大器芯片电连接，该光模块还包括光学组件和电接口，所述光学组件包括接口端MT插芯、光发射带状光缆和光接收带状光缆，所述光发射带状光缆的一端和所述光接收带状光缆的一端均与所述接口端MT插芯连接，所述光发射带状光缆的另一端与所述垂直腔面发射激光器芯片阵列之间通过有源耦合的方式对准，所述光接收带状光缆与所述光探测器芯片阵列之间通过有源耦合的方式对准，所述电接口包括设于所述电路板一侧的金手指，所述金手指与所述信号速率变速器芯片之间通过第二微带线电连接。
  2. 如权利要求1所述的光模块，其特征在于：所述光发射带状光缆或者所述光接收带状光缆包括多组独立的带状光缆。
  3. 如权利要求1所述的光模块，其特征在于：所述信号速率变速器芯片通过SMT方式贴装在所述电路板上。
  4. 如权利要求1所述的光模块，其特征在于：所述激光驱动器芯片、所述跨阻限幅放大器芯片、所述垂直腔面发射激光器芯片阵列以及所述光探测器芯片阵列均贴装在所述电路板上并使用导电银浆或者粘合剂或者共晶焊料固化。
  5. 如权利要求1所述的光模块，其特征在于：所述激光驱动器芯片与所述电路板之间、所述跨阻限幅放大器芯片与所述电路板之间、所述激光驱动器芯片与所述垂直腔面发射激光器芯片阵列之间、所述跨阻限幅放大器芯片与所述光探测器芯片阵列之间均通过金丝键合或倒装贴片的方式电连接。
  6. 如权利要求1所述的光模块，其特征在于：所述第一微带线上预留有焊盘，所述焊盘与所述激光驱动器芯片和所述跨阻限幅放大器芯片之间通过金丝键合或倒装贴片的方式电连接。
  7. 如权利要求1所述的光模块，其特征在于：所述接口端MT插芯具有两排通孔，所述光发射带状光缆的一端和所述光接收带状光缆的一端分别***两排所述通孔内并通过胶水与所述接口端MT插芯固定。
  8. 如权利要求1所述的光模块，其特征在于：所述光发射带状光缆或者所述光接收带状光缆远离所述接口端MT插芯的一端具有45°反射面，所述光学组件还包括V槽，所述光发射带状光缆或者所述光接收带状光缆靠近45°反射面的一端固定于所述V槽中并使用胶水固定。
  9. 如权利要求1所述的光模块，其特征在于：所述光学组件还包括中间MT插芯以及透镜阵列，所述光发射带状光缆或者所述光接收带状光缆远离所述接口端MT插芯的一端与所述中间MT插芯固定，所述透镜阵列与所述中间MT插芯连接固定，所述透镜阵列具有45°反射面。
  10. 如权利要求1所述的光模块，其特征在于：所述激光驱动器芯片、所述垂直腔面发射激光器芯片阵列、所述跨阻限幅放大器芯片和所述光探测器芯片阵列均位于所述电路板的同一面，或者所述激光驱动器芯片和所述垂直腔面发射激光器芯片阵列位于所述电路板其中一面，所述跨阻限幅放大器芯片和所述光探测器芯片阵列位于所述电路板另一面。
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