WO2019182399A1 - Bande adhésive de face arrière niveau tranche, et son procédé de fabrication - Google Patents

Bande adhésive de face arrière niveau tranche, et son procédé de fabrication Download PDF

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Publication number
WO2019182399A1
WO2019182399A1 PCT/KR2019/003359 KR2019003359W WO2019182399A1 WO 2019182399 A1 WO2019182399 A1 WO 2019182399A1 KR 2019003359 W KR2019003359 W KR 2019003359W WO 2019182399 A1 WO2019182399 A1 WO 2019182399A1
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weight
layer
parts
black
laminated
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PCT/KR2019/003359
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English (en)
Korean (ko)
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전성호
나병순
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주식회사 엠티아이
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Priority to CN201980021282.4A priority Critical patent/CN111902507A/zh
Publication of WO2019182399A1 publication Critical patent/WO2019182399A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3164—Partial encapsulation or coating the coating being a foil
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps

Definitions

  • the present invention relates to a backside adhesive tape for a wafer level and a method of manufacturing the same. More particularly, the present invention is capable of laser marking when applied to a wafer level, can withstand a dicing process, and exposes a chip. The present invention relates to a backside adhesive tape for wafer level, which can protect the back surface.
  • a method of attaching (mounting) a semiconductor chip to a circuit board there is a method of fusion as it is using an electrode pattern on the bottom of the chip without using an intermediate medium such as a metal wire or a ball grid array (BGA), which is a flip chip. It is called a method.
  • BGA ball grid array
  • the flip chip method is a leadless semiconductor having no wires, so that a package can be made smaller and lighter as a chip size and finely control the distance between electrodes.
  • the process for the flip chip method includes (1) forming a circuit on the wafer surface, (2) grinding the back surface of the wafer circuit surface to the required thickness through a back grinding process, and (3) dicing tape. (4) Fix the wafer to the ring frame to which Dicing Tape is attached, (4) cut / separate the wafer for Dicing Saw process, place the semiconductor chip, and (5) pick up the separated semiconductor chip. -up) to be attached (mounted) onto the substrate, and (6) covered with a molding process using an encapsulating resin, e.g. EMC, to protect the open portion of the chip (PKG). ), (7) package saws are covered, and (8) laser marking, etc.
  • EMC encapsulating resin
  • Such scratches cause cracks in the dicing saw process of (4) or the package saw process of (7), which requires a chemical etching process for removing minute scratches in the backgrinding end of (2). This provides a reason for the increase in equipment costs and equipment operation costs.
  • Korean Patent Application No. 10-2008-7024140 discloses a protective film forming sheet for a chip having a protective film forming layer composed of a thermosetting component and a binder polymer component.
  • the process using the sheet for forming a protective film for chips disclosed in the prior art can replace the molding process using EMC, but the flip chip manufacturing process is (2) heating after attaching the protective film forming sheet to the back of the circuit after backgrinding.
  • the cured protective film is formed, and after the laser marking on the laminated protective film surface, the above-described steps (3) to (5) are carried out, and the molding step of (6) is not necessary.
  • After the process of)) and proceeds to the post-process has the advantage that it is simpler and less costly than the prior art.
  • the conventional protective film-forming sheet is prepared by manufacturing one layer of a thermosetting resin mixed with a black pigment, a binder polymer, a thermosetting agent, or a UV curing agent, and when the curing of the thermosetting resin is incomplete, it is attached to the back surface of the wafer (lamination process). ), When transported to the next process, there may be a problem that the adhesion is reduced and the product is detached.
  • thermosetting resin is capable of laser marking in the state of hardening, but cracking occurs or chipping according to the state of hardening of the resin during the dicing process, or chipping: A problem such as this may occur, and the edge portion of the cured resin is broken in the reflow process during the post process and is expanded to cracks, whereby the entire surface of the wafer may be contaminated with the cured resin powder.
  • the wafer requires a separate cleaning process two to three times, and the cured resin powder contaminates the reflow machine, which causes additional costs for maintenance and repair of the device.
  • the present invention has been made to solve the above problems, and is attached to the back surface of the wafer, such as a wafer in which a pattern is laminated or a wafer, such as a bump, is laminated, and laser marking on the tape surface without cracking during curing. It is desirable to provide a backside adhesive tape for wafer level that enables this and at the same time protects the exposed backside of the chip.
  • Wafer-level backside adhesive tape according to the embodiment, the plate-shaped substrate; A black printing layer laminated on one side of the substrate to block ultraviolet rays and to facilitate visibility of laser marking; A hot melt adhesive layer laminated on the other side substrate on which the black print layer is stacked; And an acrylic low adhesion carrier layer comprising acrylics laminated on the black print layer to enable thermal adhesion, and the acrylic low adhesion carrier layer is laminated on the black printing layer to allow thermal adhesion. It is characterized by consisting of an acrylic pressure-sensitive adhesive having an adhesive force of 2 to 30gf / 25mm.
  • Wafer level backside adhesive tape according to another embodiment, a plate-shaped substrate; 15 wt parts of carbon black, 15 wt parts of polyurethane resin, 40 wt parts of methyl ethyl ketone, and 37 wt parts of isopropyl alcohol, which are laminated on one side of the substrate to block ultraviolet rays and facilitate the visibility of laser marking.
  • Black printing layer formed of 77 parts by weight and 3 parts by weight of adhesion promoter 10 parts by weight of polyurethane resin laminated on the other side of the substrate on which the black print layer is laminated, 15 parts by weight of petroleum resin hydride, DMF (N, N- Dimethylformamide) hot melt adhesive layer formed of a solvent consisting of 36 parts by weight, 35 parts by weight of methyl ethyl ketone, and 4 parts by weight of a matting agent; And it is laminated to the black printed layer includes a PET film coated with an acrylic layer made of an acrylic pressure-sensitive adhesive having an adhesive force of 2 to 30gf / 25mm at room temperature to enable heat adhesion.
  • DMF N, N- Dimethylformamide
  • the present invention is to replace the existing EPOXY MOLDING COMPOUND (EMC) to be attached to the back surface of the wafer, such as a wafer with a pattern or a wafer stacked for wafer level, thereby protecting the back surface and at the same time laser marking.
  • EMC EPOXY MOLDING COMPOUND
  • a backside adhesive tape for wafer level is provided.
  • FIG. 1 is a cross-sectional view showing a backside adhesive tape for a wafer level according to the present invention.
  • Wafer level backside adhesive tape according to the present invention is a protective tape applied to a new wafer different from the existing.
  • FIG. 1 is a cross-sectional view showing a wafer-side backside adhesive tape according to the present invention.
  • the wafer-level backside adhesive tape which concerns on this invention is a plate-shaped base material 2; A black print layer 4 laminated on one side of the substrate 2 to block ultraviolet rays and to facilitate visibility of laser marking; A hot melt adhesive layer 8 laminated on the other side substrate 2 on which the black print layer 4 is stacked; And an acrylic low adhesion carrier layer 10 including acryl which is laminated on the black printing layer 4 to enable thermal adhesion.
  • any substrate can be used as long as it has heat resistance that can withstand heating, but it is recommended to withstand a temperature range of 90 to 180 ° C.
  • Heat resistant materials such as polypropylene (PP), polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalene (PEN), or materials containing at least one or more mixtures thereof. More preferably, it is preferable to use a PET film having good price and processability.
  • the substrate 2 according to the present invention has a film shape, and the thickness thereof is not particularly limited. However, since the thickness of the wafer to be processed using an adhesive tape is usually 5 to 100 ⁇ m, the workability of the wafer, the hot-melt adhesive layer, In consideration of the stability of the substrate, it is recommended that it is 10 to 50 ⁇ m.
  • the substrate 2 according to the present invention is applied to one or both sides of the substrate 2 with a thermosetting acrylic or methacryl coating agent for easy adhesion of the hot melt adhesive layer 8 laminated on one side thereof, thereby applying a primer. can do.
  • the substrate 2 according to the present invention is subjected to a corona treatment (discharge treatment) on a coated surface to which a primer, particularly a hydrophobic primer, is applied in order to further improve the adhesion of one or both sides of the substrate 2. I can do it.
  • a corona treatment discharge treatment
  • a primer particularly a hydrophobic primer
  • the corona treatment is performed by corona discharge on the surface primed with a thermosetting acrylic or methacryl coating agent, thereby improving the adhesion of the substrate to withstand the lamination temperature, the heat adhesion temperature of the pressure-sensitive adhesive.
  • the black printing layer 4 according to the present invention is laminated on one side of the base material 2 to block ultraviolet rays and to facilitate the visibility of laser marking. (4) Anything may be used.
  • the preferred black print layer 4 is usually applied in a thickness of 1 to 1.5 ⁇ m when printing a black product on a transparent fabric, it is preferable to have a thickness of 2 to 14 ⁇ m considering the strength of the fabric and the permeability to the product.
  • the black print layer 4 according to the invention may comprise pigments, binder resins, organic solvents and / or additives.
  • Preferred black print layer 4 comprises 3 to 25% by weight of pigment, 3 to 25% by weight of binder resin, 45 to 80% by weight of organic solvent and 0.1 to 5% by weight of additives based on 100% by weight of the total black print layer. .
  • the black print layer 4 is preferably laminated on one side of the substrate 2 by a gravure printing method.
  • the pigment constituting the black printing layer 4 according to the present invention may be any pigment as long as it is a conventional pigment in the art, but it is preferable to use organic or inorganic pigments and / or dyes. In consideration of electromagnetic waves, infrared shielding properties, laser marking properties, and the like, it is preferable to use black pigments.
  • Preferred black pigments are preferably carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, or at least one mixture selected from them, but is not limited thereto. From the viewpoint of increasing the reliability of semiconductor devices, carbon black is more preferred. desirable.
  • the particle size of the carbon black is preferably used 1 to 500nm.
  • a preferred amount of the pigment is 3 to 25% by weight based on 100% by weight of the total black printing layer (4).
  • the amount of the pigment used is less than 3% by weight, the color expressing ability is lowered, making it difficult to properly display black color, and thus it is not preferable because the electromagnetic wave, the infrared shielding property, and the laser marking property are not good, and when the amount of the pigment exceeds 25% by weight,
  • the manufacturing cost may increase and economical efficiency may decrease, and printability and storage stability may decrease due to an increase in viscosity.
  • the binder resin constituting the black printed layer 4 causes the pigment to be colored on the printed object, thereby increasing the adhesion between the pigment and the printed object, and improving the quality of printing, specifically gravure printing.
  • Preferred binder resins are vinyl resins, epoxy resins, alkyd resins, amide resins, acrylic resins, acetylcellulose, chlorinated polypropylene, polyurethane or at least one or more mixtures thereof. It is more preferable to use polyurethane which is excellent and is excellent in adhesiveness with various to-be-printed bodies.
  • the amount of the preferred binder resin is preferably 3 to 25% by weight based on 100% by weight of the total black print layer 4.
  • the amount of the binder resin used is less than 3% by weight, precipitation of the pigment may occur, and printability is reduced to reduce color expressiveness and adhesion with the adherend, which is not preferable, and the content thereof exceeds 25% by weight.
  • the manufacturing cost is increased, economic efficiency is lowered, and when gravure printing is caused due to an increase in the viscosity of the composition, a high possibility of contamination of the device may occur, and printability may be deteriorated.
  • the organic solvent constituting the black printed layer 4 according to the present invention should be selected in consideration of the compatibility with the pigment and the solubility with the binder resin, etc.
  • aromatic hydrocarbons or alcohols can be used. have.
  • aromatic hydrocarbon it is preferable to use at least one or more mixtures selected from benzene, toluene, xylene, methyl ethyl ketone or these, and alcohols may be selected from ethanol, methanol, isopropyl alcohol or at least one mixture selected from them. It is preferable that the above-mentioned materials can be used alone or in combination with each other.
  • the aromatic hydrocarbon basically serves to dissolve the pigment, specifically black pigment or binder resin, alcohols improve the drying after printing.
  • the organic solvent according to the present invention is a mixture of 35 to 70 wt% of methyl ethyl ketone, and 30 to 65 wt% of isopropyl alcohol, which is an aromatic hydrocarbon.
  • the amount of the preferred organic solvent is preferably 45 to 80% by weight based on 100% by weight of the total black print layer 4.
  • the additive constituting the black print layer 4 according to the present invention may be used as long as it is a conventional additive in the art, but preferably, a dispersant, a slip agent, and an adhesion promoter may be used alone or in combination.
  • the dispersant may be selected from the group consisting of organic acids, aromatic oils, aliphatic oils, animal vegetable oils, castor oils, cottonseed oil, mineral oils, and mixtures thereof, and slip agents may use the product name BYK-333.
  • the adhesion promoter is preferably hydroxy ethyl acryloyl phosphate, hydroxy ethyl methacrylate phosphate or at least one mixture or product name BYK-4500 selected from them.
  • the amount of the preferred additive is preferably 0.1 to 5% by weight based on 100% by weight of the total black print layer 4.
  • the amount of the additive is less than 0.1% by weight, the wettability of the pigment and the binder resin is decreased, thereby reducing the physical properties of the composition, thereby reducing color expressive ability and storage stability, and printing. Blocking of partial printing of the printing surface may occur during operation, and the adhesion or slip property of the pigment and the printed object may be degraded, which is not preferable.
  • the amount of the additive is more than 5% by weight, the manufacturing cost is increased, the smoothness of the printing coating film is excessively increased to cause adhesion failure with the printed material, and the compatibility between the additive and the binder resin may be reduced. It can be undesirable.
  • the hot melt adhesive layer 8 according to the present invention is formed by being laminated on the other side substrate 2 on one side on which the black print layer 4 is laminated.
  • the thickness of the hot melt adhesive layer 8 according to the present invention is preferably 3 to 30 ⁇ m thickness.
  • adhesion may be reduced due to the lifting phenomenon when the wafer is attached, and a phenomenon may occur in which the adherend and the product are separated during heating.
  • the thickness is 30 ⁇ m or more, the degree of adhesion to the wafer is good, but in the sawing process, burrs and / or cracks may occur, and the adhesive component of the adhesive layer may be sawing blades. Contamination of the blades may adversely affect the process.
  • Hot melt adhesive layer 8 according to the present invention is preferably laminated by coating on one side of the substrate (2) T-die, slot die (Coma) coating method (Coma) coating method.
  • the hot melt adhesive layer 8 may comprise a base resin, a tackifying resin, a solvent and / or a matting agent, the composition ratio of which is based on 100% by weight of the total hot melt adhesive layer 8 It is recommended that the resin is 10 to 20% by weight, tackifying resin 10 to 20% by weight, solvent 64 to 78% by weight and / or matting agent 2 to 10% by weight.
  • the type, molecular weight, and / or compounding ratio of the base resin, physical properties of the adhesive layer, for example, adhesive force, cohesion, wetting, and / or durability, etc. may be adjusted.
  • Preferred base resins are polyamide-based resins, polyester-based resins, EVA-based resins, polyurethane-based resins, or at least one or more mixtures thereof selected from them.
  • excellent adhesion and compatibility, and excellent adhesion at low temperatures (60 ° C.) It is recommended to use a polyurethane resin having good moisture resistance, chemical resistance, and durability, and the amount of use thereof is preferably 10 to 20% by weight based on 100% by weight of the total hot melt adhesive layer 8.
  • the tackifying resin according to the present invention is used as an adjuvant for improving adhesiveness when the base resin alone does not exhibit sufficient adhesive performance, but any tackifying resin of the art having such a purpose may be used.
  • hydrides of petroleum resins, hydrides of terpene resins, natural resins, modified resins, natural resins and derivatives of modified resins may be selected singly or in combination, but is preferably hydride resins of petroleum resins. It is recommended to use, the amount of use is recommended to be 10 to 20% by weight based on 100% by weight of the total hot melt adhesive layer (8).
  • the solvent according to the present invention is used to dissolve the base resin and the tackifying resin in a liquid state, and any solvent may be used as long as it is a conventional solvent in the art having such a purpose, but preferably toluene, DMF (N, N-Dimethylformamide), MEK (Methyl ethyl ketone) or a mixture thereof is preferably used. More preferably, DMF and MEK are mixed at a weight ratio of 1: 1.
  • the amount of the preferred solvent can be changed according to the user's choice.
  • the amount of the solvent is preferably 64 to 78% by weight based on 100% by weight of the total hot melt adhesive layer 8.
  • the matting agent according to the present invention prevents the base resin and the tackifying resin from sinking when the hot-melt adhesive layer 8 is in a liquid state, and is applied to the base material 2, specifically a PET film made of PET film, during application drying.
  • the hot-melt adhesive layer 8 is for anti-blocking the back of the substrate 2, but any conventional matting agent in the art having such a purpose may be used, but preferably It is preferable to use an aerosol or polyacrylate copolymer, and the amount thereof is preferably 2 to 10% by weight based on 100% by weight of the total hot melt adhesive layer 8.
  • the acrylic low adhesion carrier layer 10 according to the present invention is laminated on the black printing layer 4 to enable thermal adhesion, and if any conventional acrylic low adhesion carrier layer 10 in the art having this purpose, You may use it.
  • the acrylic low adhesion carrier layer 10 is an acrylic layer 14 made of an acrylic adhesive on one side facing the black print layer 4 is a carrier film 12, preferably 2 to 7 ⁇ m It is preferably configured in a form coated on a PET carrier film 12 having a thickness of about 5 ⁇ m.
  • the thickness of the acrylic layer 14 constituting the acrylic low-adhesive carrier layer 10 may be formed to a thickness of 3 to 30 ⁇ m according to the user's selection, but in consideration of adhesiveness and thickness dependence of about 10 ⁇ m Forming to a thickness of is useful in terms of peeling force and lamination force.
  • the acrylic low adhesion carrier layer 10 maintains an adhesive force of about 2 to 100 gf / 25mm, and no residue remains on the adherend at a temperature of 100 to 150 ° C, preferably 110 to 120 ° C.
  • the adhesion temperature (oven cure) of the hot melt adhesive layer 8 is about 100 ° C. or more, so that a transition does not occur in the acrylic adhesive constituting the acrylic layer 14 even after the product processing. It should be avoided that it is important that no residues remain at high temperatures.
  • the adhesive tape is removed in a state in which the adhesive tape is attached to the acrylic low adhesive carrier layer 10 during the rework process of removing the adhesive tape to recover the wafer, if necessary after lamination. Since it is important to be adhered to the printed surface and removed well, it is important that the adhesion between the acrylic low adhesion carrier layer 10 and the printed surface during the rework is maintained between the hot melt adhesive layer 8 and the wafer. It should be designed higher than the adhesive force, and the adhesive force between the acrylic low adhesion carrier layer 10 and the printing surface after the oven cure in a normal process without rework should be lower than the adhesive force between the hot melt adhesive layer 8 and the wafer.
  • 2-100 gf / 25mm is suitable for the adhesive force of the acrylic low adhesion care layer 10 which concerns on this invention even after normal temperature and oven cure, and 2-30 gf / 25mm is the most preferable.
  • the acrylic layer 14 constituting the acrylic low adhesion carrier layer 10 according to the present invention contains an adhesive.
  • the preferred acrylic layer 14 preferably contains an acrylic pressure sensitive adhesive, for example an acrylic monomer, preferably an acrylic monomer having a weight average molecular weight of 200,000 to 1 million.
  • the adhesive tape according to the present invention further laminates the liner 16 on the other side of the hot melt adhesive layer 8, preferably laminated on one side of the hot melt adhesive layer 8, preferably the substrate 2.
  • the adhesive tape can be prevented from being damaged during transport, use and / or storage, and the use can be facilitated.
  • Preferred liner 16 is preferably PET film.
  • Wafer level backside adhesive tape according to the present invention having such a configuration is an acrylic low adhesion carrier layer composed of a PET film coated with an acrylic pressure-sensitive adhesive (Lamination) M / C or using a laminating equipment (two or more shafts) ( 10) fixed on the first shaft, and the tape coated with urethane adhesive on the carbon black PET film (Top_ carbon black, Bottom_ Liner) was fixed on the intermediate shaft (Roll) and roll (Roll) under pressure
  • One sticky tape is prepared by passing through the plate and homogenizing.
  • the prepared adhesive tape is aged for 45 to 50 hours in a temperature range of 45 to 55 °C in the aging room to prepare the adhesive tape as a final product.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • the gravure black coating layer coating liquid mixed with 5 g of carbon black, 77 g of polyurethane resin, 52 g of methyl ethyl ketone and 25 g of isopropyl alcohol, and 3 g of adhesion promoter BYK-4500 were added to one side of the corona treated PET film.
  • the coating was performed by a printing method to prepare a PET film having a black print layer having a thickness of about 3.5 ⁇ m.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • gravure black coating layer coating liquid mixed with 7 g of carbon black, 75 g of polyurethane resin, 50 g of methyl ethyl ketone and 25 g of isopropyl alcohol, and 3 g of adhesion promoter BYK-4500 were added to one side of the corona treated PET film.
  • the coating was performed by a printing method to prepare a PET film having a black print layer having a thickness of about 3.5 ⁇ m.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • the gravure black coating layer coating liquid mixed with 5 g of carbon black, polyurethane resin 25 g, methyl ethyl ketone 40 g and 27 g of isopropyl alcohol, and 3 g of adhesion promoter BYK-4500 were added to one side of the corona treated PET film.
  • the coating was performed by a printing method to prepare a PET film having a black print layer having a thickness of about 3.5 ⁇ m.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • the gravure black coating layer coating liquid mixed with 15 g of carbon black, 77 g of polyurethane resin, 46 g of methyl ethyl ketone and 31 g of isopropyl alcohol, and 3 g of adhesion promoter BYK-4500 were added to one side of the corona treated PET film.
  • the coating was performed by a printing method to prepare a PET film having a black print layer having a thickness of about 3.5 ⁇ m.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • gravure black coating layer coating liquid mixed with 15 g of carbon black, 77 g of polyurethane resin, 40 g of methyl ethyl ketone and 37 g of isopropyl alcohol, and 3 g of adhesion promoter BYK-4500 were added to one side of the corona treated PET film.
  • the coating was performed by a printing method to prepare a PET film having a black print layer having a thickness of about 3.5 ⁇ m.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • gravure black coating layer coating liquid mixed with 15 g of carbon black, 25 g of polyurethane resin, 34 g of methyl ethyl ketone and 23 g of isopropyl alcohol, and 3 g of adhesion promoter BYK-4500 were added to one side of the corona treated PET film.
  • the coating was performed by a printing method to prepare a PET film having a black print layer having a thickness of about 3.5 ⁇ m.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • gravure black coating layer coating liquid mixed with 25 g of carbon black, 3 g of polyurethane resin, 41 g of methyl ethyl ketone and 28 g of isopropyl alcohol, and 3 g of adhesion promoter BYK-4500 were added to one side of the corona treated PET film.
  • the coating was performed by a printing method to prepare a PET film having a black print layer having a thickness of about 3.5 ⁇ m.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • gravure black coating layer coating liquid mixed with 25 g of carbon black, 57 g of polyurethane resin, 34 g of methyl ethyl ketone and 23 g of isopropyl alcohol, and 3 g of adhesion promoter BYK-4500 were added to one side of the corona treated PET film.
  • the coating was performed by a printing method to prepare a PET film having a black print layer having a thickness of about 3.5 ⁇ m.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • gravure black coating layer coating liquid mixed with 25 g of carbon black, 47 g of polyurethane resin, 28 g of methyl ethyl ketone and 19 g of isopropyl alcohol, and 3 g of adhesion promoter BYK-4500 were added to one side of the corona treated PET film.
  • the coating was performed by a printing method to prepare a PET film having a black print layer having a thickness of about 3.5 ⁇ m.
  • the black print layer printability and UV-blocking properties prepared according to Examples 1 to 9 were measured and shown in Table 1 below.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • Example 5 which was the best in the black print layer composition content evaluation and Example 14, which was the best in the hot melt adhesive layer composition content evaluation were applied together, the main raw materials and the properties were changed, and the contents were shown in Table 3.
  • a PET film prepared by corona treatment of one side of a PET film having a thickness of about 12 ⁇ m coated with a thermosetting acrylic coating agent was prepared.
  • gravure black coating layer coating liquid mixed with 15 g of carbon black, 67 g of polyurethane resin, 40 g of methyl ethyl ketone and 37 g of isopropyl alcohol, and 3 g of adhesion promoter BYK-4500 were added to one side of the corona treated PET film.
  • the coating was performed by a printing method to prepare a PET film having a black print layer having a thickness of about 3.5 ⁇ m.
  • the PET release film was laminated on the hot melt adhesive surface to prepare a hot melt adhesive tape on which a black printing layer was printed.
  • the laminated adhesive tape is aged in a aging room at a temperature of about 50 ° C. for about 48 hours to obtain a final adhesive tape.
  • Example 19 The same procedure as in Example 19 was carried out except that a black print layer having a thickness of about 3.5 ⁇ m was formed to have a thickness of 30 ⁇ m.
  • Example 19 The same procedure as in Example 19 was carried out, except that 15 g of iron oxide was used instead of 15 g of carbon black.
  • Example 19 The same procedure as in Example 19 was carried out except that 15 g of manganese dioxide was used instead of 15 g of carbon black.
  • Example 19 The same procedure as in Example 19 was carried out except that 15 g of aniline black was used instead of 15 g of carbon black.
  • Example 19 The same procedure as in Example 19 was carried out except that 15 g of activated carbon was used instead of 15 g of carbon black.
  • Example 19 It carried out in the same manner as in Example 19, but was carried out by forming a hot melt gradually layer of 5 ⁇ m thickness with a pressure sensitive adhesive layer of 40 ⁇ m thickness.
  • Example 19 The same procedure as in Example 19 was carried out except that 15 g of polyester was used instead of 15 g of a polyurethane resin.
  • Example 19 It carried out by the same method as Example 19 except having formed the thickness of the acrylic low adhesion carrier layer of about 10 micrometers thick into the acrylic low adhesion carrier layer of about 40 micrometers thick.
  • the adhesive tape-attached wafer was removed from the carrier film of the acrylic low adhesion carrier layer protecting the black printed surface, and then marked on the black printed surface using a laser marking machine, and then visibility was observed.
  • the dicing tape for dicing is attached to the black printing surface and the adhesive surface of the dicing tape using a roll lamination machine. These were face to face and attached together with the wafer ring.
  • the sawing was performed to form a chip of 5mm x 5mm.
  • the resulting chip was left at 85 ° C. and 60% relative humidity for 168 hours, followed by moisture absorption, and then the initial temperature was 160 ° C., followed by three times of reflow for a maximum temperature of 260 ° C. and a heating time of 5 minutes. It was.
  • tip adhered to the resin layer was baked at 125 degreeC for 20 hours, and it was made to absorb moisture for 168 hours on 85 degreeC and 85% RH conditions. Immediately after taking this out, the reflow of the initial temperature of 160 degreeC and the maximum temperature of 260 degreeC conditions was passed three times. Subsequently, 25 semiconductor chips with a resin film were installed in a thermal shock apparatus, and the cycle of -40 degreeC and 125 degreeC was repeated 1000 times.
  • tip with a resin film taken out from the heat shock apparatus was evaluated for the presence or absence of lifting, peeling, and a crack in the junction part of a chip and a resin film for the microscope and side observation. Of the committed chips, lifted. The number of chips without peeling or cracking was counted.
  • Example 19 ⁇ ⁇ ⁇ 30 25
  • Example 20 ⁇ ⁇ ⁇ 25 20
  • Example 21 ⁇ ⁇ ⁇ 29 24
  • Example 22 ⁇ ⁇ ⁇ 29 23
  • Example 23 ⁇ ⁇ ⁇ 28 23
  • Example 24 ⁇ ⁇ ⁇ 28 24
  • Example 25 ⁇ ⁇ 25 20
  • Example 26 ⁇ ⁇ ⁇ 28 23
  • Example 27 ⁇ ⁇ ⁇ 30 25 Comparative example ⁇ ⁇ ⁇ 15 10 things
  • the conventional adhesive tape according to the comparative example is a normal reworking and sawing is not good, reflow, heat and moisture resistance is not good appear.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

La présente invention comprend une bande adhésive de face arrière niveau tranche comprenant : un substrat en forme de feuille ; une couche imprimée noire stratifiée sur une surface du substrat, bloquant les rayons ultraviolets, et facilitant la visibilité du marquage laser ; une couche adhésive thermofusible stratifiée sur l'autre surface du substrat, à l'opposé de la surface sur laquelle la couche imprimée noire est stratifiée ; et une couche de support acrylique faiblement adhésive stratifiée sur la couche imprimée noire et comprenant un acrylique permettant une adhésion thermique.
PCT/KR2019/003359 2018-03-23 2019-03-22 Bande adhésive de face arrière niveau tranche, et son procédé de fabrication WO2019182399A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114410235A (zh) * 2022-01-24 2022-04-29 江阴邦特科技有限公司 一种耐低温pet膜胶带及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101936873B1 (ko) * 2018-03-23 2019-01-11 (주)엠티아이 웨이퍼 레벨용 백사이드 점착테이프 및 이의 제조방법
CN110396379A (zh) * 2019-07-16 2019-11-01 湖北锂诺新能源科技有限公司 一种可进行激光喷码的锂离子电池保护胶带

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009286864A (ja) * 2008-05-28 2009-12-10 Dic Corp ラミネート用粘着フィルムおよびレーザーマーキングラベル
JP2011151363A (ja) * 2009-12-24 2011-08-04 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム
KR20140146805A (ko) * 2013-06-18 2014-12-29 권경점 무기재 차광필름 및 그 제조방법
KR20170115048A (ko) * 2015-02-05 2017-10-16 린텍 가부시키가이샤 수지막 형성용 복합 시트, 및 수지막을 갖는 칩의 제조 방법
KR101936873B1 (ko) * 2018-03-23 2019-01-11 (주)엠티아이 웨이퍼 레벨용 백사이드 점착테이프 및 이의 제조방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101734030A (zh) * 2008-11-18 2010-06-16 赵东林 一种不规则物体表面图文印刷方法及装置
CN201503666U (zh) * 2009-07-28 2010-06-09 东莞植富商标印制有限公司 一种热转印电子射频识别标签
CN102049913B (zh) * 2009-10-30 2012-11-14 正清国际有限公司 Uv热压转印成型制程
JP5501938B2 (ja) * 2009-12-24 2014-05-28 日東電工株式会社 フリップチップ型半導体裏面用フィルム
JP5546985B2 (ja) * 2010-07-28 2014-07-09 日東電工株式会社 半導体装置製造用フィルム、半導体装置製造用フィルムの製造方法、及び、半導体装置の製造方法。
US9589880B2 (en) * 2013-10-09 2017-03-07 Infineon Technologies Ag Method for processing a wafer and wafer structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009286864A (ja) * 2008-05-28 2009-12-10 Dic Corp ラミネート用粘着フィルムおよびレーザーマーキングラベル
JP2011151363A (ja) * 2009-12-24 2011-08-04 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム
KR20140146805A (ko) * 2013-06-18 2014-12-29 권경점 무기재 차광필름 및 그 제조방법
KR20170115048A (ko) * 2015-02-05 2017-10-16 린텍 가부시키가이샤 수지막 형성용 복합 시트, 및 수지막을 갖는 칩의 제조 방법
KR101936873B1 (ko) * 2018-03-23 2019-01-11 (주)엠티아이 웨이퍼 레벨용 백사이드 점착테이프 및 이의 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114410235A (zh) * 2022-01-24 2022-04-29 江阴邦特科技有限公司 一种耐低温pet膜胶带及其制备方法

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