WO2019171923A1 - Method for manufacturing resin structure and resin structure - Google Patents

Method for manufacturing resin structure and resin structure Download PDF

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Publication number
WO2019171923A1
WO2019171923A1 PCT/JP2019/005772 JP2019005772W WO2019171923A1 WO 2019171923 A1 WO2019171923 A1 WO 2019171923A1 JP 2019005772 W JP2019005772 W JP 2019005772W WO 2019171923 A1 WO2019171923 A1 WO 2019171923A1
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WO
WIPO (PCT)
Prior art keywords
resin
wiring
electronic component
convex structure
molded body
Prior art date
Application number
PCT/JP2019/005772
Other languages
French (fr)
Japanese (ja)
Inventor
若浩 川井
健太 伊東
康隆 伊木
徹也 桂川
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP2020504897A priority Critical patent/JP7010362B2/en
Publication of WO2019171923A1 publication Critical patent/WO2019171923A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/40—Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/24195—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being a discrete passive component

Definitions

  • the present invention relates to a method for producing a resin structure and a resin structure.
  • Patent Document 1 describes a resin molded product that is a part of a housing, an electronic component that is embedded in the resin molded product with the electrode exposed, and an electrode of the electronic component.
  • An electronic component mounting apparatus including a connected wiring is disclosed.
  • the wiring is printed with silver ink. According to the electronic component mounting apparatus, a conventional resin printed board is not required.
  • the ribs for reinforcement, protrusions for assembling other components, rising portions for forming a space above the electronic component, and convex structures such as a frame are formed on the resin molded product.
  • the electronic component mounting apparatus described in Japanese Patent Application Laid-Open No. 2010-272756 is manufactured by embedding an electronic component in a resin molded product and then forming a wiring by printing. For this reason, the surface of the resin molded product from which the electronic component is exposed needs to be flat to the extent that wiring can be formed by printing, and cannot meet the above requirements.
  • the present disclosure has been made paying attention to the above-mentioned problems, and the purpose thereof is a method for manufacturing a resin structure having a convex structure portion on a surface of a resin molded body on which wiring is formed, and the resin structure. Is to provide.
  • a method for manufacturing a resin structure includes mounting an electronic component on a sheet, placing the sheet in a mold, and filling the resin in the mold to embed the electronic component.
  • the step of molding the resin molded body, the step of exposing the bonding surface to which the sheet is bonded in the resin molded body by peeling the sheet from the resin molded body, and the wiring connected to the electronic component are printed on the bonding surface And a step of forming a convex structure portion of resin having a height of 1 mm or more on the joint surface using a 3D printer.
  • a method for manufacturing a resin structure includes: mounting an electronic component on a sheet; and thickening an ultraviolet curable resin material, a thermosetting resin material, or a thermoplastic resin material on the electronic component mounted on the sheet.
  • the step of molding the resin molded body in which the electronic component is embedded, and the sheet is joined to the resin molded body by peeling the sheet from the resin molded body.
  • the step of exposing the bonded surface, the step of printing the wiring connected to the electronic component on the bonded surface, and the convex structure portion of the resin having a height of 1 mm or more are formed on the bonded surface using a 3D printer.
  • the step of forming the convex structure portion is repeatedly performed by applying an ultraviolet curable resin material, a thermosetting resin material, or a thermoplastic resin material to a thickness of 14 to 20 ⁇ m and curing. According to this disclosure, a convex structure portion having a height of 1 mm or more can be easily formed.
  • the convex structure portion straddles at least one of the electronic component and the wiring. According to this disclosure, at least one of the electronic component and the wiring can be protected by the convex structure portion.
  • the step of forming the convex structure portion includes a step of disposing a support material that supports the convex structure portion between the convex structure portion and at least one of the electronic component and the wiring.
  • the support material is left without being removed. According to this disclosure, at least one of the electronic component and the wiring can be protected from the outside air by the support material.
  • the support material is an uncured resin material. According to this disclosure, the stress applied to the electronic component and the wiring can be reduced.
  • the resin structure includes a resin molded body and an electronic component embedded in the resin molded body.
  • the surface of the resin molded body has an exposed surface from which the electronic component is exposed.
  • the resin structure further includes wiring connected to the electronic component formed on the exposed surface, and a resin convex structure having a height of 1 mm or more formed on the exposed surface.
  • the convex structure portion is directly joined to the resin molded body. According to this disclosure, it is possible to provide a resin structure having a convex structure portion on the surface of the resin molded body on which the wiring is formed.
  • the wiring includes a first wiring part and a second wiring part having a distance of 3 mm or less between the first wiring part. At least a part of the convex structure portion is located between the first wiring portion and the second wiring portion on the exposed surface. According to this disclosure, the strength can be increased by the convex structure portion even at an interval of 3 mm or less between the first wiring portion and the second wiring portion.
  • the convex structure portion includes at least one standing portion formed on the exposed surface and a lid portion formed on at least one standing portion and covering at least one of the electronic component and the wiring. Including. According to this disclosure, at least one of the electronic component and the wiring can be protected.
  • the display device further includes a support portion that is disposed between the lid portion and at least one of the electronic component and the wiring and supports the lid portion. According to this disclosure, at least one of the electronic component and the wiring can be protected from the outside air.
  • the support portion is made of an uncured resin material. Stress applied to at least one of the electronic component and the wiring can be reduced.
  • FIG. 1 is a diagram illustrating a method for manufacturing a resin structure according to the present embodiment.
  • a plan view of the first intermediate body obtained in the manufacturing process is shown on the left side of FIG. 1 (a), and a side view of the first intermediate body is shown on the right side of FIG. 1 (a).
  • FIG. 1B shows a cross-sectional view of the second intermediate obtained in the manufacturing process.
  • a plan view of the third intermediate obtained in the manufacturing process is shown on the left side of FIG. 1 (c), and a cross-sectional view of the third intermediate taken along the line XX is shown on the right side of FIG. 1 (c). .
  • a plan view of the fourth intermediate obtained in the manufacturing process is shown on the left side of FIG. 1D, and a cross-sectional view taken along line XX of the fourth intermediate is shown on the right side of FIG. .
  • a plan view of the resin structure 100 is shown on the left side of FIG. 1 (e), and a cross-sectional view taken along line XX of the resin structure is shown on the right side of FIG. 1 (e).
  • the resin structure 100 including the resin convex structure portions 30a to 30c is manufactured.
  • the electronic component 20 is mounted on the temporary fixing sheet 60, the temporary fixing sheet 60 is disposed in the molding die 70, and the molding die 70 is filled with resin.
  • a first forming step is performed.
  • the resin molding 10 (refer FIG.1 (c)) by which the electronic component 20 was embed
  • the upper surface 11, which is a bonding surface to which the temporarily fixed sheet 60 is bonded, is exposed in the resin molded body 10 by peeling the temporarily fixed sheet 60 from the resin molded body 10. A peeling process is performed.
  • the electronic component 20 is exposed from the upper surface 11.
  • a printing process for printing the wiring 40 connected to the electronic component 20 on the upper surface 11 is performed.
  • a second molding step is performed on the upper surface 11 using a 3D printer to mold the resin convex structures 30a to 30c having a height H of 1 mm or more.
  • the resin structure 100 having the convex structure portion 30 on the upper surface 11 of the surface of the resin molded body 10 on which the wiring 40 is formed can be easily manufactured.
  • FIG. 2 is a perspective view showing an example of the resin structure 100.
  • the resin structure 100 includes a resin molded body 10, electronic components 20a to 20e, wirings 40, and convex structure portions 30a to 30c.
  • the resin molded body 10 is made of a resin such as polycarbonate (PC), acrylonitrile butadiene styrene (ABS), polyamide (PA), or the like.
  • PC polycarbonate
  • ABS acrylonitrile butadiene styrene
  • PA polyamide
  • the material of the resin molded body 10 is not particularly limited.
  • the surface of the resin molded body 10 has, for example, a rectangular flat upper surface 11.
  • the electronic components 20a to 20e are, for example, passive components (resistors, capacitors, etc.), active components (LSI (Large-Scale Integration), IC (Integrated Circuit), power transistors, etc.), power supply devices (batteries, etc.), display devices (LEDs) (Light Emitting Diode, etc.), parts selected from sensors, switches, etc.
  • the electronic components 20a to 20e have electrodes 21a to 21e, respectively.
  • Each of the electronic components 20a to 20e has a plurality of electrodes. In the figure, only one of the plurality of electrodes is given a reference numeral.
  • the chip-type electronic components 20c to 20e have two electrodes 21c to 21e, respectively.
  • electronic components 20a and 20b which are ICs, have four electrodes 21a and 21b, respectively.
  • each of the electronic components 20a to 20e is referred to as an “electronic component 20”.
  • each of the electrodes 21a to 21e is referred to as an “electrode 21”.
  • the electronic component 20 is embedded in the resin molded body 10 so as to be exposed from the upper surface 11 of the resin molded body 10.
  • the upper surface 11 of the resin molded body 10 is an exposed surface from which the electronic component 20 is exposed.
  • the electrode 21 is also exposed from the upper surface 11 of the resin molded body 10.
  • the surface exposed from the resin molded body 10 is continuous with the upper surface 11 of the resin molded body 10.
  • “the two surfaces are“ continuous ”” means that the step between the two surfaces is so small that the wiring 40 formed thereon is not cut.
  • the wiring 40 is made of a metal such as silver.
  • the thickness of the wiring 40 is not particularly limited and is, for example, 1 to 5 ⁇ m.
  • the wiring 40 is formed on the upper surface 11 of the resin molded body 10, and is connected to one of the electrodes 21a to 21e of the electronic components 20a to 20e.
  • the wiring 40a which is a part of the wiring 40 is connected to the electrode 21b of the electronic component 20a, the electrode 21c of the electronic component 20c, and the electrode 21d of the electronic component 20d.
  • the wiring 40b which is a part of the wiring 40 is connected to the electrode 21b of the electronic component 20a and the electrode 21c of the electronic component 20c.
  • the electronic component 20 and the wiring 40 constitute an electronic circuit.
  • the wiring 40 is easily formed by applying liquid conductive ink (for example, silver (Ag) nano ink) to the upper surface 11 of the resin molded body 10 by using, for example, an ink jet printing method or a screen printing method.
  • liquid conductive ink for example, silver (Ag) nano ink
  • the convex structure portions 30a to 30c are molded on the upper surface 11 of the resin molded body 10 using a 3D printer.
  • each of the convex structure portions 30a to 30c is referred to as a “convex structure portion 30”.
  • the convex structure part 30 has a height H of 1 mm or more.
  • the heights of the convex structure portions 30a to 30c may be the same as each other or different from each other. Since the convex structure portion 30 is molded using a 3D printer, the convex structure portion 30 is directly bonded to the resin molded body 10 without using an adhesive.
  • the convex structure portion 30 may be molded directly above the electronic component 20 or the wiring 40 or may be molded avoiding the electronic component 20 and the wiring 40. However, it is preferable that the convex structure portion 30 is molded avoiding the electronic component 20 and the wiring 40. Thereby, the damage of the electronic component 20 or the disconnection of the wiring 40 can be prevented by the stress at the time of forming the convex structure portion 30.
  • the convex structure portion 30 may be formed in a slight gap between the wirings 40.
  • the convex structure part 30b may be located between the wiring 40a and the wiring 40b whose distance D between the wiring 40a is 3 mm or less. By using a 3D printer, the convex structure portion 30b can be formed even at such a small interval.
  • the convex structure part 30 has a shape according to the purpose.
  • the convex structure portion 30 a is formed on a ridge so as to be configured as a part of a frame surrounding the electronic component 20 and the wiring 40.
  • the convex structure part 30b is formed for the purpose of ensuring the strength of the resin molded body 10, and has a rectangular parallelepiped shape.
  • the convex structure portion 30c is formed for the purpose of screwing a male screw and has a cylindrical shape.
  • the resin structure 100 is manufactured by the first molding process, the peeling process, the printing process, and the second molding process.
  • the electronic component 20 is attached to the temporary fixing sheet 60 using an adhesive (not shown). At this time, the electronic component 20 is affixed to the temporarily fixing sheet 60 so that the electrode 21 contacts the temporarily fixing sheet 60.
  • the temporary fixing sheet 60 for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), or the like can be used.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PPS polyphenylene sulfide
  • the temporary fixing sheet 60 is preferably made of a material that transmits ultraviolet rays.
  • the electronic component 20 can be attached to the temporarily fixed sheet 60 using, for example, an ultraviolet curable adhesive (not shown) applied to the temporarily fixed sheet 60.
  • an ultraviolet curable adhesive is applied to one surface of a temporary fixing sheet 60 made of transparent PET having a thickness of 50 ⁇ m to a thickness of 2 to 3 ⁇ m. This application is performed using a method such as an inkjet printing method.
  • the electronic component 20 is placed at a predetermined position.
  • UV light having an intensity of, for example, 3000 mJ / cm 2 from the other surface of the temporary fixing sheet 60 (that is, the surface opposite to the surface on which the electronic component 20 is placed)
  • the adhesive is cured,
  • the electronic component 20 is affixed to the temporary fixing sheet 60.
  • the temporarily fixing sheet 60 is placed in the mold 70.
  • the mold 70 includes a first mold 70a and a second mold 70b, and a space 70c is formed between the first mold 70a and the second mold 70b.
  • the temporarily fixed sheet 60 is disposed in the mold 70 such that the surface of the temporarily fixed sheet 60 on which the electronic component 20 is not attached is in contact with the flat inner surface of the first mold 70 a. Therefore, a space 70c is formed between the surface of the temporary fixing sheet 60 on which the electronic component 20 is attached and the second molding die 70b.
  • the molten resin is injected into the space 70c in the mold 70.
  • the resin is filled so as to surround the electronic component 20.
  • the resin molding 10 in which the electronic component 20 is embedded is molded (see FIG. 1C).
  • Resin injection molding conditions are appropriately selected according to the resin material. For example, when acrylonitrile butadiene styrene (ABS) is used, injection molding is performed at an injection resin temperature of 270 ° C. and an injection pressure of 100 MPa.
  • ABS acrylonitrile butadiene styrene
  • the temporary fixing sheet 60 is peeled from the resin molded body 10 taken out from the molding die 70.
  • the upper surface 11 of the resin molded body 10 is exposed.
  • the upper surface 11 is a bonding surface that has been bonded to the temporary fixing sheet 60.
  • the electronic component 20 is attached to the temporarily fixed sheet 60 so that the electrode 21 contacts the temporarily fixed sheet 60. Therefore, the electrode 21 of the electronic component 20 is exposed from the upper surface 11 of the resin molded body 10 and is continuous with the upper surface 11.
  • the wiring 40 is formed by ejecting conductive silver nano-ink onto the upper surface 11 of the resin molded body 10 using, for example, an ink jet printer.
  • the formation of the wiring 40 may be performed using a screen printing method or the like.
  • the convex structure portions 30a to 30c are formed on the upper surface 11 of the resin molded body 10 on which the wiring 40 is formed.
  • the convex structure portions 30a to 30c are formed using a 3D printer. For example, a process of applying a UV curable resin material, which is a model material, to a thickness of about 14 ⁇ m to 20 ⁇ m and curing it by UV is repeatedly performed until a predetermined height H is reached. Thereby, the convex structure portions 30a to 30c in which layers made of the ultraviolet curable resin material are laminated are formed.
  • the ultraviolet curable resin material for example, digital ABS (manufactured by Stratasys), which is an ink material prepared by kneading an ultraviolet curable substance with acrylonitrile butadiene styrene (ABS), can be used.
  • digital ABS manufactured by Stratasys
  • ABS acrylonitrile butadiene styrene
  • thermosetting resin material or a thermoplastic resin material may be used as a model material instead of the ultraviolet curable resin material.
  • the process of applying the melted ABS to a thickness of about 14 ⁇ m to 20 ⁇ m and cooling and curing may be repeated until a predetermined height H is reached.
  • the convex structure portions 30 a to 30 c are directly molded on the upper surface 11 of the resin molded body 10 and joined to the resin molded body 10.
  • the resin constituting the convex structure portions 30 a to 30 c is preferably the same as the resin constituting the resin molded body 10.
  • the main component of the convex structure portions 30 a to 30 c is preferably the same as the main component of the resin molded body 10.
  • a main component is a component which occupies 50 volume% or more. Thereby, the joint strength between the convex structure portions 30a to 30c and the resin molded body 10 can be increased.
  • the convex structure portions 30 a to 30 c are preferably formed on the upper surface 11 while avoiding the electronic component 20 and the wiring 40. By preventing the convex structure portions 30a to 30c from being formed immediately above the electronic component 20 embedded in the resin molded body 10 or directly above the wiring 40, mechanical damage of the electronic component 20 or disconnection of the wiring 40 is prevented. it can.
  • the convex structure portions 30a to 30c are formed by a 3D printer, they are also formed in a narrow region between the wirings 40 on the upper surface 11.
  • the convex structure portion 30b is formed between the wiring 40a and the wiring 40b having a distance D of 3 mm or less.
  • the interval D may be 1 mm or less. If it is the area
  • FIG. 3 is a cross-sectional view showing a first modification of the resin structure.
  • FIG. 4 is a cross-sectional view showing a second modification of the resin structure.
  • FIG. 5 is a cross-sectional view showing a third modification of the resin structure.
  • the convex structure 30 may be formed so as to straddle the electronic component 20 and the wiring 40. That is, it includes standing portions 31 a and 31 b formed on the upper surface 11 of the resin molded body 10 and a lid portion 32 formed on the standing portions 31 a and 31 b and covering the electronic component 20 and the wiring 40. Thereby, it can avoid that the electronic component 20 and the wiring 40 contact an external device, and the electronic component 20 and the wiring 40 can be protected.
  • the convex structure part 30 may be shape
  • the standing portion 31a shown in FIG. 3 may be omitted, and an opening may be formed between the lid portion 32 and the resin molded body 10. Also by this, since the cover part 32 covers the electronic component 20 and the wiring 40, the electronic component 20 and the wiring 40 can be protected.
  • the convex structure portion 30 may include a standing portion 31 c formed between the standing portions 31 a and 31 b in addition to the standing portions 31 a and 31 b.
  • the lid portion 32 is formed on the standing portions 31a to 31c.
  • the standing portion 31c is located between the wiring 40a and the wiring 40b.
  • the standing portion 31c can be easily formed between the wiring 40a and the wiring 40b using a 3D printer.
  • the standing portion 31c can be easily formed even in a narrow region between the wiring 40a and the wiring 40b having a distance D of 3 mm or less.
  • a support material for supporting the convex structure portion 30 may be used in addition to the model material that is the material of the convex structure portion 30 itself. That is, the second molding step may include a step of arranging a support material that supports the convex structure portion 30 between the convex structure portion 30 and at least one of the electronic component 20 and the wiring 40. In this case, the support material is preferably left without being removed. By leaving the support material, at least one of the electronic component 20 and the wiring 40 can be protected.
  • FIG. 6 is a cross-sectional view showing a fourth modification of the resin structure.
  • the resin structure in the example illustrated in FIG. 6 is different from the resin structure illustrated in FIG. 3 in that a support portion 50 is provided between the lid portion 32, the electronic component 20, and the wiring 40.
  • the support part 50 is a member that is disposed to support the convex structure part 30 and is not removed when the convex structure part 30 is molded using a 3D printer. By leaving the support part 50 as it is, the electronic component 20 and the wiring 40 are protected.
  • the support material constituting the support part 50 may be the same as or different from the material of the convex structure part 30.
  • the support unit 50 may be made of an uncured resin material.
  • the material of the support part 50 and the material of the convex structure part 30 are the same, only the area
  • an ultraviolet curable resin material is used as the material of the support part 50 and the convex structure part 30, the ultraviolet ray is irradiated only to the region that becomes the convex structure part 30, and the ultraviolet ray is not irradiated to the area that becomes the support part 50.
  • the support part 50 is comprised with the uncured resin material.
  • stress applied to the electronic component 20 and the wiring 40 can be reduced, and damage to the electronic component 20 and disconnection of the wiring 40 can be prevented.
  • the molding method in the first molding step is not limited to this, and may be a molding method using the 3D printer used in the second molding step.
  • the ultraviolet curable resin material for example, digital ABS (manufactured by Stratasys), which is an ink material prepared by kneading acrylonitrile butadiene styrene (ABS) with an ultraviolet curable substance, can be used.
  • digital ABS manufactured by Stratasys
  • ABS acrylonitrile butadiene styrene
  • thermosetting resin material instead of the ultraviolet curable resin material, a thermosetting resin material or a thermoplastic resin material may be used as the model material.
  • the method for manufacturing the resin structure 100 includes the first molding step, the peeling step, the printing step, and the second molding step.
  • the first molding step the electronic component 20 is mounted on the temporary fixing sheet 60, the temporary fixing sheet 60 is disposed in the molding die 70, and the molding die 70 is filled with resin, whereby the electronic component 20 is embedded.
  • the resin molded body 10 is molded.
  • the peeling step the temporary fixing sheet 60 is peeled from the resin molded body 10, thereby exposing the upper surface 11 that is a bonding surface to which the temporarily fixed sheet 60 is bonded in the resin molded body 10.
  • the wiring 40 connected to the electronic component 20 is printed on the upper surface 11.
  • the convex structure 30 constituting the resin having a height of 1 mm or more is molded on the upper surface 11 using a 3D printer.
  • the resin structure 100 having the convex structure portion 30 on the upper surface 11 of the surface of the resin molded body 10 on which the wiring 40 is formed can be easily manufactured.
  • the second molding step is performed separately from the first molding step. Therefore, the degree of freedom of the shape of the resin structure 100 can be increased by combining the resin molded body 10 and the convex structure portions 30a to 30c.
  • the convex structure 30 can be easily formed between two wirings 40 separated by a slight distance D. Therefore, it is possible to increase the degree of freedom of the arrangement and shape of the convex structure portion 30 that is formed avoiding the wiring 40.
  • the resin molded body 10 is molded using a molding die 70. Since the molding die is used, the degree of freedom of the shape of the resin molded body 10 is low, but the material cost can be reduced and the productivity can be increased. Therefore, a large amount of the resin molded body 10 in which the electronic component 20 is embedded and the wiring 40 is formed on the surface is prepared as a common component, and the number, shape, and arrangement location of the convex structure portions 30 are appropriately changed as desired. can do. From the above, it is possible to manufacture a small variety of resin structures 100 at low cost, and it is possible to increase the productivity of the resin structures 100.
  • the step of forming the convex structure portion 30 is repeatedly performed by, for example, applying and curing an ultraviolet curable resin material, a thermosetting resin material, or a thermoplastic resin material to a thickness of 14 to 20 ⁇ m. Thereby, the convex structure part 30 having a height of 1 mm or more can be easily formed.
  • the convex structure portion 30 straddles at least one of the electronic component 20 and the wiring 40. Thereby, at least one of the electronic component 20 and the wiring 40 can be protected by the convex structure 30.
  • the step of forming the convex structure 30 includes a step of arranging a support material that supports the convex structure 30 between the convex structure 30 and at least one of the electronic component 20 and the wiring 40.
  • the support material is left without being removed. Thereby, at least one of the electronic component 20 and the wiring 40 can be protected by the support material.
  • the support material is an uncured resin material. Thereby, the stress added to the electronic component 20 and the wiring 40 can be reduced.
  • the resin structure 100 includes a resin molded body 10 and an electronic component 20 embedded in the resin molded body 10.
  • the surface of the resin molded body 10 has an upper surface 11 that is an exposed surface from which the electronic component 20 is exposed.
  • the resin structure 100 further includes a wiring 40 connected to the electronic component 20 formed on the upper surface 11, and a resin convex structure 30 formed on the upper surface 11 and having a height of 1 mm or more.
  • the convex structure 30 is directly joined to the resin molded body 10. Thereby, the resin structure 100 which has the convex structure part 30 in the surface in which the wiring 40 was formed among the surfaces of the resin molding 10 can be provided.
  • the wiring 40 includes a wiring 40a and a wiring 40b having a distance of 3 mm or less between the wiring 40a.
  • the convex structure portion 30b is located between the wiring 40a and the wiring 40b on the upper surface 11. Thus, the strength can be increased by the convex structure portion 30b even in the interval between the wirings 40a and 40b of 3 mm or less.
  • the convex structure portion 30 includes standing portions 31 a to 31 c formed on the upper surface 11 and a lid portion 32 formed on the standing portions 31 a to 31 c and covering at least one of the electronic component 20 and the wiring 40. Thereby, at least one of the electronic component 20 and the wiring 40 can be protected.
  • the resin structure further includes a support portion 50 that is disposed between the lid portion 32 and at least one of the electronic component 20 and the wiring 40 and supports the lid portion 32. Thereby, at least one of the electronic component 20 and the wiring 40 can be protected from the outside air.
  • the support part is made of uncured resin material. Thereby, the stress applied to at least one of the electronic component 20 and the wiring 40 can be reduced.
  • (Configuration 2) Electronic components (20, 20a to 20e) are mounted on a sheet (60), and an ultraviolet curable resin material and a thermosetting resin are mounted on the electronic components (20, 20a to 20e) mounted on the sheet (60).
  • a step of molding the resin molded body (10) in which the electronic components (20, 20a to 20e) are embedded by repeating a step of applying and curing a material or a thermoplastic resin material to a thickness of 14 to 20 ⁇ m; Peeling the sheet (60) from the resin molded body (10) to expose the bonding surface (11) to which the sheet (60) is bonded in the resin molded body (10); Printing wiring (40, 40a, 40b) connected to the electronic component (20) on the joint surface (11); Forming a resin convex structure (30, 30a to 30c) having a height of 1 mm or more on the joint surface (11) using a 3D printer.
  • the step of forming the convex structure portions (30, 30a to 30c) is performed by repeatedly performing a step of applying and curing an ultraviolet curable resin material, a thermosetting resin material or a thermoplastic resin material to a thickness of 14 to 20 ⁇ m.
  • the step of forming the convex structure portion (30) includes the step between the convex structure portion (30) and at least one of the electronic components (20, 20a to 20e) and the wiring (40, 40a, 40b). Including a step of arranging a support material for supporting the convex structure portion (30), The manufacturing method of the resin structure (100) according to Configuration 4, wherein the support material is left without being removed.
  • the resin structure (100) further includes: Wiring (40, 40a, 40b) connected to the electronic components (20, 20a to 20e) formed on the exposed surface (11);
  • the said convex structure part (30) is a resin structure (100) joined directly with the said resin molding (10).
  • the wiring (40, 40a, 40b) includes a first wiring part (40a) and a second wiring part (40b) having a distance of 3 mm or less between the first wiring part (40a),
  • the convex structure part (30) is formed on the at least one standing part (31a to 31c) formed on the exposed surface (11) and the at least one standing part (31a to 31c),

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  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
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  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

This method for manufacturing a resin structure is provided with: a step for forming a resin molded article having an electronic component embedded therein, by mounting the electronic component on a sheet, disposing the sheet in a molding die, and filling the molding die with a resin; a step for separating the sheet from the resin molded article to thereby expose the joint surface, of the resin molded article, to which the sheet was joined; a step for printing, on the joint surface, wiring to be connected to the electronic component; and a step for forming, on the joint surface, a resin projection structure having a height of 1 mm or more by using a 3D printer.

Description

樹脂構造体の製造方法および樹脂構造体Manufacturing method of resin structure and resin structure
　本発明は、樹脂構造体の製造方法および樹脂構造体に関する。 The present invention relates to a method for producing a resin structure and a resin structure.
　特開２０１０－２７２７５６号公報（特許文献１）には、筐体の一部である樹脂成形品と、電極が露出された状態で樹脂成形品に埋め込まれた電子部品と、電子部品の電極に接続された配線とを備える電子部品実装装置が開示されている。配線は、銀インクによって印刷される。当該電子部品実装装置によれば、従来の樹脂製プリント基板が不要となる。 Japanese Patent Application Laid-Open No. 2010-272756 (Patent Document 1) describes a resin molded product that is a part of a housing, an electronic component that is embedded in the resin molded product with the electrode exposed, and an electrode of the electronic component. An electronic component mounting apparatus including a connected wiring is disclosed. The wiring is printed with silver ink. According to the electronic component mounting apparatus, a conventional resin printed board is not required.
特開２０１０－２７２７５６号公報JP 2010-272756 A
　樹脂成形品を筐体として用いる場合、補強用のリブ、他の部品を組み付けるための突起部、電子部品の上方に空間を形成するための立ち上がり部、フレーム等の凸構造部を樹脂成形品の表面に形成したいという要望がある。しかしながら、特開２０１０－２７２７５６号公報に記載の電子部品実装装置は、電子部品を樹脂成形品に埋め込んだ後に印刷によって配線を形成することにより作製される。そのため、樹脂成形品の表面のうち電子部品が露出する面は、印刷によって配線が形成可能な程度に平らである必要があり、上記の要望に応えることができない。 When a resin molded product is used as a casing, the ribs for reinforcement, protrusions for assembling other components, rising portions for forming a space above the electronic component, and convex structures such as a frame are formed on the resin molded product. There is a desire to form on the surface. However, the electronic component mounting apparatus described in Japanese Patent Application Laid-Open No. 2010-272756 is manufactured by embedding an electronic component in a resin molded product and then forming a wiring by printing. For this reason, the surface of the resin molded product from which the electronic component is exposed needs to be flat to the extent that wiring can be formed by printing, and cannot meet the above requirements.
　配線を形成した後に凸構造部を接着剤で取り付けることが考えられるが、配線を避けて接着剤で所望の位置に凸構造部を取り付けることは困難である。 It is conceivable to attach the convex structure portion with an adhesive after forming the wiring, but it is difficult to avoid the wiring and attach the convex structure portion at a desired position with the adhesive.
　本開示は、上記の問題点に着目してなされたもので、その目的は、樹脂成形体の表面のうち配線が形成された面に凸構造部を有する樹脂構造体の製造方法および樹脂構造体を提供することである。 The present disclosure has been made paying attention to the above-mentioned problems, and the purpose thereof is a method for manufacturing a resin structure having a convex structure portion on a surface of a resin molded body on which wiring is formed, and the resin structure. Is to provide.
　本開示の一例では、樹脂構造体の製造方法は、電子部品をシート上に実装し、シートを成形型内に配置して、成形型内に樹脂を充填させることにより、電子部品が埋設された樹脂成形体を成形する工程と、樹脂成形体からシートを剥離することにより、樹脂成形体においてシートが接合されていた接合面を露出する工程と、接合面上に電子部品に接続する配線を印刷する工程と、接合面上に、３Ｄプリンタを用いて、高さ１ｍｍ以上の樹脂の凸構造部を成形する工程とを備える。 In an example of the present disclosure, a method for manufacturing a resin structure includes mounting an electronic component on a sheet, placing the sheet in a mold, and filling the resin in the mold to embed the electronic component. The step of molding the resin molded body, the step of exposing the bonding surface to which the sheet is bonded in the resin molded body by peeling the sheet from the resin molded body, and the wiring connected to the electronic component are printed on the bonding surface And a step of forming a convex structure portion of resin having a height of 1 mm or more on the joint surface using a 3D printer.
　本開示の一例では、樹脂構造体の製造方法は、電子部品をシート上に実装し、シート上に実装された電子部品上に紫外線硬化樹脂材、熱硬化性樹脂材または熱可塑性樹脂材を厚さ１４～２０μｍに塗布して硬化させる工程を繰り返すことにより、電子部品が埋設された樹脂成形体を成形する工程と、樹脂成形体からシートを剥離することにより、樹脂成形体においてシートが接合されていた接合面を露出する工程と、接合面上に電子部品に接続する配線を印刷する工程と、接合面上に、３Ｄプリンタを用いて、高さ１ｍｍ以上の樹脂の凸構造部を成形する工程とを備える。 In an example of the present disclosure, a method for manufacturing a resin structure includes: mounting an electronic component on a sheet; and thickening an ultraviolet curable resin material, a thermosetting resin material, or a thermoplastic resin material on the electronic component mounted on the sheet. By repeating the steps of coating and curing to a thickness of 14 to 20 μm, the step of molding the resin molded body in which the electronic component is embedded, and the sheet is joined to the resin molded body by peeling the sheet from the resin molded body. The step of exposing the bonded surface, the step of printing the wiring connected to the electronic component on the bonded surface, and the convex structure portion of the resin having a height of 1 mm or more are formed on the bonded surface using a 3D printer. A process.
　この開示によれば、樹脂成形体の表面のうち配線が形成された上面に樹脂の凸構造部を有する樹脂構造体を容易に製造することができる。 According to this disclosure, it is possible to easily manufacture a resin structure having a resin convex structure on the upper surface of the resin molded body on which wiring is formed.
　本開示の一例では、凸構造部を成形する工程は、紫外線硬化樹脂材、熱硬化性樹脂材または熱可塑性樹脂材を厚さ１４～２０μｍに塗布して硬化させる工程を繰り返し行なう。この開示によれば、高さ１ｍｍ以上の凸構造部も容易に成形できる。 In an example of the present disclosure, the step of forming the convex structure portion is repeatedly performed by applying an ultraviolet curable resin material, a thermosetting resin material, or a thermoplastic resin material to a thickness of 14 to 20 μm and curing. According to this disclosure, a convex structure portion having a height of 1 mm or more can be easily formed.
　本開示の一例では、凸構造部は、電子部品および配線の少なくとも一方を跨ぐ。この開示によれば、電子部品および配線の少なくとも一方を、凸構造部によって保護することができる。 In an example of the present disclosure, the convex structure portion straddles at least one of the electronic component and the wiring. According to this disclosure, at least one of the electronic component and the wiring can be protected by the convex structure portion.
　本開示の一例では、凸構造部を成形する工程は、凸構造部と電子部品および配線の少なくとも一方との間に、凸構造部を支持するサポート材を配置する工程を含む。サポート材は、除去されることなく残される。この開示によれば、電子部品および配線の少なくとも一方を、サポート材によって外気から保護することができる。 In an example of the present disclosure, the step of forming the convex structure portion includes a step of disposing a support material that supports the convex structure portion between the convex structure portion and at least one of the electronic component and the wiring. The support material is left without being removed. According to this disclosure, at least one of the electronic component and the wiring can be protected from the outside air by the support material.
　本開示の一例では、サポート材は未硬化の樹脂材である。この開示によれば、電子部品および配線に加わる応力を低減することができる。 In an example of the present disclosure, the support material is an uncured resin material. According to this disclosure, the stress applied to the electronic component and the wiring can be reduced.
　本開示の一例では、樹脂構造体は、樹脂成形体と、樹脂成形体に埋設された電子部品とを備える。樹脂成形体の表面は、電子部品が露出する露出面を有する。樹脂構造体は、さらに、露出面に形成された、電子部品に接続する配線と、露出面に成形された、高さ１ｍｍ以上の樹脂の凸構造部とを備える。凸構造部は、樹脂成形体と直接に接合する。この開示によれば、樹脂成形体の表面のうち配線が形成された面に凸構造部を有する樹脂構造体を提供できる。 In an example of the present disclosure, the resin structure includes a resin molded body and an electronic component embedded in the resin molded body. The surface of the resin molded body has an exposed surface from which the electronic component is exposed. The resin structure further includes wiring connected to the electronic component formed on the exposed surface, and a resin convex structure having a height of 1 mm or more formed on the exposed surface. The convex structure portion is directly joined to the resin molded body. According to this disclosure, it is possible to provide a resin structure having a convex structure portion on the surface of the resin molded body on which the wiring is formed.
　本開示の一例では、配線は、第１配線部と、第１配線部との間隔が３ｍｍ以内の第２配線部とを含む。凸構造部の少なくとも一部は、露出面における第１配線部と第２配線部との間に位置する。この開示によれば、第１配線部と第２配線部との３ｍｍ以下の間隔においても、凸構造部によって強度を高めることができる。 In an example of the present disclosure, the wiring includes a first wiring part and a second wiring part having a distance of 3 mm or less between the first wiring part. At least a part of the convex structure portion is located between the first wiring portion and the second wiring portion on the exposed surface. According to this disclosure, the strength can be increased by the convex structure portion even at an interval of 3 mm or less between the first wiring portion and the second wiring portion.
　本開示の一例では、凸構造部は、露出面上に成形された少なくとも１つの立設部と、少なくとも１つの立設部上に成形され、電子部品および配線の少なくとも一方を覆う蓋部とを含む。この開示によれば、電子部品および配線の少なくとも一方を保護することができる。 In an example of the present disclosure, the convex structure portion includes at least one standing portion formed on the exposed surface and a lid portion formed on at least one standing portion and covering at least one of the electronic component and the wiring. Including. According to this disclosure, at least one of the electronic component and the wiring can be protected.
　本開示の一例では、蓋部と電子部品および配線の少なくとも一方との間に配置され、蓋部を支持するサポート部をさらに備える。この開示によれば、電子部品および配線の少なくとも一方を外気から保護することができる。 In an example of the present disclosure, the display device further includes a support portion that is disposed between the lid portion and at least one of the electronic component and the wiring and supports the lid portion. According to this disclosure, at least one of the electronic component and the wiring can be protected from the outside air.
　本開示の一例では、サポート部は未硬化の樹脂材で構成される。電子部品および配線の少なくとも一方に加わる応力を低減することができる。 In an example of the present disclosure, the support portion is made of an uncured resin material. Stress applied to at least one of the electronic component and the wiring can be reduced.
　本開示によれば、樹脂成形体の表面のうち配線が形成された面に凸構造部を有する樹脂構造体を製造できる。 According to the present disclosure, it is possible to manufacture a resin structure having a convex structure portion on the surface of the resin molded body on which the wiring is formed.
本実施形態に係る樹脂構造体の製造方法を示す図である。It is a figure which shows the manufacturing method of the resin structure which concerns on this embodiment. 樹脂構造体の一例を示す斜視図である。It is a perspective view which shows an example of a resin structure. 樹脂構造体の第１の変形例を示す断面図である。It is sectional drawing which shows the 1st modification of a resin structure. 樹脂構造体の第２の変形例を示す断面図である。It is sectional drawing which shows the 2nd modification of a resin structure. 樹脂構造体の第３の変形例を示す断面図である。It is sectional drawing which shows the 3rd modification of a resin structure. 樹脂構造体の第４の変形例を示す断面図である。It is sectional drawing which shows the 4th modification of a resin structure.
　＜適用例＞
　図１を参照して、本発明が適用される場面の一例について説明する。図１は、本実施形態に係る樹脂構造体の製造方法を示す図である。図１（ａ）の左側には製造過程で得られる第１中間体の平面図が示され、図１（ａ）の右側には第１中間体の側面図が示される。図１（ｂ）には、製造過程で得られる第２中間体の断面図が示される。図１（ｃ）の左側には製造過程で得られる第３中間体の平面図が示され、図１（ｃ）の右側には第３中間体のＸ－Ｘ線矢視断面図が示される。図１（ｄ）の左側には製造過程で得られる第４中間体の平面図が示され、図１（ｄ）の右側には第４中間体のＸ－Ｘ線矢視断面図が示される。図１（ｅ）の左側には樹脂構造体１００の平面図が示され、図１（ｅ）の右側には樹脂構造体のＸ－Ｘ線矢視断面図が示される。 <Application example>
An example of a scene to which the present invention is applied will be described with reference to FIG. FIG. 1 is a diagram illustrating a method for manufacturing a resin structure according to the present embodiment. A plan view of the first intermediate body obtained in the manufacturing process is shown on the left side of FIG. 1 (a), and a side view of the first intermediate body is shown on the right side of FIG. 1 (a). FIG. 1B shows a cross-sectional view of the second intermediate obtained in the manufacturing process. A plan view of the third intermediate obtained in the manufacturing process is shown on the left side of FIG. 1 (c), and a cross-sectional view of the third intermediate taken along the line XX is shown on the right side of FIG. 1 (c). . A plan view of the fourth intermediate obtained in the manufacturing process is shown on the left side of FIG. 1D, and a cross-sectional view taken along line XX of the fourth intermediate is shown on the right side of FIG. . A plan view of the resin structure 100 is shown on the left side of FIG. 1 (e), and a cross-sectional view taken along line XX of the resin structure is shown on the right side of FIG. 1 (e).
　図１に示す例では、電子部品２０が埋設された樹脂成形体１０と、樹脂成形体１０の上面１１に形成された配線４０と、樹脂成形体１０の上面１１に形成された高さ１ｍｍ以上の樹脂の凸構造部３０ａ～３０ｃとを備える樹脂構造体１００が製造される。 In the example shown in FIG. 1, the resin molded body 10 in which the electronic component 20 is embedded, the wiring 40 formed on the upper surface 11 of the resin molded body 10, and the height of 1 mm or more formed on the upper surface 11 of the resin molded body 10. The resin structure 100 including the resin convex structure portions 30a to 30c is manufactured.
　まず図１（ａ）（ｂ）に示されるように、電子部品２０を仮固定シート６０上に実装し、仮固定シート６０を成形型７０内に配置して、成形型７０内に樹脂を充填させる第１成形工程が行なわれる。これにより、電子部品２０が埋設された樹脂成形体１０（図１（ｃ）参照）が成形される。 First, as shown in FIGS. 1A and 1B, the electronic component 20 is mounted on the temporary fixing sheet 60, the temporary fixing sheet 60 is disposed in the molding die 70, and the molding die 70 is filled with resin. A first forming step is performed. Thereby, the resin molding 10 (refer FIG.1 (c)) by which the electronic component 20 was embed | buried is shape | molded.
　次に図１（ｃ）に示されるように、樹脂成形体１０から仮固定シート６０を剥離することにより、樹脂成形体１０において仮固定シート６０が接合されていた接合面である上面１１を露出する剥離工程が行なわれる。電子部品２０は、上面１１から露出する。 Next, as shown in FIG. 1 (c), the upper surface 11, which is a bonding surface to which the temporarily fixed sheet 60 is bonded, is exposed in the resin molded body 10 by peeling the temporarily fixed sheet 60 from the resin molded body 10. A peeling process is performed. The electronic component 20 is exposed from the upper surface 11.
　次に図１（ｄ）に示されるように、上面１１上に電子部品２０に接続する配線４０を印刷する印刷工程が行なわれる。その後、図１（ｅ）に示されるように、上面１１上に、３Ｄプリンタを用いて、高さＨが１ｍｍ以上の樹脂の凸構造部３０ａ～３０ｃを成形する第２成形工程が行なわれる。 Next, as shown in FIG. 1 (d), a printing process for printing the wiring 40 connected to the electronic component 20 on the upper surface 11 is performed. Thereafter, as shown in FIG. 1 (e), a second molding step is performed on the upper surface 11 using a 3D printer to mold the resin convex structures 30a to 30c having a height H of 1 mm or more.
　上記の製造方法によれば、樹脂成形体１０の表面のうち配線４０が形成された上面１１に凸構造部３０を有する樹脂構造体１００を容易に製造することができる。 According to the above manufacturing method, the resin structure 100 having the convex structure portion 30 on the upper surface 11 of the surface of the resin molded body 10 on which the wiring 40 is formed can be easily manufactured.
　＜具体例＞
　（樹脂構造体の構成）
　以下に、本実施の形態に係る樹脂構造体１００の製造方法と樹脂構造体１００との詳細を説明する。図２は、樹脂構造体１００の一例を示す斜視図である。図２に示されるように、樹脂構造体１００は、樹脂成形体１０と、電子部品２０ａ～２０ｅと、配線４０と、凸構造部３０ａ～３０ｃとを備える。 <Specific example>
(Configuration of resin structure)
Below, the manufacturing method of the resin structure 100 which concerns on this Embodiment, and the detail of the resin structure 100 are demonstrated. FIG. 2 is a perspective view showing an example of the resin structure 100. As shown in FIG. 2, the resin structure 100 includes a resin molded body 10, electronic components 20a to 20e, wirings 40, and convex structure portions 30a to 30c.
　樹脂成形体１０は、たとえばポリカーボネイト（ＰＣ）、アクリロニトリルブタジエンスチレン（ＡＢＳ）、ポリアミド（ＰＡ）等の樹脂からなる。ただし、樹脂成形体１０の材質は、特に限定されるものではない。樹脂成形体１０の表面は、たとえば矩形状の平らな上面１１を有する。 The resin molded body 10 is made of a resin such as polycarbonate (PC), acrylonitrile butadiene styrene (ABS), polyamide (PA), or the like. However, the material of the resin molded body 10 is not particularly limited. The surface of the resin molded body 10 has, for example, a rectangular flat upper surface 11.
　電子部品２０ａ～２０ｅは、たとえば受動部品（抵抗、コンデンサ等）、能動部品（ＬＳＩ（Large-Scale　Integration）、ＩＣ（Integrated　Circuit）、パワートランジスタ等）、電源装置（電池等）、表示装置（ＬＥＤ（Light　Emitting　Diode）等）、センサ、スイッチ等から選択される部品である。電子部品２０ａ～２０ｅは、電極２１ａ～２１ｅをそれぞれ有する。電子部品２０ａ～２０ｅの各々は複数の電極を有するが、図中には当該複数の電極のうちの一つにのみ符号を付している。たとえば、チップ型の電子部品２０ｃ～２０ｅは２つの電極２１ｃ～２１ｅをそれぞれ有する。たとえばＩＣである電子部品２０ａ，２０ｂは４つの電極２１ａ，２１ｂをそれぞれ有する。以下では、電子部品２０ａ～２０ｅを特に区別しない場合、電子部品２０ａ～２０ｅの各々を「電子部品２０」という。電極２１ａ～２１ｅを特に区別しない場合、電極２１ａ～２１ｅの各々を「電極２１」という。 The electronic components 20a to 20e are, for example, passive components (resistors, capacitors, etc.), active components (LSI (Large-Scale Integration), IC (Integrated Circuit), power transistors, etc.), power supply devices (batteries, etc.), display devices (LEDs) (Light Emitting Diode, etc.), parts selected from sensors, switches, etc. The electronic components 20a to 20e have electrodes 21a to 21e, respectively. Each of the electronic components 20a to 20e has a plurality of electrodes. In the figure, only one of the plurality of electrodes is given a reference numeral. For example, the chip-type electronic components 20c to 20e have two electrodes 21c to 21e, respectively. For example, electronic components 20a and 20b, which are ICs, have four electrodes 21a and 21b, respectively. Hereinafter, when the electronic components 20a to 20e are not particularly distinguished, each of the electronic components 20a to 20e is referred to as an “electronic component 20”. When the electrodes 21a to 21e are not particularly distinguished, each of the electrodes 21a to 21e is referred to as an “electrode 21”.
　電子部品２０は、樹脂成形体１０の上面１１から露出するように、樹脂成形体１０に埋設される。樹脂成形体１０の上面１１は、電子部品２０が露出する露出面である。このとき、電極２１も樹脂成形体１０の上面１１から露出する。電子部品２０の表面のうち樹脂成形体１０から露出する面は、樹脂成形体１０の上面１１と連続する。ここで、２つの面が「連続する」とは、当該２つの面の間の段差が、その上に形成される配線４０が切断しない程度に小さいことを意味する。 The electronic component 20 is embedded in the resin molded body 10 so as to be exposed from the upper surface 11 of the resin molded body 10. The upper surface 11 of the resin molded body 10 is an exposed surface from which the electronic component 20 is exposed. At this time, the electrode 21 is also exposed from the upper surface 11 of the resin molded body 10. Of the surface of the electronic component 20, the surface exposed from the resin molded body 10 is continuous with the upper surface 11 of the resin molded body 10. Here, “the two surfaces are“ continuous ”” means that the step between the two surfaces is so small that the wiring 40 formed thereon is not cut.
　配線４０は、たとえば銀等の金属で構成される。配線４０の厚みは特に限定されず、たとえば１～５μｍである。配線４０は、樹脂成形体１０の上面１１上に形成され、電子部品２０ａ～２０ｅの電極２１ａ～２１ｅのいずれかと接続する。たとえば、配線４０の一部である配線４０ａは、電子部品２０ａの電極２１ｂと電子部品２０ｃの電極２１ｃと電子部品２０ｄの電極２１ｄとに接続する。配線４０の一部である配線４０ｂは、電子部品２０ａの電極２１ｂと電子部品２０ｃの電極２１ｃとに接続する。これにより、複数の電子部品２０同士が電気的に接続される。その結果、電子部品２０と配線４０とによって電子回路が構成される。 The wiring 40 is made of a metal such as silver. The thickness of the wiring 40 is not particularly limited and is, for example, 1 to 5 μm. The wiring 40 is formed on the upper surface 11 of the resin molded body 10, and is connected to one of the electrodes 21a to 21e of the electronic components 20a to 20e. For example, the wiring 40a which is a part of the wiring 40 is connected to the electrode 21b of the electronic component 20a, the electrode 21c of the electronic component 20c, and the electrode 21d of the electronic component 20d. The wiring 40b which is a part of the wiring 40 is connected to the electrode 21b of the electronic component 20a and the electrode 21c of the electronic component 20c. Thereby, the some electronic components 20 are electrically connected. As a result, the electronic component 20 and the wiring 40 constitute an electronic circuit.
　配線４０は、たとえばインクジェット印刷法やスクリーン印刷法を用いて液状の導電性インク（たとえば、銀（Ａｇ）ナノインク）を樹脂成形体１０の上面１１に塗布することにより、容易に形成される。 The wiring 40 is easily formed by applying liquid conductive ink (for example, silver (Ag) nano ink) to the upper surface 11 of the resin molded body 10 by using, for example, an ink jet printing method or a screen printing method.
　凸構造部３０ａ～３０ｃは、３Ｄプリンタを用いて、樹脂成形体１０の上面１１上に成形される。以下では、凸構造部３０ａ～３０ｃを特に区別しない場合、凸構造部３０ａ～３０ｃの各々を「凸構造部３０」という。凸構造部３０は、高さＨが１ｍｍ以上である。なお、凸構造部３０ａ～３０ｃの高さは、互いに同一であってもよいし、互いに異なっていてもよい。凸構造部３０は、３Ｄプリンタを用いて成形されるため、接着剤を用いることなく、樹脂成形体１０と直接に接合する。 The convex structure portions 30a to 30c are molded on the upper surface 11 of the resin molded body 10 using a 3D printer. Hereinafter, when the convex structure portions 30a to 30c are not particularly distinguished, each of the convex structure portions 30a to 30c is referred to as a “convex structure portion 30”. The convex structure part 30 has a height H of 1 mm or more. The heights of the convex structure portions 30a to 30c may be the same as each other or different from each other. Since the convex structure portion 30 is molded using a 3D printer, the convex structure portion 30 is directly bonded to the resin molded body 10 without using an adhesive.
　凸構造部３０は、電子部品２０または配線４０の直上に成形されてもよいし、電子部品２０および配線４０を避けて成形されてもよい。ただし、凸構造部３０は、電子部品２０および配線４０を避けて成形されることが好ましい。これにより、凸構造部３０の成形時の応力によって、電子部品２０の破損または配線４０の断線を防止できる。 The convex structure portion 30 may be molded directly above the electronic component 20 or the wiring 40 or may be molded avoiding the electronic component 20 and the wiring 40. However, it is preferable that the convex structure portion 30 is molded avoiding the electronic component 20 and the wiring 40. Thereby, the damage of the electronic component 20 or the disconnection of the wiring 40 can be prevented by the stress at the time of forming the convex structure portion 30.
　凸構造部３０は、配線４０間のわずかな隙間に成形されてもよい。たとえば、凸構造部３０ｂは、配線４０ａと、配線４０ａとの間隔Ｄが３ｍｍ以内の配線４０ｂとの間に位置してもよい。３Ｄプリンタを用いることにより、このようなわずかな間隔にも凸構造部３０ｂを成形することができる。 The convex structure portion 30 may be formed in a slight gap between the wirings 40. For example, the convex structure part 30b may be located between the wiring 40a and the wiring 40b whose distance D between the wiring 40a is 3 mm or less. By using a 3D printer, the convex structure portion 30b can be formed even at such a small interval.
　凸構造部３０は、目的に応じた形状を有する。たとえば、凸構造部３０ａは、電子部品２０および配線４０の取り囲むフレームの一部として構成されるように、突条に形成される。凸構造部３０ｂは、樹脂成形体１０の強度を確保する目的のために形成され、直方体形状を有する。凸構造部３０ｃは、雄ねじが螺合される目的のために形成され、円柱形状を有する。 The convex structure part 30 has a shape according to the purpose. For example, the convex structure portion 30 a is formed on a ridge so as to be configured as a part of a frame surrounding the electronic component 20 and the wiring 40. The convex structure part 30b is formed for the purpose of ensuring the strength of the resin molded body 10, and has a rectangular parallelepiped shape. The convex structure portion 30c is formed for the purpose of screwing a male screw and has a cylindrical shape.
　（樹脂構造体の製造方法）
　次に図１を参照して、樹脂構造体１００の製造方法の詳細について説明する。上述したように、樹脂構造体１００は、第１成形工程、剥離工程、印刷工程および第２成形工程によって製造される。 (Production method of resin structure)
Next, with reference to FIG. 1, the detail of the manufacturing method of the resin structure 100 is demonstrated. As described above, the resin structure 100 is manufactured by the first molding process, the peeling process, the printing process, and the second molding process.
　　（第１成形工程）
　図１（ａ）に示されるように、電子部品２０が接着剤（図示せず）を用いて仮固定シート６０に貼り付けられる。このとき、電極２１が仮固定シート６０に接触するように、電子部品２０は仮固定シート６０に貼り付けられる。 (First molding process)
As shown in FIG. 1A, the electronic component 20 is attached to the temporary fixing sheet 60 using an adhesive (not shown). At this time, the electronic component 20 is affixed to the temporarily fixing sheet 60 so that the electrode 21 contacts the temporarily fixing sheet 60.
　仮固定シート６０の材料としては、たとえば、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）、ポリフェニレンサルファイド（ＰＰＳ）等を用いることができる。仮固定シート６０は、紫外線を透過する材料からなっていることが好ましい。 As a material of the temporary fixing sheet 60, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), or the like can be used. The temporary fixing sheet 60 is preferably made of a material that transmits ultraviolet rays.
　仮固定シート６０への電子部品２０の貼り付けは、たとえば、仮固定シート６０に塗布した紫外線硬化型の接着剤（図示せず）を用いて行なうことができる。たとえば、厚さ５０μｍの透明ＰＥＴ製の仮固定シート６０の一方の面に、紫外線硬化型の接着剤を２～３μｍの厚さで塗布する。この塗布は、たとえばインクジェット印刷法などの方法を用いて行なわれる。その後、電子部品２０を所定位置に置く。仮固定シート６０の他方の面（つまり、電子部品２０が載置された面とは反対側の面）から、たとえば３０００ｍＪ／ｃｍ２の強度の紫外線を照射することにより、接着剤が硬化し、電子部品２０が仮固定シート６０に貼り付けられる。 The electronic component 20 can be attached to the temporarily fixed sheet 60 using, for example, an ultraviolet curable adhesive (not shown) applied to the temporarily fixed sheet 60. For example, an ultraviolet curable adhesive is applied to one surface of a temporary fixing sheet 60 made of transparent PET having a thickness of 50 μm to a thickness of 2 to 3 μm. This application is performed using a method such as an inkjet printing method. Thereafter, the electronic component 20 is placed at a predetermined position. By irradiating UV light having an intensity of, for example, 3000 mJ / cm 2 from the other surface of the temporary fixing sheet 60 (that is, the surface opposite to the surface on which the electronic component 20 is placed), the adhesive is cured, The electronic component 20 is affixed to the temporary fixing sheet 60.
　次に図１（ｂ）に示されるように、仮固定シート６０が成形型７０内に配置される。成形型７０は、第１成形型７０ａと第２成形型７０ｂとから構成され、第１成形型７０ａと第２成形型７０ｂとの間に空間７０ｃが形成される。仮固定シート６０の電子部品２０が貼り付けられていない側の面が第１成形型７０ａの平らな内面に接するように、仮固定シート６０は、成形型７０内に配置される。そのため、仮固定シート６０の電子部品２０が貼り付けられた面と第２成形型７０ｂとの間に空間７０ｃが形成される。 Next, as shown in FIG. 1 (b), the temporarily fixing sheet 60 is placed in the mold 70. The mold 70 includes a first mold 70a and a second mold 70b, and a space 70c is formed between the first mold 70a and the second mold 70b. The temporarily fixed sheet 60 is disposed in the mold 70 such that the surface of the temporarily fixed sheet 60 on which the electronic component 20 is not attached is in contact with the flat inner surface of the first mold 70 a. Therefore, a space 70c is formed between the surface of the temporary fixing sheet 60 on which the electronic component 20 is attached and the second molding die 70b.
　成形型７０内の空間７０ｃに溶融樹脂を射出する。樹脂は、電子部品２０を囲むように充填される。これにより、電子部品２０が埋設された樹脂成形体１０が成形される（図１（ｃ）参照）。 The molten resin is injected into the space 70c in the mold 70. The resin is filled so as to surround the electronic component 20. Thereby, the resin molding 10 in which the electronic component 20 is embedded is molded (see FIG. 1C).
　樹脂の射出成形を行なう条件は、樹脂の材料に応じて適宜選択される。たとえば、アクリロニトリルブタジエンスチレン（ＡＢＳ）を用いる場合には、射出樹脂温度２７０℃、射出圧力１００ＭＰａで射出成形を行なう。 Resin injection molding conditions are appropriately selected according to the resin material. For example, when acrylonitrile butadiene styrene (ABS) is used, injection molding is performed at an injection resin temperature of 270 ° C. and an injection pressure of 100 MPa.
　　（剥離工程）
　次に図１（ｃ）に示されるように、成形型７０から取り出された樹脂成形体１０から仮固定シート６０を剥離する。仮固定シート６０を剥離することにより、樹脂成形体１０の上面１１が露出する。上面１１は、仮固定シート６０に接合していた接合面である。上記の第１成形工程において、電極２１が仮固定シート６０に接触するように、電子部品２０が仮固定シート６０に貼り付けられる。そのため、電子部品２０の電極２１は、樹脂成形体１０の上面１１から露出し、上面１１と連続する。 (Peeling process)
Next, as shown in FIG. 1C, the temporary fixing sheet 60 is peeled from the resin molded body 10 taken out from the molding die 70. By peeling off the temporarily fixing sheet 60, the upper surface 11 of the resin molded body 10 is exposed. The upper surface 11 is a bonding surface that has been bonded to the temporary fixing sheet 60. In the first forming step, the electronic component 20 is attached to the temporarily fixed sheet 60 so that the electrode 21 contacts the temporarily fixed sheet 60. Therefore, the electrode 21 of the electronic component 20 is exposed from the upper surface 11 of the resin molded body 10 and is continuous with the upper surface 11.
　　（印刷工程）
　次に図１（ｄ）に示されるように、たとえばインクジェット印刷機を用いて、樹脂成形体１０の上面１１に導電性の銀ナノインクを噴射することにより、配線４０を形成する。配線４０の形成は、スクリーン印刷法等を用いて行なわれてもよい。 (Printing process)
Next, as illustrated in FIG. 1D, the wiring 40 is formed by ejecting conductive silver nano-ink onto the upper surface 11 of the resin molded body 10 using, for example, an ink jet printer. The formation of the wiring 40 may be performed using a screen printing method or the like.
　　（第２成形工程）
　最後に図１（ｅ）に示されるように、樹脂成形体１０における配線４０が形成された上面１１上に、凸構造部３０ａ～３０ｃが成形される。凸構造部３０ａ～３０ｃは、３Ｄプリンタを用いて成形される。たとえば、モデル材である紫外線硬化樹脂材を厚さ１４μｍ～２０μｍ程度に塗布して紫外線硬化させる工程を規定の高さＨになるまで繰り返し行なう。これにより、紫外線硬化樹脂材からなる層が積層された凸構造部３０ａ～３０ｃが成形される。紫外線硬化樹脂材として、たとえば、アクリロニトリルブタジエンスチレン（ＡＢＳ）に紫外線硬化物質を混練して作製したインク材であるデジタルＡＢＳ（ストラタシス社製）を用いることができる。 (Second molding step)
Finally, as shown in FIG. 1E, the convex structure portions 30a to 30c are formed on the upper surface 11 of the resin molded body 10 on which the wiring 40 is formed. The convex structure portions 30a to 30c are formed using a 3D printer. For example, a process of applying a UV curable resin material, which is a model material, to a thickness of about 14 μm to 20 μm and curing it by UV is repeatedly performed until a predetermined height H is reached. Thereby, the convex structure portions 30a to 30c in which layers made of the ultraviolet curable resin material are laminated are formed. As the ultraviolet curable resin material, for example, digital ABS (manufactured by Stratasys), which is an ink material prepared by kneading an ultraviolet curable substance with acrylonitrile butadiene styrene (ABS), can be used.
　あるいは、紫外線硬化樹脂材の代わりに、熱硬化性樹脂材または熱可塑性樹脂材をモデル材として用いてもよい。たとえば、溶融したＡＢＳを厚さ１４μｍ～２０μｍ程度に塗布して冷却硬化させる工程を規定の高さＨになるまで繰り返して行なってよい。 Alternatively, a thermosetting resin material or a thermoplastic resin material may be used as a model material instead of the ultraviolet curable resin material. For example, the process of applying the melted ABS to a thickness of about 14 μm to 20 μm and cooling and curing may be repeated until a predetermined height H is reached.
　凸構造部３０ａ～３０ｃは、樹脂成形体１０の上面１１上に直接に成形され、樹脂成形体１０と接合する。凸構造部３０ａ～３０ｃを構成する樹脂は、樹脂成形体１０を構成する樹脂と同一であることが好ましい。もしくは、凸構造部３０ａ～３０ｃの主成分は、樹脂成形体１０の主成分と同一であることが好ましい。主成分とは、５０体積％以上を占める成分である。これにより、凸構造部３０ａ～３０ｃと樹脂成形体１０との接合強度を高めることができる。 The convex structure portions 30 a to 30 c are directly molded on the upper surface 11 of the resin molded body 10 and joined to the resin molded body 10. The resin constituting the convex structure portions 30 a to 30 c is preferably the same as the resin constituting the resin molded body 10. Alternatively, the main component of the convex structure portions 30 a to 30 c is preferably the same as the main component of the resin molded body 10. A main component is a component which occupies 50 volume% or more. Thereby, the joint strength between the convex structure portions 30a to 30c and the resin molded body 10 can be increased.
　凸構造部３０ａ～３０ｃは、上面１１上において、電子部品２０および配線４０を避けて成形されることが好ましい。樹脂成形体１０に埋設された電子部品２０の直上あるいは配線４０の直上に凸構造部３０ａ～３０ｃが成形されることを回避することで、電子部品２０の機械的破損あるいは配線４０の断線を防止できる。 The convex structure portions 30 a to 30 c are preferably formed on the upper surface 11 while avoiding the electronic component 20 and the wiring 40. By preventing the convex structure portions 30a to 30c from being formed immediately above the electronic component 20 embedded in the resin molded body 10 or directly above the wiring 40, mechanical damage of the electronic component 20 or disconnection of the wiring 40 is prevented. it can.
　凸構造部３０ａ～３０ｃは、３Ｄプリンタによって成形されるため、上面１１上の配線４０間の狭い領域にも成形される。たとえば、凸構造部３０ｂは、間隔Ｄが３ｍｍ以下の配線４０ａと配線４０ｂとの間に成形される。間隔Ｄは、１ｍｍ以下であってよい。２００μｍ以上の間隔Ｄの配線間の領域であれば、３Ｄプリンタを用いて、高さ１ｍｍ以上の凸構造部３０を成形できる。 Since the convex structure portions 30a to 30c are formed by a 3D printer, they are also formed in a narrow region between the wirings 40 on the upper surface 11. For example, the convex structure portion 30b is formed between the wiring 40a and the wiring 40b having a distance D of 3 mm or less. The interval D may be 1 mm or less. If it is the area | region between the wiring of the space | interval D of 200 micrometers or more, the convex structure part 30 with a height of 1 mm or more can be shape | molded using a 3D printer.
　＜変形例＞
　（凸構造部の変形例）
　凸構造部３０は、図１に示す形状に限定されず、様々な形状を取り得る。図３は、樹脂構造体の第１の変形例を示す断面図である。図４は、樹脂構造体の第２の変形例を示す断面図である。図５は、樹脂構造体の第３の変形例を示す断面図である。 <Modification>
(Modified example of convex structure)
The convex structure part 30 is not limited to the shape shown in FIG. 1, and can take various shapes. FIG. 3 is a cross-sectional view showing a first modification of the resin structure. FIG. 4 is a cross-sectional view showing a second modification of the resin structure. FIG. 5 is a cross-sectional view showing a third modification of the resin structure.
　図３に示す樹脂構造体のように、凸構造部３０は、電子部品２０および配線４０を跨ぐように成形されてもよい。すなわち、樹脂成形体１０の上面１１に成形された立設部３１ａ，３１ｂと、立設部３１ａ，３１ｂ上に成形され、電子部品２０および配線４０を覆う蓋部３２とを含む。これにより、電子部品２０および配線４０が外部装置と接触することを避けることができ、電子部品２０および配線４０を保護することができる。なお、凸構造部３０は、電子部品２０および配線４０のいずれか一方のみを跨ぐように成形されてもよい。 As in the resin structure shown in FIG. 3, the convex structure 30 may be formed so as to straddle the electronic component 20 and the wiring 40. That is, it includes standing portions 31 a and 31 b formed on the upper surface 11 of the resin molded body 10 and a lid portion 32 formed on the standing portions 31 a and 31 b and covering the electronic component 20 and the wiring 40. Thereby, it can avoid that the electronic component 20 and the wiring 40 contact an external device, and the electronic component 20 and the wiring 40 can be protected. In addition, the convex structure part 30 may be shape | molded so that only any one of the electronic component 20 and the wiring 40 may be straddled.
　図４に示す樹脂構造体のように、図３に示す立設部３１ａを省略し、蓋部３２と樹脂成形体１０との間に開口が形成されていてもよい。これによっても、蓋部３２が電子部品２０および配線４０を覆うため、電子部品２０および配線４０を保護することができる。 4, the standing portion 31a shown in FIG. 3 may be omitted, and an opening may be formed between the lid portion 32 and the resin molded body 10. Also by this, since the cover part 32 covers the electronic component 20 and the wiring 40, the electronic component 20 and the wiring 40 can be protected.
　図５に示す樹脂構造体のように、凸構造部３０は、立設部３１ａ，３１ｂの他に、立設部３１ａ，３１ｂの間に成形された立設部３１ｃを含んでもよい。蓋部３２は、立設部３１ａ～３１ｃの上に成形される。立設部３１ａと立設部３１ｂとの距離が長い場合に、立設部３１ａと立設部３１ｂとの間に立設部３１ｃを成形することにより、蓋部３２の撓みを抑制することができる。図５に示す例では、立設部３１ｃは、配線４０ａと配線４０ｂとの間に位置する。配線４０ａと配線４０ｂとの間隔Ｄが２００μｍ以上であれば、３Ｄプリンタを用いて配線４０ａと配線４０ｂとの間に立設部３１ｃを容易に成形できる。たとえば、間隔Ｄが３ｍｍ以下の配線４０ａと配線４０ｂとの間の狭い領域にも立設部３１ｃを容易に成形できる。 As in the resin structure shown in FIG. 5, the convex structure portion 30 may include a standing portion 31 c formed between the standing portions 31 a and 31 b in addition to the standing portions 31 a and 31 b. The lid portion 32 is formed on the standing portions 31a to 31c. When the distance between the standing portion 31a and the standing portion 31b is long, the bending of the lid portion 32 can be suppressed by forming the standing portion 31c between the standing portion 31a and the standing portion 31b. it can. In the example shown in FIG. 5, the standing portion 31c is located between the wiring 40a and the wiring 40b. If the distance D between the wiring 40a and the wiring 40b is 200 μm or more, the standing portion 31c can be easily formed between the wiring 40a and the wiring 40b using a 3D printer. For example, the standing portion 31c can be easily formed even in a narrow region between the wiring 40a and the wiring 40b having a distance D of 3 mm or less.
　３Ｄプリンタを用いて凸構造部３０を成形する方法では、凸構造部３０自体の材料となるモデル材の他に、凸構造部３０を支持するためのサポート材を用いてもよい。すなわち、上記の第２成形工程は、凸構造部３０と電子部品２０および配線４０の少なくとも一方との間に、凸構造部３０を支持するサポート材を配置する工程を含んでもよい。この場合、サポート材は、除去されることなく残されることが好ましい。サポート材が残されることにより、電子部品２０および配線４０の少なくとも一方を保護することができる。 In the method of forming the convex structure portion 30 using a 3D printer, a support material for supporting the convex structure portion 30 may be used in addition to the model material that is the material of the convex structure portion 30 itself. That is, the second molding step may include a step of arranging a support material that supports the convex structure portion 30 between the convex structure portion 30 and at least one of the electronic component 20 and the wiring 40. In this case, the support material is preferably left without being removed. By leaving the support material, at least one of the electronic component 20 and the wiring 40 can be protected.
　図６は、樹脂構造体の第４の変形例を示す断面図である。図６に示す例の樹脂構造体は、図３に示す樹脂構造体と比較して、蓋部３２と電子部品２０および配線４０との間にサポート部５０を備える点で相違する。サポート部５０は、３Ｄプリンタを用いて凸構造部３０を成形するときに、凸構造部３０を支持するために配置され、除去されずに残された部材である。サポート部５０がそのまま残されることにより、電子部品２０および配線４０が保護される。 FIG. 6 is a cross-sectional view showing a fourth modification of the resin structure. The resin structure in the example illustrated in FIG. 6 is different from the resin structure illustrated in FIG. 3 in that a support portion 50 is provided between the lid portion 32, the electronic component 20, and the wiring 40. The support part 50 is a member that is disposed to support the convex structure part 30 and is not removed when the convex structure part 30 is molded using a 3D printer. By leaving the support part 50 as it is, the electronic component 20 and the wiring 40 are protected.
　サポート部５０を構成するサポート材は、凸構造部３０の材料と同一であってもよいし、異なってもよい。 The support material constituting the support part 50 may be the same as or different from the material of the convex structure part 30.
　サポート部５０は、未硬化の樹脂材で構成されてもよい。たとえば、サポート部５０の材料と凸構造部３０の材料とが同一である場合、凸構造部３０となる領域のみ硬化させ、サポート部５０となる領域を硬化させない。具体的には、サポート部５０および凸構造部３０の材料として紫外線硬化樹脂材を用いる場合、凸構造部３０となる領域のみ紫外線を照射し、サポート部５０となる領域には紫外線を照射しない。これにより、サポート部５０は未硬化の樹脂材で構成される。サポート部５０を未硬化の樹脂材で構成することにより、電子部品２０および配線４０に加わる応力を低減でき、電子部品２０の破損および配線４０の断線を防止できる。 The support unit 50 may be made of an uncured resin material. For example, when the material of the support part 50 and the material of the convex structure part 30 are the same, only the area | region used as the convex structure part 30 is hardened, and the area | region used as the support part 50 is not hardened. Specifically, when an ultraviolet curable resin material is used as the material of the support part 50 and the convex structure part 30, the ultraviolet ray is irradiated only to the region that becomes the convex structure part 30, and the ultraviolet ray is not irradiated to the area that becomes the support part 50. Thereby, the support part 50 is comprised with the uncured resin material. By configuring the support portion 50 with an uncured resin material, stress applied to the electronic component 20 and the wiring 40 can be reduced, and damage to the electronic component 20 and disconnection of the wiring 40 can be prevented.
　（第１成形工程の変形例）
　上記の説明では、第１成形工程において、仮固定シート６０を成形型７０内に配置して、成形型７０内の空間７０ｃに溶融樹脂を射出することにより樹脂成形体１０を成形する射出成形法を例示した。しかしながら、第１成形工程の成形法は、これに限定されず、第２成形工程で用いた３Ｄプリンタを用いた成形法であってもよい。 (Modification of the first molding step)
In the above description, in the first molding step, an injection molding method in which the temporarily fixed sheet 60 is disposed in the molding die 70 and the resin molded body 10 is molded by injecting molten resin into the space 70c in the molding die 70. Was illustrated. However, the molding method in the first molding step is not limited to this, and may be a molding method using the 3D printer used in the second molding step.
　たとえば、仮固定シート６０に配置された電子部品２０上に、モデル材である紫外線硬化樹脂材を厚さ１４～２０μｍ程度に塗布した後に紫外線硬化させる工程を、樹脂成形体１０の設計形状になるまで繰り返し行なう。これにより、電子部品２０が埋設された樹脂成形体１０を成形できる（図１（ｃ）参照）。 For example, a process of applying an ultraviolet curable resin material as a model material to a thickness of about 14 to 20 μm on the electronic component 20 arranged on the temporary fixing sheet 60 and then curing the ultraviolet ray becomes a design shape of the resin molded body 10. Repeat until. Thereby, the resin molding 10 in which the electronic component 20 is embedded can be molded (see FIG. 1C).
　紫外線硬化樹脂材としては、たとえば、アクリロニトリルブタジエンスチレン（ＡＢＳ）に紫外線硬化物質を混錬して作製されたインク材であるデジタルＡＢＳ（ストラタシス社製）を用いることができる。 As the ultraviolet curable resin material, for example, digital ABS (manufactured by Stratasys), which is an ink material prepared by kneading acrylonitrile butadiene styrene (ABS) with an ultraviolet curable substance, can be used.
　あるいは、紫外線硬化樹脂材の代わりに、熱硬化樹脂材または熱可塑性樹脂材をモデル材として用いてもよい。 Alternatively, instead of the ultraviolet curable resin material, a thermosetting resin material or a thermoplastic resin material may be used as the model material.
　＜作用・効果＞
　以上のように、本実施の形態に係る樹脂構造体１００の製造方法は、第１成形工程と、剥離工程と、印刷工程と、第２成形工程とを備える。第１成形工程は、電子部品２０を仮固定シート６０に実装し、仮固定シート６０を成形型７０内に配置して、成形型７０内に樹脂を充填させることにより、電子部品２０が埋設された樹脂成形体１０を成形する。剥離工程は、樹脂成形体１０から仮固定シート６０を剥離することにより、樹脂成形体１０において仮固定シート６０が接合されていた接合面である上面１１を露出させる。印刷工程は、上面１１上に電子部品２０に接続する配線４０を印刷する。第２成形工程は、上面１１上に、３Ｄプリンタを用いて、高さ１ｍｍ以上の樹脂のを構成する凸構造部３０を成形する。 <Action and effect>
As described above, the method for manufacturing the resin structure 100 according to the present embodiment includes the first molding step, the peeling step, the printing step, and the second molding step. In the first molding step, the electronic component 20 is mounted on the temporary fixing sheet 60, the temporary fixing sheet 60 is disposed in the molding die 70, and the molding die 70 is filled with resin, whereby the electronic component 20 is embedded. The resin molded body 10 is molded. In the peeling step, the temporary fixing sheet 60 is peeled from the resin molded body 10, thereby exposing the upper surface 11 that is a bonding surface to which the temporarily fixed sheet 60 is bonded in the resin molded body 10. In the printing process, the wiring 40 connected to the electronic component 20 is printed on the upper surface 11. In the second molding step, the convex structure 30 constituting the resin having a height of 1 mm or more is molded on the upper surface 11 using a 3D printer.
　上記の製造方法によれば、樹脂成形体１０の表面のうち配線４０が形成された上面１１に凸構造部３０を有する樹脂構造体１００を容易に製造することができる。 According to the above manufacturing method, the resin structure 100 having the convex structure portion 30 on the upper surface 11 of the surface of the resin molded body 10 on which the wiring 40 is formed can be easily manufactured.
　さらに、第２成形工程は、第１成形工程とは別に行なわれる。そのため、樹脂成形体１０と凸構造部３０ａ～３０ｃの組み合わせ方により、樹脂構造体１００の形状の自由度を高めることができる。 Furthermore, the second molding step is performed separately from the first molding step. Therefore, the degree of freedom of the shape of the resin structure 100 can be increased by combining the resin molded body 10 and the convex structure portions 30a to 30c.
　さらに、３Ｄプリンタを用いることにより、わずかな間隔Ｄだけ離れた２つの配線４０間にも凸構造部３０を容易に形成することができる。そのため、配線４０を避けて成形される凸構造部３０の配置および形状の自由度を高めることができる。一方、樹脂成形体１０は、成形型７０を用いて成形される。成形型を用いるため、樹脂成形体１０の形状の自由度は低いが、材料コストを低減できるとともに、生産性を高めることができる。そのため、電子部品２０が埋設され、表面に配線４０が形成される樹脂成形体１０を共通部品として大量に作製しておき、凸構造部３０の個数、形状および配置箇所を要望に応じて適宜変更することができる。以上から、多品種少量の樹脂構造体１００を安価に製造することができるとともに、樹脂構造体１００の生産性を高めることができる。 Furthermore, by using a 3D printer, the convex structure 30 can be easily formed between two wirings 40 separated by a slight distance D. Therefore, it is possible to increase the degree of freedom of the arrangement and shape of the convex structure portion 30 that is formed avoiding the wiring 40. On the other hand, the resin molded body 10 is molded using a molding die 70. Since the molding die is used, the degree of freedom of the shape of the resin molded body 10 is low, but the material cost can be reduced and the productivity can be increased. Therefore, a large amount of the resin molded body 10 in which the electronic component 20 is embedded and the wiring 40 is formed on the surface is prepared as a common component, and the number, shape, and arrangement location of the convex structure portions 30 are appropriately changed as desired. can do. From the above, it is possible to manufacture a small variety of resin structures 100 at low cost, and it is possible to increase the productivity of the resin structures 100.
　凸構造部３０を成形する工程は、たとえば、紫外線硬化樹脂材、熱硬化性樹脂材または熱可塑性樹脂材を厚さ１４～２０μｍに塗布して硬化させる工程を繰り返し行なう。これにより、高さ１ｍｍ以上の凸構造部３０も容易に成形できる。 The step of forming the convex structure portion 30 is repeatedly performed by, for example, applying and curing an ultraviolet curable resin material, a thermosetting resin material, or a thermoplastic resin material to a thickness of 14 to 20 μm. Thereby, the convex structure part 30 having a height of 1 mm or more can be easily formed.
　凸構造部３０は、電子部品２０および配線４０の少なくとも一方を跨ぐ。これにより、電子部品２０および配線４０の少なくとも一方を、凸構造部３０によって保護することができる。 The convex structure portion 30 straddles at least one of the electronic component 20 and the wiring 40. Thereby, at least one of the electronic component 20 and the wiring 40 can be protected by the convex structure 30.
　凸構造部３０を成形する工程は、凸構造部３０と電子部品２０および配線４０の少なくとも一方との間に、凸構造部３０を支持するサポート材を配置する工程を含む。サポート材は、除去されることなく残される。これにより、サポート材によって、電子部品２０および配線４０の少なくとも一方を保護することができる。 The step of forming the convex structure 30 includes a step of arranging a support material that supports the convex structure 30 between the convex structure 30 and at least one of the electronic component 20 and the wiring 40. The support material is left without being removed. Thereby, at least one of the electronic component 20 and the wiring 40 can be protected by the support material.
　サポート材は未硬化の樹脂材である。これにより、電子部品２０および配線４０に加わる応力を低減することができる。 The support material is an uncured resin material. Thereby, the stress added to the electronic component 20 and the wiring 40 can be reduced.
　樹脂構造体１００は、樹脂成形体１０と、樹脂成形体１０に埋設された電子部品２０とを備える。樹脂成形体１０の表面は、電子部品２０が露出する露出面である上面１１を有する。樹脂構造体１００は、さらに、上面１１に形成された、電子部品２０に接続する配線４０と、上面１１に成形された、高さ１ｍｍ以上の樹脂の凸構造部３０とを備える。凸構造部３０は、樹脂成形体１０と直接に接合する。これにより、樹脂成形体１０の表面のうち配線４０が形成された面に凸構造部３０を有する樹脂構造体１００を提供できる。 The resin structure 100 includes a resin molded body 10 and an electronic component 20 embedded in the resin molded body 10. The surface of the resin molded body 10 has an upper surface 11 that is an exposed surface from which the electronic component 20 is exposed. The resin structure 100 further includes a wiring 40 connected to the electronic component 20 formed on the upper surface 11, and a resin convex structure 30 formed on the upper surface 11 and having a height of 1 mm or more. The convex structure 30 is directly joined to the resin molded body 10. Thereby, the resin structure 100 which has the convex structure part 30 in the surface in which the wiring 40 was formed among the surfaces of the resin molding 10 can be provided.
　配線４０は、配線４０ａと、配線４０ａとの間隔が３ｍｍ以内の配線４０ｂとを含む。凸構造部３０ｂは、上面１１における配線４０ａと配線４０ｂとの間に位置する。このように、３ｍｍ以下の配線４０ａ，４０ｂの間隔においても、凸構造部３０ｂによって強度を高めることができる。 The wiring 40 includes a wiring 40a and a wiring 40b having a distance of 3 mm or less between the wiring 40a. The convex structure portion 30b is located between the wiring 40a and the wiring 40b on the upper surface 11. Thus, the strength can be increased by the convex structure portion 30b even in the interval between the wirings 40a and 40b of 3 mm or less.
　凸構造部３０は、上面１１上に成形された立設部３１ａ～３１ｃと、立設部３１ａ～３１ｃ上に成形され、電子部品２０および配線４０の少なくとも一方を覆う蓋部３２とを含む。これにより、電子部品２０および配線４０の少なくとも一方を保護することができる。 The convex structure portion 30 includes standing portions 31 a to 31 c formed on the upper surface 11 and a lid portion 32 formed on the standing portions 31 a to 31 c and covering at least one of the electronic component 20 and the wiring 40. Thereby, at least one of the electronic component 20 and the wiring 40 can be protected.
　樹脂構造体は、蓋部３２と電子部品２０および配線４０の少なくとも一方との間に配置され、蓋部３２を支持するサポート部５０をさらに備える。これにより、電子部品２０および配線４０の少なくとも一方を外気から保護することができる。 The resin structure further includes a support portion 50 that is disposed between the lid portion 32 and at least one of the electronic component 20 and the wiring 40 and supports the lid portion 32. Thereby, at least one of the electronic component 20 and the wiring 40 can be protected from the outside air.
　サポート部は未硬化の樹脂材で構成される。これにより、電子部品２０および配線４０の少なくとも一方に加わる応力を低減することができる。 The support part is made of uncured resin material. Thereby, the stress applied to at least one of the electronic component 20 and the wiring 40 can be reduced.
　＜付記＞
　以下のように、本実施の形態は、以下のような開示を含む。 <Appendix>
As described below, the present embodiment includes the following disclosure.
　（構成１）
　電子部品（２０，２０ａ～２０ｅ）をシート（６０）上に実装し、前記シート（６０）を成形型（７０）内に配置して、前記成形型（７０）内に樹脂を充填させることにより、前記電子部品（２０，２０ａ～２０ｅ）が埋設された樹脂成形体（１０）を成形する工程と、
　前記樹脂成形体（１０）から前記シート（６０）を剥離することにより、前記樹脂成形体（１０）において前記シート（６０）が接合されていた接合面（１１）を露出させる工程と、
　前記接合面（１１）上に前記電子部品（２０）に接続する配線（４０，４０ａ，４０ｂ）を印刷する工程と、
　前記接合面（１１）上に、３Ｄプリンタを用いて、高さ１ｍｍ以上の樹脂の凸構造部（３０，３０ａ～３０ｃ）を成形する工程とを備える、樹脂構造体（１００）の製造方法。 (Configuration 1)
By mounting the electronic components (20, 20a to 20e) on the sheet (60), placing the sheet (60) in the mold (70), and filling the mold (70) with resin. Molding the resin molded body (10) in which the electronic components (20, 20a to 20e) are embedded;
Peeling the sheet (60) from the resin molded body (10) to expose the bonding surface (11) to which the sheet (60) is bonded in the resin molded body (10);
Printing wiring (40, 40a, 40b) connected to the electronic component (20) on the joint surface (11);
Forming a resin convex structure (30, 30a to 30c) having a height of 1 mm or more on the joint surface (11) using a 3D printer.
　（構成２）
　電子部品（２０，２０ａ～２０ｅ）をシート（６０）上に実装し、前記シート（６０）上に実装された前記電子部品（２０，２０ａ～２０ｅ）上に紫外線硬化樹脂材、熱硬化性樹脂材または熱可塑性樹脂材を厚さ１４～２０μｍに塗布して硬化させる工程を繰り返すことにより、前記電子部品（２０，２０ａ～２０ｅ）が埋設された樹脂成形体（１０）を成形する工程と、
　前記樹脂成形体（１０）から前記シート（６０）を剥離することにより、前記樹脂成形体（１０）において前記シート（６０）が接合されていた接合面（１１）を露出させる工程と、
　前記接合面（１１）上に前記電子部品（２０）に接続する配線（４０，４０ａ，４０ｂ）を印刷する工程と、
　前記接合面（１１）上に、３Ｄプリンタを用いて、高さ１ｍｍ以上の樹脂の凸構造部（３０，３０ａ～３０ｃ）を成形する工程とを備える、樹脂構造体（１００）の製造方法。 (Configuration 2)
Electronic components (20, 20a to 20e) are mounted on a sheet (60), and an ultraviolet curable resin material and a thermosetting resin are mounted on the electronic components (20, 20a to 20e) mounted on the sheet (60). A step of molding the resin molded body (10) in which the electronic components (20, 20a to 20e) are embedded by repeating a step of applying and curing a material or a thermoplastic resin material to a thickness of 14 to 20 μm;
Peeling the sheet (60) from the resin molded body (10) to expose the bonding surface (11) to which the sheet (60) is bonded in the resin molded body (10);
Printing wiring (40, 40a, 40b) connected to the electronic component (20) on the joint surface (11);
Forming a resin convex structure (30, 30a to 30c) having a height of 1 mm or more on the joint surface (11) using a 3D printer.
　（構成３）
　前記凸構造部（３０，３０ａ～３０ｃ）を成形する工程は、紫外線硬化樹脂材、熱硬化性樹脂材または熱可塑性樹脂材を厚さ１４～２０μｍに塗布して硬化させる工程を繰り返し行なう、構成１または２に記載の樹脂構造体（１００）の製造方法。 (Configuration 3)
The step of forming the convex structure portions (30, 30a to 30c) is performed by repeatedly performing a step of applying and curing an ultraviolet curable resin material, a thermosetting resin material or a thermoplastic resin material to a thickness of 14 to 20 μm. The manufacturing method of the resin structure (100) of 1 or 2.
　（構成４）
　前記凸構造部（３０）は前記電子部品（２０）および前記配線（４０，４０ａ，４０ｂ）の少なくとも一方を跨ぐ、構成１から３のいずれかに記載の樹脂構造体（１００）の製造方法。 (Configuration 4)
The method of manufacturing a resin structure (100) according to any one of configurations 1 to 3, wherein the convex structure portion (30) straddles at least one of the electronic component (20) and the wiring (40, 40a, 40b).
　（構成５）
　前記凸構造部（３０）を成形する工程は、前記凸構造部（３０）と前記電子部品（２０，２０ａ～２０ｅ）および前記配線（４０，４０ａ，４０ｂ）の少なくとも一方との間に、前記凸構造部（３０）を支持するサポート材を配置する工程を含み、
　前記サポート材は、除去されることなく残される、構成４に記載の樹脂構造体（１００）の製造方法。 (Configuration 5)
The step of forming the convex structure portion (30) includes the step between the convex structure portion (30) and at least one of the electronic components (20, 20a to 20e) and the wiring (40, 40a, 40b). Including a step of arranging a support material for supporting the convex structure portion (30),
The manufacturing method of the resin structure (100) according to Configuration 4, wherein the support material is left without being removed.
　（構成６）
　前記サポート材は未硬化の樹脂材である、構成５に記載の樹脂構造体（１００）の製造方法。 (Configuration 6)
The manufacturing method of the resin structure (100) according to Configuration 5, wherein the support material is an uncured resin material.
　（構成７）
　樹脂成形体（１０）と、
　前記樹脂成形体（１０）に埋設された電子部品（２０，２０ａ～２０ｅ）とを備える樹脂構造体（１００）であって、
　前記樹脂成形体（１０）の表面は、前記電子部品（２０，２０ａ～２０ｅ）が露出する露出面（１１）を有し、
　前記樹脂構造体（１００）は、さらに、
　前記露出面（１１）に形成された、前記電子部品（２０，２０ａ～２０ｅ）に接続する配線（４０，４０ａ，４０ｂ）と、
　前記露出面（１１）に成形された、高さ１ｍｍ以上の樹脂の凸構造部（３０，３０ａ～３０ｃ）とを備え、
　前記凸構造部（３０）は、前記樹脂成形体（１０）と直接に接合する、樹脂構造体（１００）。 (Configuration 7)
A resin molded body (10);
A resin structure (100) comprising electronic components (20, 20a to 20e) embedded in the resin molded body (10),
The surface of the resin molded body (10) has an exposed surface (11) from which the electronic components (20, 20a to 20e) are exposed,
The resin structure (100) further includes:
Wiring (40, 40a, 40b) connected to the electronic components (20, 20a to 20e) formed on the exposed surface (11);
A convex structure portion (30, 30a to 30c) of resin having a height of 1 mm or more formed on the exposed surface (11),
The said convex structure part (30) is a resin structure (100) joined directly with the said resin molding (10).
　（構成８）
　前記配線（４０，４０ａ，４０ｂ）は、第１配線部（４０ａ）と、前記第１配線部（４０ａ）との間隔が３ｍｍ以内の第２配線部（４０ｂ）とを含み、
　前記凸構造部（３０）の少なくとも一部は、前記露出面（１１）における前記第１配線部（４０ａ）と前記第２配線部（４０ｂ）との間に位置する、構成７に記載の樹脂構造体（１００）。 (Configuration 8)
The wiring (40, 40a, 40b) includes a first wiring part (40a) and a second wiring part (40b) having a distance of 3 mm or less between the first wiring part (40a),
The resin according to Configuration 7, wherein at least a part of the convex structure part (30) is located between the first wiring part (40a) and the second wiring part (40b) on the exposed surface (11). Structure (100).
　（構成９）
　前記凸構造部（３０）は、前記露出面（１１）上に成形された少なくとも１つの立設部（３１ａ～３１ｃ）と、前記少なくとも１つの立設部（３１ａ～３１ｃ）上に成形され、前記電子部品（２０，２０ａ～２０ｅ）および前記配線（４０，４０ａ，４０ｂ）の少なくとも一方を覆う蓋部（３２）とを含む、構成７または８に記載の樹脂構造体（１００）。 (Configuration 9)
The convex structure part (30) is formed on the at least one standing part (31a to 31c) formed on the exposed surface (11) and the at least one standing part (31a to 31c), The resin structure (100) according to Configuration 7 or 8, comprising a lid (32) that covers at least one of the electronic component (20, 20a to 20e) and the wiring (40, 40a, 40b).
　（構成１０）
　前記蓋部（３２）と前記電子部品（２０，２０ａ～２０ｅ）および前記配線（４０，４０ａ，４０ｂ）の少なくとも一方との間に配置され、前記蓋部（３２）を支持するサポート部（５０）をさらに備える、構成９に記載の樹脂構造体（１００）。 (Configuration 10)
A support portion (50) disposed between the lid portion (32) and at least one of the electronic components (20, 20a to 20e) and the wiring (40, 40a, 40b) and supporting the lid portion (32). The resin structure (100) according to Configuration 9, further comprising:
　（構成１１）
　前記サポート部（５０）は未硬化の樹脂材で構成される、構成１０に記載の樹脂構造体（１００）。 (Configuration 11)
The resin structure (100) according to Configuration 10, wherein the support part (50) is made of an uncured resin material.
　本発明の実施の形態について説明したが、今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 Although the embodiment of the present invention has been described, it should be considered that the embodiment disclosed this time is illustrative and not restrictive in all respects. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
　１０　樹脂成形体、１１　上面、２０，２０ａ～２０ｅ　電子部品、２１，２１ａ～２１ｅ　電極、３０，３０ａ～３０ｃ　凸構造部、３１ａ～３１ｃ　立設部、３２　蓋部、４０，４０ａ，４０ｂ　配線、５０　サポート部、６０　仮固定シート、７０　成形型、７０ａ　第１成形型、７０ｂ　第２成形型、７０ｃ　空間、１００　樹脂構造体。 10 resin molded body, 11 upper surface, 20, 20a-20e electronic parts, 21, 21a-21e electrodes, 30, 30a-30c convex structure part, 31a-31c standing part, 32 lid part, 40, 40a, 40b wiring, 50 support part, 60 temporary fixing sheet, 70 mold, 70a first mold, 70b second mold, 70c space, 100 resin structure.

Claims (11)

  1. 　電子部品をシート上に実装し、前記シートを成形型内に配置して、前記成形型内に樹脂を充填させることにより、前記電子部品が埋設された樹脂成形体を成形する工程と、
    　前記樹脂成形体から前記シートを剥離することにより、前記樹脂成形体において前記シートが接合されていた接合面を露出する工程と、
    　前記接合面上に前記電子部品に接続する配線を印刷する工程と、
    　前記接合面上に、３Ｄプリンタを用いて、高さ１ｍｍ以上の樹脂の凸構造部を成形する工程とを備える、樹脂構造体の製造方法。     Mounting the electronic component on a sheet, placing the sheet in a mold, and filling a resin in the mold to mold a resin molded body in which the electronic component is embedded;
    Exposing the bonding surface to which the sheet is bonded in the resin molded body by peeling the sheet from the resin molded body;
    Printing a wiring connected to the electronic component on the bonding surface;
    Forming a convex structure of a resin having a height of 1 mm or more on the joint surface using a 3D printer.
  2. 　電子部品をシート上に実装し、前記シート上に実装された前記電子部品上に紫外線硬化樹脂材、熱硬化性樹脂材または熱可塑性樹脂材を厚さ１４～２０μｍに塗布して硬化させる工程を繰り返すことにより、前記電子部品が埋設された樹脂成形体を成形する工程と、
    　前記樹脂成形体から前記シートを剥離することにより、前記樹脂成形体において前記シートが接合されていた接合面を露出する工程と、
    　前記接合面上に前記電子部品に接続する配線を印刷する工程と、
    　前記接合面上に、３Ｄプリンタを用いて、高さ１ｍｍ以上の樹脂の凸構造部を成形する工程とを備える、樹脂構造体の製造方法。     Mounting an electronic component on a sheet, and applying and curing an ultraviolet curable resin material, a thermosetting resin material, or a thermoplastic resin material on the electronic component mounted on the sheet to a thickness of 14 to 20 μm. By repeating, molding the resin molded body in which the electronic component is embedded,
    Exposing the bonding surface to which the sheet is bonded in the resin molded body by peeling the sheet from the resin molded body;
    Printing a wiring connected to the electronic component on the bonding surface;
    Forming a convex structure of a resin having a height of 1 mm or more on the joint surface using a 3D printer.
  3. 　前記凸構造部を成形する工程は、紫外線硬化樹脂材、熱硬化性樹脂材または熱可塑性樹脂材を厚さ１４～２０μｍに塗布して硬化させる工程を繰り返し行なう、請求項１または２に記載の樹脂構造体の製造方法。 3. The step of forming the convex structure portion is repeatedly performed by applying and curing an ultraviolet curable resin material, a thermosetting resin material, or a thermoplastic resin material to a thickness of 14 to 20 μm. Manufacturing method of resin structure.
  4. 　前記凸構造部は、前記電子部品および前記配線の少なくとも一方を跨ぐ、請求項１から３のいずれか１項に記載の樹脂構造体の製造方法。 The method for manufacturing a resin structure according to any one of claims 1 to 3, wherein the convex structure section straddles at least one of the electronic component and the wiring.
  5. 　前記凸構造部を成形する工程は、前記凸構造部と前記電子部品および前記配線の少なくとも一方との間に、前記凸構造部を支持するサポート材を配置する工程を含み、
    　前記サポート材は、除去されることなく残される、請求項４に記載の樹脂構造体の製造方法。     The step of forming the convex structure portion includes a step of arranging a support material that supports the convex structure portion between the convex structure portion and at least one of the electronic component and the wiring,
    The method for manufacturing a resin structure according to claim 4, wherein the support material is left without being removed.
  6. 　前記サポート材は未硬化の樹脂材である、請求項５に記載の樹脂構造体の製造方法。 The method for manufacturing a resin structure according to claim 5, wherein the support material is an uncured resin material.
  7. 　樹脂成形体と、
    　前記樹脂成形体に埋設された電子部品とを備える樹脂構造体であって、
    　前記樹脂成形体の表面は、前記電子部品が露出する露出面を有し、
    　前記樹脂構造体は、さらに、
    　前記露出面に形成された、前記電子部品に接続する配線と、
    　前記露出面に成形された、高さ１ｍｍ以上の樹脂の凸構造部とを備え、
    　前記凸構造部は、前記樹脂成形体と直接に接合する、樹脂構造体。     A resin molded body;
    A resin structure comprising an electronic component embedded in the resin molded body,
    The surface of the resin molded body has an exposed surface from which the electronic component is exposed,
    The resin structure further includes:
    Wiring connected to the electronic component formed on the exposed surface;
    A resin convex structure having a height of 1 mm or more, formed on the exposed surface;
    The convex structure part is a resin structure that is directly joined to the resin molded body.
  8. 　前記配線は、第１配線部と、前記第１配線部との間隔が３ｍｍ以内の第２配線部とを含み、
    　前記凸構造部の少なくとも一部は、前記露出面における前記第１配線部と前記第２配線部との間に位置する、請求項７に記載の樹脂構造体。     The wiring includes a first wiring part and a second wiring part having a distance of 3 mm or less between the first wiring part,
    8. The resin structure according to claim 7, wherein at least a part of the convex structure portion is located between the first wiring portion and the second wiring portion on the exposed surface.
  9. 　前記凸構造部は、前記露出面上に成形された少なくとも１つの立設部と、前記少なくとも１つの立設部上に成形され、前記電子部品および前記配線の少なくとも一方を覆う蓋部とを含む、請求項７または８に記載の樹脂構造体。 The convex structure portion includes at least one standing portion molded on the exposed surface, and a lid portion formed on the at least one standing portion and covering at least one of the electronic component and the wiring. The resin structure according to claim 7 or 8.
  10. 　前記蓋部と前記電子部品および前記配線の少なくとも一方との間に配置され、前記蓋部を支持するサポート部をさらに備える、請求項９に記載の樹脂構造体。 The resin structure according to claim 9, further comprising a support portion that is disposed between the lid portion and at least one of the electronic component and the wiring and supports the lid portion.
  11. 　前記サポート部は未硬化の樹脂材で構成される、請求項１０に記載の樹脂構造体。 The resin structure according to claim 10, wherein the support portion is made of an uncured resin material.
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JPH05315475A (en) * 1992-05-13 1993-11-26 Oki Electric Ind Co Ltd Resin sealed semiconductor device and manufacturing method thereof
JP2010272756A (en) * 2009-05-22 2010-12-02 Omron Corp Apparatus for mounting electronic component and method of manufacturing the same
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