WO2019164226A1 - Method of preparing high-purity electrolyte solution for vanadium redox flow battery using catalytic reaction - Google Patents

Method of preparing high-purity electrolyte solution for vanadium redox flow battery using catalytic reaction Download PDF

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Publication number
WO2019164226A1
WO2019164226A1 PCT/KR2019/002007 KR2019002007W WO2019164226A1 WO 2019164226 A1 WO2019164226 A1 WO 2019164226A1 KR 2019002007 W KR2019002007 W KR 2019002007W WO 2019164226 A1 WO2019164226 A1 WO 2019164226A1
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Prior art keywords
polishing
diamond
powder
thin glass
cluster powder
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PCT/KR2019/002007
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French (fr)
Korean (ko)
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황정훈
김동하
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주식회사 넥스트젠
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Priority claimed from KR1020180150586A external-priority patent/KR20190101276A/en
Application filed by 주식회사 넥스트젠 filed Critical 주식회사 넥스트젠
Publication of WO2019164226A1 publication Critical patent/WO2019164226A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/02—Wheels in one piece

Definitions

  • the present invention relates to a polishing wheel for thin glass polishing and a method for manufacturing the same.
  • the wheel In the thin glass polishing polishing wheel 100 for polishing the rim surface 11 of the thin glass 10 using a rotational force, the wheel is located at the center thereof.
  • Circular body portion 110, the insertion hole 111 is formed; and is formed to surround the outer peripheral surface 112 of the body portion 110, resin powder (Resin powder), diamond cluster powder (Diamond Cluster powder),
  • the abrasive layer and the abrasive is formed by mixing the abrasive layer 120; relates to a polishing wheel and a manufacturing method for thin glass polishing, characterized in that consisting of.
  • LCDs liquid crystal displays
  • Such LCDs are also called liquid crystal displays or liquid crystal displays, and unlike CRTs, they do not have self-luminous properties and require backlighting. However, since LCDs have low operating voltages, they consume less power and can be used as portable devices.
  • flat panel display devices such as LCDs are mainly made of thin tempered glass, and most of the panels manufactured using the flat panel panels are also manufactured.
  • the processing of the rim surface was usually carried out through the grinding wheel for chamfering rotating at high speed.
  • the polishing wheel for polishing the rim surface of the thin tempered glass is disclosed in various embodiments, among which "polishing wheel (Korean Patent Publication No. 10-0314287)" of the following Patent Document 1 is the output end of the power tool in the center A disk portion 22 having a mounting hole 22a to be mounted thereon, a rim portion 24 formed at a predetermined radius around the disk portion 22 and to which a polishing tip 30 is attached at regular intervals to a bottom surface thereof;
  • the adjacent dust suction holes 26a, 26a) is inclined in the rotational direction of the shank 20, and has a wing surface 26-1 inclined inward of the shank 20, and dust on the side of the dust suction hole 26a during the rotation of the shank 20
  • the dust suction blades 26 for generating suction force are further included, respectively, The generation of dust due
  • the "polishing wheel" of the patent document 1 is disposed so that the polishing tip is extended to the dust suction blades are spaced apart, the polishing surface is not uniformly polished at the edge, the completion reliability of the cross-section and side portion is low There was a problem that foreign matter remained.
  • conventional grinding wheels have a low grinding force due to abrasion of the diamond particles formed on the polishing tip, and the chips generated from the workpiece polished by the increase in frictional heat are fused between the diamond particles to fill the eyes. (Loading) phenomenon and glazing phenomenon occurs, the surface of the workpiece is not polished smoothly there is a problem that the defective product increases, the reliability of the product is lowered.
  • an object of the present invention is to improve the roughness of the edge cross-section of the processing surface, to remove the remaining foreign matter of the edge cross-section and the side portion of the laminated glass to improve the quality and reliability of the product It is to provide a polishing polishing wheel and a manufacturing method thereof.
  • a diamond cluster powder Diamond Cluster powder
  • the worn portion is quickly detached even if the fine diamond particles wear
  • the new fine diamond particles are exposed on the surface of the abrasive layer to maintain the grinding force, thereby increasing the replacement cycle of the abrasive wheel, and to secure the reliability of the product by precisely polishing the workpiece surface than the conventional abrasive wheel.
  • the diamond cluster powder (Diamond Cluster powder) is characterized in that a plurality of diamond particles having a size of 1 ⁇ m or less are bonded to form a binder of 30 ⁇ m ⁇ 50 ⁇ m size.
  • a plurality of diamond particles having a size of 1 ⁇ m or less are combined Preparing a diamond cluster powder (D1) formed of a binder between 30 ⁇ m and 50 ⁇ m (S1); and the diamond cluster powder, resin powder, abrasive and polish.
  • D1 diamond cluster powder formed of a binder between 30 ⁇ m and 50 ⁇ m (S1)
  • Step (S4); and the abrasive grain layer 120 is located on the polished surface And it is composed of features; step (S5) of removing the foreign matters.
  • the step (S1-1) of preparing the mixture may include 15 wt% to 40 wt% of diamond particles having a size of 1 ⁇ m or less, 35 wt% to 55 wt% of resin powder, and 5 wt% of a curing accelerator. It is characterized by mixing for 3 to 5 hours after being weighed at a ratio of 10% by weight to 10% by weight, 5% by weight to 10% by weight of the release material, and 5% by weight to 10% by weight of the adhesive.
  • the primary sintering operation is performed by setting the sintering operation conditions of the hot press at a pressure of 1Ton to 5Ton, a temperature of 30 ° C to 40 ° C, and a time of 15 minutes to 25 minutes. Then, the sintering work condition of the hot press is sintered secondly under a pressure of 10Ton to 15Ton, a temperature of 60 ° C to 70 ° C for 15 minutes to 25 minutes, and after that, the temperature is increased by 10 ° C for 10 minutes to 200 ° C. It characterized in that the sintering work to proceed.
  • step (S1-4) of cooling the primary binder is characterized in that the slow cooling at a temperature of 20 °C for 3 to 5 hours.
  • a diamond cluster powder Diamond Cluster powder
  • the worn portion is quickly detached even if the fine diamond particles wear
  • the new fine diamond particles are exposed to the surface of the abrasive layer to maintain the grinding force, thereby increasing the replacement cycle of the abrasive wheel, and to ensure the reliability of the product by precisely polishing the workpiece surface than the conventional abrasive wheel.
  • FIG. 1 is a perspective view showing an overall view of a polishing wheel for thin glass polishing according to a preferred embodiment of the present invention
  • Figure 2 is a block diagram showing a manufacturing method of a polishing wheel for thin glass polishing according to a preferred embodiment of the present invention
  • FIG. 5 is an enlarged photograph of the diamond cluster powder formed on the abrasive grain portion of the thin glass polishing polishing wheel according to the preferred embodiment of the present invention and the surface of the laminated glass polished through the same.
  • the polishing glass 100 for thin glass polishing is largely composed of a body part 110 and an abrasive grain part 120.
  • the body unit 110 will be described. As shown in FIG. 1, the body part 110 is a component that is coupled to a motor device (not shown) and rotates by a driving force of the motor device (not shown), and the motor device is located at the center of the body part 110.
  • the wheel insertion hole 111 into which the shaft (not shown) of (not shown) is inserted is perforated.
  • the outer circumferential surface 112 of the body 110 is preferably a protrusion (not shown) further protruded for close coupling with the abrasive layer portion 120 to be described later.
  • the abrasive grain part 120 is demonstrated.
  • the abrasive layer part 120 is a component formed by enclosing the outer circumferential surface of the body part 110 through a mold operation.
  • the abrasive layer part 120 is in contact with the edge surface 11 of the thin glass 10 and the edge thereof. It serves to polish the face 11.
  • the abrasive layer part is formed by mixing resin powder, diamond cluster powder, abrasive and polish material by a predetermined compounding ratio.
  • the diamond cluster powder (Diamond Cluster powder) is a plurality of diamond particles having a size of 1 ⁇ m or less are combined to form a single body of between 30 ⁇ m ⁇ 50 ⁇ m size.
  • the end portion of the diamond having a size of between 30 ⁇ m and 50 ⁇ m is rapidly worn out as the polishing time elapses, and as time passes, Although the surface roughness of the thin glass 10 becomes worse, as shown in FIG. 5, the abrasive layer portion 120 to which the diamond cluster powder, which is formed in one cluster form, is applied, has a fine end portion, and is uniform. After a period of time, worn diamond particles having a diameter of 1 ⁇ m or less are detached from the single diamond cluster powder assembly, and new diamond particles are exposed to the end of the abrasive layer portion 120, thereby performing a long grinding operation. Even grinding force to ensure the reliability of the surface roughness of the thin glass 10 It is possible.
  • FIG. 2 a manufacturing method of a polishing wheel for thin glass polishing according to an embodiment of the present invention will be described.
  • Diamond Cluster powder formed of a binder having a size of 30 ⁇ m to 50 ⁇ m (S1).
  • the prepared diamond cluster powder is mixed with a resin powder, an abrasive and a polishing material through an industrial mixer, and stirred through a stirrer to prepare a raw material of the abrasive grain unit 120. (S2).
  • the body part 110 is first placed on the casting mold for forming the polishing wheel 100, and the raw material of the abrasive layer part 120 is filled on the outer circumferential surface of the body part 110 and then pressed through a press.
  • the polishing wheel 100 S3
  • the surface of the abrasive layer portion 120 is arranged to polish the surface of the abrasive layer portion 120 of the polishing wheel 100 where the molding is completed through a polishing apparatus (S4).
  • the method for producing the diamond cluster powder is largely, the mixture preparation step (S1-1), the mixture filling step (S1-2), primary binder forming step (S1-3), cooling step ( S1-4), the diamond cluster powder (Diamond Cluster powder) generation step (S1-5), foreign matter removal step (S1-6) and drying step (S1-7).
  • the mixture manufacturing step (S1-1) is a step of preparing a mixture by mixing diamond particles having a size of 1 ⁇ m or less, resin powder, a curing accelerator, a release material, and an adhesive.
  • the release material may be polyvinyl alcohol, paraffin, Teflon dispersion, or the like
  • the adhesive is preferably polyethylene resin, EVA adhesive or the like.
  • the above materials are manufactured through a constant mixing ratio, the diamond particles formed of less than 1 ⁇ m size 15% to 40% by weight, resin powder (Resin powder) to 35% by weight to 55% by weight, promoting hardening It is preferable to measure and use the ash at 5 weight%-10 weight%, a mold release material at 5 weight%-10 weight%, and an adhesive agent at 5 weight%-10 weight%.
  • the mixture filling step (S1-2) is a preparation step for making the mixture into a rod shape by filling the mixture, the mixture is completed in the form of a circular pillar or a square pillar.
  • the diameter of the rod-shaped mixture is preferably manufactured in a shape of 15 mm or less so that diamond cluster powder, which is formed of a binder between 30 ⁇ m and 50 ⁇ m in size, may be produced in the subsequent grinding process. Do.
  • the primary binder forming step (S1-3) is a step of forming the primary binder by sintering the rod-shaped mixture filled in the auxiliary mold through a hot press.
  • the sintering operation condition of the first hot press is applied at a pressure of 1Ton to 5Ton, and maintains a temperature of 30 ° C to 40 ° C for 15 minutes to 25 minutes. Carry out the first sintering operation.
  • the sintering working conditions of the hot press is applied to a pressure of 10Ton to 15Ton, maintain the temperature of 60 °C to 70 °C, and performs the second sintering work for 15 minutes to 25 minutes.
  • the operation of removing the pores is performed 5 to 10 times.
  • the pressure is the same as in the second sintering operation, and the sintering operation is carried out to 200 ° C by raising the temperature by 10 ° C in 10 minutes. It is preferable to perform a sintering operation for 20 to 30 minutes at the temperature of the last 200 degreeC.
  • the cooling step (S1-4) is a step of cooling the primary assembly in which the sintering is completed, the cooling conditions are preferably made of a temperature of 20 °C for 3 to 5 hours.
  • the primary binder having been cooled is removed from the auxiliary mold, and the rod-shaped primary binder is put into a grinder and pulverized for 3 to 4 hours.
  • a diamond cluster powder (Diamond Cluster powder) consisting of a combination of the size between 30 ⁇ m 50 ⁇ m.
  • the foreign material removing step (S1-6) is a step of removing foreign matter by putting the diamond cluster powder (Diamond Cluster powder) in a stirring tank for 30 minutes to 1 hour 30 minutes.
  • the drying step (S1-7) is a step of drying after the dehydration operation of the diamond cluster powder (Diamond Cluster powder) from which the foreign matter is removed through a centrifuge.
  • Diamond Cluster powder Diamond Cluster powder
  • the mesh network of various sizes in accordance with the particle size conditions of the polishing wheel 100 used.

Abstract

The present invention has the effects of enhancing the roughness of a cross-section portion of an edge of a processing surface and improving the product quality and reliability by removing residual foreign matter from the cross-section portion and side-surface portion of the edge.

Description

박판 유리 연마용 폴리싱휠 및 이의 제작방법Polishing wheel for thin glass polishing and its manufacturing method
본 발명은 박판 유리 연마용 폴리싱휠 및 이의 제작방법에 관한 것으로서, 회전력을 이용하여 박판 유리(10)의 테두리면(11)을 연마하는 박판 유리 연마용 폴리싱휠(100)에 있어서, 중앙에 휠삽입공(111)이 형성되는 원형상의 바디부(110);와, 상기 바디부(110)의 외주면(112)을 감싸며 형성되되, 레진파우더(Resin powder), 다이아몬드 클러스터 파우더(Diamond Cluster powder), 연마재 및 광택재가 혼합되어 형성되는 지립층부(120);로 구성되는 것을 특징으로 하는 박판 유리 연마용 폴리싱휠 및 제작방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing wheel for thin glass polishing and a method for manufacturing the same. In the thin glass polishing polishing wheel 100 for polishing the rim surface 11 of the thin glass 10 using a rotational force, the wheel is located at the center thereof. Circular body portion 110, the insertion hole 111 is formed; and is formed to surround the outer peripheral surface 112 of the body portion 110, resin powder (Resin powder), diamond cluster powder (Diamond Cluster powder), The abrasive layer and the abrasive is formed by mixing the abrasive layer 120; relates to a polishing wheel and a manufacturing method for thin glass polishing, characterized in that consisting of.
일반적으로, 현재 출시되고 있는 TV, 모니터, 브라운관 등의 제품들은 LCD(Liqud crystal display) 등의 평판형 디스플레이를 채용하고 있다.In general, TVs, monitors, and CRTs, which are currently on the market, employ flat panel displays such as liquid crystal displays (LCDs).
이러한 LCD는 액정표시장치 또는 액정디스플레이라고도 하며, CRT와는 달리 자기발광성이 없어 후광이 필요하지만 동작 전압이 낮아서 소비전력이 적고 휴대용으로 쓰일 수 있기 때문에 손목시계, 컴퓨터 등에 널리 쓰고 있는 추세이다.Such LCDs are also called liquid crystal displays or liquid crystal displays, and unlike CRTs, they do not have self-luminous properties and require backlighting. However, since LCDs have low operating voltages, they consume less power and can be used as portable devices.
한편, LCD와 같은 평판형 디스플레이 장치는 강한 내충격성을 확보하기 위해 기판은 주로 박판 강화유리로 만들고, 이를 사용하여 제조되는 패널 또한 대부분 평판형 패널로 제작되고 있다.Meanwhile, in order to secure strong impact resistance, flat panel display devices such as LCDs are mainly made of thin tempered glass, and most of the panels manufactured using the flat panel panels are also manufactured.
이와 같은 평판형 패널은 고품질의 디스플레이 기능을 제공하기 위해 평탄도 및 테두리면의 가공, 강도, 거칠기 등을 신뢰성을 확보하는 것이 매우 중요하다.In order to provide a high-quality display function, such a flat panel panel is very important to secure reliability of flatness and edge processing, strength, roughness, and the like.
이 중 테두리면의 가공은 통상 고속으로 회전하는 면취용 연마휠을 통해 연마작업을 진행하였다.Among them, the processing of the rim surface was usually carried out through the grinding wheel for chamfering rotating at high speed.
한편, 박판 강화유리의 테두리면을 연마하는 연마휠은 다양한 실시예로 공개되어 있으며, 그중 하기 특허문헌 1의 “연마휠(대한민국 등록특허공보 제10-0314287호)”은 중앙에 전동공구의 출력단이 장착되기 위한 장착공(22a)을 갖는 디스크부 (22)와, 상기 디스크부(22)에서 일정 반경둘레로 형성되고 저면에 일정 간격으로 연마용 팁(30)이 부착되는 림부(24)와, 상기 디스크부(22)와 림부(24)를 연결하고 일정 간격으로 복수개의 분진흡입공(26a)을 갖는 콘형의 샹크(20)로 이루어진 연마 휠에 있어서, 상기 이웃한 분진흡입공(26a,26a)들의 사이에는 샹크(20)의 회전방향으로 기울어지고, 샹크(20)의 내측으로 경사진 날개면(26-1)을 갖고 샹크(20)의 회전시 분진흡입공(26a)측에 분진 흡입력을 발생시키는 분진흡입날개(26)가 각각 추가로 포함된 것이 특징으로서, 피삭재의 표면에서의 흡입되는 풍속이 수배로 증가된 흡입력으로 피삭재의 절분으로 인한 분진의 발생을 최대한 방지하여 작업환경의 개선을 향상시킨다는 장점이 있었다.On the other hand, the polishing wheel for polishing the rim surface of the thin tempered glass is disclosed in various embodiments, among which "polishing wheel (Korean Patent Publication No. 10-0314287)" of the following Patent Document 1 is the output end of the power tool in the center A disk portion 22 having a mounting hole 22a to be mounted thereon, a rim portion 24 formed at a predetermined radius around the disk portion 22 and to which a polishing tip 30 is attached at regular intervals to a bottom surface thereof; In the polishing wheel consisting of a cone-shaped shank 20 having a plurality of dust suction holes 26a connecting the disc portion 22 and the rim portion 24 at regular intervals, the adjacent dust suction holes 26a, 26a) is inclined in the rotational direction of the shank 20, and has a wing surface 26-1 inclined inward of the shank 20, and dust on the side of the dust suction hole 26a during the rotation of the shank 20 The dust suction blades 26 for generating suction force are further included, respectively, The generation of dust due to the chips of the work material to the sucked wind speed is increased to several times the suction power of the surface was an advantage sikindaneun avoid possible to enhance the improvement of the working environment.
그러나, 상기 특허문헌 1의 “연마휠”은 연마용 팁이 이격 배치된 분진흡입날개에 연장되게 배치됨으로써, 연마작업시, 테두리면이 균일하게 연마가 되지 않아 단면부 및 측면부의 완성 신뢰도가 낮고, 이물질이 잔존한다는 문제점이 있었다.However, the "polishing wheel" of the patent document 1 is disposed so that the polishing tip is extended to the dust suction blades are spaced apart, the polishing surface is not uniformly polished at the edge, the completion reliability of the cross-section and side portion is low There was a problem that foreign matter remained.
또한, 기존의 연마휠은 연마용 팁에 구성된 다이아몬드 입자의 마모에 의해 연삭력이 빠르게 저하되고, 마찰열의 증가로 연마되는 피삭물로부터 발생되는 가공가루(Chip)가 다이아몬드 입자 사이에 융착되어 눈메움(Loading)현상 및 눈무딤(Glazing)현상이 발생됨으로써, 피삭물 표면이 매끄럽게 연마되지 않아 불량품이 증가하고, 제품의 신뢰성이 저하된다는 문제점이 있었다.In addition, conventional grinding wheels have a low grinding force due to abrasion of the diamond particles formed on the polishing tip, and the chips generated from the workpiece polished by the increase in frictional heat are fused between the diamond particles to fill the eyes. (Loading) phenomenon and glazing phenomenon occurs, the surface of the workpiece is not polished smoothly there is a problem that the defective product increases, the reliability of the product is lowered.
본 발명은 상술한 문제점을 해결하고자 안출된 것으로서, 본 발명의 목적은 가공면의 에지 단면부의 조도를 향상시키고, 에지 단면부 및 측면부의 잔존이물질을 제거하여 제품의 품질 및 신뢰도를 향상시키는 박판 유리 연마용 폴리싱휠 및 이의 제작방법을 제공하는 것이다.The present invention has been made to solve the above problems, an object of the present invention is to improve the roughness of the edge cross-section of the processing surface, to remove the remaining foreign matter of the edge cross-section and the side portion of the laminated glass to improve the quality and reliability of the product It is to provide a polishing polishing wheel and a manufacturing method thereof.
또한, 크기가 미세한 다수개의 다이아몬드 입자를 결합시켜 하나의 결합체로 이루어진 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 피삭물을 연마하는 지립층부에 적용함으로써, 미세한 다이아몬드 입자가 마모되더라도 마모된 부분이 빠르게 탈리되어 새로운 미세한 다이아몬드 입자가 지립층부의 표면에 노출됨으로써, 연삭력을 유지를 통해 연마휠의 교체주기를 증가시켜주고, 기존의 연마휠보다 피삭물 표면을 정교하게 연마하여 제품의 신뢰성을 확보할 수 있는 박판 유리 연마용 폴리싱휠 및 이의 제작방법을 제공하는 것이다.In addition, by applying a plurality of diamond particles of a small size by applying a diamond cluster powder (Diamond Cluster powder) consisting of a combination of abrasive grains to polish the workpiece, the worn portion is quickly detached even if the fine diamond particles wear The new fine diamond particles are exposed on the surface of the abrasive layer to maintain the grinding force, thereby increasing the replacement cycle of the abrasive wheel, and to secure the reliability of the product by precisely polishing the workpiece surface than the conventional abrasive wheel. To provide a polishing wheel for thin glass polishing and a manufacturing method thereof.
상기와 같은 문제점을 해결하기 위하여, 본 발명에 따른 박판 유리 연마용 폴리싱휠은, 회전력을 이용하여 박판 유리(10)의 테두리면(11)을 연마하는 박판 유리 연마용 폴리싱휠(100)에 있어서, 중앙에 휠삽입공(111)이 형성되는 원형상의 바디부(110);와, 상기 바디부(110)의 외주면(112)을 감싸며 형성되되, 레진파우더(Resin powder), 다이아몬드 클러스터 파우더(Diamond Cluster powder), 연마재 및 광택재가 혼합되어 형성되는 지립층부(120);로 구성되는 것을 특징으로 한다.In order to solve the above problems, in the thin glass polishing polishing wheel according to the present invention, in the thin glass polishing polishing wheel 100 for polishing the rim surface 11 of the thin glass 10 using the rotational force A circular body portion 110 having a wheel insertion hole 111 formed at the center thereof; and being formed to surround the outer circumferential surface 112 of the body portion 110, a resin powder and a diamond cluster powder. It is characterized by consisting of; abrasive grains 120, which is formed by mixing the cluster powder), the abrasive and the polishing material.
또한, 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)는 크기가 1㎛ 이하의 다수개의 다이아몬드 입자가 결합되어 크기가 30㎛ ∼ 50㎛ 사이의 결합체로 형성되는 것을 특징으로 한다.In addition, the diamond cluster powder (Diamond Cluster powder) is characterized in that a plurality of diamond particles having a size of 1㎛ or less are bonded to form a binder of 30㎛ ~ 50㎛ size.
또한, 회전력을 이용하여 박판 유리(10)의 테두리면(11)을 연마하는 박판 유리 연마용 폴리싱휠(100)의 제작방법에 있어서, 크기가 1㎛ 이하의 다수개의 다이아몬드 입자가 결합되어 크기가 30㎛ ∼ 50㎛ 사이의 결합체로 형성되는 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 제조하는 단계(S1);와, 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder), 레진파우더(Resin powder), 연마재 및 광택재를 혼합, 교반하여 지립층부(120)의 원료를 제조하는 단계(S2);와, 폴리싱휠(100)의 성형을 위한 주금형에 바디부(110)를 위치시키고, 상기 바디부(110)의 외주면에 상기 지립층부(120)의 원료를 충진하여 상기 폴리싱휠(100)을 성형하는 단계(S3);와, 성형이 완료된 상기 폴리싱휠(100)의 상기 지립층부(120)의 표면을 연마하는 단계(S4);와, 상기 지립층부(120)가 연마된 면에 존재하는 이물질을 제거하는 단계(S5);로 구성되는 것을 특징으로 한다.In addition, in the manufacturing method of the thin glass polishing polishing wheel 100 for polishing the rim surface 11 of the thin glass 10 using the rotational force, a plurality of diamond particles having a size of 1㎛ or less are combined Preparing a diamond cluster powder (D1) formed of a binder between 30 µm and 50 µm (S1); and the diamond cluster powder, resin powder, abrasive and polish. Mixing and stirring to prepare a raw material of the abrasive grain layer portion 120 (S2); And, placing the body portion 110 in the mold for molding the polishing wheel 100, the body of the 110 Filling the raw material of the abrasive layer part 120 on an outer circumferential surface to form the polishing wheel 100 (S3); and polishing the surface of the abrasive layer part 120 of the polishing wheel 100 where the molding is completed. Step (S4); and the abrasive grain layer 120 is located on the polished surface And it is composed of features; step (S5) of removing the foreign matters.
또한, 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 제조하는 단계(S1)는, 크기가 1㎛ 이하로 형성된 다이아몬드 입자, 레진파우더(Resin powder), 경화촉진재, 이형재 및 접착제를 혼합하여 혼합물을 제조하는 단계(S1-1);와, 상기 혼합물을 원형기둥 또는 사각기둥 중 어느 하나의 형태로 이루어진 보조금형에 충진시키는 단계(S1-2);와, 상기 보조금형에 충진된 혼합물을 열간프레스를 통해 소결작업하여 1차 결합체를 성형하는 단계(S1-3);와, 소결작업이 완료된 상기 1차 결합체를 냉각시키는 단계(S1-4);와, 냉각이 완료된 상기 1차 결합체를 상기 보조금형으로부터 탈거한 후 분쇄기를 통해 분쇄하여 크기가 30㎛ ∼ 50㎛ 사이의 결합체로 이루어진 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 생성하는 단계(S1-5);와, 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 교반조를 통해 교반하여 이물질을 제거하는 단계(S1-6);와, 이물질이 제거된 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 원심분리기를 통해 탈수작업 후 건조하는 단계(S1-7);로 이루어지는 것을 특징으로 한다.In addition, the step (S1) of manufacturing the diamond cluster powder (S1), the diamond particles, the resin powder (Resin powder) formed by the size of less than 1㎛ mixed with a curing accelerator, a release material and an adhesive to prepare a mixture Step (S1-1); And, Filling the mixture in the auxiliary mold made of any one of the form of a circular column or a square pillar (S1-2); And, The hot-filling the mixture filled in the auxiliary mold Forming a primary binder by sintering through the step (S1-3); and cooling the primary binder after completing the sintering operation (S1-4); and cooling the primary binder after completion of the auxiliary mold Removing from the pulverizer through a grinder to produce a diamond cluster powder (Diamond Cluster powder) consisting of a binder having a size of 30㎛ ~ 50㎛ (S1-5); and the diamond cluster powder (S1-6) to remove the foreign matter by stirring (Diamond Cluster powder) through a stirring tank; and, after dehydrating the diamond cluster powder (Diamond Cluster powder) from which the foreign matter is removed through a centrifugal separator ( S1-7); characterized in that consisting of.
또한, 상기 혼합물을 제조하는 단계(S1-1)는 크기가 1㎛ 이하로 형성된 다이아몬드 입자 15 중량％∼40 중량％, 레진파우더(Resin powder) 35 중량％∼55 중량％, 경화촉진재 5 중량％∼10 중량％, 이형재 5 중량％∼10 중량％ 및 접착제 5 중량％∼10 중량％의 비율로 계량한 후 3시간∼5시간 동안 혼합하는 것을 특징으로 한다.In addition, the step (S1-1) of preparing the mixture may include 15 wt% to 40 wt% of diamond particles having a size of 1 μm or less, 35 wt% to 55 wt% of resin powder, and 5 wt% of a curing accelerator. It is characterized by mixing for 3 to 5 hours after being weighed at a ratio of 10% by weight to 10% by weight, 5% by weight to 10% by weight of the release material, and 5% by weight to 10% by weight of the adhesive.
또한, 상기 1차 결합체를 성형하는 단계(S1-3)는 상기 열간프레스의 소결작업조건을 압력 1Ton∼5Ton, 온도 30℃∼40℃, 시간 15분∼25분간 설정하여 1차 소결작업을 실행하고, 상기 열간프레스의 소결작업조건을 압력 10Ton∼15Ton, 온도 60℃∼70℃, 시간 15분∼25분간 2차로 소결작업을 실행하며, 이후에는 10분에 10℃씩 온도를 상승시켜 200℃까지 소결작업을 진행하는 것을 특징으로 한다.In the forming of the primary binder (S1-3), the primary sintering operation is performed by setting the sintering operation conditions of the hot press at a pressure of 1Ton to 5Ton, a temperature of 30 ° C to 40 ° C, and a time of 15 minutes to 25 minutes. Then, the sintering work condition of the hot press is sintered secondly under a pressure of 10Ton to 15Ton, a temperature of 60 ° C to 70 ° C for 15 minutes to 25 minutes, and after that, the temperature is increased by 10 ° C for 10 minutes to 200 ° C. It characterized in that the sintering work to proceed.
또한, 상기 1차 결합체를 냉각시키는 단계(S1-4)는 3시간∼5시간 동안 20℃의 온도에서 서냉시키는 것을 특징으로 한다.In addition, the step (S1-4) of cooling the primary binder is characterized in that the slow cooling at a temperature of 20 ℃ for 3 to 5 hours.
이상, 상술한 바와 같이 본 발명에 따르면, 가공면의 에지 단면부의 조도를 향상시키고, 에지 단면부 및 측면부의 잔존이물질을 제거하여 제품의 품질 및 신뢰도를 향상시킬 수 있다는 장점이 있다.As described above, according to the present invention, there is an advantage in that the roughness of the edge cross-section of the processing surface is improved, and the remaining foreign matters of the edge cross-section and the side are removed to improve the quality and reliability of the product.
또한, 크기가 미세한 다수개의 다이아몬드 입자를 결합시켜 하나의 결합체로 이루어진 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 피삭물을 연마하는 지립층부에 적용함으로써, 미세한 다이아몬드 입자가 마모되더라도 마모된 부분이 빠르게 탈리되어 새로운 미세한 다이아몬드 입자가 지립층부의 표면에 노출됨으로써, 연삭력을 유지를 통해 연마휠의 교체주기를 증가시켜주고, 기존의 연마휠보다 피삭물 표면을 정교하게 연마하여 제품의 신뢰성을 확보할 수 있다는 장점이 있다.In addition, by applying a plurality of diamond particles of a small size by applying a diamond cluster powder (Diamond Cluster powder) consisting of a combination of abrasive grains to polish the workpiece, the worn portion is quickly detached even if the fine diamond particles wear The new fine diamond particles are exposed to the surface of the abrasive layer to maintain the grinding force, thereby increasing the replacement cycle of the abrasive wheel, and to ensure the reliability of the product by precisely polishing the workpiece surface than the conventional abrasive wheel. There is an advantage.
도 1은 본 발명의 바람직한 실시예에 따른 박판 유리 연마용 폴리싱휠의 전체 모습을 보인 사시도1 is a perspective view showing an overall view of a polishing wheel for thin glass polishing according to a preferred embodiment of the present invention
도 2는 본 발명의 바람직한 실시예에 따른 박판 유리 연마용 폴리싱휠의 제작방법을 나타낸 블럭도Figure 2 is a block diagram showing a manufacturing method of a polishing wheel for thin glass polishing according to a preferred embodiment of the present invention
도 3은 기존의 연마휠 및 연마부를 확대한 사진3 is an enlarged photo of a conventional polishing wheel and a polishing unit
도 4는 기존의 연마휠의 연마부에 형성된 다이아몬드 입자의 표면 거칠기가 점차 나빠지는 모습 및 이를 통해 연마된 박판 유리의 표면을 확대한 사진4 is a view showing the surface roughness of the diamond particles formed on the polishing portion of the conventional polishing wheel gradually worsening and the enlarged surface of the laminated glass glass
도 5는 본 발명의 바람직한 실시예에 따른 박판 유리 연마용 폴리싱휠의 지립층부에 형성된 다이아몬드 클러스터 파우더의 모습 및 이를 통해 연마된 박판 유리의 표면을 확대한 사진5 is an enlarged photograph of the diamond cluster powder formed on the abrasive grain portion of the thin glass polishing polishing wheel according to the preferred embodiment of the present invention and the surface of the laminated glass polished through the same.
이하에서는 첨부된 도면을 참조로 하여, 본 발명의 일 실시예에 따른 박판 유리 연마용 폴리싱휠 및 제작방법을 상세히 설명한다. 우선, 도면들 중, 동일한 구성요소 또는 부품들은 가능한 한 동일한 참조부호로 나타내고 있음에 유의하여야 한다. 본 발명을 설명함에 있어, 관련된 공지 기능 혹은 구성에 관한 구체적인 설명은 본 발명의 요지를 모호하지 않게 하기 위하여 생략한다.Hereinafter, with reference to the accompanying drawings, it will be described in detail a polishing wheel and a manufacturing method for thin glass polishing according to an embodiment of the present invention. First, in the drawings, the same components or parts are to be noted that as indicated by the same reference numerals as possible. In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted in order not to obscure the subject matter of the present invention.
도 1을 참조하면, 본 발명의 일 실시예에 따른 박판 유리 연마용 폴리싱휠(100)은 크게 바디부(110) 및 지립층부(120)로 구성된다.Referring to FIG. 1, the polishing glass 100 for thin glass polishing according to an embodiment of the present invention is largely composed of a body part 110 and an abrasive grain part 120.
먼저, 바디부(110)에 대하여 설명한다. 상기 바디부(110)는 도 1에 나타낸 것과 같이, 모터장비(미도시)와 결합되어 모터장비(미도시)의 구동력에 의해 회전하는 구성요소로서, 상기 바디부(110)의 중앙에는 모터장비(미도시)의 샤프트(미도시)가 삽입되는 휠삽입공(111)이 타공형성된다.First, the body unit 110 will be described. As shown in FIG. 1, the body part 110 is a component that is coupled to a motor device (not shown) and rotates by a driving force of the motor device (not shown), and the motor device is located at the center of the body part 110. The wheel insertion hole 111 into which the shaft (not shown) of (not shown) is inserted is perforated.
한편, 상기 바디부(110)의 외주면(112)에는 후술할 지립층부(120)와의 긴밀한 결합을 위하여 돌기부(미도시)가 더 돌출형성되는 것이 바람직하다.On the other hand, the outer circumferential surface 112 of the body 110 is preferably a protrusion (not shown) further protruded for close coupling with the abrasive layer portion 120 to be described later.
다음으로, 지립층부(120)에 대하여 설명한다. 상기 지립층부(120)는 도 1에 나타낸 것과 같이, 금형작업을 통해 상기 바디부(110)의 외주면을 감싸며 형성되는 구성요소로서, 박판 유리(10)의 테두리면(11)에 접촉되어 상기 테두리면(11)을 연마하는 역할을 한다.Next, the abrasive grain part 120 is demonstrated. As shown in FIG. 1, the abrasive layer part 120 is a component formed by enclosing the outer circumferential surface of the body part 110 through a mold operation. The abrasive layer part 120 is in contact with the edge surface 11 of the thin glass 10 and the edge thereof. It serves to polish the face 11.
한편, 지립층부는 레진파우더(Resin powder), 다이아몬드 클러스터 파우더(Diamond Cluster powder), 연마재 및 광택재가 일정 배합비에 의해 혼합되어 형성되는 것이 바람직하다.On the other hand, it is preferable that the abrasive layer part is formed by mixing resin powder, diamond cluster powder, abrasive and polish material by a predetermined compounding ratio.
한편, 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)는 크기가 1㎛ 이하의 다수개의 다이아몬드 입자가 결합되어 크기가 30㎛ ∼ 50㎛ 사이의 하나로 된 결합체로 형성된다.On the other hand, the diamond cluster powder (Diamond Cluster powder) is a plurality of diamond particles having a size of 1㎛ or less are combined to form a single body of between 30㎛ ~ 50㎛ size.
이로 인하여, 도 3 또는 도 4에 나타낸 것과 같이, 기존의 연마휠의 경우, 크기가 30㎛ ∼ 50㎛ 사이로 이루어진 다이아몬드의 끝부분이 연마시간이 지남에 따라 급격하게 마모됨으로써, 시간이 지남에 따라 박판 유리(10)의 표면거칠기가 나빠지게 되지만, 도 5에 나타낸 것과 같이, 하나의 군집형태로 이루어진 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)가 적용된 상기 지립층부(120)은 끝부분이 미세화되어 일정 시간이 지나면 마모된 1㎛ 이하의 다이아몬드 입자는 하나로 된 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder) 결합체로부터 탈리하고 새로운 다이아몬드 입자가 상기 지립층부(120)의 끝부분에 노출됨으로써, 장시간 연마작업이 이루어지는 동안에도 균일한 연삭력을 확보하여 상기 박판 유리(10)의 표면거칠기의 신뢰성을 확보할 수 있게 된다.For this reason, as shown in FIG. 3 or FIG. 4, in the case of the conventional polishing wheel, the end portion of the diamond having a size of between 30 μm and 50 μm is rapidly worn out as the polishing time elapses, and as time passes, Although the surface roughness of the thin glass 10 becomes worse, as shown in FIG. 5, the abrasive layer portion 120 to which the diamond cluster powder, which is formed in one cluster form, is applied, has a fine end portion, and is uniform. After a period of time, worn diamond particles having a diameter of 1 μm or less are detached from the single diamond cluster powder assembly, and new diamond particles are exposed to the end of the abrasive layer portion 120, thereby performing a long grinding operation. Even grinding force to ensure the reliability of the surface roughness of the thin glass 10 It is possible.
이하에서는 도 2를 참조하여, 본 발명의 일 실시예에 따른 박판 유리 연마용 폴리싱휠의 제작방법을 설명하기로 한다.Hereinafter, referring to FIG. 2, a manufacturing method of a polishing wheel for thin glass polishing according to an embodiment of the present invention will be described.
먼저, 별도의 공정을 통해 크기가 1㎛ 이하의 다수개의 다이아몬드 입자가 결합되어 크기가 30㎛ ∼ 50㎛ 사이의 결합체로 형성되는 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 제조한다(S1).First, a plurality of diamond particles having a size of 1 μm or less are combined through a separate process to prepare diamond cluster powder (Diamond Cluster powder) formed of a binder having a size of 30 μm to 50 μm (S1).
다음으로, 제조된 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 레진파우더(Resin powder), 연마재 및 광택재와 함께 공업용 믹싱기를 통해 혼합하고, 교반기를 통해 교반하여 상기 지립층부(120)의 원료를 제조한다(S2).Next, the prepared diamond cluster powder is mixed with a resin powder, an abrasive and a polishing material through an industrial mixer, and stirred through a stirrer to prepare a raw material of the abrasive grain unit 120. (S2).
이후, 상기 폴리싱휠(100)의 성형을 위한 주금형에 먼저 바디부(110)를 위치시키고, 상기 바디부(110)의 외주면에 상기 지립층부(120)의 원료를 충진한 후 프레스를 통해 압착하여 상기 폴리싱휠(100)을 성형한다(S3).Subsequently, the body part 110 is first placed on the casting mold for forming the polishing wheel 100, and the raw material of the abrasive layer part 120 is filled on the outer circumferential surface of the body part 110 and then pressed through a press. By molding the polishing wheel 100 (S3).
다음으로, 성형이 완료된 상기 폴리싱휠(100)의 상기 지립층부(120)의 표면을 연마장치를 통해 연마하게 상기 지립층부(120)의 표면을 정리한다(S4).Next, the surface of the abrasive layer portion 120 is arranged to polish the surface of the abrasive layer portion 120 of the polishing wheel 100 where the molding is completed through a polishing apparatus (S4).
이후, 상기 지립층부(120)가 연마된 면에 존재하는 이물질을 에어브러쉬를 이용하여 제거한다(S5).Thereafter, the foreign material existing on the surface of the abrasive grain layer 120 polished is removed using an air brush (S5).
한편, 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 제조하는 방법은 크게, 혼합물 제조단계(S1-1), 혼합물 충진단계(S1-2), 1차 결합체 성형단계(S1-3), 냉각단계(S1-4), 다이아몬드 클러스터 파우더(Diamond Cluster powder) 생성단계(S1-5), 이물질 제거단계(S1-6) 및 건조단계(S1-7)로 이루어진다.On the other hand, the method for producing the diamond cluster powder (Diamond Cluster powder) is largely, the mixture preparation step (S1-1), the mixture filling step (S1-2), primary binder forming step (S1-3), cooling step ( S1-4), the diamond cluster powder (Diamond Cluster powder) generation step (S1-5), foreign matter removal step (S1-6) and drying step (S1-7).
상기 혼합물 제조단계(S1-1)는 크기가 1㎛ 이하로 형성된 다이아몬드 입자와 레진파우더(Resin powder), 경화촉진재, 이형재 및 접착제를 혼합하여 혼합물을 제조하는 단계이다.The mixture manufacturing step (S1-1) is a step of preparing a mixture by mixing diamond particles having a size of 1 μm or less, resin powder, a curing accelerator, a release material, and an adhesive.
이때, 경화촉진재는 산화마그네슘 등을 사용하는 것이 좋고, 이형재는 폴리비닐알코올, 파라핀, 테플론 디스퍼젼 등을 사용하는 것이 좋으며, 접착제는 폴리에틸렌수지, EVA계 접착제 등을 사용하는 것이 바람직하다.At this time, it is preferable to use magnesium oxide or the like as the curing accelerator, and the release material may be polyvinyl alcohol, paraffin, Teflon dispersion, or the like, and the adhesive is preferably polyethylene resin, EVA adhesive or the like.
한편, 상기한 재료들은 일정한 배합비를 통해 제조되는데, 크기가 1㎛ 이하로 형성된 다이아몬드 입자는 15 중량％∼40 중량％로, 레진파우더(Resin powder)는 35 중량％∼55 중량％로, 경화촉진재는 5 중량％∼10 중량％로, 이형재는 5 중량％∼10 중량％로, 접착제는 5 중량％∼10 중량％으로 계량하여 사용하는 것이 바람직하다. On the other hand, the above materials are manufactured through a constant mixing ratio, the diamond particles formed of less than 1㎛ size 15% to 40% by weight, resin powder (Resin powder) to 35% by weight to 55% by weight, promoting hardening It is preferable to measure and use the ash at 5 weight%-10 weight%, a mold release material at 5 weight%-10 weight%, and an adhesive agent at 5 weight%-10 weight%.
이후, 계량을 마친 혼합물은 믹싱기에 넣어 통해 3시간∼5시간 동안 잘 혼합하여 사용하는 것이 좋다.After that, it is good to use the mixture after mixing well for 3 hours to 5 hours through the mixing mixture.
상기 혼합물 충진단계(S1-2)는 혼합이 완료된 혼합물을 원형기둥 또는 사각기둥 등의 형태로 이루어진 보조금형에 충진시켜 혼합물을 막대형상으로 만들기 위한 준비단계이다.The mixture filling step (S1-2) is a preparation step for making the mixture into a rod shape by filling the mixture, the mixture is completed in the form of a circular pillar or a square pillar.
이 경우, 막대형상의 혼합물의 지름은 이후 분쇄과정에서 크기가 30㎛ ∼ 50㎛ 사이의 결합체로 형성되는 다이아몬드 클러스터 파우더(Diamond Cluster powder)가 생성될 수 있도록 15㎜ 이하의 형상으로 제조되는 것이 바람직하다.In this case, the diameter of the rod-shaped mixture is preferably manufactured in a shape of 15 mm or less so that diamond cluster powder, which is formed of a binder between 30 μm and 50 μm in size, may be produced in the subsequent grinding process. Do.
상기 1차 결합체 성형단계(S1-3)는 상기 보조금형에 충진된 막대형상의 혼합물을 열간프레스를 통해 소결작업하여 1차 결합체를 성형하는 단계이다.The primary binder forming step (S1-3) is a step of forming the primary binder by sintering the rod-shaped mixture filled in the auxiliary mold through a hot press.
보다 상세하게는 막대형상의 혼합물이 상기 보조금형에 충진된 상태에서 최초 상기 열간프레스의 소결작업조건은 1Ton∼5Ton의 압력을 가하고, 30℃∼40℃의 온도를 유지하며, 15분∼25분간 1차 소결작업을 실행한다.More specifically, in the state where the rod-shaped mixture is filled in the auxiliary mold, the sintering operation condition of the first hot press is applied at a pressure of 1Ton to 5Ton, and maintains a temperature of 30 ° C to 40 ° C for 15 minutes to 25 minutes. Carry out the first sintering operation.
이 경우, 1차 소결작업시 혼합물에 기공이 발생하므로 기공을 빼는 작업을 5회∼10회 정도 실행한다.In this case, since pores are generated in the mixture during the first sintering operation, the operation of removing the pores is performed 5 to 10 times.
다음, 상기 열간프레스의 소결작업조건은 10Ton∼15Ton의 압력을 가하고, 60℃∼70℃의 온도를 유지하며, 15분∼25분간 2차로 소결작업을 실행한다.Next, the sintering working conditions of the hot press is applied to a pressure of 10Ton to 15Ton, maintain the temperature of 60 ℃ to 70 ℃, and performs the second sintering work for 15 minutes to 25 minutes.
이때에도, 2차 소결작업시 혼합물에 기공이 발생하므로 기공을 빼는 작업을 5회∼10회 정도 실행한다. At this time, since the pores are generated in the mixture during the second sintering operation, the operation of removing the pores is performed 5 to 10 times.
2차 소결작업이 완료된 후에는 압력은 2차 소결작업때와 동일하게 하고 10분에 10℃씩 온도를 상승시켜 200℃까지 소결작업을 진행한다. 최종 200℃의 온도에서는 20분∼30분간 소결작업을 진행하는 것이 바람직하다.After completion of the second sintering operation, the pressure is the same as in the second sintering operation, and the sintering operation is carried out to 200 ° C by raising the temperature by 10 ° C in 10 minutes. It is preferable to perform a sintering operation for 20 to 30 minutes at the temperature of the last 200 degreeC.
상기 냉각단계(S1-4)는 소결작업이 완료된 상기 1차 결합체를 냉각시키는 단계로서, 냉각조건은 3시간∼5시간 동안 20℃의 온도로 이루어지는 것이 바람직하다.The cooling step (S1-4) is a step of cooling the primary assembly in which the sintering is completed, the cooling conditions are preferably made of a temperature of 20 ℃ for 3 to 5 hours.
상기 다이아몬드 클러스터 파우더(Diamond Cluster powder) 생성단계(S1-5)는 냉각이 완료된 상기 1차 결합체를 상기 보조금형으로부터 탈거한 후 막대형상의 상기 1차 결합체를 분쇄기에 넣어 3시간에서 4시간 동안 분쇄하여 크기가 30㎛ ∼ 50㎛ 사이의 결합체로 이루어진 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 생성하는 단계이다.In the diamond cluster powder production step (S1-5), the primary binder having been cooled is removed from the auxiliary mold, and the rod-shaped primary binder is put into a grinder and pulverized for 3 to 4 hours. To produce a diamond cluster powder (Diamond Cluster powder) consisting of a combination of the size between 30㎛ 50㎛.
상기 이물질 제거단계(S1-6)는 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 교반조에 넣어 30분에서 1시간 30분 정도 교반하여 이물질을 제거하는 단계이다.The foreign material removing step (S1-6) is a step of removing foreign matter by putting the diamond cluster powder (Diamond Cluster powder) in a stirring tank for 30 minutes to 1 hour 30 minutes.
상기 건조단계(S1-7)는 이물질이 제거된 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 원심분리기를 통해 탈수작업 후 건조하는 단계이다.The drying step (S1-7) is a step of drying after the dehydration operation of the diamond cluster powder (Diamond Cluster powder) from which the foreign matter is removed through a centrifuge.
이후 완성된 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)는 사용되는 폴리싱휠(100)의 입도조건에 맞게 다양한 크기의 메쉬망에 걸러 사용하는 것이 바람직하다.After the diamond cluster powder (Diamond Cluster powder) is completed is preferably used to filter the mesh network of various sizes in accordance with the particle size conditions of the polishing wheel 100 used.
도면과 명세서에서 최적 실시 예들이 개시되었다. 여기서 특정한 용어들이 사용되었으나, 이는 단지 본 발명을 설명하기 위한 목적에서 사용된 것이지 의미한정이나 특허청구범위에 기재된 본 발명의 범위를 제한하기 위하여 사용된 것은 아니다. 그러므로 본 기술 분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시 예가 가능하다는 점을 이해할 것이다. 따라서 본 발명의 진정한 기술적 보호범위는 첨부된 특허청구범위의 기술적 사상에 의해 정해져야 할 것이다.Optimal embodiments have been disclosed in the drawings and specification. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (7)

  1. 회전력을 이용하여 박판 유리(10)의 테두리면(11)을 연마하는 박판 유리 연마용 폴리싱휠(100)에 있어서,In the thin glass polishing polishing wheel 100 for polishing the rim surface 11 of the thin glass 10 using the rotational force,
    중앙에 휠삽입공(111)이 형성되는 원형상의 바디부(110);A circular body portion 110 in which a wheel insertion hole 111 is formed in the center;
    상기 바디부(110)의 외주면(112)을 감싸며 형성되되, 레진파우더(Resin powder), 다이아몬드 클러스터 파우더(Diamond Cluster powder), 연마재 및 광택재가 혼합되어 형성되는 지립층부(120);로 구성되는 것을 특징으로 하는 박판 유리 연마용 폴리싱휠(100).It is formed surrounding the outer circumferential surface 112 of the body portion 110, a resin layer, diamond cluster powder (Diamond Cluster powder), the abrasive layer portion 120 is formed by mixing the abrasive and polish material; Polishing wheel 100 for thin glass polishing, characterized in that.
  2. 제1항에 있어서,The method of claim 1,
    상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)는,The diamond cluster powder (Diamond Cluster powder),
    크기가 1㎛ 이하의 다수개의 다이아몬드 입자가 결합되어 크기가 30㎛ ∼ 50㎛ 사이의 결합체로 형성되는 것을 특징으로 하는 박판 유리 연마용 폴리싱휠(100).Polishing wheel for polishing thin glass (100), characterized in that a plurality of diamond particles having a size of 1 μm or less are bonded to each other to form a binder having a size of 30 μm to 50 μm.
  3. 회전력을 이용하여 박판 유리(10)의 테두리면(11)을 연마하는 박판 유리 연마용 폴리싱휠(100)의 제작방법에 있어서,In the manufacturing method of the thin glass polishing polishing wheel 100 for polishing the rim surface 11 of the thin glass 10 using the rotational force,
    크기가 1㎛ 이하의 다수개의 다이아몬드 입자가 결합되어 크기가 30㎛ ∼ 50㎛ 사이의 결합체로 형성되는 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 제조하는 단계(S1);Preparing a diamond cluster powder (Diamond Cluster powder) having a size of 1 μm or less of diamond particles bonded to each other to form a binder having a size of 30 μm to 50 μm (S1);
    상기 다이아몬드 클러스터 파우더(Diamond Cluster powder), 레진파우더(Resin powder), 연마재 및 광택재를 혼합, 교반하여 지립층부(120)의 원료를 제조하는 단계(S2);Preparing a raw material of the abrasive layer unit 120 by mixing and stirring the diamond cluster powder, a resin powder, an abrasive and a polishing material (S2);
    폴리싱휠(100)의 성형을 위한 주금형에 바디부(110)를 위치시키고, 상기 바디부(110)의 외주면에 상기 지립층부(120)의 원료를 충진하여 상기 폴리싱휠(100)을 성형하는 단계(S3);Positioning the body portion 110 in a casting mold for molding the polishing wheel 100, and filling the raw material of the abrasive layer portion 120 on the outer peripheral surface of the body portion 110 to shape the polishing wheel 100 Step S3;
    성형이 완료된 상기 폴리싱휠(100)의 상기 지립층부(120)의 표면을 연마하는 단계(S4);Polishing a surface of the abrasive layer portion 120 of the polishing wheel 100 in which molding is completed (S4);
    상기 지립층부(120)가 연마된 면에 존재하는 이물질을 제거하는 단계(S5);로 구성되는 것을 특징으로 하는 박판 유리 연마용 폴리싱휠의 제작방법.Step (S5) of removing the foreign matter present on the surface of the abrasive layer 120 is polished; manufacturing method of a thin glass polishing wheel for polishing.
  4. 제3항에 있어서,The method of claim 3,
    상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 제조하는 단계(S1)는,The step of producing the diamond cluster powder (Diamond Cluster powder) (S1),
    크기가 1㎛ 이하로 형성된 다이아몬드 입자, 레진파우더(Resin powder), 경화촉진재, 이형재 및 접착제를 혼합하여 혼합물을 제조하는 단계(S1-1);Preparing a mixture by mixing diamond particles having a size of 1 μm or less, resin powder, a curing accelerator, a releasing material, and an adhesive (S1-1);
    상기 혼합물을 원형기둥 또는 사각기둥 중 어느 하나의 형태로 이루어진 보조금형에 충진시키는 단계(S1-2);Filling the mixture into an auxiliary mold formed of any one of a circular column and a square column (S1-2);
    상기 보조금형에 충진된 혼합물을 열간프레스를 통해 소결작업하여 1차 결합체를 성형하는 단계(S1-3);Sintering the mixture filled in the auxiliary mold through hot pressing to form a primary binder (S1-3);
    소결작업이 완료된 상기 1차 결합체를 냉각시키는 단계(S1-4);Cooling the primary assembly in which sintering is completed (S1-4);
    냉각이 완료된 상기 1차 결합체를 상기 보조금형으로부터 탈거한 후 분쇄기를 통해 분쇄하여 크기가 30㎛ ∼ 50㎛ 사이의 결합체로 이루어진 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 생성하는 단계(S1-5);Removing the primary binder having been cooled from the auxiliary mold and pulverizing it through a grinder to generate diamond cluster powder (Diamond Cluster powder) having a size of 30 µm to 50 µm (S1-5);
    상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 교반조를 통해 교반하여 이물질을 제거하는 단계(S1-6);Removing the foreign matter by stirring the diamond cluster powder through a stirring tank (S1-6);
    이물질이 제거된 상기 다이아몬드 클러스터 파우더(Diamond Cluster powder)를 원심분리기를 통해 탈수작업 후 건조하는 단계(S1-7);로 이루어지는 것을 특징으로 하는 박판 유리 연마용 폴리싱휠의 제작방법. And drying the diamond cluster powder (Diamond Cluster powder) from which foreign matters are removed after dehydration through a centrifugal separator (S1-7); and manufacturing a polishing wheel for thin glass polishing.
  5. 제4항에 있어서,The method of claim 4, wherein
    상기 혼합물을 제조하는 단계(S1-1)는,Preparing the mixture (S1-1),
    크기가 1㎛ 이하로 형성된 다이아몬드 입자 15 중량％∼40 중량％, 레진파우더(Resin powder) 35 중량％∼55 중량％, 경화촉진재 5 중량％∼10 중량％, 이형재 5 중량％∼10 중량％ 및 접착제 5 중량％∼10 중량％의 비율로 계량한 후 3시간∼5시간 동안 혼합하는 것을 특징으로 하는 박판 유리 연마용 폴리싱휠의 제작방법.15% to 40% by weight of diamond particles having a size of 1 μm or less, 35% to 55% by weight of resin powder, 5% to 10% by weight of curing accelerator, 5% to 10% by weight of release material And measuring for 5 to 10 weight percent of the adhesive and then mixing for 3 to 5 hours.
  6. 제4항에 있어서,The method of claim 4, wherein
    상기 1차 결합체를 성형하는 단계(S1-3)는,Forming the primary binder (S1-3),
    상기 열간프레스의 소결작업조건을 압력 1Ton∼5Ton, 온도 30℃∼40℃, 시간 15분∼25분간 설정하여 1차 소결작업을 실행하고,The primary sintering operation is performed by setting the sintering working conditions of the hot press at a pressure of 1Ton to 5Ton, a temperature of 30 ° C to 40 ° C, and a time of 15 minutes to 25 minutes.
    상기 열간프레스의 소결작업조건을 압력 10Ton∼15Ton, 온도 60℃∼70℃, 시간 15분∼25분간 2차로 소결작업을 실행하며,The sintering work conditions of the hot press are sintered secondly at a pressure of 10Ton to 15Ton, a temperature of 60C to 70C, for 15 minutes to 25 minutes,
    이후에는 10분에 10℃씩 온도를 상승시켜 200℃까지 소결작업을 진행하는 것을 특징으로 하는 박판 유리 연마용 폴리싱휠의 제작방법.Thereafter, by increasing the temperature by 10 ℃ in 10 minutes to produce a polishing glass for thin glass polishing, characterized in that the sintering operation to 200 ℃.
  7. 제4항에 있어서,The method of claim 4, wherein
    상기 1차 결합체를 냉각시키는 단계(S1-4)는,Cooling the primary conjugate (S1-4),
    3시간∼5시간 동안 20℃의 온도에서 서냉시키는 것을 특징으로 하는 박판 유리 연마용 폴리싱휠의 제작방법.A method for producing a thin glass polishing polishing wheel, characterized by slow cooling at a temperature of 20 ° C. for 3 to 5 hours.
PCT/KR2019/002007 2018-02-22 2019-02-20 Method of preparing high-purity electrolyte solution for vanadium redox flow battery using catalytic reaction WO2019164226A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004034173A (en) * 2002-06-28 2004-02-05 Ebara Corp Fixed abrasive grain polishing tool
KR100524277B1 (en) * 2003-09-18 2005-10-26 김희남 magnetic abrasive with Ba-Ferrite and manufacturing method thereof
JP2007119650A (en) * 2005-10-31 2007-05-17 Nihon Micro Coating Co Ltd Abrasive material and method for producing the same
KR100790554B1 (en) * 2006-03-11 2008-01-02 주식회사 세한텍 Polishing Wheel for grinding of sheet glass edge and its manufacturing method
KR101525543B1 (en) * 2015-04-14 2015-06-03 박기태 Method for recycling waste-abrasive used in the lapping and polishing of semiconductor and industry wafer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004034173A (en) * 2002-06-28 2004-02-05 Ebara Corp Fixed abrasive grain polishing tool
KR100524277B1 (en) * 2003-09-18 2005-10-26 김희남 magnetic abrasive with Ba-Ferrite and manufacturing method thereof
JP2007119650A (en) * 2005-10-31 2007-05-17 Nihon Micro Coating Co Ltd Abrasive material and method for producing the same
KR100790554B1 (en) * 2006-03-11 2008-01-02 주식회사 세한텍 Polishing Wheel for grinding of sheet glass edge and its manufacturing method
KR101525543B1 (en) * 2015-04-14 2015-06-03 박기태 Method for recycling waste-abrasive used in the lapping and polishing of semiconductor and industry wafer

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