WO2019163586A1 - Mounting device - Google Patents
Mounting device Download PDFInfo
- Publication number
- WO2019163586A1 WO2019163586A1 PCT/JP2019/004924 JP2019004924W WO2019163586A1 WO 2019163586 A1 WO2019163586 A1 WO 2019163586A1 JP 2019004924 W JP2019004924 W JP 2019004924W WO 2019163586 A1 WO2019163586 A1 WO 2019163586A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- mounting
- magazine rack
- chip component
- stage
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 467
- 230000007246 mechanism Effects 0.000 claims abstract description 33
- 230000007723 transport mechanism Effects 0.000 claims description 27
- 230000004308 accommodation Effects 0.000 claims description 8
- 230000032258 transport Effects 0.000 description 24
- 238000000034 method Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Definitions
- the present invention relates to a mounting apparatus for mounting a chip component such as a semiconductor chip on a substrate. More specifically, the present invention relates to a mounting apparatus that takes out a substrate accommodated in a substrate magazine rack, mounts chip components, and then accommodates the substrate in a substrate magazine rack.
- a mounting apparatus for performing flip-chip mounting is such that a mounting head 5 mounts a chip component C such as a semiconductor chip on a substrate PB held by a substrate stage 4 in a mounting unit 3. 4 has a function of mounting the chip components C sequentially supplied from the chip component supply mechanism 6 at predetermined positions on the substrate PB while moving the substrate position.
- a chip component C such as a semiconductor chip
- 4 has a function of mounting the chip components C sequentially supplied from the chip component supply mechanism 6 at predetermined positions on the substrate PB while moving the substrate position.
- the conventional mounting apparatus includes a loader 211 having a function of pushing out the substrates PB one by one from the substrate magazine rack M1 that accommodates the substrates PB, and a chip component C at predetermined positions.
- mounted substrates MB an unloader having a function of accommodating the substrates (hereinafter referred to as mounted substrates MB) after being mounted on each in a substrate magazine rack (hereinafter referred to as mounted substrate magazine rack M2) different from the substrate magazine rack M1.
- mounted substrate magazine rack M2 a substrate magazine rack
- the substrate PB taken out from the substrate magazine rack M1 moves as indicated by a white arrow and is accommodated in the mounting substrate magazine rack M2 as a mounted substrate MB.
- a mounting apparatus having a configuration like the mounting apparatus 302 shown in FIG. 21 has been put into practical use from the viewpoint of improving productivity.
- two mounting parts (the mounting part 3A and the mounting part 3B) share the chip component supply mechanism 6, the loader 211, and the unloader 212, and are excellent in cost performance (Patent Document 1).
- FIG. 23A shows a top view of the mounted substrate MB in which the chip component C is mounted on the substrate PB, and the non-mounting area around the mounting area with respect to the mounting area AM on which the chip component C is mounted in the substrate PB. It can be seen that AF exists and the vacuum pad 291 in FIG. 22 can be adsorbed only in the non-mounting area.
- the size of the suction pad 291 that provides sufficient suction force to lift the substrate PB. can be selected.
- the substrate PB when the substrate PB is heated during the mounting process, the substrate PB is curved as shown in FIG. 24, and a gap VG is generated between the vacuum pad 291 and the substrate PB, which may make vacuum suction itself difficult. .
- the present invention has been made in view of the above problems, and provides a mounting apparatus that can reliably carry a substrate even when a chip component is mounted close to the outer periphery of the substrate.
- a mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in the substrate magazine rack, A substrate stage and a mounting head; and a mounting portion for mounting the chip component by the mounting head on the substrate disposed on the substrate stage; and the substrate at a receiving position in the substrate magazine rack, A substrate having a function of holding the outer edge portion of the substrate and transporting it onto the substrate stage, and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the substrate magazine rack while holding the outer edge portion.
- a mounting apparatus including a transport mechanism.
- the invention described in claim 2 A mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in a mounting substrate magazine rack,
- the substrate magazine rack and the mounting substrate magazine rack are arranged in a state in which the substrate take-out surface of the substrate magazine rack and the mounted substrate receiving surface of the mounting substrate magazine rack are arranged in the same direction on the same surface.
- Magazine rack moving mechanism to move in the aligned direction; A substrate stage and a mounting head; and a mounting portion for mounting the chip component by the mounting head on the substrate disposed on the substrate stage; and the substrate at a receiving position in the substrate magazine rack, A substrate having a function of holding the outer edge portion of the substrate and transporting it onto the substrate stage, and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the substrate magazine rack while holding the outer edge portion.
- a mounting apparatus including a transport mechanism.
- the substrate transport mechanism is a mounting device having a function of linearly transporting the substrate from the substrate magazine rack to the substrate stage in a direction perpendicular to the substrate take-out surface of the substrate magazine rack.
- the invention according to claim 4 is the mounting apparatus according to any one of claims 1 to 3,
- the mounting apparatus further includes a chip component supply mechanism for supplying the chip component to the mounting head.
- invention of Claim 5 is the mounting apparatus of Claim 4, Comprising: Two mounting portions, the substrate transport means corresponding to the mounting portions one-to-one,
- the chip component supply mechanism is a mounting apparatus that is disposed between the two mounting portions and has a function of supplying a chip component to each of the two mounting portions.
- FIG. 1 It is the schematic which shows the structure of the mounting apparatus which concerns on embodiment of this invention. It is sectional drawing explaining a substrate magazine rack, and is a figure which shows a substrate exit / entry state in the state in which (a) the board
- FIG. 7 is a diagram showing a state where a part of the substrate has reached the suction table, and (d) a state in which the substrate is pushed to a predetermined position on the suction table. It is a figure explaining operation
- FIG. 1 is a schematic diagram illustrating an apparatus configuration including a plurality of mounting units according to an embodiment of the present invention.
- FIG. 10 is a schematic diagram illustrating a device configuration including a plurality of mounting units according to the second embodiment of the present invention. It is the schematic which shows the apparatus structure of the conventional mounting apparatus. It is the schematic which shows the apparatus structure provided with the some mounting part with the conventional mounting apparatus.
- FIG. 1 is a schematic view showing an example of a mounting apparatus according to an embodiment of the present invention.
- 1 takes out a substrate PB from the substrate magazine rack M1, mounts a chip component C such as a semiconductor chip on the substrate PB, and mounts a mounted substrate MB on which a chip component C is mounted at a predetermined position of the substrate PB. It is accommodated in the magazine rack M1.
- FIG. 2A shows a cross-sectional view without the substrate PB
- FIG. A sectional view in which a substrate PB is accommodated is shown.
- the substrate PB is taken out by moving the substrates PB one by one in the surface direction, so that one of the four side surfaces of the substrate magazine rack M1 is the substrate PB.
- An opening for taking in and out is provided (hereinafter, a surface having an opening for taking out the substrate PB is referred to as a substrate taking-out surface).
- FIG. 3 shows a state in which the substrate PB is taken out from the substrate magazine rack M1 (FIG. 3A) and the mounted substrate MB is accommodated (FIG. 3B). As shown, new substrates PB can be sequentially taken out.
- a mounting apparatus 1 shown in FIG. 1 includes a gantry 2, a mounting part 3 having a substrate stage 4 and a mounting head 5, a chip component supply mechanism 6 having a chip component pickup unit 7 and a chip component transport unit 8, and a substrate transport mechanism 9. I have.
- the gantry 2 is a structure of the mounting apparatus 1 and is a basic structure that supports the substrate stage 4, the mounting head 5, the chip component pick-up means 7, the chip component transport means 8 and the substrate transport mechanism 9.
- the substrate stage 4 has a suction table 41, an XY drive mechanism 42, and a substrate clamp 43, and holds the substrate PB, moves the substrate PB in the in-plane direction, and moves the position where the chip component C is to be mounted.
- the suction table 41 has a function of sucking and holding the substrate PB
- the XY drive mechanism 42 has a function of moving and adjusting the position of the suction table 41 in the in-plane direction (XY direction) of the substrate PB
- the substrate clamp 43 is a substrate.
- it also has a function of clamping and fixing the sides of the substrate PB.
- the board clamp 43 includes a board rail 430 and a board guide 431 as constituent elements.
- the substrate rail 430 and the substrate guide 431 are fixed in the XY direction with respect to the suction table 41, but can be adjusted in the vertical direction (Z direction). That is, if the upper surface of the substrate rail 430 is made higher than the upper surface of the suction table 41, the substrate PB can be transported without contacting the suction table 41, and if the upper surface of the substrate rail 430 is made the same height as the upper surface of the suction table 41.
- the side of the substrate PB can be fixed on the suction table by the substrate guide 431.
- FIG. 5 shows an improved example incorporating the countermeasures
- FIG. 5A is a top view
- FIG. 5B is a cross-sectional view, but the end portions of the substrate rail 430 and the suction table 41 are shown. It has a comb-teeth shape. In this way, when the substrate PB transport state as shown in FIG. 6A is changed to the substrate PB fixed state as shown in FIG. 6B, the upper surface of the substrate rail 430 is lower than the suction table 41.
- the side portions of the substrate PB can be fixed by the convex portions at both ends of the suction table 41 and the substrate guide 431. For this reason, the side part of the substrate PB is not bent, which is also suitable when the non-mounting area on the side of the substrate PB is narrow.
- the mounting head 5 has a function of lowering the chip component C held at the tip and pressurizing and mounting the substrate PB.
- the function of heating the chip component simultaneously with the pressurization and the direction in the pressurizing surface May have a function of imparting ultrasonic vibration.
- the chip component C held at the tip may have a function of adjusting the angle by rotating around the Z direction as an axis.
- the word “mounting” is used on the assumption that the chip component is fixed to the substrate C together with heat and ultrasonic waves, but is not limited to this and is not cured.
- a case in which the chip component C is temporarily fixed on the substrate PB via the thermosetting adhesive is also included in the mounting in the present invention.
- the chip part pickup means 7 picks up the chip part C and delivers it to the chip part transport means 8.
- the chip component pick-up means 7 shows an example of picking up a chip component from the diced wafer substrate W, but the pickup source is not limited to this, and is housed in a container. Alternatively, the chip component C may be picked up.
- the chip component conveying means 8 conveys the chip component C delivered by the chip component pickup means 7 to the mounting head 5 and delivers the chip component C to the mounting head 5.
- the substrate transport mechanism 9 takes out the substrate PB from the substrate magazine rack M1 and transports it to the substrate stage 4 as shown in FIG. 7, and transports the mounted substrate MB from the substrate stage 4 and stores it in the substrate magazine rack M1. It has both functions.
- FIGS. 1 and 7 only the transport rail 90 constituting the substrate transport mechanism 9 is shown. However, as shown in FIGS. 8A and 8B, the end of the substrate PB is held. Have the function of conveying.
- the stage side holding part 91 has a function of holding (and releasing) the edge of the substrate PB (or the mounted board MB) on the substrate stage 4 side. It is provided on the Z arm 92 and can be moved up and down (Z direction) by the operation of the Z arm 92.
- the magazine rack side holding unit 96 has a function of holding (and releasing) the edge of the substrate PB (or the mounted substrate MB) on the substrate magazine rack M1 side (opposite the substrate stage 4 side).
- the magazine rack side holding portion 96 is provided on the Z arm 97 and can be moved up and down (Z direction) by the operation of the Z arm 97.
- the stage side holding part 91 and the magazine rack side holding part 96 hold preferably 1 mm or more from the outer edge, and preferably hold deeply according to the non-mounting area of the substrate PB, but at most 8 mm. Is enough.
- the Z arm 92 has a movable range in which the edge of the substrate PB (or the mounted substrate MB) held by the stage side holding portion 91 can be pushed and pulled in the horizontal direction.
- the Z arm 97 is on the magazine rack side.
- the movable part has a movable range in which the edge of the substrate PB (or the mounted substrate MB) held by the holding unit 96 can be pushed and pulled in the horizontal direction.
- a specific example is an embodiment whose top view is shown in FIG.
- the Z arm 92 has a movable range in the Y direction along the slide rail 94 via the X arm 93, and the Z arm 97 is also connected to the slide rail 99 via the X arm 98. It has a movable range along. That is, the substrate transport mechanism 9 in this embodiment includes a transport rail 90, a stage side holding portion 91, a Z arm 92, an X arm 93, a slide rail 94, a magazine rack side holding portion 96, a Z arm 97, an X arm 98, and a slide.
- a rail 99 is included as a component.
- FIG. 9A shows a state in which the substrate PB is taken out from the substrate magazine rack M1.
- the substrate take-out surface of the substrate magazine rack M1 faces the suction table 41, and the substrate PB (to be taken out) is arranged on a straight line extending from the suction table 41 to the substrate transport mechanism 9.
- the substrate transport mechanism 9 operates so that the stage side holding portion 91 holds the edge on the stage side (the upper side in the figure) of the substrate PB at the accommodation position in the substrate magazine rack M1.
- the substrate transport mechanism 9 holds the substrate PB and pulls it toward the stage as shown in FIG. 9B. At that time, since the substrate PB moves while being placed on the transport rail 90, even if only one edge is held, it can be moved horizontally.
- the substrate guide 431 forms a gap with the substrate rail 430 to the extent that the substrate PB is allowed to pass through and the deformation such as warpage of the substrate PB is restricted.
- the substrate guide 431 also has a role of regulating the width of the substrate PB.
- a mechanism that can adjust the length of the X arm may be provided so that the position of the substrate in the X direction can be corrected in the stage of FIG. 9B.
- the magazine rack side holding portion 96 is changed into the substrate PB as shown in FIG.
- the magazine rack side edge is held, and the stage side holding portion 91 releases the holding and moves to the standby position.
- the substrate PB held by the magazine rack side holding unit 96 is pushed to a predetermined position on the suction table 41 as shown in FIG.
- the magazine rack side holding unit 96 releases the holding and moves away from the suction table 41 as shown in FIG. Thereafter, the substrate rail 430 constituting the substrate clamp 43 is lowered so that the upper surface is the same height as the upper surface of the suction table 41 (or the suction table 41 is raised) as shown in FIG. From this state, the suction table 41 sucks the substrate PB, and the substrate guide 431 descends, sandwiches the side of the substrate PB together with the substrate rail 430, and fixes the substrate PB on the suction table 41.
- the self-running head 5 sequentially mounts the chip components C supplied by the chip component supply mechanism 6 on the substrate PB while moving the substrate PB together with the suction table 41 by the XY drive mechanism 42 constituting the substrate stage 4. Then, the mounted board MB is obtained as shown in FIG.
- the mounted substrate MB is transported from the suction table 41 and stored in the substrate magazine rack M1.
- the suction by the suction stage 41 is released, the substrate rail 430 is raised (or the suction table 41 is lowered), and the substrate The guide 431 is raised with respect to the board rail 430 so that the mounted board MB can slide on the board rail 430 as shown in FIG.
- the upper surface of the substrate rail 430 is made equal to the upper surface of the transport rail 90.
- the magazine rack side holding portion 96 holds the edge of the mounted substrate MB on the substrate magazine rack side as shown in FIG. 10 (h), and pulls it toward the magazine rack side as shown in FIG. 11 (i).
- the magazine rack side holding unit 96 cannot move the mounted substrate MB to the inside of the substrate take-out surface of the substrate magazine rack M1. Therefore, as shown in FIG. 11 (j), the stage side holding portion 91 holds the edge of the mounted substrate MB on the stage side, and the magazine rack side holding portion 96 releases the holding and returns to the standby position.
- the stage-side holding unit 91 holds the mounted substrate MB and pushes it toward the magazine rack (FIG. 11 (k)), and transports the mounted substrate MB to the accommodation position of the substrate magazine rack M1 (FIG. 11). 11 (l)).
- the board transport mechanism 9 of the present invention is a mechanism that linearly moves the board PB (and the mounted board MB) on the rail, and has a limited edge of the board PB (mounted board MB). Even if the range is maintained, it can be reliably conveyed. For this reason, even if the chip component is mounted up to the vicinity of the outer periphery of the substrate PB, the substrate can be reliably conveyed.
- FIG. 12 it has already been described that the apparatus configuration in which the substrate PB (or the mounted substrate MB) is transported only by the stage-side holding unit 91 is disadvantageous in terms of apparatus space.
- FIG. 13 It is possible to adopt a configuration in which the magazine rack side holding portion 96 is also installed on the Z arm 92 on which the side holding portion 91 is installed.
- the configuration is shown in FIG. 13 as a modification of the present embodiment.
- FIGS. 13 (a) to 13 (d) show a state in which the states shown in FIGS. 9 (a) to 9 (d) are implemented in a modified example.
- FIGS. ) To FIG. 11 (l) can also be implemented in a modified example.
- the substrate PB accommodated in the substrate magazine rack M1 is returned to the original substrate magazine rack M1 as the mounted substrate MB, but the mounted substrate MB is placed in a magazine rack different from the substrate magazine rack M1. In some cases it is desirable to accommodate.
- a general substrate magazine rack is often made of resin, but when a heat treatment or the like is performed in a subsequent process of the mounted substrate MB, the substrate magazine rack may be put in an oven.
- the substrate magazine rack that accommodates the mounted substrate MB may be made of metal, and a mounting substrate magazine rack M2 for accommodating the mounted substrate MB may be provided separately from the substrate magazine rack M1. is there.
- the mounting substrate magazine rack M2 When the mounting substrate magazine rack M2 is provided separately from the substrate magazine rack M1, there is a configuration in which the substrate magazine rack M1, the suction table 41, and the mounting substrate magazine rack M2 are arranged linearly as shown in FIG. However, in the configuration of FIG. 14, two substrate transport mechanisms are required separately from the substrate magazine rack M1 to the suction table 41 and from the suction table 41 to the mounting substrate magazine rack M2, and a corresponding space is also required.
- FIG. 15 is a schematic view of the mounting apparatus 101 according to the second embodiment of the present invention. 15, symbols common to those of the mounting apparatus 1 of FIG. 1 have the same functions, but a mounting board magazine rack M2 and a magazine rack moving mechanism 10 are added to the mounting apparatus 101.
- the mounting apparatus 101 takes out the substrate PB from the substrate magazine rack M1, mounts the chip component C such as a semiconductor chip on the substrate PB, and mounts the mounted substrate MB on which the chip component C is mounted at a predetermined position of the substrate PB. It is housed in M2. Similarly to the substrate magazine rack M1, the mounting substrate magazine rack M2 has an opening for accommodating the mounted substrate MB (hereinafter referred to as an opening for accommodating the mounted substrate MB). The surface is referred to as the mounting board receiving surface).
- the substrate take-out surface of the substrate magazine rack M1 and the mounting substrate accommodation surface of the mounting substrate magazine rack M2 are arranged so as to be aligned in the same direction on the same surface. Further, in the magazine rack moving mechanism 10, either the substrate take-out surface of the substrate magazine rack M1 or the mounting substrate receiving surface of the mounting substrate magazine rack M2 is arranged on a straight line that continues from the mounting stage 4 to the substrate transport mechanism 9. As described above, the substrate magazine rack M1 and the mounting substrate magazine rack M2 are moved in the direction in which the substrate magazine rack M1 and the mounting substrate magazine rack M2 are arranged.
- FIGS. 16A and 16B show the state in which the substrate PB is pulled out from the substrate magazine M1, and the operation of the substrate transport mechanism 9 is shown in FIGS. 9A and 9B.
- the magazine rack moving mechanism 10 arranges the substrate magazine rack M1 on a straight line extending from the mounting stage 4 to the substrate transport mechanism 9.
- the substrate transport mechanism 9 of the mounting apparatus 101 also arranges the substrate PB on the suction table 41 as shown in FIGS. 9C to 10F in the same manner as the mounting apparatus 1, and the semiconductor chip C Is mounted so that the mounted substrate MB mounted on the suction table 41 is carried out.
- the magazine rack moving mechanism 10 operates so as to arrange the mounted substrate magazine rack M2 on a straight line continuous from the mounting stage 4 to the substrate transport mechanism 9. That is, after the magazine rack side of the substrate PB comes out of the substrate magazine rack M1, the magazine rack moving mechanism 10 moves the mounted substrate magazine rack M2 while the magazine rack side of the mounted substrate MB exists on the transport rail 90. Are arranged on a straight line extending from the mounting stage 4 to the substrate transport mechanism 9.
- the substrate transport mechanism 9 transports the mounted substrate MB to the accommodation position of the mounting substrate magazine rack M2.
- the substrate magazine rack M1 is again arranged on a straight line extending from the mounting stage 4 to the substrate transport mechanism 9 (FIG. 17 ( e))
- the substrate PB is pulled out from the substrate magazine rack M1 (same as in FIG. 16A). The above operation is continued until there is no substrate PB in the substrate magazine rack M1 or until the mounted substrate magazine rack M2 is filled with the mounted substrates MB.
- the transport from the substrate magazine rack M1 to the suction table 41, and the suction table 41 to the mounting substrate are performed. Since the transport to the magazine rack M2 is shared by one transport mechanism, the space efficiency is excellent.
- the mounting substrate PB is rectangular, if the longitudinal direction of the substrate is the substrate transport direction (Y direction in FIG. 15), the movement direction of the substrate magazine rack M1 and the mounting substrate magazine rack M2 by the magazine rack moving mechanism 10 is Due to the short direction of the substrate, the movement distance is short and the space and the apparatus load are excellent.
- the present invention requires neither the loader 211 nor the unloader and the space required for substrate transport is smaller than that of the mounting apparatus 301 as shown in FIG. Therefore, the present invention is effective even in a mounting apparatus having a plurality of mounting portions, such as a mounting apparatus 101 shown in FIG. 18 or a mounting apparatus 202 shown in FIG. That is, the mounting apparatus 202 of FIG. 19 also requires a magazine rack moving mechanism (10A, 10B) for each mounting unit, but the transport distance of the substrate PB (and the mounted substrate MB) is short, so FIG. Compared to the mounting apparatus 302 shown, the apparatus can be made more compact.
- the mounted substrate MB obtained by the mounting unit 3A and the mounted substrate MB obtained by the mounting unit 3B are accommodated in the same mounting substrate magazine rack M2. It may be necessary to consider the influence of machine differences between the part 3A and the mounting part 3B in a subsequent process. Specifically, when changing the conditions for each mounting unit in a subsequent process as necessary while tracking in which mounting unit the mounted substrate MB accommodated in the mounting substrate magazine rack M2 is mounted There is. On the other hand, in the mounting apparatus 101 shown in FIG. 18 and the mounting apparatus 202 shown in FIG. 19, the mounted boards MB accommodated in the mounting board magazine rack M2 (the board magazine rack M1 in the mounting apparatus 201 in FIG. 18).
- the chip component C is a semiconductor chip and the substrate PB has a quadrangular shape.
- the substrate PB may be circular like a wafer substrate, and the material may be selected from semiconductor materials such as resin, ceramics, and silicon, and composite materials thereof.
- the chip component C is not limited to a semiconductor chip, and may be a chip of a passive element such as a resistor or a capacitance.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Provided is a mounting device capable of reliably transferring a substrate even in the cases where a chip component is to be mounted to the vicinity of the outer periphery of the substrate. Specifically, a mounting device, which takes out a substrate stored in a substrate magazine rack, mounts a chip component on the substrate, and then stores, in the substrate magazine rack, the substrate having the chip component mounted thereon is provided. The mounting device is equipped with a mounting unit, which has a substrate stage and a mounting head, and which mounts, using the mounting head, the chip component on the substrate disposed on the substrate stage. The mounting device is also equipped with a substrate transfer mechanism having: a function of transferring the substrate onto the substrate stage by holding an outer edge portion of the substrate, said substrate having been at a storing position in the substrate magazine rack; and a function of transferring the substrate having the component mounted thereon from the substrate stage to the storing position in the substrate magazine rack by holding the outer edge portion.
Description
本発明は半導体チップ等のチップ部品を基板に実装する実装装置に関する。より詳しくは基板マガジンラックに収容された基板を取り出し、チップ部品を実装してから基板マガジンラックに収容する実装装置に関する。
The present invention relates to a mounting apparatus for mounting a chip component such as a semiconductor chip on a substrate. More specifically, the present invention relates to a mounting apparatus that takes out a substrate accommodated in a substrate magazine rack, mounts chip components, and then accommodates the substrate in a substrate magazine rack.
フリップチップ実装等を行なう実装装置は図20に示すように、実装部3において、基板ステージ4が保持した基板PBに、実装ヘッド5が半導体チップ等のチップ部品Cを実装するもので、基板ステージ4が基板位置を移動させながらチップ部品供給機構6から順次供給されるチップ部品Cを基板PB上の所定箇所に実装する機能を有している。
As shown in FIG. 20, a mounting apparatus for performing flip-chip mounting is such that a mounting head 5 mounts a chip component C such as a semiconductor chip on a substrate PB held by a substrate stage 4 in a mounting unit 3. 4 has a function of mounting the chip components C sequentially supplied from the chip component supply mechanism 6 at predetermined positions on the substrate PB while moving the substrate position.
また、従来の実装装置は、図20に示す実装装置301のように、基板PBを収容する基板マガジンラックM1から基板PBを1枚ずつ押し出す機能を有したローダ211と、チップ部品Cを所定箇所に実装した後の基板(以後、実装済基板MBと記す)を基板マガジンラックM1とは別の基板マガジンラック(以後、実装基板マガジンラックM2と記す)に1枚ずつ収容する機能を有したアンローダ212を備えており、基板マガジンラックM1から取り出された基板PBは白抜き矢印のように移動して実装済基板MBとして実装基板マガジンラックM2に収容される。
Further, as in the mounting apparatus 301 shown in FIG. 20, the conventional mounting apparatus includes a loader 211 having a function of pushing out the substrates PB one by one from the substrate magazine rack M1 that accommodates the substrates PB, and a chip component C at predetermined positions. An unloader having a function of accommodating the substrates (hereinafter referred to as mounted substrates MB) after being mounted on each in a substrate magazine rack (hereinafter referred to as mounted substrate magazine rack M2) different from the substrate magazine rack M1. 212, and the substrate PB taken out from the substrate magazine rack M1 moves as indicated by a white arrow and is accommodated in the mounting substrate magazine rack M2 as a mounted substrate MB.
なお、最近では生産性向上の観点から図21に示す実装装置302のような構成の実装装置も実用化されている。実装装置302では、2つの実装部(実装部3Aと実装部3B)がチップ部品供給機構6、ローダ211およびアンローダ212を共有しており、コストパフォーマンスに優れている(特許文献1)。
Recently, a mounting apparatus having a configuration like the mounting apparatus 302 shown in FIG. 21 has been put into practical use from the viewpoint of improving productivity. In the mounting apparatus 302, two mounting parts (the mounting part 3A and the mounting part 3B) share the chip component supply mechanism 6, the loader 211, and the unloader 212, and are excellent in cost performance (Patent Document 1).
ところで、従来、図20および図21の白抜き矢印で示したように基板PBおよび実装済基板MBを移動させるのに際して、基板上面の四隅を吸着して吊上げる方法が用いられてきた。すなわち、図22に示すような先端部に真空パッド291を有する吊上アーム290を用い、基板PB(または実装済基板MB)を吊上げた状態でレール等により所定箇所に搬送してから降下して吸着解除するという手法が用いられている(例えば特許文献2)。
By the way, conventionally, when the substrate PB and the mounted substrate MB are moved as shown by the white arrows in FIGS. 20 and 21, a method of attracting and lifting the four corners of the upper surface of the substrate has been used. That is, using a lifting arm 290 having a vacuum pad 291 at the tip as shown in FIG. 22, the substrate PB (or mounted substrate MB) is lifted and conveyed to a predetermined location by a rail or the like, and then lowered. A technique of releasing adsorption is used (for example, Patent Document 2).
図23(a)に基板PBにチップ部品Cを実装した実装済基板MBの上面図を示すが、基板PB内においてチップ部品Cを実装する実装エリアAMに対して実装エリアの周囲に非実装エリアAFが存在し、図22の真空パッド291が吸着できるのが非実装エリアに限定されることが判る。ここで、図23(a)のように、基板PBのサイズに対して非実装エリアの比率が比較的大きい場合は、基板PBを吊上げるのに充分な吸着力が得られる吸着パッド291のサイズを選定することが出来る。
FIG. 23A shows a top view of the mounted substrate MB in which the chip component C is mounted on the substrate PB, and the non-mounting area around the mounting area with respect to the mounting area AM on which the chip component C is mounted in the substrate PB. It can be seen that AF exists and the vacuum pad 291 in FIG. 22 can be adsorbed only in the non-mounting area. Here, as shown in FIG. 23A, when the ratio of the non-mounting area is relatively large with respect to the size of the substrate PB, the size of the suction pad 291 that provides sufficient suction force to lift the substrate PB. Can be selected.
ところが、最近では、1枚の基板PBに極力多くのチップ部品Cを実装することが求められており、図23(b)に示すように非実装エリアAFが狭まり、真空パッド291も小さくせざるを得なくなっている。このため、基板PBを吊上げるのに充分な吸着力を得るのが困難となっている。
However, recently, it has been required to mount as many chip components C as possible on a single substrate PB. As shown in FIG. 23B, the non-mounting area AF is narrowed, and the vacuum pad 291 has to be reduced. Is getting lost. For this reason, it is difficult to obtain a sufficient suction force for lifting the substrate PB.
更に、実装過程において基板PBが加熱される場合においては、図24のように基板PBが湾曲して、真空パッド291と基板PBの間に空隙VGが生じ真空吸着自体が困難となることもある。
Further, when the substrate PB is heated during the mounting process, the substrate PB is curved as shown in FIG. 24, and a gap VG is generated between the vacuum pad 291 and the substrate PB, which may make vacuum suction itself difficult. .
本発明は上記課題に鑑みてなされたものであり、チップ部品を基板の外周近くまで実装する場合においても、基板搬送を確実に行うことが可能な実装装置を提供するものである。
The present invention has been made in view of the above problems, and provides a mounting apparatus that can reliably carry a substrate even when a chip component is mounted close to the outer periphery of the substrate. *
上記の課題を解決するために、請求項1に記載の発明は、
基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を前記基板マガジンラックに収容する実装装置であって、
基板ステージと実装ヘッドとを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、前記基板マガジンラック内の収容位置にある前記基板を、前記基板の外縁部を保持して前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から外縁部を保持して前記基板マガジンラックの収容位置まで搬送する機能と、を有する基板搬送機構とを備えた実装装置である。 In order to solve the above problems, the invention described inclaim 1
A mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in the substrate magazine rack,
A substrate stage and a mounting head; and a mounting portion for mounting the chip component by the mounting head on the substrate disposed on the substrate stage; and the substrate at a receiving position in the substrate magazine rack, A substrate having a function of holding the outer edge portion of the substrate and transporting it onto the substrate stage, and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the substrate magazine rack while holding the outer edge portion. A mounting apparatus including a transport mechanism.
基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を前記基板マガジンラックに収容する実装装置であって、
基板ステージと実装ヘッドとを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、前記基板マガジンラック内の収容位置にある前記基板を、前記基板の外縁部を保持して前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から外縁部を保持して前記基板マガジンラックの収容位置まで搬送する機能と、を有する基板搬送機構とを備えた実装装置である。 In order to solve the above problems, the invention described in
A mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in the substrate magazine rack,
A substrate stage and a mounting head; and a mounting portion for mounting the chip component by the mounting head on the substrate disposed on the substrate stage; and the substrate at a receiving position in the substrate magazine rack, A substrate having a function of holding the outer edge portion of the substrate and transporting it onto the substrate stage, and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the substrate magazine rack while holding the outer edge portion. A mounting apparatus including a transport mechanism.
請求項2に記載の発明は、
基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を実装基板マガジンラックに収容する実装装置であって、
前記基板マガジンラックの基板取り出し面と、前記実装基板マガジンラックの実装済基板収容面とを同一面上の同一方向にして並べた状態に配置して、前記基板マガジンラックと前記実装基板マガジンラックを並べた方向に移動させるマガジンラック移動機構と、
基板ステージと実装ヘッドとを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、前記基板マガジンラック内の収容位置にある前記基板を、前記基板の外縁部を保持して前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から外縁部を保持して前記基板マガジンラックの収容位置まで搬送する機能と、を有する基板搬送機構とを備えた実装装置である。 The invention described inclaim 2
A mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in a mounting substrate magazine rack,
The substrate magazine rack and the mounting substrate magazine rack are arranged in a state in which the substrate take-out surface of the substrate magazine rack and the mounted substrate receiving surface of the mounting substrate magazine rack are arranged in the same direction on the same surface. Magazine rack moving mechanism to move in the aligned direction;
A substrate stage and a mounting head; and a mounting portion for mounting the chip component by the mounting head on the substrate disposed on the substrate stage; and the substrate at a receiving position in the substrate magazine rack, A substrate having a function of holding the outer edge portion of the substrate and transporting it onto the substrate stage, and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the substrate magazine rack while holding the outer edge portion. A mounting apparatus including a transport mechanism.
基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を実装基板マガジンラックに収容する実装装置であって、
前記基板マガジンラックの基板取り出し面と、前記実装基板マガジンラックの実装済基板収容面とを同一面上の同一方向にして並べた状態に配置して、前記基板マガジンラックと前記実装基板マガジンラックを並べた方向に移動させるマガジンラック移動機構と、
基板ステージと実装ヘッドとを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、前記基板マガジンラック内の収容位置にある前記基板を、前記基板の外縁部を保持して前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から外縁部を保持して前記基板マガジンラックの収容位置まで搬送する機能と、を有する基板搬送機構とを備えた実装装置である。 The invention described in
A mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in a mounting substrate magazine rack,
The substrate magazine rack and the mounting substrate magazine rack are arranged in a state in which the substrate take-out surface of the substrate magazine rack and the mounted substrate receiving surface of the mounting substrate magazine rack are arranged in the same direction on the same surface. Magazine rack moving mechanism to move in the aligned direction;
A substrate stage and a mounting head; and a mounting portion for mounting the chip component by the mounting head on the substrate disposed on the substrate stage; and the substrate at a receiving position in the substrate magazine rack, A substrate having a function of holding the outer edge portion of the substrate and transporting it onto the substrate stage, and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the substrate magazine rack while holding the outer edge portion. A mounting apparatus including a transport mechanism.
請求項3に記載の発明は、請求項1または請求項2に記載の実装装置であって、
前記基板搬送機構は、前記基板を、前記基板マガジンラックから前記基板ステージ上まで、前記基板マガジンラックの基板取り出し面に対して直角方向に直線搬送する機能を有する実装装置である。 Invention ofClaim 3 is the mounting apparatus of Claim 1 or Claim 2, Comprising:
The substrate transport mechanism is a mounting device having a function of linearly transporting the substrate from the substrate magazine rack to the substrate stage in a direction perpendicular to the substrate take-out surface of the substrate magazine rack.
前記基板搬送機構は、前記基板を、前記基板マガジンラックから前記基板ステージ上まで、前記基板マガジンラックの基板取り出し面に対して直角方向に直線搬送する機能を有する実装装置である。 Invention of
The substrate transport mechanism is a mounting device having a function of linearly transporting the substrate from the substrate magazine rack to the substrate stage in a direction perpendicular to the substrate take-out surface of the substrate magazine rack.
請求項4に記載の発明は、請求項1から請求項3のいずれかの請求項に記載の実装装置であって、
前記実装ヘッドに前記チップ部品を供給するチップ部品供給機構を更に備えた実装装置である。 The invention according toclaim 4 is the mounting apparatus according to any one of claims 1 to 3,
The mounting apparatus further includes a chip component supply mechanism for supplying the chip component to the mounting head.
前記実装ヘッドに前記チップ部品を供給するチップ部品供給機構を更に備えた実装装置である。 The invention according to
The mounting apparatus further includes a chip component supply mechanism for supplying the chip component to the mounting head.
請求項5に記載の発明は、請求項4記載の実装装置であって、
前記実装部を2つ備え、前記実装部夫々と1対1で対応する前記基板搬送手段を備え、
前記チップ部品供給機構は、前記2つの実装部の間に配置され、2つの前記実装部夫々にチップ部品を供給する機能を有する実装装置である。 Invention ofClaim 5 is the mounting apparatus of Claim 4, Comprising:
Two mounting portions, the substrate transport means corresponding to the mounting portions one-to-one,
The chip component supply mechanism is a mounting apparatus that is disposed between the two mounting portions and has a function of supplying a chip component to each of the two mounting portions.
前記実装部を2つ備え、前記実装部夫々と1対1で対応する前記基板搬送手段を備え、
前記チップ部品供給機構は、前記2つの実装部の間に配置され、2つの前記実装部夫々にチップ部品を供給する機能を有する実装装置である。 Invention of
Two mounting portions, the substrate transport means corresponding to the mounting portions one-to-one,
The chip component supply mechanism is a mounting apparatus that is disposed between the two mounting portions and has a function of supplying a chip component to each of the two mounting portions.
本発明により、チップ部品を基板の外周近くまで実装する場合においても、基板搬送を確実に行うことが可能な実装装置が提供できる。
According to the present invention, it is possible to provide a mounting apparatus capable of reliably carrying a substrate even when chip components are mounted close to the outer periphery of the substrate. *
本発明の実施形態について、図面を用いて説明する。
図1は本発明の実施形態に係る実装装置の一例を示す概略図である。図1の実装装置1は、基板マガジンラックM1から基板PBを取り出し、基板PBに半導体チップ等のチップ部品Cを実装し、基板PBの所定箇所にチップ部品Cを実装した実装済基板MBを基板マガジンラックM1に収容するものである。 Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic view showing an example of a mounting apparatus according to an embodiment of the present invention. 1 takes out a substrate PB from the substrate magazine rack M1, mounts a chip component C such as a semiconductor chip on the substrate PB, and mounts a mounted substrate MB on which a chip component C is mounted at a predetermined position of the substrate PB. It is accommodated in the magazine rack M1.
図1は本発明の実施形態に係る実装装置の一例を示す概略図である。図1の実装装置1は、基板マガジンラックM1から基板PBを取り出し、基板PBに半導体チップ等のチップ部品Cを実装し、基板PBの所定箇所にチップ部品Cを実装した実装済基板MBを基板マガジンラックM1に収容するものである。 Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic view showing an example of a mounting apparatus according to an embodiment of the present invention. 1 takes out a substrate PB from the substrate magazine rack M1, mounts a chip component C such as a semiconductor chip on the substrate PB, and mounts a mounted substrate MB on which a chip component C is mounted at a predetermined position of the substrate PB. It is accommodated in the magazine rack M1.
ここで、基板マガジンラックM1は、基板PB同士を適度な隙間を開けて積層収容するものであり、図2(a)に基板PBが入っていない断面図を示し、図2(b)には基板PBが収容された断面図を示している。また、基板PBの取り出しは、図2(b)に示すように、基板PBを1枚ずつ面方向に移動させて行なうため、基板マガジンラックM1の4側面の中の1面は、基板PBの出し入れを行なう開口を有している(以下、基板PBを取り出す開口を有する面を基板取り出し面と記す)。
Here, the substrate magazine rack M1 stacks and accommodates the substrates PB with an appropriate gap, and FIG. 2A shows a cross-sectional view without the substrate PB, and FIG. A sectional view in which a substrate PB is accommodated is shown. Further, as shown in FIG. 2B, the substrate PB is taken out by moving the substrates PB one by one in the surface direction, so that one of the four side surfaces of the substrate magazine rack M1 is the substrate PB. An opening for taking in and out is provided (hereinafter, a surface having an opening for taking out the substrate PB is referred to as a substrate taking-out surface).
図3は、基板マガジンラックM1から基板PBを取り出して(図3(a)、実装済基板MBを収容する(図3(b))様子を示したものであるが、図3(c)に示すように順次新たな基板PBを取り出せるようになっている。
FIG. 3 shows a state in which the substrate PB is taken out from the substrate magazine rack M1 (FIG. 3A) and the mounted substrate MB is accommodated (FIG. 3B). As shown, new substrates PB can be sequentially taken out.
図1の実装装置1は、架台2、基板ステージ4と実装ヘッド5を有する実装部3、チップ部品ピックアップ手段7とチップ部品搬送手段8とを有するチップ部品供給機構6、および基板搬送機構9を備えている。
A mounting apparatus 1 shown in FIG. 1 includes a gantry 2, a mounting part 3 having a substrate stage 4 and a mounting head 5, a chip component supply mechanism 6 having a chip component pickup unit 7 and a chip component transport unit 8, and a substrate transport mechanism 9. I have.
架台2は実装装置1の構造体であり、基板ステージ4、実装ヘッド5、チップ部品ピックアップ手段7、チップ部品搬送手段8および基板搬送機構9を支持する基礎構造体となっている。
The gantry 2 is a structure of the mounting apparatus 1 and is a basic structure that supports the substrate stage 4, the mounting head 5, the chip component pick-up means 7, the chip component transport means 8 and the substrate transport mechanism 9.
基板ステージ4は、吸着テーブル41、XY駆動機構42、基板クランプ43を有し、基板PBを保持するとともに、基板PBを面内方向に移動させ、チップ部品Cを実装すべき位置を移動させる機能を有している。吸着テーブル41は基板PBを吸着保持する機能を有し、XY駆動機構42は基板PBの面内方向(XY方向)に吸着テーブル41を移動させ位置調整する機能を有し、基板クランプ43は基板PBを吸着テーブル41に搬送する際のガイドとして機能するとともに、基板PBの側辺をクランプして固定する機能も有している。
The substrate stage 4 has a suction table 41, an XY drive mechanism 42, and a substrate clamp 43, and holds the substrate PB, moves the substrate PB in the in-plane direction, and moves the position where the chip component C is to be mounted. have. The suction table 41 has a function of sucking and holding the substrate PB, the XY drive mechanism 42 has a function of moving and adjusting the position of the suction table 41 in the in-plane direction (XY direction) of the substrate PB, and the substrate clamp 43 is a substrate. In addition to functioning as a guide when transporting the PB to the suction table 41, it also has a function of clamping and fixing the sides of the substrate PB.
図4(a)に示すように、基板クランプ43は、基板レール430と基板ガイド431を構成要素としている。基板レール430および基板ガイド431は吸着テーブル41に対しXY方向には固定されているものの、上下方向(Z方向)には位置調整可能になっている。すなわち、基板レール430上面を吸着テーブル41の上面より高くすれば、基板PBを吸着テーブル41と接触させずに搬送することが出来、基板レール430上面を吸着テーブル41上面と同高さにすれば、基板ガイド431によって基板PBの側辺を吸着テーブル上に固定することが出来る。
As shown in FIG. 4A, the board clamp 43 includes a board rail 430 and a board guide 431 as constituent elements. The substrate rail 430 and the substrate guide 431 are fixed in the XY direction with respect to the suction table 41, but can be adjusted in the vertical direction (Z direction). That is, if the upper surface of the substrate rail 430 is made higher than the upper surface of the suction table 41, the substrate PB can be transported without contacting the suction table 41, and if the upper surface of the substrate rail 430 is made the same height as the upper surface of the suction table 41. The side of the substrate PB can be fixed on the suction table by the substrate guide 431.
ただし、基板レール430の上面と吸着テーブル41上面の高さを同一にする際に誤差が生じると、基板PBの側辺部が折れ曲がった状態になる懸念がある。その対策を盛り込んだ改良例を示したのが図5であり、図5(a)が上面図で、図5(b)が断面図であるが、基板レール430と吸着テーブル41の端部を櫛歯状でかみ合うような形状にしている。このようにすることで、図6(a)のような基板PB搬送状態から、図6(b)のような基板PB固定状態にする際、基板レール430上面が吸着テーブル41より低くなっても、吸着テーブル41両端の凸部と基板ガイド431によって基板PBの側辺部を固定することが出来る。このため、基板PBの側辺部が折れ曲がることはなく、基板PB側辺の非実装エリアが狭い場合にも好適である。
However, if an error occurs when the height of the upper surface of the substrate rail 430 and the upper surface of the suction table 41 are the same, the side portion of the substrate PB may be bent. FIG. 5 shows an improved example incorporating the countermeasures, FIG. 5A is a top view, and FIG. 5B is a cross-sectional view, but the end portions of the substrate rail 430 and the suction table 41 are shown. It has a comb-teeth shape. In this way, when the substrate PB transport state as shown in FIG. 6A is changed to the substrate PB fixed state as shown in FIG. 6B, the upper surface of the substrate rail 430 is lower than the suction table 41. The side portions of the substrate PB can be fixed by the convex portions at both ends of the suction table 41 and the substrate guide 431. For this reason, the side part of the substrate PB is not bent, which is also suitable when the non-mounting area on the side of the substrate PB is narrow.
実装ヘッド5は、先端部で保持したチップ部品Cを降下させて、基板PBに加圧して実装する機能を有しており、加圧と同時にチップ部品を加熱する機能や、加圧面内の方向に超音波振動を付与する機能、等を有していてもよい。更に、先端部に保持したチップ部品Cを、Z方向を軸として回転して角度調整する機能を有していてもよい。
The mounting head 5 has a function of lowering the chip component C held at the tip and pressurizing and mounting the substrate PB. The function of heating the chip component simultaneously with the pressurization and the direction in the pressurizing surface May have a function of imparting ultrasonic vibration. Further, the chip component C held at the tip may have a function of adjusting the angle by rotating around the Z direction as an axis.
なお、本明細書の説明において、チップ部品を基板Cに熱や超音波とともに圧着して固定することを想定して実装という言葉を用いているが、これに限定されるものではなく、未硬化の熱硬化性接着材を介して、基板PB上にチップ部品Cを仮固定するケースも本発明における実装に含まれる。
In the description of the present specification, the word “mounting” is used on the assumption that the chip component is fixed to the substrate C together with heat and ultrasonic waves, but is not limited to this and is not cured. A case in which the chip component C is temporarily fixed on the substrate PB via the thermosetting adhesive is also included in the mounting in the present invention.
チップ部品ピックアップ手段7は、チップ部品Cをピックアップして、チップ部品搬送手段8に受け渡すものである。図1の実装装置1では、チップ部品ピックアップ手段7は、ダイシングされたウェハ基板Wからチップ部品をピックアップする例を示しているが、ピックアップ元はこれに限定されるものではなく、容器に収容されたチップ部品Cをピックアップする構成であってもよい。
The chip part pickup means 7 picks up the chip part C and delivers it to the chip part transport means 8. In the mounting apparatus 1 of FIG. 1, the chip component pick-up means 7 shows an example of picking up a chip component from the diced wafer substrate W, but the pickup source is not limited to this, and is housed in a container. Alternatively, the chip component C may be picked up.
チップ部品搬送手段8は、チップ部品ピックアップ手段7によって受け渡されたチップ部品Cを実装ヘッド5まで搬送し、チップ部品Cを実装ヘッド5に受け渡すものである。
The chip component conveying means 8 conveys the chip component C delivered by the chip component pickup means 7 to the mounting head 5 and delivers the chip component C to the mounting head 5.
基板搬送機構9は、図7に示すように基板PBを基板マガジンラックM1から取り出して基板ステージ4に搬送する機能と、実装済基板MBを基板ステージ4から搬送して基板マガジンラックM1に収容する機能の両機能を有するものである。
The substrate transport mechanism 9 takes out the substrate PB from the substrate magazine rack M1 and transports it to the substrate stage 4 as shown in FIG. 7, and transports the mounted substrate MB from the substrate stage 4 and stores it in the substrate magazine rack M1. It has both functions.
図1および図7においては、基板搬送機構9を構成する搬送レール90のみを表示しているが、図8(a)および図8(b)に示すように、基板PBの端部を保持して搬送する機能を有している。
In FIGS. 1 and 7, only the transport rail 90 constituting the substrate transport mechanism 9 is shown. However, as shown in FIGS. 8A and 8B, the end of the substrate PB is held. Have the function of conveying.
図8(a)において、ステージ側保持部91は、基板PB(または実装済基板MB)の基板ステージ4側の縁を保持(および解除)する機能を有しており、ステージ側保持部91はZアーム92に設けられていて、Zアーム92の動作により上下(Z方向)移動が可能である。図8(b)において、マガジンラック側保持部96は、基板PB(または実装済基板MB)の基板マガジンラックM1側(基板ステージ4側の反対)の縁を保持(および解除)する機能を有しており、マガジンラック側保持部96はZアーム97に設けられていて、Zアーム97の動作により上下(Z方向)移動が可能である。
8A, the stage side holding part 91 has a function of holding (and releasing) the edge of the substrate PB (or the mounted board MB) on the substrate stage 4 side. It is provided on the Z arm 92 and can be moved up and down (Z direction) by the operation of the Z arm 92. In FIG. 8B, the magazine rack side holding unit 96 has a function of holding (and releasing) the edge of the substrate PB (or the mounted substrate MB) on the substrate magazine rack M1 side (opposite the substrate stage 4 side). The magazine rack side holding portion 96 is provided on the Z arm 97 and can be moved up and down (Z direction) by the operation of the Z arm 97.
ここで、ステージ側保持部91およびマガジンラック側保持部96が保持するのは、外縁から1mm以上あることが望ましく、基板PBの非実装エリアに応じて深く保持することが望ましいが最大でも8mmあれば充分である。
Here, the stage side holding part 91 and the magazine rack side holding part 96 hold preferably 1 mm or more from the outer edge, and preferably hold deeply according to the non-mounting area of the substrate PB, but at most 8 mm. Is enough.
更に、Zアーム92はステージ側保持部91が保持した基板PB(または実装済基板MB)の縁を水平方向に押し引き可能な可動範囲を有しており、同様にZアーム97はマガジンラック側保持部96が保持した基板PB(または実装済基板MB)の縁を水平方向に押し引き可能な可動範囲を有している。その具体例が、図9(a)に上面図を示した実施形態である。
Further, the Z arm 92 has a movable range in which the edge of the substrate PB (or the mounted substrate MB) held by the stage side holding portion 91 can be pushed and pulled in the horizontal direction. Similarly, the Z arm 97 is on the magazine rack side. The movable part has a movable range in which the edge of the substrate PB (or the mounted substrate MB) held by the holding unit 96 can be pushed and pulled in the horizontal direction. A specific example is an embodiment whose top view is shown in FIG.
図9(a)で説明すると、Zアーム92はXアーム93を介してスライドレール94に沿ってY方向に可動範囲を有しており、Zアーム97もXアーム98を介してスライドレール99に沿って可動範囲を有している。すなわち、本実施形態における基板搬送機構9は、搬送レール90、ステージ側保持部91、Zアーム92、Xアーム93、スライドレール94、マガジンラック側保持部96、Zアーム97、Xアーム98およびスライドレール99を構成要素として有している。
9A, the Z arm 92 has a movable range in the Y direction along the slide rail 94 via the X arm 93, and the Z arm 97 is also connected to the slide rail 99 via the X arm 98. It has a movable range along. That is, the substrate transport mechanism 9 in this embodiment includes a transport rail 90, a stage side holding portion 91, a Z arm 92, an X arm 93, a slide rail 94, a magazine rack side holding portion 96, a Z arm 97, an X arm 98, and a slide. A rail 99 is included as a component.
以下、図9(a)に示した基板搬送機構9を備えた実装装置1について、基板マガジンラックM1から基板PBを取り出してから、実装済基板MBとして基板マガジンラックM1に収容するまでの動作を、図9から図11を用いて説明する。
Hereinafter, with respect to the mounting apparatus 1 provided with the substrate transport mechanism 9 shown in FIG. 9A, the operation from taking out the substrate PB from the substrate magazine rack M1 until it is accommodated in the substrate magazine rack M1 as the mounted substrate MB. This will be described with reference to FIGS. 9 to 11.
図9(a)は、基板マガジンラックM1から基板PBを取り出す状態を示したものである。ここで、基板マガジンラックM1の基板取り出し面は、吸着テーブル41の方を向いており、吸着テーブル41から基板搬送機構9に連なる直線上に(取り出すべき)基板PBが配置されている。
FIG. 9A shows a state in which the substrate PB is taken out from the substrate magazine rack M1. Here, the substrate take-out surface of the substrate magazine rack M1 faces the suction table 41, and the substrate PB (to be taken out) is arranged on a straight line extending from the suction table 41 to the substrate transport mechanism 9.
この状態で、基板搬送機構9はステージ側保持部91が、基板マガジンラックM1内の収容位置にある基板PBのステージ側(図の上側)の縁を保持するように動作する。
In this state, the substrate transport mechanism 9 operates so that the stage side holding portion 91 holds the edge on the stage side (the upper side in the figure) of the substrate PB at the accommodation position in the substrate magazine rack M1.
この後、基板搬送機構9は基板PBを保持した状態で、図9(b)に示す様にステージ側に引いて移動させる。その際、基板PBは搬送レール90上に載った状態で移動するので、一方の縁だけを保持した状態であっても水平に移動させることが出来る。
Thereafter, the substrate transport mechanism 9 holds the substrate PB and pulls it toward the stage as shown in FIG. 9B. At that time, since the substrate PB moves while being placed on the transport rail 90, even if only one edge is held, it can be moved horizontally.
更に基板PBを移動させると、図9(c)のように、基板PBの一部が吸着テーブル41上に達する。この状態において、図4(a)のように、基板クランプ43を構成する基板レール430の上面は吸着テーブル41より高く、搬送レール90の上面と等しくすることにより、基板PBをスムーズに搬送することが出来る。また、基板ガイド431は基板PBを通過させつつ、基板PBの反り等の変形を規制する程度に、基板レール430との間に隙間を形成している。なお、基板ガイド431は基板PBの幅を規制する役割も有している。このため、基板PBのX方向位置がずれた状態で搬送すると、基板PBは基板ガイド431間を通過することが出来ない。そこで、図9(b)の段階で、基板のX方向位置が修正できるよう、Xアームの長さを調整できるような機構を有していてもよい。
When the substrate PB is further moved, a part of the substrate PB reaches the suction table 41 as shown in FIG. In this state, as shown in FIG. 4A, the upper surface of the substrate rail 430 constituting the substrate clamp 43 is higher than the suction table 41 and is equal to the upper surface of the transport rail 90, so that the substrate PB can be transported smoothly. I can do it. Further, the substrate guide 431 forms a gap with the substrate rail 430 to the extent that the substrate PB is allowed to pass through and the deformation such as warpage of the substrate PB is restricted. The substrate guide 431 also has a role of regulating the width of the substrate PB. For this reason, if the substrate PB is transported in a state where the position in the X direction is shifted, the substrate PB cannot pass between the substrate guides 431. Therefore, a mechanism that can adjust the length of the X arm may be provided so that the position of the substrate in the X direction can be corrected in the stage of FIG. 9B.
ところで、図9(c)の状態から、ステージ側保持部91が基板PBを保持した状態のままで、基板PBを吸着テーブル41の所定位置まで搬送するような構成とすることは可能である。しかし、そのような構成とする場合、図12に示すように、吸着テーブル41を超えた位置(図12における吸着テーブルの上側)までステージ側保持部91を移動させる必要がある。図12のように、吸着テーブル41を超えた部分にスペースを設けた装置構成としてもよいが、本発明ではステージ側保持部91とは別に、マガジンラック側保持部96を設けた構成として装置スペースの削減を図っている。
Incidentally, from the state of FIG. 9C, it is possible to adopt a configuration in which the substrate PB is transported to a predetermined position of the suction table 41 while the stage side holding portion 91 holds the substrate PB. However, in such a configuration, as shown in FIG. 12, it is necessary to move the stage side holding portion 91 to a position beyond the suction table 41 (upper side of the suction table in FIG. 12). As shown in FIG. 12, an apparatus configuration in which a space is provided in a portion beyond the suction table 41 may be used. However, in the present invention, an apparatus space in which a magazine rack side holding portion 96 is provided separately from the stage side holding portion 91. We are trying to reduce it.
図9(c)のようにステージ側保持部91を用いて基板PBの一部を吸着テーブル41方向に引いた状態から、図9(d)のようにマガジンラック側保持部96が、基板PBのマガジンラック側の縁を保持し、ステージ側保持部91は保持を解除して待機位置に移動する。その後は、図10(e)のようにマガジンラック側保持部96が保持した基板PBを吸着テーブル41上の所定位置まで押して行く。
From a state in which a part of the substrate PB is pulled in the direction of the suction table 41 using the stage side holding portion 91 as shown in FIG. 9C, the magazine rack side holding portion 96 is changed into the substrate PB as shown in FIG. The magazine rack side edge is held, and the stage side holding portion 91 releases the holding and moves to the standby position. Thereafter, the substrate PB held by the magazine rack side holding unit 96 is pushed to a predetermined position on the suction table 41 as shown in FIG.
基板PBが吸着テーブル41上の所定位置に配置されたなら、図10(f)のようにマガジンラック側保持部96は保持を解除して吸着テーブル41上から離れる。その後、基板クランプ43を構成する基板レール430は、図4(b)のように、上面が吸着テーブル41上面と同じ高さとなるように下降させる(あるいは吸着テーブル41を上昇させる)。この状態から、吸着テーブル41は基板PBを吸着するとともに、基板ガイド431が下降して、基板レール430とともに基板PBの側辺を挟み込み、基板PBを吸着テーブル41上に固定する。このように、基板レール430と基板ガイド431により、基板PBの側辺を固定した状態で、吸着テーブル41が吸着動作することで、基板PBに若干の反り等の変形があったとしても、確実に全面吸着される。
When the substrate PB is placed at a predetermined position on the suction table 41, the magazine rack side holding unit 96 releases the holding and moves away from the suction table 41 as shown in FIG. Thereafter, the substrate rail 430 constituting the substrate clamp 43 is lowered so that the upper surface is the same height as the upper surface of the suction table 41 (or the suction table 41 is raised) as shown in FIG. From this state, the suction table 41 sucks the substrate PB, and the substrate guide 431 descends, sandwiches the side of the substrate PB together with the substrate rail 430, and fixes the substrate PB on the suction table 41. In this way, even if the substrate PB is slightly deformed or warped by the suction operation of the suction table 41 while the side of the substrate PB is fixed by the substrate rail 430 and the substrate guide 431, it is ensured. The whole surface is adsorbed.
この後、基板ステージ4を構成するXY駆動機構42により、吸着テーブル41とともに基板PBを移動させながら、チップ部品供給機構6により供給されたチップ部品Cを自走ヘッド5が基板PB上に順次実装し、図10(g)のように実装済基板MBが得られる。
Thereafter, the self-running head 5 sequentially mounts the chip components C supplied by the chip component supply mechanism 6 on the substrate PB while moving the substrate PB together with the suction table 41 by the XY drive mechanism 42 constituting the substrate stage 4. Then, the mounted board MB is obtained as shown in FIG.
この後、実装済基板MBを吸着テーブル41上から搬送して、基板マガジンラックM1に収容する工程になる。
Thereafter, the mounted substrate MB is transported from the suction table 41 and stored in the substrate magazine rack M1.
まず、基板PBへのチップ部品Cの実装が完了し、実装済基板MBが得られたら、吸着ステージ41による吸着を解除し、基板レール430を上昇(あるいは吸着テーブル41を下降)させるとともに、基板ガイド431を基板レール430に対して上昇させ、図4(c)のように実装済基板MBが基板レール430上をスライドできる状態とする。この状態において、基板レール430の上面は搬送レール90の上面と等しくする。
First, when the mounting of the chip component C on the substrate PB is completed and the mounted substrate MB is obtained, the suction by the suction stage 41 is released, the substrate rail 430 is raised (or the suction table 41 is lowered), and the substrate The guide 431 is raised with respect to the board rail 430 so that the mounted board MB can slide on the board rail 430 as shown in FIG. In this state, the upper surface of the substrate rail 430 is made equal to the upper surface of the transport rail 90.
この状態から、図10(h)のように、マガジンラック側保持部96が実装済基板MBの基板マガジンラック側の縁を保持し、図11(i)のようにマガジンラック側に引く。
From this state, the magazine rack side holding portion 96 holds the edge of the mounted substrate MB on the substrate magazine rack side as shown in FIG. 10 (h), and pulls it toward the magazine rack side as shown in FIG. 11 (i).
ところで、マガジンラック側保持部96は、実装済基板MBを基板マガジンラックM1の基板取り出し面の内側まで移動させることは出来ない。そこで、図11(j)のように、ステージ側保持部91が実装済基板MBのステージ側の縁を保持し、マガジンラック側保持部96は保持を解除して待機位置に戻る。
By the way, the magazine rack side holding unit 96 cannot move the mounted substrate MB to the inside of the substrate take-out surface of the substrate magazine rack M1. Therefore, as shown in FIG. 11 (j), the stage side holding portion 91 holds the edge of the mounted substrate MB on the stage side, and the magazine rack side holding portion 96 releases the holding and returns to the standby position.
その後、ステージ側保持部91が実装済基板MBを保持した状態で、マガジンラック側に押していき(図11(k))、実装済基板MBを、基板マガジンラックM1の収容位置まで搬送する(図11(l))。
Thereafter, the stage-side holding unit 91 holds the mounted substrate MB and pushes it toward the magazine rack (FIG. 11 (k)), and transports the mounted substrate MB to the accommodation position of the substrate magazine rack M1 (FIG. 11). 11 (l)).
その後は、図3(c)に示したように基板マガジンラックM1から新たな基板PBを取り出し、実装済基板MBとして収容する動作を繰り返し、基板マガジンラックM1内の基板PB全てを実装済基板MBとする。
Thereafter, as shown in FIG. 3C, the operation of taking out a new substrate PB from the substrate magazine rack M1 and storing it as a mounted substrate MB is repeated, and all the substrates PB in the substrate magazine rack M1 are mounted. And
以上のように、本発明の基板搬送機構9は、基板PB(および実装済基板MB)をレール上で直線的に移動する機構であり、基板PB(実装済基板MB)の縁の限られた範囲を保持しただけでも確実に搬送することが可能である。このため、基板PBの外周付近までチップ部品が実装されていたとしても基板搬送を確実に実施することが出来る。
As described above, the board transport mechanism 9 of the present invention is a mechanism that linearly moves the board PB (and the mounted board MB) on the rail, and has a limited edge of the board PB (mounted board MB). Even if the range is maintained, it can be reliably conveyed. For this reason, even if the chip component is mounted up to the vicinity of the outer periphery of the substrate PB, the substrate can be reliably conveyed.
ところで、図12において、ステージ側保持部91のみで基板PB(または実装済基板MB)を搬送する装置構成では、装置スペース的に不利である旨を既に記したが、図13に示すようにステージ側保持部91を設置したZアーム92にマガジンラック側保持部96も設置する構成とすることは可能である。その構成を本実施形態の変形例として、図13に示す。図13(a)~図13(d)は、図9(a)~図9(d)に示した状態を、変形例で実施した状態を示したものであり、同様に、図10(e)から図11(l)までの動作も変形例で実施可能である。
Incidentally, in FIG. 12, it has already been described that the apparatus configuration in which the substrate PB (or the mounted substrate MB) is transported only by the stage-side holding unit 91 is disadvantageous in terms of apparatus space. However, as shown in FIG. It is possible to adopt a configuration in which the magazine rack side holding portion 96 is also installed on the Z arm 92 on which the side holding portion 91 is installed. The configuration is shown in FIG. 13 as a modification of the present embodiment. FIGS. 13 (a) to 13 (d) show a state in which the states shown in FIGS. 9 (a) to 9 (d) are implemented in a modified example. Similarly, FIGS. ) To FIG. 11 (l) can also be implemented in a modified example.
以上の実施形態において、基板マガジンラックM1に収容された基板PBを実装済基板MBとして元の基板マガジンラックM1に戻しているが、実装済基板MBを基板マガジンラックM1とは別のマガジンラックに収容することが望ましいケースもある。
In the above embodiment, the substrate PB accommodated in the substrate magazine rack M1 is returned to the original substrate magazine rack M1 as the mounted substrate MB, but the mounted substrate MB is placed in a magazine rack different from the substrate magazine rack M1. In some cases it is desirable to accommodate.
例えば、一般的な基板マガジンラックは樹脂製であることが多いが、実装済基板MBの後工程において熱処理等を行なう場合では、基板マガジンラックごとオーブンに入れることもある。このため、実装済基板MBを収容する基板マガジンラックを金属製にするようなこともあり、基板マガジンラックM1とは別に実装済基板MBを収容するための実装基板マガジンラックM2を別に設けることがある。
For example, a general substrate magazine rack is often made of resin, but when a heat treatment or the like is performed in a subsequent process of the mounted substrate MB, the substrate magazine rack may be put in an oven. For this reason, the substrate magazine rack that accommodates the mounted substrate MB may be made of metal, and a mounting substrate magazine rack M2 for accommodating the mounted substrate MB may be provided separately from the substrate magazine rack M1. is there.
基板マガジンラックM1とは別に実装基板マガジンラックM2を設ける場合、図14のように、基板マガジンラックM1、吸着テーブル41、実装基板マガジンラックM2を直線状に配置する構成がある。しかし、図14の構成では、基板マガジンラックM1から吸着テーブル41までと、吸着テーブル41から実装基板マガジンラックM2までの、2つの基板搬送機構が別に必要となり、その分のスペースも必要となる。
When the mounting substrate magazine rack M2 is provided separately from the substrate magazine rack M1, there is a configuration in which the substrate magazine rack M1, the suction table 41, and the mounting substrate magazine rack M2 are arranged linearly as shown in FIG. However, in the configuration of FIG. 14, two substrate transport mechanisms are required separately from the substrate magazine rack M1 to the suction table 41 and from the suction table 41 to the mounting substrate magazine rack M2, and a corresponding space is also required.
そこで、以下に、基板マガジンラックM1とは別の実装基板マガジンラックM2が必要な場合にも対応した、本発明の第二実施形態について説明する。
Therefore, a second embodiment of the present invention that corresponds to the case where a mounting substrate magazine rack M2 different from the substrate magazine rack M1 is required will be described below.
図15は本発明の第二実施形態に係る実装装置101の該略図である。図15において、図1の実装装置1と共通の記号については同一の機能を有するものであるが、実装装置101には実装基板マガジンラックM2とマガジンラック移動機構10が付加されている。
FIG. 15 is a schematic view of the mounting apparatus 101 according to the second embodiment of the present invention. 15, symbols common to those of the mounting apparatus 1 of FIG. 1 have the same functions, but a mounting board magazine rack M2 and a magazine rack moving mechanism 10 are added to the mounting apparatus 101.
実装装置101は、基板マガジンラックM1から基板PBを取り出し、基板PBに半導体チップ等のチップ部品Cを実装し、基板PBの所定箇所にチップ部品Cを実装した実装済基板MBを実装基板マガジンラックM2に収容するものである。実装基板マガジンラックM2も、基板マガジンラックM1と同じく4側面の中の1面は、実装済基板MBの収容を行なう開口を有している(以下、実装済基板MBの収容を行なう開口を有する面を実装基板収容面と記す)。
The mounting apparatus 101 takes out the substrate PB from the substrate magazine rack M1, mounts the chip component C such as a semiconductor chip on the substrate PB, and mounts the mounted substrate MB on which the chip component C is mounted at a predetermined position of the substrate PB. It is housed in M2. Similarly to the substrate magazine rack M1, the mounting substrate magazine rack M2 has an opening for accommodating the mounted substrate MB (hereinafter referred to as an opening for accommodating the mounted substrate MB). The surface is referred to as the mounting board receiving surface).
図15の実装装置101において、基板マガジンラックM1の基板取り出し面と、実装基板マガジンラックM2の実装基板収容面とは、同一面上で同一方向を向いて並ぶように配置されている。また、マガジンラック移動機構10は、実装ステージ4から基板搬送機構9に連なる直線上に、基板マガジンラックM1の基板取り出し面か、実装基板マガジンラックM2の実装基板収容面の何れかが配置されるよう、基板マガジンラックM1と実装基板マガジンラックM2を並べた方向に、基板マガジンラックM1および実装基板マガジンラックM2を移動させるものである。
In the mounting apparatus 101 of FIG. 15, the substrate take-out surface of the substrate magazine rack M1 and the mounting substrate accommodation surface of the mounting substrate magazine rack M2 are arranged so as to be aligned in the same direction on the same surface. Further, in the magazine rack moving mechanism 10, either the substrate take-out surface of the substrate magazine rack M1 or the mounting substrate receiving surface of the mounting substrate magazine rack M2 is arranged on a straight line that continues from the mounting stage 4 to the substrate transport mechanism 9. As described above, the substrate magazine rack M1 and the mounting substrate magazine rack M2 are moved in the direction in which the substrate magazine rack M1 and the mounting substrate magazine rack M2 are arranged.
図16(a)~図16(d)、図17(e)および図17(f)は実装装置101による基板PBの搬送および実装基板MBの搬送動作を説明する上面図である。図16(a)と図16(b)は基板マガジンM1から基板PBを引出す状態を示したものであり、基板搬送機構9の動作としては図9(a)と図9(b)に示した実装装置1と同じである。この段階で、マガジンラック移動機構10は、実装ステージ4から基板搬送機構9に連なる直線上に基板マガジンラックM1を配置している。
16 (a) to 16 (d), 17 (e), and 17 (f) are top views for explaining the substrate PB transport operation and the mounting substrate MB transport operation by the mounting apparatus 101. FIG. FIGS. 16A and 16B show the state in which the substrate PB is pulled out from the substrate magazine M1, and the operation of the substrate transport mechanism 9 is shown in FIGS. 9A and 9B. The same as the mounting apparatus 1. At this stage, the magazine rack moving mechanism 10 arranges the substrate magazine rack M1 on a straight line extending from the mounting stage 4 to the substrate transport mechanism 9.
この後、実装装置101の基板搬送機構9も、実装装置1と同様に図9(c)から図10(f)に示したように、基板PBを吸着テーブル41上に配置し、半導体チップCを実装した実装済基板MBを吸着テーブル41から搬出するよう動作する。その際、マガジンラック移動機構10は、実装済基板マガジンラックM2を実装ステージ4から基板搬送機構9に連なる直線上に配置するように動作する。すなわち、基板PBのマガジンラック側が基板マガジンラックM1から出てから、実装済基板MBのマガジンラック側が搬送レール90上に存在している間に、マガジンラック移動機構10は、実装済基板マガジンラックM2を実装ステージ4から基板搬送機構9に連なる直線上に配置する。このようにすることにより、図16(c)、(d)に示すように、基板搬送機構9は実装基板マガジンラックM2の収容位置に実装済基板MBを搬送することになる。なお、実装基板マガジンラックM2の収容位置への実装済基板MBの収容が完了したならば、再び、実装ステージ4から基板搬送機構9に連なる直線上に基板マガジンラックM1を配置し(図17(e))、基板マガジンラックM1から基板PBを引出す状態(図16(a)と同じ)になる。以上の動作を、基板マガジンラックM1内の基板PBがなくなるか、実装基板マガジンラックM2内が実装済基板MBで満たされるまで続けることになる。
Thereafter, the substrate transport mechanism 9 of the mounting apparatus 101 also arranges the substrate PB on the suction table 41 as shown in FIGS. 9C to 10F in the same manner as the mounting apparatus 1, and the semiconductor chip C Is mounted so that the mounted substrate MB mounted on the suction table 41 is carried out. At that time, the magazine rack moving mechanism 10 operates so as to arrange the mounted substrate magazine rack M2 on a straight line continuous from the mounting stage 4 to the substrate transport mechanism 9. That is, after the magazine rack side of the substrate PB comes out of the substrate magazine rack M1, the magazine rack moving mechanism 10 moves the mounted substrate magazine rack M2 while the magazine rack side of the mounted substrate MB exists on the transport rail 90. Are arranged on a straight line extending from the mounting stage 4 to the substrate transport mechanism 9. By doing so, as shown in FIGS. 16C and 16D, the substrate transport mechanism 9 transports the mounted substrate MB to the accommodation position of the mounting substrate magazine rack M2. When the mounting of the mounted substrate MB in the mounting position of the mounting substrate magazine rack M2 is completed, the substrate magazine rack M1 is again arranged on a straight line extending from the mounting stage 4 to the substrate transport mechanism 9 (FIG. 17 ( e)), the substrate PB is pulled out from the substrate magazine rack M1 (same as in FIG. 16A). The above operation is continued until there is no substrate PB in the substrate magazine rack M1 or until the mounted substrate magazine rack M2 is filled with the mounted substrates MB.
以上のように、第二実施形態は、基板マガジンラックM1とは別の実装基板マガジンラックM2が必要な場合においても、基板マガジンラックM1から吸着テーブル41までの搬送と、吸着テーブル41から実装基板マガジンラックM2までの搬送を1つの搬送機構で兼用するためスペース効率的に優れている。
As described above, in the second embodiment, even when the mounting substrate magazine rack M2 different from the substrate magazine rack M1 is required, the transport from the substrate magazine rack M1 to the suction table 41, and the suction table 41 to the mounting substrate are performed. Since the transport to the magazine rack M2 is shared by one transport mechanism, the space efficiency is excellent.
特に、実装基板PBが長方形の場合、基板の長手方向を基板搬送方向(図15におけるY方向)とすれば、マガジンラック移動機構10による基板マガジンラックM1および実装基板マガジンラックM2の移動方向は、基板の短手方向であるため、移動距離が短くスペース的にも装置負荷的にも優れている。
In particular, when the mounting substrate PB is rectangular, if the longitudinal direction of the substrate is the substrate transport direction (Y direction in FIG. 15), the movement direction of the substrate magazine rack M1 and the mounting substrate magazine rack M2 by the magazine rack moving mechanism 10 is Due to the short direction of the substrate, the movement distance is short and the space and the apparatus load are excellent.
ところで、本発明は、図20に示したような実装装置301に比べて、ローダ211もアンローダも不要であり、基板搬送に必要なスペースも僅かである。このため、複数の実装部を有する実装装置において、図18に示す実装装置101や、図19に示す実装装置202のような構成としても本発明は有効である。すなわち、図19の実装装置202においても、実装部毎にマガジンラック移動機構(10A、同10B)を必要とするものの、基板PB(および実装済基板MB)の搬送距離が短いため、図21に示した実装装置302に比べて、装置のコンパクト化が図れる。
By the way, the present invention requires neither the loader 211 nor the unloader and the space required for substrate transport is smaller than that of the mounting apparatus 301 as shown in FIG. Therefore, the present invention is effective even in a mounting apparatus having a plurality of mounting portions, such as a mounting apparatus 101 shown in FIG. 18 or a mounting apparatus 202 shown in FIG. That is, the mounting apparatus 202 of FIG. 19 also requires a magazine rack moving mechanism (10A, 10B) for each mounting unit, but the transport distance of the substrate PB (and the mounted substrate MB) is short, so FIG. Compared to the mounting apparatus 302 shown, the apparatus can be made more compact.
また、図21のような実装装置302の場合、実装部3Aで得た実装済基板MBと、実装部3Bで得た実装済基板MBが同じ実装基板マガジンラックM2に収容されているため、実装部3Aと実装部3Bの機差の影響を後工程で考慮する必要が生じることがある。具体的には、実装基板マガジンラックM2に収容された実装済基板MBが何れの実装部で実装されたものかを追跡しながら、必要に応じて後工程で、実装部毎に条件変更する場合がある。これに対して、図18に示す実装装置101および図19に示す実装装置202では、実装基板マガジンラックM2(図18の実装装置201では基板マガジンラックM1)に収容されている実装済基板MBの全てが何れかの実装部(実装部3Aまたは実装部3B)に限定されるので、実装済基板MB単位で後工程の条件変更をするようなことが不要となる。
なお、ここまでの説明で、チップ部品Cは半導体チップであって、基板PBは四角形状の例について説明してきたが、これに限定されるものではない。例えば、基板PBがウェハ基板のような円形のものであってもよく、素材も樹脂、セラミックス、シリコン等の半導体の素材およびこれらの複合材から選んでよい。また、チップ部品Cも、半導体チップに限定されるものではなく、抵抗やキャパシタンスのような受動素子のチップであってもよい。 In the case of the mountingapparatus 302 as shown in FIG. 21, the mounted substrate MB obtained by the mounting unit 3A and the mounted substrate MB obtained by the mounting unit 3B are accommodated in the same mounting substrate magazine rack M2. It may be necessary to consider the influence of machine differences between the part 3A and the mounting part 3B in a subsequent process. Specifically, when changing the conditions for each mounting unit in a subsequent process as necessary while tracking in which mounting unit the mounted substrate MB accommodated in the mounting substrate magazine rack M2 is mounted There is. On the other hand, in the mounting apparatus 101 shown in FIG. 18 and the mounting apparatus 202 shown in FIG. 19, the mounted boards MB accommodated in the mounting board magazine rack M2 (the board magazine rack M1 in the mounting apparatus 201 in FIG. 18). Since all are limited to any one of the mounting parts (the mounting part 3A or the mounting part 3B), it is not necessary to change the conditions of the post-process for each mounted board MB.
In the above description, the chip component C is a semiconductor chip and the substrate PB has a quadrangular shape. However, the present invention is not limited to this. For example, the substrate PB may be circular like a wafer substrate, and the material may be selected from semiconductor materials such as resin, ceramics, and silicon, and composite materials thereof. The chip component C is not limited to a semiconductor chip, and may be a chip of a passive element such as a resistor or a capacitance.
なお、ここまでの説明で、チップ部品Cは半導体チップであって、基板PBは四角形状の例について説明してきたが、これに限定されるものではない。例えば、基板PBがウェハ基板のような円形のものであってもよく、素材も樹脂、セラミックス、シリコン等の半導体の素材およびこれらの複合材から選んでよい。また、チップ部品Cも、半導体チップに限定されるものではなく、抵抗やキャパシタンスのような受動素子のチップであってもよい。 In the case of the mounting
In the above description, the chip component C is a semiconductor chip and the substrate PB has a quadrangular shape. However, the present invention is not limited to this. For example, the substrate PB may be circular like a wafer substrate, and the material may be selected from semiconductor materials such as resin, ceramics, and silicon, and composite materials thereof. The chip component C is not limited to a semiconductor chip, and may be a chip of a passive element such as a resistor or a capacitance.
1 実装装置
2 架台
3 実装部
4 基板ステージ
5 実装ヘッド
6 チップ部品供給機構
7 チップ部品ピックアップ手段
8 チップ部品搬送手段
9 基板搬送機構
10 マガジンラック移動機構
41 吸着テーブル
42 XY駆動機構
43 基板クランプ
101 実装装置
201 実装装置
202 実装装置
430 基板レール
431 基板ガイド
90 搬送レール
91 ステージ側保持部
92 Zアーム
93 Xアーム
94 スライドレール
96 マガジンラック側保持部
97 Zアーム
98 Xアーム
99 スライドレール
C チップ部品
M1 基板マガジンラック
M2 実装基板マガジンラック
MB 実装済基板
PB 基板 DESCRIPTION OFSYMBOLS 1 Mounting apparatus 2 Mounting frame 3 Mounting part 4 Substrate stage 5 Mounting head 6 Chip component supply mechanism 7 Chip component pick-up means 8 Chip component transport means 9 Substrate transport mechanism 10 Magazine rack moving mechanism 41 Suction table 42 XY drive mechanism 43 Substrate clamp 101 Mounting Device 201 Mounting device 202 Mounting device 430 Board rail 431 Board guide
90Transport rail 91 Stage side holding part 92 Z arm 93 X arm 94 Slide rail 96 Magazine rack side holding part 97 Z arm 98 X arm 99 Slide rail C Chip part
M1 board magazine rack M2 mounted board magazine rack MB mounted board PB board
2 架台
3 実装部
4 基板ステージ
5 実装ヘッド
6 チップ部品供給機構
7 チップ部品ピックアップ手段
8 チップ部品搬送手段
9 基板搬送機構
10 マガジンラック移動機構
41 吸着テーブル
42 XY駆動機構
43 基板クランプ
101 実装装置
201 実装装置
202 実装装置
430 基板レール
431 基板ガイド
90 搬送レール
91 ステージ側保持部
92 Zアーム
93 Xアーム
94 スライドレール
96 マガジンラック側保持部
97 Zアーム
98 Xアーム
99 スライドレール
C チップ部品
M1 基板マガジンラック
M2 実装基板マガジンラック
MB 実装済基板
PB 基板 DESCRIPTION OF
90
M1 board magazine rack M2 mounted board magazine rack MB mounted board PB board
Claims (5)
- 基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を前記基板マガジンラックに収容する実装装置であって、
基板ステージと実装ヘッドとを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、
前記基板マガジンラック内の収容位置にある前記基板を、前記基板の外縁部を保持して前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から外縁部を保持して前記基板マガジンラックの収容位置まで搬送する機能と、を有する基板搬送機構とを備えた実装装置。 A mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in the substrate magazine rack,
A mounting part for mounting the chip component by the mounting head on the substrate disposed on the substrate stage, the substrate stage and a mounting head;
A function of transporting the substrate at the accommodation position in the substrate magazine rack onto the substrate stage while holding the outer edge portion of the substrate, and holding the outer edge portion of the mounted substrate from the substrate stage. A mounting apparatus comprising a substrate transport mechanism having a function of transporting to a housing position of a substrate magazine rack. - 基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を実装基板マガジンラックに収容する実装装置であって、
前記基板マガジンラックの基板取り出し面と、前記実装基板マガジンラックの実装済基板収容面とを同一面上の同一方向にして並べた状態に配置して、前記基板マガジンラックと前記実装基板マガジンラックを並べた方向に移動させるマガジンラック移動機構と、
基板ステージと実装ヘッドとを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、
前記基板マガジンラック内の収容位置にある前記基板を、前記基板の外縁部を保持して前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から外縁部を保持して前記基板マガジンラックの収容位置まで搬送する機能と、を有する基板搬送機構とを備えた実装装置。 A mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in a mounting substrate magazine rack,
The substrate magazine rack and the mounting substrate magazine rack are arranged in a state in which the substrate take-out surface of the substrate magazine rack and the mounted substrate receiving surface of the mounting substrate magazine rack are arranged in the same direction on the same surface. Magazine rack moving mechanism to move in the aligned direction;
A mounting part for mounting the chip component by the mounting head on the substrate disposed on the substrate stage, the substrate stage and a mounting head;
A function of transporting the substrate at the accommodation position in the substrate magazine rack onto the substrate stage while holding the outer edge portion of the substrate, and holding the outer edge portion of the mounted substrate from the substrate stage. A mounting apparatus comprising a substrate transport mechanism having a function of transporting to a housing position of a substrate magazine rack. - 請求項1または請求項2に記載の実装装置であって、
前記基板搬送機構は、
前記基板を、前記基板マガジンラックから前記基板ステージ上まで、前記基板マガジンラックの基板取り出し面に対して直角方向に直線搬送する機能を有する実装装置。 The mounting apparatus according to claim 1 or 2,
The substrate transport mechanism is
A mounting apparatus having a function of linearly transporting the substrate from the substrate magazine rack to the substrate stage in a direction perpendicular to the substrate take-out surface of the substrate magazine rack. - 請求項1から請求項3のいずれかの請求項に記載の実装装置であって、
前記実装ヘッドに前記チップ部品を供給するチップ部品供給機構を更に備えた実装装置。 The mounting apparatus according to any one of claims 1 to 3, comprising:
A mounting apparatus further comprising a chip component supply mechanism for supplying the chip component to the mounting head. - 請求項4記載の実装装置であって、
前記実装部を2つ備え、
前記実装部夫々と1対1で対応する前記基板搬送手段を備え、
前記チップ部品供給機構は、前記2つの実装部の間に配置され、2つの前記実装部夫々にチップ部品を供給する機能を有する実装装置。 The mounting apparatus according to claim 4,
Two mounting parts are provided,
Including the board transfer means corresponding to each of the mounting parts on a one-to-one basis;
The chip component supply mechanism is disposed between the two mounting units, and has a function of supplying a chip component to each of the two mounting units.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020207026812A KR20200123182A (en) | 2018-02-22 | 2019-02-13 | Mounting device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-029257 | 2018-02-22 | ||
JP2018029257A JP7023740B2 (en) | 2018-02-22 | 2018-02-22 | Mounting device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019163586A1 true WO2019163586A1 (en) | 2019-08-29 |
Family
ID=67687190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2019/004924 WO2019163586A1 (en) | 2018-02-22 | 2019-02-13 | Mounting device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7023740B2 (en) |
KR (1) | KR20200123182A (en) |
TW (1) | TWI756517B (en) |
WO (1) | WO2019163586A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022011530A (en) * | 2020-06-30 | 2022-01-17 | キヤノン株式会社 | Article manufacturing device and article manufacturing method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6139529A (en) * | 1984-07-31 | 1986-02-25 | Toshiba Corp | Mounting device |
JPS6139940U (en) * | 1984-08-15 | 1986-03-13 | 株式会社東芝 | Bonding equipment for semiconductor devices |
JPS62285843A (en) * | 1986-06-04 | 1987-12-11 | Fujitsu Ltd | Printed-circuit board handover/receive device |
JPH0722780A (en) * | 1993-06-30 | 1995-01-24 | Matsushita Electric Ind Co Ltd | Mounting installation for printed circuit board |
JPH11266099A (en) * | 1998-03-17 | 1999-09-28 | Matsushita Electric Ind Co Ltd | Substrate delivery device |
JP2001036291A (en) * | 1999-07-16 | 2001-02-09 | Matsushita Electric Ind Co Ltd | Plate-like work feeder |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2849519B2 (en) * | 1993-02-17 | 1999-01-20 | シャープ株式会社 | Semiconductor device bonding equipment |
JPH09260896A (en) * | 1996-03-19 | 1997-10-03 | Matsushita Electric Ind Co Ltd | Circuit board transfer device |
JP2005243703A (en) | 2004-02-24 | 2005-09-08 | Matsushita Electric Ind Co Ltd | Substrate transfer machine and substrate transfer method |
JP3972941B2 (en) * | 2004-06-30 | 2007-09-05 | オムロン株式会社 | Solder printing inspection method for component mounting board and inspection machine for solder printing inspection |
JP5211295B2 (en) * | 2008-09-10 | 2013-06-12 | 株式会社アドウェルズ | Component supply apparatus and component supply method |
JP5373517B2 (en) * | 2009-09-14 | 2013-12-18 | 株式会社ディスコ | Conveying mechanism and processing device |
JP6218600B2 (en) * | 2013-12-26 | 2017-10-25 | 株式会社ディスコ | Processing equipment |
KR20170022275A (en) | 2015-08-20 | 2017-03-02 | 주식회사 안소프트 | Contents providing method and system capable of filtering spam message on hold |
JP6717630B2 (en) * | 2016-03-29 | 2020-07-01 | 芝浦メカトロニクス株式会社 | Electronic component mounting equipment |
CN109315067B (en) * | 2016-07-04 | 2019-12-24 | 株式会社铃木 | Transfer method and mounting method |
-
2018
- 2018-02-22 JP JP2018029257A patent/JP7023740B2/en active Active
-
2019
- 2019-02-13 WO PCT/JP2019/004924 patent/WO2019163586A1/en active Application Filing
- 2019-02-13 KR KR1020207026812A patent/KR20200123182A/en not_active Application Discontinuation
- 2019-02-22 TW TW108105963A patent/TWI756517B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6139529A (en) * | 1984-07-31 | 1986-02-25 | Toshiba Corp | Mounting device |
JPS6139940U (en) * | 1984-08-15 | 1986-03-13 | 株式会社東芝 | Bonding equipment for semiconductor devices |
JPS62285843A (en) * | 1986-06-04 | 1987-12-11 | Fujitsu Ltd | Printed-circuit board handover/receive device |
JPH0722780A (en) * | 1993-06-30 | 1995-01-24 | Matsushita Electric Ind Co Ltd | Mounting installation for printed circuit board |
JPH11266099A (en) * | 1998-03-17 | 1999-09-28 | Matsushita Electric Ind Co Ltd | Substrate delivery device |
JP2001036291A (en) * | 1999-07-16 | 2001-02-09 | Matsushita Electric Ind Co Ltd | Plate-like work feeder |
Also Published As
Publication number | Publication date |
---|---|
JP2019145692A (en) | 2019-08-29 |
TWI756517B (en) | 2022-03-01 |
JP7023740B2 (en) | 2022-02-22 |
TW201937621A (en) | 2019-09-16 |
KR20200123182A (en) | 2020-10-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5589790B2 (en) | Substrate transfer hand and substrate transfer robot | |
KR101226733B1 (en) | Substrate carrying device | |
KR102003130B1 (en) | Semiconductor manufacturing device and manufacturing method of semiconductor device | |
KR101017711B1 (en) | Driving gripper, automatic processing apparatus comprising the same and material transfer method using the same | |
JP6941513B2 (en) | Semiconductor manufacturing equipment and manufacturing method of semiconductor equipment | |
WO2017119216A1 (en) | Electronic component handling unit | |
US7021357B2 (en) | Component mounting apparatus and component mounting method | |
JPWO2020066285A1 (en) | Wafer breaking equipment, reversing equipment, and transfer system | |
WO2019163586A1 (en) | Mounting device | |
KR102211940B1 (en) | Adsorption mechanism, adsorption hand, conveyance mechanism, resin molding apparatus, conveyance method and manufacturing method for resin molded article | |
JP5358529B2 (en) | Mounting machine | |
CN102340980B (en) | Mounting apparatus | |
WO2020022345A1 (en) | Electronic component mounting device | |
JP6200735B2 (en) | Die bonder and bonding method | |
TWI715727B (en) | Disposal method of package substrate | |
KR101133124B1 (en) | PCB support apparatus for chip mounter | |
JP4585496B2 (en) | Semiconductor chip mounting equipment | |
KR20090076010A (en) | Apparatus for feeding chip tray | |
JP3711802B2 (en) | Pallet for conveyance, conveyance apparatus provided with this pallet for conveyance, and work fixing method | |
JP2001320195A (en) | Composite mounting device | |
JP5078424B2 (en) | Electronic component mounting equipment | |
JP2003115698A (en) | Electronic component mounting device | |
KR200245078Y1 (en) | Chip mounter | |
JP2005243703A (en) | Substrate transfer machine and substrate transfer method | |
WO2019188008A1 (en) | Substrate transport device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 19756812 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20207026812 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 19756812 Country of ref document: EP Kind code of ref document: A1 |