WO2019163586A1 - Mounting device - Google Patents

Mounting device Download PDF

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Publication number
WO2019163586A1
WO2019163586A1 PCT/JP2019/004924 JP2019004924W WO2019163586A1 WO 2019163586 A1 WO2019163586 A1 WO 2019163586A1 JP 2019004924 W JP2019004924 W JP 2019004924W WO 2019163586 A1 WO2019163586 A1 WO 2019163586A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
mounting
magazine rack
chip component
stage
Prior art date
Application number
PCT/JP2019/004924
Other languages
French (fr)
Japanese (ja)
Inventor
寺田　勝美
晴　孝志
賢 北村
Original Assignee
東レエンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東レエンジニアリング株式会社 filed Critical 東レエンジニアリング株式会社
Priority to KR1020207026812A priority Critical patent/KR20200123182A/en
Publication of WO2019163586A1 publication Critical patent/WO2019163586A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Definitions

  • the present invention relates to a mounting apparatus for mounting a chip component such as a semiconductor chip on a substrate. More specifically, the present invention relates to a mounting apparatus that takes out a substrate accommodated in a substrate magazine rack, mounts chip components, and then accommodates the substrate in a substrate magazine rack.
  • a mounting apparatus for performing flip-chip mounting is such that a mounting head 5 mounts a chip component C such as a semiconductor chip on a substrate PB held by a substrate stage 4 in a mounting unit 3. 4 has a function of mounting the chip components C sequentially supplied from the chip component supply mechanism 6 at predetermined positions on the substrate PB while moving the substrate position.
  • a chip component C such as a semiconductor chip
  • 4 has a function of mounting the chip components C sequentially supplied from the chip component supply mechanism 6 at predetermined positions on the substrate PB while moving the substrate position.
  • the conventional mounting apparatus includes a loader 211 having a function of pushing out the substrates PB one by one from the substrate magazine rack M1 that accommodates the substrates PB, and a chip component C at predetermined positions.
  • mounted substrates MB an unloader having a function of accommodating the substrates (hereinafter referred to as mounted substrates MB) after being mounted on each in a substrate magazine rack (hereinafter referred to as mounted substrate magazine rack M2) different from the substrate magazine rack M1.
  • mounted substrate magazine rack M2 a substrate magazine rack
  • the substrate PB taken out from the substrate magazine rack M1 moves as indicated by a white arrow and is accommodated in the mounting substrate magazine rack M2 as a mounted substrate MB.
  • a mounting apparatus having a configuration like the mounting apparatus 302 shown in FIG. 21 has been put into practical use from the viewpoint of improving productivity.
  • two mounting parts (the mounting part 3A and the mounting part 3B) share the chip component supply mechanism 6, the loader 211, and the unloader 212, and are excellent in cost performance (Patent Document 1).
  • FIG. 23A shows a top view of the mounted substrate MB in which the chip component C is mounted on the substrate PB, and the non-mounting area around the mounting area with respect to the mounting area AM on which the chip component C is mounted in the substrate PB. It can be seen that AF exists and the vacuum pad 291 in FIG. 22 can be adsorbed only in the non-mounting area.
  • the size of the suction pad 291 that provides sufficient suction force to lift the substrate PB. can be selected.
  • the substrate PB when the substrate PB is heated during the mounting process, the substrate PB is curved as shown in FIG. 24, and a gap VG is generated between the vacuum pad 291 and the substrate PB, which may make vacuum suction itself difficult. .
  • the present invention has been made in view of the above problems, and provides a mounting apparatus that can reliably carry a substrate even when a chip component is mounted close to the outer periphery of the substrate.
  • a mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in the substrate magazine rack, A substrate stage and a mounting head; and a mounting portion for mounting the chip component by the mounting head on the substrate disposed on the substrate stage; and the substrate at a receiving position in the substrate magazine rack, A substrate having a function of holding the outer edge portion of the substrate and transporting it onto the substrate stage, and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the substrate magazine rack while holding the outer edge portion.
  • a mounting apparatus including a transport mechanism.
  • the invention described in claim 2 A mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in a mounting substrate magazine rack,
  • the substrate magazine rack and the mounting substrate magazine rack are arranged in a state in which the substrate take-out surface of the substrate magazine rack and the mounted substrate receiving surface of the mounting substrate magazine rack are arranged in the same direction on the same surface.
  • Magazine rack moving mechanism to move in the aligned direction; A substrate stage and a mounting head; and a mounting portion for mounting the chip component by the mounting head on the substrate disposed on the substrate stage; and the substrate at a receiving position in the substrate magazine rack, A substrate having a function of holding the outer edge portion of the substrate and transporting it onto the substrate stage, and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the substrate magazine rack while holding the outer edge portion.
  • a mounting apparatus including a transport mechanism.
  • the substrate transport mechanism is a mounting device having a function of linearly transporting the substrate from the substrate magazine rack to the substrate stage in a direction perpendicular to the substrate take-out surface of the substrate magazine rack.
  • the invention according to claim 4 is the mounting apparatus according to any one of claims 1 to 3,
  • the mounting apparatus further includes a chip component supply mechanism for supplying the chip component to the mounting head.
  • invention of Claim 5 is the mounting apparatus of Claim 4, Comprising: Two mounting portions, the substrate transport means corresponding to the mounting portions one-to-one,
  • the chip component supply mechanism is a mounting apparatus that is disposed between the two mounting portions and has a function of supplying a chip component to each of the two mounting portions.
  • FIG. 1 It is the schematic which shows the structure of the mounting apparatus which concerns on embodiment of this invention. It is sectional drawing explaining a substrate magazine rack, and is a figure which shows a substrate exit / entry state in the state in which (a) the board
  • FIG. 7 is a diagram showing a state where a part of the substrate has reached the suction table, and (d) a state in which the substrate is pushed to a predetermined position on the suction table. It is a figure explaining operation
  • FIG. 1 is a schematic diagram illustrating an apparatus configuration including a plurality of mounting units according to an embodiment of the present invention.
  • FIG. 10 is a schematic diagram illustrating a device configuration including a plurality of mounting units according to the second embodiment of the present invention. It is the schematic which shows the apparatus structure of the conventional mounting apparatus. It is the schematic which shows the apparatus structure provided with the some mounting part with the conventional mounting apparatus.
  • FIG. 1 is a schematic view showing an example of a mounting apparatus according to an embodiment of the present invention.
  • 1 takes out a substrate PB from the substrate magazine rack M1, mounts a chip component C such as a semiconductor chip on the substrate PB, and mounts a mounted substrate MB on which a chip component C is mounted at a predetermined position of the substrate PB. It is accommodated in the magazine rack M1.
  • FIG. 2A shows a cross-sectional view without the substrate PB
  • FIG. A sectional view in which a substrate PB is accommodated is shown.
  • the substrate PB is taken out by moving the substrates PB one by one in the surface direction, so that one of the four side surfaces of the substrate magazine rack M1 is the substrate PB.
  • An opening for taking in and out is provided (hereinafter, a surface having an opening for taking out the substrate PB is referred to as a substrate taking-out surface).
  • FIG. 3 shows a state in which the substrate PB is taken out from the substrate magazine rack M1 (FIG. 3A) and the mounted substrate MB is accommodated (FIG. 3B). As shown, new substrates PB can be sequentially taken out.
  • a mounting apparatus 1 shown in FIG. 1 includes a gantry 2, a mounting part 3 having a substrate stage 4 and a mounting head 5, a chip component supply mechanism 6 having a chip component pickup unit 7 and a chip component transport unit 8, and a substrate transport mechanism 9. I have.
  • the gantry 2 is a structure of the mounting apparatus 1 and is a basic structure that supports the substrate stage 4, the mounting head 5, the chip component pick-up means 7, the chip component transport means 8 and the substrate transport mechanism 9.
  • the substrate stage 4 has a suction table 41, an XY drive mechanism 42, and a substrate clamp 43, and holds the substrate PB, moves the substrate PB in the in-plane direction, and moves the position where the chip component C is to be mounted.
  • the suction table 41 has a function of sucking and holding the substrate PB
  • the XY drive mechanism 42 has a function of moving and adjusting the position of the suction table 41 in the in-plane direction (XY direction) of the substrate PB
  • the substrate clamp 43 is a substrate.
  • it also has a function of clamping and fixing the sides of the substrate PB.
  • the board clamp 43 includes a board rail 430 and a board guide 431 as constituent elements.
  • the substrate rail 430 and the substrate guide 431 are fixed in the XY direction with respect to the suction table 41, but can be adjusted in the vertical direction (Z direction). That is, if the upper surface of the substrate rail 430 is made higher than the upper surface of the suction table 41, the substrate PB can be transported without contacting the suction table 41, and if the upper surface of the substrate rail 430 is made the same height as the upper surface of the suction table 41.
  • the side of the substrate PB can be fixed on the suction table by the substrate guide 431.
  • FIG. 5 shows an improved example incorporating the countermeasures
  • FIG. 5A is a top view
  • FIG. 5B is a cross-sectional view, but the end portions of the substrate rail 430 and the suction table 41 are shown. It has a comb-teeth shape. In this way, when the substrate PB transport state as shown in FIG. 6A is changed to the substrate PB fixed state as shown in FIG. 6B, the upper surface of the substrate rail 430 is lower than the suction table 41.
  • the side portions of the substrate PB can be fixed by the convex portions at both ends of the suction table 41 and the substrate guide 431. For this reason, the side part of the substrate PB is not bent, which is also suitable when the non-mounting area on the side of the substrate PB is narrow.
  • the mounting head 5 has a function of lowering the chip component C held at the tip and pressurizing and mounting the substrate PB.
  • the function of heating the chip component simultaneously with the pressurization and the direction in the pressurizing surface May have a function of imparting ultrasonic vibration.
  • the chip component C held at the tip may have a function of adjusting the angle by rotating around the Z direction as an axis.
  • the word “mounting” is used on the assumption that the chip component is fixed to the substrate C together with heat and ultrasonic waves, but is not limited to this and is not cured.
  • a case in which the chip component C is temporarily fixed on the substrate PB via the thermosetting adhesive is also included in the mounting in the present invention.
  • the chip part pickup means 7 picks up the chip part C and delivers it to the chip part transport means 8.
  • the chip component pick-up means 7 shows an example of picking up a chip component from the diced wafer substrate W, but the pickup source is not limited to this, and is housed in a container. Alternatively, the chip component C may be picked up.
  • the chip component conveying means 8 conveys the chip component C delivered by the chip component pickup means 7 to the mounting head 5 and delivers the chip component C to the mounting head 5.
  • the substrate transport mechanism 9 takes out the substrate PB from the substrate magazine rack M1 and transports it to the substrate stage 4 as shown in FIG. 7, and transports the mounted substrate MB from the substrate stage 4 and stores it in the substrate magazine rack M1. It has both functions.
  • FIGS. 1 and 7 only the transport rail 90 constituting the substrate transport mechanism 9 is shown. However, as shown in FIGS. 8A and 8B, the end of the substrate PB is held. Have the function of conveying.
  • the stage side holding part 91 has a function of holding (and releasing) the edge of the substrate PB (or the mounted board MB) on the substrate stage 4 side. It is provided on the Z arm 92 and can be moved up and down (Z direction) by the operation of the Z arm 92.
  • the magazine rack side holding unit 96 has a function of holding (and releasing) the edge of the substrate PB (or the mounted substrate MB) on the substrate magazine rack M1 side (opposite the substrate stage 4 side).
  • the magazine rack side holding portion 96 is provided on the Z arm 97 and can be moved up and down (Z direction) by the operation of the Z arm 97.
  • the stage side holding part 91 and the magazine rack side holding part 96 hold preferably 1 mm or more from the outer edge, and preferably hold deeply according to the non-mounting area of the substrate PB, but at most 8 mm. Is enough.
  • the Z arm 92 has a movable range in which the edge of the substrate PB (or the mounted substrate MB) held by the stage side holding portion 91 can be pushed and pulled in the horizontal direction.
  • the Z arm 97 is on the magazine rack side.
  • the movable part has a movable range in which the edge of the substrate PB (or the mounted substrate MB) held by the holding unit 96 can be pushed and pulled in the horizontal direction.
  • a specific example is an embodiment whose top view is shown in FIG.
  • the Z arm 92 has a movable range in the Y direction along the slide rail 94 via the X arm 93, and the Z arm 97 is also connected to the slide rail 99 via the X arm 98. It has a movable range along. That is, the substrate transport mechanism 9 in this embodiment includes a transport rail 90, a stage side holding portion 91, a Z arm 92, an X arm 93, a slide rail 94, a magazine rack side holding portion 96, a Z arm 97, an X arm 98, and a slide.
  • a rail 99 is included as a component.
  • FIG. 9A shows a state in which the substrate PB is taken out from the substrate magazine rack M1.
  • the substrate take-out surface of the substrate magazine rack M1 faces the suction table 41, and the substrate PB (to be taken out) is arranged on a straight line extending from the suction table 41 to the substrate transport mechanism 9.
  • the substrate transport mechanism 9 operates so that the stage side holding portion 91 holds the edge on the stage side (the upper side in the figure) of the substrate PB at the accommodation position in the substrate magazine rack M1.
  • the substrate transport mechanism 9 holds the substrate PB and pulls it toward the stage as shown in FIG. 9B. At that time, since the substrate PB moves while being placed on the transport rail 90, even if only one edge is held, it can be moved horizontally.
  • the substrate guide 431 forms a gap with the substrate rail 430 to the extent that the substrate PB is allowed to pass through and the deformation such as warpage of the substrate PB is restricted.
  • the substrate guide 431 also has a role of regulating the width of the substrate PB.
  • a mechanism that can adjust the length of the X arm may be provided so that the position of the substrate in the X direction can be corrected in the stage of FIG. 9B.
  • the magazine rack side holding portion 96 is changed into the substrate PB as shown in FIG.
  • the magazine rack side edge is held, and the stage side holding portion 91 releases the holding and moves to the standby position.
  • the substrate PB held by the magazine rack side holding unit 96 is pushed to a predetermined position on the suction table 41 as shown in FIG.
  • the magazine rack side holding unit 96 releases the holding and moves away from the suction table 41 as shown in FIG. Thereafter, the substrate rail 430 constituting the substrate clamp 43 is lowered so that the upper surface is the same height as the upper surface of the suction table 41 (or the suction table 41 is raised) as shown in FIG. From this state, the suction table 41 sucks the substrate PB, and the substrate guide 431 descends, sandwiches the side of the substrate PB together with the substrate rail 430, and fixes the substrate PB on the suction table 41.
  • the self-running head 5 sequentially mounts the chip components C supplied by the chip component supply mechanism 6 on the substrate PB while moving the substrate PB together with the suction table 41 by the XY drive mechanism 42 constituting the substrate stage 4. Then, the mounted board MB is obtained as shown in FIG.
  • the mounted substrate MB is transported from the suction table 41 and stored in the substrate magazine rack M1.
  • the suction by the suction stage 41 is released, the substrate rail 430 is raised (or the suction table 41 is lowered), and the substrate The guide 431 is raised with respect to the board rail 430 so that the mounted board MB can slide on the board rail 430 as shown in FIG.
  • the upper surface of the substrate rail 430 is made equal to the upper surface of the transport rail 90.
  • the magazine rack side holding portion 96 holds the edge of the mounted substrate MB on the substrate magazine rack side as shown in FIG. 10 (h), and pulls it toward the magazine rack side as shown in FIG. 11 (i).
  • the magazine rack side holding unit 96 cannot move the mounted substrate MB to the inside of the substrate take-out surface of the substrate magazine rack M1. Therefore, as shown in FIG. 11 (j), the stage side holding portion 91 holds the edge of the mounted substrate MB on the stage side, and the magazine rack side holding portion 96 releases the holding and returns to the standby position.
  • the stage-side holding unit 91 holds the mounted substrate MB and pushes it toward the magazine rack (FIG. 11 (k)), and transports the mounted substrate MB to the accommodation position of the substrate magazine rack M1 (FIG. 11). 11 (l)).
  • the board transport mechanism 9 of the present invention is a mechanism that linearly moves the board PB (and the mounted board MB) on the rail, and has a limited edge of the board PB (mounted board MB). Even if the range is maintained, it can be reliably conveyed. For this reason, even if the chip component is mounted up to the vicinity of the outer periphery of the substrate PB, the substrate can be reliably conveyed.
  • FIG. 12 it has already been described that the apparatus configuration in which the substrate PB (or the mounted substrate MB) is transported only by the stage-side holding unit 91 is disadvantageous in terms of apparatus space.
  • FIG. 13 It is possible to adopt a configuration in which the magazine rack side holding portion 96 is also installed on the Z arm 92 on which the side holding portion 91 is installed.
  • the configuration is shown in FIG. 13 as a modification of the present embodiment.
  • FIGS. 13 (a) to 13 (d) show a state in which the states shown in FIGS. 9 (a) to 9 (d) are implemented in a modified example.
  • FIGS. ) To FIG. 11 (l) can also be implemented in a modified example.
  • the substrate PB accommodated in the substrate magazine rack M1 is returned to the original substrate magazine rack M1 as the mounted substrate MB, but the mounted substrate MB is placed in a magazine rack different from the substrate magazine rack M1. In some cases it is desirable to accommodate.
  • a general substrate magazine rack is often made of resin, but when a heat treatment or the like is performed in a subsequent process of the mounted substrate MB, the substrate magazine rack may be put in an oven.
  • the substrate magazine rack that accommodates the mounted substrate MB may be made of metal, and a mounting substrate magazine rack M2 for accommodating the mounted substrate MB may be provided separately from the substrate magazine rack M1. is there.
  • the mounting substrate magazine rack M2 When the mounting substrate magazine rack M2 is provided separately from the substrate magazine rack M1, there is a configuration in which the substrate magazine rack M1, the suction table 41, and the mounting substrate magazine rack M2 are arranged linearly as shown in FIG. However, in the configuration of FIG. 14, two substrate transport mechanisms are required separately from the substrate magazine rack M1 to the suction table 41 and from the suction table 41 to the mounting substrate magazine rack M2, and a corresponding space is also required.
  • FIG. 15 is a schematic view of the mounting apparatus 101 according to the second embodiment of the present invention. 15, symbols common to those of the mounting apparatus 1 of FIG. 1 have the same functions, but a mounting board magazine rack M2 and a magazine rack moving mechanism 10 are added to the mounting apparatus 101.
  • the mounting apparatus 101 takes out the substrate PB from the substrate magazine rack M1, mounts the chip component C such as a semiconductor chip on the substrate PB, and mounts the mounted substrate MB on which the chip component C is mounted at a predetermined position of the substrate PB. It is housed in M2. Similarly to the substrate magazine rack M1, the mounting substrate magazine rack M2 has an opening for accommodating the mounted substrate MB (hereinafter referred to as an opening for accommodating the mounted substrate MB). The surface is referred to as the mounting board receiving surface).
  • the substrate take-out surface of the substrate magazine rack M1 and the mounting substrate accommodation surface of the mounting substrate magazine rack M2 are arranged so as to be aligned in the same direction on the same surface. Further, in the magazine rack moving mechanism 10, either the substrate take-out surface of the substrate magazine rack M1 or the mounting substrate receiving surface of the mounting substrate magazine rack M2 is arranged on a straight line that continues from the mounting stage 4 to the substrate transport mechanism 9. As described above, the substrate magazine rack M1 and the mounting substrate magazine rack M2 are moved in the direction in which the substrate magazine rack M1 and the mounting substrate magazine rack M2 are arranged.
  • FIGS. 16A and 16B show the state in which the substrate PB is pulled out from the substrate magazine M1, and the operation of the substrate transport mechanism 9 is shown in FIGS. 9A and 9B.
  • the magazine rack moving mechanism 10 arranges the substrate magazine rack M1 on a straight line extending from the mounting stage 4 to the substrate transport mechanism 9.
  • the substrate transport mechanism 9 of the mounting apparatus 101 also arranges the substrate PB on the suction table 41 as shown in FIGS. 9C to 10F in the same manner as the mounting apparatus 1, and the semiconductor chip C Is mounted so that the mounted substrate MB mounted on the suction table 41 is carried out.
  • the magazine rack moving mechanism 10 operates so as to arrange the mounted substrate magazine rack M2 on a straight line continuous from the mounting stage 4 to the substrate transport mechanism 9. That is, after the magazine rack side of the substrate PB comes out of the substrate magazine rack M1, the magazine rack moving mechanism 10 moves the mounted substrate magazine rack M2 while the magazine rack side of the mounted substrate MB exists on the transport rail 90. Are arranged on a straight line extending from the mounting stage 4 to the substrate transport mechanism 9.
  • the substrate transport mechanism 9 transports the mounted substrate MB to the accommodation position of the mounting substrate magazine rack M2.
  • the substrate magazine rack M1 is again arranged on a straight line extending from the mounting stage 4 to the substrate transport mechanism 9 (FIG. 17 ( e))
  • the substrate PB is pulled out from the substrate magazine rack M1 (same as in FIG. 16A). The above operation is continued until there is no substrate PB in the substrate magazine rack M1 or until the mounted substrate magazine rack M2 is filled with the mounted substrates MB.
  • the transport from the substrate magazine rack M1 to the suction table 41, and the suction table 41 to the mounting substrate are performed. Since the transport to the magazine rack M2 is shared by one transport mechanism, the space efficiency is excellent.
  • the mounting substrate PB is rectangular, if the longitudinal direction of the substrate is the substrate transport direction (Y direction in FIG. 15), the movement direction of the substrate magazine rack M1 and the mounting substrate magazine rack M2 by the magazine rack moving mechanism 10 is Due to the short direction of the substrate, the movement distance is short and the space and the apparatus load are excellent.
  • the present invention requires neither the loader 211 nor the unloader and the space required for substrate transport is smaller than that of the mounting apparatus 301 as shown in FIG. Therefore, the present invention is effective even in a mounting apparatus having a plurality of mounting portions, such as a mounting apparatus 101 shown in FIG. 18 or a mounting apparatus 202 shown in FIG. That is, the mounting apparatus 202 of FIG. 19 also requires a magazine rack moving mechanism (10A, 10B) for each mounting unit, but the transport distance of the substrate PB (and the mounted substrate MB) is short, so FIG. Compared to the mounting apparatus 302 shown, the apparatus can be made more compact.
  • the mounted substrate MB obtained by the mounting unit 3A and the mounted substrate MB obtained by the mounting unit 3B are accommodated in the same mounting substrate magazine rack M2. It may be necessary to consider the influence of machine differences between the part 3A and the mounting part 3B in a subsequent process. Specifically, when changing the conditions for each mounting unit in a subsequent process as necessary while tracking in which mounting unit the mounted substrate MB accommodated in the mounting substrate magazine rack M2 is mounted There is. On the other hand, in the mounting apparatus 101 shown in FIG. 18 and the mounting apparatus 202 shown in FIG. 19, the mounted boards MB accommodated in the mounting board magazine rack M2 (the board magazine rack M1 in the mounting apparatus 201 in FIG. 18).
  • the chip component C is a semiconductor chip and the substrate PB has a quadrangular shape.
  • the substrate PB may be circular like a wafer substrate, and the material may be selected from semiconductor materials such as resin, ceramics, and silicon, and composite materials thereof.
  • the chip component C is not limited to a semiconductor chip, and may be a chip of a passive element such as a resistor or a capacitance.

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

Provided is a mounting device capable of reliably transferring a substrate even in the cases where a chip component is to be mounted to the vicinity of the outer periphery of the substrate. Specifically, a mounting device, which takes out a substrate stored in a substrate magazine rack, mounts a chip component on the substrate, and then stores, in the substrate magazine rack, the substrate having the chip component mounted thereon is provided. The mounting device is equipped with a mounting unit, which has a substrate stage and a mounting head, and which mounts, using the mounting head, the chip component on the substrate disposed on the substrate stage. The mounting device is also equipped with a substrate transfer mechanism having: a function of transferring the substrate onto the substrate stage by holding an outer edge portion of the substrate, said substrate having been at a storing position in the substrate magazine rack; and a function of transferring the substrate having the component mounted thereon from the substrate stage to the storing position in the substrate magazine rack by holding the outer edge portion.

Description

実装装置Mounting device
　本発明は半導体チップ等のチップ部品を基板に実装する実装装置に関する。より詳しくは基板マガジンラックに収容された基板を取り出し、チップ部品を実装してから基板マガジンラックに収容する実装装置に関する。 The present invention relates to a mounting apparatus for mounting a chip component such as a semiconductor chip on a substrate. More specifically, the present invention relates to a mounting apparatus that takes out a substrate accommodated in a substrate magazine rack, mounts chip components, and then accommodates the substrate in a substrate magazine rack.
　フリップチップ実装等を行なう実装装置は図２０に示すように、実装部３において、基板ステージ４が保持した基板ＰＢに、実装ヘッド５が半導体チップ等のチップ部品Ｃを実装するもので、基板ステージ４が基板位置を移動させながらチップ部品供給機構６から順次供給されるチップ部品Ｃを基板ＰＢ上の所定箇所に実装する機能を有している。 As shown in FIG. 20, a mounting apparatus for performing flip-chip mounting is such that a mounting head 5 mounts a chip component C such as a semiconductor chip on a substrate PB held by a substrate stage 4 in a mounting unit 3. 4 has a function of mounting the chip components C sequentially supplied from the chip component supply mechanism 6 at predetermined positions on the substrate PB while moving the substrate position.
　また、従来の実装装置は、図２０に示す実装装置３０１のように、基板ＰＢを収容する基板マガジンラックＭ１から基板ＰＢを１枚ずつ押し出す機能を有したローダ２１１と、チップ部品Ｃを所定箇所に実装した後の基板（以後、実装済基板ＭＢと記す）を基板マガジンラックＭ１とは別の基板マガジンラック（以後、実装基板マガジンラックＭ２と記す）に１枚ずつ収容する機能を有したアンローダ２１２を備えており、基板マガジンラックＭ１から取り出された基板ＰＢは白抜き矢印のように移動して実装済基板ＭＢとして実装基板マガジンラックＭ２に収容される。 Further, as in the mounting apparatus 301 shown in FIG. 20, the conventional mounting apparatus includes a loader 211 having a function of pushing out the substrates PB one by one from the substrate magazine rack M1 that accommodates the substrates PB, and a chip component C at predetermined positions. An unloader having a function of accommodating the substrates (hereinafter referred to as mounted substrates MB) after being mounted on each in a substrate magazine rack (hereinafter referred to as mounted substrate magazine rack M2) different from the substrate magazine rack M1. 212, and the substrate PB taken out from the substrate magazine rack M1 moves as indicated by a white arrow and is accommodated in the mounting substrate magazine rack M2 as a mounted substrate MB.
　なお、最近では生産性向上の観点から図２１に示す実装装置３０２のような構成の実装装置も実用化されている。実装装置３０２では、２つの実装部（実装部３Ａと実装部３Ｂ）がチップ部品供給機構６、ローダ２１１およびアンローダ２１２を共有しており、コストパフォーマンスに優れている（特許文献１）。 Recently, a mounting apparatus having a configuration like the mounting apparatus 302 shown in FIG. 21 has been put into practical use from the viewpoint of improving productivity. In the mounting apparatus 302, two mounting parts (the mounting part 3A and the mounting part 3B) share the chip component supply mechanism 6, the loader 211, and the unloader 212, and are excellent in cost performance (Patent Document 1).
　ところで、従来、図２０および図２１の白抜き矢印で示したように基板ＰＢおよび実装済基板ＭＢを移動させるのに際して、基板上面の四隅を吸着して吊上げる方法が用いられてきた。すなわち、図２２に示すような先端部に真空パッド２９１を有する吊上アーム２９０を用い、基板ＰＢ（または実装済基板ＭＢ）を吊上げた状態でレール等により所定箇所に搬送してから降下して吸着解除するという手法が用いられている（例えば特許文献２）。 By the way, conventionally, when the substrate PB and the mounted substrate MB are moved as shown by the white arrows in FIGS. 20 and 21, a method of attracting and lifting the four corners of the upper surface of the substrate has been used. That is, using a lifting arm 290 having a vacuum pad 291 at the tip as shown in FIG. 22, the substrate PB (or mounted substrate MB) is lifted and conveyed to a predetermined location by a rail or the like, and then lowered. A technique of releasing adsorption is used (for example, Patent Document 2).
特願２０１７－０２２２７５号Japanese Patent Application No. 2017-022275 特開２００５－２４３７０３号公報JP 2005-243703 A
　図２３（ａ）に基板ＰＢにチップ部品Ｃを実装した実装済基板ＭＢの上面図を示すが、基板ＰＢ内においてチップ部品Ｃを実装する実装エリアＡＭに対して実装エリアの周囲に非実装エリアＡＦが存在し、図２２の真空パッド２９１が吸着できるのが非実装エリアに限定されることが判る。ここで、図２３（ａ）のように、基板ＰＢのサイズに対して非実装エリアの比率が比較的大きい場合は、基板ＰＢを吊上げるのに充分な吸着力が得られる吸着パッド２９１のサイズを選定することが出来る。 FIG. 23A shows a top view of the mounted substrate MB in which the chip component C is mounted on the substrate PB, and the non-mounting area around the mounting area with respect to the mounting area AM on which the chip component C is mounted in the substrate PB. It can be seen that AF exists and the vacuum pad 291 in FIG. 22 can be adsorbed only in the non-mounting area. Here, as shown in FIG. 23A, when the ratio of the non-mounting area is relatively large with respect to the size of the substrate PB, the size of the suction pad 291 that provides sufficient suction force to lift the substrate PB. Can be selected.
　ところが、最近では、１枚の基板ＰＢに極力多くのチップ部品Ｃを実装することが求められており、図２３（ｂ）に示すように非実装エリアＡＦが狭まり、真空パッド２９１も小さくせざるを得なくなっている。このため、基板ＰＢを吊上げるのに充分な吸着力を得るのが困難となっている。 However, recently, it has been required to mount as many chip components C as possible on a single substrate PB. As shown in FIG. 23B, the non-mounting area AF is narrowed, and the vacuum pad 291 has to be reduced. Is getting lost. For this reason, it is difficult to obtain a sufficient suction force for lifting the substrate PB.
　更に、実装過程において基板ＰＢが加熱される場合においては、図２４のように基板ＰＢが湾曲して、真空パッド２９１と基板ＰＢの間に空隙ＶＧが生じ真空吸着自体が困難となることもある。 Further, when the substrate PB is heated during the mounting process, the substrate PB is curved as shown in FIG. 24, and a gap VG is generated between the vacuum pad 291 and the substrate PB, which may make vacuum suction itself difficult. .
　本発明は上記課題に鑑みてなされたものであり、チップ部品を基板の外周近くまで実装する場合においても、基板搬送を確実に行うことが可能な実装装置を提供するものである。　 The present invention has been made in view of the above problems, and provides a mounting apparatus that can reliably carry a substrate even when a chip component is mounted close to the outer periphery of the substrate. *
　上記の課題を解決するために、請求項１に記載の発明は、
基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を前記基板マガジンラックに収容する実装装置であって、
基板ステージと実装ヘッドとを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、前記基板マガジンラック内の収容位置にある前記基板を、前記基板の外縁部を保持して前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から外縁部を保持して前記基板マガジンラックの収容位置まで搬送する機能と、を有する基板搬送機構とを備えた実装装置である。 In order to solve the above problems, the invention described in claim 1
A mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in the substrate magazine rack,
A substrate stage and a mounting head; and a mounting portion for mounting the chip component by the mounting head on the substrate disposed on the substrate stage; and the substrate at a receiving position in the substrate magazine rack, A substrate having a function of holding the outer edge portion of the substrate and transporting it onto the substrate stage, and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the substrate magazine rack while holding the outer edge portion. A mounting apparatus including a transport mechanism.
　請求項２に記載の発明は、
基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を実装基板マガジンラックに収容する実装装置であって、
前記基板マガジンラックの基板取り出し面と、前記実装基板マガジンラックの実装済基板収容面とを同一面上の同一方向にして並べた状態に配置して、前記基板マガジンラックと前記実装基板マガジンラックを並べた方向に移動させるマガジンラック移動機構と、
基板ステージと実装ヘッドとを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、前記基板マガジンラック内の収容位置にある前記基板を、前記基板の外縁部を保持して前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から外縁部を保持して前記基板マガジンラックの収容位置まで搬送する機能と、を有する基板搬送機構とを備えた実装装置である。 The invention described in claim 2
A mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in a mounting substrate magazine rack,
The substrate magazine rack and the mounting substrate magazine rack are arranged in a state in which the substrate take-out surface of the substrate magazine rack and the mounted substrate receiving surface of the mounting substrate magazine rack are arranged in the same direction on the same surface. Magazine rack moving mechanism to move in the aligned direction;
A substrate stage and a mounting head; and a mounting portion for mounting the chip component by the mounting head on the substrate disposed on the substrate stage; and the substrate at a receiving position in the substrate magazine rack, A substrate having a function of holding the outer edge portion of the substrate and transporting it onto the substrate stage, and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the substrate magazine rack while holding the outer edge portion. A mounting apparatus including a transport mechanism.
　請求項３に記載の発明は、請求項１または請求項２に記載の実装装置であって、
前記基板搬送機構は、前記基板を、前記基板マガジンラックから前記基板ステージ上まで、前記基板マガジンラックの基板取り出し面に対して直角方向に直線搬送する機能を有する実装装置である。 Invention of Claim 3 is the mounting apparatus of Claim 1 or Claim 2, Comprising:
The substrate transport mechanism is a mounting device having a function of linearly transporting the substrate from the substrate magazine rack to the substrate stage in a direction perpendicular to the substrate take-out surface of the substrate magazine rack.
　請求項４に記載の発明は、請求項１から請求項３のいずれかの請求項に記載の実装装置であって、
前記実装ヘッドに前記チップ部品を供給するチップ部品供給機構を更に備えた実装装置である。 The invention according to claim 4 is the mounting apparatus according to any one of claims 1 to 3,
The mounting apparatus further includes a chip component supply mechanism for supplying the chip component to the mounting head.
　請求項５に記載の発明は、請求項４記載の実装装置であって、
前記実装部を２つ備え、前記実装部夫々と１対１で対応する前記基板搬送手段を備え、
前記チップ部品供給機構は、前記２つの実装部の間に配置され、２つの前記実装部夫々にチップ部品を供給する機能を有する実装装置である。 Invention of Claim 5 is the mounting apparatus of Claim 4, Comprising:
Two mounting portions, the substrate transport means corresponding to the mounting portions one-to-one,
The chip component supply mechanism is a mounting apparatus that is disposed between the two mounting portions and has a function of supplying a chip component to each of the two mounting portions.
本発明により、チップ部品を基板の外周近くまで実装する場合においても、基板搬送を確実に行うことが可能な実装装置が提供できる。　 According to the present invention, it is possible to provide a mounting apparatus capable of reliably carrying a substrate even when chip components are mounted close to the outer periphery of the substrate. *
本発明の実施形態に係る実装装置の構成を示す概略図である。It is the schematic which shows the structure of the mounting apparatus which concerns on embodiment of this invention. 基板マガジンラックについて説明する断面図であり、（ａ）基板が入っていない状態、（ｂ）基板が入った状態で基板出入り状態を示す図である。It is sectional drawing explaining a substrate magazine rack, and is a figure which shows a substrate exit / entry state in the state in which (a) the board | substrate is not inserted, and the state in which (b) the board | substrate entered. 本発明の実施形態に係る基板と基板マガジンラックの関係を説明する断面図であり、（ａ）基板マガジンラックから基板が取り出される状態、（ｂ）実装済基板が基板マガジンラックに収容される状態、（ｃ）実装済基板を収容後に別の基板が基板マガジンラックから取り出される状態を示す図である。It is sectional drawing explaining the relationship between the board | substrate which concerns on embodiment of this invention, and a board | substrate magazine rack, (a) The state in which a board | substrate is taken out from a board | substrate magazine rack, (b) The state in which the mounted board | substrate is accommodated in a board | substrate magazine rack (C) It is a figure which shows the state from which another board | substrate is taken out from a board | substrate magazine rack after accommodating the mounted board | substrate. 本発明の実施形態に係る実装装置の基板クランプの動作を説明する図であり、（ａ）基板搬送時、（ｂ）基板固定時、（ｃ）実装済基板搬送時の断面図である。It is a figure explaining the operation | movement of the board | substrate clamp of the mounting apparatus which concerns on embodiment of this invention, (a) At the time of board | substrate conveyance, (b) At the time of board fixation, (c) It is sectional drawing at the time of board | substrate conveyance. 本発明の実施形態に係る実装装置における基板クランプ改良例について説明する図であり、（ａ）上面図、（ｂ）断面図を示す図である。It is a figure explaining the example of a board clamp improvement in the mounting device concerning the embodiment of the present invention, and is a figure showing (a) a top view and (b) sectional view. 本発明の実施形態に係る実装装置における基板クランプ改良例の動作について説明する断面図であり、（ａ）基板搬送時の状態、（ｂ）基板固定時の状態を示す図である。It is sectional drawing explaining the operation | movement of the example of a board | substrate clamp improvement in the mounting apparatus which concerns on embodiment of this invention, (a) The state at the time of board | substrate conveyance, (b) It is a figure which shows the state at the time of board | substrate fixation. 本発明の実施形態に係る実装装置の基板搬送方向を説明する図である。It is a figure explaining the board | substrate conveyance direction of the mounting apparatus which concerns on embodiment of this invention. 本発明の実施形態に係る基板搬送機構の、（ａ）ステージ側保持部周辺、（ｂ）マガジンラック側保持部周辺を説明する図である。It is a figure explaining (a) stage side holding part periphery and (b) magazine rack side holding part periphery of the board | substrate conveyance mechanism which concerns on embodiment of this invention. 本発明の実施形態に係る基板搬送機構の動作を説明する図であり、（ａ）基板マガジンラックから基板を引き出す状態、（ｂ）基板をステージ側に引いて搬送する状態（ｃ）基板を引いて一部が吸着テーブル上に達した状態、（ｄ）基板を吸着テーブル上の所定位置に押して行く状態を示す図である。It is a figure explaining operation | movement of the board | substrate conveyance mechanism which concerns on embodiment of this invention, (a) The state which pulls out a board | substrate from a board | substrate magazine rack, (b) The state which pulls and conveys a board | substrate to the stage side (c) Pulls a board | substrate FIG. 7 is a diagram showing a state where a part of the substrate has reached the suction table, and (d) a state in which the substrate is pushed to a predetermined position on the suction table. 本発明の実施形態に係る基板搬送機構の動作を説明する図であり、（ｅ）基板を押して吸着テーブル上の所定位置に配置した状態、（ｆ）基板を吸着テーブル上に固定した状態、（ｇ）基板上へのチップ部品の実装が完了した状態、（ｈ）実装済基板を吸着テーブル上から基板マガジンラック側に引き出す状態を示す図である。It is a figure explaining operation | movement of the board | substrate conveyance mechanism which concerns on embodiment of this invention, (e) The state which pushed the board | substrate and arrange | positioned in the predetermined position on a suction table, (f) The state which fixed the board | substrate on the suction table, ( (g) A state in which the mounting of the chip components on the substrate is completed, and (h) a state in which the mounted substrate is pulled out from the suction table to the substrate magazine rack side. 本発明の実施形態に係る基板搬送機構の動作を説明する図であり、（ｉ）実装済基板を基板マガジンラック側に引いて搬送する状態、（ｊ）実装済基板を基板マガジンラック側に押して搬送する状態、（ｋ）実装済基板を基板マガジンラックに押し込む状態、（ｌ）実装済基板を基板マガジンラックに収容した状態を示す図である。It is a figure explaining operation | movement of the board | substrate conveyance mechanism which concerns on embodiment of this invention, (i) The state which pulls and mounts a mounted substrate to the substrate magazine rack side, (j) Pushes a mounted substrate to the substrate magazine rack side. It is a figure which shows the state which conveys, (k) the state which pushed the mounted board | substrate in a board | substrate magazine rack, and the state which accommodated the mounted board | substrate in the board | substrate magazine rack. 本発明の実施形態に係り、基板のステージ側のみを保持する装置構成を示した図である。It is the figure which showed the apparatus structure which concerns on embodiment of this invention and hold | maintains only the stage side of a board | substrate. 本発明の実施形態に係る基板搬送機構の変形例を説明する図であり、（ａ）基板マガジンラックから基板を引き出す状態、（ｂ）基板をステージ側に引いて搬送する状態（ｃ）基板を引いて一部が吸着テーブル上に達した状態、（ｄ）基板を吸着テーブル上の所定位置に押して行く状態を示す図である。It is a figure explaining the modification of the board | substrate conveyance mechanism which concerns on embodiment of this invention, (a) The state which pulls out a board | substrate from a board | substrate magazine rack, (b) The state which pulls and conveys a board | substrate to the stage side (c) A board | substrate It is a figure which shows the state which pulled and the part reached on the adsorption | suction table, (d) The state which pushes a board | substrate to the predetermined position on an adsorption | suction table. 実装済基板を元の基板マガジンラックとは別の実装基板マガジンラックに収容する場合の装置構成の一例である。It is an example of an apparatus structure in the case of accommodating a mounted substrate in a mounting substrate magazine rack different from the original substrate magazine rack. 本発明の第二実施形態に係る実装装置の構成を示す概略図である。It is the schematic which shows the structure of the mounting apparatus which concerns on 2nd embodiment of this invention. 本発明の第二実施形態に係る基板搬送機構の動作を説明する図であり、（ａ）基板マガジンラックから基板を引き出す状態、（ｂ）基板をステージ側に引いて搬送する状態（ｃ）実装済基板をマガジンラック側に押して搬送する状態、（ｄ）実装済基板を実装基板マガジンラックに押し込む状態を示す図である。It is a figure explaining operation | movement of the board | substrate conveyance mechanism which concerns on 2nd embodiment of this invention, (a) The state which pulls out a board | substrate from a board | substrate magazine rack, (b) The state which pulls and conveys a board | substrate to the stage side (c) Mounting It is a figure which shows the state which pushes a completed board | substrate to the magazine rack side, and conveys, and (d) the state which pushes a mounted board | substrate into a mounting board | substrate magazine rack. 本発明の第二実施形態に係る基板搬送機構の動作を説明する図であり、（ｅ）基板マガジンから基板を引き出す準備段階、（ｆ）基板マガジンラックから基板を引き出す状態を示す図である。It is a figure explaining operation | movement of the board | substrate conveyance mechanism which concerns on 2nd embodiment of this invention, (e) The preparation stage which draws out a board | substrate from a board | substrate magazine, (f) It is a figure which shows the state which pulls out a board | substrate from a board | substrate magazine rack. 本発明の実施形態に係り、複数の実装部を備えた装置構成を示す概略図である。1 is a schematic diagram illustrating an apparatus configuration including a plurality of mounting units according to an embodiment of the present invention. 本発明の第二実施形態に係り、複数の実装部を備えた装置構成を示す概略図である。FIG. 10 is a schematic diagram illustrating a device configuration including a plurality of mounting units according to the second embodiment of the present invention. 従来の実装装置の装置構成を示す概略図である。It is the schematic which shows the apparatus structure of the conventional mounting apparatus. 従来の実装装置で複数の実装部を備えた装置構成を示す概略図である。It is the schematic which shows the apparatus structure provided with the some mounting part with the conventional mounting apparatus. 従来の実装装置で基板を搬送するのに用いる基板吊上げ手法を説明する図である。It is a figure explaining the board | substrate lifting technique used for conveying a board | substrate with the conventional mounting apparatus. （ａ）実装済基板の実装エリアと非実装エリアについて説明する図であり、（ｂ）非実装エリアが狭まっている状況を説明する図である。(A) It is a figure explaining the mounting area and non-mounting area of a mounted substrate, (b) It is a figure explaining the condition where the non-mounting area is narrowing. 非実装エリアが狭まった実装済基板の表面を吸着して吊上げる際の問題点を説明する図である。It is a figure explaining the problem at the time of adsorb | sucking and lifting the surface of the mounted board | substrate with which the non-mounting area was narrowed.
　本発明の実施形態について、図面を用いて説明する。
図１は本発明の実施形態に係る実装装置の一例を示す概略図である。図１の実装装置１は、基板マガジンラックＭ１から基板ＰＢを取り出し、基板ＰＢに半導体チップ等のチップ部品Ｃを実装し、基板ＰＢの所定箇所にチップ部品Ｃを実装した実装済基板ＭＢを基板マガジンラックＭ１に収容するものである。 Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic view showing an example of a mounting apparatus according to an embodiment of the present invention. 1 takes out a substrate PB from the substrate magazine rack M1, mounts a chip component C such as a semiconductor chip on the substrate PB, and mounts a mounted substrate MB on which a chip component C is mounted at a predetermined position of the substrate PB. It is accommodated in the magazine rack M1.
　ここで、基板マガジンラックＭ１は、基板ＰＢ同士を適度な隙間を開けて積層収容するものであり、図２（ａ）に基板ＰＢが入っていない断面図を示し、図２（ｂ）には基板ＰＢが収容された断面図を示している。また、基板ＰＢの取り出しは、図２（ｂ）に示すように、基板ＰＢを１枚ずつ面方向に移動させて行なうため、基板マガジンラックＭ１の４側面の中の１面は、基板ＰＢの出し入れを行なう開口を有している（以下、基板ＰＢを取り出す開口を有する面を基板取り出し面と記す）。 Here, the substrate magazine rack M1 stacks and accommodates the substrates PB with an appropriate gap, and FIG. 2A shows a cross-sectional view without the substrate PB, and FIG. A sectional view in which a substrate PB is accommodated is shown. Further, as shown in FIG. 2B, the substrate PB is taken out by moving the substrates PB one by one in the surface direction, so that one of the four side surfaces of the substrate magazine rack M1 is the substrate PB. An opening for taking in and out is provided (hereinafter, a surface having an opening for taking out the substrate PB is referred to as a substrate taking-out surface).
　図３は、基板マガジンラックＭ１から基板ＰＢを取り出して（図３（ａ）、実装済基板ＭＢを収容する（図３（ｂ））様子を示したものであるが、図３（ｃ）に示すように順次新たな基板ＰＢを取り出せるようになっている。 FIG. 3 shows a state in which the substrate PB is taken out from the substrate magazine rack M1 (FIG. 3A) and the mounted substrate MB is accommodated (FIG. 3B). As shown, new substrates PB can be sequentially taken out.
　図１の実装装置１は、架台２、基板ステージ４と実装ヘッド５を有する実装部３、チップ部品ピックアップ手段７とチップ部品搬送手段８とを有するチップ部品供給機構６、および基板搬送機構９を備えている。 A mounting apparatus 1 shown in FIG. 1 includes a gantry 2, a mounting part 3 having a substrate stage 4 and a mounting head 5, a chip component supply mechanism 6 having a chip component pickup unit 7 and a chip component transport unit 8, and a substrate transport mechanism 9. I have.
　架台２は実装装置１の構造体であり、基板ステージ４、実装ヘッド５、チップ部品ピックアップ手段７、チップ部品搬送手段８および基板搬送機構９を支持する基礎構造体となっている。 The gantry 2 is a structure of the mounting apparatus 1 and is a basic structure that supports the substrate stage 4, the mounting head 5, the chip component pick-up means 7, the chip component transport means 8 and the substrate transport mechanism 9.
　基板ステージ４は、吸着テーブル４１、ＸＹ駆動機構４２、基板クランプ４３を有し、基板ＰＢを保持するとともに、基板ＰＢを面内方向に移動させ、チップ部品Ｃを実装すべき位置を移動させる機能を有している。吸着テーブル４１は基板ＰＢを吸着保持する機能を有し、ＸＹ駆動機構４２は基板ＰＢの面内方向（ＸＹ方向）に吸着テーブル４１を移動させ位置調整する機能を有し、基板クランプ４３は基板ＰＢを吸着テーブル４１に搬送する際のガイドとして機能するとともに、基板ＰＢの側辺をクランプして固定する機能も有している。 The substrate stage 4 has a suction table 41, an XY drive mechanism 42, and a substrate clamp 43, and holds the substrate PB, moves the substrate PB in the in-plane direction, and moves the position where the chip component C is to be mounted. have. The suction table 41 has a function of sucking and holding the substrate PB, the XY drive mechanism 42 has a function of moving and adjusting the position of the suction table 41 in the in-plane direction (XY direction) of the substrate PB, and the substrate clamp 43 is a substrate. In addition to functioning as a guide when transporting the PB to the suction table 41, it also has a function of clamping and fixing the sides of the substrate PB.
　図４（ａ）に示すように、基板クランプ４３は、基板レール４３０と基板ガイド４３１を構成要素としている。基板レール４３０および基板ガイド４３１は吸着テーブル４１に対しＸＹ方向には固定されているものの、上下方向（Ｚ方向）には位置調整可能になっている。すなわち、基板レール４３０上面を吸着テーブル４１の上面より高くすれば、基板ＰＢを吸着テーブル４１と接触させずに搬送することが出来、基板レール４３０上面を吸着テーブル４１上面と同高さにすれば、基板ガイド４３１によって基板ＰＢの側辺を吸着テーブル上に固定することが出来る。 As shown in FIG. 4A, the board clamp 43 includes a board rail 430 and a board guide 431 as constituent elements. The substrate rail 430 and the substrate guide 431 are fixed in the XY direction with respect to the suction table 41, but can be adjusted in the vertical direction (Z direction). That is, if the upper surface of the substrate rail 430 is made higher than the upper surface of the suction table 41, the substrate PB can be transported without contacting the suction table 41, and if the upper surface of the substrate rail 430 is made the same height as the upper surface of the suction table 41. The side of the substrate PB can be fixed on the suction table by the substrate guide 431.
　ただし、基板レール４３０の上面と吸着テーブル４１上面の高さを同一にする際に誤差が生じると、基板ＰＢの側辺部が折れ曲がった状態になる懸念がある。その対策を盛り込んだ改良例を示したのが図５であり、図５（ａ）が上面図で、図５（ｂ）が断面図であるが、基板レール４３０と吸着テーブル４１の端部を櫛歯状でかみ合うような形状にしている。このようにすることで、図６（ａ）のような基板ＰＢ搬送状態から、図６（ｂ）のような基板ＰＢ固定状態にする際、基板レール４３０上面が吸着テーブル４１より低くなっても、吸着テーブル４１両端の凸部と基板ガイド４３１によって基板ＰＢの側辺部を固定することが出来る。このため、基板ＰＢの側辺部が折れ曲がることはなく、基板ＰＢ側辺の非実装エリアが狭い場合にも好適である。 However, if an error occurs when the height of the upper surface of the substrate rail 430 and the upper surface of the suction table 41 are the same, the side portion of the substrate PB may be bent. FIG. 5 shows an improved example incorporating the countermeasures, FIG. 5A is a top view, and FIG. 5B is a cross-sectional view, but the end portions of the substrate rail 430 and the suction table 41 are shown. It has a comb-teeth shape. In this way, when the substrate PB transport state as shown in FIG. 6A is changed to the substrate PB fixed state as shown in FIG. 6B, the upper surface of the substrate rail 430 is lower than the suction table 41. The side portions of the substrate PB can be fixed by the convex portions at both ends of the suction table 41 and the substrate guide 431. For this reason, the side part of the substrate PB is not bent, which is also suitable when the non-mounting area on the side of the substrate PB is narrow.
　実装ヘッド５は、先端部で保持したチップ部品Ｃを降下させて、基板ＰＢに加圧して実装する機能を有しており、加圧と同時にチップ部品を加熱する機能や、加圧面内の方向に超音波振動を付与する機能、等を有していてもよい。更に、先端部に保持したチップ部品Ｃを、Ｚ方向を軸として回転して角度調整する機能を有していてもよい。 The mounting head 5 has a function of lowering the chip component C held at the tip and pressurizing and mounting the substrate PB. The function of heating the chip component simultaneously with the pressurization and the direction in the pressurizing surface May have a function of imparting ultrasonic vibration. Further, the chip component C held at the tip may have a function of adjusting the angle by rotating around the Z direction as an axis.
　なお、本明細書の説明において、チップ部品を基板Ｃに熱や超音波とともに圧着して固定することを想定して実装という言葉を用いているが、これに限定されるものではなく、未硬化の熱硬化性接着材を介して、基板ＰＢ上にチップ部品Ｃを仮固定するケースも本発明における実装に含まれる。 In the description of the present specification, the word “mounting” is used on the assumption that the chip component is fixed to the substrate C together with heat and ultrasonic waves, but is not limited to this and is not cured. A case in which the chip component C is temporarily fixed on the substrate PB via the thermosetting adhesive is also included in the mounting in the present invention.
　チップ部品ピックアップ手段７は、チップ部品Ｃをピックアップして、チップ部品搬送手段８に受け渡すものである。図１の実装装置１では、チップ部品ピックアップ手段７は、ダイシングされたウェハ基板Ｗからチップ部品をピックアップする例を示しているが、ピックアップ元はこれに限定されるものではなく、容器に収容されたチップ部品Ｃをピックアップする構成であってもよい。 The chip part pickup means 7 picks up the chip part C and delivers it to the chip part transport means 8. In the mounting apparatus 1 of FIG. 1, the chip component pick-up means 7 shows an example of picking up a chip component from the diced wafer substrate W, but the pickup source is not limited to this, and is housed in a container. Alternatively, the chip component C may be picked up.
　チップ部品搬送手段８は、チップ部品ピックアップ手段７によって受け渡されたチップ部品Ｃを実装ヘッド５まで搬送し、チップ部品Ｃを実装ヘッド５に受け渡すものである。 The chip component conveying means 8 conveys the chip component C delivered by the chip component pickup means 7 to the mounting head 5 and delivers the chip component C to the mounting head 5.
　基板搬送機構９は、図７に示すように基板ＰＢを基板マガジンラックＭ１から取り出して基板ステージ４に搬送する機能と、実装済基板ＭＢを基板ステージ４から搬送して基板マガジンラックＭ１に収容する機能の両機能を有するものである。 The substrate transport mechanism 9 takes out the substrate PB from the substrate magazine rack M1 and transports it to the substrate stage 4 as shown in FIG. 7, and transports the mounted substrate MB from the substrate stage 4 and stores it in the substrate magazine rack M1. It has both functions.
　図１および図７においては、基板搬送機構９を構成する搬送レール９０のみを表示しているが、図８（ａ）および図８（ｂ）に示すように、基板ＰＢの端部を保持して搬送する機能を有している。 In FIGS. 1 and 7, only the transport rail 90 constituting the substrate transport mechanism 9 is shown. However, as shown in FIGS. 8A and 8B, the end of the substrate PB is held. Have the function of conveying.
　図８（ａ）において、ステージ側保持部９１は、基板ＰＢ（または実装済基板ＭＢ）の基板ステージ４側の縁を保持（および解除）する機能を有しており、ステージ側保持部９１はＺアーム９２に設けられていて、Ｚアーム９２の動作により上下（Ｚ方向）移動が可能である。図８（ｂ）において、マガジンラック側保持部９６は、基板ＰＢ（または実装済基板ＭＢ）の基板マガジンラックＭ１側（基板ステージ４側の反対）の縁を保持（および解除）する機能を有しており、マガジンラック側保持部９６はＺアーム９７に設けられていて、Ｚアーム９７の動作により上下（Ｚ方向）移動が可能である。 8A, the stage side holding part 91 has a function of holding (and releasing) the edge of the substrate PB (or the mounted board MB) on the substrate stage 4 side. It is provided on the Z arm 92 and can be moved up and down (Z direction) by the operation of the Z arm 92. In FIG. 8B, the magazine rack side holding unit 96 has a function of holding (and releasing) the edge of the substrate PB (or the mounted substrate MB) on the substrate magazine rack M1 side (opposite the substrate stage 4 side). The magazine rack side holding portion 96 is provided on the Z arm 97 and can be moved up and down (Z direction) by the operation of the Z arm 97.
　ここで、ステージ側保持部９１およびマガジンラック側保持部９６が保持するのは、外縁から１ｍｍ以上あることが望ましく、基板ＰＢの非実装エリアに応じて深く保持することが望ましいが最大でも８ｍｍあれば充分である。 Here, the stage side holding part 91 and the magazine rack side holding part 96 hold preferably 1 mm or more from the outer edge, and preferably hold deeply according to the non-mounting area of the substrate PB, but at most 8 mm. Is enough.
　更に、Ｚアーム９２はステージ側保持部９１が保持した基板ＰＢ（または実装済基板ＭＢ）の縁を水平方向に押し引き可能な可動範囲を有しており、同様にＺアーム９７はマガジンラック側保持部９６が保持した基板ＰＢ（または実装済基板ＭＢ）の縁を水平方向に押し引き可能な可動範囲を有している。その具体例が、図９（ａ）に上面図を示した実施形態である。 Further, the Z arm 92 has a movable range in which the edge of the substrate PB (or the mounted substrate MB) held by the stage side holding portion 91 can be pushed and pulled in the horizontal direction. Similarly, the Z arm 97 is on the magazine rack side. The movable part has a movable range in which the edge of the substrate PB (or the mounted substrate MB) held by the holding unit 96 can be pushed and pulled in the horizontal direction. A specific example is an embodiment whose top view is shown in FIG.
　図９（ａ）で説明すると、Ｚアーム９２はＸアーム９３を介してスライドレール９４に沿ってＹ方向に可動範囲を有しており、Ｚアーム９７もＸアーム９８を介してスライドレール９９に沿って可動範囲を有している。すなわち、本実施形態における基板搬送機構９は、搬送レール９０、ステージ側保持部９１、Ｚアーム９２、Ｘアーム９３、スライドレール９４、マガジンラック側保持部９６、Ｚアーム９７、Ｘアーム９８およびスライドレール９９を構成要素として有している。 9A, the Z arm 92 has a movable range in the Y direction along the slide rail 94 via the X arm 93, and the Z arm 97 is also connected to the slide rail 99 via the X arm 98. It has a movable range along. That is, the substrate transport mechanism 9 in this embodiment includes a transport rail 90, a stage side holding portion 91, a Z arm 92, an X arm 93, a slide rail 94, a magazine rack side holding portion 96, a Z arm 97, an X arm 98, and a slide. A rail 99 is included as a component.
　以下、図９（ａ）に示した基板搬送機構９を備えた実装装置１について、基板マガジンラックＭ１から基板ＰＢを取り出してから、実装済基板ＭＢとして基板マガジンラックＭ１に収容するまでの動作を、図９から図１１を用いて説明する。 Hereinafter, with respect to the mounting apparatus 1 provided with the substrate transport mechanism 9 shown in FIG. 9A, the operation from taking out the substrate PB from the substrate magazine rack M1 until it is accommodated in the substrate magazine rack M1 as the mounted substrate MB. This will be described with reference to FIGS. 9 to 11.
　図９（ａ）は、基板マガジンラックＭ１から基板ＰＢを取り出す状態を示したものである。ここで、基板マガジンラックＭ１の基板取り出し面は、吸着テーブル４１の方を向いており、吸着テーブル４１から基板搬送機構９に連なる直線上に（取り出すべき）基板ＰＢが配置されている。 FIG. 9A shows a state in which the substrate PB is taken out from the substrate magazine rack M1. Here, the substrate take-out surface of the substrate magazine rack M1 faces the suction table 41, and the substrate PB (to be taken out) is arranged on a straight line extending from the suction table 41 to the substrate transport mechanism 9.
　この状態で、基板搬送機構９はステージ側保持部９１が、基板マガジンラックＭ１内の収容位置にある基板ＰＢのステージ側（図の上側）の縁を保持するように動作する。 In this state, the substrate transport mechanism 9 operates so that the stage side holding portion 91 holds the edge on the stage side (the upper side in the figure) of the substrate PB at the accommodation position in the substrate magazine rack M1.
　この後、基板搬送機構９は基板ＰＢを保持した状態で、図９（ｂ）に示す様にステージ側に引いて移動させる。その際、基板ＰＢは搬送レール９０上に載った状態で移動するので、一方の縁だけを保持した状態であっても水平に移動させることが出来る。 Thereafter, the substrate transport mechanism 9 holds the substrate PB and pulls it toward the stage as shown in FIG. 9B. At that time, since the substrate PB moves while being placed on the transport rail 90, even if only one edge is held, it can be moved horizontally.
　更に基板ＰＢを移動させると、図９（ｃ）のように、基板ＰＢの一部が吸着テーブル４１上に達する。この状態において、図４（ａ）のように、基板クランプ４３を構成する基板レール４３０の上面は吸着テーブル４１より高く、搬送レール９０の上面と等しくすることにより、基板ＰＢをスムーズに搬送することが出来る。また、基板ガイド４３１は基板ＰＢを通過させつつ、基板ＰＢの反り等の変形を規制する程度に、基板レール４３０との間に隙間を形成している。なお、基板ガイド４３１は基板ＰＢの幅を規制する役割も有している。このため、基板ＰＢのＸ方向位置がずれた状態で搬送すると、基板ＰＢは基板ガイド４３１間を通過することが出来ない。そこで、図９（ｂ）の段階で、基板のＸ方向位置が修正できるよう、Ｘアームの長さを調整できるような機構を有していてもよい。 When the substrate PB is further moved, a part of the substrate PB reaches the suction table 41 as shown in FIG. In this state, as shown in FIG. 4A, the upper surface of the substrate rail 430 constituting the substrate clamp 43 is higher than the suction table 41 and is equal to the upper surface of the transport rail 90, so that the substrate PB can be transported smoothly. I can do it. Further, the substrate guide 431 forms a gap with the substrate rail 430 to the extent that the substrate PB is allowed to pass through and the deformation such as warpage of the substrate PB is restricted. The substrate guide 431 also has a role of regulating the width of the substrate PB. For this reason, if the substrate PB is transported in a state where the position in the X direction is shifted, the substrate PB cannot pass between the substrate guides 431. Therefore, a mechanism that can adjust the length of the X arm may be provided so that the position of the substrate in the X direction can be corrected in the stage of FIG. 9B.
　ところで、図９（ｃ）の状態から、ステージ側保持部９１が基板ＰＢを保持した状態のままで、基板ＰＢを吸着テーブル４１の所定位置まで搬送するような構成とすることは可能である。しかし、そのような構成とする場合、図１２に示すように、吸着テーブル４１を超えた位置（図１２における吸着テーブルの上側）までステージ側保持部９１を移動させる必要がある。図１２のように、吸着テーブル４１を超えた部分にスペースを設けた装置構成としてもよいが、本発明ではステージ側保持部９１とは別に、マガジンラック側保持部９６を設けた構成として装置スペースの削減を図っている。 Incidentally, from the state of FIG. 9C, it is possible to adopt a configuration in which the substrate PB is transported to a predetermined position of the suction table 41 while the stage side holding portion 91 holds the substrate PB. However, in such a configuration, as shown in FIG. 12, it is necessary to move the stage side holding portion 91 to a position beyond the suction table 41 (upper side of the suction table in FIG. 12). As shown in FIG. 12, an apparatus configuration in which a space is provided in a portion beyond the suction table 41 may be used. However, in the present invention, an apparatus space in which a magazine rack side holding portion 96 is provided separately from the stage side holding portion 91. We are trying to reduce it.
　図９（ｃ）のようにステージ側保持部９１を用いて基板ＰＢの一部を吸着テーブル４１方向に引いた状態から、図９（ｄ）のようにマガジンラック側保持部９６が、基板ＰＢのマガジンラック側の縁を保持し、ステージ側保持部９１は保持を解除して待機位置に移動する。その後は、図１０（ｅ）のようにマガジンラック側保持部９６が保持した基板ＰＢを吸着テーブル４１上の所定位置まで押して行く。 From a state in which a part of the substrate PB is pulled in the direction of the suction table 41 using the stage side holding portion 91 as shown in FIG. 9C, the magazine rack side holding portion 96 is changed into the substrate PB as shown in FIG. The magazine rack side edge is held, and the stage side holding portion 91 releases the holding and moves to the standby position. Thereafter, the substrate PB held by the magazine rack side holding unit 96 is pushed to a predetermined position on the suction table 41 as shown in FIG.
　基板ＰＢが吸着テーブル４１上の所定位置に配置されたなら、図１０（ｆ）のようにマガジンラック側保持部９６は保持を解除して吸着テーブル４１上から離れる。その後、基板クランプ４３を構成する基板レール４３０は、図４（ｂ）のように、上面が吸着テーブル４１上面と同じ高さとなるように下降させる（あるいは吸着テーブル４１を上昇させる）。この状態から、吸着テーブル４１は基板ＰＢを吸着するとともに、基板ガイド４３１が下降して、基板レール４３０とともに基板ＰＢの側辺を挟み込み、基板ＰＢを吸着テーブル４１上に固定する。このように、基板レール４３０と基板ガイド４３１により、基板ＰＢの側辺を固定した状態で、吸着テーブル４１が吸着動作することで、基板ＰＢに若干の反り等の変形があったとしても、確実に全面吸着される。 When the substrate PB is placed at a predetermined position on the suction table 41, the magazine rack side holding unit 96 releases the holding and moves away from the suction table 41 as shown in FIG. Thereafter, the substrate rail 430 constituting the substrate clamp 43 is lowered so that the upper surface is the same height as the upper surface of the suction table 41 (or the suction table 41 is raised) as shown in FIG. From this state, the suction table 41 sucks the substrate PB, and the substrate guide 431 descends, sandwiches the side of the substrate PB together with the substrate rail 430, and fixes the substrate PB on the suction table 41. In this way, even if the substrate PB is slightly deformed or warped by the suction operation of the suction table 41 while the side of the substrate PB is fixed by the substrate rail 430 and the substrate guide 431, it is ensured. The whole surface is adsorbed.
　この後、基板ステージ４を構成するＸＹ駆動機構４２により、吸着テーブル４１とともに基板ＰＢを移動させながら、チップ部品供給機構６により供給されたチップ部品Ｃを自走ヘッド５が基板ＰＢ上に順次実装し、図１０（ｇ）のように実装済基板ＭＢが得られる。 Thereafter, the self-running head 5 sequentially mounts the chip components C supplied by the chip component supply mechanism 6 on the substrate PB while moving the substrate PB together with the suction table 41 by the XY drive mechanism 42 constituting the substrate stage 4. Then, the mounted board MB is obtained as shown in FIG.
　この後、実装済基板ＭＢを吸着テーブル４１上から搬送して、基板マガジンラックＭ１に収容する工程になる。 Thereafter, the mounted substrate MB is transported from the suction table 41 and stored in the substrate magazine rack M1.
　まず、基板ＰＢへのチップ部品Ｃの実装が完了し、実装済基板ＭＢが得られたら、吸着ステージ４１による吸着を解除し、基板レール４３０を上昇（あるいは吸着テーブル４１を下降）させるとともに、基板ガイド４３１を基板レール４３０に対して上昇させ、図４（ｃ）のように実装済基板ＭＢが基板レール４３０上をスライドできる状態とする。この状態において、基板レール４３０の上面は搬送レール９０の上面と等しくする。 First, when the mounting of the chip component C on the substrate PB is completed and the mounted substrate MB is obtained, the suction by the suction stage 41 is released, the substrate rail 430 is raised (or the suction table 41 is lowered), and the substrate The guide 431 is raised with respect to the board rail 430 so that the mounted board MB can slide on the board rail 430 as shown in FIG. In this state, the upper surface of the substrate rail 430 is made equal to the upper surface of the transport rail 90.
　この状態から、図１０（ｈ）のように、マガジンラック側保持部９６が実装済基板ＭＢの基板マガジンラック側の縁を保持し、図１１（ｉ）のようにマガジンラック側に引く。 From this state, the magazine rack side holding portion 96 holds the edge of the mounted substrate MB on the substrate magazine rack side as shown in FIG. 10 (h), and pulls it toward the magazine rack side as shown in FIG. 11 (i).
　ところで、マガジンラック側保持部９６は、実装済基板ＭＢを基板マガジンラックＭ１の基板取り出し面の内側まで移動させることは出来ない。そこで、図１１（ｊ）のように、ステージ側保持部９１が実装済基板ＭＢのステージ側の縁を保持し、マガジンラック側保持部９６は保持を解除して待機位置に戻る。 By the way, the magazine rack side holding unit 96 cannot move the mounted substrate MB to the inside of the substrate take-out surface of the substrate magazine rack M1. Therefore, as shown in FIG. 11 (j), the stage side holding portion 91 holds the edge of the mounted substrate MB on the stage side, and the magazine rack side holding portion 96 releases the holding and returns to the standby position.
　その後、ステージ側保持部９１が実装済基板ＭＢを保持した状態で、マガジンラック側に押していき（図１１（ｋ））、実装済基板ＭＢを、基板マガジンラックＭ１の収容位置まで搬送する（図１１（ｌ））。 Thereafter, the stage-side holding unit 91 holds the mounted substrate MB and pushes it toward the magazine rack (FIG. 11 (k)), and transports the mounted substrate MB to the accommodation position of the substrate magazine rack M1 (FIG. 11). 11 (l)).
　その後は、図３（ｃ）に示したように基板マガジンラックＭ１から新たな基板ＰＢを取り出し、実装済基板ＭＢとして収容する動作を繰り返し、基板マガジンラックＭ１内の基板ＰＢ全てを実装済基板ＭＢとする。 Thereafter, as shown in FIG. 3C, the operation of taking out a new substrate PB from the substrate magazine rack M1 and storing it as a mounted substrate MB is repeated, and all the substrates PB in the substrate magazine rack M1 are mounted. And
　以上のように、本発明の基板搬送機構９は、基板ＰＢ（および実装済基板ＭＢ）をレール上で直線的に移動する機構であり、基板ＰＢ（実装済基板ＭＢ）の縁の限られた範囲を保持しただけでも確実に搬送することが可能である。このため、基板ＰＢの外周付近までチップ部品が実装されていたとしても基板搬送を確実に実施することが出来る。 As described above, the board transport mechanism 9 of the present invention is a mechanism that linearly moves the board PB (and the mounted board MB) on the rail, and has a limited edge of the board PB (mounted board MB). Even if the range is maintained, it can be reliably conveyed. For this reason, even if the chip component is mounted up to the vicinity of the outer periphery of the substrate PB, the substrate can be reliably conveyed.
　ところで、図１２において、ステージ側保持部９１のみで基板ＰＢ（または実装済基板ＭＢ）を搬送する装置構成では、装置スペース的に不利である旨を既に記したが、図１３に示すようにステージ側保持部９１を設置したＺアーム９２にマガジンラック側保持部９６も設置する構成とすることは可能である。その構成を本実施形態の変形例として、図１３に示す。図１３（ａ）～図１３（ｄ）は、図９（ａ）～図９（ｄ）に示した状態を、変形例で実施した状態を示したものであり、同様に、図１０（ｅ）から図１１（ｌ）までの動作も変形例で実施可能である。 Incidentally, in FIG. 12, it has already been described that the apparatus configuration in which the substrate PB (or the mounted substrate MB) is transported only by the stage-side holding unit 91 is disadvantageous in terms of apparatus space. However, as shown in FIG. It is possible to adopt a configuration in which the magazine rack side holding portion 96 is also installed on the Z arm 92 on which the side holding portion 91 is installed. The configuration is shown in FIG. 13 as a modification of the present embodiment. FIGS. 13 (a) to 13 (d) show a state in which the states shown in FIGS. 9 (a) to 9 (d) are implemented in a modified example. Similarly, FIGS. ) To FIG. 11 (l) can also be implemented in a modified example.
　以上の実施形態において、基板マガジンラックＭ１に収容された基板ＰＢを実装済基板ＭＢとして元の基板マガジンラックＭ１に戻しているが、実装済基板ＭＢを基板マガジンラックＭ１とは別のマガジンラックに収容することが望ましいケースもある。 In the above embodiment, the substrate PB accommodated in the substrate magazine rack M1 is returned to the original substrate magazine rack M1 as the mounted substrate MB, but the mounted substrate MB is placed in a magazine rack different from the substrate magazine rack M1. In some cases it is desirable to accommodate.
　例えば、一般的な基板マガジンラックは樹脂製であることが多いが、実装済基板ＭＢの後工程において熱処理等を行なう場合では、基板マガジンラックごとオーブンに入れることもある。このため、実装済基板ＭＢを収容する基板マガジンラックを金属製にするようなこともあり、基板マガジンラックＭ１とは別に実装済基板ＭＢを収容するための実装基板マガジンラックＭ２を別に設けることがある。 For example, a general substrate magazine rack is often made of resin, but when a heat treatment or the like is performed in a subsequent process of the mounted substrate MB, the substrate magazine rack may be put in an oven. For this reason, the substrate magazine rack that accommodates the mounted substrate MB may be made of metal, and a mounting substrate magazine rack M2 for accommodating the mounted substrate MB may be provided separately from the substrate magazine rack M1. is there.
　基板マガジンラックＭ１とは別に実装基板マガジンラックＭ２を設ける場合、図１４のように、基板マガジンラックＭ１、吸着テーブル４１、実装基板マガジンラックＭ２を直線状に配置する構成がある。しかし、図１４の構成では、基板マガジンラックＭ１から吸着テーブル４１までと、吸着テーブル４１から実装基板マガジンラックＭ２までの、２つの基板搬送機構が別に必要となり、その分のスペースも必要となる。 When the mounting substrate magazine rack M2 is provided separately from the substrate magazine rack M1, there is a configuration in which the substrate magazine rack M1, the suction table 41, and the mounting substrate magazine rack M2 are arranged linearly as shown in FIG. However, in the configuration of FIG. 14, two substrate transport mechanisms are required separately from the substrate magazine rack M1 to the suction table 41 and from the suction table 41 to the mounting substrate magazine rack M2, and a corresponding space is also required.
　そこで、以下に、基板マガジンラックＭ１とは別の実装基板マガジンラックＭ２が必要な場合にも対応した、本発明の第二実施形態について説明する。 Therefore, a second embodiment of the present invention that corresponds to the case where a mounting substrate magazine rack M2 different from the substrate magazine rack M1 is required will be described below.
　図１５は本発明の第二実施形態に係る実装装置１０１の該略図である。図１５において、図１の実装装置１と共通の記号については同一の機能を有するものであるが、実装装置１０１には実装基板マガジンラックＭ２とマガジンラック移動機構１０が付加されている。 FIG. 15 is a schematic view of the mounting apparatus 101 according to the second embodiment of the present invention. 15, symbols common to those of the mounting apparatus 1 of FIG. 1 have the same functions, but a mounting board magazine rack M2 and a magazine rack moving mechanism 10 are added to the mounting apparatus 101.
　実装装置１０１は、基板マガジンラックＭ１から基板ＰＢを取り出し、基板ＰＢに半導体チップ等のチップ部品Ｃを実装し、基板ＰＢの所定箇所にチップ部品Ｃを実装した実装済基板ＭＢを実装基板マガジンラックＭ２に収容するものである。実装基板マガジンラックＭ２も、基板マガジンラックＭ１と同じく４側面の中の１面は、実装済基板ＭＢの収容を行なう開口を有している（以下、実装済基板ＭＢの収容を行なう開口を有する面を実装基板収容面と記す）。 The mounting apparatus 101 takes out the substrate PB from the substrate magazine rack M1, mounts the chip component C such as a semiconductor chip on the substrate PB, and mounts the mounted substrate MB on which the chip component C is mounted at a predetermined position of the substrate PB. It is housed in M2. Similarly to the substrate magazine rack M1, the mounting substrate magazine rack M2 has an opening for accommodating the mounted substrate MB (hereinafter referred to as an opening for accommodating the mounted substrate MB). The surface is referred to as the mounting board receiving surface).
　図１５の実装装置１０１において、基板マガジンラックＭ１の基板取り出し面と、実装基板マガジンラックＭ２の実装基板収容面とは、同一面上で同一方向を向いて並ぶように配置されている。また、マガジンラック移動機構１０は、実装ステージ４から基板搬送機構９に連なる直線上に、基板マガジンラックＭ１の基板取り出し面か、実装基板マガジンラックＭ２の実装基板収容面の何れかが配置されるよう、基板マガジンラックＭ１と実装基板マガジンラックＭ２を並べた方向に、基板マガジンラックＭ１および実装基板マガジンラックＭ２を移動させるものである。 In the mounting apparatus 101 of FIG. 15, the substrate take-out surface of the substrate magazine rack M1 and the mounting substrate accommodation surface of the mounting substrate magazine rack M2 are arranged so as to be aligned in the same direction on the same surface. Further, in the magazine rack moving mechanism 10, either the substrate take-out surface of the substrate magazine rack M1 or the mounting substrate receiving surface of the mounting substrate magazine rack M2 is arranged on a straight line that continues from the mounting stage 4 to the substrate transport mechanism 9. As described above, the substrate magazine rack M1 and the mounting substrate magazine rack M2 are moved in the direction in which the substrate magazine rack M1 and the mounting substrate magazine rack M2 are arranged.
　図１６（ａ）～図１６（ｄ）、図１７（ｅ）および図１７（ｆ）は実装装置１０１による基板ＰＢの搬送および実装基板ＭＢの搬送動作を説明する上面図である。図１６（ａ）と図１６（ｂ）は基板マガジンＭ１から基板ＰＢを引出す状態を示したものであり、基板搬送機構９の動作としては図９（ａ）と図９（ｂ）に示した実装装置１と同じである。この段階で、マガジンラック移動機構１０は、実装ステージ４から基板搬送機構９に連なる直線上に基板マガジンラックＭ１を配置している。 16 (a) to 16 (d), 17 (e), and 17 (f) are top views for explaining the substrate PB transport operation and the mounting substrate MB transport operation by the mounting apparatus 101. FIG. FIGS. 16A and 16B show the state in which the substrate PB is pulled out from the substrate magazine M1, and the operation of the substrate transport mechanism 9 is shown in FIGS. 9A and 9B. The same as the mounting apparatus 1. At this stage, the magazine rack moving mechanism 10 arranges the substrate magazine rack M1 on a straight line extending from the mounting stage 4 to the substrate transport mechanism 9.
　この後、実装装置１０１の基板搬送機構９も、実装装置１と同様に図９（ｃ）から図１０（ｆ）に示したように、基板ＰＢを吸着テーブル４１上に配置し、半導体チップＣを実装した実装済基板ＭＢを吸着テーブル４１から搬出するよう動作する。その際、マガジンラック移動機構１０は、実装済基板マガジンラックＭ２を実装ステージ４から基板搬送機構９に連なる直線上に配置するように動作する。すなわち、基板ＰＢのマガジンラック側が基板マガジンラックＭ１から出てから、実装済基板ＭＢのマガジンラック側が搬送レール９０上に存在している間に、マガジンラック移動機構１０は、実装済基板マガジンラックＭ２を実装ステージ４から基板搬送機構９に連なる直線上に配置する。このようにすることにより、図１６（ｃ）、（ｄ）に示すように、基板搬送機構９は実装基板マガジンラックＭ２の収容位置に実装済基板ＭＢを搬送することになる。なお、実装基板マガジンラックＭ２の収容位置への実装済基板ＭＢの収容が完了したならば、再び、実装ステージ４から基板搬送機構９に連なる直線上に基板マガジンラックＭ１を配置し（図１７（ｅ））、基板マガジンラックＭ１から基板ＰＢを引出す状態（図１６（ａ）と同じ）になる。以上の動作を、基板マガジンラックＭ１内の基板ＰＢがなくなるか、実装基板マガジンラックＭ２内が実装済基板ＭＢで満たされるまで続けることになる。 Thereafter, the substrate transport mechanism 9 of the mounting apparatus 101 also arranges the substrate PB on the suction table 41 as shown in FIGS. 9C to 10F in the same manner as the mounting apparatus 1, and the semiconductor chip C Is mounted so that the mounted substrate MB mounted on the suction table 41 is carried out. At that time, the magazine rack moving mechanism 10 operates so as to arrange the mounted substrate magazine rack M2 on a straight line continuous from the mounting stage 4 to the substrate transport mechanism 9. That is, after the magazine rack side of the substrate PB comes out of the substrate magazine rack M1, the magazine rack moving mechanism 10 moves the mounted substrate magazine rack M2 while the magazine rack side of the mounted substrate MB exists on the transport rail 90. Are arranged on a straight line extending from the mounting stage 4 to the substrate transport mechanism 9. By doing so, as shown in FIGS. 16C and 16D, the substrate transport mechanism 9 transports the mounted substrate MB to the accommodation position of the mounting substrate magazine rack M2. When the mounting of the mounted substrate MB in the mounting position of the mounting substrate magazine rack M2 is completed, the substrate magazine rack M1 is again arranged on a straight line extending from the mounting stage 4 to the substrate transport mechanism 9 (FIG. 17 ( e)), the substrate PB is pulled out from the substrate magazine rack M1 (same as in FIG. 16A). The above operation is continued until there is no substrate PB in the substrate magazine rack M1 or until the mounted substrate magazine rack M2 is filled with the mounted substrates MB.
　以上のように、第二実施形態は、基板マガジンラックＭ１とは別の実装基板マガジンラックＭ２が必要な場合においても、基板マガジンラックＭ１から吸着テーブル４１までの搬送と、吸着テーブル４１から実装基板マガジンラックＭ２までの搬送を１つの搬送機構で兼用するためスペース効率的に優れている。 As described above, in the second embodiment, even when the mounting substrate magazine rack M2 different from the substrate magazine rack M1 is required, the transport from the substrate magazine rack M1 to the suction table 41, and the suction table 41 to the mounting substrate are performed. Since the transport to the magazine rack M2 is shared by one transport mechanism, the space efficiency is excellent.
　特に、実装基板ＰＢが長方形の場合、基板の長手方向を基板搬送方向（図１５におけるＹ方向）とすれば、マガジンラック移動機構１０による基板マガジンラックＭ１および実装基板マガジンラックＭ２の移動方向は、基板の短手方向であるため、移動距離が短くスペース的にも装置負荷的にも優れている。 In particular, when the mounting substrate PB is rectangular, if the longitudinal direction of the substrate is the substrate transport direction (Y direction in FIG. 15), the movement direction of the substrate magazine rack M1 and the mounting substrate magazine rack M2 by the magazine rack moving mechanism 10 is Due to the short direction of the substrate, the movement distance is short and the space and the apparatus load are excellent.
　ところで、本発明は、図２０に示したような実装装置３０１に比べて、ローダ２１１もアンローダも不要であり、基板搬送に必要なスペースも僅かである。このため、複数の実装部を有する実装装置において、図１８に示す実装装置１０１や、図１９に示す実装装置２０２のような構成としても本発明は有効である。すなわち、図１９の実装装置２０２においても、実装部毎にマガジンラック移動機構（１０Ａ、同１０Ｂ）を必要とするものの、基板ＰＢ（および実装済基板ＭＢ）の搬送距離が短いため、図２１に示した実装装置３０２に比べて、装置のコンパクト化が図れる。 By the way, the present invention requires neither the loader 211 nor the unloader and the space required for substrate transport is smaller than that of the mounting apparatus 301 as shown in FIG. Therefore, the present invention is effective even in a mounting apparatus having a plurality of mounting portions, such as a mounting apparatus 101 shown in FIG. 18 or a mounting apparatus 202 shown in FIG. That is, the mounting apparatus 202 of FIG. 19 also requires a magazine rack moving mechanism (10A, 10B) for each mounting unit, but the transport distance of the substrate PB (and the mounted substrate MB) is short, so FIG. Compared to the mounting apparatus 302 shown, the apparatus can be made more compact.
　また、図２１のような実装装置３０２の場合、実装部３Ａで得た実装済基板ＭＢと、実装部３Ｂで得た実装済基板ＭＢが同じ実装基板マガジンラックＭ２に収容されているため、実装部３Ａと実装部３Ｂの機差の影響を後工程で考慮する必要が生じることがある。具体的には、実装基板マガジンラックＭ２に収容された実装済基板ＭＢが何れの実装部で実装されたものかを追跡しながら、必要に応じて後工程で、実装部毎に条件変更する場合がある。これに対して、図１８に示す実装装置１０１および図１９に示す実装装置２０２では、実装基板マガジンラックＭ２（図１８の実装装置２０１では基板マガジンラックＭ１）に収容されている実装済基板ＭＢの全てが何れかの実装部（実装部３Ａまたは実装部３Ｂ）に限定されるので、実装済基板ＭＢ単位で後工程の条件変更をするようなことが不要となる。　
　なお、ここまでの説明で、チップ部品Ｃは半導体チップであって、基板ＰＢは四角形状の例について説明してきたが、これに限定されるものではない。例えば、基板ＰＢがウェハ基板のような円形のものであってもよく、素材も樹脂、セラミックス、シリコン等の半導体の素材およびこれらの複合材から選んでよい。また、チップ部品Ｃも、半導体チップに限定されるものではなく、抵抗やキャパシタンスのような受動素子のチップであってもよい。 In the case of the mounting apparatus 302 as shown in FIG. 21, the mounted substrate MB obtained by the mounting unit 3A and the mounted substrate MB obtained by the mounting unit 3B are accommodated in the same mounting substrate magazine rack M2. It may be necessary to consider the influence of machine differences between the part 3A and the mounting part 3B in a subsequent process. Specifically, when changing the conditions for each mounting unit in a subsequent process as necessary while tracking in which mounting unit the mounted substrate MB accommodated in the mounting substrate magazine rack M2 is mounted There is. On the other hand, in the mounting apparatus 101 shown in FIG. 18 and the mounting apparatus 202 shown in FIG. 19, the mounted boards MB accommodated in the mounting board magazine rack M2 (the board magazine rack M1 in the mounting apparatus 201 in FIG. 18). Since all are limited to any one of the mounting parts (the mounting part 3A or the mounting part 3B), it is not necessary to change the conditions of the post-process for each mounted board MB.
In the above description, the chip component C is a semiconductor chip and the substrate PB has a quadrangular shape. However, the present invention is not limited to this. For example, the substrate PB may be circular like a wafer substrate, and the material may be selected from semiconductor materials such as resin, ceramics, and silicon, and composite materials thereof. The chip component C is not limited to a semiconductor chip, and may be a chip of a passive element such as a resistor or a capacitance.
　　　１　　　実装装置
　　　２　　　架台
　　　３　　　実装部
　　　４　　　基板ステージ
　　　５　　　実装ヘッド
　　　６　　　チップ部品供給機構
　　　７　　　チップ部品ピックアップ手段
　　　８　　　チップ部品搬送手段
　　　９　　　基板搬送機構
　　１０　　　マガジンラック移動機構
　　４１　　　吸着テーブル
　　４２　　　ＸＹ駆動機構
　　４３　　　基板クランプ
　１０１　　　実装装置
　２０１　　　実装装置
　２０２　　　実装装置
　４３０　　　基板レール
　４３１　　　基板ガイド　　
　　９０　　　搬送レール
　　９１　　　ステージ側保持部
　　９２　　　Ｚアーム
　　９３　　　Ｘアーム
　　９４　　　スライドレール
　　９６　　　マガジンラック側保持部
　　９７　　　Ｚアーム
　　９８　　　Ｘアーム
　　９９　　　スライドレール
　　　Ｃ　　　チップ部品　
　　　Ｍ１　　基板マガジンラック
　　　Ｍ２　　実装基板マガジンラック
　　　ＭＢ　　実装済基板
　　　ＰＢ　　基板 DESCRIPTION OF SYMBOLS 1 Mounting apparatus 2 Mounting frame 3 Mounting part 4 Substrate stage 5 Mounting head 6 Chip component supply mechanism 7 Chip component pick-up means 8 Chip component transport means 9 Substrate transport mechanism 10 Magazine rack moving mechanism 41 Suction table 42 XY drive mechanism 43 Substrate clamp 101 Mounting Device 201 Mounting device 202 Mounting device 430 Board rail 431 Board guide
90 Transport rail 91 Stage side holding part 92 Z arm 93 X arm 94 Slide rail 96 Magazine rack side holding part 97 Z arm 98 X arm 99 Slide rail C Chip part
M1 board magazine rack M2 mounted board magazine rack MB mounted board PB board

Claims (5)

  1. 基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を前記基板マガジンラックに収容する実装装置であって、
    基板ステージと実装ヘッドとを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、
    前記基板マガジンラック内の収容位置にある前記基板を、前記基板の外縁部を保持して前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から外縁部を保持して前記基板マガジンラックの収容位置まで搬送する機能と、を有する基板搬送機構とを備えた実装装置。     A mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in the substrate magazine rack,
    A mounting part for mounting the chip component by the mounting head on the substrate disposed on the substrate stage, the substrate stage and a mounting head;
    A function of transporting the substrate at the accommodation position in the substrate magazine rack onto the substrate stage while holding the outer edge portion of the substrate, and holding the outer edge portion of the mounted substrate from the substrate stage. A mounting apparatus comprising a substrate transport mechanism having a function of transporting to a housing position of a substrate magazine rack.
  2. 基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を実装基板マガジンラックに収容する実装装置であって、
    前記基板マガジンラックの基板取り出し面と、前記実装基板マガジンラックの実装済基板収容面とを同一面上の同一方向にして並べた状態に配置して、前記基板マガジンラックと前記実装基板マガジンラックを並べた方向に移動させるマガジンラック移動機構と、
    基板ステージと実装ヘッドとを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、
    前記基板マガジンラック内の収容位置にある前記基板を、前記基板の外縁部を保持して前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から外縁部を保持して前記基板マガジンラックの収容位置まで搬送する機能と、を有する基板搬送機構とを備えた実装装置。     A mounting apparatus for taking out a substrate housed in a substrate magazine rack, mounting a chip component on the substrate, and then housing a mounted substrate on which the chip component is mounted in a mounting substrate magazine rack,
    The substrate magazine rack and the mounting substrate magazine rack are arranged in a state in which the substrate take-out surface of the substrate magazine rack and the mounted substrate receiving surface of the mounting substrate magazine rack are arranged in the same direction on the same surface. Magazine rack moving mechanism to move in the aligned direction;
    A mounting part for mounting the chip component by the mounting head on the substrate disposed on the substrate stage, the substrate stage and a mounting head;
    A function of transporting the substrate at the accommodation position in the substrate magazine rack onto the substrate stage while holding the outer edge portion of the substrate, and holding the outer edge portion of the mounted substrate from the substrate stage. A mounting apparatus comprising a substrate transport mechanism having a function of transporting to a housing position of a substrate magazine rack.
  3. 請求項１または請求項２に記載の実装装置であって、
    前記基板搬送機構は、
    前記基板を、前記基板マガジンラックから前記基板ステージ上まで、前記基板マガジンラックの基板取り出し面に対して直角方向に直線搬送する機能を有する実装装置。     The mounting apparatus according to claim 1 or 2,
    The substrate transport mechanism is
    A mounting apparatus having a function of linearly transporting the substrate from the substrate magazine rack to the substrate stage in a direction perpendicular to the substrate take-out surface of the substrate magazine rack.
  4. 請求項１から請求項３のいずれかの請求項に記載の実装装置であって、
    前記実装ヘッドに前記チップ部品を供給するチップ部品供給機構を更に備えた実装装置。     The mounting apparatus according to any one of claims 1 to 3, comprising:
    A mounting apparatus further comprising a chip component supply mechanism for supplying the chip component to the mounting head.
  5. 請求項４記載の実装装置であって、
    前記実装部を２つ備え、
    前記実装部夫々と１対１で対応する前記基板搬送手段を備え、
    前記チップ部品供給機構は、前記２つの実装部の間に配置され、２つの前記実装部夫々にチップ部品を供給する機能を有する実装装置。     The mounting apparatus according to claim 4,
    Two mounting parts are provided,
    Including the board transfer means corresponding to each of the mounting parts on a one-to-one basis;
    The chip component supply mechanism is disposed between the two mounting units, and has a function of supplying a chip component to each of the two mounting units.
PCT/JP2019/004924 2018-02-22 2019-02-13 Mounting device WO2019163586A1 (en)

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