WO2019145154A1 - A method and a jig for manufacturing a pin-fin type power module - Google Patents

A method and a jig for manufacturing a pin-fin type power module Download PDF

Info

Publication number
WO2019145154A1
WO2019145154A1 PCT/EP2019/050488 EP2019050488W WO2019145154A1 WO 2019145154 A1 WO2019145154 A1 WO 2019145154A1 EP 2019050488 W EP2019050488 W EP 2019050488W WO 2019145154 A1 WO2019145154 A1 WO 2019145154A1
Authority
WO
WIPO (PCT)
Prior art keywords
jig
holes
pin
fins
fin
Prior art date
Application number
PCT/EP2019/050488
Other languages
French (fr)
Inventor
Xiaoguang Liang
Original Assignee
Zf Friedrichshafen Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zf Friedrichshafen Ag filed Critical Zf Friedrichshafen Ag
Priority to JP2020541446A priority Critical patent/JP7290650B2/en
Priority to EP19700871.7A priority patent/EP3747046A1/en
Priority to CN201980006546.9A priority patent/CN111527598A/en
Publication of WO2019145154A1 publication Critical patent/WO2019145154A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14131—Positioning or centering articles in the mould using positioning or centering means forming part of the insert

Definitions

  • the invention relates to a method and a jig for manufacturing a Pin-Fin type power module.
  • a Pin-Fin baseplate 10 includes a metal plate 11 having several Fins 12 on one side (the Pin-Fin side), and the other side (the flat side) of the Pin-Fin baseplate 10 is connected to a power module.
  • the Fins contact a liquid cooling system directly, so the power module will not be overheated.
  • the thermal cycling capability of the power module is significantly improved and the lifetime of the power module is extended.
  • a traditional Pin-Fin type power module uses silicone gel as sealant.
  • the power module further comprises an insulation material 20 (such as DBC (Direct Bonded Copper), polymer film) and power chips 30 (IGBT, MOSFET, Diode, etc.) provided on the insulation material 20.
  • the insulation material 20 is connected to the flat side of the Pin-Fin baseplate 10.
  • the insulation material 20 and power chips 30 are encapsulated in a housing 50 and the space inside the housing is filled with silicone gel 40.
  • the traditional Pin-Fin type power module has a complicated structure and needs more steps in the manufacturing process, which leads to low manufacturing efficiency and higher cost.
  • a transfer molded power module is presented. As shown in FIG.2-FIG.3, in this power module, epoxy resin 60 is used as sealant and no housing is needed. A bottom mold 702 and a top mold 701 are used to manufacture the power module. The power module is placed in the cavity 700 between the top mold 701 and the bottom mold 702, and the Pin-Fin side is placed on the upper surface 7021 of the bottom mold 702. The epoxy resin is injected into the cavity 700 by pressure through an opening 7011 on the top mold 701.
  • the current manufacturing process has the following drawbacks:
  • One aspect of the present invention is to provide a method for
  • a Pin-Fin type power module including: (1) providing a Pin-Fin type power module and a jig, the power module comprises a Pin-Fin baseplate, insulation material connecting the base plate and power chips provided on the insulation material.
  • the baseplate has a first surface and a second surface opposite the first surface. The first surface is connected to the insulation material and the second surface has several Fins on it.
  • the jig includes a main body having a flat upper surface and a flat lower surface, and holes provided on the upper surface of the main body, wherein the distribution of the holes is the same as the arrangement of the Fins, the aperture of the holes is larger than the dimension of the Fins, and the length of the holes is not shorter than that of the Fins.
  • the aperture of the holes depends on the thermal expansion of the Fins' material and/or the jig's material.
  • the jig is made of carbon, copper or steel.
  • the insulation material is DBC or polymer film.
  • Another aspect of the present invention is to provide a jig for
  • the module includes a surface with several protrusive Fins on it, the jig comprises: a main body having a flat upper surface and a flat lower surface, holes provided on the upper surface of the main body, wherein the distribution of the holes is the same as the arrangement of the Fins, the aperture of the holes is larger than the dimension of the Fins, and the length of the holes is not shorter than that of the Fins.
  • the holes are through holes.
  • the holes are blind holes.
  • the cross section of the holes is round, oval or diamond shape.
  • FIG.l is a cross section of a traditional gel-sealed Pin-Fin type power module.
  • FIG.2 is a cross section of a transfer molded Pin-Fin type power module.
  • FIG.3 illustrates molding the Pin-Fin type power module with epoxy resin in the top mold and the bottom mold by traditional way.
  • FIG.4 illustrates the unsealed Pin-Fin type power module before molding process.
  • FIG.5 illustrates a jig protecting the Pin-Fin during molding process.
  • FIG.6 illustrates inserting the Pin-Fin into a jig having through holes.
  • FIG.7 illustrates molding the Pin-Fin type power module with epoxy resin under the protection of the jig.
  • FIG.8 illustrates the epoxy resin sealed Pin-Fin type power module after stripping the jig.
  • FIG.9 illustrates inserting the Pin-Fin into a jig having blind holes through arrow A.
  • FIG.10 illustrates the combination of the Pin-Fin and the jig after the Fins are completely inserted into the blind holes.
  • FIG.ll illustrates another alternative jig having blind holes.
  • Embodiment 1 referring to FIG.4-FIG.8, the Pin-Fin type power module is manufactured by the following steps:
  • the power module comprises a Pin-Fin baseplate 1, insulation material (a DBC) 2 connecting the base plate 1 and power chips 3 provided on the DBC 2.
  • the baseplate 1 has a first surface 11 and a second surface 12 opposite the first surface 11.
  • the first surface 11 is connected to the DBC 2 and the second surface 12 has several Fins 121 on it.
  • the jig 9 includes a carbon main body having a flat upper surface and a flat lower surface, and several through holes 91 provided on the upper surface of the main body, wherein the distribution of the through holes is the same as the arrangement of the Fins, the aperture of the holes is larger than the dimension of the Fins, and the length of through holes is the same as that of the Fins.
  • Embodiment 2 referring now to FIG.9-FIG.10, in an alternative solution, a steel jig 9 with blind holes 91 is used.
  • the length of blind holes is the same as that of the Fins.
  • the Pin-Fin is supported steadily by the jig.
  • the jig with blind holes is stable enough so the pressure on the power module is distributed uniformly during the molding process.
  • Embodiment 3 referring now to FIG.ll, in another alternative jig, blind holes 91 are provided, but the length of blind holes 91 is longer than that of the Fins 121, so there is a vertical gap 800 between each Fin and the corresponding blind hole. The vertical direction is parallel to the length direction of the Fins.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A method and a jig for manufacturing a Pin-Fin type power module are disclosed. The method including: providing a Pin-Fin type power module and a jig, the power module comprises a Pin-Fin baseplate, insulation material connecting the base plate and power chips provided on the insulation material, the jig includes a main body having a flat upper surface and a flat lower surface, and holes provided on the upper surface of the main body, wherein the distribution of the holes is the same as the arrangement of the Fins, the aperture of the holes is larger than the dimension of the Fins, and the length of the holes is not shorter than that of the Fins, inserting the Pin-Fin into the jig so each Fin is inside the corresponding hole, placing the power module combined with the jig in a cavity between a top mold and a bottom mold while the lower surface of the jig is placed on the upper surface of the bottom mold, performing the molding process by injecting epoxy resin, removing the jig from the Pin-Fin. The pressure is distributed uniformly during the epoxy resin molding since the flat surface is contacting the bottom mold, thus the insulation material and Pin-Fin cracking or bending can be avoided.

Description

A METHOD AND A JIG FOR MANUFACTURING A PIN-FIN TYPE POWER
MODULE
FIELD OF THE INVENTION
[001] The invention relates to a method and a jig for manufacturing a Pin-Fin type power module.
BACKGROUND OF THE INVENTION
[002] Referring to FIG.l, a Pin-Fin baseplate 10 includes a metal plate 11 having several Fins 12 on one side (the Pin-Fin side), and the other side (the flat side) of the Pin-Fin baseplate 10 is connected to a power module. The Fins contact a liquid cooling system directly, so the power module will not be overheated.
Thus, the thermal cycling capability of the power module is significantly improved and the lifetime of the power module is extended.
[003] A traditional Pin-Fin type power module uses silicone gel as sealant. As shown in FIG.l, except the Pin-Fin baseplate 10, the power module further comprises an insulation material 20 (such as DBC (Direct Bonded Copper), polymer film) and power chips 30 (IGBT, MOSFET, Diode, etc.) provided on the insulation material 20. The insulation material 20 is connected to the flat side of the Pin-Fin baseplate 10. The insulation material 20 and power chips 30 are encapsulated in a housing 50 and the space inside the housing is filled with silicone gel 40. The traditional Pin-Fin type power module has a complicated structure and needs more steps in the manufacturing process, which leads to low manufacturing efficiency and higher cost.
[004] In order to simplify the structure of the Pin-Fin type power module and the manufacturing process, a transfer molded power module is presented. As shown in FIG.2-FIG.3, in this power module, epoxy resin 60 is used as sealant and no housing is needed. A bottom mold 702 and a top mold 701 are used to manufacture the power module. The power module is placed in the cavity 700 between the top mold 701 and the bottom mold 702, and the Pin-Fin side is placed on the upper surface 7021 of the bottom mold 702. The epoxy resin is injected into the cavity 700 by pressure through an opening 7011 on the top mold 701. However, the current manufacturing process has the following drawbacks:
1) current transfer molding process needs a flat bottom to prevent epoxy resin to penetrate between the bottom mold and the bottom surface of power module. In current process, epoxy resin will penetrate between the bottom mold and the bottom surface of power module since there are gaps 800 between Fins 12. 2) When epoxy resin is being injected, the pressure on the insulation material is not uniform and forces acting on each Fin are also non-uniform, which may cause insulation material & Pin-Fin baseplate cracking and/ or bending.
BRIEF SUMMARY
[005] One aspect of the present invention is to provide a method for
manufacturing a Pin-Fin type power module, including: (1) providing a Pin-Fin type power module and a jig, the power module comprises a Pin-Fin baseplate, insulation material connecting the base plate and power chips provided on the insulation material. The baseplate has a first surface and a second surface opposite the first surface. The first surface is connected to the insulation material and the second surface has several Fins on it. The jig includes a main body having a flat upper surface and a flat lower surface, and holes provided on the upper surface of the main body, wherein the distribution of the holes is the same as the arrangement of the Fins, the aperture of the holes is larger than the dimension of the Fins, and the length of the holes is not shorter than that of the Fins. (2) Inserting the Pin-Fin into the jig so each Fin is inside the corresponding hole. (3) Placing the power module combined with the jig in a cavity between a top mold and a bottom mold while the lower surface of the jig is placed on the upper surface of the bottom mold. (4) Performing the molding process by injecting epoxy resin, followed by (5) removing the jig from the Pin-Fin baseplate.
[006] Preferably, the aperture of the holes depends on the thermal expansion of the Fins' material and/or the jig's material. The jig is made of carbon, copper or steel.
[007] Preferably, the insulation material is DBC or polymer film.
[008] Another aspect of the present invention is to provide a jig for
manufacturing a Pin-Fin type power module, the module includes a surface with several protrusive Fins on it, the jig comprises: a main body having a flat upper surface and a flat lower surface, holes provided on the upper surface of the main body, wherein the distribution of the holes is the same as the arrangement of the Fins, the aperture of the holes is larger than the dimension of the Fins, and the length of the holes is not shorter than that of the Fins.
[009] Preferably, the holes are through holes.
[010] Preferably, the holes are blind holes.
[011] Preferably, the cross section of the holes is round, oval or diamond shape. BRIEF DESCRIPTION OF THE DRAWINGS
[012] FIG.l is a cross section of a traditional gel-sealed Pin-Fin type power module.
[013] FIG.2 is a cross section of a transfer molded Pin-Fin type power module.
[014] FIG.3 illustrates molding the Pin-Fin type power module with epoxy resin in the top mold and the bottom mold by traditional way.
[015] FIG.4 illustrates the unsealed Pin-Fin type power module before molding process.
[016] FIG.5 illustrates a jig protecting the Pin-Fin during molding process.
[017] FIG.6 illustrates inserting the Pin-Fin into a jig having through holes.
[018] FIG.7 illustrates molding the Pin-Fin type power module with epoxy resin under the protection of the jig.
[019] FIG.8 illustrates the epoxy resin sealed Pin-Fin type power module after stripping the jig.
[020] FIG.9 illustrates inserting the Pin-Fin into a jig having blind holes through arrow A.
[021] FIG.10 illustrates the combination of the Pin-Fin and the jig after the Fins are completely inserted into the blind holes.
[022] FIG.ll illustrates another alternative jig having blind holes. DETAILED DESCRIPTION OF THE EMBODIMENTS
[023] Embodiment 1 : referring to FIG.4-FIG.8, the Pin-Fin type power module is manufactured by the following steps:
[024] First, providing a Pin-Fin type power module and a jig 9. The power module comprises a Pin-Fin baseplate 1, insulation material (a DBC) 2 connecting the base plate 1 and power chips 3 provided on the DBC 2. The baseplate 1 has a first surface 11 and a second surface 12 opposite the first surface 11. The first surface 11 is connected to the DBC 2 and the second surface 12 has several Fins 121 on it. The jig 9 includes a carbon main body having a flat upper surface and a flat lower surface, and several through holes 91 provided on the upper surface of the main body, wherein the distribution of the through holes is the same as the arrangement of the Fins, the aperture of the holes is larger than the dimension of the Fins, and the length of through holes is the same as that of the Fins.
[025] Inserting the Pin-Fin into the jig, as shown in FIG.6, more specifically, inserting every Fin 121 into the corresponding through hole 91. Thus, the Fins are protected by the jig.
[026] Referring now to FIG.7, placing the power module combined with the jig in a cavity 400 between a top mold 41 and a bottom mold 42. The power module is stabilized since the lower surface of the jig is placed on the upper surface of the bottom mold and all the Fins are protected. Then performing the molding process by injecting epoxy resin 5. After that, removing the jig from the Pin-Fin, the Pin-Fin power module sealed by epoxy resin is formed, shown in FIG.8.
[027] With the help of the jig, the pressure is distributed uniformly during the epoxy resin molding since a flat surface is contacting the bottom mold, thus the DBC cracking or bending can be avoided. Meanwhile the Fins are unlikely to crack or bend under the protection of the jig during the molding process.
[028] Embodiment 2: referring now to FIG.9-FIG.10, in an alternative solution, a steel jig 9 with blind holes 91 is used. The length of blind holes is the same as that of the Fins. Before molding, inserting all the Fins 121 into the corresponding blind holes 91 through arrow A, then the Pin-Fin is supported steadily by the jig. The jig with blind holes is stable enough so the pressure on the power module is distributed uniformly during the molding process. [029] Embodiment 3: referring now to FIG.ll, in another alternative jig, blind holes 91 are provided, but the length of blind holes 91 is longer than that of the Fins 121, so there is a vertical gap 800 between each Fin and the corresponding blind hole. The vertical direction is parallel to the length direction of the Fins.
[030] A number of alternative structural elements and processing steps have been suggested for the preferred embodiment. Thus while the invention has been described with reference to specific embodiments, the description is illustrative of the invention and is not to be construed as limiting the invention. Various modifications and applications may occur to those skilled in the art without departing from the true spirit and scope of the invention as defined by the appended claims.

Claims

CLAIMS We claim:
1. A method for manufacturing a Pin-Fin type power module comprising: providing a Pin-Fin type power module and a jig, the power module comprises a Pin-Fin baseplate, insulation material connecting the base plate and power chips provided on the insulation material, the baseplate has a first surface and a second surface opposite the first surface, the first surface is connected to the insulation material and the second surface has several Fins on it, the jig includes a main body having a flat upper surface and a flat lower surface, and holes provided on the upper surface of the main body, wherein the distribution of the holes is the same as the arrangement of the Fins, the aperture of the holes is larger than the dimension of the Fins, and the length of the holes is not shorter than that of the Fins,
inserting the Pin-Fin into the jig so each Fin is inside the corresponding hole, placing the power module combined with the jig in a cavity between a top mold and a bottom mold while the lower surface of the jig is placed on the upper surface of the bottom mold,
performing the molding process by injecting epoxy resin,
removing the jig from the Pin-Fin.
2. The method as defined by claim 1, the holes are through holes.
3. The method as defined by claim 1, the holes are blind holes.
4. The method as defined by claim 3, there is a gap between each Fin and the corresponding blind hole.
5. The method as defined by claim 1, the jig is made of carbon or metal.
6. The method as defined by claim 1, the aperture of the holes depends on the thermal expansion of the Fins' material and/ or the jig's material.
7. The method as defined by claim 1, the cross section of the Fins is round, oval or diamond shape.
8. The method as defined by claim 1, the cross section of the holes is round, oval or diamond shape.
9. The method as defined by claim 1, the insulation material is DBC or polymer film.
10. A jig for manufacturing a Pin-Fin type power module, the module includes a surface with several protrusive Fins on it, the jig comprises:
a main body having a flat upper surface and a flat lower surface, holes provided on the upper surface of the main body,
wherein the distribution of the holes is the same as the arrangement of the Fins, the aperture of the holes is larger than the dimension of the Fins, and the length of the holes is not shorter than that of the Fins.
11. The jig as defined by claim 10, the holes are through holes.
12. The jig as defined by claim 10, the holes are blind holes.
13. The jig as defined by claim 1, the jig is made of carbon or metal.
14. The jig as defined by any of claim 10-claim 13, the aperture of the holes depends on the thermal expansion of the Fins' material and/ or the jig's material.
15. The jig as defined by any of claim 10-claim 13, the cross section of the holes is round, oval or diamond shape.
PCT/EP2019/050488 2018-01-29 2019-01-10 A method and a jig for manufacturing a pin-fin type power module WO2019145154A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020541446A JP7290650B2 (en) 2018-01-29 2019-01-10 METHOD AND JIG FOR MANUFACTURING PIN FIN TYPE POWER MODULE
EP19700871.7A EP3747046A1 (en) 2018-01-29 2019-01-10 A method and a jig for manufacturing a pin-fin type power module
CN201980006546.9A CN111527598A (en) 2018-01-29 2019-01-10 Method and jig for manufacturing pin-fin type power module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018201263.6A DE102018201263B3 (en) 2018-01-29 2018-01-29 A METHOD AND DEVICE FOR MANUFACTURING A PIN-FIN POWER MODULE
DE102018201263.6 2018-01-29

Publications (1)

Publication Number Publication Date
WO2019145154A1 true WO2019145154A1 (en) 2019-08-01

Family

ID=65036765

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/050488 WO2019145154A1 (en) 2018-01-29 2019-01-10 A method and a jig for manufacturing a pin-fin type power module

Country Status (5)

Country Link
EP (1) EP3747046A1 (en)
JP (1) JP7290650B2 (en)
CN (1) CN111527598A (en)
DE (1) DE102018201263B3 (en)
WO (1) WO2019145154A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220016814A1 (en) * 2020-07-15 2022-01-20 Zf Friedrichshafen Ag Mold for Encapsulating a Pin-Fin Type Power Module and Method for Manufacturing a Power Module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022056719A1 (en) * 2020-09-16 2022-03-24 华为技术有限公司 Injection mold and injection molding method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011238644A (en) * 2010-05-06 2011-11-24 Denso Corp Method of manufacturing power semiconductor module
JP2012164763A (en) * 2011-02-04 2012-08-30 Toyota Motor Corp Method for manufacturing semiconductor package with heat sink, and heat sink
JP2012243941A (en) * 2011-05-19 2012-12-10 Toyota Motor Corp Jig, manufacturing method of semiconductor module, and semiconductor module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2965699B1 (en) 2010-10-05 2013-03-29 Commissariat Energie Atomique DEVICE FOR THERMAL DISSIPATION FOR AT LEAST ONE ELECTRONIC COMPONENT AND CORRESPONDING METHOD
CN104145331B (en) 2012-01-31 2017-09-29 三菱电机株式会社 Semiconductor device and its manufacture method
JP5987190B2 (en) 2012-09-25 2016-09-07 三菱電機株式会社 Mold for sealing semiconductor device and semiconductor device
JP6021695B2 (en) 2013-03-06 2016-11-09 三菱電機株式会社 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
JP2015185835A (en) 2014-03-26 2015-10-22 株式会社デンソー Semiconductor device and manufacturing method of the same
JP6446280B2 (en) 2015-01-28 2018-12-26 日立オートモティブシステムズ株式会社 Electronic equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011238644A (en) * 2010-05-06 2011-11-24 Denso Corp Method of manufacturing power semiconductor module
JP2012164763A (en) * 2011-02-04 2012-08-30 Toyota Motor Corp Method for manufacturing semiconductor package with heat sink, and heat sink
JP2012243941A (en) * 2011-05-19 2012-12-10 Toyota Motor Corp Jig, manufacturing method of semiconductor module, and semiconductor module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220016814A1 (en) * 2020-07-15 2022-01-20 Zf Friedrichshafen Ag Mold for Encapsulating a Pin-Fin Type Power Module and Method for Manufacturing a Power Module
US11673302B2 (en) * 2020-07-15 2023-06-13 Zf Friedrichshafen Ag Mold for encapsulating a Pin-Fin type power module and method for manufacturing a power module

Also Published As

Publication number Publication date
JP2021513217A (en) 2021-05-20
EP3747046A1 (en) 2020-12-09
DE102018201263B3 (en) 2019-05-16
JP7290650B2 (en) 2023-06-13
CN111527598A (en) 2020-08-11

Similar Documents

Publication Publication Date Title
CA1174821A (en) Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
KR100709278B1 (en) Power semiconductor device
US9059145B2 (en) Power module, method for manufacturing power module, and molding die
JP6249892B2 (en) Manufacturing method of semiconductor device
US20150097281A1 (en) Semiconductor device
CN109564908B (en) Semiconductor device and method for manufacturing semiconductor device
CN102047414A (en) Power semiconductor circuit device and method for manufacturing the same
US20090001532A1 (en) Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof
JP2004303900A (en) Semiconductor device
EP0066188A1 (en) Plastic encapsulated semiconductor device and method for manufacturing the same
EP3747046A1 (en) A method and a jig for manufacturing a pin-fin type power module
CN215911397U (en) Mould for encapsulating pin fin type power module
CN108538728B (en) Method for manufacturing semiconductor device
JPH06151657A (en) Semiconductor device and its manufacture
US12014974B2 (en) Power module with electrodes and heat sink and manufacturing method therefor
US20230170287A1 (en) Power semiconductor module, method for assembling a power semiconductor module and housing for a power semiconductor module
JP2011187819A (en) Resin sealed power module and method of manufacturing the same
JPS62109326A (en) Manufacture of semiconductor device
CN111769090A (en) Plastic packaging power module, plastic packaging mold and plastic packaging method
JPH0244147B2 (en)
EP4270469A1 (en) Power semiconductor module
CN218888766U (en) Hybrid packaging structure of integrated circuit chip
JP4293232B2 (en) Manufacturing method of semiconductor device
JP2014107384A (en) Semiconductor device and semiconductor device manufacturing method
CN212570975U (en) Plastic package power module

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19700871

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2020541446

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2019700871

Country of ref document: EP

Effective date: 20200831