WO2019137159A1 - Mobile terminal antenna and feed network thereof - Google Patents

Mobile terminal antenna and feed network thereof Download PDF

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Publication number
WO2019137159A1
WO2019137159A1 PCT/CN2018/121482 CN2018121482W WO2019137159A1 WO 2019137159 A1 WO2019137159 A1 WO 2019137159A1 CN 2018121482 W CN2018121482 W CN 2018121482W WO 2019137159 A1 WO2019137159 A1 WO 2019137159A1
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WO
WIPO (PCT)
Prior art keywords
antenna
substrate
feed network
conductor layer
high frequency
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Application number
PCT/CN2018/121482
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French (fr)
Chinese (zh)
Inventor
盘龙
胡沥
李立忠
Original Assignee
上海安费诺永亿通讯电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from CN201820037813.1U external-priority patent/CN207781895U/en
Priority claimed from CN201810022116.3A external-priority patent/CN108258424A/en
Application filed by 上海安费诺永亿通讯电子有限公司 filed Critical 上海安费诺永亿通讯电子有限公司
Publication of WO2019137159A1 publication Critical patent/WO2019137159A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands

Definitions

  • the present invention relates to the field of wireless communications, and in particular, to an antenna disposed on a same multilayer circuit board and a feed network thereof.
  • the wireless spectrum is the most valuable resource for mobile communication systems.
  • the spectrum resources below 6 GHz are quite crowded, while the high transmission rate and high data density in 5G systems require more spectrum resources to provide support, while in the high frequency bands (such as the millimeter wave band) there is a very rich spectrum of unused. Resources can meet the high transmission rate requirements of 5G communication.
  • the present invention provides a mobile terminal antenna and a feed network thereof, including a substrate and an antenna and a feed network disposed on the substrate, the substrate including at least two conductor layers and at least one dielectric layer, the conductor The layer and the dielectric layer are superposed on each other, and the front and back sides of the substrate are a first conductor layer and a second conductor layer, respectively;
  • the antenna includes a high frequency antenna radiator and a high frequency antenna reference ground, the high frequency An antenna radiator is disposed on at least one conductor layer including the first conductor layer, the high frequency antenna being disposed in reference on at least one conductor layer including the second conductor layer;
  • the network is disposed on a conductor layer, the feed network includes a plurality of feeder lines, each antenna is connected to a signal processing module through at least one feeder line; the high frequency antenna reference ground can be used as a radiator of the low frequency antenna
  • the reference ground of the low frequency antenna is connected to the main board, and the high frequency antenna reference ground and the low frequency signal reference ground form
  • the low frequency antenna radiator is connected to a plurality of metal members for enhancing signal strength.
  • the second conductor layer is provided with a signal island connected to the signal processing module, and a gap for isolating the reference from the high frequency antenna is disposed around the signal island.
  • the outer sides of the first conductor layer and the second conductor layer are provided with a solder resist layer for solder resist and oxidation prevention.
  • the plurality of conductor layers on which the high frequency antenna is located are connected by a via.
  • the antenna may be a patch antenna, a slot antenna, or a printed antenna, and the number of the antennas is at least two, and the connection manner between the antenna and the feed network is coupling and straight-through. Or metal vias.
  • metal vias are disposed on both sides of the signal transmission line of the feeding network for preventing signal crosstalk.
  • the substrate comprises a flexible circuit board, a carrier-like board, a printed circuit board, a ceramic substrate, a glass substrate, a thermoplastic polymer material substrate, a thermosetting polymer material substrate, a composite material substrate, or a combination of these materials.
  • the substrate is connected to the signal processing module by a bonding technique, a surface mount, a solder ball array package, or the like.
  • the high frequency antenna operates above 15 GHz and has a beam scanning function; the low frequency antenna operates below 15 GHz.
  • the present invention provides an antenna and a feed network on the same multilayer PCB circuit board, the circuit board including at least two conductor layers and at least one dielectric layer stacked on each other, which can effectively save space at the joint, and Since it is integrated on a single circuit board, the connection procedure is omitted, which can effectively reduce the frequency of failures at the connection, and has a positive effect on the integration of electronic products.
  • a high-frequency reference ground is connected to a feed line, and is connected to a low-frequency antenna reference ground on the main board through a ground line.
  • the reference ground can be regarded as a radiator of the low-frequency antenna, which is equivalent to being high.
  • the combination of the frequency antenna and the low frequency antenna can be freely switched between the high frequency and the low frequency to achieve high and low frequency dual use, avoiding the cost increase caused by the two antennas and occupying more space.
  • the multilayer PCB circuit board can adopt a flexible circuit board as a substrate, and its flexible characteristics can adapt to most different spatial structures, so that it has a wider application range, has a certain universal type, and saves internal space of electronic products.
  • the cost of redesigning the antenna is different in different environments. At the same time, it is easy to cause unstable signal reliability when redesigning. This solution can avoid adding extra manpower and material resources.
  • Metal vias are arranged on both sides of the feed network, which can effectively reduce the crosstalk of the line components and solve the problem of mutual interference between signals.
  • Figure 1 is a schematic view of the overall structure of the present invention
  • FIG. 2 is a cross-sectional structural view of a section B direction of an antenna region of the present invention
  • FIG. 3 is a cross-sectional structural view of a section C direction of a feeder line region of the present invention.
  • Figure 4 is a schematic view of an embodiment of the present invention.
  • Figure 5 is a side cross-sectional structural view of Figure 4.
  • Figure 6 is a schematic view of a specific embodiment of the present invention.
  • the present invention provides a mobile terminal antenna for integrating an antenna and a feeding network on a PCB circuit board, comprising a substrate and an antenna and a feeding network disposed on the substrate, wherein the substrate comprises At least two conductor layers and at least one dielectric layer, the conductor layer and the dielectric layer are superposed on each other, and the front and back sides of the substrate are respectively a first conductor layer and a second conductor layer; the antenna comprises a high frequency antenna radiator and a high frequency antenna Referringly, the high frequency antenna radiator is disposed on at least one conductor layer including the first conductor layer, and the high frequency antenna is disposed on the at least one conductor layer including the second conductor layer; the feed network is disposed at On a conductor layer, the feed network comprises a plurality of feed lines, each antenna being connected to a signal processing module via at least one feed line; wherein the high frequency antenna is grounded to the main board via a feed line, at this time high
  • the reference antenna of the frequency antenna can
  • the substrate in this embodiment adopts a flexible circuit board, and the antenna includes an antenna area 1, a feeder area 2, and a bending area 3.
  • the antenna area is provided with 8 patch antennas, and the feeder area 2 is integrated.
  • the root transmission line is connected to the signal processing module and the antenna, and a metal via is disposed at every other end of each transmission line for shielding signal interference to prevent mutual interference between the signal lines; if the transmission is in the feeder area 2
  • the transmission line and the antenna are directly connected in signal communication.
  • the transmission line in the feeder area 2 is not in the same layer as the antenna of the antenna area 1, the transmission line and the antenna are used.
  • the vias are connected in a coupled manner; the other end of the substrate is connected to the signal processing module by a bonding technique, a surface mount, or a solder ball array package.
  • the scheme is designed with 8 antenna radiators connected to the signal processing module. Under the control of the signal processing module, the antenna can also realize the beam scanning function.
  • FIG. 2 is a cross-sectional structural view of the section B direction of the antenna region according to the embodiment, and includes four conductive layers from top to bottom, which are an antenna 4, a first ground layer 5, a signal line layer 6 and a first
  • the grounding layer 7 is an insulating material dielectric layer between each two conductive layers, and a solder resist layer is coated on the uppermost layer and the lowermost layer of the substrate to prevent internal oxidation and protection, and the signal line layer is a feeder network.
  • the transmission line is connected to the processing module and connected to the antenna through a metal via or coupling.
  • FIG. 3 is a cross-sectional structural view of a section C direction of a feeder line region in the embodiment, wherein the structure is provided with three conductor layers from top to bottom, respectively, a first feeder ground layer 8, a feeder signal layer 9 and a second feeder ground layer 10, A dielectric layer of insulating material is disposed between each two conductor layers, and eight transmission lines pass through the feeder signal layer, and the first feeder ground layer 8 and the second feeder ground layer 10 are connected by metal vias, and The metal vias shield the signals in each line on both sides of each of the two transmission lines to prevent signals from interfering with each other, and the upper and lower surfaces of the substrate are coated with a solder resist layer.
  • the antenna in this solution is not limited to the patch antenna, and may be other structural forms such as a slot antenna or a printed antenna.
  • the substrate includes the first The ground layer 72, the signal layer 74 and the second ground layer 73 are provided with an insulating first dielectric layer 75 and a second dielectric layer 76 between each two conductor layers, between the first ground layer 72 and the second ground layer 73.
  • Signal transmission is performed by a metal via connection through a slit 71 as a radiator of a high frequency signal.
  • the material of the multilayer circuit board is not limited to the above flexible circuit board, and may be other materials such as a carrier board, a printed circuit board, a ceramic substrate, a glass substrate, a thermoplastic polymer substrate, a thermosetting polymer substrate, and a composite. Material substrate or combination thereof.
  • the antenna is disposed on a mobile phone 91, and includes a main board 92.
  • the signal processing module 83 is disposed on the main board, and the signal processing module is connected.
  • the high-frequency transmitting antenna 81 of the solution adopts a flexible PCB circuit board, and can change the shape according to the spatial structure, and the multi-layer signal substrate is attached to the outer side of the top frame of the mobile phone, the antenna area is located on the border of the top of the mobile phone, and the feeder area is located in the mobile phone.
  • the ground layer of the signal substrate is connected to the reference ground of the main board, one end of the feeding line is connected to the antenna, and the other end is connected to the signal processing module 83.
  • a low frequency signal feed line 82 is connected to the ground layer of the high frequency antenna, and the feed line 82 is connected to the signal generator of the main board 92, and the ground layer of the high frequency antenna serves as a radiator of the low frequency antenna, and the low frequency The reference ground of the antenna is connected to the main board.
  • the reference ground of the high frequency antenna is the radiator 101 of the low frequency signal, and the low frequency signal generating device and the low frequency signal reference ground form a complete low frequency antenna for transmitting the low frequency signal;
  • the quality of the signal, the high-frequency antenna reference ground can also be connected with some metal components to increase the signal effect; this scheme can combine high-frequency signal transmission and low-frequency signal transmission function, realize high and low frequency dual use, and because of high frequency signal and low frequency signal The frequencies vary greatly and there is no interference between them.
  • the position of the low frequency signal feeding line 82 in this embodiment is not limited to the position shown in the figure, and may be adjusted correspondingly according to the specific situation in actual use.

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  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

The present invention provides a mobile terminal antenna and a feed network thereof, comprising a substrate, and an antenna and a feed network disposed on the substrate. The substrate comprises at least two conductor layers and at least one dielectric layer. The conductor layers and the dielectric layer are superimposed on each other, and the front and the back surfaces of the substrate are a first conductor layer and a second conductor layer, respectively. The antenna comprises a high frequency antenna radiator and a high frequency antenna reference ground. The high frequency antenna radiator is arranged on at least one conductor layer including the first conductor layer, and the high frequency antenna reference ground is arranged on at least one conductor layer including the second conductor layer. One end of the feed network is connected to the antenna, and the other end is connected to a signal processing module. The high frequency antenna reference ground is connected to a main board via a feeder circuit and connected to a low frequency antenna reference ground on the main board via a ground wire for transmitting a low frequency signal in order to achieve a dual purpose antenna assembly for high and low frequency signals.

Description

一种移动终端天线及其馈电网络Mobile terminal antenna and feed network thereof 技术领域Technical field
本发明涉及无线通信领域，尤其涉及一种设置在同一片多层电路板上的天线及其馈电网络。The present invention relates to the field of wireless communications, and in particular, to an antenna disposed on a same multilayer circuit board and a feed network thereof.
背景技术Background technique
随着移动通信技术的发展以及4G标准的全面商用，以4G标准为目标的技术研发暂时告一段落。另一方面，智能手机的高速发展引发了互联网从固定桌面快速向移动终端转移的革命，并带来了无线数据流量的指数级增长。业界普遍预测，到2020年，移动通信网络的容量需求是目前网络的1000倍，连接数将是10～100倍。面向2020年及未来的第五代移动通信(5G)已成为全球研发热点。With the development of mobile communication technology and the full commercialization of the 4G standard, the research and development of the technology aiming at the 4G standard has come to an end. On the other hand, the rapid development of smartphones has triggered a revolution in the rapid transfer of the Internet from fixed desktops to mobile terminals, and has led to an exponential increase in wireless data traffic. The industry generally predicts that by 2020, the capacity requirement of mobile communication networks is 1000 times that of current networks, and the number of connections will be 10 to 100 times. The fifth generation of mobile communications (5G) for 2020 and beyond has become a global research and development hotspot.
无线频谱是移动通信***最为宝贵的资源。目前，6GHz以下的频谱资源相当拥挤，而5G***中的高传输速率、高数据密度需要更多的频谱资源来提供支持，而在高频段(例如毫米波频段)拥有非常丰富的尚未利用的频谱资源，可以满足5G通信的高传输速率的需求。The wireless spectrum is the most valuable resource for mobile communication systems. At present, the spectrum resources below 6 GHz are quite crowded, while the high transmission rate and high data density in 5G systems require more spectrum resources to provide support, while in the high frequency bands (such as the millimeter wave band) there is a very rich spectrum of unused. Resources can meet the high transmission rate requirements of 5G communication.
发明内容Summary of the invention
本发明提供了一种移动终端天线及其馈电网络，包括一基板以及设置在该基板上的天线和馈电网络，所述基板包括至少两层导体层和至少一层介质层，所述导体层与所述介质层互相叠加设置，且所述基板的正面和背面分别为第一导体层和第二导体层；所述天线包括高频天线辐射体以及高频天线参考地，所述高频天线辐射体设置在包括所述第一导体层在内的至少一个导体层上，所述高频天线参 考地设置在包括所述第二导体层在内的至少一个导体层上；所述馈电网络设置在一导体层上，所述馈电网络包括若干条馈电线路，每个天线至少通过一条馈电线路与一信号处理模块连接；所述高频天线参考地可作为低频天线的辐射体，所述低频天线的参考地与主板连接，所述高频天线参考地以及低频信号参考地构成一完整的低频天线。The present invention provides a mobile terminal antenna and a feed network thereof, including a substrate and an antenna and a feed network disposed on the substrate, the substrate including at least two conductor layers and at least one dielectric layer, the conductor The layer and the dielectric layer are superposed on each other, and the front and back sides of the substrate are a first conductor layer and a second conductor layer, respectively; the antenna includes a high frequency antenna radiator and a high frequency antenna reference ground, the high frequency An antenna radiator is disposed on at least one conductor layer including the first conductor layer, the high frequency antenna being disposed in reference on at least one conductor layer including the second conductor layer; The network is disposed on a conductor layer, the feed network includes a plurality of feeder lines, each antenna is connected to a signal processing module through at least one feeder line; the high frequency antenna reference ground can be used as a radiator of the low frequency antenna The reference ground of the low frequency antenna is connected to the main board, and the high frequency antenna reference ground and the low frequency signal reference ground form a complete low frequency antenna.
在本发明一具体实施方式中，所述低频天线辐射体连接若干金属件，用以增强信号强度。In an embodiment of the invention, the low frequency antenna radiator is connected to a plurality of metal members for enhancing signal strength.
在本发明一具体实施方式中，所述第二导体层上设置有与所述信号处理模块连接的信号岛，所述信号岛周围设置有用于与所述高频天线参考地隔离的缝隙。In a specific embodiment of the present invention, the second conductor layer is provided with a signal island connected to the signal processing module, and a gap for isolating the reference from the high frequency antenna is disposed around the signal island.
在本发明一具体实施方式中，所述第一导体层和第二导体层的外侧设置有阻焊层，用于阻焊以及防氧化。In an embodiment of the invention, the outer sides of the first conductor layer and the second conductor layer are provided with a solder resist layer for solder resist and oxidation prevention.
在本发明一具体实施方式中，所述高频天线参考地所在的若干导体层通过过孔方式连接。In an embodiment of the invention, the plurality of conductor layers on which the high frequency antenna is located are connected by a via.
在本发明一具体实施方式中，所述天线可以是贴片天线、缝隙天线或印刷天线，且所述天线数量至少为两个，所述天线与所述馈电网络的连接方式为耦合、直通或金属过孔。In an embodiment of the present invention, the antenna may be a patch antenna, a slot antenna, or a printed antenna, and the number of the antennas is at least two, and the connection manner between the antenna and the feed network is coupling and straight-through. Or metal vias.
在本发明一具体实施方式中，所述馈电网络的信号传输线路两侧设置有金属过孔，用于防止信号串扰。In an embodiment of the present invention, metal vias are disposed on both sides of the signal transmission line of the feeding network for preventing signal crosstalk.
在本发明一具体实施方式中，基板包括柔性电路板、类载板、印刷电路板、陶瓷基板、玻璃基板、热塑性高分子材料基板、热固性高分子材料基板、复合材料基板或这些板材的组合。In an embodiment of the invention, the substrate comprises a flexible circuit board, a carrier-like board, a printed circuit board, a ceramic substrate, a glass substrate, a thermoplastic polymer material substrate, a thermosetting polymer material substrate, a composite material substrate, or a combination of these materials.
在本发明一具体实施方式中，所述基板通过键合技术、表面贴装、焊球阵列封装等形式与信号处理模块相连。In an embodiment of the invention, the substrate is connected to the signal processing module by a bonding technique, a surface mount, a solder ball array package, or the like.
在本发明一具体实施方式中，所述高频天线工作在15GHz以上，具有波束扫 描功能；所述低频天线工作在15GHz以下。In an embodiment of the invention, the high frequency antenna operates above 15 GHz and has a beam scanning function; the low frequency antenna operates below 15 GHz.
通过采用上述技术手段，使其与现有技术相比具有以下优点和有益效果：By adopting the above technical means, it has the following advantages and benefits compared with the prior art:
(1)本发明将天线和馈电网络设置在同一片多层PCB电路板上，该电路板包括至少两层导体层和至少一层介质层互相叠加设置，可有效节省连接处的空间，且由于集成在一片电路板上，省略了连接程序，可有效降低连接处发生故障的频率，对电子产品的集成化起到积极的效果。(1) The present invention provides an antenna and a feed network on the same multilayer PCB circuit board, the circuit board including at least two conductor layers and at least one dielectric layer stacked on each other, which can effectively save space at the joint, and Since it is integrated on a single circuit board, the connection procedure is omitted, which can effectively reduce the frequency of failures at the connection, and has a positive effect on the integration of electronic products.
(2)高频参考地连接一馈电线路，并通过一接地线与主板上的低频天线参考地连接，当发送低频信号时，该参考地可视作低频天线的辐射体，等同于将高频天线和低频天线相结合，可在高频与低频之间自由切换，实现高低频两用，避免设置两种天线造成的成本上升，占用较多空间的问题。(2) A high-frequency reference ground is connected to a feed line, and is connected to a low-frequency antenna reference ground on the main board through a ground line. When transmitting a low-frequency signal, the reference ground can be regarded as a radiator of the low-frequency antenna, which is equivalent to being high. The combination of the frequency antenna and the low frequency antenna can be freely switched between the high frequency and the low frequency to achieve high and low frequency dual use, avoiding the cost increase caused by the two antennas and occupying more space.
(3)该多层PCB电路板可采用柔性电路板作为基板，其柔性特点可适应大多数不同的空间结构，使其有更广的适用范围，具有一定的通用型，节省因电子产品内部空间环境不同重新设计天线的成本，同时，重新设计时容易造成信号可靠性不稳定的问题，本方案可避免增加额外人力与物力的投入。(3) The multilayer PCB circuit board can adopt a flexible circuit board as a substrate, and its flexible characteristics can adapt to most different spatial structures, so that it has a wider application range, has a certain universal type, and saves internal space of electronic products. The cost of redesigning the antenna is different in different environments. At the same time, it is easy to cause unstable signal reliability when redesigning. This solution can avoid adding extra manpower and material resources.
(4)在馈电网络两侧设置有金属过孔，可有效减少线路件信号的串扰，解决了信号间互相干扰的问题。(4) Metal vias are arranged on both sides of the feed network, which can effectively reduce the crosstalk of the line components and solve the problem of mutual interference between signals.
附图说明DRAWINGS
图1为本发明整体结构示意图；Figure 1 is a schematic view of the overall structure of the present invention;
图2为本发明天线区section B方向截面结构图；2 is a cross-sectional structural view of a section B direction of an antenna region of the present invention;
图3为本发明馈线区section C方向截面结构图；3 is a cross-sectional structural view of a section C direction of a feeder line region of the present invention;
图4为本发明一实施例示意图；Figure 4 is a schematic view of an embodiment of the present invention;
图5为图4的侧视截面结构图；Figure 5 is a side cross-sectional structural view of Figure 4;
图6为本发明一具体实施例示意图；Figure 6 is a schematic view of a specific embodiment of the present invention;
标号说明Label description
1‐天线区；2‐馈线区；3‐折弯区；4‐天线；5‐第一接地层；6‐信号线层；7‐第二接地层；8‐第一馈线接地层；9‐馈线信号层；10‐第二馈线接地层；70‐基板；71‐缝隙；1‐antenna area; 2‐feeder area; 3‐bend area; 4‐antenna; 5‐first ground plane; 6‐signal line layer; 7‐second ground plane; 8‐first feeder ground plane; Feeder signal layer; 10 - second feeder ground plane; 70-substrate; 71-slit;
具体实施方式Detailed ways
以下结合附图和具体实施方式对本发明作进一步详细说明，结合下面说明，本发明的优点和特征将更加清楚，需要说明的是，附图均采用非常简化的形式且非精准的比率，仅用以方便明晰的辅助说明本实施例的目的。The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will be more clearly understood from the following description. It should be noted that the drawings are in a very simplified form and are not precise. The purpose of this embodiment will be explained with the aid of a clear and concise explanation.
请参阅图1至图6，本发明提供了一种将天线和馈电网络集成在一片PCB电路板上的移动终端天线，包括一基板以及设置在该基板上的天线和馈电网络，基板包括至少两层导体层和至少一层介质层，导体层与介质层互相叠加设置，且基板的正面和背面分别为第一导体层和第二导体层；天线包括高频天线辐射体以及高频天线参考地，高频天线辐射体设置在包括第一导体层在内的至少一个导体层上，高频天线参考地设置在包括第二导体层在内的至少一个导体层上；馈电网络设置在一导体层上，馈电网络包括若干条馈电线路，每个天线至少通过一条馈电线路与一信号处理模块连接；其中，高频天线参考地通过一馈电线路与主板连接，此时高频天线参考地可视为低频天线辐射体，其通过一接地线与设置在主板上的低频天线参考地连接，实现发射低频信号的功能。第二导体层上设置有与信号处理模块连接的信号岛，信号岛周围设置有用于与高频天线参考地隔离的缝隙；第一导体层和第二导体层的外侧设置有阻焊层，用于阻焊以及防氧化；高频天线参考地所在的若干导体层通过过孔方式连接；馈电网络的信号传输线路两侧设置有金属过孔，用于防止信号串扰。Referring to FIG. 1 to FIG. 6 , the present invention provides a mobile terminal antenna for integrating an antenna and a feeding network on a PCB circuit board, comprising a substrate and an antenna and a feeding network disposed on the substrate, wherein the substrate comprises At least two conductor layers and at least one dielectric layer, the conductor layer and the dielectric layer are superposed on each other, and the front and back sides of the substrate are respectively a first conductor layer and a second conductor layer; the antenna comprises a high frequency antenna radiator and a high frequency antenna Referringly, the high frequency antenna radiator is disposed on at least one conductor layer including the first conductor layer, and the high frequency antenna is disposed on the at least one conductor layer including the second conductor layer; the feed network is disposed at On a conductor layer, the feed network comprises a plurality of feed lines, each antenna being connected to a signal processing module via at least one feed line; wherein the high frequency antenna is grounded to the main board via a feed line, at this time high The reference antenna of the frequency antenna can be regarded as a low-frequency antenna radiator, which is connected to a low-frequency antenna reference ground disposed on the main board through a ground line to realize a function of transmitting a low-frequency signal.a signal island connected to the signal processing module is disposed on the second conductor layer, and a gap for separating from the reference ground of the high frequency antenna is disposed around the signal island; a solder resist layer is disposed on the outer side of the first conductor layer and the second conductor layer, For solder mask and anti-oxidation; several conductor layers where the reference area of the high-frequency antenna is located are connected by via holes; metal vias are provided on both sides of the signal transmission line of the feed network for preventing signal crosstalk.
具体地，请参阅图1，本实施例中的基板采用柔性电路板，该天线包括天线区1，馈线区2以及弯折区3，天线区设置有8个贴片天线，馈线区2集成8根传输 线路连接信号处理模块和天线，且在每条传输线路的两侧每隔一端距离设置有金属过孔，用来屏蔽信号干扰，防止信号线路之间互相干扰；若馈线区2中的传输线路与天线区1的天线处在同一层时，传输线路与天线采用直接连接的方式进行信号连通，当馈线区2中的传输线路与天线区1的天线不在同一层时，传输线路与天线采用过孔或耦合的方式连接；基板的另一端通过键合技术、表面贴装或焊球阵列封装的方式与信号处理模块连接。Specifically, referring to FIG. 1, the substrate in this embodiment adopts a flexible circuit board, and the antenna includes an antenna area 1, a feeder area 2, and a bending area 3. The antenna area is provided with 8 patch antennas, and the feeder area 2 is integrated. The root transmission line is connected to the signal processing module and the antenna, and a metal via is disposed at every other end of each transmission line for shielding signal interference to prevent mutual interference between the signal lines; if the transmission is in the feeder area 2 When the line is in the same layer as the antenna of the antenna area 1, the transmission line and the antenna are directly connected in signal communication. When the transmission line in the feeder area 2 is not in the same layer as the antenna of the antenna area 1, the transmission line and the antenna are used. The vias are connected in a coupled manner; the other end of the substrate is connected to the signal processing module by a bonding technique, a surface mount, or a solder ball array package.
本方案设计采用8个与信号处理模块连接的天线辐射体，在信号处理模块的控制下，该天线还可实现波束扫描的功能。The scheme is designed with 8 antenna radiators connected to the signal processing module. Under the control of the signal processing module, the antenna can also realize the beam scanning function.
进一步的，请参阅图2，图2为本实施例天线区section B方向截面结构图，自上至下包括四层导电层，依次为天线4，第一接地层5，信号线层6以及第二接地层7，在每两个导电层之间为绝缘材质的介质层，在基板的最上层和最下层涂有阻焊层，防止内部氧化，起保护作用，信号线层为馈线网络，其中的输送线路连接在处理模块上，通过金属过孔或耦合的方式与天线连接。Further, please refer to FIG. 2. FIG. 2 is a cross-sectional structural view of the section B direction of the antenna region according to the embodiment, and includes four conductive layers from top to bottom, which are an antenna 4, a first ground layer 5, a signal line layer 6 and a first The grounding layer 7 is an insulating material dielectric layer between each two conductive layers, and a solder resist layer is coated on the uppermost layer and the lowermost layer of the substrate to prevent internal oxidation and protection, and the signal line layer is a feeder network. The transmission line is connected to the processing module and connected to the antenna through a metal via or coupling.
图3为本实施例中馈线区section C方向截面结构图，该结构自上至下分别设置有三层导体层，分别为第一馈线接地层8，馈线信号层9以及第二馈线接地层10，在每两层导体层之间设置有绝缘材质的介质层，8条输送线路从馈线信号层中穿过，第一馈线接地层8和第二馈线接地层10通过金属过孔的方式连接，且金属过孔在每两条输送线路的两侧，对每条线路中的信号起到屏蔽的作用，防止信号互相干扰，在基板的最外侧的上下表面涂有阻焊层。3 is a cross-sectional structural view of a section C direction of a feeder line region in the embodiment, wherein the structure is provided with three conductor layers from top to bottom, respectively, a first feeder ground layer 8, a feeder signal layer 9 and a second feeder ground layer 10, A dielectric layer of insulating material is disposed between each two conductor layers, and eight transmission lines pass through the feeder signal layer, and the first feeder ground layer 8 and the second feeder ground layer 10 are connected by metal vias, and The metal vias shield the signals in each line on both sides of each of the two transmission lines to prevent signals from interfering with each other, and the upper and lower surfaces of the substrate are coated with a solder resist layer.
应当理解，本方案中的天线不仅限于贴片天线，还可以是缝隙天线或印刷天线等其他结构形式，以下结合图4和图5以缝隙天线为例对本方案做进一步陈述，该基板包括第一接地层72、信号层74和第二接地层73，每两层导体层之间设置有绝缘的第一介质层75和第二介质层76，第一接地层72和第二接地层73之间通过金属过孔连接，通过缝隙71作为高频信号的辐射体，进行信号发射。It should be understood that the antenna in this solution is not limited to the patch antenna, and may be other structural forms such as a slot antenna or a printed antenna. The following is further illustrated by taking the slot antenna as an example in conjunction with FIG. 4 and FIG. 5 , the substrate includes the first The ground layer 72, the signal layer 74 and the second ground layer 73 are provided with an insulating first dielectric layer 75 and a second dielectric layer 76 between each two conductor layers, between the first ground layer 72 and the second ground layer 73. Signal transmission is performed by a metal via connection through a slit 71 as a radiator of a high frequency signal.
多层电路板的材质不局限于上述中的柔性电路板，还可以是其他材质，例如类载板、印刷电路板、陶瓷基板、玻璃基板、热塑性高分子材料基板、热固性高分子材料基板、复合材料基板或其组合等。The material of the multilayer circuit board is not limited to the above flexible circuit board, and may be other materials such as a carrier board, a printed circuit board, a ceramic substrate, a glass substrate, a thermoplastic polymer substrate, a thermosetting polymer substrate, and a composite. Material substrate or combination thereof.
下面以手机信号发射天线为例对本方案做进一步陈述，参阅图6，该天线设置在一手机91上，包括一主板92，在主板上设置有信号处理模块83，与信号处理模块连接的为本方案的高频发射天线81，该发射天线采用柔性PCB电路板，可根据空间结构改变形状，将多层信号基板贴合到手机顶端边框外侧，天线区域位于手机顶端的边框上，馈线区域位于手机主板上，所述信号基板的接地层和主板的参考地相连，馈线一端连接天线，另一端和信号处理模块83相连。The following is a further description of the solution by using the mobile phone signal transmitting antenna as an example. Referring to FIG. 6, the antenna is disposed on a mobile phone 91, and includes a main board 92. The signal processing module 83 is disposed on the main board, and the signal processing module is connected. The high-frequency transmitting antenna 81 of the solution adopts a flexible PCB circuit board, and can change the shape according to the spatial structure, and the multi-layer signal substrate is attached to the outer side of the top frame of the mobile phone, the antenna area is located on the border of the top of the mobile phone, and the feeder area is located in the mobile phone. On the main board, the ground layer of the signal substrate is connected to the reference ground of the main board, one end of the feeding line is connected to the antenna, and the other end is connected to the signal processing module 83.
进一步的，在高频天线的接地层上连接一低频信号馈电线路82，该馈电线路82与主板上92的信号发生器连接，高频天线的接地层作为低频天线的辐射体，且低频天线的参考地连接在主板上，此时高频天线的参考地为低频信号的辐射体101，与低频信号发生装置以及低频信号参考地形成一完整的低频天线，用于发射低频信号；为保证信号的质量，高频天线参考地还可外接部分金属构件，以增加信号效果；本方案能够兼具高频信号发送与低频信号发送功能，实现高低频两用，且因为高频信号和低频信号的频率相差巨大，互相之间不会产生干扰。Further, a low frequency signal feed line 82 is connected to the ground layer of the high frequency antenna, and the feed line 82 is connected to the signal generator of the main board 92, and the ground layer of the high frequency antenna serves as a radiator of the low frequency antenna, and the low frequency The reference ground of the antenna is connected to the main board. At this time, the reference ground of the high frequency antenna is the radiator 101 of the low frequency signal, and the low frequency signal generating device and the low frequency signal reference ground form a complete low frequency antenna for transmitting the low frequency signal; The quality of the signal, the high-frequency antenna reference ground can also be connected with some metal components to increase the signal effect; this scheme can combine high-frequency signal transmission and low-frequency signal transmission function, realize high and low frequency dual use, and because of high frequency signal and low frequency signal The frequencies vary greatly and there is no interference between them.
应当理解，该实施例中的低频信号馈电线路82的位置不局限于图中所示的位置，实际使用时可根据具体情况进行相应的调整。It should be understood that the position of the low frequency signal feeding line 82 in this embodiment is not limited to the position shown in the figure, and may be adjusted correspondingly according to the specific situation in actual use.
以上结合附图对本发明的实施方式作了详细说明，但是本发明并不限于上述实施方，即使对本发明作出各种变化，倘若这些变化属于本发明权利要求及其等同技术的范围之内，则仍落入在本发明的保护范围之中。The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, and even if the changes are within the scope of the claims and the equivalents thereof, It still falls within the scope of protection of the present invention.

Claims (10)

  1. 一种移动终端天线及其馈电网络，其特征在于，包括一基板以及设置在该基板上的天线和馈电网络，所述基板包括至少两层导体层和至少一层介质层，所述导体层与所述介质层互相叠加设置，且所述基板的正面和背面分别为第一导体层和第二导体层；所述天线包括高频天线辐射体以及高频天线参考地，所述高频天线辐射体设置在包括所述第一导体层在内的至少一个导体层上，所述高频天线参考地设置在包括所述第二导体层在内的至少一个导体层上；所述馈电网络设置在一导体层上，所述馈电网络包括若干条馈电线路，每个天线至少通过一条馈电线路与信号处理模块连接；所述高频天线参考地可作为低频天线的辐射体，所述低频天线的参考地与主板连接，所述高频天线参考地以及低频天线参考地构成一完整的低频天线。A mobile terminal antenna and a feed network thereof, comprising: a substrate and an antenna and a feed network disposed on the substrate, the substrate comprising at least two conductor layers and at least one dielectric layer, the conductor The layer and the dielectric layer are superposed on each other, and the front and back sides of the substrate are a first conductor layer and a second conductor layer, respectively; the antenna includes a high frequency antenna radiator and a high frequency antenna reference ground, the high frequency An antenna radiator is disposed on at least one conductor layer including the first conductor layer, the high frequency antenna being disposed in reference on at least one conductor layer including the second conductor layer; The network is disposed on a conductor layer, and the feeding network comprises a plurality of feeding lines, each antenna is connected to the signal processing module through at least one feeding line; the high frequency antenna reference ground can be used as a radiator of the low frequency antenna, The reference ground of the low frequency antenna is connected to the main board, and the high frequency antenna reference ground and the low frequency antenna reference ground form a complete low frequency antenna.
  2. 根据权利要求1所述的一种移动终端天线及其馈电网络，其特征在于，所述低频天线辐射体连接若干金属件，用于增强信号强度。A mobile terminal antenna and a feed network thereof according to claim 1, wherein the low frequency antenna radiator is connected to a plurality of metal members for enhancing signal strength.
  3. 根据权利要求1所述的一种移动终端天线及其馈电网络，其特征在于，所述第二导体层上设置有与所述信号处理模块连接的信号岛，所述信号岛周围设置有用于与所述高频天线参考地隔离的缝隙。The mobile terminal antenna and the feed network thereof according to claim 1, wherein the second conductor layer is provided with a signal island connected to the signal processing module, and the signal island is provided around A gap that is isolated from the high frequency antenna with reference to ground.
  4. 根据权利要求1所述的一种移动终端天线及其馈电网络，其特征在于，所述第一导体层和第二导体层的外侧设置有阻焊层，用于阻焊以及防氧化。A mobile terminal antenna and a feed network thereof according to claim 1, wherein a solder resist layer is disposed on an outer side of the first conductor layer and the second conductor layer for solder resist and oxidation prevention.
  5. 根据权利要求1所述的一种移动终端天线及其馈电网络，其特征在于，所述高频天线参考地所在的若干导体层通过过孔方式连接。A mobile terminal antenna and a feed network thereof according to claim 1, wherein a plurality of conductor layers on which the high frequency antenna is located are connected by a via.
  6. 根据权利要求1所述的一种移动终端天线及其馈电网络，其特征在于，所述天线可以是贴片天线、缝隙天线或印刷天线，且所述天线数量至少为两个，所述天线与所述馈电网络的连接方式为耦合、直通或金属过孔。The mobile terminal antenna and the feed network thereof according to claim 1, wherein the antenna may be a patch antenna, a slot antenna or a printed antenna, and the number of the antennas is at least two, the antenna The connection to the feed network is a coupling, a through or a metal via.
  7. 根据权利要求1所述的一种移动终端天线及其馈电网络，其特征在于，所述馈 电网络的信号传输线路两侧设置有金属过孔，用于防止信号串扰。A mobile terminal antenna and a feed network thereof according to claim 1, wherein metal signal vias are disposed on both sides of the signal transmission line of the feed network for preventing signal crosstalk.
  8. 根据权利要求1所述的一种移动终端天线及其馈电网络，其特征在于，所述基板包括柔性电路板、类载板、印刷电路板、陶瓷基板、玻璃基板、热塑性高分子材料基板、热固性高分子材料基板、复合材料基板或这些板材的组合。The mobile terminal antenna and the feed network thereof according to claim 1, wherein the substrate comprises a flexible circuit board, a carrier-like board, a printed circuit board, a ceramic substrate, a glass substrate, a thermoplastic polymer material substrate, A thermosetting polymer material substrate, a composite substrate, or a combination of these sheets.
  9. 根据权利要求1所述的一种移动终端天线及其馈电网络，其特征在于，所述基板通过键合技术、表面贴装、焊球阵列封装等方式与信号处理模块相连。The mobile terminal antenna and the feed network thereof according to claim 1, wherein the substrate is connected to the signal processing module by a bonding technique, a surface mount, a solder ball array package, or the like.
  10. 根据权利要求1所述的一种移动终端天线及其馈电网络，其特征在于，所述高频天线工作在15GHz以上，具有波束扫描功能；所述低频天线工作在15GHz以下。The mobile terminal antenna and the feed network thereof according to claim 1, wherein the high frequency antenna operates above 15 GHz and has a beam scanning function; and the low frequency antenna operates below 15 GHz.
PCT/CN2018/121482 2018-01-10 2018-12-17 Mobile terminal antenna and feed network thereof WO2019137159A1 (en)

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CN201820037813.1U CN207781895U (en) 2018-01-10 2018-01-10 A kind of mobile terminal antenna and its feeding network
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CN108258424A (en) * 2018-01-10 2018-07-06 上海安费诺永亿通讯电子有限公司 A kind of mobile terminal antenna and its feeding network
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CN105977634A (en) * 2016-05-03 2016-09-28 瑞声科技(新加坡)有限公司 LTE full band mobile phone antenna structure
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