WO2019100992A1 - 一种led发光装置 - Google Patents
一种led发光装置 Download PDFInfo
- Publication number
- WO2019100992A1 WO2019100992A1 PCT/CN2018/115469 CN2018115469W WO2019100992A1 WO 2019100992 A1 WO2019100992 A1 WO 2019100992A1 CN 2018115469 W CN2018115469 W CN 2018115469W WO 2019100992 A1 WO2019100992 A1 WO 2019100992A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- gap
- segment
- chip
- emitting device
- light emitting
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims description 13
- 238000009434 installation Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001954 sterilising effect Effects 0.000 description 2
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- 238000004887 air purification Methods 0.000 description 1
- 230000000675 anti-caries Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2020207000028U KR200495465Y1 (ko) | 2017-11-22 | 2018-11-14 | Led 발광장치 |
JP2020600067U JP3229414U (ja) | 2017-11-22 | 2018-11-14 | Led発光装置 |
US16/878,290 US11362074B2 (en) | 2017-11-22 | 2020-05-19 | Light-emitting diode device |
US17/804,888 US12002796B2 (en) | 2017-11-22 | 2022-06-01 | Light-emitting diode device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721568219.7 | 2017-11-22 | ||
CN201721568219.7U CN207818608U (zh) | 2017-11-22 | 2017-11-22 | 一种led发光装置 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/878,290 Continuation-In-Part US11362074B2 (en) | 2017-11-22 | 2020-05-19 | Light-emitting diode device |
US16/878,290 Continuation US11362074B2 (en) | 2017-11-22 | 2020-05-19 | Light-emitting diode device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019100992A1 true WO2019100992A1 (zh) | 2019-05-31 |
Family
ID=63333683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2018/115469 WO2019100992A1 (zh) | 2017-11-22 | 2018-11-14 | 一种led发光装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US11362074B2 (zh) |
JP (1) | JP3229414U (zh) |
KR (1) | KR200495465Y1 (zh) |
CN (1) | CN207818608U (zh) |
WO (1) | WO2019100992A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN207818608U (zh) * | 2017-11-22 | 2018-09-04 | 厦门市三安光电科技有限公司 | 一种led发光装置 |
CN111162070A (zh) * | 2020-01-16 | 2020-05-15 | 宁波升谱光电股份有限公司 | 一种深紫外led器件及其制备方法 |
CN115868036A (zh) | 2020-10-23 | 2023-03-28 | 三星电子株式会社 | 显示装置 |
KR20220054107A (ko) * | 2020-10-23 | 2022-05-02 | 삼성전자주식회사 | 디스플레이 장치 및 그 광원 장치 |
JP7460911B2 (ja) | 2020-12-21 | 2024-04-03 | 日亜化学工業株式会社 | 発光装置及びそれを用いたディスプレイ |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009283337A (ja) * | 2008-05-23 | 2009-12-03 | Rohm Co Ltd | 傾斜センサ |
CN102130287A (zh) * | 2010-12-22 | 2011-07-20 | 晶科电子(广州)有限公司 | 具有静电损伤保护功能的发光二极管器件及其制造方法 |
CN102155936A (zh) * | 2010-02-12 | 2011-08-17 | 艾笛森光电股份有限公司 | 具有抗静电元件的光学感应装置 |
CN107293629A (zh) * | 2017-07-31 | 2017-10-24 | 广东工业大学 | 一种紫外led外延芯片倒装结构及其制作方法 |
CN207818608U (zh) * | 2017-11-22 | 2018-09-04 | 厦门市三安光电科技有限公司 | 一种led发光装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7081667B2 (en) * | 2004-09-24 | 2006-07-25 | Gelcore, Llc | Power LED package |
US10008637B2 (en) * | 2011-12-06 | 2018-06-26 | Cree, Inc. | Light emitter devices and methods with reduced dimensions and improved light output |
US8486724B2 (en) * | 2010-10-22 | 2013-07-16 | Tsmc Solid State Lighting Ltd. | Wafer level reflector for LED packaging |
KR101769075B1 (ko) | 2010-12-24 | 2017-08-18 | 서울바이오시스 주식회사 | 발광 다이오드 칩 및 그것을 제조하는 방법 |
US9673363B2 (en) * | 2011-01-31 | 2017-06-06 | Cree, Inc. | Reflective mounting substrates for flip-chip mounted horizontal LEDs |
KR101469052B1 (ko) * | 2013-08-02 | 2014-12-04 | 주식회사 루멘스 | 발광 소자 패키지 및 이의 제작 방법 |
US9548429B2 (en) * | 2014-05-10 | 2017-01-17 | Sensor Electronic Technology, Inc. | Packaging for ultraviolet optoelectronic device |
JP6587161B2 (ja) * | 2015-07-22 | 2019-10-09 | パナソニックIpマネジメント株式会社 | 発光装置 |
JP6614414B2 (ja) * | 2016-03-18 | 2019-12-04 | 豊田合成株式会社 | 発光装置および発光装置の製造方法 |
-
2017
- 2017-11-22 CN CN201721568219.7U patent/CN207818608U/zh active Active
-
2018
- 2018-11-14 KR KR2020207000028U patent/KR200495465Y1/ko active IP Right Grant
- 2018-11-14 JP JP2020600067U patent/JP3229414U/ja active Active
- 2018-11-14 WO PCT/CN2018/115469 patent/WO2019100992A1/zh active Application Filing
-
2020
- 2020-05-19 US US16/878,290 patent/US11362074B2/en active Active
-
2022
- 2022-06-01 US US17/804,888 patent/US12002796B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009283337A (ja) * | 2008-05-23 | 2009-12-03 | Rohm Co Ltd | 傾斜センサ |
CN102155936A (zh) * | 2010-02-12 | 2011-08-17 | 艾笛森光电股份有限公司 | 具有抗静电元件的光学感应装置 |
CN102130287A (zh) * | 2010-12-22 | 2011-07-20 | 晶科电子(广州)有限公司 | 具有静电损伤保护功能的发光二极管器件及其制造方法 |
CN107293629A (zh) * | 2017-07-31 | 2017-10-24 | 广东工业大学 | 一种紫外led外延芯片倒装结构及其制作方法 |
CN207818608U (zh) * | 2017-11-22 | 2018-09-04 | 厦门市三安光电科技有限公司 | 一种led发光装置 |
Also Published As
Publication number | Publication date |
---|---|
US12002796B2 (en) | 2024-06-04 |
JP3229414U (ja) | 2020-12-10 |
US11362074B2 (en) | 2022-06-14 |
CN207818608U (zh) | 2018-09-04 |
KR20200001203U (ko) | 2020-06-09 |
US20200279838A1 (en) | 2020-09-03 |
KR200495465Y1 (ko) | 2022-05-30 |
US20220302097A1 (en) | 2022-09-22 |
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