WO2019100580A1 - Equivalent structure for bending experiment instead of flexible display panel - Google Patents
Equivalent structure for bending experiment instead of flexible display panel Download PDFInfo
- Publication number
- WO2019100580A1 WO2019100580A1 PCT/CN2018/073483 CN2018073483W WO2019100580A1 WO 2019100580 A1 WO2019100580 A1 WO 2019100580A1 CN 2018073483 W CN2018073483 W CN 2018073483W WO 2019100580 A1 WO2019100580 A1 WO 2019100580A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- encapsulation layer
- display panel
- flexible substrate
- flexible display
- package structure
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/32—Investigating strength properties of solid materials by application of mechanical stress by applying repeated or pulsating forces
Definitions
- the present invention belongs to the field of display technology, and in particular, to an equivalent structure for performing a bending experiment instead of a flexible display panel.
- Flexible OLED display panels need to be bendable.
- Thin film encapsulation (TFE) is typically performed on OLED devices in order to block moisture and oxygen.
- the thin film encapsulation layer generally adopts SiN x and SiO x materials. Since the Young's modulus of the thin film encapsulation layer is larger than the Young's modulus of other layers, and the thin film encapsulation layer tends to be far away from the neutral layer, the thin film encapsulation layer is often bent. The stress is large and the fracture is most likely to occur. Therefore, it is necessary to perform bending experiments on the flexible OLED display panel to ensure the mechanical properties of the thin film encapsulation layer.
- the present invention provides an equivalent structure for performing a bending experiment instead of a flexible display panel.
- an equivalent structure for performing a bending experiment in place of a flexible display panel comprising: a first flexible substrate; a package structure disposed on the first flexible substrate
- the package structure is identical to the package structure of the flexible display panel; wherein the thickness of the first flexible substrate can ensure that the package structure has the same stress as the package structure of the flexible display panel at the same bending radius.
- the first flexible substrate is formed by making polyethylene naphthalate.
- the package structure of the equivalent structure includes: a first encapsulation layer disposed on the first flexible substrate, the first encapsulation layer being identical to the first thin film encapsulation layer of the package structure of the flexible display panel; a second encapsulation layer disposed on the first encapsulation layer, the second encapsulation layer being identical to the second thin film encapsulation layer of the package structure of the flexible display panel; and a third encapsulation layer disposed on the second encapsulation layer The third encapsulation layer is identical to the third thin film encapsulation layer of the package structure of the flexible display panel.
- an equivalent structure for performing a bending experiment instead of a flexible display panel comprising: a first flexible substrate; a package structure disposed on the first flexible On the substrate, the package structure is exactly the same as the package structure of the flexible display panel; the second flexible substrate is disposed on the package structure; wherein the thickness of the first flexible substrate and the second flexible substrate can be ensured
- the package structure has the same stress as the package structure of the flexible display panel at the same bending radius.
- the thickness of the second flexible substrate is linear with the stress of the package structure.
- the thickness of the second flexible substrate increases as the thickness of the first flexible substrate increases.
- first flexible substrate and the second flexible substrate are both formed by polyethylene naphthalate.
- the package structure of the equivalent structure includes: a first encapsulation layer disposed on the first flexible substrate, the first encapsulation layer being identical to the first thin film encapsulation layer of the package structure of the flexible display panel; a second encapsulation layer disposed on the first encapsulation layer, the second encapsulation layer being identical to the second thin film encapsulation layer of the package structure of the flexible display panel; and a third encapsulation layer disposed on the second encapsulation layer
- the third encapsulation layer is exactly the same as the third thin film encapsulation layer of the package structure of the flexible display panel, and the second flexible substrate is disposed on the third encapsulation layer.
- first encapsulation layer and the third encapsulation layer are formed by a nitride of silicon, and the second encapsulation layer is formed by an oxide of silicon.
- the present invention proposes an equivalent structure for performing a bending experiment instead of a flexible display panel, and the equivalent structure can be used to determine whether a complete flexible display panel satisfies the mechanical performance requirement. So you don't have to wait until you get a complete flexible display panel for quick experimental verification, which speeds up the product development cycle and saves costs.
- FIG. 1 is a schematic structural view of a flexible display panel according to an embodiment of the present invention.
- FIG. 2 is a graph showing stress and strain curves of the flexible display panel shown in FIG. 1;
- 3 is an equivalent structure for performing a bending experiment in place of a flexible display panel in accordance with an embodiment of the present invention
- Figure 4 is a graph showing the stress-strain curve of the equivalent structure shown in Figure 3;
- FIG. 6 is a graph showing the relationship between the thickness of the second flexible substrate of the equivalent structure shown in FIG. 5 and the stress of the package structure;
- FIG. 1 is a schematic structural view of a flexible display panel in accordance with an embodiment of the present invention.
- a flexible display panel 100 includes a flexible substrate 10, a first optical adhesive layer 11, a thin film transistor array layer 110, an organic electroluminescent layer 23, a thin film encapsulation structure 120, The touch layer 27, the second optical adhesive layer 28, and the polarizer 29.
- the thin film transistor array layer 110 includes: a first transparent flexible substrate 12, an inorganic layer 13, a second transparent flexible substrate 14, a buffer layer 15, a first gate insulating layer 16, a gate metal layer 17, and a second gate insulating layer.
- thin film encapsulation structure 120 includes: silicon nitride (SiN x ) produced a first thin film encapsulation layer 24 is formed, a second thin film encapsulation layer formed of silicon oxide (SiO x) produced 25 and formed of silicon nitride (SiN x) making a third forming thin film encapsulation layer 26.
- FIG. 2 shows a stress-strain curve of the flexible display panel shown in FIG. 1.
- the abscissa Strain represents strain
- the abscissa Stress represents stress
- the ordinate Thickness represents thickness of each layer.
- the maximum stress is located at the film package structure 120.
- 3 is an equivalent structure for performing a bending experiment in place of a flexible display panel in accordance with an embodiment of the present invention.
- an equivalent structure 200 includes a first flexible substrate 210 and a package structure 220 disposed on the first flexible substrate 210.
- the package structure 220 is identical to the thin film package structure 120 of the flexible display panel 100.
- the package structure 220 includes a first encapsulation layer 221, a second encapsulation layer 222 disposed on the first encapsulation layer 221, and a third encapsulation layer 223 disposed on the second encapsulation layer 222.
- the first encapsulation layer 221 is formed by using silicon nitride, and the thickness of the first encapsulation layer 221 is the same as the thickness of the first thin film encapsulation layer 24, that is, the first encapsulation layer 221 is identical to the first thin film encapsulation layer 24.
- the second encapsulation layer 222 is formed using an oxide of silicon, and the thickness of the second encapsulation layer 222 is the same as the thickness of the second thin film encapsulation layer 25, that is, the second encapsulation layer 222 is identical to the second thin film encapsulation layer 25.
- the third encapsulation layer 223 is formed using silicon nitride, and the thickness of the third encapsulation layer 223 is the same as the thickness of the third thin film encapsulation layer 26, that is, the third encapsulation layer 223 is identical to the third thin film encapsulation layer 26.
- the first flexible substrate 210 is formed of polyethylene naphthalate (PEN), but the present invention is not limited thereto.
- PEN polyethylene naphthalate
- the thickness of the first flexible substrate 210 is determined according to mechanical calculations, thereby ensuring that the package structure 220 and the film package structure 120 of the flexible display panel 100 have the same stress at the same bending radius.
- the thickness of the first flexible substrate 210 is set to 46 ⁇ m.
- Fig. 4 is a graph showing the stress-strain curve of the equivalent structure shown in Fig. 3.
- the abscissa Strain represents strain
- the abscissa Stress represents stress
- the ordinate Thickness represents thickness of each layer.
- the equivalent structure 200 of the present embodiment can perform the bending experiment instead of the flexible display panel 100.
- Figure 5 is an equivalent structure for performing a bending experiment in place of a flexible display panel in accordance with another embodiment of the present invention.
- the equivalent structure 200A according to another embodiment of the present invention further includes a second flexible substrate 230 disposed on the third encapsulation layer. 223.
- the second flexible substrate 230 is also formed of polyethylene naphthalate (PEN), but the invention is not limited thereto.
- PEN polyethylene naphthalate
- the thicknesses of the first flexible substrate 210 and the second flexible substrate 230 are determined according to mechanical calculations, thereby ensuring the package structure 220 and the thin film encapsulation structure 120 of the flexible display panel 100 at the same bending radius.
- the stress is the same.
- Fig. 6 is a graph showing the relationship between the thickness of the second flexible substrate of the equivalent structure shown in Fig. 5 and the stress of the package structure.
- the abscissa indicates the thickness of the second flexible substrate 230
- the ordinate indicates the stress of the package structure 220.
- the thickness of the second flexible substrate 230 is linear with the stress of the package structure 220, and is in a positive correlation.
- the thickness of the first flexible substrate 210 is set to 50 ⁇ m, and the thickness of the second flexible substrate 230 is set to 84.5 ⁇ m.
- Fig. 7 is a graph showing the stress-strain curve of the equivalent structure shown in Fig. 5.
- the abscissa Strain represents strain
- the abscissa Stress represents stress
- the ordinate Thickness represents thickness of each layer.
- the equivalent structure 200A of the present embodiment can perform the bending experiment instead of the flexible display panel 100.
- the thickness of the first flexible substrate 210 may be set to 100 ⁇ m, and the thickness of the second flexible substrate 230 may be set to 130 ⁇ m.
- Fig. 8 is a graph showing the stress-strain curve of the equivalent structure shown in Fig. 5.
- the abscissa Strain represents strain
- the abscissa Stress represents stress
- the ordinate Thickness represents thickness of each layer.
- the equivalent structure 200A of the present embodiment can perform the bending experiment instead of the flexible display panel 100.
- the thickness of the first flexible substrate 210 when the thickness of the first flexible substrate 210 is increased, in order to keep the maximum stress of the package structure 220 equivalent to the maximum stress of the thin film package structure 120 of the flexible display panel 100, the thickness of the second flexible substrate 230 also needs to be increased.
- the invention is not limited thereto.
- an equivalent structure for performing a bending experiment instead of a flexible display panel is proposed, and the bending experiment can be used to determine whether the complete flexible display panel is Meet the mechanical performance requirements, so you don't have to wait until you get a complete flexible display panel to perform rapid experimental verification, speed up the product development cycle, and save costs.
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
An equivalent structure (200) for a bending experiment instead of a flexible display panel (100). The equivalent structure (200) comprises: a first flexible substrate (210); and an encapsulating structure (220) arranged on the first flexible substrate (210), wherein the encapsulating structure (220) is completely the same as an encapsulating structure (120) of the flexible display panel (100). The thickness of the first flexible substrate (210) can ensure that the encapsulating structure (220) has the same strain as the encapsulating structure (120) of the flexible display panel (100) under the same bending radius. Using the equivalent structure (200) to perform a bending experiment enables determination of whether a complete flexible display panel (100) satisfies mechanical performance requirements; as such, an experiment can be quickly performed for verification without the need to wait to obtain a complete flexible display panel (100), accelerating the product development cycle and saving on costs.
Description
本发明属于显示技术领域，具体地讲，涉及一种用于替代柔性显示面板进行弯折实验的等效结构。The present invention belongs to the field of display technology, and in particular, to an equivalent structure for performing a bending experiment instead of a flexible display panel.
柔性OLED显示面板需具有可弯折性。通常为了阻挡水汽和氧气会对OLED器件进行薄膜封装(Thin Film Encapsulation，TFE)。薄膜封装层一般采用SiN
x、SiO
x材料，由于薄膜封装层的杨氏模量比其它层的杨氏模量大，并且薄膜封装层往往远离中性层，因此在弯折时往往薄膜封装层的应力很大，从而最容易发生断裂现象。因此需要对柔性OLED显示面板进行弯折实验来保证薄膜封装层的力学性能。
Flexible OLED display panels need to be bendable. Thin film encapsulation (TFE) is typically performed on OLED devices in order to block moisture and oxygen. The thin film encapsulation layer generally adopts SiN x and SiO x materials. Since the Young's modulus of the thin film encapsulation layer is larger than the Young's modulus of other layers, and the thin film encapsulation layer tends to be far away from the neutral layer, the thin film encapsulation layer is often bent. The stress is large and the fracture is most likely to occur. Therefore, it is necessary to perform bending experiments on the flexible OLED display panel to ensure the mechanical properties of the thin film encapsulation layer.
由于在量产之前的实验阶段，柔性OLED显示面板的测试样品往往量小，从而这些待测试的柔性OLED显示面板就显得很珍贵，因此需要设计一种用于替代柔性OLED显示面板进行实验测试的等效结构。Since the test samples of the flexible OLED display panel tend to be small in the experimental stage before mass production, the flexible OLED display panels to be tested are very precious, so it is necessary to design an alternative OLED display panel for experimental testing. Equivalent structure.
发明内容Summary of the invention
为了实现上述提出的目的，本发明提供了一种用于替代柔性显示面板进行弯折实验的等效结构。In order to achieve the above proposed object, the present invention provides an equivalent structure for performing a bending experiment instead of a flexible display panel.
根据本发明的一方面，提供了一种用于替代柔性显示面板进行弯折实验的等效结构，所述等效结构包括：第一柔性基板；封装结构，设置于所述第一柔性基板上，所述封装结构与柔性显示面板的封装结构完全相同；其中，所述第一柔性基板的厚度能够确保在相同弯折半径下所述封装结构与所述柔性显示面板的封装结构的应力相同。According to an aspect of the present invention, there is provided an equivalent structure for performing a bending experiment in place of a flexible display panel, the equivalent structure comprising: a first flexible substrate; a package structure disposed on the first flexible substrate The package structure is identical to the package structure of the flexible display panel; wherein the thickness of the first flexible substrate can ensure that the package structure has the same stress as the package structure of the flexible display panel at the same bending radius.
进一步地，所述第一柔性基板由聚萘二甲酸乙二醇酯制作形成。Further, the first flexible substrate is formed by making polyethylene naphthalate.
进一步地，所述等效结构的封装结构包括：第一封装层，设置于所述第一 柔性基板上，所述第一封装层与柔性显示面板的封装结构的第一薄膜封装层完全相同；第二封装层，设置于所述第一封装层上，所述第二封装层与柔性显示面板的封装结构的第二薄膜封装层完全相同；第三封装层，设置于所述第二封装层上，所述第三封装层与柔性显示面板的封装结构的第三薄膜封装层完全相同。Further, the package structure of the equivalent structure includes: a first encapsulation layer disposed on the first flexible substrate, the first encapsulation layer being identical to the first thin film encapsulation layer of the package structure of the flexible display panel; a second encapsulation layer disposed on the first encapsulation layer, the second encapsulation layer being identical to the second thin film encapsulation layer of the package structure of the flexible display panel; and a third encapsulation layer disposed on the second encapsulation layer The third encapsulation layer is identical to the third thin film encapsulation layer of the package structure of the flexible display panel.
根据本发明的另一方面，还提供了一种用于替代柔性显示面板进行弯折实验的等效结构，所述等效结构包括：第一柔性基板；封装结构，设置于所述第一柔性基板上，所述封装结构与柔性显示面板的封装结构完全相同；第二柔性基板，设置于所述封装结构上；其中，所述第一柔性基板和所述第二柔性基板的厚度能够确保在相同弯折半径下所述封装结构与所述柔性显示面板的封装结构的应力相同。According to another aspect of the present invention, there is also provided an equivalent structure for performing a bending experiment instead of a flexible display panel, the equivalent structure comprising: a first flexible substrate; a package structure disposed on the first flexible On the substrate, the package structure is exactly the same as the package structure of the flexible display panel; the second flexible substrate is disposed on the package structure; wherein the thickness of the first flexible substrate and the second flexible substrate can be ensured The package structure has the same stress as the package structure of the flexible display panel at the same bending radius.
进一步地，所述第二柔性基板的厚度与所述封装结构的应力成线性关系。Further, the thickness of the second flexible substrate is linear with the stress of the package structure.
进一步地，所述第二柔性基板的厚度随着所述第一柔性基板的厚度的增加而增加。Further, the thickness of the second flexible substrate increases as the thickness of the first flexible substrate increases.
进一步地，所述第一柔性基板和所述第二柔性基板均由聚萘二甲酸乙二醇酯制作形成。Further, the first flexible substrate and the second flexible substrate are both formed by polyethylene naphthalate.
进一步地，所述等效结构的封装结构包括：第一封装层，设置于所述第一柔性基板上，所述第一封装层与柔性显示面板的封装结构的第一薄膜封装层完全相同；第二封装层，设置于所述第一封装层上，所述第二封装层与柔性显示面板的封装结构的第二薄膜封装层完全相同；第三封装层，设置于所述第二封装层上，所述第三封装层与柔性显示面板的封装结构的第三薄膜封装层完全相同，所述第二柔性基板设置于所述第三封装层上。Further, the package structure of the equivalent structure includes: a first encapsulation layer disposed on the first flexible substrate, the first encapsulation layer being identical to the first thin film encapsulation layer of the package structure of the flexible display panel; a second encapsulation layer disposed on the first encapsulation layer, the second encapsulation layer being identical to the second thin film encapsulation layer of the package structure of the flexible display panel; and a third encapsulation layer disposed on the second encapsulation layer The third encapsulation layer is exactly the same as the third thin film encapsulation layer of the package structure of the flexible display panel, and the second flexible substrate is disposed on the third encapsulation layer.
进一步地，所述第一封装层和所述第三封装层由硅的氮化物制作形成，所述第二封装层由硅的氧化物制作形成。Further, the first encapsulation layer and the third encapsulation layer are formed by a nitride of silicon, and the second encapsulation layer is formed by an oxide of silicon.
本发明的有益效果：本发明提出了一种用于替代柔性显示面板进行弯折实验的等效结构，用该等效结构进行弯折实验就能判断出完整的柔性显示面板是否满足力学性能要求，如此不必等到获得完整的柔性显示面板就能进行快速的 实验验证，从而加快产品开发周期，并且节省成本。Advantageous Effects of the Invention: The present invention proposes an equivalent structure for performing a bending experiment instead of a flexible display panel, and the equivalent structure can be used to determine whether a complete flexible display panel satisfies the mechanical performance requirement. So you don't have to wait until you get a complete flexible display panel for quick experimental verification, which speeds up the product development cycle and saves costs.
通过结合附图进行的以下描述，本发明的实施例的上述和其它方面、特点和优点将变得更加清楚，附图中：The above and other aspects, features and advantages of the embodiments of the present invention will become more apparent from
图1是根据本发明的实施例的柔性显示面板的结构示意图；1 is a schematic structural view of a flexible display panel according to an embodiment of the present invention;
图2示出了图1所示的柔性显示面板的应力应变曲线图；2 is a graph showing stress and strain curves of the flexible display panel shown in FIG. 1;
图3是根据本发明的实施例的用于替代柔性显示面板进行弯折实验的等效结构；3 is an equivalent structure for performing a bending experiment in place of a flexible display panel in accordance with an embodiment of the present invention;
图4示出了图3所示的等效结构的应力应变曲线图；Figure 4 is a graph showing the stress-strain curve of the equivalent structure shown in Figure 3;
图5是根据本发明的另一实施例的用于替代柔性显示面板进行弯折实验的等效结构；5 is an equivalent structure for performing a bending experiment in place of a flexible display panel in accordance with another embodiment of the present invention;
图6是图5所示的等效结构的第二柔性基板的厚度与封装结构的应力的关系曲线图；6 is a graph showing the relationship between the thickness of the second flexible substrate of the equivalent structure shown in FIG. 5 and the stress of the package structure;
图7和图8示出了图5所示的等效结构的应力应变曲线图。7 and 8 show stress-strain curves of the equivalent structure shown in Fig. 5.
以下，将参照附图来详细描述本发明的实施例。然而，可以以许多不同的形式来实施本发明，并且本发明不应该被解释为限制于这里阐述的具体实施例。相反，提供这些实施例是为了解释本发明的原理及其实际应用，从而使本领域的其他技术人员能够理解本发明的各种实施例和适合于特定预期应用的各种修改。Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention may be embodied in many different forms and the invention should not be construed as being limited to the specific embodiments set forth herein. Rather, these embodiments are provided to explain the principles of the invention and the application of the invention, and the various embodiments of the invention can be understood.
在附图中，为了清楚起见，夸大了层和区域的厚度。相同的标号在整个说明书和附图中表示相同的元器件。In the drawings, the thickness of layers and regions are exaggerated for clarity. The same reference numerals are used throughout the drawings and the drawings.
图1是根据本发明的实施例的柔性显示面板的结构示意图。1 is a schematic structural view of a flexible display panel in accordance with an embodiment of the present invention.
参照图1，根据本发明的实施例的柔性显示面板100从下至上顺序包括： 柔性基板10、第一光学胶层11、薄膜晶体管阵列层110、有机电致发光层23、薄膜封装结构120、触摸层27、第二光学胶层28和偏光片29。其中，薄膜晶体管阵列层110包括：第一透明柔性基板12、无机层13、第二透明柔性基板14、缓冲层15、第一栅极绝缘层16、栅极金属层17、第二栅极绝缘层18、层间介电层(IDL)19、有机平坦层(PLN)20、有机像素限定层(PDL)21、有机光阻层22；薄膜封装结构120包括：由硅的氮化物(SiN
x)制作形成的第一薄膜封装层24、由硅的氧化物(SiO
x)制作形成的第二薄膜封装层25以及由硅的氮化物(SiN
x)制作形成的第三薄膜封装层26。
Referring to FIG. 1, a flexible display panel 100 according to an embodiment of the present invention includes a flexible substrate 10, a first optical adhesive layer 11, a thin film transistor array layer 110, an organic electroluminescent layer 23, a thin film encapsulation structure 120, The touch layer 27, the second optical adhesive layer 28, and the polarizer 29. The thin film transistor array layer 110 includes: a first transparent flexible substrate 12, an inorganic layer 13, a second transparent flexible substrate 14, a buffer layer 15, a first gate insulating layer 16, a gate metal layer 17, and a second gate insulating layer. Layer 18, interlayer dielectric layer (IDL) 19, organic planarization layer (PLN) 20, organic pixel defining layer (PDL) 21, organic photoresist layer 22; thin film encapsulation structure 120 includes: silicon nitride (SiN x ) produced a first thin film encapsulation layer 24 is formed, a second thin film encapsulation layer formed of silicon oxide (SiO x) produced 25 and formed of silicon nitride (SiN x) making a third forming thin film encapsulation layer 26.
图2示出了图1所示的柔性显示面板的应力应变曲线图。在图2中，横坐标Strain表示应变，横坐标Stress表示应力，纵坐标Thickness表示各层厚度。FIG. 2 shows a stress-strain curve of the flexible display panel shown in FIG. 1. In Fig. 2, the abscissa Strain represents strain, the abscissa Stress represents stress, and the ordinate Thickness represents thickness of each layer.
参照图2，当柔性显示面板根据设定好的弯折程度进行弯折时，最大应力位于薄膜封装结构120处。在图2中，薄膜封装结构120由TFE表示，TFE的最大应力σ＝1258Mpa。Referring to FIG. 2, when the flexible display panel is bent according to the set degree of bending, the maximum stress is located at the film package structure 120. In FIG. 2, the thin film encapsulation structure 120 is represented by TFE, and the maximum stress of TFE is σ=1258 MPa.
图3是根据本发明的实施例的用于替代柔性显示面板进行弯折实验的等效结构。3 is an equivalent structure for performing a bending experiment in place of a flexible display panel in accordance with an embodiment of the present invention.
参照图3，根据本发明的实施例的等效结构200包括第一柔性基板210以及设置于第一柔性基板210上的封装结构220。其中，该封装结构220与柔性显示面板100的薄膜封装结构120完全相同。Referring to FIG. 3, an equivalent structure 200 according to an embodiment of the present invention includes a first flexible substrate 210 and a package structure 220 disposed on the first flexible substrate 210. The package structure 220 is identical to the thin film package structure 120 of the flexible display panel 100.
进一步地，封装结构220包括：第一封装层221；设置于第一封装层221上的第二封装层222以及设置于第二封装层222上的第三封装层223。第一封装层221采用硅的氮化物制作形成，并且第一封装层221的厚度与第一薄膜封装层24的厚度相同，即第一封装层221与第一薄膜封装层24完全相同。第二封装层222采用硅的氧化物制作形成，并且第二封装层222的厚度与第二薄膜封装层25的厚度相同，即第二封装层222与第二薄膜封装层25完全相同。第三封装层223采用硅的氮化物制作形成，并且第三封装层223的厚度与第三薄膜封装层26的厚度相同，即第三封装层223与第三薄膜封装层26完全相同。Further, the package structure 220 includes a first encapsulation layer 221, a second encapsulation layer 222 disposed on the first encapsulation layer 221, and a third encapsulation layer 223 disposed on the second encapsulation layer 222. The first encapsulation layer 221 is formed by using silicon nitride, and the thickness of the first encapsulation layer 221 is the same as the thickness of the first thin film encapsulation layer 24, that is, the first encapsulation layer 221 is identical to the first thin film encapsulation layer 24. The second encapsulation layer 222 is formed using an oxide of silicon, and the thickness of the second encapsulation layer 222 is the same as the thickness of the second thin film encapsulation layer 25, that is, the second encapsulation layer 222 is identical to the second thin film encapsulation layer 25. The third encapsulation layer 223 is formed using silicon nitride, and the thickness of the third encapsulation layer 223 is the same as the thickness of the third thin film encapsulation layer 26, that is, the third encapsulation layer 223 is identical to the third thin film encapsulation layer 26.
此外，在本实施例中，第一柔性基板210由聚萘二甲酸乙二醇酯(PEN)制作形成，但本发明并不限制于此。Further, in the present embodiment, the first flexible substrate 210 is formed of polyethylene naphthalate (PEN), but the present invention is not limited thereto.
进一步地，在本实施例中，第一柔性基板210的厚度根据力学计算确定，以此保证在相同弯折半径下封装结构220与柔性显示面板100的薄膜封装结构120的应力相同。Further, in the present embodiment, the thickness of the first flexible substrate 210 is determined according to mechanical calculations, thereby ensuring that the package structure 220 and the film package structure 120 of the flexible display panel 100 have the same stress at the same bending radius.
在本实施例中，将第一柔性基板210的厚度设置为46μm。图4示出了图3所示的等效结构的应力应变曲线图。在图4中，横坐标Strain表示应变，横坐标Stress表示应力，纵坐标Thickness表示各层厚度。In the present embodiment, the thickness of the first flexible substrate 210 is set to 46 μm. Fig. 4 is a graph showing the stress-strain curve of the equivalent structure shown in Fig. 3. In FIG. 4, the abscissa Strain represents strain, the abscissa Stress represents stress, and the ordinate Thickness represents thickness of each layer.
参照图4，当等效结构根据设定好的弯折程度(与柔性显示面板100具有相同的弯折程度)进行弯折时，最大应力位于封装结构220处。在图4中，封装结构220由TFE表示，TFE的最大应力σ＝1264Mpa，这与图2中的1258Mpa几乎相等。因此，本实施例的等效结构200可以替代柔性显示面板100进行弯折实验。Referring to FIG. 4, when the equivalent structure is bent according to the set degree of bending (having the same degree of bending as the flexible display panel 100), the maximum stress is located at the package structure 220. In FIG. 4, the package structure 220 is represented by TFE, and the maximum stress σ of the TFE is =1264 MPa, which is almost equal to 1258 MPa in FIG. Therefore, the equivalent structure 200 of the present embodiment can perform the bending experiment instead of the flexible display panel 100.
图5是根据本发明的另一实施例的用于替代柔性显示面板进行弯折实验的等效结构。Figure 5 is an equivalent structure for performing a bending experiment in place of a flexible display panel in accordance with another embodiment of the present invention.
参照图5，与图3所示的等效结构不同的是，根据本发明的另一实施例的等效结构200A还包括第二柔性基板230，该第二柔性基板230设置于第三封装层223上。Referring to FIG. 5, different from the equivalent structure shown in FIG. 3, the equivalent structure 200A according to another embodiment of the present invention further includes a second flexible substrate 230 disposed on the third encapsulation layer. 223.
在本实施例中，第二柔性基板230也由聚萘二甲酸乙二醇酯(PEN)制作形成，但本发明并不限制于此。In the present embodiment, the second flexible substrate 230 is also formed of polyethylene naphthalate (PEN), but the invention is not limited thereto.
进一步地，在本实施例中，第一柔性基板210和第二柔性基板230的厚度根据力学计算确定，以此保证在相同弯折半径下封装结构220与柔性显示面板100的薄膜封装结构120的应力相同。Further, in the embodiment, the thicknesses of the first flexible substrate 210 and the second flexible substrate 230 are determined according to mechanical calculations, thereby ensuring the package structure 220 and the thin film encapsulation structure 120 of the flexible display panel 100 at the same bending radius. The stress is the same.
图6是图5所示的等效结构的第二柔性基板的厚度与封装结构的应力的关系曲线图。在图6中，横坐标表示第二柔性基板230的厚度，纵坐标表示封装结构220的应力。Fig. 6 is a graph showing the relationship between the thickness of the second flexible substrate of the equivalent structure shown in Fig. 5 and the stress of the package structure. In FIG. 6, the abscissa indicates the thickness of the second flexible substrate 230, and the ordinate indicates the stress of the package structure 220.
参照图6，第二柔性基板230的厚度与封装结构220的应力成线性关系，并且呈正相关关系。Referring to FIG. 6, the thickness of the second flexible substrate 230 is linear with the stress of the package structure 220, and is in a positive correlation.
在本实施例中，将第一柔性基板210的厚度设置为50μm，将第二柔性基板230的厚度设置为84.5μm。图7示出了图5所示的等效结构的应力应变曲线图。在图7中，横坐标Strain表示应变，横坐标Stress表示应力，纵坐标Thickness表示各层厚度。In the present embodiment, the thickness of the first flexible substrate 210 is set to 50 μm, and the thickness of the second flexible substrate 230 is set to 84.5 μm. Fig. 7 is a graph showing the stress-strain curve of the equivalent structure shown in Fig. 5. In Fig. 7, the abscissa Strain represents strain, the abscissa Stress represents stress, and the ordinate Thickness represents thickness of each layer.
参照图7，当等效结构根据设定好的弯折程度(与柔性显示面板100具有相同的弯折程度)进行弯折时，最大应力位于封装结构220处。在图7中，封装结构220由TFE表示，TFE的最大应力σ＝1253Mpa，这与图2中的1258Mpa几乎相等。因此，本实施例的等效结构200A可以替代柔性显示面板100进行弯折实验。Referring to FIG. 7, when the equivalent structure is bent according to the set degree of bending (having the same degree of bending as the flexible display panel 100), the maximum stress is located at the package structure 220. In FIG. 7, the package structure 220 is represented by TFE, and the maximum stress of the TFE is σ=1253 MPa, which is almost equal to 1258 MPa in FIG. Therefore, the equivalent structure 200A of the present embodiment can perform the bending experiment instead of the flexible display panel 100.
此外，在本实施例中，还可以将第一柔性基板210的厚度设置为100μm，将第二柔性基板230的厚度设置为130μm。图8示出了图5所示的等效结构的应力应变曲线图。在图8中，横坐标Strain表示应变，横坐标Stress表示应力，纵坐标Thickness表示各层厚度。Further, in the present embodiment, the thickness of the first flexible substrate 210 may be set to 100 μm, and the thickness of the second flexible substrate 230 may be set to 130 μm. Fig. 8 is a graph showing the stress-strain curve of the equivalent structure shown in Fig. 5. In Fig. 8, the abscissa Strain represents strain, the abscissa Stress represents stress, and the ordinate Thickness represents thickness of each layer.
参照图8，当等效结构根据设定好的弯折程度(与柔性显示面板100具有相同的弯折程度)进行弯折时，最大应力位于封装结构220处。在图8中，封装结构220由TFE表示，TFE的最大应力σ＝1261Mpa，这与图2中的1258Mpa几乎相等。因此，本实施例的等效结构200A可以替代柔性显示面板100进行弯折实验。Referring to FIG. 8, when the equivalent structure is bent according to the set degree of bending (having the same degree of bending as the flexible display panel 100), the maximum stress is located at the package structure 220. In FIG. 8, the package structure 220 is represented by TFE, and the maximum stress of the TFE is σ=1261 MPa, which is almost equal to 1258 MPa in FIG. Therefore, the equivalent structure 200A of the present embodiment can perform the bending experiment instead of the flexible display panel 100.
此外，由上可知，当第一柔性基板210的厚度增加时，为了保持封装结构220的最大应力与柔性显示面板100的薄膜封装结构120的最大应力相当，第二柔性基板230的厚度也需要增加，但本发明并不限制于此。In addition, it can be seen from the above that when the thickness of the first flexible substrate 210 is increased, in order to keep the maximum stress of the package structure 220 equivalent to the maximum stress of the thin film package structure 120 of the flexible display panel 100, the thickness of the second flexible substrate 230 also needs to be increased. However, the invention is not limited thereto.
综上所述，根据本发明的实施例，提出了一种用于替代柔性显示面板进行弯折实验的等效结构，用该等效结构进行弯折实验就能判断出完整的柔性显示面板是否满足力学性能要求，如此不必等到获得完整的柔性显示面板就能进行快速的实验验证，加快产品开发周期，节省成本。In summary, according to an embodiment of the present invention, an equivalent structure for performing a bending experiment instead of a flexible display panel is proposed, and the bending experiment can be used to determine whether the complete flexible display panel is Meet the mechanical performance requirements, so you don't have to wait until you get a complete flexible display panel to perform rapid experimental verification, speed up the product development cycle, and save costs.
虽然已经参照特定实施例示出并描述了本发明，但是本领域的技术人员将理解：在不脱离由权利要求及其等同物限定的本发明的精神和范围的情况下，可在此进行形式和细节上的各种变化。While the invention has been shown and described with respect to the specific embodiments the embodiments of the invention Various changes in details.
Claims (11)
- 一种用于替代柔性显示面板进行弯折实验的等效结构，其中，所述等效结构包括：An equivalent structure for performing a bending experiment in place of a flexible display panel, wherein the equivalent structure includes:第一柔性基板；a first flexible substrate;封装结构，设置于所述第一柔性基板上，所述封装结构与柔性显示面板的封装结构完全相同；a package structure disposed on the first flexible substrate, the package structure being identical to a package structure of the flexible display panel;其中，所述第一柔性基板的厚度能够确保在相同弯折半径下所述封装结构与所述柔性显示面板的封装结构的应力相同。Wherein, the thickness of the first flexible substrate can ensure that the package structure has the same stress as the package structure of the flexible display panel at the same bending radius.
- 根据权利要求1所述的等效结构，其中，所述第一柔性基板由聚萘二甲酸乙二醇酯制作形成。The equivalent structure according to claim 1, wherein said first flexible substrate is formed of polyethylene naphthalate.
- 根据权利要求1所述的等效结构，其中，所述等效结构的封装结构包括：The equivalent structure according to claim 1, wherein the package structure of the equivalent structure comprises:第一封装层，设置于所述第一柔性基板上，所述第一封装层与柔性显示面板的封装结构的第一薄膜封装层完全相同；a first encapsulation layer disposed on the first flexible substrate, the first encapsulation layer being identical to the first thin film encapsulation layer of the package structure of the flexible display panel;第二封装层，设置于所述第一封装层上，所述第二封装层与柔性显示面板的封装结构的第二薄膜封装层完全相同；a second encapsulation layer disposed on the first encapsulation layer, the second encapsulation layer being identical to the second thin film encapsulation layer of the package structure of the flexible display panel;第三封装层，设置于所述第二封装层上，所述第三封装层与柔性显示面板的封装结构的第三薄膜封装层完全相同。The third encapsulation layer is disposed on the second encapsulation layer, and the third encapsulation layer is identical to the third thin film encapsulation layer of the package structure of the flexible display panel.
- 根据权利要求3所述的等效结构，其中，所述第一封装层和所述第三封装层由硅的氮化物制作形成，所述第二封装层由硅的氧化物制作形成。The equivalent structure according to claim 3, wherein said first encapsulation layer and said third encapsulation layer are formed of a nitride of silicon, and said second encapsulation layer is formed of an oxide of silicon.
- 一种用于替代柔性显示面板进行弯折实验的等效结构，其中，所述等效结构包括：An equivalent structure for performing a bending experiment in place of a flexible display panel, wherein the equivalent structure includes:第一柔性基板；a first flexible substrate;封装结构，设置于所述第一柔性基板上，所述封装结构与柔性显示面板的封装结构完全相同；a package structure disposed on the first flexible substrate, the package structure being identical to a package structure of the flexible display panel;第二柔性基板，设置于所述封装结构上；a second flexible substrate disposed on the package structure;其中，所述第一柔性基板和所述第二柔性基板的厚度能够确保在相同弯折半径下所述封装结构与所述柔性显示面板的封装结构的应力相同。Wherein, the thicknesses of the first flexible substrate and the second flexible substrate can ensure that the package structure has the same stress as the package structure of the flexible display panel at the same bending radius.
- 根据权利要求5所述的等效结构，其中，所述第二柔性基板的厚度与所述封装结构的应力成线性关系。The equivalent structure of claim 5 wherein the thickness of the second flexible substrate is linear with the stress of the package structure.
- 根据权利要求5所述的等效结构，其中，所述第二柔性基板的厚度随着所述第一柔性基板的厚度的增加而增加。The equivalent structure according to claim 5, wherein the thickness of the second flexible substrate increases as the thickness of the first flexible substrate increases.
- 根据权利要求6所述的等效结构，其中，所述第二柔性基板的厚度随着所述第一柔性基板的厚度的增加而增加。The equivalent structure according to claim 6, wherein the thickness of the second flexible substrate increases as the thickness of the first flexible substrate increases.
- 根据权利要求5所述的等效结构，其中，所述第一柔性基板和所述第二柔性基板均由聚萘二甲酸乙二醇酯制作形成。The equivalent structure according to claim 5, wherein the first flexible substrate and the second flexible substrate are each formed of polyethylene naphthalate.
- 根据权利要求5所述的等效结构，其中，所述等效结构的封装结构包括：The equivalent structure according to claim 5, wherein the package structure of the equivalent structure comprises:第一封装层，设置于所述第一柔性基板上，所述第一封装层与柔性显示面板的封装结构的第一薄膜封装层完全相同；a first encapsulation layer disposed on the first flexible substrate, the first encapsulation layer being identical to the first thin film encapsulation layer of the package structure of the flexible display panel;第二封装层，设置于所述第一封装层上，所述第二封装层与柔性显示面板的封装结构的第二薄膜封装层完全相同；a second encapsulation layer disposed on the first encapsulation layer, the second encapsulation layer being identical to the second thin film encapsulation layer of the package structure of the flexible display panel;第三封装层，设置于所述第二封装层上，所述第三封装层与柔性显示面板的封装结构的第三薄膜封装层完全相同，所述第二柔性基板设置于所述第三封装层上。a third encapsulation layer disposed on the second encapsulation layer, the third encapsulation layer being identical to the third thin film encapsulation layer of the package structure of the flexible display panel, wherein the second flexible substrate is disposed in the third package On the floor.
- 根据权利要求10所述的等效结构，其中，所述第一封装层和所述第三封装层由硅的氮化物制作形成，所述第二封装层由硅的氧化物制作形成。The equivalent structure according to claim 10, wherein said first encapsulation layer and said third encapsulation layer are formed of a nitride of silicon, and said second encapsulation layer is formed of an oxide of silicon.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711182983.5A CN107991166A (en) | 2017-11-23 | 2017-11-23 | The equivalent structure of bending experiment is carried out for substituting flexible display panels |
| CN201711182983.5 | 2017-11-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2019100580A1 true WO2019100580A1 (en) | 2019-05-31 |
Family
ID=62032915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2018/073483 WO2019100580A1 (en) | 2017-11-23 | 2018-01-19 | Equivalent structure for bending experiment instead of flexible display panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107991166A (en) |
| WO (1) | WO2019100580A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112309257B (en) * | 2020-10-30 | 2022-07-12 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and flexible display device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140052305A (en) * | 2012-10-24 | 2014-05-07 | 서울과학기술대학교 산학협력단 | The apparatus of bending tester for flexible device |
| CN203858161U (en) * | 2014-05-30 | 2014-10-01 | 四川虹视显示技术有限公司 | OLED (Organic Light Emitting Diode) display screen testing device |
| CN205140985U (en) * | 2015-10-22 | 2016-04-06 | 信利（惠州）智能显示有限公司 | Flexible AMOLED display panel structure |
| CN106596078A (en) * | 2017-02-15 | 2017-04-26 | 华南理工大学 | OLED device bending test machine |
| CN106783660A (en) * | 2016-12-26 | 2017-05-31 | 武汉华星光电技术有限公司 | The bending test apparatus and bending method of testing of flexible display panels |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201285359Y (en) * | 2008-10-24 | 2009-08-05 | 中国科学院金属研究所 | Reliability in-situ evaluation system for thin film material on flexible electronic substrate |
| KR101712261B1 (en) * | 2015-03-24 | 2017-03-03 | 고려대학교 산학협력단 | Multi-layered electrode structure |
| KR20180121977A (en) * | 2016-03-29 | 2018-11-09 | 닛토덴코 가부시키가이샤 | Flexible polarizing film, manufacturing method thereof, and image display device |
| CN107068895B (en) * | 2016-12-28 | 2019-09-24 | 上海天马微电子有限公司 | Display panel and display thereof |
-
2017
- 2017-11-23 CN CN201711182983.5A patent/CN107991166A/en active Pending
-
2018
- 2018-01-19 WO PCT/CN2018/073483 patent/WO2019100580A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140052305A (en) * | 2012-10-24 | 2014-05-07 | 서울과학기술대학교 산학협력단 | The apparatus of bending tester for flexible device |
| CN203858161U (en) * | 2014-05-30 | 2014-10-01 | 四川虹视显示技术有限公司 | OLED (Organic Light Emitting Diode) display screen testing device |
| CN205140985U (en) * | 2015-10-22 | 2016-04-06 | 信利（惠州）智能显示有限公司 | Flexible AMOLED display panel structure |
| CN106783660A (en) * | 2016-12-26 | 2017-05-31 | 武汉华星光电技术有限公司 | The bending test apparatus and bending method of testing of flexible display panels |
| CN106596078A (en) * | 2017-02-15 | 2017-04-26 | 华南理工大学 | OLED device bending test machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107991166A (en) | 2018-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10297647B2 (en) | Circular polarizer for an organic light emitting diode | |
| Park et al. | Stretchable, transparent zinc oxide thin film transistors | |
| US10553815B2 (en) | Organic light emission display device and encapsulation method therefor | |
| US9768196B2 (en) | Flexible display apparatus, flexible display motherboard and method for manufacturing flexible display motherboard | |
| Garner et al. | Ultra-slim flexible glass for roll-to-roll electronic device fabrication | |
| US7671364B2 (en) | Thin film transistor substrate for display unit | |
| TW201448314A (en) | Display apparatus having improved bending properties and method of manufacturing same | |
| WO2020056867A1 (en) | Flexible display panel and preparing method therefor | |
| KR102463601B1 (en) | Organic light emitting display device | |
| CN104681579B (en) | Organic light-emitting display device and its manufacturing method | |
| US11258038B2 (en) | Flexible organic light-emitting diode (OLED) device of reduced stess at bending place and fabrication method thereof | |
| WO2016086616A1 (en) | Display substrate and manufacturing method therefor, and display device | |
| MX2021007940A (en) | Thin film encapsulation structure and display panel. | |
| US20210181877A1 (en) | Touch display assembly and method for manufacturing same | |
| CN106784384A (en) | Flexible display and preparation method thereof | |
| WO2019100580A1 (en) | Equivalent structure for bending experiment instead of flexible display panel | |
| WO2020103610A1 (en) | Display panel and fabrication method therefor, and display device | |
| US9399336B2 (en) | Gas barrier substrate | |
| TW201933301A (en) | Flexible display and method of fabricating the same | |
| WO2020118905A1 (en) | Method for manufacturing composite film, and display device | |
| US20190097173A1 (en) | OLED Packaging Structure and Manufacturing Method Thereof | |
| US10978679B2 (en) | Method of manufacturing composite film layer and display device | |
| Ko et al. | Ultrathin, Flexible, and Transparent Oxide Thin‐Film Transistors by Delamination and Transfer Methods for Deformable Displays | |
| US20240023421A1 (en) | Display panel and manufacturing method thereof | |
| Fu et al. | Characterizing mechanical behaviors of a flexible AMOLED during the debonding process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18880327 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 18880327 Country of ref document: EP Kind code of ref document: A1 |