WO2019100410A1 - 柔性oled显示面板的制备方法 - Google Patents

柔性oled显示面板的制备方法 Download PDF

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WO2019100410A1
WO2019100410A1 PCT/CN2017/113223 CN2017113223W WO2019100410A1 WO 2019100410 A1 WO2019100410 A1 WO 2019100410A1 CN 2017113223 W CN2017113223 W CN 2017113223W WO 2019100410 A1 WO2019100410 A1 WO 2019100410A1
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flexible oled
oled display
display panel
flexible
substrate
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PCT/CN2017/113223
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English (en)
French (fr)
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蔡孟起
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武汉华星光电半导体显示技术有限公司
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Priority to US15/579,229 priority Critical patent/US20190386066A1/en
Publication of WO2019100410A1 publication Critical patent/WO2019100410A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method for fabricating a flexible OLED display panel.
  • OLED display panels have the advantages of self-luminous, high contrast, thin thickness, wide viewing angle and fast response speed. They are representative of the new generation of flat display technology and are increasingly being accepted by the industry. Admired.
  • a flexible OLED display panel is one of the important development trends.
  • a flexible OLED display panel includes a flexible substrate and an OLED display unit formed on the flexible substrate, and the OLED display unit includes a film sequentially formed on the flexible substrate. a transistor array layer, an anode layer, an organic light emitting layer, a cathode layer, and an encapsulation layer.
  • the flexible OLED display panel not only can be thinner and lighter in volume, but also can reduce power consumption, thereby helping to improve the endurance of the corresponding product. At the same time, due to the flexibility and flexibility of the flexible OLED display panel, it is also more durable than ordinary hard display panels. Flexible OLED display panels can be widely used in various products with display functions, such as tablet computers, televisions, mobile terminals, and various types of wearable devices.
  • the flexible OLED display panel has its own drawbacks while bringing a series of advantages. Due to the flexibility and thermal expansion of the flexible substrate, the processing of the display device is inconvenient, and the substrate is prone to sag, or even wrinkles or breaks. It is difficult to accurately carry out the subsequent film preparation process. In order to solve this problem, it is necessary to connect a flexible substrate to a rigid substrate such as a glass substrate to support and fix the flexible substrate to facilitate film formation. After the layers of the display panel are formed on the flexible substrate, the rigid substrate is peeled off from the flexible substrate by a lift-off process, thereby completing the preparation work of the flexible display panel.
  • the current mainstream flexible OLED display panel manufacturing method includes the following steps:
  • a glass substrate is used as a carrier, and a polyimide (PI) film is coated on the entire surface of the glass substrate to cure the PI film, and the PI film serves as a flexible substrate.
  • PI polyimide
  • the glass substrate and the flexible OLED display mother board are divided into split pieces to form a single flexible OLED display panel.
  • a laser lift off (LLO) process is used to separate the PI film from the glass substrate, thereby obtaining a flexible OLED display panel.
  • a laser cutting device is used for the cutting process of step three.
  • Laser cutting equipment is known to be relatively expensive and the cost of using the equipment is also high.
  • the laser cutting process also needs to cut the glass substrate, which not only consumes labor and materials, but also increases the loss and the use cost of the laser cutting equipment.
  • the present invention provides a method for preparing a flexible OLED display panel for improving production efficiency and reducing production cost.
  • a method for preparing a flexible OLED display panel comprising:
  • the flexible OLED mother board comprising a plurality of flexible OLED display panels spaced apart from each other;
  • each of the flexible OLED display panels is provided with a light transmissive unit
  • the supporting substrate is irradiated from the reticle by using a laser, and a separation region is formed corresponding to the transparent unit at a connection interface between the flexible OLED mother board and the supporting substrate, and the flexible OLED display panel is located In the separation region;
  • the flexible OLED motherboard is cut along an inner edge of the separation region by a laser cutting process, and the plurality of flexible OLED display panels are peeled off from the support substrate.
  • the step of preparing a flexible OLED mother substrate on the second surface of the support substrate comprises: applying a coating process to prepare a flexible substrate on the second surface of the support substrate;
  • the flexible substrate prepares a plurality of OLED display units spaced apart from each other.
  • the material of the flexible substrate is polyimide, polycarbonate, polyether sulfone, polyethylene terephthalate, polyethylene naphthalate, polyarylate or glass fiber reinforced plastic.
  • the OLED display unit comprises a thin film crystal array layer, an anode layer, an organic light emitting layer and a cathode layer which are sequentially formed on the flexible substrate.
  • the plurality of flexible OLED display panels are of the same size and arranged in a regular array in the flexible OLED motherboard, the light transmissive unit in the mask and the plurality of flexible OLED displays The one-to-one correspondence of the panels, the projection of the light transmissive unit on the flexible OLED motherboard completely covers the corresponding flexible OLED display panel.
  • the plurality of flexible OLED display panels include flexible OLED display panels of various sizes, and the light transmissive unit in the mask has a one-to-one correspondence with the plurality of flexible OLED display panels.
  • the projection on the flexible OLED motherboard completely covers the corresponding flexible OLED display panel.
  • a plurality of criss-crossing cutting lines are disposed on the flexible OLED mother board, the cutting lines are disposed between an inner edge of the separation region and an outer edge of the flexible OLED display panel; The cutting line cuts the flexible OLED mother board, and the plurality of flexible OLED display panels are peeled off from the support substrate.
  • the distance between the outer edge of the flexible OLED display panel and the inner edge of the separation region is 1 to 2 mm, and the distance between the cutting line and the inner edge of the separation region is 0 to 1 mm.
  • the distance between the cutting line and the inner edge of the separation region is 0.5 to 1 mm.
  • the support substrate is a glass substrate
  • the mask plate is a mask plate made of aluminum alloy material.
  • the method for preparing a flexible OLED display panel provided by the embodiment of the present invention firstly provides a mask plate on the back surface of the support substrate and performs a laser lift-off process (LLO), so that the connection interface between the flexible OLED mother board and the support substrate forms a corresponding flexibility.
  • LLO laser lift-off process
  • the cutting substrate is not required to be cut, which not only avoids more labor and materials, but also reduces the loss and the use cost of the laser cutting device, thereby improving the generation efficiency of the flexible OLED display panel and reducing the efficiency. Cost of production.
  • FIG. 1 is a process flow diagram of a method for fabricating a flexible OLED display panel according to an embodiment of the present invention
  • 2a-2g are exemplary illustrations of device structures obtained in accordance with various steps in a method of fabricating a flexible OLED display panel according to an embodiment of the present invention.
  • the embodiment provides a method for preparing a flexible OLED display panel. Specifically, referring to FIG. 1 and FIGS. 2a to 2d, the preparation method includes the following steps:
  • a support substrate 1 is provided, and a flexible OLED mother board 2 is formed on the second surface 1b of the support substrate 1, the flexible OLED mother board 2 comprising a plurality of flexible layers arranged at intervals OLED display panel 20.
  • the step specifically includes: firstly forming a flexible substrate 21 on the second surface 1b of the support substrate 1 by applying a coating process, and then preparing a plurality of OLED display units 22 spaced apart from each other on the flexible substrate, This results in a flexible OLED motherboard 2 comprising a plurality of flexible OLED display panels 20 spaced apart from one another.
  • the OLED display unit 22 exemplarily shows a cross-sectional view of one of the flexible OLED display panels 20 including a flexible substrate 21 and an OLED display unit 22 formed on the flexible substrate 21,
  • the OLED display unit 22 further includes a thin film crystal array layer 221, an anode layer 222, an organic light emitting layer 223, a cathode layer 224, and the like which are sequentially formed on the flexible substrate 21.
  • the thin film transistor array layer 221 is provided with a respective structural film layer such as a thin film transistor, a data line, and a scanning line.
  • the organic light-emitting layer 223 includes a hole transport layer (HTL) formed by an organic material, an espressive layer (EML), and an electron transport layer (ETL). Wait.
  • the specific preparation method of each functional film layer of the OLED display unit 20 can be performed by any one of the process techniques known in the art.
  • the support substrate 1 is a glass substrate, and the material of the flexible substrate 21 is polyimide, polycarbonate, polyether sulfone, polyethylene terephthalate, polyethylene naphthalate. Ester, polyarylate or glass fiber reinforced plastic.
  • the plurality of flexible OLED display panels 20 are of the same size and arranged in a regular array in the flexible OLED motherboard 2, which can reduce the process difficulty.
  • the plurality of flexible OLED display panels 20 may also be flexible OLED display panels 20 including a plurality of sizes, so that flexible OLED display panels 20 of various sizes can be simultaneously prepared.
  • a mask plate 3 is disposed on the first surface 1a of the support substrate 1 opposite to the second surface 1b, and each of the masks 3 corresponds to each of the flexible OLED display panels 20
  • a light transmitting unit 30 is provided.
  • the light transmissive unit 30 in the reticle 3 is in one-to-one correspondence with the plurality of flexible OLED display panels 20, and the projection of the light transmissive unit 30 on the flexible OLED mother board 2 completely covers the corresponding Flexible OLED display panel 20. It should be noted that, in order to clearly show the correspondence relationship between the light transmitting unit 30 and the flexible OLED display panel 20, a part of the flexible OLED display panel 20 is shown in a perspective view in FIG. 2c.
  • the mask plate 3 can be selected as a mask of aluminum alloy material.
  • the specific structure of the mask 3 needs to be specifically designed according to the size and arrangement of the flexible OLED display panel 20 on the flexible OLED motherboard 2.
  • the step is to apply a laser lift-off process (LLO) such that the support substrate 1 and the flexible substrate 21 in the region irradiated by the laser are separated from each other, that is, in the separation region 40, the support substrate 1 and The flexible substrates 21 are separated from each other.
  • LLO laser lift-off process
  • the size of the separation area 40 is the same as the size of the transparent unit 30. Therefore, the mask 3 is specifically designed according to the size and arrangement of the flexible OLED display panel 20. The size and arrangement of the light transmitting unit 30 in the medium can then control the distance between the outer edge of the flexible OLED display panel 20 and the inner edge of the separation region 40.
  • a plurality of criss-crossing cutting lines Lx, Ly are first disposed on the flexible OLED mother board 2, and the cutting lines Lx, Ly are disposed on the inner edge of the separation region 40. Between the outer edge of the flexible OLED display panel 20. The flexible OLED mother board 2 is then cut along the cutting lines Lx, Ly by applying a laser cutting process, thereby peeling off the plurality of flexible OLED display panels 20 from the support substrate 1.
  • the distance D1 between the outer edge of the flexible OLED display panel 20 and the inner edge of the separation region 40 is set within a range of 1 to 2 mm, and the cutting The pitch D2 between the lines Lx, Ly and the inner edge of the separation region 40 is set in the range of 0 to 1 mm. More preferably, D2 is set in the range of 0.5 to 1 mm.
  • a mask is disposed on the back surface of the support substrate and a laser lift-off process (LLO) is performed, so that a connection interface of the flexible OLED mother board and the support substrate is formed corresponding to each flexible OLED.
  • LLO laser lift-off process
  • the preparation method of the embodiment of the invention does not need to perform cutting lobes on the support substrate (glass substrate), which has the following advantages:
  • the support substrate Since the support substrate is not required to be cut, the support substrate can be reused to reduce the material cost.
  • the method for preparing a flexible OLED display panel provided by the embodiment of the present invention can improve the generation efficiency of the flexible OLED display panel and reduce the production cost.

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Abstract

本发明公开了一种柔性OLED显示面板的制备方法，包括：提供支撑基板，在所述支撑基板的第二表面上制备形成柔性OLED母板，所述柔性OLED母板包括多个相互间隔排布的柔性OLED显示面板；在所述支撑基板的与所述第二表面相对的第一表面上设置掩膜版，所述掩膜版中对应每一个所述柔性OLED显示面板设置有一个透光单元；采用激光从所述掩膜版上对所述支撑基板进行照射，在所述柔性OLED母板和所述支撑基板的连接界面、对应所述透光单元形成分离区域，所述柔性OLED显示面板位于所述分离区域中；沿所述分离区域的内侧边缘、应用激光切割工艺切断所述柔性OLED母板，从所述支撑基板上将所述多个柔性OLED显示面板剥离。

Description

柔性OLED显示面板的制备方法 技术领域
本发明涉及显示技术领域,尤其涉及一种柔性OLED显示面板的制备方法。
背景技术
有机电致发光二极管(Organic light-emitting diodes，OLED)显示面板具备自发光、对比度高、厚度薄、视角广和反应速度快等优点，是新一代平面显示技术的代表，越来越受到业界的推崇。柔性OLED显示面板是其中的一个重要发展趋势，通常地，柔性OLED显示面板包括柔性基底和形成在所述柔性基底上的OLED显示单元，所述OLED显示单元包括依次形成在所述柔性基底上薄膜晶体管阵列层、阳极层、有机发光层、阴极层和封装层。
柔性OLED显示面板不仅能够在体积上更加轻薄，而且能够降低功耗，从而有助于提升相应产品的续航能力。同时，由于柔性OLED显示面板的可弯曲性和柔韧性，其耐用程度也高于普通硬质显示面板。柔性OLED显示面板可广泛应用于各种带显示功能的产品中，例如可以应用于平板电脑、电视、移动终端和各类可穿戴式设备中。
柔性OLED显示面板在带来一系列优点的同时也具有其本身的缺陷，由于柔性基板具有挠性和热膨胀性等问题，给显示器件的加工带来不便，容易出现基板下垂，甚至产生褶皱或断裂，很难精准的进行后续膜层的制备工序。为了解决该问题，需要将柔性基板连接于刚性的基板如玻璃基板上，用以支撑和固定柔性基板以利于薄膜的形成。在柔性基板上制备形成显示面板的各层元件之后，再通过剥离工艺，将刚性基板从柔性基板上剥离开来，从而完成柔性显示面板的制备工作。
目前主流的柔性OLED显示面板的制作方法包括以下步骤：
一、以玻璃基板为载体，在整面玻璃基板上涂布一层聚酰亚胺(PI)膜，对PI膜进行固化，PI膜充当柔性基板。
二、从PI膜往上依次制作薄膜晶体管阵列层、阳极层、有机发光层、阴极 层和封装层，如此即制得柔性OLED显示母板。
三、应用切割工艺，将玻璃基板以及柔性OLED显示母板分割裂片形成单片的柔性OLED显示面板。
四、针对各个单片的柔性OLED显示面板，应用激光剥离(Laser lift off，LLO)工艺将PI膜与玻璃基板分离，即得到柔性OLED显示面板。
以上的工艺步骤中，对于步骤三的切割工艺，为了可以将柔性OLED显示母板进行精确的切割，通过是使用激光切割设备。众所周知，激光切割设备是比较昂贵的并且设备的使用成本也较高。而在以上的步骤三中，在进行激光切割工艺时还需要对玻璃基板进行切割，不仅耗费了工时和材料，也增加了激光切割设备的损耗和使用成本。
因此，现有技术还有待于改进和发展。
发明内容
鉴于现有技术的不足，本发明提供了一种柔性OLED显示面板的制备方法，用于提高生成效率并降低生产成本。
为了实现上述目的，本发明采用了如下的技术方案：
一种柔性OLED显示面板的制备方法，其中，包括：
提供支撑基板，在所述支撑基板的第二表面上制备形成柔性OLED母板，所述柔性OLED母板包括多个相互间隔排布的柔性OLED显示面板；
在所述支撑基板的与所述第二表面相对的第一表面上设置掩膜版，所述掩膜版中对应每一个所述柔性OLED显示面板设置有一个透光单元；
采用激光从所述掩膜版上对所述支撑基板进行照射，在所述柔性OLED母板和所述支撑基板的连接界面、对应所述透光单元形成分离区域，所述柔性OLED显示面板位于所述分离区域中；
沿所述分离区域的内侧边缘、应用激光切割工艺切断所述柔性OLED母板，从所述支撑基板上将所述多个柔性OLED显示面板剥离。
其中，在所述支撑基板的第二表面上制备形成柔性OLED母板的步骤具体包括：应用涂布工艺，在所述支撑基板的第二表面上制备形成柔性衬底；在所 述柔性衬底制备多个相互间隔排布的OLED显示单元。
其中，所述柔性衬底的材料为聚酰亚胺、聚碳酸酯、聚醚砜、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物或玻璃纤维增强塑料。
其中，所述OLED显示单元包括依次形成在所述柔性衬底上薄膜晶体阵列层、阳极层、有机发光层和阴极层。
其中，所述多个柔性OLED显示面板为同一种规格尺寸、并且在所述柔性OLED母板中呈规则的阵列排布，所述掩膜版中的透光单元与所述多个柔性OLED显示面板一一对应，所述透光单元在所述柔性OLED母板上的投影完全覆盖对应的柔性OLED显示面板。
其中，所述多个柔性OLED显示面板包括多种规格尺寸柔性OLED显示面板，所述掩膜版中的透光单元与所述多个柔性OLED显示面板一一对应，所述透光单元在所述柔性OLED母板上的投影完全覆盖对应的柔性OLED显示面板。
其中，在所述柔性OLED母板上设置多个纵横交错的切割线，所述切割线布置于所述分离区域的内侧边缘与所述柔性OLED显示面板的外侧边缘之间；应用激光切割工艺沿着所述切割线切断所述柔性OLED母板，从所述支撑基板上将所述多个柔性OLED显示面板剥离。
其中，所述柔性OLED显示面板的外侧边缘与所述分离区域的内侧边缘的间距为1～2mm，所述切割线与所述分离区域的内侧边缘的间距为0～1mm。
其中，所述切割线与所述分离区域的内侧边缘的间距为0.5～1mm。
其中，所述支撑基板为玻璃基板，所述掩膜版为铝合金材质的掩膜版。
本发明实施例提供的柔性OLED显示面板的制备方法，首先是在支撑基板的背面设置掩膜版并进行激光剥离工艺(LLO)，使得柔性OLED母板和支撑基板的连接界面形成对应每一个柔性OLED显示面板的分离区域；然后沿分离区域的内侧边缘、应用激光切割工艺切断柔性OLED母板，从支撑基板上将多个柔性OLED显示面板剥离。该制备方法中不需要对支撑基板进行切割裂片，不仅避免了耗费更多的工时和材料，也降低了激光切割设备的损耗和使用成本，由此提高了柔性OLED显示面板的生成效率，降低了生产成本。
附图说明
图1是本发明实施例提供的柔性OLED显示面板的制备方法的工艺流程图；
图2a～2g是本发明实施例提供柔性OLED显示面板的制备方法中，各个步骤对应获得的器件结构的示例性图示。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面结合附图对本发明的具体实施方式进行详细说明。这些优选实施方式的示例在附图中进行了例示。附图中所示和根据附图描述的本发明的实施方式仅仅是示例性的，并且本发明并不限于这些实施方式。
在此，还需要说明的是，为了避免因不必要的细节而模糊了本发明，在附图中仅仅示出了与根据本发明的方案密切相关的结构和/或处理步骤，而省略了与本发明关系不大的其他细节。
本实施例提供了一种柔性OLED显示面板的制备方法，具体地，参阅图1以及图2a～2d，所述制备方法包括步骤：
S101、参阅图2a和图2b，提供支撑基板1，在所述支撑基板1的第二表面1b上制备形成柔性OLED母板2，所述柔性OLED母板2包括多个相互间隔排布的柔性OLED显示面板20。该步骤具体包括：首先应用涂布工艺在所述支撑基板1的第二表面1b上制备形成柔性衬底21，然后在所述柔性衬底制备多个相互间隔排布的OLED显示单元22，由此获得包括多个相互间隔排布的柔性OLED显示面板20的柔性OLED母板2。
其中，图2b示例性地示出了其中一个柔性OLED显示面板20的剖面图，所述柔性OLED显示面板20包括柔性衬底21以及形成在所述柔性衬底21上的OLED显示单元22，所述OLED显示单元22又包括依次形成在所述柔性衬底21上薄膜晶体阵列层221、阳极层222、有机发光层223和阴极层224等。其中，所述薄膜晶体管阵列层221中设置有薄膜晶体管、数据线和扫描线等各个结构膜层。其中，所述有机发光层223则包括由有机材料制备形成的空穴传输功能层(Hole Transport Layer，HTL)、发光材料层(Emissive Layer，EML)以及电子传输功能层(Electron Transport Layer，ETL)等。所述OLED显示单元20的各个功能膜层的具体制备方法可以选择本领域中已知的任意一种工艺技术进行。
其中，所述支撑基板1为玻璃基板，所述柔性衬底21的材料为聚酰亚胺、聚碳酸酯、聚醚砜、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物或玻璃纤维增强塑料。
在本实施例中，如图2a所示，所述多个柔性OLED显示面板20为同一种规格尺寸、并且在所述柔性OLED母板2中呈规则的阵列排布，这样可以降低工艺难度。在另外的一些实施例中，所述多个柔性OLED显示面板20也可以是包括多种规格尺寸的柔性OLED显示面板20，这样可以同时制备获得多种规格尺寸的柔性OLED显示面板20。
S102、参阅图2c，在所述支撑基板1的与所述第二表面1b相对的第一表面1a上设置掩膜版3，所述掩膜版3中对应每一个所述柔性OLED显示面板20设置有一个透光单元30。具体地，所述掩膜版3中的透光单元30与所述多个柔性OLED显示面板20一一对应，所述透光单元30在所述柔性OLED母板2上的投影完全覆盖对应的柔性OLED显示面板20。需要说明的是，为了清楚地示出透光单元30与柔性OLED显示面板20的对应关系，图2c中采用透视视图示出了其中一部分柔性OLED显示面板20。
其中，所述掩膜版3可以选择为铝合金材质的掩膜版。所述掩膜版3的具体结构需要根据所述柔性OLED母板2上的柔性OLED显示面板20的规格尺寸以及排布结构来具体设计。
S103、参阅图2d，采用激光4从所述掩膜版3上对所述支撑基板1进行照射(如图2d中沿着X方向连续扫描照射)，在所述柔性OLED母板2和所述支撑基板1的连接界面、对应所述透光单元30形成分离区域40，所述柔性OLED显示面板20位于所述分离区域40中。具体地，该步骤是应用激光剥离工艺(LLO)使得被激光照射的区域中的支撑基板1和柔性衬底21相互分离，也就是说，在所述分离区域40中，所述支撑基板1和所述柔性衬底21是相互分离的。
其中，所述分离区域40的大小是与所述透光单元30的大小是相同的，因此，首先根据所述柔性OLED显示面板20的规格尺寸以及排布结构来具体设计所述掩膜版3中的透光单元30的规格尺寸以及排布结构，然后就可以控制所述柔性OLED显示面板20的外侧边缘与所述分离区域40的内侧边缘的间距。
S104、参阅图2e和图2f，沿所述分离区域40的内侧边缘、应用激光切割 工艺5切断所述柔性OLED母板2，从所述支撑基板1上将所述多个柔性OLED显示面板20剥离。
具体到本实施例中，参阅图2g，首先在所述柔性OLED母板2上设置多个纵横交错的切割线Lx、Ly，所述切割线Lx、Ly布置于所述分离区域40的内侧边缘与所述柔性OLED显示面板20的外侧边缘之间。然后应用激光切割工艺沿着所述切割线Lx、Ly切断所述柔性OLED母板2，由此从所述支撑基板1上将所述多个柔性OLED显示面板20剥离。
在较为优选的实施方案中，如图2g所示，所述柔性OLED显示面板20的外侧边缘与所述分离区域40的内侧边缘的间距D1设定在1～2mm的范围内，而所述切割线Lx、Ly与所述分离区域40的内侧边缘的间距D2设定在0～1mm的范围内。更为优选的是，D2设定在0.5～1mm的范围内。
如上实施例提供的柔性OLED显示面板的制备方法，首先是在支撑基板的背面设置掩膜版并进行激光剥离工艺(LLO)，使得柔性OLED母板和支撑基板的连接界面形成对应每一个柔性OLED显示面板的分离区域；然后沿分离区域的内侧边缘、应用激光切割工艺切断柔性OLED母板，从支撑基板上将多个柔性OLED显示面板剥离。相比于现有技术，本发明实施例的制备方法中不需要对支撑基板(玻璃基板)进行切割裂片，其具有以下的优点：
(1)、由于在使用激光切割设备对柔性OLED母板进行切割时，不需要切割支撑基板，避免了耗费更多的工时和材料，也降低了激光切割设备的损耗和使用成本。
(2)、通过设置掩膜版，使用一次激光剥离工艺同时对多个柔性OLED显示面板进行剥离，相比于现有技术中先切割裂片再分别进行激光剥离工艺，激光剥离工艺的工作效率得到提高，节省了生产工时。
(3)、由于不需要切割支撑基板，支撑基板可以重复使用，降低材料成本。
综上所述，本发明实施例提供的柔性OLED显示面板的制备方法，其可以提高柔性OLED显示面板的生成效率，降低了生产成本。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过 程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (18)

  1. 一种柔性OLED显示面板的制备方法，其中，包括：
    提供支撑基板，在所述支撑基板的第二表面上制备形成柔性OLED母板，所述柔性OLED母板包括多个相互间隔排布的柔性OLED显示面板；
    在所述支撑基板的与所述第二表面相对的第一表面上设置掩膜版，所述掩膜版中对应每一个所述柔性OLED显示面板设置有一个透光单元；
    采用激光从所述掩膜版上对所述支撑基板进行照射，在所述柔性OLED母板和所述支撑基板的连接界面、对应所述透光单元形成分离区域，所述柔性OLED显示面板位于所述分离区域中；
    沿所述分离区域的内侧边缘、应用激光切割工艺切断所述柔性OLED母板，从所述支撑基板上将所述多个柔性OLED显示面板剥离。
  2. 根据权利要求1所述的柔性OLED显示面板的制备方法，其中，在所述支撑基板的第二表面上制备形成柔性OLED母板的步骤具体包括：
    应用涂布工艺，在所述支撑基板的第二表面上制备形成柔性衬底；
    在所述柔性衬底制备多个相互间隔排布的OLED显示单元。
  3. 根据权利要求2所述的柔性OLED显示面板的制备方法，其中，所述柔性衬底的材料为聚酰亚胺、聚碳酸酯、聚醚砜、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物或玻璃纤维增强塑料。
  4. 根据权利要求2所述的柔性OLED显示面板的制备方法，其中，所述OLED显示单元包括依次形成在所述柔性衬底上薄膜晶体阵列层、阳极层、有机发光层和阴极层。
  5. 根据权利要求1所述的柔性OLED显示面板的制备方法，其中，所述多个柔性OLED显示面板为同一种规格尺寸、并且在所述柔性OLED母板中呈规则的阵列排布，所述掩膜版中的透光单元与所述多个柔性OLED显示面板一一对应，所述透光单元在所述柔性OLED母板上的投影完全覆盖对应的柔性OLED显示面板。
  6. 根据权利要求1所述的柔性OLED显示面板的制备方法，其中，所述多 个柔性OLED显示面板包括多种规格尺寸柔性OLED显示面板，所述掩膜版中的透光单元与所述多个柔性OLED显示面板一一对应，所述透光单元在所述柔性OLED母板上的投影完全覆盖对应的柔性OLED显示面板。
  7. 根据权利要求1所述的柔性OLED显示面板的制备方法，其中，所述支撑基板为玻璃基板。
  8. 根据权利要求1所述的柔性OLED显示面板的制备方法，其中，所述掩膜版为铝合金材质的掩膜版。
  9. 一种柔性OLED显示面板的制备方法，其中，包括：
    提供支撑基板，在所述支撑基板的第二表面上制备形成柔性OLED母板，所述柔性OLED母板包括多个相互间隔排布的柔性OLED显示面板；
    在所述支撑基板的与所述第二表面相对的第一表面上设置掩膜版，所述掩膜版中对应每一个所述柔性OLED显示面板设置有一个透光单元；
    采用激光从所述掩膜版上对所述支撑基板进行照射，在所述柔性OLED母板和所述支撑基板的连接界面、对应所述透光单元形成分离区域，所述柔性OLED显示面板位于所述分离区域中；
    在所述柔性OLED母板上设置多个纵横交错的切割线，所述切割线布置于所述分离区域的内侧边缘与所述柔性OLED显示面板的外侧边缘之间；
    应用激光切割工艺沿着所述切割线切断所述柔性OLED母板，从所述支撑基板上将所述多个柔性OLED显示面板剥离。
  10. 根据权利要求9所述的柔性OLED显示面板的制备方法，其中，所述柔性OLED显示面板的外侧边缘与所述分离区域的内侧边缘的间距为1～2mm，所述切割线与所述分离区域的内侧边缘的间距为0～1mm。
  11. 根据权利要求10所述的柔性OLED显示面板的制备方法，其中，所述切割线与所述分离区域的内侧边缘的间距为0.5～1mm。
  12. 根据权利要求9所述的柔性OLED显示面板的制备方法，其中，在所述支撑基板的第二表面上制备形成柔性OLED母板的步骤具体包括：
    应用涂布工艺，在所述支撑基板的第二表面上制备形成柔性衬底；
    在所述柔性衬底制备多个相互间隔排布的OLED显示单元。
  13. 根据权利要求12所述的柔性OLED显示面板的制备方法，其中，所述柔性衬底的材料为聚酰亚胺、聚碳酸酯、聚醚砜、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物或玻璃纤维增强塑料。
  14. 根据权利要求12所述的柔性OLED显示面板的制备方法，其中，所述OLED显示单元包括依次形成在所述柔性衬底上薄膜晶体阵列层、阳极层、有机发光层和阴极层。
  15. 根据权利要求9所述的柔性OLED显示面板的制备方法，其中，所述多个柔性OLED显示面板为同一种规格尺寸、并且在所述柔性OLED母板中呈规则的阵列排布，所述掩膜版中的透光单元与所述多个柔性OLED显示面板一一对应，所述透光单元在所述柔性OLED母板上的投影完全覆盖对应的柔性OLED显示面板。
  16. 根据权利要求9所述的柔性OLED显示面板的制备方法，其中，所述多个柔性OLED显示面板包括多种规格尺寸柔性OLED显示面板，所述掩膜版中的透光单元与所述多个柔性OLED显示面板一一对应，所述透光单元在所述柔性OLED母板上的投影完全覆盖对应的柔性OLED显示面板。
  17. 根据权利要求9所述的柔性OLED显示面板的制备方法，其中，所述支撑基板为玻璃基板。
  18. 根据权利要求9所述的柔性OLED显示面板的制备方法，其中，所述掩膜版为铝合金材质的掩膜版。
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