WO2019096224A1 - 电子设备的壳体及其制备方法和电子设备 - Google Patents

电子设备的壳体及其制备方法和电子设备 Download PDF

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Publication number
WO2019096224A1
WO2019096224A1 PCT/CN2018/115726 CN2018115726W WO2019096224A1 WO 2019096224 A1 WO2019096224 A1 WO 2019096224A1 CN 2018115726 W CN2018115726 W CN 2018115726W WO 2019096224 A1 WO2019096224 A1 WO 2019096224A1
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WO
WIPO (PCT)
Prior art keywords
glass cover
middle frame
housing
plastic member
coating
Prior art date
Application number
PCT/CN2018/115726
Other languages
English (en)
French (fr)
Inventor
王海霞
马兰
任鹏
孙剑
陈梁
Original Assignee
比亚迪股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 比亚迪股份有限公司 filed Critical 比亚迪股份有限公司
Publication of WO2019096224A1 publication Critical patent/WO2019096224A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers

Definitions

  • the present application relates to the field of materials engineering, and in particular to a housing of an electronic device, a method of manufacturing the same, and an electronic device.
  • the housing of an electronic device is required to have both aesthetic and durability advantages.
  • the outer casing of the existing electronic equipment for example, is molded by metal and plastic, and then bonded to the glass by means of dispensing, and has the defects of shielding signal, poor consistency of appearance and poor sealing.
  • the present application provides a housing for an electronic device, the housing including a glass cover and a ceramic middle frame, and the glass cover and the ceramic middle frame are integrally connected by injection molding plastic.
  • the shell structure is integrally connected by injection molding plastic.
  • the present application provides a housing for an electronic device, the housing comprising: a glass cover; and a ceramic middle frame having a plastic member between the glass cover and the ceramic middle frame.
  • the present application also provides a method of preparing a housing of an electronic device, comprising: forming a plastic member between a ceramic middle frame and a glass cover such that the glass cover and the ceramic middle frame are between Connected by the plastic piece.
  • the present application also provides a method for preparing a housing of an electronic device, the method comprising the steps of: mounting a ceramic middle frame and a glass cover in an injection mold and performing injection molding and molding using an injection molded plastic material, such that The glass cover body and the ceramic middle frame are connected by an injection molding plastic into an integrated housing structure.
  • the present application also provides a housing for an electronic device prepared according to the preparation method as described above.
  • the present application also provides an electronic device comprising a housing as described above and an electronic component mounted within the housing.
  • the housing provided by the present application avoids the shielding effect of the metal material in the conventional housing, so that there is no need to divide the metal in multiple places, which greatly improves the appearance aesthetic of the product; and solves the traditional housing.
  • the injection molding, and the CNC processing results in low brightness, and can not achieve the same effect as the mirror effect of the glass; further, the glass cover and the ceramic middle frame in the housing provided by the application are glued by plastic injection molding. Together, the bonding force is large, there is no step feeling, and the waterproofness is good.
  • the present application provides a housing for an electronic device, the housing including a glass cover and a ceramic middle frame, and a plastic member is disposed between the glass cover and the ceramic middle frame, that is, a glass cover and The ceramic middle frame is connected by an plastic member into an integrated housing structure.
  • the plastic member is disposed between the edge of the glass cover and the edge of the ceramic middle frame. That is to say, the edge of the glass cover and the edge of the ceramic middle frame are connected by an plastic member into an integrated housing structure.
  • the plastic part contains resin and glass fiber.
  • the addition of glass fiber can prevent the plastic from shrinking too much and cause deformation of the product. That is, the addition of glass fiber (glass fiber) can reduce the shrinkage rate of the plastic part.
  • the resin is contained in an amount of 60 to 80% by weight, and the glass fiber is contained in an amount of 20 to 40% by weight.
  • the above resin may include at least one of PA, PC, PBT, and PPS; the glass fiber may have a length of 0.2 to 0.6 mm and a diameter of 12 to 17 ⁇ m.
  • a shielding layer may be provided on the surface of the plastic member.
  • the shielding layer can impart a mirror-like highlight to the plastic piece.
  • the obscuring layer may be formed by spraying a coating and baking.
  • the film thickness of the spray may be 2 to 10 ⁇ m, and the baking temperature is 90 to 150 °C.
  • the coating used for spraying can be a nano coating.
  • it may be a coating of TZT007 sold by Guangzhou Sisenmeike New Material Technology Co., Ltd.
  • a fluoride anti-fingerprint coating may be disposed on the outer surface of the ceramic middle frame.
  • a fluoride anti-fingerprint coating may be provided on the outer surface of the glass cover.
  • the fluoride anti-fingerprint coating can prevent the coating from directly contacting the glass or the ceramic material, so that the conventional erasing agent can be easily passed. For example, alcohol, remove the coating on the glass cover and the ceramic frame surface.
  • the term "design surface” refers specifically to the surface of the structure (such as a glass cover, a ceramic middle frame or a plastic part) that is exposed to the outside and visible to the user.
  • the appearance surface may be a surface of the above structure that is away from the inner side of the electronic device.
  • the above-mentioned fluoride anti-fingerprint coating film may be provided on the entire surface of the ceramic middle frame and the glass cover body, whereby the specific position of forming the fluoride anti-fingerprint coating film is not particularly limited.
  • the ceramic middle frame may have micropores, and the micro holes may be obtained by sandblasting or laser engraving, or ceramic A part of the micropores on the middle frame can be obtained by sandblasting, and another part of the micropores can be obtained by laser engraving. That is, the ceramic middle frame may have micropores obtained by sand blasting and/or laser engraving. Similarly, the surface of the cover glass may also have micropores which may be obtained by chemical etching, sand blasting or laser engraving.
  • micropores on the surface of the glass cover can also be obtained in various ways, for example, a part of the glass cover can be chemically etched, and the other part of the cover can be sandblasted.
  • the pores located on the surface of the glass cover and the pores and depth of the micropores located on the surface of the ceramic frame may be the same or different, as long as the size of any dimension of the micropores is on the order of micrometers.
  • an adhesive layer is further disposed between the ceramic middle frame and the plastic member.
  • an adhesive layer may be provided between the glass cover and the plastic member.
  • the adhesive layer may also be embedded in the micropores.
  • the material forming the binder layer may include at least one of a polyurethane, a polyacrylate, and an epoxy resin.
  • the ceramic middle frame has a thickness of 1.2-2 mm and a height of 4-6 mm;
  • the side width is 0.2-0.5 mm, the thickness of the glass cover is 0.55-0.8 mm; or, when the casing is a 3D product, the ceramic middle frame has a thickness of about 2-4 mm and a height of 2-5 mm;
  • the plastic member has a side width of 0.4-1 mm, and the glass cover has a thickness of 0.5-0.7 mm.
  • the glass cover surface may further have at least one of an optical coating layer, a decorative layer, a shielding layer and an explosion-proof layer. That is, the surface of the glass cover may be provided with one, two, three or four of an optical coating layer, a decorative layer, a shielding layer and an explosion-proof layer.
  • the present application also provides a method of preparing a housing of an electronic device, the method comprising the steps of: forming a plastic member between a ceramic middle frame and a glass cover such that the glass cover and the ceramic The middle frames are connected by the plastic member.
  • the housing prepared by this method may be the housing described above.
  • the ceramic middle frame and the glass cover are installed in the injection mold and injection molded and molded using the injection molded plastic material, so that the glass cover and the ceramic middle frame are connected by an plastic member into an integrated casing. structure.
  • Plastic parts are formed by injection molding plastic.
  • a plastic piece is formed between the edge of the cover glass and the edge of the ceramic middle frame and joined to form an integrated housing structure.
  • the material forming the plastic part may contain resin and glass fiber, that is, an injection molded material, or an injection molded plastic material, which may contain numerical values and glass fibers (glass fiber).
  • the content of the resin is 60-80% by weight, and the content of the glass fiber is 20-40% by weight.
  • the resin includes at least one of PA, PC, PBT, and PPS.
  • the glass fiber has a length of 0.2 to 0.6 mm and a diameter of 12 to 17 ⁇ m.
  • the injection molding temperature may be 200-330 ° C, and the molding pressure may be 20-26 MPa.
  • the method further comprises the step of forming a shielding layer on the surface of the plastic part, such as the outer surface of the plastic part, the shielding layer providing a bright appearance effect for the plastic part.
  • the specific step of forming the shielding layer may include: spraying and baking the surface of the formed workpiece (the housing that is integrally connected after forming the plastic member) to form a shadow on the surface of the plastic member Floor.
  • the coating used for spraying can be a nano coating.
  • the film thickness formed after spraying the coating may be 2-10 ⁇ m, and the baking temperature may be 90-150 °C.
  • the method further comprises: performing a fluoride anti-fingerprint coating treatment on the surface of the glass cover before the molding, that is, before forming the plastic member.
  • fluoride anti-fingerprint coating treatment can also be performed on the ceramic frame surface.
  • a fluoride film layer can be formed on the surface of the glass cover and the ceramic middle frame. Therefore, in the process of preparing the casing, for example, when the spraying operation is involved in the processing, the fluoride anti-fingerprint coating can prevent the coating, the ink and the like which may be involved in the preparation process from directly contacting the glass or the ceramic material, thereby The coating of the glass cover and the ceramic frame surface can be easily removed by a conventional erasing agent such as alcohol.
  • the aforementioned step of forming a shadow layer on the surface of the plastic member may be performed.
  • the baked workpiece can be erased using an erasing agent.
  • the plastic part is sprayed to form the shielding layer, although the glass cover body and the ceramic middle frame can be shielded by the profiling tool during the spraying process, the ink is not sprayed on the glass cover body and On the ceramic middle frame, the ink directly contacts the glass or the ceramic material is difficult to remove, affecting the appearance.
  • the processed product may have a fluoride film layer, so that the ink used for masking the plastic does not adhere to the ceramic middle frame or the glass cover.
  • the exposed surface can be easily erased by an eraser such as alcohol.
  • the method further comprises: forming a micro hole in the ceramic middle frame surface in advance before forming the plastic member.
  • the micropores may be micropores in the housing as previously described, and may be formed in at least one of sandblasting and laser engraving. The details of the size and formation of the micropores have been described in detail above and will not be described herein.
  • the ceramic mid-frame surface can be sandblasted and/or laser engraved to form micropores.
  • the formation of the micropores on the surface of the glass cover may include at least one of chemical etching, sand blasting, and laser engraving.
  • the surface of the glass cover may be subjected to chemical etching, sand blasting or laser engraving to obtain micropores.
  • the method further comprises: applying an adhesive on a side of the glass cover to be in contact with the plastic member prior to injection molding.
  • the applied binder can be heated.
  • an adhesive may also be applied to the side of the ceramic intermediate frame that is to be in contact with the plastic member.
  • heat treatment can also be performed.
  • the binder-forming material may include at least one of polyurethane, acrylate, and epoxy resin, and may include one, any two, or three of the above three materials.
  • the heating temperature may be 80-120 ° C and the time may be 30-90 min.
  • the adhesive can be applied by screen printing, spraying or dispensing.
  • the method further comprises: performing at least one of an optical coating process, a decoration process, a masking process, and an explosion-proof process on the surface of the glass cover body before injection molding.
  • the above decorative treatment may include: performing silk screen printing or spraying color ink on the surface of the glass cover body, then engraving the texture shape by a laser engraving machine, and repeating the step of forming the texture shape a plurality of times.
  • the texture shapes of the multi-layer color ink layer can be superimposed together, thereby obtaining a superimposed appearance effect of the multi-layer texture and color.
  • the color of the color ink formed multiple times may be the same or different, and the texture shapes of the multiple engraving may be the same or different, as long as the appearance of the multi-layered texture layer which is superimposed multiple times is not complete. Consistently, a superimposed stereoscopic appearance effect can be obtained.
  • a first layer of color ink may be screen printed or sprayed on the surface of the glass cover, and then the texture shape is engraved by a laser engraving machine, followed by silk screen printing or spraying a second layer of color ink, and then passing The laser engraving machine engraves another different texture shape and then superimposes it.
  • the number of layers superimposed above may be 2-4 layers.
  • Each layer of screen printed or sprayed ink can be dried at 120-150 ° C for 30 min - 60 min.
  • the explosion-proof treatment may include applying an explosion-proof coating to the surface of the glass cover by silk screen and spray coating, followed by baking at 90-120 ° C for 30-60 min.
  • the ceramic middle frame can be obtained by first forming a profile by calendering and grinding and polishing by CNC (CNC machine cutting).
  • CNC CNC machine cutting
  • the surface of the ceramic middle frame may be sandblasted and/or laser engraved. Namely: the surface of the ceramic frame can be sandblasted, or the surface of the ceramic frame can be laser engraved, or the surface of the ceramic frame can be sandblasted and laser engraved.
  • the method provided by the present application can be specifically implemented as follows: optical coating on a flat or 3D glass cover to achieve different colors of highlights, and then screen printing or spraying multiple layers of ink on the glass cover.
  • the decoration method is as follows: silk screen or spray the first layer of color ink, engrave a certain texture shape by laser engraving machine, silk screen or spray a second layer of color ink, different from the first layer color, and then engrave another difference by laser engraving machine
  • the texture shapes, which are superimposed together, can be stacked 2-4 layers to achieve a rich appearance of different color textures.
  • Each layer of silk screen or sprayed ink needs to be dried at 120-150 ° C for 30 min-60 min.
  • the explosion-proof coating is processed to the above by silk screen printing and spraying to achieve the explosion-proof effect.
  • the explosion-proof coating needs to be baked at 90-120 ° C for 30-60 min.
  • the adhesive is coated on the outermost side by screen printing, spraying or dispensing, and baked at 80-120 ° C for 30-90 min to complete the process of the glass cover.
  • the ceramic intermediate frame processed by calendering the contoured frame, and then subjected to CNC grinding, polishing, etc., is coated with a binder by spraying or dispensing, and baked at 120-150 ° C, 90 -120min.
  • the surface of the ceramic frame can be subjected to roughening treatment by sandblasting and laser engraving micropores to form micropores, and the internal bonding force is increased by the rubber-coated structure, and the glass cover body is improved.
  • the roughening treatment can be performed by chemical etching, sand blasting, laser engraving micropores, etc., to increase the bonding force with the binder.
  • the present application also provides a housing for an electronic device prepared according to the preparation method as described above.
  • the present application also provides an electronic device comprising a housing as described above and an electronic component mounted within the housing.
  • the housing may be a previously proposed housing or may be prepared as previously described.
  • a black high-brightness ceramic film was plated on the 3D glass cover, white ink was sprayed thereon, the thickness was 10 ⁇ m, and it was placed in an oven at 150 ° C for 30 minutes; a certain diamond pattern was engraved by a laser engraving machine. Then, a black ink was sprayed on the glass cover, and the thickness was 10 ⁇ m, and it was placed in an oven at 150 ° C for 30 minutes. A diamond pattern formed at different locations is then engraved on the glass cover by a laser engraving machine. Then, 10 ⁇ m of explosion-proof ink was sprayed on the above ink layer, and dried in an oven at 120 ° C for 30 minutes. A binder (the binder component was polycarbonate type polyurethane) was sprayed on the edge of the glass at 30 ⁇ m, and baked at 120 ° C for 30 minutes.
  • the binder component was polycarbonate type polyurethane
  • the ceramic middle frame is formed by calendering the contoured middle frame, and then subjected to CNC grinding, sand blasting, polishing, etc., and spraying the adhesive (the binder component is polycarbonate type polyurethane) by spraying for 30 ⁇ m. It was baked at 120 ° C for 30 min.
  • Fluoride anti-fingerprint coating treatment is performed on the surface of the above-mentioned glass cover and the above-mentioned ceramic middle frame.
  • the injection molding plastic (using 80 parts by weight of PA (polyamide) and 20 parts by weight of GF (glass fiber, length 0.2 mm, diameter 12 ⁇ m) mixed) was placed in an oven for pre-heat treatment, and passed through a mold temperature of 120 ° C. At a temperature of 310 ° C, the glass is injection molded together with the ceramic middle frame. The injection width is 0.5 mm. The molding pressure was 25 MPa.
  • the injection molded workpiece was sprayed and baked to form a shielding layer on the surface of the plastic injection molded part; the coating used for spraying was a nano coating; the thickness of the coating was 5 ⁇ m; and the baking temperature was 120 °C.
  • the glass cover and the coating for spraying on the ceramic middle frame are then erased with alcohol, thereby obtaining a housing of the electronic device.
  • a black high-brightness ceramic film was plated on the 3D glass cover, white ink was sprayed thereon, the thickness was 10 ⁇ m, and it was placed in an oven at 150 ° C for 30 minutes; a certain diamond pattern was engraved by a laser engraving machine. Then, a black ink was sprayed on the glass cover, and the thickness was 10 ⁇ m, and it was placed in an oven at 150 ° C for 30 minutes. A diamond pattern formed at different locations is then engraved on the glass cover by a laser engraving machine. Then, 10 ⁇ m of explosion-proof ink was sprayed on the above ink layer, and dried in an oven at 120 ° C for 30 minutes. A glass cover is obtained.
  • the ceramic middle frame is formed by calendering the contoured middle frame, and then processed by CNC grinding, sand blasting and polishing.
  • the ceramic middle frame and the glass cover were bonded together by dispensing to obtain the housing of the electronic device of Comparative Example 1.
  • Mirror surface thrust test The binding force of the glass screen and the metal frame was tested by a universal material testing machine (propulsion speed 10 mm/min); the test result of the casing of the embodiment 1 was: mirror thrust > 4000N.
  • the test result of the casing of Comparative Example 1 is: the mirror thrust is ⁇ 2000N, the direct dispensing force is poor, and the thrust is small.
  • Drop test no load drop test, height 1m. After the drop test, the product shall not be deformed, indented or damaged.
  • the test result of the shell of Example 1 was: >300 times.
  • the test result of the shell of Comparative Example 1 is: ⁇ 150 times, the metal strength is low, and it is apt to be damaged and damaged when dropped. The dispensing force is poor, and it is easy to crack when dropped.
  • Temperature shock test Visually inspect the sample before the test, put the product into the temperature impact test machine, at -40 ° C 2 hr - 85 ° C 2 hr (1CYCLE), place 5CYCLE in the chamber ⁇ place at room temperature for 4 hr, before/after the test No corrosion, spots, discoloration, discoloration, cracks, blistering, distortion, etc., and no fingernail scratching is acceptable.
  • the test result of the shell of Example 1 was: pass.
  • the test result of the casing of Comparative Example 1 was: unqualified, the direct bonding force was poor, and the local bonding surface had cracks during the temperature impact test.
  • Salt spray test The sample was placed in a salt spray chamber according to the actual installation method, and continuously sprayed at 35 ⁇ 2 ° C for 2 hours (spray solution: 5% NaCl solution, pH 6.5-7.2). The sample was then placed in a constant temperature and humidity chamber and placed in a cycle at 55 ° C / 95% for 22 hours for a total of 3 cycles of 72 hours. The samples were visually and mechanically inspected during the laboratory environment recovery period. The surface of the product should be free of rust, discoloration, foaming and other abnormalities. The adhesion test was carried out with 3M610 tape (pull 4 times), and no peeling was acceptable. The test result of the shell of Example 1 was: pass. The test result of the casing of Comparative Example 1 was: unacceptable.
  • Anti-chemical test Apply edible oil, sunscreen lotion, lipstick, liquid foundation, mosquito repellent, hand cream evenly on the product, and put it in a constant temperature and humidity chamber with a temperature of 70 ° C and a humidity of 90%. After being placed at room temperature for 4 hours, the product was wiped with alcohol, and there was no obvious residue, which was acceptable. The test result of the shell of Example 1 was: pass. The test result of the casing of Comparative Example 1 was: unacceptable.
  • the housing of the electronic device of the present application is more beautiful and more durable.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

提出了一种电子设备的壳体，该壳体包括玻璃盖体；以及陶瓷中框，所述玻璃盖体和所述陶瓷中框之间具有塑胶件。本申请还提供了一种制备电子设备的壳体的方法，该方法包括：在陶瓷中框和玻璃盖体之间形成塑胶件，使得所述玻璃盖体和所述陶瓷中框之间通过所述塑胶件相连。本申请还提供了根据如上所述的方法制备得到的电子设备的壳体以及包括如上所述的壳体和安装在所述壳体内的电子元件的电子设备。

Description

电子设备的壳体及其制备方法和电子设备
优先权信息
本申请请求2017年11月16日向中国国家知识产权局提交的、专利申请号为201711140757.0的申请专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及材料工程领域，具体地，涉及电子设备的壳体及其制备方法和电子设备。
背景技术
随着信息化时代的到来，各种电子设备的普及率越来越高。随着电子设备市场竞争的日趋激烈，用户对电子设备的壳体的要求也越来越高。例如，要求电子设备的壳体的兼具美观和耐用的优点。
现有的电子设备的外壳，例如采用金属与塑胶注塑后再与玻璃通过点胶的方式粘接在一起，存在屏蔽信号、外观一致性较差和密封性较差等缺陷。
发明内容
本申请的目的是提供一种电子设备的外壳，该外壳不屏蔽信号并且外观优良而且密封性好。
为了实现上述目的，一方面，本申请提供一种电子设备的壳体，该壳体包括玻璃盖体和陶瓷中框，所述玻璃盖体和所述陶瓷中框之间通过注塑塑胶连接成一体化壳体结构。
在本申请的一个方面，本申请提出了一种电子设备的壳体，该壳体包括：玻璃盖体；以及陶瓷中框，所述玻璃盖体和所述陶瓷中框之间具有塑胶件。
另一方面，本申请还提供了一种制备电子设备的壳体的方法，包括：在陶瓷中框和玻璃盖体之间形成塑胶件，使得所述玻璃盖体和所述陶瓷中框之间通过所述塑胶件相连。
另一方面，本申请还提供了一种电子设备的壳体的制备方法，该方法包括如下步骤：将陶瓷中框和玻璃盖体安装在注塑模具内并使用注塑塑胶料进行注塑和成型，使得所述玻璃盖体和所述陶瓷中框之间通过注塑塑胶连接成一体化壳体结构。
另一方面，本申请还提供了根据如上所述的制备方法制备得到的电子设备的壳体。
再一方面，本申请还提供了一种电子设备，该电子设备包括如上所述的壳体和安装在所述壳体内的电子元件。
通过上述技术方案，本申请所提供的壳体避免了传统壳体中金属材料的屏蔽作用，因此不需要对金属进行多处分割，这就大大提高了产品的外观美感；并且解决了传统壳体中金属中框留料注塑，再CNC加工导致亮度低，而无法达到与玻璃一样镜面的效果的问题；再有，本申请所提供的壳体中玻璃盖体和陶瓷中框通过塑胶注塑方式粘接在一起，结合力大，无台阶感，防水性好。
本申请的其他特征和优点将在随后的具体实施方式部分予以详细说明。
具体实施方式
以下对本申请的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。
一方面，本申请提供一种电子设备的壳体，该壳体包括玻璃盖体和陶瓷中框，所述玻璃盖体和所述陶瓷中框之间设置有塑胶件，即：玻璃盖体和陶瓷中框通过塑胶件连接成一体化壳体结构。
可选地，塑胶件设置在玻璃盖体的边缘，和陶瓷中框的边缘之间。也即是说，所述玻璃盖体的边缘和所述陶瓷中框的边缘之间通过塑胶件连接成一体化壳体结构。
可选地，塑胶件含有树脂和玻纤。玻纤的加入能够防止塑胶收缩过大造成产品变形，即玻纤(玻璃纤维)的加入可以减小塑胶件的收缩率。塑胶件中，所述树脂的含量为60-80重量％，所述玻纤的含量为20-40重量％。根据本申请一些具体的示例，上述树脂可以包括PA、PC、PBT和PPS中的至少一种；玻纤的长度可以为0.2-0.6mm，直径可以为12-17μm。
可选地，为了使得所述壳体更加美观，获得高亮的外观效果，可在塑胶件的表面设置遮蔽层。遮蔽层能够赋予塑胶件具有玻璃一样的镜面高亮的效果。
根据本申请的一些示例，遮蔽层可以是经过喷涂涂料并烘烤形成的。例如，喷涂的膜厚可以为2-10μm，烘烤的温度为90-150℃。其中，喷涂所用的涂料可以为纳米涂料。例如，可以为由广州希森美克新材料科技有限公司出售的牌号为TZT007的涂料。
可选地，陶瓷中框的外观面上可设置有氟化物防指纹镀膜。类似地，玻璃盖体的外观面上也可以设置有氟化物防指纹镀膜。由此，在制备该壳体的过程中，例如，在加工过程中涉及喷涂作业时，上述氟化物防指纹镀膜可以防止涂料直接接触玻璃或是陶瓷材料，从而可以简便地通过常规的擦除剂，例如酒精，去除玻璃盖体和陶瓷中框表面的涂料。
需要特别说明的是，术语“外观面”特指该壳体中的结构(如玻璃盖体、陶瓷中框 或是塑胶件)中，暴露在外，对用户可见的表面。例如，当该壳体应用于电子设备时，外观面可以为上述结构中远离电子设备内部一侧的表面。此外，上述氟化物防指纹镀膜可以设置在陶瓷中框和玻璃盖体的全部表面上，由此，不需要对形成氟化物防指纹镀膜的具***置进行特别限制。
可选地，为了使得所述陶瓷中框与塑胶件之间的结合力更强，所述陶瓷中框上可以具有微孔，微孔可以是通过喷砂或激光雕刻处理得到的，或者，陶瓷中框上的一部分微孔可以经喷砂处理得到，另一部分微孔可经激光雕刻处理得到。即：陶瓷中框上可具有喷砂和/或激光雕刻处理得到的微孔。类似地，玻璃盖体表面也可以具有微孔，该微孔可以是通过化学蚀刻、喷砂或激光雕刻处理得到的。玻璃盖体表面的微孔也可通过多种方式获得，例如可对部分玻璃盖体进行化学刻蚀，对另一部分玻璃盖体进行喷砂等处理。位于玻璃盖体表面的微孔，和位于陶瓷中框表面的微孔的孔径、深度等参数可以相同也可以不同，只要微孔的任意维度的尺寸在微米级别即可。
可选地，陶瓷中框与塑胶件之间还具有粘结剂层。类似地，玻璃盖体与塑胶件之间也可以具有粘结剂层。当陶瓷中框或是玻璃盖体表面具有前述的微孔时，所述粘结剂层还可以嵌入所述微孔中。形成所述粘结剂层的材料可以包括聚氨酯、聚丙烯酸酯和环氧树脂中的至少一种。由此，可以进一步提高塑胶件和玻璃盖体，或是塑胶件和陶瓷中框之间的结合力。
可选地，为了使得所述壳体更加匀称美观，在所述壳体为2D与2.5D产品时，所述陶瓷中框的厚度为1.2-2mm，高度为4-6mm；所述塑胶件的侧面宽度为0.2-0.5mm，所述玻璃盖体的厚度为0.55-0.8mm；或者，在所述壳体为3D产品时，所述陶瓷中框的厚度约2-4mm，高度2-5mm；所述塑胶件的侧面宽度0.4-1mm，所述玻璃盖体的厚度为0.5-0.7mm。
可选地，为了使得所述陶瓷中框更加实用、美观和坚固，所述玻璃盖体表面还可以具有光学镀膜层、装饰层、遮蔽层和防爆层中的至少一者。即：玻璃盖体表面可以设置有光学镀膜层、装饰层、遮蔽层和防爆层中的一个、两个、三个或是四个。
另一方面，本申请还提供了一种制备电子设备的壳体的方法，该方法包括如下步骤：在陶瓷中框和玻璃盖体之间形成塑胶件，使得所述玻璃盖体和所述陶瓷中框之间通过所述塑胶件相连。该方法制备的壳体可以为前面描述的壳体。
换句话说，即将陶瓷中框和玻璃盖体安装在注塑模具内并使用注塑塑胶料进行注塑和成型，使得所述玻璃盖体和所述陶瓷中框之间通过塑胶件连接成一体化壳体结构。塑胶件是通过注塑塑胶形成的。
可选地，在玻璃盖体的边缘，和陶瓷中框的边缘之间形成塑胶件并连接成一体化壳体结构。
可选地，形成塑胶件的材料可含有树脂和玻纤，即：注塑的材料，或称为注塑塑胶料，可含有数值和玻璃纤维(玻纤)。所述注塑塑胶料中，所述树脂的含量为60-80重量％，所述玻纤的含量为20-40重量％。所述树脂包括PA、PC、PBT和PPS中的至少一种。所述玻纤的长度为0.2-0.6mm，直径为12-17μm。
可选地，注塑的温度可以为200-330℃，成型的压力可以为20-26MPa。
可选地，该方法还包括在塑胶件表面，例如塑胶件的外表面形成遮蔽层的步骤，遮蔽层可为塑胶件提供高亮的外观效果。根据本申请一些示例，形成遮蔽层的具体步骤可以包括：在成型后的工件(形成塑胶件后连接为一体的壳体)表面进行喷涂涂料并烘烤的步骤，以在塑胶件的表面形成遮蔽层。喷涂所用的涂料可以为纳米涂料。喷涂涂料后形成的膜层的膜厚可以为2-10μm，烘烤的温度可以为90-150℃。
可选地，该方法还包括：在注塑前，即在形成塑胶件之前，预先在玻璃盖体表面进行氟化物防指纹镀膜处理。类似地，也可以在陶瓷中框表面进行氟化物防指纹镀膜处理。由此，可在所述玻璃盖体和所述陶瓷中框的表面上形成氟化物膜层。由此，在制备该壳体的过程中，例如，在加工过程中涉及喷涂作业时，上述氟化物防指纹镀膜可以防止制备工艺中可能涉及的涂料、油墨等直接接触玻璃或是陶瓷材料，从而可以简便地通过常规的擦除剂，例如酒精，去除玻璃盖体和陶瓷中框表面的涂料。
根据本申请一些具体的示例，在玻璃盖体和所述陶瓷中框的表面上形成氟化物膜层之后，可进行前述的在塑胶件表面形成遮蔽层的步骤。在对喷涂形成的涂料膜层进行烘烤后，可使用擦除剂对烘烤后的工件进行擦除。在对塑胶件进行喷涂以形成遮蔽层时，在喷涂过程中虽然可以通过仿形治具对所述玻璃盖体、所述陶瓷中框进行遮蔽，但无法避免油墨喷洒在所述玻璃盖体与所述陶瓷中框上，油墨直接接触玻璃或陶瓷材料很难去除，影响外观。而如在形成遮蔽层之前预先形成氟化物膜层，则经处理的产品因为有氟化物膜层的存在，导致遮蔽塑胶所用的油墨不会粘结在所述陶瓷中框或是玻璃盖板的暴露表面，可通过例如酒精的擦除剂轻松擦除。
可选地，为了使得所述陶瓷中框与塑胶件的结合力更强，该方法还包括：在形成塑胶件之前，预先在所述陶瓷中框表面形成微孔。微孔可以是如前面描述的壳体中的微孔，形成的方式可以为喷砂和激光雕刻处理的至少之一。关于微孔的尺寸、形成方式，前面已经进行了详细的描述，在此不再赘述。换句话说，可对陶瓷中框表面进行喷砂和/或激光雕刻处理，以形成微孔。类似的，也可以在形成塑胶件之前，预先在玻 璃盖体表面形成微孔。玻璃盖体表面微孔的形成方式可包括化学蚀刻、喷砂和激光雕刻处理的至少之一。换句话说，可对所述玻璃盖体表面进行化学蚀刻、喷砂或激光雕刻处理得到的微孔。
可选地，该方法还包括：在注塑前，在所述玻璃盖体的将要与所述塑胶件接触的侧面上涂覆粘结剂。并且，可对涂覆的粘结剂进行加热。由此可提高注塑材料形成的塑胶件和玻璃盖体之间的结合力。类似地，也可以在所述陶瓷中框的将要与所述塑胶件接触的侧面上涂覆粘结剂。并且，也可进行加热处理。形成粘结剂的材料可以包括聚氨酯、丙烯酸酯和环氧树脂中的至少一种，如可包括上述三种材料中的一种、任意两种或是三种。加热的温度可以为80-120℃，时间可为30-90min。涂覆粘结剂的方式可为丝印、喷涂或点胶。
可选地，该方法还包括：在注塑前，在所述玻璃盖体的表面进行光学镀膜处理、装饰处理、遮蔽处理和防爆处理中的至少一种。可选地，上述装饰处理可包括：在所述玻璃盖体表面进行丝印或喷涂颜色油墨，然后通过激光雕刻机雕刻出纹理形状，并多次重复形成纹理形状的步骤。由此，多层基于颜色油墨层的纹理形状可叠加在一起，进而获得多层纹理、颜色的叠加外观效果。本领域技术人员能够理解的是，多次形成的颜色油墨的颜色可以相同也可以不相同，多次雕刻的纹理形状可以相同也可以不相同，只要多次叠加的多层纹理层的外观不完全一致即可，由此可获得叠加的立体外观效果。例如，根据本申请一些具体的示例，可以在所述玻璃盖体表面进行丝印或喷涂第一层颜色油墨，然后通过激光雕刻机雕刻出纹理形状，接着丝印或喷涂第二层颜色油墨，再通过激光雕刻机雕刻出另一种不同的纹理形状，进而叠加在一起。上述叠加的层数可以为2-4层。每层丝印或喷涂后的油墨可在120-150℃下烘干30min-60min。
根据本申请的一些示例，防爆处理可包括：将防爆涂料通过丝印与喷涂的方式涂覆到所述玻璃盖体表面，然后在90-120℃下烘烤30-60min。
根据本申请的一些示例，陶瓷中框可通过以下步骤获得：首先通过压延成型轮廓，并且经CNC(数控机床切割)磨削和抛光。同时可选地，可对所述陶瓷中框表面进行喷砂和/或激光雕刻处理。即：可对陶瓷中框表面进行喷砂，或对陶瓷中框表面进行激光雕刻处理，或者可对陶瓷中框表面进行喷砂和激光雕刻处理。
根据本申请的具体示例，本申请提供的方法可以具体实施如下：在平面或3D的玻璃盖体上进行光学镀膜，实现高亮的不同色彩，再在玻璃盖体上通过丝印或喷涂多层油墨的方式进行装饰与遮蔽。装饰的方式如下：丝印或喷涂第一层颜色油墨，通过激光雕刻机雕刻一定的纹理形状，丝印或喷涂第二层颜色油墨，与第一层颜色不同，再 通过激光雕刻机雕刻另一种不同纹理形状，进而叠加在一起，可叠加2-4层，从而实现不同色彩纹理的丰富外观效果，每层丝印或喷涂后的油墨需在120-150℃，烘干30min-60min。再将防爆涂料通过丝印与喷涂的方式加工到上面，达到防爆的效果，防爆涂料需在90-120℃，烘烤30-60min。最后通过丝印、喷涂或点胶的方式将粘结剂涂覆在最外侧，将其在80-120℃，烘烤30-90min，完成玻璃盖体的工艺处理。将通过压延成型轮廓中框、再经CNC磨削加工、抛光等工艺加工好后的陶瓷中框通过喷涂或点胶的方式涂覆上粘结剂，将其在120-150℃，烘烤90-120min。同时可通过对陶瓷中框表面进行喷砂、激光雕刻微孔的方式进行粗化处理以形成微孔，内部通过拉胶结构来提高与粘结剂之间的结合力，并且所述玻璃盖体可通过化学蚀刻、喷砂、激光雕刻微孔等方式进行粗化处理，增加与粘结剂之间的结合力。最后将玻璃盖体与陶瓷中框分别放入模具内进行注塑。
另一方面，本申请还提供了根据如上所述的制备方法制备得到的电子设备的壳体。
再一方面，本申请还提供了一种电子设备，该电子设备包括如上所述的壳体和安装在所述壳体内的电子元件。该壳体可以是前面提出的壳体，也可以为前面描述的方法制备的。
以下通过实施例进一步详细说明本发明。
实施例1
在3D的玻璃盖体上镀上黑色高亮陶瓷膜，在上面喷涂白色油墨，厚度10μm，放入150℃的烘箱干燥30min；经激光雕刻机雕刻一定的菱形图样。然后在玻璃盖体上喷涂上黑色油墨，厚度10μm，放入150℃的烘箱干燥30min。接着在玻璃盖体上经激光雕刻机雕刻在不同位置形成的菱形图样。再在以上油墨层上喷涂防爆油墨10μm，放入120℃的烘箱干燥30min。在玻璃边缘喷涂粘结剂(粘结剂组成成分为聚碳酸酯型聚氨酯)30μm，将其在120℃，烘烤30min。
陶瓷中框经压延成型轮廓中框、再经CNC磨削加工、喷砂、抛光等工艺加工成型，用喷涂方式将粘结剂(粘结剂组成成分为聚碳酸酯型聚氨酯)喷涂30μm，将其在120℃，烘烤30min。
在上述玻璃盖体和上述陶瓷中框的表面进行氟化物防指纹镀膜处理。
将注塑料(采用80重量份的PA(聚酰胺)和20重量份的GF(玻璃纤维，长度为0.2mm，直径为12μm)混合)放入烘箱进行预热处理，通过模温120℃，料温310℃，将玻璃与陶瓷中框结合注塑在一起。注塑宽度为0.5mm。成型的压力为25MPa。
将注塑后的工件进行喷涂并烘烤以在所述塑胶注塑件的表面形成遮蔽层；喷涂所用的涂料为纳米涂料；喷涂的厚度为5μm；烘烤的温度为120℃。然后用酒精擦除所述玻璃盖体和所述陶瓷中框上的喷涂所用的涂料，由此得到电子设备的壳体。
对比例1
在3D的玻璃盖体上镀上黑色高亮陶瓷膜，在上面喷涂白色油墨，厚度10μm，放入150℃的烘箱干燥30min；经激光雕刻机雕刻一定的菱形图样。然后在玻璃盖体上喷涂上黑色油墨，厚度10μm，放入150℃的烘箱干燥30min。接着在玻璃盖体上经激光雕刻机雕刻在不同位置形成的菱形图样。再在以上油墨层上喷涂防爆油墨10μm，放入120℃的烘箱干燥30min。得到玻璃盖体。
陶瓷中框经压延成型轮廓中框、再经CNC磨削加工、喷砂、抛光等工艺加工成型。将陶瓷中框与玻璃盖体通过点胶的方式粘接在一起，得到对比例1的电子设备的壳体。
测试实施例1
平面度测试：用海克斯康三坐标测量机测量注塑后玻璃屏表面的平面度；实施例1壳体的测试结果为：平面度(平均值)≤0.2。对比例1壳体的测试结果为：平面度(平均值)＞0.25，平面度差导致组装玻璃前盖时装配间隙大，台阶感严重。
镜面推力测试：用万能材料试验机(推进速度10mm/min)测试玻璃屏与金属边框结合力；实施例1壳体的测试结果为：镜面推力＞4000N。对比例1壳体的测试结果为：镜面推力＜2000N，直接点胶结合力差，推力小。
跌落测试：无负载跌落测试，高度1m。经跌落试验后，产品不得有变形、压痕和损伤。实施例1壳体的测试结果为：＞300次。对比例1壳体的测试结果为：＜150次，金属强度低，跌落时易变性、损伤。点胶结合力差，跌落时易开裂。
温度冲击测试：测试之前目视检查样品，将产品放入温度冲击试验机中，-40℃2hr—85℃2hr(1CYCLE)的条件下，在chamber放置5CYCLE→常温放置4hr后，测试前/后无腐蚀、斑点、掉色、变色、裂纹、起泡、扭曲等不良以及不能有手指甲刮伤现象，即为合格。实施例1壳体的测试结果为：合格。对比例1壳体的测试结果为：不合格，直接点胶结合力差，在温度冲击测试时局部结合面有裂纹。
湿热循环测试：将产品放于50℃、湿度95％的恒温恒湿箱中72hr。测试前/后无腐蚀、斑点、掉色,变色、裂纹、起泡、扭曲等不良以及不能有手指甲刮伤现象，即为合格。实施例1壳体的测试结果为：合格。对比例1壳体的测试结果为：不合格。
盐雾测试：将样品按照实际安装方式放置到盐雾室中，在35±2℃，连续喷雾2小时(喷雾溶液：5％的NaCl溶液，pH值6.5-7.2)。然后将样品放入恒温恒湿箱中，在55℃/95％放置22小时为一个循环，共做3个循环72小时，在实验室环境恢复期对样品进行目视及机械性能检查。产品表面应无锈蚀、变色、起泡等异常，进行附着力测试用3M610胶带(拉拔4次)，无脱落为合格。实施例1壳体的测试结果为：合格。对比例1壳体的测试结果为：不合格。
抗化学品测试：将食用油、防晒油、唇膏、粉底液、驱蚊液、护手霜均匀涂抹于产品上，放于温度为70℃，湿度为90％的恒温恒湿箱中24小时后，在常温放置4小时，用酒精擦拭产品，无明显残留痕迹，即为合格。实施例1壳体的测试结果为：合格。对比例1壳体的测试结果为：不合格。
根据测试实施例1的结果可见，本申请的电子设备的壳体更加美观且更加耐用。
以上详细描述了本申请的优选实施方式，但是，本申请并不限于上述实施方式中的具体细节，在本申请的技术构思范围内，可以对本申请的技术方案进行多种简单变型，这些简单变型均属于本申请的保护范围。
另外需要说明的是，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合，为了避免不必要的重复，本申请对各种可能的组合方式不再另行说明。
此外，本申请的各种不同的实施方式之间也可以进行任意组合，只要其不违背本申请的思想，其同样应当视为本申请所公开的内容。

Claims (30)

  1. 一种电子设备的壳体，包括：
    玻璃盖体；以及
    陶瓷中框，所述玻璃盖体和所述陶瓷中框之间具有塑胶件。
  2. 根据权利要求1所述的壳体，所述塑胶件设置在所述玻璃盖体的边缘和所述陶瓷中框的边缘之间。
  3. 根据权利要求1或2所述的壳体，所述塑胶件含有树脂和玻纤。
  4. 根据权利要求3所述的壳体，所述塑胶件中，所述树脂的含量为60-80重量％，所述玻纤的含量为20-40重量％。
  5. 根据权利要求3所述的壳体，所述树脂包括PA、PC、PBT和PPS中的至少一种，所述玻纤的长度为0.2-0.6mm，直径为12-17μm。
  6. 根据权利要求1-5任一项所述的壳体，所述塑胶件的外观面具有遮蔽层，所述遮蔽层是通过喷涂涂料并烘烤而形成的，喷涂的涂料为纳米涂料，喷涂后形成的膜层厚度为2-10μm，烘烤的温度为90-150℃。
  7. 根据权利要求6所述的壳体，所述陶瓷中框的外观面上设置有氟化物防指纹镀膜。
  8. 根据权利要求6所述的壳体，其特征在于，所述玻璃盖体的外观面具有氟化物防指纹镀膜。
  9. 根据权利要求1-8任一项所述的壳体，所述陶瓷中框表面具有微孔，所述陶瓷中框与所述塑胶件之间还具有粘结剂层，所述粘结剂层嵌入所述微孔中，所述粘结剂层包括聚氨酯、聚丙烯酸酯和环氧树脂中的至少一种。
  10. 根据权利要求1-8任一项所述的壳体，所述玻璃盖体表面具有微孔，所述玻璃盖体与所述塑胶件之间还具有粘结剂层，所述粘结剂层嵌入所述微孔中，所述粘结剂层包括聚氨酯、聚丙烯酸酯和环氧树脂中的至少一种。
  11. 根据权利要求1-10任一项所述的壳体，所述陶瓷中框的厚度为1.2-2mm，高度为4-6mm；所述塑胶件的侧面宽度为0.2-0.5mm，所述玻璃盖体的厚度为0.55-0.8mm。
  12. 根据权利要求1-10任一项所述的壳体，所述陶瓷中框的厚度为2-4mm，高度为2-5mm；所述塑胶件的侧面宽度为0.4-1mm，所述玻璃盖体的厚度为0.5-0.7mm。
  13. 根据权利要求1-12任一项所述的壳体，所述玻璃盖体表面还具有光学镀膜层、装饰层、遮蔽层和防爆层中的至少一者。
  14. 一种制备电子设备的壳体的方法，包括：
    在陶瓷中框和玻璃盖体之间形成塑胶件，使得所述玻璃盖体和所述陶瓷中框之间通过所述塑胶件相连。
  15. 根据权利要求14所述的方法，所述塑胶件设置在所述玻璃盖体的边缘和所述陶瓷中框的边缘之间。
  16. 根据权利要求14或15所述的制备方法，所述塑胶件含有树脂和玻纤。
  17. 根据权利要求16所述的方法，其特征在于，所述塑胶件中，所述树脂的含量为60-80重量％，所述玻纤的含量为20-40重量％。
  18. 根据权利要求16所述的方法，其特征在于，所述树脂包括PA、PC、PBT和PPS中的至少一种，所述玻纤的长度为0.2-0.6mm，直径为12-17μm。
  19. 根据权利要求14-18任一项所述的方法，将所述陶瓷中框和所述玻璃盖体置于注塑模具内，向所述注塑模具内注塑塑胶并成型，以形成所述塑胶件。
  20. 根据权利要求19所述的方法，所述注塑的温度为200-330℃；所述成型的压力为20-26MPa。
  21. 根据权利要求14-20任一项所述的方法，形成所述塑胶件之后进一步包括：在所述塑胶件的外表面喷涂涂料并烘烤，以形成遮蔽层，所述涂料为纳米涂料，所述喷涂的膜厚为2-10μm，所述烘烤的温度为90-150℃。
  22. 根据权利要求21所述的方法，在形成所述塑胶件之前，还包括：对所述玻璃盖体的表面和所述陶瓷中框的表面进行氟化物防指纹镀膜处理，以形成氟化物膜层，并在所述烘烤后使用擦除剂对烘烤后的工件进行擦除。
  23. 根据权利要求14-22任一项所述的方法，该方法还包括一下步骤的至少之一：
    在形成所述塑胶件之前，在所述玻璃盖体的将要与所述塑胶件接触的接触面上涂覆粘结剂；
    在形成所述塑胶件之前，在所述陶瓷中框的将要与所述塑胶注塑件接触的接触面上涂覆粘结剂；以及
    对所述粘结剂进行加热，所述加热的温度为80-120℃，时间为30-90min，
    所述粘结剂包括聚氨酯、聚丙烯酸酯和环氧树脂中的至少一种，所述涂覆的方式为丝印、喷涂或点胶。
  24. 根据权利要求23所述的方法，涂覆所述粘结剂之前进一步包括一下步骤的至少之一：在所述陶瓷中框表面形成微孔，所述微孔是通过以下方式的至少之一形 成的：喷砂以及激光雕刻处理；
    在所述玻璃盖体表面形成微孔，所述微孔是通过以下方式的至少之一形成的：化学蚀刻、喷砂以及激光雕刻处理。
  25. 根据权利要求14-24任一项所述的方法，该方法还包括：在形成所述塑胶件之前，在所述玻璃盖体的表面进行光学镀膜处理、装饰处理、遮蔽处理和防爆处理中的至少一种。
  26. 根据权利要求25所述的方法，所述装饰处理包括：在所述玻璃盖体表面进行丝印或喷涂颜色油墨，然后通过激光雕刻机雕刻出纹理形状，并多次重复形成所述纹理形状的步骤，形成的颜色油墨的层数为2-4层，所述颜色油墨在120-150℃下烘干30min-60min，
    所述防爆处理包括：将防爆涂料通过丝印与喷涂的方式涂覆到所述玻璃盖体表面，然后在90-120℃下烘烤30-60min。
  27. 根据权利要求14-26任一项所述的方法，所述陶瓷中框是通过压延成型轮廓，并且经CNC磨削和抛光而形成的。
  28. 一种壳体，该壳体包括玻璃盖体和陶瓷中框，所述玻璃盖体和所述陶瓷中框之间通过注塑塑胶连接成一体化壳体结构。
  29. 一种壳体，所述壳体是经权利要求14-27中任意一项所述的方法制备得到的。
  30. 一种电子设备，该电子设备包括壳体，和安装在所述壳体内的电子元件，
    所述壳体为权利要求28，或权利要求1-13任一项所述的，或为权利要求14-27中任意一项所述的方法获得的。
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