WO2019095434A1 - 柔性显示屏的贴合方法及柔性显示屏贴合设备 - Google Patents

柔性显示屏的贴合方法及柔性显示屏贴合设备 Download PDF

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Publication number
WO2019095434A1
WO2019095434A1 PCT/CN2017/113347 CN2017113347W WO2019095434A1 WO 2019095434 A1 WO2019095434 A1 WO 2019095434A1 CN 2017113347 W CN2017113347 W CN 2017113347W WO 2019095434 A1 WO2019095434 A1 WO 2019095434A1
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Prior art keywords
flexible
display screen
bonding
flexible display
holes
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PCT/CN2017/113347
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English (en)
French (fr)
Inventor
胡磊
王思元
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武汉华星光电半导体显示技术有限公司
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Priority to US15/579,479 priority Critical patent/US10515885B2/en
Publication of WO2019095434A1 publication Critical patent/WO2019095434A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/04—Inorganic
    • B32B2266/057—Silicon-containing material, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/42—Polarizing, birefringent, filtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/422—Luminescent, fluorescent, phosphorescent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B32B2307/7244—Oxygen barrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention belongs to the technical field of display screen manufacturing, and in particular to a method for bonding a flexible display screen and a flexible display panel bonding device.
  • the bendability of OLED display panels Due to the self-luminous characteristics of the OLED, the characteristics of short response time, high contrast, wide viewing angle, wide color gamut, thinness and thinness, and bendability are realized. In particular, the bendability of OLED display panels has brought consumers a subversive concept, so flexible OLED display panels have been the mainstream of OLED development in recent years.
  • the flexible OLED display panel is bonded together by the display portion and the foam portion by optical glue or the like. Since the display portion is made of polyimide resin, the thickness is very thin and very soft like the foam, so the bonding process is performed.
  • the bonding process is performed.
  • captain has greatly increased the difficulty of the bonding process, affecting the accuracy of the fit, thereby reducing production efficiency.
  • the present invention provides a bonding method of a flexible display panel and a flexible display panel bonding apparatus capable of improving the bonding precision and improving the production efficiency.
  • a method of attaching a flexible display screen comprising: providing a flexible display screen, the flexible display screen comprising two first through holes in a non-display area thereof, the two The first through holes are diagonally disposed; a flexible plywood is provided, the flexible plywood includes two second through holes, the two second through holes are disposed diagonally; and a bonding device is provided,
  • the bonding device comprises a rigid substrate and two positioning pins on the rigid substrate, the two positioning pins are disposed diagonally; the flexible bonding plate is placed on the rigid substrate, so that the two positioning pins are respectively Passing through two second through holes; placing the flexible display screen on the flexible bonding plate such that two positioning pins also pass through the two first through holes respectively, thereby making the flexible display screen and the The flexible plywood is fixedly attached together.
  • the flexible bonding board comprises: a foam board and a flexible back board, the flexible back board is disposed on the foam board and is fixed and fixed with the foam board by optical glue, the second pass A hole penetrates the foam sheet and the flexible back sheet; wherein the foam sheet faces the rigid substrate when the flexible laminate is placed on the rigid substrate.
  • the flexible display screen includes: a flexible substrate; an array layer formed on the flexible substrate, the array layer includes a plurality of thin film transistors arranged in an array; and an organic electroluminescent layer formed on the array layer An encapsulation layer formed on the organic electroluminescent layer; a polarizer comprising a horizontal portion and a vertical portion formed by bending a side end of the horizontal portion, the horizontal portion being disposed on the encapsulation layer a vertical portion disposed on the array layer, the first through hole penetrating the flexible substrate, the array layer, and the vertical portion; wherein the flexible display screen is placed on the flexible bonding board
  • the flexible substrate faces the flexible backsheet.
  • the flexible substrate and the flexible back sheet are adhesively fixed by an optical glue.
  • the flexible substrate is made of polyimide resin.
  • first through hole and/or the second through hole have a diameter of less than 100 ⁇ m.
  • a flexible display panel fitting apparatus comprising: a flexible display screen comprising two first through holes in a non-display area thereof, the two The first through hole is diagonally disposed; the flexible bonding plate includes two second through holes, the two second through holes are diagonally disposed; the fitting device, the bonding device includes a hard a substrate and two positioning pins on the rigid substrate, the two positioning pins are disposed diagonally; wherein the flexible bonding plate is placed on the rigid substrate, so that two positioning pins pass through the two a second through hole; the flexible display screen is placed on the flexible bonding board, so that the two positioning pins also pass through the two first through holes respectively, thereby bonding the flexible display screen to the flexible bonding board Together.
  • the flexible bonding board comprises: a foam board and a flexible back board, the flexible back board is disposed on the foam board and is fixed and fixed with the foam board by optical glue, the second pass a hole penetrating the foam sheet and the flexible back sheet; wherein the foam sheet is located between the hard substrate and the flexible back sheet when the flexible laminate is placed on the rigid substrate .
  • the flexible display screen includes: a flexible substrate; an array layer formed on the flexible On the substrate, the array layer includes a plurality of thin film transistors arranged in an array; an organic electroluminescent layer formed on the array layer; an encapsulation layer formed on the organic electroluminescent layer; and a polarizer including a horizontal portion And a vertical portion formed by bending a side end of the horizontal portion, the horizontal portion is disposed on the encapsulation layer, the vertical portion is disposed on the array layer, and the first through hole penetrates the flexible portion a substrate, the array layer, and the vertical portion; wherein the flexible back sheet is positioned between the flexible substrate and the foam sheet when the flexible display panel is placed on the flexible laminate.
  • the flexible substrate and the flexible back sheet are fixed by optical glue bonding.
  • the invention has the beneficial effects that the fitting method of the invention can accurately fix the flexible display screen and the flexible bonding board through the positioning pin, thereby completing the bonding process of the flexible display screen while ensuring the precision, thereby greatly reducing the operation difficulty. Increased production efficiency.
  • FIG. 1 is a front elevational view of a flexible display screen in accordance with an embodiment of the present invention
  • Figure 2 is a cross-sectional view taken along line A-A of Figure 1;
  • Figure 3 is a front elevational view of a flexible plywood in accordance with an embodiment of the present invention.
  • Figure 4 is a cross-sectional view taken along line B-B of Figure 3;
  • Figure 5 is a front elevational view of a laminating device in accordance with an embodiment of the present invention.
  • Figure 6 is a cross-sectional view taken along line C-C of Figure 5;
  • FIG. 7 is a flow chart of a method of fitting a flexible display screen in accordance with an embodiment of the present invention.
  • FIG. 1 is a front elevational view of a flexible display screen in accordance with an embodiment of the present invention.
  • Figure 2 is a cross-sectional view taken along line A-A of Figure 1.
  • a flexible display screen 1 includes a display area, a non-display area located around the display area, and two first through holes 101 in the non-display area.
  • the flexible display screen has a rectangular shape, and one of the two first through holes 101 is located at one corner of the flexible display screen 1, and the other of the two first through holes 101 is located at the other of the flexible display screen 1.
  • a corner, the one corner and the other corner are located on a diagonal of the rectangle, that is, the two first through holes 101 are located on one diagonal of the rectangle, that is, the two first through holes 101 are in a pair Corner setting.
  • the diameter of the first through hole 101 is less than 100 ⁇ m, but the present invention is not limited thereto.
  • the flexible display screen 1 includes a flexible substrate 11, an array layer 12, an organic electroluminescent layer 13, an encapsulation layer 14, and a polarizer 15.
  • the flexible substrate 11 may be made of polyimide resin, but the present invention is not limited thereto, and the flexible substrate 11 may also be made of other flexible materials.
  • the array layer 12 is formed on the flexible substrate 11.
  • array layer 12 includes a plurality of thin film transistors (not shown) arranged in an array, as well as the desired circuitry and the like.
  • the organic electroluminescent layer 13 is formed on the array layer 12.
  • the organic electroluminescent layer 13 is used for luminescent display.
  • the area occupied by the organic electroluminescent layer 13 is the display area, and the other areas are the non-display areas.
  • the encapsulation layer 14 is formed on the organic electroluminescent layer 13.
  • the encapsulation layer 14 is generally used for waterproofing oxygen or the like to protect the organic electroluminescent layer 13.
  • the polarizer 15 includes a horizontal portion 151 and a vertical portion 152 which is formed by bending the side ends (opposing side ends) of the horizontal portion 151.
  • the horizontal portion 151 is disposed on the encapsulation layer 14, and the vertical portion 152 is disposed on the array layer 12.
  • the vertical portion 152 is located in the non-display area.
  • the first through hole 101 penetrates the flexible substrate 11 , Array layer 12 and vertical portion 152.
  • the number of the first through holes 101 is not limited to two, for example, three or four, but the two first through holes 101 are the minimum number.
  • FIG. 3 is a front elevational view of a flexible plywood in accordance with an embodiment of the present invention.
  • Figure 4 is a cross-sectional view taken along line B-B of Figure 3 .
  • the flexible laminate 2 includes two second through holes 201.
  • the flexible plywood 2 has a rectangular shape, and one of the two second through holes 201 is located at one corner of the flexible plywood 2, and the other of the two second through holes 201 is located at the flexible plywood 2.
  • the one corner and the other corner are located on a diagonal of the rectangle, that is, the two second through holes 201 are located on one diagonal of the rectangle, that is, the two second through holes 201 are Diagonal setting.
  • the diameter of the second through hole 201 is less than 100 ⁇ m, but the present invention is not limited thereto.
  • the flexible bonding board 2 includes a foam board 21 and a flexible back board 22, and the flexible back board 22 is disposed on the foam board 21 and fixed to the foam board 21 by optical glue, the second pass The hole 201 extends through the foam sheet 21 and the flexible back sheet 22.
  • Figure 5 is a front elevational view of a fitting device in accordance with an embodiment of the present invention.
  • Figure 6 is a cross-sectional view taken along line C-C of Figure 5 .
  • a bonding apparatus 3 includes a rigid substrate 31 and two positioning pins 32 on the rigid substrate 31.
  • the rigid substrate 31 has a rectangular shape, and one of the two positioning pins 32 is located at one corner of the rigid substrate 31, and the other of the two positioning pins 32 is located at the other corner of the rigid substrate 31.
  • the one corner and the other corner are located on a diagonal of the rectangle, that is, the two positioning pins 32 are located on one diagonal of the rectangle, that is, the two positioning pins 32 are diagonally disposed.
  • the diameter of the positioning pin 32 is slightly smaller than the diameters of the first through hole 101 and the second through hole 201.
  • the present embodiment further provides a flexible display panel bonding apparatus comprising the flexible display panel 1 shown in FIG. 1, the flexible bonding board 2 shown in FIG. 2, and the bonding apparatus 3 shown in FIG.
  • FIG. 7 is a flow chart of a method of fitting a flexible display screen in accordance with an embodiment of the present invention.
  • a method of bonding a flexible display screen according to an embodiment of the present invention includes steps 1 through 5.
  • step one is performed.
  • a flexible display screen 1 shown in FIGS. 1 and 2 is provided. After performing step one, proceed to step two.
  • step two referring to the figure b in Fig. 7, a flexible plywood 2 shown in Figs. 3 and 4 is provided. After performing step two, proceed to step three.
  • step three referring to the figure c in Fig. 7, a bonding apparatus 3 shown in Figs. 5 and 6 is provided. After performing step three, proceed to step four.
  • step four referring to the diagram of d in FIG. 7, the flexible bonding board 2 is placed on the rigid substrate 31 such that one of the two positioning pins 32 passes through one of the two second through holes 201, and two The other of the positioning pins 32 passes through the other of the two second through holes 201. At this time, the foam sheet 21 faces the rigid substrate 31. After performing step four, proceed to step five.
  • step five referring to the e diagram in FIG. 7, the flexible display screen 1 is placed on the flexible bonding board 2, one of the two positioning pins 32 is passed through one of the two first through holes 101, and two The other of the positioning pins 32 passes through the other of the two first through holes 101. At this time, the flexible substrate 11 faces the flexible bonding board 2.
  • step 1 to step 5 the surface of the flexible back sheet 22 facing away from the foam sheet 21 has optical glue, and when the flexible substrate 11 is placed on the flexible back sheet 22, it is fixed by the optical adhesive and the flexible back sheet 22, thereby realizing The flexible display screen 1 is fixed to the flexible laminate 2.
  • the flexible display screen and the flexible bonding board can be accurately fixed by the positioning pin, thereby completing the fitting of the flexible display screen while ensuring accuracy.
  • the process greatly reduces the difficulty of operation and improves production efficiency.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本发明提供了一种柔性显示屏的贴合方法，其包括：提供一柔性显示屏，柔性显示屏包括位于其非显示区的呈对角设置的两个第一通孔；提供一柔性贴合板，柔性贴合板包括两个第二通孔，两个第二通孔呈对角设置；提供一贴合装置，贴合装置包括硬质基板以及位于硬质基板上的两个定位销，两个定位销对角设置；将柔性贴合板放置于硬质基板上，使两个定位销分别穿过两个第二通孔；将所述柔性显示屏放置于所述柔性贴合板上，使两个定位销也分别穿过两个第一通孔，从而使所述柔性显示屏与所述柔性贴合板贴合在一起。本发明还提供了一种柔性显示屏贴合设备。本发明在保证精度的情况下完成柔性显示屏的贴合制程，大大降低了操作难度，提高了生产效率。

Description

柔性显示屏的贴合方法及柔性显示屏贴合设备 技术领域
本发明属于显示屏制造技术领域，具体地讲，涉及一种柔性显示屏的贴合方法及柔性显示屏贴合设备。
背景技术
随着OLED显示技术的发展日趋成熟，广大消费者体验到了OLED显示与传统LCD显示的巨大差异，随之而来的是OLED消费市场的迅速增长。
由于OLED自发光的特性，使得响应时间短、高对比度、广视角、广色域、轻薄化、可弯折性等特点得以实现。特别是OLED显示面板的可弯折性，给消费者带来了颠覆性的概念，因此柔性OLED显示面板近年来是OLED发展的主流。通常柔性OLED显示面板由显示部分和泡棉部分通过光学胶等粘合在一起，由于显示部分以聚酰亚胺树脂制作基板，其与泡棉一样厚度很薄且非常柔软，因此在贴合过程中将大大增加贴合制程的难度，影响了贴合的精度，从而降低了生产效率。
发明内容
为了解决上述现有技术存在的问题，本发明提供了一种能够提高贴合精度且提高生产效率的柔性显示屏的贴合方法及柔性显示屏贴合设备。
根据本发明的一方面，提供了一种柔性显示屏的贴合方法，其包括：提供一柔性显示屏，所述柔性显示屏包括位于其非显示区的两个第一通孔，所述两个第一通孔呈对角设置；提供一柔性贴合板，所述柔性贴合板包括两个第二通孔，所述两个第二通孔呈对角设置；提供一贴合装置，所述贴合装置包括硬质基板以及位于硬质基板上的两个定位销，所述两个定位销对角设置；将所述柔性贴合板放置于所述硬质基板上，使两个定位销分别穿过两个第二通孔；将所述柔性显示屏放置于所述柔性贴合板上，使两个定位销也分别穿过两个第一通孔，从而使所述柔性显示屏与所述柔性贴合板固定贴合在一起。
进一步地，所述柔性贴合板包括：泡棉板和柔性背板，所述柔性背板设置于所述泡棉板上且与所述泡棉板通过光学胶粘贴固定，所述第二通孔贯穿所述泡棉板和所述柔性背板；其中，在将所述柔性贴合板放置于所述硬质基板上时，所述泡棉板面向所述硬质基板。
进一步地，所述柔性显示屏包括：柔性基板；阵列层，形成于所述柔性基板上，所述阵列层包括阵列排布的若干薄膜晶体管；有机电致发光层，形成于所述阵列层上；封装层，形成于所述有机电致发光层上；偏光片，包括水平部以及由所述水平部的侧端弯折形成的垂直部，所述水平部设置于所述封装层上，所述垂直部设置于所述阵列层上，所述第一通孔贯穿所述柔性基板、所述阵列层和所述垂直部；其中，在将所述柔性显示屏放置于所述柔性贴合板上时，所述柔性基板面向所述柔性背板。
进一步地，利用光学胶将所述柔性基板和所述柔性背板粘合固定。
进一步地，所述柔性基板由聚酰亚胺树脂制成。
进一步地，所述第一通孔和/或所述第二通孔的孔径小于100μm。
根据本发明的另一方面，还提供了一种柔性显示屏贴合设备，其包括：柔性显示屏，所述柔性显示屏包括位于其非显示区的两个第一通孔，所述两个第一通孔呈对角设置；柔性贴合板，所述柔性贴合板包括两个第二通孔，所述两个第二通孔呈对角设置；贴合装置，所述贴合装置包括硬质基板以及位于硬质基板上的两个定位销，所述两个定位销对角设置；其中，所述柔性贴合板放置于所述硬质基板上，使两个定位销分别穿过两个第二通孔；所述柔性显示屏放置于所述柔性贴合板上，使两个定位销也分别穿过两个第一通孔，从而使所述柔性显示屏与所述柔性贴合板贴合在一起。
进一步地，所述柔性贴合板包括：泡棉板和柔性背板，所述柔性背板设置于所述泡棉板上且与所述泡棉板通过光学胶粘贴固定，所述第二通孔贯穿所述泡棉板和所述柔性背板；其中，所述柔性贴合板放置于所述硬质基板上时，所述泡棉板位于所述硬质基板和所述柔性背板之间。
进一步地，所述柔性显示屏包括：柔性基板；阵列层，形成于所述柔性 基板上，所述阵列层包括阵列排布的若干薄膜晶体管；有机电致发光层，形成于所述阵列层上；封装层，形成于所述有机电致发光层上；偏光片，包括水平部以及由所述水平部的侧端弯折形成的垂直部，所述水平部设置于所述封装层上，所述垂直部设置于所述阵列层上，所述第一通孔贯穿所述柔性基板、所述阵列层和所述垂直部；其中，所述柔性显示屏放置于所述柔性贴合板上时，所述柔性背板位于所述柔性基板和所述泡棉板之间。
进一步地，所述柔性基板和所述柔性背板通过光学胶粘合固定。
本发明的有益效果：本发明的贴合方法通过定位销就能精确的固定柔性显示屏与柔性贴合板，从而在保证精度的情况下完成柔性显示屏的贴合制程，大大降低了操作难度，提高了生产效率。
附图说明
通过结合附图进行的以下描述，本发明的实施例的上述和其它方面、特点和优点将变得更加清楚，附图中：
图1是根据本发明的实施例的柔性显示屏的正视图；
图2是沿图1中的A-A线的剖面图；
图3是根据本发明的实施例的柔性贴合板的正视图；
图4是沿图3中的B-B线的剖面图；
图5是根据本发明的实施例的贴合装置的正视图；
图6是沿图5中的C-C线的剖面图；
图7是根据本发明的实施例的柔性显示屏的贴合方法的流程图。
具体实施方式
以下，将参照附图来详细描述本发明的实施例。然而，可以以许多不同的形式来实施本发明，并且本发明不应该被解释为限制于这里阐述的具体实施例。相反，提供这些实施例是为了解释本发明的原理及其实际应用，从而使本领域的其他技术人员能够理解本发明的各种实施例和适合于特定预期应用的 各种修改。
在附图中，为了清楚起见，夸大了层和区域的厚度。相同的标号在整个说明书和附图中表示相同的元器件。
图1是根据本发明的实施例的柔性显示屏的正视图。图2是沿图1中的A-A线的剖面图。
参照图1，根据本发明的实施例的柔性显示屏1包括显示区、位于显示区四周的非显示区以及位于非显示区中的两个第一通孔101。通常而言，柔性显示屏呈矩形，而这两个第一通孔101中的一个位于柔性显示屏1的一个角落，这两个第一通孔101中的另一个位于柔性显示屏1的另一个角落，该一个角落与该另一个角落位于矩形的一条对角线上，也就是说，两个第一通孔101位于矩形的一条对角线上，即两个第一通孔101呈对角设置。此外，第一通孔101的直径小于100μm，但本发明并不限制于此。
进一步地，参照图2，柔性显示屏1包括：柔性基板11、阵列层12、有机电致发光层13、封装层14以及偏光片15。
柔性基板11可以由聚酰亚胺树脂制成，但本发明并不限制于此，柔性基板11也可以由其他的柔性材料制成。
阵列层12形成于柔性基板11上。一般而言，阵列层12包括阵列排布的若干薄膜晶体管(未示出)以及所需的线路等。
有机电致发光层13形成于阵列层12上。有机电致发光层13用于进行发光显示。一般而言，有机电致发光层13所占的区域即为显示区，而其他的区域即为非显示区。
封装层14形成于有机电致发光层13上。封装层14通常用于防水氧等，以保护有机电致发光层13。
偏光片15包括水平部151以及由水平部151的侧端(相对的两侧端)弯折形成的垂直部152，水平部151设置于封装层14上，垂直部152设置于阵列层12上。这样，垂直部152位于非显示区。第一通孔101贯穿柔性基板11、 阵列层12和垂直部152。
需要说明的是，第一通孔101的数量并不以两个为限，例如也可以是三个或者四个，但是两个第一通孔101是最少数量。
图3是根据本发明的实施例的柔性贴合板的正视图。图4是沿图3中的B-B线的剖面图。
参照图3，根据本发明的实施例的柔性贴合板2包括两个第二通孔201。通常而言，柔性贴合板2呈矩形，而这两个第二通孔201中的一个位于柔性贴合板2的一个角落，这两个第二通孔201中的另一个位于柔性贴合板2的另一个角落，该一个角落与该另一个角落位于矩形的一条对角线上，也就是说，两个第二通孔201位于矩形的一条对角线上，即两个第二通孔201呈对角设置。此外，第二通孔201的直径小于100μm，但本发明并不限制于此。
进一步地，参照图4，柔性贴合板2包括：泡棉板21和柔性背板22，柔性背板22设置于泡棉板21上且与泡棉板21通过光学胶粘贴固定，第二通孔201贯穿泡棉板21和柔性背板22。
图5是根据本发明的实施例的贴合装置的正视图。图6是沿图5中的C-C线的剖面图。
参照图5和图6，根据本发明的实施例的贴合装置3包括硬质基板31以及位于硬质基板31上的两个定位销32。通常而言，硬质基板31呈矩形，而这两个定位销32中的一个位于硬质基板31的一个角落，这两个定位销32中的另一个位于硬质基板31的另一个角落，该一个角落与该另一个角落位于矩形的一条对角线上，也就是说，两个定位销32位于矩形的一条对角线上，即两个定位销32呈对角设置。此外，定位销32的直径略小于第一通孔101和第二通孔201的直径。
此外，本实施例还提供了一由图1所示的柔性显示屏1、图2所示的柔性贴合板2和图3所示的贴合装置3构成的柔性显示屏贴合设备。
图7是根据本发明的实施例的柔性显示屏的贴合方法的流程图。
参照图7，根据本发明的实施例的柔性显示屏的贴合方法包括步骤一至步骤五。
具体地，首先进行步骤一，参照图7中的a图，提供一图1和图2所示的柔性显示屏1。进行完步骤一之后，进行步骤二。
在步骤二中，参照图7中的b图，提供一图3和图4所示的柔性贴合板2。进行完步骤二之后，进行步骤三。
在步骤三中，参照图7中的c图，提供一图5和图6所示的贴合装置3。进行完步骤三之后，进行步骤四。
在步骤四中，参照图7中的d图，将柔性贴合板2放置于硬质基板31上，使两个定位销32之一穿过两个第二通孔201之一，且使两个定位销32之另一穿过两个第二通孔201之另一。此时，泡棉板21面向硬质基板31。进行完步骤四之后，进行步骤五。
在步骤五中，参照图7中的e图，将柔性显示屏1放置于柔性贴合板2上，使两个定位销32之一穿过两个第一通孔101之一，且使两个定位销32之另一穿过两个第一通孔101之另一。此时，柔性基板11面向柔性贴合板2。
这样，经过步骤一至步骤五之后，柔性背板22的背向泡棉板21的表面上具有光学胶，柔性基板11放置于柔性背板22上时通过光学胶与柔性背板22固定，从而实现柔性显示屏1与柔性贴合板2的固定。
综上所述，根据本发明的实施例的柔性显示屏的贴合方法，通过定位销就能精确的固定柔性显示屏与柔性贴合板，从而在保证精度的情况下完成柔性显示屏的贴合制程，大大降低了操作难度，提高了生产效率。
虽然已经参照特定实施例示出并描述了本发明，但是本领域的技术人员将理解：在不脱离由权利要求及其等同物限定的本发明的精神和范围的情况下，可在此进行形式和细节上的各种变化。

Claims (10)

  1. 一种柔性显示屏的贴合方法，其中，包括：
    提供一柔性显示屏，所述柔性显示屏包括位于其非显示区的两个第一通孔，所述两个第一通孔呈对角设置；
    提供一柔性贴合板，所述柔性贴合板包括两个第二通孔，所述两个第二通孔呈对角设置；
    提供一贴合装置，所述贴合装置包括硬质基板以及位于硬质基板上的两个定位销，所述两个定位销对角设置；
    将所述柔性贴合板放置于所述硬质基板上，使两个定位销分别穿过两个第二通孔；
    将所述柔性显示屏放置于所述柔性贴合板上，使两个定位销也分别穿过两个第一通孔，从而使所述柔性显示屏与所述柔性贴合板固定贴合在一起。
  2. 根据权利要求1所述的贴合方法，其中，所述柔性贴合板包括：泡棉板和柔性背板，所述柔性背板设置于所述泡棉板上且与所述泡棉板通过光学胶粘贴固定，所述第二通孔贯穿所述泡棉板和所述柔性背板；其中，在将所述柔性贴合板放置于所述硬质基板上时，所述泡棉板面向所述硬质基板。
  3. 根据权利要求2所述的贴合方法，其中，所述柔性显示屏包括：柔性基板；阵列层，形成于所述柔性基板上，所述阵列层包括阵列排布的若干薄膜晶体管；有机电致发光层，形成于所述阵列层上；封装层，形成于所述有机电致发光层上；偏光片，包括水平部以及由所述水平部的侧端弯折形成的垂直部，所述水平部设置于所述封装层上，所述垂直部设置于所述阵列层上，所述第一通孔贯穿所述柔性基板、所述阵列层和所述垂直部；其中，在将所述柔性显示屏放置于所述柔性贴合板上时，所述柔性基板面向所述柔性背板。
  4. 根据权利要求3所述的贴合方法，其中，利用光学胶将所述柔性基板和所述柔性背板粘合固定。
  5. 根据权利要求1所述的贴合方法，其中，所述第一通孔和/或所述第二通孔的孔径小于100μm。
  6. 一种柔性显示屏贴合设备，其中，包括：
    柔性显示屏，所述柔性显示屏包括位于其非显示区的两个第一通孔，所述两个第一通孔呈对角设置；
    柔性贴合板，所述柔性贴合板包括两个第二通孔，所述两个第二通孔呈对角设置；
    贴合装置，所述贴合装置包括硬质基板以及位于硬质基板上的两个定位销，所述两个定位销对角设置；
    其中，所述柔性贴合板放置于所述硬质基板上，使两个定位销分别穿过两个第二通孔；所述柔性显示屏放置于所述柔性贴合板上，使两个定位销也分别穿过两个第一通孔，从而使所述柔性显示屏与所述柔性贴合板贴合在一起。
  7. 根据权利要求6所述的柔性显示屏贴合设备，其中，所述柔性贴合板包括：泡棉板和柔性背板，所述柔性背板设置于所述泡棉板上且与所述泡棉板通过光学胶粘贴固定，所述第二通孔贯穿所述泡棉板和所述柔性背板；其中，所述柔性贴合板放置于所述硬质基板上时，所述泡棉板位于所述硬质基板和所述柔性背板之间。
  8. 根据权利要求7所述的柔性显示屏贴合设备，其中，所述柔性显示屏包括：柔性基板；阵列层，形成于所述柔性基板上，所述阵列层包括阵列排布的若干薄膜晶体管；有机电致发光层，形成于所述阵列层上；封装层，形成于所述有机电致发光层上；偏光片，包括水平部以及由所述水平部的侧端弯折形成的垂直部，所述水平部设置于所述封装层上，所述垂直部设置于所述阵列层上，所述第一通孔贯穿所述柔性基板、所述阵列层和所述垂直部；其中，所述柔性显示屏放置于所述柔性贴合板上时，所述柔性背板位于所述柔性基板和所述泡棉板之间。
  9. 根据权利要求8所述的柔性显示屏贴合设备，其中，所述柔性基板和所述柔性背板通过光学胶粘合固定。
  10. 根据权利要求6所述的柔性显示屏贴合设备，其中，所述第一通孔和/或所述第二通孔的孔径小于100μm。
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