WO2019095432A1 - Panel grinding device and grinding method - Google Patents

Panel grinding device and grinding method Download PDF

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Publication number
WO2019095432A1
WO2019095432A1 PCT/CN2017/113245 CN2017113245W WO2019095432A1 WO 2019095432 A1 WO2019095432 A1 WO 2019095432A1 CN 2017113245 W CN2017113245 W CN 2017113245W WO 2019095432 A1 WO2019095432 A1 WO 2019095432A1
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WO
WIPO (PCT)
Prior art keywords
panel
grinding
turntable
stage
connecting block
Prior art date
Application number
PCT/CN2017/113245
Other languages
French (fr)
Chinese (zh)
Inventor
黄建龙
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US15/740,232 priority Critical patent/US20190381625A1/en
Publication of WO2019095432A1 publication Critical patent/WO2019095432A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B24B45/003—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines

Definitions

  • the present invention relates to the field of display panel processing technology, and in particular, to a panel polishing apparatus and a polishing method.
  • the circuit is cut, or to remove the horizontal crack (Laseral Crack), the vertical crack (Median Crack) of the glass surface of the liquid crystal display module, and to avoid the person taking the film. Cut by an acute angle of glass, the panel needs to be edged.
  • the load-bearing platform of the load-bearing panel adopts a single design, and only one panel can be placed at a time.
  • the working efficiency is low, which becomes a bottleneck affecting the production efficiency of the panel, and due to chamfer grinding.
  • Inefficiency causes the panel after cutting to accumulate in the buffer zone, which is likely to cause the risk of blocking. Therefore, how to improve the production efficiency of the grinding machine becomes an urgent problem to be solved.
  • the present invention provides a panel polishing apparatus and a polishing method, which can greatly improve the polishing efficiency.
  • a panel grinding device includes a stage, a turntable rotatably disposed on an upper surface of the stage, and a grinding mechanism, wherein the upper surface of the turntable is provided with a plurality of grooves for placing the panel, and the grinding mechanism is used for The surface of the panel placed in the recess is ground.
  • the inner wall of each of the grooves is provided with an elastic buffer layer.
  • all of the grooves extend in the radial direction of the turntable, and each two adjacent grooves are spaced apart in the circumferential direction of the turntable.
  • every two adjacent grooves are equally spaced in the circumferential direction of the turntable.
  • a rotating motor is fixed on the stage, and a rotating shaft of the rotating motor is vertically fixed at a center of a bottom surface of the rotating table.
  • the grinding mechanism includes a polishing head for contacting the panel and a first bracket for fixing the polishing head, the polishing head being movably movable with respect to a length direction and a height direction of the stage Located above the turntable.
  • the grinding mechanism further includes a first connecting block
  • the first bracket includes a first longitudinal beam on both sides and a first beam connected to the top ends of the two first longitudinal beams
  • the grinding head is fixed on the first beam;
  • the two opposite faces of the first connecting block are respectively provided with first protrusions protruding perpendicular to the longitudinal direction of the first connecting block, and penetrating the first connecting block a first sliding slot in the longitudinal direction, wherein the two sidewalls in the longitudinal direction of the loading platform are respectively recessed with guiding slots, and each of the first longitudinal beam and the sidewall of the loading platform is provided with one of the a first connecting block, and an inner side of the first longitudinal beam is embedded in the first sliding slot, and the first protruding block of the first connecting block is embedded in the guiding groove.
  • the panel grinding apparatus further includes a spray mechanism for ejecting liquid, the spray mechanism being fixed on the first beam and the spray pipe nozzle of the spray mechanism Towards the end of the polishing head.
  • the panel grinding apparatus further includes a positioning mechanism for grasping position coordinates on the panel, and the positioning mechanism is movably disposed on the carrier along a length direction of the stage Above the stage.
  • Another object of the present invention is to provide a panel polishing method using the panel polishing apparatus, comprising:
  • Grinding mechanism aligns the corresponding surface on the panel in one of the grooves to start grinding
  • the invention can grind the batch panel at one time. During the grinding process, when the current panel is finished, just turn the turntable to the appropriate position, then switch to the next panel to continue the grinding process and repeat the above process until all the turntable After the panel is polished, the grinding pause time between the multiple panels is shortened, the grinding speed is increased, and the risk of blocking the buffer panel is avoided.
  • FIG. 1 is a schematic perspective structural view of a panel polishing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a partial structural schematic view of a panel polishing apparatus according to an embodiment of the present invention.
  • Figure 3 is a Y-direction view of Figure 1;
  • Figure 4 is an X-direction view of Figure 1;
  • FIG. 5 is a schematic view of a method of polishing a panel according to an embodiment of the present invention.
  • the panel polishing apparatus of the embodiment of the present invention mainly includes a stage 10 as a carrying platform, a turntable 20 rotatably disposed on the upper surface of the stage 10, and a grinding mechanism 30.
  • the upper surface of the turntable 20 is opened.
  • a rotating motor 40 is fixed to the stage 10 of the embodiment, and the base of the rotating motor 40 is fixed on the stage 10, and the rotating shaft is vertically fixed to the rotating table 20.
  • the rotating shaft of the turntable 20 and the rotating motor 40 can be connected by a flat key and a flat key hole, that is, the end of the rotating shaft is a flat key, and a flat key hole for inserting a flat key is opened at the bottom of the turntable 20 to ensure that the turntable 20 and the rotating motor 40 maintain synchronous rotation.
  • the turntable 20 can be easily removed from the rotating shaft.
  • the current turntable 20 can be directly replaced, and another turntable 20 that also carries a plurality of panels to be ground is mounted. After entering the rotating shaft, the removed panel on the turntable is removed, and the next batch of panels to be ground is loaded, and multiple panels are removed and loaded at one time, and the grinding process is not affected, thereby further improving the grinding efficiency.
  • all the grooves 200 on the turntable 20 extend in the radial direction of the turntable 20, and each two adjacent grooves are spaced apart in the circumferential direction of the turntable 20, and each two adjacent grooves 200 are circumferentially in the turntable 20
  • the arcs are equally spaced.
  • the rotating motor 40 is driven by the square wave driving signal to realize intermittent rotation and stop of the turntable 20, so that the angle of each rotation of the turntable 20 is uniform, so that the next panel can be accurately moved to a suitable position with each turning action.
  • the grinding mechanism 30 is used for grinding.
  • each groove 200 is provided with an elastic buffer layer 201.
  • the elastic buffer layer 201 is made of foam or the like, and can clamp the panel P placed thereon well. Play one The buffering effect is fixed, and the thickness of the elastic buffer layer 201 on the bottom surface of each groove 200 is smaller than the thickness of the side wall of each groove 200, or the elastic buffer layer 201 is located only on the side wall of each groove 200. In order to ensure that the panel P does not tilt during the grinding process, affecting the processing accuracy.
  • the grinding mechanism 30 includes a polishing head 31 for contacting the panel P and a first bracket 32 for fixing the polishing head 31.
  • the polishing head 31 is movably disposed above the turntable 20 with respect to the longitudinal direction and the height direction of the stage 10. .
  • the grinding mechanism 30 of the embodiment further includes
  • the first connecting block 33 has a gate shape and is mounted on two sides of the stage 10, and includes a first longitudinal beam 321 on both sides and a first beam 322 connected to the top ends of the two first longitudinal beams 321
  • the head 31 is fixed on the first beam 322.
  • the two opposite faces of the first connecting block 33 are respectively provided with a first protrusion 331 protruding perpendicular to the longitudinal direction of the first connecting block 33, and extending through the longitudinal direction of the first connecting block 33.
  • first chute wherein the two side walls of the stage 10 are recessed with guide grooves 11 respectively, and each of the first longitudinal beams 321 and the side wall of the stage 10 is provided with a first connecting block 33, and The inner side of the first longitudinal beam 321 is embedded in the first sliding slot, and the first protruding block 331 of the first connecting block 33 is embedded in the guiding slot 11 .
  • the first engaging block 33 of the embodiment can be horizontally slidable relative to the stage 10, and the first bracket 32 can slide up and down relative to the first connecting block 33, thereby realizing the first bracket 32 in multiple directions. The movement.
  • a spray mechanism 50 for ejecting liquid is fixed on the first beam 322, and the shower mechanism is fixed. 50 has a plurality of spray pipes 51, and the nozzle of each spray pipe 51 faces the end of the polishing head 31.
  • the cleaning liquid can be sprayed toward the panel surface in time by the spray pipe 51 to remove the residual glass debris on the panel surface, and each groove 200 on the turntable 20 of the embodiment penetrates the turntable 20
  • the side wall can also facilitate the cleaning of the glass debris and the cleaning liquid to prevent the liquid from collecting in the groove 200.
  • the panel polishing apparatus of the present embodiment further includes The alignment mechanism 60 for detecting the alignment mark on the panel P is movably disposed above the stage 10 along the longitudinal direction of the stage 10. After the turntable 20 is rotated to the corresponding position, the registration mechanism 60 is moved directly above the turntable 20 and grabs the position coordinates of the alignment mark on the panel P, and finally the polishing head 31 of the grinding mechanism 30 moves to the surface of the corresponding panel P. Grinding is performed directly above the position coordinates.
  • the alignment mechanism 60 specifically includes an alignment mode for capturing alignment marks on the panel P.
  • the second beam 622 at the top of the two second longitudinal beams 621 is fixed on the second beam 622.
  • the two opposite faces of the second connecting block 63 are respectively disposed perpendicular to the longitudinal direction of the second connecting block 63.
  • the registration mechanism 60 can be moved up and down with respect to the stage 10 to adjust the position in the longitudinal direction of the alignment module 61 as necessary to prevent unnecessary interference between the alignment module 61 and the polishing mechanism 30.
  • the panel polishing method provided by the present invention includes:
  • the panel P is placed in the recess 200 of the stage 10.
  • the groove 200 has an elastic buffer layer 201 capable of functioning as a protection and clamping function.
  • the panel P is radially disposed from the center of the turntable 20 to the periphery, and each of the two adjacent panels P has a predetermined arc interval therebetween. .
  • the grinding mechanism 30 is aligned with the corresponding surface on the panel P in one of the grooves 200 to start grinding.
  • the positioning mechanism 60 is first moved to the upper side of the turntable 20 along the length direction of the stage 10, and then the positional coordinates of the alignment mark on the current panel P are captured by the alignment module 61, and then ground.
  • the polishing head 31 of the mechanism 30 is moved directly above the corresponding position coordinates and lowered to contact the surface of the panel P to start the grinding process.
  • the cleaning liquid can be sprayed on the polishing portion of the surface of the panel P by the spraying mechanism 50 to improve the grinding effect.
  • the air drying mechanism can be used to blow the polishing portion to air dry the residual cleaning liquid.
  • the turntable 20 is rotated to align the grinding mechanism 30 with the corresponding surface on the panel P in the next recess 200, and the grinding is continued until the panel P in all the grooves 200 in the turntable 20 is ground. .
  • the grinding head 31 of the grinding mechanism 30 is longitudinally lifted and removed, and then turned to the turntable 20 to move the next panel P to the position to be polished, and then the alignment module 61 grasps the panel P.
  • the position coordinates of the alignment mark, the polishing head 31 is moved directly above the corresponding position coordinate, and is lowered to contact with the surface of the panel P to start the grinding process again. This cycle, until the panel P in all the grooves 200 in the turntable 20 is finished, the turntable 20 can be replaced, and the panel polishing process on the next turntable 20 can be continued.
  • the invention can grind the batch panel at one time.
  • just turn the turntable to the appropriate position then switch to the next panel to continue the grinding process and repeat the above process.
  • the grinding pause time between the multiple panels is shortened, the grinding speed is increased, and the risk of blocking the buffer panel is avoided.
  • the positioning mechanism is used to position the grinding portion and the spraying mechanism is used to assist the grinding, the grinding head of the invention has high positioning precision and better grinding effect.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

Disclosed by the present invention is a panel grinding device, comprising a loading table, a turnable that is rotatably provided on an upper surface of the loading table, and a grinding mechanism; a plurality of slots that are used for placing a panel are opened on an upper surface of the turnable, and the grinding mechanism is used to grind a surface of the panel that is placed with the slots. Further disclosed by the present invention is a panel grinding method. In the present invention, a batch of panels may be ground at once; during grinding, the turnable need only be rotated to a suitable position after a current panel is completely ground so as to switch to a next panel to continue the grinding process and repeat the described procedure until all of the panels on the turnable are ground, thus shortening the time paused between the grinding of a plurality of panels, increasing grinding speed and preventing the risk of panel blockage in a buffer area.

Description

面板研磨装置及研磨方法Panel polishing device and polishing method 技术领域Technical field
本发明涉及显示面板加工技术领域，尤其涉及一种面板研磨装置及研磨方法。The present invention relates to the field of display panel processing technology, and in particular, to a panel polishing apparatus and a polishing method.
背景技术Background technique
通常，在面板行业中，为了避免液晶显示模组的玻璃边缘割伤线路，或为了去除液晶显示模组的玻璃表面的水平裂纹(Lateral Crack)、垂直裂纹(Median Crack)以及避免人员取片时被玻璃锐角割伤，面板需要进行磨边制程。Usually, in the panel industry, in order to avoid the glass edge of the liquid crystal display module, the circuit is cut, or to remove the horizontal crack (Laseral Crack), the vertical crack (Median Crack) of the glass surface of the liquid crystal display module, and to avoid the person taking the film. Cut by an acute angle of glass, the panel needs to be edged.
目前，倒角研磨机大都需要人工放片和取片，承载面板的承载台采用单体设计，每次只能放置一片面板，作业效率低下，成为影响面板生产效率的瓶颈，且由于倒角研磨效率低下导致切割后的面板堆积在缓冲区，容易造成堵片的风险，因此如何提高研磨机的生产效率成为急需解决的问题。At present, most of the chamfering grinders need to be manually placed and taken. The load-bearing platform of the load-bearing panel adopts a single design, and only one panel can be placed at a time. The working efficiency is low, which becomes a bottleneck affecting the production efficiency of the panel, and due to chamfer grinding. Inefficiency causes the panel after cutting to accumulate in the buffer zone, which is likely to cause the risk of blocking. Therefore, how to improve the production efficiency of the grinding machine becomes an urgent problem to be solved.
发明内容Summary of the invention
鉴于现有技术存在的不足，本发明提供了一种面板研磨装置及研磨方法，可以大幅提升研磨效率。In view of the deficiencies of the prior art, the present invention provides a panel polishing apparatus and a polishing method, which can greatly improve the polishing efficiency.
为了实现上述的目的，本发明采用了如下的技术方案：In order to achieve the above object, the present invention adopts the following technical solutions:
一种面板研磨装置，包括载台、可转动地设于所述载台上表面的转盘以及研磨机构，所述转盘上表面开设有多个用于放置面板的凹槽，所述研磨机构用于对放置在所述凹槽内的面板表面进行研磨。A panel grinding device includes a stage, a turntable rotatably disposed on an upper surface of the stage, and a grinding mechanism, wherein the upper surface of the turntable is provided with a plurality of grooves for placing the panel, and the grinding mechanism is used for The surface of the panel placed in the recess is ground.
作为其中一种实施方式，每个所述凹槽的内壁设有弹性缓冲层。As one of the embodiments, the inner wall of each of the grooves is provided with an elastic buffer layer.
作为其中一种实施方式，所有的所述凹槽均沿所述转盘的径向延伸，每两个相邻的凹槽在所述转盘的周向上间隔设置。As one of the embodiments, all of the grooves extend in the radial direction of the turntable, and each two adjacent grooves are spaced apart in the circumferential direction of the turntable.
作为其中一种实施方式，每两个相邻的所述凹槽在所述转盘周向上所间隔的弧度相同。 As one of the embodiments, every two adjacent grooves are equally spaced in the circumferential direction of the turntable.
作为其中一种实施方式，所述载台上固定有转动马达，所述转动马达的转轴垂直固定在所述转盘底面的中心。As one of the embodiments, a rotating motor is fixed on the stage, and a rotating shaft of the rotating motor is vertically fixed at a center of a bottom surface of the rotating table.
作为其中一种实施方式，所述研磨机构包括用于接触面板的研磨头和用于固定所述研磨头的第一支架，所述研磨头相对于所述载台长度方向和高度方向可移动地设于所述转盘上方。As one of the embodiments, the grinding mechanism includes a polishing head for contacting the panel and a first bracket for fixing the polishing head, the polishing head being movably movable with respect to a length direction and a height direction of the stage Located above the turntable.
作为其中一种实施方式，所述研磨机构还包括第一衔接块，所述第一支架包括两侧的第一纵梁和连接在两根所述第一纵梁顶端的第一横梁，所述研磨头固定在所述第一横梁上；所述第一衔接块的两个相对面分别设有垂直于所述第一衔接块长度方向凸设的第一凸块、贯穿所述第一衔接块长度方向的第一滑槽，所述载台的长度方向的两侧壁分别凹陷设有导槽，每个所述第一纵梁与所述载台的侧壁之间各设有一个所述第一衔接块，且所述第一纵梁的内侧嵌设于所述第一滑槽内，所述第一衔接块的所述第一凸块嵌设于所述导槽内。In one embodiment, the grinding mechanism further includes a first connecting block, the first bracket includes a first longitudinal beam on both sides and a first beam connected to the top ends of the two first longitudinal beams, The grinding head is fixed on the first beam; the two opposite faces of the first connecting block are respectively provided with first protrusions protruding perpendicular to the longitudinal direction of the first connecting block, and penetrating the first connecting block a first sliding slot in the longitudinal direction, wherein the two sidewalls in the longitudinal direction of the loading platform are respectively recessed with guiding slots, and each of the first longitudinal beam and the sidewall of the loading platform is provided with one of the a first connecting block, and an inner side of the first longitudinal beam is embedded in the first sliding slot, and the first protruding block of the first connecting block is embedded in the guiding groove.
作为其中一种实施方式，所述的面板研磨装置还包括用于喷出液体的喷淋机构，所述喷淋机构固定在所述第一横梁上且所述喷淋机构的喷淋管管口朝向所述研磨头的末端。In one embodiment, the panel grinding apparatus further includes a spray mechanism for ejecting liquid, the spray mechanism being fixed on the first beam and the spray pipe nozzle of the spray mechanism Towards the end of the polishing head.
作为其中一种实施方式，所述的面板研磨装置还包括用于抓取面板上的位置坐标的对位机构，所述对位机构沿所述载台的长度方向可移动地设于所述载台上方。In one embodiment, the panel grinding apparatus further includes a positioning mechanism for grasping position coordinates on the panel, and the positioning mechanism is movably disposed on the carrier along a length direction of the stage Above the stage.
本发明的另一目的在于提供一种面板研磨方法，使用所述的面板研磨装置，包括：Another object of the present invention is to provide a panel polishing method using the panel polishing apparatus, comprising:
将面板放置在载台的凹槽内；Place the panel in the recess of the stage;
研磨机构对准其中一个凹槽内的面板上的相应表面，开始研磨；Grinding mechanism aligns the corresponding surface on the panel in one of the grooves to start grinding;
当前面板研磨完成后，转动转盘，将研磨机构对准下一个凹槽内的面板上的相应表面，继续研磨，直至转盘内所有凹槽内的面板研磨完毕。After the current panel is finished, turn the turntable, align the grinding mechanism with the corresponding surface on the panel in the next groove, and continue grinding until the panel in all the grooves in the turntable is finished.
本发明可以一次性对批量的面板进行研磨，研磨过程中，当当前面板研磨完毕，只需转动转盘至合适的位置，即可切换至下一个面板继续研磨制程并重复上述过程，直至转盘上所有的面板研磨完毕，缩短了多个面板之间的研磨停顿时间，提高了研磨速度，避免了缓冲区面板堵片的风险。The invention can grind the batch panel at one time. During the grinding process, when the current panel is finished, just turn the turntable to the appropriate position, then switch to the next panel to continue the grinding process and repeat the above process until all the turntable After the panel is polished, the grinding pause time between the multiple panels is shortened, the grinding speed is increased, and the risk of blocking the buffer panel is avoided.
附图说明 DRAWINGS
图1为本发明实施例的面板研磨装置的立体结构示意图；1 is a schematic perspective structural view of a panel polishing apparatus according to an embodiment of the present invention;
图2为本发明实施例的面板研磨装置的局部结构示意图；2 is a partial structural schematic view of a panel polishing apparatus according to an embodiment of the present invention;
图3为图1的Y向视图；Figure 3 is a Y-direction view of Figure 1;
图4为图1的X向视图；Figure 4 is an X-direction view of Figure 1;
图5为本发明实施例的面板研磨方法示意图。FIG. 5 is a schematic view of a method of polishing a panel according to an embodiment of the present invention.
具体实施方式Detailed ways
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
参阅图1和图2，本发明实施例的面板研磨装置主要包括作为承载平台的载台10、可转动地设于载台10上表面的转盘20以及研磨机构30，转盘20的上表面开设有多个用于放置面板P的凹槽200，研磨机构30用于对放置在凹槽200内的面板P表面进行研磨。Referring to FIG. 1 and FIG. 2, the panel polishing apparatus of the embodiment of the present invention mainly includes a stage 10 as a carrying platform, a turntable 20 rotatably disposed on the upper surface of the stage 10, and a grinding mechanism 30. The upper surface of the turntable 20 is opened. A plurality of grooves 200 for placing the panel P for grinding the surface of the panel P placed in the recess 200.
结合图3所示，作为其中一种示例性地驱动方式，本实施例的载台10上固定有转动马达40，该转动马达40的底座固定在载台10上，其转轴垂直固定在转盘20底面的中心部位。转盘20与转动马达40的转轴可以采用平键与平键孔连接，即转轴末端为平键，转盘20底部开设有供平键***的平键孔，确保转盘20与转动马达40保持同步转动，同时，转盘20可以很方便地从转轴上拆下，当转盘20上的所有面板都研磨完毕，还可以直接更换当前的转盘20，将另一同样承载有多片待研磨的面板的转盘20装入转轴，然后再取下转盘上已研磨的面板，并将下一批待研磨的面板装入，一次性取下和装入多块面板，且不影响研磨制程，进一步提高了研磨效率。As shown in FIG. 3, as one of the exemplary driving modes, a rotating motor 40 is fixed to the stage 10 of the embodiment, and the base of the rotating motor 40 is fixed on the stage 10, and the rotating shaft is vertically fixed to the rotating table 20. The center of the bottom surface. The rotating shaft of the turntable 20 and the rotating motor 40 can be connected by a flat key and a flat key hole, that is, the end of the rotating shaft is a flat key, and a flat key hole for inserting a flat key is opened at the bottom of the turntable 20 to ensure that the turntable 20 and the rotating motor 40 maintain synchronous rotation. At the same time, the turntable 20 can be easily removed from the rotating shaft. When all the panels on the turntable 20 are ground, the current turntable 20 can be directly replaced, and another turntable 20 that also carries a plurality of panels to be ground is mounted. After entering the rotating shaft, the removed panel on the turntable is removed, and the next batch of panels to be ground is loaded, and multiple panels are removed and loaded at one time, and the grinding process is not affected, thereby further improving the grinding efficiency.
这里，转盘20上所有的凹槽200均沿转盘20的径向延伸，每两个相邻的凹槽在转盘20的周向上间隔设置，每两个相邻的凹槽200在转盘20周向上所间隔的弧度相同。转动马达40由方波驱动信号进行驱动，实现转盘20的间歇性转动和停止，实现转盘20每次转动的角度一致，使得每一次转动动作即可将下一块面板准确地移动到合适的位置，以便研磨机构30进行研磨。Here, all the grooves 200 on the turntable 20 extend in the radial direction of the turntable 20, and each two adjacent grooves are spaced apart in the circumferential direction of the turntable 20, and each two adjacent grooves 200 are circumferentially in the turntable 20 The arcs are equally spaced. The rotating motor 40 is driven by the square wave driving signal to realize intermittent rotation and stop of the turntable 20, so that the angle of each rotation of the turntable 20 is uniform, so that the next panel can be accurately moved to a suitable position with each turning action. The grinding mechanism 30 is used for grinding.
结合图2～4所示，每个凹槽200的内壁设有弹性缓冲层201，该弹性缓冲层201采用泡棉等材料制作，可以很好地卡紧放置在其上的面板P，并能起到一 定的缓冲作用，并且，弹性缓冲层201位于每个凹槽200的底面的厚度要小于位于每个凹槽200的侧壁的厚度，或者弹性缓冲层201仅位于每个凹槽200的侧壁，以保证研磨过程中面板P不会发生倾斜，影响加工精度。As shown in FIG. 2 to FIG. 4, the inner wall of each groove 200 is provided with an elastic buffer layer 201. The elastic buffer layer 201 is made of foam or the like, and can clamp the panel P placed thereon well. Play one The buffering effect is fixed, and the thickness of the elastic buffer layer 201 on the bottom surface of each groove 200 is smaller than the thickness of the side wall of each groove 200, or the elastic buffer layer 201 is located only on the side wall of each groove 200. In order to ensure that the panel P does not tilt during the grinding process, affecting the processing accuracy.
具体地，研磨机构30包括用于接触面板P的研磨头31和用于固定研磨头31的第一支架32，研磨头31相对于载台10长度方向和高度方向可移动地设于转盘20上方。Specifically, the grinding mechanism 30 includes a polishing head 31 for contacting the panel P and a first bracket 32 for fixing the polishing head 31. The polishing head 31 is movably disposed above the turntable 20 with respect to the longitudinal direction and the height direction of the stage 10. .
为实现研磨头31的自由移动，保证其可以在面板P需要研磨时移动至接近该面板P，并在当前面板研磨完成后需要转动转盘20时及时移开，本实施例的研磨机构30还包括第一衔接块33，第一支架32呈门形，架设在载台10的两侧，包括两侧的第一纵梁321和连接在两根第一纵梁321顶端的第一横梁322，研磨头31固定在第一横梁322上；第一衔接块33的两个相对面分别设有垂直于第一衔接块33长度方向凸设的第一凸块331、贯穿第一衔接块33长度方向的第一滑槽，载台10的长度方向的两侧壁分别凹陷设有导槽11，每个第一纵梁321与载台10的侧壁之间各设有一个第一衔接块33，且第一纵梁321的内侧嵌设于第一滑槽内，第一衔接块33的第一凸块331嵌设于导槽11内。通过这样的设计，使得本实施例的第一衔接块33可相对于载台10水平滑动，第一支架32又能相对于第一衔接块33上下滑动，实现了第一支架32沿多个方向的移动。In order to realize the free movement of the polishing head 31, it is ensured that it can be moved to approach the panel P when the panel P needs to be ground, and is removed when the rotating panel 20 needs to be rotated after the current panel is finished. The grinding mechanism 30 of the embodiment further includes The first connecting block 33 has a gate shape and is mounted on two sides of the stage 10, and includes a first longitudinal beam 321 on both sides and a first beam 322 connected to the top ends of the two first longitudinal beams 321 The head 31 is fixed on the first beam 322. The two opposite faces of the first connecting block 33 are respectively provided with a first protrusion 331 protruding perpendicular to the longitudinal direction of the first connecting block 33, and extending through the longitudinal direction of the first connecting block 33. a first chute, wherein the two side walls of the stage 10 are recessed with guide grooves 11 respectively, and each of the first longitudinal beams 321 and the side wall of the stage 10 is provided with a first connecting block 33, and The inner side of the first longitudinal beam 321 is embedded in the first sliding slot, and the first protruding block 331 of the first connecting block 33 is embedded in the guiding slot 11 . With such a design, the first engaging block 33 of the embodiment can be horizontally slidable relative to the stage 10, and the first bracket 32 can slide up and down relative to the first connecting block 33, thereby realizing the first bracket 32 in multiple directions. The movement.
考虑到面板研磨过程中会出现研磨后的碎屑，如果不及时清理掉会影响后续研磨过程，因此，在第一横梁322上还固定有用于喷出液体的喷淋机构50，该喷淋机构50具有多根喷淋管51，且每根喷淋管51的管口朝向研磨头31的末端。在面板研磨过程中，可以通过喷淋管51及时地朝面板表面喷出清洗液，以清除面板表面残留的玻璃碎屑，而本实施例的转盘20上的每个凹槽200均贯穿转盘20的侧壁，也可以方便清理的玻璃碎屑以及清洗液流出，防止凹槽200内积液。Considering that the grinding debris will appear in the panel grinding process, if it is not cleaned up in time, the subsequent grinding process will be affected. Therefore, a spray mechanism 50 for ejecting liquid is fixed on the first beam 322, and the shower mechanism is fixed. 50 has a plurality of spray pipes 51, and the nozzle of each spray pipe 51 faces the end of the polishing head 31. During the panel grinding process, the cleaning liquid can be sprayed toward the panel surface in time by the spray pipe 51 to remove the residual glass debris on the panel surface, and each groove 200 on the turntable 20 of the embodiment penetrates the turntable 20 The side wall can also facilitate the cleaning of the glass debris and the cleaning liquid to prevent the liquid from collecting in the groove 200.
为保证研磨机构30的研磨头31可以精确地定位到转盘20上的面板P表面的待研磨位置，面板P的表面设置有对位标记，与之相应地，本实施例的面板研磨装置还包括用于检测面板P上对位标记的对位机构60，对位机构60沿载台10的长度方向可移动地设于载台10上方。当转盘20转动到相应位置后，对位机构60移动至转盘20正上方并抓取面板P上对位标记的位置坐标，最后研磨机构30的研磨头31才移动至相应的面板P表面的该位置坐标正上方进行研磨。In order to ensure that the polishing head 31 of the grinding mechanism 30 can be accurately positioned to the position to be polished of the surface of the panel P on the turntable 20, the surface of the panel P is provided with an alignment mark, and accordingly, the panel polishing apparatus of the present embodiment further includes The alignment mechanism 60 for detecting the alignment mark on the panel P is movably disposed above the stage 10 along the longitudinal direction of the stage 10. After the turntable 20 is rotated to the corresponding position, the registration mechanism 60 is moved directly above the turntable 20 and grabs the position coordinates of the alignment mark on the panel P, and finally the polishing head 31 of the grinding mechanism 30 moves to the surface of the corresponding panel P. Grinding is performed directly above the position coordinates.
如图4所示，对位机构60具体包括用于捕捉面板P上的对位标记的对位模 块61、用于固定对位模块61的第二支架62、设于第二支架62与载台10之间的第二衔接块63，第二支架62包括两侧的第二纵梁621和连接在两根第二纵梁621顶端的第二横梁622，对位模块61固定在第二横梁622上，第二衔接块63的两个相对面分别设有垂直于第二衔接块63长度方向凸设的第二凸块631、贯穿第二衔接块63长度方向的第二滑槽，每个第二纵梁621与载台10的侧壁之间各设有一个第二衔接块63，且第二纵梁621的内侧嵌设于第二滑槽内，第二衔接块63的第二凸块631嵌设于导槽11内。这里，对位机构60可相对于载台10上下移动，以在必要时调节对位模块61纵向上的位置，防止对位模块61与研磨机构30发生不必要的干涉。As shown in FIG. 4, the alignment mechanism 60 specifically includes an alignment mode for capturing alignment marks on the panel P. a block 61, a second bracket 62 for fixing the alignment module 61, a second connecting block 63 disposed between the second bracket 62 and the stage 10, and the second bracket 62 includes a second longitudinal beam 621 and a connection on both sides. The second beam 622 at the top of the two second longitudinal beams 621 is fixed on the second beam 622. The two opposite faces of the second connecting block 63 are respectively disposed perpendicular to the longitudinal direction of the second connecting block 63. a second protrusion 631, a second sliding slot extending through the length of the second connecting block 63, and a second connecting block 63 between each of the second longitudinal beam 621 and the side wall of the loading platform 10, and The inner side of the two longitudinal beams 621 is embedded in the second sliding slot, and the second protruding block 631 of the second connecting block 63 is embedded in the guiding slot 11 . Here, the registration mechanism 60 can be moved up and down with respect to the stage 10 to adjust the position in the longitudinal direction of the alignment module 61 as necessary to prevent unnecessary interference between the alignment module 61 and the polishing mechanism 30.
如图5所示，相应地，本发明提供的面板研磨方法包括：As shown in FIG. 5, correspondingly, the panel polishing method provided by the present invention includes:
S01、将面板P放置在载台10的凹槽200内。S01, the panel P is placed in the recess 200 of the stage 10.
凹槽200内具有可起到保护和夹紧功能的弹性缓冲层201，面板P被自转盘20中心朝四周呈辐射形地摆放，每两片相邻的面板P之间具有预定的弧度间隔。The groove 200 has an elastic buffer layer 201 capable of functioning as a protection and clamping function. The panel P is radially disposed from the center of the turntable 20 to the periphery, and each of the two adjacent panels P has a predetermined arc interval therebetween. .
S02、研磨机构30对准其中一个凹槽200内的面板P上的相应表面，开始研磨。S02, the grinding mechanism 30 is aligned with the corresponding surface on the panel P in one of the grooves 200 to start grinding.
研磨机构30与面板P对准时，首先对位机构60沿载台10的长度方向移动至转盘20上方，然后利用对位模块61抓取当前面板P上的对位标记的位置坐标，然后，研磨机构30的研磨头31移动至对应的位置坐标正上方，并下降至与面板P表面接触，开始研磨制程。研磨过程中，可以通过喷淋机构50朝面板P表面的研磨部位喷洒清洗液，提升研磨效果，最后，还可采用风干机构朝研磨部位吹气以风干残留清洗液。When the grinding mechanism 30 is aligned with the panel P, the positioning mechanism 60 is first moved to the upper side of the turntable 20 along the length direction of the stage 10, and then the positional coordinates of the alignment mark on the current panel P are captured by the alignment module 61, and then ground. The polishing head 31 of the mechanism 30 is moved directly above the corresponding position coordinates and lowered to contact the surface of the panel P to start the grinding process. During the grinding process, the cleaning liquid can be sprayed on the polishing portion of the surface of the panel P by the spraying mechanism 50 to improve the grinding effect. Finally, the air drying mechanism can be used to blow the polishing portion to air dry the residual cleaning liquid.
S03、当前面板P研磨完成后，转动转盘20，将研磨机构30对准下一个凹槽200内的面板P上的相应表面，继续研磨，直至转盘20内所有凹槽200内的面板P研磨完毕。S03. After the polishing of the current panel P is completed, the turntable 20 is rotated to align the grinding mechanism 30 with the corresponding surface on the panel P in the next recess 200, and the grinding is continued until the panel P in all the grooves 200 in the turntable 20 is ground. .
当前面板P研磨完成后，先将研磨机构30的研磨头31纵向提升并移开，然后转到转盘20以将下一块面板P移动到待研磨位置，然后对位模块61抓取该面板P上的对位标记的位置坐标，研磨头31移动至对应的位置坐标正上方，并下降至与面板P表面接触，开始再一次研磨制程。如此循环，直至转盘20内所有凹槽200内的面板P研磨完毕，则可更换转盘20，继续下一个转盘20上的面板研磨制程。 After the polishing of the front panel P is completed, the grinding head 31 of the grinding mechanism 30 is longitudinally lifted and removed, and then turned to the turntable 20 to move the next panel P to the position to be polished, and then the alignment module 61 grasps the panel P. The position coordinates of the alignment mark, the polishing head 31 is moved directly above the corresponding position coordinate, and is lowered to contact with the surface of the panel P to start the grinding process again. This cycle, until the panel P in all the grooves 200 in the turntable 20 is finished, the turntable 20 can be replaced, and the panel polishing process on the next turntable 20 can be continued.
综上所述，本发明可以一次性对批量的面板进行研磨，研磨过程中，当当前面板研磨完毕，只需转动转盘至合适的位置，即可切换至下一个面板继续研磨制程并重复上述过程，直至转盘上所有的面板研磨完毕，缩短了多个面板之间的研磨停顿时间，提高了研磨速度，避免了缓冲区面板堵片的风险。同时，由于采用了对位机构定位研磨部位，采用喷淋机构辅助研磨，本发明的研磨头的定位精度高，研磨效果更好。In summary, the invention can grind the batch panel at one time. During the grinding process, when the current panel is finished, just turn the turntable to the appropriate position, then switch to the next panel to continue the grinding process and repeat the above process. Until all the panels on the turntable are ground, the grinding pause time between the multiple panels is shortened, the grinding speed is increased, and the risk of blocking the buffer panel is avoided. At the same time, since the positioning mechanism is used to position the grinding portion and the spraying mechanism is used to assist the grinding, the grinding head of the invention has high positioning precision and better grinding effect.
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。 The above description is only a specific embodiment of the present application, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present application. It should be considered as the scope of protection of this application.

Claims (20)

  1. 一种面板研磨装置，其中，包括载台、可转动地设于所述载台上表面的转盘以及研磨机构，所述转盘上表面开设有多个用于放置面板的凹槽，所述研磨机构用于对放置在所述凹槽内的面板表面进行研磨。A panel polishing apparatus, comprising: a stage, a turntable rotatably disposed on an upper surface of the stage, and a grinding mechanism, wherein the upper surface of the turntable is provided with a plurality of grooves for placing the panel, the grinding mechanism For grinding the surface of the panel placed in the recess.
  2. 根据权利要求1所述的面板研磨装置，其中，每个所述凹槽的内壁设有弹性缓冲层。The panel grinding apparatus according to claim 1, wherein an inner wall of each of said grooves is provided with an elastic buffer layer.
  3. 根据权利要求1所述的面板研磨装置，其中，所有的所述凹槽均沿所述转盘的径向延伸，每两个相邻的凹槽在所述转盘的周向上间隔设置。The panel grinding apparatus according to claim 1, wherein all of said grooves extend in a radial direction of said turntable, and each two adjacent grooves are spaced apart in a circumferential direction of said turntable.
  4. 根据权利要求3所述的面板研磨装置，其中，每个所述凹槽均贯穿所述转盘的侧壁。The panel grinding apparatus according to claim 3, wherein each of said grooves penetrates a side wall of said turntable.
  5. 根据权利要求3所述的面板研磨装置，其中，每两个相邻的所述凹槽在所述转盘周向上所间隔的弧度相同。The panel grinding apparatus according to claim 3, wherein each two adjacent grooves are equally spaced in the circumferential direction of the turntable.
  6. 根据权利要求1所述的面板研磨装置，其中，所述载台上固定有转动马达，所述转动马达的转轴垂直固定在所述转盘底面的中心。The panel polishing apparatus according to claim 1, wherein a rotating motor is fixed to the stage, and a rotating shaft of the rotating motor is vertically fixed at a center of a bottom surface of the turntable.
  7. 根据权利要求1所述的面板研磨装置，其中，所述研磨机构包括用于接触面板的研磨头和用于固定所述研磨头的第一支架，所述研磨头相对于所述载台长度方向和高度方向可移动地设于所述转盘上方。The panel grinding apparatus according to claim 1, wherein the grinding mechanism includes a polishing head for contacting the panel and a first holder for fixing the polishing head, the polishing head being oriented with respect to the length of the stage And a height direction is movably disposed above the turntable.
  8. 根据权利要求7所述的面板研磨装置，其中，所述研磨机构还包括第一衔接块，所述第一支架包括两侧的第一纵梁和连接在两根所述第一纵梁顶端的第一横梁，所述研磨头固定在所述第一横梁上；所述第一衔接块的两个相对面分别设有垂直于所述第一衔接块长度方向凸设的第一凸块、贯穿所述第一衔接块长度方向的第一滑槽，所述载台的长度方向的两侧壁分别凹陷设有导槽，每个所述第一纵梁与所述载台的侧壁之间各设有一个所述第一衔接块，且所述第一纵梁的内侧嵌设于所述第一滑槽内，所述第一衔接块的所述第一凸块嵌设于所述导槽内。The panel grinding apparatus according to claim 7, wherein the grinding mechanism further comprises a first engaging block, the first bracket comprising a first longitudinal beam on both sides and a top end connected to the two first longitudinal beams a first beam, the grinding head is fixed on the first beam; the two opposite faces of the first connecting block are respectively provided with a first protrusion protruding perpendicular to the longitudinal direction of the first connecting block, and penetrating through a first sliding slot in the longitudinal direction of the first connecting block, and two sidewalls in the longitudinal direction of the loading platform are respectively recessed with guiding slots, and between each of the first longitudinal beam and the sidewall of the loading platform One of the first connecting blocks is disposed, and an inner side of the first longitudinal beam is embedded in the first sliding slot, and the first protruding block of the first connecting block is embedded in the guiding Inside the slot.
  9. 根据权利要求7所述的面板研磨装置，其中，还包括用于喷出液体的喷淋机构，所述喷淋机构固定在所述第一横梁上且所述喷淋机构的喷淋管管口朝向所述研磨头的末端。A panel grinding apparatus according to claim 7, further comprising a spray mechanism for ejecting a liquid, said sprinkler mechanism being fixed to said first cross member and said sprinkler nozzle of said sprinkler mechanism Towards the end of the polishing head.
  10. 根据权利要求7所述的面板研磨装置，其中，还包括用于抓取面板上 的位置坐标的对位机构，所述对位机构沿所述载台的长度方向可移动地设于所述载台上方。The panel grinding apparatus according to claim 7, further comprising: for gripping the panel The alignment mechanism of the position coordinates, the alignment mechanism being movably disposed above the stage along the length direction of the stage.
  11. 根据权利要求3所述的面板研磨装置，其中，所述研磨机构包括用于接触面板的研磨头和用于固定所述研磨头的第一支架，所述研磨头相对于所述载台长度方向和高度方向可移动地设于所述转盘上方。The panel grinding apparatus according to claim 3, wherein the grinding mechanism includes a polishing head for contacting the panel and a first holder for fixing the polishing head, the polishing head being oriented with respect to the length of the stage And a height direction is movably disposed above the turntable.
  12. 根据权利要求11所述的面板研磨装置，其中，所述研磨机构还包括第一衔接块，所述第一支架包括两侧的第一纵梁和连接在两根所述第一纵梁顶端的第一横梁，所述研磨头固定在所述第一横梁上；所述第一衔接块的两个相对面分别设有垂直于所述第一衔接块长度方向凸设的第一凸块、贯穿所述第一衔接块长度方向的第一滑槽，所述载台的长度方向的两侧壁分别凹陷设有导槽，每个所述第一纵梁与所述载台的侧壁之间各设有一个所述第一衔接块，且所述第一纵梁的内侧嵌设于所述第一滑槽内，所述第一衔接块的所述第一凸块嵌设于所述导槽内。The panel grinding apparatus according to claim 11, wherein the grinding mechanism further comprises a first engaging block, the first bracket comprising a first longitudinal beam on both sides and a top end connected to the two first longitudinal beams a first beam, the grinding head is fixed on the first beam; the two opposite faces of the first connecting block are respectively provided with a first protrusion protruding perpendicular to the longitudinal direction of the first connecting block, and penetrating through a first sliding slot in the longitudinal direction of the first connecting block, and two sidewalls in the longitudinal direction of the loading platform are respectively recessed with guiding slots, and between each of the first longitudinal beam and the sidewall of the loading platform One of the first connecting blocks is disposed, and an inner side of the first longitudinal beam is embedded in the first sliding slot, and the first protruding block of the first connecting block is embedded in the guiding Inside the slot.
  13. 根据权利要求11所述的面板研磨装置，其中，还包括用于喷出液体的喷淋机构，所述喷淋机构固定在所述第一横梁上且所述喷淋机构的喷淋管管口朝向所述研磨头的末端。A panel grinding apparatus according to claim 11, further comprising a spray mechanism for ejecting a liquid, said sprinkler mechanism being fixed to said first cross member and said sprinkler nozzle of said sprinkler mechanism Towards the end of the polishing head.
  14. 根据权利要求11所述的面板研磨装置，其中，还包括用于抓取面板上的位置坐标的对位机构，所述对位机构沿所述载台的长度方向可移动地设于所述载台上方。A panel polishing apparatus according to claim 11, further comprising a registration mechanism for grasping position coordinates on the panel, said alignment mechanism being movably disposed at said load along a length direction of said stage Above the stage.
  15. 根据权利要求4所述的面板研磨装置，其中，所述研磨机构包括用于接触面板的研磨头和用于固定所述研磨头的第一支架，所述研磨头相对于所述载台长度方向和高度方向可移动地设于所述转盘上方。The panel grinding apparatus according to claim 4, wherein the grinding mechanism includes a polishing head for contacting the panel and a first holder for fixing the polishing head, the polishing head being oriented with respect to the length of the stage And a height direction is movably disposed above the turntable.
  16. 根据权利要求15所述的面板研磨装置，其中，所述研磨机构还包括第一衔接块，所述第一支架包括两侧的第一纵梁和连接在两根所述第一纵梁顶端的第一横梁，所述研磨头固定在所述第一横梁上；所述第一衔接块的两个相对面分别设有垂直于所述第一衔接块长度方向凸设的第一凸块、贯穿所述第一衔接块长度方向的第一滑槽，所述载台的长度方向的两侧壁分别凹陷设有导槽，每个所述第一纵梁与所述载台的侧壁之间各设有一个所述第一衔接块，且所述第一纵梁的内侧嵌设于所述第一滑槽内，所述第一衔接块的所述第一凸块嵌设于所述导槽内。 The panel grinding apparatus according to claim 15, wherein the grinding mechanism further comprises a first engaging block, the first bracket comprising a first longitudinal beam on both sides and a top end connected to the two first longitudinal beams a first beam, the grinding head is fixed on the first beam; the two opposite faces of the first connecting block are respectively provided with a first protrusion protruding perpendicular to the longitudinal direction of the first connecting block, and penetrating through a first sliding slot in the longitudinal direction of the first connecting block, and two sidewalls in the longitudinal direction of the loading platform are respectively recessed with guiding slots, and between each of the first longitudinal beam and the sidewall of the loading platform One of the first connecting blocks is disposed, and an inner side of the first longitudinal beam is embedded in the first sliding slot, and the first protruding block of the first connecting block is embedded in the guiding Inside the slot.
  17. 根据权利要求15所述的面板研磨装置，其中，还包括用于喷出液体的喷淋机构，所述喷淋机构固定在所述第一横梁上且所述喷淋机构的喷淋管管口朝向所述研磨头的末端。A panel grinding apparatus according to claim 15, further comprising a spray mechanism for ejecting a liquid, said sprinkler mechanism being fixed to said first cross member and said sprinkler nozzle of said sprinkler mechanism Towards the end of the polishing head.
  18. 根据权利要求15所述的面板研磨装置，其中，还包括用于抓取面板上的位置坐标的对位机构，所述对位机构沿所述载台的长度方向可移动地设于所述载台上方。A panel polishing apparatus according to claim 15, further comprising a registration mechanism for grasping position coordinates on the panel, said alignment mechanism being movably disposed at said load along a length direction of said stage Above the stage.
  19. 一种面板研磨装置，其中，包括载台、可转动地设于所述载台上表面的转盘、用于喷出液体的喷淋机构以及研磨机构，所述转盘上表面开设有多个用于放置面板的凹槽，所述研磨机构用于对放置在所述凹槽内的面板表面进行研磨，每个所述凹槽均贯穿所述转盘的侧壁，所述喷淋机构固定在所述第一横梁上且所述喷淋机构的喷淋管管口朝向所述研磨头的末端。A panel polishing apparatus, comprising: a stage, a turntable rotatably disposed on an upper surface of the stage, a spray mechanism for ejecting liquid, and a grinding mechanism, wherein the upper surface of the turntable is provided with a plurality of Positioning a groove of the panel, the grinding mechanism for grinding a surface of the panel placed in the groove, each of the grooves extending through a side wall of the turntable, the spray mechanism being fixed at the The spray tube nozzle of the first beam and the shower mechanism faces the end of the polishing head.
  20. 一种面板研磨方法，其中，使用面板研磨装置，所述面板研磨装置包括载台、可转动地设于所述载台上表面的转盘以及研磨机构，所述转盘上表面开设有多个用于放置面板的凹槽，所述研磨机构用于对放置在所述凹槽内的面板表面进行研磨；所述面板研磨方法包括：A panel polishing method, wherein a panel polishing apparatus includes a stage, a turntable rotatably provided on an upper surface of the stage, and a grinding mechanism, and the upper surface of the turntable is provided with a plurality of a groove for placing a panel, the grinding mechanism for grinding a surface of the panel placed in the groove; the panel polishing method comprises:
    将面板放置在载台的凹槽内；Place the panel in the recess of the stage;
    研磨机构对准其中一个凹槽内的面板上的相应表面，开始研磨；Grinding mechanism aligns the corresponding surface on the panel in one of the grooves to start grinding;
    当前面板研磨完成后，转动转盘，将研磨机构对准下一个凹槽内的面板上的相应表面，继续研磨，直至转盘内所有凹槽内的面板研磨完毕。 After the current panel is finished, turn the turntable, align the grinding mechanism with the corresponding surface on the panel in the next groove, and continue grinding until the panel in all the grooves in the turntable is finished.
PCT/CN2017/113245 2017-11-20 2017-11-28 Panel grinding device and grinding method WO2019095432A1 (en)

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110315405B (en) * 2019-08-02 2020-11-10 阜阳市远大浮法玻璃制品有限公司 Float TFT-LCD glass production process
CN111496616B (en) * 2020-05-19 2023-01-03 深圳市浩枫科技有限公司 Edge grinding machine suitable for electronic display screen
CN113021184B (en) * 2021-03-12 2022-08-23 深圳市华星光电半导体显示技术有限公司 Method and device for grinding, blowing and aligning panel
CN113524029B (en) * 2021-07-19 2022-09-06 深圳尚海轩科技有限公司 Chip discharge mechanism for semiconductor chip production

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205325427U (en) * 2016-02-02 2016-06-22 北京京东方显示技术有限公司 Base plate grinder
CN205981956U (en) * 2016-08-30 2017-02-22 无锡东恒新能源科技有限公司 Grind and disperse inside hardness testing arrangement of attrition medium for carbon nanotube paste
CN206277256U (en) * 2016-12-02 2017-06-27 凯茂科技(深圳)有限公司 A kind of polissoir

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0847838A (en) * 1994-08-05 1996-02-20 Dowa Mining Co Ltd Device of charging body to be processed to processing device
CN204725269U (en) * 2015-05-09 2015-10-28 福建艺根玻璃有限公司 A kind of glass background wall edge polisher of Multi-angle water spray
CN204771933U (en) * 2015-07-02 2015-11-18 嘉善三星轴承有限公司 Grinding device of bearing
CN204870277U (en) * 2015-08-21 2015-12-16 安徽美景工艺品有限公司 Dustproof wood carving machine
CN105328548B (en) * 2015-11-25 2017-10-27 苏州金逸康自动化设备有限公司 A kind of automatic flash removed machine of many station
CN206493187U (en) * 2017-01-06 2017-09-15 华纬科技股份有限公司 A kind of efficient spring sanding apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205325427U (en) * 2016-02-02 2016-06-22 北京京东方显示技术有限公司 Base plate grinder
CN205981956U (en) * 2016-08-30 2017-02-22 无锡东恒新能源科技有限公司 Grind and disperse inside hardness testing arrangement of attrition medium for carbon nanotube paste
CN206277256U (en) * 2016-12-02 2017-06-27 凯茂科技(深圳)有限公司 A kind of polissoir

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