WO2019092881A1 - Multilayer wiring plate and production method therefor - Google Patents
Multilayer wiring plate and production method therefor Download PDFInfo
- Publication number
- WO2019092881A1 WO2019092881A1 PCT/JP2017/040744 JP2017040744W WO2019092881A1 WO 2019092881 A1 WO2019092881 A1 WO 2019092881A1 JP 2017040744 W JP2017040744 W JP 2017040744W WO 2019092881 A1 WO2019092881 A1 WO 2019092881A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hole
- coaxial wire
- shield layer
- layer
- multilayer wiring
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Definitions
- the present invention relates to a multilayer wiring board provided with coaxial wires and a method of manufacturing the same.
- Patent Document 1 discloses a multilayer wiring board provided with coaxial wires.
- the signal line of the coaxial wire disposed in the inner layer is connected to the outer layer electrode through the plating layer provided on the inner wall of the through hole, and the shield layer of the coaxial wire is a non-through hole (via) It is connected to the ground located in the inner layer of a wiring board via the plating layer provided in the inner wall etc. of this, and an outer-layer electrode.
- Patent Document 2 discloses a method of manufacturing a wiring board provided with a coaxial wire.
- the coaxial wire is disposed in the inner layer close to the outer surface of the multilayer wiring board, the coaxial wire is disposed in the inner back of the multilayer wiring board. As compared with the case of the above, it is easier to form a non-through hole (via) for exposing the shield layer (peripheral conductor) of the coaxial wire from the outside.
- this multilayer wiring board may be shrunk due to heat or the like, and the coaxial wire used for the multilayer wiring board is disposed in the inner layer of the multilayer wiring board, so that the shield layer of the coaxial wire is exposed.
- An object of the present invention is to provide a multilayer wiring board which can reliably obtain a sufficient shielding effect.
- the present invention relates to a multilayer wiring board as one aspect thereof.
- the multilayer wiring board includes a signal line, an insulating layer surrounding the signal line, and a shield layer disposed around the insulating layer, the coaxial wire extending in a first direction, a first direction, and a first direction
- An adhesive sheet extending along a surface direction defined by the intersecting second direction, the adhesive sheet on which the coaxial wire is laid, and a first surface disposed on the side of the first surface of the adhesive sheet to expose a portion of the coaxial wire
- a metal layer to be the diameter of the first hole of the base or the lateral width along the second direction is larger than the outer diameter of the shield layer of the coaxial wire.
- the diameter or the lateral width in the second direction of the first hole provided in the substrate is configured to be larger than the outer diameter of the shield layer of the coaxial wire.
- the diameter or the lateral width of the first hole is equal to that of the coaxial wire. Since it is formed larger than the outer diameter of the shield layer, the shield layer of the coaxial wire can be sufficiently exposed in the first hole, and the shield layer of the coaxial wire and the outer layer electrode are more reliably electrically conducted by the metal layer. Connection can be made.
- wiring used here means that a coaxial wire is made to adhere to the said sheet while being wound so that a part may be embedded on an adhesive sheet etc.
- the first hole may be a non-through hole.
- the first hole since the first hole can be manufactured within the range required to electrically connect the shield layer of the coaxial wire and the outer layer electrode, the first hole can be easily manufactured.
- the first hole when the first hole is a non-through hole, the first hole is formed only to the required depth of the wiring layer, so other wirings can be arranged in the wiring layer deeper than that. Can be achieved.
- the diameter or the lateral width of the first hole may be not less than 1.2 times and not more than 3 times the outer diameter of the shield layer of the coaxial wire.
- the wiring position accuracy of the coaxial wire wiring in the multilayer wiring board is a value close to the allowable limit. Even if heat shrinkage occurs to the multilayer wiring board, the shield layer can be sufficiently exposed in the first hole, and the shield layer and the outer layer electrode are more reliably electrically conducted by the metal layer. Connection can be made.
- the diameter or width of the first hole is not more than three times the outer diameter of the shield layer, it is not necessary to make a hole larger than necessary in the multilayer wiring board, and a wiring pattern provided on the surface of the multilayer wiring board It is possible to increase the design freedom of (wiring circuit).
- the vertical width of the first hole in the first direction may be different from the horizontal width of the first hole.
- the hole shape can be made more suitable for the formation of the metal layer and the like.
- the horizontal width of the first hole may be wider than the vertical width thereof. In this case, it is possible to widen the tolerance of deviation of the arrangement position of the coaxial wire with respect to the processing position of the first hole (via) for exposing the shield layer of the coaxial wire, and to wire the surface layer by forming the hole. It is possible to suppress a decrease in the degree of freedom in pattern design.
- the above-mentioned multilayer wiring board may further comprise a laminate having a metal foil and disposed on the second surface opposite to the first surface of the adhesive sheet, and the metal foil of this laminate is coaxial
- the metal layer is configured to be at the same potential as the wire, and the metal layer may be electrically connected to the metal foil.
- the first hole since the first hole has an action of making the depth constant without making the depth of the first hole deeper than a certain level, it is possible to suppress the variation in quality due to production.
- the base material may be provided with a second hole exposing another portion different from a part of the coaxial wire, and the shield layer of the coaxial wire exposed in the second hole
- the outer layer electrode may be electrically connected by the metal layer.
- the shield layer of the coaxial wire and the outer layer electrode are electrically connected at two or more points, and the connection reliability between the both can be further enhanced, and a sufficient shielding effect can be obtained more reliably. it can.
- the diameter of the second hole or the lateral width along the second direction may be larger than the outer diameter of the shield layer of the coaxial wire. In this case, in either of the first and second holes, the shield layer of the coaxial wire and the outer layer electrode are electrically more reliably connected, and a sufficient shielding effect can be obtained more reliably. .
- this invention relates to the manufacturing method of a multilayer wiring board as another aspect.
- the method for manufacturing a multilayer wiring board includes the steps of preparing a coaxial wire having a signal line, an insulating layer surrounding the signal line, and a shield layer disposed around the insulating layer, and crossing the first direction and the first direction.
- the method further comprises the steps of: forming a hole inward from the outer surface so as to be exposed; and electrically connecting the shield layer of the coaxial wire exposed in the hole and the outer layer electrode with a metal layer.
- the hole is provided such that the diameter of the hole in the base or the lateral width in the second direction is larger than the outer diameter of the shield layer of the coaxial wire.
- the hole in the step of providing the hole, the hole is provided such that the diameter of the hole in the base or the lateral width along the second direction is larger than the outer diameter of the shield layer of the coaxial wire.
- the diameter or the lateral width of the first hole is equal to that of the coaxial wire. Since it is formed larger than the outer diameter of the shield layer, the shield layer of the coaxial wire can be sufficiently exposed in the first hole, and the shield layer of the coaxial wire and the outer layer electrode are more reliably electrically conducted by the metal layer. Connection can be made.
- a multilayer wiring board having a sufficient shielding effect can be easily obtained.
- the step of providing the holes drilling is performed from the outer surface to the front of the shield layer of the coaxial wire such that the diameter or lateral width of the holes is larger than the outer diameter of the shield layer of the coaxial wire.
- the steps of forming the main part of the hole and performing the drilling process are followed by laser processing up to the shield layer on the basis of the main part of the hole to complete the hole.
- the main part of the hole for exposing the shield layer of the coaxial wire is drilled at a high processing speed, and then laser processing with higher processing accuracy is performed to suppress breakage of the shield layer and complete the hole. ing. For this reason, the hole for exposing the shield layer of a coaxial wire can be formed early and certainly.
- FIG. 1 is a cross-sectional view showing a multilayer wiring board according to an embodiment of the present invention.
- FIG. 2 is a view showing a method of manufacturing the multilayer wiring board shown in FIG.
- FIG. 3 is a schematic top view of the shield layer of the coaxial wire as viewed from above in the step shown in FIG. 2 (e).
- FIG. 4 is a schematic top view of the shield layer of the coaxial wire of the modified example as viewed from above in the step shown in FIG.
- FIG. 5 is a cross-sectional view showing a multilayer wiring board according to another embodiment of the present invention.
- FIG. 6 is a schematic view showing a connection relationship in a multilayer wiring board according to a modification of the present invention.
- FIG. 7 is a cross-sectional view showing an example of a multilayer wiring board according to a comparative example.
- FIG. 1 is a cross-sectional view showing a multilayer wiring board according to an embodiment of the present invention.
- the multilayer wiring board 1 includes a coaxial wire 10, a base 20, an adhesive sheet 21, a base 22, an outer electrode 23, and a metal layer 24.
- holes 22 a for exposing a part (upper part in the drawing) of the shield layer 13 of the coaxial wire 10 are provided from the outside to the inside of the base material 22.
- the holes 22a are non-through holes in the embodiment shown in FIG. 1, but may be through holes.
- the coaxial wire 10 includes a signal line 11, an insulating layer 12 covering and surrounding the signal line 11, a shield layer 13 disposed around the insulating layer 12, and a shielding layer 13 so as to form an enclosing shield layer 13.
- a conductor fixing layer 14 for fixing a plurality of conductors is provided.
- the coaxial wire 10 is a wire extending in a direction (first direction) orthogonal to the paper surface of FIG.
- the signal line 11 is, for example, a wire with a diameter of 50 ⁇ m to 300 ⁇ m, and more preferably 100 ⁇ m to 220 ⁇ m, such as copper, a copper alloy, or an aluminum alloy or a piano wire coated with copper It can be used.
- the signal line 11 is an area through which a high frequency signal (for example, an electrical signal such as 10 GHz) is transmitted through the coaxial wire 10.
- the signal line 11 may be a single wire or may be a stranded wire.
- the insulating layer 12 is a covering resin layer for insulating the signal line 11, and is made of, for example, a polyimide resin, a polyamideimide resin, or a fluorine resin.
- the insulating layer 12 is coated along the longitudinal direction on the outer periphery of the signal line 11, and can have a thickness of, for example, 80 ⁇ m to 150 ⁇ m.
- the shield layer 13 is an external conductor for shielding external radiation of the electromagnetic noise from the high frequency signal flowing through the signal line 11, and for preventing the electromagnetic noise from entering other wires or various wires arranged adjacent to each other. is there.
- the shield layer 13 is a layer in which, for example, a plurality of copper wires with a wire diameter of 15 ⁇ m to 30 ⁇ m are arranged without gaps along the circumferential direction, and the outer periphery thereof surrounds the insulating layer 12 covering the signal line 11. Are placed in and shield external emissions of electromagnetic noise.
- the shield layer 13 may be a stranded wire of the plurality of copper wires, but may have another configuration as long as the shielding effect can be realized.
- the shield layer 13 also shields external noise from entering the signal line 11.
- the conductor fixing layer 14 covers a plurality of metal wires (copper wires) constituting the shield layer 13 and is a resin for fixing the coaxial wire 10 so as not to be separated even when the coaxial wire 10 is twisted or the like. It is a layer, and is made of, for example, a fluorine resin or an imide resin.
- the thickness of the conductor fixed layer 14 can be, for example, 10 ⁇ m to 50 ⁇ m, and more preferably, 20 ⁇ m to 40 ⁇ m.
- the conductor fixing layer 14 also functions as a jacket for reducing damage externally applied to the coaxial wire.
- the conductor fixing layer 14 may be made of a UV-curable or thermosetting adhesive resin. In this case, the adhesion of the coaxial wire 10 to the adhesive sheet 21 can be improved.
- the substrate 20 is a substrate having an insulating property such as, for example, a prepreg.
- the “prepreg” is a sheet of a semi-cured state in which a reinforcing material (eg, glass cloth) is impregnated with an insulating resin (eg, a polyimide resin), or a sheet of this semi-cured state. It refers to an insulating layer that is cured and formed by laminating and integrating by heating and pressing.
- the adhesive sheet 21 is an adhesive sheet by curing the adhesive component contained in the coaxial wire 10 in which at least a part of the lower part (the lower half in the example of FIG. 1) is embedded by wiring. 21 is a layer for fixing on top.
- the adhesive sheet 21 contains, for example, an adhesive resin component of any one of a phenoxy resin, a polyamideimide resin, and a bismaleimide resin.
- the adhesive resin component constituting the adhesive sheet 21 may be either of a UV curing type or a thermosetting type.
- the adhesive sheet 21 can have a thickness of, for example, 300 ⁇ m to 700 ⁇ m, and more preferably, 400 ⁇ m to 500 ⁇ m.
- wired means that the coaxial wire is wound along a predetermined wiring pattern so that a part thereof is embedded on the adhesive sheet, and is attached to the adhesive sheet. This attachment can be performed, for example, by ultrasound.
- a base 22 is laminated on the upper side of the adhesive sheet 21.
- the substrate 22 is, like the substrate 20, a substrate having insulation, such as a prepreg.
- the substrate 22 is laminated on the adhesive sheet 21 such that a portion (e.g., the upper half) of the coaxial wire 10 wired on the adhesive sheet 21 is located therein.
- the base 22 is provided with a hole 22a (first hole) so that the upper surface of the shield layer 13 of the coaxial wire 10 is exposed.
- the holes 22 a are non-through holes formed inward from the outer surface of the multilayer wiring board 1.
- the holes 22 a may be through holes penetrating from one outer surface to the other outer surface depending on the configuration of the multilayer wiring board 1. In the hole 22a, the conductor fixing layer 14 is partially (upper) scraped, and the shield layer 13 is exposed.
- the outer layer electrode 23 is an electrode layer provided on the surface of the outer layer of the base material 22.
- the outer layer electrode 23 is made of, for example, a metal foil such as copper foil, and is stuck on a base material 22 made of a prepreg or the like.
- the thickness of the outer layer electrode 23 may be, for example, 5 ⁇ m or more and 70 ⁇ m or less.
- the metal layer 24 is a conductive layer for electrically connecting the shield layer 13 of the coaxial wire 10 exposed in the hole 22 a and the outer layer electrode 23.
- the metal layer 24 includes a first region 24 a covering the exposed region of the shield layer 13, a second region 24 b provided on the bottom of the hole 22 a excluding the exposed region of the shield layer 13, and an inner peripheral surface of the hole 22 a.
- a third region 24c is provided, and a fourth region 24d provided on the outer layer electrode 23.
- the first region 24a to the fourth region 24d are collectively formed, for example, by plating.
- the thickness of the metal layer 24 may be, for example, 10 ⁇ m or more and 30 ⁇ m or less.
- the hole 22a is, for example, a hole having a shape such as a circle (see FIG. 3), an ellipse, or a polygon such as a square (see FIG. 4) in plan view, and its inner diameter or width D1 is the coaxial wire 10 Is formed to be wider than the outer diameter D2 of the shield layer 13 of FIG.
- the inner diameter or the lateral width D1 of the hole 22a is a length along a direction (second direction, right and left direction in FIG. 1) orthogonal (intersecting) to the direction (first direction) in which the coaxial wire 10 is wired.
- the inner diameter or the lateral width D1 of the hole 22a is not less than 1.2 times and not more than 3 times the outer diameter D2 of the shield layer 13.
- the wiring position accuracy of the wiring of the coaxial wire 10 in the multilayer wiring board 1 is a value close to the allowable limit Even if the holes 22a are shifted laterally from the predetermined position or heat contraction occurs to the multilayer wiring board 1, the shield layer 13 can be sufficiently exposed in the holes 22a. It is possible to electrically connect the shield layer 13 and the outer layer electrode 23 more reliably by the metal layer 24.
- the shield layer 13 in the hole 22a it is preferable to have a portion where 50% or more (25% or more of the entire outer periphery) of the upper outer periphery of the shield layer 13 is exposed in the hole 22a. 70% or more of the upper outer periphery (35% or more of the entire outer periphery) is more preferable, and 90% or more of the upper outer periphery (45% or more of the entire outer periphery) is more preferable.
- the diameter or width D1 of the hole 22 a is not more than three times the outer diameter of the shield layer 13, it is not necessary to make a hole larger than necessary in the multilayer wiring board 1. The degree of freedom in designing the wiring pattern (wiring circuit) can be increased.
- the holes 22a are circular in plan view in the example shown in FIG. 3, the holes 22a are not limited to this, and may have a substantially rectangular shape with rounded corners (see FIG. 4).
- the horizontal width D1 of the hole 22b is different from the vertical width D3 along the wiring direction of the coaxial wire 10, and the horizontal width D1 is wider than the vertical width D3.
- FIG. 2 is a view showing a method of manufacturing the multilayer wiring board shown in FIG.
- the coaxial wire 10 including the signal line 11, the insulating layer 12, the shield layer 13 and the conductor fixing layer 14 is prepared, and the adhesive sheet 21 is laminated on the base 20 as shown in FIG. Prepare a laminate.
- the base material 20 and the adhesive sheet 21 prepared here are spread along the surface direction defined by the horizontal direction of the drawing and the direction orthogonal to the paper surface of FIG.
- the coaxial wire 10 is laid on the adhesive sheet 21 of the laminate composed of the base material 20 and the adhesive sheet 21.
- the wiring direction of the coaxial wire 10 is, for example, a direction orthogonal to the paper surface of FIG. 2, but depending on the wiring pattern, it may be bent in a different direction on the way.
- ultrasonic waves are applied to fix the coaxial wire 10 to the adhesive sheet 21 while applying a predetermined pressure to the coaxial wire 10, for example.
- the coaxial wire 10 in a desired wiring pattern is formed on the adhesive sheet 21.
- the base material 22 is laminated
- the base material 22 is made of, for example, a prepreg, and is fixed to the adhesive sheet 21 by applying heat and pressure after laminating on the adhesive sheet 21.
- a metal foil 23 a (for example, copper foil) to be the outer layer electrode 23 is attached on the base material 22.
- the coaxial wire is placed in a part of the area (the area in which the coaxial wire 10 is embedded) in the base material 22 in which the coaxial wire 10 is wired.
- Holes 22a are provided inward from the outer surface so that the upper portions of the ten shield layers 13 are exposed.
- this hole 22a is provided, first, as shown in (d) of FIG. 2, from the outer surface of the base material 22 to the front of the shield layer 13 of the coaxial wire 10 with respect to the region where the coaxial wire 10 is embedded. A hole is drilled to make the main part 22c of the hole 22a. Then, after this drilling, as shown in (e) of FIG. 2, the CO 2 laser is used to precisely advance the hole to the shield layer 13 with reference to the main part 22 c of the hole 22 a, A portion of the conductor fixing layer 14 is melted to expose the top of the shield layer 13.
- the holes 22a are formed by a drill and a laser, as shown in FIG. 3, the holes 22a are formed such that the diameter D1 of the holes 22a is longer than the outer diameter D2 of the shield layer 13 of the coaxial wire 10. More preferably, the holes 22a are formed such that the diameter D1 of the holes 22a is in the range of not less than 1.2 times and not more than 3.0 times the outer diameter of the shield layer 13. Further, the shape of the hole 22a is not limited to the circular shape shown in FIG. 3, but as shown in FIG.
- the hole 22b of such shape is provided May be In the hole 22b, the horizontal width D1 is longer than the vertical width D3, and the shield layer 13 of the coaxial wire 10 is more reliably exposed in the hole 22b even if the misalignment between the coaxial wire 10 and the installation position of the hole increases. It is supposed to
- the multilayer wiring board 1 shown in FIG. 1 is manufactured.
- the diameter or the lateral width D1 of the holes 22a and 22b provided in the base material 22 is configured to be larger than the outer diameter D2 of the shield layer 13 of the coaxial wire 10. ing. Therefore, even if the arrangement position of the coaxial wire 10 is slightly deviated from the processing position of the holes 22a and 22b (vias) for exposing the shield layer 13 of the coaxial wire 10, the diameter or the lateral width D1 of the holes 22a and 22b.
- the shield layer 13 of the coaxial wire 10 can be sufficiently exposed in the holes 22a and 22b, and the shield layer 13 of the coaxial wire 10 and It becomes possible to electrically connect the outer layer electrode 23 more reliably by the metal layer 24.
- a sufficient shielding effect can be reliably obtained.
- the coaxial wire 10 since the coaxial wire 10 is used, even if it is a multilayer wiring board in which the wire pitch between adjacent conductors becomes fine (for example, 0.3 mm or less) and is densified. And the influence of crosstalk due to electromagnetic interference can be suppressed.
- the holes 22a and 22b are non-through holes. Therefore, the holes 22a and 22b can be produced in the range required to electrically connect the shield layer 13 of the coaxial wire 10 and the outer layer electrode 23, so the holes 22a and 22b can be easily produced. it can.
- the holes 22a and 22b are non-through holes, the holes 22a and 22b are formed only to the required depth of the wiring layer, so other wirings can be arranged in the wiring layer deeper than that. Can be achieved.
- the diameter or the lateral width D1 of the holes 22a and 22b may be 1.2 times or more and 3 times or less the outer diameter D2 of the shield layer 13 of the coaxial wire 10.
- the diameter or width D1 of the holes 22a and 22b is 1.2 times or more the outer diameter of the shield layer 13 of the coaxial wire 10
- the wiring position accuracy of the wiring of the coaxial wire 10 in the multilayer wiring board 1 is acceptable.
- the shield layer 13 can be sufficiently exposed in the holes 22 a and 22 b, and the shield layer 13 and the outer layer electrode 23 Can be electrically connected more reliably by the metal layer 24.
- the multilayer wiring board 1 does not need to have holes larger than necessary, and the surface layer of the multilayer wiring board 1 The degree of freedom in design of the wiring pattern (wiring circuit) provided in
- the vertical width D3 of the hole 22b may be different from the horizontal width D1 of the hole 22b.
- the hole shape can be made more suitable for the formation of the metal layer 24 or the like.
- the horizontal width D1 of the hole 22b may be wider than the vertical width D3. In this case, it is possible to widen the allowable range of displacement of the arrangement position of the coaxial wire 10 with respect to the processing position of the hole 22b (via) for exposing the shield layer 13 of the coaxial wire 10, and the surface layer by forming the hole 22b. It is possible to suppress the reduction in the degree of freedom in the design of the wiring pattern.
- the diameter or lateral width D1 of the holes 22a and 22b of the base 22 is greater than the outer diameter of the shield layer 13 of the coaxial wire 10.
- the holes are made to be large.
- the diameter or width D1 of the holes 22a and 22b may be small even if the arrangement position of the coaxial wire 10 is slightly deviated from the processing position of the holes 22a and 22b (vias) for exposing the shield layer 13 of the coaxial wire 10.
- the shield layer 13 of the coaxial wire 10 can be sufficiently exposed in the holes 22a and 22b, and the shield layer 13 of the coaxial wire 10 and It becomes possible to electrically connect the outer layer electrode 23 more reliably by the metal layer 24.
- multilayer wiring board 1 having a sufficient shielding effect can be easily obtained.
- the diameter or width D1 of the holes 22a and 22b is larger than the outer diameter of the shield layer 13 of the coaxial wire 10
- the shield layer 13 is referred to the main portion 22c of the holes 22a and 22b.
- the main portions 22c of the holes 22a and 22b for exposing the shield layer 13 of the coaxial wire 10 are drilled at a high processing speed, and then laser processing with higher processing accuracy is performed to damage the shield layer 13.
- the holes 22a and 22b for exposing the shield layer 13 of the coaxial wire 10 can be formed early and surely.
- FIG. 5 is a cross-sectional view showing a multilayer wiring board according to another embodiment of the present invention.
- the multilayer wiring board 1 a includes a coaxial wire 10, a base 20, an adhesive sheet 21, a base 22, an outer layer electrode 23, and a metal layer 24. , And insulating substrates 27 and 28. Further, in the multilayer wiring board 1a, a through hole 29 penetrating from one outer surface to the other outer surface is provided.
- the copper-clad laminate 26 including 100% (50% of the entire outer circumference) of the upper outer periphery of the shield layer 13 of the coaxial wire 10 and the copper foil 26a (metal foil) of the same potential is exposed.
- a hole 22d is provided. By plating the holes 22 d, the outer layer electrode 23 and the shield layer 13 of the coaxial wire 10 are electrically connected by the metal layer 24 through the copper foil 26 a of the copper clad laminate 26.
- the multilayer wiring board 1 a further includes the copper-clad laminate 26 disposed on the lower surface side of the adhesive sheet 21, and the copper foil 26 a of the copper-clad laminate 26 is the same as the shield layer 13 of the coaxial wire 10.
- the shield layer 13 is electrically connected to the metal layer 24 through the copper foil 26 a of the copper-clad laminate 26 so as to be a potential.
- the depth of the holes 22d can be made constant without making the depth of the holes 22d deeper than a certain level or more, the variation in quality due to production can be suppressed.
- the multilayer wiring board which concerns on this embodiment, and its manufacturing method were demonstrated in detail, this invention is not limited to the said embodiment, Various embodiment is applicable.
- the number of holes for exposing the shield layer 13 and connecting with the outer layer electrode 23 is not necessarily one. Multiple holes may be provided.
- FIG. 6 when the coaxial wire 10 is laid from the first point 15a to the second point 15b, two or more of the holes 22a and the metal layer 24 described above are provided in the middle thereof
- the shield layer 13 of the coaxial wire 10 and the outer layer electrode 23 may be electrically connected at a plurality of places, and in the example shown in FIG.
- the shield layer 13 and the outer layer electrode 23 are connected at a location. At this time, all the four holes may be configured to be larger than the outer diameter of the shield layer 13 of the coaxial wire 10 as the holes 22a shown in FIG. Otherwise, the configuration may be different (for example, the configuration of FIG. 7).
- the metal layer 24 covers a half (less than 50%) of the upper outer periphery of the shield layer 13, and the hole 122 e is smaller than the outer diameter of the shield layer 13. .
- the substrate 20, the adhesive sheet 21, the coaxial wire 10, the substrate 22, and the metal foil 23a are prepared according to the procedure shown in FIGS.
- a laminate was prepared by sequentially laminating (the outer layer electrode 23) (see (c) in FIG. 2).
- the outer diameter D2 of the shield layer 13 of the coaxial wire 10 in this laminate was 0.24 mm.
- four types of drills having drill diameters of 0.2 mm, 0.3 mm, 0.5 mm and 0.7 mm (manufactured by Union Tool Co., Ltd., trade name: UC30) were prepared.
- a CO 2 laser manufactured by Via Mechanics Co., Ltd., trade name: LC-2Q252 was prepared.
- the shield layer 13 of the coaxial wire 10 and the outer layer electrode 23 are electrically connected by metal plating. Drilling was performed toward (see (d) in FIG. 2). At this time, after the coaxial wire 10 and the drill hole were positioned, drilling was performed until the topmost part of the shield layer 13 of the coaxial wire 10 was approached to about 0.05 mm at the closest position. In this drilling, a drill with a 0.3 mm drill diameter was used as Example 1.
- Example 2 it carried out similarly to Example 1 except having used the drill whose drill diameter is 0.5 mm, and produced the structure shown to (e) of FIG.
- Example 3 a configuration shown in (e) of FIG. 2 was produced in the same manner as in Example 1 except that a drill having a drill diameter of 0.7 mm was used.
- non-through holes were produced in the laminate shown in (c) of FIG. 2 in the same manner as in Example 1 except that a drill having a drill diameter of 0.2 mm was used as Comparative Example 1.
- Such positional deviation is affected by the wiring position accuracy (permissible error ⁇ 0.05 mm) of the coaxial wire 10 with respect to the design value and the dimensional contraction difference (eg, 0.12 mm) of the multilayer wiring board. It was considered that when the non-through holes having a diameter smaller than the outer diameter are provided, these effects can not be sufficiently absorbed.
- the alignment of the coaxial wire 10 with the hole 22a which is the non-through hole provided in the laminated body of FIG. 2C can be easily performed.
- a stable electrical connection between the shield layer 13 (70% or more of the upper outer periphery and 35% or more of the entire outer periphery) exposed to the hole 22a and the outer layer electrode 23 can be made to coincide with the center of the coaxial wire 10 I was able to get it.
- the diameter of the hole 22a is 0.3 mm, 0.5 mm and 0.7 mm larger than the outer diameter of the shield layer 13 of the coaxial wire 10, and the wiring position of the coaxial wire 10 with respect to the design value Even if there were effects of accuracy (tolerance ⁇ 0.05 mm) and dimensional shrinkage difference (eg, 0.12 mm) of the multilayer wiring board, it was considered that these effects could be sufficiently absorbed.
- Table 1 below shows the relationship between the drill diameter (corresponding to the diameter D1 of the hole 21a) and the outer diameter D2 of the shield layer 13 used in Examples 1 to 3 and Comparative Example 1, and the hole 21a and the shield layer 13 It shows what was summarized about the presence or absence of deviation.
- the shield layer 13 and the outer layer electrode 23 can be reliably electrically connected by the metal layer 24, and a sufficient shielding effect can be reliably obtained.
- the present invention can be applied to multilayer wiring boards provided with coaxial wires.
- 1, 1a multilayer wiring board, 10: coaxial wire, 11: signal line, 12: insulating layer, 13: shield layer, 14: conductor fixing layer, 20: base material, 21: adhesive sheet, 22: base material, 22a , 22b, 22d: hole, 22c: main part, 23: outer layer electrode, 24: metal layer, 26: copper-clad laminate, 26a: copper foil, 27, 28: insulating base material, 29: through hole, D1: diameter Or horizontal width, D2: outer diameter of shield layer, D3: vertical width.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Provided is a multilayer wiring plate equipped with a coaxial wire. This multilayer wiring plate 1 comprises: a coaxial wire 10 having a signal line 11, an insulation layer 12, and a shield layer 13, and extending in a first direction; an adhesive sheet 21 spread along a plane direction defined by the first direction and a second direction intersecting with the first direction, whereon the coaxial wire 10 is laid; a base material 22 disposed on the side of a first surface of the adhesive sheet 21 and provided with a hole 22a that is oriented from the external surface to the interior thereof and exposes a portion of the coaxial wire 10; an outer layer electrode 23 provided on the external surface of the base material 22; and a metal layer 24 electrically connecting the outer layer electrode 23 to the shield layer 13 of the coaxial wire 10 exposed in the hole 22a. The diameter or the horizontal width D1 of the hole 22a in the base material 22 is greater than the external diameter D2 of the shield layer 13 in the coaxial wire 10.
Description
本発明は、同軸ワイヤを備えた多層配線板及びその製造方法に関する。
The present invention relates to a multilayer wiring board provided with coaxial wires and a method of manufacturing the same.
特許文献1には、同軸ワイヤを備えた多層配線板が開示されている。この多層配線板では、内層に配置された同軸ワイヤの信号線が貫通孔の内壁に設けられためっき層を介して外層電極に接続され、また、同軸ワイヤのシールド層が非貫通孔(ビア)の内壁等に設けられためっき層及び外層電極を介して配線板の内層に位置するグランドに接続されている。特許文献2には、同軸ワイヤを備えた配線板の製造方法が開示されている。
Patent Document 1 discloses a multilayer wiring board provided with coaxial wires. In this multilayer wiring board, the signal line of the coaxial wire disposed in the inner layer is connected to the outer layer electrode through the plating layer provided on the inner wall of the through hole, and the shield layer of the coaxial wire is a non-through hole (via) It is connected to the ground located in the inner layer of a wiring board via the plating layer provided in the inner wall etc. of this, and an outer-layer electrode. Patent Document 2 discloses a method of manufacturing a wiring board provided with a coaxial wire.
特許文献1等に記載の同軸ワイヤを備えた多層配線板では、同軸ワイヤを多層配線板の外表面に近い内層に配置していることから、同軸ワイヤを多層配線板の内側の奥に配置している場合に比べて、同軸ワイヤのシールド層(外周導体)を露出させるための非貫通孔(ビア)を外側から形成し易くなっている。しかしながら、この多層配線板は熱等によって収縮してしまうこともあり、また多層配線板に用いられる同軸ワイヤが多層配線板の内層に配置されることから、同軸ワイヤのシールド層を露出させるための非貫通孔(ビア)の加工位置を同軸ワイヤの配置箇所に精度よく一致させることが難しい場合もある。仮に同軸ワイヤと非貫通孔(ビア)との位置がずれた場合(図7参照)には、金属めっきした際の接触面積の不足により接続信頼性が低下してしまい、不要電波の輻射を防止するといったシールド効果を十分に得ることができなくなる虞がある。
In the multilayer wiring board provided with the coaxial wire described in Patent Document 1 etc., since the coaxial wire is disposed in the inner layer close to the outer surface of the multilayer wiring board, the coaxial wire is disposed in the inner back of the multilayer wiring board. As compared with the case of the above, it is easier to form a non-through hole (via) for exposing the shield layer (peripheral conductor) of the coaxial wire from the outside. However, this multilayer wiring board may be shrunk due to heat or the like, and the coaxial wire used for the multilayer wiring board is disposed in the inner layer of the multilayer wiring board, so that the shield layer of the coaxial wire is exposed. In some cases, it may be difficult to precisely match the processing position of the non-through hole (via) with the placement position of the coaxial wire. If the positions of the coaxial wire and the non-through holes (vias) are shifted (see FIG. 7), the connection reliability is reduced due to the lack of contact area at the time of metal plating, and the radiation of unnecessary radio waves is prevented. There is a risk that it will not be possible to obtain a sufficient shielding effect.
本発明は、十分なシールド効果を確実に得ることができる多層配線板を提供することを目的とする。
An object of the present invention is to provide a multilayer wiring board which can reliably obtain a sufficient shielding effect.
本発明は、その一側面として、多層配線板に関する。この多層配線板は、信号線、信号線を取り囲む絶縁層、絶縁層の周りに配置されるシールド層を有し、第1方向に延在する同軸ワイヤと、第1方向及び当該第1方向に交差する第2方向により画定される面方向に沿って広がり、同軸ワイヤが布線される接着シートと、接着シートの第1の面の側に配置され、同軸ワイヤの一部を露出させる第1の孔が外表面から内に向けて設けられる基材と、基材の外表面に設けられる外層電極と、第1の孔内で露出する同軸ワイヤのシールド層と外層電極とを電気的に接続する金属層と、を備えている。この多層配線板では、基材の第1の孔の直径又は第2方向に沿った横幅が同軸ワイヤのシールド層の外径よりも大きい。
The present invention relates to a multilayer wiring board as one aspect thereof. The multilayer wiring board includes a signal line, an insulating layer surrounding the signal line, and a shield layer disposed around the insulating layer, the coaxial wire extending in a first direction, a first direction, and a first direction An adhesive sheet extending along a surface direction defined by the intersecting second direction, the adhesive sheet on which the coaxial wire is laid, and a first surface disposed on the side of the first surface of the adhesive sheet to expose a portion of the coaxial wire Electrically connect the outer layer electrode provided on the outer surface of the base material with the outer surface of the base material, the outer layer electrode of the coaxial wire exposed in the first hole, and the outer layer electrode And a metal layer to be In this multilayer wiring board, the diameter of the first hole of the base or the lateral width along the second direction is larger than the outer diameter of the shield layer of the coaxial wire.
上記の多層配線板では、基材に設けられる第1の孔の直径又は第2方向に沿った横幅が同軸ワイヤのシールド層の外径よりも大きくなるように構成されている。この場合、同軸ワイヤのシールド層を露出させるための第1の孔(ビア)の加工位置に対して同軸ワイヤの配置箇所が多少ずれたとしても、第1の孔の直径又は横幅が同軸ワイヤのシールド層の外径よりも大きく形成されているため、第1の孔において同軸ワイヤのシールド層を十分に露出させることができ、同軸ワイヤのシールド層と外層電極とを金属層によってより確実に電気的に接続することが可能となる。その結果、この多層配線板によれば、十分なシールド効果を確実に得ることができる。また、この多層配線板では、同軸ワイヤを用いていることから、隣接する導体との間のワイヤピッチが微細(例えば0.3mm以下)となり高密度化された多層配線板であっても、電磁障害によるクロストークの影響を抑制することができる。なお、ここで用いる「布線(Wiring)」とは、同軸ワイヤを接着シートなどの上に一部が埋没するように這わせると共に、当該シートに付着させることを意味する。
In the above multilayer wiring board, the diameter or the lateral width in the second direction of the first hole provided in the substrate is configured to be larger than the outer diameter of the shield layer of the coaxial wire. In this case, even if the arrangement position of the coaxial wire is slightly deviated from the processing position of the first hole (via) for exposing the shield layer of the coaxial wire, the diameter or the lateral width of the first hole is equal to that of the coaxial wire. Since it is formed larger than the outer diameter of the shield layer, the shield layer of the coaxial wire can be sufficiently exposed in the first hole, and the shield layer of the coaxial wire and the outer layer electrode are more reliably electrically conducted by the metal layer. Connection can be made. As a result, according to this multilayer wiring board, a sufficient shielding effect can be reliably obtained. Further, in this multilayer wiring board, since coaxial wires are used, even if the wire pitch between adjacent conductors is fine (for example, 0.3 mm or less) and is a high density multilayer wiring board, It is possible to suppress the influence of crosstalk due to a failure. In addition, "wiring" (wiring) used here means that a coaxial wire is made to adhere to the said sheet while being wound so that a part may be embedded on an adhesive sheet etc.
上記の多層配線板では、第1の孔が非貫通孔であってもよい。この場合、同軸ワイヤのシールド層と外層電極とを電気的に接続するのに必要な範囲で第1の孔を作製することができるため、第1の孔を容易に作製することができる。また、第1の孔が非貫通孔である場合、必要な配線層の深さまでしか第1の孔が形成されないため、それよりも深い配線層には他の配線を配置することができ、配線の高密度化を図ることができる。
In the above multilayer wiring board, the first hole may be a non-through hole. In this case, since the first hole can be manufactured within the range required to electrically connect the shield layer of the coaxial wire and the outer layer electrode, the first hole can be easily manufactured. In addition, when the first hole is a non-through hole, the first hole is formed only to the required depth of the wiring layer, so other wirings can be arranged in the wiring layer deeper than that. Can be achieved.
上記の多層配線板では、第1の孔の直径又は横幅は、同軸ワイヤのシールド層の外径の1.2倍以上3倍以下であってもよい。このように第1の孔の直径又は横幅が同軸ワイヤのシールド層の外径の1.2倍以上である場合、多層配線板における同軸ワイヤの布線の配線位置精度が許容限界に近い値であったり又は多層配線板に対して熱収縮が生じた場合であっても、第1の孔においてシールド層を十分に露出させることができ、シールド層と外層電極とを金属層によってより確実に電気的に接続することが可能となる。一方、第1の孔の直径又は横幅がシールド層の外径の3倍以下である場合、多層配線板に必要以上に大きな孔を明けなくてよくなり、多層配線板の表層に設けられる配線パターン(配線回路)の設計自由度を高めることができる。
In the above multilayer wiring board, the diameter or the lateral width of the first hole may be not less than 1.2 times and not more than 3 times the outer diameter of the shield layer of the coaxial wire. Thus, when the diameter or lateral width of the first hole is 1.2 times or more of the outer diameter of the shield layer of the coaxial wire, the wiring position accuracy of the coaxial wire wiring in the multilayer wiring board is a value close to the allowable limit. Even if heat shrinkage occurs to the multilayer wiring board, the shield layer can be sufficiently exposed in the first hole, and the shield layer and the outer layer electrode are more reliably electrically conducted by the metal layer. Connection can be made. On the other hand, when the diameter or width of the first hole is not more than three times the outer diameter of the shield layer, it is not necessary to make a hole larger than necessary in the multilayer wiring board, and a wiring pattern provided on the surface of the multilayer wiring board It is possible to increase the design freedom of (wiring circuit).
上記の多層配線板では、第1の孔の第1方向に沿った縦幅は、第1の孔の横幅と異なっていてもよい。この場合、金属層の形成等により適した孔形状とすることができる。また、この多層配線板では、第1の孔の横幅がその縦幅よりも広くてもよい。この場合、同軸ワイヤのシールド層を露出させるための第1の孔(ビア)の加工位置に対する、同軸ワイヤの配置箇所のずれの許容範囲を広くすることができると共に、孔の形成による表層の配線パターンの設計自由度の低下を抑制することができる。
In the multilayer wiring board described above, the vertical width of the first hole in the first direction may be different from the horizontal width of the first hole. In this case, the hole shape can be made more suitable for the formation of the metal layer and the like. Further, in this multilayer wiring board, the horizontal width of the first hole may be wider than the vertical width thereof. In this case, it is possible to widen the tolerance of deviation of the arrangement position of the coaxial wire with respect to the processing position of the first hole (via) for exposing the shield layer of the coaxial wire, and to wire the surface layer by forming the hole. It is possible to suppress a decrease in the degree of freedom in pattern design.
上記の多層配線板は、金属箔を有し、接着シートの第1の面と逆の第2の面側に配置される積層板を更に備えてもよく、この積層板の金属箔は、同軸ワイヤと同電位になるように構成されており、金属層は、金属箔に電気的に接続されてもよい。この場合、第1の孔の深さを一定以上深くすることなく、また、その深さを一定にできる作用があるため、生産による品質ばらつきを抑えることができる。
The above-mentioned multilayer wiring board may further comprise a laminate having a metal foil and disposed on the second surface opposite to the first surface of the adhesive sheet, and the metal foil of this laminate is coaxial The metal layer is configured to be at the same potential as the wire, and the metal layer may be electrically connected to the metal foil. In this case, since the first hole has an action of making the depth constant without making the depth of the first hole deeper than a certain level, it is possible to suppress the variation in quality due to production.
上記の多層配線板では、基材には、同軸ワイヤの一部とは異なる他部を露出させる第2の孔が設けられてもよく、第2の孔内に露出する同軸ワイヤのシールド層と外層電極とが金属層により電気的に接続されてもよい。この場合、同軸ワイヤのシールド層と外層電極とが2箇所以上で電気的に接続されることになり、両者の接続信頼性を更に高めることができ、十分なシールド効果をより確実に得ることができる。また、この場合において、第2の孔の直径又は第2方向に沿った横幅が同軸ワイヤのシールド層の外径より大きくてもよい。この場合、第1及び第2の孔のいずれにおいても、同軸ワイヤのシールド層と外層電極とが電気的により確実に接続されることになり、十分なシールド効果をより一層確実に得ることができる。
In the multilayer wiring board described above, the base material may be provided with a second hole exposing another portion different from a part of the coaxial wire, and the shield layer of the coaxial wire exposed in the second hole The outer layer electrode may be electrically connected by the metal layer. In this case, the shield layer of the coaxial wire and the outer layer electrode are electrically connected at two or more points, and the connection reliability between the both can be further enhanced, and a sufficient shielding effect can be obtained more reliably. it can. Also, in this case, the diameter of the second hole or the lateral width along the second direction may be larger than the outer diameter of the shield layer of the coaxial wire. In this case, in either of the first and second holes, the shield layer of the coaxial wire and the outer layer electrode are electrically more reliably connected, and a sufficient shielding effect can be obtained more reliably. .
また、本発明は、別の側面として、多層配線板の製造方法に関する。この多層配線板の製造方法は、信号線、信号線を取り囲む絶縁層、絶縁層の周りに配置されるシールド層を有する同軸ワイヤを準備する工程と、第1方向及び当該第1方向に交差する第2方向により画定される面方向に沿って広がる接着シートを準備する工程と、少なくとも一部が第1方向に沿うように同軸ワイヤを接着シートに布線する工程と、同軸ワイヤが布線された接着シートの上に基材を積層する工程と、基材の外表面に外層電極を設ける工程と、基材において同軸ワイヤが布線されている領域の一部に、同軸ワイヤの一部が露出するように外表面から内に向かって孔を設ける工程と、孔内に露出する同軸ワイヤのシールド層と外層電極とを金属層によって電気的に接続する工程と、を備えている。この製造方法では、孔を設ける工程において、基材の孔の直径又は第2方向に沿った横幅が同軸ワイヤのシールド層の外径よりも大きくなるように、孔を設ける。
Moreover, this invention relates to the manufacturing method of a multilayer wiring board as another aspect. The method for manufacturing a multilayer wiring board includes the steps of preparing a coaxial wire having a signal line, an insulating layer surrounding the signal line, and a shield layer disposed around the insulating layer, and crossing the first direction and the first direction. Providing an adhesive sheet extending along a surface direction defined by the second direction; arranging a coaxial wire on the adhesive sheet such that at least a portion of the adhesive sheet extends along the first direction; A step of laminating the substrate on the adhesive sheet, a step of providing the outer layer electrode on the outer surface of the substrate, a part of the coaxial wire in a part of the region where the coaxial wire is wired in the substrate The method further comprises the steps of: forming a hole inward from the outer surface so as to be exposed; and electrically connecting the shield layer of the coaxial wire exposed in the hole and the outer layer electrode with a metal layer. In this manufacturing method, in the step of providing the hole, the hole is provided such that the diameter of the hole in the base or the lateral width in the second direction is larger than the outer diameter of the shield layer of the coaxial wire.
上記の多層配線板の製造方法では、孔を設ける工程において、基材の孔の直径又は第2方向に沿った横幅が同軸ワイヤのシールド層の外径よりも大きくなるように、孔を設けている。この場合、同軸ワイヤのシールド層を露出させるための第1の孔(ビア)の加工位置に対して同軸ワイヤの配置箇所が多少ずれたとしても、第1の孔の直径又は横幅が同軸ワイヤのシールド層の外径よりも大きく形成されているため、第1の孔において同軸ワイヤのシールド層を十分に露出させることができ、同軸ワイヤのシールド層と外層電極とを金属層によってより確実に電気的に接続することが可能となる。その結果、この多層配線板の製造方法によれば、十分なシールド効果を有する多層配線板を容易に得ることができる。
In the method of manufacturing a multilayer wiring board described above, in the step of providing the hole, the hole is provided such that the diameter of the hole in the base or the lateral width along the second direction is larger than the outer diameter of the shield layer of the coaxial wire. There is. In this case, even if the arrangement position of the coaxial wire is slightly deviated from the processing position of the first hole (via) for exposing the shield layer of the coaxial wire, the diameter or the lateral width of the first hole is equal to that of the coaxial wire. Since it is formed larger than the outer diameter of the shield layer, the shield layer of the coaxial wire can be sufficiently exposed in the first hole, and the shield layer of the coaxial wire and the outer layer electrode are more reliably electrically conducted by the metal layer. Connection can be made. As a result, according to this method of manufacturing a multilayer wiring board, a multilayer wiring board having a sufficient shielding effect can be easily obtained.
上記の多層配線板の製造方法では、孔を設ける工程は、孔の直径又は横幅が同軸ワイヤのシールド層の外径よりも大きくなるように外表面から同軸ワイヤのシールド層の手前までドリル加工を行って孔の主要部を形成する工程と、ドリル加工を行う工程の後に、孔の主要部を基準にしてシールド層までレーザ加工を行い、孔を完成させる工程と、を備えている。この場合、同軸ワイヤのシールド層を露出させるための孔の主要部を加工速度の速いドリル加工により行い、その後、加工精度がより高いレーザ加工を行ってシールド層の破損を抑えて孔を完成させている。このため、同軸ワイヤのシールド層を露出させるための孔を早期且つ確実に形成することができる。
In the method of manufacturing a multilayer wiring board described above, in the step of providing the holes, drilling is performed from the outer surface to the front of the shield layer of the coaxial wire such that the diameter or lateral width of the holes is larger than the outer diameter of the shield layer of the coaxial wire. The steps of forming the main part of the hole and performing the drilling process are followed by laser processing up to the shield layer on the basis of the main part of the hole to complete the hole. In this case, the main part of the hole for exposing the shield layer of the coaxial wire is drilled at a high processing speed, and then laser processing with higher processing accuracy is performed to suppress breakage of the shield layer and complete the hole. ing. For this reason, the hole for exposing the shield layer of a coaxial wire can be formed early and certainly.
本発明によれば、十分なシールド効果を確実に得ることができる多層配線板及びその製造方法を提供することができる。
According to the present invention, it is possible to provide a multilayer wiring board capable of reliably obtaining a sufficient shielding effect and a method of manufacturing the same.
以下、図面を参照しつつ、本発明に係る多層配線板の実施形態について説明する。説明において、同一要素又は同一機能を有する要素には、同一符号を用いる場合があり、重複する説明は省略する。
Hereinafter, an embodiment of a multilayer wiring board according to the present invention will be described with reference to the drawings. In the description, the same reference numeral may be used for the same element or an element having the same function, and the overlapping description will be omitted.
図1は、本発明の一実施形態に係る多層配線板を示す断面図である。図1に示すように、多層配線板1は、同軸ワイヤ10、基材20、接着シート21、基材22、外層電極23、及び、金属層24を備えている。多層配線板1には、同軸ワイヤ10のシールド層13の一部(図では上部)を露出させる孔22aが基材22の外側から内にかけて設けられている。孔22aは、図1に示す実施形態では、非貫通孔であるが、貫通孔であってもよい。
FIG. 1 is a cross-sectional view showing a multilayer wiring board according to an embodiment of the present invention. As shown in FIG. 1, the multilayer wiring board 1 includes a coaxial wire 10, a base 20, an adhesive sheet 21, a base 22, an outer electrode 23, and a metal layer 24. In the multilayer wiring board 1, holes 22 a for exposing a part (upper part in the drawing) of the shield layer 13 of the coaxial wire 10 are provided from the outside to the inside of the base material 22. The holes 22a are non-through holes in the embodiment shown in FIG. 1, but may be through holes.
同軸ワイヤ10は、信号線11、信号線11を被覆して取り囲む絶縁層12、絶縁層12の周りに配置されるシールド層13、及び、シールド層13を被覆して取り囲みシールド層13を構成する複数の導体を固定する導体固定層14を備えている。同軸ワイヤ10は、図1の紙面に直交する方向(第1方向)に延在するワイヤである。
The coaxial wire 10 includes a signal line 11, an insulating layer 12 covering and surrounding the signal line 11, a shield layer 13 disposed around the insulating layer 12, and a shielding layer 13 so as to form an enclosing shield layer 13. A conductor fixing layer 14 for fixing a plurality of conductors is provided. The coaxial wire 10 is a wire extending in a direction (first direction) orthogonal to the paper surface of FIG.
信号線11は、例えば直径が50μm以上300μm以下のワイヤであり、100μm以上220μm以下のワイヤであることがより好ましく、銅、銅合金、若しくは、アルミニウム合金又はピアノ線に銅を被覆したもの等を用いることができる。信号線11は、同軸ワイヤ10において高周波信号(例えば10GHz等の電気信号)が伝送される領域である。信号線11は単線であってもよいが、撚り線であってもよい。
The signal line 11 is, for example, a wire with a diameter of 50 μm to 300 μm, and more preferably 100 μm to 220 μm, such as copper, a copper alloy, or an aluminum alloy or a piano wire coated with copper It can be used. The signal line 11 is an area through which a high frequency signal (for example, an electrical signal such as 10 GHz) is transmitted through the coaxial wire 10. The signal line 11 may be a single wire or may be a stranded wire.
絶縁層12は、信号線11を絶縁するための被覆樹脂層であり、例えば、ポリイミド系樹脂、ポリアミドイミド系樹脂、又はフッ素系樹脂から構成されている。絶縁層12は、信号線11の外周にその長手方向に沿って被覆されており、例えばその厚みを80μm以上150μm以下とすることができる。
The insulating layer 12 is a covering resin layer for insulating the signal line 11, and is made of, for example, a polyimide resin, a polyamideimide resin, or a fluorine resin. The insulating layer 12 is coated along the longitudinal direction on the outer periphery of the signal line 11, and can have a thickness of, for example, 80 μm to 150 μm.
シールド層13は、信号線11を流れる高周波信号からの電磁ノイズの外部放射を遮蔽し、隣接配置等される他のワイヤ又は各種配線に対して電磁ノイズが入らないようにするための外部導体である。シールド層13は、例えば線径が15μm以上30μm以下の複数の銅線を円周方向に沿って隙間なく配置した層であり、信号線11を被覆する絶縁層12の周りを取り囲むようにその外周に配置され、電磁ノイズの外部放出を遮蔽する。シールド層13は、これら複数の銅線の撚り線であってもよいが、遮蔽効果を実現することができれば、他の構成であってもよい。また、シールド層13は、外部ノイズが信号線11へ入射することも遮蔽する。
The shield layer 13 is an external conductor for shielding external radiation of the electromagnetic noise from the high frequency signal flowing through the signal line 11, and for preventing the electromagnetic noise from entering other wires or various wires arranged adjacent to each other. is there. The shield layer 13 is a layer in which, for example, a plurality of copper wires with a wire diameter of 15 μm to 30 μm are arranged without gaps along the circumferential direction, and the outer periphery thereof surrounds the insulating layer 12 covering the signal line 11. Are placed in and shield external emissions of electromagnetic noise. The shield layer 13 may be a stranded wire of the plurality of copper wires, but may have another configuration as long as the shielding effect can be realized. The shield layer 13 also shields external noise from entering the signal line 11.
導体固定層14は、シールド層13を構成する複数の金属線(銅線)を被覆して、同軸ワイヤ10が捻られた際などの場合であってもばらばらにならないように固定するための樹脂層であり、例えば、フッ素樹脂又はイミド系樹脂から構成されている。導体固定層14は、例えばその厚みを10μm以上50μm以下とすることができ、より好ましくは20μm以上40μm以下とすることができる。また、導体固定層14は、外部から同軸ワイヤに加えられるダメージを軽減するジャケットとしても機能する。なお、導体固定層14は、UV硬化型又は熱硬化型の接着性樹脂から構成されていてもよい。この場合、同軸ワイヤ10の接着シート21への接着性を向上させることができる。
The conductor fixing layer 14 covers a plurality of metal wires (copper wires) constituting the shield layer 13 and is a resin for fixing the coaxial wire 10 so as not to be separated even when the coaxial wire 10 is twisted or the like. It is a layer, and is made of, for example, a fluorine resin or an imide resin. The thickness of the conductor fixed layer 14 can be, for example, 10 μm to 50 μm, and more preferably, 20 μm to 40 μm. In addition, the conductor fixing layer 14 also functions as a jacket for reducing damage externally applied to the coaxial wire. The conductor fixing layer 14 may be made of a UV-curable or thermosetting adhesive resin. In this case, the adhesion of the coaxial wire 10 to the adhesive sheet 21 can be improved.
基材20は、例えばプリプレグなどの絶縁性を有する基材である。「プリプレグ」とは、補強材(例えばガラスクロス)に絶縁樹脂(例えばポリイミド樹脂)を含浸させ、半硬化状態としたシート状のもの、又は、この半硬化状態のシート状のものを用いて、加熱加圧による積層一体化等により硬化形成した絶縁層をいう。
The substrate 20 is a substrate having an insulating property such as, for example, a prepreg. The “prepreg” is a sheet of a semi-cured state in which a reinforcing material (eg, glass cloth) is impregnated with an insulating resin (eg, a polyimide resin), or a sheet of this semi-cured state. It refers to an insulating layer that is cured and formed by laminating and integrating by heating and pressing.
接着シート21は、布線により少なくとも下方の一部(図1の例では下側半分)がその中に埋め込まれた同軸ワイヤ10を、含有された接着剤成分等を硬化することで、接着シート21上に固定するための層である。接着シート21は、例えばフェノキシ系樹脂、ポリアミドイミド系樹脂、又は、ビスマレイミド系樹脂の何れか1種類の接着性樹脂成分を含んで構成されている。接着シート21を構成する接着性樹脂成分は、UV硬化型又は熱硬化型のいずれであってもよい。また、接着シート21は、例えばその厚みが300μm以上700μm以下とすることができ、より好ましくは400μm以上500μm以下とすることができる。ここで用いる「布線」とは、同軸ワイヤを接着シートの上に一部が埋没するように所定の配線パターンに沿って這わせると共に、当該接着シートに付着させることを意味する。この付着は例えば超音波によって実行することができる。なお、接着シート21の上方側には基材22が積層されている。
The adhesive sheet 21 is an adhesive sheet by curing the adhesive component contained in the coaxial wire 10 in which at least a part of the lower part (the lower half in the example of FIG. 1) is embedded by wiring. 21 is a layer for fixing on top. The adhesive sheet 21 contains, for example, an adhesive resin component of any one of a phenoxy resin, a polyamideimide resin, and a bismaleimide resin. The adhesive resin component constituting the adhesive sheet 21 may be either of a UV curing type or a thermosetting type. The adhesive sheet 21 can have a thickness of, for example, 300 μm to 700 μm, and more preferably, 400 μm to 500 μm. As used herein, “wired” means that the coaxial wire is wound along a predetermined wiring pattern so that a part thereof is embedded on the adhesive sheet, and is attached to the adhesive sheet. This attachment can be performed, for example, by ultrasound. A base 22 is laminated on the upper side of the adhesive sheet 21.
基材22は、基材20と同様に、例えばプリプレグなどの絶縁性を有する基材である。基材22は、接着シート21上に布線された同軸ワイヤ10の一部(例えば、上方半分)がその中に位置するように、接着シート21の上に積層されている。また、基材22には、同軸ワイヤ10のシールド層13の上部表面が露出するように孔22a(第1の孔)が設けられている。孔22aは、多層配線板1の外表面から内に向かって形成された非貫通孔である。孔22aは、多層配線板1の構成によっては、一方の外表面から他方の外表面まで貫通する貫通孔であってもよい。なお、孔22aでは、導体固定層14が一部(上部)削られた構成となっており、シールド層13が露出するようになっている。
The substrate 22 is, like the substrate 20, a substrate having insulation, such as a prepreg. The substrate 22 is laminated on the adhesive sheet 21 such that a portion (e.g., the upper half) of the coaxial wire 10 wired on the adhesive sheet 21 is located therein. Further, the base 22 is provided with a hole 22a (first hole) so that the upper surface of the shield layer 13 of the coaxial wire 10 is exposed. The holes 22 a are non-through holes formed inward from the outer surface of the multilayer wiring board 1. The holes 22 a may be through holes penetrating from one outer surface to the other outer surface depending on the configuration of the multilayer wiring board 1. In the hole 22a, the conductor fixing layer 14 is partially (upper) scraped, and the shield layer 13 is exposed.
外層電極23は、基材22の外層の表面に設けられる電極層である。外層電極23は、例えば、銅箔などの金属箔から構成され、プリプレグ等からなる基材22上に貼り付けられる。外層電極23の厚みは、例えば、5μm以上70μm以下であってもよい。
The outer layer electrode 23 is an electrode layer provided on the surface of the outer layer of the base material 22. The outer layer electrode 23 is made of, for example, a metal foil such as copper foil, and is stuck on a base material 22 made of a prepreg or the like. The thickness of the outer layer electrode 23 may be, for example, 5 μm or more and 70 μm or less.
金属層24は、孔22a内で露出する同軸ワイヤ10のシールド層13と外層電極23とを電気的に接続するための導電層である。金属層24は、シールド層13の露出した領域を覆う第1領域24aと、シールド層13の露出領域を除く孔22aの底面上に設けられる第2領域24bと、孔22aの内周面上に設けられる第3領域24cと、外層電極23上に設けられる第4領域24dとを有しており、例えばめっき処理によって、これら第1領域24a~第4領域24dが一括して形成される。金属層24の厚みは、例えば、10μm以上30μm以下であってもよい。
The metal layer 24 is a conductive layer for electrically connecting the shield layer 13 of the coaxial wire 10 exposed in the hole 22 a and the outer layer electrode 23. The metal layer 24 includes a first region 24 a covering the exposed region of the shield layer 13, a second region 24 b provided on the bottom of the hole 22 a excluding the exposed region of the shield layer 13, and an inner peripheral surface of the hole 22 a. A third region 24c is provided, and a fourth region 24d provided on the outer layer electrode 23. The first region 24a to the fourth region 24d are collectively formed, for example, by plating. The thickness of the metal layer 24 may be, for example, 10 μm or more and 30 μm or less.
ここで、基材22に設けられる孔22aについて、更に詳細に説明する。孔22aは、例えば平面視した際に、円形(図3参照)、楕円形、又は、四角形(図4参照)などの多角形といった形状を呈する孔であり、その内径又は横幅D1が同軸ワイヤ10のシールド層13の外径D2よりも広くなるように形成されている。孔22aの内径又は横幅D1は、同軸ワイヤ10を布線する方向(第1方向)に直交(交差)する方向(第2方向、図1の左右方向)に沿った長さである。孔22aは、その内径又は横幅D1がシールド層13の外径D2の1.2倍以上3倍以下であることがより好ましい。孔22aの内径又は横幅D1がシールド層13の外径D2の1.2倍以上であることにより、多層配線板1における同軸ワイヤ10の布線の配線位置精度が許容限界に近い値であったり(その分、所定位置より孔22aが横にずれたり)、又は多層配線板1に対して熱収縮が生じた場合であっても、孔22aにおいてシールド層13を十分に露出させることができ、シールド層13と外層電極23とを金属層24によってより確実に電気的に接続することが可能となる。ここで、孔22aにおいてシールド層13を十分に露出させるには、孔22a内においてシールド層13の上部外周の50%以上(全外周の25%以上)が露出している部分を有することが好ましく、上部外周の70%以上(全外周の35%以上)がより好ましく、上部外周の90%以上(全外周の45%以上)がさらに好ましい。一方、孔22aの直径又は横幅D1がシールド層13の外径の3倍以下であることにより、多層配線板1に必要以上に大きな孔を明けなくてよくなり、多層配線板1の表層に設けられる配線パターン(配線回路)の設計自由度を高めることができる。
Here, the holes 22 a provided in the base material 22 will be described in more detail. The hole 22a is, for example, a hole having a shape such as a circle (see FIG. 3), an ellipse, or a polygon such as a square (see FIG. 4) in plan view, and its inner diameter or width D1 is the coaxial wire 10 Is formed to be wider than the outer diameter D2 of the shield layer 13 of FIG. The inner diameter or the lateral width D1 of the hole 22a is a length along a direction (second direction, right and left direction in FIG. 1) orthogonal (intersecting) to the direction (first direction) in which the coaxial wire 10 is wired. More preferably, the inner diameter or the lateral width D1 of the hole 22a is not less than 1.2 times and not more than 3 times the outer diameter D2 of the shield layer 13. When the inner diameter or the lateral width D1 of the hole 22a is 1.2 or more times the outer diameter D2 of the shield layer 13, the wiring position accuracy of the wiring of the coaxial wire 10 in the multilayer wiring board 1 is a value close to the allowable limit Even if the holes 22a are shifted laterally from the predetermined position or heat contraction occurs to the multilayer wiring board 1, the shield layer 13 can be sufficiently exposed in the holes 22a. It is possible to electrically connect the shield layer 13 and the outer layer electrode 23 more reliably by the metal layer 24. Here, in order to sufficiently expose the shield layer 13 in the hole 22a, it is preferable to have a portion where 50% or more (25% or more of the entire outer periphery) of the upper outer periphery of the shield layer 13 is exposed in the hole 22a. 70% or more of the upper outer periphery (35% or more of the entire outer periphery) is more preferable, and 90% or more of the upper outer periphery (45% or more of the entire outer periphery) is more preferable. On the other hand, when the diameter or width D1 of the hole 22 a is not more than three times the outer diameter of the shield layer 13, it is not necessary to make a hole larger than necessary in the multilayer wiring board 1. The degree of freedom in designing the wiring pattern (wiring circuit) can be increased.
また、孔22aは、図3に示す例では平面視円形の孔であるが、これに限定されることはなく、角部を丸めた略矩形形状であってもよい(図4参照)。この場合、孔22bの横幅D1は、同軸ワイヤ10の布線方向に沿った縦幅D3と異なっており、横幅D1が縦幅D3よりも広くなっている。
Further, although the holes 22a are circular in plan view in the example shown in FIG. 3, the holes 22a are not limited to this, and may have a substantially rectangular shape with rounded corners (see FIG. 4). In this case, the horizontal width D1 of the hole 22b is different from the vertical width D3 along the wiring direction of the coaxial wire 10, and the horizontal width D1 is wider than the vertical width D3.
次に、図2を参照して、同軸ワイヤ10のシールド層13が露出する孔22aを備えた多層配線板の製造方法について説明する。図2は、図1に示す多層配線板の製造方法を示す図である。
Next, with reference to FIG. 2, a method of manufacturing a multilayer wiring board provided with the holes 22 a to which the shield layer 13 of the coaxial wire 10 is exposed will be described. FIG. 2 is a view showing a method of manufacturing the multilayer wiring board shown in FIG.
まず、信号線11、絶縁層12、シールド層13及び導体固定層14を備える同軸ワイヤ10を準備すると共に、図2の(a)に示すように、基材20上に接着シート21を積層した積層体を準備する。なお、ここで準備した基材20及び接着シート21は、図の左右方向及び図2の紙面に直交する方向により画定される面方向に沿って広がっている。
First, the coaxial wire 10 including the signal line 11, the insulating layer 12, the shield layer 13 and the conductor fixing layer 14 is prepared, and the adhesive sheet 21 is laminated on the base 20 as shown in FIG. Prepare a laminate. The base material 20 and the adhesive sheet 21 prepared here are spread along the surface direction defined by the horizontal direction of the drawing and the direction orthogonal to the paper surface of FIG.
次に、図2の(b)に示すように、基材20及び接着シート21からなる積層体の接着シート21上に同軸ワイヤ10を布線する。同軸ワイヤ10の布線方向は、例えば、図2の紙面に直行する方向であるが、布線パターンによっては、途中で違う方向に曲げるようにしてもよい。同軸ワイヤ10を布線する際には、例えば同軸ワイヤ10に所定の圧力を付与しながら、超音波を与えて同軸ワイヤ10を接着シート21に固定する。これにより、所望の布線パターンとされた同軸ワイヤ10が接着シート21上に形成される。
Next, as shown in (b) of FIG. 2, the coaxial wire 10 is laid on the adhesive sheet 21 of the laminate composed of the base material 20 and the adhesive sheet 21. The wiring direction of the coaxial wire 10 is, for example, a direction orthogonal to the paper surface of FIG. 2, but depending on the wiring pattern, it may be bent in a different direction on the way. When laying the coaxial wire 10, ultrasonic waves are applied to fix the coaxial wire 10 to the adhesive sheet 21 while applying a predetermined pressure to the coaxial wire 10, for example. As a result, the coaxial wire 10 in a desired wiring pattern is formed on the adhesive sheet 21.
次に、図2の(c)に示すように、同軸ワイヤ10が布線された接着シート21の上に基材22を積層する。基材22は、例えばプリプレグから構成されており、接着シート21の上に積層した後、加熱加圧を加えることにより、接着シート21に固定される。なお、基材22の上には、外層電極23となる金属箔23a(例えば銅箔)が取り付けられている。
Next, as shown to (c) of FIG. 2, the base material 22 is laminated | stacked on the adhesive sheet 21 by which the coaxial wire 10 was wired. The base material 22 is made of, for example, a prepreg, and is fixed to the adhesive sheet 21 by applying heat and pressure after laminating on the adhesive sheet 21. A metal foil 23 a (for example, copper foil) to be the outer layer electrode 23 is attached on the base material 22.
次に、図2の(d)及び(e)に示すように、基材22において同軸ワイヤ10が布線されている領域(同軸ワイヤ10が埋設されている領域)の一部に、同軸ワイヤ10のシールド層13の上部が露出するように外表面から内に向かって孔22aを設ける。この孔22aを設ける際、まずは、図2の(d)に示すように、同軸ワイヤ10が埋設されている領域に対して、基材22の外表面から同軸ワイヤ10のシールド層13の手前までドリルにより孔を明けて、孔22aの主要部22cを作製する。そして、このドリル加工の後に、図2の(e)に示すように、孔22aの主要部22cを基準にしてシールド層13までCO2レーザを使って孔を精度よく掘り進め、同軸ワイヤ10の導体固定層14の一部を溶かし、シールド層13の上部を露出させる。
Next, as shown in (d) and (e) of FIG. 2, the coaxial wire is placed in a part of the area (the area in which the coaxial wire 10 is embedded) in the base material 22 in which the coaxial wire 10 is wired. Holes 22a are provided inward from the outer surface so that the upper portions of the ten shield layers 13 are exposed. When this hole 22a is provided, first, as shown in (d) of FIG. 2, from the outer surface of the base material 22 to the front of the shield layer 13 of the coaxial wire 10 with respect to the region where the coaxial wire 10 is embedded. A hole is drilled to make the main part 22c of the hole 22a. Then, after this drilling, as shown in (e) of FIG. 2, the CO 2 laser is used to precisely advance the hole to the shield layer 13 with reference to the main part 22 c of the hole 22 a, A portion of the conductor fixing layer 14 is melted to expose the top of the shield layer 13.
孔22aをドリル及びレーザによって形成する際、図3に示すように、孔22aの直径D1が同軸ワイヤ10のシールド層13の外径D2よりも長くなるように、孔22aを形成する。より好ましくは、孔22aの直径D1がシールド層13の外径の1.2倍以上3.0倍以下の範囲となるように孔22aを形成する。また、孔22aの形状は図3に示す円形に限られず、図4に示すように、角部を丸めた略矩形形状などの多角形であってもよく、このような形状の孔22bを設けてもよい。孔22bでは、横幅D1が縦幅D3よりも長くなっており、同軸ワイヤ10と孔の設置位置とのずれが大きくなっても、同軸ワイヤ10のシールド層13がより確実に孔22b内に露出するようになっている。
When the holes 22a are formed by a drill and a laser, as shown in FIG. 3, the holes 22a are formed such that the diameter D1 of the holes 22a is longer than the outer diameter D2 of the shield layer 13 of the coaxial wire 10. More preferably, the holes 22a are formed such that the diameter D1 of the holes 22a is in the range of not less than 1.2 times and not more than 3.0 times the outer diameter of the shield layer 13. Further, the shape of the hole 22a is not limited to the circular shape shown in FIG. 3, but as shown in FIG. 4, it may be a polygon such as a substantially rectangular shape with rounded corners, and the hole 22b of such shape is provided May be In the hole 22b, the horizontal width D1 is longer than the vertical width D3, and the shield layer 13 of the coaxial wire 10 is more reliably exposed in the hole 22b even if the misalignment between the coaxial wire 10 and the installation position of the hole increases. It is supposed to
次に、同軸ワイヤ10のシールド層13の上方が孔22a(又は孔22b)内に露出すると、無電解銅めっきなどの金属めっき処理により、シールド層13の内、孔内に露出している領域、孔22aの内周面、及び外層電極23の上方に、めっきからなる金属層24を形成する。なお、金属めっき処理の前処理としては、デスミア処理(アルカリ過マンガン酸水溶液)により孔22a(又は孔22b)内の残存異物を除去するようにしてもよい。以上により、図1に示す多層配線板1が作製される。
Next, when the upper side of the shield layer 13 of the coaxial wire 10 is exposed in the hole 22a (or the hole 22b), a region exposed in the hole in the shield layer 13 by metal plating treatment such as electroless copper plating. A metal layer 24 made of plating is formed on the inner peripheral surface of the hole 22 a and above the outer layer electrode 23. In addition, as a pretreatment of the metal plating treatment, the remaining foreign matter in the holes 22a (or the holes 22b) may be removed by a desmear treatment (an alkaline permanganic acid aqueous solution). Thus, the multilayer wiring board 1 shown in FIG. 1 is manufactured.
以上、本実施形態に係る多層配線板1によれば、基材22に設けられる孔22a,22bの直径又は横幅D1が同軸ワイヤ10のシールド層13の外径D2よりも大きくなるように構成されている。このため、同軸ワイヤ10のシールド層13を露出させるための孔22a,22b(ビア)の加工位置に対して同軸ワイヤ10の配置箇所が多少ずれたとしても、孔22a,22bの直径又は横幅D1が同軸ワイヤ10のシールド層13の外径D2よりも大きく形成されているため、孔22a,22bにおいて同軸ワイヤ10のシールド層13を十分に露出させることができ、同軸ワイヤ10のシールド層13と外層電極23とを金属層24によってより確実に電気的に接続することが可能となる。その結果、この多層配線板1によれば、十分なシールド効果を確実に得ることができる。また、この多層配線板1では、同軸ワイヤ10を用いていることから、隣接する導体との間のワイヤピッチが微細(例えば0.3mm以下)となり高密度化された多層配線板であっても、電磁障害によるクロストークの影響を抑制することができる。
As described above, according to the multilayer wiring board 1 according to the present embodiment, the diameter or the lateral width D1 of the holes 22a and 22b provided in the base material 22 is configured to be larger than the outer diameter D2 of the shield layer 13 of the coaxial wire 10. ing. Therefore, even if the arrangement position of the coaxial wire 10 is slightly deviated from the processing position of the holes 22a and 22b (vias) for exposing the shield layer 13 of the coaxial wire 10, the diameter or the lateral width D1 of the holes 22a and 22b. Is larger than the outer diameter D2 of the shield layer 13 of the coaxial wire 10, the shield layer 13 of the coaxial wire 10 can be sufficiently exposed in the holes 22a and 22b, and the shield layer 13 of the coaxial wire 10 and It becomes possible to electrically connect the outer layer electrode 23 more reliably by the metal layer 24. As a result, according to this multilayer wiring board 1, a sufficient shielding effect can be reliably obtained. Moreover, in this multilayer wiring board 1, since the coaxial wire 10 is used, even if it is a multilayer wiring board in which the wire pitch between adjacent conductors becomes fine (for example, 0.3 mm or less) and is densified. And the influence of crosstalk due to electromagnetic interference can be suppressed.
また、本実施形態に係る多層配線板1では、孔22a,22bが非貫通孔である。このため、同軸ワイヤ10のシールド層13と外層電極23とを電気的に接続するのに必要な範囲で孔22a,22bを作製することができるため、孔22a,22bを容易に作製することができる。また、孔22a,22bが非貫通孔である場合、必要な配線層の深さまでしか孔22a,22bが形成されないため、それよりも深い配線層には他の配線を配置することができ、配線の高密度化を図ることができる。
Further, in the multilayer wiring board 1 according to the present embodiment, the holes 22a and 22b are non-through holes. Therefore, the holes 22a and 22b can be produced in the range required to electrically connect the shield layer 13 of the coaxial wire 10 and the outer layer electrode 23, so the holes 22a and 22b can be easily produced. it can. In addition, when the holes 22a and 22b are non-through holes, the holes 22a and 22b are formed only to the required depth of the wiring layer, so other wirings can be arranged in the wiring layer deeper than that. Can be achieved.
また、本実施形態に係る多層配線板1では、孔22a,22bの直径又は横幅D1は、同軸ワイヤ10のシールド層13の外径D2の1.2倍以上3倍以下であってもよい。このように孔22a,22bの直径又は横幅D1が同軸ワイヤ10のシールド層13の外径の1.2倍以上である場合、多層配線板1における同軸ワイヤ10の布線の配線位置精度が許容限界に近い値であったり又は多層配線板1に対して熱収縮が生じた場合であっても、孔22a,22bにおいてシールド層13を十分に露出させることができ、シールド層13と外層電極23とを金属層24によってより確実に電気的に接続することが可能となる。一方、孔22a,22bの直径又は横幅D1がシールド層13の外径D2の3倍以下である場合、多層配線板1に必要以上に大きな孔を明けなくてよくなり、多層配線板1の表層に設けられる配線パターン(配線回路)の設計自由度を高めることができる。
In the multilayer wiring board 1 according to the present embodiment, the diameter or the lateral width D1 of the holes 22a and 22b may be 1.2 times or more and 3 times or less the outer diameter D2 of the shield layer 13 of the coaxial wire 10. As described above, when the diameter or width D1 of the holes 22a and 22b is 1.2 times or more the outer diameter of the shield layer 13 of the coaxial wire 10, the wiring position accuracy of the wiring of the coaxial wire 10 in the multilayer wiring board 1 is acceptable. Even when the value is close to the limit or thermal contraction occurs in the multilayer wiring board 1, the shield layer 13 can be sufficiently exposed in the holes 22 a and 22 b, and the shield layer 13 and the outer layer electrode 23 Can be electrically connected more reliably by the metal layer 24. On the other hand, when the diameter or width D1 of the holes 22a and 22b is not more than three times the outer diameter D2 of the shield layer 13, the multilayer wiring board 1 does not need to have holes larger than necessary, and the surface layer of the multilayer wiring board 1 The degree of freedom in design of the wiring pattern (wiring circuit) provided in
また、本実施形態に係る多層配線板1では、孔22bの縦幅D3は、孔22bの横幅D1と異なっていてもよい。この場合、金属層24の形成等により適した孔形状とすることができる。また、この多層配線板1では、孔22bの横幅D1がその縦幅D3よりも広くてもよい。この場合、同軸ワイヤ10のシールド層13を露出させるための孔22b(ビア)の加工位置に対する、同軸ワイヤ10の配置箇所のずれの許容範囲を広くすることができると共に、孔22bの形成による表層の配線パターンの設計自由度の低下を抑制することができる。
Further, in the multilayer wiring board 1 according to the present embodiment, the vertical width D3 of the hole 22b may be different from the horizontal width D1 of the hole 22b. In this case, the hole shape can be made more suitable for the formation of the metal layer 24 or the like. Further, in the multilayer wiring board 1, the horizontal width D1 of the hole 22b may be wider than the vertical width D3. In this case, it is possible to widen the allowable range of displacement of the arrangement position of the coaxial wire 10 with respect to the processing position of the hole 22b (via) for exposing the shield layer 13 of the coaxial wire 10, and the surface layer by forming the hole 22b. It is possible to suppress the reduction in the degree of freedom in the design of the wiring pattern.
また、本実施形態に係る多層配線板1の製造方法では、孔22a,22bを設ける工程において、基材22の孔22a,22bの直径又は横幅D1が同軸ワイヤ10のシールド層13の外径よりも大きくなるように、孔を設けている。この場合、同軸ワイヤ10のシールド層13を露出させるための孔22a,22b(ビア)の加工位置に対して同軸ワイヤ10の配置箇所が多少ずれたとしても、孔22a,22bの直径又は横幅D1が同軸ワイヤ10のシールド層13の外径D2よりも大きく形成されているため、孔22a,22bにおいて同軸ワイヤ10のシールド層13を十分に露出させることができ、同軸ワイヤ10のシールド層13と外層電極23とを金属層24によってより確実に電気的に接続することが可能となる。その結果、この多層配線板1の製造方法によれば、十分なシールド効果を有する多層配線板1を容易に得ることができる。
Further, in the method of manufacturing the multilayer wiring board 1 according to the present embodiment, in the step of providing the holes 22a and 22b, the diameter or lateral width D1 of the holes 22a and 22b of the base 22 is greater than the outer diameter of the shield layer 13 of the coaxial wire 10. The holes are made to be large. In this case, the diameter or width D1 of the holes 22a and 22b may be small even if the arrangement position of the coaxial wire 10 is slightly deviated from the processing position of the holes 22a and 22b (vias) for exposing the shield layer 13 of the coaxial wire 10. Is larger than the outer diameter D2 of the shield layer 13 of the coaxial wire 10, the shield layer 13 of the coaxial wire 10 can be sufficiently exposed in the holes 22a and 22b, and the shield layer 13 of the coaxial wire 10 and It becomes possible to electrically connect the outer layer electrode 23 more reliably by the metal layer 24. As a result, according to the method of manufacturing multilayer wiring board 1, multilayer wiring board 1 having a sufficient shielding effect can be easily obtained.
本実施形態に係る多層配線板の製造方法では、孔を設ける工程は、孔22a,22bの直径又は横幅D1が同軸ワイヤ10のシールド層13の外径よりも大きくなるように外表面から同軸ワイヤ10のシールド層13の手前までドリル加工を行って孔22a,22bの主要部22cを形成する工程と、ドリル加工を行う工程の後に、孔22a,22bの主要部22cを基準にしてシールド層13までレーザ加工を行い、孔22a,22bを完成させる工程と、を備えている。この場合、同軸ワイヤ10のシールド層13を露出させるための孔22a,22bの主要部22cを加工速度の速いドリル加工により行い、その後、加工精度がより高いレーザ加工を行ってシールド層13の破損を抑えて孔22a,22bを完成させている。このため、同軸ワイヤ10のシールド層13を露出させるための孔22a,22bを早期且つ確実に形成することができる。
In the method of manufacturing a multilayer wiring board according to the present embodiment, in the step of providing the holes, the diameter or width D1 of the holes 22a and 22b is larger than the outer diameter of the shield layer 13 of the coaxial wire 10 After the process of forming the main portion 22c of the holes 22a and 22b by drilling to the front of the shield layer 13 and the step of performing the drilling, the shield layer 13 is referred to the main portion 22c of the holes 22a and 22b. Laser processing to complete the holes 22a and 22b. In this case, the main portions 22c of the holes 22a and 22b for exposing the shield layer 13 of the coaxial wire 10 are drilled at a high processing speed, and then laser processing with higher processing accuracy is performed to damage the shield layer 13. To complete the holes 22a and 22b. Therefore, the holes 22a and 22b for exposing the shield layer 13 of the coaxial wire 10 can be formed early and surely.
ここで、図5を参照して、本発明の他の実施形態に係る多層配線板について説明する。図5は、本発明の他の実施形態に係る多層配線板を示す断面図である。図5に示すように、多層配線板1aは、同軸ワイヤ10、基材20、接着シート21、基材22、外層電極23、及び、金属層24を備えており、更に、銅張積層板26、絶縁基材27,28を備えている。また、多層配線板1aには、一方の外表面から他方の外表面まで貫通する貫通孔29が設けられている。
Here, a multilayer wiring board according to another embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view showing a multilayer wiring board according to another embodiment of the present invention. As shown in FIG. 5, the multilayer wiring board 1 a includes a coaxial wire 10, a base 20, an adhesive sheet 21, a base 22, an outer layer electrode 23, and a metal layer 24. , And insulating substrates 27 and 28. Further, in the multilayer wiring board 1a, a through hole 29 penetrating from one outer surface to the other outer surface is provided.
多層配線板1aでは、同軸ワイヤ10のシールド層13の上部外周の100%(全外周の50%)と、同電位の銅箔26a(金属箔)を含む銅張積層板26が露出するように孔22dが設けられている。孔22dにめっき処理が施されることにより、銅張積層板26の銅箔26aを介して外層電極23と同軸ワイヤ10のシールド層13とが金属層24により電気的に接続されている。
In the multilayer wiring board 1a, the copper-clad laminate 26 including 100% (50% of the entire outer circumference) of the upper outer periphery of the shield layer 13 of the coaxial wire 10 and the copper foil 26a (metal foil) of the same potential is exposed. A hole 22d is provided. By plating the holes 22 d, the outer layer electrode 23 and the shield layer 13 of the coaxial wire 10 are electrically connected by the metal layer 24 through the copper foil 26 a of the copper clad laminate 26.
このように、多層配線板1aは、接着シート21の下面側に配置される銅張積層板26を更に備えており、銅張積層板26の銅箔26aが同軸ワイヤ10のシールド層13と同電位になるように構成され、銅張積層板26の銅箔26aを介してシールド層13が金属層24に電気的に接続されている。この場合、孔22dの深さを一定以上よりも深くすることなく、また、深さを一定にできる作用があるため、生産による品質ばらつきを抑えることができる。
Thus, the multilayer wiring board 1 a further includes the copper-clad laminate 26 disposed on the lower surface side of the adhesive sheet 21, and the copper foil 26 a of the copper-clad laminate 26 is the same as the shield layer 13 of the coaxial wire 10. The shield layer 13 is electrically connected to the metal layer 24 through the copper foil 26 a of the copper-clad laminate 26 so as to be a potential. In this case, since the depth of the holes 22d can be made constant without making the depth of the holes 22d deeper than a certain level or more, the variation in quality due to production can be suppressed.
以上、本実施形態に係る多層配線板及びその製造方法について詳細に説明してきたが、本発明は上記実施形態に限定されるものではなく、様々な実施形態を適用することができる。例えば、上記実施形態では、基材22の1つの孔22a又は22bを設ける例を説明したが、シールド層13を露出して外層電極23と接続するための孔は1つである必要はなく、複数の孔を設けてもよい。例えば、図6に示すように、同軸ワイヤ10を第1の地点15aから第2の地点15bに向けて布線する場合、その途中において、上述した孔22aと金属層24を2箇所以上設けて、複数の箇所にて、同軸ワイヤ10のシールド層13と外層電極23とを電気的に接続する構成であってもよく、図6に示す例では、例えば、4箇所に孔22aを設け、4箇所でシールド層13と外層電極23とを接続している。また、この際、4箇所の孔すべてが図1に示す孔22aのように、同軸ワイヤ10のシールド層13の外径より大きくなる構成であってもよいし、少なくとも一部が当該構成であって、他は異なる構成(例えば図7の構成)であってもよい。少なくとも一部において、図1に示す構成の孔22a及び外層電極23を有していることにより、十分なシールド効果を確実に得ることができる多層配線板とすることができる。なお、図7に示す構成では、シールド層13の上部外周の半分弱(50%未満)を金属層24が覆う構成になっており、孔122eがシールド層13の外径よりも小さくなっている。
As mentioned above, although the multilayer wiring board which concerns on this embodiment, and its manufacturing method were demonstrated in detail, this invention is not limited to the said embodiment, Various embodiment is applicable. For example, in the above embodiment, an example in which one hole 22a or 22b of the base material 22 is provided has been described, but the number of holes for exposing the shield layer 13 and connecting with the outer layer electrode 23 is not necessarily one. Multiple holes may be provided. For example, as shown in FIG. 6, when the coaxial wire 10 is laid from the first point 15a to the second point 15b, two or more of the holes 22a and the metal layer 24 described above are provided in the middle thereof The shield layer 13 of the coaxial wire 10 and the outer layer electrode 23 may be electrically connected at a plurality of places, and in the example shown in FIG. The shield layer 13 and the outer layer electrode 23 are connected at a location. At this time, all the four holes may be configured to be larger than the outer diameter of the shield layer 13 of the coaxial wire 10 as the holes 22a shown in FIG. Otherwise, the configuration may be different (for example, the configuration of FIG. 7). By having the holes 22a and the outer layer electrode 23 configured as shown in FIG. 1 at least in part, it is possible to obtain a multilayer wiring board capable of reliably obtaining a sufficient shielding effect. In the configuration shown in FIG. 7, the metal layer 24 covers a half (less than 50%) of the upper outer periphery of the shield layer 13, and the hole 122 e is smaller than the outer diameter of the shield layer 13. .
以下、本発明を実施例により詳細に説明するが、本発明はこれらの実施例に限定されるものではない。
Hereinafter, the present invention will be described in detail by way of examples, but the present invention is not limited to these examples.
まず、図1に示す構成の多層配線板を作製するため、図2の(a)~(c)に示す手順で、基材20、接着シート21、同軸ワイヤ10、基材22、金属箔23a(外層電極23)を順に積層した積層体を作製した(図2の(c)を参照)。この積層体における同軸ワイヤ10のシールド層13の外径D2は0.24mmであった。また、ドリル径が0.2mm、0.3mm、0.5mm及び0.7mmの4種類のドリル(ユニオンツール株式会社製、商品名:UC30)を準備した。また、CO2レーザ(ビアメカニクス株式会社製、商品名:LC-2Q252)を準備した。
First, in order to produce a multilayer wiring board having the configuration shown in FIG. 1, the substrate 20, the adhesive sheet 21, the coaxial wire 10, the substrate 22, and the metal foil 23a are prepared according to the procedure shown in FIGS. A laminate was prepared by sequentially laminating (the outer layer electrode 23) (see (c) in FIG. 2). The outer diameter D2 of the shield layer 13 of the coaxial wire 10 in this laminate was 0.24 mm. In addition, four types of drills having drill diameters of 0.2 mm, 0.3 mm, 0.5 mm and 0.7 mm (manufactured by Union Tool Co., Ltd., trade name: UC30) were prepared. In addition, a CO 2 laser (manufactured by Via Mechanics Co., Ltd., trade name: LC-2Q252) was prepared.
続いて、図2の(c)に示す積層体を作製後、同軸ワイヤ10のシールド層13と外層電極23とを金属めっきにて電気的に接続するため、表層の金属箔23aから同軸ワイヤ10に向かってドリル加工を行った(図2の(d)参照)。この際、同軸ワイヤ10とドリル孔とを位置決めした後に、同軸ワイヤ10のシールド層13の最上部まで、最も近い位置において0.05mm程度に近接するまでドリル加工を行った。このドリル加工では、実施例1として0.3mmのドリル径のドリルを用いた。
Subsequently, after the laminate shown in FIG. 2C is manufactured, the shield layer 13 of the coaxial wire 10 and the outer layer electrode 23 are electrically connected by metal plating. Drilling was performed toward (see (d) in FIG. 2). At this time, after the coaxial wire 10 and the drill hole were positioned, drilling was performed until the topmost part of the shield layer 13 of the coaxial wire 10 was approached to about 0.05 mm at the closest position. In this drilling, a drill with a 0.3 mm drill diameter was used as Example 1.
続いて、ドリルによるドリル加工が終了した後、図2の(e)に示すように、加工されたドリル孔を基準にしてCO2レーザを使って20μsのパルス幅で1回加工を行った。この加工により、孔を更に深くすると共に、同軸ワイヤ10の導体固定層14の上部を取り除き、非貫通孔である孔22aを作製した。孔22aでは、同軸ワイヤ10のシールド層13が図2の(e)に示すように露出されていた。
Subsequently, after completion of drilling with a drill, machining was performed once with a pulse width of 20 μs using a CO 2 laser based on the processed drill hole as shown in (e) of FIG. By this processing, the hole was further deepened, and the upper portion of the conductor fixing layer 14 of the coaxial wire 10 was removed, and a hole 22a which was a non-through hole was produced. In the hole 22a, the shield layer 13 of the coaxial wire 10 was exposed as shown in FIG. 2 (e).
また、実施例2として、ドリル径が0.5mmのドリルを用いた以外は、実施例1と同様にして、図2の(e)に示す構成を作製した。
Moreover, as Example 2, it carried out similarly to Example 1 except having used the drill whose drill diameter is 0.5 mm, and produced the structure shown to (e) of FIG.
また、実施例3として、ドリル径が0.7mmのドリルを用いた以外は、実施例1と同様にして、図2の(e)に示す構成を作製した。
Further, as Example 3, a configuration shown in (e) of FIG. 2 was produced in the same manner as in Example 1 except that a drill having a drill diameter of 0.7 mm was used.
一方、比較例1として、ドリル径が0.2mmのドリルを用いた以外は、実施例1と同様にして、図2の(c)に示す積層体に対して、非貫通孔を作製した。
On the other hand, non-through holes were produced in the laminate shown in (c) of FIG. 2 in the same manner as in Example 1 except that a drill having a drill diameter of 0.2 mm was used as Comparative Example 1.
比較例1の場合、図2の(c)の積層体に設けた非貫通孔と同軸ワイヤとの位置合わせが難しく、非貫通孔の中心と同軸ワイヤの中心とが一致せずに横にずれてしまった。比較例については、同様の条件で13回の穴開け加工を行ったが、最もずれが大きいものでは、同軸ワイヤ10のシールド層13の外径の半分程度が非貫通孔から外れてしまい、非貫通孔に露出するシールド層13(上部外周の50%未満、全外周の25%未満)と外層電極23との安定した電気接続を得ることが難しい状態となってしまった。なお、このような位置ずれは、設計値に対する同軸ワイヤ10の配線位置精度(許容誤差±0.05mm)と多層配線板の寸法収縮差(例えば0.12mm)の影響があり、シールド層13の外径よりも小さい径を有する非貫通孔を設けた場合には、これらの影響を十分に吸収できないことが原因と考えられた。
In the case of Comparative Example 1, the alignment between the non-through hole and the coaxial wire provided in the laminate of (c) of FIG. 2 is difficult, and the center of the non-through hole and the center of the coaxial wire do not match and shift laterally It has gone. About a comparative example, although the drilling process was performed 13 times on the same conditions, about half of the outer diameter of the shield layer 13 of the coaxial wire 10 remove | deviates from the non-through hole in what has the largest deviation. It has become difficult to obtain stable electrical connection between the shield layer 13 (less than 50% of the upper outer periphery and less than 25% of the entire outer periphery) exposed to the through holes and the outer layer electrode 23. Such positional deviation is affected by the wiring position accuracy (permissible error ± 0.05 mm) of the coaxial wire 10 with respect to the design value and the dimensional contraction difference (eg, 0.12 mm) of the multilayer wiring board. It was considered that when the non-through holes having a diameter smaller than the outer diameter are provided, these effects can not be sufficiently absorbed.
これに対し、実施例1~3の場合、図2の(c)の積層体に設けた非貫通孔である孔22aと同軸ワイヤ10との位置合わせを容易に行うことができ、孔22aの中心と同軸ワイヤ10の中心とを一致させることができ、孔22aに露出したシールド層13(上部外周の70%以上、全外周の35%以上)と外層電極23との安定した電気的接続を得ることができた。これは、実施例1~3では、同軸ワイヤ10のシールド層13の外径よりも孔22aの径が0.3mm、0.5mm及び0.7mmと大きく、設計値に対する同軸ワイヤ10の配線位置精度(許容誤差±0.05mm)と多層配線板の寸法収縮差(例えば0.12mm)の影響があったとしても、これらの影響を十分に吸収することができたものと考えられた。
On the other hand, in the case of Examples 1 to 3, the alignment of the coaxial wire 10 with the hole 22a which is the non-through hole provided in the laminated body of FIG. 2C can be easily performed. A stable electrical connection between the shield layer 13 (70% or more of the upper outer periphery and 35% or more of the entire outer periphery) exposed to the hole 22a and the outer layer electrode 23 can be made to coincide with the center of the coaxial wire 10 I was able to get it. This is because in Examples 1 to 3, the diameter of the hole 22a is 0.3 mm, 0.5 mm and 0.7 mm larger than the outer diameter of the shield layer 13 of the coaxial wire 10, and the wiring position of the coaxial wire 10 with respect to the design value Even if there were effects of accuracy (tolerance ± 0.05 mm) and dimensional shrinkage difference (eg, 0.12 mm) of the multilayer wiring board, it was considered that these effects could be sufficiently absorbed.
以下の表1に、実施例1~3及び比較例1において用いたドリル径(孔21aの直径D1に相当)とシールド層13の外径D2との関係、及び、孔21aとシールド層13とのずれの有無についてまとめたものを示す。
Table 1 below shows the relationship between the drill diameter (corresponding to the diameter D1 of the hole 21a) and the outer diameter D2 of the shield layer 13 used in Examples 1 to 3 and Comparative Example 1, and the hole 21a and the shield layer 13 It shows what was summarized about the presence or absence of deviation.
以上、表1に示すように、ドリル径に相当する孔22aの直径(又は横幅)がシールド層13の外径よりも大きいことにより、孔21aとシールド層13の外形とのずれが生じにくくなることが確認できた。よって、上記実施形態の多層配線基板によれば、シールド層13と外層電極23とを金属層24によって確実に電気的に接続でき、十分なシールド効果を確実に得ることができる。
As described above, as shown in Table 1, when the diameter (or the lateral width) of the hole 22a corresponding to the drill diameter is larger than the outer diameter of the shield layer 13, the displacement between the hole 21a and the outer shape of the shield layer 13 is less likely to occur. That was confirmed. Therefore, according to the multilayer wiring board of the above embodiment, the shield layer 13 and the outer layer electrode 23 can be reliably electrically connected by the metal layer 24, and a sufficient shielding effect can be reliably obtained.
本発明は、同軸ワイヤを備えた多層配線板に適用することができる。
The present invention can be applied to multilayer wiring boards provided with coaxial wires.
1,1a…多層配線板、10…同軸ワイヤ、11…信号線、12…絶縁層、13…シールド層、14…導体固定層、20…基材、21…接着シート、22…基材、22a,22b,22d…孔、22c…主要部、23…外層電極、24…金属層、26…銅張積層板、26a…銅箔、27,28…絶縁基材、29…貫通孔、D1…直径又は横幅、D2…シールド層の外径、D3…縦幅。
1, 1a: multilayer wiring board, 10: coaxial wire, 11: signal line, 12: insulating layer, 13: shield layer, 14: conductor fixing layer, 20: base material, 21: adhesive sheet, 22: base material, 22a , 22b, 22d: hole, 22c: main part, 23: outer layer electrode, 24: metal layer, 26: copper-clad laminate, 26a: copper foil, 27, 28: insulating base material, 29: through hole, D1: diameter Or horizontal width, D2: outer diameter of shield layer, D3: vertical width.
Claims (10)
- 信号線、前記信号線を取り囲む絶縁層、前記絶縁層の周りに配置されるシールド層を有し、第1方向に延在する同軸ワイヤと、
前記第1方向及び当該第1方向に交差する第2方向により画定される面方向に沿って広がり、前記同軸ワイヤが布線される接着シートと、
前記接着シートの第1の面の側に配置され、前記同軸ワイヤの一部を露出させる第1の孔が外表面から内に向けて設けられる基材と、
前記基材の外表面に設けられる外層電極と、
前記第1の孔内で露出する前記同軸ワイヤの前記シールド層と前記外層電極とを電気的に接続する金属層と、
を備え、
前記基材の前記第1の孔の直径又は前記第2方向に沿った横幅が前記同軸ワイヤの前記シールド層の外径よりも大きい、多層配線板。 A coaxial wire extending in a first direction, having a signal line, an insulating layer surrounding the signal line, and a shield layer disposed around the insulating layer;
An adhesive sheet which extends along a surface direction defined by the first direction and a second direction intersecting the first direction, and in which the coaxial wire is laid.
A base material disposed on the side of the first surface of the adhesive sheet and provided with a first hole inward from an outer surface, which exposes a part of the coaxial wire;
An outer layer electrode provided on the outer surface of the substrate;
A metal layer electrically connecting the shield layer of the coaxial wire exposed in the first hole and the outer layer electrode;
Equipped with
The multilayer wiring board, wherein the diameter of the first hole of the substrate or the lateral width along the second direction is larger than the outer diameter of the shield layer of the coaxial wire. - 前記第1の孔が非貫通孔である、請求項1に記載の多層配線板。 The multilayer wiring board according to claim 1, wherein the first hole is a non-through hole.
- 前記第1の孔の前記直径又は前記横幅は、前記同軸ワイヤの前記シールド層の外径の1.2倍以上3倍以下である、請求項1又は2に記載の多層配線板。 The multilayer wiring board according to claim 1, wherein the diameter or the lateral width of the first hole is 1.2 times or more and 3 times or less the outer diameter of the shield layer of the coaxial wire.
- 前記第1の孔の前記第1方向に沿った縦幅は、前記第1の孔の前記横幅と異なっている、請求項1~3の何れか一項に記載の多層配線板。 The multilayer wiring board according to any one of claims 1 to 3, wherein a longitudinal width of the first hole in the first direction is different from the lateral width of the first hole.
- 前記第1の孔の前記横幅が前記縦幅よりも広い、請求項4に記載の多層配線板。 The multilayer wiring board according to claim 4, wherein the lateral width of the first hole is wider than the longitudinal width.
- 金属箔を有し、前記接着シートの前記第1の面と逆の第2の面側に配置される積層板を更に備え、
前記積層板の前記金属箔は、前記同軸ワイヤと同電位になるように構成されており、前記金属層は、前記金属箔に電気的に接続される、請求項1~5の何れか一項に記載の多層配線板。 It further comprises a laminate having a metal foil and disposed on a second side opposite to the first side of the adhesive sheet,
The metal foil of the laminate is configured to be at the same potential as the coaxial wire, and the metal layer is electrically connected to the metal foil. Multilayer wiring board as described in. - 前記基材には、前記同軸ワイヤの前記一部とは異なる他部を露出させる第2の孔が設けられ、前記第2の孔内に露出する前記同軸ワイヤの前記シールド層と前記外層電極とが前記金属層により電気的に接続される、請求項1~6の何れか一項に記載の多層配線板。 The base material is provided with a second hole that exposes the other part different from the part of the coaxial wire, and the shield layer of the coaxial wire and the outer layer electrode which are exposed in the second hole The multilayer wiring board according to any one of claims 1 to 6, wherein is electrically connected by the metal layer.
- 前記第2の孔の直径又は前記第2方向に沿った横幅が前記同軸ワイヤの前記シールド層の外径よりも大きい、請求項7に記載の多層配線板。 The multilayer wiring board according to claim 7, wherein a diameter of the second hole or a lateral width along the second direction is larger than an outer diameter of the shield layer of the coaxial wire.
- 信号線、前記信号線を取り囲む絶縁層、前記絶縁層の周りに配置されるシールド層を有する同軸ワイヤを準備する工程と、
第1方向及び当該第1方向に交差する第2方向により画定される面方向に沿って広がる接着シートを準備する工程と、
少なくとも一部が前記第1方向に沿うように前記同軸ワイヤを前記接着シートに布線する工程と、
前記同軸ワイヤが布線された前記接着シートの上に基材を積層する工程と、
前記基材の外表面に外層電極を設ける工程と、
前記基材において前記同軸ワイヤが布線されている領域の一部に、前記同軸ワイヤの一部が露出するように前記外表面から内に向かって孔を設ける工程と、
前記孔内に露出する前記同軸ワイヤの前記シールド層と前記外層電極とを金属層によって電気的に接続する工程と、
を備え、
前記孔を設ける工程では、前記基材の前記孔の直径又は前記第2方向に沿った横幅が前記同軸ワイヤの前記シールド層の外径よりも大きくなるように、前記孔を設ける、多層配線板の製造方法。 Preparing a coaxial wire having a signal line, an insulating layer surrounding the signal line, and a shield layer disposed around the insulating layer;
Providing an adhesive sheet extending along a surface direction defined by a first direction and a second direction intersecting the first direction;
Laying out the coaxial wire on the adhesive sheet so that at least a part thereof is along the first direction;
Laminating a substrate on the adhesive sheet on which the coaxial wire is wired;
Providing an outer layer electrode on the outer surface of the substrate;
Providing a hole inward from the outer surface such that a part of the coaxial wire is exposed in a part of the area where the coaxial wire is wired in the base material;
Electrically connecting the shield layer of the coaxial wire exposed in the hole and the outer layer electrode with a metal layer;
Equipped with
In the step of providing the hole, the hole is provided such that the diameter of the hole in the base or the lateral width in the second direction is larger than the outer diameter of the shield layer of the coaxial wire. Manufacturing method. - 前記孔を設ける工程は、
前記孔の直径又は前記横幅が前記同軸ワイヤの前記シールド層の外径よりも大きくなるように前記外表面から前記同軸ワイヤの前記シールド層の手前までドリル加工を行って前記孔の主要部を形成する工程と、
前記ドリル加工を行う工程の後に、前記孔の前記主要部を基準にして前記シールド層までレーザ加工を行い、前記孔を形成する工程と、
を備える、請求項9に記載の多層配線板の製造方法。 In the step of providing the holes,
The main portion of the hole is formed by drilling from the outer surface to the front of the shield layer of the coaxial wire so that the diameter or the lateral width of the hole is larger than the outer diameter of the shield layer of the coaxial wire. The process to
After the drilling step, laser processing is performed up to the shield layer on the basis of the main portion of the hole to form the hole;
The manufacturing method of the multilayer wiring board of Claim 9 provided with.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019551860A JP7051891B2 (en) | 2017-11-13 | 2017-11-13 | Multi-layer wiring board and its manufacturing method |
PCT/JP2017/040744 WO2019092881A1 (en) | 2017-11-13 | 2017-11-13 | Multilayer wiring plate and production method therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/040744 WO2019092881A1 (en) | 2017-11-13 | 2017-11-13 | Multilayer wiring plate and production method therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019092881A1 true WO2019092881A1 (en) | 2019-05-16 |
Family
ID=66438364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2017/040744 WO2019092881A1 (en) | 2017-11-13 | 2017-11-13 | Multilayer wiring plate and production method therefor |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7051891B2 (en) |
WO (1) | WO2019092881A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05267845A (en) * | 1992-03-17 | 1993-10-15 | Hitachi Chem Co Ltd | Manufacture of circuit board using coaxial wires |
JPH07115276A (en) * | 1992-03-12 | 1995-05-02 | Hitachi Chem Co Ltd | Manufacture of wiring board circuit board and manufacture of wiring board using the wiring board circuit board |
WO2014015832A1 (en) * | 2012-07-26 | 2014-01-30 | Huawei Technologies Co., Ltd. | Device and Method for Printed Circuit Board with Embedded Cable |
JP2014168050A (en) * | 2013-01-30 | 2014-09-11 | Hitachi Chemical Co Ltd | Multilayer wiring board and method for manufacturing the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5267845B2 (en) | 2008-03-05 | 2013-08-21 | カシオ計算機株式会社 | Manufacturing method of display device |
JP6275958B2 (en) | 2013-05-21 | 2018-02-07 | 株式会社東芝 | Facility operation policy determination method, facility operation policy determination device, facility operation policy determination program, and facility operation policy determination system |
-
2017
- 2017-11-13 JP JP2019551860A patent/JP7051891B2/en active Active
- 2017-11-13 WO PCT/JP2017/040744 patent/WO2019092881A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07115276A (en) * | 1992-03-12 | 1995-05-02 | Hitachi Chem Co Ltd | Manufacture of wiring board circuit board and manufacture of wiring board using the wiring board circuit board |
JPH05267845A (en) * | 1992-03-17 | 1993-10-15 | Hitachi Chem Co Ltd | Manufacture of circuit board using coaxial wires |
WO2014015832A1 (en) * | 2012-07-26 | 2014-01-30 | Huawei Technologies Co., Ltd. | Device and Method for Printed Circuit Board with Embedded Cable |
JP2014168050A (en) * | 2013-01-30 | 2014-09-11 | Hitachi Chemical Co Ltd | Multilayer wiring board and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JP7051891B2 (en) | 2022-04-11 |
JPWO2019092881A1 (en) | 2020-11-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8536457B2 (en) | Multilayer wiring board and method for manufacturing the same | |
US8735739B2 (en) | Wiring board and method for manufacturing the same | |
US8493747B2 (en) | Flex-rigid wiring board and method for manufacturing the same | |
US9603248B2 (en) | Wiring board and method for manufacturing the same | |
JP5056080B2 (en) | Multilayer printed wiring board and manufacturing method thereof | |
KR20100138755A (en) | Boring method for printed substrate | |
JP6421968B2 (en) | Manufacturing method of multilayer wiring board | |
US20180035534A1 (en) | Printed wiring board and method for manufacturing same | |
WO2019092881A1 (en) | Multilayer wiring plate and production method therefor | |
JP2012033529A (en) | Wiring board | |
WO2021230216A1 (en) | High frequency circuit | |
US11277910B2 (en) | Wiring substrate | |
JP2019071318A (en) | Multilayer wiring board and manufacturing method therefor | |
TWI399152B (en) | Method for manufacturing blind hole in printed circuit board | |
JP2009032965A (en) | Electric wire composite printed wiring board, manufacturing method of electric wire composite printed wiring board, electric wire component, manufacturing method of electric wire component, and electronic equipment | |
JP2014072311A (en) | Multilayer wiring board and manufacturing method therefor | |
JP6963726B2 (en) | Multi-layer wiring board and its manufacturing method | |
JP2009088337A (en) | Printed circuit board and its manufacturing method | |
JP6852803B2 (en) | Multi-wire wiring board | |
TWI785868B (en) | Wiring substrate and method of manufacturing the same | |
WO2023095798A1 (en) | Printed wiring board | |
JP2019029559A (en) | Multilayer wiring board and manufacturing method thereof | |
TWM484280U (en) | Circuit board | |
KR102104185B1 (en) | Multilayer wiring board and its manufacturing method | |
JP2023111608A (en) | wiring board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17931447 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2019551860 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 17931447 Country of ref document: EP Kind code of ref document: A1 |