WO2019090731A1 - 柔性背板及柔性显示装置、制备方法 - Google Patents
柔性背板及柔性显示装置、制备方法 Download PDFInfo
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- WO2019090731A1 WO2019090731A1 PCT/CN2017/110558 CN2017110558W WO2019090731A1 WO 2019090731 A1 WO2019090731 A1 WO 2019090731A1 CN 2017110558 W CN2017110558 W CN 2017110558W WO 2019090731 A1 WO2019090731 A1 WO 2019090731A1
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- the present invention relates to the field of display technologies, and in particular, to a flexible backplane, a flexible display device, and a preparation method.
- the flexible display device affects the quality of the panel due to the critical voltage drift of the device due to Electro-Static Discharge (ESD) during contact or work.
- ESD Electro-Static Discharge
- the existing product is to attach a metal sheet for electrostatic shielding under the glass substrate, such as a copper sheet, to block external interference, but the disadvantage is that the metal sheet is not conducive to flexing or folding of the flexible display device.
- the embodiment of the invention discloses a flexible backboard, a flexible display device and a preparation method.
- the flexible backsheet and the flexible display device provided by the invention can have better flexing and folding performance while being capable of shielding static interference.
- a flexible backplane comprising a lower substrate, a carrier layer formed on one side of the lower substrate, an inorganic material layer formed on a side of the carrier layer away from the lower substrate, and formed on the carrier layer away from the A patterned metal film layer on the lower substrate side.
- a flexible display device comprising an intermediate substrate, a flexible display device formed on the intermediate substrate, and a flexible back sheet as described above, the flexible back sheet being formed on a side of the intermediate substrate away from the flexible display device, and The side of the flexible backing plate away from the lower substrate is attached to the intermediate substrate.
- a method for preparing a flexible display device comprising the steps of: providing an intermediate substrate; fabricating a flexible display device on the intermediate substrate; preparing a flexible back plate, the flexible back plate comprising a lower substrate, and a bearing formed on a side of the lower substrate a layer, an inorganic material layer formed on a side of the carrier layer away from the lower substrate, and a patterned metal film layer formed on a side of the carrier layer away from the lower substrate; and attaching the intermediate substrate to the flexible back The side of the board that is remote from the lower substrate.
- the patterned metal film layer is set On the lower substrate side, the electrostatic shielding effect can also be achieved; and the flexural performance of the patterned metal film layer is superior to that of the metal sheet, thereby ensuring the flexing or folding performance of the flexible display device; Carrying the patterned metal film layer on the carrier layer can buffer the stress damage of the flexible display device by flexing or folding, further improving the flexing or folding performance of the flexible display device; further, preparing the flexible display device of the present invention
- the method flow is relatively simple and the process yield is high.
- FIG. 1 is a schematic cross-sectional view showing a flexible display device according to a first embodiment of the present invention.
- Figure 2 is a cross-sectional view showing a flexible display device in accordance with a second embodiment of the present invention.
- Figure 3 is a cross-sectional view showing a flexible display device in accordance with a third embodiment of the present invention.
- Figure 4 is a cross-sectional view showing a flexible display device in accordance with a fourth embodiment of the present invention.
- Figure 5 is a cross-sectional view showing a flexible display device in accordance with a fifth embodiment of the present invention.
- 6a to 6d are schematic views showing a method of preparing a flexible back sheet according to a sixth embodiment of the present invention.
- FIG. 7a to 7d are schematic views showing a method of preparing a flexible back sheet according to a seventh embodiment of the present invention.
- FIGS. 8a to 8e are schematic views showing a method of manufacturing a flexible back sheet according to an eighth embodiment of the present invention.
- 9a to 9e are schematic views showing a method of manufacturing a flexible back sheet according to a ninth embodiment of the present invention.
- 10a to 10e are schematic views showing a method of manufacturing a flexible back sheet according to a tenth embodiment of the present invention.
- FIG. 1 is a schematic cross-sectional view showing a flexible display device according to a first embodiment of the present invention.
- a flexible display device 10 includes an intermediate substrate 11, a flexible display device 12 formed on the intermediate substrate 11, a flexible back sheet 13 formed on a side of the intermediate substrate 11 away from the flexible display device 12, and covering the flexible display The package substrate 14 of the device 12.
- the intermediate substrate 11 may be a flexible circuit substrate based on a resin; the material of the resin may be: polycarbonate, polyethylene terephthalate, polyimide, polyarylate, polyether. One or a combination of two or more of sulfone, polyethylene naphthalate or fiber reinforced plastic.
- the flexible display device 12 may include one or two of a liquid crystal display, an organic electroluminescence display, an electronic paper, an electrophoretic display, a touch screen, a MEMS (Micro-Electro-Mechanical System), a thin film photovoltaic cell. More than one combination.
- the flexible backplane 13 may include a lower substrate 131, a carrier layer 132 formed on a side of the lower substrate 131, an inorganic material layer 133 formed on a side of the carrier layer 132 away from the lower substrate 131, and formed on the The carrier layer 132 is away from the patterned metal film layer 134 on the side of the lower substrate 131.
- the side of the flexible backing plate 13 away from the lower substrate 131 is in contact with the intermediate substrate 11 .
- the lower substrate 131 is preferably an ultra-thin glass substrate, specifically a glass substrate having a thickness of 0.1 mm or less, more preferably an ultra-thin glass substrate having a smooth edge, so that the lower substrate 131 has a property of not being damaged after conventional bending;
- the material of the carrier layer 132 may be a resin material such as polyimide, polycarbonate, polyethylene terephthalate or the like, preferably polyimide; the inorganic material layer 133 may include oxides and/or nitrogen.
- the compound specifically, may include calcium oxide, aluminum oxide, silica, titanium oxide, indium oxide, silicon oxide, silicon nitride, aluminum nitride, or the like, which is used to prevent or prevent gas, moisture, etc. from the outside.
- the material of the patterned metal film layer 134 is preferably copper, and the pattern of the patterned metal film layer 134 may be strips, grids, or the like arranged substantially in parallel.
- the patterned metal film layer 134 is used for electrostatic shielding.
- the patterned metal film layer 134 is formed on a side of the inorganic material layer 133 away from the lower substrate 131.
- the package substrate 14 may be a resin substrate, an ultra-thin glass substrate, or the like.
- the flexible display device 10 may further include a driving circuit (not shown) that drives the flexible display device 12.
- the driving circuit is integrated on the intermediate substrate 11.
- Figure 2 is a cross-sectional view showing a flexible display device in accordance with a second embodiment of the present invention.
- the flexible display device 10a of the present embodiment is similar to the flexible display device 10 of the first embodiment, except that the patterned metal film layer 134 is embedded in the inorganic material layer 133.
- the The one side surface of the patterned metal film layer 134 adjacent to the lower substrate 131 is in contact with the carrier layer 132 and flush with a side surface of the inorganic material layer 133 adjacent to the lower substrate 131, the pattern One side surface of the metal film layer 134 away from the lower substrate 131 is substantially flush with a side surface of the inorganic material layer 133 away from the lower substrate 131.
- Figure 3 is a cross-sectional view showing a flexible display device in accordance with a third embodiment of the present invention.
- the flexible display device 10b of the present embodiment is similar to the flexible display device 10 of the first embodiment, except that the flexible back plate 13 further includes a protective layer 135, and the protective layer 135 is formed on the flexible back plate 13.
- the side of the intermediate substrate 12 is away from the patterned metal film layer 134 and the inorganic material layer 133 exposed to the gap of the patterned metal film layer 134.
- the material of the protective layer 135 is the same as that of the carrier layer 132, and may be a resin material such as polyimide, polycarbonate, or polyethylene terephthalate, preferably poly. Imide.
- Figure 4 is a cross-sectional view showing a flexible display device in accordance with a fourth embodiment of the present invention.
- the flexible display device 10c of the present embodiment is similar to the flexible display device 10a of the second embodiment, except that the flexible back plate 13 further includes a protective layer 135, and the protective layer 135 is formed on the flexible back plate 13.
- the side of the intermediate substrate 12 is away from the patterned metal film layer 134 and the inorganic material layer 133.
- the material of the protective layer 135 is the same as that of the carrier layer 132, and may be a resin material such as polyimide, polycarbonate, or polyethylene terephthalate, preferably poly. Imide.
- Figure 5 is a cross-sectional view showing a flexible display device in accordance with a fifth embodiment of the present invention.
- the flexible display device 10d of the present embodiment is similar to the flexible display device 10 of the second embodiment, The difference is that the flexible back sheet 13 further includes a reinforcing layer 136 formed between the patterned metal film layer 134 and the inorganic material layer 133.
- the material of the reinforcing layer 136 is the same as that of the carrier layer 132, and may be a resin material such as polyimide, polycarbonate or polyethylene terephthalate, preferably poly. Imide.
- a reinforcing layer may be formed between the patterned metal film layer and the inorganic material layer of the third embodiment; for example, The surface of the patterned metal film layer of Embodiment 5 is covered with a protective layer; it is not limited to the above embodiment.
- the preparation method of the flexible display device 10, 10a to 10d may include the following steps:
- An intermediate substrate 11 is provided; a flexible display device 12 is fabricated on the intermediate substrate 11; a flexible back sheet 13 is prepared; the intermediate substrate 11 is attached to the flexible back sheet 13; and a package substrate 14 is formed on the flexible display device 12.
- the preparation sequence is not limited to the above description.
- FIGS. 6a to 6d are schematic views showing a method of preparing a flexible back sheet according to a sixth embodiment of the present invention.
- a substrate 131 is provided.
- the lower substrate 131 is preferably an ultra-thin glass substrate, specifically a glass substrate having a thickness of 0.1 mm or less, and more preferably an ultra-thin glass substrate having a smooth edge, so that the lower substrate 131 has a property of not being damaged after conventional bending.
- a carrier layer 132 is formed on one surface of the lower substrate 131.
- the material of the carrier layer 132 may be a resin material such as polyimide, polycarbonate, or polyethylene terephthalate, and is preferably polyimide.
- an inorganic material layer 133 is formed on a side surface of the carrier layer 132 away from the lower substrate 131.
- the inorganic material layer 133 may include an oxide and/or a nitride, and specifically, may include oxygen Calcium, alumina, silica, titania, indium oxide, silicon oxide, silicon nitride, aluminum nitride, etc., the inorganic material layer is used to prevent or prevent gas, moisture, etc. from entering from the outside, and to block the load The gas released by layer 132.
- a patterned metal film layer 134 is formed on a side of the inorganic material layer 133 away from the carrier layer 132.
- the material of the patterned metal film layer 134 is preferably copper, and the pattern of the patterned metal film layer 134 may be strips, grids, or the like arranged substantially in parallel, and the patterned metal film layer 134 is used for electrostatic shielding. .
- FIGS. 7a to 7d are schematic views showing a method of preparing a flexible back sheet according to a seventh embodiment of the present invention.
- a substrate 131 is provided.
- the lower substrate 131 is preferably an ultra-thin glass substrate, specifically a glass substrate having a thickness of 0.1 mm or less, and more preferably an ultra-thin glass substrate having a smooth edge, so that the lower substrate 131 has a property of not being damaged after conventional bending.
- a carrier layer 132 is formed on one surface of the lower substrate 131.
- the material of the carrier layer 132 may be a resin material such as polyimide, polycarbonate, or polyethylene terephthalate, and is preferably polyimide.
- a patterned metal film layer 134 is formed on a surface of the carrier layer 132 away from the lower substrate 131.
- the material of the patterned metal film layer 134 is preferably copper, and the pattern of the patterned metal film layer 134 may be strips, grids, or the like arranged substantially in parallel, and the patterned metal film layer 134 is used for electrostatic shielding. .
- an inorganic material layer 133 is formed in the pattern gap of the patterned metal film layer 134.
- the patterned metal film layer 134 is embedded in the inorganic material layer 133, and the patterned metal film layer 134 is adjacent to the carrier substrate 132 on a side surface of the lower substrate 131, and The inorganic material layer 133 is flush with a surface of one side of the lower substrate 131, and a side surface of the patterned metal film layer 134 away from the lower substrate 131 and the inorganic material layer 133 are away from the lower substrate.
- One side surface of 131 is substantially flush.
- the inorganic material layer 133 may include an oxide and/or a nitride, and specifically, may include calcium oxide, aluminum oxide, silica, titanium oxide, indium oxide, silicon oxide, silicon nitride, aluminum nitride, or the like, the inorganic The material layer serves to prevent or prevent gas, moisture, and the like from entering from the outside, and to block the gas released by the carrier layer 132.
- FIGS. 8a to 8e are schematic views showing a method of manufacturing a flexible back sheet according to an eighth embodiment of the present invention.
- the method for preparing the flexible back sheet of the embodiment is similar to the method for preparing the flexible back sheet of the sixth embodiment, and includes providing the substrate 131 (FIG. 8a) and forming the carrier layer 132 on the lower substrate 131 (FIG. 8b). Further, an inorganic material layer 133 is formed on the carrier layer 132 (FIG. 8c), and a patterned metal film layer 134 is formed on the inorganic material layer 133 (FIG. 8d), except that the preparation method of the flexible back sheet of the present embodiment is different.
- the preparation method of the flexible back sheet of the six embodiment is one step further:
- a protective layer 135 is formed on the surface of the patterned metal film layer 134 and the surface of the inorganic material layer 133 exposed to the gap of the patterned metal film layer 134.
- the material of the protective layer 135 is the same as that of the carrier layer 132, and may be a resin material such as polyimide, polycarbonate, or polyethylene terephthalate, preferably poly. Imide.
- FIGS. 9a to 9e are schematic views showing a method of manufacturing a flexible back sheet according to a ninth embodiment of the present invention.
- the method for preparing the flexible back sheet of the present embodiment is similar to the method for preparing the flexible back sheet of the seventh embodiment, and includes providing the substrate 131 (FIG. 9a) and forming the carrier layer 132 on the lower substrate 131 (FIG. 9b).
- a patterned metal film layer 134 is further formed on the carrier layer 132 (FIG. 9c), and an inorganic material layer 133 is formed in the pattern gap of the patterned metal film layer 134 (FIG. 9d), except that the flexible back sheet of the present embodiment
- the preparation method is one step further than the preparation method of the flexible back sheet of the seventh embodiment:
- a protective layer 135 is formed on the surface of the patterned metal film layer 134 and the inorganic material layer 133.
- the material of the protective layer 135 is the same as that of the carrier layer 132, and may be a resin material such as polyimide, polycarbonate, or polyethylene terephthalate, preferably poly. Imide.
- FIGS. 10a to 10e are schematic views showing a method of manufacturing a flexible back sheet according to a tenth embodiment of the present invention.
- the method for preparing the flexible back sheet of the embodiment is similar to the method for preparing the flexible back sheet of the sixth embodiment, and includes providing the substrate 131 (FIG. 10a) and forming the carrier layer 132 on the lower substrate 131 (FIG. 10b). Further, an inorganic material layer 133 is formed on the carrier layer 132 (FIG. 10c), and a patterned metal film layer 134 is formed on the inorganic material layer (FIG. 10e), except that the preparation method of the flexible back sheet of the present embodiment is the seventh.
- the preparation method of the flexible back sheet of the embodiment has one more step:
- a reinforcing layer 136 is formed on the surface of the inorganic material layer 133, and the patterned metal film layer 134 is formed in the The reinforcing layer 136 is away from the surface of the inorganic material layer 133.
- the material of the reinforcing layer 136 is the same as that of the carrier layer 132, and may be a resin material such as polyimide, polycarbonate or polyethylene terephthalate, preferably poly. Imide.
- the flexible back plate and the flexible display device and the preparation method of the embodiments of the present technical solution have the following advantages:
- a conventional flexible display device and a manufacturing process are provided with a metal sheet under the glass substrate to block external interference.
- the patterned metal film layer is disposed above the lower substrate, and can also be electrostatically shielded. effect;
- the conventional flexible display device and the metal sheet in the preparation process can reduce the flexing or folding performance of the flexible display device; in the embodiment of the technical solution, the flexural performance of the patterned metal film layer is superior to that of the metal sheet, thereby Thereby ensuring the flexing or folding performance of the flexible display device;
- the embodiment of the technical solution further forms a carrier layer of a resin material on the lower substrate and patterns the layer
- the metal film layer is carried on the carrier layer, which can buffer the stress damage of the flexible display device by flexing or folding, and further improve the flexing or folding performance of the flexible display device;
- the patterned metal film layer of the embodiment of the present technical solution is formed inside the flexible display device, so that the performance of the flexible display device is more stable, and the metal sheet does not need to be additionally attached, that is, an additional filming process is not required, so that The process is relatively simple; and because of some yield problems in the filming process, the filming process is omitted in this case, and the relative yield of the whole process is also high.
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Abstract
一种柔性显示装置(10),包括中间基板(11),形成于中间基板(11)上的柔性显示器件(12)及柔性背板(13),柔性背板(13)形成于中间基板(11)远离柔性显示器件(12)的一侧;柔性背板(13)包括下基板(131),形成于下基板(131)一侧的承载层(132),形成于承载层(132)远离下基板(131)一侧的无机材料层(133),及形成于承载层(132)远离下基板(131)一侧的图案化金属膜层(134);柔性背板(13)的远离下基板(131)的一侧与中间基板(11)相贴。该柔性背板(13)及柔性显示装置(10),在实现静电屏蔽的同时还能保证柔性显示装置(10)的挠曲性能。
Description
本发明涉及显示技术领域,尤其涉及一种柔性背板及柔性显示装置、制备方法。
目前柔性显示装置会因在碰触或工作时因静电释放(Electro-Static Discharge,ESD)导致器件临界电压飘移而影响面板的品质。现有产品是在玻璃基板下方贴上用于静电屏蔽的金属片,如铜片,以阻隔外界干扰,但缺点就是金属片不利于柔性显示装置的挠曲或折叠。
发明内容
本发明实施例公开一种柔性背板及柔性显示装置、制备方法,本发明提出的柔性背板及柔性显示装置在能够屏蔽静电干扰的同时能够具有较好的挠曲、折叠性能。
一种柔性背板,包括下基板,形成于所述下基板一侧的承载层,形成于所述承载层远离所述下基板一侧的无机材料层,及形成于所述承载层远离所述下基板一侧的图案化金属膜层。
一种柔性显示装置,包括中间基板,形成于中间基板上的柔性显示器件及如前述的柔性背板,所述柔性背板形成于所述中间基板远离所述柔性显示器件的一侧,且所述柔性背板的远离所述下基板的一侧与所述中间基板相贴。
一种柔性显示装置的制备方法,包括步骤:提供中间基板;在中间基板上制作柔性显示器件;制备一柔性背板,所述柔性背板包括下基板,形成于所述下基板一侧的承载层,形成于所述承载层远离所述下基板一侧的无机材料层,及形成于所述承载层远离所述下基板一侧的图案化金属膜层;以及将中间基板贴附于柔性背板的远离所述下基板的一侧。
本发明的柔性背板及柔性显示装置、制备方法,将图案化的金属膜层设置
于下基板侧,同样能起到静电屏蔽的效果;而图案化金属膜层的挠曲性能比金属片的挠曲性能优异,从而也就保证了柔性显示装置的挠曲或折叠性能;并且,将图案化金属膜层承载于所述承载层上,能缓冲挠曲或折叠对柔性显示装置的应力破坏,进一步提高了柔性显示装置的挠曲或折叠性能;进一步,本发明的柔性显示装置制备方法流程较为简单,制程良率较高。
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本发明第一实施例的柔性显示装置的剖视示意图。
图2是本发明第二实施例的柔性显示装置的剖视示意图。
图3是本发明第三实施例的柔性显示装置的剖视示意图。
图4是本发明第四实施例的柔性显示装置的剖视示意图。
图5是本发明第五实施例的柔性显示装置的剖视示意图。
图6a至6d是本发明第六实施例的柔性背板的制备方法的示意图。
图7a至7d是本发明第七实施例的柔性背板的制备方法的示意图。
图8a至8e是本发明第八实施例的柔性背板的制备方法的示意图。
图9a至9e是本发明第九实施例的柔性背板的制备方法的示意图。
图10a至10e是本发明第十实施例的柔性背板的制备方法的示意图。
下面将结合本发明技术方案实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做
出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
请参考图1。图1是本发明第一实施例的柔性显示装置的剖视示意图。
一柔性显示装置10,包括中间基板11,形成于中间基板11上的柔性显示器件12、形成于所述中间基板11远离所述柔性显示器件12一侧的柔性背板13及覆盖所述柔性显示器件12的封装基板14。
其中,所述中间基板11可以为以树脂为基材的柔性电路基板;树脂的材质可以为:聚碳酸酯、聚对苯二甲酸乙二醇酯、聚酰亚胺、聚芳酯、聚醚砜、聚萘二甲酸乙二醇酯或纤维强化塑料的一种或两种以上的组合。
所述柔性显示器件12可以包括:液晶显示器、有机电致发光显示器、电子纸、电泳式显示器、触摸屏、微机电***(MEMS,Micro-Electro-Mechanical System)、薄膜光伏电池中的一种或两种以上的组合。
所述柔性背板13可以包括下基板131,形成于下基板131一侧的承载层132,形成于所述承载层132远离所述下基板131一侧的无机材料层133,及形成于所述承载层132远离所述下基板131一侧的图案化金属膜层134。其中,所述柔性背板13的远离所述下基板131的一侧与所述中间基板11相贴。
所述下基板131优选为超薄玻璃基板,具体指厚度小于等于0.1mm的玻璃基板,更优选为边缘光滑的超薄玻璃基板,从而使得下基板131具有常规弯曲后不致破损的性能;所述承载层132的材质可以为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯等树脂材料,优选为聚酰亚胺;所述无机材料层133可以包括氧化物和/或氮化物,具体地,可以包括氧化钙、氧化铝、硅石、氧化钛、氧化铟、氧化硅、氮化硅、氮化铝等,所述无机材料层用于阻止或防止气体、湿气等从外界进入,以及阻隔承载层132所释放的气体;所述图案化金属膜层134的材质优选为铜,所述图案化金属膜层134的图案可以为大致平行排列的条状、网格状等,所述图案化金属膜层134用于静电屏蔽。
本实施例中,所述图案化金属膜层134形成于所述无机材料层133远离所述下基板131的一侧。
所述封装基板14可以为树脂基板或超薄玻璃基板等。
所述柔性显示装置10还可以包括驱动所述柔性显示器件12的驱动电路(图未示)。优选地,所述驱动电路集成于所述中间基板11上。
请参考图2。图2是本发明第二实施例的柔性显示装置的剖视示意图。
本实施例的柔性显示装置10a与第一实施例的柔性显示装置10类似,其区别在于,所述图案化金属膜层134嵌设于所述无机材料层133内;本实施例中,所述图案化金属膜层134靠近所述下基板131的一侧表面与所述承载层132相接、并与所述无机材料层133靠近所述下基板131的一侧表面相齐平,所述图案化金属膜层134远离所述下基板131的一侧表面与所述无机材料层133远离所述下基板131的一侧表面大致相齐平。
请参考图3。图3是本发明第三实施例的柔性显示装置的剖视示意图。
本实施例的柔性显示装置10b与第一实施例的柔性显示装置10类似,其区别在于,所述柔性背板13还包括一保护层135,所述保护层135形成于所述柔性背板13远离所述中间基板12的一侧,并覆盖所述图案化金属膜层134及暴露于所述图案化金属膜层134间隙的所述无机材料层133。
本实施例中,所述保护层135的材质与所述承载层132的材质相同,均可以为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯等树脂材料,优选为聚酰亚胺。
请参考图4。图4是本发明第四实施例的柔性显示装置的剖视示意图。
本实施例的柔性显示装置10c与第二实施例的柔性显示装置10a类似,其区别在于,所述柔性背板13还包括一保护层135,所述保护层135形成于所述柔性背板13远离所述中间基板12的一侧,并覆盖所述图案化金属膜层134及所述无机材料层133。
本实施例中,所述保护层135的材质与所述承载层132的材质相同,均可以为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯等树脂材料,优选为聚酰亚胺。
请参考图5。图5是本发明第五实施例的柔性显示装置的剖视示意图。
本实施例的柔性显示装置10d与第二实施例的柔性显示装置10类似,其
区别在于,所述柔性背板13还包括一增强层136,所述增强层136形成于所述图案化金属膜层134与所述无机材料层133之间。
本实施例中,所述增强层136的材质与所述承载层132的材质相同,均可以为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯等树脂材料,优选为聚酰亚胺。
可以理解,本技术方案的柔性显示装置并不限于上述实施例所述,例如,也可以在实施例三的图案化金属膜层与无机材料层之间形成一增强层;又例如,也可以在实施例五的图案化金属膜层表面覆盖一保护层;并不以上述实施例为限。
所述柔性显示装置10、10a至10d的制备方法可以包括步骤:
提供中间基板11;在中间基板11上制作柔性显示器件12;制备柔性背板13;将中间基板11贴附于柔性背板13上;及在柔性显示器件12上形成封装基板14。其中,制备次序并不以以上叙述为限。
以下以实施例说明柔性背板13的制备方法。
请参考图6a至6d。图6a至6d是本发明第六实施例的柔性背板的制备方法的示意图。
本实施例的柔性背板的制备方法包括如下步骤:
首先,请参阅图6a,提供一下基板131。
所述下基板131优选为超薄玻璃基板,具体指厚度小于等于0.1mm的玻璃基板,更优选为边缘光滑的超薄玻璃基板,从而使得下基板131具有常规弯曲后不致破损的性能。
其次,请参阅图6b,在所述下基板131的一侧表面形成一承载层132。
所述承载层132的材质可以为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯等树脂材料,优选为聚酰亚胺。
再次,请参阅图6c,在所述承载层132远离所述下基板131的一侧表面形成一无机材料层133。
所述无机材料层133可以包括氧化物和/或氮化物,具体地,可以包括氧
化钙、氧化铝、硅石、氧化钛、氧化铟、氧化硅、氮化硅、氮化铝等,所述无机材料层用于阻止或防止气体、湿气等从外界进入,以及阻隔所述承载层132所释放的气体。
然后,请参阅图6d,在所述无机材料层133远离所述承载层132的一侧形成一图案化金属膜层134。
所述图案化金属膜层134的材质优选为铜,所述图案化金属膜层134的图案可以为大致平行排列的条状、网格状等,所述图案化金属膜层134用于静电屏蔽。
请参考图7a至7d。图7a至7d是本发明第七实施例的柔性背板的制备方法的示意图。
本实施例的柔性背板的制备方法包括如下步骤:
首先,请参阅图7a,提供一下基板131。
所述下基板131优选为超薄玻璃基板,具体指厚度小于等于0.1mm的玻璃基板,更优选为边缘光滑的超薄玻璃基板,从而使得下基板131具有常规弯曲后不致破损的性能。
其次,请参阅图7b,在所述下基板131的一侧表面形成一承载层132。
所述承载层132的材质可以为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯等树脂材料,优选为聚酰亚胺。
再次,请参阅图7c,在所述承载层132远离所述下基板131的一侧表面形成一图案化金属膜层134。
所述图案化金属膜层134的材质优选为铜,所述图案化金属膜层134的图案可以为大致平行排列的条状、网格状等,所述图案化金属膜层134用于静电屏蔽。
然后,请参阅图7d,在所述图案化金属膜层134的图案间隙形成一无机材料层133。
从而,所述图案化金属膜层134嵌设于所述无机材料层133内,所述图案化金属膜层134靠近所述下基板131的一侧表面与所述承载层132相接,并与
所述无机材料层133靠近所述下基板131的一侧表面相齐平,所述图案化金属膜层134远离所述下基板131的一侧表面与所述无机材料层133远离所述下基板131的一侧表面大致相齐平。
所述无机材料层133可以包括氧化物和/或氮化物,具体地,可以包括氧化钙、氧化铝、硅石、氧化钛、氧化铟、氧化硅、氮化硅、氮化铝等,所述无机材料层用于阻止或防止气体、湿气等从外界进入,以及阻隔所述承载层132所释放的气体。
请参考图8a至8e。图8a至8e是本发明第八实施例的柔性背板的制备方法的示意图。
本实施例的柔性背板的制备方法与第六实施例的柔性背板的制备方法类似,都包括先提供一下基板131(图8a),再在下基板131上形成承载层132(图8b),再在承载层132上形成无机材料层133(图8c),及在无机材料层133上形成图案化金属膜层134(图8d),不同在于,本实施例的柔性背板的制备方法比第六实施例的柔性背板的制备方法多了一步:
形成图案化金属膜层134之后,请参阅图8e,在所述图案化金属膜层134表面及暴露于所述图案化金属膜层134间隙的所述无机材料层133表面形成一保护层135。
本实施例中,所述保护层135的材质与所述承载层132的材质相同,均可以为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯等树脂材料,优选为聚酰亚胺。
请参考图9a至9e。图9a至9e是本发明第九实施例的柔性背板的制备方法的示意图。
本实施例的柔性背板的制备方法与第七实施例的柔性背板的制备方法类似,都包括先提供一下基板131(图9a),再在下基板131上形成承载层132(图9b),再在承载层132上形成图案化金属膜层134(图9c),及在图案化金属膜层134的图案间隙形成无机材料层133(图9d),不同在于,本实施例的柔性背板的制备方法比第七实施例的柔性背板的制备方法多了一步:
形成无机材料层133之后,请参阅图9e,在所述图案化金属膜层134及所述无机材料层133表面形成一保护层135。
本实施例中,所述保护层135的材质与所述承载层132的材质相同,均可以为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯等树脂材料,优选为聚酰亚胺。
请参考图10a至10e。图10a至10e是本发明第十实施例的柔性背板的制备方法的示意图。
本实施例的柔性背板的制备方法与第六实施例的柔性背板的制备方法类似,都包括先提供一下基板131(图10a),再在下基板131上形成承载层132(图10b),再在承载层132上形成无机材料层133(图10c),及在无机材料层上形成图案化金属膜层134(图10e),不同在于,本实施例的柔性背板的制备方法比第七实施例的柔性背板的制备方法多了一步:
在形成无机材料层133之后,以及在形成图案化金属膜层134之前,请参阅图10d,在所述无机材料层133表面形成一增强层136,所述图案化金属膜层134形成于所述增强层136远离所述无机材料层133的表面。
本实施例中,所述增强层136的材质与所述承载层132的材质相同,均可以为聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯等树脂材料,优选为聚酰亚胺。
相比于传统的柔性显示装置及制备工艺,本技术方案实施例的柔性背板及柔性显示装置、制备方法具有如下优点:
1.传统的柔性显示装置及制备工艺在玻璃基板下方贴上金属片以阻隔外界干扰;而本技术方案实施例中,将图案化金属膜层设置于下基板上方,同样能起到静电屏蔽的效果;
2.传统的柔性显示装置及制备工艺中的金属片会降低柔性显示装置的挠曲或折叠性能;本技术方案实施例图案化金属膜层的挠曲性能比金属片的挠曲性能优异,从而也就保证了柔性显示装置的挠曲或折叠性能;
3.本技术方案实施例还在下基板上形成有树脂材质的承载层,并将图案化
金属膜层承载于所述承载层上,能缓冲挠曲或折叠对柔性显示装置的应力破坏,进一步提高了柔性显示装置的挠曲或折叠性能;
4.本技术方案实施例的图案化金属膜层形成在柔性显示装置的内部,使柔性显示装置的性能更加稳定,且不需要另外贴合金属片,也即不需要进行额外的贴膜工艺,使流程较为简单;并且因贴膜工艺存在一些良率问题,本案省去了贴膜工艺,整个工艺的相对良率也较高。
以上所述是本发明的优选实施例,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明的保护范围。
Claims (16)
- 一种柔性背板,包括下基板,形成于所述下基板一侧的承载层,形成于所述承载层远离所述下基板一侧的无机材料层,及形成于所述承载层远离所述下基板一侧的图案化金属膜层。
- 如权利要求1所述的柔性背板,其特征在于,所述下基板为超薄玻璃基板。
- 如权利要求1所述的柔性背板,其特征在于,所述图案化金属膜层形成于所述无机材料层远离所述下基板的一侧。
- 如权利要求3所述的柔性背板,其特征在于,还包括一增强层,所述增强层形成于所述图案化金属膜层与所述无机材料层之间。
- 如权利要求1所述的柔性背板,其特征在于,所述图案化金属膜层嵌设于所述无机材料层内。
- 如权利要求5所述的柔性背板,其特征在于,所述图案化金属膜层靠近所述下基板的一侧表面与所述承载层相接、并与所述无机材料层靠近所述下基板的一侧表面相齐平,所述图案化金属膜层远离所述下基板的一侧表面与所述无机材料层远离所述下基板的一侧表面相齐平。
- 如权利要求1所述的柔性背板,其特征在于,还包括一保护层,所述保护层形成于所述柔性背板的远离所述下基板的一侧,并覆盖所述图案化金属膜层及所述无机材料层。
- 一种柔性显示装置,包括中间基板,形成于中间基板上的柔性显示器件及如权利要求1-7任一项所述的柔性背板,所述柔性背板形成于所述中间基板远离所述柔性显示器件的一侧,且所述柔性背板的远离所述下基板的一侧与所述中间基板相贴。
- 如权利要求8所述的柔性显示装置,其特征在于,还包括一封装基板,所述封装基板覆盖所述柔性显示器件。
- 一种柔性显示装置的制备方法,包括步骤:提供中间基板;在中间基板上制作柔性显示器件;制备一柔性背板,所述柔性背板包括下基板,形成于所述下基板一侧的承载层,形成于所述承载层远离所述下基板一侧的无机材料层,及形成于所述承载层远离所述下基板一侧的图案化金属膜层;以及将中间基板贴附于柔性背板的远离所述下基板的一侧。
- 如权利要求10所述的柔性显示装置的制备方法,其特征在于,还包括在柔性显示器件上形成封装基板的步骤。
- 如权利要求10所述的柔性显示装置的制备方法,其特征在于,制备所述柔性背板的步骤包括:提供一下基板;在所述下基板的一侧表面形成一承载层;在所述承载层远离所述下基板的一侧表面形成一无机材料层;及在所述无机材料层远离所述承载层的一侧形成一图案化金属膜层。
- 如权利要求12所述的柔性显示装置的制备方法,其特征在于,所述柔性背板还包括一保护层;在形成所述图案化金属膜层之后,所述柔性背板的制备方法还包括步骤:在所述图案化金属膜层表面及暴露于所述图案化金属膜层间隙的所述无机材料层表面形成一保护层。
- 如权利要求12所述的柔性显示装置的制备方法,其特征在于,所述柔性背板还包括一增强层;在形成所述无机材料层之后,以及在形成所述图案化金属膜层之前,所述柔性背板的制备方法还包括步骤:在所述无机材料层表面形成一增强层,从而,所述图案化金属膜层形成于所述增强层远离所述无机材料层的表面。
- 如权利要求10所述的柔性显示装置的制备方法,其特征在于,制备所述柔性背板的步骤包括:提供一下基板;在所述下基板的一侧表面形成一承载层;在所述承载层远离所述下基板的一侧表面形成一图案化金属膜层;及在所述图案化金属膜层的图案间隙形成一无机材料层。
- 如权利要求15所述的柔性显示装置的制备方法,其特征在于,所述柔性背板还包括一保护层;在形成所述无机材料层之后,所述柔性背板的制备 方法还包括步骤:在所述图案化金属膜层表面及所述无机材料层表面形成一保护层。
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CN206148473U (zh) * | 2016-11-10 | 2017-05-03 | 上海天马微电子有限公司 | 一种柔性显示装置 |
CN106653815B (zh) * | 2016-12-29 | 2019-09-27 | 上海天马微电子有限公司 | 一种有机发光显示面板及其制作方法、显示装置 |
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