WO2019085859A1 - 准直器、光学指纹识别器以及全面屏 - Google Patents

准直器、光学指纹识别器以及全面屏 Download PDF

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WO2019085859A1
WO2019085859A1 PCT/CN2018/112408 CN2018112408W WO2019085859A1 WO 2019085859 A1 WO2019085859 A1 WO 2019085859A1 CN 2018112408 W CN2018112408 W CN 2018112408W WO 2019085859 A1 WO2019085859 A1 WO 2019085859A1
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collimating
layer
layers
collimator
optical sensor
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PCT/CN2018/112408
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English (en)
French (fr)
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吴俊纬
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维沃移动通信有限公司
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Priority to US16/757,969 priority Critical patent/US20200342195A1/en
Priority to EP18874564.0A priority patent/EP3706033A4/en
Publication of WO2019085859A1 publication Critical patent/WO2019085859A1/zh

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • G06V40/1318Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/30Collimators
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • G06V40/1324Sensors therefor by using geometrical optics, e.g. using prisms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B2207/00Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
    • G02B2207/123Optical louvre elements, e.g. for directional light blocking

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  • the present disclosure relates to the field of computer technologies, and in particular, to a collimator, an optical fingerprint reader, and a full screen.
  • the fingerprint recognition module for mobile phones is mainly based on capacitive type, but since it cannot penetrate a cover glass having a thickness of 0.5 mm or more, it is usually necessary to dig a nest on the glass cover to make it The thickness required to penetrate is reduced to within 0.3-0.4 mm. Since the cover glass thickness that the capacitive fingerprint recognition module can penetrate is the physical principle of the capacitor technology, it is difficult to progress with time. Generally, the limit is 0.3-0.4 mm, so if it is to be used as a mobile phone application and as a hidden fingerprint. The identification application needs to penetrate the thickness of the cover plate above 0.5mm. The capacitor technology is almost abandoned, so some fingerprint manufacturers began to turn to the direction of the optical fingerprint.
  • the main problem of the current optical fingerprint recognition is that, due to the presence of the cover 12 and the plastic organic light emitting diode (POLED) 13, the fingerprint recognition module of the screen is at least 0.5 mm from the fingerprint 11 image, and since the optical sensor 15 is not For example, the camera's lens optical imaging system, therefore, relying solely on the collimation of the alignment layer 14, the resulting fingerprint image will be blurred.
  • CMOS complementary metal oxide semiconductor memory
  • a thick hole 17 as a collimator disposed between the cover plate 16 and the sensor layer 18. If the diameter of the small hole is 5um, the thickness may be as thick as 50um in order to make the collimation angle small enough.
  • collimators of this thickness are difficult to manufacture in a panel factory or a semiconductor factory; if an optical fiber is used as a collimator, the cost will be very expensive and the cost of the fiber process will be very high.
  • An embodiment of the present disclosure provides a collimator, including: at least two collimating layers and a light transmissive substrate disposed between two adjacent collimating layers;
  • the at least two collimating layers have a plurality of collimating holes, the collimating holes of two adjacent collimating layers form a trough hole, or the collimating holes of the at least two collimating layers are misaligned.
  • the number of collimating holes on two adjacent collimating layers is the same and facing each other.
  • a positionally adjustable alignment layer is present in the at least two alignment layers.
  • the at least two alignment layers are prepared from a light-shielding material.
  • An embodiment of the present disclosure further provides an optical fingerprint reader, including: a cover plate, an optical sensor layer, and the collimator described above;
  • the collimator is disposed between the cover plate and the optical sensor layer.
  • the collimating holes of the collimating layer closest to the optical sensor layer in the at least two collimating layers are in one-to-one correspondence with the sensor pixel points of the optical sensor layer.
  • the collimating holes of the collimating layer closest to the optical sensor layer in the at least two collimating layers have a one-to-many relationship with the sensor pixel points of the optical sensor layer.
  • the collimating holes of the collimating layer closest to the optical sensor layer in the at least two collimating layers have a many-to-one relationship with the sensor pixel points of the optical sensor layer.
  • An embodiment of the present disclosure further provides a comprehensive screen comprising: an organic light emitting diode (OLED) layer and the optical fingerprint reader described above;
  • OLED organic light emitting diode
  • the OLED layer is disposed between the cap plate and the collimator, and the collimator and the optical sensor layer cover the entire OLED layer.
  • the OLED layer is a flexible OLED or a glass OLED.
  • FIG. 1a and 1b are schematic structural views of a collimator in the related art
  • FIG. 2 is a schematic structural diagram of a collimator according to Embodiment 1 of the present disclosure
  • FIG. 3 is a schematic structural diagram of an optical fingerprint reader according to Embodiment 3 of the present disclosure.
  • FIG. 4 is a schematic structural diagram of a full screen according to Embodiment 4 of the present disclosure.
  • the collimator may specifically include: at least two stacked collimating layers 21, 22 and two collimating layers disposed adjacent to each other. Transparent substrate 23 between;
  • the at least two alignment layers 21, 22 have a plurality of collimating holes, the collimating holes of the adjacent two collimating layers 21, 22 form a sleeve hole, or the quasi-straighten layers 21, 22 Straight hole misalignment is coupled to collimate the light emitted by the illumination source 24.
  • the alignment layers 21, 22 are prepared from a light-shielding material, such as a pure aluminum foil strip and an aluminum foil material prepared from a transparent polyester film strip; and the transparent substrate 23 is made of a light-transmitting material, such as glass.
  • a light-shielding material such as a pure aluminum foil strip and an aluminum foil material prepared from a transparent polyester film strip
  • the transparent substrate 23 is made of a light-transmitting material, such as glass.
  • the shape of the collimating holes may be a circle, a regular hexagon, a triangle, etc., and may be specifically circular here.
  • the sleeve hole may be a hole formed by at least two collimating holes whose axes are on the same straight line, wherein an implementation manner of forming the sleeve hole may be:
  • the number of collimating holes on each of the collimating layers 21, 22, the distribution position and the size thereof are the same and the corresponding collimating holes are disposed opposite each other.
  • one implementation manner of the misalignment coupling of the collimating holes 21, 22 of the collimating layers 21, 22 may be:
  • the misalignment may be two or two misalignments of adjacent collimation layers; or, the alignment layers of the odd layers overlap, and the alignment layers of the even layers overlap; or, the misalignment is performed in groups, and each group includes the quasi-alignment Straight is uncertain.
  • the thickness of each layer of the alignment layer may also be different.
  • FIG. 2 only shows the structure of two layers of collimating layers, and for the structure of collimating layers of three or more layers, it is not difficult to understand that a layer of collimating layers is added, correspondingly Ground, a layer of transparent substrate is added between the newly added alignment layer and the nearest collimation layer from the newly added alignment layer.
  • the misalignment coupling of the three-layer and three-layer alignment layers is similar to that of the two-layer alignment layer, and details are not described herein again.
  • the embodiment of the present disclosure replaces the single-layer thick hole collimator with the double-layer collimating layer + light-transmitting substrate, so that the collimation effect can be achieved by using a thinner panel, and the processing process is simple and cost-effective. A little bit low.
  • a very thin black material can be produced by a process example: a black matrix (BM) process using a liquid crystal display.
  • BM black matrix
  • the BM process can coat a thickness of about 2 um, and the difficulty of making thick holes is extremely high, but it can be used to form a similar thick hole alignment effect on the front and back sides of the substrate, and the process is simple and cheap.
  • the present embodiment reduces the thickness required for the alignment layer by providing a transparent substrate to further reduce the manufacturing cost on the basis of ensuring the collimation effect.
  • the embodiment 2 further provides an illuminator, comprising: a light source and the collimator of the embodiment 1;
  • the collimator is configured to perform collimation processing on light emitted by the illumination source.
  • a collimator can be placed between the lamp and the lampshade to control the angle of illumination of the lamp.
  • the light-emitting angle of the illuminator can be adjusted based on the collimation processing of the light by the collimator.
  • FIG. 3 is a schematic structural diagram of an optical fingerprint reader according to Embodiment 3 of the present disclosure.
  • the optical fingerprint identifier may specifically include: a (protective) cover 31 , an optical sensor layer 33 , and Embodiment 1 Collimator 32;
  • the collimator 32 is disposed between the cover plate 31 and the optical sensor layer 33 for collimating the light emitted by the optical sensor layer 33.
  • the collimating holes of the collimating layer 321 closest to the optical sensor layer 33 among the at least two collimating layers in the collimator 32 are in one-to-one correspondence with the sensor pixel points 331 of the optical sensor layer 33, or
  • the collimating hole is one-to-many with the sensor pixel, or the collimating hole and the sensor pixel are many-to-one.
  • a plurality of sensor pixel points 331 can be disposed corresponding to one collimation hole, whereby the optical sensor can collect enough light signals. In turn, a clearer fingerprint image is obtained.
  • the collimator based on the double-layer small hole performs collimation processing on the light emitted by the optical sensor to avoid the occurrence of light leakage and achieve the purpose of accurately identifying the fingerprint.
  • the comprehensive screen may specifically include: an OLED layer 42 and an optical fingerprint identifier in Embodiment 3;
  • the OLED layer 42 is disposed between the cap plate 41 and the collimator 43 (collimation layer), and the collimator 43 and the optical sensor layer 44 cover the entire OLED layer 42.
  • the OLED layer 42 is a flexible OLED or a glass OLED.
  • the full-screen fingerprint implementation method of the present invention is as follows: POLED (plastic OLED) is a mature flexible OLED or glass OLED, with a cover glass 41 on top, and an optical sensor layer placed under the entire OLED module. 44 and a collimator 43, wherein the glass-based optical sensor layer can be a switching thin film transistor + an image thin film transistor (on/off TFT+photo TFT), or a switching thin film transistor + an image diode (on/off TFT+photo diode (photo) PIN)), taking Figure 4 as an example, the fiber receiving angle to penetrate the 1.1mm module without mixing light is about 7 degrees.
  • the collimating aperture and the sensor pixel can be one-to-one, that is, one fiber tube (fiber collimation) corresponds to one pixel, or one-to-many, or many-to-one.
  • the fingerprint recognition module can be disposed under the OLED layer 42 so that the fingerprint imaging can be clearly applied to a large-area glass-based image sensor without affecting or sacrificing the original OLED.
  • Design and performance in turn, can realize the full screen technology of mobile phones, pads, etc.
  • the production cost of the full screen can be further reduced.
  • embodiments of the present disclosure may be provided as a method, system, or computer program product. Accordingly, the present disclosure may take the form of an entirely hardware embodiment, an entirely software embodiment or a combination of software and hardware aspects. Moreover, the present disclosure may employ a computer program embodied on one or more computer usable storage media (including but not limited to disk storage, compact disk read only memory (CD-ROM), optical storage, etc.) in which computer usable program code is embodied. The form of the product.
  • computer usable storage media including but not limited to disk storage, compact disk read only memory (CD-ROM), optical storage, etc.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Image Input (AREA)

Abstract

本公开公开了一种准直器、光学指纹识别器以及全面屏。该准直器包括:至少两个准直层以及设置在相邻两个准直层之间的透光基板;所述至少两个准直层具有若干准直孔,相邻两个准直层的准直孔形成套孔,或者,所述至少两个准直层的准直孔错位耦合。

Description

准直器、光学指纹识别器以及全面屏
相关申请的交叉引用
本申请主张在2017年10月31日在中国提交的中国专利申请No.201711044121.6的优先权,其全部内容通过引用包含于此。
技术领域
本公开涉及计算机技术领域,尤其涉及一种准直器、光学指纹识别器以及全面屏。
背景技术
目前,手机用的指纹识别模块主要是以电容式的为主,但由于其无法穿透0.5mm以上厚度的玻璃盖板(cover glass),因此,通常需要在玻璃盖板上挖巢,使其需要穿透的厚度降至0.3-0.4mm以内。而由于电容式指纹识别模块可穿透的cover glass厚度是电容技术的物理原理问题,很难随着时间去进步,一般认为极限就是0.3-0.4mm,因此如果要作为手机应用且作为隐藏式指纹识别的应用,需要穿透0.5mm以上的盖板厚度,电容技术几乎是要被放弃的,因此有些指纹厂商开始转往光学式指纹的方向。
参见图1a,目前的光学式指纹识别主要问题为,由于盖板12和塑料有机发光二极管(POLED)13的存在,屏下指纹识别模块距离指纹11影像至少为0.5mm,而由于光学传感器15没有如相机的镜头(lens)光学成像***,因此,仅依靠准直层14的准直作用,得到的指纹影像会是模糊的。而若使用硅基的互补金属氧化物半导体存储器(Complementary Metal Oxide Semiconductor,CMOS)式的光学传感器,则会出现由于成本过高,而无法应用在全面屏上的问题。
另外,参见图1b,还有一种使用厚小孔17来作准直器的技术方案,设置在盖板16和传感器层18之间。如小孔直径为5um时,为了准直角度够小,厚度可能需要50um这么厚。但这个厚度的准直器一般面板厂或者半导体厂制作会很困难;而若另外用光纤作准直器,则花费将非常昂贵且光纤工艺成 本也会非常高。
发明内容
本公开实施例提供一种准直器,包括:至少两个准直层以及设置在相邻两个准直层之间的透光基板;
所述至少两个准直层具有若干准直孔,相邻两个准直层的准直孔形成套孔,或者,所述至少两个准直层的准直孔错位耦合。
可选地,相邻两个准直层上的准直孔的数量相同且正对设置。
可选地,所述至少两个准直层中存在位置可调的准直层。
可选地,所述至少两个准直层由遮光材料制备而成。
本公开实施例还提供一种光学指纹识别器,其中,包括:盖板、光学传感器层以及上述的准直器;
所述准直器设置在所述盖板和所述光学传感器层之间。
可选地,所述至少两个准直层中与所述光学传感器层距离最近的准直层的准直孔与所述光学传感器层的传感器像素点一一对应。
可选地,所述至少两个准直层中与所述光学传感器层距离最近的准直层的准直孔与所述光学传感器层的传感器像素点具有一对多关系。
可选地,所述至少两个准直层中与所述光学传感器层距离最近的准直层的准直孔与所述光学传感器层的传感器像素点具有多对一关系。
本公开实施例还提供一种全面屏,包括:有机发光二极管(OLED)层和上述的光学指纹识别器;
所述OLED层设置在所述盖板与所述准直器之间,且所述准直器和所述光学传感器层铺满整个OLED层。
可选地,所述OLED层为柔性OLED或者玻璃OLED。
附图说明
此处所说明的附图用来提供对本公开的进一步理解,构成本公开的一部 分,本公开的示意性实施例及其说明用于解释本公开,并不构成对本公开的不当限定。在附图中:
图1a和图1b为相关技术中的准直器的结构示意图;
图2为本公开实施例1提供的准直器的结构示意图;
图3为本公开实施例3提供的光学指纹识别器的结构示意图;
图4为本公开实施例4提供的全面屏的结构示意图。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚,下面将结合本公开具体实施例及相应的附图对本公开技术方案进行清楚、完整地描述。显然,所描述的实施例仅是本公开一部分实施例,而不是全部的实施例。基于本公开中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本公开保护的范围。
以下结合附图,详细说明本公开各实施例提供的技术方案。
实施例1
图2为本公开实施例1提供的准直器的结构示意图,参见图2,该准直器具体可以包括:至少两个堆叠的准直层21,22以及设置在相邻两个准直层之间的透光基板23;
所述至少两个准直层21,22具有若干准直孔,相邻两个准直层21,22的准直孔形成套孔,或者,所述至少两个准直层21,22的准直孔错位耦合,以对发光源24发出的光线进行准直处理。
其中,至少两个准直层21,22由遮光材料制备而成,例如:纯铝箔条和透明聚酯薄膜条制备的铝箔材料等;透光基板23由透光材料制备而成,例如:玻璃和高聚物等;准直孔的形状可以为圆形、正六边形、三角形等,此处可具体为圆形。
本实施例中,套孔可以为轴线在同一条直线上的至少两个准直孔形成的孔,其中,形成套孔的一种实现方式可以为:
每个准直层21,22上的准直孔的数量、分布位置及其大小均相同且相对 应的准直孔正对设置。
本实施例中,准直层21,22的准直孔错位耦合的一种实现方式可以为:
基于透明基板23和每层准直层21,22的厚度,及其准直孔的分布位置、形状、大小等数据,计算相邻两个准直层21,22上的准直孔对应的收光角的大小,然后,选择性地调节任意1个或者多个准直层21,22的位置,实现准直层21,22的准直孔错位耦合。
本实现方式中,错位可以为相邻的准直层两两错位;或者,奇数层的准直层重合,偶数层的准直层重合;或者,以组为单位进行错位,每组包括的准直层不定。另外,每层准直层的厚度也可不尽相同。
还需要说明的是,图2仅示出了两层准直层的结构,而对于三层及三层以上的准直层的结构,不难理解的是,增设一层准直层,则相应地,在新增准直层与距离新增准直层最近的准直层之间增设一层透光基板。另外,三层及三层以上的准直层的错位耦合与两层准直层的相似,此处不再赘述。
可见,本公开实施例通过将单层的厚小孔准直器替换为双层的准直层+透光基板,以实现采用较薄的面板即可完成准直作用,具有加工工艺简单,成本低的有点。详细来说,其中,制作极薄的黑色材料可用工艺举例为:利用液晶显示器的黑色矩阵(BM)工艺制作。一般BM工艺能涂布的厚度约为2um,作厚小孔困难度极高,但用来作在基板的正反面即可形成类似厚小孔准直的效果,工艺很简单很便宜。而且,本实施例通过设置透明基板减小准直层所需的厚度,以在保证准直效果的基础上,进一步地降低制造成本。
实施例2
在实施例1的基础上,本实施例2还提供了一种发光器,包括:发光源和实施例1的准直器;
发光源,用于发出光线;
所述准直器,用于对所述发光源发出的光线进行准直处理。
例如,可在灯与灯罩之间铺设准直器,以控制电灯的照射角度。
可见,本实施例通过将准直器应用在发光器上,能基于准直器对光线的准直处理,调节发光器的出光角度。
实施例3
图3为本公开实施例3提供的光学指纹识别器的结构示意图,参见图3,该光学指纹识别器具体可以包括:(保护)盖板31、光学传感器(sensor)层33以及实施例1中的准直器32;
所述准直器32设置在所述盖板31和所述光学传感器层33之间,用于对所述光学传感器层33发出的光线进行准直处理。
其中,准直器32中的至少两个准直层中与所述光学传感器层33距离最近的准直层321的准直孔与所述光学传感器层33的传感器像素点331一一对应,或者,准直孔与传感器像素点一对多,或者,准直孔与传感器像素点多对一。
不难理解的是,如何设置准直层321的准直孔与传感器像素点331的对应关系可基于用户的实际需求而定。以图3为例:可设置多个传感器像素点331与一个准直孔相对应,由此,光学传感器可采集到足够多的光信号。进而得到较为清晰的指纹图像。
可见,本实施例基于双层小孔的准直器,对光学传感器发出的光线进行准直处理,以避免出现漏光的情况,达到精确识别指纹的目的。
实施例4
图4为本公开实施例4提供的全面屏的结构示意图,参见图4,该全面屏具体可以包括:OLED层42和实施例3中的光学指纹识别器;
所述OLED层42设置在所述盖板41与所述准直器43(准直层)之间,且所述准直器43和所述光学传感器层44铺满整个OLED层42。
其中,所述OLED层42为柔性OLED或者玻璃OLED。
需要说明的是,本发明全屏指纹实现方式一如下,POLED(plastic OLED)为成熟的柔性OLED或玻璃OLED,上方有防护玻璃盖板(cover glass)41,在整个OLED模块底下放置一个光学传感器层44以及准直器43,其中玻璃基光学传感器层可以是开关薄膜晶体管+图像薄膜晶体管(on/off TFT+photo TFT),或者,开关薄膜晶体管+图像二极管(on/off TFT+photo diode(photo  PIN)),以图4为例,要穿透1.1mm模块而不混光的光纤收光角设计约为7度。其中准直孔和传感器像素点(sensor pixel)可为一对一,即一根光纤管(光纤准直)对应一个像素点,或一对多,或多对一。
可见,本实施例基于上述的准直器,能将指纹识别模块设置在OLED层42的下方,达到可以清楚把指纹成像应用在大面积的玻璃基image sensor上且不影响或不牺牲OLED原本的设计及性能,进而可实现手机、pad等全面屏的技术;而且,由于双层、多层小孔的准直器结构造价低,可进一步地降低全面屏的生产成本。
需要说明的是,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、商品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、商品或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、商品或者设备中还存在另外的相同要素。
本领域技术人员应明白,本公开的实施例可提供为方法、***或计算机程序产品。因此,本公开可采用完全硬件实施例、完全软件实施例或结合软件和硬件方面的实施例的形式。而且,本公开可采用在一个或多个其中包含有计算机可用程序代码的计算机可用存储介质(包括但不限于磁盘存储器、光盘只读存储器(CD-ROM)、光学存储器等)上实施的计算机程序产品的形式。
以上所述仅为本公开的实施例而已,并不用于限制本公开。对于本领域技术人员来说,本公开可以有各种更改和变化。凡在本公开的精神和原理之内所作的任何修改、等同替换、改进等,均应包含在本公开的权利要求范围之内。

Claims (10)

  1. 一种准直器,包括:至少两个准直层以及设置在相邻两个准直层之间的透光基板;
    所述至少两个准直层具有若干准直孔,相邻两个准直层的准直孔形成套孔,或者,所述至少两个准直层的准直孔错位耦合。
  2. 根据权利要求1所述的准直器,其中,相邻两个准直层上的准直孔的数量相同且正对设置。
  3. 根据权利要求1所述的准直器,其中,所述至少两个准直层中存在位置可调的准直层。
  4. 根据权利要求1所述的准直器,其中,所述至少两个准直层由遮光材料制备而成。
  5. 一种光学指纹识别器,包括:盖板、光学传感器层以及权利要求1-4任一项所述的准直器;
    所述准直器设置在所述盖板和所述光学传感器层之间。
  6. 根据权利要求5所述的光学指纹识别器,其中,所述至少两个准直层中与所述光学传感器层距离最近的准直层的准直孔与所述光学传感器层的传感器像素点一一对应。
  7. 根据权利要求5所述的光学指纹识别器,其中,所述至少两个准直层中与所述光学传感器层距离最近的准直层的准直孔与所述光学传感器层的传感器像素点具有一对多关系。
  8. 根据权利要求5所述的光学指纹识别器,其中,所述至少两个准直层中与所述光学传感器层距离最近的准直层的准直孔与所述光学传感器层的传感器像素点具有多对一关系。
  9. 一种全面屏,包括:有机发光二极管(OLED)层和权利要求5或6所述的光学指纹识别器;
    所述OLED层设置在所述盖板与所述准直器之间,且所述准直器和所述光学传感器层铺满整个OLED层。
  10. 根据权利要求9所述的全面屏,其中,所述OLED层为柔性OLED 或者玻璃OLED。
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112816398A (zh) * 2020-12-30 2021-05-18 中国科学院近代物理研究所 植物微束辐照实验准直器以及自动换样装置
US11437447B2 (en) 2020-11-30 2022-09-06 Xiamen Tianma Micro-Electronics Co., Ltd. Display device and manufacturing method thereof
EP4145336A4 (en) * 2020-04-28 2023-12-27 Beijing Xiaomi Mobile Software Co., Ltd. Nanjing Branch TERMINAL DEVICE

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107844767B (zh) * 2017-10-31 2020-03-17 维沃移动通信有限公司 一种准直器、光学指纹识别器以及全面屏
CN110349984B (zh) 2018-04-01 2021-08-03 广州印芯半导体技术有限公司 具有光学结构的集成电路
CN108615003B (zh) * 2018-04-20 2019-06-11 Oppo广东移动通信有限公司 指纹识别组件、显示装置及电子装置
CN108596080B (zh) * 2018-04-20 2021-05-14 Oppo广东移动通信有限公司 指纹识别组件、显示装置及电子装置
WO2019215192A1 (en) 2018-05-07 2019-11-14 Wavetouch Limited Compact optical sensor for fingerprint detection
CN110502955A (zh) * 2018-05-17 2019-11-26 京东方科技集团股份有限公司 指纹识别面板、指纹识别方法及显示装置
CN110175492B (zh) * 2018-07-20 2022-03-01 神盾股份有限公司 光学指纹感测装置
US10635374B2 (en) * 2018-08-28 2020-04-28 Innolux Corporation Electronic device
DE112019004882T5 (de) 2018-09-27 2021-08-05 Apple Inc. Optischer fingerabdrucksensor unter der anzeige mit nfv-kollimator und tft-/organischem bildgeber
CN109239938A (zh) 2018-10-11 2019-01-18 京东方科技集团股份有限公司 光学准直结构及其制作方法、指纹识别装置
WO2020102949A1 (zh) * 2018-11-19 2020-05-28 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN109753919B (zh) * 2018-12-29 2021-04-02 武汉华星光电技术有限公司 光学指纹识别装置
CN109740556B (zh) * 2019-01-10 2021-02-02 京东方科技集团股份有限公司 基于准直光取出的光学结构的指纹识别模块及其制备方法
CN111476055A (zh) * 2019-01-23 2020-07-31 南昌欧菲生物识别技术有限公司 柔性准直器及其制备方法、指纹识别模组以及电子设备
CN110309705B (zh) 2019-04-30 2022-04-19 厦门天马微电子有限公司 显示面板和显示装置
CN111914605A (zh) * 2019-05-10 2020-11-10 南昌欧菲生物识别技术有限公司 准直器的制作方法、准直器、光学指纹模组及电子设备
CN110278299B (zh) * 2019-06-24 2021-10-19 Oppo广东移动通信有限公司 显示装置、电子设备及图像获取方法
CN112151572B (zh) * 2019-06-28 2023-06-23 云谷(固安)科技有限公司 指纹识别显示器件及其制备方法、指纹识别显示装置
CN110321832B (zh) 2019-06-28 2021-05-18 维沃移动通信有限公司 光学模组及移动终端
CN112199979A (zh) * 2019-07-07 2021-01-08 奕力科技股份有限公司 能够侦测一手指的指纹的显示装置与指纹识别芯片
CN111785763A (zh) * 2020-07-29 2020-10-16 北海惠科光电技术有限公司 一种显示面板及其制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170017824A1 (en) * 2015-02-02 2017-01-19 Synaptics Incorporated Low profile illumination in an optical fingerprint sensor
CN106773219A (zh) * 2017-02-07 2017-05-31 京东方科技集团股份有限公司 一种显示装置
CN106873063A (zh) * 2017-02-23 2017-06-20 京东方科技集团股份有限公司 一种显示装置
CN106874828A (zh) * 2015-12-11 2017-06-20 金佶科技股份有限公司 指纹感测模块
CN206470779U (zh) * 2016-12-23 2017-09-05 敦捷光电股份有限公司 生物特征辨识装置
CN107844767A (zh) * 2017-10-31 2018-03-27 维沃移动通信有限公司 一种准直器、光学指纹识别器以及全面屏

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10732771B2 (en) * 2014-11-12 2020-08-04 Shenzhen GOODIX Technology Co., Ltd. Fingerprint sensors having in-pixel optical sensors
US10410037B2 (en) * 2015-06-18 2019-09-10 Shenzhen GOODIX Technology Co., Ltd. Under-screen optical sensor module for on-screen fingerprint sensing implementing imaging lens, extra illumination or optical collimator array
US10176355B2 (en) * 2015-12-03 2019-01-08 Synaptics Incorporated Optical sensor for integration in a display
KR102570180B1 (ko) * 2016-11-28 2023-08-25 엘지디스플레이 주식회사 지문 센서 일체형 전계 발광 표시장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170017824A1 (en) * 2015-02-02 2017-01-19 Synaptics Incorporated Low profile illumination in an optical fingerprint sensor
CN106874828A (zh) * 2015-12-11 2017-06-20 金佶科技股份有限公司 指纹感测模块
CN206470779U (zh) * 2016-12-23 2017-09-05 敦捷光电股份有限公司 生物特征辨识装置
CN106773219A (zh) * 2017-02-07 2017-05-31 京东方科技集团股份有限公司 一种显示装置
CN106873063A (zh) * 2017-02-23 2017-06-20 京东方科技集团股份有限公司 一种显示装置
CN107844767A (zh) * 2017-10-31 2018-03-27 维沃移动通信有限公司 一种准直器、光学指纹识别器以及全面屏

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3706033A4 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4145336A4 (en) * 2020-04-28 2023-12-27 Beijing Xiaomi Mobile Software Co., Ltd. Nanjing Branch TERMINAL DEVICE
US11437447B2 (en) 2020-11-30 2022-09-06 Xiamen Tianma Micro-Electronics Co., Ltd. Display device and manufacturing method thereof
CN112816398A (zh) * 2020-12-30 2021-05-18 中国科学院近代物理研究所 植物微束辐照实验准直器以及自动换样装置
CN112816398B (zh) * 2020-12-30 2023-07-25 中国科学院近代物理研究所 植物微束辐照实验准直器以及自动换样装置

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