WO2019081041A1

WO2019081041A1 - Apparatus configured to determine a state of a deposition arrangement, system for the manufacture of a solar cell, and method for determining a state of a deposition arrangement

Info

Publication number: WO2019081041A1
Application number: PCT/EP2017/077607
Authority: WO
Inventors: Gioele DALL'ANESE; Alberto Emilio Ruffo; Alessandro Partesotti
Original assignee: Applied Materials Italia S.R.L.
Priority date: 2017-10-27
Filing date: 2017-10-27
Publication date: 2019-05-02
Also published as: CN111295767A

Abstract

An apparatus (100) configured to determine a state of a deposition arrangement (300) is provided. The apparatus (100) includes an inspection device (110) configured to detect at least a portion (30) of a material deposited on at least one of a substrate (10) and a substrate support (20), and a processor (120) configured to determine a state of a deposition arrangement (300) based on the portion (30) of the material detected by the inspection device (110).

Description

APPARATUS CONFIGURED TO DETERMINE A STATE OF A DEPOSITION ARRANGEMENT, SYSTEM FOR THE MANUFACTURE OF A SOLAR CELL, AND METHOD FOR DETERMINING A STATE OF A DEPOSITION ARRANGEMENT

FIELD [0001] Embodiments of the present disclosure relate to an apparatus configured to determine a state of a deposition arrangement, a system for the manufacture of a solar cell, and a method for determining a state of a deposition arrangement. Embodiments of the present disclosure particularly relate to apparatuses, systems and methods for predicting a failure of the deposition arrangement, such as a screen used in a screen printing process.

BACKGROUND

[0002] Solar cells are photovoltaic (PV) devices that convert sunlight directly into electrical power. Within this field, it is known to produce solar cells on a substrate such as a crystalline silicon base using deposition techniques, such as screen printing, achieving a structure of electrically conductive line patterns on one or more surfaces of the solar cells. If for instance the screen is torn or breaks, paste may contaminate at least one of a production tool and the substrate (cell). The tool has to be cleaned, leading to an increased downtime of the tool. Further, a lot of paste is wasted when the screen is torn or breaks.

[0003] In view of the above, new apparatuses, systems and methods that overcome at least some of the problems in the art are beneficial. The present disclosure particularly aims at providing an apparatus, system and method that can reduce a downtime of a solar cell production tool and/or save deposition material, such as paste.

SUMMARY [0004] In light of the above, an apparatus configured to determine a state of a deposition arrangement, a system for the manufacture of a solar cell, and a method for determining a state of a deposition arrangement are provided. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description, and the accompanying drawings.

[0005] According to an aspect of the present disclosure, an apparatus configured to determine a state of a deposition arrangement is provided. The apparatus includes an inspection device configured to detect at least a portion of a material deposited on at least one of a substrate and a substrate support, and a processor configured to determine a state of the deposition arrangement based on the portion of the material detected by the inspection device. [0006] According to another aspect of the present disclosure, an apparatus configured to determine a state of a deposition arrangement is provided. The apparatus includes an inspection device configured to detect stains on at least one of a substrate and a substrate support, and a processor configured to predict a failure of the deposition arrangement if stains are detected by the inspection device. [0007] According to a further aspect of the present disclosure, a system for the manufacture of a solar cell is provided. The system includes a deposition arrangement configured to deposit a material on a substrate, and the apparatus configured to determine a state of a deposition arrangement according to the present disclosure.

[0008] According to a yet further aspect of the present disclosure, a method for determining a state of a deposition arrangement is provided. The method includes detecting at least a portion of a material deposited on at least one of a substrate and a substrate support, and determining a state of a deposition arrangement based on the portion of the material detected by the inspection device.

[0009] According to another aspect of the present disclosure, a computer-readable storage medium including computer-executable instructions for implementing the method for determining a state of a deposition arrangement is provided.

[0010] Embodiments are also directed at apparatuses for carrying out the disclosed method and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

FIG. 1 shows a schematic view of an apparatus configured to determine a state of a deposition arrangement according to embodiments described herein;

FIG. 2 shows a solar cell having a line pattern according to embodiments described herein;

FIG. 3A shows a schematic view of a screen printing apparatus according to embodiments described herein;

FIG. 3B shows a schematic view of a screen device according to embodiments described herein; FIG. 4 shows a schematic view of a substrate support according to embodiments described herein;

FIG. 5 shows a schematic view of an edge area around a substrate in which stains are detected;

FIG. 6 shows a schematic view of a system for the manufacture of a solar cell according to embodiments described herein; and FIG. 7 shows a flowchart of a method for determining a state of a deposition arrangement according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

[0012] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0013] In the manufacture of solar cells, paste can be deposited on a substrate or wafer using a deposition arrangement to form for instance a back side aluminum field and/or a line pattern, such as tabbing, fingers and/or busbars of a solar cell. The deposition arrangement or parts thereof, such as a screen, can wear down with time. The deposition arrangement can finally fail. The failure, such as a broken screen, can lead to a contamination of the tool with paste, leading to a considerable downtime of the tool which is needed to clean the tool. Further, a deposition material, such as paste, is wasted.

[0014] The present disclosure determines the state of the deposition arrangement or a part thereof, such as the screen, by looking at a deposition material deposited on the substrate and/or substrate support. If abnormalities are detected, e.g., if there are stains on the substrate support, the present disclosure can determine that a failure of the deposition arrangement is imminent and stop the deposition process and/or notify an operator. A downtime of the tool can be reduced by avoiding a long cleaning time. Further, a deposition material, such as paste, can be saved and manufacturing costs can be reduced.

[0015] FIG. 1 shows a schematic view of an apparatus 100 configured to determine a state of a deposition arrangement (not shown), such as a screen device, according to embodiments described herein. The apparatus 100 according to the present disclosure can be part of a serial production line and can be configured to manufacture solar cells.

[0016] The following description is given with reference to screen printing. However, the present disclosure is not limited thereto and the embodiments described herein can be used for other deposition arrangements, such as jet printers or ink jet printers. In some implementations, the deposition arrangement can be configured for double printing, multiple printing, jet printing, and optionally laser scribing.

[0017] The apparatus 100 includes an inspection device 110 configured to detect at least a portion 30 of a material deposited on a substrate 10 and/or a substrate support 20, and a processor 120 configured to determine a state of a deposition arrangement, such as a screen, based on the portion 30 of the material detected by the inspection device 110. The deposition material can be a paste used in a screen printing process to form for instance a back side aluminum field and/or a line pattern on a surface of the substrate 10, such as tabbing, fingers and/or busbars of a solar cell. The apparatus 100 can automatically detect or recognize paste leakage using for instance an exit position camera.

[0018] According to some embodiments, which can be combined with other embodiments described herein, the inspection device 110 includes one or more cameras. The one or more cameras can have a field of view 112. The field of view 112 can be provided such that a predetermined area of the substrate 10 and/or the substrate support 20 can be detected or imaged. For example, the field of view 112 can be provided such that an entire surface area of the substrate 10 can be detected or imaged. Additionally or alternatively, the field of view 112 can be provided such that an area of the substrate support 20 at an edge of the substrate 10 can be detected or imaged. For example, the inspection device 110 can be configured to detect the portion 30 of the material deposited in the area of the substrate support 20 at the edge of the substrate 10.

[0019] According to some embodiments, which can be combined with other embodiments described herein, the one or more cameras are selected from the group including a high- resolution camera, a low-resolution camera, a matrix camera, and combinations thereof. For example, the one or more cameras can be high-resolution cameras having a resolution of 1 megapixel or more, and can specifically have a resolution of 2 megapixel or more. The one or more cameras can have a resolution of 300 micrometers or less per pixel, specifically 200 micrometers or less per pixel, specifically 100 micrometers or less per pixel, specifically 30 micrometers or less per pixel, specifically 20 micrometers or less per pixel, and more specifically 10 micrometers or less per pixel. In further examples, the one or more cameras can be low-resolution cameras having a resolution of less than 1 megapixel. The one or more cameras can include a single camera, such as a matrix camera, or a system of cameras, such as matrix cameras. For example, the one or more cameras can be 1 camera, 2 cameras, 3 cameras, or 4 cameras.

[0020] In some implementations, the deposition arrangement and the inspection device 110 can be successively provided along a processing line e.g. for the manufacture of solar cells. For example, a printing station having the deposition arrangement and an inspection station having the inspection device 110 can be provided along the processing line. The processing line can be a linear processing line, a non-linear processing line, or a combination thereof. For example, a processing line can have one or more transport devices for transportation of the substrate 10 and/or the substrate support 20, which may be a printing nest. The one or more transport devices can include a linear transport device and/or a nonlinear transport device, such as a rotary table.

[0021] According to some embodiments, the inspection device 110 is configured to detect a state of the substrate 10 after a deposition process. For example, the inspection device 110 may include one or more cameras configured to detect an integrity of the substrate ("post print cameras"). The post print camera can be configured to look at a paper nest appearance of the printing process. For example, the inspection device 110 can be provided at an "out" or "exit" position of a transport device, such as a rotary table (indicated with number "3" in FIG. 6). In some embodiments, the one or more cameras can be low-resolution cameras. [0022] Additionally or alternatively, the inspection device 110 is configured to detect a quality of a deposition pattern on the substrate. The deposition pattern can be a conductive line pattern, and in particular a printed pattern, deposited on a surface of the substrate 10. In some implementations, the inspection device 110 can include one or more cameras configured to detect the (printing) quality, such as a quality of a back side tabbing, fingers and/or busbars deposited on the substrate 10. For example, the one or more cameras can be AOI (automatic optical inspection) embedded cameras (e.g. "ESATTO AOI"). In some implementations, the one or more cameras can be high-resolution cameras, such as high- resolution linear or matrix cameras. The inspection device 110 can be provided in an inspection station and/or a conveyor for inspecting the quality of the printing.

[0023] In some implementations, the inspection device 110 includes either the post print camera or the AOI embedded camera. In further implementations, the inspection device 110 includes both the post print camera and the camera.

[0024] The inspection device 110 is configured to detect at least a portion 30 of a material deposited on at least one of a substrate 10 and a substrate support 20. The portion 30 can be a stain. The portion 30 can be a portion of the deposition material which is outside of an area defined by a preset shape of the deposition pattern. The preset shape of the deposition pattern may be stored in a memory of the processor 120. The processor 120 can be configured to determine whether there is deposition material present outside of the preset shape of the deposition pattern. In other words, the processor 120 can be configured to detect a leakage of the deposition material to unwanted locations. In some implementations, the processor 120 can be configured to determine at least one of an amount, size, shape, and location of the material outside of the preset shape of the deposition pattern.

[0025] According to some embodiments, which can be combined with embodiments described herein, the processor 120 can be configured to determine the state of the deposition arrangement based on a deviation from a nominal (or ideal, perfect) state. The state can be a normal state (a non-defective state in which a failure is not imminent), a defective state (e.g. the screen is already broken), or a state in which a failure is imminent (the deposition arrangement is still operable but a failure will occur soon).

[0026] The normal state can be a state in which the deposition pattern essentially corresponds to the preset shape or is within a given tolerance. The non-normal state can be a state in which the deposition pattern does not correspond to the preset shape or is without a given tolerance. For example, the deposition pattern in the non-normal state can include deviations from the normal state, such as the portion 30 or stain outside of the preset shape. The portion 30 or stain outside of the preset shape may be located on the substrate support 20 and/or on the substrate 10 itself. In some implementations, the portion or stain outside of the preset shape and which is located on the substrate support 20 may be detected by the post print camera at the exit position of the rotary table. The portion or stain outside of the preset shape and which is located on the substrate 10 may be detected by the camera.

[0027] The processor 120 can be configured to determine the normal state of the deposition arrangement when the deviation from the nominal state is less than a threshold deviation. Optionally or alternatively, the processor 120 can be configured to determine the non-normal state, such as the defective state or the imminent failure, of the deposition arrangement when the deviation from the nominal state is greater than the threshold deviation.

[0028] In some embodiments, the processor 120 can be configured to determine whether there is material present outside of the preset shape of the deposition pattern. If there is no material outside of the preset shape of the deposition pattern and/or if an amount of the material outside of the preset shape is less than a set threshold (i.e., the deviation from the nominal or ideal state is less than the threshold deviation), the processor 120 may determine that the deposition arrangement is in the normal state and operable. If an amount of the material outside of the preset shape is more than the set threshold (i.e., the deviation from the nominal or ideal state is larger than the threshold deviation), the processor 120 may determine a failure or an imminent failure of the deposition arrangement. The processor 120 may stop the deposition process and/or notify a user.

[0029] In some embodiments, the threshold deviation can be selected by an operator. For example, the threshold deviation can be selected as a deviation at which the deposition arrangement is still operable but a failure is imminent. The deposition process can be stopped before the deposition arrangement fails. "Imminent" is to be understood in the sense that the deposition process still provides acceptable results and the deposition arrangement has not yet failed. The remaining time and/or number of printing operations until the failure, i.e., when the deposition process does not provide acceptable results anymore and/or the deposition arrangement breaks, can be determined or predicted. The threshold deviation from the nominal state can be flexibly set e.g. by an operator. The threshold deviation may be selected based on at least one of a minimum quality of the deposition pattern, type of the deposition arrangement, throughput, yield, and the like.

[0030] According to some embodiments, which can be combined with other embodiments described herein, the processor 120 includes software having instructions which are, when executed, configured to determine the state of the deposition arrangement based on the portion of the material detected by the inspection device. For example, a computer-readable storage medium including computer-executable instructions can be provided. The software can include an algorithm to determine the deviation from the nominal state. In particular, the software can recognize stains on the substrate and/or substrate support, such as on paper of a printing nest. The operator can set the threshold deviation e.g. using an interface, such as a graphical interface.

[0031] FIG. 2 shows a solar cell having a deposition pattern, which is a line pattern, according to embodiments described herein. However, the present disclosure is not limited thereto and the deposition pattern can be a back side tabbing.

[0032] The deposition pattern can include fingers 11 and busbars 12 on a front surface of the substrate 10. The deposition pattern can be formed using printing, such as screen printing. A printing material used to print the line pattern may include, or be, silver. According to some embodiments, which can be combined with other embodiments described herein, the printing material can be selected from the group consisting of silver, aluminum, copper, tin, nickel, silicon based pastes, and any combination thereof.

[0033] The lines of the line pattern can have a length and a width. The width can be defined in a direction perpendicular to the length extension of the line. FIG. 2 exemplarily illustrates a finger width W of a finger 11. The deviation from the normal state is determined based on a portion of the material detected by the inspection device. The portion may include stains 32, which may be outside of the preset shape of the deposition pattern. The preset shape and/or the condition that no deposition material is present on the substrate support may define the nominal shape. The preset shape can define an area on the substrate 10 in which the ideal deposition pattern should be located. The stains 32 can be detected on the substrate 10 and/or the substrate support. Additionally or alternatively, the portion may correspond to an enlargement of the deposition pattern with respect to the present shape. In other words, the portion can be a "delta" between the ideal shape and the real shape of the deposition pattern. When the enlargement exceeds a threshold, i.e., when the threshold deviation occurs, the non-normal state can be determined. [0034] FIG. 3A shows a schematic view of a deposition arrangement, which is a screen printing apparatus 300, according to embodiments described herein. FIG. 3B shows a schematic view of a screen device 310 according to embodiments described herein.

[0035] According to some embodiments, which can be combined with other embodiments described herein, the deposition arrangement can be configured for screen printing. In particular, the deposition arrangement can be configured for multiple printing, such as double printing, on the substrate 10. The deposition arrangement can be configured for printing of fingers and/or busbars of the solar cell using the multiple printing process.

[0036] In a multiple printing process, two or more layers (or line patterns) can be printed on top of each other using two different screen devices or the same screen device to form the fingers and/or busbars. For example, a first layer can be printed directly on the substrate 10 using a first screen device. A second layer can be printed on the first layer, and particularly directly on the first layer, using the first screen device or a second screen device. A printing material used in the multiple printing process may include, or be, silver. According to some embodiments, which can be combined with other embodiments described herein, the printing material can be selected from the group consisting of silver, aluminum, copper, tin, nickel, silicon based pastes, and any combination thereof.

[0037] In some implementations, the screen device 310 can include a frame 320 and a screen 314 attached to the frame 320. The screen 314 may include at least one of a net, a printing mask, a sheet, a metal sheet, a plastic sheet, a plate, a metal plate, and a plastic plate. In some implementations, the screen 314 defines a screen pattern or features corresponding to a structure to be printed on the substrate 10, wherein the screen pattern or features may include at least one of holes, slots, incisions or other apertures. In some embodiments, a printing device such as a squeegee contacts the screen 314, wherein the printing device urges material to be printed (deposition material) onto the substrate 10 through the screen 314, and particularly through the apertures defining, for example, the deposition pattern.

[0038] The screen 314, and in particular the screen patterns or features, may wear down with time. The deposition arrangement can finally fail. The failure, such as a broken screen, can lead to a contamination of the tool with paste, leading to a considerable downtime of the tool which is needed to clean the tool. Further, a lot of paste is wasted. The embodiments of the present disclosure can detect a state of the screen by determining whether paste is present on the substrate and/or the substrate support at positions that are not provided or defined by the screen patterns or features. In other words, a paste leakage can be recognized.

[0039] The substrate 10 according to the embodiments described herein may include at least one of a conductive material, particularly with silicon or aluminum, a plate, a wafer, a foil, a semiconductor wafer, a solar cell wafer, a silicon solar cell waver, or a green-tape circuit board, which can particularly be used to form solar cells.

[0040] FIG. 4 shows a substrate support 400 according to the present disclosure. The substrate support exemplarily illustrated in FIG. 4 can also be referred to as "printing nest" or "processing nest".

[0041 ] In some implementations, the substrate support 400 includes a conveyor device 406 having a feed roll 407 and a reception roll 408. The feed roll 407 and the reception roll 408 can be configured to feed and retain a material 402, such as paper, positioned on a surface 404 of the substrate support 400. According to some embodiments, the material 402 can be periodically removed and replaced. The embodiments of the present disclosure can be configured to detect stains of the deposition material, such as stains of paste, on the material 402.

[0042] According to some embodiments, which can be combined with other embodiments described herein, the processor of the apparatus of the present disclosure (the processor 120 of FIG. 1) can be configured to control the substrate support 400. In particular, the processor can be configured to control the conveyor device 406 to move the material 402, such as paper, on or along the surface 404 of the substrate support 400 for instance when stains are detected on the paper. In some implementations, the processor which detects the stain on the paper can be configured to automatically control and/or drive e.g. the printing nest paper movement. In particular, the processor can move the paper e.g. one step forward when the paper is too dirty such that new clean paper is available for the next printing. There is no need to preset a fixed number of prints before the paper is conveyed further and user convenience can be increased. [0043] According to some embodiments, which can be combined with other embodiments described herein, the substrate support 400 includes at least one suction device (not shown) configured for holding the substrate 10 on the substrate support 400. For example, the material 402 can be a porous material that allows the substrate 10 disposed on one side of the material 402 to be held to the surface 404 by a vacuum applied to the opposing side of the material 402 e.g. by vacuum ports formed in the surface 404. In some implementations, a vacuum is created by use of a vacuum source (not shown) coupled to the ports in the surface 404.

[0044] FIG. 5 shows a schematic view of an edge area 502 around a substrate 10 in which stains 32 are detected.

[0045] According to some embodiments, which can be combined with other embodiments described herein, the inspection device can be configured such that an entire surface area of the substrate 10 can be detected or imaged. Additionally or alternatively, the inspection device can be configured such that such that an area of the substrate support at an edge of the substrate 10, i.e., the edge area 502, can be detected or imaged. For example, the inspection device can be configured to detect the stains 32 on the substrate support in the edge area 502 around the substrate 10. The edge area 502 can be defined by a boundary line 504 around the substrate 10.

[0046] The embodiments of the present disclosure can determine the state of the deposition arrangement based on an amount of the material detected in the edge area. For example, the normal state can be determined if there are no stains at all in the edge area or if an amount and/or area of the stains is below a threshold. The non-normal state can be determined if there are stains in the edge area or if an amount and/or area of the stains exceeds a threshold.

[0047] FIG. 6 shows a system for production of solar cells according to embodiments described herein.

[0048] The system includes the deposition arrangement configured to deposit a material on a substrate, and the apparatus configured to determine a state of the deposition arrangement according to the present disclosure. The deposition arrangement, which may be included in a printing station 910, can be configured for screen printing and may include a screen. The processor of the apparatus can be configured to determine a state of the screen, such as the normal state or the non-normal state.

[0049] According to some embodiments, the system includes a transport arrangement configured for transportation of the substrate and/or the substrate support. The inspection device can be provided at the transport arrangement. The transport arrangement can have one or more transport devices for transportation of the substrate 10 and/or the substrate support, which may be the printing nest. The one or more transport devices can include a linear transport device, such as belt conveyors, and/or a non-linear transport device, such as a rotary table 1000. [0050] In the example illustrated in FIG. 6, the system includes the rotary table 1000 rotatable around a rotational axis 1050 for moving the substrate 10 e.g. between the printing station 910 and the inspection device. The inspection device can be provided at an exit position of the rotary table 1000. However, the present disclosure is not limited thereto and transport devices other than the rotary table 1000, such as linear transport devices, can be used for transporting the substrate 10 between the printing station 910 and the inspection device.

[0051] In some implementations, the substrate 10 is positioned on the substrate support, such as a moveable substrate support ("shuttle" and/or "printing nest"), which can be attached to the rotary table 1000. In other implementations, the rotary table 1000 provides the substrate support. For example, the rotary table 1000 can provide a support surface on which the substrate 10 can be positioned.

[0052] According to some embodiments, the system, and in particular the transport arrangement, includes an input device 3100 configured to transfer the substrate 10 to the rotary table 1000 and an output device 3200 configured for receiving the substrate 10 having the deposition pattern printed thereon from the rotary table 1000. As exemplarily illustrated, the input device 3100 can have an incoming conveyor. The incoming conveyor can have one or more first conveyor belts. For example the incoming conveyor may include two first conveyor belts 3150 arranged in parallel, for example, at a distance of between 5 cm and 15 cm from each other. The output device 3200 can be configured to receive the substrate 10 having the deposition pattern printed thereon from the rotary table 1000. The output device 3200 can have an outgoing conveyor. The outgoing conveyor can have one or more second conveyor belts. For example the outgoing conveyor may include two second conveyor belts 3250 arranged in parallel, for example, at a distance to each other of between 5 cm and 15 cm. The input device 3100 and the output device 3200 may be automated substrate handling devices that are part of a larger production line.

[0053] The rotary table 1000 can be rotatable around the rotation axis 1050. For example, the rotary table 1000 can be configured to be rotatable around the rotation axis 1050 at least between a substrate receiving position 1 and a processing position 2. According to embodiments, the rotary table 1000 is configured to be rotatable between the substrate receiving position 1, the processing position 2, and at least one of a substrate discharge position 3 and a substrate dump position 4. In some implementations, the inspection device can be provided at the substrate discharge position 3, which can be an "out" or "exit" position of the rotary table 1000.

[0054] The rotary table 1000 can be configured to rotate and transport substrates 10 along an orbit as defined by the rotary table's rotational movement, e.g., around the rotation axis 1050. The rotary table 1000 may be rotated in order to move the substrates 10 positioned on the rotary table 1000 or a substrate support (e.g., moveable substrate support or shuttle) attached to the rotary table 1000 according to a clockwise or anti-clockwise rotation. The rotary table 1000 can be configured to accelerate to a maximum rotational speed and then to decelerate the movement again to halt the rotary table 1000 again.

[0055] In some implementations, a rotation angle between adjacent positions, such as the substrate receiving position 1 and the processing position 2, can be about 90°. For example, the rotary table 1000 can be rotated by 90° for moving the substrate 10 from the substrate receiving position 1 to the processing position 2. Likewise, the rotary table 1000 can be rotated by 90° for moving the substrate 10 from the processing position 2 to the substrate discharge position 3.

[0056] Although the present embodiment has the printing station 910 at the processing position 2 and the inspection device at the substrate discharge position 3, it is to be understood that the present disclosure is not limited thereto and that the printing station 910 and/or the inspection device can be provided at different positions of, for example, the rotary table 1000.

[0057] FIG. 7 shows a flow chart of a method 700 for determining a state of a deposition arrangement according to embodiments described herein. The method 700 can utilize the apparatus and system according to the present disclosure. The method 700 can be used in a solar cell manufacturing process using single printing, double printing, multiple printing, e.g., triple printing, laser scribing, or any combination thereof. For example, a first line pattern can be formed by laser scribing, and a second line pattern can be formed by a deposition technique, such as screen printing. [0058] The method 700 includes in block 710 detecting at least a portion of a material deposited on at least one of a substrate and a substrate support, and in block 720 determining a state of a deposition arrangement based on the portion of the material detected by the inspection assembly.

[0059] The method 700 may, in some embodiments, include a determining of a normal state of the deposition arrangement if the detected portion of the material corresponds to a deviation from a nominal state which is less than a threshold deviation (or if there is no deviation at all; then, the detected state corresponds to the nominal state). The method 700 can further include a determining of a non-normal state, such as an imminent failure or a defective state of the deposition arrangement, if the detected portion of the material corresponds to a deviation from the nominal state which is greater than the threshold deviation. In some implementations, an imminent failure of the deposition arrangement based on the detected portion of the material can be predicted. The deposition process can be stopped before the deposition arrangement fails.

[0060] The normal state may include at least one of a state in which no material is present on the substrate support and a state in which an accuracy of a pattern deposited on the substrate is within a set range. For example, the normal state may be determined if the deposition arrangement still provides acceptable results. The remaining time and/or number of printing operations until the failure, i.e., when the deposition process does not provide acceptable results anymore and/or the deposition arrangement is broken, can be determined or predicted. [0061] According to some embodiments, a surface area of the substrate 10 can be detected or imaged. Additionally or alternatively, an area of the substrate support at an edge of the substrate, i.e., an edge area, can be detected or imaged. In some implementations, the state of the deposition arrangement can be determined based on an amount of the material detected in the edge area. For example, the normal state can be determined if there are no stains at all in the edge area or if an amount and/or area of the stains is below a threshold. The non- normal state can be determined if there are stains in the edge area or if an amount and/or area of the stains exceeds a threshold.

[0062] According to embodiments described herein, the method for determining a state of a deposition arrangement can be conducted using computer programs, software, computer software products and the interrelated controllers, which can have a CPU, a memory, a user interface, and input and output devices being in communication with the corresponding components of the apparatus configured to determine a state of a deposition arrangement.

[0063] The present disclosure determines the state of the deposition arrangement or a part thereof, such as the screen, by looking at a deposition material deposited on the substrate and/or substrate support. If abnormalities are detected, e.g., if there are stains on the substrate support, the present disclosure can determine that a failure of the deposition arrangement is imminent and stop the deposition process and/or notify an operator. A downtime of the tool can be reduced by avoiding a long cleaning time. Further, a deposition material, such as paste, can be saved and manufacturing costs can be reduced.

[0064] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. An apparatus configured to determine a state of a deposition arrangement, comprising: an inspection device configured to detect at least a portion of a material deposited on at least one of a substrate and a substrate support; and a processor configured to determine a state of the deposition arrangement based on the portion of the material detected by the inspection device.

2. The apparatus of claim 1, wherein the processor is configured to control a conveyor device of the substrate support to move a material on a surface of the substrate support.

3. The apparatus of claim 1 or 2, wherein the processor is configured to determine the state of the deposition arrangement based on a deviation from a nominal state.

4. The apparatus of claim 3, wherein the processor is configured to determine the normal state of the deposition arrangement when the deviation is less than a threshold deviation, and wherein the processor is configured to determine a non-normal state of the deposition arrangement when the deviation is greater than the threshold deviation.

5. The apparatus of any one of claims 1 to 4, wherein the inspection device is configured to detect the portion of the material deposited in an area of the substrate support at an edge of the substrate.

6. The apparatus of any one of claims 1 to 5, wherein the inspection device is further configured to detect at least one of a state of the substrate after a deposition process and a quality of a deposition pattern on the substrate.

7. A system for the manufacture of a solar cell, comprising: a deposition arrangement configured to deposit a material on a substrate; and the apparatus of any one of claims 1 to 6.

8. The system of claim 7, wherein the deposition arrangement is configured for screen printing and includes a screen, and wherein the processor is configured to determine a state of the screen.

9. The system of claim 7 or 8, further comprising: a transport arrangement configured for transportation of the substrate, wherein the inspection device is provided at the transport arrangement.

10. A method for determining a state of a deposition arrangement, comprising: detecting at least a portion of a material deposited on at least one of a substrate and a substrate support; and determining a state of a deposition arrangement based on the detected portion of the material.

11. The method of claim 10, further comprising: determining a normal state of the deposition arrangement if the detected portion of the material corresponds to a deviation from a nominal state which is less than a threshold deviation, and determining a non-normal state of the deposition arrangement if the detected portion of the material corresponds to a deviation from the nominal state which is greater than the threshold deviation.

12. The method of claim 11, wherein the normal state includes at least one of a state in which no material is present on the substrate support and a state in which an accuracy of a pattern deposited on the substrate is within a set range.

13. The method of any one of claims 10 to 12, further comprising: detecting an area of the substrate support at an edge of the substrate; and determining the state of the deposition arrangement based on an amount of the material detected in the area of the substrate support.

14. The method of any one of claims 10 to 13, further including: predicting a failure of the deposition arrangement based on the detected portion of the material.

15. A computer-readable storage medium comprising computer-executable instructions for implementing the method of any one of claims 10 to 14.