WO2019071622A1 - 一种散热装置 - Google Patents

一种散热装置 Download PDF

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Publication number
WO2019071622A1
WO2019071622A1 PCT/CN2017/106216 CN2017106216W WO2019071622A1 WO 2019071622 A1 WO2019071622 A1 WO 2019071622A1 CN 2017106216 W CN2017106216 W CN 2017106216W WO 2019071622 A1 WO2019071622 A1 WO 2019071622A1
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WIPO (PCT)
Prior art keywords
heat
heat dissipation
cooling medium
cooling
heat sink
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PCT/CN2017/106216
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English (en)
French (fr)
Inventor
邹昊雄
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邹昊雄
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Publication date
Application filed by 邹昊雄 filed Critical 邹昊雄
Priority to PCT/CN2017/106216 priority Critical patent/WO2019071622A1/zh
Publication of WO2019071622A1 publication Critical patent/WO2019071622A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat sink and, more particularly, to a heat sink for an electronic product.
  • An object of the present invention is to provide a heat dissipating device for an electronic product, which can more effectively help the electronic product to dissipate heat and improve the user experience.
  • the heat sink comprises:
  • the base comprises a heat absorbing plate made of a metal material for placing an electronic product, and the heat absorbing plate is provided with a heat absorbing plate flow path through which the cooling medium flows;
  • the heat dissipation body connected to the base, the heat dissipation body includes a housing, and a first heat sink and a heat dissipation fan disposed in the housing, the first heat sink including a first heat dissipation substrate a first heat dissipation channel through which a cooling medium flows is disposed in the first heat dissipation substrate;
  • the heat absorbing plate flow path and the first heat dissipation flow path are connected by a pipeline and form a cooling medium circulation loop, and the fluid circulation pump is provided with a fluid pump.
  • the heat sink body further includes a second heat sink disposed in the housing, the second heat sink including a solid state cooling component, and the solid state cooling disposed a cooling plate of the cold end of the component, wherein the cooling plate is provided with a cooling plate flow path through which the cooling medium flows, and the cooling plate flow path is a part of the cooling medium circulation circuit.
  • the second heat sink further includes a second heat dissipation substrate disposed at a hot end of the solid-state refrigeration component, and a second heat dissipation substrate away from the hot end of the solid-state refrigeration component
  • the side has heat dissipating fins.
  • the solid-state refrigerating component is a semiconductor refrigerating component, a magnetocaloric effect refrigerating component, or an electric card effect refrigerating component.
  • one side of the first heat dissipation substrate is formed with heat dissipating fins.
  • the heat sink further includes a solid state cooling component, and the cold end of the solid state cooling component is attached to the first heat sink substrate.
  • the cooling medium circulation circuit is further provided with a container for accommodating the cooling medium.
  • the base includes a bottom case disposed below the heat absorbing plate, and the fluid pump and the container are disposed in the bottom case.
  • the housing is formed with an air inlet and an air outlet for drawing air from the air inlet and discharging it from the air outlet.
  • the base and the heat dissipating body are connected by a duct.
  • the heat dissipating device of the present invention has the following beneficial effects: the heat dissipating device of the present invention uses the heat absorbing plate and the first bulk substrate in the heat dissipating body to form a cooling medium circulation loop, which has higher heat dissipation efficiency and can improve the user experience.
  • FIG. 1 is a perspective view of an embodiment of a heat sink according to the present invention.
  • FIG. 2 is a rear elevational view of the heat sink shown in Figure 1;
  • FIG 3 is a schematic view showing the internal structure of the heat sink shown in Figure 1;
  • Figure 4 is a second schematic view of the internal structure of the heat sink shown in Figure 1;
  • Figure 5 is a schematic view of a heat absorbing plate in an embodiment of a heat sink according to the present invention.
  • FIG. 6a is a perspective view of a first heat sink in an embodiment of a heat sink according to the present invention.
  • Figure 6b is a schematic structural view of the first heat sink shown in Figure 6a;
  • Figure 7a is a side elevational view of a second heat sink in an embodiment of a heat sink according to the present invention.
  • Figure 7b is a schematic view of the solid state cooling component and the cooling plate in the second heat sink shown in Figure 7a;
  • Figure 7c is a schematic structural view of the solid state cooling component and the cooling plate in the second heat sink shown in Figure 7a;
  • Figure 8 is a schematic diagram of a cooling medium circulation circuit of the heat sink shown in Figure 1;
  • FIG. 9 is a schematic diagram of a cooling medium circulation circuit according to another embodiment of the present invention.
  • FIG. 10 is a schematic illustration of a cooling medium circuit in accordance with yet another embodiment of the present invention.
  • FIG. 1 to FIG. 4 are schematic diagrams showing an embodiment of a heat dissipation device for heat dissipation of an electronic product, particularly for heat dissipation of an electronic product having a metal casing, such as a plate having a metal casing. Cooling of electronic products such as computers and notebook computers.
  • the heat dissipating device comprises a base 1 comprising a heat absorbing plate 10 made of a metal material for placing an electronic product, and the heat absorbing plate 10 is provided with a cooling medium flow.
  • the heat absorbing plate flow path 101 is provided with a cooling medium inlet 102 and a cooling medium outlet 103 respectively communicating with the heat absorbing plate flow path 101.
  • the heat absorbing plate 10 is preferably made of a metal having good thermal conductivity, such as copper, copper alloy, aluminum, aluminum alloy or other metal or alloy material, and the cooling medium preferably has a fluid having a larger specific heat capacity, such as water, or water and other substances.
  • the mixture may also be a mixture of oils and oils having a larger fluidity than the heat capacity.
  • the form of the heat absorbing plate runner 101 can be varied, can be a plurality of parallel flow channels, can also be a labyrinth flow channel, can also be a flow channel in the form of a microchannel, or any other conventionally suitable flow channel form.
  • the electronic product with a larger amount of heat can be directly placed on the heat absorbing plate 10, and the heat absorbing plate 10 is in contact with a portion of the electronic product having a relatively high temperature.
  • the base 1 further includes a bottom case 13 disposed under the heat absorbing plate 10.
  • the bottom case 13 can raise the heat absorbing plate 10 to a certain height to facilitate heat dissipation of the heat absorbing plate 10.
  • the bottom case 13 has other components. Contain space to place other components of the heat sink.
  • the heat dissipation device further includes a heat dissipation body 2 connected to the base 1.
  • the heat dissipation body 2 includes a housing 20, which may preferably be made of metal having good thermal conductivity, such as copper, copper alloy, aluminum, Aluminum alloy or other metal or alloy material, of course, the housing 20 can also be made of a non-metallic material.
  • a hook may be disposed on the housing 20, and when the heat sink is used in a notebook computer, when the working device is in operation, the display screen of the notebook computer is erected, and the housing 20 can be hung on the outer casing of the display screen. on.
  • the hooks may be slidably disposed on the housing 20. Referring to Fig.
  • the hooks may be disposed on the vertical rails 203 of the housing 20, and the hooks may slide on the slide rails 203 to adjust the position of the hooks.
  • the housing 20 can also be attached to the housing of the display screen by other suitable means, such as a suction cup, or other conventionally suitable construction.
  • the housing 20 can be supported by a foldable bracket such that the housing 20 can be erected.
  • the first heat sink 30 and the heat dissipation fan 60 are disposed in the housing 20.
  • the first heat sink 30 includes a first heat dissipation substrate 31, and the first heat dissipation substrate 31 is disposed.
  • the first heat dissipation substrate 31 is provided with a first inlet 313 and a first outlet 314 respectively communicating with both ends of the first heat dissipation channel 311, and the cooling medium flows through the first When the substrate 31 is cooled, it flows in from the first inlet 313, flows through the first heat dissipation channel 311, and then flows out through the first outlet 314.
  • the heat absorbing plate flow path 101 and the first heat dissipation flow path 311 are connected by a pipeline 51 and form a cooling medium circulation circuit.
  • the cooling medium circulation circuit is provided with a fluid pump 11 for powering the cooling medium to circulate and flow in the circulation circuit.
  • the fluid pump 11 can be a common electric pump.
  • One side of the first heat dissipation substrate 311 is formed with heat dissipation fins 312.
  • the gap between the heat dissipation fins 312 forms a first air passage 315.
  • the housing 20 is formed with an air inlet 201 and an air outlet 202.
  • the heat dissipation fan 60 is used for The air is sucked into the casing 20 by the air inlet 201, and the sucked air is exhausted through the first air passage 315 and the heat radiating fins 312, and then discharged by the air outlet 202, so that the heat of the heat radiating fins 312 can be taken away. Improve heat dissipation efficiency.
  • a filtering member such as a primary air filter cotton may be provided at the air inlet 201 to filter out dust in the air to ensure the interior of the casing 20 is clean, and the filter member may be periodically replaced or cleaned.
  • the heat dissipation body 2 further includes a second heat sink 40 disposed in the housing 20, and the second heat sink 40 is disposed above the first heat sink 30.
  • the second heat sink 40 includes a solid-state refrigerating member 41, and a cooling plate 42 disposed at the cold end 411 of the solid-state refrigerating member 41.
  • the cooling plate 42 is provided with a cooling plate flow path 421 through which the cooling medium flows, and the cooling plate 42 is disposed. There are a second inlet 422 and a second outlet 423 respectively communicating with the cooling plate flow path 421.
  • the cooling plate runner 421 is part of a cooling medium circulation loop,
  • the cooling plate flow path 421 is connected to the cooling medium circulation circuit through the line 51.
  • the cooling medium circulation circuit is constituted by the heat absorbing plate flow path 101, the first heat dissipation flow path 311, the cooling plate flow path 421, the fluid pump 11, and the connection line 51.
  • the cooling medium outlet 103 of the heat absorbing plate 10 is connected to the first inlet 313 of the first heat dissipation substrate 31 through the pipeline 51, and the first outlet 314 of the first heat dissipation substrate 31 passes through the pipeline 51 and the second of the cooling plate 42.
  • the inlet 422 is connected, the second outlet 423 of the cooling plate 42 is connected to the inlet of the fluid pump 11 via a line 51, and the outlet of the fluid pump 11 is connected to the coolant inlet 102 of the heat absorbing plate 10 via a line 51.
  • the cooling medium cooled by the cooling plate 42 enters the heat absorbing plate flow path 101 of the heat absorbing plate 10 under the action of the fluid pump 11, and the temperature of the cooling medium and the heat absorbing plate 10 exchanges heat, and then the temperature rises.
  • the first heat dissipation channel 311 entering the first heat dissipation substrate 31 exchanges heat with the first heat dissipation substrate 31.
  • the temperature of the cooling medium is lowered, and then enters the cooling plate flow path 421 of the cooling plate 42. Further heat exchange is performed with the cooling plate 42. Since the cooling plate 42 is in contact with the cold end 411 of the solid-state refrigerating member 41, the temperature of the cooling plate 42 is low, and the cooling medium flowing through the cooling 42 is further cooled, and then pumped by the fluid pump 11 to the heat absorbing plate 10 to lower The temperature of the heat absorbing plate 10.
  • the cooling medium circulation circuit is further provided with a container 12 for accommodating a cooling medium, and the container 12 can play a buffering role in the cooling medium circulation circuit to be thermally affected by the cooling medium.
  • the fluid pump 11 and the container 12 are disposed in the bottom case 13 of the base 1.
  • the fluid pump 11 and the container 12 may also be disposed in the housing 20 of the heat dissipation body 2, or may be disposed in the earthen shell 13 and the housing 20, respectively.
  • the second heat sink 40 further includes a second heat dissipation substrate 412 disposed at the hot end 413 of the solid-state refrigeration component 41.
  • the side of the second heat dissipation substrate 412 away from the hot end 413 of the solid-state refrigeration component 41 has heat-dissipating fins. 414, the gap between the heat dissipating fins 414 forms a second air passage 415, and the first air passage 315 of the first radiator 30 communicates with the second air passage 415, and the air flow sucked into the casing 20 by the heat radiating fan 60 After passing through the first air passage 315, it enters the second air passage 415 and is then discharged by the air outlet 202.
  • the base 1 and the heat dissipating body 2 are connected by a duct 70.
  • the conduit 51 connecting the heat absorbing plate runner 101 and the first heat dissipation channel 311, and the heat dissipation fan 60 in the heat dissipation body 2 and the power supply line of the solid state cooling member 41 may be disposed in the conduit 70.
  • the solid-state refrigerating member 41 in the present invention may be a semiconductor refrigerating member, a magnetocaloric effect refrigerating member or an electric card-effect refrigerating member, or other solid-state refrigerating member capable of generating a cooling effect.
  • a temperature difference is generated on both sides of the solid-state refrigerating member 41, and the lower temperature side, that is, the cold end 411, absorbs heat from the cooling plate 42 in contact with the side to lower the temperature of the cooling plate 42, thereby lowering The temperature of the cooling medium flowing in the cooling plate 42; the higher temperature side, that is, the hot end 413, transfers heat to the second heat dissipation substrate 412 that is in contact with the side, and is radiated outward by the heat dissipation fins 414.
  • the higher temperature side can also directly dissipate heat into the environment.
  • the base 1 is configured to absorb heat generated by the electronic product placed on the heat absorbing plate 10 to cool the electronic product
  • the heat dissipation body 2 is configured to cool and cool the cooling medium in the cooling medium circulation circuit.
  • the separate structure of the heat dissipation body 2 and the heat dissipation body 2 have higher heat dissipation efficiency and can improve the user experience.
  • the first heat sink 30 in the first embodiment, the cooling plate flow path 421 of the cooling plate 42 of the second heat sink 40, and the heat absorbing plate of the heat absorbing plate 10 are omitted.
  • the flow path 101 forms a cooling medium circulation loop, and the cooling medium circuit of this embodiment is as shown in FIG.
  • the first heat sink 30 may be disposed in the heat dissipation body 2, and the first heat sink 30 further includes a solid-state refrigeration component, and the cold end of the solid-state refrigeration component is bonded to the first heat dissipation substrate 31.
  • the second heat sink 40 in the first embodiment, the first heat dissipation channel 311 of the heat dissipation substrate 31 of the first heat sink 30, and the suction of the heat absorbing plate 10 are omitted.
  • the hot plate flow path 101 forms a cooling medium circulation circuit, and the cooling medium circuit of this embodiment is as shown in FIG.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置，包括：底座（1），该底座（1）包括由金属材料制成的用于放置电子产品的吸热板（10），该吸热板（10）内设置有供冷却介质流过的吸热板流道（101）；与该底座（1）相连接的散热主体（2），该散热主体（2）包括壳体（20），以及设置在该壳体（20）内的第一散热器（30）和散热风扇（60），该第一散热器（30）包括第一散热基板（31），该第一散热基板（31）内设置有供冷却介质流过的第一散热流道（311）；该吸热板流道（101）和该第一散热流道（311）通过管路（51）连接并形成冷却介质循环回路，该冷却介质循环回路上设置有流体泵（11）。该散热装置利用吸热板（10）、散热主体（2）内第一散热基板（31）形成冷却介质循环回路，具有更高的散热效率，可以改善用户体验。

Description

一种散热装置 技术领域
本发明涉及散热装置，更具体地说，涉及一种用于电子产品的散热装置。
背景技术
电子产品，例如手机、平板电脑、笔记本电脑等产品，一方面，越来越轻薄化，而且越来越多的采用无风扇设计；另一方面，随着电子产品性能的日益提升，其内部的中央处理器(CPU)、图形处理器(GPU)的核心数量越来越多，而且频率也越来越来高，发热量也在变大，这对电子产品的散热设计带来巨大的挑战。尽管越来越多的电子产品采用金属外壳，借助于外壳进行散热，但在运行游戏或其他需要运算较多的软件时，仍然会出现由于过热导致卡顿甚至死机的情况，这会给用户造成非常不好的体验。为了帮助电子产品散热，也有一些辅助散热装置出现，例如一些利用风扇对电子产品进行风冷的散热底座，这些散热底座散热效率较低，只在环境温度较低的情况下有效。
发明内容
本发明的目的在于提供一种用于电子产品的散热装置，该散热装置能够更为高效的帮助电子产品散热，提升用户体验。
根据本发明的散热装置的一实施例，该散热装置包括：
底座，所述底座包括由金属材料制成的用于放置电子产品的吸热板，所述吸热板内设置有供冷却介质流过的吸热板流道；
与所述底座相连接的散热主体，所述散热主体包括壳体，以及设置在所述壳体内的第一散热器和散热风扇，所述第一散热器包括第一散热基板，所 述第一散热基板内设置有供冷却介质流过的第一散热流道；
所述吸热板流道和所述第一散热流道通过管路连接并形成冷却介质循环回路，所述冷却介质循环回路上设置有流体泵。
根据本发明的散热装置的一实施例，该散热装置所述散热主体还包括设置在所述壳体内的第二散热器，所述第二散热器包括固态制冷部件，以及设置在所述固态制冷部件的冷端的冷却板，所述冷却板内设置有供冷却介质流过的冷却板流道，所述冷却板流道为所述冷却介质循环回路的一部分。
根据本发明的散热装置的一实施例所述第二散热器还包括设置在所述固态制冷部件的热端的第二散热基板，所述第二散热基板的远离所述固态制冷部件的热端的一侧具有散热翅片。
根据本发明的散热装置的一实施例所述固态制冷部件为半导体制冷部件、磁热效应制冷部件或电卡效应制冷部件。
根据本发明的散热装置的一实施例，所述第一散热基板的一侧形成有散热翅片。
根据本发明的散热装置的一实施例，该散热装置还包括固态制冷部件，所述固态制冷部件的冷端与所述第一散热基板贴合。
根据本发明的散热装置的一实施例，所述冷却介质循环回路上还设置有用于收容冷却介质的容器。
根据本发明的散热装置的一实施例，所述底座包括设置在所述吸热板下方的底壳，所述流体泵以及所述容器设置在所述底壳内。
根据本发明的散热装置的一实施例，所述壳体上形成有空气入口和空气出口，所述散热风扇用于将空气由空气入口吸入并由空气出口排出。
根据本发明的散热装置的一实施例，所述底座与所述散热主体通过导管相连接。
实施本发明的散热装置，具有以下有益效果：本发明的散热装置利用吸热板、散热主体内第一散基板形成冷却介质循环回路，具有更高的散热效率，可以改善用户体验。
附图说明
下面将结合附图及实施例对本发明作进一步说明，附图中：
图1是根据本发明的散热装置的一实施例的立体示意图；
图2是图1所示的散热装置的后视图；
图3是图1所示的散热装置的内部结构的示意图之一；
图4是图1所示的散热装置的内部结构的示意图之二；
图5是根据本发明的散热装置的一实施例中吸热板的示意图；
图6a是根据本发明的散热装置的一实施例中第一散热器的立体示意图；
图6b是图6a中所示的第一散热器的结构示意图；
图7a是根据本发明的散热装置的一实施例中第二散热器的侧面示意图；
图7b是图7a所示的第二散热器中的固态制冷部件以及冷却板的示意图；
图7c是图7a所示的第二散热器中的固态制冷部件以及冷却板的结构示意图；
图8是图1所示的散热装置的冷却介质循环回路示意图；
图9是根据本发明的另一实施例的冷却介质循环回路示意图；
图10是根据本发明的又一实施例的冷却介质循环回路示意图。
具体实施方式
为了对本发明的技术特征、目的和效果有更加清楚的理解，现对照附图详细说明本发明的具体实施方式。
下面详细描述本发明的散热装置的实施例，这些实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。
在本发明的散热装置的描述中，需要理解的是，术语“前”、“后”、“上”、“下”、“上端”、“下端”、“上部”、“下部”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构 造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性。
如图1至图4所示，为本发明的散热装置的一实施例的示意图，该散热装置用于电子产品的散热，尤其适用于具有金属外壳的电子产品的散热，例如具有金属外壳的平板电脑、笔记本电脑等电子产品的散热。参看图1至图5，在该实施例中，散热装置包括底座1，底座1包括由金属材料制成的用于放置电子产品的吸热板10，吸热板10内设置有供冷却介质流过的吸热板流道101，吸热板10上设置有分别与吸热板流道101连通的冷却介质入口102和冷却介质出口103。吸热板10优选具有良好导热性能的金属制成，例如铜、铜合金、铝、铝合金或其他金属或合金材料，冷却介质优选具有较大比热容的流体，例如水，或水与其他物质形成的混合液，还可以是比热容较大流动性较好的油类以及油类的混合物。当温度较低的冷却介质由吸热板10的冷却介质入口102进入吸热板10，流经吸热板流道101后由冷却介质出口103流出时，冷却介质与吸热板10进行热交换并带走热量。吸热板流道101的形式可以是多样的，可以多条平行的流道，也可以是迷宫式流道，还可以是微通道形式的流道，或者其他任何常规适用的流道形式。发热量较大的电子产品可以直接放置在吸热板10上，吸热板10与电子产品温度较高的部分接触，例如，笔记本电脑的金属底壳直接放置在吸热板10上，笔记本电脑工作时产生的热量可以经由金属底壳传递给吸热板10，然后由流经吸热板10的吸热板流道101的冷却介质带走，以达到降低笔记本电脑温度的效果。底座1还包括设置在吸热板10下方的底壳13，底壳13可以使吸热板10抬高一定高度，以利于吸热板10向外散热，此外，底壳13具有收容其他部件的收容空间，以放置散热装置的其他部件。
在本实施例中，散热装置还包括与底座1相连接的散热主体2，散热主体2包括壳体20，壳体20可以优选具有良好导热性能的金属制成，例如铜、铜合金、铝、铝合金或其他金属或合金材料，当然，壳体20也可以选用非金属材料制成。壳体20上可以设置挂钩，当散热装置用于笔记本电脑时，工作的时候，笔记本电脑的显示屏竖起来，壳体20可以挂在显示屏的外壳 上。挂钩可以可滑动地设置在壳体20上，参看图1，可以设置在壳体20的竖直侧边的滑轨203上，挂钩可以在滑轨203上滑动以调整挂钩的位置，这样可以适用各种规格的笔记本电脑。当然，需要理解的是，壳体20也可以通过其他适宜的方式附着在显示屏的外壳上，比如吸盘，或其他常规适用的结构。当用于其他电子产品时，壳体20可以通过可折叠支架来支撑以使壳体20可以竖起来。
在本实施例中，壳体20内设置有第一散热器30和散热风扇60，参看图6a-6b以及图8，第一散热器30包括第一散热基板31，第一散热基板31内设置有供冷却介质流过的第一散热流道311，第一散热基板31上设置有分别与第一散热流道311的两端连通的第一入口313和第一出口314，冷却介质流经第一散热基板31时，由第一入口313流入，流经第一散热流道311后由第一出口314流出。吸热板流道101和第一散热流道311通过管路51连接并形成冷却介质循环回路，冷却介质循环回路上设置有流体泵11，流体泵11为冷却介质在循环回路中循环流动提供动力，流体泵11可以是常见的电动泵。第一散热基板311的一侧形成有散热翅片312，散热翅片312之间的间隙形成第一空气通道315，壳体20上形成有空气入口201和空气出口202，散热风扇60用于将空气由空气入口201吸入到壳体20内，并使吸入的空气流经第一空气通道315与散热翅片312进行热交换后由空气出口202排出，这样可以带走散热翅片312的热量，提高散热效率。为了防止壳体20内部聚集灰尘，可以在空气入口201处设置过滤部件，比如初级空气过滤棉，以过滤掉空气中的灰尘，保证壳体20内部的洁净，过滤部件可以定期更换或清洗。
参看图4、图7a-7c以及图8，在本实施例中，散热主体2还包括设置在壳体20内的第二散热器40，第二散热器40设置在第一散热器30的上方。第二散热器40包括固态制冷部件41，以及设置在固态制冷部件41的冷端411的冷却板42，冷却板42内设置有供冷却介质流过的冷却板流道421，冷却板42上设置有分别与冷却板流道421连通的第二入口422和第二出口423，冷却介质流经冷却板421时，由第二入口422流入，流经冷却板流道421后由第二出口423流出。冷却板流道421为冷却介质循环回路的一部分， 冷却板流道421通过管路51连接入冷却介质循环回路。
参看图8，在本实施例中，冷却介质循环回路由吸热板流道101、第一散热流道311、冷却板流道421、流体泵11以及连接管路51构成。具体地，吸热板10的冷却介质出口103通过管路51与第一散热基板31的第一入口313连接，第一散热基板31的第一出口314通过管路51与冷却板42的第二入口422连接，冷却板42的第二出口423通过管路51与流体泵11的入口连接，流体泵11的出口通过管路51与吸热板10的冷却介质入口102连接。冷却装置工作时，经过冷却板42冷却的冷却介质在流体泵11的作用下进入到吸热板10的吸热板流道101，冷却介质与吸热板10进行热交换后温度升高，然后进入到第一散热基板31的第一散热流道311与第一散热基板31进行热交换，经由第一散热通道311后，冷却介质的温度会降低，然后进入冷却板42的冷却板流道421进一步与冷却板42进行热交换。由于冷却板42与固态制冷部件41的冷端411相接触，冷却板42的温度较低，流经冷却42的冷却介质会进一步降温，然后再由流体泵11泵入到吸热板10以降低吸热板10的温度。
参看图3及图8，在本实施例中，冷却介质循环回路上还设置有用于收容冷却介质的容器12，容器12在冷却介质循环回路中可以起到缓冲的作用，以在冷却介质热受热膨胀或压力过大时，提供缓冲的空间，避免冷却介质回路压力过大。在本实施例中，流体泵11和容器12设置在底座1的底壳13内。当然，需要理解的是，流体泵11和容器12也可以设置在散热主体2的壳体20内，还可以分别设置在地壳13和壳体20内。
参看图7a，第二散热器40还包括设置在固态制冷部件41的热端413的第二散热基板412，第二散热基板412的远离固态制冷部件41的热端413的一侧具有散热翅片414，散热翅片414之间的间隙形成第二空气通道415，第一散热器30的第一空气通道315与第二空气通道415相连通，由散热风扇60吸入到壳体20内的空气流经第一空气通道315后进入第二空气通道415，然后由空气出口202排出。
参看图1至图4，在本实施例中，底座1和散热主体2通过导管70连 接，连接吸热板流道101和第一散热流道311的管路51，以及散热主体2内的散热风扇60、固态制冷部件41的供电线路可以设置在导管70内。
本发明中的固态制冷部件41可以是半导体制冷部件、磁热效应制冷部件或电卡效应制冷部件，或其他能够产生制冷效应的固态制冷部件。工作时，固态制冷部件41的两侧会产生温度差，温度较低的一侧，也即冷端411，由与该侧接触的冷却板42吸收热量，以降低冷却板42的温度，进而降低冷却板42中流动的冷却介质的温度；温度较高的一侧，也即热端413，向与该侧接触的第二散热基板412传递热量，并由散热翅片414向外散热。当然，需要理解的是，温度较高的一侧也可以直接向环境中散热。
在本实施例中，底座1用于吸收放置在吸热板10上的电子产品产生的热量，使该电子产品降温，散热主体2用于对冷却介质循环回路中的冷却介质进行散热降温，底座1和散热主体2这种分开式的结构，具有更高的散热效率，可以改善用户体验。
在本发明的散热装置的另一实施例中，省去第一实施例中第一散热器30，第二散热器40的冷却板42的冷却板流道421与吸热板10的吸热板流道101形成冷却介质循环回路，该实施例的冷却介质回路如图9所示。或者，也可以是散热主体2内只有第一散热器30，第一散热器30还包括固态制冷部件，固态制冷部件的冷端与第一散热基板31贴合。
在本发明的散热装置的又一实施例中，省去第一实施例中的第二散热器40，第一散热器30的散热基板31的第一散热流道311与吸热板10的吸热板流道101形成冷却介质循环回路，该实施例的冷却介质回路如图10所示。
上面结合附图对本发明的实施例进行了描述，但是本发明并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本发明的启示下，在不脱离本发明宗旨和权利要求所保护的范围情况下，还可做出很多形式，这些落入于本发明的保护之内。

Claims (10)

  1. 一种散热装置，其特征在于，包括：
    底座，所述底座包括由金属材料制成的用于放置电子产品的吸热板，所述吸热板内设置有供冷却介质流过的吸热板流道；
    与所述底座相连接的散热主体，所述散热主体包括壳体，以及设置在所述壳体内的第一散热器和散热风扇，所述第一散热器包括第一散热基板，所述第一散热基板内设置有供冷却介质流过的第一散热流道；
    所述吸热板流道和所述第一散热流道通过管路连接并形成冷却介质循环回路，所述冷却介质循环回路上设置有流体泵。
  2. 根据权利要求1所述的散热装置，其特征在于，所述散热主体还包括设置在所述壳体内的第二散热器，所述第二散热器包括固态制冷部件，以及设置在所述固态制冷部件的冷端的冷却板，所述冷却板内设置有供冷却介质流过的冷却板流道，所述冷却板流道为所述冷却介质循环回路的一部分。
  3. 根据权利要求2所述的散热装置，其特征在于，所述第二散热器还包括设置在所述固态制冷部件的热端的第二散热基板，所述第二散热基板的远离所述固态制冷部件的热端的一侧具有散热翅片。
  4. 根据权利要求2所述的散热装置，其特征在于，所述固态制冷部件为半导体制冷部件、磁热效应制冷部件或电卡效应制冷部件。
  5. 根据权利要求1所述的散热装置，其特征在于，所述第一散热基板的一侧形成有散热翅片。
  6. 根据权利要求1所述的散热装置，其特征在于，还包括固态制冷部件，所述固态制冷部件的冷端与所述第一散热基板贴合。
  7. 根据权利要求1所述的散热装置，其特征在于，所述冷却介质循环回路上还设置有用于收容冷却介质的容器。
  8. 根据权利要求7所述的散热装置，其特征在于，所述底座包括设置在所述吸热板下方的底壳，所述流体泵以及所述容器设置在所述底壳内。
  9. 根据权利要求1所述的散热装置，其特征在于，所述壳体上形成有空 气入口和空气出口，所述散热风扇用于将空气由空气入口吸入并由空气出口排出。
  10. 根据权利要求1所述的散热装置，其特征在于，所述底座与所述散热主体通过导管相连接。
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