WO2019061408A1

WO2019061408A1 - Card holder structure and mobile phone

Info

Publication number: WO2019061408A1
Application number: PCT/CN2017/104799
Authority: WO
Inventors: 孟跃龙; 鞠伟光
Original assignee: 深圳传音制造有限公司
Priority date: 2017-09-30
Filing date: 2017-09-30
Publication date: 2019-04-04
Also published as: CN111279667A; CN111279667B

Abstract

Provided by the present invention are a card holder structure and a mobile phone. The card holder structure comprises: a card holder body, a metal spring foot, a shielding cover and an electronic component; the card holder body and the metal spring foot are both arranged on a motherboard, wherein the metal spring foot is arranged on the outer side of the card holder body; the bottom of the shielding cover is arranged on the motherboard, and a shielding cavity is formed between the shielding cover and the motherboard, the card holder body and the metal spring foot both being located in the shielding cavity; the top of the shielding cover is provided with a hole for the spring foot to extend out, and when the metal spring foot is in a free state, the metal spring foot extends out of the top of the shield cover by means of the hole for the spring foot to extend out; when the electronic component is arranged at the top of the shielding cover, the metal spring foot is in contact with a contact point on the electronic component. When the electronic component is arranged at the top of the card holder, a direct connection between the electronic component and the motherboard is achieved by direct contact connection between the contact point on the electronic component and the metal spring foot arranged in the shielding cover, thus making the layout structure more compact and significantly reducing costs.

Description

卡座结构及手机Card structure and mobile phone

技术领域Technical field

本发明涉及电子产品技术领域，尤其涉及一种卡座结构及手机。The present invention relates to the field of electronic product technology, and in particular, to a card holder structure and a mobile phone.

背景技术Background technique

随着电子技术的快速发展，手机中配置的功能也越来越多，这就导致了在主板上需要布置的电子器件也越来越多，因此在手机开发过程中对有限的主板空间内进行合理布局就变得尤为重要。With the rapid development of electronic technology, more and more functions are configured in mobile phones, which leads to more and more electronic devices that need to be arranged on the motherboard. Therefore, in the development of the mobile phone, the limited motherboard space is carried out. A reasonable layout becomes even more important.

现有手机中的卡座通常只用于承载SIM卡或者TF卡，但是，对于一些厚度较厚的手机，在卡座顶部和手机壳体之间通常还预留有一定的纵向空间，有些手机厂商就会将一些有高度位置要求的电子组件布置在卡座顶部，再通过柔性电路板(Flexible Printed Circuit，简称FPC)和连接器与主板进行连接。例如，手机厂商将闪光灯组件架起贴在卡座的顶部，再通过FPC和板对板连接器(Board to Board，简称：BTB)与主板进行连接。The card holder in the existing mobile phone is usually only used to carry the SIM card or the TF card. However, for some thicker mobile phones, a certain vertical space is usually reserved between the top of the card holder and the mobile phone case, and some mobile phones are reserved. The manufacturer will place some electronic components with high position requirements on the top of the deck, and then connect to the motherboard through a Flexible Printed Circuit (FPC) and a connector. For example, the mobile phone manufacturer attaches the flash unit to the top of the deck, and then connects to the motherboard through the FPC and the board to board connector (BTB).

通过在现有的卡座上对电子组件进行布置和走线，BTB和FPC在主板上还是会占用较多的平面空间，不利于主板上电子组件的紧凑排布。By arranging and routing electronic components on existing decks, BTB and FPC still occupy more plane space on the motherboard, which is not conducive to the compact arrangement of electronic components on the motherboard.

发明内容Summary of the invention

本发明提供一种卡座结构及手机，在电子组件布置到卡座顶部上时，通过将电子组件上的触点和设置在屏蔽罩内的金属弹脚直接接触连接，从而实现电子组件与主板的导通，省去了柔性电路板和板对板连接器的走线结构，使得布置结构更加紧凑，同时也大大降低了成本。The invention provides a card holder structure and a mobile phone. When the electronic component is arranged on the top of the card holder, the electronic component and the main board are realized by directly contacting the contact on the electronic component and the metal elastic foot disposed in the shielding cover. The conduction eliminates the wiring structure of the flexible circuit board and the board-to-board connector, which makes the arrangement more compact and greatly reduces the cost.

第一方面，本发明提供了一种卡座结构，包括：卡座本体、金属弹脚、屏蔽罩以及电子组件；In a first aspect, the present invention provides a card holder structure, including: a card holder body, a metal bullet, a shield, and an electronic component;

所述卡座本体和所述金属弹脚均设置在主板上，其中，所述金属弹脚设置在所述卡座本体的外侧；The card body and the metal elastic foot are disposed on the main board, wherein the metal elastic foot is disposed outside the card body;

所述屏蔽罩底部设置在所述主板上，所述屏蔽罩与所述主板之间形成屏蔽腔，其中，所述卡座本体和所述金属弹脚均位于所述屏蔽腔内；The bottom of the shielding cover is disposed on the main board, and a shielding cavity is formed between the shielding cover and the main board, The cartridge body and the metal bullet are both located in the shielding cavity;

所述屏蔽罩的顶部开设有弹脚伸出孔，当所述金属弹脚处于自由状态时，所述金属弹脚通过所述弹脚伸出孔伸出所述屏蔽罩的顶部；The top of the shielding cover is provided with a projecting foot extending hole, and when the metal elastic leg is in a free state, the metal elastic foot protrudes from the top of the shielding cover through the protruding foot extending hole;

当所述电子组件设置在所述屏蔽罩顶部时，所述金属弹脚与所述电子组件上的触点相接触。The metal foot contacts the contacts on the electronic component when the electronic component is disposed on top of the shield.

在一种可能的设计中，所述屏蔽罩上设置有第一定位部，所述电子组件上设置有第二定位部；In a possible design, the shielding cover is provided with a first positioning portion, and the electronic component is provided with a second positioning portion;

当所述第一定位部和所述第二定位部满足预设的位置关系时，所述金属弹脚与所述电子组件上的触点相接触。When the first positioning portion and the second positioning portion satisfy a preset positional relationship, the metal elastic foot contacts the contact on the electronic component.

在一种可能的设计中，所述屏蔽罩上设置的第一定位部为至少一个第一定位孔，所述电子组件上设置的第二定位部为至少一个第二定位孔；In a possible design, the first positioning portion disposed on the shielding cover is at least one first positioning hole, and the second positioning portion disposed on the electronic component is at least one second positioning hole;

当所述第一定位孔的轴线与所述第二定位孔的轴线相互重合时，所述金属弹脚与所述电子组件上的触点相接触。When the axis of the first positioning hole and the axis of the second positioning hole coincide with each other, the metal foot contacts the contact on the electronic component.

在一种可能的设计中，所述屏蔽罩上设置的第一定位部为至少一个定位脚，所述电子组件上设置的第二定位部为至少一个定位槽；In a possible design, the first positioning portion disposed on the shielding cover is at least one positioning leg, and the second positioning portion disposed on the electronic component is at least one positioning groove;

当所述定位脚卡设在所述定位槽内时，所述金属弹脚与所述电子组件上的触点相接触。When the positioning pin is disposed in the positioning groove, the metal elastic foot contacts the contact on the electronic component.

在一种可能的设计中，所述金属弹脚的两端设置在所述主板上，所述金属弹脚的中部通过所述弹脚伸出孔伸出所述屏蔽罩的顶部。In a possible design, both ends of the metal elastic are disposed on the main board, and a middle portion of the metal elastic protrudes from a top of the shielding cover through the protruding protrusion hole.

在一种可能的设计中，所述金属弹脚的材料为铜。In one possible design, the material of the metal foot is copper.

在一种可能的设计中，所述金属弹脚的中部与所述电子组件上的触点相接触的位置的表面镀银。In one possible design, the surface at the location where the middle portion of the metal foot contacts the contact on the electronic component is silver plated.

在一种可能的设计中，所述屏蔽罩的长度大于所述电子组件的长度，所述屏蔽罩的宽度大于所述电子组件的宽度，当所述电子组件设置在所述屏蔽罩顶部时，所述电子组件在所述屏蔽罩顶部的投影位于所述屏蔽罩顶部的内部。In a possible design, the length of the shield is greater than the length of the electronic component, the width of the shield is greater than the width of the electronic component, when the electronic component is disposed on the top of the shield, A projection of the electronic component on top of the shield is located inside the top of the shield.

在一种可能的设计中，所述屏蔽罩靠近所述金属弹脚的侧壁上开设有散热孔。In a possible design, the shielding cover is provided with a heat dissipation hole near the sidewall of the metal elastic.

第二方面，本发明还提供了一种手机，包括第一方面及第一方面各种可能的设计所述的卡座结构。In a second aspect, the present invention also provides a mobile phone comprising the first aspect and the card seat structure of the various possible designs of the first aspect.

本发明提供一种卡座结构，在卡座顶部布置电子组件时，通过将电子组件上的触点和设置在屏蔽罩内的金属弹脚直接接触连接，从而实现电子组件与主板的导通，省去了柔性电路板和板对板连接器的走线结构，使得布置结构更加紧凑，同时也大大降低了成本。The invention provides a card seat structure. When an electronic component is arranged on the top of the card seat, the contact between the electronic component and the main board is realized by directly contacting the contact on the electronic component with the metal elastic foot disposed in the shielding cover. Province The routing structure of the flexible circuit board and the board-to-board connector has been removed, which makes the arrangement more compact and also greatly reduces the cost.

附图说明DRAWINGS

为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief description of the drawings used in the embodiments or the prior art description will be briefly described below. Obviously, the drawings in the following description It is a certain embodiment of the present invention, and other drawings can be obtained from those skilled in the art without any inventive labor.

图1是本发明根据一示例性实施例示出的卡座结构的装配示意图；1 is a schematic view showing the assembly of a card holder structure according to an exemplary embodiment of the present invention;

图2是图1所示卡座结构的卡座部分结构示意图；Figure 2 is a schematic structural view of a portion of the card holder structure of the card holder structure shown in Figure 1;

图3是本发明根据另一示例性实施例示出的卡座结构的装配示意图；3 is a schematic view showing the assembly of a card seat structure according to another exemplary embodiment of the present invention;

图4是图3所示卡座结构的卡座部分结构示意图；Figure 4 is a schematic structural view of a portion of the card holder structure of the card holder structure shown in Figure 3;

图5是本发明根据又一示例性实施例示出的卡座结构的装配示意图；FIG. 5 is a schematic view showing the assembly of a card seat structure according to still another exemplary embodiment of the present invention; FIG.

图6是图5所示卡座结构的卡座部分结构示意图。Fig. 6 is a structural schematic view showing a portion of the card holder structure of the card holder structure shown in Fig. 5.

附图标记说明：Description of the reference signs:

1：卡座本体；1: card holder body;

2：金属弹脚；2: metal bullets;

3：屏蔽罩；3: shield cover;

31：弹脚伸出孔；31: The foot of the bullet extends out of the hole;

32：第一定位孔；32: a first positioning hole;

33：散热孔；33: heat dissipation hole;

4：电子组件；4: electronic components;

41：第二定位孔；41: a second positioning hole;

5：主板。5: Motherboard.

具体实施方式Detailed ways

为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. It is a partial embodiment of the invention, and not all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall belong to the present invention. The scope of protection.

图1是本发明根据一示例性实施例示出的卡座结构的装配示意图，图2是图1所示卡座结构的卡座部分结构示意图。如图1-图2所示，本实施例提供的卡座结构，包括：卡座本体1、金属弹脚2、屏蔽罩3以及电子组件4。1 is a schematic view showing the assembly of a card seat structure according to an exemplary embodiment of the present invention, and FIG. 2 is a schematic structural view of a card seat portion of the card seat structure shown in FIG. As shown in FIG. 1 to FIG. 2, the card holder structure provided in this embodiment includes: a card holder body 1, a metal bullet 2, a shield cover 3, and an electronic component 4.

具体地，可以将卡座本体1和金属弹脚2进行分体设计，也可以将卡座本体1和金属弹脚2进行整体设计。对于分体设计方式，在组装工艺上，先将卡座本体1通过PIN脚焊接在主板5上，具体焊接方式可以是手工焊接，也可以是通过贴片生产线上的波峰焊机或者回流焊机进行焊接，在完成卡座本体1的焊接之后，再将金属弹脚2焊接到主板5上，其中，金属弹脚2设置在卡座本体1的外侧。而对于整体设计方式，需要在保持原有的卡座本体1结构的基础上在其外侧增设金属弹脚2支撑部。组装工艺上，在对卡座本体1进行注塑的时候，采用嵌件注塑的方式，将金属弹脚2一体注塑到卡座本体1增设的支撑部上，其中，金属弹脚2设置在卡座本体1的外侧。然后通过手工焊接、波峰焊机或者回流焊机将一体成型有卡座本体1和金属弹脚2的卡座结构焊接到主板5上。值得说明地，金属弹脚2具体设置的位置和数量根据与其配合的电子组件4上的触点位置和数量确定。例如，对于闪光灯组件，则只需要两个触点就可以驱动，因此可以在卡座本体1垂直于插卡开口的两侧分别设置一个金属弹脚2用于从主板5上取电。Specifically, the card body 1 and the metal foot 2 may be separately designed, or the card body 1 and the metal foot 2 may be integrally designed. For the split design method, in the assembly process, the card body 1 is first soldered to the main board 5 through the PIN pin, and the specific soldering method may be manual soldering, or may be a wave soldering machine or a reflow soldering machine through the patch production line. Welding is performed, and after the welding of the cartridge body 1 is completed, the metal elastic foot 2 is welded to the main plate 5, wherein the metal elastic foot 2 is disposed outside the cartridge body 1. For the overall design method, it is necessary to add a metal elastic foot 2 support portion on the outer side of the original card holder body 1 structure. In the assembly process, when the card body 1 is injection molded, the metal foot 2 is integrally molded into the support portion of the card body 1 by insert molding, wherein the metal foot 2 is disposed on the card seat The outside of the body 1. The card holder structure integrally formed with the card body 1 and the metal foot 2 is then soldered to the main board 5 by hand soldering, wave soldering or reflow soldering. It is worth noting that the position and number of the metal foot 2 are specifically determined according to the position and number of contacts on the electronic component 4 to which it is mated. For example, for the flash unit, only two contacts are required to be driven, so that a metal foot 2 can be respectively disposed on the sides of the deck body 1 perpendicular to the card opening for taking power from the main board 5.

考虑到需要对卡座本体1和金属弹脚2进行保护，以及对电子组件4进行可靠的支撑，则需要在卡座本体1和金属弹脚2的外侧设置一个屏蔽罩3。屏蔽罩3的底部设置在主板5上，并且，屏蔽罩3与主板5之间形成屏蔽腔，其中，卡座本体1和金属弹脚2均位于屏蔽腔内。对于屏蔽罩3和主板5之间的连接可以采取插接的方式，在主板5预留有插接口，屏蔽罩3的底部设置有插接柱，装配时，可以将屏蔽罩3底部的插接柱***到主板5上的插接口中，并且插接柱穿过主板5部分伸出，再通过加锡或者加胶的方式对主板5与插接柱穿出主板5的部分进行固定。In view of the need to protect the card body 1 and the metal foot 2, and to reliably support the electronic component 4, it is necessary to provide a shield 3 on the outside of the card body 1 and the metal foot 2. The bottom of the shielding cover 3 is disposed on the main board 5, and a shielding cavity is formed between the shielding cover 3 and the main board 5, wherein the holder body 1 and the metal elastic foot 2 are both located in the shielding cavity. The connection between the shield cover 3 and the main board 5 can be plugged, and the plug-in interface is reserved in the main board 5. The bottom of the shield cover 3 is provided with a plug post. When assembling, the bottom of the shield cover 3 can be inserted. The column is inserted into the plug connector on the main board 5, and the plug post protrudes through the main board 5, and then the main board 5 and the plug post are fixed through the main board 5 by adding tin or adding glue.

在屏蔽罩3的顶部开设有弹脚伸出孔31，当未与电子组件4进行装配时，金属弹脚2处于自由状态，此时，金属弹脚2通过弹脚伸出孔31伸出屏蔽罩3的顶部。可选地，金属弹脚2的两端设置在主板5上，金属弹脚2的中部通过弹脚伸出孔31伸出所述屏蔽罩的顶部。A projecting-out hole 31 is formed in the top of the shielding cover 3. When not assembled with the electronic component 4, the metal elastic foot 2 is in a free state. At this time, the metal elastic foot 2 protrudes through the protruding hole 31. The top of the cover 3. Optionally, both ends of the metal elastic foot 2 are disposed on the main board 5, and the middle portion of the metal elastic foot 2 protrudes from the top of the shielding cover through the elastic protruding hole 31.

其中，金属弹脚2伸出屏蔽罩3顶部的部分的长度可以根据电子组件4上的触点设计方式而确定。例如，如果电子组件4上的触点与其底面平面共面，则金属弹脚2 伸出屏蔽罩3顶部的部分的长度不宜过大，而当电子组件4上的触点是采取凹陷方式设计时，则金属弹脚2伸出屏蔽罩3顶部的部分的长度还需根据触点凹陷的深度进行进一步地确定。本实施例中，并不对金属弹脚2伸出屏蔽罩3顶部的部分的长度以及电子组件4上的触点设置方式进行具体地限定，但是需要保证的是，在电子组件4装配到屏蔽罩3顶部时，金属弹脚2与电子组件4上的触点充分接触，且金属弹脚2处于一定的弹性变形状态，通过金属弹脚2的弹力使得金属弹脚2与电子组件4上的触点接触更加可靠。The length of the portion of the metal foot 2 that protrudes from the top of the shield 3 can be determined according to the manner in which the contacts on the electronic component 4 are designed. For example, if the contact on the electronic component 4 is coplanar with the plane of its bottom surface, the metal foot 2 The length of the portion protruding from the top of the shield 3 should not be too large, and when the contact on the electronic component 4 is designed to be recessed, the length of the portion of the metal foot 2 that protrudes from the top of the shield 3 needs to be based on the contact. The depth of the depression is further determined. In this embodiment, the length of the portion of the metal foot 2 that protrudes from the top of the shield 3 and the manner in which the contacts on the electronic component 4 are disposed are not specifically limited, but it is necessary to ensure that the electronic component 4 is assembled to the shield. 3 at the top, the metal elastic foot 2 is in full contact with the contact on the electronic component 4, and the metal elastic foot 2 is in a certain elastic deformation state, and the metal elastic foot 2 and the electronic component 4 are touched by the elastic force of the metal elastic foot 2 Point contact is more reliable.

考虑到如果在屏蔽罩3顶部安装的是一些大电流驱动的电子组件4，例如闪光灯，那么需要采取电导率较高的金属作为金属弹脚2的材料，例如，铜，银，金等。同时考虑到制造成本，也可以选择较便宜的金属，如钢，作为金属弹脚2的材料，然后在表面进行镀铜等高电导率金属。而为了进一步地减小金属弹脚2与电子组件4触点之间接触位置的电阻，可以在金属弹脚2的中部与电子组件4上的触点相接触的位置的表面镀银。It is considered that if some high-current-driven electronic components 4 such as a flash lamp are mounted on the top of the shield case 3, it is necessary to use a metal having a higher conductivity as a material of the metal projectile 2, for example, copper, silver, gold, or the like. At the same time, considering the manufacturing cost, it is also possible to select a cheaper metal such as steel as the material of the metal foot 2, and then perform high-conductivity metal such as copper plating on the surface. To further reduce the resistance of the contact position between the metal foot 2 and the contact of the electronic component 4, silver may be plated on the surface of the metal spring 2 at a position where it contacts the contact on the electronic component 4.

此外，考虑电子组件4能够得到屏蔽罩3有效的支撑，可以将屏蔽罩3的长度设置为大于电子组件4的长度，同时屏蔽罩3的宽度大于电子组件4的宽度，当电子组件4设置在屏蔽罩3顶部时，电子组件4在屏蔽罩3顶部的投影位于屏蔽罩3顶部的内部。In addition, considering that the electronic component 4 can obtain effective support of the shield 3, the length of the shield 3 can be set larger than the length of the electronic component 4, while the width of the shield 3 is larger than the width of the electronic component 4, when the electronic component 4 is disposed at When the top of the shield 3 is shielded, the projection of the electronic component 4 on the top of the shield 3 is located inside the top of the shield 3.

本实施例中，在卡座顶部布置电子组件时，通过将电子组件上的触点和设置在屏蔽罩内的金属弹脚直接接触连接，从而实现电子组件与主板的导通，省去了柔性电路板和板对板连接器的走线结构，使得布置结构更加紧凑，同时也大大降低了成本。In this embodiment, when the electronic component is arranged on the top of the card holder, the contact between the electronic component and the main board is realized by directly connecting the contact on the electronic component and the metal elastic foot disposed in the shielding cover, thereby eliminating flexibility. The routing structure of the board and the board-to-board connector makes the arrangement more compact and also greatly reduces the cost.

在图1所示的实施例的基础上，图3是本发明根据另一示例性实施例示出的卡座结构的装配示意图，图4是图3所示卡座结构的卡座部分结构示意图。如图3-图4所示，本实施例提供的卡座结构，包括：卡座本体1、金属弹脚2、屏蔽罩3以及电子组件4，并且，在屏蔽罩3上设置有第一定位部，在电子组件上设置有第二定位部；当第一定位部和第二定位部满足预设的位置关系时，金属弹脚与电子组件上的触点相接触。FIG. 3 is a schematic view showing the assembly of the card holder structure according to another exemplary embodiment of the present invention, and FIG. 4 is a schematic structural view of the card holder portion of the card holder structure shown in FIG. As shown in FIG. 3 to FIG. 4, the card holder structure provided in this embodiment includes: a card holder body 1, a metal elastic foot 2, a shield cover 3, and an electronic component 4, and a first positioning is disposed on the shielding cover 3. The second positioning portion is disposed on the electronic component; when the first positioning portion and the second positioning portion satisfy the preset positional relationship, the metal elastic foot contacts the contact on the electronic component.

具体地，可以将卡座本体1和金属弹脚2进行分体设计，也可以将卡座本体1和金属弹脚2进行整体设计。对于分体设计方式，组装工艺上，先将卡座本体1通过PIN脚焊接在主板5上，具体焊接方式可以是手工焊接，也可以是通过贴片生产线上的波峰焊机或者回流焊机进行焊接，在完成卡座本体1的焊接之后，再将金属弹脚2焊接到主板5上，其中，金属弹脚2设置在卡座本体1的外侧。而对于整体设计方式，需要在保持原有的卡座本体1结构的基础上在其外侧增设金属弹脚2支撑部。组装工艺上，在对卡座本体1进行注塑的时候，采用嵌件注塑的方式，将金属弹脚2一体注塑到卡座本体1增设的支撑部上，其中，金属弹脚2设置在卡座本体1的外侧。然后通过手工焊接、波峰焊机或者回流焊机将一体成型有卡座本体1和金属弹脚2的卡座结构焊接到主板5上。值得说明地，金属弹脚2具体设置的位置和数量根据与其配合的电子组件4上的触点位置和数量确定。例如，对于闪光灯组件，则只需要两个触点就可以驱动，因此可以在卡座本体1垂直于插卡开口的两侧分别设置一个金属弹脚2用于从主板5上取电。Specifically, the card body 1 and the metal foot 2 may be separately designed, or the card body 1 and the metal foot 2 may be integrally designed. For the split design method and the assembly process, the card body 1 is first soldered to the main board 5 through the PIN pin. The specific soldering method may be manual soldering, or may be performed by a wave soldering machine or a reflow soldering machine on the patch production line. Welding, after the welding of the cartridge body 1 is completed, the metal elastic foot 2 is welded To the main board 5, wherein the metal elastic foot 2 is disposed outside the card body 1. For the overall design method, it is necessary to add a metal elastic foot 2 support portion on the outer side of the original card holder body 1 structure. In the assembly process, when the card body 1 is injection molded, the metal foot 2 is integrally molded into the support portion of the card body 1 by insert molding, wherein the metal foot 2 is disposed on the card seat The outside of the body 1. The card holder structure integrally formed with the card body 1 and the metal foot 2 is then soldered to the main board 5 by hand soldering, wave soldering or reflow soldering. It is worth noting that the position and number of the metal foot 2 are specifically determined according to the position and number of contacts on the electronic component 4 to which it is mated. For example, for the flash unit, only two contacts are required to be driven, so that a metal foot 2 can be respectively disposed on the sides of the deck body 1 perpendicular to the card opening for taking power from the main board 5.

其中，金属弹脚2伸出屏蔽罩3顶部的部分的长度可以根据电子组件4上的触点设计方式而确定。例如，如果电子组件4上的触点与其底面平面共面，则金属弹脚2伸出屏蔽罩3顶部的部分的长度不宜过大，而当电子组件4上的触点是采取凹陷方式设计时，则金属弹脚2伸出屏蔽罩3顶部的部分的长度还需根据触点凹陷的深度进行进一步地确定。本实施例中，并不对金属弹脚2伸出屏蔽罩3顶部的部分的长度以及电子组件4上的触点设置方式进行具体地限定，但是需要保证的是，在电子组件4装配到屏蔽罩3顶部时，金属弹脚2与电子组件4上的触点充分接触，且金属弹脚2处于一定的弹性变形状态，通过金属弹脚2的弹力使得金属弹脚2与电子组件4上的触点接触更加可靠。The length of the portion of the metal foot 2 that protrudes from the top of the shield 3 can be determined according to the manner in which the contacts on the electronic component 4 are designed. For example, if the contact on the electronic component 4 is coplanar with the plane of the bottom surface, the length of the portion of the metal projecting foot 2 that protrudes from the top of the shield 3 is not excessive, and when the contact on the electronic component 4 is designed to be recessed. The length of the portion of the metal foot 2 that protrudes from the top of the shield 3 is further determined according to the depth of the contact recess. In this embodiment, the length of the portion of the metal foot 2 that protrudes from the top of the shield 3 and the manner in which the contacts on the electronic component 4 are disposed are not specifically limited, but it is necessary to ensure that the electronic component 4 is assembled to the shield. 3 at the top, the metal elastic foot 2 is in full contact with the contact on the electronic component 4, and the metal elastic foot 2 is in a certain elastic deformation state, and the metal elastic foot 2 and the electronic component 4 are touched by the elastic force of the metal elastic foot 2 Point contact is more reliable.

考虑到在屏蔽罩3顶部安装的是一些大电流驱动的电子组件4，例如闪光灯，那么需要采取电导率较高的金属作为金属弹脚2的材料，例如，铜，银，金等。同时考虑到制造成本，也可以选择较便宜的金属，如钢作为金属弹脚2的材料，然后在表面进行镀铜的高电导率金属。而为了进一步地减小金属弹脚2与电子组件4触点之间接触位置的电阻，可以在金属弹脚2的中部与电子组件4上的触点相接触的位置的表面镀银。Considering that some of the high current driven electronic components 4, such as flashlights, are mounted on top of the shield 3, then It is necessary to use a metal having a high conductivity as a material of the metal foot 2, for example, copper, silver, gold, or the like. At the same time, considering the manufacturing cost, it is also possible to select a cheaper metal such as steel as the material of the metal foot 2 and then perform a copper-plated high-conductivity metal on the surface. To further reduce the resistance of the contact position between the metal foot 2 and the contact of the electronic component 4, silver may be plated on the surface of the metal spring 2 at a position where it contacts the contact on the electronic component 4.

考虑到在将电子组件4安装到屏蔽罩3上部的定位问题，屏蔽罩3上设置的第一定位部可以为至少一个第一定位孔32，电子组件4上设置的第二定位部为至少一个第二定位孔41，在将电子组件4装配到屏蔽罩3上时，先将第一定位孔32和第二定位孔41轴线对准，再通过背胶固定，当第一定位孔41的轴线与第二定位孔41的轴线相互重合时，金属弹脚2与电子组件4上的触点相接触。其中，第一定位孔32可以两个，分别设置在屏蔽罩3上部一边的两个角上，也可以是设置在屏蔽罩3上部的两个对角。电子组件4上设置的第二定位孔41上的设置方式根据屏蔽罩3上的第一定位孔32设置位置确定。本实施例中并不对第一定位孔32和第二定位孔41设置的位置以及数量作具体地限定。Considering the positioning problem of mounting the electronic component 4 to the upper portion of the shield 3, the first positioning portion provided on the shield cover 3 may be at least one first positioning hole 32, and the second positioning portion disposed on the electronic component 4 is at least one The second positioning hole 41, when the electronic component 4 is assembled to the shield 3, first aligns the first positioning hole 32 and the second positioning hole 41, and then fixes it by the adhesive, when the axis of the first positioning hole 41 When the axes of the second positioning holes 41 coincide with each other, the metal pins 2 are in contact with the contacts on the electronic component 4. The first positioning holes 32 may be disposed at two corners on one side of the upper portion of the shield cover 3, or may be two opposite corners disposed on the upper portion of the shield cover 3. The arrangement on the second positioning hole 41 provided on the electronic component 4 is determined according to the position of the first positioning hole 32 on the shield case 3. The position and number of the first positioning hole 32 and the second positioning hole 41 are not specifically limited in this embodiment.

可选地，屏蔽罩3上设置的第一定位部可以为至少一个定位脚，电子组件4上设置的第二定位部为至少一个定位槽，在将电子组件4装配到屏蔽罩3上时，先将定位脚插接到定位槽中，再通过背胶固定，此时，金属弹脚2与电子组件4上的触点相接触。其中，定位脚可以两个，分别设置在屏蔽罩3上部一边的两个角上，也可以是设置在屏蔽罩3上部的两个对角。电子组件4上设置的定位槽上的设置方式根据屏蔽罩3上的定位脚设置位置确定。本实施例中并不对定位脚和定位槽设置的位置以及数量作具体地限定。Optionally, the first positioning portion disposed on the shielding cover 3 may be at least one positioning leg, and the second positioning portion disposed on the electronic component 4 is at least one positioning slot. When the electronic component 4 is assembled to the shielding cover 3, The positioning pin is first inserted into the positioning groove, and then fixed by the adhesive tape. At this time, the metal elastic foot 2 is in contact with the contact on the electronic component 4. The positioning legs may be two, respectively disposed on two corners of the upper part of the shielding cover 3, or may be two diagonals disposed on the upper part of the shielding cover 3. The setting manner on the positioning groove provided on the electronic component 4 is determined according to the positioning position of the positioning pin on the shield case 3. The position and number of positioning legs and positioning slots are not specifically limited in this embodiment.

在图3所示的实施例的基础上，图5是本发明根据又一示例性实施例示出的卡座结构的装配示意图，图6是图5所示卡座结构的卡座部分结构示意图。如图5-图6所示，本实施例提供的卡座结构，包括：卡座本体1、金属弹脚2、屏蔽罩3以及电子组件4，在屏蔽罩3上设置有第一定位部，在电子组件上设置有第二定位部；当第一定位部和第二定位部满足预设的位置关系时，金属弹脚与电子组件上的触点相接触，并且在屏蔽罩3靠近金属弹脚2的侧壁上开设有散热孔33。On the basis of the embodiment shown in FIG. 3, FIG. 5 is a schematic view showing the assembly of the card holder structure according to still another exemplary embodiment of the present invention, and FIG. 6 is a schematic structural view of the card holder portion of the card holder structure shown in FIG. As shown in FIG. 5 to FIG. 6 , the card holder structure provided by the embodiment includes: a card holder body 1 , a metal elastic foot 2 , a shielding cover 3 , and an electronic component 4 . The shielding frame 3 is provided with a first positioning portion. Providing a second positioning portion on the electronic component; when the first positioning portion and the second positioning portion satisfy a preset positional relationship, the metal elastic foot contacts the contact on the electronic component, and the shielding cover 3 is close to the metal bullet A heat dissipation hole 33 is formed in the side wall of the foot 2.

具体地，可以将卡座本体1和金属弹脚2进行分体设计，也可以将卡座本体1和金属弹脚2进行整体设计。对于分体设计方式，组装工艺上，先将卡座本体1通过PIN脚焊接在主板5上，具体焊接方式可以是手工焊接，也可以是通过贴片生产线上的波峰焊机或者回流焊机进行焊接，在完成卡座本体1的焊接之后，再将金属弹脚2焊接到主板5上，其中，金属弹脚2设置在卡座本体1的外侧。而对于整体设计方式，需要在保持原有的卡座本体1结构的基础上在其外侧增设金属弹脚2支撑部。组装工艺上，在对卡座本体1进行注塑的时候，采用嵌件注塑的方式，将金属弹脚2一体注塑到卡座本体1增设的支撑部上，其中，金属弹脚2设置在卡座本体1的外侧。然后通过手工焊接、波峰焊机或者回流焊机将一体成型有卡座本体1和金属弹脚2的卡座结构焊接到主板5上。值得说明地，金属弹脚2具体设置的位置和数量根据与其配合的电子组件4上的触点位置和数量确定。例如，对于闪光灯组件，则只需要两个触点就可以驱动，因此可以在卡座本体1垂直于插卡开口的两侧分别设置一个金属弹脚2用于从主板5上取电。Specifically, the card body 1 and the metal foot 2 may be separately designed, or the card body 1 and the metal foot 2 may be integrally designed. For the split design method and assembly process, the card body 1 is first soldered to the main board 5 through the PIN pin, and the specific soldering method may be manual soldering or wave passing through the patch production line. The peak welder or the reflow soldering machine performs welding. After the welding of the cartridge body 1 is completed, the metal elastic foot 2 is welded to the main plate 5, wherein the metal elastic foot 2 is disposed outside the cartridge body 1. For the overall design method, it is necessary to add a metal elastic foot 2 support portion on the outer side of the original card holder body 1 structure. In the assembly process, when the card body 1 is injection molded, the metal foot 2 is integrally molded into the support portion of the card body 1 by insert molding, wherein the metal foot 2 is disposed on the card seat The outside of the body 1. The card holder structure integrally formed with the card body 1 and the metal foot 2 is then soldered to the main board 5 by hand soldering, wave soldering or reflow soldering. It is worth noting that the position and number of the metal foot 2 are specifically determined according to the position and number of contacts on the electronic component 4 to which it is mated. For example, for the flash unit, only two contacts are required to be driven, so that a metal foot 2 can be respectively disposed on the sides of the deck body 1 perpendicular to the card opening for taking power from the main board 5.

其中，金属弹脚2伸出屏蔽罩3顶部的部分的长度可以根据电子组件4上的触点设计方式而确定。例如，如果电子组件4上的触点与其底面平面共面，则金属弹脚2伸出屏蔽罩3顶部的部分的长度不宜过大，而当电子组件4上的触点是采取凹陷方式设计时，则金属弹脚2伸出屏蔽罩3顶部的部分的长度还需根据触点凹陷的深度进行进一步地确定。本实施例中，并不对金属弹脚2伸出屏蔽罩3顶部的部分的长度以及电子组件4上的触点设置方式进行具体地限定，但是需要保证的是，在电子组件4装配到屏蔽罩3顶部时，金属弹脚2与电子组件4上的触点充分接触，且金属弹脚2处于一定的弹性变形状态，通过金属弹脚2的弹力使得金属弹脚2与电子组件4上的触点接触更加可靠。 The length of the portion of the metal foot 2 that protrudes from the top of the shield 3 can be determined according to the manner in which the contacts on the electronic component 4 are designed. For example, if the contact on the electronic component 4 is coplanar with the plane of the bottom surface, the length of the portion of the metal projecting foot 2 that protrudes from the top of the shield 3 is not excessive, and when the contact on the electronic component 4 is designed to be recessed. The length of the portion of the metal foot 2 that protrudes from the top of the shield 3 is further determined according to the depth of the contact recess. In this embodiment, the length of the portion of the metal foot 2 that protrudes from the top of the shield 3 and the manner in which the contacts on the electronic component 4 are disposed are not specifically limited, but it is necessary to ensure that the electronic component 4 is assembled to the shield. 3 at the top, the metal elastic foot 2 is in full contact with the contact on the electronic component 4, and the metal elastic foot 2 is in a certain elastic deformation state, and the metal elastic foot 2 and the electronic component 4 are touched by the elastic force of the metal elastic foot 2 Point contact is more reliable.

考虑到在屏蔽罩3顶部安装的是一些大电流驱动的电子组件4，例如闪光灯，那么需要采取电导率较高的金属作为金属弹脚2的材料，例如，铜，银，金等。同时考虑到制造成本，也可以选择较便宜的金属，如钢作为金属弹脚2的材料，然后在表面进行镀铜的高电导率金属。而为了进一步地减小金属弹脚2与电子组件4触点之间接触位置的电阻，可以在金属弹脚2的中部与电子组件4上的触点相接触的位置的表面镀银。Considering that some of the high current-driven electronic components 4, such as flash lamps, are mounted on the top of the shield 3, it is necessary to use a metal having a higher conductivity as the material of the metal legs 2, for example, copper, silver, gold, or the like. At the same time, considering the manufacturing cost, it is also possible to select a cheaper metal such as steel as the material of the metal foot 2 and then perform a copper-plated high-conductivity metal on the surface. To further reduce the resistance of the contact position between the metal foot 2 and the contact of the electronic component 4, silver may be plated on the surface of the metal spring 2 at a position where it contacts the contact on the electronic component 4.

当屏蔽罩3顶部安装的是一些大电流驱动的电子组件4时，例如闪光灯，电子组件4在长期运行的过程中会产生大量的热量，为了进行有效地散热，可以在屏蔽罩3靠近金属弹脚2的侧壁上开设有散热孔33。可选地，对于大电流驱动的电子组件4，还可以在屏蔽罩3和电子组件4之间涂抹散热导热膏。When the top of the shield 3 is mounted with some high-current-driven electronic components 4, such as a flash lamp, the electronic component 4 generates a large amount of heat during long-term operation. In order to effectively dissipate heat, the shield 3 can be placed close to the metal bomb. A heat dissipation hole 33 is formed in the side wall of the foot 2. Alternatively, for the high current driven electronic component 4, a thermal conductive paste may also be applied between the shield 3 and the electronic component 4.

本发明提供的手机，包括上述卡座结构，该卡座结构在用于安装SIM卡或TF卡的同时，在其屏蔽罩的上部还可以架设一些电子组件。在卡座顶部布置电子组件时，通过将电子组件上的触点和设置在屏蔽罩内的金属弹脚直接接触连接，从而实现电子组件与主板的导通，省去了柔性电路板和板对板连接器的走线结构，使得布置结构更加紧凑，同时也大大降低了成本。The mobile phone provided by the invention comprises the above-mentioned card seat structure, and the card seat structure can also mount some electronic components on the upper part of the shielding cover while installing the SIM card or the TF card. When the electronic component is arranged on the top of the card seat, the contact between the electronic component and the main board is realized by directly contacting the contact on the electronic component with the metal elastic foot disposed in the shielding cover, thereby eliminating the flexible circuit board and the board pair. The wiring structure of the board connector makes the arrangement more Plus, it also greatly reduces the cost.

可选地，该手机还可以包括以下一个或多个组件：处理组件、存储器、电源组件、多媒体组件、音频组件、输入/输出(I/O)接口、传感器组件、以及通信组件。Optionally, the handset may also include one or more of the following components: a processing component, a memory, a power component, a multimedia component, an audio component, an input/output (I/O) interface, a sensor component, and a communication component.

处理组件通常控制手机的整体操作，诸如与显示、电话呼叫、数据通信、相机操作和记录操作相关联的操作。处理组件可以包括一个或多个处理器来执行指令，以完成上述的方法的全部或部分步骤。此外，处理组件可以包括一个或多个模块，便于处理组件和其他组件之间的交互。例如，处理组件可以包括多媒体模块，以方便多媒体组件和处理组件之间的交互。Processing components typically control the overall operation of the handset, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing component can include one or more processors to execute instructions to perform all or part of the steps of the methods described above. In addition, a processing component can include one or more modules to facilitate interaction between components and other components. For example, the processing component can include a multimedia module to facilitate interaction between the multimedia component and the processing component.

存储器被配置为存储各种类型的数据以支持在手机的操作。这些数据的示例包括用于在手机上操作的任何应用程序或方法的指令、联系人数据、电话簿数据、消息、图片、视频等。存储器可以由任何类型的易失性或非易失性存储设备或者它们的组合实现，如静态随机存取存储器(SRAM)、电可擦除可编程只读存储器(EEPROM)、可擦除可编程只读存储器(EPROM)、可编程只读存储器(PROM)、只读存储器(ROM)、磁存储器、快闪存储器、磁盘或光盘。The memory is configured to store various types of data to support operation on the handset. Examples of such data include instructions for any application or method operating on a handset, contact data, phone book data, messages, pictures, videos, and the like. The memory can be implemented by any type of volatile or non-volatile memory device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read only memory (EEPROM), erasable programmable Read Only Memory (EPROM), Programmable Read Only Memory (PROM), Read Only Memory (ROM), magnetic memory, flash memory, magnetic or optical disk.

电源组件为手机的各种组件提供电力。电源组件可以包括电源管理***，一个或多个电源，及其他与为手机生成、管理和分配电力相关联的组件。The power components provide power to the various components of the handset. The power components can include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for the handset.

多媒体组件包括在所述手机和用户之间的提供一个输出接口的屏幕。在一些实施例中，屏幕可以包括液晶显示器(LCD)和触摸面板(TP)。如果屏幕包括触摸面板，屏幕可以被实现为触摸屏，以接收来自用户的输入信号。触摸面板包括一个或多个触摸传感器以感测触摸、滑动和触摸面板上的手势。所述触摸传感器可以不仅感测触摸或滑动动作的边界，而且还检测与所述触摸或滑动操作相关的持续时间和压力。在一些实施例中，多媒体组件包括前置摄像头和/或后置摄像头。当手机处于操作模式，如拍摄模式或视频模式时，前置摄像头和/或后置摄像头可以接收外部的多媒体数据。每个前置摄像头和后置摄像头可以是一个固定的光学透镜***或具有焦距和光学变焦能力。The multimedia component includes a screen between the handset and the user that provides an output interface. In some embodiments, the screen can include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen can be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, slides, and gestures on the touch panel. The touch sensor may sense not only the boundary of the touch or sliding action, but also the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component includes a front camera and/or a rear camera. The front camera and/or rear camera can receive external multimedia data when the phone is in an operating mode, such as shooting mode or video mode. Each front and rear camera can be a fixed optical lens system or have focal length and optical zoom capabilities.

音频组件被配置为输出和/或输入音频信号。例如，音频组件包括一个麦克风(MIC)，当手机处于操作模式，如呼叫模式、记录模式和语音识别模式时，麦克风被配置为接收外部音频信号。所接收的音频信号可以被进一步存储在存储器或经由通信组件发送。在一些实施例中，音频组件还包括一个扬声器，用于输出音频信号。The audio component is configured to output and/or input an audio signal. For example, the audio component includes a microphone (MIC) that is configured to receive an external audio signal when the handset is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in a memory or transmitted via a communication component. In some embodiments, the audio component further includes a speaker for outputting an audio signal.

I/O接口为处理组件和***接口模块之间提供接口，上述***接口模块可以是键盘，点击轮，按钮等。这些按钮可包括但不限于：主页按钮、音量按钮、启动按钮和锁定按钮。 The I/O interface provides an interface between the processing component and the peripheral interface module, and the peripheral interface module may be a keyboard, a click wheel, a button, or the like. These buttons may include, but are not limited to, a home button, a volume button, a start button, and a lock button.

传感器组件包括一个或多个传感器，用于为手机提供各个方面的状态评估。例如，传感器组件可以检测到手机的打开/关闭状态，组件的相对定位，例如所述组件为手机的显示器和小键盘，传感器组件还可以检测手机或手机一个组件的位置改变，用户与手机接触的存在或不存在，手机方位或加速/减速和手机的温度变化。传感器组件可以包括接近传感器，被配置用来在没有任何的物理接触时检测附近物体的存在。传感器组件还可以包括光传感器，如CMOS或CCD图像传感器，用于在成像应用中使用。在一些实施例中，该传感器组件还可以包括加速度传感器，陀螺仪传感器，磁传感器，压力传感器或温度传感器。The sensor assembly includes one or more sensors for providing a status assessment of the various aspects of the handset. For example, the sensor assembly can detect the on/off state of the mobile phone, the relative positioning of the components, for example, the component is a display and a keypad of the mobile phone, and the sensor component can also detect a change in the position of a component of the mobile phone or the mobile phone, and the user is in contact with the mobile phone. The presence or absence of the phone's orientation or acceleration/deceleration and the temperature of the phone. The sensor assembly can include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly can also include an acceleration sensor, a gyro sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

通信组件被配置为便于手机和其他设备之间有线或无线方式的通信。手机可以接入基于通信标准的无线网络，如WiFi、2G或3G、或它们的组合。在一个示例性实施例中，通信组件经由广播信道接收来自外部广播管理***的广播信号或广播相关信息。在一个示例性实施例中，所述通信组件还包括近场通信(NFC)模块，以促进短程通信。例如，在NFC模块可基于射频识别(RFID)技术、红外数据协会(IrDA)技术，超宽带(UWB)技术、蓝牙(BT)技术和其他技术来实现。The communication component is configured to facilitate wired or wireless communication between the handset and other devices. The handset can access a wireless network based on communication standards such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component receives a broadcast signal or broadcast associated information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component further includes a near field communication (NFC) module to facilitate short range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include one or more of the features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

在本发明的描述中，需要理解的是，术语“中心”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“轴向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "back", "left", " The orientation or positional relationship of the indications of right, vertical, horizontal, top, bottom, axial, and circumferential is based on the drawing The orientation or the positional relationship is merely for the purpose of describing the present invention and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, is constructed and operated in a specific orientation, and therefore is not to be construed as limiting the invention. . Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include one or more of the features either explicitly or implicitly.

在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应当做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或者是一体地连接；可以是机械连接，也可以是电连接；还可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" should be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connections, or integral connections; may be mechanical connections or electrical connections; they may be directly connected or indirectly connected via an intermediate medium, which may be internal to the two components. The specific meaning of the above terms in the present invention can be understood in a specific case by those skilled in the art. Unless otherwise expressly stated and limited, The first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include that the first and second features are not in direct contact but are contacted by additional features between them. . Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.

最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。 Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that The technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or substitutions do not deviate from the technical solutions of the embodiments of the present invention. range.

Claims

一种卡座结构，其特征在于，包括：卡座本体、金属弹脚、屏蔽罩以及电子组件；A card holder structure, comprising: a card holder body, a metal elastic foot, a shielding cover and an electronic component;

所述卡座本体和所述金属弹脚均设置在主板上，其中，所述金属弹脚设置在所述卡座本体的外侧；The card body and the metal elastic foot are disposed on the main board, wherein the metal elastic foot is disposed outside the card body;

所述屏蔽罩底部设置在所述主板上，所述屏蔽罩与所述主板之间形成屏蔽腔，其中，所述卡座本体和所述金属弹脚均位于所述屏蔽腔内；The bottom of the shielding cover is disposed on the main board, and a shielding cavity is formed between the shielding cover and the main board, wherein the card holder body and the metal elastic foot are located in the shielding cavity;

所述屏蔽罩的顶部开设有弹脚伸出孔，当所述金属弹脚处于自由状态时，所述金属弹脚通过所述弹脚伸出孔伸出所述屏蔽罩的顶部；The top of the shielding cover is provided with a projecting foot extending hole, and when the metal elastic leg is in a free state, the metal elastic foot protrudes from the top of the shielding cover through the protruding foot extending hole;

当所述电子组件设置在所述屏蔽罩顶部时，所述金属弹脚与所述电子组件上的触点相接触。The metal foot contacts the contacts on the electronic component when the electronic component is disposed on top of the shield.
根据权利要求1所述的卡座结构，其特征在于，所述屏蔽罩上设置有第一定位部，所述电子组件上设置有第二定位部；The card holder structure according to claim 1, wherein the shield cover is provided with a first positioning portion, and the electronic component is provided with a second positioning portion;

当所述第一定位部和所述第二定位部满足预设的位置关系时，所述金属弹脚与所述电子组件上的触点相接触。When the first positioning portion and the second positioning portion satisfy a preset positional relationship, the metal elastic foot contacts the contact on the electronic component.
根据权利要求2所述的卡座结构，其特征在于，所述屏蔽罩上设置的第一定位部为至少一个第一定位孔，所述电子组件上设置的第二定位部为至少一个第二定位孔；The card holder structure according to claim 2, wherein the first positioning portion disposed on the shielding cover is at least one first positioning hole, and the second positioning portion disposed on the electronic component is at least one second Positioning hole

当所述第一定位孔的轴线与所述第二定位孔的轴线相互重合时，所述金属弹脚与所述电子组件上的触点相接触。When the axis of the first positioning hole and the axis of the second positioning hole coincide with each other, the metal foot contacts the contact on the electronic component.
根据权利要求2所述的卡座结构，其特征在于，所述屏蔽罩上设置的第一定位部为至少一个定位脚，所述电子组件上设置的第二定位部为至少一个定位槽；The card holder structure according to claim 2, wherein the first positioning portion disposed on the shielding cover is at least one positioning leg, and the second positioning portion disposed on the electronic component is at least one positioning groove;

当所述定位脚卡设在所述定位槽内时，所述金属弹脚与所述电子组件上的触点相接触。When the positioning pin is disposed in the positioning groove, the metal elastic foot contacts the contact on the electronic component.
根据权利要求1-4中任一项所述的卡座结构，其特征在于，所述金属弹脚的两端设置在所述主板上，所述金属弹脚的中部通过所述弹脚伸出孔伸出所述屏蔽罩的顶部。The card holder structure according to any one of claims 1 to 4, wherein both ends of the metal elastic foot are disposed on the main board, and a middle portion of the metal elastic foot protrudes through the elastic foot A hole extends from the top of the shield.
根据权利要求5所述的卡座结构，其特征在于，所述金属弹脚的材料为铜。The card holder structure according to claim 5, wherein the metal foot is made of copper.
根据权利要求6所述的卡座结构，其特征在于，所述金属弹脚的中部与所述电子组件上的触点相接触的位置的表面镀银。The card holder structure according to claim 6, wherein a surface at a position where the middle portion of the metal projectile contacts the contact on the electronic component is silver plated.
根据权利要求5所述的卡座结构，其特征在于，所述屏蔽罩的长度大于所述电子组件的长度，所述屏蔽罩的宽度大于所述电子组件的宽度，当所述电子组件设置在所述屏蔽罩顶部时，所述电子组件在所述屏蔽罩顶部的投影位于所述屏蔽罩顶部的内部。The card holder structure according to claim 5, wherein the length of the shield is greater than the electric a length of the subassembly, the width of the shield is greater than a width of the electronic component, and when the electronic component is disposed at the top of the shield, a projection of the electronic component at the top of the shield is located in the shield The inside of the top.
根据权利要求6-8中任一项所述的卡座结构，其特征在于，所述屏蔽罩靠近所述金属弹脚的侧壁上开设有散热孔。The card holder structure according to any one of claims 6 to 8, wherein the shielding cover is provided with a heat dissipation hole on a side wall of the metal elastic.
一种手机，其特征在于，所述手机包括如权利要求1-9任一项所述的卡座结构。 A mobile phone, characterized in that the mobile phone comprises the card holder structure according to any one of claims 1-9.