WO2019041503A1

WO2019041503A1 - Temperature monitoring system

Info

Publication number: WO2019041503A1
Application number: PCT/CN2017/108106
Authority: WO
Inventors: 杨鹏; 伍丹
Original assignee: 深圳市艾廷思技术有限公司
Priority date: 2017-08-31
Filing date: 2017-10-27
Publication date: 2019-03-07
Also published as: CN107659616A

Abstract

A temperature monitoring system (100), comprising: an energy storage device (110), comprising a housing (112) and at least one energy storage unit (111) provided in the housing (112); acquisition units (130), provided in the energy storage device (110), to acquire temperatures of the energy storage units (111); a monitoring processing device (120), comprising an information processing module (121), and a conversion module (122), a storage module (124), and a communication module (123) that are connected to the information processing module (121), the information processing module (121) being connected to the acquisition units (130); and a communication device (140) connected to the communication module (123). The temperature monitoring system (100) acquires temperature information of the energy storage device (110) by means of the acquisition units (130) to form three-dimensional temperature monitoring on an internal space field of the energy storage device (110), and processes the temperature information to form a temperature field model; the monitoring processing device (120) can estimate a temperature variation of each point in the space, and monitoring on the working environment of the energy storage device (110) and fault estimation are convenient and accurate; a user can view the temperature information of each position of the energy storage device (110) by accessing the monitoring processing device (120) by means of the communication device (140), so that the operation is simple and convenient.

Description

温度监测*** Temperature monitoring system

技术领域 Technical field

[0001] 本发明涉及采样电路技术领域，具体涉及一种温度监测***。 [0001] The present invention relates to the field of sampling circuits, and in particular, to a temperature monitoring system.

背景技术 Background technique

[0002] 超级电容是目前应用比较广泛的储能设备，超级电容具有电阻小、寿命超长、充电快速、安全可靠的特点，倍受社会各界关注。超级电容使用环境都比较恶劣，不同超级电容之间具有一定差异性，在充放电过程中，某一节超级电容会先于其他超级电容达到过充、过放或者过温。 [0002] Supercapacitor is a widely used energy storage device. The supercapacitor has the characteristics of small resistance, long life, fast charging, safe and reliable, and has received much attention from all walks of life. The environment of supercapacitors is relatively bad. There are certain differences between different supercapacitors. During the charging and discharging process, a certain supercapacitor will overcharge, over discharge or over temperature before other supercapacitors.

[0003] 因此，在实际应用吋都会给超级电容模组加装一个超级电容管理***，通过超级电容管理***监控超级电容模组状态，并采取一些均衡电压、温度控制的措施，以及通过控制充电控制器或者放电控制器来控制充电和放电，防止超级电容模组的过充和过放、过温，延长超级电容的使用寿命。但是，目前的超级电容管理***对超级电容的监测不准确，无法精准的对超级电容模组的工作状态技术问题 [0003] Therefore, in practical applications, a supercapacitor management system is added to the supercapacitor module, and the supercapacitor management system monitors the state of the supercapacitor module, and adopts some measures of equalizing voltage and temperature control, and charging by control. The controller or the discharge controller controls the charging and discharging to prevent overcharging and over-discharging and over-temperature of the super capacitor module, and prolonging the service life of the super capacitor. However, the current supercapacitor management system does not accurately monitor the supercapacitor, and cannot accurately determine the working state of the supercapacitor module.

[0004] 有鉴于此，有必要提供一种监测精准、低功耗且成本低的温度监测***。 [0004] In view of this, it is necessary to provide a temperature monitoring system that monitors accuracy, low power consumption, and low cost.

问题的解决方案 Problem solution

技术解决方案 Technical solution

[0005] 一种温度监测***，包括： [0005] A temperature monitoring system, comprising:

[0006] 储能设备，包括壳体和设于壳体内的至少一储能单元； An energy storage device includes a housing and at least one energy storage unit disposed in the housing;

[0007] 采集单元，对应于各储能单元设于所述储能设备，以采集各储能单元的温度； [0008] 监控处理装置，包括信息处理模块和连接至信息处理模块的转换模块、存储模块、通信模块，所述信息处理模块连接至所述采集单元；以及 [0007] an acquisition unit, corresponding to each energy storage unit is disposed in the energy storage device to collect the temperature of each energy storage unit; [0008] a monitoring processing device, including an information processing module and a conversion module connected to the information processing module, a storage module, a communication module, the information processing module is connected to the collection unit;

[0009] 通信设备，连接至所述通信模块； a communication device connected to the communication module;

[0010] 当所述储能单元工作发热吋，所述壳体吸热升温，所述采集单元采集所述各储能单元的温度并将采集的温度信息传送至所述转换模块，所述转换模块用于对所述温度信息进行转换处理后传输至所述信息处理模块，所述信息处理模块对所述温度信息进行处理后存储至所述存储模块，并通过所述通信模块传输至所述通信设备。 [0010] when the energy storage unit works hot, the housing absorbs heat, the collecting unit collects the temperature of each energy storage unit and transmits the collected temperature information to the conversion module, the conversion Module for pair The temperature information is converted to the information processing module, and the information processing module processes the temperature information and stores the temperature information to the storage module, and transmits the data to the communication device through the communication module.

[0011] 进一步地，多个所述采集单元均布于所述壳体，以采集所述壳体对应各储能单元的多个位置的模拟温度信息，并将所述模拟温度信息传输至所述转换模块。 [0011] Further, a plurality of the collection units are uniformly disposed on the casing to collect simulated temperature information corresponding to the plurality of positions of the energy storage units of the casing, and transmit the simulated temperature information to the The conversion module.

[0012] 进一步地，所述转换模块为模数转换模块，当所述模拟温度信息被传输至所述转换模块后，所述转换模块将所述模拟温度信息转换为数字温度信息，并将所述数字温度信息传输至所述信息处理模块。 [0012] Further, the conversion module is an analog-to-digital conversion module, and after the analog temperature information is transmitted to the conversion module, the conversion module converts the analog temperature information into digital temperature information, and The digital temperature information is transmitted to the information processing module.

[0013] 进一步地，所述处理模块将所述数字温度信息处理成三维温度场模型，并将所述三维温度场模型保存至所述存储模块。 [0013] Further, the processing module processes the digital temperature information into a three-dimensional temperature field model, and saves the three-dimensional temperature field model to the storage module.

[0014] 进一步地，当所述通信设备向所述监控处理装置发生请求信号吋，所述通信模块接受所述请求信息并传输至所述处理模块，所述处理模块根据所述请求信息将所述三维温度场模型通过所述通信模块发送至所述通信设备。 [0014] Further, when the communication device generates a request signal to the monitoring processing device, the communication module accepts the request information and transmits the request information to the processing module, and the processing module sends the request information according to the request information. The three-dimensional temperature field model is transmitted to the communication device via the communication module.

[0015] 进一步地，所述储能单元为超级电容。 [0015] Further, the energy storage unit is a super capacitor.

[0016] 进一步地，所述探测单元为温度传感器。 [0016] Further, the detecting unit is a temperature sensor.

[0017] 进一步地，所述通信模块包括用于进行有线通信的有线通信模块和用于进行无线通信的无线通信模块，所述有线通信模块和所述无线通信模块分别连接至所述信息处理模块，所述监控处理装置通过所述有线通信模块或所无线通信模块与所述通信设备进行通信。 [0017] Further, the communication module includes a wired communication module for performing wired communication and a wireless communication module for performing wireless communication, and the wired communication module and the wireless communication module are respectively connected to the information processing module And the monitoring processing device communicates with the communication device through the wired communication module or the wireless communication module.

[0018] 进一步地，所述无线通信模块为蓝牙模块、 WIFI模块中的一种。 [0018] Further, the wireless communication module is one of a Bluetooth module and a WIFI module.

[0019] 进一步地，所述通信设备包括手机和电脑，其安装有应用软件，所述通信设备通过所述应用软件处理并显示所述温度信息。 [0019] Further, the communication device includes a mobile phone and a computer, which are installed with application software, and the communication device processes and displays the temperature information by using the application software.

发明的有益效果 Advantageous effects of the invention

有益效果 Beneficial effect

[0020] 上述温度监测***通过采集单元采集储能设备的温度信息，来对储能设备的内部空间场形成三维立体温度监测，并处理形成一个可供用户査看的温度场模型，监控处理装置可模拟估算出壳体内部空间每一点的温度变化，对储能设备的工作环境监测和故障评估方便精准；用户通过通信设备，比如手机，访问监控处理装置即可査看储能设备各个位置的温度信息，无需额外增加终端设备，简单方便，成本低，可远距离管理；上述温度监测***除了可用于超级电容模组箱体外，还可用于一般的电池模组箱体，适用性广。 [0020] The temperature monitoring system collects temperature information of the energy storage device through the collecting unit, and forms a three-dimensional temperature monitoring on the internal space field of the energy storage device, and processes and forms a temperature field model for the user to view, and the monitoring processing device It can simulate and estimate the temperature change at every point in the internal space of the housing, and it is convenient and accurate for the monitoring and fault assessment of the working environment of the energy storage device; the user accesses the monitoring through the communication device, such as the mobile phone. The processing device can view the temperature information of each position of the energy storage device without additional terminal equipment, which is simple and convenient, low in cost, and can be remotely managed; the above temperature monitoring system can be used not only in the outer body of the super capacitor module but also The general battery module cabinet has wide applicability.

对附图的简要说明 Brief description of the drawing

附图说明 DRAWINGS

[0021] 图 1是本发明实施例的温度监测***的结构框图。 1 is a block diagram showing the structure of a temperature monitoring system according to an embodiment of the present invention.

[0022] 图 2是本发明实施例的温度监测***的信息处理模块和无线通信模块的连接电路图。 2 is a connection circuit diagram of an information processing module and a wireless communication module of a temperature monitoring system according to an embodiment of the present invention.

[0023] 图 3是本发明实施例的转换模块的电路图。 3 is a circuit diagram of a conversion module according to an embodiment of the present invention.

[0024] 图 4是本发明实施例的存储模块的电路图。 4 is a circuit diagram of a memory module in accordance with an embodiment of the present invention.

[0025] 图 5是本发明实施例的采集单元的电路图。 5 is a circuit diagram of an acquisition unit according to an embodiment of the present invention.

本发明的实施方式 Embodiments of the invention

[0026] 以下将结合具体实施例和附图对本发明进行详细说明。 The present invention will be described in detail below with reference to specific embodiments and drawings.

[0027] 请参阅图 1，示出本发明实施例的一种温度监测*** 100，包括储能设备 100、监控处理装置 120、采集单元 130和通信设备 140，储能设备 110包括壳体 112和设于壳体 112内多个串联在一起的储能单元 111，监控处理装置 120包括信息处理模块 121和分别连接至信息处理模块 121的转换模块 122、存储模块 124、通信模块 1 23，采集单元 130设于壳体 112并电连接至转换模块 122; 通信模块 123包括分别连接至信息处理模块 121的有线通信模块 1231和无线通信模块 1232，通信设备 14 0与有线通信模块 1231或无线通信模块 1232建立通信连接，以与监控处理装置 12 0进行数据交换。 Referring to FIG. 1, a temperature monitoring system 100 according to an embodiment of the present invention includes an energy storage device 100, a monitoring processing device 120, an acquisition unit 130, and a communication device 140. The energy storage device 110 includes a housing 112 and A plurality of energy storage units 111 are disposed in the housing 112. The monitoring processing device 120 includes an information processing module 121 and a conversion module 122, a storage module 124, and a communication module 123 respectively connected to the information processing module 121. 130 is disposed in the housing 112 and electrically connected to the conversion module 122; the communication module 123 includes a wired communication module 1231 and a wireless communication module 1232 respectively connected to the information processing module 121, and the communication device 140 and the wired communication module 1231 or the wireless communication module 1232 A communication connection is established to exchange data with the monitoring processing device 120.

[0028] 在本实施例中，优选的，储能单元 111为超级电容，壳体 112内设有多个储能单元 111，多个采集单元 130均布于壳体 112表面，对应于各储能单元 111的位置，可以是一对多，即一个储能单元 111周边均匀布置有多个采集单元 130，通过均匀分布更多的采集点，得到更加准确更广的温度数据分布；无线通信模块 1232为蓝牙模块，通信设备 140为手机，通信设备 140通过无线通信模块 1232与监控处理装置 120建立无线通信连接。在其他实施方式中，通信设备 140可为电脑，有线通信模块 123可设有通信接口，通信设备 140通过线缆连接至通信接口，以与监控处理装置 120建立有线通信连接。 [0028] In this embodiment, preferably, the energy storage unit 111 is a super capacitor, and a plurality of energy storage units 111 are disposed in the housing 112. The plurality of collection units 130 are uniformly disposed on the surface of the housing 112, corresponding to each storage. The position of the energy unit 111 may be one-to-many, that is, a plurality of collection units 130 are evenly arranged around one energy storage unit 111, and more accurate and wider temperature data distribution is obtained by uniformly distributing more collection points; 1232 is a Bluetooth module, communication device 140 is a mobile phone, and communication device 140 establishes a wireless communication connection with monitoring processing device 120 through wireless communication module 1232. In other embodiments, the communication device 140 can be a computer, The line communication module 123 can be provided with a communication interface, and the communication device 140 is connected to the communication interface by a cable to establish a wired communication connection with the monitoring processing device 120.

[0029] 图 2为信息处理模块 121与无线通信模块 1232的连接电路图，图中，信息处理模块 121包括处理芯片 Ul、电容 Cl、 C2、 C4、 C6、 C10、 Cl l、 C12、电阻 Rl、 R5 、晶振 Yl、 Y2和幵关 Sl，具体的，电容 CI一端接地，另一端连接处理芯片的引脚 33; C2的一端接地，另一端连接至引脚 32，晶振 Y1的两端连接处理芯片的引脚 32和 33; 电阻 R1—端接地，另一端连接处理芯片的引脚 38，幵关 S1的一端同吋连接至电阻 R1和处理芯片的引脚 38，另一端连接电源；电容 C4的一端接地，另一端连接处理芯片 U1的引脚 40; 电容 C6的一端接地，另一端连接处理芯片的引脚 10; 电容 C10—端接地，另一端连接处理芯片 U1的引脚 20; 电容 C11一端接地，另一端连接处理芯片 U1的引脚 22，电容 C12—端接地，另一端连接处理芯片 U1的引脚 23，晶振 Y2的一端接地且连接处理芯片 U1的引脚 22，另一端接地和连接处理芯片 U1的引脚 23; 电阻 R5—端接地，另一端连接处理芯片 U1的引脚 30。 2 is a connection circuit diagram of the information processing module 121 and the wireless communication module 1232. In the figure, the information processing module 121 includes a processing chip U1, capacitors C1, C2, C4, C6, C10, Cl1, C12, a resistor R1, R5, crystal oscillator Yl, Y2 and SSl, specifically, one end of the capacitor CI is grounded, and the other end is connected to the pin 33 of the processing chip; one end of C2 is grounded, the other end is connected to pin 32, and the two ends of the crystal oscillator Y1 are connected to the processing chip Pins 32 and 33; resistor R1 - terminal grounded, the other end is connected to the pin 38 of the processing chip, one end of the switch S1 is connected to the resistor R1 and the pin 38 of the processing chip, and the other end is connected to the power supply; the capacitor C4 One end is grounded, and the other end is connected to the pin 40 of the processing chip U1; one end of the capacitor C6 is grounded, and the other end is connected to the pin 10 of the processing chip; the capacitor C10 is grounded, the other end is connected to the pin 20 of the processing chip U1; the end of the capacitor C11 Grounding, the other end is connected to the pin 22 of the processing chip U1, the capacitor C12 is grounded, the other end is connected to the pin 23 of the processing chip U1, one end of the crystal oscillator Y2 is grounded and connected U1 pin plate 22, and the other end connected to pin 23 of U1 chip bonding process; R5- resistor is grounded, and the other end connected to pin 30 of chip U1.

[0030] 无线通信模块 1232包括通信芯片 U2、电阻 R8、电容 C7、 C8和天线 El，通信芯片 U2的引脚 4、 3分别连接至信息处理模块 121的处理芯片 U1的引脚 25、 26，电容 C7—端接地，另一端连接通信芯片 U2的引脚 1，电阻 R的两端分别连接电容 C7、 C8，电容 C8未与电阻 R8连接的一端接地，天线 E1连接电阻 R8和电容 C8。 [0030] The wireless communication module 1232 includes a communication chip U2, a resistor R8, capacitors C7, C8, and an antenna El. The pins 4, 3 of the communication chip U2 are respectively connected to the pins 25, 26 of the processing chip U1 of the information processing module 121, The capacitor C7 is grounded, the other end is connected to the pin 1 of the communication chip U2, the two ends of the resistor R are respectively connected to the capacitors C7 and C8, the end of the capacitor C8 not connected to the resistor R8 is grounded, and the antenna E1 is connected to the resistor R8 and the capacitor C8.

[0031] 图 3为转换模块 122的电路图，图中，转换模块 122包括转换芯片 U3、电阻 R6、 R7和电容 C5，电阻 R6的一端接电源，另一端连接转换芯片 U3的引脚 10; 电阻 R7 的一端接电源，另一端连接转换芯片 U3的引脚 9; 电容 C5的一端接地，另一端连接转换芯片 U3的引脚 8。请一并参照图 2，处理芯片 U1的引脚 2、 3分别连接转换芯片 U3的引脚 10、 9。 3 is a circuit diagram of the conversion module 122, wherein the conversion module 122 includes a conversion chip U3, resistors R6, R7 and a capacitor C5, one end of the resistor R6 is connected to the power supply, and the other end is connected to the pin 10 of the conversion chip U3; One end of R7 is connected to the power supply, and the other end is connected to pin 9 of the conversion chip U3; one end of the capacitor C5 is grounded, and the other end is connected to the pin 8 of the conversion chip U3. Please refer to FIG. 2 together, and the pins 2 and 3 of the processing chip U1 are respectively connected to the pins 10 and 9 of the conversion chip U3.

[0032] 图 4为存储模块 124的电路图，图中，存储模块 124包括存储芯片 U4、电阻 R2、 R3、 R4和电容 C2，电阻 R2、 R3、 R4的一端相互连接并连接至电源，另一端分别连接存储芯片 U4的引脚 7、 6、 5，电容 C2的一端接地，另一端与存储芯片 U4 的引脚 8—同连接电源。请一并参照图 2，处理芯片 U1的引脚 2、 3、 6分别连接至存储芯片 U4的引脚 6、 5、 7。 4 is a circuit diagram of the memory module 124. In the figure, the memory module 124 includes a memory chip U4, resistors R2, R3, and R4, and a capacitor C2. One ends of the resistors R2, R3, and R4 are connected to each other and connected to a power source, and the other end is connected to the power source. Connect the pins 7, 6, and 5 of the memory chip U4 respectively. One end of the capacitor C2 is grounded, and the other end is connected to the pin 8 of the memory chip U4. Referring to FIG. 2 together, the pins 2, 3, and 6 of the processing chip U1 are respectively connected to the pins 6, 5, and 7 of the memory chip U4.

[0033] 图 5为采集单元 130的电路图，图中，采集单元 130包括采集芯片 U5、电阻 R10 、电容 C13和 17，电阻 R10—端连接采集芯片 U5的引脚 2，另一端连接电容 C17，电容 C17接地；电容 C13的一端接地，另一端连接采集芯片 U5的引脚 4和电源。请一并参照图 2和图 3，转换芯片 U3的引脚 4连接至采集单元 130的电阻 R10和电容 C17。处理芯片 U1的引脚 19连接采集芯片 U5的引脚 3，使处理芯片 U1可对采集芯片 U5的灵敏度、电压、电流等参数进行设置与控制。 [0033] FIG. 5 is a circuit diagram of the acquisition unit 130. In the figure, the acquisition unit 130 includes an acquisition chip U5 and a resistor R10. Capacitor C13 and 17, resistor R10 is connected to pin 2 of acquisition chip U5, the other end is connected to capacitor C17, capacitor C17 is grounded; one end of capacitor C13 is grounded, and the other end is connected to pin 4 of the acquisition chip U5 and the power supply. Referring to FIG. 2 and FIG. 3 together, the pin 4 of the conversion chip U3 is connected to the resistor R10 and the capacitor C17 of the acquisition unit 130. The pin 19 of the processing chip U1 is connected to the pin 3 of the acquisition chip U5, so that the processing chip U1 can set and control the parameters of the sensitivity, voltage, current and the like of the acquisition chip U5.

[0034] 请一并参照图 1至图 5，以下结合附图对温度监控*** 100的工作过程进行说明 [0034] Please refer to FIG. 1 to FIG. 5 together, and the working process of the temperature monitoring system 100 will be described below with reference to the accompanying drawings.

[0035] 当储能设备 110幵始为其他电子设备进行供电吋，储能单元 111工作发热，壳体 112吸收储能单元 111散发的热量而升温，均匀分布于壳体 112外侧的多个采集单元 130采集壳体 112各个位置的模拟温度信息，然后采集单元 130的采集芯片 U5将上述模拟温度信息传输至转换芯片 U3的引脚 4 (ANI引脚）；转换芯片 U3将上述模拟温度信息转换成数字温度信息并通过引脚 9和 10 (引脚 SDA和 SCL) 传输至处理芯片 U1的引脚 3和 2 (引脚 SDA和 SCL) ；处理芯片 U1对上述数字信号进行处理后通过引脚 3和 2 (引脚 SDA和 SCL) 传输至存储芯片 U4的引脚 5和 6 (引脚 S DA和 SCL) ，以将壳体 112的各个位置的数字温度信息存储起来。 [0035] When the energy storage device 110 starts to supply power to other electronic devices, the energy storage unit 111 works to generate heat, and the casing 112 absorbs heat generated by the energy storage unit 111 to heat up, and is uniformly distributed on the outside of the casing 112. The unit 130 collects the simulated temperature information of each position of the housing 112, and then the acquisition chip U5 of the acquisition unit 130 transmits the above analog temperature information to the pin 4 (ANI pin) of the conversion chip U3; the conversion chip U3 converts the above analog temperature information Digital temperature information is transmitted to pins 3 and 2 (pins SDA and SCL) of processing chip U1 via pins 9 and 10 (pins SDA and SCL); processing chip U1 processes the digital signal and passes through the pin 3 and 2 (pins SDA and SCL) are transferred to pins 5 and 6 (pins S DA and SCL) of memory chip U4 to store digital temperature information for various locations of housing 112.

[0036] 当用户需要査看储能设备 110的温度信息吋，用户通过操作通信设备 140上的应用软件来向监控处理装置 120发生请求査看命令，监控处理装置 120的通信芯片 U 2通过天线 E1接收上述请求査看指令并传送至处理芯片 U1，处理芯片 U1调用存储在存储芯片 U4上的壳体 112各个位置的数字温度信息并通过通信芯片 U2及天线 E1发送至通信设备 140，通信设备 140上的应用软件将壳体 112各个位置的数字温度信息处理成三维温度场模型后显示在通信设备 140的显示屏上，用户査看显示屏上三维温度场模型即可获知储能设备 110壳体 112的各个位置的温度，简单直观，操作方便。 [0036] When the user needs to view the temperature information of the energy storage device 110, the user requests a viewing command to the monitoring processing device 120 by operating the application software on the communication device 140, and the communication chip U2 of the monitoring processing device 120 passes through the antenna. E1 receives the above request viewing command and transmits it to the processing chip U1, and the processing chip U1 calls the digital temperature information of each position of the housing 112 stored on the memory chip U4 and transmits it to the communication device 140 through the communication chip U2 and the antenna E1, the communication device The application software on the 140 processes the digital temperature information of each position of the housing 112 into a three-dimensional temperature field model and displays it on the display screen of the communication device 140. The user can view the three-dimensional temperature field model on the display screen to obtain the energy storage device 110 shell. The temperature of each position of the body 112 is simple and intuitive, and the operation is convenient.

[0037] 需要说明的是，通信设备 140上的应用软件将壳体 112各个位置的温度信息处理成三维温度场模型吋，也一并将壳体 112的内部温度模拟出来，三维温度场模型不仅显示壳体 112外表面温度，还显示壳体 112内部温度，即储能单元 111所处环境的温度，用户看到的是壳体 112的表面温度和内部环境温度。采集单元 130设置越多，采集单元 130采集的壳体 112表面温度越准确，三维温度场模型模拟的壳体 112内部环境温度就越精确。 [0037] It should be noted that the application software on the communication device 140 processes the temperature information of each position of the housing 112 into a three-dimensional temperature field model, and simulates the internal temperature of the housing 112, and the three-dimensional temperature field model is not only The outer surface temperature of the housing 112 is displayed, and the internal temperature of the housing 112, that is, the temperature of the environment in which the energy storage unit 111 is located, is displayed, and the user sees the surface temperature of the housing 112 and the internal environmental temperature. The more the collection unit 130 is set, the more accurate the surface temperature of the housing 112 collected by the acquisition unit 130 is, and the three-dimensional temperature field model is simulated. The more accurate the ambient temperature inside the housing 112.

[0038] 由此可见，上述温度监测*** 100通过采集单元 130采集储能设备 110的温度信息，来对储能设备 110的内部空间场形成三维立体温度监测，并处理形成一个可供用户査看的温度场模型，监控处理装置 120可模拟估算出壳体 112内部空间每一点的温度变化，对储能设备 112的工作环境监测和故障评估方便精准；用户通过通信设备 140，比如手机，访问监控处理装置 120即可査看储能设备 110各个位置的温度信息，无需额外增加终端设备，简单方便，成本低，可远距离管理；上述温度监测*** 100除了可用于超级电容模组箱体外，还可用于一般的电池模组箱体，适用性广。 [0038] It can be seen that the temperature monitoring system 100 collects the temperature information of the energy storage device 110 by the collecting unit 130, and forms a three-dimensional temperature monitoring on the internal space field of the energy storage device 110, and processes and forms a view for the user to view. The temperature field model, the monitoring processing device 120 can simulate the temperature change at each point in the internal space of the housing 112, and the working environment monitoring and fault assessment of the energy storage device 112 is convenient and accurate; the user accesses the monitoring through the communication device 140, such as a mobile phone. The processing device 120 can view the temperature information of each position of the energy storage device 110, without additional terminal equipment, is simple and convenient, has low cost, and can be remotely managed; the temperature monitoring system 100 can be used not only for the super capacitor module box, It can also be used in general battery module cabinets with wide applicability.

[0039] 需要说明的是，本发明并不局限于上述实施方式，根据本发明的创造精神，本领域技术人员还可以做出其他变化，这些依据本发明的创造精神所做的变化，都应包含在本发明所要求保护的范围之内。 [0039] It should be noted that the present invention is not limited to the above embodiments, and other changes may be made by those skilled in the art according to the inventive spirit of the present invention, and the changes according to the inventive spirit of the present invention should be It is intended to be included within the scope of the invention as claimed.

Claims

权利要求书 Claim

[权利要求 1] 一种温度监测***，其特征在于，包括： [Claim 1] A temperature monitoring system, comprising:

储能设备，包括壳体和设于壳体内的至少一储能单元； The energy storage device includes a housing and at least one energy storage unit disposed in the housing;

采集单元，对应于各储能单元设于所述储能设备，以采集各储能单元的温度； The collecting unit is disposed in the energy storage device corresponding to each energy storage unit to collect the temperature of each energy storage unit;

监控处理装置，包括信息处理模块和连接至信息处理模块的转换模块、存储模块、通信模块，所述信息处理模块连接至所述采集单元；以及 a monitoring processing device, comprising: an information processing module and a conversion module, a storage module, and a communication module connected to the information processing module, wherein the information processing module is connected to the collection unit; and

通信设备，连接至所述通信模块； a communication device, connected to the communication module;

当所述储能单元工作发热吋，所述壳体吸热升温，所述采集单元采集各储能单元的温度并将采集的温度信息传送至所述转换模块，所述转换模块对所述温度信息进行转换处理后传输至所述信息处理模块，所述信息处理模块对所述温度信息进行处理后存储至所述存储模块，并通过所述通信模块传输至所述通信设备。 When the energy storage unit works hot, the housing absorbs heat, the collecting unit collects the temperature of each energy storage unit and transmits the collected temperature information to the conversion module, and the conversion module pairs the temperature The information is converted to the information processing module, and the information processing module processes the temperature information and stores the temperature information to the storage module, and transmits the data to the communication device through the communication module.

[权利要求 2] 如权利要求 1所述的温度监测***，其特征在于，多个所述采集单元均布于所述壳体，以采集所述壳体对应各储能单元的多个位置的模拟温度信息，并将所述模拟温度信息传输至所述转换模块。 [Claim 2] The temperature monitoring system according to claim 1, wherein a plurality of the collecting units are evenly distributed to the housing to collect a plurality of positions of the housing corresponding to the respective energy storage units. Simulating temperature information and transmitting the simulated temperature information to the conversion module.

[权利要求 3] 如权利要求 2所述的温度监测***，其特征在于，所述转换模块为模数转换模块，当所述模拟温度信息被传输至所述转换模块后，所述转换模块将所述模拟温度信息转换为数字温度信息，并将所述数字温度信息传输至所述信息处理模块。 [Claim 3] The temperature monitoring system according to claim 2, wherein the conversion module is an analog-to-digital conversion module, and after the analog temperature information is transmitted to the conversion module, the conversion module The analog temperature information is converted to digital temperature information and transmitted to the information processing module.

[权利要求 4] 如权利要求 3所述的温度监测***，其特征在于，所述处理模块将所述数字温度信息处理成三维温度场模型，并将所述三维温度场模型保存至所述存储模块。 [Claim 4] The temperature monitoring system according to claim 3, wherein the processing module processes the digital temperature information into a three-dimensional temperature field model, and saves the three-dimensional temperature field model to the storage Module.

[权利要求 5] 如权利要求 4所述的温度监测***，其特征在于，当所述通信设备向所述监控处理装置发生请求信号吋，所述通信模块接受所述请求信息并传输至所述处理模块，所述处理模块根据所述请求信息将所述三维温度场模型通过所述通信模块发送至所述通信设备。 [Claim 5] The temperature monitoring system according to claim 4, wherein when the communication device generates a request signal to the monitoring processing device, the communication module accepts the request information and transmits the request information to And a processing module, where the processing module sends the three-dimensional temperature field model to the communication device by using the communication module according to the request information.

[权利要求 6] 如权利要求 1所述的温度监测***，其特征在于，所述储能单元为超级电容。 [Claim 6] The temperature monitoring system according to claim 1, wherein the energy storage unit is a super capacitor.

[权利要求 7] 如权利要求 1所述的温度监测***，其特征在于，所述探测单元为温度传感器。 [Claim 7] The temperature monitoring system according to claim 1, wherein the detecting unit is a temperature sensor.

[权利要求 8] 如权利要求 1所述的温度监测***，其特征在于，所述通信模块包括用于进行有线通信的有线通信模块和用于进行无线通信的无线通信模块，所述有线通信模块和所述无线通信模块分别连接至所述信息处理模块，所述监控处理装置通过所述有线通信模块或所无线通信模块与所述通信设备进行通信。 [Claim 8] The temperature monitoring system according to claim 1, wherein the communication module includes a wired communication module for performing wired communication and a wireless communication module for performing wireless communication, the wired communication module And the wireless communication module is respectively connected to the information processing module, and the monitoring processing device communicates with the communication device through the wired communication module or the wireless communication module.

[权利要求 9] 如权利要求 8所述的温度监测***，其特征在于，所述无线通信模块为蓝牙模块、 WIFI模块中的一种。 [Claim 9] The temperature monitoring system according to claim 8, wherein the wireless communication module is one of a Bluetooth module and a WIFI module.

[权利要求 10] 如权利要求 1所述的温度监测***，其特征在于，所述通信设备包括手机或电脑，其安装有应用软件，所述通信设备通过所述应用软件处理并显示所述温度信息。 [Claim 10] The temperature monitoring system according to claim 1, wherein the communication device comprises a mobile phone or a computer, which is installed with application software, and the communication device processes and displays the temperature through the application software. information.