WO2019041366A1 - 一种线圈的制造方法、线圈、电子设备 - Google Patents

一种线圈的制造方法、线圈、电子设备 Download PDF

Info

Publication number
WO2019041366A1
WO2019041366A1 PCT/CN2017/100546 CN2017100546W WO2019041366A1 WO 2019041366 A1 WO2019041366 A1 WO 2019041366A1 CN 2017100546 W CN2017100546 W CN 2017100546W WO 2019041366 A1 WO2019041366 A1 WO 2019041366A1
Authority
WO
WIPO (PCT)
Prior art keywords
coil
laser
manufacturing
metal sheet
tape
Prior art date
Application number
PCT/CN2017/100546
Other languages
English (en)
French (fr)
Inventor
邹泉波
王喆
宋青林
孙德波
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Priority to US16/643,361 priority Critical patent/US11417463B2/en
Publication of WO2019041366A1 publication Critical patent/WO2019041366A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/045—Trimming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings
    • H01F41/127—Encapsulating or impregnating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils

Definitions

  • the present invention relates to the field of processing and manufacturing of devices, and more particularly to a manufacturing process of a coil; the present invention also relates to a coil obtained by applying the above manufacturing method; and an electronic device using the above coil.
  • Coils are common components in modern electronic products, and can be applied to sounding devices such as speakers and receivers; in addition, they can be applied to motors, inductors, transformers, loop antennas, and applications such as smart phones, smart phones.
  • a method of manufacturing a coil comprising the steps of:
  • the laser light is transmitted through the transparent laser substrate and acts on the adhesive layer to disengage the laser-transmissive substrate; after removing the adhesive layer, the metal sheet is first removed The coil pattern on the side is exposed;
  • the adhesive layer is selected from the group consisting of polyimide, benzocyclobutene, polybenzoxazole, epoxy resin, silica gel, acrylic adhesive, photoresist, parylene, polyamide Or polyurethane.
  • the laser-transparent substrate is selected from a laser beam or a laser sapphire.
  • the tape is a UV tape
  • a tape frame is further disposed at both ends of the UV tape.
  • the encapsulating layer is selected from the group consisting of polyimide, benzocyclobutene, polybenzoxazole, epoxy resin, silica gel, acrylic adhesive, photoresist, parylene, polyamide or Polyurethane.
  • the encapsulation layer is formed on the coil by means of silicone, spray coating, dispensing, printing or vapor deposition.
  • the step of forming an external pad by cutting the laser on the metal sheet is further included.
  • the metal sheet is a copper foil.
  • an electronic device comprising the above-described coil.
  • the manufacturing method of the present invention can produce a coil having a small size and a linear shape by laser cutting on a metal sheet as compared with the prior art.
  • the spacing between the coils and the coil size can be reasonably selected to ensure the performance of the coil when it is used at medium and high frequencies.
  • a laser-transmissive substrate is used as a substrate for fabrication, and the laser-transmissive substrate can be removed more easily by laser stripping or laser stripping, thereby avoiding deformation of the coil.
  • 1 to 5 are process flow diagrams of a method of manufacturing a coil of the present invention.
  • Figure 6 is a schematic illustration of a coil package structure of the present invention.
  • the present invention provides a method of manufacturing a coil and a coil obtained by the manufacturing method, and the volume of the coil can be made small by the above-described manufacturing method; the manufacturing method is low in cost, and the process of each step is mature, Suitable for mass production.
  • the coil obtained by the manufacturing method has controllable spacing between the coils, and the coil has small internal resistance, small heat loss, and excellent electrical and thermal conductivity.
  • the coil can be applied to various electronic devices, for example, to the field of inductance, or to the field of wireless charging of low power, medium power or even high power, such as in the field of charging of smart phones, smart watches or other wearable electronic devices.
  • FIG. 1 to 5 show a process flow diagram of a manufacturing method of the present invention. Specifically, the following steps are included:
  • the substrate 1 of the present invention is selected from a laser-transmissive material such as glass, sapphire or other laser-transmissive materials well known to those skilled in the art, so that the laser can be subsequently passed. Degumming or peeling.
  • the glue layer 2 is used for bonding the metal sheet 3 to the laser-transmissive substrate 1, which can be selected from the group consisting of polyimide, benzocyclobutene, polybenzoxazole, epoxy resin, silica gel, and acrylic adhesive.
  • a photoresist known to those skilled in the art such as photoresist, parylene, polyamide or polyurethane.
  • the metal piece 3 of the present invention is preferably a copper foil.
  • other materials commonly used in the field of coils can also be selected by those skilled in the art, and will not be enumerated here.
  • the laser cuts the second side of the metal piece 3 (refer to the view direction of FIG. 2, the second side of the metal piece 3 is the upper side) according to a predetermined pattern, and the coil pattern 30 is cut on the metal piece 3, Thereby, a structure of the coil 31 which penetrates the upper and lower sides of the metal piece 3 is formed on the metal piece 3.
  • the parameters of the laser it is possible to control the size and pitch of the coil 31.
  • the laser light is transmitted through the transparent laser substrate 1 and acts on the adhesive layer 2 to make the laser-transmissive substrate 1 and the metal plate 3 One side is detached; after removing the glue layer 2, the coil pattern on the first side of the metal piece is exposed; and the coil pattern 30 on the first side of the metal piece 3 is exposed;
  • the second side of the metal sheet 3 is bonded to the tape 4 to facilitate transportation of the product and retrieval of the product during use.
  • the adhesive tape 4 is a UV adhesive tape
  • a tape frame 5 is further disposed at both ends of the UV adhesive tape, through which the overall positioning can be achieved.
  • the laser light is passed through the laser substrate 1 and acts on the glue layer 2, and the adhesive layer 2 and the laser-transmissive substrate 1 lose their viscosity (or the viscosity is lowered), and the laser-transmissive substrate 1 is detached to achieve laser de-glue. Or the role of laser stripping. Thereafter, the adhesive layer 2 is removed, so that the coil pattern 30 of the first side of the metal piece 3 (the lower side of the metal piece 3) can be exposed, with reference to FIG.
  • the removal method of the glue layer 2 is determined according to the material thereof. For example, when the glue layer 2 is selected from the 3M LC5000 series glue, the standard mass production process is adhered to the glue layer 2 by another tape and is torn off. If the adhesive layer 2 is made of a photoresist, it can be washed away with a glue removal solution or the like. The method of removing the glue layer 2 is common knowledge of those skilled in the art and will not be specifically described herein.
  • the encapsulating layer 6 of the present invention mainly functions to insulate and protect the coil 31, and may be made of the same material as the adhesive layer 2 or a material different therefrom.
  • the encapsulating layer 6 may be made of polyimide, benzocyclobutene, polybenzoxazole, epoxy resin, silica gel, acrylic adhesive, photoresist, and poly pair.
  • a rubber material well known to those skilled in the art such as xylene, polyamide or polyurethane.
  • the encapsulation layer 6 can be formed on the first side of the coil 31 by silicone coating, spraying, dispensing, printing, vapor deposition, or other means well known to those skilled in the art, thereby positioning the first side of the coil 31. Encapsulated.
  • the coil package structure of the present invention is bonded to the tape 4, with reference to the structure shown in FIG.
  • the adhesive surface of the tape 4 can be made to lose its tackiness (or the viscosity becomes very low) after UV exposure, so that the package of the coil can be easily picked up from the tape 4. For example, it can be picked up by a vacuum nozzle and delivered to an assembly station.
  • the manufacturing method of the present invention can produce a coil having a small size and a linear shape by laser cutting on a metal sheet as compared with the prior art.
  • the spacing between the coils and the coil size can be reasonably selected to ensure the performance of the coil when it is used at medium and high frequencies.
  • a laser-transmissive substrate is used as a substrate for fabrication, and the laser-transmissive substrate can be removed more easily by laser stripping or laser stripping, thereby avoiding the coil.
  • the step of forming an external pad on the metal piece 3 by laser is further included.
  • the coil 31 can be connected to an external circuit through the formed external pads.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

一种线圈的制造方法、线圈、电子设备，包括以下步骤：将金属片(3)的第一侧通过胶层(2)粘接在透激光衬底(1)上；通过激光在金属片(3)的第二侧上切割线圈图案(30)，以在金属片(3)上形成贯穿其两侧的线圈(31)；将金属片(3)的第二侧粘接在胶带(4)上后，使激光透过所述透激光衬底(1)并作用在胶层(2)上，以使透激光衬底(1)、胶层(2)脱离金属片(3)的第一侧，并将金属片(3)第一侧的线圈图案(30)露出；在线圈(31)上形成封装层(6)，以将线圈(31)上第一侧的位置封装起来。通过激光的方式在金属片上进行切割，可以生产出尺寸微小、线型规则的线圈，而且采用透激光衬底作为制造的基底，后续可以通过激光去胶或者激光剥离的方式使透激光衬底更容易地去除，避免了线圈的变形。

Description

一种线圈的制造方法、线圈、电子设备 技术领域
本发明涉及器件的加工制造领域，更具体地，涉及一种线圈的制造工艺；本发明还涉及一种应用上述制造方法得到的线圈；以及采用上述线圈的电子设备。
背景技术
线圈是现代电子产品中常见的部件，其可以应用到扬声器、受话器等发声装置中；除此之外，其还可以应用到马达、电感、变压器、环形天线中，以及应用到例如智能手机、智能手表，或其它可穿戴电子设备的无线充电领域。
随着科技的发展，传统的线圈由于其体积大、内阻高、质量大，已经不能满足现代电子产品的轻薄化需求。而且由于线圈对工作参数的要求以及其较为特殊的结构，采用常规的微电子技术难以在平面衬底上制作高性能的微型化线圈。
发明内容
本发明的一个目的是提供一种线圈的制造方法的新技术方案。
根据本发明的第一方面，提供了一种线圈的制造方法，包括以下步骤：
a)将金属片的第一侧通过胶层粘接在透激光衬底上；
b)通过激光在金属片的第二侧上切割线圈图案，以在金属片上形成贯穿其两侧的线圈；
c)将金属片的第二侧粘接在胶带上后，使激光透过所述透激光衬底并作用在胶层上，以使透激光衬底脱离；去除胶层后将金属片第一侧的线圈图案露出；
d)在线圈上形成封装层，以将线圈上第一侧的位置封装起来。
可选地，所述胶层选自聚酰亚胺、苯并环丁烯、聚苯并恶唑、环氧树脂、硅胶、丙烯酸类粘合剂、光刻胶、聚对二甲苯、聚酰胺或聚氨基甲酸乙酯。
可选地，所述透激光衬底选用透激光玻璃或透激光蓝宝石。
可选地，所述胶带为UV胶带，在所述UV胶带的两端位置还设置有胶带框架。
可选地，所述封装层选用聚酰亚胺、苯并环丁烯、聚苯并恶唑、环氧树脂、硅胶、丙烯酸类粘合剂、光刻胶、聚对二甲苯、聚酰胺或聚氨基甲酸乙酯。
可选地，所述封装层通过甩胶、喷涂、点胶、印刷或者气相沉积的方式形成在线圈上。
可选地，在所述步骤b)中，还包括通过激光在金属片上切割形成外接焊盘的步骤。
可选地，所述金属片为铜箔。
根据本发明的另一方面，还提供了一种使用上述制造方法所制造出的线圈。
根据本发明的另一方面，还提供了一种电子设备，包含上述的线圈。
本发明的制造方法与现有技术相比，通过激光的方式在金属片上进行切割，可以生产出尺寸微小、线型规则的线圈。通过对激光参数的调节，可以合理选择线圈之间的间距以及线圈尺寸，保证了该线圈在中高频使用时的性能。本发明的制造方法，采用透激光衬底作为制造的基底，后续可以通过激光去胶或者激光剥离的方式使透激光衬底更容易地去除，避免了线圈的变形。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1至图5是本发明线圈制造方法的工艺流程图。
图6是本发明线圈封装结构的示意图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
本发明提供了一种线圈的制造方法以及通过该制造方法得到的线圈，通过上述的制造方法，可以使线圈的体积可以做到很小；该制造方法的成本低廉，而且各步骤的制程成熟，适合批量化生产。
通过该制造方法得到的线圈，线圈之间的间距可控，而且线圈的内阻小、热损耗小，导电导热性能优良。该线圈可以应用到各电子设备中，例如应用到电感领域，或者低功率、中功率甚至高功率的无线充电领域，比如智能手机、智能手表或者其它可穿戴电子设备的充电领域中等等。
图1至图5示出了本发明制造方法的工艺流程图。具体地，包括以下步骤：
a)将金属片3的第一侧通过胶层2粘接在透激光衬底1上；
参考图1，本发明的衬底1选用透激光的材质，例如玻璃、蓝宝石或者本领域技术人员所熟知的其它透激光材料，使得后续可以通过激光的方 式进行去胶或者剥离。
胶层2用于将金属片3粘接在透激光衬底1上，其可以选择聚酰亚胺、苯并环丁烯、聚苯并恶唑、环氧树脂、硅胶、丙烯酸类粘合剂、光刻胶、聚对二甲苯、聚酰胺或聚氨基甲酸乙酯等本领域技术人员所熟知的胶材。
铜材质具备优良的导电、导热性能，而且其成本也较为低廉。因此，本发明的金属片3优选采用铜箔。但是对于本领域的技术人员而言，还可以选择线圈领域中常用的其它材质，在此不再一一列举。
b)通过激光在金属片3的第二侧上切割出线圈图案30，以在金属片3上形成贯穿其两侧的线圈31；
参考图2，激光按照预定的图形对金属片3的第二侧(参考图2的视图方向，金属片3的第二侧为上侧)进行切割，在金属片3上切割出线圈图案30，从而在金属片3上形成了一圈圈贯穿金属片3上下两侧的线圈31结构。通过调节激光的参数，使得可以控制线圈31的尺寸、间距。
c)将金属片3的第二侧粘接在胶带4上后，使激光透过所述透激光衬底1并作用在胶层2上，以使透激光衬底1与金属片3的第一侧脱离；去除胶层2后将金属片第一侧的线圈图案露出；并将金属片3第一侧的线圈图案30露出；
参考图3，将金属片3的第二侧粘接在胶带4上，可以便于产品的运输以及使用时产品的取料。在本发明一个优选的实施方式中，所述胶带4为UV胶带，在所述UV胶带的两端位置还设置有胶带框架5，通过该胶带框架5可以实现整体的定位。
使激光通过透激光衬底1，并作用在胶层2上，胶层2与透激光衬底1之间失去粘性(或者粘性降低后)，将透激光衬底1脱离，以达到激光去胶或者激光剥离的作用。之后去除胶层2，使得可以将金属片3第一侧(金属片3下侧)的线圈图案30露出，参考图4。
胶层2的去除方法根据其材质而定，例如当胶层2选用3M的LC5000系列胶，标准量产制程是用另一个胶带粘在此胶层2上并将其撕下来。如果胶层2选用光刻胶，则可以用去胶液洗掉等等。胶层2的去除方法属于本领域技术人员的公知常识，在此不再具体说明。
d)在线圈31上形成封装层6，以将线圈31上第一侧的位置封装起来；
参考图5，本发明的封装层6主要起到绝缘并保护线圈31的作用，其可以采用与胶层2相同的材质，也可以选用与其不同的材质。在本发明一个具体的实施方式中，封装层6可以采用聚酰亚胺、苯并环丁烯、聚苯并恶唑、环氧树脂、硅胶、丙烯酸类粘合剂、光刻胶、聚对二甲苯、聚酰胺或聚氨基甲酸乙酯等本领域技术人员所熟知的胶材。
在成型工艺中，封装层6可以通过甩胶、喷涂、点胶、印刷、气相沉积或者本领域技术人员所熟知的其它方式形成在线圈31的第一侧，从而将线圈31的第一侧位置封装起来。
本发明的线圈封装结构粘接在胶带4上，参考图5示出的结构。当需要使用的时候，胶带4的胶面在UV曝光后，可使其失去粘性(或粘性变得很低)，这样线圈的封装就可以很容易地从胶带4上被拾取起来。例如可以通过真空吸嘴进行拾取，并输送到装配工位上。
本发明的制造方法与现有技术相比，通过激光的方式在金属片上进行切割，可以生产出尺寸微小、线型规则的线圈。通过对激光参数的调节，可以合理选择线圈之间的间距以及线圈尺寸，保证了该线圈在中高频使用时的性能。本发明的制造方法，采用透激光衬底作为制造的基底，后续可以通过激光去胶或者激光剥离的方式使透激光衬底更容易地去除，避免了线圈的。
在本发明一个优选的实施方式中，在所述步骤b)中，还包括通过激光在金属片3上切割形成外接焊盘的步骤。通过形成的外接焊盘可以将线圈31与外部电路连接在一起。
在此需要注意的是，由于外接焊盘用于焊接外部的线路，因此，在步骤d)的封装工序中，需要将外接焊盘露出，在此不再具体说明。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种线圈的制造方法，其特征在于，包括以下步骤：
    a)将金属片的第一侧通过胶层粘接在透激光衬底上；
    b)通过激光在金属片的第二侧上切割线圈图案，以在金属片上形成贯穿其两侧的线圈；
    c)将金属片的第二侧粘接在胶带上后，使激光透过所述透激光衬底并作用在胶层上，以使透激光衬底脱离；去除胶层后将金属片第一侧的线圈图案露出；
    d)在线圈上形成封装层，以将线圈上第一侧的位置封装起来。
  2. 根据权利要求1所述的制造方法，其特征在于：所述胶层选自聚酰亚胺、苯并环丁烯、聚苯并恶唑、环氧树脂、硅胶、丙烯酸类粘合剂、者光刻胶、聚对二甲苯、聚酰胺或聚氨基甲酸乙酯。
  3. 根据权利要求1或2所述的制造方法，其特征在于：所述透激光衬底选用透激光玻璃或透激光蓝宝石。
  4. 根据权利要求1至3任一项所述的制造方法，其特征在于：所述胶带为UV胶带，在所述UV胶带的两端位置还设置有胶带框架。
  5. 根据权利要求1至4任一项所述的制造方法，其特征在于：所述封装层选用聚酰亚胺、苯并环丁烯、聚苯并恶唑、环氧树脂、硅胶、丙烯酸类粘合剂、光刻胶、聚对二甲苯、聚酰胺或聚氨基甲酸乙酯。
  6. 根据权利要求1至5任一项所述的制造方法，其特征在于：所述封装层通过甩胶、喷涂、点胶、印刷或者气相沉积的方式形成在线圈上。
  7. 根据权利要求1至6任一项所述的制造方法，其特征在于：在所述步骤b)中，还包括通过激光在金属片上切割形成外接焊盘的步骤。
  8. 根据权利要求1至7任一项所述的制造方法，其特征在于：所述金属片为铜箔。
  9. 一种使用根据权利要求1至8任一项所述的制造方法所制造出的线圈。
  10. 一种电子设备，包含根据权利要求9所述的线圈。
PCT/CN2017/100546 2017-08-30 2017-09-05 一种线圈的制造方法、线圈、电子设备 WO2019041366A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/643,361 US11417463B2 (en) 2017-08-30 2017-09-05 Method for manufacturing coil, coil and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710765976.1 2017-08-30
CN201710765976.1A CN107705976B (zh) 2017-08-30 2017-08-30 一种线圈的制造方法、线圈、电子设备

Publications (1)

Publication Number Publication Date
WO2019041366A1 true WO2019041366A1 (zh) 2019-03-07

Family

ID=61171234

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/100546 WO2019041366A1 (zh) 2017-08-30 2017-09-05 一种线圈的制造方法、线圈、电子设备

Country Status (3)

Country Link
US (1) US11417463B2 (zh)
CN (1) CN107705976B (zh)
WO (1) WO2019041366A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114497985A (zh) * 2022-02-24 2022-05-13 深圳市卓睿通信技术有限公司 一种nfc天线及终端

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108711494B (zh) * 2018-05-18 2019-06-11 东莞领益精密制造科技有限公司 一种双线圈的充电线圈及其制造方法
CN112974480A (zh) * 2021-02-23 2021-06-18 高东亮 一种将铜丝与铁环完全分离的互感器回收装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110047793A1 (en) * 2006-09-21 2011-03-03 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Method for producing flexible integrated circuits which may be provided contiguously
CN104465418A (zh) * 2014-12-24 2015-03-25 南通富士通微电子股份有限公司 一种扇出晶圆级封装方法
CN104519666A (zh) * 2014-12-17 2015-04-15 上海蓝沛新材料科技股份有限公司 一种用于柔性线路板制作的柔性模具及其制备方法
CN104992908A (zh) * 2015-07-14 2015-10-21 华进半导体封装先导技术研发中心有限公司 一种晶圆级封装中超薄封盖的制作方法
CN106129047A (zh) * 2016-06-29 2016-11-16 北京时代民芯科技有限公司 一种平面螺旋电感的新型制作方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6311389B1 (en) * 1998-07-01 2001-11-06 Kabushiki Kaisha Toshiba Gradient magnetic coil apparatus and method of manufacturing the same
US6838773B2 (en) * 2000-06-21 2005-01-04 Hitachi Maxell, Ltd. Semiconductor chip and semiconductor device using the semiconductor chip
JP2008140528A (ja) * 2006-12-05 2008-06-19 Hitachi Global Storage Technologies Netherlands Bv 垂直磁気記録媒体
JP6060508B2 (ja) 2012-03-26 2017-01-18 Tdk株式会社 平面コイル素子およびその製造方法
CN103043599B (zh) * 2012-12-07 2015-10-28 北京大学 一种基于柔性聚合物衬底的螺旋电感的制备方法
KR101983137B1 (ko) * 2013-03-04 2019-05-28 삼성전기주식회사 파워 인덕터 및 그 제조방법
KR101503144B1 (ko) * 2013-07-29 2015-03-16 삼성전기주식회사 박막 인덕터 소자 및 이의 제조방법
KR101640909B1 (ko) * 2014-09-16 2016-07-20 주식회사 모다이노칩 회로 보호 소자 및 그 제조 방법
US10049808B2 (en) * 2014-10-31 2018-08-14 Samsung Electro-Mechanics Co., Ltd. Coil component assembly for mass production of coil components and coil components made from coil component assembly
CN104665418A (zh) 2015-03-27 2015-06-03 陈红 保健药枕
CN105014156B (zh) * 2015-06-29 2018-06-19 高屋科技（深圳）有限公司 扁平导线层叠线圈的切削成型方法
KR102145314B1 (ko) * 2015-07-31 2020-08-18 삼성전기주식회사 코일 부품 및 그 제조 방법
US10269702B2 (en) * 2016-01-29 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Info coil structure and methods of manufacturing same
CN106783074B (zh) * 2016-12-26 2018-12-14 南京后莱新材料有限公司 大过流叠装线圈
CN107705971A (zh) * 2017-08-30 2018-02-16 歌尔股份有限公司 一种线圈的制造方法、线圈、电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110047793A1 (en) * 2006-09-21 2011-03-03 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Method for producing flexible integrated circuits which may be provided contiguously
CN104519666A (zh) * 2014-12-17 2015-04-15 上海蓝沛新材料科技股份有限公司 一种用于柔性线路板制作的柔性模具及其制备方法
CN104465418A (zh) * 2014-12-24 2015-03-25 南通富士通微电子股份有限公司 一种扇出晶圆级封装方法
CN104992908A (zh) * 2015-07-14 2015-10-21 华进半导体封装先导技术研发中心有限公司 一种晶圆级封装中超薄封盖的制作方法
CN106129047A (zh) * 2016-06-29 2016-11-16 北京时代民芯科技有限公司 一种平面螺旋电感的新型制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114497985A (zh) * 2022-02-24 2022-05-13 深圳市卓睿通信技术有限公司 一种nfc天线及终端

Also Published As

Publication number Publication date
US11417463B2 (en) 2022-08-16
CN107705976A (zh) 2018-02-16
US20200365321A1 (en) 2020-11-19
CN107705976B (zh) 2020-08-25

Similar Documents

Publication Publication Date Title
CN206210789U (zh) 具有电磁干扰遮蔽的半导体装置
US20220384289A1 (en) Semiconductor package device and method of manufacturing the same
KR101997487B1 (ko) Ic 패키지용 고밀도 필름
US8039309B2 (en) Systems and methods for post-circuitization assembly
US8105880B2 (en) Method for attaching a semiconductor die to a leadframe, and a semiconductor device
JP2018533848A (ja) キャリア超薄型基板
KR20150104467A (ko) 반도체 디바이스의 제조 방법 및 이에 따른 반도체 디바이스
WO2019041366A1 (zh) 一种线圈的制造方法、线圈、电子设备
JP2011151372A (ja) 電子部品モジュールの製造方法及び電子部品モジュール
CN103311204A (zh) 倒装芯片封装技术和配置
WO2007106625A2 (en) Perforated embedded plane package and method
TW201608686A (zh) 半導體封裝件及其製法
WO2019041367A1 (zh) 一种线圈的制造方法、线圈、电子设备
US9362142B2 (en) Flip-chip electronic device and production method thereof
US9362256B2 (en) Bonding process for a chip bonding to a thin film substrate
JP2018010964A (ja) 回路モジュールの製造方法および成膜装置
US9474162B2 (en) Circuit substrate and method of manufacturing same
CN105846038B (zh) 金属圆片级蚀刻型表面声滤波芯片封装结构的制造方法
JP2006100666A (ja) 半導体装置及びその製造方法
CN103021880B (zh) 半导体装置的制造方法
TWI588016B (zh) 用於形成電子模組之方法與系統
US20200273823A1 (en) Semiconductor device package and method of manufacturing the same
US9373587B2 (en) Stacked electronic device
TW201933965A (zh) 電子裝置製造方法及其結構
JP2019033175A (ja) 半導体装置の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17923410

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17923410

Country of ref document: EP

Kind code of ref document: A1