WO2019039484A1 - Package with rfid tag - Google Patents
Package with rfid tag Download PDFInfo
- Publication number
- WO2019039484A1 WO2019039484A1 PCT/JP2018/030893 JP2018030893W WO2019039484A1 WO 2019039484 A1 WO2019039484 A1 WO 2019039484A1 JP 2018030893 W JP2018030893 W JP 2018030893W WO 2019039484 A1 WO2019039484 A1 WO 2019039484A1
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- WO
- WIPO (PCT)
- Prior art keywords
- package body
- rfid tag
- antenna conductor
- package
- conductor layer
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/20—External fittings
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
Definitions
- the present invention relates to an RFID tagged package.
- Patent Document 1 discloses a wireless IC device (RFID (Radio-Frequency Identification) tag) attached so as to stand on the outer surface of an article.
- the article is an article at least the outer surface of which is metal, and the RFID tag is configured to perform wireless communication via the metal portion.
- RFID Radio-Frequency Identification
- the RFID tag described in Patent Document 1 is attached to a product so as to stand upright, there is a possibility that the design of the product may be impaired. If the article is, for example, a package for a high-end retail article, the outer surface of which is at least partially covered by a metal layer, the RFID tag can greatly impair the high aesthetics that give it a high-class feel.
- this invention makes it a subject to provide the package with a RFID tag provided with the RFID tag so that the designability might not be impaired.
- Package with RFID tag A package body made of a non-conductive material, A metal layer partially provided on the outer surface of the package body; An RFIC chip provided with the first and second input / output terminals and disposed in the package body; A first antenna conductor layer disposed at a portion of the package body, one end of which is connected to the first input / output terminal of the RFIC chip and the other end of which is an open end, and the metal layer is not provided; A second terminal connected to the second input / output terminal of the RFIC chip at one end and directly connected to the metal layer at the other end or via a capacitor and disposed in the package body An RFID tagged package is provided, comprising: an antenna conductor layer.
- Package with RFID tag A package body made of a conductive material and provided with through holes; A sealing member attached to the package body to close the through hole; An RFIC chip provided with the first and second input / output terminals and disposed in the package body; A first antenna conductor layer disposed on the seal member such that one end is connected to the first input / output terminal of the RFIC chip, the other end is an open end, and is located within the opening of the through hole; A second one connected to the second input / output terminal of the RFIC chip at one end, and the other end connected directly to the package body or connected via a capacitor; An RFID tagged package is provided, comprising: an antenna conductor layer.
- a package with an RFID tag can be provided in which the RFID tag is provided so as not to impair the design.
- a perspective view of a package with an RFID tag according to Embodiment 1 of the present invention A perspective view of the package body with the RFID tag removed Perspective view of RFID tag Equivalent circuit diagram of RFID tag
- An exploded perspective view of the RFIC module A perspective view of a package with an RFID tag according to Embodiment 2 of the present invention The perspective view of the package main body of the state which removed the RFID tag based on this Embodiment 2
- a perspective view of a package with an RFID tag according to Embodiment 3 of the present invention A perspective view of the package body with the RFID tag removed
- the perspective view of the package with a RFID tag concerning Embodiment 4 of the present invention The perspective view of the package with an RFID tag concerning Embodiment 5 of the present invention
- the RFID tag-equipped package comprises a package body made of a nonconductive material, a metal layer partially provided on the outer surface of the package body, and first and second input / output terminals.
- a portion of the package body having one end connected to the first input / output terminal of the RFIC chip, the other end being an open end, and the metal layer not provided And one end is connected to the second input / output terminal of the RFIC chip, and the other end is directly connected to the metal layer or via a capacitor.
- a second antenna conductor layer disposed on the package body.
- the RFID tag-attached package has a sheet substrate attached to the package body, and the RFIC chip, the first antenna conductor layer, and the second antenna conductor layer are provided on the sheet substrate. It may be provided.
- the sheet base material may be attached to the package body such that the package body has a through hole and the first antenna conductor layer is located in the opening of the through hole.
- the package body may comprise a transparent window
- the first antenna conductor layer, the second antenna conductor layer, and the sheet substrate may be made of a transparent material and disposed in the transparent window.
- the first and second antenna conductor layers may be made of the same material as the metal layer and provided on the outer surface of the package body.
- the package body is a rectangular parallelepiped box having a front surface, a back surface, a right side surface, a left side surface, a top surface, and a bottom surface, any one of the front surface, the back surface, the right side surface, and the left side surface.
- the RFIC chip, the first antenna conductor layer, and the second antenna conductor layer are arranged in the opposing direction of the top surface and the bottom surface.
- An RFID tag-attached package is made of a conductive material and includes a package body provided with a through hole, a seal member attached to the package body so as to close the through hole, and The RFIC chip disposed in the package body, one end is connected to the first input / output terminal of the RFIC chip, the other end is an open end, and the opening of the through hole is provided.
- a second antenna conductor layer connected via a capacitor and disposed in the package body.
- FIG. 1 is a perspective view showing a package with an RFID (Radio-Frequency IDentification) tag according to Embodiment 1 of the present invention.
- the XYZ coordinate system is for the purpose of facilitating the understanding of the invention, and does not limit the invention.
- the RFID tag-equipped package 10 includes a package body 12 which is a rectangular parallelepiped box body, and a sheet-like RFID tag 30 attached to the package body 12. Have.
- FIG. 2 shows the package body 12 with the RFID tag 30 removed.
- the package body 12 has a front surface 12a which is directed to the front of the display shelf when displayed on a display shelf of a store, a back surface 12b opposite to the front surface 12a, and a right side surface 12c between the front surface 12a and the back surface 12b.
- a left side 12d, a bottom 12e opposite to the display shelf, and a top 12f opposite to the bottom 12e are provided.
- the package body 12 is made of a non-conductive material, such as a paper material or a resin material.
- the package body 12 is made of a paper material.
- the transparent window 14 made of a transparent (or translucent) sheet, for example, a resin sheet, is provided so that the articles contained in the RFID tag-attached package 10 can be viewed.
- the transparent window 14 is provided on the front surface 12 a of the package body 12.
- a metal layer 16 is partially provided on the outer surface of the package body 12.
- the metal layer 16 is provided on the package body 12 in order to create a sense of quality of the articles contained in the RFID tag-attached package 10.
- the package body 12 has a metallic luster due to the metal layer 16.
- the metal layer 16 prints, for example, an ink containing metal particles such as aluminum or silver on the package body 12 (sheet-like member before being formed on the package body 12) It is formed by doing.
- the metal layer 16 is formed on the entire surface of the back surface 12b, the left side surface 12d, the bottom surface 12e, and the top surface 12f.
- the metal layer 16 is formed over the entire surface except for the transparent window 14.
- the metal layer 16 is formed on the right side surface 12c except for a portion (exposed portion) 12g. That is, most of the outer surface of the package body 12 is covered by the metal layer 16.
- An RFID tag 30 is attached to the exposed portion 12 g of the right side surface 12 c of the package body 12 where the metal layer 16 is not provided. The RFID tag 30 will be described.
- FIG. 3 is a perspective view of the RFID tag 30. 4 is an equivalent circuit diagram of the RFID tag 30. As shown in FIG. 3
- the RFID tag 30 includes a sheet base 32, first and second antenna conductor layers 34 and 36 provided on the sheet base 32, and an RFIC (Radio-Frequency Integrated Circuit) module. And 40.
- RFIC Radio-Frequency Integrated Circuit
- the sheet base 32 is a rectangular sheet made of a nonconductive material such as a paper material or a resin material, and includes the first antenna conductor layer 34 and the second antenna conductor layer. And a main surface 32a on which the RFIC module 40 is provided, and a back surface 32b opposite to the main surface 32a.
- the sheet base 32 is attached to the package body 12 via the main surface 32 a.
- the back surface 32 b of the sheet base 32 is exposed to the outside and constitutes a part of the outer surface of the RFID tag-attached package 10.
- a barcode or a component table of a product may be printed on the back surface 32b.
- the exposed portion 12g affects the design of the RFID tag-attached package 10
- the sheet substrate 32 has a size capable of completely covering the exposed portion 12g of the package body 12 as shown in FIG. It is preferable to have.
- the first and second antenna conductor layers 34 and 36 are pattern layers made of a conductor material such as aluminum, silver, copper, etc., and are pattern printed, for example, on the major surface 32 a of the sheet substrate 32.
- the first antenna conductor layer 34 is disposed on one end side of the sheet base 32 in the longitudinal direction (Y-axis direction).
- the first antenna conductor layer 34 has one end (land portion) 34 a connected to the RFIC module 40 and the other end 34 b being an open end, which will be described in detail later.
- the portion of the first antenna conductor layer 34 between the land portion 34 a and the open end 34 b is formed in a meander shape. By forming in a meander shape in this manner, the details will be described later, but the first antenna conductor layer 34 is necessary for the RFID tag 30 to function as an exciter for good wireless communication at a predetermined communication frequency. Electric length.
- the first antenna conductor layer 34 is disposed on the exposed portion 12 g when the sheet base 32 is attached to the package body 12.
- One antenna conductor layer 34 is provided on the sheet substrate 32. Thereby, the electrical connection between the metal layer 16 and the first antenna conductor layer 34 is avoided.
- the first antenna conductor layer 34 is disposed on the sheet substrate 32 such that the open end 34 b of the first antenna conductor layer 34 is located approximately at the center of the exposed portion 12 g. This is to avoid capacitive coupling between the metal layer 16 and the open end 34b.
- the second antenna conductor layer 36 is independent of the first antenna conductor layer 34 at a distance, and the longitudinal direction of the sheet base 32 (Y It is arranged on the other end side of the axial direction).
- the second antenna conductor layer 36 has one end (land portion) 36 a connected to the RFIC module 40 and the other end (contact pad portion) 36 b connected to the metal layer 16, which will be described in detail later.
- the portion of the second antenna conductor layer 36 between the land portion 36a and the contact pad portion 36b is formed in a meander shape.
- the second antenna conductor layer 36 has an inductance L5.
- the second antenna conductor layer 36 is exposed to the exposed portion 12g except the contact pad portion 36b.
- a second antenna conductor layer 36 is provided on the sheet substrate 32 so as to be disposed. That is, the contact pad portion 36 b overlaps the metal layer 16 and thereby electrically connects to the metal layer 16.
- the sheet base 32 is attached (adhered) to the package body 12 via the insulating adhesive (not shown).
- contact pad portion 36b and metal layer 16 are connected (capacitively coupled) via capacitance C2.
- the RFIC module 40 is a wireless communication device that performs wireless communication at a communication frequency of, for example, 900 MHz band, that is, UHF band, and is provided on the main surface 32 a of the sheet base 32. . Further, the RFIC module 40 is connected to the first antenna conductor layer 34 and the second antenna conductor layer 36 in order to perform wireless communication. The RFIC module 40 will be described with reference to FIG.
- FIG. 5 is an exploded perspective view of the RFIC module 40. As shown in FIG.
- the RFIC module 40 is configured of a multilayer substrate consisting of three layers. Specifically, the RFIC module 40 is configured by laminating flexible insulating sheets 42A, 42B, and 42C made of resin materials such as polyimide and liquid crystal polymer. 5 shows the RFIC module 40 shown in FIG. 3 in a state of being turned over and disassembled.
- the RFIC module 40 has an RFIC chip 44, a plurality of inductance elements 46A, 46B, 46C, and 46D, and external connection terminals 48, 50.
- the inductance elements 46A to 46D and the external connection terminals 48 and 50 are formed on the insulating sheets 42A to 42C, and are formed of conductor patterns made of a conductor material such as copper.
- the RFIC chip 44 is mounted at the central portion in the longitudinal direction (X-axis direction) on the insulating sheet 42C.
- the RFIC chip 44 has a structure in which various elements are incorporated in a semiconductor substrate made of a semiconductor such as silicon.
- the RFIC chip 44 further includes a first input / output terminal 44a and a second input / output terminal 44b.
- the RFIC chip 44 has an internal capacitance (capacitance: self-capacitance of the RFIC chip itself) C1.
- the inductance element (first inductance element) 46A is formed of a conductor pattern provided in a spiral coil shape on the insulation sheet 42C on one side in the longitudinal direction (X-axis direction) of the insulation sheet 42C. It is configured. Further, as shown in FIG. 4, the inductance element 46A includes an inductance L1. A land 46Aa connected to the first input / output terminal 44a of the RFIC chip 44 is provided at one end (the end outside the coil) of the inductance element 46A. A land 46Ab is also provided at the other end (end on the coil center side).
- the inductance element (second inductance element) 46B is provided on the other side of the insulating sheet 42C in the longitudinal direction (X-axis direction) from the conductor pattern provided in a spiral coil shape on the insulating sheet 42C. It is configured. Further, as shown in FIG. 4, the inductance element 46B includes an inductance L2. A land 46Ba connected to the second input / output terminal 44b of the RFIC chip 44 is provided at one end (end outside the coil) of the inductance element 46B. A land 46Bb is also provided at the other end (end on the coil center side).
- an inductance element (third inductance element) 46C is formed of a conductor pattern provided in a spiral coil shape on the insulation sheet 42B on one side in the longitudinal direction (X-axis direction) of the insulation sheet 42B. It is configured. Further, the inductance element 46C is opposed to the inductance element 46A in the stacking direction (Z-axis direction). Furthermore, as shown in FIG. 4, the inductance element 46C includes an inductance L3. A land 46Ca is provided at one end (end on the coil center side) of the inductance element 46C. The land 46Ca is connected to the land 46Ab of the inductance element 46A on the insulating sheet 42C through the interlayer connecting conductor 52 such as a through hole conductor penetrating the insulating sheet 42B.
- an inductance element (fourth inductance element) 46D is provided on the other side of the insulating sheet 42B in the longitudinal direction (X-axis direction) from the conductor pattern provided in a spiral coil shape on the insulating sheet 42B. It is configured. Further, the inductance element 46D is opposed to the inductance element 46B in the stacking direction (Z-axis direction). Furthermore, as shown in FIG. 4, the inductance element 46D includes an inductance L4. A land 46Da is provided at one end (end on the coil center side) of the inductance element 46D. The land 46Da is connected to the land 46Bb of the inductance element 46B on the insulating sheet 42C via the interlayer connection conductor 54 such as a through hole conductor penetrating the insulating sheet 42B.
- the inductance elements 46C and 46D on the insulating sheet 42B are integrated as one conductor pattern. That is, the respective other ends (ends outside the coil) are connected to each other. Further, through holes 42Ba in which the RFIC chips 44 mounted on the insulating sheet 42C are accommodated are formed in the insulating sheet 42B.
- the external connection terminals 48 and 50 are formed of a conductor pattern provided on the insulating sheet 42A. Further, the external connection terminals 48 and 50 are opposed in the longitudinal direction (X-axis direction) of the insulating sheet 42A.
- One external connection terminal 48 is connected to the land 46Ca of the inductance element 46C on the insulating sheet 42B via an interlayer connecting conductor 56 such as a through hole conductor penetrating the insulating sheet 42A.
- the other external connection terminal 50 is connected to the land 46 Da of the inductance element 46 D on the insulating sheet 42 B via an interlayer connecting conductor 58 such as a through hole conductor penetrating the insulating sheet 42 A.
- One external connection terminal 48 is connected to the land portion 36 a of the second antenna conductor layer 36 via, for example, a solder.
- the other external connection terminal 50 is connected to the land 34 a of the first antenna conductor layer 34 via, for example, a solder.
- the RFIC chip 44 is composed of a semiconductor substrate. Further, the RFIC chip 44 exists between the inductance elements 46A and 46B and between the inductance elements 46C and 46D. The RFIC chip 44 functions as a shield, thereby suppressing magnetic field coupling and capacitive coupling between the spiral coil inductance elements 46A and 46B provided on the insulating sheet 42C. Similarly, magnetic field coupling and capacitive coupling between the spiral coiled inductance elements 46C and 46D provided on the insulating sheet 42B are suppressed. As a result, narrowing of the pass band of the communication signal is suppressed.
- the capacitance C1 (internal capacitance of the RFIC chip 44) and the inductances L1 to L4 (inductances of four inductance elements) allow the RFIC chip 44 and the first and second antenna conductor layers 34 and 36 to A matching circuit for matching between the two is configured.
- the RFID tag 30 exchanges radio waves with an external wireless communication device (for example, a reader / writer device) via the metal layer 16 of the package body 12.
- an external wireless communication device for example, a reader / writer device
- the first antenna conductor layer 34 substantially functions as an exciter for exciting the second antenna conductor layer 36 (for radiating radio waves from the metal layer 16 through the second antenna conductor layer 36).
- the first antenna conductor layer 34 is formed in a meander shape and has an electrical length for functioning as an exciter.
- the RFIC chip 44 of the RFIC module 40 is driven by the electromotive force.
- the driven RFIC chip 44 transmits the data stored in the storage unit via the second antenna conductor layer 36 or the metal layer 16.
- the first antenna conductor layer 34, the second antenna conductor layer 36, and the RFIC module 40 are arranged in the opposing direction (Y-axis direction) of the top surface 12 f and the bottom surface 12 e of (package body 12). Moreover, these are arrange
- radio waves are substantially emitted from the metal layer 16 on the front surface 12a, the back surface 12b, the right side surface 12c, and the left side surface 12d. That is, radiation of radio waves from the top surface 12f and the bottom surface 12e is suppressed.
- the RFID tag 30 of the RFID tag-attached package 10 placed on the display shelf with the bottom surface 12e in contact with the display shelf can be read not only from the front but also from the rear of the display shelf.
- the display shelf above the RFID tag-equipped package 10 and the display shelf below can function as a shield to interfere with wireless communication.
- the RFID tag-attached package 10 can be provided in which the RFID tag 30 is provided so as not to impair the design.
- the RFID tag-equipped package 10 provided with the RFID tag 30 can be provided without substantially changing the external shape of the package body 12.
- the first antenna conductor layer 34 is disposed on the exposed portion 12 g of the package body 12 in which the metal layer 16 is not provided.
- the second embodiment is different.
- the other configuration is substantially the same as that of the first embodiment described above. Therefore, components substantially the same as the components of the first embodiment described above are assigned the same reference numerals.
- FIG. 6 is a perspective view of a package with an RFID tag according to the second embodiment.
- FIG. 7 is a perspective view of the package body with the RFID tag removed.
- the appearance of the RFID tag equipped package 110 according to the second embodiment is the same as the appearance of the RFID tag equipped package 10 according to the above-described first embodiment shown in FIG.
- the package body 112 is different from the package body 12 of the first embodiment described above.
- the package body 112 is provided with a through hole 112h.
- the through hole 112 h is a portion of the package body 112 where the metal layer 116 is not provided.
- the first antenna conductor layer 34 is provided such that the first antenna conductor layer 34 is located in the opening of the through hole 112h formed in the right side surface 112c.
- the sheet base 32 is attached to the package body 12. That is, when viewed in the direction (X-axis direction) orthogonal to the right side surface 112c, the first antenna conductor layer 34 is surrounded by the opening edge of the through hole 112h at a distance.
- the RFIC module 40 and a part of the second antenna conductor layer 36 are also located in the opening of the through hole 112h.
- the sheet base 32 has a size capable of closing the through hole 112 h (that is, it functions as a seal member).
- the RFID tag-attached package 110 can be provided in which the RFID tag 30 is provided so as not to impair the design.
- the first antenna conductor layer 34, the second antenna conductor layer 36, and the RFIC module 40 are provided on the sheet base 32, and the sheet base 32 is attached to the package body 12.
- the first antenna conductor layer 34, the second antenna conductor layer 36, and the RFIC module 40 are disposed in the package body 12.
- the third embodiment is different.
- the other configuration is substantially the same as that of the first embodiment described above. Therefore, components substantially the same as the components of the first embodiment described above are assigned the same reference numerals.
- FIG. 8 is a perspective view of a package with an RFID tag according to the third embodiment.
- FIG. 9 is a perspective view of the package body with the RFID tag removed.
- the appearance of the RFID tag equipped package 210 according to the third embodiment is the same as the appearance of the RFID tag equipped package 10 according to the above-described first embodiment shown in FIG.
- the package main body 212 is different from the package main body 12 of the first embodiment described above.
- the first antenna conductor layer 234 and the second antenna conductor layer 236 of the RFID tag 230 are not provided on the sheet base 232 but are provided on the package body 212.
- the first antenna conductor layer 234 and the second antenna conductor layer 236 are made of the same material as the metal layer 216. That is, the metal layer 216, the first antenna conductor layer 234, and the second antenna conductor layer 236 are formed on the outer surface of the package body 212 in the same process (for example, a printing process). Therefore, the shape of the exposed portion 212g is more complicated than the exposed portion 12g of the first embodiment described above.
- the metal layer 216 and the second antenna conductor layer 236 are directly connected. Being made of the same material, the electrical resistance between the metal layer 216 and the second antenna conductor layer 236 is substantially zero.
- the RFIC module 40 is also provided in the package body 212.
- the sheet substrate 232 serves to protect the first antenna conductor layer 234, the second antenna conductor layer 236, and the RFIC module 40.
- the RFIC module 40 may be provided on the sheet substrate 232.
- the RFIC module 40 is connected to the first and second antenna conductor layers 34 and 36 by attaching the sheet base 232 to the package body 212.
- the RFID tag-attached package 210 can be provided in which the RFID tag 230 is provided so as not to impair the design.
- Embodiment 4 differs from the above-described first embodiment in that the RFID tag is substantially transparent.
- FIG. 10 is a perspective view of a package with an RFID tag according to the fourth embodiment.
- transparent windows 314A, 314B, and 314C are provided on the front surface 312a, the right side surface 312c, and the left side surface 312d of the package body 312, respectively.
- the RFID tag 330 is attached to the right side surface 312 c of the package body 312.
- the sheet base 332, the first antenna conductor layer 334, and the second antenna conductor layer 336 are made of a transparent material.
- the first antenna conductor layer 334 and the second antenna conductor layer 336 are made of, for example, indium tin oxide (ITO).
- the sheet base material 332 is attached to the right side surface 312 c of the package body 312 such that the first antenna conductor layer 334 is disposed in the transparent window 314 B. That is, the first antenna conductor layer 334 is disposed in the transparent window 314 B which is a portion of the package body 312 where the metal layer 316 is not provided.
- the second antenna conductor layer 336 and the sheet base 332 are partially disposed in the transparent window 314B.
- the RFID tag 330 is transparent, the transparency of the transparent window 314B hardly changes even if it is disposed in the transparent window 314B. Also, even if a part of the RFID tag 330 overlaps the metal layer 316 in order to connect the contact pad portion 336 b of the second antenna conductor layer 336 with the metal layer 316, it is transparent. You can see the part. Therefore, in the case of the fourth embodiment, even if the RFID tag 330 is provided, the design of the package body 312 is hardly changed.
- the RFID tag-attached package 310 can be provided in which the RFID tag 330 is provided so as not to impair the design.
- the package body 12 is made of a paper material, that is, a non-conductive material.
- the package body is made of a conductor material.
- the RFID tag is substantially the same as that of the first embodiment.
- FIG. 11 is a perspective view of a package with an RFID tag according to the fifth embodiment of the present invention.
- the RFID tag-attached package is shown with the RFID tag removed.
- the package body 412 of the RFID tag-attached package 410 is a bag made of a sheet-like conductive material.
- the package body 412 is produced by making an aluminum sheet cylindrical and sealing its both ends.
- a through hole 412 h is formed in the package body 412. Further, a sheet-like seal member 418 made of a nonconductive material (for example, a resin material) is attached to the package body 412 in order to close the through hole 412 h.
- a nonconductive material for example, a resin material
- the RFID tag 30 is attached to the package body 412 such that the first antenna conductor layer 34 is located in the opening of the through hole 412 h, that is, disposed on the seal member 418. Thereby, the electrical connection between the first antenna conductor layer 34 and the package body 412 is avoided.
- the sheet base 32 of the RFID tag 30 has a size capable of closing the through hole 412 h of the package body 412 and is made of a resin material, the sheet base 32 blocks the through hole 412 h. It may function as a seal member. Thereby, the seal member 418 can be omitted.
- the through hole 412 h may be closed by a transparent seal member 418 to form a transparent window of the package body 412.
- the sheet base 32, the first antenna conductor layer 34, and the second antenna conductor layer 36 are made of a transparent material.
- the RFID tag-attached package 410 can be provided in which the RFID tag 30 is provided so as not to impair the design.
- the package body 12 in the RFID tag-attached package 10 is a rectangular parallelepiped box, but the embodiment of the present invention is not limited thereto.
- the shape of the package body may be cylindrical, for example.
- the package body made of non-conductive material may also be a bag as in the fifth embodiment described above.
- the package body may be a bag made of paper or resin material, the outer surface of which may be partially provided with a metal coating.
- the first antenna conductor layer 34 and the second antenna conductor layer 36 have meandering portions, but the embodiment of the present invention is not limited to this. Not limited to.
- the shapes of the first antenna conductor layer and the second antenna conductor layer correspond to the specifications of the RFID tag (communication frequency, communicable distance, etc.), and the electrical characteristics (inductance, electric length, etc.) necessary for the specifications Are modified in various ways to provide
- the RFID tag 30 is attached to the outer surface of the package body 12, but the embodiment of the present invention is not limited to this.
- an RFID tag may be provided on the inner surface of the package body 12.
- the RFID tag is attached to its inner surface before the package body is formed (prior to assembly).
- the second antenna conductor layer disposed on the inner surface side of the package body capacitively couples with the metal layer provided on the outer surface through the package body. In this case, the RFID tag is less likely to come off the package body during handling of the RFID tag-equipped package.
- an RFID tag-attached package broadly includes a package body made of a non-conductive material, a metal layer partially provided on the outer surface of the package body, And a second input / output terminal, the RFIC chip disposed in the package body, one end connected to the first input / output terminal of the RFIC chip, the other end being an open end, the metal layer provided A first antenna conductor layer disposed in the portion of the package body which is not connected, and one end is connected to the second input / output terminal of the RFIC chip, and the other end is directly connected to the metal layer And a second antenna conductor layer connected via a capacitor and disposed on the package body.
- the invention is applicable to packages that need to have an RFID tag attached.
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Abstract
This package 10 with an RFID tag comprises: a package main body 12 which is formed from a non-conductive material; a metal layer 16 which is partially provided on the outer surface of the package main body 12; an RFIC chip which is provided with first and second input/output terminals and is arranged on the package main body 12; a first antenna conductor layer 34 which has one end connected to the first input/output terminal of the RFIC chip, while having the other end act as an open end, and which is arranged in a portion 12g of the package main body 12, where the metal layer 16 is not provided; and a second antenna conductor layer 36 which has one end connected to the second input/output terminal of the RFIC chip, while having the other end connected to the metal layer 16 directly or via a capacitor, and which is arranged on the package main body 12.
Description
本発明は、RFIDタグ付きパッケージに関する。
The present invention relates to an RFID tagged package.
例えば、特許文献1には、物品の外面に対して立設するように取り付けられた無線ICデバイス(RFID(Radio-Frequency IDentification)タグ)が開示されている。この物品は少なくとも外面が金属である物品であって、RFIDタグは、その金属部分を介して無線通信を行うように構成されている。
For example, Patent Document 1 discloses a wireless IC device (RFID (Radio-Frequency Identification) tag) attached so as to stand on the outer surface of an article. The article is an article at least the outer surface of which is metal, and the RFID tag is configured to perform wireless communication via the metal portion.
ところで、特許文献1に記載されたRFIDタグは、物品に対して立設するように取り付けられるために、物品の意匠性を損なう可能性がある。物品が、例えば外面が少なくとも部分的に金属層で覆われている高級小売物品用のパッケージである場合、RFIDタグによって高級感を醸し出す高い意匠性が大きく損なわれる可能性がある。
By the way, since the RFID tag described in Patent Document 1 is attached to a product so as to stand upright, there is a possibility that the design of the product may be impaired. If the article is, for example, a package for a high-end retail article, the outer surface of which is at least partially covered by a metal layer, the RFID tag can greatly impair the high aesthetics that give it a high-class feel.
そこで、本発明は、意匠性を損なわないようにRFIDタグが設けられた、RFIDタグ付きパッケージを提供することを課題とする。
Then, this invention makes it a subject to provide the package with a RFID tag provided with the RFID tag so that the designability might not be impaired.
上記技術的課題を解決するために、本発明の一態様によれば、
RFIDタグ付きパッケージであって、
非導体材料から作製されたパッケージ本体と、
前記パッケージ本体の外面上に部分的に設けられた金属層と、
第1および第2の入出力端子を備え、前記パッケージ本体に配置されたRFICチップと、
一端が前記RFICチップの第1の入出力端子に接続され、他端が開放端であり、前記金属層が設けられていない前記パッケージ本体の部分に配置された第1のアンテナ導体層と、
一端が前記RFICチップの第2の入出力端子に接続され、他端が前記金属層に対して直接的に接続されているまたは容量を介して接続され、前記パッケージ本体に配置された第2のアンテナ導体層と、を有する、RFIDタグ付きパッケージが提供される。 In order to solve the above technical problems, according to one aspect of the present invention,
Package with RFID tag,
A package body made of a non-conductive material,
A metal layer partially provided on the outer surface of the package body;
An RFIC chip provided with the first and second input / output terminals and disposed in the package body;
A first antenna conductor layer disposed at a portion of the package body, one end of which is connected to the first input / output terminal of the RFIC chip and the other end of which is an open end, and the metal layer is not provided;
A second terminal connected to the second input / output terminal of the RFIC chip at one end and directly connected to the metal layer at the other end or via a capacitor and disposed in the package body An RFID tagged package is provided, comprising: an antenna conductor layer.
RFIDタグ付きパッケージであって、
非導体材料から作製されたパッケージ本体と、
前記パッケージ本体の外面上に部分的に設けられた金属層と、
第1および第2の入出力端子を備え、前記パッケージ本体に配置されたRFICチップと、
一端が前記RFICチップの第1の入出力端子に接続され、他端が開放端であり、前記金属層が設けられていない前記パッケージ本体の部分に配置された第1のアンテナ導体層と、
一端が前記RFICチップの第2の入出力端子に接続され、他端が前記金属層に対して直接的に接続されているまたは容量を介して接続され、前記パッケージ本体に配置された第2のアンテナ導体層と、を有する、RFIDタグ付きパッケージが提供される。 In order to solve the above technical problems, according to one aspect of the present invention,
Package with RFID tag,
A package body made of a non-conductive material,
A metal layer partially provided on the outer surface of the package body;
An RFIC chip provided with the first and second input / output terminals and disposed in the package body;
A first antenna conductor layer disposed at a portion of the package body, one end of which is connected to the first input / output terminal of the RFIC chip and the other end of which is an open end, and the metal layer is not provided;
A second terminal connected to the second input / output terminal of the RFIC chip at one end and directly connected to the metal layer at the other end or via a capacitor and disposed in the package body An RFID tagged package is provided, comprising: an antenna conductor layer.
また、本発明の別態様によれば、
RFIDタグ付きパッケージであって、
導体材料から作製され、貫通穴を備えるパッケージ本体と、
前記貫通穴を塞ぐように前記パッケージ本体に貼り付けられたシール部材と、
第1のおよび第2の入出力端子を備え、前記パッケージ本体に配置されたRFICチップと、
一端が前記RFICチップの第1の入出力端子に接続され、他端が開放端であり、前記貫通穴の開口内に位置するように前記シール部材に配置された第1のアンテナ導体層と、
一端が前記RFICチップの第2の入出力端子に接続され、他端が前記パッケージ本体に対して直接的に接続されているまたは容量を介して接続され、前記パッケージ本体に配置された第2のアンテナ導体層と、を有する、RFIDタグ付きパッケージが提供される。 Also, according to another aspect of the present invention,
Package with RFID tag,
A package body made of a conductive material and provided with through holes;
A sealing member attached to the package body to close the through hole;
An RFIC chip provided with the first and second input / output terminals and disposed in the package body;
A first antenna conductor layer disposed on the seal member such that one end is connected to the first input / output terminal of the RFIC chip, the other end is an open end, and is located within the opening of the through hole;
A second one connected to the second input / output terminal of the RFIC chip at one end, and the other end connected directly to the package body or connected via a capacitor; An RFID tagged package is provided, comprising: an antenna conductor layer.
RFIDタグ付きパッケージであって、
導体材料から作製され、貫通穴を備えるパッケージ本体と、
前記貫通穴を塞ぐように前記パッケージ本体に貼り付けられたシール部材と、
第1のおよび第2の入出力端子を備え、前記パッケージ本体に配置されたRFICチップと、
一端が前記RFICチップの第1の入出力端子に接続され、他端が開放端であり、前記貫通穴の開口内に位置するように前記シール部材に配置された第1のアンテナ導体層と、
一端が前記RFICチップの第2の入出力端子に接続され、他端が前記パッケージ本体に対して直接的に接続されているまたは容量を介して接続され、前記パッケージ本体に配置された第2のアンテナ導体層と、を有する、RFIDタグ付きパッケージが提供される。 Also, according to another aspect of the present invention,
Package with RFID tag,
A package body made of a conductive material and provided with through holes;
A sealing member attached to the package body to close the through hole;
An RFIC chip provided with the first and second input / output terminals and disposed in the package body;
A first antenna conductor layer disposed on the seal member such that one end is connected to the first input / output terminal of the RFIC chip, the other end is an open end, and is located within the opening of the through hole;
A second one connected to the second input / output terminal of the RFIC chip at one end, and the other end connected directly to the package body or connected via a capacitor; An RFID tagged package is provided, comprising: an antenna conductor layer.
本発明によれば、意匠性を損なわないようにRFIDタグが設けられた、RFIDタグ付きパッケージを提供することができる。
According to the present invention, a package with an RFID tag can be provided in which the RFID tag is provided so as not to impair the design.
本発明の一態様のRFIDタグ付きパッケージは、非導体材料から作製されたパッケージ本体と、前記パッケージ本体の外面上に部分的に設けられた金属層と、第1および第2の入出力端子を備え、前記パッケージ本体に配置されたRFICチップと、一端が前記RFICチップの第1の入出力端子に接続され、他端が開放端であり、前記金属層が設けられていない前記パッケージ本体の部分に配置された第1のアンテナ導体層と、一端が前記RFICチップの第2の入出力端子に接続され、他端が前記金属層に対して直接的に接続されているまたは容量を介して接続され、前記パッケージ本体に配置された第2のアンテナ導体層と、を有する。
The RFID tag-equipped package according to one aspect of the present invention comprises a package body made of a nonconductive material, a metal layer partially provided on the outer surface of the package body, and first and second input / output terminals. A portion of the package body having one end connected to the first input / output terminal of the RFIC chip, the other end being an open end, and the metal layer not provided And one end is connected to the second input / output terminal of the RFIC chip, and the other end is directly connected to the metal layer or via a capacitor. And a second antenna conductor layer disposed on the package body.
この一態様によれば、意匠性を損なわないようにRFIDタグが設けられた、RFIDタグ付きパッケージを提供することができる。
According to this aspect, it is possible to provide an RFID tag-attached package in which the RFID tag is provided so as not to impair the design.
例えば、前記RFIDタグ付きパッケージが、前記パッケージ本体に取り付けられるシート基材を有し、前記シート基材上に、前記RFICチップ、前記第1のアンテナ導体層、および前記第2のアンテナ導体層が設けられてもよい。
For example, the RFID tag-attached package has a sheet substrate attached to the package body, and the RFIC chip, the first antenna conductor layer, and the second antenna conductor layer are provided on the sheet substrate. It may be provided.
例えば、前記パッケージ本体が貫通穴を備え、前記第1のアンテナ導体層が貫通穴の開口内に位置するように、前記シート基材が前記パッケージ本体に取り付けられてもよい。
For example, the sheet base material may be attached to the package body such that the package body has a through hole and the first antenna conductor layer is located in the opening of the through hole.
例えば、前記パッケージ本体が透明窓を備え、前記第1のアンテナ導体層、前記第2のアンテナ導体層、および前記シート基材が、透明材料から作製され、前記透明窓に配置されてもよい。
For example, the package body may comprise a transparent window, and the first antenna conductor layer, the second antenna conductor layer, and the sheet substrate may be made of a transparent material and disposed in the transparent window.
例えば、前記第1および第2のアンテナ導体層が、前記金属層と同一の材料から作製され、前記パッケージ本体の外面上に設けられてもよい。
For example, the first and second antenna conductor layers may be made of the same material as the metal layer and provided on the outer surface of the package body.
例えば、前記パッケージ本体が、正面、背面、右側面、左側面、頂面、および底面を備える直方体形状の箱体であって、前記正面、前記背面、前記右側面、および前記左側面のいずれか1つに、前記RFICチップ、前記第1のアンテナ導体層、および前記第2のアンテナ導体層が、前記頂面と底面との対向方向に並んだ状態で配置されている。これにより、陳列棚の前方に正面を向けた状態で該陳列棚に陳列された状態のとき、RFIDタグ付きパッケージは、陳列棚の前方に電波を放射することができる。
For example, the package body is a rectangular parallelepiped box having a front surface, a back surface, a right side surface, a left side surface, a top surface, and a bottom surface, any one of the front surface, the back surface, the right side surface, and the left side surface. In one, the RFIC chip, the first antenna conductor layer, and the second antenna conductor layer are arranged in the opposing direction of the top surface and the bottom surface. Thus, the RFID tag-attached package can emit radio waves to the front of the display shelf when it is displayed on the display shelf with the front facing the front of the display shelf.
本発明の別態様のRFIDタグ付きパッケージは、導体材料から作製され、貫通穴を備えるパッケージ本体と、前記貫通穴を塞ぐように前記パッケージ本体に貼り付けられたシール部材と、第1のおよび第2の入出力端子を備え、前記パッケージ本体に配置されたRFICチップと、一端が前記RFICチップの第1の入出力端子に接続され、他端が開放端であり、前記貫通穴の開口内に位置するように前記シール部材に配置された第1のアンテナ導体層と、一端が前記RFICチップの第2の入出力端子に接続され、他端が前記パッケージ本体に対して直接的に接続されているまたは容量を介して接続され、前記パッケージ本体に配置された第2のアンテナ導体層と、を有する。
An RFID tag-attached package according to another aspect of the present invention is made of a conductive material and includes a package body provided with a through hole, a seal member attached to the package body so as to close the through hole, and The RFIC chip disposed in the package body, one end is connected to the first input / output terminal of the RFIC chip, the other end is an open end, and the opening of the through hole is provided. The first antenna conductor layer disposed on the seal member so as to be positioned, one end is connected to the second input / output terminal of the RFIC chip, and the other end is directly connected to the package body. And a second antenna conductor layer connected via a capacitor and disposed in the package body.
この別態様によれば、意匠性を損なわないようにRFIDタグが設けられた、RFIDタグ付きパッケージを提供することができる。
According to this aspect, it is possible to provide an RFID tag-attached package in which the RFID tag is provided so as not to impair the design.
以下、本発明の実施の形態について、図面を参照しながら説明する。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(実施の形態1)
図1は本発明の実施の形態1に係るRFID(Radio-Frequency IDentification)タグ付きパッケージを示す斜視図である。なお、図中において、X-Y-Z座標系は、発明の理解を容易にするためのものであって、発明を限定するものではない。 Embodiment 1
FIG. 1 is a perspective view showing a package with an RFID (Radio-Frequency IDentification) tag according to Embodiment 1 of the present invention. In the drawings, the XYZ coordinate system is for the purpose of facilitating the understanding of the invention, and does not limit the invention.
図1は本発明の実施の形態1に係るRFID(Radio-Frequency IDentification)タグ付きパッケージを示す斜視図である。なお、図中において、X-Y-Z座標系は、発明の理解を容易にするためのものであって、発明を限定するものではない。 Embodiment 1
FIG. 1 is a perspective view showing a package with an RFID (Radio-Frequency IDentification) tag according to Embodiment 1 of the present invention. In the drawings, the XYZ coordinate system is for the purpose of facilitating the understanding of the invention, and does not limit the invention.
図1に示すように、RFIDタグ付きパッケージ10は、本実施の形態1の場合、直方体形状の箱体であるパッケージ本体12と、そのパッケージ本体12に取り付けられたシート状のRFIDタグ30とを有する。
As shown in FIG. 1, in the case of the first embodiment, the RFID tag-equipped package 10 includes a package body 12 which is a rectangular parallelepiped box body, and a sheet-like RFID tag 30 attached to the package body 12. Have.
図2は、RFIDタグ30を取り外した状態のパッケージ本体12を示している。パッケージ本体12は、店舗の陳列棚に陳列されるときに該陳列棚の前方に向けられる正面12a、正面12aに対して反対側の背面12b、正面12aと背面12bとの間の右側面12cと左側面12d、陳列棚に対向する底面12e、および底面12eに対して反対側の頂面12fを備える。
FIG. 2 shows the package body 12 with the RFID tag 30 removed. The package body 12 has a front surface 12a which is directed to the front of the display shelf when displayed on a display shelf of a store, a back surface 12b opposite to the front surface 12a, and a right side surface 12c between the front surface 12a and the back surface 12b. A left side 12d, a bottom 12e opposite to the display shelf, and a top 12f opposite to the bottom 12e are provided.
また、パッケージ本体12は、非導体材料、例えば紙材料や樹脂材料から作製されている。本実施の形態1の場合、パッケージ本体12は紙材料から作製されている。さらに、本実施の形態1の場合、RFIDタグ付きパッケージ10内に収容された物品が視認できるように、透明(または半透明)シート、例えば樹脂シートから作製された透明窓14を備える。透明窓14は、パッケージ本体12の正面12aに設けられている。
Also, the package body 12 is made of a non-conductive material, such as a paper material or a resin material. In the case of the first embodiment, the package body 12 is made of a paper material. Furthermore, in the case of the first embodiment, the transparent window 14 made of a transparent (or translucent) sheet, for example, a resin sheet, is provided so that the articles contained in the RFID tag-attached package 10 can be viewed. The transparent window 14 is provided on the front surface 12 a of the package body 12.
パッケージ本体12の外面上には、金属層16が部分的に設けられている。金属層16は、RFIDタグ付きパッケージ10に収容された物品の高級感を演出するために、パッケージ本体12に設けられている。この金属層16により、パッケージ本体12は金属光沢を備える。
A metal layer 16 is partially provided on the outer surface of the package body 12. The metal layer 16 is provided on the package body 12 in order to create a sense of quality of the articles contained in the RFID tag-attached package 10. The package body 12 has a metallic luster due to the metal layer 16.
具体的には、本実施の形態1の場合、金属層16は、例えば、アルミニウムや銀などの金属粒子を含むインクをパッケージ本体12(パッケージ本体12に形成される前のシート状部材)に印刷することによって形成されている。なお、本実施の形態1の場合、背面12b、左側面12d、底面12e、および頂面12fについては、全面にわたって金属層16が形成されている。正面12aについては、透明窓14を除いて全面にわたって金属層16が形成されている。右側面12cについては、一部分(露出部分)12gを除いて金属層16が形成されている。すなわち、パッケージ本体12の外面のほとんどが金属層16に覆われている。
Specifically, in the case of the first embodiment, the metal layer 16 prints, for example, an ink containing metal particles such as aluminum or silver on the package body 12 (sheet-like member before being formed on the package body 12) It is formed by doing. In the case of the first embodiment, the metal layer 16 is formed on the entire surface of the back surface 12b, the left side surface 12d, the bottom surface 12e, and the top surface 12f. For the front surface 12a, the metal layer 16 is formed over the entire surface except for the transparent window 14. The metal layer 16 is formed on the right side surface 12c except for a portion (exposed portion) 12g. That is, most of the outer surface of the package body 12 is covered by the metal layer 16.
パッケージ本体12の右側面12cにおける金属層16が設けられていない露出部分12gには、RFIDタグ30が取り付けられる。そのRFIDタグ30について説明する。
An RFID tag 30 is attached to the exposed portion 12 g of the right side surface 12 c of the package body 12 where the metal layer 16 is not provided. The RFID tag 30 will be described.
図3は、RFIDタグ30の斜視図である。また、図4は、RFIDタグ30の等価回路図である。
FIG. 3 is a perspective view of the RFID tag 30. 4 is an equivalent circuit diagram of the RFID tag 30. As shown in FIG.
図3に示すように、RFIDタグ30は、シート基材32と、シート基材32上に設けられた第1および第2のアンテナ導体層34、36と、RFIC(Radio-Frequency Integrated Circuit)モジュール40とを有する。
As shown in FIG. 3, the RFID tag 30 includes a sheet base 32, first and second antenna conductor layers 34 and 36 provided on the sheet base 32, and an RFIC (Radio-Frequency Integrated Circuit) module. And 40.
シート基材32は、本実施の形態1の場合、紙材料または樹脂材料などの非導体材料から作製された矩形状のシートであって、第1のアンテナ導体層34、第2のアンテナ導体層36、およびRFICモジュール40が設けられる主面32aと、その主面32aに対して反対側の裏面32bとを備える。図1に示すように、シート基材32は、主面32aを介してパッケージ本体12に取り付けられる。シート基材32の裏面32bは、外部に露出し、RFIDタグ付きパッケージ10の外面の一部を構成する。なお、その裏面32bに、バーコードや商品の成分表などが印刷されてもよい。また、露出部分12gがRFIDタグ付きパッケージ10の意匠性に影響する場合、シート基材32は、図1に示すように、パッケージ本体12の露出部分12gを完全に覆い隠すことができる大きさを備えているのが好ましい。
In the case of the first embodiment, the sheet base 32 is a rectangular sheet made of a nonconductive material such as a paper material or a resin material, and includes the first antenna conductor layer 34 and the second antenna conductor layer. And a main surface 32a on which the RFIC module 40 is provided, and a back surface 32b opposite to the main surface 32a. As shown in FIG. 1, the sheet base 32 is attached to the package body 12 via the main surface 32 a. The back surface 32 b of the sheet base 32 is exposed to the outside and constitutes a part of the outer surface of the RFID tag-attached package 10. A barcode or a component table of a product may be printed on the back surface 32b. In addition, when the exposed portion 12g affects the design of the RFID tag-attached package 10, the sheet substrate 32 has a size capable of completely covering the exposed portion 12g of the package body 12 as shown in FIG. It is preferable to have.
第1および第2のアンテナ導体層34、36は、アルミニウム、銀、銅など導体材料から作製されたパターン層であって、例えば、シート基材32の主面32aにパターン印刷されている。
The first and second antenna conductor layers 34 and 36 are pattern layers made of a conductor material such as aluminum, silver, copper, etc., and are pattern printed, for example, on the major surface 32 a of the sheet substrate 32.
本実施の形態1の場合、図3に示すように、第1のアンテナ導体層34は、シート基材32の長手方向(Y軸方向)の一端側に配置されている。また、第1のアンテナ導体層34は、詳細は後述するが、RFICモジュール40に接続される一端(ランド部)34aと、開放端である他端34bとを備える。なお、本実施の形態1の場合、第1のアンテナ導体層34におけるランド部34aと開放端34bとの間の部分は、ミアンダ状に形成されている。このようにミアンダ状に形成することにより、詳細は後述するが、第1のアンテナ導体層34は、RFIDタグ30が所定の通信周波数で良好に無線通信するための励振器として機能するために必要な電気長を備える。
In the case of the first embodiment, as shown in FIG. 3, the first antenna conductor layer 34 is disposed on one end side of the sheet base 32 in the longitudinal direction (Y-axis direction). The first antenna conductor layer 34 has one end (land portion) 34 a connected to the RFIC module 40 and the other end 34 b being an open end, which will be described in detail later. In the first embodiment, the portion of the first antenna conductor layer 34 between the land portion 34 a and the open end 34 b is formed in a meander shape. By forming in a meander shape in this manner, the details will be described later, but the first antenna conductor layer 34 is necessary for the RFID tag 30 to function as an exciter for good wireless communication at a predetermined communication frequency. Electric length.
また、本実施の形態1の場合、図1に示すように、シート基材32がパッケージ本体12に取り付けられたときに第1のアンテナ導体層34が露出部分12gに配置されるように、第1のアンテナ導体層34がシート基材32に設けられている。これにより、金属層16と第1のアンテナ導体層34との電気的な接続が回避されている。また、第1のアンテナ導体層34の開放端34bが露出部分12gの概ね中央に位置するように、第1のアンテナ導体層34はシート基材32に配置されている。これは、金属層16と開放端34bとの間の容量結合を回避するためである。
Further, in the case of the first embodiment, as shown in FIG. 1, the first antenna conductor layer 34 is disposed on the exposed portion 12 g when the sheet base 32 is attached to the package body 12. One antenna conductor layer 34 is provided on the sheet substrate 32. Thereby, the electrical connection between the metal layer 16 and the first antenna conductor layer 34 is avoided. In addition, the first antenna conductor layer 34 is disposed on the sheet substrate 32 such that the open end 34 b of the first antenna conductor layer 34 is located approximately at the center of the exposed portion 12 g. This is to avoid capacitive coupling between the metal layer 16 and the open end 34b.
本実施の形態1の場合、図3に示すように、第2のアンテナ導体層36は、第1のアンテナ導体層34に対して距離をあけて独立し、シート基材32の長手方向(Y軸方向)の他端側に配置されている。また、第2のアンテナ導体層36は、詳細は後述するが、RFICモジュール40に接続される一端(ランド部)36aと、金属層16に接続される他端(コンタクトパッド部)36bとを備える。なお、本実施の形態1の場合、第2のアンテナ導体層36におけるランド部36aとコンタクトパッド部36bとの間の部分は、ミアンダ状に形成されている。ミアンダ状に形成することにより、図4に示すように、第2のアンテナ導体層36は、インダクタンスL5を備える。
In the case of the first embodiment, as shown in FIG. 3, the second antenna conductor layer 36 is independent of the first antenna conductor layer 34 at a distance, and the longitudinal direction of the sheet base 32 (Y It is arranged on the other end side of the axial direction). The second antenna conductor layer 36 has one end (land portion) 36 a connected to the RFIC module 40 and the other end (contact pad portion) 36 b connected to the metal layer 16, which will be described in detail later. . In the case of the first embodiment, the portion of the second antenna conductor layer 36 between the land portion 36a and the contact pad portion 36b is formed in a meander shape. By forming in a meander shape, as shown in FIG. 4, the second antenna conductor layer 36 has an inductance L5.
また、本実施の形態1の場合、図1に示すように、シート基材32がパッケージ本体12に取り付けられたときに第2のアンテナ導体層36がコンタクトパッド部36bを除いて露出部分12gに配置されるように、第2のアンテナ導体層36がシート基材32に設けられている。すなわち、コンタクトパッド部36bは、金属層16に重なり、それにより金属層16と電気的に接続する。本実施の形態1の場合、シート基材32は、絶縁性接着剤(図示せず)を介して、パッケージ本体12に取り付けられる(貼り付けられる)。その結果として、図4に示すように、コンタクトパッド部36bと金属層16とが容量C2を介して接続する(容量結合する)。
Further, in the case of the first embodiment, as shown in FIG. 1, when the sheet base 32 is attached to the package body 12, the second antenna conductor layer 36 is exposed to the exposed portion 12g except the contact pad portion 36b. A second antenna conductor layer 36 is provided on the sheet substrate 32 so as to be disposed. That is, the contact pad portion 36 b overlaps the metal layer 16 and thereby electrically connects to the metal layer 16. In the case of the first embodiment, the sheet base 32 is attached (adhered) to the package body 12 via the insulating adhesive (not shown). As a result, as shown in FIG. 4, contact pad portion 36b and metal layer 16 are connected (capacitively coupled) via capacitance C2.
図3および図4に示すように、RFICモジュール40は、例えば900MHz帯、すなわちUHF帯の通信周波数で無線通信を行う無線通信デバイスであって、シート基材32の主面32aに設けられている。また、RFICモジュール40は、無線通信を行うために、第1のアンテナ導体層34と第2のアンテナ導体層36とに接続されている。このRFICモジュール40について、図5を参照しながら説明する。
As shown in FIGS. 3 and 4, the RFIC module 40 is a wireless communication device that performs wireless communication at a communication frequency of, for example, 900 MHz band, that is, UHF band, and is provided on the main surface 32 a of the sheet base 32. . Further, the RFIC module 40 is connected to the first antenna conductor layer 34 and the second antenna conductor layer 36 in order to perform wireless communication. The RFIC module 40 will be described with reference to FIG.
図5は、RFICモジュール40の分解斜視図である。
FIG. 5 is an exploded perspective view of the RFIC module 40. As shown in FIG.
図5に示すように、本実施の形態1の場合、RFICモジュール40は、三層からなる多層基板で構成されている。具体的には、RFICモジュール40は、ポリイミドや液晶ポリマなどの樹脂材料から作製されて可撓性を備える絶縁シート42A、42B、および42Cを積層して構成されている。なお、図5は、図3に示すRFICモジュール40を裏返して分解した状態を示している。
As shown in FIG. 5, in the case of the first embodiment, the RFIC module 40 is configured of a multilayer substrate consisting of three layers. Specifically, the RFIC module 40 is configured by laminating flexible insulating sheets 42A, 42B, and 42C made of resin materials such as polyimide and liquid crystal polymer. 5 shows the RFIC module 40 shown in FIG. 3 in a state of being turned over and disassembled.
図5に示すように、RFICモジュール40は、RFICチップ44と、複数のインダクタンス素子46A、46B、46C、および46Dと、外部接続端子48、50とを有する。本実施の形態1の場合、インダクタンス素子46A~46Dと外部接続端子48、50は、絶縁シート42A~42C上に形成され、銅などの導体材料から作製された導体パターンから構成されている。
As shown in FIG. 5, the RFIC module 40 has an RFIC chip 44, a plurality of inductance elements 46A, 46B, 46C, and 46D, and external connection terminals 48, 50. In the case of the first embodiment, the inductance elements 46A to 46D and the external connection terminals 48 and 50 are formed on the insulating sheets 42A to 42C, and are formed of conductor patterns made of a conductor material such as copper.
図5に示すように、RFICチップ44は、絶縁シート42C上の長手方向(X軸方向)の中央部に実装されている。RFICチップ44は、シリコン等の半導体を素材とする半導体基板に各種の素子を内蔵した構造を有する。また、RFICチップ44は、第1の入出力端子44aと第2の入出力端子44bとを備える。さらに、図4に示すように、RFICチップ44は、内部容量(キャパシタンス:RFICチップ自身が持つ自己容量)C1を備える。
As shown in FIG. 5, the RFIC chip 44 is mounted at the central portion in the longitudinal direction (X-axis direction) on the insulating sheet 42C. The RFIC chip 44 has a structure in which various elements are incorporated in a semiconductor substrate made of a semiconductor such as silicon. The RFIC chip 44 further includes a first input / output terminal 44a and a second input / output terminal 44b. Furthermore, as shown in FIG. 4, the RFIC chip 44 has an internal capacitance (capacitance: self-capacitance of the RFIC chip itself) C1.
図5に示すように、インダクタンス素子(第1のインダクタンス素子)46Aは、絶縁シート42Cの長手方向(X軸方向)の一方側で、絶縁シート42C上に渦巻きコイル状に設けられた導体パターンから構成されている。また、図4に示すように、インダクタンス素子46Aは、インダクタンスL1を備える。インダクタンス素子46Aの一端(コイル外側の端)には、RFICチップ44の第1の入出力端子44aに接続されるランド46Aaが設けられている。なお、他端(コイル中心側の端)にも、ランド46Abが設けられている。
As shown in FIG. 5, the inductance element (first inductance element) 46A is formed of a conductor pattern provided in a spiral coil shape on the insulation sheet 42C on one side in the longitudinal direction (X-axis direction) of the insulation sheet 42C. It is configured. Further, as shown in FIG. 4, the inductance element 46A includes an inductance L1. A land 46Aa connected to the first input / output terminal 44a of the RFIC chip 44 is provided at one end (the end outside the coil) of the inductance element 46A. A land 46Ab is also provided at the other end (end on the coil center side).
図5に示すように、インダクタンス素子(第2のインダクタンス素子)46Bは、絶縁シート42Cの長手方向(X軸方向)の他方側で、絶縁シート42C上に渦巻きコイル状に設けられた導体パターンから構成されている。また、図4に示すように、インダクタンス素子46Bは、インダクタンスL2を備える。インダクタンス素子46Bの一端(コイル外側の端)には、RFICチップ44の第2の入出力端子44bに接続されるランド46Baが設けられている。なお、他端(コイル中心側の端)にも、ランド46Bbが設けられている。
As shown in FIG. 5, the inductance element (second inductance element) 46B is provided on the other side of the insulating sheet 42C in the longitudinal direction (X-axis direction) from the conductor pattern provided in a spiral coil shape on the insulating sheet 42C. It is configured. Further, as shown in FIG. 4, the inductance element 46B includes an inductance L2. A land 46Ba connected to the second input / output terminal 44b of the RFIC chip 44 is provided at one end (end outside the coil) of the inductance element 46B. A land 46Bb is also provided at the other end (end on the coil center side).
図5に示すように、インダクタンス素子(第3のインダクタンス素子)46Cは、絶縁シート42Bの長手方向(X軸方向)の一方側で、絶縁シート42B上に渦巻きコイル状に設けられた導体パターンから構成されている。また、インダクタンス素子46Cは、積層方向(Z軸方向)にインダクタンス素子46Aに対して対向している。さらに、図4に示すように、インダクタンス素子46Cは、インダクタンスL3を備える。インダクタンス素子46Cの一端(コイル中心側の端)には、ランド46Caが設けられている。このランド46Caは、絶縁シート42Bを貫通するスルーホール導体などの層間接続導体52を介して、絶縁シート42C上のインダクタンス素子46Aのランド46Abに接続されている。
As shown in FIG. 5, an inductance element (third inductance element) 46C is formed of a conductor pattern provided in a spiral coil shape on the insulation sheet 42B on one side in the longitudinal direction (X-axis direction) of the insulation sheet 42B. It is configured. Further, the inductance element 46C is opposed to the inductance element 46A in the stacking direction (Z-axis direction). Furthermore, as shown in FIG. 4, the inductance element 46C includes an inductance L3. A land 46Ca is provided at one end (end on the coil center side) of the inductance element 46C. The land 46Ca is connected to the land 46Ab of the inductance element 46A on the insulating sheet 42C through the interlayer connecting conductor 52 such as a through hole conductor penetrating the insulating sheet 42B.
図5に示すように、インダクタンス素子(第4のインダクタンス素子)46Dは、絶縁シート42Bの長手方向(X軸方向)の他方側で、絶縁シート42B上に渦巻きコイル状に設けられた導体パターンから構成されている。また、インダクタンス素子46Dは、積層方向(Z軸方向)にインダクタンス素子46Bに対して対向している。さらに、図4に示すように、インダクタンス素子46Dは、インダクタンスL4を備える。インダクタンス素子46Dの一端(コイル中心側の端)には、ランド46Daが設けられている。このランド46Daは、絶縁シート42Bを貫通するスルーホール導体などの層間接続導体54を介して、絶縁シート42C上のインダクタンス素子46Bのランド46Bbに接続されている。
As shown in FIG. 5, an inductance element (fourth inductance element) 46D is provided on the other side of the insulating sheet 42B in the longitudinal direction (X-axis direction) from the conductor pattern provided in a spiral coil shape on the insulating sheet 42B. It is configured. Further, the inductance element 46D is opposed to the inductance element 46B in the stacking direction (Z-axis direction). Furthermore, as shown in FIG. 4, the inductance element 46D includes an inductance L4. A land 46Da is provided at one end (end on the coil center side) of the inductance element 46D. The land 46Da is connected to the land 46Bb of the inductance element 46B on the insulating sheet 42C via the interlayer connection conductor 54 such as a through hole conductor penetrating the insulating sheet 42B.
なお、絶縁シート42B上のインダクタンス素子46C、46Dは、1つの導体パターンとして一体化されている。すなわち、それぞれの他端(コイル外側の端)同士が接続されている。また、絶縁シート42Bには、絶縁シート42C上に実装されたRFICチップ44が収容される貫通穴42Baが形成されている。
The inductance elements 46C and 46D on the insulating sheet 42B are integrated as one conductor pattern. That is, the respective other ends (ends outside the coil) are connected to each other. Further, through holes 42Ba in which the RFIC chips 44 mounted on the insulating sheet 42C are accommodated are formed in the insulating sheet 42B.
図5に示すように、外部接続端子48、50は、絶縁シート42A上に設けられた導体パターンから構成されている。また、外部接続端子48、50は、絶縁シート42Aの長手方向(X軸方向)に対向している。
As shown in FIG. 5, the external connection terminals 48 and 50 are formed of a conductor pattern provided on the insulating sheet 42A. Further, the external connection terminals 48 and 50 are opposed in the longitudinal direction (X-axis direction) of the insulating sheet 42A.
一方の外部接続端子48は、絶縁シート42Aを貫通するスルーホール導体などの層間接続導体56を介して、絶縁シート42B上のインダクタンス素子46Cのランド46Caに接続されている。
One external connection terminal 48 is connected to the land 46Ca of the inductance element 46C on the insulating sheet 42B via an interlayer connecting conductor 56 such as a through hole conductor penetrating the insulating sheet 42A.
他方の外部接続端子50は、絶縁シート42Aを貫通するスルーホール導体などの層間接続導体58を介して、絶縁シート42B上のインダクタンス素子46Dのランド46Daに接続されている。
The other external connection terminal 50 is connected to the land 46 Da of the inductance element 46 D on the insulating sheet 42 B via an interlayer connecting conductor 58 such as a through hole conductor penetrating the insulating sheet 42 A.
一方の外部接続端子48は、第2のアンテナ導体層36のランド部36aに、例えばはんだなどを介して接続される。同様に、他方の外部接続端子50は、第1のアンテナ導体層34のランド部34aに、例えばはんだなどを介して接続される。
One external connection terminal 48 is connected to the land portion 36 a of the second antenna conductor layer 36 via, for example, a solder. Similarly, the other external connection terminal 50 is connected to the land 34 a of the first antenna conductor layer 34 via, for example, a solder.
なお、RFICチップ44は、半導体基板で構成されている。また、RFICチップ44は、インダクタンス素子46A、46Bの間と、インダクタンス素子46C、46Dの間に存在する。このRFICチップ44がシールドとして機能することにより、絶縁シート42C上に設けられた渦巻コイル状のインダクタンス素子46A、46Bの間での磁界結合および容量結合が抑制される。同様に、絶縁シート42B上に設けられた渦巻コイル状のインダクタンス素子46C、46Dの間での磁界結合および容量結合が抑制される。その結果、通信信号の通過帯域が狭くなることが抑制される。
The RFIC chip 44 is composed of a semiconductor substrate. Further, the RFIC chip 44 exists between the inductance elements 46A and 46B and between the inductance elements 46C and 46D. The RFIC chip 44 functions as a shield, thereby suppressing magnetic field coupling and capacitive coupling between the spiral coil inductance elements 46A and 46B provided on the insulating sheet 42C. Similarly, magnetic field coupling and capacitive coupling between the spiral coiled inductance elements 46C and 46D provided on the insulating sheet 42B are suppressed. As a result, narrowing of the pass band of the communication signal is suppressed.
図4に示すように、容量C1(RFICチップ44の内部容量)とインダクタンスL1~L4(4つのインダクタンス素子のインダクタンス)により、RFICチップ44と第1および第2のアンテナ導体層34、36との間の整合をとる整合回路が構成されている。
As shown in FIG. 4, the capacitance C1 (internal capacitance of the RFIC chip 44) and the inductances L1 to L4 (inductances of four inductance elements) allow the RFIC chip 44 and the first and second antenna conductor layers 34 and 36 to A matching circuit for matching between the two is configured.
これまで説明してきた構成によれば、RFIDタグ30は、パッケージ本体12の金属層16を介して、外部の無線通信装置(例えば、リーダ/ライタ装置)と電波をやりとりする。
According to the configuration described above, the RFID tag 30 exchanges radio waves with an external wireless communication device (for example, a reader / writer device) via the metal layer 16 of the package body 12.
なお、第1のアンテナ導体層34は、実質的に、第2のアンテナ導体層36を励振させる(第2のアンテナ導体層36を介して金属層16から電波を放射させる)励振器として機能する。そのために、第1のアンテナ導体層34は、ミアンダ状に形成されて励振器として機能するための電気長を備える。
The first antenna conductor layer 34 substantially functions as an exciter for exciting the second antenna conductor layer 36 (for radiating radio waves from the metal layer 16 through the second antenna conductor layer 36). . To that end, the first antenna conductor layer 34 is formed in a meander shape and has an electrical length for functioning as an exciter.
例えば、第2のアンテナ導体層36または金属層16を介して電波を受信すると、これらに起電力が生じ、その起電力によってRFICモジュール40のRFICチップ44が駆動する。駆動したRFICチップ44は、その記憶部に記憶されたデータを、第2のアンテナ導体層36または金属層16を介して送信する。
For example, when a radio wave is received through the second antenna conductor layer 36 or the metal layer 16, an electromotive force is generated in them, and the RFIC chip 44 of the RFIC module 40 is driven by the electromotive force. The driven RFIC chip 44 transmits the data stored in the storage unit via the second antenna conductor layer 36 or the metal layer 16.
また、本実施の形態1の場合、図1に示すように、第1のアンテナ導体層34、第2のアンテナ導体層36、およびRFICモジュール40(すなわちRFICチップ44)が、RFIDタグ付きパッケージ10(パッケージ本体12)における頂面12fと底面12eとの対向方向(Y軸方向)に並んでいる。また、これらが右側面12cに配置されている。それにより、正面12a、背面12b、右側面12c、および左側面12d上の金属層16から電波が実質的に放射される。すなわち、頂面12fと底面12eからの電波の放射が抑制されている。その結果として、底面12eが陳列棚に接触した状態で該陳列棚に載置されているRFIDタグ付きパッケージ10のRFIDタグ30を、陳列棚の前方のみならず後方からも読み取ることができる。なお、頂面12fおよび底面12eから電波が放射される場合、RFIDタグ付きパッケージ10の上方の陳列棚と下方の陳列棚が、シールドとして機能して無線通信を妨害しうる。
Further, in the case of the first embodiment, as shown in FIG. 1, the first antenna conductor layer 34, the second antenna conductor layer 36, and the RFIC module 40 (that is, the RFIC chip 44) They are arranged in the opposing direction (Y-axis direction) of the top surface 12 f and the bottom surface 12 e of (package body 12). Moreover, these are arrange | positioned at the right side 12c. As a result, radio waves are substantially emitted from the metal layer 16 on the front surface 12a, the back surface 12b, the right side surface 12c, and the left side surface 12d. That is, radiation of radio waves from the top surface 12f and the bottom surface 12e is suppressed. As a result, the RFID tag 30 of the RFID tag-attached package 10 placed on the display shelf with the bottom surface 12e in contact with the display shelf can be read not only from the front but also from the rear of the display shelf. When radio waves are emitted from the top surface 12 f and the bottom surface 12 e, the display shelf above the RFID tag-equipped package 10 and the display shelf below can function as a shield to interfere with wireless communication.
このような本実施の形態1によれば、意匠性を損なわないようにRFIDタグ30が設けられた、RFIDタグ付きパッケージ10を提供することができる。具体的には、パッケージ本体12の外観形状を実質的に変化させることなくRFIDタグ30が設けられたRFIDタグ付きパッケージ10を提供することができる。
According to the first embodiment, the RFID tag-attached package 10 can be provided in which the RFID tag 30 is provided so as not to impair the design. Specifically, the RFID tag-equipped package 10 provided with the RFID tag 30 can be provided without substantially changing the external shape of the package body 12.
(実施の形態2)
上述の実施の形態1の場合、図1および図2に示すように、第1のアンテナ導体層34は、金属層16が設けられていないパッケージ本体12の露出部分12gに配置されている。しかし、本実施の形態2は異なる。その他の構成については、上述の実施の形態1と実質的に同一である。そのため、上述の実施の形態1の構成要素と実質的に同一の構成要素には、同一の符号が付されている。 Second Embodiment
In the case of Embodiment 1 described above, as shown in FIGS. 1 and 2, the firstantenna conductor layer 34 is disposed on the exposed portion 12 g of the package body 12 in which the metal layer 16 is not provided. However, the second embodiment is different. The other configuration is substantially the same as that of the first embodiment described above. Therefore, components substantially the same as the components of the first embodiment described above are assigned the same reference numerals.
上述の実施の形態1の場合、図1および図2に示すように、第1のアンテナ導体層34は、金属層16が設けられていないパッケージ本体12の露出部分12gに配置されている。しかし、本実施の形態2は異なる。その他の構成については、上述の実施の形態1と実質的に同一である。そのため、上述の実施の形態1の構成要素と実質的に同一の構成要素には、同一の符号が付されている。 Second Embodiment
In the case of Embodiment 1 described above, as shown in FIGS. 1 and 2, the first
図6は、本実施の形態2に係るRFIDタグ付きパッケージの斜視図である。図7は、RFIDタグを取り外した状態のパッケージ本体の斜視図である。
FIG. 6 is a perspective view of a package with an RFID tag according to the second embodiment. FIG. 7 is a perspective view of the package body with the RFID tag removed.
図6に示すように、本実施の形態2に係るRFIDタグ付きパッケージ110の外観は、図1に示す上述の実施の形態1に係るRFIDタグ付きパッケージ10の外観と同じである。ただし、図7に示すように、パッケージ本体112が、上述の実施の形態1のパッケージ本体12と異なる。
As shown in FIG. 6, the appearance of the RFID tag equipped package 110 according to the second embodiment is the same as the appearance of the RFID tag equipped package 10 according to the above-described first embodiment shown in FIG. However, as shown in FIG. 7, the package body 112 is different from the package body 12 of the first embodiment described above.
具体的には、本実施の形態2の場合、図7に示すように、パッケージ本体112は貫通穴112hを備える。当然ながら、貫通穴112hは、金属層116が設けられていないパッケージ本体112の部分である。
Specifically, in the case of the second embodiment, as shown in FIG. 7, the package body 112 is provided with a through hole 112h. Naturally, the through hole 112 h is a portion of the package body 112 where the metal layer 116 is not provided.
具体的には、図6に示すように、右側面112cに形成された貫通穴112hの開口内に第1のアンテナ導体層34が位置するように、その第1のアンテナ導体層34が設けられたシート基材32がパッケージ本体12に取り付けられている。すなわち、右側面112cと直交する方向(X軸方向)に見た場合、第1のアンテナ導体層34が、貫通穴112hの開口縁に距離をあけて囲まれている。なお、本実施の形態2の場合、RFICモジュール40と第2のアンテナ導体層36の一部(コンタクトパッド部36bを除く)も、貫通穴112hの開口内に位置する。また、シート基材32は、貫通穴112hを塞ぐことができる大きさを備える(すなわち、シール部材として機能する)。
Specifically, as shown in FIG. 6, the first antenna conductor layer 34 is provided such that the first antenna conductor layer 34 is located in the opening of the through hole 112h formed in the right side surface 112c. The sheet base 32 is attached to the package body 12. That is, when viewed in the direction (X-axis direction) orthogonal to the right side surface 112c, the first antenna conductor layer 34 is surrounded by the opening edge of the through hole 112h at a distance. In the case of the second embodiment, the RFIC module 40 and a part of the second antenna conductor layer 36 (except for the contact pad portion 36b) are also located in the opening of the through hole 112h. Further, the sheet base 32 has a size capable of closing the through hole 112 h (that is, it functions as a seal member).
本実施の形態2も、上述の実施の形態1と同様に、意匠性を損なわないようにRFIDタグ30が設けられた、RFIDタグ付きパッケージ110を提供することができる。
Also in the second embodiment, as in the above-described first embodiment, the RFID tag-attached package 110 can be provided in which the RFID tag 30 is provided so as not to impair the design.
(実施の形態3)
上述の実施の形態1の場合、第1のアンテナ導体層34、第2のアンテナ導体層36、およびRFICモジュール40はシート基材32に設けられ、そのシート基材32をパッケージ本体12に取り付けることにより、第1のアンテナ導体層34、第2のアンテナ導体層36、およびRFICモジュール40はパッケージ本体12に配置されている。しかし、本実施の形態3は異なる。その他の構成については、上述の実施の形態1と実質的に同一である。そのため、上述の実施の形態1の構成要素と実質的に同一の構成要素には、同一の符号が付されている。 Third Embodiment
In the case of the first embodiment described above, the firstantenna conductor layer 34, the second antenna conductor layer 36, and the RFIC module 40 are provided on the sheet base 32, and the sheet base 32 is attached to the package body 12. Thus, the first antenna conductor layer 34, the second antenna conductor layer 36, and the RFIC module 40 are disposed in the package body 12. However, the third embodiment is different. The other configuration is substantially the same as that of the first embodiment described above. Therefore, components substantially the same as the components of the first embodiment described above are assigned the same reference numerals.
上述の実施の形態1の場合、第1のアンテナ導体層34、第2のアンテナ導体層36、およびRFICモジュール40はシート基材32に設けられ、そのシート基材32をパッケージ本体12に取り付けることにより、第1のアンテナ導体層34、第2のアンテナ導体層36、およびRFICモジュール40はパッケージ本体12に配置されている。しかし、本実施の形態3は異なる。その他の構成については、上述の実施の形態1と実質的に同一である。そのため、上述の実施の形態1の構成要素と実質的に同一の構成要素には、同一の符号が付されている。 Third Embodiment
In the case of the first embodiment described above, the first
図8は、本実施の形態3に係るRFIDタグ付きパッケージの斜視図である。図9は、RFIDタグを取り外した状態のパッケージ本体の斜視図である。
FIG. 8 is a perspective view of a package with an RFID tag according to the third embodiment. FIG. 9 is a perspective view of the package body with the RFID tag removed.
図8に示すように、本実施の形態3に係るRFIDタグ付きパッケージ210の外観は、図1に示す上述の実施の形態1に係るRFIDタグ付きパッケージ10の外観と同じである。ただし、図9に示すように、パッケージ本体212が、上述の実施の形態1のパッケージ本体12と異なる。
As shown in FIG. 8, the appearance of the RFID tag equipped package 210 according to the third embodiment is the same as the appearance of the RFID tag equipped package 10 according to the above-described first embodiment shown in FIG. However, as shown in FIG. 9, the package main body 212 is different from the package main body 12 of the first embodiment described above.
図9に示すように、RFIDタグ230の第1のアンテナ導体層234と第2のアンテナ導体層236は、シート基材232に設けられておらず、パッケージ本体212に設けられている。具体的に言えば、第1のアンテナ導体層234と第2のアンテナ導体層236が、金属層216と同一の材料から作製されている。すなわち、金属層216、第1のアンテナ導体層234、および第2のアンテナ導体層236は、同一の工程(例えば、印刷工程)で、パッケージ本体212の外面に形成されている。そのため、露出部分212gの形状は、上述の実施の形態1の露出部分12gに比べて複雑である。
As shown in FIG. 9, the first antenna conductor layer 234 and the second antenna conductor layer 236 of the RFID tag 230 are not provided on the sheet base 232 but are provided on the package body 212. Specifically, the first antenna conductor layer 234 and the second antenna conductor layer 236 are made of the same material as the metal layer 216. That is, the metal layer 216, the first antenna conductor layer 234, and the second antenna conductor layer 236 are formed on the outer surface of the package body 212 in the same process (for example, a printing process). Therefore, the shape of the exposed portion 212g is more complicated than the exposed portion 12g of the first embodiment described above.
また、本実施の形態3の場合、金属層216と第2のアンテナ導体層236は直接的に接続されている。同一材料から作製されているために、金属層216と第2のアンテナ導体層236との間の電気抵抗は実質的にゼロである。
Further, in the case of the third embodiment, the metal layer 216 and the second antenna conductor layer 236 are directly connected. Being made of the same material, the electrical resistance between the metal layer 216 and the second antenna conductor layer 236 is substantially zero.
なお、図9に示すように、RFICモジュール40もパッケージ本体212に設けられている。この場合、シート基材232は、第1のアンテナ導体層234、第2のアンテナ導体層236、およびRFICモジュール40を保護する役割をする。これに代わって、RFICモジュール40が、シート基材232に設けられてもよい。この場合、シート基材232をパッケージ本体212に取り付けることにより、RFICモジュール40が、第1および第2のアンテナ導体層34、36に接続される。
As shown in FIG. 9, the RFIC module 40 is also provided in the package body 212. In this case, the sheet substrate 232 serves to protect the first antenna conductor layer 234, the second antenna conductor layer 236, and the RFIC module 40. Alternatively, the RFIC module 40 may be provided on the sheet substrate 232. In this case, the RFIC module 40 is connected to the first and second antenna conductor layers 34 and 36 by attaching the sheet base 232 to the package body 212.
本実施の形態3も、上述の実施の形態1と同様に、意匠性を損なわないようにRFIDタグ230が設けられた、RFIDタグ付きパッケージ210を提供することができる。
In the third embodiment as well as the above-described first embodiment, the RFID tag-attached package 210 can be provided in which the RFID tag 230 is provided so as not to impair the design.
(実施の形態4)
本実施の形態4は、RFIDタグが実質的に透明である点で、上述の実施の形態1と異なる。 Embodiment 4
The fourth embodiment differs from the above-described first embodiment in that the RFID tag is substantially transparent.
本実施の形態4は、RFIDタグが実質的に透明である点で、上述の実施の形態1と異なる。 Embodiment 4
The fourth embodiment differs from the above-described first embodiment in that the RFID tag is substantially transparent.
図10は、本実施の形態4に係るRFIDタグ付きパッケージの斜視図である。
FIG. 10 is a perspective view of a package with an RFID tag according to the fourth embodiment.
図10に示すように、本実施の形態4の場合、パッケージ本体312の正面312a、右側面312c、および左側面312dそれぞれに、透明窓314A、314B、および314Cが設けられている。RFIDタグ330は、パッケージ本体312の右側面312cに取り付けられている。
As shown in FIG. 10, in the case of the fourth embodiment, transparent windows 314A, 314B, and 314C are provided on the front surface 312a, the right side surface 312c, and the left side surface 312d of the package body 312, respectively. The RFID tag 330 is attached to the right side surface 312 c of the package body 312.
本実施の形態4の場合、RFIDタグ330において、シート基材332、第1のアンテナ導体層334、および第2のアンテナ導体層336は、透明材料から作製されている。第1のアンテナ導体層334と第2のアンテナ導体層336は、例えば酸化インジウムスズ(ITO)から作製される。
In the case of the fourth embodiment, in the RFID tag 330, the sheet base 332, the first antenna conductor layer 334, and the second antenna conductor layer 336 are made of a transparent material. The first antenna conductor layer 334 and the second antenna conductor layer 336 are made of, for example, indium tin oxide (ITO).
また、シート基材332は、第1のアンテナ導体層334が透明窓314Bに配置されるように、パッケージ本体312の右側面312cに取り付けられている。すなわち、第1のアンテナ導体層334は、金属層316が設けられていないパッケージ本体312の部分である透明窓314Bに配置されている。なお、本実施の形態の場合、第2のアンテナ導体層336およびシート基材332は、部分的に透明窓314Bに配置されている。
In addition, the sheet base material 332 is attached to the right side surface 312 c of the package body 312 such that the first antenna conductor layer 334 is disposed in the transparent window 314 B. That is, the first antenna conductor layer 334 is disposed in the transparent window 314 B which is a portion of the package body 312 where the metal layer 316 is not provided. In the case of the present embodiment, the second antenna conductor layer 336 and the sheet base 332 are partially disposed in the transparent window 314B.
RFIDタグ330が透明であるために、透明窓314Bに配置されても透明窓314Bの透過性はほとんど変わらない。また、第2のアンテナ導体層336のコンタクトパッド部336bが金属層316と接続するためにRFIDタグ330の一部が金属層316に重なっても、透明であるために、その重なる金属層316の部分を視認することができる。したがって、本実施の形態4の場合、RFIDタグ330を設けても、パッケージ本体312の意匠性はほとんど変わらない。
Because the RFID tag 330 is transparent, the transparency of the transparent window 314B hardly changes even if it is disposed in the transparent window 314B. Also, even if a part of the RFID tag 330 overlaps the metal layer 316 in order to connect the contact pad portion 336 b of the second antenna conductor layer 336 with the metal layer 316, it is transparent. You can see the part. Therefore, in the case of the fourth embodiment, even if the RFID tag 330 is provided, the design of the package body 312 is hardly changed.
本実施の形態4も、上述の実施の形態1と同様に、意匠性を損なわないようにRFIDタグ330が設けられた、RFIDタグ付きパッケージ310を提供することができる。
Also in the fourth embodiment, as in the first embodiment described above, the RFID tag-attached package 310 can be provided in which the RFID tag 330 is provided so as not to impair the design.
(実施の形態5)
上述の実施の形態1の場合、パッケージ本体12は紙材料、すなわち非導体材料から作製されている。それと異なり、本実施の形態5は、パッケージ本体が導体材料から作製されている。RFIDタグについては、実施の形態1と実質的に同一である。 Fifth Embodiment
In the case of the first embodiment described above, thepackage body 12 is made of a paper material, that is, a non-conductive material. On the other hand, in the fifth embodiment, the package body is made of a conductor material. The RFID tag is substantially the same as that of the first embodiment.
上述の実施の形態1の場合、パッケージ本体12は紙材料、すなわち非導体材料から作製されている。それと異なり、本実施の形態5は、パッケージ本体が導体材料から作製されている。RFIDタグについては、実施の形態1と実質的に同一である。 Fifth Embodiment
In the case of the first embodiment described above, the
図11は、本発明の実施の形態5に係るRFIDタグ付きパッケージの斜視図である。なお、RFIDタグが取り外された状態で、RFIDタグ付きパッケージは示されている。
FIG. 11 is a perspective view of a package with an RFID tag according to the fifth embodiment of the present invention. The RFID tag-attached package is shown with the RFID tag removed.
図11に示すように、本実施の形態5の場合、RFIDタグ付きパッケージ410のパッケージ本体412は、シート状の導体材料から作製された袋体である。例えば、パッケージ本体412は、アルミシートを筒状にし、その両端をシールすることによって作製されている。
As shown in FIG. 11, in the case of the fifth embodiment, the package body 412 of the RFID tag-attached package 410 is a bag made of a sheet-like conductive material. For example, the package body 412 is produced by making an aluminum sheet cylindrical and sealing its both ends.
また、パッケージ本体412には、貫通穴412hが形成されている。また、その貫通穴412hを塞ぐために、非導体材料(例えば樹脂材料)から作製されたシート状のシール部材418がパッケージ本体412に取り付けられている。
Further, a through hole 412 h is formed in the package body 412. Further, a sheet-like seal member 418 made of a nonconductive material (for example, a resin material) is attached to the package body 412 in order to close the through hole 412 h.
RFIDタグ30は、その第1のアンテナ導体層34が貫通穴412hの開口内に位置するように、すなわちシール部材418に配置されるように、パッケージ本体412に取り付けられる。これにより、第1のアンテナ導体層34とパッケージ本体412との電気的な接続が回避されている。
The RFID tag 30 is attached to the package body 412 such that the first antenna conductor layer 34 is located in the opening of the through hole 412 h, that is, disposed on the seal member 418. Thereby, the electrical connection between the first antenna conductor layer 34 and the package body 412 is avoided.
なお、RFIDタグ30のシート基材32がパッケージ本体412の貫通穴412hを塞ぐことができる大きさを備え、且つ、樹脂材料から作製されている場合、そのシート基材32が貫通穴412hを塞ぐシール部材として機能してもよい。これにより、シール部材418を省略することができる。
If the sheet base 32 of the RFID tag 30 has a size capable of closing the through hole 412 h of the package body 412 and is made of a resin material, the sheet base 32 blocks the through hole 412 h. It may function as a seal member. Thereby, the seal member 418 can be omitted.
貫通穴412hを透明なシール部材418で塞ぐことにより、パッケージ本体412の透明窓としてもよい。この場合、上述の実施の形態4と同様に、シート基材32、第1のアンテナ導体層34、および第2のアンテナ導体層36は、透明材料から作製される。
The through hole 412 h may be closed by a transparent seal member 418 to form a transparent window of the package body 412. In this case, as in the fourth embodiment described above, the sheet base 32, the first antenna conductor layer 34, and the second antenna conductor layer 36 are made of a transparent material.
本実施の形態5も、上述の実施の形態1と同様に、意匠性を損なわないようにRFIDタグ30が設けられた、RFIDタグ付きパッケージ410を提供することができる。
Also in the fifth embodiment, as in the first embodiment described above, the RFID tag-attached package 410 can be provided in which the RFID tag 30 is provided so as not to impair the design.
以上、上述の実施の形態を挙げて本発明を説明したが、本発明の実施の形態はこれに限らない。
As mentioned above, although the present invention was described with the above-mentioned embodiment, the embodiment of the present invention is not limited to this.
例えば、上述の実施の形態1の場合、RFIDタグ付きパッケージ10におけるパッケージ本体12は、直方体形状の箱体であるが、本発明の実施の形態はこれに限らない。パッケージ本体の形状は、例えば筒状であってもよい。
For example, in the case of the first embodiment described above, the package body 12 in the RFID tag-attached package 10 is a rectangular parallelepiped box, but the embodiment of the present invention is not limited thereto. The shape of the package body may be cylindrical, for example.
これに関連して、非導体材料から作製されるパッケージ本体も、上述の実施の形態5のように、袋体であってもよい。例えば、パッケージ本体が紙材料または樹脂材料から作製された袋体であって、その外面に部分的にメタルコーティングが設けられてもよい。
In this connection, the package body made of non-conductive material may also be a bag as in the fifth embodiment described above. For example, the package body may be a bag made of paper or resin material, the outer surface of which may be partially provided with a metal coating.
また、上述の実施の形態1の場合、図3に示すように、第1のアンテナ導体層34と第2のアンテナ導体層36はミアンダ状の部分を備えるが、本発明の実施の形態はこれに限らない。第1のアンテナ導体層と第2のアンテナ導体層それぞれの形状は、RFIDタグの仕様(通信周波数や通信可能距離など)に対応し、その仕様に必要な電気的特性(インダクタンスや電気長など)を備えるために様々に変更される。
Further, in the case of the above-described first embodiment, as shown in FIG. 3, the first antenna conductor layer 34 and the second antenna conductor layer 36 have meandering portions, but the embodiment of the present invention is not limited to this. Not limited to. The shapes of the first antenna conductor layer and the second antenna conductor layer correspond to the specifications of the RFID tag (communication frequency, communicable distance, etc.), and the electrical characteristics (inductance, electric length, etc.) necessary for the specifications Are modified in various ways to provide
さらに、上述の実施の形態1の場合、RFIDタグ30は、パッケージ本体12の外面に取り付けられているが、本発明の実施の形態はこれに限らない。例えば、RFIDタグは、パッケージ本体12の内面に設けられてもよい。この場合、RFIDタグは、パッケージ本体が形成される前(組み立てられる前)に、その内面に取り付けられる。またこの場合、パッケージ本体の内面側に配置される第2のアンテナ導体層は、パッケージ本体を介して、その外面に設けられた金属層と容量結合する。この形態の場合、RFIDタグ付きパッケージの取り扱い中に、パッケージ本体からRFIDタグが脱落しにくい。
Furthermore, in the case of the first embodiment described above, the RFID tag 30 is attached to the outer surface of the package body 12, but the embodiment of the present invention is not limited to this. For example, an RFID tag may be provided on the inner surface of the package body 12. In this case, the RFID tag is attached to its inner surface before the package body is formed (prior to assembly). In this case, the second antenna conductor layer disposed on the inner surface side of the package body capacitively couples with the metal layer provided on the outer surface through the package body. In this case, the RFID tag is less likely to come off the package body during handling of the RFID tag-equipped package.
加えてまた、ある実施の形態に対して別の少なくとも1つの実施の形態を全体としてまたは部分的に組み合わせて本発明に係るさらなる実施の形態とすることが可能であることは、当業者にとって明らかである。
In addition, it will be apparent to those skilled in the art that at least one other embodiment may be combined in whole or in part with one embodiment to form a further embodiment according to the present invention. It is.
したがって、本発明の実施の形態に係るRFIDタグ付きパッケージは、広義には、非導体材料から作製されたパッケージ本体と、前記パッケージ本体の外面上に部分的に設けられた金属層と、第1および第2の入出力端子を備え、前記パッケージ本体に配置されたRFICチップと、一端が前記RFICチップの第1の入出力端子に接続され、他端が開放端であり、前記金属層が設けられていない前記パッケージ本体の部分に配置された第1のアンテナ導体層と、一端が前記RFICチップの第2の入出力端子に接続され、他端が前記金属層に対して直接的に接続されているまたは容量を介して接続され、前記パッケージ本体に配置された第2のアンテナ導体層と、を有するRFIDタグ付きパッケージである。
Therefore, an RFID tag-attached package according to an embodiment of the present invention broadly includes a package body made of a non-conductive material, a metal layer partially provided on the outer surface of the package body, And a second input / output terminal, the RFIC chip disposed in the package body, one end connected to the first input / output terminal of the RFIC chip, the other end being an open end, the metal layer provided A first antenna conductor layer disposed in the portion of the package body which is not connected, and one end is connected to the second input / output terminal of the RFIC chip, and the other end is directly connected to the metal layer And a second antenna conductor layer connected via a capacitor and disposed on the package body.
本発明は、RFIDタグを取り付ける必要があるパッケージに適用可能である。
The invention is applicable to packages that need to have an RFID tag attached.
10 RFIDタグ付きパッケージ
12 パッケージ本体
12g 金属層が設けられていないパッケージ本体の部分(露出部分)
34 第1のアンテナ導体層
34a 一端(ランド部)
34b 他端(開放端)
36 第2のアンテナ導体層
36a 一端(ランド部)
36b 他端(コンタクトパッド部)
44 RFICチップ
44a 第1の入出力端子
44b 第2の入出力端子 10 package withRFID tag 12 package body 12 g part of the package body not provided with the metal layer (exposed part)
34 firstantenna conductor layer 34a one end (land portion)
34b other end (open end)
36 secondantenna conductor layer 36a one end (land portion)
36b The other end (contact pad)
44RFIC chip 44a first input / output terminal 44b second input / output terminal
12 パッケージ本体
12g 金属層が設けられていないパッケージ本体の部分(露出部分)
34 第1のアンテナ導体層
34a 一端(ランド部)
34b 他端(開放端)
36 第2のアンテナ導体層
36a 一端(ランド部)
36b 他端(コンタクトパッド部)
44 RFICチップ
44a 第1の入出力端子
44b 第2の入出力端子 10 package with
34 first
34b other end (open end)
36 second
36b The other end (contact pad)
44
Claims (7)
- RFIDタグ付きパッケージであって、
非導体材料から作製されたパッケージ本体と、
前記パッケージ本体の外面上に部分的に設けられた金属層と、
第1および第2の入出力端子を備え、前記パッケージ本体に配置されたRFICチップと、
一端が前記RFICチップの第1の入出力端子に接続され、他端が開放端であり、前記金属層が設けられていない前記パッケージ本体の部分に配置された第1のアンテナ導体層と、
一端が前記RFICチップの第2の入出力端子に接続され、他端が前記金属層に対して直接的に接続されているまたは容量を介して接続され、前記パッケージ本体に配置された第2のアンテナ導体層と、を有するRFIDタグ付きパッケージ。 Package with RFID tag,
A package body made of a non-conductive material,
A metal layer partially provided on the outer surface of the package body;
An RFIC chip provided with the first and second input / output terminals and disposed in the package body;
A first antenna conductor layer disposed at a portion of the package body, one end of which is connected to the first input / output terminal of the RFIC chip and the other end of which is an open end, and the metal layer is not provided;
A second terminal connected to the second input / output terminal of the RFIC chip at one end and directly connected to the metal layer at the other end or via a capacitor and disposed in the package body An antenna conductor layer, and a package with an RFID tag. - 前記パッケージ本体に取り付けられるシート基材を有し、
前記シート基材上に、前記RFICチップ、前記第1のアンテナ導体層、および前記第2のアンテナ導体層が設けられている、請求項1に記載のRFIDタグ付きパッケージ。 Having a sheet substrate attached to the package body,
The RFID tag-attached package according to claim 1, wherein the RFIC chip, the first antenna conductor layer, and the second antenna conductor layer are provided on the sheet substrate. - 前記パッケージ本体が貫通穴を備え、
前記第1のアンテナ導体層が貫通穴の開口内に位置するように、前記シート基材が前記パッケージ本体に取り付けられている、請求項2に記載のRFIDタグ付きパッケージ。 The package body comprises a through hole;
The RFID tag-equipped package according to claim 2, wherein the sheet substrate is attached to the package body such that the first antenna conductor layer is located in the opening of the through hole. - 前記パッケージ本体が透明窓を備え、
前記第1のアンテナ導体層、前記第2のアンテナ導体層、および前記シート基材が、透明材料から作製され、前記透明窓に配置されている、請求項2に記載のRFIDタグ付きパッケージ。 The package body comprises a transparent window;
The RFID tag-equipped package according to claim 2, wherein the first antenna conductor layer, the second antenna conductor layer, and the sheet substrate are made of a transparent material and disposed in the transparent window. - 前記第1および第2のアンテナ導体層が、前記金属層と同一の材料から作製され、前記パッケージ本体の外面上に設けられている、請求項1に記載のRFIDタグ付きパッケージ。 The RFID tag-equipped package according to claim 1, wherein the first and second antenna conductor layers are made of the same material as the metal layer and provided on the outer surface of the package body.
- 前記パッケージ本体が、正面、背面、右側面、左側面、頂面、および底面を備える直方体形状の箱体であって、
前記正面、前記背面、前記右側面、および前記左側面のいずれか1つに、前記RFICチップ、前記第1のアンテナ導体層、および前記第2のアンテナ導体層が、前記頂面と底面との対向方向に並んだ状態で配置されている、請求項1から5のいずれか一項に記載のRFIDタグ付きパッケージ。 The package body is a rectangular parallelepiped box including a front surface, a back surface, a right side surface, a left side surface, a top surface, and a bottom surface,
In any one of the front surface, the back surface, the right side surface, and the left side surface, the RFIC chip, the first antenna conductor layer, and the second antenna conductor layer have the top surface and the bottom surface. The RFID tag-equipped package according to any one of claims 1 to 5, which is arranged side by side in the opposite direction. - RFIDタグ付きパッケージであって、
導体材料から作製され、貫通穴を備えるパッケージ本体と、
前記貫通穴を塞ぐように前記パッケージ本体に貼り付けられたシール部材と、
第1のおよび第2の入出力端子を備え、前記パッケージ本体に配置されたRFICチップと、
一端が前記RFICチップの第1の入出力端子に接続され、他端が開放端であり、前記貫通穴の開口内に位置するように前記シール部材に配置された第1のアンテナ導体層と、
一端が前記RFICチップの第2の入出力端子に接続され、他端が前記パッケージ本体に対して直接的に接続されているまたは容量を介して接続され、前記パッケージ本体に配置された第2のアンテナ導体層と、を有するRFIDタグ付きパッケージ。 Package with RFID tag,
A package body made of a conductive material and provided with through holes;
A sealing member attached to the package body to close the through hole;
An RFIC chip provided with the first and second input / output terminals and disposed in the package body;
A first antenna conductor layer disposed on the seal member such that one end is connected to the first input / output terminal of the RFIC chip, the other end is an open end, and is located within the opening of the through hole;
A second one connected to the second input / output terminal of the RFIC chip at one end, and the other end connected directly to the package body or connected via a capacitor; An antenna conductor layer, and a package with an RFID tag.
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JP2019525921A JP6785966B2 (en) | 2017-08-24 | 2018-08-22 | RFID-tagged package |
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DE212021000250U1 (en) | 2020-11-09 | 2022-08-23 | Murata Manufacturing Co., Ltd. | Container comprising an RFID module |
JP7476722B2 (en) | 2020-08-24 | 2024-05-01 | 大日本印刷株式会社 | RF tagged packaging |
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JP6439344B2 (en) * | 2014-09-22 | 2018-12-19 | 大日本印刷株式会社 | IC tag label |
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JP2009031893A (en) * | 2007-07-25 | 2009-02-12 | Hitachi Ltd | Rfid tag mounting package and production method therefor |
JP2013258779A (en) * | 2011-02-28 | 2013-12-26 | Murata Mfg Co Ltd | Wireless communication device |
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JP7476722B2 (en) | 2020-08-24 | 2024-05-01 | 大日本印刷株式会社 | RF tagged packaging |
WO2022075263A1 (en) * | 2020-10-05 | 2022-04-14 | 株式会社村田製作所 | Container including rfid module |
DE212021000250U1 (en) | 2020-11-09 | 2022-08-23 | Murata Manufacturing Co., Ltd. | Container comprising an RFID module |
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JPWO2022113851A1 (en) * | 2020-11-30 | 2022-06-02 | ||
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