WO2019035396A1 - Rf tag and rf tag device - Google Patents
Rf tag and rf tag device Download PDFInfo
- Publication number
- WO2019035396A1 WO2019035396A1 PCT/JP2018/029705 JP2018029705W WO2019035396A1 WO 2019035396 A1 WO2019035396 A1 WO 2019035396A1 JP 2018029705 W JP2018029705 W JP 2018029705W WO 2019035396 A1 WO2019035396 A1 WO 2019035396A1
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- WIPO (PCT)
- Prior art keywords
- tag
- chip
- antenna
- antenna unit
- tag according
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
Definitions
- the present invention relates to an RF tag and an RF tag device.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2016-173747
- an RFID tag that can suppress a decrease in communication performance when in contact with or in proximity to a conductor or a high dielectric, and can achieve both thinning and cost reduction Is disclosed.
- the RFID tag described in Patent Document 1 includes a stacked body including one conductive layer as an intermediate layer, an antenna provided on the stacked body, and an IC chip connected to the antenna, and one conductive layer includes It has at least one structure including a neck portion.
- Patent Document 2 Japanese Patent Application Laid-Open No. 2016-58062 discloses an RFID tag that prevents a semiconductor chip from breaking.
- the base material, the semiconductor chip mounted on the base material, and the semiconductor chip are covered, and the folding line starting point of the folding line is released from the semiconductor chip when it is folded. And an island-like reinforcing material for reinforcing the base material.
- Patent Document 3 Japanese Patent Laid-Open No. 2014-222423 discloses a package with an RFID tag capable of performing wireless communication in the UHF band without causing a decrease in communication distance and an increase in size.
- the RFID tag-attached package including the package to which the RFID tag is attached and in which the package is enclosed, the package functions as an antenna for communication of the RFID tag.
- the RFID tag has an IC chip and two conductive members individually connected to two electrodes of the IC chip, and the two conductive One of the members is attached to the surface of the sheet via the insulating member so that at least a part thereof is located on one side of the slit with respect to the width direction of the slit, the other of the two conductive members is at least a part of the slit Is attached to the surface of the sheet via the insulating member so as to be located on the other side of the slit with respect to the width direction of the Once cut along the imaginary line including the line in which the RFID tag becomes poor communication.
- Patent Document 4 Japanese Patent Laid-Open No. 2008-107947 discloses an RFID tag that transmits and receives data without contact with an external data read / write device, the RFID tag being a package made of aluminum foil and a metal-deposited film. The RFID tag is disclosed that does not malfunction even if the RFID tag is attached to a material or attached to a large cardboard or the like.
- an RFID chip that transmits and receives data contactlessly with an external data read / write device, an IC chip and an IC chip used to transmit and receive data at least contactlessly with the support.
- the inlet formed with the conductive wire and the antenna used for transmission and reception are separately formed, and by adhering the inlet and the antenna, the conductive wire and the antenna are connected by capacitor coupling.
- Patent Document 5 Japanese Unexamined Patent Publication No. 2011-2218378 discloses a wireless communication tag which can prohibit communication outside the management area.
- the semiconductor chip is mounted and electrically connected to the semiconductor chip.
- An antenna module having a tag having a power receiving unit, an antenna unit for receiving radio waves from a communication device, and a feeding unit electrically connected to the antenna unit, and having a configuration that can be attached to and detached from the tag.
- the power reception unit and the power supply unit are electrically connected to be in a communicable state with the communication device.
- Patent Document 6 Japanese Patent Application Laid-Open No. 2012-70076 discloses an RF-ID media which sufficiently achieves the effect of the booster antenna in the RF-ID media using the booster antenna.
- a second antenna is formed on a second base substrate on a first base substrate on which a first antenna in which current flows by an electromagnetic wave from the outside is formed.
- the RF-ID media on which an inlet formed is mounted and on which an IC chip connected to the second antenna is mounted, and the current flows to the second antenna by electromagnetic induction by the current flowing to the first antenna
- the second antenna consists of two spiral antenna parts whose outer peripheral end is connected to the IC chip and wound in the same direction and the inner peripheral end is opened, and the first antenna is When the inlet is mounted on one of the base substrates, two unequal regions are formed along the overlapping portion of the outer peripheral portion of each of the two antenna portions including the region between the two antenna portions. And has a current path in which a current flows by electromagnetic waves in the opposite direction of the spiral for na section.
- Patent Document 7 Japanese Patent Application Laid-Open No. 2008-117165 relates to an RFID tag in which even if the RFID tags are overlapped, a reading failure due to the interference of radio waves does not occur, and a spacer is not necessary between the RFID tags to be overlapped. It is disclosed.
- the wireless communication tag described in Patent Document 7 is an IC tag including an IC chip operated by a wireless wave and an antenna formed of a metal film layer formed on a base of an insulator,
- the antenna includes a slit for impedance matching, one first antenna on which the IC chip is mounted, and at least one second antenna on which the IC chip is not mounted, and the first antenna and the at least one first antenna The two antennas are capacitively coupled.
- Patent Document 8 Japanese Patent Application Laid-Open No. 2013-54751 discloses an RFID information medium capable of appropriate communication with a reading device (or reading and writing device) and easily miniaturized.
- the RFID information medium described in Patent Document 8 is an RFID information medium that performs data communication without contact with an external reader, and includes a main body having an insulating member, an antenna member provided in the main body, and a main body. And an optical change device whose color or image changes depending on visual observation, the conductor having a layer of a conductive material, the layer of the conductive material being a member for an antenna Partially overlapping in the thickness direction of the main body, the optical change device comprises a conductive reflective layer or a conductive transparent layer, and the reflective layer or transparent layer of the optical change device comprises a conductive material Is also used as a layer of
- the main object of the present invention is to provide an RF tag and an RF tag device which can be easily attached to goods.
- Another object of the present invention is to provide an RF tag and an RF tag device which can be easily attached to products, dramatically improve communication sensitivity, and receive nondirectional radio waves. .
- the RF tag is formed by joining an inlet portion including an IC chip and an inductor pattern, and an antenna portion used to transmit and receive data transmitted from a reader, and the capacitance inside the IC chip;
- the inductor pattern forms a resonant circuit to communicate with the reader.
- the inlet portion and the antenna portion are formed by bonding, and the resonance circuit is formed by the capacitance inside the IC chip and the inductor pattern.
- miniaturization of the RF tag can be realized.
- the peripheral distance of the antenna unit is one of ⁇ / 4, ⁇ / 2, 3/2, 4/5, and 5/8 with respect to the wavelength ⁇ of the wave number of the UHF band RFID frequency. It may be designed to correspond to
- the peripheral distance of the antenna unit is designed to correspond to any one of ⁇ / 4, ⁇ / 2, 3 ⁇ / 4, 5 ⁇ / 8 with respect to wavelength ⁇ , and as a result, the communication sensitivity is increased. While dramatically improving, it is possible to receive nondirectional radio waves.
- an adhesive layer may be formed on the antenna portion.
- the RF tag since the adhesive layer is formed in the antenna portion, the RF tag can be easily attached to the adherend member such as a bag via the adhesive layer. Moreover, when it attaches to a conductor member via an adhesive agent, the said conductor member can be used as an antenna.
- the inlet portion may have a non-conductive layer formed on the same side as the adhesive layer.
- the inlet portion has the non-conductive layer on the same side as the adhesive layer, even when the RF tag is attached to the conductor member, the electrical short circuit in the inlet portion can be prevented.
- the RF tag according to the fifth invention is the RF tag according to the fourth invention, wherein the inlet portion may be covered by a non-conductive layer.
- the inlet portion is included in the non-conductive layer, the RF tag can be attached regardless of the front and back of the RF tag.
- an electrical short circuit at the inlet can be prevented.
- the nonconductive layer may be made of a foamed resin.
- the non-conductive layer is made of a foamed resin
- the durability can be enhanced and shock absorption can be realized.
- the foamed resin is preferably made of expanded polystyrene. In the case of expanded polystyrene, it is inexpensive and easily available.
- An RF tag device comprises the RF tag according to any one of claims 1 to 6, a bag, a box, a film for packaging goods, a resin sheet, an aluminum thin film, a seal applied to goods.
- An RF tag is attached to one of a bag, a box, a film for packaging a product, a resin sheet, an aluminum thin film, and a seal applied to the product.
- management can be performed by sticking the miniaturized RF tag on any of a box, a seal, a resin sheet, aluminum, and a packaging film.
- an RF tag can be easily attached to a product in a product manufacturing plant, a shop, a convenience store, or the like.
- FIG. 1 is a schematic perspective view showing an example of the RF tag 100 according to the present embodiment as viewed from the front
- FIG. 2 is a schematic perspective view showing an example of the RF tag 100 as viewed from the back.
- the RF tag 100 As shown in FIGS. 1 and 2, the RF tag 100 mainly includes an inlet 200 and an antenna 300. In addition, the antenna unit 300 is formed at an end of the inlet unit 200.
- the antenna unit 300 is made of a conductive material.
- the antenna unit 300 is made of a metal thin film of aluminum.
- the thin film in the present embodiment is formed to have a thickness of 3 ⁇ m to 35 ⁇ m.
- the antenna unit 300 is formed by a method such as etching or pattern printing.
- the outer peripheral length value of the antenna unit 300 (distance around the antenna unit 300) is the sum of the lengths of the side 301a, the side 301b, the side 301c, the side 301d, and the side 301e.
- the outer circumference length value is designed to correspond to any one of ⁇ / 4, ⁇ / 2, 3/2, 4/5, and 5/8, when the wavelength ⁇ (lambda) of the UHF band RFID frequency is used. ing.
- antenna unit 300 has a shape including side 301a, side 301b, side 301c, side 301d, and side 301e.
- the present invention is not limited to this.
- a rectangular shape, a star shape, a polygon, or the like is used. It may be of any shape.
- the inlet portion 200 includes an IC chip 500 and a circuit 210 that forms an inductor pattern L.
- the circuit 210 has a shape having a cutout portion in which a part of a substantially annular circuit portion is cut out. That is, specifically, it consists of C shape of an alphabet character.
- the circuit 210 is formed of a side 211 a, a side 211 b, a side 211 c, and a side 211 d. Note that although a case where the circuit 210 is partially cut off has been described, the present invention is not limited to this, and an insulating portion may be formed instead of the cutout portion.
- the circuit 210 is made of a metal thin film of aluminum.
- the thin film in the present embodiment is formed to have a thickness of 3 ⁇ m to 35 ⁇ m.
- the circuit 210 is formed by a technique such as etching or pattern printing.
- an IC chip 500 is provided so as to bridge the cut-out portion of the circuit 210 of the inlet portion 200.
- the impedance of the inductor pattern L can be made constant due to the internal area S of the circuit section 210.
- the IC chip 500 operates based on the radio wave of the reading device received by the antenna unit 300 of the RF tag 100. Specifically, the IC chip 500 according to the present embodiment first rectifies a part of the carrier wave transmitted from the reader to generate a power supply voltage necessary for the IC chip 500 itself to operate. Then, the IC chip 500 operates the non-volatile memory in which the control logic circuit in the IC chip 500, the unique information of the product, and the like are stored by the generated power supply voltage.
- the IC chip 500 operates a communication circuit and the like for transmitting and receiving data to and from the reader.
- FIG. 3 is a schematic view showing an example of an AA cross section of the RF tag 100 shown in FIG. 2, and FIG. 4 is a schematic view showing another example of the AA cross section of the RF tag 100.
- 5 is a schematic view showing still another example of the cross section AA of the RF tag 100, and
- FIG. 6 is a schematic view showing still another example of the cross section AA of the RF tag 100. As shown in FIG.
- the adhesive layer 400 in the present embodiment shown in FIG. 2 or 3 is a double-sided tape.
- the adhesive layer 400 is provided at least on one side of the antenna unit 300.
- the pressure-sensitive adhesive layer 400 is made of a double-sided tape.
- the present invention is not limited to this, and another pressure-sensitive adhesive layer may be formed or an adhesive may be applied.
- the double-sided tape may be a part of the circuit 210 of the inlet portion 200 instead of the entire surface.
- the double-sided tape is exemplified, as will be described later, when the antenna unit 300 of the RF tag 100 is attached to a product or a seal, the release sheet of the double-sided tape is easily attached by peeling off. Because it is possible to wear.
- the adhesive layer 400 is provided on one side of the antenna unit 300.
- the present invention is not limited to this, and as shown in FIG. A sheet member 420 may be provided.
- the sheet member 420 may be provided only in the inlet portion 200.
- the sheet member 420 may be provided from the back surface side of the antenna unit 300 and the inlet unit 200 to the front side through the side surface of the inlet unit 200.
- the sheet member 420 may be mainly made of one or more insulating materials or resins such as polyethylene terephthalate, polyimide, polyvinyl chloride, etc. Even if other insulating film processing is used. Good.
- the thickness of the sheet member 420 is preferably several micrometers or more and several hundred micrometers or less, and more preferably several tens of micrometers or so.
- an adhesive layer 400 may be provided on the back surface side of the antenna unit 300, and a foam material 450 may be provided on at least the back surface side of the inlet unit 200.
- the foam material 450 may be foam polystyrene, polyethylene, polyimide, thin foam (borer) or the like, or may be made of an insulation layer such as another foam or material having insulation properties, and any foam material.
- the electrical conduction in the inlet portion 200 of the RF tag 100 can be protected, and the circuit 210 can be protected.
- FIG. 7 is a view showing an example of an equivalent circuit of the RF tag 100.
- the equivalent circuit of the RF tag 100 mainly includes an inductor pattern L, a capacitor Cb, and an IC chip 500.
- the inductor pattern L, the capacitor Cb, and the IC chip 500 constitute a resonant circuit that resonates in the frequency band of the radio wave transmitted from the reader.
- the resonant frequency f [Hz] of this resonant circuit is given by equation (1).
- the value of the resonance frequency f is set to be included in the frequency band of the radio wave transmitted from the reader.
- L a inductor pattern L of the inductance
- C b it means the equivalent capacitance of the IC chip 500.
- the IC chip 500 includes a capacitor inside, and the IC chip 500 has a floating capacitance. Therefore, when setting the resonance frequency f of the resonant circuit, to adjust the equivalent capacitance C b of the IC chip 500, to form a resonant circuit. That is, the resonant circuit preferably having an inductor pattern L the inductance, and the IC chip 500 inside the equivalent capacitance C b was considered set resonant frequency f of the.
- the resonance frequency f of the resonant circuit it is possible to accurately set the radio frequency band. As a result, the reading performance of the RF tag 100 can be further improved. Further, the power supply voltage generated by the IC chip 500 can be further increased.
- FIG. 8 is a schematic view showing an example of use of the RF tag 100
- FIG. 9 is a schematic view showing another example of use of the RF tag 100. As shown in FIG.
- the RF tag 100 may be formed in the package of the bag 900.
- the bag 900 is made of an aluminum vapor deposition film will be described.
- the inlet 200 is attached from the end of the bag 900 to protect the electrical continuity of the circuit on the back of the inlet 200. It is desirable that it be stuck so that
- FIG. 9 when the RF tag 100 shown in FIG. 4, FIG. 5, FIG. 6 is attached to the bag 900, the electrical conduction of the circuit on the back surface of the inlet portion 200 Because it is protected by the member 450, it may be placed at any position of the bag 900.
- FIG. 10 is a schematic view showing an example of an equivalent circuit of the RF tag device 110 including the RF tag 100 and the bag 900 shown in FIG.
- the adhesive layer 400 or the sheet member 420 is interposed between the antenna unit 300 and the aluminum deposition of the bag 900, so that it can function as a capacitor.
- the aluminum deposited film portion of the outer layer of the bag 900 can be used as an antenna.
- the bag 900 made of an aluminum vapor deposition film is illustrated, but the present invention is not limited to this, and the RF tag 100 can be attached to a bag, a box, a seal attached to a product, or the like.
- the inlet portion 200 and the antenna portion 300 are formed by bonding, and the resonance circuit is formed by the capacitance Cb inside the IC chip 500 and the inductor pattern L. It is formed.
- miniaturization of the RF tag 100 can be realized.
- the peripheral distance of the antenna unit 300 is designed to correspond to one of ⁇ / 4, ⁇ / 2, 3 ⁇ / 4, 5 ⁇ / 8 with respect to the wavelength ⁇ , as a result, the communication sensitivity is increased. While dramatically improving, it is possible to receive nondirectional radio waves.
- the adhesive layer 400 is formed on the antenna unit 300, the RF tag 100 can be easily attached via the adhesive layer 400. Moreover, when it attaches to a conductor member via an adhesive agent, the said conductor member can be used as an antenna.
- the inlet portion 200 has the sheet member 420 or the foam material 450 on the same side as the adhesive layer 400, it is possible to prevent an electrical short circuit in the inlet portion 200 even when attached to a conductor member. .
- the foamed resin preferably comprises expanded polystyrene. In the case of expanded polystyrene, it is inexpensive and easily available.
- management can be performed by sticking the miniaturized RF tag 100 on any of the bag 900, a box, a seal, a resin sheet, aluminum, and a packaging film.
- the RF tag 100 can be easily attached to a product in a product manufacturing plant, a store, a convenience store, or the like.
- the RF tag 100 corresponds to an "RF tag”
- the RF tag device 110 corresponds to an “RF tag device”
- the IC chip 500 corresponds to an “IC chip”
- the inductor pattern L is "inductor”.
- the inlet portion 200 corresponds to the “inlet portion”
- the antenna portion 300 corresponds to the “antenna portion”
- the adhesive layer 400 corresponds to the “adhesive layer”
- the sheet member 420 or the foam material 450 Corresponds to the "non-conductive layer”
- the outer peripheral length value of the antenna unit 300 corresponds to the "distance around the antenna unit”
- the foam material 450 corresponds to the "foam resin”
- the bag 900 is "bag, box”
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Abstract
[Problem] To provide an RF tag and an RF tag device that can be easily attached to a product. [Solution] An RF tag 100 is formed by connecting: an inlet unit 200 that includes an IC chip 500 and an inductor pattern L; and an antenna unit 300 that is used for transmitting and receiving data transmitted from a reading device. A resonant circuit is formed by the internal capacitance of the IC chip 500 and an inductor pattern L. The RF tag communicates with the reading device.
Description
本発明は、RFタグおよびRFタグ装置に関する。
The present invention relates to an RF tag and an RF tag device.
例えば、特許文献1(特開2016-173747号公報)には、導電体や高誘電体に接触もしくは近接したときの通信性の低下を抑制でき、かつ薄型化と低コスト化を両立できるRFIDタグについて開示されている。
For example, in Patent Document 1 (Japanese Patent Application Laid-Open No. 2016-173747), an RFID tag that can suppress a decrease in communication performance when in contact with or in proximity to a conductor or a high dielectric, and can achieve both thinning and cost reduction Is disclosed.
特許文献1記載のRFIDタグは、一の導電層を中間層として含む積層体と、積層体上に設けられたアンテナと、アンテナに接続されたICチップと、を備え、一の導電層は、括れ部を含む構造を少なくとも1つ有するものである。
The RFID tag described in Patent Document 1 includes a stacked body including one conductive layer as an intermediate layer, an antenna provided on the stacked body, and an IC chip connected to the antenna, and one conductive layer includes It has at least one structure including a neck portion.
特許文献2(特開2016-58062号公報)には、半導体チップが割れるのを防止するRFIDタグについて開示されている。
Patent Document 2 (Japanese Patent Application Laid-Open No. 2016-58062) discloses an RFID tag that prevents a semiconductor chip from breaking.
特許文献2記載のRFIDタグにおいては、基材と、基材の上に搭載された半導体チップと、半導体チップを覆うと共に、折り曲げたときにできる折り曲げ線が半導体チップから外れるように折り曲げ線の起点となる凹みを側部に備え、かつ、基材を補強する島状の補強材と、を有するものである。
In the RFID tag described in Patent Document 2, the base material, the semiconductor chip mounted on the base material, and the semiconductor chip are covered, and the folding line starting point of the folding line is released from the semiconductor chip when it is folded. And an island-like reinforcing material for reinforcing the base material.
特許文献3(特開2014-222423号公報)には、交信距離の低下及び大型化を招くことなく、UHF帯での無線通信が可能なRFIDタグ付き包装体について開示されている。
Patent Document 3 (Japanese Patent Laid-Open No. 2014-222423) discloses a package with an RFID tag capable of performing wireless communication in the UHF band without causing a decrease in communication distance and an increase in size.
特許文献3記載のRFIDタグ付き包装体においては、RFIDタグが取り付けられ、被包装物が封入される包装体を備えるRFIDタグ付き包装体において、包装体は、RFIDタグの通信用のアンテナとして機能する、スリットが形成された導電層を含むシートを有し、RFIDタグは、ICチップと、該ICチップの2つの電極に個別に接続された2つの導電部材と、を有し、2つの導電部材の一方は、少なくとも一部がスリットの幅方向に関してスリットの一側に位置するようにシートの表面に絶縁部材を介して取り付けられており、2つの導電部材の他方は、少なくとも一部がスリットの幅方向に関してスリットの他側に位置するようにシートの表面に絶縁部材を介して取り付けられており、包装体には、切断線が設けられ、切断線を含む仮想線に沿って切断されるとRFIDタグが通信不良になるものである。
In the RFID tag-equipped package described in Patent Document 3, the RFID tag-attached package including the package to which the RFID tag is attached and in which the package is enclosed, the package functions as an antenna for communication of the RFID tag. The RFID tag has an IC chip and two conductive members individually connected to two electrodes of the IC chip, and the two conductive One of the members is attached to the surface of the sheet via the insulating member so that at least a part thereof is located on one side of the slit with respect to the width direction of the slit, the other of the two conductive members is at least a part of the slit Is attached to the surface of the sheet via the insulating member so as to be located on the other side of the slit with respect to the width direction of the Once cut along the imaginary line including the line in which the RFID tag becomes poor communication.
特許文献4(特開2008―107947号公報)には、外部にあるデータ読み書き装置との間で、非接触でデータの送受信を行うRFIDタグにおいて、RFIDタグをアルミ箔,金属蒸着フィルムからなる包材にRFIDタグを貼っても、大きな段ボール等に貼っても、誤作動しないRFIDタグについて開示されている。
Patent Document 4 (Japanese Patent Laid-Open No. 2008-107947) discloses an RFID tag that transmits and receives data without contact with an external data read / write device, the RFID tag being a package made of aluminum foil and a metal-deposited film. The RFID tag is disclosed that does not malfunction even if the RFID tag is attached to a material or attached to a large cardboard or the like.
特許文献4記載のRFIDタグにおいては、外部にあるデータ読み書き装置との間で、非接触でデータの送受信を行うRFIDタグにおいて、支持体に少なくとも非接触でデータの送受信に用いるICチップとICチップにつながれた導線とが形成されたインレットと、送受信に用いるアンテナとが分離して形成され、インレットとアンテナとを貼着することによって、導線とアンテナとがコンデンサー結合でつながるものである。
In the RFID tag described in Patent Document 4, an RFID chip that transmits and receives data contactlessly with an external data read / write device, an IC chip and an IC chip used to transmit and receive data at least contactlessly with the support. The inlet formed with the conductive wire and the antenna used for transmission and reception are separately formed, and by adhering the inlet and the antenna, the conductive wire and the antenna are connected by capacitor coupling.
特許文献5(特開2011-221838号公報)には、管理領域外においては通信を禁止できる無線通信用タグについて開示されている。
Patent Document 5 (Japanese Unexamined Patent Publication No. 2011-221838) discloses a wireless communication tag which can prohibit communication outside the management area.
特許文献5記載の無線通信用タグにおいては、外部の通信装置との通信動作を行う半導体チップを有する無線通信用タグにおいて、半導体チップが搭載されるとともに、該半導体チップと電気的に接続された受電部を有するタグと、通信装置からの電波を受信するアンテナ部と、該アンテナ部と電気的に接続された給電部と、を有するとともに、タグと着脱可能な構成を備えたアンテナモジュールと、を備え、タグがアンテナモジュールと接続されたときに、受電部と給電部とが電気的に接続することにより、通信装置と通信可能な状態となるものである。
In the tag for wireless communication described in Patent Document 5, in the tag for wireless communication having a semiconductor chip performing a communication operation with an external communication device, the semiconductor chip is mounted and electrically connected to the semiconductor chip. An antenna module having a tag having a power receiving unit, an antenna unit for receiving radio waves from a communication device, and a feeding unit electrically connected to the antenna unit, and having a configuration that can be attached to and detached from the tag. When the tag is connected to the antenna module, the power reception unit and the power supply unit are electrically connected to be in a communicable state with the communication device.
特許文献6(特開2012-70076号公報)には、ブースターアンテナを用いたRF-IDメディアにおいてブースターアンテナによる効果を十分に得るRF-IDメディアについて開示されている。
Patent Document 6 (Japanese Patent Application Laid-Open No. 2012-70076) discloses an RF-ID media which sufficiently achieves the effect of the booster antenna in the RF-ID media using the booster antenna.
特許文献6記載のRF-IDメディアにおいては、外部からの電磁波によって電流が流れる第1のアンテナが形成された第1のベース基材上に、第2のベース基材上に第2のアンテナが形成されるとともに該第2のアンテナに接続されたICチップが搭載されてなるインレットが搭載され、第1のアンテナに流れた電流による電磁誘導によって第2のアンテナに電流が流れるRF-IDメディアにおいて、第2のアンテナは、外周端部がICチップに接続され、互いに同一方向に巻回されて内周端部が開放された渦巻き状の2つのアンテナ部からなり、第1のアンテナは、第1のベース基材上にインレットが搭載された場合に2つのアンテナ部間の領域を含む該2つのアンテナ部それぞれの外周部分に沿うまたは重なる領域に、2つのアンテナ部について渦巻き状における反対方向に電磁波による電流が流れる電流経路を有するものである。
In the RF-ID media described in Patent Document 6, a second antenna is formed on a second base substrate on a first base substrate on which a first antenna in which current flows by an electromagnetic wave from the outside is formed. In the RF-ID media on which an inlet formed is mounted and on which an IC chip connected to the second antenna is mounted, and the current flows to the second antenna by electromagnetic induction by the current flowing to the first antenna The second antenna consists of two spiral antenna parts whose outer peripheral end is connected to the IC chip and wound in the same direction and the inner peripheral end is opened, and the first antenna is When the inlet is mounted on one of the base substrates, two unequal regions are formed along the overlapping portion of the outer peripheral portion of each of the two antenna portions including the region between the two antenna portions. And has a current path in which a current flows by electromagnetic waves in the opposite direction of the spiral for na section.
特許文献7(特開2008-117165号公報)には、RFIDタグを重ね合わせても、電波の干渉による読取不良を発生せず、重ね合わせるRFIDタグの間にスペーサが不要となる、RFIDタグについて開示されている。
Patent Document 7 (Japanese Patent Application Laid-Open No. 2008-117165) relates to an RFID tag in which even if the RFID tags are overlapped, a reading failure due to the interference of radio waves does not occur, and a spacer is not necessary between the RFID tags to be overlapped. It is disclosed.
特許文献7記載の無線通信用タグにおいては、無線波により作動するICチップと、絶縁体のベース上に形成される金属膜層からなるアンテナと、を含んで構成されるICタグであって、アンテナは、インピーダンスマッチング用のスリット、及びICチップが搭載される1つの第1のアンテナおよび、ICチップが搭載されない少なくとも1つの第2のアンテナを含んでなり、第1のアンテナと少なくとも1つの第2のアンテナとを静電容量結合させたものである。
The wireless communication tag described in Patent Document 7 is an IC tag including an IC chip operated by a wireless wave and an antenna formed of a metal film layer formed on a base of an insulator, The antenna includes a slit for impedance matching, one first antenna on which the IC chip is mounted, and at least one second antenna on which the IC chip is not mounted, and the first antenna and the at least one first antenna The two antennas are capacitively coupled.
特許文献8(特開2013-54751号公報)には、読み取り装置(または読み書き装置)との適正な通信が可能で、かつ容易に小型化が可能なRFID情報媒体について開示されている。
Patent Document 8 (Japanese Patent Application Laid-Open No. 2013-54751) discloses an RFID information medium capable of appropriate communication with a reading device (or reading and writing device) and easily miniaturized.
特許文献8記載のRFID情報媒体においては、外部の読み取り装置と非接触でデータ通信を行うRFID情報媒体であって、絶縁部材を有する本体部と、本体部に設けられたアンテナ用部材と、本体部に設けられた導電体と、目視する見方によって色彩や画像が変化する光学変化デバイスと、を備え、導電体は導電性材料の層を有し、該導電性材料の層が、アンテナ用部材に部分的に、本体部の厚さ方向に重ねられており、光学変化デバイスが、導電性の反射層または導電性の透明層を備え、光学変化デバイスの反射層または透明層が、導電性材料の層と兼用されるものである。
The RFID information medium described in Patent Document 8 is an RFID information medium that performs data communication without contact with an external reader, and includes a main body having an insulating member, an antenna member provided in the main body, and a main body. And an optical change device whose color or image changes depending on visual observation, the conductor having a layer of a conductive material, the layer of the conductive material being a member for an antenna Partially overlapping in the thickness direction of the main body, the optical change device comprises a conductive reflective layer or a conductive transparent layer, and the reflective layer or transparent layer of the optical change device comprises a conductive material Is also used as a layer of
以上の特許文献1乃至8においては、種々のRFタグが開発されているが、主に金属上に貼着した場合、動作しないという問題がある。当該問題をクリアした場合であっても、RFタグ形成において、インダクタンスを一定に保持することができないという問題が生じる。
Although various RF tags are developed in Patent Documents 1 to 8 described above, there is a problem that they do not operate mainly when they are stuck on metal. Even when the problem is cleared, there arises a problem that the inductance can not be kept constant in forming the RF tag.
本発明の主な目的は、容易に商品に取り付けることができるRFタグおよびRFタグ装置を提供することである。
本発明の他の目的は、容易に商品に取り付けでき、かつ、通信感度を飛躍的に向上させるとともに、無指向性の電波を受信することができるRFタグおよびRFタグ装置を提供することである。 The main object of the present invention is to provide an RF tag and an RF tag device which can be easily attached to goods.
Another object of the present invention is to provide an RF tag and an RF tag device which can be easily attached to products, dramatically improve communication sensitivity, and receive nondirectional radio waves. .
本発明の他の目的は、容易に商品に取り付けでき、かつ、通信感度を飛躍的に向上させるとともに、無指向性の電波を受信することができるRFタグおよびRFタグ装置を提供することである。 The main object of the present invention is to provide an RF tag and an RF tag device which can be easily attached to goods.
Another object of the present invention is to provide an RF tag and an RF tag device which can be easily attached to products, dramatically improve communication sensitivity, and receive nondirectional radio waves. .
(1)
一局面に従うRFタグは、ICチップおよびインダクタパターンを含むインレット部と、読取装置から送信されたデータの送受信に用いるアンテナ部と、が接合して形成され、ICチップの内部の静電容量と、インダクタパターンと、により共振回路が形成され、読取装置と通信を行うものである。 (1)
The RF tag according to one aspect is formed by joining an inlet portion including an IC chip and an inductor pattern, and an antenna portion used to transmit and receive data transmitted from a reader, and the capacitance inside the IC chip; The inductor pattern forms a resonant circuit to communicate with the reader.
一局面に従うRFタグは、ICチップおよびインダクタパターンを含むインレット部と、読取装置から送信されたデータの送受信に用いるアンテナ部と、が接合して形成され、ICチップの内部の静電容量と、インダクタパターンと、により共振回路が形成され、読取装置と通信を行うものである。 (1)
The RF tag according to one aspect is formed by joining an inlet portion including an IC chip and an inductor pattern, and an antenna portion used to transmit and receive data transmitted from a reader, and the capacitance inside the IC chip; The inductor pattern forms a resonant circuit to communicate with the reader.
この場合、インレット部と、アンテナ部とが接合して形成され、ICチップ内部の静電容量とインダクタパターンにより共振回路が形成される。その結果、RFタグの小型化を実現することができる。
In this case, the inlet portion and the antenna portion are formed by bonding, and the resonance circuit is formed by the capacitance inside the IC chip and the inductor pattern. As a result, miniaturization of the RF tag can be realized.
(2)
第2の発明にかかるRFタグは、アンテナ部の周辺距離は、UHF帯RFID周波数の波数の波長λに対して、λ/4、λ/2、3λ/4、5λ/8のいずれか1つに該当するよう設計されてもよい。 (2)
In the RF tag according to the second aspect of the present invention, the peripheral distance of the antenna unit is one of λ / 4, λ / 2, 3/2, 4/5, and 5/8 with respect to the wavelength λ of the wave number of the UHF band RFID frequency. It may be designed to correspond to
第2の発明にかかるRFタグは、アンテナ部の周辺距離は、UHF帯RFID周波数の波数の波長λに対して、λ/4、λ/2、3λ/4、5λ/8のいずれか1つに該当するよう設計されてもよい。 (2)
In the RF tag according to the second aspect of the present invention, the peripheral distance of the antenna unit is one of λ / 4, λ / 2, 3/2, 4/5, and 5/8 with respect to the wavelength λ of the wave number of the UHF band RFID frequency. It may be designed to correspond to
この場合、アンテナ部の周辺距離は、波長λに対して、λ/4、λ/2、3λ/4、5λ/8のいずれか1つに該当するよう設計するため、その結果、通信感度を飛躍的に向上させるとともに、無指向性の電波を受信することができる。
In this case, the peripheral distance of the antenna unit is designed to correspond to any one of λ / 4, λ / 2, 3λ / 4, 5λ / 8 with respect to wavelength λ, and as a result, the communication sensitivity is increased. While dramatically improving, it is possible to receive nondirectional radio waves.
(3)
第3の発明にかかるRFタグは、一局面または第2の発明にかかるRFタグにおいて、アンテナ部には、粘着層が形成されてもよい。 (3)
In the RF tag according to the third aspect of the present invention, in the RF tag according to the first aspect or the second aspect, an adhesive layer may be formed on the antenna portion.
第3の発明にかかるRFタグは、一局面または第2の発明にかかるRFタグにおいて、アンテナ部には、粘着層が形成されてもよい。 (3)
In the RF tag according to the third aspect of the present invention, in the RF tag according to the first aspect or the second aspect, an adhesive layer may be formed on the antenna portion.
この場合、アンテナ部に粘着層が形成されているので、粘着層を介してRFタグを容易に袋などの被貼着部材に取り付けることができる。また、接着剤を介して導体部材に取り付けた場合には、当該導体部材をアンテナにすることができる。
In this case, since the adhesive layer is formed in the antenna portion, the RF tag can be easily attached to the adherend member such as a bag via the adhesive layer. Moreover, when it attaches to a conductor member via an adhesive agent, the said conductor member can be used as an antenna.
(4)
第4の発明にかかるRFタグは、一局面から第3の発明のいずれかにかかるRFタグにおいて、インレット部は、粘着層と同一面側に非導電体層が形成されてもよい。 (4)
In the RF tag according to the fourth aspect of the present invention, in the RF tag according to any one of the first aspect to the third aspect, the inlet portion may have a non-conductive layer formed on the same side as the adhesive layer.
第4の発明にかかるRFタグは、一局面から第3の発明のいずれかにかかるRFタグにおいて、インレット部は、粘着層と同一面側に非導電体層が形成されてもよい。 (4)
In the RF tag according to the fourth aspect of the present invention, in the RF tag according to any one of the first aspect to the third aspect, the inlet portion may have a non-conductive layer formed on the same side as the adhesive layer.
この場合、インレット部は、粘着層と同一面側に非導電体層を有するので、RFタグが導体部材に貼着された場合においても、インレット部における電気的短絡を防止することができる。
In this case, since the inlet portion has the non-conductive layer on the same side as the adhesive layer, even when the RF tag is attached to the conductor member, the electrical short circuit in the inlet portion can be prevented.
(5)
第5の発明にかかるRFタグは、第4の発明にかかるRFタグにおいて、インレット部は、非導電体層で包含されていてもよい。 (5)
The RF tag according to the fifth invention is the RF tag according to the fourth invention, wherein the inlet portion may be covered by a non-conductive layer.
第5の発明にかかるRFタグは、第4の発明にかかるRFタグにおいて、インレット部は、非導電体層で包含されていてもよい。 (5)
The RF tag according to the fifth invention is the RF tag according to the fourth invention, wherein the inlet portion may be covered by a non-conductive layer.
この場合、インレット部は、非導電体層で包含されているので、RFタグの表裏面に関わらず、RFタグを貼着することができる。また、RFタグを張り付けた商品を積層配置した場合においても、インレット部における電気的短絡を防止することができる。
In this case, since the inlet portion is included in the non-conductive layer, the RF tag can be attached regardless of the front and back of the RF tag. In addition, even when the products to which the RF tag is attached are stacked and arranged, an electrical short circuit at the inlet can be prevented.
(6)
第6の発明にかかるRFタグは、一局面から第5の発明のいずれかにかかるRFタグにおいて、非導電体層は、発泡樹脂からなってもよい。 (6)
In the RF tag according to the sixth aspect of the present invention, in the RF tag according to any one of the first aspect to the fifth aspect, the nonconductive layer may be made of a foamed resin.
第6の発明にかかるRFタグは、一局面から第5の発明のいずれかにかかるRFタグにおいて、非導電体層は、発泡樹脂からなってもよい。 (6)
In the RF tag according to the sixth aspect of the present invention, in the RF tag according to any one of the first aspect to the fifth aspect, the nonconductive layer may be made of a foamed resin.
この場合、非導電体層は、発泡樹脂からなるので、耐久性を高めることができるとともに、衝撃吸収を実現することができる。また、発泡樹脂は、発泡スチロールからなることが好ましい。発泡スチロールの場合、安価で容易に入手することができる。
In this case, since the non-conductive layer is made of a foamed resin, the durability can be enhanced and shock absorption can be realized. Further, the foamed resin is preferably made of expanded polystyrene. In the case of expanded polystyrene, it is inexpensive and easily available.
(7)
他の局面にかかるRFタグ装置は、請求項1乃至6のいずれか1項に記載のRFタグと、袋、箱、商品を包装するフィルム、樹脂シート、アルミニウム薄膜、商品に貼着されるシールのいずれかと、を含み、袋、箱、商品を包装するフィルム、樹脂シート、アルミニウム薄膜、商品に貼着されるシールのいずれかにRFタグが貼着されたものである。 (7)
An RF tag device according to another aspect comprises the RF tag according to any one of claims 1 to 6, a bag, a box, a film for packaging goods, a resin sheet, an aluminum thin film, a seal applied to goods. An RF tag is attached to one of a bag, a box, a film for packaging a product, a resin sheet, an aluminum thin film, and a seal applied to the product.
他の局面にかかるRFタグ装置は、請求項1乃至6のいずれか1項に記載のRFタグと、袋、箱、商品を包装するフィルム、樹脂シート、アルミニウム薄膜、商品に貼着されるシールのいずれかと、を含み、袋、箱、商品を包装するフィルム、樹脂シート、アルミニウム薄膜、商品に貼着されるシールのいずれかにRFタグが貼着されたものである。 (7)
An RF tag device according to another aspect comprises the RF tag according to any one of claims 1 to 6, a bag, a box, a film for packaging goods, a resin sheet, an aluminum thin film, a seal applied to goods. An RF tag is attached to one of a bag, a box, a film for packaging a product, a resin sheet, an aluminum thin film, and a seal applied to the product.
この場合、小型化されたRFタグを、箱、シール、樹脂シート、アルミニウム、包装フィルムのいずれかに貼着することで、管理を行うことができる。例えば、商品の製造工場、店舗、コンビニエンスストア等において、RFタグを商品に容易に貼着することができる。
In this case, management can be performed by sticking the miniaturized RF tag on any of a box, a seal, a resin sheet, aluminum, and a packaging film. For example, an RF tag can be easily attached to a product in a product manufacturing plant, a shop, a convenience store, or the like.
以下、図面を参照しつつ、本発明の実施の形態について説明する。以下の説明では、同一の部品には同一の符号を付す。また、同符号の場合には、それらの名称および機能も同一である。したがって、それらについての詳細な説明は繰り返さないものとする。
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same components are denoted by the same reference numerals. Moreover, in the case of the same sign, their names and functions are also the same. Therefore, detailed description about them shall not be repeated.
[本実施の形態]
図1は、本実施の形態にかかるRFタグ100を表面から見た一例を示す模式的斜視図であり、図2は、RFタグ100を裏面から見た一例を示す模式的斜視図である。 This Embodiment
FIG. 1 is a schematic perspective view showing an example of theRF tag 100 according to the present embodiment as viewed from the front, and FIG. 2 is a schematic perspective view showing an example of the RF tag 100 as viewed from the back.
図1は、本実施の形態にかかるRFタグ100を表面から見た一例を示す模式的斜視図であり、図2は、RFタグ100を裏面から見た一例を示す模式的斜視図である。 This Embodiment
FIG. 1 is a schematic perspective view showing an example of the
(RFタグ100)
図1および図2に示すように、RFタグ100は、主にインレット部200およびアンテナ部300からなる。
また、アンテナ部300は、インレット部200の端部に形成される。 (RF tag 100)
As shown in FIGS. 1 and 2, theRF tag 100 mainly includes an inlet 200 and an antenna 300.
In addition, theantenna unit 300 is formed at an end of the inlet unit 200.
図1および図2に示すように、RFタグ100は、主にインレット部200およびアンテナ部300からなる。
また、アンテナ部300は、インレット部200の端部に形成される。 (RF tag 100)
As shown in FIGS. 1 and 2, the
In addition, the
(アンテナ部300)
図1および図2に示すように、アンテナ部300は、導電性を有する部材からなる。本実施の形態においてアンテナ部300は、アルミニウムの金属薄膜からなる。一般的に本実施の形態における薄膜は3μm以上35μm以下の厚みから形成される。アンテナ部300は、エッチングまたはパターン印刷等の手法によって形成される。 (Antenna unit 300)
As shown in FIGS. 1 and 2, theantenna unit 300 is made of a conductive material. In the present embodiment, the antenna unit 300 is made of a metal thin film of aluminum. Generally, the thin film in the present embodiment is formed to have a thickness of 3 μm to 35 μm. The antenna unit 300 is formed by a method such as etching or pattern printing.
図1および図2に示すように、アンテナ部300は、導電性を有する部材からなる。本実施の形態においてアンテナ部300は、アルミニウムの金属薄膜からなる。一般的に本実施の形態における薄膜は3μm以上35μm以下の厚みから形成される。アンテナ部300は、エッチングまたはパターン印刷等の手法によって形成される。 (Antenna unit 300)
As shown in FIGS. 1 and 2, the
また、図1に示すように、アンテナ部300の外周長さ値(アンテナ部300の周辺距離)は、辺301a、辺301b、辺301c、辺301d、辺301eの長さの合計である。外周長さ値は、UHF帯RFID周波数の周波数の波長λ(ラムダ)を用いた場合、λ/4、λ/2、3λ/4、5λ/8のいずれか1つに該当するように設計されている。
Further, as shown in FIG. 1, the outer peripheral length value of the antenna unit 300 (distance around the antenna unit 300) is the sum of the lengths of the side 301a, the side 301b, the side 301c, the side 301d, and the side 301e. The outer circumference length value is designed to correspond to any one of λ / 4, λ / 2, 3/2, 4/5, and 5/8, when the wavelength λ (lambda) of the UHF band RFID frequency is used. ing.
なお、値S1は、使用する周波数の波長λの半分の長さであることがより好ましい。
また、本実施の形態においてアンテナ部300は、辺301a、辺301b、辺301c、辺301d、辺301eからなる形状としているが、これに限定されず、矩形状、星形状、多角形、その他の任意の形状からなってもよい。 The value S1 is more preferably half the wavelength λ of the frequency to be used.
In the present embodiment,antenna unit 300 has a shape including side 301a, side 301b, side 301c, side 301d, and side 301e. However, the present invention is not limited to this. A rectangular shape, a star shape, a polygon, or the like is used. It may be of any shape.
また、本実施の形態においてアンテナ部300は、辺301a、辺301b、辺301c、辺301d、辺301eからなる形状としているが、これに限定されず、矩形状、星形状、多角形、その他の任意の形状からなってもよい。 The value S1 is more preferably half the wavelength λ of the frequency to be used.
In the present embodiment,
(インレット部200)
図1および図2に示すように、インレット部200は、ICチップ500およびインダクタパターンLを形成する回路210を含む。
回路210は、略環状形状の回路部の一部を切欠いた切り欠き部を有する形状からなる。すなわち、具体的には、アルファベット文字のC形状からなる。
回路210は、辺211a、辺211b、辺211c、および辺211dから形成される。
なお、回路210は、一部を切欠く場合について説明したが、これに限定されず、切り欠き部の代わりに、絶縁部を形成してもよい。 (Inlet 200)
As shown in FIGS. 1 and 2, theinlet portion 200 includes an IC chip 500 and a circuit 210 that forms an inductor pattern L.
Thecircuit 210 has a shape having a cutout portion in which a part of a substantially annular circuit portion is cut out. That is, specifically, it consists of C shape of an alphabet character.
Thecircuit 210 is formed of a side 211 a, a side 211 b, a side 211 c, and a side 211 d.
Note that although a case where thecircuit 210 is partially cut off has been described, the present invention is not limited to this, and an insulating portion may be formed instead of the cutout portion.
図1および図2に示すように、インレット部200は、ICチップ500およびインダクタパターンLを形成する回路210を含む。
回路210は、略環状形状の回路部の一部を切欠いた切り欠き部を有する形状からなる。すなわち、具体的には、アルファベット文字のC形状からなる。
回路210は、辺211a、辺211b、辺211c、および辺211dから形成される。
なお、回路210は、一部を切欠く場合について説明したが、これに限定されず、切り欠き部の代わりに、絶縁部を形成してもよい。 (Inlet 200)
As shown in FIGS. 1 and 2, the
The
The
Note that although a case where the
本実施の形態において、回路210は、アルミニウムの金属薄膜からなる。一般的に本実施の形態における薄膜は3μm以上35μm以下の厚みから形成される。
回路210は、エッチングまたはパターン印刷等の手法によって形成される。 In the present embodiment, thecircuit 210 is made of a metal thin film of aluminum. Generally, the thin film in the present embodiment is formed to have a thickness of 3 μm to 35 μm.
Thecircuit 210 is formed by a technique such as etching or pattern printing.
回路210は、エッチングまたはパターン印刷等の手法によって形成される。 In the present embodiment, the
The
また、インレット部200の回路210の切り欠き部を架け渡すように、ICチップ500が設けられる。
本実施の形態においては、インレット部200においては、回路部210の内部面積Sにより、インダクタパターンLのインピーダンスを一定にすることができる。 Further, anIC chip 500 is provided so as to bridge the cut-out portion of the circuit 210 of the inlet portion 200.
In the present embodiment, in theinlet section 200, the impedance of the inductor pattern L can be made constant due to the internal area S of the circuit section 210.
本実施の形態においては、インレット部200においては、回路部210の内部面積Sにより、インダクタパターンLのインピーダンスを一定にすることができる。 Further, an
In the present embodiment, in the
ICチップ500は、RFタグ100のアンテナ部300が受信した読取装置の電波に基づいて動作する。
具体的に本実施の形態にかかるICチップ500は、まず、読取装置から送信される搬送波の一部を整流して、ICチップ500自身が動作するために必要な電源電圧を生成する。そして、ICチップ500は、生成した電源電圧によって、ICチップ500内の制御用の論理回路、商品の固有情報等が格納された不揮発性メモリを動作させる。 TheIC chip 500 operates based on the radio wave of the reading device received by the antenna unit 300 of the RF tag 100.
Specifically, theIC chip 500 according to the present embodiment first rectifies a part of the carrier wave transmitted from the reader to generate a power supply voltage necessary for the IC chip 500 itself to operate. Then, the IC chip 500 operates the non-volatile memory in which the control logic circuit in the IC chip 500, the unique information of the product, and the like are stored by the generated power supply voltage.
具体的に本実施の形態にかかるICチップ500は、まず、読取装置から送信される搬送波の一部を整流して、ICチップ500自身が動作するために必要な電源電圧を生成する。そして、ICチップ500は、生成した電源電圧によって、ICチップ500内の制御用の論理回路、商品の固有情報等が格納された不揮発性メモリを動作させる。 The
Specifically, the
また、ICチップ500は、読取装置との間でデータの送受信を行うための通信回路等を動作させる。
In addition, the IC chip 500 operates a communication circuit and the like for transmitting and receiving data to and from the reader.
(粘着層400)
図3は、図2に示すRFタグ100のA-A断面の一例を示す模式図であり、図4は、RFタグ100のA-A断面の他の例を示す模式図である。
また、図5は、RFタグ100のA-A断面のさらに他の例を示す模式図であり、図6は、RFタグ100のA-A断面のさらに他の例を示す模式図である。 (Adhesive layer 400)
FIG. 3 is a schematic view showing an example of an AA cross section of theRF tag 100 shown in FIG. 2, and FIG. 4 is a schematic view showing another example of the AA cross section of the RF tag 100.
5 is a schematic view showing still another example of the cross section AA of theRF tag 100, and FIG. 6 is a schematic view showing still another example of the cross section AA of the RF tag 100. As shown in FIG.
図3は、図2に示すRFタグ100のA-A断面の一例を示す模式図であり、図4は、RFタグ100のA-A断面の他の例を示す模式図である。
また、図5は、RFタグ100のA-A断面のさらに他の例を示す模式図であり、図6は、RFタグ100のA-A断面のさらに他の例を示す模式図である。 (Adhesive layer 400)
FIG. 3 is a schematic view showing an example of an AA cross section of the
5 is a schematic view showing still another example of the cross section AA of the
図2または図3に示す本実施の形態における粘着層400は、両面テープからなる。粘着層400は、少なくともアンテナ部300の片面に設けられる。
なお、本実施の形態においては、粘着層400が両面テープからなることとしているが、これに限定されず、他の粘着層の形成または接着剤の塗布等であってもよい。また、両面テープは、インレット部200の回路210の全面でなく、一部であってもよい。
本実施の形態において、両面テープを例示したのは、後述するように、RFタグ100のアンテナ部300を商品またはシール等に貼着する場合、両面テープの剥離紙を、はがすことにより容易に貼着が可能だからである。 Theadhesive layer 400 in the present embodiment shown in FIG. 2 or 3 is a double-sided tape. The adhesive layer 400 is provided at least on one side of the antenna unit 300.
In the present embodiment, the pressure-sensitive adhesive layer 400 is made of a double-sided tape. However, the present invention is not limited to this, and another pressure-sensitive adhesive layer may be formed or an adhesive may be applied. Also, the double-sided tape may be a part of the circuit 210 of the inlet portion 200 instead of the entire surface.
In the present embodiment, the double-sided tape is exemplified, as will be described later, when theantenna unit 300 of the RF tag 100 is attached to a product or a seal, the release sheet of the double-sided tape is easily attached by peeling off. Because it is possible to wear.
なお、本実施の形態においては、粘着層400が両面テープからなることとしているが、これに限定されず、他の粘着層の形成または接着剤の塗布等であってもよい。また、両面テープは、インレット部200の回路210の全面でなく、一部であってもよい。
本実施の形態において、両面テープを例示したのは、後述するように、RFタグ100のアンテナ部300を商品またはシール等に貼着する場合、両面テープの剥離紙を、はがすことにより容易に貼着が可能だからである。 The
In the present embodiment, the pressure-
In the present embodiment, the double-sided tape is exemplified, as will be described later, when the
なお、本実施の形態においては、アンテナ部300の片面に粘着層400を設けることとしているが、これに限定されず、図4に示すように、アンテナ部300およびインレット部200の裏面側に、シート部材420を設けてもよい。なお、インレット部200のみに、シート部材420を設けても良い。
In the present embodiment, the adhesive layer 400 is provided on one side of the antenna unit 300. However, the present invention is not limited to this, and as shown in FIG. A sheet member 420 may be provided. The sheet member 420 may be provided only in the inlet portion 200.
また、図5に示すように、アンテナ部300およびインレット部200の裏面側から、インレット部200の側面を通過して表側まで、シート部材420を設けても良い。
Further, as shown in FIG. 5, the sheet member 420 may be provided from the back surface side of the antenna unit 300 and the inlet unit 200 to the front side through the side surface of the inlet unit 200.
具体的に、シート部材420は、主にポリエチレンテレフタレート、ポリイミド、ポリ塩化ビニル等の絶縁性のある素材または樹脂を1種または複数種を用いてもよく、さらに他の絶縁被膜処理を用いてもよい。
シート部材420は、数マイクロメートル以上数百マイクロメートル以下の厚みであることが好ましく、数十マイクロメートル程度の厚みであることがより好ましい。 Specifically, thesheet member 420 may be mainly made of one or more insulating materials or resins such as polyethylene terephthalate, polyimide, polyvinyl chloride, etc. Even if other insulating film processing is used. Good.
The thickness of thesheet member 420 is preferably several micrometers or more and several hundred micrometers or less, and more preferably several tens of micrometers or so.
シート部材420は、数マイクロメートル以上数百マイクロメートル以下の厚みであることが好ましく、数十マイクロメートル程度の厚みであることがより好ましい。 Specifically, the
The thickness of the
さらに図6に示すように、アンテナ部300の裏面側には、粘着層400を設け、インレット部200の少なくとも裏面側には、発泡材料450を設けても良い。発泡材料450は、発泡スチロール、ポリエチレン、ポリイミド、薄物発泡体(ボラ―ラ)等でもよく、あるいは絶縁性を有する他の発泡体または素材等の絶縁層、任意の発泡材料からなってもよい。
Furthermore, as shown in FIG. 6, an adhesive layer 400 may be provided on the back surface side of the antenna unit 300, and a foam material 450 may be provided on at least the back surface side of the inlet unit 200. The foam material 450 may be foam polystyrene, polyethylene, polyimide, thin foam (borer) or the like, or may be made of an insulation layer such as another foam or material having insulation properties, and any foam material.
その結果、RFタグ100のインレット部200における電気的導通を保護し、回路210を保護することができる。
As a result, the electrical conduction in the inlet portion 200 of the RF tag 100 can be protected, and the circuit 210 can be protected.
(等価回路)
また、図7は、RFタグ100の等価回路の一例を示す図である。
図7に示すように、RFタグ100の等価回路は、主にインダクタパターンLと、コンデンサCbと、ICチップ500とからなる。インダクタパターンL、コンデンサCbおよびICチップ500は、読取装置から送信される電波の周波数帯域で共振する共振回路を構成する。
この共振回路の共振周波数f[Hz]は、式(1)により与えられる。共振周波数fの値は、読取装置から送信される電波の周波数帯域に含まれるように設定される。 (Equivalent circuit)
FIG. 7 is a view showing an example of an equivalent circuit of theRF tag 100. As shown in FIG.
As shown in FIG. 7, the equivalent circuit of theRF tag 100 mainly includes an inductor pattern L, a capacitor Cb, and an IC chip 500. The inductor pattern L, the capacitor Cb, and the IC chip 500 constitute a resonant circuit that resonates in the frequency band of the radio wave transmitted from the reader.
The resonant frequency f [Hz] of this resonant circuit is given by equation (1). The value of the resonance frequency f is set to be included in the frequency band of the radio wave transmitted from the reader.
また、図7は、RFタグ100の等価回路の一例を示す図である。
図7に示すように、RFタグ100の等価回路は、主にインダクタパターンLと、コンデンサCbと、ICチップ500とからなる。インダクタパターンL、コンデンサCbおよびICチップ500は、読取装置から送信される電波の周波数帯域で共振する共振回路を構成する。
この共振回路の共振周波数f[Hz]は、式(1)により与えられる。共振周波数fの値は、読取装置から送信される電波の周波数帯域に含まれるように設定される。 (Equivalent circuit)
FIG. 7 is a view showing an example of an equivalent circuit of the
As shown in FIG. 7, the equivalent circuit of the
The resonant frequency f [Hz] of this resonant circuit is given by equation (1). The value of the resonance frequency f is set to be included in the frequency band of the radio wave transmitted from the reader.
式(1)において、La:インダクタパターンLのインダクタンス、Cb:ICチップ500内部の等価容量を意味する。
In the formula (1), L a: inductor pattern L of the inductance, C b: it means the equivalent capacitance of the IC chip 500.
ここで、本実施の形態においてICチップ500には、内部にコンデンサを含むものがあり、また、ICチップ500は浮遊容量を有する。そのため、共振回路の共振周波数fを設定する場合、ICチップ500内部の等価容量Cbを調整し、共振回路を形成する。すなわち、共振回路は、インダクタパターンLのインダクタンス、およびICチップ500の内部の等価容量Cbを考慮して設定された共振周波数fを有することが好ましい。
Here, in the present embodiment, the IC chip 500 includes a capacitor inside, and the IC chip 500 has a floating capacitance. Therefore, when setting the resonance frequency f of the resonant circuit, to adjust the equivalent capacitance C b of the IC chip 500, to form a resonant circuit. That is, the resonant circuit preferably having an inductor pattern L the inductance, and the IC chip 500 inside the equivalent capacitance C b was considered set resonant frequency f of the.
上記のように、ICチップ500内部の等価容量Cbを調整することで、共振回路の共振周波数fを、電波の周波数帯域に精度良く設定することができる。その結果、RFタグ100の読み取り性能をさらに向上させることができる。また、ICチップ500が生成する電源電圧をさらに高くすることができる。
As described above, by adjusting the equivalent capacitance C b of the IC chip 500, the resonance frequency f of the resonant circuit, it is possible to accurately set the radio frequency band. As a result, the reading performance of the RF tag 100 can be further improved. Further, the power supply voltage generated by the IC chip 500 can be further increased.
(RFタグ100の使用例)
図8は、RFタグ100の使用の一例を示す模式図であり、図9はRFタグ100の使用の他の例を示す模式図である。 (Example of using RF tag 100)
FIG. 8 is a schematic view showing an example of use of theRF tag 100, and FIG. 9 is a schematic view showing another example of use of the RF tag 100. As shown in FIG.
図8は、RFタグ100の使用の一例を示す模式図であり、図9はRFタグ100の使用の他の例を示す模式図である。 (Example of using RF tag 100)
FIG. 8 is a schematic view showing an example of use of the
図8に示すように、RFタグ100は、袋900の包装に形成されてもよい。
特に、袋900は、アルミ蒸着フィルムからなる場合について説明する。
図8に示すように、図3に示したRFタグ100を袋900に貼着させる場合、インレット部200の裏面の回路の電気的導通を保護するために、袋900の端部からインレット部200が突出するように、貼着されることが望ましい。 As shown in FIG. 8, theRF tag 100 may be formed in the package of the bag 900.
In particular, the case where thebag 900 is made of an aluminum vapor deposition film will be described.
As shown in FIG. 8, when theRF tag 100 shown in FIG. 3 is attached to the bag 900, the inlet 200 is attached from the end of the bag 900 to protect the electrical continuity of the circuit on the back of the inlet 200. It is desirable that it be stuck so that
特に、袋900は、アルミ蒸着フィルムからなる場合について説明する。
図8に示すように、図3に示したRFタグ100を袋900に貼着させる場合、インレット部200の裏面の回路の電気的導通を保護するために、袋900の端部からインレット部200が突出するように、貼着されることが望ましい。 As shown in FIG. 8, the
In particular, the case where the
As shown in FIG. 8, when the
一方、図9に示すように、図4、図5、図6に示したRFタグ100を袋900に貼着させる場合、インレット部200の裏面の回路の電気的導通が、シート部材420または発泡部材450により保護されているため、袋900のどの位置に配置させてもよい。
On the other hand, as shown in FIG. 9, when the RF tag 100 shown in FIG. 4, FIG. 5, FIG. 6 is attached to the bag 900, the electrical conduction of the circuit on the back surface of the inlet portion 200 Because it is protected by the member 450, it may be placed at any position of the bag 900.
(等価回路)
図10は、図9に示したRFタグ100と袋900とを含むRFタグ装置110の等価回路の一例を示す模式図である。 (Equivalent circuit)
FIG. 10 is a schematic view showing an example of an equivalent circuit of theRF tag device 110 including the RF tag 100 and the bag 900 shown in FIG.
図10は、図9に示したRFタグ100と袋900とを含むRFタグ装置110の等価回路の一例を示す模式図である。 (Equivalent circuit)
FIG. 10 is a schematic view showing an example of an equivalent circuit of the
図10に示すように、アンテナ部300および袋900のアルミ蒸着との間に、粘着層400またはシート部材420が介在されるので、コンデンサとして機能させることができる。
その結果、袋900の外層のアルミ蒸着フィルム部分をアンテナとして利用することができる。 As shown in FIG. 10, theadhesive layer 400 or the sheet member 420 is interposed between the antenna unit 300 and the aluminum deposition of the bag 900, so that it can function as a capacitor.
As a result, the aluminum deposited film portion of the outer layer of thebag 900 can be used as an antenna.
その結果、袋900の外層のアルミ蒸着フィルム部分をアンテナとして利用することができる。 As shown in FIG. 10, the
As a result, the aluminum deposited film portion of the outer layer of the
なお、本実施の形態においては、アルミ蒸着フィルムの袋900を例示したが、これに限定されず、袋、箱、商品に貼着されるシール等にRFタグ100を貼着することができる。
In the present embodiment, the bag 900 made of an aluminum vapor deposition film is illustrated, but the present invention is not limited to this, and the RF tag 100 can be attached to a bag, a box, a seal attached to a product, or the like.
以上のように、本実施の形態にかかるRFタグ100においては、インレット部200と、アンテナ部300とが接合して形成され、ICチップ500内部の静電容量CbとインダクタパターンLにより共振回路が形成される。その結果、RFタグ100の小型化を実現することができる。
また、アンテナ部300の周辺距離は、波長λに対して、λ/4、λ/2、3λ/4、5λ/8のいずれか1つに該当するよう設計するため、その結果、通信感度を飛躍的に向上させるとともに、無指向性の電波を受信することができる。 As described above, in theRF tag 100 according to the present embodiment, the inlet portion 200 and the antenna portion 300 are formed by bonding, and the resonance circuit is formed by the capacitance Cb inside the IC chip 500 and the inductor pattern L. It is formed. As a result, miniaturization of the RF tag 100 can be realized.
In addition, since the peripheral distance of theantenna unit 300 is designed to correspond to one of λ / 4, λ / 2, 3λ / 4, 5λ / 8 with respect to the wavelength λ, as a result, the communication sensitivity is increased. While dramatically improving, it is possible to receive nondirectional radio waves.
また、アンテナ部300の周辺距離は、波長λに対して、λ/4、λ/2、3λ/4、5λ/8のいずれか1つに該当するよう設計するため、その結果、通信感度を飛躍的に向上させるとともに、無指向性の電波を受信することができる。 As described above, in the
In addition, since the peripheral distance of the
さらに、アンテナ部300に粘着層400が形成されているので、粘着層400を介してRFタグ100を容易に取り付けることができる。また、接着剤を介して導体部材に取り付けた場合には、当該導体部材をアンテナにすることができる。
Furthermore, since the adhesive layer 400 is formed on the antenna unit 300, the RF tag 100 can be easily attached via the adhesive layer 400. Moreover, when it attaches to a conductor member via an adhesive agent, the said conductor member can be used as an antenna.
さらに、インレット部200は、粘着層400と同一面側にシート部材420または発泡材料450を有するので、導体部材に貼着された場合においても、インレット部200における電気的短絡を防止することができる。
Furthermore, since the inlet portion 200 has the sheet member 420 or the foam material 450 on the same side as the adhesive layer 400, it is possible to prevent an electrical short circuit in the inlet portion 200 even when attached to a conductor member. .
また、インレット部200をシート部材420または発泡材料450で包含することにより、RFタグ100の表裏面に関わらず、貼着することができる。また、RFタグ100を張り付けた商品を積層配置した場合においても、インレット部200における電気的短絡を防止することができる。
さらに、発泡樹脂は、発泡スチロールからなることが好ましい。発泡スチロールの場合、安価で容易に入手することができる。 In addition, by including theinlet portion 200 with the sheet member 420 or the foam material 450, it can be stuck regardless of the front and back of the RF tag 100. In addition, even when the products to which the RF tag 100 is attached are stacked and arranged, an electrical short circuit in the inlet portion 200 can be prevented.
Furthermore, the foamed resin preferably comprises expanded polystyrene. In the case of expanded polystyrene, it is inexpensive and easily available.
さらに、発泡樹脂は、発泡スチロールからなることが好ましい。発泡スチロールの場合、安価で容易に入手することができる。 In addition, by including the
Furthermore, the foamed resin preferably comprises expanded polystyrene. In the case of expanded polystyrene, it is inexpensive and easily available.
また、小型化されたRFタグ100を、袋900、箱、シール、樹脂シート、アルミニウム、包装フィルムのいずれかに貼着することで、管理を行うことができる。例えば、商品の製造工場、店舗、コンビニエンスストア等において、RFタグ100を商品に容易に貼着することができる。
Further, management can be performed by sticking the miniaturized RF tag 100 on any of the bag 900, a box, a seal, a resin sheet, aluminum, and a packaging film. For example, the RF tag 100 can be easily attached to a product in a product manufacturing plant, a store, a convenience store, or the like.
本発明においては、RFタグ100が、「RFタグ」に相当し、RFタグ装置110が「RFタグ装置」に相当し、ICチップ500が「ICチップ」に相当し、インダクタパターンLが「インダクタパターン」に相当し、インレット部200が、「インレット部」に相当し、アンテナ部300が「アンテナ部」に相当し、粘着層400が「粘着層」に相当し、シート部材420または発泡材料450が「非導電体層」に相当し、アンテナ部300の外周長さ値が「アンテナ部の周辺距離」に相当し、発泡材料450が「発泡樹脂」に相当し、袋900が「袋、箱、商品を包装するフィルム、樹脂シート、アルミニウム薄膜、商品に貼着されるシールのいずれか」に相当する。
In the present invention, the RF tag 100 corresponds to an "RF tag", the RF tag device 110 corresponds to an "RF tag device", the IC chip 500 corresponds to an "IC chip", and the inductor pattern L is "inductor". The inlet portion 200 corresponds to the “inlet portion”, the antenna portion 300 corresponds to the “antenna portion”, the adhesive layer 400 corresponds to the “adhesive layer”, and the sheet member 420 or the foam material 450 Corresponds to the "non-conductive layer", the outer peripheral length value of the antenna unit 300 corresponds to the "distance around the antenna unit", the foam material 450 corresponds to the "foam resin", and the bag 900 is "bag, box" , A film for packaging a product, a resin sheet, an aluminum thin film, or any of a seal applied to a product.
本発明の好ましい一実施の形態は上記の通りであるが、本発明はそれだけに制限されない。本発明の精神と範囲から逸脱することのない様々な実施形態が他になされることは理解されよう。さらに、本実施形態において、本発明の構成による作用および効果を述べているが、これら作用および効果は、一例であり、本発明を限定するものではない。
Although a preferred embodiment of the present invention is as described above, the present invention is not limited thereto. It will be understood that various other embodiments may be made without departing from the spirit and scope of the present invention. Furthermore, in the present embodiment, actions and effects according to the configuration of the present invention are described, but these actions and effects are only examples and do not limit the present invention.
100 RFタグ
110 RFタグ装置
200 インレット部
300 アンテナ
400 粘着層
420 シール部材
450 発泡材料
500 ICチップ
900 袋
DESCRIPTION OFSYMBOLS 100 RF tag 110 RF tag apparatus 200 inlet part 300 antenna 400 adhesive layer 420 seal member 450 foam material 500 IC chip 900 bag
110 RFタグ装置
200 インレット部
300 アンテナ
400 粘着層
420 シール部材
450 発泡材料
500 ICチップ
900 袋
DESCRIPTION OF
Claims (7)
- ICチップおよびインダクタパターンを含むインレット部と、
読取装置から送信されたデータの送受信に用いるアンテナ部と、が接合して形成され、
前記ICチップの内部の静電容量と、前記インダクタパターンと、により共振回路が形成され、読取装置と通信を行う、RFタグ。 An inlet section including an IC chip and an inductor pattern,
And an antenna unit used to transmit and receive data transmitted from the reading device.
An RF tag which forms a resonant circuit by the internal capacitance of the IC chip and the inductor pattern and communicates with a reader. - 前記アンテナ部の周辺距離は、UHF帯RFID周波数の波数の波長λに対して、λ/4、λ/2、3λ/4、5λ/8のいずれか1つに該当するよう設計された、請求項1記載のRFタグ。 The peripheral distance of the antenna unit is designed to correspond to one of λ / 4, λ / 2, 3/2, 4/5, and 5/8 with respect to the wavelength λ of the wave number of the UHF band RFID frequency. The RF tag according to Item 1.
- 前記アンテナ部は、粘着層を有する、請求項1または2記載のRFタグ。 The RF tag according to claim 1, wherein the antenna unit has an adhesive layer.
- 前記インレット部は、前記粘着層と同一面側に非導電体層を有する、請求項3記載のRFタグ。 The RF tag according to claim 3, wherein the inlet portion has a non-conductive layer on the same surface side as the adhesive layer.
- 前記インレット部は、前記非導電体層で包含されている、請求項4に記載のRFタグ。 The RF tag according to claim 4, wherein the inlet portion is included in the nonconductive layer.
- 前記非導電体層は、発泡樹脂からなる、請求項4または5に記載のRFタグ。 The RF tag according to claim 4, wherein the nonconductive layer is made of a foamed resin.
- 請求項1乃至6のいずれか1項に記載のRFタグと、
袋、箱、商品を包装するフィルム、樹脂シート、アルミニウム薄膜、商品に貼着されるシールのいずれかと、を含み、
前記袋、箱、商品を包装するフィルム、樹脂シート、アルミニウム薄膜、商品に貼着されるシールのいずれかに前記RFタグが貼着された、RFタグ装置。 The RF tag according to any one of claims 1 to 6.
Including a bag, a box, a film for packaging goods, a resin sheet, an aluminum thin film, and any of a seal applied to the goods,
An RF tag device in which the RF tag is attached to any of the bag, a box, a film for packaging a product, a resin sheet, an aluminum thin film, and a seal attached to a product.
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JP2019536747A JP7133228B2 (en) | 2017-08-18 | 2018-08-08 | RF tag and RF tag device |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010092120A (en) * | 2008-10-03 | 2010-04-22 | Toppan Printing Co Ltd | Non-contact information medium and booklet with non-contact information medium |
WO2013011865A1 (en) * | 2011-07-19 | 2013-01-24 | 株式会社村田製作所 | Antenna module, antenna device, rfid tag, and communication terminal device |
JP2017076340A (en) * | 2015-10-16 | 2017-04-20 | 株式会社スマート | Linear antenna ic tag, system thereof, and manufacturing method |
-
2018
- 2018-08-08 WO PCT/JP2018/029705 patent/WO2019035396A1/en active Application Filing
- 2018-08-08 JP JP2019536747A patent/JP7133228B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010092120A (en) * | 2008-10-03 | 2010-04-22 | Toppan Printing Co Ltd | Non-contact information medium and booklet with non-contact information medium |
WO2013011865A1 (en) * | 2011-07-19 | 2013-01-24 | 株式会社村田製作所 | Antenna module, antenna device, rfid tag, and communication terminal device |
JP2017076340A (en) * | 2015-10-16 | 2017-04-20 | 株式会社スマート | Linear antenna ic tag, system thereof, and manufacturing method |
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JP7133228B2 (en) | 2022-09-08 |
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