WO2019023855A1 - Shielding case and terminal - Google Patents

Shielding case and terminal Download PDF

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Publication number
WO2019023855A1
WO2019023855A1 PCT/CN2017/095196 CN2017095196W WO2019023855A1 WO 2019023855 A1 WO2019023855 A1 WO 2019023855A1 CN 2017095196 W CN2017095196 W CN 2017095196W WO 2019023855 A1 WO2019023855 A1 WO 2019023855A1
Authority
WO
WIPO (PCT)
Prior art keywords
cover
thickness
groove
shield
tangential
Prior art date
Application number
PCT/CN2017/095196
Other languages
French (fr)
Chinese (zh)
Inventor
刘静平
叶连杰
靳宏伟
曹胜辉
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN202110310881.7A priority Critical patent/CN113226002B/en
Priority to CN201780092999.9A priority patent/CN110870396B/en
Priority to PCT/CN2017/095196 priority patent/WO2019023855A1/en
Publication of WO2019023855A1 publication Critical patent/WO2019023855A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Definitions

  • Embodiments of the present invention relate to an electronic device, and more particularly to a shield cover and a terminal.
  • Electronic products usually include a Printed Circuit Board. Multiple electronic components can be mounted or placed on the PCB. To prevent electromagnetic interference or to protect some electronic components, one or more shields can be placed on the PCB to place some electronic components inside the shield.
  • the shield is usually made of stainless steel or copper alloy.
  • the shield is typically designed in a detachable form.
  • the detachable shield includes a shield frame and a shield cover.
  • the shielding frame is soldered to the circuit board by surface mount technology (SMT), and the shielding cover is fastened to the upper part of the shielding frame to form a closed cavity, and the electronic components in the cavity are shielded and protected.
  • SMT surface mount technology
  • the shield cover can be repeatedly removed.
  • detachable shields are typically bulky and costly.
  • Embodiments of the present invention provide a shield cover and a terminal, which can reduce the volume and reduce the cost.
  • an embodiment of the present invention provides a shield cover, the shield cover (300) comprising: a cover body side (302) and a cover upper surface (304).
  • the cover upper surface (304) includes at least one first half tangent structure (310); the first half tangent structure (310) encloses a semi-closed or closed shape, the first half tangent structure (310) ) includes a first recess (312) located outside the cover.
  • the thickness of the cover at the first half tangential structure (310) in the upper surface (304) of the cover is smaller than the thickness of the other cover.
  • the thickness of the cover other than the at least one first half-tangential structure (310) in the upper surface (304) of the cover is a first thickness
  • the cover of the first groove (312) The thickness is a second thickness
  • the second thickness is less than the first thickness.
  • the thickness of the cover at the first half of the tangential structure (310) is relatively small, such that the shield is easily torn or cut along the first half of the tangential structure.
  • the shield provided in this embodiment is integrated and has a small volume. Thus, while ensuring the convenience of maintenance, the present embodiment provides a shield that is small in size and low in cost.
  • the first half tangential structure (310) further includes a second groove (314) located inside the cover body; a first groove (312) of the same first half tangential structure (310) Corresponding to the position of the second groove (314).
  • the thickness of the cover between the first groove (312) and the second groove (314) of the same first half-tangential structure (310) is a third thickness, and the third thickness is smaller than the first thickness. With the second recess, the thickness of the cover at the first half of the tangential structure can be smaller, making it easier to tear or cut.
  • first groove (312) or the second groove (314) has a triangular, rectangular, trapezoidal or other shape in cross section. Any two of the first half-tangent structures (310) of the at least one first half-tangent structure (310) are formed in the same or different shape.
  • any one of the at least one first half-tangent structure (310) is surrounded by a triangle, a rectangle, a polygon, a circle or other shapes.
  • the cover side (302) may include at least one second half-tangent structure (320).
  • the second half tangential structure (320) includes a third recess (322) located outside the cover.
  • the thickness of the cover at the second half tangential structure (320) in the side (302) of the cover is smaller than the thickness of the other cover.
  • the thickness of the cover other than the at least one second half tangent structure (320) in the side surface (302) of the cover is a fourth thickness
  • the thickness of the cover at the third groove (322) The fifth thickness is less than the fourth thickness.
  • the second half tangential structure is similar to the first half tangential structure except that the second half tangential structure does not need to enclose a closed shape.
  • the second half tangential structure (320) further includes a fourth groove (324) located inside the cover body; and a third groove (322) of the same second half tangential structure (320) Corresponding to the position of the fourth groove (324).
  • the thickness of the cover between the third groove (322) and the fourth groove (324) of the same second half tangential structure (320) is a sixth thickness, and the sixth thickness is smaller than the fourth thickness.
  • the third groove (322) or the fourth groove (324) has a triangular, rectangular or trapezoidal cross section.
  • the second half tangent structure (320) is parallel to the side edges (3021) in the side (302) of the cover.
  • the second half tangential structure (320) extends toward the upper surface (304) of the cover, and the extended second half tangential structure (320) intersects the first half tangential structure (310) .
  • the second half tangential structure (320) intersects the first half tangential structure (310), it is easier to remove the shield.
  • an embodiment of the present invention further provides a terminal, including: a circuit board, a plurality of electronic components disposed on the circuit board, and a shielding cover over the one or more of the electronic components;
  • the shield is any of the shields of the first aspect.
  • FIG. 1 is a block diagram showing a part of a structure of a terminal according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram of a circuit board of a terminal according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a shield cover according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of another shielding cover according to an embodiment of the present invention.
  • 5A-5D are cross-sectional views showing a first half tangent structure in the direction of A-A' in Fig. 3;
  • 6A-6D are cross-sectional views showing another first half-tangent structure in the direction of A-A' in Fig. 3;
  • FIGS. 7A-7B are schematic diagrams of a shield cover during maintenance according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of another shielding cover according to an embodiment of the present invention.
  • 9A and 9B are cross-sectional views showing a second half tangential structure in the direction of B-B' in Fig. 8;
  • 9C and 9D are cross-sectional views showing another second half-tangential structure in the direction of B-B' in Fig. 8;
  • FIG. 10 is a schematic diagram of another shielding cover according to an embodiment of the present invention.
  • FIG. 11 is a schematic view of the embodiment of the present invention when the shield cover is removed.
  • the shield provided by the embodiments of the present invention can be applied to various terminals.
  • the terminal can be, for example, a mobile phone, a tablet personal computer, a laptop computer, a digital camera, Electronic devices such as personal digital assistants (PDAs), navigation devices, mobile Internet devices (MIDs), or wearable devices.
  • PDAs personal digital assistants
  • MIDs mobile Internet devices
  • FIG. 1 is a block diagram showing a partial structure of a terminal according to an embodiment of the present invention.
  • the terminal is described by taking the mobile phone 100 as an example.
  • the mobile phone 100 includes: a radio frequency (RF) circuit 110, a power source 120, a processor 130, a memory 140, an input unit 150, a display unit 160, a sensor 170, and audio.
  • the circuit 180 and a component such as a wireless fidelity (WiFi) module 190.
  • WiFi wireless fidelity
  • the components of the mobile phone 100 will be specifically described below with reference to FIG. 1 :
  • the RF circuit 110 can be used to send and receive information or to receive and transmit signals during a call.
  • the RF circuit 110 may send downlink data received from the base station to the processor 130 for processing, and send the uplink data to the base station.
  • RF circuits include, but are not limited to, RF chips, antennas, at least one amplifier, transceiver, coupler, Low Noise Amplifier (LNA), duplexer, RF switch, and the like.
  • LNA Low Noise Amplifier
  • RF circuitry 110 can also communicate wirelessly with networks and other devices.
  • the wireless communication may use any communication standard or protocol, including but not limited to Global System of Mobile communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (Code). Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), E-mail, Short Messaging Service (SMS), etc.
  • GSM Global System of Mobile communication
  • GPRS General Packet Radio Service
  • CDMA Code Division Multiple
  • the memory 140 can be used to store software programs and modules, and the processor 130 executes various functional applications and data processing of the mobile phone 100 by running software programs and modules stored in the memory 140.
  • the memory 140 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application required for at least one function (such as a sound playing function, an image playing function, etc.), and the like; the storage data area may be stored. Data created according to the use of the mobile phone 100 (such as audio data, phone book, etc.).
  • memory 140 can include high speed random access memory, and can also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.
  • the input unit 150 can be configured to receive input numeric or character information and to generate key signal inputs related to user settings and function control of the handset 100.
  • the input unit 150 may include a touch panel 151 and other input devices 152.
  • the touch panel 151 also referred to as a touch screen, can collect touch operations on or near the user (such as the user using a finger, a stylus, or the like on the touch panel 151 or near the touch panel 151. Operation), and drive the corresponding connecting device according to a preset program.
  • the touch panel 151 may include two parts: a touch detection device and a touch controller.
  • the touch detection device detects the touch orientation of the user, and detects a signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts the touch information into contact coordinates, and sends the touch information.
  • the processor 130 is provided and can receive commands from the processor 130 and execute them.
  • the touch panel 151 can be implemented in various types such as resistive, capacitive, infrared, and surface acoustic waves.
  • the input unit 150 may also include other input devices 152.
  • other input devices 152 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control buttons, switch buttons, etc.), trackballs, mice, joysticks, and the like.
  • the display unit 160 can be used to display information input by the user or information provided to the user and each of the mobile phone 100 Kind of menu.
  • the display unit 160 may include a display panel 161.
  • the display panel 161 may be configured in the form of a liquid crystal display (LCD) or an organic light-emitting diode (OLED).
  • the touch panel 151 can cover the display panel 161. When the touch panel 151 detects a touch operation on or near the touch panel 151, the touch panel 151 transmits to the processor 130 to determine the type of the touch event, and then the processor 130 according to the touch event. The type provides a corresponding visual output on display panel 161.
  • the touch panel 151 and the display panel 161 are two independent components to implement the input and input functions of the mobile phone 100 in FIG. 1, in some embodiments, the touch panel 151 may be integrated with the display panel 161. The input and output functions of the mobile phone 100 are implemented.
  • the handset 100 can also include at least one type of sensor 170, such as a light sensor, motion sensor, and other sensors.
  • the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel 161 according to the brightness of the ambient light, and the proximity sensor may close the display panel 161 when the mobile phone 100 moves to the ear. / or backlight.
  • the accelerometer sensor can detect the magnitude of acceleration in all directions (usually three axes). When it is stationary, it can detect the magnitude and direction of gravity. It can be used to identify the gesture of the mobile phone (such as horizontal and vertical screen switching, related Game, magnetometer attitude calibration), vibration recognition related functions (such as pedometer, tapping).
  • the mobile phone 100 can also be configured with other sensors such as a gyroscope, a barometer, a hygrometer, a thermometer, an infrared sensor, and the like, and will not be described herein.
  • the audio circuit 180, the speaker 181, and the microphone 182 can provide an audio interface between the user and the handset 100.
  • the audio circuit 180 can transmit the converted electrical data of the received audio data to the speaker 181 for conversion to the sound signal output by the speaker 181; on the other hand, the microphone 182 converts the collected sound signal into an electrical signal by the audio circuit 180. After receiving, it is converted into audio data, and then the audio data is output to the RF circuit 110 for transmission to, for example, another mobile phone, or the audio data is output to the memory 140 for further processing.
  • WiFi is a short-range wireless transmission technology
  • the mobile phone 100 can help users to send and receive emails, browse web pages, and access streaming media through the WiFi module 190, which provides wireless broadband Internet access for users.
  • FIG. 1 shows the WiFi module 190, it can be understood that it does not belong to the essential configuration of the mobile phone 100, and may be omitted as needed within the scope of not changing the essence of the invention.
  • the processor 130 is the control center of the handset 100, which connects various portions of the entire handset using various interfaces and lines, by running or executing software programs and/or modules stored in the memory 140, and recalling data stored in the memory 140, The various functions and processing data of the mobile phone 100 are executed, thereby realizing various services based on the mobile phone.
  • the processor 130 may include one or more processing units; preferably, the processor 130 may integrate an application processor and a modem processor, where the application processor mainly processes an operating system, a user interface, an application, and the like.
  • the modem processor primarily handles wireless communications. It can be understood that the above modem processor may not be integrated into the processor 130.
  • the mobile phone 100 also includes a power source 120 (such as a battery) that supplies power to various components.
  • a power source 120 such as a battery
  • the power source can be logically coupled to the processor 130 through a power management system to manage functions such as charging, discharging, and power consumption through the power management system.
  • the mobile phone 100 may further include a camera, a Bluetooth module, and the like, and details are not described herein.
  • Figure 1 shows a block diagram of a part of the structure of the mobile phone.
  • the terminal includes a circuit board, which is generally a PCB board.
  • the PCB is provided with electronic components required for the terminal, wherein the electronic components include, but are not limited to, various capacitors, resistors, inductors, sensors, chips, and the like. Further, the PCB board is arranged There are one or more shields that are overlying a portion of the electronic components that are placed in the enclosed cavity of the shield.
  • FIG. 2 is a schematic diagram of a circuit board of a terminal according to an embodiment of the present invention.
  • the circuit board 200 is included in the terminal.
  • a plurality of electronic components may be included on the circuit board 200.
  • One or more shields 300 may also be included on the circuit board 200.
  • the shield 300 is overlaid on one or more of the electronic components, and the shield 300 is attached to the circuit board 200.
  • the shield 300 can be soldered to the circuit board 200 by SMT. After the shield 300 is soldered to the circuit board 200, a closed cavity is formed between the shield 300 and the circuit board 200, the enclosed cavity containing one or more electronic components that need to be shielded or protected.
  • FIG. 3 is a schematic diagram of a shield cover according to an embodiment of the present invention.
  • the shield 300 includes a cover side 302 and a cover upper surface 304.
  • the opposite side of the upper surface 304 of the cover has no shielding cover, that is, the opposite surface of the upper surface 304 of the cover is empty.
  • the cover side 302 is a circumferentially surrounding surface, i.e., the portion of the shield 300 that is connected to the cover upper surface 304 and to the circuit board is referred to as the cover side 302.
  • the shield cover 300 can be integrally formed, and the cover side surface 302 and the cover upper surface 304 are fixedly connected and cannot be repeatedly removed. Thus, the shield is small in size and low in cost.
  • One or more first half tangential structures 310 may be included in the upper surface 304 of the shell.
  • the first half tangential structure 310 can enclose a closed shape, as shown in FIG. 3, the closed shape being a rectangle.
  • the closed shape may also be a triangle, a polygon, a circle, or other shapes.
  • the shapes of any two of the plurality of first half-tangential structures 310 may be the same or different.
  • the first half-tangential structure 310 can also be enclosed in a semi-closed shape.
  • FIG. 4 is a schematic diagram of another shielding cover according to an embodiment of the present invention, wherein a first half-tangential structure 310 is enclosed. It is a semi-closed rectangle. It should be noted that any two first half-tangential structures 310 do not intersect, that is, the areas enclosed by any two first half-tangential structures 310 are not connected.
  • the thickness of the cover at the first half of the tangential structure 310 is less than the thickness of the cover other than the first half of the tangential structure 310.
  • FIG. 5A-5D are cross-sectional views showing a first half tangential structure in the direction of A-A' in Fig. 3, respectively.
  • the first half tangential structure 310 includes a first recess 312 located outside of the housing.
  • the outer side of the cover means that the cover of the shield is exposed on the outer side after the shield is soldered on the circuit board.
  • the first groove 312 can have a variety of shapes. For example, as shown in FIG. 5A, the first groove 312 has a triangular cross section. As shown in FIG. 5B, the first groove 312 has a rectangular cross section. As shown in FIG. 5C, the first groove 312 has a trapezoidal cross section. Wherein, as shown in FIG.
  • the thickness of the cover body other than the first half-tangential structure 310 in the upper surface 304 of the cover body is the first thickness L1
  • the thickness of the cover body at the first groove 312 is the second thickness. L2
  • the second thickness L2 is smaller than the first thickness L1.
  • FIGS. 6A-6D are cross-sectional views showing another first half-tangential structure in the direction of A-A' in Fig. 3, respectively.
  • the first semi-tangential structure 310 further includes a second recess 314 located inside the cover.
  • the inside of the cover means that the cover of the shield faces one side of the internal electronic component after the shield is soldered to the circuit board.
  • the positions of the first groove 312 and the second groove 314 correspond.
  • the shape of the second groove 314 may also be various.
  • the cross section of the second groove 314 may be triangular, rectangular, trapezoidal or the like.
  • the shapes of the first groove 312 and the second groove 314 may be the same or different.
  • the thickness of the cover between the first groove 312 and the second groove 314 of the same first half-tangential structure 310 is a third thickness L3, and the third thickness L3 is smaller than the first Thickness L1.
  • first half tangential structures 310 are included in the cover upper surface 304 of the shield.
  • the thickness of the cover at the first half of the tangential structure 310 is smaller than the thickness of the cover at other locations, so that the shield can be torn along the semi-tangential structure under a certain external force without damaging other portions of the shield.
  • a first half-tangential structure 310 surrounds the area 330.
  • an external force such as a small tool such as a tweezers or a pliers, may be used along the first half-tangential structure.
  • the region 330 can be torn away by tearing the shield away from an opening 314 (shown in Figure 7A) which is shaped to encompass the semi-tangential structure.
  • an opening 314 shown in Figure 7A
  • the torn cover can be cut off by means of scissors after the opening is torn open.
  • a copper foil or other film material 700 having shielding properties (as shown in FIG. 7B) may be applied to the already opened opening 314, the area of the material 700 being larger than the opening 314, and the material 700 completely covering the opening. 314, to ensure that the shield is still shielded after repair, can be used normally.
  • the embodiment of the invention provides an easy-pull integrated shield cover, and a structure similar to a can lid is designed by a half-tangential structure, and an easy-to-remove area is designed in a designated area on the surface of the shield cover.
  • the detachable area can be easily removed by small tools such as tweezers and pliers.
  • the present embodiment provides a small-sized, low-cost shield cover on the basis of ensuring ease of maintenance.
  • FIG. 8 is a schematic diagram of another shielding cover according to an embodiment of the present invention.
  • the cover side 302 of the shield can include one or more second half-tangential structures 320.
  • the thickness of the cover at the second half tangential structure 320 is less than the thickness of the cover other than the second half tangential structure 310.
  • the second half tangential structure is similar to the first half tangential structure except that the second half tangential structure need not be enclosed in a semi-closed or closed shape.
  • FIG. 9A and 9B are cross-sectional views showing a second half tangential structure in the direction of B-B' in Fig. 8.
  • Fig. 9A and Fig. 9B are plan views of the cross section in the B-B' direction.
  • the second half tangential structure 320 includes a third recess 322 located outside the shield of the shield.
  • the outer side of the cover means that the cover of the shield is exposed on the outer side after the shield is soldered on the circuit board.
  • the shape of the third groove 322 is similar to the shape of the aforementioned first groove 312, and may have various shapes. As shown in FIG.
  • the thickness of the cover other than the at least one second half-tangential structure 320 in the side surface 302 of the cover is a fourth thickness L4
  • the thickness of the cover at the third groove 322 is The fifth thickness L5 is smaller than the fourth thickness L4.
  • FIG. 9C and 9D are cross-sectional views showing another second half-tangent structure in the direction of B-B' in Fig. 8.
  • the second half-tangential structure 320 further includes a fourth recess 324 located inside the cover.
  • the inside of the cover means that the cover of the shield faces one side of the internal electronic component after the shield is soldered to the circuit board.
  • the positions of the third groove 322 and the fourth groove 324 correspond.
  • the shape of the fourth groove 324 may also be various.
  • the cross section of the fourth groove 324 may be a triangle, a rectangle, a trapezoid or the like.
  • the shapes of the third groove 322 and the fourth groove 324 may be the same or different.
  • the thickness of the cover between the third groove 322 and the fourth groove 324 of the same second half-tangential structure 320 is a sixth thickness L6, and the sixth thickness L6 is smaller than the fourth Thickness L4.
  • the second half tangential structure 320 may be adjacent to the side edge 3021 of the side surface 302 of the cover body. Parallel.
  • FIG. 10 is a schematic diagram of another shielding cover according to an embodiment of the present invention.
  • the second half-tangential structure 320 may extend toward the upper surface 304 of the cover, and the extended second half-tangential structure 320 and the The first half of the tangent structure 310 intersects.
  • the embodiment of the present invention When servicing a terminal, it is sometimes necessary to remove the entire shield from the board.
  • the embodiment of the present invention also provides a semi-tangential structure on the side of the shield.
  • you can use a tool such as tweezers, pliers, scissors, etc. to tear off the area of the upper surface of the cover that is surrounded by the first half of the tangential structure, and then use the tool to cut the cover along the second half of the tangential line.
  • the cover may be cut along the second half-tangential structure 3201, and then the region 1001 is heated by a hot air blower.
  • the portion 340 of the shield in the region 1001 is separated from the circuit board, and then the cover can be cut along the second half tangential structure 3202, thereby allowing the shield 340 region to be completely removed from the circuit board. Take it down. After removing it, use a local heat gun to remove the next part until the shield is completely removed.
  • the shield provided in this embodiment can be disassembled in steps, so that the electronic component or the circuit board can be protected from being damaged. In the prior art, the shield needs to be heated by the whole to be removed. When the whole area is heated, the pad of the electronic component is cracked, thereby causing the electronic component or the circuit board to fail.
  • the shielding cover provided in this embodiment can ensure the safety of the electronic components and the circuit board.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Embodiments of the present invention provide a shielding case and a terminal. The shielding case (300) comprises case body side surfaces (302) and a case body upper surface (304). The case body upper surface (304) comprises at least one first semitangent structure (310). The first semitangent structure (310) defines a semi-closed or closed shape in a surrounding manner. The first semitangent structure (310) comprises a first groove (312) located outside the case body. The thickness of the case body expect the first semitangent structure (310) on the case body upper surface (304) is a first thickness, the thickness of the case body in the first groove (312) is a second thickness, and the second thickness is smaller than the first thickness. The shielding case provided in the embodiment of the present invention has a small volume and low costs, and allows an electronic element inside the shielding case to be easily maintained.

Description

一种屏蔽罩和终端Shield and terminal 技术领域Technical field
本发明实施例涉及电子设备，尤其涉及一种屏蔽罩和终端。Embodiments of the present invention relate to an electronic device, and more particularly to a shield cover and a terminal.
背景技术Background technique
电子产品中通常包括印制电路板(Printed Circuit Board)。PCB板上可以安装或布置多个电子元件。为了防止电磁干扰或者为了对一些电子元件进行保护，PCB板上可以设置一个或多个屏蔽罩，将一些电子元件置于屏蔽罩之内。屏蔽罩通常使用的材料为不锈钢或者铜合金。Electronic products usually include a Printed Circuit Board. Multiple electronic components can be mounted or placed on the PCB. To prevent electromagnetic interference or to protect some electronic components, one or more shields can be placed on the PCB to place some electronic components inside the shield. The shield is usually made of stainless steel or copper alloy.
为便于对屏蔽罩内部的电子元件进行维修和故障检查，屏蔽罩通常被设计成可拆卸的形式。可拆卸的屏蔽罩包括屏蔽框和屏蔽盖。其中，屏蔽框通过表面贴装技术(surface mount technology，SMT)焊在电路板上，屏蔽盖扣合在屏蔽框的上部，形成封闭的腔体，对该腔体内的电子元件进行屏蔽和保护。该屏蔽盖可以反复拆卸。然而，可拆卸的屏蔽罩通常体积大、且成本高。To facilitate maintenance and troubleshooting of the electronic components inside the shield, the shield is typically designed in a detachable form. The detachable shield includes a shield frame and a shield cover. The shielding frame is soldered to the circuit board by surface mount technology (SMT), and the shielding cover is fastened to the upper part of the shielding frame to form a closed cavity, and the electronic components in the cavity are shielded and protected. The shield cover can be repeatedly removed. However, detachable shields are typically bulky and costly.
发明内容Summary of the invention
本发明实施例提供了一种屏蔽罩和终端，能够减小体积、降低成本。Embodiments of the present invention provide a shield cover and a terminal, which can reduce the volume and reduce the cost.
第一方面，本发明实施例提供一种屏蔽罩，所述屏蔽罩(300)包括：罩体侧面(302)和罩体上表面(304)。所述罩体上表面(304)包括至少一个第一半切线结构(310)；所述第一半切线结构(310)围成一个半封闭或封闭的形状，所述第一半切线结构(310)包括位于所述罩体外侧的第一凹槽(312)。所述罩体上表面(304)中所述第一半切线结构(310)处的罩体的厚度，小于其它位置罩体的厚度。例如：所述罩体上表面(304)中除所述至少一个第一半切线结构(310)以外的罩体的厚度为第一厚度，所述第一凹槽(312)处的罩体的厚度为第二厚度，所述第二厚度小于所述第一厚度。第一半切线结构(310)处的罩体厚度比较小，使得屏蔽罩易于沿第一半切线结构撕开或剪开。并且，本实施例提供的屏蔽罩是一体的，体积较小。由此，在保证了维修便捷性的同时，本实施例提供了一种体积小、成本低的屏蔽罩。In a first aspect, an embodiment of the present invention provides a shield cover, the shield cover (300) comprising: a cover body side (302) and a cover upper surface (304). The cover upper surface (304) includes at least one first half tangent structure (310); the first half tangent structure (310) encloses a semi-closed or closed shape, the first half tangent structure (310) ) includes a first recess (312) located outside the cover. The thickness of the cover at the first half tangential structure (310) in the upper surface (304) of the cover is smaller than the thickness of the other cover. For example, the thickness of the cover other than the at least one first half-tangential structure (310) in the upper surface (304) of the cover is a first thickness, and the cover of the first groove (312) The thickness is a second thickness, and the second thickness is less than the first thickness. The thickness of the cover at the first half of the tangential structure (310) is relatively small, such that the shield is easily torn or cut along the first half of the tangential structure. Moreover, the shield provided in this embodiment is integrated and has a small volume. Thus, while ensuring the convenience of maintenance, the present embodiment provides a shield that is small in size and low in cost.
进一步的，所述第一半切线结构(310)还包括位于所述罩体内侧的第二凹槽(314)；同一个所述第一半切线结构(310)的第一凹槽(312)和第二凹槽(314)的位置相对应。同一个所述第一半切线结构(310)的第一凹槽(312)和第二凹槽(314)之间的罩体的厚度为第三厚度，所述第三厚度小于所述第一厚度。有了第二凹槽之后，第一半切线结构处的罩体厚度可以更小，更便于撕开或剪开。Further, the first half tangential structure (310) further includes a second groove (314) located inside the cover body; a first groove (312) of the same first half tangential structure (310) Corresponding to the position of the second groove (314). The thickness of the cover between the first groove (312) and the second groove (314) of the same first half-tangential structure (310) is a third thickness, and the third thickness is smaller than the first thickness. With the second recess, the thickness of the cover at the first half of the tangential structure can be smaller, making it easier to tear or cut.
其中，所述第一凹槽(312)或所述第二凹槽(314)的横截面为三角形、矩形、梯形或其它形状。所述至少一个第一半切线结构(310)中的任意两个第一半切线结构(310)围成的形状相同或不同。Wherein, the first groove (312) or the second groove (314) has a triangular, rectangular, trapezoidal or other shape in cross section. Any two of the first half-tangent structures (310) of the at least one first half-tangent structure (310) are formed in the same or different shape.
其中，所述至少一个第一半切线结构(310)中的任意一个围成三角形、矩形、多边形、圆形或其它形状。 Wherein any one of the at least one first half-tangent structure (310) is surrounded by a triangle, a rectangle, a polygon, a circle or other shapes.
进一步的，为了方便将屏蔽罩整个从电路板上取下来，所述罩体侧面(302)可以包括至少一个第二半切线结构(320)。所述第二半切线结构(320)包括位于所述罩体外侧的第三凹槽(322)。所述罩体侧面(302)中所述第二半切线结构(320)处的罩体的厚度，小于其它位置罩体的厚度。例如：所述罩体侧面(302)中除所述至少一个第二半切线结构(320)以外的罩体的厚度为第四厚度，所述第三凹槽(322)处的罩体的厚度为第五厚度，所述第五厚度小于所述第四厚度。第二半切线结构与第一半切线结构类似，只是第二半切线结构不需要围成一个封闭的形状。Further, in order to facilitate the removal of the shield from the circuit board, the cover side (302) may include at least one second half-tangent structure (320). The second half tangential structure (320) includes a third recess (322) located outside the cover. The thickness of the cover at the second half tangential structure (320) in the side (302) of the cover is smaller than the thickness of the other cover. For example, the thickness of the cover other than the at least one second half tangent structure (320) in the side surface (302) of the cover is a fourth thickness, and the thickness of the cover at the third groove (322) The fifth thickness is less than the fourth thickness. The second half tangential structure is similar to the first half tangential structure except that the second half tangential structure does not need to enclose a closed shape.
进一步的，所述第二半切线结构(320)还包括位于所述罩体内侧的第四凹槽(324)；同一个所述第二半切线结构(320)的第三凹槽(322)和第四凹槽(324)的位置相对应。同一个所述第二半切线结构(320)的第三凹槽(322)和第四凹槽(324)之间的罩体的厚度为第六厚度，所述第六厚度小于所述第四厚度。其中，所述第三凹槽(322)或所述第四凹槽(324)的横截面为三角形、矩形或梯形。Further, the second half tangential structure (320) further includes a fourth groove (324) located inside the cover body; and a third groove (322) of the same second half tangential structure (320) Corresponding to the position of the fourth groove (324). The thickness of the cover between the third groove (322) and the fourth groove (324) of the same second half tangential structure (320) is a sixth thickness, and the sixth thickness is smaller than the fourth thickness. Wherein, the third groove (322) or the fourth groove (324) has a triangular, rectangular or trapezoidal cross section.
其中，所述第二半切线结构(320)与所述罩体侧面(302)中的侧棱(3021)相平行。Wherein the second half tangent structure (320) is parallel to the side edges (3021) in the side (302) of the cover.
进一步的，所述第二半切线结构(320)向所述罩体上表面(304)延伸，延伸后的所述第二半切线结构(320)与所述第一半切线结构(310)相交。当第二半切线结构(320)与第一半切线结构(310)相交时，更便于拆卸屏蔽罩。Further, the second half tangential structure (320) extends toward the upper surface (304) of the cover, and the extended second half tangential structure (320) intersects the first half tangential structure (310) . When the second half tangential structure (320) intersects the first half tangential structure (310), it is easier to remove the shield.
第二方面，本发明实施例还提供一种终端，包括：电路板，置于所述电路板上的多个电子元件，以及罩在一个或多个所述电子元件上的屏蔽罩；所述屏蔽罩为第一方面所述的任意一种屏蔽罩。In a second aspect, an embodiment of the present invention further provides a terminal, including: a circuit board, a plurality of electronic components disposed on the circuit board, and a shielding cover over the one or more of the electronic components; The shield is any of the shields of the first aspect.
附图说明DRAWINGS
图1为本发明实施例提供的终端的部分结构框图；1 is a block diagram showing a part of a structure of a terminal according to an embodiment of the present invention;
图2为本发明实施例提供的终端的电路板的示意图；2 is a schematic diagram of a circuit board of a terminal according to an embodiment of the present invention;
图3为本发明实施例提供的一种屏蔽罩的示意图；3 is a schematic diagram of a shield cover according to an embodiment of the present invention;
图4为本发明实施例提供的另一种屏蔽罩的示意图；4 is a schematic diagram of another shielding cover according to an embodiment of the present invention;
图5A-图5D分别为图3中A-A’方向上一种第一半切线结构的剖面图；5A-5D are cross-sectional views showing a first half tangent structure in the direction of A-A' in Fig. 3;
图6A-图6D分别为图3中A-A’方向上另一种第一半切线结构的剖面图；6A-6D are cross-sectional views showing another first half-tangent structure in the direction of A-A' in Fig. 3;
图7A-图7B为本发明实施例提供的维修时屏蔽罩的示意图；7A-7B are schematic diagrams of a shield cover during maintenance according to an embodiment of the present invention;
图8为本发明实施例提供的另一种屏蔽罩的示意图；FIG. 8 is a schematic diagram of another shielding cover according to an embodiment of the present invention; FIG.
图9A和图9B为图8中B-B’方向上一种第二半切线结构的剖面图；9A and 9B are cross-sectional views showing a second half tangential structure in the direction of B-B' in Fig. 8;
图9C和图9D为图8中B-B’方向上另一种第二半切线结构的剖面图；9C and 9D are cross-sectional views showing another second half-tangential structure in the direction of B-B' in Fig. 8;
图10为本发明实施例提供的另一种屏蔽罩的示意图；FIG. 10 is a schematic diagram of another shielding cover according to an embodiment of the present invention; FIG.
图11为本发明实施例提供的拆卸屏蔽罩时的示意图。FIG. 11 is a schematic view of the embodiment of the present invention when the shield cover is removed.
具体实施方式Detailed ways
本发明各实施例提供的屏蔽罩可以应用于各种终端中。该终端例如可以为：移动电话、平板电脑(Tablet Personal Computer)、膝上型电脑(Laptop Computer)、数码相机、 个人数字助理(personal digital assistant，简称PDA)、导航装置、移动上网装置(Mobile Internet Device，MID)或可穿戴式设备(Wearable Device)等电子设备。The shield provided by the embodiments of the present invention can be applied to various terminals. The terminal can be, for example, a mobile phone, a tablet personal computer, a laptop computer, a digital camera, Electronic devices such as personal digital assistants (PDAs), navigation devices, mobile Internet devices (MIDs), or wearable devices.
图1为本发明实施例提供的终端的部分结构框图。该终端以手机100为例进行说明，参考图1，手机100包括：射频(Radio Frequency，RF)电路110、电源120、处理器130、存储器140、输入单元150、显示单元160、传感器170、音频电路180、以及无线保真(wireless fidelity，WiFi)模块190等部件。本领域技术人员可以理解，图1中示出的手机结构并不构成对手机的限定，可以包括比图示更多或更少的部件，或者组合某些部件，或者不同的部件布置。FIG. 1 is a block diagram showing a partial structure of a terminal according to an embodiment of the present invention. The terminal is described by taking the mobile phone 100 as an example. Referring to FIG. 1 , the mobile phone 100 includes: a radio frequency (RF) circuit 110, a power source 120, a processor 130, a memory 140, an input unit 150, a display unit 160, a sensor 170, and audio. The circuit 180, and a component such as a wireless fidelity (WiFi) module 190. It will be understood by those skilled in the art that the structure of the handset shown in FIG. 1 does not constitute a limitation to the handset, and may include more or less components than those illustrated, or some components may be combined, or different components may be arranged.
下面结合图1对手机100的各个构成部件进行具体的介绍：The components of the mobile phone 100 will be specifically described below with reference to FIG. 1 :
RF电路110可用于收发信息或在通话过程中进行信号的接收和发送。例如：RF电路110可以将从基站接收的下行数据发送给处理器130处理，并把上行数据发送给基站。通常，RF电路包括但不限于RF芯片、天线、至少一个放大器、收发信机、耦合器、低噪声放大器(Low Noise Amplifier，LNA)、双工器、射频开关等。此外，RF电路110还可以与网络和其他设备进行无线通信。所述无线通信可以使用任一通信标准或协议，包括但不限于全球移动通讯***(Global System of Mobile communication，GSM)、通用分组无线服务(General Packet Radio Service，GPRS)、码分多址(Code Division Multiple Access，CDMA)、宽带码分多址(Wideband Code Division Multiple Access，WCDMA)、长期演进(Long Term Evolution，LTE)、电子邮件、短消息服务(Short Messaging Service，SMS)等。The RF circuit 110 can be used to send and receive information or to receive and transmit signals during a call. For example, the RF circuit 110 may send downlink data received from the base station to the processor 130 for processing, and send the uplink data to the base station. Generally, RF circuits include, but are not limited to, RF chips, antennas, at least one amplifier, transceiver, coupler, Low Noise Amplifier (LNA), duplexer, RF switch, and the like. In addition, RF circuitry 110 can also communicate wirelessly with networks and other devices. The wireless communication may use any communication standard or protocol, including but not limited to Global System of Mobile communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (Code). Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), E-mail, Short Messaging Service (SMS), etc.
存储器140可用于存储软件程序以及模块，处理器130通过运行存储在存储器140的软件程序以及模块，从而执行手机100的各种功能应用以及数据处理。存储器140可主要包括存储程序区和存储数据区，其中，存储程序区可存储操作***、至少一个功能所需的应用程序(比如声音播放功能、图象播放功能等)等；存储数据区可存储根据手机100的使用所创建的数据(比如音频数据、电话本等)等。此外，存储器140可以包括高速随机存取存储器，还可以包括非易失性存储器，例如至少一个磁盘存储器件、闪存器件、或其他易失性固态存储器件。The memory 140 can be used to store software programs and modules, and the processor 130 executes various functional applications and data processing of the mobile phone 100 by running software programs and modules stored in the memory 140. The memory 140 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application required for at least one function (such as a sound playing function, an image playing function, etc.), and the like; the storage data area may be stored. Data created according to the use of the mobile phone 100 (such as audio data, phone book, etc.). Moreover, memory 140 can include high speed random access memory, and can also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.
输入单元150可用于接收输入的数字或字符信息，以及产生与手机100的用户设置以及功能控制有关的键信号输入。具体地，输入单元150可包括触控面板151以及其他输入设备152。触控面板151，也称为触摸屏，可收集用户在其上或附近的触摸操作(比如用户使用手指、触笔等任何适合的物体或附件在触控面板151上或在触控面板151附近的操作)，并根据预先设定的程式驱动相应的连接装置。可选的，触控面板151可包括触摸检测装置和触摸控制器两个部分。其中，触摸检测装置检测用户的触摸方位，并检测触摸操作带来的信号，将信号传送给触摸控制器；触摸控制器从触摸检测装置上接收触摸信息，并将它转换成触点坐标，再送给处理器130，并能接收处理器130发来的命令并加以执行。此外，可以采用电阻式、电容式、红外线以及表面声波等多种类型实现触控面板151。除了触控面板151，输入单元150还可以包括其他输入设备152。具体地，其他输入设备152可以包括但不限于物理键盘、功能键(比如音量控制按键、开关按键等)、轨迹球、鼠标、操作杆等中的一种或多种。The input unit 150 can be configured to receive input numeric or character information and to generate key signal inputs related to user settings and function control of the handset 100. Specifically, the input unit 150 may include a touch panel 151 and other input devices 152. The touch panel 151, also referred to as a touch screen, can collect touch operations on or near the user (such as the user using a finger, a stylus, or the like on the touch panel 151 or near the touch panel 151. Operation), and drive the corresponding connecting device according to a preset program. Optionally, the touch panel 151 may include two parts: a touch detection device and a touch controller. Wherein, the touch detection device detects the touch orientation of the user, and detects a signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts the touch information into contact coordinates, and sends the touch information. The processor 130 is provided and can receive commands from the processor 130 and execute them. In addition, the touch panel 151 can be implemented in various types such as resistive, capacitive, infrared, and surface acoustic waves. In addition to the touch panel 151, the input unit 150 may also include other input devices 152. Specifically, other input devices 152 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control buttons, switch buttons, etc.), trackballs, mice, joysticks, and the like.
显示单元160可用于显示由用户输入的信息或提供给用户的信息以及手机100的各 种菜单。显示单元160可包括显示面板161，可选的，可以采用液晶显示屏(liquid crystal display，简称为LCD)、机电激光显示(organic light-emitting diode，简称为OLED)等形式来配置显示面板161。进一步的，触控面板151可覆盖显示面板161，当触控面板151检测到在其上或附近的触摸操作后，传送给处理器130以确定触摸事件的类型，随后处理器130根据触摸事件的类型在显示面板161上提供相应的视觉输出。虽然在图1中，触控面板151与显示面板161是作为两个独立的部件来实现手机100的输入和输入功能，但是在某些实施例中，可以将触控面板151与显示面板161集成而实现手机100的输入和输出功能。The display unit 160 can be used to display information input by the user or information provided to the user and each of the mobile phone 100 Kind of menu. The display unit 160 may include a display panel 161. Alternatively, the display panel 161 may be configured in the form of a liquid crystal display (LCD) or an organic light-emitting diode (OLED). Further, the touch panel 151 can cover the display panel 161. When the touch panel 151 detects a touch operation on or near the touch panel 151, the touch panel 151 transmits to the processor 130 to determine the type of the touch event, and then the processor 130 according to the touch event. The type provides a corresponding visual output on display panel 161. Although the touch panel 151 and the display panel 161 are two independent components to implement the input and input functions of the mobile phone 100 in FIG. 1, in some embodiments, the touch panel 151 may be integrated with the display panel 161. The input and output functions of the mobile phone 100 are implemented.
手机100还可包括至少一种传感器170，比如光传感器、运动传感器以及其他传感器。具体地，光传感器可包括环境光传感器及接近传感器，其中，环境光传感器可根据环境光线的明暗来调节显示面板161的亮度，接近传感器可在手机100移动到耳边时，关闭显示面板161和/或背光。作为运动传感器的一种，加速计传感器可检测各个方向上(一般为三轴)加速度的大小，静止时可检测出重力的大小及方向，可用于识别手机姿态的应用(比如横竖屏切换、相关游戏、磁力计姿态校准)、振动识别相关功能(比如计步器、敲击)等。手机100还可以配置的陀螺仪、气压计、湿度计、温度计、红外线传感器等其他传感器，在此不再赘述。The handset 100 can also include at least one type of sensor 170, such as a light sensor, motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel 161 according to the brightness of the ambient light, and the proximity sensor may close the display panel 161 when the mobile phone 100 moves to the ear. / or backlight. As a kind of motion sensor, the accelerometer sensor can detect the magnitude of acceleration in all directions (usually three axes). When it is stationary, it can detect the magnitude and direction of gravity. It can be used to identify the gesture of the mobile phone (such as horizontal and vertical screen switching, related Game, magnetometer attitude calibration), vibration recognition related functions (such as pedometer, tapping). The mobile phone 100 can also be configured with other sensors such as a gyroscope, a barometer, a hygrometer, a thermometer, an infrared sensor, and the like, and will not be described herein.
音频电路180、扬声器181、麦克风182可提供用户与手机100之间的音频接口。音频电路180可将接收到的音频数据转换后的电信号，传输到扬声器181，由扬声器181转换为声音信号输出；另一方面，麦克风182将收集的声音信号转换为电信号，由音频电路180接收后转换为音频数据，再将音频数据输出至RF电路110以发送给比如另一手机，或者将音频数据输出至存储器140以便进一步处理。The audio circuit 180, the speaker 181, and the microphone 182 can provide an audio interface between the user and the handset 100. The audio circuit 180 can transmit the converted electrical data of the received audio data to the speaker 181 for conversion to the sound signal output by the speaker 181; on the other hand, the microphone 182 converts the collected sound signal into an electrical signal by the audio circuit 180. After receiving, it is converted into audio data, and then the audio data is output to the RF circuit 110 for transmission to, for example, another mobile phone, or the audio data is output to the memory 140 for further processing.
WiFi属于短距离无线传输技术，手机100通过WiFi模块190可以帮助用户收发电子邮件、浏览网页和访问流式媒体等，它为用户提供了无线的宽带互联网访问。虽然图1示出了WiFi模块190，但是可以理解的是，其并不属于手机100的必须构成，完全可以根据需要在不改变发明的本质的范围内而省略。WiFi is a short-range wireless transmission technology, and the mobile phone 100 can help users to send and receive emails, browse web pages, and access streaming media through the WiFi module 190, which provides wireless broadband Internet access for users. Although FIG. 1 shows the WiFi module 190, it can be understood that it does not belong to the essential configuration of the mobile phone 100, and may be omitted as needed within the scope of not changing the essence of the invention.
处理器130是手机100的控制中心，利用各种接口和线路连接整个手机的各个部分，通过运行或执行存储在存储器140内的软件程序和/或模块，以及调用存储在存储器140内的数据，执行手机100的各种功能和处理数据，从而实现基于手机的多种业务。可选的，处理器130可包括一个或多个处理单元；优选的，处理器130可集成应用处理器和调制解调处理器，其中，应用处理器主要处理操作***、用户界面和应用程序等，调制解调处理器主要处理无线通信。可以理解的是，上述调制解调处理器也可以不集成到处理器130中。The processor 130 is the control center of the handset 100, which connects various portions of the entire handset using various interfaces and lines, by running or executing software programs and/or modules stored in the memory 140, and recalling data stored in the memory 140, The various functions and processing data of the mobile phone 100 are executed, thereby realizing various services based on the mobile phone. Optionally, the processor 130 may include one or more processing units; preferably, the processor 130 may integrate an application processor and a modem processor, where the application processor mainly processes an operating system, a user interface, an application, and the like. The modem processor primarily handles wireless communications. It can be understood that the above modem processor may not be integrated into the processor 130.
手机100还包括给各个部件供电的电源120(比如电池)，优选的，电源可以通过电源管理***与处理器130逻辑相连，从而通过电源管理***实现管理充电、放电、以及功耗等功能。The mobile phone 100 also includes a power source 120 (such as a battery) that supplies power to various components. Preferably, the power source can be logically coupled to the processor 130 through a power management system to manage functions such as charging, discharging, and power consumption through the power management system.
尽管未示出，手机100还可以包括摄像头、蓝牙模块等，在此不再赘述。Although not shown, the mobile phone 100 may further include a camera, a Bluetooth module, and the like, and details are not described herein.
图1示出的是手机的部分结构框图。而在终端的实际结构中，终端中包括电路板，一般为PCB板。该PCB板上布置有所述终端所需使用的电子元件，其中所述的电子元件包括但不限于：各种电容、电阻、电感、传感器、芯片等。进一步的，PCB板上布置 有一个或多个屏蔽罩，屏蔽罩扣在部分电子元件之上，将这些电子元件置于所述屏蔽罩的封闭腔体中。Figure 1 shows a block diagram of a part of the structure of the mobile phone. In the actual structure of the terminal, the terminal includes a circuit board, which is generally a PCB board. The PCB is provided with electronic components required for the terminal, wherein the electronic components include, but are not limited to, various capacitors, resistors, inductors, sensors, chips, and the like. Further, the PCB board is arranged There are one or more shields that are overlying a portion of the electronic components that are placed in the enclosed cavity of the shield.
图2为本发明实施例提供的终端的电路板的示意图。如图2所示，终端中包括电路板200。电路板200上可以包括多个电子元件(图中未示出)。电路板200上还可以包括一个或多个屏蔽罩300。屏蔽罩300罩在一个或多个所述电子元件上，且屏蔽罩300固定在电路板200上，例如可以通过SMT将屏蔽罩300焊在电路板200上。屏蔽罩300焊接在电路板200之后，屏蔽罩300和电路板200之间形成封闭的腔体，该封闭的腔体容纳有需要屏蔽或保护的一个或多个电子元件。FIG. 2 is a schematic diagram of a circuit board of a terminal according to an embodiment of the present invention. As shown in FIG. 2, the circuit board 200 is included in the terminal. A plurality of electronic components (not shown) may be included on the circuit board 200. One or more shields 300 may also be included on the circuit board 200. The shield 300 is overlaid on one or more of the electronic components, and the shield 300 is attached to the circuit board 200. For example, the shield 300 can be soldered to the circuit board 200 by SMT. After the shield 300 is soldered to the circuit board 200, a closed cavity is formed between the shield 300 and the circuit board 200, the enclosed cavity containing one or more electronic components that need to be shielded or protected.
图3为本发明实施例提供的一种屏蔽罩的示意图。如图3所示，屏蔽罩300包括罩体侧面302和罩体上表面304。其中罩体上表面304相对的面没有屏蔽罩体，即罩体上表面304相对的面是空的。罩体侧面302为围绕一周的面，即屏蔽罩300中与罩体上表面304相连且与电路板相连的部分称为罩体侧面302。屏蔽罩300可以一体成型，罩体侧面302和罩体上表面304固定连接，不可反复拆卸。由此，该屏蔽罩的体积较小，成本低。FIG. 3 is a schematic diagram of a shield cover according to an embodiment of the present invention. As shown in FIG. 3, the shield 300 includes a cover side 302 and a cover upper surface 304. The opposite side of the upper surface 304 of the cover has no shielding cover, that is, the opposite surface of the upper surface 304 of the cover is empty. The cover side 302 is a circumferentially surrounding surface, i.e., the portion of the shield 300 that is connected to the cover upper surface 304 and to the circuit board is referred to as the cover side 302. The shield cover 300 can be integrally formed, and the cover side surface 302 and the cover upper surface 304 are fixedly connected and cannot be repeatedly removed. Thus, the shield is small in size and low in cost.
罩体上表面304中可以包括一个或多个第一半切线结构310。该第一半切线结构310可以围成一个封闭的形状，如图3所示，该封闭的形状为矩形。可选的，该封闭的形状还可以为三角形、多边形、圆形或其它形状。其中，多个第一半切线结构310中的任意两个围成的形状可以相同也可以不同。该第一半切线结构310也可以围成一个半封闭的形状，如图4所示，图4为本发明实施例提供的另一种屏蔽罩的示意图，其中一个第一半切线结构310围成的即为半封闭的矩形。需要说明的是，任意两个第一半切线结构310不相交，即任意两个第一半切线结构310围成的区域不相连。One or more first half tangential structures 310 may be included in the upper surface 304 of the shell. The first half tangential structure 310 can enclose a closed shape, as shown in FIG. 3, the closed shape being a rectangle. Optionally, the closed shape may also be a triangle, a polygon, a circle, or other shapes. The shapes of any two of the plurality of first half-tangential structures 310 may be the same or different. The first half-tangential structure 310 can also be enclosed in a semi-closed shape. As shown in FIG. 4, FIG. 4 is a schematic diagram of another shielding cover according to an embodiment of the present invention, wherein a first half-tangential structure 310 is enclosed. It is a semi-closed rectangle. It should be noted that any two first half-tangential structures 310 do not intersect, that is, the areas enclosed by any two first half-tangential structures 310 are not connected.
第一半切线结构310处的罩体的厚度比除第一半切线结构310以外的罩体的厚度小。The thickness of the cover at the first half of the tangential structure 310 is less than the thickness of the cover other than the first half of the tangential structure 310.
图5A-图5D分别为图3中A-A’方向上一种第一半切线结构的剖面图。如图5A-图5D所示，第一半切线结构310包括位于罩体外侧的第一凹槽312。所述的罩体外侧指的是：当该屏蔽罩焊接在电路板上之后，所述屏蔽罩的罩体露在外面的一侧。该第一凹槽312可以有多种形状。例如图5A所示，第一凹槽312的横截面为三角形。如图5B所示，第一凹槽312的横截面为矩形。如图5C所示，第一凹槽312的横截面为梯形。其中，如图5D所示，罩体上表面304中除所述第一半切线结构310以外的罩体的厚度为第一厚度L1，第一凹槽312处的罩体的厚度为第二厚度L2，所述第二厚度L2小于所述第一厚度L1。5A-5D are cross-sectional views showing a first half tangential structure in the direction of A-A' in Fig. 3, respectively. As shown in Figures 5A-5D, the first half tangential structure 310 includes a first recess 312 located outside of the housing. The outer side of the cover means that the cover of the shield is exposed on the outer side after the shield is soldered on the circuit board. The first groove 312 can have a variety of shapes. For example, as shown in FIG. 5A, the first groove 312 has a triangular cross section. As shown in FIG. 5B, the first groove 312 has a rectangular cross section. As shown in FIG. 5C, the first groove 312 has a trapezoidal cross section. Wherein, as shown in FIG. 5D, the thickness of the cover body other than the first half-tangential structure 310 in the upper surface 304 of the cover body is the first thickness L1, and the thickness of the cover body at the first groove 312 is the second thickness. L2, the second thickness L2 is smaller than the first thickness L1.
图6A-图6D分别为图3中A-A’方向上另一种第一半切线结构的剖面图。如图6A-图6D所示，第一半切线结构310还包括位于罩体内侧的第二凹槽314。所述的罩体内侧指的是：当该屏蔽罩焊接在电路板上之后，所述屏蔽罩的罩体朝向内部电子元件的一侧。对于同一个第一半切线结构310而言，第一凹槽312和第二凹槽314的位置相对应。第二凹槽314的形状也可以有多种，例如第二凹槽314的横截面可以为三角形、矩形、梯形等。对于同一个第一半切线结构310，第一凹槽312和第二凹槽314的形状可以相同，也可以不同。如图6D所示，同一个第一半切线结构310的第一凹槽312和第二凹槽314之间的罩体的厚度为第三厚度L3，所述第三厚度L3小于所述第一厚度L1。 6A-6D are cross-sectional views showing another first half-tangential structure in the direction of A-A' in Fig. 3, respectively. As shown in Figures 6A-6D, the first semi-tangential structure 310 further includes a second recess 314 located inside the cover. The inside of the cover means that the cover of the shield faces one side of the internal electronic component after the shield is soldered to the circuit board. For the same first half tangential structure 310, the positions of the first groove 312 and the second groove 314 correspond. The shape of the second groove 314 may also be various. For example, the cross section of the second groove 314 may be triangular, rectangular, trapezoidal or the like. For the same first half tangential structure 310, the shapes of the first groove 312 and the second groove 314 may be the same or different. As shown in FIG. 6D, the thickness of the cover between the first groove 312 and the second groove 314 of the same first half-tangential structure 310 is a third thickness L3, and the third thickness L3 is smaller than the first Thickness L1.
在屏蔽罩的罩体上表面304中，包括一个或多个第一半切线结构310。第一半切线结构310处的罩体厚度小于其它地方的罩体厚度，使得屏蔽罩能够在一定的外力作用下沿半切线结构被撕开，而不破坏屏蔽罩的其他部分。如图3所示，一个第一半切线结构310包围着区域330，当该屏蔽罩内的电子元件需要检修时，可以通过外力，例如使用镊子、钳子等小工具，沿该第一半切线结构310可以将区域330撕掉，即将屏蔽罩撕开一个开口314(如图7A所示)，该开口的形状即为该半切线结构围成的形状。当该半切线结构围成的形状为半封闭形状时，在撕开开口之后，可以借助剪刀将撕开的罩体剪掉。当在维修之后，可以在已经撕开的开口314处贴合铜箔或者其他具有屏蔽性能的膜式材料700(如图7B所示)，材料700的面积大于开口314，且材料700完全覆盖开口314，以保证屏蔽罩在维修后仍然具有屏蔽性能，可以正常使用。其中，在屏蔽罩未被撕开之前，整个屏蔽罩中是没有开孔的。由于任意两个第一半切线结构围成的区域不相连，所以相邻的易拉区域之间还有屏蔽罩，由此当易拉区域被撕掉之后，还可以保证屏蔽罩的强度。In the cover upper surface 304 of the shield, one or more first half tangential structures 310 are included. The thickness of the cover at the first half of the tangential structure 310 is smaller than the thickness of the cover at other locations, so that the shield can be torn along the semi-tangential structure under a certain external force without damaging other portions of the shield. As shown in FIG. 3, a first half-tangential structure 310 surrounds the area 330. When the electronic components in the shield need to be repaired, an external force, such as a small tool such as a tweezers or a pliers, may be used along the first half-tangential structure. The region 330 can be torn away by tearing the shield away from an opening 314 (shown in Figure 7A) which is shaped to encompass the semi-tangential structure. When the shape of the semi-tangential structure is a semi-closed shape, the torn cover can be cut off by means of scissors after the opening is torn open. After repair, a copper foil or other film material 700 having shielding properties (as shown in FIG. 7B) may be applied to the already opened opening 314, the area of the material 700 being larger than the opening 314, and the material 700 completely covering the opening. 314, to ensure that the shield is still shielded after repair, can be used normally. There is no opening in the entire shield before the shield is not torn. Since the area enclosed by any two first half-tangential structures is not connected, there is a shield between the adjacent easy-to-pull regions, so that the strength of the shield can be ensured after the easy-pull region is torn off.
本发明实施例提供一种易拉式一体式屏蔽罩，通过半切线结构设计类似易拉罐盖子的结构，在屏蔽罩表面指定区域设计易于拆卸的区域。拆卸时，可以通过镊子、钳子等小工具便捷地拆下可拆卸区域。由此，本实施例在保证便于维修的基础上，提供了一种体积小、成本低的屏蔽罩。The embodiment of the invention provides an easy-pull integrated shield cover, and a structure similar to a can lid is designed by a half-tangential structure, and an easy-to-remove area is designed in a designated area on the surface of the shield cover. When disassembling, the detachable area can be easily removed by small tools such as tweezers and pliers. Thus, the present embodiment provides a small-sized, low-cost shield cover on the basis of ensuring ease of maintenance.
图8为本发明实施例提供的另一种屏蔽罩的示意图。如图8所示，在前述实施例的基础上，该屏蔽罩的罩体侧面302可以包括一个或多个第二半切线结构320。第二半切线结构320处的罩体的厚度比除第二半切线结构310以外的罩体的厚度小。第二半切线结构与第一半切线结构类似，只是第二半切线结构不需要围成一个半封闭或封闭的形状。FIG. 8 is a schematic diagram of another shielding cover according to an embodiment of the present invention. As shown in FIG. 8, on the basis of the foregoing embodiments, the cover side 302 of the shield can include one or more second half-tangential structures 320. The thickness of the cover at the second half tangential structure 320 is less than the thickness of the cover other than the second half tangential structure 310. The second half tangential structure is similar to the first half tangential structure except that the second half tangential structure need not be enclosed in a semi-closed or closed shape.
图9A和图9B为图8中B-B’方向上一种第二半切线结构的剖面图。其中，图9A和图9B为B-B’方向上的剖面的俯视图。如图9A所示，第二半切线结构320包括位于屏蔽罩的罩体外侧的第三凹槽322。所述的罩体外侧指的是：当该屏蔽罩焊接在电路板上之后，所述屏蔽罩的罩体露在外面的一侧。该第三凹槽322的形状与前述第一凹槽312的形状类似，可以为多种形状。如图9B所示，所述罩体侧面302中除所述至少一个第二半切线结构320以外的罩体的厚度为第四厚度L4，所述第三凹槽322处的罩体的厚度为第五厚度L5，所述第五厚度L5小于所述第四厚度L4。9A and 9B are cross-sectional views showing a second half tangential structure in the direction of B-B' in Fig. 8. Here, Fig. 9A and Fig. 9B are plan views of the cross section in the B-B' direction. As shown in FIG. 9A, the second half tangential structure 320 includes a third recess 322 located outside the shield of the shield. The outer side of the cover means that the cover of the shield is exposed on the outer side after the shield is soldered on the circuit board. The shape of the third groove 322 is similar to the shape of the aforementioned first groove 312, and may have various shapes. As shown in FIG. 9B, the thickness of the cover other than the at least one second half-tangential structure 320 in the side surface 302 of the cover is a fourth thickness L4, and the thickness of the cover at the third groove 322 is The fifth thickness L5 is smaller than the fourth thickness L4.
图9C和图9D为图8中B-B’方向上另一种第二半切线结构的剖面图。如图9C所示，所述第二半切线结构320还包括位于罩体内侧的第四凹槽324。所述的罩体内侧指的是：当该屏蔽罩焊接在电路板上之后，所述屏蔽罩的罩体朝向内部电子元件的一侧。对于同一个第二半切线结构320，第三凹槽322和第四凹槽324的位置相对应。第四凹槽324的形状也可以有多种，例如第四凹槽324的横截面可以为三角形、矩形、梯形等。对于同一个第二半切线结构320，第三凹槽322和第四凹槽324的形状可以相同，也可以不同。如图9D所示，同一个第二半切线结构320的第三凹槽322和第四凹槽324之间的罩体的厚度为第六厚度L6，所述第六厚度L6小于所述第四厚度L4。9C and 9D are cross-sectional views showing another second half-tangent structure in the direction of B-B' in Fig. 8. As shown in FIG. 9C, the second half-tangential structure 320 further includes a fourth recess 324 located inside the cover. The inside of the cover means that the cover of the shield faces one side of the internal electronic component after the shield is soldered to the circuit board. For the same second half tangential structure 320, the positions of the third groove 322 and the fourth groove 324 correspond. The shape of the fourth groove 324 may also be various. For example, the cross section of the fourth groove 324 may be a triangle, a rectangle, a trapezoid or the like. For the same second half tangential structure 320, the shapes of the third groove 322 and the fourth groove 324 may be the same or different. As shown in FIG. 9D, the thickness of the cover between the third groove 322 and the fourth groove 324 of the same second half-tangential structure 320 is a sixth thickness L6, and the sixth thickness L6 is smaller than the fourth Thickness L4.
其中，如图8所示，所述第二半切线结构320可以与所述罩体侧面302中的侧棱3021 相平行。Wherein, as shown in FIG. 8 , the second half tangential structure 320 may be adjacent to the side edge 3021 of the side surface 302 of the cover body. Parallel.
图10为本发明实施例提供的另一种屏蔽罩的示意图。如图10所示，在图8所示实施例的基础上，所述第二半切线结构320可以向所述罩体上表面304延伸，延伸后的所述第二半切线结构320与所述第一半切线结构310相交。FIG. 10 is a schematic diagram of another shielding cover according to an embodiment of the present invention. As shown in FIG. 10, on the basis of the embodiment shown in FIG. 8, the second half-tangential structure 320 may extend toward the upper surface 304 of the cover, and the extended second half-tangential structure 320 and the The first half of the tangent structure 310 intersects.
在维修终端时，有时需要把整个屏蔽罩都从电路板上取下来。为了方便取下整个屏蔽罩，本发明实施例在屏蔽罩的侧面也设置半切线结构。在要取下整个屏蔽罩时，可以先用镊子、钳子、剪刀等工具撕掉罩体上表面中由第一半切线结构围着的区域，再用工具沿第二半切线将罩体剪开，然后从沿第二半切线剪开的区域开始，通过热风枪局部加热，使得屏蔽罩焊在电路板上的一部分与电路板分离，直至相邻的一个第二半切线结构处，就可以沿该相邻的第二半切线结构，将屏蔽罩的一部分拆下来。如图11所示，在撕掉罩体上表面中由第一半切线结构围着的区域之后，可以先沿第二半切线结构3201剪开罩体，然后用热风机对区域1001进行加热，使得区域1001内的屏蔽罩的一部分区域340与电路板相分离，然后可以再沿着第二半切线结构3202将罩体剪开，由此，就可以把屏蔽罩的区域340完全从电路板上取下来。在拆下来之后，再使用热风枪局部加热，拆卸下一部分，直至将屏蔽罩全部拆卸下来。本实施例提供的屏蔽罩，可以分步被拆卸，从而可以保证电子元件或电路板不被破坏。现有技术中，屏蔽罩需要被整体加热才能取掉，当整体大面积加热时，会导致电子元器件的焊盘崩裂，从而导致电子元件或电路板失效。而本实施例提供的屏蔽罩，可以保证电子元件和电路板的安全。When servicing a terminal, it is sometimes necessary to remove the entire shield from the board. In order to facilitate the removal of the entire shield, the embodiment of the present invention also provides a semi-tangential structure on the side of the shield. When removing the entire shield, you can use a tool such as tweezers, pliers, scissors, etc. to tear off the area of the upper surface of the cover that is surrounded by the first half of the tangential structure, and then use the tool to cut the cover along the second half of the tangential line. And then starting from the area cut along the second half of the tangential line, by local heating by the heat gun, so that a part of the shield welded on the circuit board is separated from the circuit board until an adjacent second half of the tangent structure can be along The adjacent second half tangential structure removes a portion of the shield. As shown in FIG. 11, after the region surrounded by the first half-tangential structure in the upper surface of the cover is torn off, the cover may be cut along the second half-tangential structure 3201, and then the region 1001 is heated by a hot air blower. The portion 340 of the shield in the region 1001 is separated from the circuit board, and then the cover can be cut along the second half tangential structure 3202, thereby allowing the shield 340 region to be completely removed from the circuit board. Take it down. After removing it, use a local heat gun to remove the next part until the shield is completely removed. The shield provided in this embodiment can be disassembled in steps, so that the electronic component or the circuit board can be protected from being damaged. In the prior art, the shield needs to be heated by the whole to be removed. When the whole area is heated, the pad of the electronic component is cracked, thereby causing the electronic component or the circuit board to fail. The shielding cover provided in this embodiment can ensure the safety of the electronic components and the circuit board.
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应该以权利要求的保护范围为准。 The above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention. It should be covered by the scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims (11)

  1. 一种屏蔽罩，其特征在于，所述屏蔽罩(300)包括：罩体侧面(302)和罩体上表面(304)；A shielding cover, characterized in that: the shielding cover (300) comprises: a cover body side (302) and a cover upper surface (304);
    所述罩体上表面(304)包括至少一个第一半切线结构(310)；所述第一半切线结构(310)围成一个半封闭或封闭的形状，所述第一半切线结构(310)包括位于所述罩体外侧的第一凹槽(312)；The cover upper surface (304) includes at least one first half tangent structure (310); the first half tangent structure (310) encloses a semi-closed or closed shape, the first half tangent structure (310) a first groove (312) located outside the cover;
    所述罩体上表面(304)中除所述至少一个第一半切线结构(310)以外的罩体的厚度为第一厚度，所述第一凹槽(312)处的罩体的厚度为第二厚度，所述第二厚度小于所述第一厚度。The thickness of the cover other than the at least one first half-tangential structure (310) in the upper surface (304) of the cover is a first thickness, and the thickness of the cover at the first groove (312) is a second thickness, the second thickness being less than the first thickness.
  2. 根据权利要求1所述的屏蔽罩，其特征在于，所述第一半切线结构(310)还包括位于所述罩体内侧的第二凹槽(314)；同一个所述第一半切线结构(310)的第一凹槽(312)和第二凹槽(314)的位置相对应；The shield according to claim 1, wherein said first half-tangential structure (310) further comprises a second recess (314) on the inside of said cover; and said first half-tangent structure a position of the first groove (312) and the second groove (314) of (310);
    同一个所述第一半切线结构(310)的第一凹槽(312)和第二凹槽(314)之间的罩体的厚度为第三厚度，所述第三厚度小于所述第一厚度。The thickness of the cover between the first groove (312) and the second groove (314) of the same first half-tangential structure (310) is a third thickness, and the third thickness is smaller than the first thickness.
  3. 根据权利要求1或2所述的屏蔽罩，其特征在于，所述第一凹槽(312)的横截面为三角形、矩形或梯形。The shield according to claim 1 or 2, wherein the first groove (312) has a triangular, rectangular or trapezoidal cross section.
  4. 根据权利要求2所述的屏蔽罩，其特征在于，所述第二凹槽(314)的横截面为三角形、矩形或梯形。The shield according to claim 2, wherein the second groove (314) has a triangular, rectangular or trapezoidal cross section.
  5. 根据权利要求1-4任一所述的屏蔽罩，其特征在于，所述至少一个第一半切线结构(310)中的任意两个第一半切线结构(310)围成的形状相同或不同。A shield according to any one of claims 1 to 4, wherein any two of the first half-tangent structures (310) of the at least one first half-tangent structure (310) are of the same or different shape .
  6. 根据权利要求1-5任一所述的屏蔽罩，其特征在于，所述至少一个第一半切线结构(310)中的任意一个围成三角形、矩形、多边形或圆形。A shield according to any of claims 1-5, wherein any one of said at least one first half-tangential structure (310) is triangular, rectangular, polygonal or circular.
  7. 根据权利要求1-6任一所述的屏蔽罩，其特征在于，所述罩体侧面(302)包括至少一个第二半切线结构(320)，所述第二半切线结构(320)包括位于所述罩体外侧的第三凹槽(322)；A shield according to any of claims 1-6, wherein said cover side (302) comprises at least one second half tangent structure (320), said second half tangent structure (320) being comprised a third groove (322) outside the cover;
    所述罩体侧面(302)中除所述至少一个第二半切线结构(320)以外的罩体的厚度为第四厚度，所述第三凹槽(322)处的罩体的厚度为第五厚度，所述第五厚度小于所述第四厚度。The thickness of the cover body other than the at least one second half-tangential structure (320) in the side surface (302) of the cover body is a fourth thickness, and the thickness of the cover body at the third groove (322) is Five thicknesses, the fifth thickness being less than the fourth thickness.
  8. 根据权利要求7所述的屏蔽罩，其特征在于，所述第二半切线结构(320)还包括位于所述罩体内侧的第四凹槽(324)；同一个所述第二半切线结构(320)的第三凹槽(322)和第四凹槽(324)的位置相对应；The shield according to claim 7, wherein said second half tangent structure (320) further comprises a fourth recess (324) on the inside of said cover; and said second half tangent structure The positions of the third groove (322) and the fourth groove (324) of (320) correspond to each other;
    同一个所述第二半切线结构(320)的第三凹槽(322)和第四凹槽(324)之间的罩体的厚度为第六厚度，所述第六厚度小于所述第四厚度。The thickness of the cover between the third groove (322) and the fourth groove (324) of the same second half tangential structure (320) is a sixth thickness, and the sixth thickness is smaller than the fourth thickness.
  9. 根据权利要求7或8所述的屏蔽罩，其特征在于，所述第二半切线结构(320)与所述罩体侧面(302)中的侧棱(3021)相平行。A shield according to claim 7 or 8, wherein said second half-tangential structure (320) is parallel to a side edge (3021) in said side (302) of said cover.
  10. 根据权利要求7或8所述的屏蔽罩，其特征在于，所述第二半切线结构(320)向所述罩体上表面(304)延伸，延伸后的所述第二半切线结构(320)与所述第一半切线结构(310)相交。The shield according to claim 7 or 8, wherein the second half-tangential structure (320) extends toward the upper surface (304) of the cover, and the second half-tangent structure (320) extends. ) intersecting the first half tangent structure (310).
  11. 一种终端，包括：电路板，置于所述电路板上的多个电子元件，以及罩在一 个或多个所述电子元件上的至少一个如权利要求1-10任一所述的屏蔽罩。 A terminal comprising: a circuit board, a plurality of electronic components placed on the circuit board, and a cover At least one of the one or more of the electronic components of the shield of any of claims 1-10.
PCT/CN2017/095196 2017-07-31 2017-07-31 Shielding case and terminal WO2019023855A1 (en)

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CN201780092999.9A CN110870396B (en) 2017-07-31 2017-07-31 Shielding case and terminal
PCT/CN2017/095196 WO2019023855A1 (en) 2017-07-31 2017-07-31 Shielding case and terminal

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