WO2019022026A1 - Light source module and lighting fixture for vehicles - Google Patents

Light source module and lighting fixture for vehicles Download PDF

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Publication number
WO2019022026A1
WO2019022026A1 PCT/JP2018/027560 JP2018027560W WO2019022026A1 WO 2019022026 A1 WO2019022026 A1 WO 2019022026A1 JP 2018027560 W JP2018027560 W JP 2018027560W WO 2019022026 A1 WO2019022026 A1 WO 2019022026A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
light
light source
emitting elements
source module
Prior art date
Application number
PCT/JP2018/027560
Other languages
French (fr)
Japanese (ja)
Inventor
鈴木　哲也
主 時田
元弘 小松
大野　智之
Original Assignee
株式会社小糸製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2017143552A external-priority patent/JP7053185B2/en
Priority claimed from JP2017143550A external-priority patent/JP2019029057A/en
Priority claimed from JP2017143551A external-priority patent/JP7053184B2/en
Application filed by 株式会社小糸製作所 filed Critical 株式会社小糸製作所
Publication of WO2019022026A1 publication Critical patent/WO2019022026A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to a light source module and a vehicle lamp.
  • Vehicle lamps are generally capable of switching between low beam and high beam.
  • the low beam illuminates the near side with a predetermined illuminance, and a light distribution rule is defined so as not to give glare to oncoming vehicles and preceding vehicles, and is mainly used when traveling in a city area.
  • the high beam illuminates a wide range and a distance ahead with relatively high illuminance, and is mainly used when traveling at high speed on a road where there are few oncoming vehicles and preceding vehicles. Therefore, although the high beam is more excellent in visibility by the driver than the low beam, there is a problem that glare is given to the driver of the vehicle existing in front of the vehicle and the pedestrian.
  • ADB Adaptive Driving Beam
  • ADB technology reduces the glare to be given to a vehicle or pedestrian by detecting the presence or absence of a preceding vehicle in front of the vehicle, an oncoming vehicle or a pedestrian, and reducing the area corresponding to the vehicle or pedestrian. is there.
  • light emitting elements such as a plurality of LEDs (Light Emitting Diodes) are mounted in a row on a substrate to turn off the LEDs in the area corresponding to a vehicle or a pedestrian.
  • Patent Document 1 Patent Document 1
  • a large number of light emitting elements are two-dimensionally disposed on a substrate to selectively control turning off and lighting of the light emitting elements to control light distribution patterns of high beams in more detail.
  • a vehicle lamp having such a two-dimensional array of light emitting elements it is necessary to increase the mounting density of the light emitting elements and improve the accuracy of the mounting position in order to satisfactorily irradiate the two-dimensional light distribution pattern. is there.
  • LEDs are used as light emitting elements, a surface mount type package is adopted, and a structure in which individual LEDs are positioned and mounted on lands formed on a substrate is adopted and mounted with high density.
  • FIG. 10 is a schematic plan view showing the light source module 1 using the ADB technology.
  • a connector 3 for electrically connecting to the outside is mounted on a substrate 2, and a wiring pattern 4 is formed on the surface of the substrate 2 extending from the connector 3.
  • a plurality of LEDs 5 are mounted on the pattern 4.
  • the vicinity of the LED 5 mounting portion of the wiring pattern 4 is formed wide, and is used as a heat dissipation pattern for well dissipating heat generated by the light emission of the LED 5.
  • the surface of the substrate 2 is covered with a resist layer to suppress unintended light reflection in the wiring pattern 4, and an optical member is formed on the substrate 2 to reflect light from the LED 5 with desired light distribution characteristics. It is mounted.
  • the distance between the LEDs 5 is increased to secure the area of the heat radiation pattern, and high density mounting is difficult. Furthermore, since the LEDs 5 are surface mounted in individual packages, the surface mounting alignment accuracy There is also a problem that high density mounting is difficult also from the point of view. In order to solve this problem, mounting multiple LED chips in one package and making electrical connection with the wiring layer on the substrate by wire bonding enables surface mounting alignment accuracy and high density mounting of LED chips. Can be compatible.
  • An object of the present invention is to provide a light source module and a vehicular lamp capable of suppressing the occurrence of glare while mounting light emitting elements with high density.
  • Another object of the present invention is to provide a light source module and a vehicular lamp capable of preventing light leakage while mounting light emitting elements at high density to improve luminous intensity.
  • Another object of the present invention is to provide a light source module and a vehicular lamp capable of precisely aligning the relative positional relationship between the optical member and the LED while mounting the light emitting element at a high density.
  • a light source module includes a plurality of light emitting elements, a plurality of metal wires individually supplying power to the light emitting elements, and at least a part of side surfaces of the light emitting elements.
  • the light-reflective resin part currently sealed and the light absorptive resin part which has sealed the said metal wire are provided.
  • the periphery of the light emitting element is sealed with the light reflective resin portion to improve the light extraction efficiency, and the metal wire is sealed with the light absorbing resin portion to achieve high density. It becomes possible to suppress the occurrence of glare while mounting the light emitting element.
  • the light reflective resin portion is filled between the adjacent light emitting elements, and collectively seals side surfaces of the predetermined number of light emitting elements.
  • the light absorbing resin part collectively seals a predetermined number of the metal wires.
  • a submount having a submount wiring formed on one surface thereof is provided, and a plurality of the light emitting elements are mounted on the submount wiring along a first direction of the submount; A wire is connected to the submount wiring.
  • the plurality of submounts are arranged as a first row extending in the first direction.
  • a plurality of the submounts are further arranged adjacent to the first row as a second row extending in the first direction.
  • the vehicle lamp of this invention is provided with the light source module as described in any one of the said, and supplies electric power selectively with respect to several said metal wire and several said light emitting elements.
  • a submount having a submount wiring formed on one surface thereof, and a plurality of light emissions mounted along the first direction on the submount wiring And a light reflective resin portion filled between adjacent light emitting elements to seal the side surfaces of the light emitting elements, and the distance between the side surfaces of the adjacent light emitting elements is 0.1 mm to 0 The range is .6 mm.
  • the space between the adjacent light emitting elements is filled with the light reflective resin portion and sealed, and the distance between the side faces of the adjacent light emitting elements is in the range of 0.1 mm to 0.6 mm. Therefore, it is possible to prevent light leakage while mounting the light emitting elements at high density to improve the luminous intensity.
  • the plurality of submounts are arranged as a first row extending in the first direction.
  • a plurality of the submounts are further arranged adjacent to the first row as a second row extending in the first direction.
  • a metal wire corresponding to each light emitting element is connected to the submount wiring, and the light emitting elements in the first row and the second row are the submount wiring in the first row Are positioned between the metal wire connected to and the metal wire connected to the submount wiring of the second row.
  • the vehicle lamp of this invention is provided with the light source module as described in any one said, and supplies electric power selectively with respect to several said light emitting elements. In such a vehicle lamp of the present invention, it is possible to prevent light leakage while mounting the light emitting elements at high density to improve the luminous intensity.
  • a light source module includes a mounting substrate having a wiring pattern formed on one surface, and a plurality of the light source modules mounted on the one surface and electrically connected to the wiring pattern.
  • a light source unit having a light emitting element and an optical member reflecting light from the light source unit are provided, a resist layer is formed on the wiring pattern of the mounting substrate, and the resist layer is formed on the mounting substrate An optical member mounting area is formed, and the optical member is mounted on the optical member mounting area.
  • the resist layer is removed in the optical member mounting region of the mounting substrate, and the optical member may be fixed at a desired position even if the film thickness of the resist layer is different from the design value.
  • the relative positional relationship between the optical member and the LED can be precisely aligned while mounting the light emitting element with high density.
  • the mounting substrate is formed of a laminated structure of a metal plate and a glass epoxy resin layer, and the glass epoxy resin layer is exposed in the optical member mounting region.
  • the light source unit has the light emitting element mounted on the metal plate without the glass epoxy resin layer, and the height dimension of the light emitting element is the thickness of the glass epoxy resin layer Larger than dimensions
  • the optical member mounting area is provided in a pair on both sides of the light source unit, and in the light source unit, a plurality of light emitting elements are arrayed along a first direction.
  • the optical member is fixed on an extension of the light emission center line of the device.
  • the vehicle lamp of this invention is equipped with the light source module as described in any one of the said, and the electric power feeding connector electrically connected with the said wiring pattern is provided on the said one surface. And power is selectively supplied to the plurality of light emitting elements through the power supply connector.
  • the relative positional relationship between the optical member and the LED can be precisely aligned while mounting the light emitting element at a high density.
  • the present invention it is possible to provide a light source module and a vehicular lamp capable of suppressing the occurrence of glare while mounting light emitting elements at high density.
  • a light source module and a vehicular lamp capable of preventing light leakage while mounting light emitting elements at high density to improve the luminous intensity.
  • a light source module and a vehicular lamp capable of precisely aligning the relative positional relationship between the optical member and the LED while mounting the light emitting element at high density.
  • FIG. 6 is a schematic plan view showing the light source module 40 in a state in which each member is mounted on a mounting substrate 41.
  • FIG. 6 is an enlarged perspective view showing a submount 43 in an enlarged manner.
  • 16 is a partial enlarged cross-sectional view showing a state in which the submount 43 is mounted on the light emitting unit mounting region 49. It is an enlarged plan view which expands and shows the light emission part mounting area
  • FIG. 1 is an exploded perspective view showing a vehicular lamp 100 in the present embodiment.
  • the vehicular lamp 100 includes a lens 10, a lens holder 20, a reflector 30, a light source module 40, a heat sink 50, and a cooling fan 60.
  • the members are mutually positioned and fixed by fixing means (not shown). ing.
  • the lens 10 is a member which is made of a translucent material and irradiates the light from the light source module 40 forward so as to obtain a predetermined light distribution.
  • the lens holder 20 is a member for holding the lens 10 in a state where the relative positional relationship between the lens 10 and the light source module 40 and the reflector 30 is maintained.
  • the reflector 30 is a member disposed in front of the light source module 40 to reflect light from the light source module 40 forward, and corresponds to the optical member in the present invention.
  • the light source module 40 is a member that emits light according to the power and signal supplied from the outside of the vehicle lamp 100, and the details will be described later.
  • the heat sink 50 is a heat conductive good member disposed in contact with the light source module 40 on the back surface of the light source module 40, and a heat radiation fin is formed on the back surface side.
  • the cooling fan 60 is a member that is disposed on the back side of the heat sink 50 and generates an air flow when power is supplied.
  • the light source module 40 when power and a signal are supplied from the outside, the light source module 40 emits light according to the power and the signal, and the light reflected forward by the reflector 30 is in the lens holder 20 and through the lens 10. Irradiated forward. Further, the heat associated with the light emission of the light source module 40 is dissipated into the air via the heat sink 50 and is cooled by the air from the cooling fan 60.
  • FIG. 2 is a schematic perspective view showing the light source module 40 in the present embodiment.
  • the light source module 40 includes a mounting substrate 41, a wiring pattern 42, a submount 43, a feeding connector 44, a metal wire 45a, a light absorbing resin portion 45, and a resist layer 46.
  • An optical member mounting area 47 is formed, and an optical member fixing portion 48 is formed in the optical member mounting area 47.
  • the mounting substrate 41 is a substantially flat member formed of a material having good thermal conductivity, and the wiring pattern 42 is formed on one surface, and a plurality of submounts 43 and a feed connector 44 are mounted. There is. In addition, a resist layer 46 is formed to cover the wiring pattern 42.
  • the material which comprises the mounting substrate 41 is not limited, It is preferable to use metal with favorable heat conductivity, such as copper and aluminum.
  • a composite substrate in which an insulating substrate is bonded to a conductive substrate may be used as the mounting substrate 41, and for example, a glass epoxy resin layer may be bonded to a metal substrate.
  • the mounting substrate 41 is formed of a metal substrate, it is preferable to form an anti-oxidation film on the back surface side of the mounting substrate 41 in order to prevent the thermal conductivity from being lowered due to the oxidation of the metal material.
  • the pre-flux process and Au plating process are mentioned as a formation method of an antioxidant film
  • the wiring pattern 42 is a conductive pattern formed on the surface of the mounting substrate 41, and is for securing the electrical connection from the terminal of the power supply connector 44 to the submount 43.
  • a conductive material is used as the mounting substrate 41, an insulating layer is formed between the wiring pattern 42 and the mounting substrate 41.
  • the submount 43 is mounted on the surface of the mounting substrate 41 and electrically connected to the wiring pattern 42 by the metal wire 45a, and is a member that emits light according to the power by being supplied with power through the metal wire 45a. It is. The detailed structure of the submount 43 will be described later.
  • the feed connector 44 is a member mounted on the surface of the mounting substrate 41 for securing an electrical connection with the outside, and a plurality of terminals are electrically connected to the wiring pattern 42.
  • a substantially rectangular parallelepiped is shown in FIG. 2 as a shape of the electric power feeding connector 44, an external shape, a terminal shape, etc. will not be limited if it can connect according to a well-known cable harness.
  • the metal wire 45a is a member for connecting the terminal provided on the submount 43 and the wiring pattern 42 formed on the mounting substrate 41, and is a metal conductive member which can be realized by a known wire bonding technique. is there.
  • the material which comprises the metal wire 45a is not limited, Although gold, copper, aluminum etc. can be used, it is preferable to use gold.
  • the light absorbing resin portion 45 is a resin member in which an inorganic filler and a light absorbing material are mixed in a base resin, and covers and seals the metal wire 45a.
  • the metal wire 45a may be sealed individually by the light absorbing resin portion 45. However, it is preferable to collectively seal the plurality of metal wires 45a.
  • a base resin of the light absorbing resin portion 45 a curable resin composition having high heat resistance, light resistance, and good handleability which is light transmissive is preferable, and a known sealing material such as an epoxy resin or a silicone resin is mentioned.
  • a silicone resin having a low elastic modulus after curing may be used as a base resin.
  • a carbon filler etc. are mentioned as a light absorptive material mixed in base resin.
  • the light source module 40 of the present embodiment by covering and sealing the metal wire 45a with the light absorbing resin portion 45, it is possible to prevent the conductive foreign matter from adhering to the metal wire 45a and causing a short circuit. Further, since the light absorbing resin portion 45 mixes the light absorbing material, the light from the submount 43 reaches the metal wire 45 a and is reflected, and is irradiated to the outside of the vehicular lamp 100 as stray light. Can be prevented.
  • the light emitting element included in the submount 43 is selectively turned on using the ADB technology, it is possible to prevent stray light reflected by the metal wire 45a from reaching the non-irradiated area, and the light emitting element It is possible to suppress the occurrence of glare while implementing the
  • the base resin obtained by kneading the inorganic filler and the light absorbing material is supplied onto the metal wire 45a by a dispenser or the like and then cured.
  • the viscosity and thixotropy after kneading the light absorbing material can be arbitrarily adjusted by adjusting the material selection of the base resin and the addition amount of the inorganic filler in consideration of the moldability after application and the stress on the feeding wire. It is possible.
  • Thixotropy is determined by the injectability of the dispenser / the moldability after application, at a viscosity of 0.5 rpm at 23 ° C.
  • the viscosity is 2.0 or more and 3.5 or less.
  • the thixotropy is set in this range, the fluidity of the base resin is appropriately maintained, and even if the submount 43 is not surrounded by a dam member or the like, the resin flows out and the metal wire 45a is exposed, and the metal wire 45a It is possible to prevent the formation of a void in the gap between the two or in the lower part.
  • the resist layer 46 is an insulating film-like member formed on the surface side of the mounting substrate 41 so as to cover the wiring pattern 42.
  • the material which comprises the resist layer 46 is not limited, In order to suppress the stray light by the light reflection in the surface of the mounting substrate 41, and the wiring pattern 42 differing, the light reflectivity in the area
  • a light reflective material or a light absorbing material is used to
  • the optical member mounting area 47 is an area on the surface of the mounting substrate 41 for mounting the reflector 30, which is an optical member, and is an area where the resist layer 46 is not formed and the surface of the mounting substrate 41 is exposed.
  • the optical member mounting area 47 is located on both sides of the mounting substrate 41 across the area on which the submount 43 is mounted, and the reflector 30 is brought into contact with the optical member mounting area 47 to fix the submount.
  • the reflector 30 can be disposed across 43.
  • the optical member fixing portion 48 is a through hole provided in the optical member mounting area 47.
  • the reflector 30 is brought into contact with the optical member mounting area 47, and a fixing member such as a screw is inserted into the optical member fixing portion 48 from the surface side of the mounting substrate 41 to fix the mounting substrate 41 and the reflector 30 to the heat sink 50.
  • the details of the formation position of the optical member fixing portion 48 will be described later, but the submount 43 is arranged between the two optical member fixing portions 48.
  • FIG. 3 is a schematic plan view showing the mounting substrate 41 in the present embodiment.
  • the wiring pattern 42 is formed on the mounting substrate 41, and a resist layer 46 is formed to cover the wiring pattern 42.
  • an optical member mounting area 47, a light emitting section mounting area 49 for mounting the submount 43, a portion for bonding the metal wire 45a, a feeding connector mounting portion 44a for mounting the feeding connector 44, and feeding A resist layer 46 is formed in the region excluding the portion connecting the terminals of the connector 44.
  • the light emitting portion mounting area 49 is an area on which the plurality of sub mounts 43 are mounted as described above, and is formed so that the sub mounts 43 can be arranged in two rows with the horizontal direction in the drawing as the longitudinal direction. Further, a line L1 connecting the centers of the optical member fixing portions 48 has a positional relationship such that it crosses the approximate center of the light emitting portion mounting area 49 along the longitudinal direction.
  • FIG. 4A and 4B are diagrams for explaining the structure of the mounting substrate 41 in the present embodiment in detail, FIG. 4A is an exploded perspective view, and FIG. 4B is a schematic cross-sectional view.
  • the mounting substrate 41 is formed of a laminated structure of a metal plate 41a, an adhesive sheet 41b, and a glass epoxy resin layer 41c.
  • openings 49b and 49c having a shape corresponding to the light emitting unit mounting area 49 are respectively formed, and the positions of the openings 49b and 49c coincide with each other.
  • the openings 49b and 49c may be formed in advance in predetermined regions of the adhesive sheet 41b and the glass epoxy resin layer 41c and may be aligned and attached, and the metal plate 41a and the glass epoxy resin layer 41c may be adhered with the adhesive sheet 41b. After that, the openings 49b and 49c may be collectively formed by cutting or the like.
  • the adhesive sheet 41b and the glass epoxy resin layer 41c are laminated around the light emitting portion mounting area 49, and the wiring pattern 42 and the resist layer 46 are formed on the glass epoxy resin layer 41c.
  • the surface of the metal plate 41a is partially exposed in the regions corresponding to the openings 49b and 49c. Further, as described above, since the resist layer 46 is not formed in the optical member mounting region 47, the glass epoxy resin layer 41c is exposed in the optical member mounting region 47.
  • the resist layer 46 is not formed in the optical member mounting area 47, and the reflector 30, which is an optical member, is directly mounted on the glass epoxy resin layer 41c and fixed. Thereby, the positional deviation between the reflector 30 and the submount 43 caused by the variation of the film thickness of the resist layer 46 is suppressed, and the relative positional relationship between the optical member and the light emitting element 43c is precisely aligned to obtain good light distribution characteristics. It becomes possible to irradiate with light.
  • the glass epoxy resin layer 41c to the metal plate 41a using the adhesive sheet 41b, it is not necessary to form an insulating layer containing a high thermal conductivity filler on the metal plate 41a, and the manufacturing process and cost can be reduced. It becomes possible to aim at reduction.
  • FIG. 5 is a schematic plan view showing the light source module 40 in a state in which each member is mounted on the mounting substrate 41.
  • Solder is applied to the feed connector mounting portion 44a and the terminal connection portion of the mounting substrate 41 shown in FIGS. 4A and 4B, and the surface mount feed connector 44 is mounted by solder reflow.
  • metal wires are formed by wire bonding.
  • the submount 43 and the wiring pattern 42 are electrically connected.
  • the light absorbing resin portion 45 is applied to the plurality of metal wires 45a with a dispenser and cured.
  • the line L1 connecting the centers of the optical member fixing portions 48 is located approximately at the center along the longitudinal direction of the submounts 43 arranged in two rows.
  • FIG. 6 is an enlarged perspective view showing the submount 43 in an enlarged manner.
  • a plurality of submount wires 43b are formed on a submount substrate 43a
  • a plurality of light emitting elements 43c are mounted on the submount wire 43b
  • the side surfaces of the plurality of light emitting elements 43c are collectively light reflective.
  • the resin portion 43d is sealed. Further, the light reflective resin portion 43d is not formed on a part of the submount substrate 43a, and the surface of the submount substrate 43a and the submount wiring 43b are exposed.
  • the light emitting element 43c is flip chip mounted across the adjacent submount wires 43b inside the light reflective resin portion 43d.
  • the submount substrate 43a is a substantially rectangular flat plate member made of an insulating material having good thermal conductivity, and is made of, for example, Si or AlN.
  • the submount wiring 43b is a conductive pattern formed on one surface of the submount substrate 43a, and is electrically connected to the light emitting element 43c and wire-bonded to the metal wire 45a.
  • the light emitting element 43c is a member which is electrically connected to the two metal wires 45a and emits light when a voltage is applied between the metal wires 45a, and is formed of a combination of an LED chip and a phosphor material.
  • the LED chip a known compound semiconductor material such as blue or violet or a GaN-based that emits the wavelength of ultraviolet light as primary light can be used.
  • a phosphor material a known material which is excited by primary light and emits a desired secondary light can be used, and ones which obtain white by mixing with primary light from the LED chip, and a plurality of phosphor materials are used. What can be used to obtain white by mixing a plurality of secondary lights can be used.
  • the light reflective resin portion 43d is a member in which light reflective fine particles are mixed in a base resin, and for example, white resin in which fine particles such as titanium oxide are mixed is mentioned, and light emitted by the light emitting element 43c is favorably reflected.
  • the light reflective resin portion 43d is sealed so as to surround the light emitting element 43c at its side, and reflects light emitted from the side of the light emitting element 43c in the inside direction of the light emitting element 43c. As a result, light emitted from the light emitting element 43c does not leak laterally from the side surface of the light emitting element 43c, and the light is favorably emitted to the outside from the top surface of the light emitting element 43c.
  • a plurality of submounts 43 are arranged in upper and lower two rows to constitute a light source unit, and extended in the longitudinal direction to be arranged with a plurality of submount substrates 43a adjacent to each other to form a first row
  • the submount substrate 43a of the second row is disposed adjacent to the first row while constituting an example of the first row.
  • FIG. 7 is a partially enlarged cross-sectional view showing a state in which the submount 43 is mounted on the light emitting portion mounting region 49.
  • the submount substrate 43a is fixed with an adhesive on the metal plate 41a exposed in the light emitting portion mounting region 49, and the side surface of the light emitting element 43c on the submount substrate 43a is sealed by the light reflective resin portion 43d.
  • One end of the metal wire 45a is wire-bonded to the area on the submount substrate 43a where the light reflective resin portion 43d is not formed.
  • a plurality of light emitting elements 43c are mounted on the submount substrate 43a, and metal wires 45a are bonded to the submount wiring 43b formed on the surface of the submount substrate 43a to perform power. Supply.
  • a large current can be supplied by the metal wire 45a having a high melting point, and the light intensity of the light source module 40 can be increased.
  • the submount substrate 43a is mounted on the metal plate 41a exposed in the light emitting portion mounting region 49, and is fixed using an adhesive having a high heat resistance temperature, compared to mounting of the light emitting element 43c using solder.
  • the heat resistant temperature can be set high, and further, large current supply and high light intensity can be achieved.
  • the wiring pattern 42 formed on the glass epoxy resin layer 41c is covered with the resist layer 46, but the resist layer 46 is formed at the position where the other end of the metal wire 45a is wire bonded. Not.
  • the entire metal wire 45a is sealed by the light absorbing resin portion 45, and is filled in the wire bonding positions at both ends of the metal wire 45a and the upper and lower portions of the metal wire 45a.
  • the light absorbing resin portion 45 is formed adjacent to the light reflecting resin portion 43d at the wire bonding position of the submount substrate 43a.
  • the adhesive sheet 41b is not shown.
  • the submount 43 is mounted on the metal plate 41a without the glass epoxy resin layer 41c in the light emitting portion mounting region 49, and the height dimension of the light emitting element in the submount 43 is the glass epoxy resin layer 41c.
  • the height dimension of the light emitting element in the submount 43 is the distance from the bottom surface of the submount substrate 43a to the upper surface of the light emitting element 43c, and is, for example, about 1.3 mm.
  • the height of the submount 43 is larger than the thickness of the glass epoxy resin layer 41c, so the upper surface of the light emitting element 43c, which is the light extraction surface of the submount 43, is higher than the glass epoxy resin layer 41c. Located in Thus, it is possible to prevent the light emitted from the submount 43 from entering the side surface of the glass epoxy resin layer 41c and blocking it, and light can be extracted well and irradiated with a desired light distribution characteristic.
  • the metal plate 41a and the glass epoxy resin layer 41c are bonded together with the adhesive sheet 41b, and then the optical member fixing portion 48 is formed by punching from the back surface side of the mounting substrate 41.
  • the thickness dimension of the glass epoxy resin layer 41c is 0.05 mm to 0.2 mm, preferably 0.075 mm to 0.15 mm, burrs generated on the metal plate 41a at the time of punching are suppressed by the glass epoxy resin layer 41c, and optical It becomes possible to position and fix the reflector 30 which is a member precisely.
  • FIG. 8 is an enlarged plan view showing the area around the light emitting unit mounting area 49 in an enlarged manner.
  • the light absorbing resin portion 45 collectively seals the plurality of metal wires 45 a, covers from the wire bonding position of the wiring pattern 42 to the wire bonding position of the submount 43, and reflects light. It is formed to a position adjacent to the resin portion 43d.
  • a plurality of submounts 43 are arranged along the left-right direction, and two rows are arranged adjacent to each other in the up-down direction to constitute the light source unit of the present invention.
  • the light emitting elements 43c are also arranged in two lines, and a line L2 shown in FIG. 8 is a light emission center line indicating an intermediate position of the two lines of light emitting elements 43c.
  • the light emission center line L2 substantially coincides with the line L1 connecting the centers of the optical member fixing portion 48 shown in FIG. 5, and is an optical member on the extension of the light emission center line L2 of the plurality of light emitting elements 43c.
  • the reflector 30 is fixed.
  • the mounting substrate 41 is warped.
  • the warp can be reduced by fastening the reflector 30 on the light emission center line L2, and the positional relationship between the light source unit and the optical member can be appropriately set.
  • the mounting substrate 41 and the reflector 30 are fastened together including the heat sink 50, the back side of the light emitting portion mounting region 49 can be in close contact with the heat sink, and the heat dissipation characteristics similar to the mounting substrate 41 without warpage. It is possible to obtain
  • the wire bonding position of the wiring pattern 42 is provided along the upper and lower sides of the light emitting portion mounting region 49 in the drawing, and the upper row (an example of the first row) in the drawing is from above in the drawing.
  • the metal wire 45a is wire-bonded, and the metal wire 45a is wire-bonded from the lower side in the figure to the submount 43 in the lower row (an example of the second row) in the figure. Accordingly, the light emitting elements 43c in the first row and the second row are located between the metal wire 45a connected to the first row and the metal wire 45a connected to the second row.
  • the vehicle lamp 100 of the present invention power is selectively supplied from the outside to the light emitting element 43c via the power supply connector 44, the wiring pattern 42, the metal wire 45a, and the submount wiring 43b, and the light emitting element 43c is lit.
  • the light distribution distribution in the whole light source part is determined by lighting the selected light emitting element 43c among the plurality of submounts 43 which constitute the light source part, and the vehicle lamp according to ADB technology through the reflector 30 and the lens 10
  • a two-dimensional light distribution pattern is emitted forward of 100.
  • FIGS. 9A and 9B a second embodiment of the present invention will be described using FIGS. 9A and 9B.
  • the same contents as the first embodiment will not be described.
  • the present embodiment can also be applied to the case where ADB technology is not used.
  • the configuration of the vehicular lamp 100 and the configuration of the light source module 40 are the same as those of the first embodiment, and the description thereof will be omitted.
  • FIGS. 9A and 9B are graphs showing the synthetic light intensity from the adjacent light emitting elements 43c in the present embodiment
  • FIG. 9A shows an example in which the distance between the light emitting elements 43c is long and the synthetic light intensity is insufficient.
  • 9B shows an example in which the distance between the light emitting elements 43c is short and the synthetic light intensity is sufficient.
  • the horizontal axis indicates the position along the longitudinal direction of the submount 43
  • the vertical axis indicates the light intensity.
  • the broken line in the figure shows the luminous intensity of the light emitted from one light emitting element 43c
  • the solid line in the figure shows the synthetic luminous intensity of the lights emitted from the two adjacent light emitting elements 43c.
  • the peak of the synthetic light intensity is small as shown in FIG. 9A, and is greater than the light intensity irradiated from one light emitting element 43c. It only improves by a few percent.
  • the peak of the synthetic light intensity becomes large, and can be improved by 20% or more than the light intensity irradiated from one light emitting element 43c.
  • the light emitting element 43c is selectively turned on and off to precisely control the irradiated area and the non-irradiated area, so that the higher the synthetic light intensity of the irradiated area is the contrast with the non-irradiated area. Can be enhanced.
  • the thickness of the light reflective resin portion 43d filling the side surfaces of the light emitting element 43c is insufficient, and light leaks from the side surfaces to form one light emitting element 43c.
  • the light intensity of the light emitted from the light source itself is reduced.
  • the combined luminous intensity also decreases due to the light leaking from the side.
  • the light emitting element 43c is selectively turned on by applying the ADB technology, light leaked from the side face may be emitted similarly to the light emitted from the light emitting element 43c which is not turned on. It becomes difficult to irradiate a two-dimensional light distribution pattern.
  • CSP chip size package
  • the distance between light emitting elements is 0.6 mm
  • the synthetic light intensity is 100
  • the synthetic light intensity is 119 at 0.2 mm.
  • the distance d1 between the side surfaces of the light emitting elements 43c is 0.6 mm
  • the synthetic light intensity is 112
  • the synthetic light intensity is 140 at 0.2 mm
  • the synthetic light intensity is 147 at 0.1 mm. is there.
  • the distance d1 between the side surfaces of the light emitting elements 43c is preferably in the range of 0.1 mm to 0.6 mm.
  • the distance between the light emitting elements 43c in the plurality of submounts 43 is preferably in the range of 0.1 mm to 0.6 mm.

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Abstract

This light source module (40) is provided with: a plurality of light emitting elements (43c); a plurality of metal wires (45a) which separately supply electric power to the light emitting elements (43c), respectively; a light-reflecting resin part (43d) which seals at least a part of the lateral surface of each light emitting element (43c); and a light-absorbing resin part (45) which seals the metal wires (45a).

Description

光源モジュール及び車両用灯具Light source module and vehicle lamp
　本発明は、光源モジュールおよび車両用灯具に関する。 The present invention relates to a light source module and a vehicle lamp.
　車両用灯具は、一般にロービームとハイビームとを切りかえることが可能である。ロービームは、近方を所定の照度で照明するものであって、対向車や先行車にグレアを与えないよう配光規定が定められており、主に市街地を走行する場合に用いられる。一方、ハイビームは、前方の広範囲および遠方を比較的高い照度で照明するものであり、主に対向車や先行車が少ない道路を高速走行する場合に用いられる。したがって、ハイビームはロービームと比較してより運転者による視認性に優れているが、車両前方に存在する車両の運転者や歩行者にグレアを与えてしまうという問題がある。 Vehicle lamps are generally capable of switching between low beam and high beam. The low beam illuminates the near side with a predetermined illuminance, and a light distribution rule is defined so as not to give glare to oncoming vehicles and preceding vehicles, and is mainly used when traveling in a city area. On the other hand, the high beam illuminates a wide range and a distance ahead with relatively high illuminance, and is mainly used when traveling at high speed on a road where there are few oncoming vehicles and preceding vehicles. Therefore, although the high beam is more excellent in visibility by the driver than the low beam, there is a problem that glare is given to the driver of the vehicle existing in front of the vehicle and the pedestrian.
　近年、車両の周囲の状態にもとづいて、ハイビームの配光パターンを動的、適応的に制御するＡＤＢ（Ａｄａｐｔｉｖｅ　Ｄｒｉｖｉｎｇ　Ｂｅａｍ）技術が提案されている。ＡＤＢ技術は、車両の前方の先行車、対向車や歩行者の有無を検出し、車両あるいは歩行者に対応する領域を減光するなどして、車両あるいは歩行者に与えるグレアを低減するものである。このようなＡＤＢ技術では、複数のＬＥＤ（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）などの発光素子を基板上に列状に搭載して、車両や歩行者に対応する領域のＬＥＤを消灯するものも提案されている（例えば特許文献１）。 In recent years, ADB (Adaptive Driving Beam) technology has been proposed which dynamically and adaptively controls a light distribution pattern of a high beam based on the state of the surroundings of a vehicle. ADB technology reduces the glare to be given to a vehicle or pedestrian by detecting the presence or absence of a preceding vehicle in front of the vehicle, an oncoming vehicle or a pedestrian, and reducing the area corresponding to the vehicle or pedestrian. is there. In such ADB technology, there has also been proposed one in which light emitting elements such as a plurality of LEDs (Light Emitting Diodes) are mounted in a row on a substrate to turn off the LEDs in the area corresponding to a vehicle or a pedestrian. For example, Patent Document 1).
　さらに近年では、発光素子を基板上に二次元的に多数配置して、選択的に発光素子の消灯と点灯を切り替えることでハイビームの配光パターンをより詳細に制御するものも提案されている。このような二次元的な発光素子の配列を有する車両用灯具では、二次元的な配光パターンを良好に照射するために、発光素子の実装密度を上げるとともに実装位置の精度を向上させる必要がある。発光素子としてＬＥＤを用いる場合には、表面実装型のパッケージを採用して、基板上に形成したランドに個々のＬＥＤを位置決めして実装する構造を採用して高密度に実装している。 Furthermore, in recent years, a large number of light emitting elements are two-dimensionally disposed on a substrate to selectively control turning off and lighting of the light emitting elements to control light distribution patterns of high beams in more detail. In a vehicle lamp having such a two-dimensional array of light emitting elements, it is necessary to increase the mounting density of the light emitting elements and improve the accuracy of the mounting position in order to satisfactorily irradiate the two-dimensional light distribution pattern. is there. When LEDs are used as light emitting elements, a surface mount type package is adopted, and a structure in which individual LEDs are positioned and mounted on lands formed on a substrate is adopted and mounted with high density.
　図１０は、ＡＤＢ技術を用いた光源モジュール１を示す模式平面図である。図１０に示すように光源モジュール１は、基板２上に外部と電気的に接続するためのコネクタ３が搭載され、基板２の表面にはコネクタ３から延長して配線パターン４が形成され、配線パターン４上に複数のＬＥＤ５が搭載されている。また光源モジュール１では、配線パターン４のＬＥＤ５搭載部分近傍を幅広に形成しておき、ＬＥＤ５の発光に伴う発熱を良好に放熱するための放熱パターンとして用いている。 FIG. 10 is a schematic plan view showing the light source module 1 using the ADB technology. As shown in FIG. 10, in the light source module 1, a connector 3 for electrically connecting to the outside is mounted on a substrate 2, and a wiring pattern 4 is formed on the surface of the substrate 2 extending from the connector 3. A plurality of LEDs 5 are mounted on the pattern 4. Further, in the light source module 1, the vicinity of the LED 5 mounting portion of the wiring pattern 4 is formed wide, and is used as a heat dissipation pattern for well dissipating heat generated by the light emission of the LED 5.
　また、配線パターン４での意図しない光の反射を抑制するために基板２の表面をレジスト層で覆い、ＬＥＤ５からの光を所望の配光特性で反射するために、基板２上に光学部材を搭載している。 Further, the surface of the substrate 2 is covered with a resist layer to suppress unintended light reflection in the wiring pattern 4, and an optical member is formed on the substrate 2 to reflect light from the LED 5 with desired light distribution characteristics. It is mounted.
日本国特開２０１５－０１６７７３号公報Japanese Patent Laid-Open Publication No. 2015-016773
　このような光源モジュール１では、放熱パターンの面積を確保するためにＬＥＤ５同士の間隔が拡がり高密度実装が困難であり、さらにＬＥＤ５を個別パッケージで表面実装しているため面実装の位置合わせ精度の点からも高密度実装が困難であるという問題があった。この問題を解決するために、１つのパッケージに複数のＬＥＤチップを搭載し、ワイヤボンディングにより基板上の配線層と電気的接続を行うことで、面実装の位置合わせ精度とＬＥＤチップの高密度実装を両立することができる。 In such a light source module 1, the distance between the LEDs 5 is increased to secure the area of the heat radiation pattern, and high density mounting is difficult. Furthermore, since the LEDs 5 are surface mounted in individual packages, the surface mounting alignment accuracy There is also a problem that high density mounting is difficult also from the point of view. In order to solve this problem, mounting multiple LED chips in one package and making electrical connection with the wiring layer on the substrate by wire bonding enables surface mounting alignment accuracy and high density mounting of LED chips. Can be compatible.
　しかし、ワイヤボンディングに用いられる金属ワイヤはＬＥＤからの光を反射して迷光が生じるため、車両用灯具からの照射光にグレアが生じてしまうという問題があった。ＡＤＢ技術では、光の照射領域と非照射領域を精密に制御する必要があるため、迷光によるグレアの問題は通常の車両用灯具よりもシビアな問題となる。 However, since the metal wire used for wire bonding reflects light from the LED to generate stray light, there is a problem that glare occurs in the irradiation light from the vehicular lamp. In the ADB technology, since it is necessary to precisely control the light irradiation area and the non-irradiation area, the problem of glare due to stray light becomes a more serious problem than ordinary vehicle lamps.
　また、ＬＥＤ５同士の間隔が拡がると、隣接するＬＥＤ５を点灯して得られる全体の光度を向上させることが困難であるという問題があった。また、ＡＤＢ技術ではＬＥＤを一つずつ選択的に点灯させ、点灯領域に応じて精密に制御された光照射をするため、ＬＥＤからの光の漏洩を防ぐ必要もある。 In addition, when the distance between the LEDs 5 is expanded, there is a problem that it is difficult to improve the overall luminous intensity obtained by lighting the adjacent LEDs 5. In addition, in the ADB technology, it is necessary to prevent the leakage of light from the LEDs, because the LEDs are selectively lighted one by one and light is precisely controlled according to the lighting area.
　また、このような光源モジュール１では、基板２の表面を覆うレジスト層を塗布により形成しているため、膜厚の均一性を向上するにも限界があった。設計と異なる膜厚のレジスト層上に光学部材を搭載すると、光学部材の焦点位置にＬＥＤを正確に位置合わせすることができず、車両用灯具として照射する配光特性を得られないという問題が生じる。特にＡＤＢ技術では、光の照射領域と非照射領域を精密に制御する必要があるため、光学部材とＬＥＤの相対的位置関係の調整は通常の車両用灯具よりもシビアな問題となる。 Moreover, in such a light source module 1, since the resist layer which covers the surface of the board | substrate 2 is formed by application | coating, there existed a limit also in improving the uniformity of a film thickness. If the optical member is mounted on a resist layer having a film thickness different from that of the design, the LED can not be accurately positioned at the focal position of the optical member, and the light distribution characteristic to be irradiated as a vehicle lamp can not be obtained. It occurs. In particular, in the ADB technology, since it is necessary to precisely control the irradiated area and the non-irradiated area of light, adjustment of the relative positional relationship between the optical member and the LED becomes a more serious problem than ordinary vehicle lamps.
　本発明は、高密度に発光素子を実装しながらもグレアの発生を抑制することが可能な光源モジュール及び車両用灯具を提供することを目的とする。 An object of the present invention is to provide a light source module and a vehicular lamp capable of suppressing the occurrence of glare while mounting light emitting elements with high density.
　また、本発明は、高密度に発光素子を実装して光度を向上しつつ、光の漏洩を防止することが可能な光源モジュール及び車両用灯具を提供することを目的とする。 Another object of the present invention is to provide a light source module and a vehicular lamp capable of preventing light leakage while mounting light emitting elements at high density to improve luminous intensity.
　また、本発明は、高密度に発光素子を実装しながらも光学部材とＬＥＤの相対的位置関係を精密に位置合わせすることが可能な光源モジュール及び車両用灯具を提供することを目的とする。 Another object of the present invention is to provide a light source module and a vehicular lamp capable of precisely aligning the relative positional relationship between the optical member and the LED while mounting the light emitting element at a high density.
　上記課題を解決するために、本発明の光源モジュールは、複数の発光素子と、前記各発光素子に対して個別に電力を供給する複数の金属ワイヤと、前記発光素子の側面の少なくとも一部を封止している光反射性樹脂部と、前記金属ワイヤを封止している光吸収性樹脂部とを備える。 In order to solve the above problems, a light source module according to the present invention includes a plurality of light emitting elements, a plurality of metal wires individually supplying power to the light emitting elements, and at least a part of side surfaces of the light emitting elements. The light-reflective resin part currently sealed and the light absorptive resin part which has sealed the said metal wire are provided.
　このような本発明の光源モジュールでは、発光素子の周囲を光反射性樹脂部で封止して光取り出し効率を向上させ、金属ワイヤを光吸収性樹脂部で封止することで、高密度に発光素子を実装しながらもグレアの発生を抑制することが可能となる。 In such a light source module according to the present invention, the periphery of the light emitting element is sealed with the light reflective resin portion to improve the light extraction efficiency, and the metal wire is sealed with the light absorbing resin portion to achieve high density. It becomes possible to suppress the occurrence of glare while mounting the light emitting element.
　また本発明の一態様では、前記光反射性樹脂部は、隣接する前記発光素子の間に充填されて、所定数の前記発光素子の側面を一括して封止している。 In one aspect of the present invention, the light reflective resin portion is filled between the adjacent light emitting elements, and collectively seals side surfaces of the predetermined number of light emitting elements.
　また本発明の一態様では、前記光吸収性樹脂部は、所定数の前記金属ワイヤを一括して封止している。 In one aspect of the present invention, the light absorbing resin part collectively seals a predetermined number of the metal wires.
　また本発明の一態様では、一方の表面にサブマウント配線が形成されたサブマウントを備え、前記サブマウントの第一方向に沿って前記サブマウント配線上に前記発光素子が複数搭載され、前記金属ワイヤは前記サブマウント配線に接続されている。 In one aspect of the present invention, a submount having a submount wiring formed on one surface thereof is provided, and a plurality of the light emitting elements are mounted on the submount wiring along a first direction of the submount; A wire is connected to the submount wiring.
　また本発明の一態様では、複数の前記サブマウントが、前記第一方向に延伸した第一列として配列されている。 In one aspect of the present invention, the plurality of submounts are arranged as a first row extending in the first direction.
　また本発明の一態様では、さらに複数の前記サブマウントが、前記第一方向に延伸した第二列として前記第一列に隣接して配列されている。 In one aspect of the present invention, a plurality of the submounts are further arranged adjacent to the first row as a second row extending in the first direction.
　また上記課題を解決するために、本発明の車両用灯具は、上記何れか一つに記載の光源モジュールを備え、複数の前記金属ワイヤおよび複数の前記発光素子に対して選択的に電力を供給する。 Moreover, in order to solve the said subject, the vehicle lamp of this invention is provided with the light source module as described in any one of the said, and supplies electric power selectively with respect to several said metal wire and several said light emitting elements. Do.
　このような本発明の車両用灯具では、高密度に発光素子を実装しながらもグレアの発生を抑制することが可能となる。 In such a vehicle lamp of the present invention, it is possible to suppress the occurrence of glare while mounting the light emitting elements at high density.
　また、上記課題を解決するために、本発明の光源モジュールは、一方の表面にサブマウント配線が形成されたサブマウントと、前記サブマウント配線上に第一方向に沿って搭載された複数の発光素子と、隣接する前記発光素子の間に充填されて前記発光素子の側面を封止している光反射性樹脂部と、を備え、隣接する前記発光素子の側面間距離は０．１ｍｍ～０．６ｍｍの範囲である。 Further, in order to solve the above problems, in the light source module according to the present invention, a submount having a submount wiring formed on one surface thereof, and a plurality of light emissions mounted along the first direction on the submount wiring And a light reflective resin portion filled between adjacent light emitting elements to seal the side surfaces of the light emitting elements, and the distance between the side surfaces of the adjacent light emitting elements is 0.1 mm to 0 The range is .6 mm.
　このような本発明の光源モジュールでは、隣接する発光素子の間を光反射性樹脂部で充填して封止し、隣接する発光素子の側面間距離を０．１ｍｍ～０．６ｍｍの範囲としているので、高密度に発光素子を実装して光度を向上しつつ、光の漏洩を防止することが可能となる。 In such a light source module according to the present invention, the space between the adjacent light emitting elements is filled with the light reflective resin portion and sealed, and the distance between the side faces of the adjacent light emitting elements is in the range of 0.1 mm to 0.6 mm. Therefore, it is possible to prevent light leakage while mounting the light emitting elements at high density to improve the luminous intensity.
　また本発明の一態様では、複数の前記サブマウントが、前記第一方向に延伸した第一列として配列されている。 In one aspect of the present invention, the plurality of submounts are arranged as a first row extending in the first direction.
　また本発明の一態様では、さらに複数の前記サブマウントが、前記第一方向に延伸した第二列として前記第一列に隣接して配列されている。 In one aspect of the present invention, a plurality of the submounts are further arranged adjacent to the first row as a second row extending in the first direction.
　また本発明の一態様では、前記各発光素子に対応した金属ワイヤが前記サブマウント配線に接続され、前記第一列および前記第二列の前記発光素子は、前記第一列の前記サブマウント配線に接続された前記金属ワイヤと、前記第二列の前記サブマウント配線に接続された前記金属ワイヤとの間に位置している。また上記課題を解決するために、本発明の車両用灯具は、上記何れか一つに記載の光源モジュールを備え、複数の前記発光素子に対して選択的に電力を供給する。このような本発明の車両用灯具では、高密度に発光素子を実装して光度を向上しつつ、光の漏洩を防止することが可能となる。 In one aspect of the present invention, a metal wire corresponding to each light emitting element is connected to the submount wiring, and the light emitting elements in the first row and the second row are the submount wiring in the first row Are positioned between the metal wire connected to and the metal wire connected to the submount wiring of the second row. Moreover, in order to solve the said subject, the vehicle lamp of this invention is provided with the light source module as described in any one said, and supplies electric power selectively with respect to several said light emitting elements. In such a vehicle lamp of the present invention, it is possible to prevent light leakage while mounting the light emitting elements at high density to improve the luminous intensity.
　また、上記課題を解決するために、本発明の光源モジュールは、一方の表面に配線パターンが形成された搭載基板と、前記一方の表面に搭載され前記配線パターンと電気的に接続された複数の発光素子を有する光源部と、前記光源部からの光を反射する光学部材を備え、前記搭載基板の前記配線パターン上にはレジスト層が形成されており、前記搭載基板上には、前記レジスト層がない光学部材搭載領域が形成されており、前記光学部材搭載領域に前記光学部材が搭載されている。 Further, in order to solve the above problems, a light source module according to the present invention includes a mounting substrate having a wiring pattern formed on one surface, and a plurality of the light source modules mounted on the one surface and electrically connected to the wiring pattern. A light source unit having a light emitting element and an optical member reflecting light from the light source unit are provided, a resist layer is formed on the wiring pattern of the mounting substrate, and the resist layer is formed on the mounting substrate An optical member mounting area is formed, and the optical member is mounted on the optical member mounting area.
　このような本発明の光源モジュールでは、搭載基板の光学部材搭載領域ではレジスト層が除去されており、レジスト層の膜厚が設計値と異なっていても光学部材を所望の位置に固定することができ、高密度に発光素子を実装しながらも光学部材とＬＥＤの相対的位置関係を精密に位置合わせすることができる。 In such a light source module of the present invention, the resist layer is removed in the optical member mounting region of the mounting substrate, and the optical member may be fixed at a desired position even if the film thickness of the resist layer is different from the design value. Thus, the relative positional relationship between the optical member and the LED can be precisely aligned while mounting the light emitting element with high density.
　また本発明の一態様では、前記搭載基板は金属板とガラスエポキシ樹脂層の積層構造で構成されており、前記光学部材搭載領域は、前記ガラスエポキシ樹脂層が露出している。 In one aspect of the present invention, the mounting substrate is formed of a laminated structure of a metal plate and a glass epoxy resin layer, and the glass epoxy resin layer is exposed in the optical member mounting region.
　また本発明の一態様では、前記光源部は前記ガラスエポキシ樹脂層を介さず前記発光素子が前記金属板に搭載されており、前記発光素子の高さ寸法は、前記ガラスエポキシ樹脂層の厚さ寸法より大きい。 In one aspect of the present invention, the light source unit has the light emitting element mounted on the metal plate without the glass epoxy resin layer, and the height dimension of the light emitting element is the thickness of the glass epoxy resin layer Larger than dimensions
　また本発明の一態様では、前記光学部材搭載領域は、前記光源部を挟んで一対設けられており、前記光源部は、複数の発光素子が第一方向に沿って配列され、複数の前記発光素子の発光中心線の延長線上において、前記光学部材が固定されている。 In one aspect of the present invention, the optical member mounting area is provided in a pair on both sides of the light source unit, and in the light source unit, a plurality of light emitting elements are arrayed along a first direction. The optical member is fixed on an extension of the light emission center line of the device.
　また上記課題を解決するために、本発明の車両用灯具は、上記何れか一つに記載の光源モジュールを備え、前記一方の表面には、前記配線パターンと電気的に接続された給電コネクタが搭載され、前記給電コネクタを介して複数の前記発光素子に対して選択的に電力を供給する。 Moreover, in order to solve the said subject, the vehicle lamp of this invention is equipped with the light source module as described in any one of the said, and the electric power feeding connector electrically connected with the said wiring pattern is provided on the said one surface. And power is selectively supplied to the plurality of light emitting elements through the power supply connector.
　このような本発明の車両用灯具では、高密度に発光素子を実装しながらも光学部材とＬＥＤの相対的位置関係を精密に位置合わせすることができる。 In such a vehicle lamp of the present invention, the relative positional relationship between the optical member and the LED can be precisely aligned while mounting the light emitting element at a high density.
　本発明では、高密度に発光素子を実装しながらもグレアの発生を抑制することが可能な光源モジュール及び車両用灯具を提供することができる。 According to the present invention, it is possible to provide a light source module and a vehicular lamp capable of suppressing the occurrence of glare while mounting light emitting elements at high density.
　また、本発明では、高密度に発光素子を実装して光度を向上しつつ、光の漏洩を防止することが可能な光源モジュール及び車両用灯具を提供することができる。 Further, according to the present invention, it is possible to provide a light source module and a vehicular lamp capable of preventing light leakage while mounting light emitting elements at high density to improve the luminous intensity.
　また、本発明では、高密度に発光素子を実装しながらも光学部材とＬＥＤの相対的位置関係を精密に位置合わせすることが可能な光源モジュール及び車両用灯具を提供することができる。 Further, according to the present invention, it is possible to provide a light source module and a vehicular lamp capable of precisely aligning the relative positional relationship between the optical member and the LED while mounting the light emitting element at high density.
第１実施形態における車両用灯具１００を示す分解斜視図である。It is a disassembled perspective view which shows the vehicle lamp 100 in 1st Embodiment. 第１実施形態における光源モジュール４０を示す模式斜視図である。It is a model perspective view which shows the light source module 40 in 1st Embodiment. 第１実施形態における搭載基板４１を示す模式平面図である。It is a model top view which shows the mounting substrate 41 in 1st Embodiment. 第１実施形態における搭載基板４１の分解斜視図である。It is a disassembled perspective view of the mounting substrate 41 in 1st Embodiment. 第１実施形態における搭載基板４１の模式断面図である。It is a schematic cross section of the mounting substrate 41 in 1st Embodiment. 搭載基板４１上に各部材を搭載した状態の光源モジュール４０を示す模式平面図である。FIG. 6 is a schematic plan view showing the light source module 40 in a state in which each member is mounted on a mounting substrate 41. サブマウント４３を拡大して示す拡大斜視図である。FIG. 6 is an enlarged perspective view showing a submount 43 in an enlarged manner. 発光部搭載領域４９にサブマウント４３を搭載した状態を示す部分拡大断面図である。FIG. 16 is a partial enlarged cross-sectional view showing a state in which the submount 43 is mounted on the light emitting unit mounting region 49. 発光部搭載領域４９周辺を拡大して示す拡大平面図である。It is an enlarged plan view which expands and shows the light emission part mounting area | region 49 periphery. 第２実施形態において隣接する発光素子４３ｃからの合成光度を示すグラフであり、発光素子４３ｃ同士の距離が遠くて合成光度が不十分である例を示している。It is a graph which shows the synthetic | combination light intensity from the adjacent light emitting element 43c in 2nd Embodiment, and has shown the example whose distance of light emitting element 43c is long and synthetic | combination light intensity is inadequate. 第２実施形態において隣接する発光素子４３ｃからの合成光度を示すグラフであり、発光素子４３ｃ同士の距離が近くて合成光度が十分である例を示している。It is a graph which shows the synthetic | combination light intensity from the adjacent light emitting element 43c in 2nd Embodiment, and has shown the example whose distance of light emitting element 43c is near and synthetic | combination light intensity is enough. ＡＤＢ技術を用いた光源モジュール１を示す模式平面図である。It is a model top view which shows the light source module 1 using ADB technology.
　（第１実施形態）
　以下、本発明の実施の形態について、図面を参照して詳細に説明する。各図面に示される同一または同等の構成要素、部材、処理には、同一の符号を付すものとし、適宜重複した説明は省略する。図１は、本実施形態における車両用灯具１００を示す分解斜視図である。車両用灯具１００は、レンズ１０と、レンズホルダ２０と、リフレクタ３０と、光源モジュール４０と、ヒートシンク５０と、冷却ファン６０とを備え、各部材が相互に位置決めされて図示しない固定手段で固定されている。 First Embodiment
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or equivalent components, members, and processes shown in the drawings are denoted by the same reference numerals, and duplicative descriptions will be omitted as appropriate. FIG. 1 is an exploded perspective view showing a vehicular lamp 100 in the present embodiment. The vehicular lamp 100 includes a lens 10, a lens holder 20, a reflector 30, a light source module 40, a heat sink 50, and a cooling fan 60. The members are mutually positioned and fixed by fixing means (not shown). ing.
　レンズ１０は、透光性材料で構成されて光源モジュール４０からの光を所定の配光分布となるように前方に照射するための部材である。レンズホルダ２０は、レンズ１０と光源モジュール４０およびリフレクタ３０との相対的位置関係を維持した状態でレンズ１０を保持するための部材である。リフレクタ３０は、光源モジュール４０の前方に配置されて光源モジュール４０からの光を前方に反射する部材であり、本発明における光学部材に相当している。 The lens 10 is a member which is made of a translucent material and irradiates the light from the light source module 40 forward so as to obtain a predetermined light distribution. The lens holder 20 is a member for holding the lens 10 in a state where the relative positional relationship between the lens 10 and the light source module 40 and the reflector 30 is maintained. The reflector 30 is a member disposed in front of the light source module 40 to reflect light from the light source module 40 forward, and corresponds to the optical member in the present invention.
　光源モジュール４０は、車両用灯具１００の外部から供給される電力および信号に応じて発光する部材であり、詳細は後述する。ヒートシンク５０は、光源モジュール４０の背面で光源モジュール４０に接触して配置された熱伝導性の良好な部材であり、背面側に放熱フィンが形成されている。冷却ファン６０は、ヒートシンク５０の背面側に配置されて、電力が供給されることで空気の流れを生じさせる部材である。 The light source module 40 is a member that emits light according to the power and signal supplied from the outside of the vehicle lamp 100, and the details will be described later. The heat sink 50 is a heat conductive good member disposed in contact with the light source module 40 on the back surface of the light source module 40, and a heat radiation fin is formed on the back surface side. The cooling fan 60 is a member that is disposed on the back side of the heat sink 50 and generates an air flow when power is supplied.
　車両用灯具１００では、外部から電力および信号が供給されると、光源モジュール４０が電力と信号に応じて発光し、リフレクタ３０で前方に反射された光がレンズホルダ２０内およびレンズ１０を介して前方に照射される。また、光源モジュール４０の発光に伴う熱はヒートシンク５０を介して空気中に放熱され、冷却ファン６０からの送風によって冷却される。 In the vehicle lamp 100, when power and a signal are supplied from the outside, the light source module 40 emits light according to the power and the signal, and the light reflected forward by the reflector 30 is in the lens holder 20 and through the lens 10. Irradiated forward. Further, the heat associated with the light emission of the light source module 40 is dissipated into the air via the heat sink 50 and is cooled by the air from the cooling fan 60.
　図２は、本実施形態における光源モジュール４０を示す模式斜視図である。光源モジュール４０は、搭載基板４１と、配線パターン４２と、サブマウント４３と、給電コネクタ４４と、金属ワイヤ４５ａと、光吸収性樹脂部４５と、レジスト層４６とを備え、搭載基板４１には光学部材搭載領域４７が形成されており、光学部材搭載領域４７内には光学部材固定部４８が形成されている。 FIG. 2 is a schematic perspective view showing the light source module 40 in the present embodiment. The light source module 40 includes a mounting substrate 41, a wiring pattern 42, a submount 43, a feeding connector 44, a metal wire 45a, a light absorbing resin portion 45, and a resist layer 46. An optical member mounting area 47 is formed, and an optical member fixing portion 48 is formed in the optical member mounting area 47.
　搭載基板４１は、熱伝導性が良好な材料で形成された略平板状の部材であり、一方の表面に配線パターン４２が形成されるとともに、複数のサブマウント４３と給電コネクタ４４が搭載されている。また配線パターン４２を覆うようにレジスト層４６が形成されている。搭載基板４１を構成する材料は限定されないが、銅やアルミニウム等の熱伝導性が良好な金属を用いることが好ましい。 The mounting substrate 41 is a substantially flat member formed of a material having good thermal conductivity, and the wiring pattern 42 is formed on one surface, and a plurality of submounts 43 and a feed connector 44 are mounted. There is. In addition, a resist layer 46 is formed to cover the wiring pattern 42. Although the material which comprises the mounting substrate 41 is not limited, It is preferable to use metal with favorable heat conductivity, such as copper and aluminum.
　また、搭載基板４１として導電性の基板上に絶縁性の基板を貼り合わせた複合基板を用いるとしてもよく、例えば金属基板上にガラスエポキシ樹脂層を貼り付けたものが挙げられる。搭載基板４１を金属基板で構成する場合には、金属材料の酸化による熱伝導率低下を防止するために、搭載基板４１の裏面側に酸化防止膜を形成することが好ましい。酸化防止膜の形成方法としてはプリフラックス処理やＡｕメッキ処理が挙げられるが、放熱性向上という観点からＡｕメッキ処理が好ましい。 In addition, a composite substrate in which an insulating substrate is bonded to a conductive substrate may be used as the mounting substrate 41, and for example, a glass epoxy resin layer may be bonded to a metal substrate. When the mounting substrate 41 is formed of a metal substrate, it is preferable to form an anti-oxidation film on the back surface side of the mounting substrate 41 in order to prevent the thermal conductivity from being lowered due to the oxidation of the metal material. Although the pre-flux process and Au plating process are mentioned as a formation method of an antioxidant film | membrane, Au plating process is preferable from a viewpoint of heat dissipation improvement.
　配線パターン４２は、搭載基板４１の表面に形成された導電性パターンであり、給電コネクタ４４の端子からサブマウント４３への電気的接続を確保するためのものである。搭載基板４１として導電性材料を用いる場合には、配線パターン４２と搭載基板４１の間に絶縁層を形成する。 The wiring pattern 42 is a conductive pattern formed on the surface of the mounting substrate 41, and is for securing the electrical connection from the terminal of the power supply connector 44 to the submount 43. When a conductive material is used as the mounting substrate 41, an insulating layer is formed between the wiring pattern 42 and the mounting substrate 41.
　サブマウント４３は、搭載基板４１の表面に搭載されるとともに金属ワイヤ４５ａにより配線パターン４２に電気的に接続され、金属ワイヤ４５ａを介して電力が供給されることにより電力に応じた発光を行う部材である。サブマウント４３の詳細な構造については後述する。 The submount 43 is mounted on the surface of the mounting substrate 41 and electrically connected to the wiring pattern 42 by the metal wire 45a, and is a member that emits light according to the power by being supplied with power through the metal wire 45a. It is. The detailed structure of the submount 43 will be described later.
　給電コネクタ４４は、搭載基板４１の表面に搭載された外部との電気的接続を確保するための部材であり、複数の端子が配線パターン４２に電気的に接続されている。給電コネクタ４４の形状として図２では略直方体のものを示しているが、公知のケーブルハーネスに対応して接続可能なものであれば外形や端子形状等は限定されない。 The feed connector 44 is a member mounted on the surface of the mounting substrate 41 for securing an electrical connection with the outside, and a plurality of terminals are electrically connected to the wiring pattern 42. Although the thing of a substantially rectangular parallelepiped is shown in FIG. 2 as a shape of the electric power feeding connector 44, an external shape, a terminal shape, etc. will not be limited if it can connect according to a well-known cable harness.
　金属ワイヤ４５ａは、サブマウント４３に設けられた端子と搭載基板４１上に形成された配線パターン４２とを接続するための部材であり、公知のワイヤボンディング技術で実現できる金属製の導電性部材である。金属ワイヤ４５ａを構成する材料は限定されず、金、銅、アルミニウム等を用いることができるが、金を用いることが好ましい。 The metal wire 45a is a member for connecting the terminal provided on the submount 43 and the wiring pattern 42 formed on the mounting substrate 41, and is a metal conductive member which can be realized by a known wire bonding technique. is there. The material which comprises the metal wire 45a is not limited, Although gold, copper, aluminum etc. can be used, it is preferable to use gold.
　光吸収性樹脂部４５は、ベース樹脂に無機フィラーと光吸収性材料を混入した樹脂部材であり、金属ワイヤ４５ａを覆って封止する。光吸収性樹脂部４５による金属ワイヤ４５ａの封止は、金属ワイヤ４５ａを個別に１本ずつ封止するとしてもよいが、複数の金属ワイヤ４５ａを一括して封止することが好ましい。光吸収性樹脂部４５のベース樹脂としては、高い耐熱性、耐光性、透光性を有したハンドリングの良い硬化性樹脂組成物が好ましく、エポキシ樹脂やシリコーン樹脂等の公知の封止材料が挙げられる。特に、熱による光吸収性樹脂部４５の膨張や収縮で金属ワイヤ４５ａに応力が加わり変形や破断することを防止するためには、ベース樹脂として硬化後の弾性率が低いシリコーン樹脂を用いることが好ましい。ベース樹脂に混入する光吸収性材料としては、カーボンフィラー等が挙げられる。 The light absorbing resin portion 45 is a resin member in which an inorganic filler and a light absorbing material are mixed in a base resin, and covers and seals the metal wire 45a. The metal wire 45a may be sealed individually by the light absorbing resin portion 45. However, it is preferable to collectively seal the plurality of metal wires 45a. As a base resin of the light absorbing resin portion 45, a curable resin composition having high heat resistance, light resistance, and good handleability which is light transmissive is preferable, and a known sealing material such as an epoxy resin or a silicone resin is mentioned. Be In particular, in order to prevent stress from being applied to the metal wire 45a due to expansion or contraction of the light absorbing resin portion 45 due to heat, a silicone resin having a low elastic modulus after curing may be used as a base resin. preferable. A carbon filler etc. are mentioned as a light absorptive material mixed in base resin.
　本実施形態の光源モジュール４０では、金属ワイヤ４５ａを光吸収性樹脂部４５で覆って封止することで、金属ワイヤ４５ａに導電性異物が付着してショートすることを防止できる。また、光吸収性樹脂部４５は光吸収性材料を混入しているため、サブマウント４３からの光が金属ワイヤ４５ａに到達して反射され、迷光として車両用灯具１００の外部に照射されることを防止できる。特に、ＡＤＢ技術を用いてサブマウント４３に含まれる発光素子を選択的に点灯させる場合には、金属ワイヤ４５ａにより反射された迷光が非照射領域に到達することを防止でき、高密度に発光素子を実装しながらもグレアの発生を抑制することが可能となる。 In the light source module 40 of the present embodiment, by covering and sealing the metal wire 45a with the light absorbing resin portion 45, it is possible to prevent the conductive foreign matter from adhering to the metal wire 45a and causing a short circuit. Further, since the light absorbing resin portion 45 mixes the light absorbing material, the light from the submount 43 reaches the metal wire 45 a and is reflected, and is irradiated to the outside of the vehicular lamp 100 as stray light. Can be prevented. In particular, in the case where the light emitting element included in the submount 43 is selectively turned on using the ADB technology, it is possible to prevent stray light reflected by the metal wire 45a from reaching the non-irradiated area, and the light emitting element It is possible to suppress the occurrence of glare while implementing the
　光吸収性樹脂部４５を形成する際には、無機フィラーと光吸収性材料を混練したベース樹脂をディスペンサー等で金属ワイヤ４５ａ上に供給した後に硬化する。光吸収性材料を混練した後の粘度およびチクソ性は、塗布後の成型性や給電ワイヤへの応力を考慮して、ベース樹脂の材料選定や無機フィラーの添加量を調整することで任意に調整可能である。チクソ性はディスペンサーの射出性／塗布後の成型性より、Ｅ型粘度計における２３℃、回転数０．５ｒｐｍの粘度、および回転数５ｒｐｍの粘度において、（０．５ｒｐｍの粘度）／（５ｒｐｍの粘度）が２．０以上３．５以下であることがハンドリングの観点から好ましい。チクソ性をこの範囲に設定するとベース樹脂の流動性が適度に保たれ、サブマウント４３の周囲をダム部材等で囲まなくとも、樹脂が流出して金属ワイヤ４５ａが露出することや、金属ワイヤ４５ａ同士の間隙や下部に空隙が生じることを防止できる。 When forming the light absorbing resin portion 45, the base resin obtained by kneading the inorganic filler and the light absorbing material is supplied onto the metal wire 45a by a dispenser or the like and then cured. The viscosity and thixotropy after kneading the light absorbing material can be arbitrarily adjusted by adjusting the material selection of the base resin and the addition amount of the inorganic filler in consideration of the moldability after application and the stress on the feeding wire. It is possible. Thixotropy is determined by the injectability of the dispenser / the moldability after application, at a viscosity of 0.5 rpm at 23 ° C. and a viscosity of 5 rpm at an E-type viscometer (viscosity of 0.5 rpm) / (5 rpm) It is preferable from the viewpoint of handling that the viscosity) is 2.0 or more and 3.5 or less. When the thixotropy is set in this range, the fluidity of the base resin is appropriately maintained, and even if the submount 43 is not surrounded by a dam member or the like, the resin flows out and the metal wire 45a is exposed, and the metal wire 45a It is possible to prevent the formation of a void in the gap between the two or in the lower part.
　レジスト層４６は、搭載基板４１の表面側に配線パターン４２を覆うように形成された絶縁性の膜状部材である。レジスト層４６を構成する材料は限定されないが、搭載基板４１の表面と配線パターン４２での光反射が異なることによる迷光を抑制するために、レジスト層４６を形成した領域内の光反射率を均一化するように光反射性材料または光吸収性材料を用いることが好ましい。 The resist layer 46 is an insulating film-like member formed on the surface side of the mounting substrate 41 so as to cover the wiring pattern 42. Although the material which comprises the resist layer 46 is not limited, In order to suppress the stray light by the light reflection in the surface of the mounting substrate 41, and the wiring pattern 42 differing, the light reflectivity in the area | region in which the resist layer 46 was formed is uniform. Preferably, a light reflective material or a light absorbing material is used to
　光学部材搭載領域４７は、光学部材であるリフレクタ３０を搭載するための搭載基板４１表面における領域であり、レジスト層４６が形成されず搭載基板４１の表面が露出している領域である。光学部材搭載領域４７は、サブマウント４３を搭載している領域を挟んで搭載基板４１の両側に位置しており、光学部材搭載領域４７にリフレクタ３０を当接させて固定することで、サブマウント４３を跨いでリフレクタ３０を配置することができる。 The optical member mounting area 47 is an area on the surface of the mounting substrate 41 for mounting the reflector 30, which is an optical member, and is an area where the resist layer 46 is not formed and the surface of the mounting substrate 41 is exposed. The optical member mounting area 47 is located on both sides of the mounting substrate 41 across the area on which the submount 43 is mounted, and the reflector 30 is brought into contact with the optical member mounting area 47 to fix the submount. The reflector 30 can be disposed across 43.
　光学部材固定部４８は、光学部材搭載領域４７内に設けられた貫通孔である。光学部材搭載領域４７にリフレクタ３０を当接させ、光学部材固定部４８に搭載基板４１の表面側からネジ等の固定部材を挿入して搭載基板４１およびリフレクタ３０をヒートシンク５０に固定する。光学部材固定部４８の形成位置についても詳細を後述するが、２つの光学部材固定部４８の間にサブマウント４３が配列されている。 The optical member fixing portion 48 is a through hole provided in the optical member mounting area 47. The reflector 30 is brought into contact with the optical member mounting area 47, and a fixing member such as a screw is inserted into the optical member fixing portion 48 from the surface side of the mounting substrate 41 to fix the mounting substrate 41 and the reflector 30 to the heat sink 50. The details of the formation position of the optical member fixing portion 48 will be described later, but the submount 43 is arranged between the two optical member fixing portions 48.
　図３は、本実施形態における搭載基板４１を示す模式平面図である。図２で示したように、搭載基板４１上には配線パターン４２が形成されており、配線パターン４２を覆ってレジスト層４６が形成されている。図３に示すように、光学部材搭載領域４７と、サブマウント４３を搭載する発光部搭載領域４９と、金属ワイヤ４５ａをボンディングする部分と、給電コネクタ４４を搭載する給電コネクタ搭載部４４ａと、給電コネクタ４４の端子を接続する部分を除いた領域にはレジスト層４６が形成されている。 FIG. 3 is a schematic plan view showing the mounting substrate 41 in the present embodiment. As shown in FIG. 2, the wiring pattern 42 is formed on the mounting substrate 41, and a resist layer 46 is formed to cover the wiring pattern 42. As shown in FIG. 3, an optical member mounting area 47, a light emitting section mounting area 49 for mounting the submount 43, a portion for bonding the metal wire 45a, a feeding connector mounting portion 44a for mounting the feeding connector 44, and feeding A resist layer 46 is formed in the region excluding the portion connecting the terminals of the connector 44.
　発光部搭載領域４９は、前述したように複数のサブマウント４３を搭載する領域であり、図中左右方向を長手方向としてサブマウント４３を二列配列できるように形成されている。また、光学部材固定部４８の中心を結ぶ線Ｌ１は、発光部搭載領域４９の略中央を長手方向に沿って横断するような位置関係とされている。 The light emitting portion mounting area 49 is an area on which the plurality of sub mounts 43 are mounted as described above, and is formed so that the sub mounts 43 can be arranged in two rows with the horizontal direction in the drawing as the longitudinal direction. Further, a line L1 connecting the centers of the optical member fixing portions 48 has a positional relationship such that it crosses the approximate center of the light emitting portion mounting area 49 along the longitudinal direction.
　図４Ａおよび図４Ｂは、本実施形態における搭載基板４１の構造を詳細に説明する図であり、図４Ａは分解斜視図であり、図４Ｂは模式断面図である。図４Ａに示すように、搭載基板４１は、金属板４１ａと接着シート４１ｂとガラスエポキシ樹脂層４１ｃの積層構造で構成されている。接着シート４１ｂとガラスエポキシ樹脂層４１ｃには、それぞれに発光部搭載領域４９に対応した形状の開口部４９ｂ，４９ｃが形成されており、開口部４９ｂ，４９ｃの位置が一致している。接着シート４１ｂとガラスエポキシ樹脂層４１ｃの所定領域に開口部４９ｂ，４９ｃを予め形成しておき位置合わせして貼り付けるとしてもよく、金属板４１ａとガラスエポキシ樹脂層４１ｃを接着シート４１ｂで貼り付けた後に切削加工等により開口部４９ｂ，４９ｃを一括して形成するとしてもよい。 4A and 4B are diagrams for explaining the structure of the mounting substrate 41 in the present embodiment in detail, FIG. 4A is an exploded perspective view, and FIG. 4B is a schematic cross-sectional view. As shown in FIG. 4A, the mounting substrate 41 is formed of a laminated structure of a metal plate 41a, an adhesive sheet 41b, and a glass epoxy resin layer 41c. In the adhesive sheet 41b and the glass epoxy resin layer 41c, openings 49b and 49c having a shape corresponding to the light emitting unit mounting area 49 are respectively formed, and the positions of the openings 49b and 49c coincide with each other. The openings 49b and 49c may be formed in advance in predetermined regions of the adhesive sheet 41b and the glass epoxy resin layer 41c and may be aligned and attached, and the metal plate 41a and the glass epoxy resin layer 41c may be adhered with the adhesive sheet 41b. After that, the openings 49b and 49c may be collectively formed by cutting or the like.
　図４Ｂに示すように、発光部搭載領域４９の周囲では接着シート４１ｂとガラスエポキシ樹脂層４１ｃが積層され、ガラスエポキシ樹脂層４１ｃ上には配線パターン４２およびレジスト層４６が形成されている。発光部搭載領域４９の内部では、開口部４９ｂ，４９ｃに対応した領域で金属板４１ａの表面が一部露出している。また、前述したように光学部材搭載領域４７にはレジスト層４６が形成されていないため、光学部材搭載領域４７ではガラスエポキシ樹脂層４１ｃが露出している。 As shown in FIG. 4B, the adhesive sheet 41b and the glass epoxy resin layer 41c are laminated around the light emitting portion mounting area 49, and the wiring pattern 42 and the resist layer 46 are formed on the glass epoxy resin layer 41c. Inside the light emitting portion mounting region 49, the surface of the metal plate 41a is partially exposed in the regions corresponding to the openings 49b and 49c. Further, as described above, since the resist layer 46 is not formed in the optical member mounting region 47, the glass epoxy resin layer 41c is exposed in the optical member mounting region 47.
　本実施形態の光源モジュール４０では、光学部材搭載領域４７にはレジスト層４６が形成されておらず、光学部材であるリフレクタ３０をガラスエポキシ樹脂層４１ｃに直接搭載して固定する。これにより、レジスト層４６の膜厚のばらつきによって生じるリフレクタ３０とサブマウント４３との位置ズレを抑制し、光学部材と発光素子４３ｃの相対的位置関係を精密に位置合わせして良好な配光特性で光照射することが可能となる。また、金属板４１ａに接着シート４１ｂを用いてガラスエポキシ樹脂層４１ｃを貼り付けることで、金属板４１ａ上に高熱伝導性フィラーを含有した絶縁層を形成する必要がなくなり、製造工程及び製造コストの低減を図ることが可能となる。 In the light source module 40 of the present embodiment, the resist layer 46 is not formed in the optical member mounting area 47, and the reflector 30, which is an optical member, is directly mounted on the glass epoxy resin layer 41c and fixed. Thereby, the positional deviation between the reflector 30 and the submount 43 caused by the variation of the film thickness of the resist layer 46 is suppressed, and the relative positional relationship between the optical member and the light emitting element 43c is precisely aligned to obtain good light distribution characteristics. It becomes possible to irradiate with light. In addition, by bonding the glass epoxy resin layer 41c to the metal plate 41a using the adhesive sheet 41b, it is not necessary to form an insulating layer containing a high thermal conductivity filler on the metal plate 41a, and the manufacturing process and cost can be reduced. It becomes possible to aim at reduction.
　図５は、搭載基板４１上に各部材を搭載した状態の光源モジュール４０を示す模式平面図である。図４Ａおよび図４Ｂで示した搭載基板４１の給電コネクタ搭載部４４ａと端子接続部分にハンダを塗布し、表面実装型の給電コネクタ４４をハンダリフローにより実装する。また、サブマウント４３の裏面と発光部搭載領域４９内で露出する金属板４１ａとを接着剤で固定し、長手方向に沿って複数のサブマウント４３を二列配列した後に、ワイヤボンディングにより金属ワイヤ４５ａでサブマウント４３と配線パターン４２とを電気的に接続する。最後に、複数の金属ワイヤ４５ａに対してディスペンサーで光吸収性樹脂部４５を塗布して硬化する。前述したように、光学部材固定部４８の中心を結んだ線Ｌ１は、二列に配列したサブマウント４３の長手方向に沿って略中央に位置している。 FIG. 5 is a schematic plan view showing the light source module 40 in a state in which each member is mounted on the mounting substrate 41. As shown in FIG. Solder is applied to the feed connector mounting portion 44a and the terminal connection portion of the mounting substrate 41 shown in FIGS. 4A and 4B, and the surface mount feed connector 44 is mounted by solder reflow. Further, after fixing the back surface of the submount 43 and the metal plate 41a exposed in the light emitting portion mounting region 49 with an adhesive and arranging the plural submounts 43 in two rows along the longitudinal direction, metal wires are formed by wire bonding. At 45a, the submount 43 and the wiring pattern 42 are electrically connected. Finally, the light absorbing resin portion 45 is applied to the plurality of metal wires 45a with a dispenser and cured. As described above, the line L1 connecting the centers of the optical member fixing portions 48 is located approximately at the center along the longitudinal direction of the submounts 43 arranged in two rows.
　図６は、サブマウント４３を拡大して示す拡大斜視図である。サブマウント４３は、サブマウント基板４３ａ上に複数のサブマウント配線４３ｂが形成され、サブマウント配線４３ｂ上に複数の発光素子４３ｃが搭載され、複数の発光素子４３ｃの側面を一括して光反射性樹脂部４３ｄが封止している。また、サブマウント基板４３ａ上の一部には光反射性樹脂部４３ｄが形成されず、サブマウント基板４３ａの表面及びサブマウント配線４３ｂが露出している。発光素子４３ｃは、光反射性樹脂部４３ｄの内部において、隣り合うサブマウント配線４３ｂ間に跨ってフリップチップ実装されている。 FIG. 6 is an enlarged perspective view showing the submount 43 in an enlarged manner. In the submount 43, a plurality of submount wires 43b are formed on a submount substrate 43a, a plurality of light emitting elements 43c are mounted on the submount wire 43b, and the side surfaces of the plurality of light emitting elements 43c are collectively light reflective. The resin portion 43d is sealed. Further, the light reflective resin portion 43d is not formed on a part of the submount substrate 43a, and the surface of the submount substrate 43a and the submount wiring 43b are exposed. The light emitting element 43c is flip chip mounted across the adjacent submount wires 43b inside the light reflective resin portion 43d.
　サブマウント基板４３ａは、絶縁性で熱伝導性が良好な材質で形成された略矩形の平板状部材であり、例えばＳｉやＡｌＮ等で構成されている。サブマウント配線４３ｂは、サブマウント基板４３ａの一方の表面上に形成された導電性パターンであり、発光素子４３ｃと電気的に接続されるとともに金属ワイヤ４５ａがワイヤボンドされる。 The submount substrate 43a is a substantially rectangular flat plate member made of an insulating material having good thermal conductivity, and is made of, for example, Si or AlN. The submount wiring 43b is a conductive pattern formed on one surface of the submount substrate 43a, and is electrically connected to the light emitting element 43c and wire-bonded to the metal wire 45a.
　発光素子４３ｃは、２本の金属ワイヤ４５ａに電気的に接続されて、金属ワイヤ４５ａ間に電圧が印加されると発光する部材であり、ＬＥＤチップと蛍光体材料との組み合わせによって構成されている。ＬＥＤチップとしては青色や紫色、紫外光の波長を一次光として出射するＧａＮ系などの公知の化合物半導体材料を用いることができる。蛍光体材料としては、一次光により励起されて所望の二次光を照射する公知の材料を用いることができ、ＬＥＤチップからの一次光と混色により白色を得るものや、複数の蛍光体材料を用いて複数の二次光の混色により白色を得るものを用いることができる。 The light emitting element 43c is a member which is electrically connected to the two metal wires 45a and emits light when a voltage is applied between the metal wires 45a, and is formed of a combination of an LED chip and a phosphor material. . As the LED chip, a known compound semiconductor material such as blue or violet or a GaN-based that emits the wavelength of ultraviolet light as primary light can be used. As a phosphor material, a known material which is excited by primary light and emits a desired secondary light can be used, and ones which obtain white by mixing with primary light from the LED chip, and a plurality of phosphor materials are used. What can be used to obtain white by mixing a plurality of secondary lights can be used.
　光反射性樹脂部４３ｄは、ベース樹脂に光反射性微粒子を混入した部材であり、例えば酸化チタン等の微粒子を混入した白色樹脂が挙げられ、発光素子４３ｃで出射した光を良好に反射する。また光反射性樹脂部４３ｄは、発光素子４３ｃを囲んで側面を封止して充填されており、発光素子４３ｃの側面から照射される光を発光素子４３ｃ内部方向に反射する。これにより、発光素子４３ｃでの発光は発光素子４３ｃ側面から側方に漏れ出すことがなく、発光素子４３ｃの上面から良好に外部に照射される。 The light reflective resin portion 43d is a member in which light reflective fine particles are mixed in a base resin, and for example, white resin in which fine particles such as titanium oxide are mixed is mentioned, and light emitted by the light emitting element 43c is favorably reflected. The light reflective resin portion 43d is sealed so as to surround the light emitting element 43c at its side, and reflects light emitted from the side of the light emitting element 43c in the inside direction of the light emitting element 43c. As a result, light emitted from the light emitting element 43c does not leak laterally from the side surface of the light emitting element 43c, and the light is favorably emitted to the outside from the top surface of the light emitting element 43c.
　図６に示すように、サブマウント４３の長手方向（第一方向の一例）に沿って配列された複数の発光素子４３ｃは、隣接する発光素子４３ｃ同士の側面間距離はｄ１であり、発光素子４３ｃ同士の中心間距離はｄ２となっている。図２に示したように、複数のサブマウント４３が上下二列に配列されて光源部を構成しており、長手方向に延伸してサブマウント基板４３ａが複数隣接して配置されて一列目（第一列の一例）を構成するとともに、一列目に隣接して二列目（第二列の一例）のサブマウント基板４３ａが配置されている。 As shown in FIG. 6, in the plurality of light emitting elements 43c arranged along the longitudinal direction (an example of the first direction) of the submount 43, the distance between the side surfaces of the adjacent light emitting elements 43c is d1, and the light emitting elements The distance between centers of 43c is d2. As shown in FIG. 2, a plurality of submounts 43 are arranged in upper and lower two rows to constitute a light source unit, and extended in the longitudinal direction to be arranged with a plurality of submount substrates 43a adjacent to each other to form a first row The submount substrate 43a of the second row (an example of the second row) is disposed adjacent to the first row while constituting an example of the first row.
　図７は、発光部搭載領域４９にサブマウント４３を搭載した状態を示す部分拡大断面図である。発光部搭載領域４９で露出した金属板４１ａ上に接着剤でサブマウント基板４３ａが固定され、サブマウント基板４３ａ上の発光素子４３ｃの側面は光反射性樹脂部４３ｄで封止されている。サブマウント基板４３ａ上の光反射性樹脂部４３ｄが形成されていない領域には、金属ワイヤ４５ａの一端がワイヤボンドされている。 FIG. 7 is a partially enlarged cross-sectional view showing a state in which the submount 43 is mounted on the light emitting portion mounting region 49. As shown in FIG. The submount substrate 43a is fixed with an adhesive on the metal plate 41a exposed in the light emitting portion mounting region 49, and the side surface of the light emitting element 43c on the submount substrate 43a is sealed by the light reflective resin portion 43d. One end of the metal wire 45a is wire-bonded to the area on the submount substrate 43a where the light reflective resin portion 43d is not formed.
　本実施形態の光源モジュール４０では、複数の発光素子４３ｃをサブマウント基板４３ａ上に搭載し、サブマウント基板４３ａ表面に形成されたサブマウント配線４３ｂに対して金属ワイヤ４５ａをワイヤボンドして電力を供給する。これにより、ハンダを用いて発光素子４３ｃを配線パターン４２上に直接搭載するよりも、融点の高い金属ワイヤ４５ａで大電流を供給することができ、光源モジュール４０の光度を高めることが可能となる。また、サブマウント基板４３ａを発光部搭載領域４９内で露出した金属板４１ａに対して搭載し、耐熱温度が高い接着剤を用いて固定することにより、ハンダを用いた発光素子４３ｃの実装よりも耐熱温度を高く設定でき、さらに大電流供給と高光度化を図ることができる。 In the light source module 40 according to the present embodiment, a plurality of light emitting elements 43c are mounted on the submount substrate 43a, and metal wires 45a are bonded to the submount wiring 43b formed on the surface of the submount substrate 43a to perform power. Supply. As a result, rather than mounting the light emitting element 43c directly on the wiring pattern 42 using solder, a large current can be supplied by the metal wire 45a having a high melting point, and the light intensity of the light source module 40 can be increased. . Further, the submount substrate 43a is mounted on the metal plate 41a exposed in the light emitting portion mounting region 49, and is fixed using an adhesive having a high heat resistance temperature, compared to mounting of the light emitting element 43c using solder. The heat resistant temperature can be set high, and further, large current supply and high light intensity can be achieved.
　図７に示すように、ガラスエポキシ樹脂層４１ｃ上に形成された配線パターン４２はレジスト層４６で覆われているが、金属ワイヤ４５ａの他端をワイヤボンドする位置にはレジスト層４６が形成されていない。金属ワイヤ４５ａ全体は光吸収性樹脂部４５で封止されており、金属ワイヤ４５ａの両端におけるワイヤボンド位置と金属ワイヤ４５ａの上部および下部に充填されている。光吸収性樹脂部４５は、サブマウント基板４３ａのワイヤボンド位置において光反射性樹脂部４３ｄに隣接して形成されている。図７では接着シート４１ｂの図示は省略している。 As shown in FIG. 7, the wiring pattern 42 formed on the glass epoxy resin layer 41c is covered with the resist layer 46, but the resist layer 46 is formed at the position where the other end of the metal wire 45a is wire bonded. Not. The entire metal wire 45a is sealed by the light absorbing resin portion 45, and is filled in the wire bonding positions at both ends of the metal wire 45a and the upper and lower portions of the metal wire 45a. The light absorbing resin portion 45 is formed adjacent to the light reflecting resin portion 43d at the wire bonding position of the submount substrate 43a. In FIG. 7, the adhesive sheet 41b is not shown.
　上述したように、サブマウント４３は発光部搭載領域４９内でガラスエポキシ樹脂層４１ｃを介さず金属板４１ａに搭載されており、サブマウント４３における発光素子の高さ寸法は、ガラスエポキシ樹脂層４１ｃの厚さ寸法より大きい。ここでサブマウント４３における発光素子の高さ寸法とは、サブマウント基板４３ａの底面から発光素子４３ｃの上面までの距離であり、例えば１．３ｍｍ程度である。 As described above, the submount 43 is mounted on the metal plate 41a without the glass epoxy resin layer 41c in the light emitting portion mounting region 49, and the height dimension of the light emitting element in the submount 43 is the glass epoxy resin layer 41c. Larger than the thickness dimension of Here, the height dimension of the light emitting element in the submount 43 is the distance from the bottom surface of the submount substrate 43a to the upper surface of the light emitting element 43c, and is, for example, about 1.3 mm.
　本実施形態の光源モジュール４０では、サブマウント４３の高さがガラスエポキシ樹脂層４１ｃの厚さよりも大きいため、サブマウント４３の光取り出し面である発光素子４３ｃ上面がガラスエポキシ樹脂層４１ｃよりも上方に位置する。これにより、サブマウント４３から照射される光がガラスエポキシ樹脂層４１ｃの側面に入射して遮られることを防止でき、良好に光を取り出して所望の配光特性で光照射することができる。 In the light source module 40 of the present embodiment, the height of the submount 43 is larger than the thickness of the glass epoxy resin layer 41c, so the upper surface of the light emitting element 43c, which is the light extraction surface of the submount 43, is higher than the glass epoxy resin layer 41c. Located in Thus, it is possible to prevent the light emitted from the submount 43 from entering the side surface of the glass epoxy resin layer 41c and blocking it, and light can be extracted well and irradiated with a desired light distribution characteristic.
　本実施形態の光源モジュール４０では、金属板４１ａとガラスエポキシ樹脂層４１ｃを接着シート４１ｂで貼り合わせた後に、搭載基板４１の裏面側から抜き打ち加工で光学部材固定部４８を形成する。ガラスエポキシ樹脂層４１ｃの厚さ寸法を０．０５ｍｍ～０．２ｍｍ、好ましくは０．０７５ｍｍ～０．１５ｍｍとすると、抜き打ち加工時に金属板４１ａに生じるバリがガラスエポキシ樹脂層４１ｃによって抑制され、光学部材であるリフレクタ３０を精密に位置合わせして固定することが可能となる。 In the light source module 40 of the present embodiment, the metal plate 41a and the glass epoxy resin layer 41c are bonded together with the adhesive sheet 41b, and then the optical member fixing portion 48 is formed by punching from the back surface side of the mounting substrate 41. When the thickness dimension of the glass epoxy resin layer 41c is 0.05 mm to 0.2 mm, preferably 0.075 mm to 0.15 mm, burrs generated on the metal plate 41a at the time of punching are suppressed by the glass epoxy resin layer 41c, and optical It becomes possible to position and fix the reflector 30 which is a member precisely.
　図８は、発光部搭載領域４９周辺を拡大して示す拡大平面図である。図８に示すように光吸収性樹脂部４５は、複数の金属ワイヤ４５ａを一括して封止しており、配線パターン４２のワイヤボンド位置からサブマウント４３のワイヤボンド位置まで覆い、光反射性樹脂部４３ｄに隣接する位置にまで形成されている。また、サブマウント４３は左右方向に沿って複数配列されるとともに、上下方向に二列が隣接して配置されて本発明の光源部を構成している。 FIG. 8 is an enlarged plan view showing the area around the light emitting unit mounting area 49 in an enlarged manner. As shown in FIG. 8, the light absorbing resin portion 45 collectively seals the plurality of metal wires 45 a, covers from the wire bonding position of the wiring pattern 42 to the wire bonding position of the submount 43, and reflects light. It is formed to a position adjacent to the resin portion 43d. Further, a plurality of submounts 43 are arranged along the left-right direction, and two rows are arranged adjacent to each other in the up-down direction to constitute the light source unit of the present invention.
　上下二列にサブマウント４３が配列された光源部では、発光素子４３ｃも二列に配列されており、図８に示す線Ｌ２は二列の発光素子４３ｃの中間位置を示す発光中心線である。この発光中心線Ｌ２は、図５で示した光学部材固定部４８の中心を結んだ線Ｌ１と略一致しており、複数の発光素子４３ｃの発光中心線Ｌ２の延長線上において、光学部材であるリフレクタ３０が固定される。 In the light source section in which the submounts 43 are arranged in two upper and lower lines, the light emitting elements 43c are also arranged in two lines, and a line L2 shown in FIG. 8 is a light emission center line indicating an intermediate position of the two lines of light emitting elements 43c. . The light emission center line L2 substantially coincides with the line L1 connecting the centers of the optical member fixing portion 48 shown in FIG. 5, and is an optical member on the extension of the light emission center line L2 of the plurality of light emitting elements 43c. The reflector 30 is fixed.
　本実施形態の光源モジュール４０では、光学部材固定部４８の中心を結んだ線Ｌ１と、サブマウント４３の発光中心線Ｌ２とが略一致しているため、搭載基板４１に反りが生じている場合などにも、発光中心線Ｌ２上でリフレクタ３０を締結することで反りを低減し、光源部と光学部材との位置関係を適切に設定することができる。また、ヒートシンク５０を含めて一括して搭載基板４１とリフレクタ３０を締結すると、発光部搭載領域４９の裏面側をヒートシンクに対して密着させることができ、反りの無い搭載基板４１と同様の放熱特性を得ることが可能となる。 In the light source module 40 according to the present embodiment, since the line L1 connecting the centers of the optical member fixing portions 48 and the light emission center line L2 of the submount 43 substantially coincide with each other, the mounting substrate 41 is warped. In addition, the warp can be reduced by fastening the reflector 30 on the light emission center line L2, and the positional relationship between the light source unit and the optical member can be appropriately set. In addition, if the mounting substrate 41 and the reflector 30 are fastened together including the heat sink 50, the back side of the light emitting portion mounting region 49 can be in close contact with the heat sink, and the heat dissipation characteristics similar to the mounting substrate 41 without warpage. It is possible to obtain
　配線パターン４２のワイヤボンド位置は、発光部搭載領域４９の図中上下辺に沿って設けられており、図中上列（第一列の一例）のサブマウント４３に対しては図中上方から金属ワイヤ４５ａがワイヤボンディングされ、図中下列（第二列の一例）のサブマウント４３に対しては図中下方から金属ワイヤ４５ａがワイヤボンディングされている。したがって、第一列および第二列の発光素子４３ｃは、第一列に接続される金属ワイヤ４５ａと、第二列に接続される金属ワイヤ４５ａとの間に位置している。 The wire bonding position of the wiring pattern 42 is provided along the upper and lower sides of the light emitting portion mounting region 49 in the drawing, and the upper row (an example of the first row) in the drawing is from above in the drawing. The metal wire 45a is wire-bonded, and the metal wire 45a is wire-bonded from the lower side in the figure to the submount 43 in the lower row (an example of the second row) in the figure. Accordingly, the light emitting elements 43c in the first row and the second row are located between the metal wire 45a connected to the first row and the metal wire 45a connected to the second row.
　本発明の車両用灯具１００では、給電コネクタ４４、配線パターン４２、金属ワイヤ４５ａ、サブマウント配線４３ｂを介して、外部から発光素子４３ｃに対して選択的に電力が供給され、発光素子４３ｃが点灯する。光源部を構成する複数のサブマウント４３のうち、選択された発光素子４３ｃが点灯することで光源部全体での配光分布が決定され、リフレクタ３０およびレンズ１０を介してＡＤＢ技術により車両用灯具１００前方に二次元的な配光パターンを照射する。 In the vehicle lamp 100 of the present invention, power is selectively supplied from the outside to the light emitting element 43c via the power supply connector 44, the wiring pattern 42, the metal wire 45a, and the submount wiring 43b, and the light emitting element 43c is lit. Do. The light distribution distribution in the whole light source part is determined by lighting the selected light emitting element 43c among the plurality of submounts 43 which constitute the light source part, and the vehicle lamp according to ADB technology through the reflector 30 and the lens 10 A two-dimensional light distribution pattern is emitted forward of 100.
　（第２実施形態）
　次に、本発明の第２実施形態について図９Ａおよび図９Ｂを用いて説明する。第１実施形態と重複する内容は説明を省略する。本実施形態では、ＡＤＢ技術を用いない場合にも適用することができる。車両用灯具１００の構成及び光源モジュール４０の構成は第１実施形態と同様であり説明を省略する。 Second Embodiment
Next, a second embodiment of the present invention will be described using FIGS. 9A and 9B. The same contents as the first embodiment will not be described. The present embodiment can also be applied to the case where ADB technology is not used. The configuration of the vehicular lamp 100 and the configuration of the light source module 40 are the same as those of the first embodiment, and the description thereof will be omitted.
　図９Ａおよび図９Ｂは、本実施形態において隣接する発光素子４３ｃからの合成光度を示すグラフであり、図９Ａは発光素子４３ｃ同士の距離が遠くて合成光度が不十分である例を示し、図９Ｂは発光素子４３ｃ同士の距離が近くて合成光度が十分である例を示している。図中横軸はサブマウント４３の長手方向に沿った位置を示し、縦軸は光度を示している。図中の破線は１つの発光素子４３ｃから照射される光の光度を示し、図中の実線は隣接する２つの発光素子４３ｃから照射される光の合成光度を示している。 FIGS. 9A and 9B are graphs showing the synthetic light intensity from the adjacent light emitting elements 43c in the present embodiment, and FIG. 9A shows an example in which the distance between the light emitting elements 43c is long and the synthetic light intensity is insufficient. 9B shows an example in which the distance between the light emitting elements 43c is short and the synthetic light intensity is sufficient. In the figure, the horizontal axis indicates the position along the longitudinal direction of the submount 43, and the vertical axis indicates the light intensity. The broken line in the figure shows the luminous intensity of the light emitted from one light emitting element 43c, and the solid line in the figure shows the synthetic luminous intensity of the lights emitted from the two adjacent light emitting elements 43c.
　図６に示した隣接する発光素子４３ｃの側面間距離ｄ１が０．６ｍｍを超える場合には、図９Ａに示すように合成光度のピークが小さく、１つの発光素子４３ｃから照射される光度よりも数％程度向上するだけである。側面間距離ｄ１を０．６ｍｍ以下とすることで、図９Ｂに示すように合成光度のピークが大きくなり、１つの発光素子４３ｃから照射される光度よりも２０％以上向上させることができる。特に、ＡＤＢ技術を適用する場合には、発光素子４３ｃを選択的に点灯および非点灯として照射領域と非照射領域を精密に制御するため、照射領域の合成光度が高いほうが非照射領域とのコントラストを高めることができ好ましい。 When the distance d1 between the side surfaces of the adjacent light emitting elements 43c shown in FIG. 6 exceeds 0.6 mm, the peak of the synthetic light intensity is small as shown in FIG. 9A, and is greater than the light intensity irradiated from one light emitting element 43c. It only improves by a few percent. By setting the side distance d1 to 0.6 mm or less, as shown in FIG. 9B, the peak of the synthetic light intensity becomes large, and can be improved by 20% or more than the light intensity irradiated from one light emitting element 43c. In particular, when the ADB technology is applied, the light emitting element 43c is selectively turned on and off to precisely control the irradiated area and the non-irradiated area, so that the higher the synthetic light intensity of the irradiated area is the contrast with the non-irradiated area. Can be enhanced.
　側面間距離ｄ１が０．１ｍｍ未満の場合には、発光素子４３ｃの側面を充填している光反射性樹脂部４３ｄの厚さが不十分となり、側面から光が漏洩して１つの発光素子４３ｃから照射される光の光度自体が低下してしまう。また、側面から光が漏洩することで合成光度も低下してしまう。特に、ＡＤＢ技術を適用して選択的に発光素子４３ｃを点灯する場合には、側面から漏洩した光が非点灯な発光素子４３ｃからの発光と同様に照射されてしまう可能性があり、所望の二次元的な配光パターンを照射することが困難になってしまう。 When the distance d1 between the side surfaces is less than 0.1 mm, the thickness of the light reflective resin portion 43d filling the side surfaces of the light emitting element 43c is insufficient, and light leaks from the side surfaces to form one light emitting element 43c. The light intensity of the light emitted from the light source itself is reduced. In addition, the combined luminous intensity also decreases due to the light leaking from the side. In particular, in the case where the light emitting element 43c is selectively turned on by applying the ADB technology, light leaked from the side face may be emitted similarly to the light emitted from the light emitting element 43c which is not turned on. It becomes difficult to irradiate a two-dimensional light distribution pattern.
　本実施形態の光源モジュール４０としてサブマウント４３として複数の発光素子４３ｃを含めた場合と、１つのＬＥＤチップをチップサイズパッケージ（ＣＳＰ）とした場合における、発光素子４３ｃ間距離と合成光度の関係を表１に示す。チップサイズパッケージで発光素子間隔を０．６ｍｍとした場合の合成光度を１００として相対値を示している。 The relationship between the distance between the light emitting elements 43c and the combined light intensity in the case where a plurality of light emitting elements 43c are included as the submount 43 as the light source module 40 of the present embodiment and in the case where one LED chip is a chip size package (CSP) It is shown in Table 1. The relative value is shown by setting the synthetic luminous intensity to 100 when the light emitting element interval is 0.6 mm in the chip size package.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　表１に示したように、チップサイズパッケージでは発光素子間隔が０．６ｍｍで合成光度は１００であり、０．２ｍｍで合成光度は１１９である。一方、本実施形態のサブマウント４３では発光素子４３ｃの側面間距離ｄ１が０．６ｍｍで合成光度は１１２であり、０．２ｍｍで合成光度は１４０であり、０．１ｍｍで合成光度は１４７である。 As shown in Table 1, in the chip size package, the distance between light emitting elements is 0.6 mm, the synthetic light intensity is 100, and the synthetic light intensity is 119 at 0.2 mm. On the other hand, in the submount 43 of this embodiment, the distance d1 between the side surfaces of the light emitting elements 43c is 0.6 mm, the synthetic light intensity is 112, the synthetic light intensity is 140 at 0.2 mm, and the synthetic light intensity is 147 at 0.1 mm. is there.
　したがって、本実施形態の光源モジュール４０では、発光素子４３ｃの側面間距離ｄ１は０．１ｍｍ～０．６ｍｍの範囲が好ましい。複数のサブマウント４３同士における発光素子４３ｃ同士の間隔も、同様に０．１ｍｍ～０．６ｍｍの範囲とすることが好ましい。側面間距離ｄ１がこの範囲であることにより、側面からの光漏洩を防止しつつ合成光度の向上を図ることができる。また、ＡＤＢ技術を適用した場合には、照射領域と非照射領域のコントラストを高めるとともに、所望の二次元的な配光パターンを良好に照射することができる。 Therefore, in the light source module 40 according to the present embodiment, the distance d1 between the side surfaces of the light emitting elements 43c is preferably in the range of 0.1 mm to 0.6 mm. Similarly, the distance between the light emitting elements 43c in the plurality of submounts 43 is preferably in the range of 0.1 mm to 0.6 mm. When the distance d1 between the side surfaces is in this range, it is possible to improve the synthetic light intensity while preventing light leakage from the side surfaces. When the ADB technology is applied, the contrast between the irradiated area and the non-irradiated area can be enhanced, and a desired two-dimensional light distribution pattern can be favorably irradiated.
　本発明は上述した各実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能であり、異なる実施形態にそれぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても本発明の技術的範囲に含まれる。 The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Is also included in the technical scope of the present invention.
　本出願は、２０１７年７月２５日出願の日本特許出願２０１７－１４３５５０号、２０１７年７月２５日出願の日本特許出願２０１７－１４３５５１号、および２０１７年７月２５日出願の日本特許出願２０１７－１４３５５２号に基づくものであり、その内容はここに参照として取り込まれる。 The present application is based on Japanese Patent Application No. 201-143550 filed on Jul. 25, 2017, Japanese Patent Application No. 201-1431551 filed on Jul. 25, 2017, and Japanese Patent Application No. 2017 filed on July 25, 2017. No. 143,552, the contents of which are incorporated herein by reference.

Claims (14)

  1. 　複数の発光素子と、
    　前記各発光素子に対して個別に電力を供給する複数の金属ワイヤと、
    　前記発光素子の側面の少なくとも一部を封止している光反射性樹脂部と、
    　前記金属ワイヤを封止している光吸収性樹脂部と、
    を備える光源モジュール。     Multiple light emitting elements,
    A plurality of metal wires individually supplying power to the light emitting elements;
    A light reflective resin portion sealing at least a part of the side surface of the light emitting element;
    A light absorbing resin portion sealing the metal wire;
    A light source module comprising
  2. 　前記光反射性樹脂部は、隣接する前記発光素子の間に充填されて、所定数の前記発光素子の側面を一括して封止している請求項１に記載の光源モジュール。 The light source module according to claim 1, wherein the light reflective resin portion is filled between the adjacent light emitting elements, and collectively seals side surfaces of a predetermined number of the light emitting elements.
  3. 　前記光吸収性樹脂部は、所定数の前記金属ワイヤを一括して封止している請求項１または２に記載の光源モジュール。 The light source module according to claim 1, wherein the light absorbing resin part collectively seals a predetermined number of the metal wires.
  4. 　一方の表面にサブマウント配線が形成されたサブマウントを備え、
    　前記サブマウントの第一方向に沿って前記サブマウント配線上に前記発光素子が複数搭載され、前記金属ワイヤは前記サブマウント配線に接続されている請求項１から３の何れか一つに記載の光源モジュール。     It has a submount with submount wiring formed on one surface,
    4. The light emitting device according to claim 1, wherein a plurality of the light emitting elements are mounted on the submount wiring along a first direction of the submount, and the metal wire is connected to the submount wiring. Light source module.
  5. 　一方の表面にサブマウント配線が形成されたサブマウントと、
    　前記サブマウント配線上に第一方向に沿って搭載された複数の発光素子と、
    　隣接する前記発光素子の間に充填されて前記発光素子の側面を封止している光反射性樹脂部と、を備え、
    　隣接する前記発光素子の側面間距離は０．１ｍｍ～０．６ｍｍの範囲である光源モジュール。     A submount in which submount wiring is formed on one surface,
    A plurality of light emitting elements mounted along the first direction on the submount wiring;
    And a light reflective resin portion which is filled between the adjacent light emitting elements and seals the side surface of the light emitting elements.
    A light source module, wherein the distance between the side surfaces of the adjacent light emitting elements is in the range of 0.1 mm to 0.6 mm.
  6. 　複数の前記サブマウントが、前記第一方向に延伸した第一列として配列されている請求項４または５に記載の光源モジュール。 The light source module according to claim 4 or 5, wherein the plurality of submounts are arranged as a first row extending in the first direction.
  7. 　さらに複数の前記サブマウントが、前記第一方向に延伸した第二列として前記第一列に隣接して配列されている請求項６に記載の光源モジュール。 The light source module according to claim 6, wherein a plurality of the submounts are arranged adjacent to the first row as a second row extending in the first direction.
  8. 　前記各発光素子に対応した金属ワイヤが前記サブマウント配線に接続され、
    　前記第一列および前記第二列の前記発光素子は、前記第一列の前記サブマウント配線に接続された前記金属ワイヤと、前記第二列の前記サブマウント配線に接続された前記金属ワイヤとの間に位置している請求項７に記載の光源モジュール。     A metal wire corresponding to each light emitting element is connected to the submount wiring,
    The light emitting elements of the first row and the second row include the metal wire connected to the submount wiring of the first row and the metal wire connected to the submount wiring of the second row The light source module according to claim 7, which is located between
  9. 　請求項１から８の何れか一つに記載の光源モジュールを備え、
    　複数の前記発光素子に対して選択的に電力を供給することを特徴とする車両用灯具。     A light source module according to any one of claims 1 to 8, comprising:
    A vehicle lamp characterized in that power is selectively supplied to a plurality of the light emitting elements.
  10. 　一方の表面に配線パターンが形成された搭載基板と、
    　前記一方の表面に搭載され前記配線パターンと電気的に接続された複数の発光素子を有する光源部と、
    　前記光源部からの光を反射する光学部材と、を備え、
    　前記搭載基板の前記配線パターン上にはレジスト層が形成されており、
    　前記搭載基板上には、前記レジスト層がない光学部材搭載領域が形成されており、前記光学部材搭載領域に前記光学部材が搭載されている光源モジュール。     A mounting substrate having a wiring pattern formed on one surface,
    A light source unit having a plurality of light emitting elements mounted on the one surface and electrically connected to the wiring pattern;
    And an optical member that reflects light from the light source unit,
    A resist layer is formed on the wiring pattern of the mounting substrate,
    An optical member mounting area without the resist layer is formed on the mounting substrate, and the optical member is mounted in the optical member mounting area.
  11. 　前記搭載基板は金属板とガラスエポキシ樹脂層の積層構造で構成されており、
    　前記光学部材搭載領域は、前記ガラスエポキシ樹脂層が露出している請求項１０に記載の光源モジュール。     The mounting substrate is formed of a laminated structure of a metal plate and a glass epoxy resin layer,
    The light source module according to claim 10, wherein the glass epoxy resin layer is exposed in the optical member mounting area.
  12. 　前記光源部は前記ガラスエポキシ樹脂層を介さず前記発光素子が前記金属板に搭載されており、
    　前記発光素子の高さ寸法は、前記ガラスエポキシ樹脂層の厚さ寸法より大きい請求項１１に記載の光源モジュール。     In the light source unit, the light emitting element is mounted on the metal plate without interposing the glass epoxy resin layer.
    The light source module according to claim 11, wherein a height dimension of the light emitting device is larger than a thickness dimension of the glass epoxy resin layer.
  13. 　前記光学部材搭載領域は、前記光源部を挟んで一対設けられており、
    　前記光源部は、複数の発光素子が第一方向に沿って配列され、
    　複数の前記発光素子の発光中心線の延長線上において、前記光学部材が固定されている請求項１０から１２の何れか一つに記載の光源モジュール。     The optical member mounting area is provided as a pair across the light source unit,
    In the light source unit, a plurality of light emitting elements are arranged along a first direction,
    The light source module according to any one of claims 10 to 12, wherein the optical member is fixed on an extension of a light emission center line of the plurality of light emitting elements.
  14. 　請求項１０から１３の何れか一つに記載の光源モジュールを備え、
    　前記一方の表面には、前記配線パターンと電気的に接続された給電コネクタが搭載され、前記給電コネクタを介して複数の前記発光素子に対して選択的に電力を供給する車両用灯具。     A light source module according to any one of claims 10 to 13, comprising:
    A vehicle lamp having a feed connector electrically connected to the wiring pattern mounted on the one surface, and selectively supplying power to the plurality of light emitting elements through the feed connector.
PCT/JP2018/027560 2017-07-25 2018-07-23 Light source module and lighting fixture for vehicles WO2019022026A1 (en)

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JP2017143550A JP2019029057A (en) 2017-07-25 2017-07-25 Light source module and vehicular lighting fixture
JP2017-143550 2017-07-25
JP2017-143552 2017-07-25
JP2017143551A JP7053184B2 (en) 2017-07-25 2017-07-25 Vehicle lighting

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