WO2019007956A1 - Beschichtungsvorrichtung mit beschichteter sendespule - Google Patents
Beschichtungsvorrichtung mit beschichteter sendespule Download PDFInfo
- Publication number
- WO2019007956A1 WO2019007956A1 PCT/EP2018/067947 EP2018067947W WO2019007956A1 WO 2019007956 A1 WO2019007956 A1 WO 2019007956A1 EP 2018067947 W EP2018067947 W EP 2018067947W WO 2019007956 A1 WO2019007956 A1 WO 2019007956A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coating
- nickel
- tin
- transmitting coil
- layer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
- H05B6/105—Induction heating apparatus, other than furnaces, for specific applications using a susceptor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/001—Magnets
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
Definitions
- Coating device with coated transmitting coil Field of technology
- the invention relates to a device for depositing a layer on a substrate by feeding one or more process gases into a process chamber in which a susceptor carrying the substrate can be heated to a process temperature by means of an electromagnetic alternating field generated by one or more transmitting coils, wherein the one or more transmitting coils have a coating.
- a device of this type is described in DE 10 2010 016 471 AI.
- a housing which is closed in a gas-tight manner to the outside, there is a process chamber in which there is a susceptor consisting of an electrically conductive material, on which a substrate rests.
- a gas inlet member reactive process gases are fed into the process chamber.
- the susceptor is heated by a heater to a process temperature at which the process gases decompose pyrolytically to deposit a layer on the substrate.
- the heating of the susceptor by means of an electromagnetic alternating field with radio frequency. In the susceptor induced eddy currents generate heat, which heats the substrate.
- the transmitting coils with which the electromagnetic alternating field is generated are provided with a gold layer.
- Gold like other precious metals, has the property of low optical emissivity, which does not change over time.
- a low optical emissivity is advantageous because it can minimize the heat losses through the transmitting coil.
- a changing emissivity for example as a result of oxide or reaction layers, would adversely affect the heat balance of the reactor.
- moisture and Cl 2 (or HCl) corrosion resistant coatings which also have / have simultaneously constant and low emissivity.
- DE 10 2009 025 971, US 7,897,205, US 4,699,675, US 2012/052216, US 7,241,506 and US 2011/259879 are also known in the art.
- the invention has for its object to provide a corrosion resistant, at the same time possessing a low emissivity and therefore effective in the presence of chlorine compounds and moisture transmitting coil coating for a generic device.
- the problem is solved by the invention specified in the claims, wherein the dependent claims represent not only advantageous developments of the main claim, but also independent solutions to the problem. Individual features of the claims may be combined with individual features of other claims. According to the invention an improved device and an improved transmission coil is given.
- a coating of tin and nickel is used instead of a coating consisting of precious metals.
- the outermost layer only has a coating the elements tin and nickel.
- the transmission coil which is formed in particular from a non-ferrous metal and is designed as a spiral hollow body, has an outer surface which is mechanically cleaned in a suitable manner prior to coating, for example glass bead blasting.
- the coating according to the invention is applied to a base layer (1-50 ⁇ m NiP (Hi-phosphorus (10-14% by weight))
- the coating is the mixture of two nickel / tin compounds, namely a mixture from Ni 3 Sn 2 and N13 Sn 4.
- the mixture may have a non-stoichiometric composition, in particular it is provided that the coating has a tin / nickel ratio of 60/40 wt% to 70/30 wt% the layer thickness can be in the range between 1 and 50 ⁇ m or 1 and 30 ⁇ m, and is preferably about 20 ⁇ m, and the layer is deposited on the optionally pretreated main body of the transmitting antenna
- the nickel-containing base layer which preferably has a layer thickness of at least 30 ⁇ m, forms one Diffusion barrier.
- the coating of the invention has proven to be resistant to chlorine or chlorine-containing compounds on the one hand and on the other hand has a low optical emissivity, so high optical reflectivity.
- the emissivity / reflectivity is also stable over time. It does not change even after prolonged exposure to the coating with chlorine or a chlorine-containing compound even at higher temperatures.
- the layer has a high resistance to chlorine ions and forms an effective diffusion barrier against chlorine ions. It prevents chlorine ions from diffusing through the coating to the base material of the metallic transmitting coil.
- the mixture / alloy according to the invention has a substantially constant emissivity.
- the optical properties of the surface also change with prolonged exposure the surface due to chlorine or chlorine-containing compounds not. The chemical resistance is ensured in particular in a chlorine-rich and humid environment.
- Fig. 2 is a plan view of a transmitting coil 5 and
- a gas-tight housing surrounds a process chamber 1, into which a gas inlet member 2 opens, through which (in addition to further precursors) also chlorine-containing gases, for example chlorine-containing compounds of elements of the III main group are fed.
- chlorine-containing gases for example chlorine-containing compounds of elements of the III main group are fed.
- other chlorine-containing compounds can also be fed in, for instance to purify the process chamber 1 after a coating process by means of an etching step.
- Suitable gases are, in particular, Cl 2 or HCl.
- a susceptor 3 which consists of graphite or other electrically conductive material and carries one or more substrates 4, which are to be coated. In particular, they can be coated with a semiconductor layer and in particular with a III-V semiconductor layer.
- a transmitting coil 5 which consists of metal and has a spiral shape.
- the transmitting coil 5 has two ends 6, 7 which are electrically conductively connected to feedthroughs with feed lines arranged outside the process chamber 1 (see WO 01/78105). Through these supply lines, a cooling liquid can be fed, which flows through a cavity 8 of a rectangular or round cross-section having transmitting coil 5.
- the transmission coil made of metal, in particular a Cu alloy 5 has an outwardly facing surface, which may come into contact with the process gas fed into the process chamber 1 and in particular to chlorine-containing gases.
- the transmitting coil 5 has a coating on its outside.
- the coating 9, which consists in the prior art of a noble metal and in particular gold, is formed according to the invention of a tin-nickel alloy, wherein the tin / nickel ratio
- the coating is applied galvanically.
- the transmitter coil 5 Before coating the transmitter coil 5, this can be pretreated in a suitable manner, for example. Mechanically cleaned by a Glasperlenbe- radiation. It can take place a chemical pretreatment, for example.
- a base layer NiP, NiCo, bronze
- the base layer may be 50 ⁇ thick.
- the tin-nickel coating may consist of the two phases Ni 3 Sn 2 and N13 Sn 4 . It is thus a metastable phase mixture of two phases.
- the coating of the transmitting coil 5 is preferably a multilayer coating.
- the transmitting coil 5 is preferably made of copper or substantially made of copper. On the surface of the copper base body, a layer containing essentially nickel is first deposited. This base layer is preferably a chemical nickel layer.
- the base layer serves as an additional diffusion barrier and preferably has a layer thickness of at least 30 ⁇ m.
- the layer thickness can be in the range between 30 ⁇ and 50 ⁇ .
- the layer thickness can be between 1 and 50 ⁇ . It is preferably in the range between 10 and 20 ⁇ .
- the tin / nickel ratio is within the range given above.
- a device characterized in that the coating 9 is a mixture of Ni 3 Sn 2 and N 13 Sn 4 .
- a device which is characterized in that the layer thickness of the coating 9 is between 1 and 50 ⁇ or between 1 and 30 ⁇ , preferably 20 ⁇ .
- a device which is characterized in that the coating 9 is galvanically deposited on the transmitting coil 5.
- a device which is characterized in that on the substantially copper-containing transmitting coil, a substantially nickel-containing base layer is applied, which carries the coating 9.
- a device which is characterized in that the base layer has a layer thickness of 1 to 50 ⁇ and in particular of at least 30 ⁇ .
- a transmitting coil which is characterized in that the coating consists of tin and nickel.
- a transmitting coil which is characterized in that the coating 9 is a mixture of Ni 3 Sn 2 and N13 Sn 4 .
- a transmitting coil which is characterized in that the tin / nickel ratio is in the range between 60/40 wt% and 70/30 wt% and in particular 35/35 wt% and / or that the layer thickness in the range between 1 and 50 ⁇ , in particular 20 ⁇ is.
- All disclosed features are essential to the invention (individually, but also in combination with one another).
- the disclosure of the associated / attached priority documents (copy of the prior application) is hereby also incorporated in full in the disclosure of the application, also for the purpose of including features of these documents in claims of the present application.
- the subclaims characterize, even without the features of a claimed claim, with their features independent inventive developments of the prior art, in particular in order to make divisional applications based on these claims.
- each claim may additionally have one or more of the features described in the preceding description, in particular with reference numerals and / or given in the reference numerals.
- the invention also relates to design forms in which individual of the features mentioned in the above description are not realized, in particular insofar as they are recognizable dispensable for the respective purpose or can be replaced by other technically equivalent means.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201880045491.8A CN110869540A (zh) | 2017-07-07 | 2018-07-03 | 具有经涂覆的发射线圈的涂覆设备 |
US16/628,985 US11851762B2 (en) | 2017-07-07 | 2018-07-03 | Coating device having coated transmitter coil |
EP18737872.4A EP3649280A1 (de) | 2017-07-07 | 2018-07-03 | Beschichtungsvorrichtung mit beschichteter sendespule |
KR1020207001718A KR102640176B1 (ko) | 2017-07-07 | 2018-07-03 | 코팅된 트랜스미터 코일을 갖는 코팅 디바이스 |
JP2019571615A JP7221229B2 (ja) | 2017-07-07 | 2018-07-03 | コーティングされたトランスミッタコイルを具備するコーティング装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202017104061.5 | 2017-07-07 | ||
DE202017104061.5U DE202017104061U1 (de) | 2017-07-07 | 2017-07-07 | Beschichtungseinrichtung mit beschichteter Sendespule |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019007956A1 true WO2019007956A1 (de) | 2019-01-10 |
Family
ID=62842100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2018/067947 WO2019007956A1 (de) | 2017-07-07 | 2018-07-03 | Beschichtungsvorrichtung mit beschichteter sendespule |
Country Status (8)
Country | Link |
---|---|
US (1) | US11851762B2 (de) |
EP (1) | EP3649280A1 (de) |
JP (1) | JP7221229B2 (de) |
KR (1) | KR102640176B1 (de) |
CN (1) | CN110869540A (de) |
DE (1) | DE202017104061U1 (de) |
TW (1) | TWI766059B (de) |
WO (1) | WO2019007956A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023008689A1 (ko) * | 2021-07-26 | 2023-02-02 | 삼성전자 주식회사 | 무선 충전을 지원하는 안테나 구조체 및 이를 갖는 전자 장치 |
Citations (10)
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US4699675A (en) | 1985-12-26 | 1987-10-13 | Rca Corporation | Vapor phase growth of III-V materials |
WO2001078105A1 (de) | 2000-04-12 | 2001-10-18 | Aixtron Ag | Reaktionskammer mit wenigstens einer hf-durchführung |
US7241506B2 (en) | 2003-06-10 | 2007-07-10 | Cardinal Cg Company | Corrosion-resistant low-emissivity coatings |
US20100271161A1 (en) * | 2008-07-11 | 2010-10-28 | Yipeng Yan | Magnetic components and methods of manufacturing the same |
DE102009025971A1 (de) | 2009-06-15 | 2010-12-16 | Aixtron Ag | Verfahren zum Einrichten eines Epitaxie-Reaktors |
US20110037557A1 (en) * | 2008-04-28 | 2011-02-17 | Murata Manufacturing Co., Ltd. | Multilayer coil component and method for manufacturing the same |
US7897205B2 (en) | 2005-04-08 | 2011-03-01 | Tokyo Electron Limited | Film forming method and film forming apparatus |
DE102010016471A1 (de) | 2010-04-16 | 2011-10-20 | Aixtron Ag | Vorrichtung und Verfahren zum gleichzeitigen Abscheiden mehrerer Halbleiterschichten in mehreren Prozesskammern |
US20110259879A1 (en) | 2010-04-22 | 2011-10-27 | Applied Materials, Inc. | Multi-Zone Induction Heating for Improved Temperature Uniformity in MOCVD and HVPE Chambers |
US20120052216A1 (en) | 2010-08-27 | 2012-03-01 | Applied Materials, Inc. | Gas distribution showerhead with high emissivity surface |
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US6071372A (en) * | 1997-06-05 | 2000-06-06 | Applied Materials, Inc. | RF plasma etch reactor with internal inductive coil antenna and electrically conductive chamber walls |
AUPQ653700A0 (en) * | 2000-03-28 | 2000-04-20 | Ceramic Fuel Cells Limited | Surface treated electrically conductive metal element and method of forming same |
JP5001489B2 (ja) | 2001-03-19 | 2012-08-15 | 東京エレクトロン株式会社 | 処理装置 |
JP4340221B2 (ja) * | 2004-12-03 | 2009-10-07 | キヤノンアネルバ株式会社 | 窒化金属膜作製装置及び窒化金属膜作製方法 |
IT1394098B1 (it) * | 2009-03-24 | 2012-05-25 | Brembo Ceramic Brake Systems Spa | Forno ad induzione e processo di infiltrazione |
US20100277267A1 (en) * | 2009-05-04 | 2010-11-04 | Robert James Bogert | Magnetic components and methods of manufacturing the same |
US20120148760A1 (en) * | 2010-12-08 | 2012-06-14 | Glen Eric Egami | Induction Heating for Substrate Processing |
US8574722B2 (en) * | 2011-05-09 | 2013-11-05 | Tyco Electronics Corporation | Corrosion resistant electrical conductor |
JP5556761B2 (ja) * | 2011-07-28 | 2014-07-23 | 株式会社デンソー | 炭化珪素単結晶製造装置 |
US20140113453A1 (en) * | 2012-10-24 | 2014-04-24 | Lam Research Corporation | Tungsten carbide coated metal component of a plasma reactor chamber and method of coating |
DE102012021027A1 (de) * | 2012-10-26 | 2013-05-02 | Daimler Ag | Vorrichtung zur induktiven Erwärmung von Werkstücken |
JP5774061B2 (ja) | 2013-07-03 | 2015-09-02 | Jx日鉱日石金属株式会社 | 電磁波シールド用金属箔、電磁波シールド材及びシールドケーブル |
DE102013019019A1 (de) * | 2013-11-14 | 2015-05-21 | Daimler Ag | Vorrichtung zur induktiven Erwärmung eines Bauteils |
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JP6365182B2 (ja) | 2014-09-26 | 2018-08-01 | 株式会社オートネットワーク技術研究所 | コネクタ用電気接点材料及びその製造方法 |
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-
2017
- 2017-07-07 DE DE202017104061.5U patent/DE202017104061U1/de active Active
-
2018
- 2018-07-02 TW TW107122822A patent/TWI766059B/zh active
- 2018-07-03 CN CN201880045491.8A patent/CN110869540A/zh active Pending
- 2018-07-03 WO PCT/EP2018/067947 patent/WO2019007956A1/de unknown
- 2018-07-03 EP EP18737872.4A patent/EP3649280A1/de active Pending
- 2018-07-03 JP JP2019571615A patent/JP7221229B2/ja active Active
- 2018-07-03 KR KR1020207001718A patent/KR102640176B1/ko active IP Right Grant
- 2018-07-03 US US16/628,985 patent/US11851762B2/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4699675A (en) | 1985-12-26 | 1987-10-13 | Rca Corporation | Vapor phase growth of III-V materials |
WO2001078105A1 (de) | 2000-04-12 | 2001-10-18 | Aixtron Ag | Reaktionskammer mit wenigstens einer hf-durchführung |
US7241506B2 (en) | 2003-06-10 | 2007-07-10 | Cardinal Cg Company | Corrosion-resistant low-emissivity coatings |
US7897205B2 (en) | 2005-04-08 | 2011-03-01 | Tokyo Electron Limited | Film forming method and film forming apparatus |
US20110037557A1 (en) * | 2008-04-28 | 2011-02-17 | Murata Manufacturing Co., Ltd. | Multilayer coil component and method for manufacturing the same |
US20100271161A1 (en) * | 2008-07-11 | 2010-10-28 | Yipeng Yan | Magnetic components and methods of manufacturing the same |
DE102009025971A1 (de) | 2009-06-15 | 2010-12-16 | Aixtron Ag | Verfahren zum Einrichten eines Epitaxie-Reaktors |
DE102010016471A1 (de) | 2010-04-16 | 2011-10-20 | Aixtron Ag | Vorrichtung und Verfahren zum gleichzeitigen Abscheiden mehrerer Halbleiterschichten in mehreren Prozesskammern |
US20110259879A1 (en) | 2010-04-22 | 2011-10-27 | Applied Materials, Inc. | Multi-Zone Induction Heating for Improved Temperature Uniformity in MOCVD and HVPE Chambers |
US20120052216A1 (en) | 2010-08-27 | 2012-03-01 | Applied Materials, Inc. | Gas distribution showerhead with high emissivity surface |
Also Published As
Publication number | Publication date |
---|---|
DE202017104061U1 (de) | 2018-10-09 |
EP3649280A1 (de) | 2020-05-13 |
TW201907053A (zh) | 2019-02-16 |
JP7221229B2 (ja) | 2023-02-13 |
CN110869540A (zh) | 2020-03-06 |
KR102640176B1 (ko) | 2024-02-22 |
US20200123657A1 (en) | 2020-04-23 |
US11851762B2 (en) | 2023-12-26 |
TWI766059B (zh) | 2022-06-01 |
JP2020526917A (ja) | 2020-08-31 |
KR20200026900A (ko) | 2020-03-11 |
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