WO2018214633A1 - 显示基板的制备方法、显示基板母板 - Google Patents

显示基板的制备方法、显示基板母板 Download PDF

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Publication number
WO2018214633A1
WO2018214633A1 PCT/CN2018/080157 CN2018080157W WO2018214633A1 WO 2018214633 A1 WO2018214633 A1 WO 2018214633A1 CN 2018080157 W CN2018080157 W CN 2018080157W WO 2018214633 A1 WO2018214633 A1 WO 2018214633A1
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Prior art keywords
substrate
major surface
magnetic layer
layer
present disclosure
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PCT/CN2018/080157
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English (en)
French (fr)
Inventor
杨忠英
吴建鹏
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京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Priority to US16/090,967 priority Critical patent/US11277930B2/en
Publication of WO2018214633A1 publication Critical patent/WO2018214633A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1429—Housings for circuits carrying a CPU and adapted to receive expansion cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184—Mounting of motherboards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • At least one embodiment of the present disclosure is directed to a method of fabricating a display substrate, a display substrate mother board.
  • the current user demand for display products is increasing, and the size of the display screen is also increasing.
  • the display substrate in the display screen uses an evaporation process during the preparation process, and a large-sized display substrate may cause a sagging problem, thereby affecting the accuracy of the evaporation process and affecting the display yield of the product.
  • At least one embodiment of the present disclosure provides a method of fabricating a display substrate, comprising: providing a substrate including: a first major surface and a second major surface opposite to each other, the substrate being divided into active regions and located in the a dummy region around the effective region; forming a magnetic layer on at least one of the first major surface and the first major surface of the dummy region; and forming an element layer on the first major surface.
  • forming the element layer on the first main surface includes: placing a base substrate forming the magnetic layer into an evaporation apparatus, the evaporation apparatus including An evaporation source and a magnetic adsorption layer; depositing the first main surface to deposit the element layer; wherein the substrate is located between the evaporation source and the magnetic adsorption layer, the magnetic adsorption layer Located on one side of the second major surface of the base substrate.
  • the magnetic layer is formed on the first major surface in the dummy region, and the magnetic layer is positive on the first major surface
  • the projection is located within or coincident with the dummy area.
  • the magnetic layer is formed on the second main surface, and an orthographic projection of the magnetic layer on the second main surface is located in the second Within or coincident with the second major surface.
  • an orthographic projection of the magnetic layer on the second major surface is located within or coincides with the dummy region.
  • the preparation method provided by at least one embodiment of the present disclosure further includes treating the magnetic layer on the second major surface with an etching solution to remove the magnetic layer.
  • the preparation method provided by at least one embodiment of the present disclosure may further include: mounting a mask on one side of the first main surface of the base substrate before performing evaporation.
  • the element layer includes at least one of an anode of the light emitting device, a cathode, and an organic layer between the anode and the cathode.
  • the element layer is formed at least in the effective area.
  • the substrate substrate includes a plurality of the effective regions arranged at intervals, and the dummy regions are disposed between adjacent ones of the active regions.
  • the preparation method provided by at least one embodiment of the present disclosure may further include: cutting the dummy region of the base substrate.
  • At least one embodiment of the present disclosure provides a display substrate motherboard including: a substrate substrate including first and second major surfaces opposite to each other, the substrate being divided into active regions and located in the active region a surrounding dummy region; a magnetic layer disposed on at least one of the first major surface and the first major surface of the dummy region; and an element layer disposed on the first major surface.
  • the element layer is formed at least in the effective area.
  • the magnetic layer is disposed on the second major surface of the dummy region.
  • a magnetic layer is formed on a main surface of a base substrate in a display substrate, and a magnetic substrate can be used to alleviate or eliminate the substrate during the evaporation process.
  • the drooping can improve the evaporation yield of the display substrate.
  • FIG. 1A is a schematic structural view of a substrate to be processed according to an embodiment of the present disclosure
  • Figure 1B is a cross-sectional view of the substrate substrate of Figure 1A taken along line A-B;
  • FIG. 2A is a schematic view showing a distribution of a magnetic layer on a first main surface of a substrate according to an embodiment of the present disclosure
  • FIG. 2B is a cross-sectional view of the substrate substrate on which the magnetic layer is formed in FIG. 2A along C-D;
  • 2C is a schematic view showing another distribution of a magnetic layer on a first main surface of a substrate according to an embodiment of the present disclosure
  • 3A is a schematic view showing a distribution of a magnetic layer on a second main surface of a substrate according to an embodiment of the present disclosure
  • 3B is a schematic diagram of another distribution of a magnetic layer on a second main surface of a substrate according to an embodiment of the present disclosure
  • FIG. 4 is a schematic structural view showing that a substrate on which a magnetic layer is formed is mounted in an evaporation device according to an embodiment of the present disclosure
  • 5A is a schematic structural diagram of a display substrate motherboard according to an embodiment of the present disclosure.
  • Figure 5B is a cross-sectional view of the display substrate mother board shown in Figure 5A along E-F;
  • 6A is a schematic structural diagram of a process of cutting a display substrate mother board according to an embodiment of the present disclosure
  • FIG. 6B is a distribution diagram of the display substrate sub-board obtained after the display substrate of FIG. 6A is cut.
  • FIG. 6B is a distribution diagram of the display substrate sub-board obtained after the display substrate of FIG. 6A is cut.
  • 1-vacuum evaporation chamber 2-support portion; 100-substrate substrate; 101-first main surface; 102-second main surface; 110-active region; 120-dummy region; 200-magnetic layer; Adsorption layer; 400-evaporation source; 500-mask; 600-element layer; 700-display substrate sub-board.
  • At least one embodiment of the present disclosure provides a method of preparing a display substrate and a display substrate mother board.
  • the method of manufacturing the display substrate by forming a magnetic layer on the base substrate, it is possible to alleviate or eliminate the problem of sagging of the display substrate mother board (a plurality of display substrate daughter boards can be obtained after the display substrate mother board is cut) by magnetic attraction force .
  • At least one embodiment of the present disclosure provides a method of fabricating a display substrate, the method comprising: providing a substrate including a first major surface and a second major surface opposite to each other, the substrate being divided into active regions And a dummy region located around the active region; forming a magnetic layer on at least one of the first major surface and the first major surface of the dummy region; forming an element layer on the first major surface.
  • the method for preparing a display substrate includes: providing a substrate, FIG. 1A is a schematic structural view of a substrate to be processed according to an embodiment of the present disclosure; FIG. 1B is a lining of FIG. A cross-sectional view of the base substrate along AB.
  • the base substrate 100 includes a first main surface 101 and a second main surface 102 opposed to each other, and the base substrate 100 is divided into active regions 110 (shown in FIGS. 1A and 1B). A portion defined by a broken line frame in the base substrate 100) and a dummy region 120 (a portion other than the effective region 100 in the base substrate 100) located around the effective region 100.
  • the effective area 110 and the dummy area 120 are design areas for the base substrate 100, and the dotted line frame for defining the range of the effective area 110 in FIG. 1A and FIG. 1B is not actually present, and the specific division of the design area may be The embodiments of the present disclosure are not described herein, as determined by the actual process requirements.
  • the material for manufacturing the base substrate 100 is not limited.
  • the base substrate 100 may be a transparent substrate, and for example, the manufacturing material of the transparent substrate may include glass or a transparent resin or the like.
  • the base substrate 100 may include a plurality of active regions 110 arranged at intervals, and dummy between adjacent active regions 110 is disposed. Area 120.
  • the display substrate mother board can be obtained after processing the base substrate 100, and the portion of the display substrate mother board located in the effective area 110 can correspond to the display substrate of the display panel.
  • the specific distribution positions of the effective area 110 and the dummy area 120 in the base substrate 100 are not limited, and may be determined according to actual process requirements.
  • the method of fabricating the display substrate provided by at least one embodiment of the present disclosure further includes forming a magnetic layer on at least one of the second main surface 102 of the base substrate 100 and the first main surface 101 in the dummy region 120.
  • the magnetic layer is formed at a plurality of positions on the base substrate 100, which will be described below.
  • a magnetic layer is formed on the first main surface 101 in the dummy region 120 of the base substrate 100
  • FIG. 2A is a magnetic layer provided on the substrate substrate according to an embodiment of the present disclosure.
  • FIG. 2B is a cross-sectional view of the substrate substrate on which the magnetic layer is formed as shown in FIG. 2A along the CD.
  • FIGS. 2A and 2B when the magnetic layer 200 is formed on the first main surface 101 of the base substrate 100, the magnetic layer 200 is formed in the dummy region 120, that is, the magnetic layer 200 is formed only on the base substrate 100. The area corresponding to the dummy area 120.
  • the arrangement of the magnetic layer 200 does not affect the subsequent processing of the display substrate, and during the cutting process, the magnetic layer 200 located in the dummy region 120 is cut together, so the magnetic layer 200 is not formed eventually.
  • the product (display substrate) has an effect.
  • the specific distribution of the magnetic layer on the first main surface is not limited.
  • the orthographic projection of the magnetic layer on the first major surface is located within the dummy region, that is, the magnetic layer covers a portion of the dummy region.
  • the orthographic projection of the magnetic layer on the first main surface coincides with the dummy region, that is, the magnetic layer covers all of the dummy regions, so that the set area of the magnetic layer can be increased, and the magnetic attraction force is increased.
  • the magnetic layer 200 may cover the entire area of the first major surface 101 in the dummy region 120, and may also cover a partial region of the first major surface 101 in the dummy region 120.
  • 2C is another schematic diagram of distribution of a magnetic layer on a first major surface of a substrate according to an embodiment of the present disclosure.
  • the magnetic layer 200 is formed on a partial region of the first major surface 101 in the dummy region 120, for example, on the intermediate region of the first major surface 101 in the dummy region 120.
  • the position at which the magnetic layer 200 is formed in the embodiment of the present disclosure is not limited as long as the magnetic layer 200 can sag to the base substrate 100.
  • a magnetic layer may be formed on the second major surface of the base substrate.
  • the orthographic projection of the magnetic layer on the second major surface is within the second major surface, ie the magnetic layer covers a portion of the second major surface; or the orthographic projection of the magnetic layer on the second major surface and the second major surface. The coincidence, that is, the magnetic layer covers all of the second main surface, so that the set area of the magnetic layer can be increased and the magnetic attraction force can be increased.
  • a magnetic layer may be formed on the second major surface of the dummy region of the base substrate.
  • the magnetic layer can be simultaneously removed, simplifying the production process.
  • the orthographic projection of the magnetic layer on the second major surface is located within the dummy region; or the orthographic projection of the magnetic layer on the second major surface coincides with the dummy region, thus increasing the set area of the magnetic layer and increasing magnetic attraction force.
  • FIG. 3A is a schematic view showing a distribution of a magnetic layer on a second main surface of a substrate according to an embodiment of the present disclosure.
  • a magnetic layer 200 is formed on the second major surface 102 and formed in the dummy region 120, that is, on the second major surface 102 within the dummy region 120 of the base substrate 100.
  • the magnetic layer 200 may cover all or a portion of the second major surface 102 within the dummy region 120.
  • FIG. 3A is a schematic view showing a distribution of a magnetic layer on a second main surface of a substrate according to an embodiment of the present disclosure.
  • a magnetic layer 200 is formed on the second major surface 102 and formed in the dummy region 120, that is, on the second major surface 102 within the dummy region 120 of the base substrate 100.
  • the magnetic layer 200 may cover all or a portion of the second major surface 102 within the dummy region 120.
  • the manner in which the magnetic layer 200 is formed may be referred to the related description in the foregoing embodiment (the embodiment in which the magnetic layer 200 is formed on the first main surface 101 of the base substrate 100), the present disclosure, the present disclosure The embodiments are not described herein.
  • FIG. 3B is another schematic diagram of the distribution of the magnetic layer on the second major surface of the base substrate according to an embodiment of the present disclosure.
  • the magnetic layer 200 when the magnetic layer 200 is disposed on the second major surface 102 of the base substrate 100, the magnetic layer 200 may also cover the second major surface 102 in the active region 110 of the base substrate 100, and magnetically The layer 200 may cover all or a portion of the second major surface 102 of the base substrate 100, which is not limited by the embodiments of the present disclosure.
  • the material for fabricating the magnetic layer 200 may include a metal material having magnetic permeability or a metal material with magnetic properties, and the metal material may include, for example, metals such as iron, cobalt, or nickel or The alloy; the material from which the magnetic layer 200 is made may also include other materials with magnetic properties.
  • a specific material for manufacturing the magnetic layer 200 is not limited as long as the magnetic layer 200 has magnetic permeability.
  • the manner in which the magnetic layer 200 is formed is not limited. Taking the arrangement position of the magnetic layer 200 shown in FIG. 2A as an example, the method of forming the magnetic layer 200 on the base substrate 100 may include a process of forming a magnetic material layer on the first main surface 101 of the base substrate 100; Coating a photoresist layer on the magnetic material layer, exposing the photoresist layer using a mask; developing the exposed photoresist layer to obtain a photoresist pattern, the photoresist pattern exposing and the active region 110 Corresponding magnetic material layer covers the magnetic material layer corresponding to the dummy region 120; the magnetic material layer is etched using the photoresist pattern as a mask, and then the photoresist pattern is removed.
  • the manner in which the magnetic material layer is formed on the base substrate 100 may include plating or evaporation, and the like, and the embodiment of the present disclosure does not limit the manner in which the magnetic material layer is formed.
  • the method for fabricating a display substrate further includes: forming an element layer on the first main surface 101 of the base substrate 100, and FIG. 4 provides a substrate on which the magnetic layer is formed according to an embodiment of the present disclosure.
  • FIG. 4 provides a substrate on which the magnetic layer is formed according to an embodiment of the present disclosure.
  • the evaporation apparatus may include an evaporation source 400 and a magnetic adsorption layer 300.
  • the vapor deposition apparatus may be a vacuum evaporation apparatus, and may include a structure such as a vacuum chamber 1 and a support portion 2, and the support portion 2 may support the magnetic adsorption layer 300.
  • the process of forming an element layer on the first main surface 101 of the base substrate 100 may include a process of: as shown in FIG. 4, the base substrate 100 on which the magnetic layer 200 is to be formed
  • the vapor deposition apparatus is placed, wherein the base substrate 100 having the magnetic layer 200 is disposed between the magnetic adsorption layer 300 and the evaporation source 400, and the magnetic adsorption layer 300 is located on one side of the second main surface 102 of the base substrate 100.
  • the first main surface 101 of the base substrate 100 is evaporated to deposit the element layer 600.
  • An evaporation material may be included in the evaporation source 400.
  • the evaporation source 400 heats the evaporation material and changes it to a gaseous state, and the gaseous evaporation material is deposited on the base substrate 100 and forms a structural layer of the corresponding material.
  • the magnetic layer 300 may generate a magnetic adsorption force with the magnetic adsorption layer 300 in the evaporation apparatus, which may alleviate or eliminate the sagging of the base substrate 100; and in the current evaporation process,
  • the magnetic layer 200 can protect the surface of the substrate substrate 100, thereby reducing the generation of fragments and improving the display, because the substrate to be vapor-deposited touches the substrate and the substrate is easily broken. Substrate yield and cost reduction.
  • the magnetic adsorption layer 300 may be a rigid structure.
  • the magnetic adsorption layer 300 may include a permanent magnet or an electromagnet or the like.
  • the method of manufacturing the display substrate provided by at least one embodiment of the present disclosure further includes: mounting a mask on one side of the first main surface 101 of the base substrate 100 before performing vapor deposition.
  • a mask 500 may be disposed between the base substrate 100 and the evaporation source 400.
  • the mask 500 may be a metal mask (for example, a fine metal mask), and the magnetic attraction force generated between the metal mask 500 and the magnetic attraction layer 300 may improve the adhesion between the metal mask 500 and the substrate 100. Degree to ensure the yield of the evaporation process.
  • FIG. 5A is a schematic structural view of the display substrate mother board according to an embodiment of the present disclosure
  • FIG. 5B is a cross section of the display substrate mother board shown in FIG. 5A along the EF.
  • FIG. 5A and FIG. 5B are schematic diagrams showing the structure of the display substrate mother board after the completion of the vapor deposition process shown in FIG. 4.
  • the type of display substrate motherboard is not limited.
  • the display substrate mother board may be an array substrate mother board for liquid crystal display.
  • the display substrate mother board may be an organic light emitting diode (OLED) display substrate mother board.
  • OLED organic light emitting diode
  • the display substrate mother board may be an organic light emitting diode (OLED) display substrate mother board
  • the element layer 600 includes an anode, a cathode, and a light emitting device. At least one of the organic layers between the anode and the cathode.
  • the organic layer includes an organic light-emitting layer, and may further include any one or more of a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer.
  • the element layer 600 is formed at least on the substrate substrate 100 in the active region 110.
  • the component layer 600 may be formed only in the active region 110 or may be simultaneously formed in the dummy region 120.
  • the specific position of the component layer 600 is not limited in the present disclosure.
  • the method of fabricating the display substrate provided by at least one embodiment of the present disclosure further includes removing the magnetic layer 200 disposed on the base substrate 100. Since the formation positions of the magnetic layer 200 on the base substrate 100 include a plurality of types, the removal manner of the corresponding magnetic layers 200 is also different, which will be separately described below.
  • the method for fabricating a display substrate provided by at least one embodiment of the present disclosure further includes cutting a portion of the dummy region 120 of the substrate substrate 100 in a direction perpendicular to a surface of the substrate substrate 100.
  • the dummy area is cut off.
  • 6A is a schematic structural view of a process for cutting a display substrate according to an embodiment of the present disclosure
  • FIG. 6B is a distribution diagram of a display substrate daughter board obtained after cutting the display substrate of FIG. 6A. For example, as shown in FIG. 6A and FIG.
  • the substrate mother board is cut along the broken line, and the portion corresponding to the dummy region 120 of the base substrate 100 in the display substrate mother board is removed, and the remaining portion of the substrate mother board is displayed (display substrate mother board)
  • the portion corresponding to the effective region 110 of the base substrate 100 is the display substrate sub-board 700.
  • the manner of cutting the display substrate may include cutter wheel cutting or laser cutting or the like.
  • the magnetic layer 200 may be formed on the first major surface 101 of the base substrate 100; the substrate may also be in the dummy region 120 A magnetic layer 200 is formed on the first major surface 101 of the substrate 100 (e.g., the embodiment shown in Figure 3A).
  • the magnetic layer 200 is only located on the surface in the dummy region 120 of the base substrate 100.
  • the magnetic layer 200 will follow the substrate.
  • the dummy region 120 of 100 is cut together, so that the magnetic substrate 200 is not present on the substrate sub-board 700, and the magnetic layer 200 can be prevented from interfering with electronic components in the display substrate.
  • a magnetic layer 200 is formed on the second major surface 102 of the base substrate 100, and the magnetic layer 200 is at least partially formed in the active region 110 of the base substrate 100
  • the method of fabricating the display substrate of at least one embodiment of the present disclosure further includes treating the magnetic layer 200 on the second major surface 102 of the base substrate 100 with an etching solution to remove the magnetic layer 200.
  • an etching solution For example, during the thinning process of the display substrate mother board, the portion of the second main surface 102 of the display substrate mother board is taken out by the etching liquid, and thus, the magnetic layer 200 on the second main surface 102 can be simultaneously removed.
  • the display substrate is then subjected to a dicing process to obtain a display substrate sub-board 700.
  • the cutting process is not limited to cutting the display substrate mother board, and after the display substrate mother board is processed into the display panel mother board, the display panel mother board is cut to obtain multiple displays. Panel daughter board.
  • At least one embodiment of the present disclosure provides a display substrate motherboard comprising: a substrate substrate including first and second major surfaces opposite to each other, the substrate substrate being divided into an active region and a dummy region located around the active region a magnetic layer disposed on at least one of the first major surface and the first major surface of the dummy region; and an element layer disposed on the first major surface.
  • the base substrate has a magnetic layer thereon, and the magnetic attraction force can alleviate or eliminate the problem that the display substrate mother board (the display substrate mother board can be obtained after cutting the plurality of display substrate sub-boards) is drooped.
  • the element layer is formed at least in the effective area.
  • a magnetic layer is disposed on a second major surface in the dummy region.
  • the structure of the display substrate mother board can refer to the structure shown in FIG. 5A and FIG. 5B and the description of the specific structure of the display substrate mother board. Reference can also be made to the foregoing embodiment (the embodiment related to the method for preparing the display substrate). For the related content, the embodiments of the present disclosure are not described herein.
  • the magnetic layer 200 may be It is formed at any position on the main surface of the base substrate 100.
  • At least one embodiment of the present disclosure provides a method of manufacturing a display substrate, a display substrate mother board, and may have at least one of the following beneficial effects:
  • At least one embodiment of the present disclosure provides a method of manufacturing a display substrate, wherein a magnetic layer is formed on a substrate of the display substrate, and the sagging of the substrate substrate can be alleviated or eliminated by the magnetic adsorption force during the evaporation process. In order to improve the evaporation yield of the display substrate.
  • the magnetic layer covers and protects the main surface of the substrate substrate, which reduces the risk of fragmentation of the substrate substrate during operation.
  • the magnetic layer is formed on the main surface of the dummy region of the base substrate, and the magnetic layer follows the dummy region of the substrate during the dicing process The removal together simplifies the preparation process of the display substrate and reduces the cost.
  • the magnetic attraction force generated between the metal mask and the magnetic adsorption layer can improve the adhesion between the metal mask and the substrate. Degree to ensure the yield of the evaporation process.

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Abstract

一种显示基板的制备方法、显示基板母板。该显示基板的制备方法包括：提供衬底基板(100)，包括彼此相对的第一主表面(101)和第二主表面(102)，衬底基板(100)被划分为有效区(110)和位于有效区(110)周围的虚设区(120)；在第二主表面(102)和虚设区(120)内的第一主表面(101)至少之一上形成磁性层(200)；以及在第一主表面(101)上形成元件层(600)。在蒸镀工艺过程中，磁性层(200)可以缓解或消除衬底基板(100)下垂的问题，提高显示基板的蒸镀良率。

Description

显示基板的制备方法、显示基板母板
本申请要求于2017年5月25日递交的中国专利申请第201710377934.0号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开至少一个实施例涉及一种显示基板的制备方法、显示基板母板。
背景技术
当前用户对显示产品的需求越来越高，显示屏的尺寸也随之增大。但是显示屏中的显示基板在制备过程中会使用蒸镀工艺，大尺寸的显示基板会产生下垂问题，从而影响蒸镀工艺的精度，影响产品的显示良率。
发明内容
本公开至少一个实施例提供一种显示基板的制备方法，包括：提供衬底基板，包括彼此相对的第一主表面和第二主表面，所述衬底基板被划分为有效区和位于所述有效区周围的虚设区；在所述第二主表面和所述虚设区内的所述第一主表面至少之一上形成磁性层；以及在所述第一主表面上形成元件层。
例如，在本公开至少一个实施例提供的制备方法中，在所述第一主表面上形成元件层包括：将形成所述磁性层的衬底基板放入蒸镀设备，所述蒸镀设备包括蒸发源和磁吸附层；对所述第一主表面进行蒸镀以沉积所述元件层；其中，所述衬底基板位于所述蒸发源和所述磁吸附层之间，所述磁吸附层位于所述衬底基板的所述第二主表面的一侧。
例如，在本公开至少一个实施例提供的制备方法中，所述磁性层形成在所述虚设区内的所述第一主表面上，以及所述磁性层在所述第一主表面上的正投影位于所述虚设区之内或者与所述虚设区重合。
例如，在本公开至少一个实施例提供的制备方法中，所述磁性层形成 在所述第二主表面上，以及所述磁性层在所述第二主表面上的正投影位于所述第二主表面之内或者与所述第二主表面重合。
例如，在本公开至少一个实施例提供的制备方法中，所述磁性层在所述第二主表面上的正投影位于所述虚设区之内或者与所述虚设区重合。
例如，本公开至少一个实施例提供的制备方法还包括：使用腐蚀液对所述第二主表面上的所述磁性层进行处理以去除所述磁性层。
例如，本公开至少一个实施例提供的制备方法还可以包括：在进行蒸镀之前，在所述衬底基板的所述第一主表面的一侧安装掩模板。
例如，在本公开至少一个实施例提供的制备方法中，所述元件层包括发光器件的阳极、阴极以及位于所述阳极和所述阴极之间的有机层至少之一。
例如，在本公开至少一个实施例提供的制备方法中，所述元件层至少形成在所述有效区。
例如，在本公开至少一个实施例提供的制备方法中，所述衬底基板包括间隔排列的多个所述有效区，相邻的所述有效区之间设置有所述虚设区。
例如，本公开至少一个实施例提供的制备方法还可以包括：切除所述衬底基板的所述虚设区。
本公开至少一个实施例提供一种显示基板母板，包括：衬底基板，包括彼此相对的第一主表面和第二主表面，所述衬底基板被划分为有效区和位于所述有效区周围的虚设区；设置于所述第二主表面和所述虚设区内的所述第一主表面至少之一上的磁性层；以及设置于所述第一主表面上的元件层。
例如，在本公开至少一个实施例提供的显示基板母板中，所述元件层至少形成在所述有效区内。
例如，在本公开至少一个实施例提供的显示基板母板中，所述磁性层设置在所述虚设区内的所述第二主表面上。
在本公开至少一个实施例提供的显示基板的制备方法中，在显示基板中的衬底基板的主表面上形成磁性层，通过磁吸附力，在蒸镀过程中，可以缓解或者消除衬底基板的下垂，从而可以提升显示基板的蒸镀良率。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1A为本公开一个实施例提供的待加工的衬底基板的结构示意图；
图1B为图1A所示衬底基板沿A-B的截面图；
图2A为本公开一个实施例提供的磁性层在衬底基板的第一主表面上的一种分布示意图；
图2B为图2A所示形成有磁性层的衬底基板沿C-D的截面图；
图2C为本公开一个实施例提供的磁性层在衬底基板的第一主表面上的另一种分布示意图；
图3A为本公开一个实施例提供的磁性层在衬底基板的第二主表面上的一种分布示意图；
图3B为本公开一个实施例提供的磁性层在衬底基板的第二主表面上的另一种分布示意图；
图4为本公开实施例提供形成有磁性层的衬底基板安装在蒸镀设备中的结构示意图；
图5A为本公开一个实施例提供的显示基板母板的结构示意图；
图5B为图5A所示显示基板母板沿E-F的截面图；
图6A为本公开一个实施例提供的对显示基板母板进行切割工艺的结构示意图；以及
图6B为图6A所示显示基板母板切割后得到的显示基板子板的分布图。
附图标记：
1-真空蒸镀室；2-支撑部；100-衬底基板；101-第一主表面；102-第二主表面；110-有效区；120-虚设区；200-磁性层；300-磁吸附层；400-蒸发源；500-掩模板；600-元件层；700-显示基板子板。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。 基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
本公开至少一个实施例提供一种显示基板的制备方法和显示基板母板。在该显示基板的制备方法中，通过在衬底基板上形成磁性层，可以通过磁吸附力缓解或者消除显示基板母板(显示基板母板切割后可以得到多个显示基板子板)下垂的问题。
下面将结合附图对根据本公开至少一个实施例中的显示基板的制备方法和显示基板母板进行详细的说明。
本公开至少一个实施例提供一种显示基板的制备方法，该方法包括：提供衬底基板，该衬底基板包括彼此相对的第一主表面和第二主表面，衬底基板被划分为有效区和位于有效区周围的虚设区；在第二主表面和虚设区内的第一主表面至少之一上形成磁性层；在第一主表面上形成元件层。关于该制备方法中的衬底基板、磁性层以及元件层等结构的具体化结构及功能可以参考下述内容，本公开的实施例在此不作赘述。
例如，本公开至少一个实施例提供的显示基板的制备方法包括：提供衬底基板，图1A为本公开一个实施例提供的待加工的衬底基板的结构示意图；图1B为图1A所示衬底基板沿A-B的截面图。例如，如图1A和图1B所示，衬底基板100包括彼此相对的第一主表面101和第二主表面102，并且衬底基板100被划分为有效区110(图1A和图1B所示衬底基板100中虚线框所限定的部分)和位于有效区100周围的虚设区120(衬底基板100中有效区100以外的部分)。需要说明的是，有效区110和虚设区120是对衬底基板100的设计区域，图1A和图1B中用于限定有效区110范围 的虚线框不是实际存在的，该设计区域的具体划分可以根据实际工艺的需求决定，本公开的实施例在此不作赘述。
在本公开至少一个实施例中，对制造衬底基板100的材料不作限制。例如，衬底基板100可以为透明衬底，例如该透明衬底的制造材料可以包括玻璃或透明树脂等。
例如，在本公开至少一个实施例提供的制备方法中，如图1A和图1B所示，衬底基板100可以包括间隔排列的多个有效区110，相邻的有效区110之间设置有虚设区120。如此，对衬底基板100加工后可以得到显示基板母板，显示基板母板中的位于有效区110的部分可以对应于显示面板的显示基板。在本公开至少一个实施例中，对衬底基板100中的有效区110和虚设区120的具体分布位置不作限制，可以根据实际工艺需求决定。关于对衬底基板100加工以形成显示基板母板的过程可以参考下述实施例(例如图5A和图5B所示的实施例)中的相关内容。
例如，本公开至少一个实施例提供的显示基板的制备方法还包括：在衬底基板100的第二主表面102和虚设区120内的第一主表面101至少之一上形成磁性层。该磁性层在衬底基板100上的形成位置为多种，下面分别对其进行说明。
例如，在本公开至少一个实施例中，磁性层形成在衬底基板100的虚设区120内的第一主表面101上，图2A为本公开一个实施例提供的磁性层在衬底基板的第一主表面上的一种分布示意图，图2B为图2A所示形成有磁性层的衬底基板沿C-D的截面图。例如图2A和图2B所示，当磁性层200形成在衬底基板100的第一主表面101上时，磁性层200形成在虚设区120中，即磁性层200仅形成在与衬底基板100的虚设区120对应的区域。如此，磁性层200的设置不会影响显示基板的后续加工工艺，而且在切割工艺过程中，位于虚设区120中的磁性层200会被一同切割掉，所以磁性层200也不会对最终形成的产品(显示基板)产生影响。
需要说明的是，在本公开至少一个实施例中，在磁性层位于第一主表面上的情况下，对磁性层在第一主表面上的具体分布不作限制。例如，在本公开至少一个实施例中，在磁性层位于虚设区内的第一主表面时，磁性层在第一主表面上的正投影位于虚设区之内，即磁性层覆盖虚设区的一部分；或者，磁性层在第一主表面上的正投影与虚设区重合，即磁性层覆盖 虚设区的全部，如此，可以增加磁性层的设置面积，增加磁吸附力。
例如，如图2A所示，磁性层200可以的覆盖虚设区120内的第一主表面101的全部区域，也可以覆盖虚设区120内的第一主表面101的部分区域。图2C为本公开一个实施例提供的磁性层在衬底基板的第一主表面上的另一种分布示意图。例如，如图2C所示，磁性层200形成在虚设区120内的第一主表面101的部分区域上，例如可以形成虚设区120内的第一主表面101的中间区域上。本公开实施例对磁性层200的形成位置不作限定，只要磁性层200可以将对衬底基板100的下垂即可。
例如，在本公开至少一个实施例中，磁性层可以形成在衬底基板的第二主表面上。例如，磁性层在第二主表面上的正投影位于第二主表面之内，即磁性层覆盖第二主表面的一部分；或者，磁性层在第二主表面上的正投影与第二主表面重合，即磁性层覆盖第二主表面的全部，如此，可以增加磁性层的设置面积，增加磁吸附力。
例如，在本公开至少一个实施例中，磁性层可以形成在衬底基板的虚设区内的第二主表面上。如此，在后续切除虚设区的工艺中，可以同时去除磁性层，简化生产工艺。例如，磁性层在第二主表面上的正投影位于虚设区之内；或者，磁性层在第二主表面上的正投影与虚设区重合，如此，可以增加磁性层的设置面积，增加磁吸附力。
图3A为本公开一个实施例提供的磁性层在衬底基板的第二主表面上的一种分布示意图。例如，如图3A所示，磁性层200形成在第二主表面102上且形成在虚设区120中，即衬底基板100的虚设区120内的第二主表面102上。磁性层200可以覆盖虚设区120内的第二主表面102的全部区域或者部分区域。对于如图3A所示的实施例，磁性层200的形成方式可以参考前述实施例(关于磁性层200形成在衬底基板100的第一主表面101上的实施例)中的相关描述，本公开的实施例在此不作赘述。
需要说明的是，在磁性层形成在衬底基板的第二主表面上的情况下，本公开的实施例对磁性层形成的具***置不作限定。图3B为本公开一个实施例提供的磁性层在衬底基板的第二主表面上的另一种分布示意图。例如，如图3B所示，磁性层200设置在衬底基板100的第二主表面102上时，磁性层200也可以覆盖衬底基板100的有效区110内的第二主表面102，并且磁性层200可以覆盖衬底基板100的第二主表面102的全部区域或者 部分区域，本公开的实施例对此不作限制。
例如，在本公开至少一个实施例中，制造磁性层200的材料可以包括具有导磁的金属材料也可以包括带有磁性的金属材料，该金属材料例如可以包括铁、钴或者镍等金属或者它们的合金；制造磁性层200的材料也可以包括其它带有磁性的材料。在本公开至少一个实施例中，对用于制造磁性层200的具体材料不作限定，只要磁性层200具有导磁能力即可。
例如，在本公开至少一个实施例中，对磁性层200的形成方式不作限定。以图2A所示的磁性层200的设置位置为例，在衬底基板100上形成磁性层200的方法可以包括如下过程：在衬底基板100的第一主表面101上形成磁性材料层；然后在该磁性材料层上涂覆光刻胶层，使用掩模板对光刻胶层进行曝光；对曝光的光刻胶层进行显影以得到光刻胶图案，该光刻胶图案暴露与有效区110对应的磁性材料层，并且覆盖与虚设区120对应的磁性材料层；使用光刻胶图案作为掩模对该磁性材料层进行蚀刻，然后去除光刻胶图案。例如，在衬底基板100上形成磁性材料层的方式可以包括电镀或者蒸镀等，本公开的实施例对磁性材料层的形成方式不作限定。
下面，以图2A所示的磁性层200的设置方式为例，对本公开至少一个实施例中的技术方案进行说明。
例如，本公开至少一个实施例提供的显示基板的制备方法还包括：在衬底基板100的第一主表面101上形成元件层，图4为本公开实施例提供形成有磁性层的衬底基板安装在蒸镀设备中的结构示意图。例如，如图4所示，蒸镀设备可以包括蒸发源400和磁吸附层300。例如，蒸镀设备可以为真空蒸镀设备，可以包括真空室1和支撑部2等结构，支撑部2可以支撑磁吸附层300。
例如，在本公开至少一个实施例中，在衬底基板100的第一主表面101上形成元件层的工艺可以包括如下过程：如图4所示，将形成有磁性层200的衬底基板100放入蒸镀设备，其中，具有有磁性层200的衬底基板100设置在磁吸附层300和蒸发源400之间，并且磁吸附层300位于衬底基板100的第二主表面102的一侧；对衬底基板100的第一主表面101进行蒸镀以沉积形成元件层600。
蒸发源400中可以包括蒸发材料。在蒸镀过程中，蒸发源400加热蒸发材料并使之变为气态，气态的蒸发材料在衬底基板100上沉积并形成相 应材料的结构层。
在上述蒸镀过程中，磁性层300可以与蒸镀设备中的磁吸附层300产生磁吸附力，该磁吸附力可以缓解或者消除衬底基板100的下垂；而且在当前的蒸镀工艺中，待蒸镀的基板因为对位等操作会触碰基板，使得基板容易产生破片，在本公开实施例中，磁性层200可以对衬底基板100的表面进行保护，减少了破片的产生，提高显示基板良率，降低成本。例如，该磁吸附层300可以为刚性结构。例如，磁吸附层300可以包括永磁体或者电磁体等。
例如，本公开至少一个实施例提供的显示基板的制备方法还包括：在进行蒸镀之前，在衬底基板100的第一主表面101的一侧安装掩模板。如图4所示，掩模板500可以设置在衬底基板100和蒸发源400之间。掩模板500可以为金属掩模板(例如，精细金属掩模板)，金属掩模板500和磁吸附层300之间产生的磁吸附力可以提高金属掩模板500和衬底基板100之间贴合的紧密度，保证蒸镀工艺的良率。
在衬底基板100上形成元件层600之后得到显示基板母板，图5A为本公开一个实施例提供的显示基板母板的结构示意图，图5B为图5A所示显示基板母板沿E-F的截面图。例如图5A和图5B为图4所示完成蒸镀过程后的显示基板母板的结构示意图。
在本公开至少一个实施例中，对显示基板母板的类型不作限制。例如，该显示基板母板可以为用于液晶显示的阵列基板母板。例如该显示基板母板可以为有机发光二极管(OLED)显示基板母板。
例如，在本公开至少一个实施例中，如图5A和图5B所示，该显示基板母板可以为有机发光二极管(OLED)显示基板母板，元件层600包括发光器件的阳极、阴极以及位于阳极和阴极之间的有机层至少之一。例如，有机层包括有机发光层，还可以包括空穴注入层、空穴传输层、电子注入层以及电子传输层等中的任意一种或几种。
例如，在本公开至少一个实施例提供的显示基板的制备方法中，如图5A和图5B所示，元件层600至少形成在有效区110中的衬底基板100上。元件层600可以只形成在有效区110，也可以同时形成在虚设区120，本公开对元件层600的具***置不作限定。
例如，本公开至少一个实施例提供的显示基板的制备方法还包括：去 除设置在衬底基板100上的磁性层200。因为磁性层200在衬底基板100上的形成位置包括多种，相应的磁性层200的去除方式也不同，下面分别对其进行说明。
例如，本公开至少一个实施例提供的显示基板的制备方法还包括：在垂直于衬底基板100所在面的方向上，切割衬底基板100的虚设区120部分。也就是说，将虚设区切除。图6A为本公开一个实施例提供的对显示基板母板进行切割工艺的结构示意图，以及图6B为图6A所示显示基板母板切割后得到的显示基板子板的分布图。例如图6A和图6B所示，沿着虚线切割显示基板母板，去除显示基板母板中的与衬底基板100的虚设区120对应的部分，显示基板母板剩余的部分(显示基板母板中的与衬底基板100的有效区110对应的部分)为显示基板子板700。例如，显示基板母板的切割方式可以包括刀轮切割或者激光切割等。
在本公开至少一个实施例中，可以在衬底基板100的第一主表面101上形成磁性层200(例如图2A～图2C所示的实施例)；也可以在虚设区120内的衬底基板100的第一主表面101上形成磁性层200(例如图3A所示的实施例)。对于上述情况，磁性层200只位于衬底基板100的虚设区120内的表面上，在对显示基板母板进行切割工艺以获得显示基板子板的过程中，磁性层200会随着衬底基板100的虚设区120一同切割掉，所以显示基板子板700上不会有磁性层200，可以防止磁性层200对显示基板中的电子元件产生干扰。
在本公开至少一个实施例中，如图3B所示，在衬底基板100的第二主表面102上形成磁性层200，并且磁性层200至少部分形成在衬底基板100的有效区110中，本公开至少一个实施例的显示基板的制备方法还包括：使用腐蚀液对衬底基板100的第二主表面102上的磁性层200进行处理以去除磁性层200。例如，在显示基板母板的减薄工艺过程中，利用腐蚀液取出显示基板母板的第二主表面102一侧的部分，如此，可以同时去除第二主表面102上的磁性层200。然后对显示基板母板进行切割工艺以获得显示基板子板700。
需要说明的是，在前述实施例中，切割工艺不限于对显示基板母板切割，也可以将显示基板母板加工为显示面板母板之后，再对显示面板母板进行切割以得到多个显示面板子板。
本公开至少一个实施例提供一种显示基板母板，包括：衬底基板，包括彼此相对的第一主表面和第二主表面，衬底基板被划分为有效区和位于有效区周围的虚设区；设置于第二主表面和虚设区内的第一主表面至少之一上的磁性层；以及设置于第一主表面上的元件层。在该显示基板母板中，衬底基板上具有磁性层，可以通过磁吸附力缓解或者消除显示基板母板(显示基板母板切割后可以得到多个显示基板子板)下垂的问题。
例如，在本公开至少一个实施例提供的显示基板母板中，元件层至少形成在有效区内。
例如，在本公开至少一个实施例提供的显示基板母板中，磁性层设置在虚设区内的第二主表面上。
该显示基板母板的结构可以参考图5A和图5B所示的结构以及对该显示基板母板的具体化结构的说明也可以参考前述实施例(与显示基板的制备方法相关的实施例)中的相关内容，本公开的实施例在此不作赘述。
需要说明的是，在本公开的实施例中，如果显示基板子板700的衬底基板100上允许磁性层200的存在，则不需要对磁性层200进行单独的清除工艺，而且磁性层200可以形成在衬底基板100的主表面上的任意位置。
本公开至少一个实施例提供一种显示基板的制备方法、显示基板母板，并且可以具有以下至少一项有益效果：
(1)本公开至少一个实施例提供一种显示基板的制备方法，显示基板的衬底基板上形成有磁性层，在蒸镀工艺过程中，通过磁吸附力可以缓解或者消除衬底基板的下垂，以提高显示基板的蒸镀良率。
(2)在本公开至少一个实施例提供的显示基板的制备方法中，磁性层覆盖衬底基板的主表面并对其进行保护，降低了操作过程中衬底基板出现破片的风险。
(3)在本公开至少一个实施例提供的显示基板的制备方法中，磁性层形成在衬底基板的虚设区内的主表面上，在切割工艺过程中，磁性层随衬底基板的虚设区一同去除，简化了显示基板的制备工艺，降低成本。
(4)当掩膜版为金属掩模板(例如，精细金属掩模板)时，金属掩模板和磁吸附层之间产生的磁吸附力可以提高金属掩模板和衬底基板之间贴合的紧密度，保证蒸镀工艺的良率。
对于本公开，还有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，本公开的保护范围应以权利要求的保护范围为准。

Claims (14)

  1. 一种显示基板的制备方法，包括：
    提供衬底基板，包括彼此相对的第一主表面和第二主表面，所述衬底基板被划分为有效区和位于所述有效区周围的虚设区；
    在所述第二主表面和所述虚设区内的所述第一主表面至少之一上形成磁性层；以及
    在所述第一主表面上形成元件层。
  2. 根据权利要求1所述的制备方法，其中，在所述第一主表面上形成元件层包括：
    将形成所述磁性层的衬底基板放入蒸镀设备，所述蒸镀设备包括蒸发源和磁吸附层；
    对所述第一主表面进行蒸镀以形成所述元件层；
    其中，所述衬底基板位于所述蒸发源和所述磁吸附层之间，所述磁吸附层位于所述衬底基板的所述第二主表面的一侧。
  3. 根据权利要求1或2所述的制备方法，其中，
    所述磁性层形成在所述虚设区内的所述第一主表面上，以及
    所述磁性层在所述第一主表面上的正投影位于所述虚设区之内或者与所述虚设区重合。
  4. 根据权利要求1或2所述的制备方法，其中，
    所述磁性层形成在所述第二主表面上，以及
    所述磁性层在所述第二主表面上的正投影位于所述第二主表面之内或者与所述第二主表面重合。
  5. 根据权利要求4所述的制备方法，其中，
    所述磁性层在所述第二主表面上的正投影位于所述虚设区之内或者与所述虚设区重合。
  6. 根据权利要求4或5所述的制备方法，还包括：
    使用腐蚀液对所述第二主表面上的所述磁性层进行处理以去除所述磁性层。
  7. 根据权利要求1-6中任一项所述的制备方法，还包括：
    在进行蒸镀之前，在所述衬底基板的所述第一主表面的一侧安装掩模 板。
  8. 根据权利要求1-7中任一项所述的制备方法，其中，
    所述元件层包括发光器件的阳极、阴极以及位于所述阳极和所述阴极之间的有机层至少之一。
  9. 根据权利要求1-8中任一项所述的制备方法，其中，
    所述元件层至少形成在所述有效区。
  10. 根据权利要求1-9中任一项所述的制备方法，其中，
    所述衬底基板包括间隔排列的多个所述有效区，相邻的所述有效区之间设置有所述虚设区。
  11. 根据权利要求1-10中任一项所述的制备方法，还包括：
    切除所述衬底基板的所述虚设区。
  12. 一种显示基板母板，包括：
    衬底基板，包括彼此相对的第一主表面和第二主表面，所述衬底基板被划分为有效区和位于所述有效区周围的虚设区；
    设置于所述第二主表面和所述虚设区内的所述第一主表面至少之一上的磁性层；以及
    设置于所述第一主表面上的元件层。
  13. 根据权利要求12所述的显示基板母板，其中
    所述元件层至少形成在所述有效区内。
  14. 根据权利要求12或13所述的显示基板母板，其中，
    所述磁性层设置在所述虚设区内的所述第二主表面上。
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