WO2018205174A1 - 射频电路、天线装置及电子设备 - Google Patents
射频电路、天线装置及电子设备 Download PDFInfo
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- WO2018205174A1 WO2018205174A1 PCT/CN2017/083841 CN2017083841W WO2018205174A1 WO 2018205174 A1 WO2018205174 A1 WO 2018205174A1 CN 2017083841 W CN2017083841 W CN 2017083841W WO 2018205174 A1 WO2018205174 A1 WO 2018205174A1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L5/00—Arrangements affording multiple use of the transmission path
Definitions
- the present invention relates to the field of communications technologies, and in particular, to a radio frequency circuit, an antenna device, and an electronic device.
- LTE Long Term The Evolution, Long Term Evolution communication signal may include signals having a frequency between 700 MHz and 2700 MHz.
- the radio frequency signals that the mobile terminal can support can be divided into a low frequency signal, an intermediate frequency signal, and a high frequency signal.
- the low frequency signal, the intermediate frequency signal, and the high frequency signal each include a plurality of sub-band signals. Each sub-band signal needs to be transmitted to the outside through the antenna.
- carrier aggregation carrier Aggregation
- CA carrier aggregation
- multiple sub-band signals can be aggregated together to improve the uplink and downlink transmission rates of the network.
- the frequency resources of various communication markets around the world are different. Communication operators in different regions have different communication spectrum allocations, so there are different carrier aggregation band combinations. However, the current carrier aggregation is capable of a single frequency band of aggregation, lacking diversity, and cannot meet the above requirements.
- the embodiments of the present invention provide a radio frequency circuit, an antenna device, and an electronic device, which can improve the diversity of carrier aggregation of an RF signal by an electronic device.
- An embodiment of the present invention provides a radio frequency circuit including a front end module, an RF switch module, a first combiner module, and a second combiner.
- the front end module is connected to the RF switch module, and the RF switch module is Connected to the first combiner module and the second combiner respectively;
- the RF switch module When the RF switch module is connected to the first combiner module and the second combiner, the high frequency signal and the intermediate frequency signal provided by the front end module are transmitted to the first combiner module for carrier aggregation to form a first Aggregating a signal, and transmitting the first aggregated signal and the low frequency signal to the second combiner for carrier aggregation;
- the RF switch module When the RF switch module is disconnected from the first combiner module and connected to the second combiner, one of the high frequency signal and the intermediate frequency signal and the low frequency signal are sent to the second combiner for carrier aggregation.
- Embodiments of the present invention provide an antenna apparatus including the above-described radio frequency circuit.
- An embodiment of the present invention provides an electronic device including a housing and a circuit board.
- the circuit board is installed inside the housing.
- the circuit board is provided with a radio frequency circuit, and the radio frequency circuit is the radio frequency circuit. .
- the embodiments of the present invention provide a radio frequency circuit, an antenna device, and an electronic device, which can improve the diversity of carrier aggregation of an RF signal by an electronic device.
- FIG. 1 is an exploded perspective view of an electronic device according to an embodiment of the present invention.
- FIG. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
- FIG. 3 is a schematic diagram of a first structure of a radio frequency circuit according to an embodiment of the present invention.
- FIG. 4 is a schematic diagram of a second structure of a radio frequency circuit according to an embodiment of the present invention.
- FIG. 5 is a schematic partial structural diagram of a radio frequency circuit according to an embodiment of the present invention.
- FIG. 6 is a first schematic structural diagram of a radio frequency switch module of a radio frequency circuit according to an embodiment of the present invention.
- FIG. 7 is a second schematic structural diagram of a radio frequency switch module of a radio frequency circuit according to an embodiment of the present invention.
- FIG. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
- first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
- features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
- the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
- connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
- Connected, or integrally connected may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
- the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
- the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
- the first feature "above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
- the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
- an embodiment of the present invention provides an electronic device.
- the electronic device can be a device such as a smartphone or a tablet.
- the electronic device 100 includes a cover 101, a display screen 102, a circuit board 103, a battery 104, and a housing 105.
- the cover plate 101 is mounted to the display screen 102 to cover the display screen 102.
- the cover plate 101 may be a transparent glass cover.
- the cover plate 101 can be a glass cover plate made of a material such as sapphire.
- the display screen 102 is mounted on the housing 105 to form a display surface of the electronic device 100.
- the display screen 102 can include a display area 102A and a non-display area 102B.
- the display area 102A is for displaying information such as images, texts, and the like.
- the non-display area 102B does not display information.
- the bottom of the non-display area 102B may be provided with functional components such as a fingerprint module and a touch circuit.
- the circuit board 103 is mounted inside the housing 105.
- the circuit board 103 can be a motherboard of the electronic device 100.
- Functional components such as a camera, a proximity sensor, and a processor can be integrated on the circuit board 103.
- the display screen 102 can be electrically connected to the circuit board 103.
- the radio frequency (RF, Radio) is provided on the circuit board 103.
- Frequency Frequency
- the radio frequency circuit can communicate with a network device (eg, a server, a base station, etc.) or other electronic device (eg, a smart phone, etc.) through a wireless network to complete transceiving information with the network device or other electronic device.
- a network device eg, a server, a base station, etc.
- other electronic device eg, a smart phone, etc.
- the RF circuit 200 includes a front end module 21 , a radio frequency switch module 22 , a first combiner module 23 , a second combiner 24 , and an antenna 25 .
- the front end module 21 is connected to the RF switch module 22, and the RF switch module 22 is connected to the first combiner module 23 and the second combiner 24.
- the RF switch module 22 When the RF switch module 22 is connected to the first combiner module 23 and the second combiner 24, the high frequency signal and the intermediate frequency signal provided by the front end module 21 are transmitted to the first combiner module 23 for performing.
- the carrier is aggregated to form a first aggregated signal, and the first aggregated signal and the low frequency signal are sent to the second combiner 24 for carrier aggregation.
- the RF switch module 22 When the RF switch module 22 is disconnected from the first combiner module 23 and connected to the second combiner 24, one of the high frequency signal and the intermediate frequency signal and the low frequency signal are sent to the second combiner 24 for performing. Carrier aggregation.
- the front end module 21 includes a radio frequency transceiver 211, a low frequency amplifier component 212, an intermediate frequency amplifier component 213, a high frequency amplifier component 214, a low frequency filtering component 215, an intermediate frequency filtering component 216, and a high Frequency filter component 217.
- the radio frequency transceiver 211, the low frequency amplifier component 212, and the low frequency filtering component 215 are sequentially connected.
- the RF transceiver 211, the intermediate frequency amplifier component 213, and the intermediate frequency filtering component 216 are sequentially connected.
- the radio frequency transceiver 211, the high frequency amplifier component 214, and the high frequency filtering component 217 are sequentially connected.
- the high frequency filtering component 217 and the intermediate frequency filtering component 216 are respectively connected to a third switching component 223, which is connected to the first switching component 221.
- the low frequency amplifier component 212 includes a low frequency amplifier 2121 and a low frequency gate 2122.
- the low frequency filtering component 215 includes a plurality of first filters 2151.
- the first filter 2151 is a duplexer.
- the low frequency gate 2122 has a low frequency port and a first input port L0.
- the low frequency port has at least two fourth sub ports.
- the low frequency port has a fourth sub port L1 and a fourth sub port L2.
- the low frequency gate 2122 can selectively connect the first input port L0 with one of the at least two fourth sub-ports L1/L2/L3/L4. Each fourth sub-port is connected to a first filter 2151.
- the intermediate frequency amplifier component 213 includes an intermediate frequency amplifier 2131 and an intermediate frequency gate 2132.
- the intermediate frequency filtering component 216 includes a plurality of second filters 2161.
- the second filter 2161 is a duplexer.
- the intermediate frequency gate 2132 has an intermediate frequency port and a second input port M0, the intermediate frequency port having a first sub-port M4, a second sub-port M1, a second sub-port M2, and a second sub-port M3.
- the intermediate frequency gate 2132 can selectively connect the second input port M0 to one of the plurality of sub ports of the intermediate frequency port.
- the first sub-port M4 is connected to a second filter 2161
- the second sub-port M1 is connected to a second filter 2161
- the second sub-port M2 is connected to a second filter 2161.
- Each sub-port of the intermediate frequency port is connected to only one second filter 2161.
- the high frequency amplifier assembly 214 includes a high frequency amplifier 2141 and a high frequency gate 2142.
- the high frequency filtering component 217 includes a plurality of third filters 2171.
- the third filter 2171 is a duplexer.
- the high frequency gate 2142 has a high frequency port and a third input port H0, wherein the high frequency port includes at least two third sub ports, for example, the at least two third sub ports are a third sub port H1, a third Subport H2, third subport H3, and third subport H4.
- the high frequency gate 2142 can selectively connect the third input port H0 with one of the at least two third sub-ports H1/H2/H3/H4.
- the at least two third sub-ports H1/H2/H3/H4 are respectively connected to the plurality of third filters 2171 in one-to-one correspondence.
- the RF switch module 22 includes a first switch component 221 , a second switch component 222 , a third switch component 223 , and a fourth switch component 224 .
- Each of the fourth sub-ports of the low-frequency gate 2122 of the front-end module 21 is connected to the first switch component 221 through a first filter 2151.
- the first switch component 221 is connected to the second combiner 24. .
- Each of the first sub-port M4, the second sub-port M1, and the second sub-port M2 of the intermediate frequency port of the intermediate frequency gate 2132 of the front-end module 21 is connected to the third switch component 223 via a second filter 2161. .
- Each third sub-port of the high-frequency port of the high-frequency gate 2142 of the front-end module 21 is connected to the third switch component 223 through a third filter 2171, and the third switch component 223 is respectively coupled with the first switch The road module 23 and the second combiner 24 are connected.
- Each third sub-port of the high-frequency port of the high-frequency gate 2142 of the front-end module 21 is connected to the fourth switch component 224 through a third filter 2171, and the fourth switch component 224 is coupled to the first switch
- the router module 23 is connected.
- the first combiner module 23 includes a third combiner 231 and a fourth combiner 232.
- the first switch component 221 includes a plurality of second input sub-ports D1/D2/D3/D4 and a second output sub-port D0, wherein the plurality of second input sub-ports D1/D2/D3/D4 can be Two input sub-ports D1, second input sub-port D2, second input sub-port D3, and second input sub-port D4.
- the fourth sub-ports L1/L2/L3/L4 of the low-frequency port are respectively connected in one-to-one correspondence with the second input sub-ports D1/D2/D3/D4, and the first switch component 221 is configured to use the plurality of second input sub-ports D1
- a second input subport in /D2/D3/D4 is connected to the second output subport D0.
- the first switch component 221 is a single-pole K-throw switch, wherein K is the same number as the second input sub-port.
- the second switch component 222 is respectively connected to the first input port of the first sub-port M4, the second sub-port M1, the second sub-port M2, the third combiner 231, and the first input end of the fourth combiner 232.
- the second switch component 222 selectively connects the first sub-port M4 with the first input of the fourth combiner 232 or the second sub-port M1/M2 with the first input of the third combiner 231 Turn on.
- the second switch component 222 includes a first single-pole single-throw switch 2221 and a first single-pole N-throw switch 2222.
- One end F1 of the first single-pole single-throw switch 2221 is connected to the first sub-port M4, and the other end F0 is connected to the first input end of the third combiner 231.
- the N gates E1/E2 of the first single-pole N-throw switch 2222 are respectively connected in one-to-one correspondence with the at least two second sub-ports M1/M2, and the fixed ends E0 and the fourth of the first single-pole N-throw switch 2222 are connected.
- the first input of the router 232 is connected, and the first single-pole N-throw switch 2222 selectively selects one of the at least two second sub-ports M1/M2 and the first of the fourth combiner 232 The input is switched on.
- the first single-pole N-throw switch 2222 is a single-pole double-throw switch.
- the fourth switch component 224 is respectively connected to the plurality of third sub-ports H1/H2/H3/H4, the second input end of the third combiner 231, and the second input end of the fourth combiner 232.
- the fourth switch component 224 selectively connects one of the plurality of third sub-ports H1/H2/H3/H4 with the second input of the third combiner 231 or the fourth combiner 232 The second input is turned on.
- the fourth switch assembly 224 includes a second single-pole M-throw switch 2241 and a third single-pole double-throw switch 2242, where M is the number of third sub-ports.
- the M gates B1/B2/B3/B4 of the second single-pole M-throw switch 2241 are respectively connected to the plurality of third sub-ports H1/H2/H3/H4 in one-to-one correspondence.
- M 4.
- the M strobes are a strobe B1, a strobe B2, a strobe B3, and a strobe B4.
- the strobe B1 is connected to the third sub-port H1, the strobe B2 is connected to the third sub-port H2, the strobe B3 is connected to the third sub-port H3, and the strobe B4 is connected to the third sub-port H4.
- the fixed end B0 of the second single-pole M-throw switch is connected to the fixed end A0 of the third single-pole double-throw switch 2242, and the two strobe ends A1/A2 of the third single-pole double-throw switch 2242 are respectively associated with the third combiner 231
- the two inputs and the second input of the fourth combiner 232 are connected one-to-one.
- the strobe end A1 is connected to the second input end of the third combiner 231, and the strobe end A2 is connected to the second input end of the fourth combiner 232.
- the third switch component 223 includes a plurality of first input sub-ports and a first output sub-port C0, and the plurality of first input sub-ports are respectively connected to the first sub-port M4 and the at least two second sub-ports M1/M2
- the outputs of the at least two third sub-ports H1/H2/H3/H4, the third combiner 231, and the output of the fourth combiner 232 are connected one-to-one, and the first output sub-port C0 is connected to the second
- the first input of the router 24 is connected.
- the third switch component 223 is configured to selectively connect one of the plurality of first input sub-ports C1-C10 with the first output sub-port C0.
- the plurality of first input sub-ports are respectively the first input sub-ports C1-C10, and a total of ten.
- the third switch component 223 is a single-pole L-throw switch 223, and L is a natural number greater than or equal to M+N+3.
- the first input sub-port C1 of the third switch component 223 is connected to the output end of the third combiner 231, and the first input sub-port C2 is connected to the output end of the fourth combiner 232.
- the first input sub-port C3 is connected to the second sub-port M1
- the first input sub-port C4 is connected to the second sub-port M2
- the first input sub-port C5 is connected to the second sub-port M3
- the first input The sub-port C6 is connected to the first sub-port M4.
- the first input sub-port C7 is connected to the third sub-port H1
- the first input sub-port C8 is connected to the third sub-port H2
- the first input sub-port C9 is connected to the third sub-port H3
- the first input sub-port C10 is connected to the third sub-port H4.
- the signals in the M1-M4 are respectively the first intermediate frequency sub-signal, the second intermediate frequency sub-signal, the third intermediate frequency sub-signal, and the fourth intermediate frequency sub-signal in the intermediate frequency signal.
- the signals in the H1-H4 are respectively the first high frequency sub-signal, the second high frequency sub-signal, the third high-frequency sub-signal, and the fourth high-frequency sub-signal in the high-frequency signal.
- the signals in the L1-L4 are the first low frequency sub-signal, the second low frequency sub-signal, the third low-frequency sub-signal, and the fourth low-frequency sub-signal, respectively, in the intermediate frequency signal.
- the second single-pole M-throw switch is The gate terminal B1 of the 2241 is connected to the fixed terminal B0, and the gate terminal E2 of the first single-pole N-throw switch 2222 is connected to the fixed terminal E0, and the first input sub-port C2 of the third switch component 223 is connected to the first terminal.
- An output sub-port C0 is turned on, and the second input sub-port D1 of the first switch component 221 is connected to the second output sub-port D0, so that the first intermediate frequency sub-signal and the first high-frequency sub-signal are in the fourth
- the aggregated signal formed by carrier aggregation in the combiner 232 and the first low frequency sub-signal are subjected to carrier aggregation in the second combiner 24.
- the first input sub-port C3 of the third switching component 223 and the first output sub-portion are used.
- the port C0 is turned on, and the second input sub-port D1 of the first switch component 221 is connected to the second output sub-port D0, so that the first intermediate frequency sub-signal and the first low-frequency sub-signal are in the second combiner 24 Carrier aggregation is performed.
- the fourth switch component 224 can also be implemented by other circuits.
- the fourth switch component 224 includes a second single-pole M-throw switch 2241 and a third single-pole M. Throw switch 2243.
- the four gate terminals B1/B2/B3/B4 of the single-pole M-throw switch 2241 are respectively connected to the four third sub-ports H1/H2/H3/H4 in one-to-one correspondence.
- the four gate terminals G1/G2/G3/G4 of the third single-pole M-throw switch 2241 are respectively connected to the four third sub-ports H1/H2/H3/H4 in one-to-one correspondence.
- the third single-pole M-throw switch 2243 and the second single-pole M-throw switch 2241 are both single-pole and four-throw switches.
- carrier aggregation of low frequency and intermediate frequency, low frequency and high frequency or low frequency, intermediate frequency and high frequency signals can be selectively performed, which can improve the selectivity and diversity of carrier aggregation.
- FIG. 8 is another schematic structural diagram of an electronic device 100 according to an embodiment of the present invention.
- the electronic device 100 includes an antenna device 10, a memory 20, a display unit 30, a power source 40, and a processor 50.
- Those skilled in the art can appreciate that the structure of the electronic device 100 shown in FIG. 8 does not constitute a limitation on the electronic device 100.
- Electronic device 100 may include more or fewer components than illustrated, or some components in combination, or different component arrangements.
- the antenna device 10 includes the radio frequency circuit 200 described in any of the above embodiments.
- the antenna device 10 can communicate with a network device (eg, a server) or other electronic device (eg, a smart phone) over a wireless network to perform transceiving of information with a network device or other electronic device.
- a network device eg, a server
- other electronic device eg, a smart phone
- Memory 20 can be used to store applications and data.
- the application stored in the memory 20 contains executable program code.
- Applications can form various functional modules.
- the processor 50 executes various functional applications and data processing by running an application stored in the memory 20.
- the display unit 30 can be used to display information input by the user to the electronic device 100 or information provided to the user and various graphical user interfaces of the electronic device 100. These graphical user interfaces can be composed of graphics, text, icons, video, and any combination thereof.
- the display unit 30 may include a display panel.
- the power source 40 is used to power various components of the electronic device 100.
- the power source 40 can be logically coupled to the processor 50 through a power management system to enable functions such as managing charging, discharging, and power management through the power management system.
- the processor 50 is a control center of the electronic device 100.
- the processor 50 connects various parts of the entire electronic device 100 using various interfaces and lines, performs various functions of the electronic device 100 by running or executing an application stored in the memory 20, and calling data stored in the memory 20.
- the data is processed to perform overall monitoring of the electronic device 100.
- the electronic device 100 may further include a camera module, a Bluetooth module, and the like, and details are not described herein again.
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Abstract
本发明提供了一种射频电路、天线装置及电子设备,该射频电路包括前端模组、射频开关模组、第一合路器模组以及第二合路器,前端模组与射频开关模组连接,射频开关模组分别与第一合路器模组以及第二合路器连接。
Description
本发明涉及通信技术领域,特别涉及一种射频电路、天线装置及电子设备。
随着通信技术的发展,移动终端能够支持的通信频段越来越多。例如,LTE(Long Term
Evolution,长期演进)通信信号可以包括频率在700MHz至2700MHz之间的信号。
移动终端能够支持的射频信号可以分为低频信号、中频信号和高频信号。其中,低频信号、中频信号以及高频信号各自又包括多个子频段信号。每个子频段信号都需要通过天线发射到外界。
由此,产生了载波聚合(Carrier
Aggregation,简称CA)技术。通过载波聚合,可以将多个子频段信号聚合在一起,以提高网络上下行传输速率。
目前,全球各个通信市场的频率资源互不相同。不同区域的通信运营商拥有不同的通信频谱分配,因此也就存在不同的载波聚合的频段组合需求。然而,当前的载波聚合能够进行聚合的频段单一,缺乏多样性,无法满足上述需求。
本发明实施例提供一种射频电路、天线装置及电子设备,可以提高电子设备对射频信号进行载波聚合的多样性。
本发明实施例提供了一种射频电路,其包括前端模组、射频开关模组、第一合路器模组以及第二合路器,前端模组与射频开关模组连接,射频开关模组分别与第一合路器模组以及第二合路器连接;
当射频开关模组与第一合路器模组以及第二合路接通时,将前端模组提供的高频信号以及中频信号传输给第一合路器模组进行载波聚合以形成第一聚合信号,并将该第一聚合信号以及低频信号发送给第二合路器进行载波聚合;
当射频开关模组与第一合路器模组断开且与第二合路器接通时,将高频信号与中频信号之一以及低频信号发送给第二合路器进行载波聚合。
本发明实施例提供了一种天线装置,其包括上述的射频电路。
本发明实施例提供了一种电子设备,其包括壳体和电路板,所述电路板安装在所述壳体内部,所述电路板上设置有射频电路,所述射频电路为上述的射频电路。
本发明实施例提供一种射频电路、天线装置及电子设备,可以提高电子设备对射频信号进行载波聚合的多样性。
图1是本发明实施例提供的电子设备的分解示意图。
图2是本发明实施例提供的电子设备的结构示意图。
图3是本发明实施例提供的射频电路的第一种结构示意图。
图4是本发明实施例提供的射频电路的第二种结构示意图。
图5是本发明实施例提供的射频电路的局部结构示意图。
图6是本发明实施例提供的射频电路的射频开关模组的第一种结构示意图。
图7是本发明实施例提供的射频电路的射频开关模组的第二种结构示意图。
图8是本发明实施例提供的电子设备的结构示意图。
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。
请参照图1和图2,本发明实施例提供一种电子设备。该电子设备可以是智能手机、平板电脑等设备。参考图1和图2,电子设备100包括盖板101、显示屏102、电路板103、电池104以及壳体105。
其中,盖板101安装到显示屏102上,以覆盖显示屏102。盖板101可以为透明玻璃盖板。在一些实施例中,盖板101可以是用诸如蓝宝石等材料制成的玻璃盖板。
显示屏102安装在壳体105上,以形成电子设备100的显示面。显示屏102可以包括显示区域102A和非显示区域102B。显示区域102A用于显示图像、文本等信息。非显示区域102B不显示信息。非显示区域102B的底部可以设置指纹模组、触控电路等功能组件。
电路板103安装在壳体105内部。电路板103可以为电子设备100的主板。电路板103上可以集成有摄像头、接近传感器以及处理器等功能组件。同时,显示屏102可以电连接至电路板103。
在一些实施例中,电路板103上设置有射频(RF,Radio
Frequency)电路。射频电路可以通过无线网络与网络设备(例如,服务器、基站等)或其他电子设备(例如,智能手机等)通信,以完成与网络设备或其他电子设备之间的信息收发。
在一些实施例中,如图3所示,该射频电路200包括前端模组21、射频开关模组22、第一合路器模组23、第二合路器24以及天线25。该前端模组21与射频开关模组22连接,射频开关模组22分别与第一合路器模组23以及第二合路器24连接。
当射频开关模组22与第一合路器模组23以及第二合路器24接通时,将前端模组21提供的高频信号以及中频信号传输给第一合路器模组23进行载波聚合以形成第一聚合信号,并将该第一聚合信号以及低频信号发送给第二合路器24进行载波聚合。当射频开关模组22与第一合路器模组23断开且与第二合路器24接通时,将高频信号与中频信号之一以及低频信号发送给第二合路器24进行载波聚合。
在一些实施例中,请同时参照图4,该前端模组21包括射频收发器211、低频放大器组件212、中频放大器组件213、高频放大器组件214、低频滤波组件215、中频滤波组件216以及高频滤波组件217。
其中,该射频收发器211、低频放大器组件212以及低频滤波组件215依次连接。该射频收发器211、中频放大器组件213以及中频滤波组件216依次连接。该射频收发器211、高频放大器组件214以及高频滤波组件217依次连接。该高频滤波组件217以及中频滤波组件216分别与第三开关组件223连接,该低频滤波组件215与第一开关组件221连接。
在实际应用中,该低频放大器组件212包括低频放大器2121以及低频选通器2122。该低频滤波组件215包括多个第一滤波器2151。该第一滤波器2151为双工器。该低频选通器2122具有低频端口以及第一输入端口L0,该低频端口具有至少两个第四子端口,例如,在本实施例中,低频端口具有第四子端口L1、第四子端口L2、第四子端口L3以及第四子端口L4。该低频选通器2122可选择性地将该第一输入端口L0与该至少两个第四子端口L1/L2/L3/L4中的一个第四子端口接通。每一第四子端口分别与一第一滤波器2151连接。
在实际应用中,该中频放大器组件213包括中频放大器2131以及中频选通器2132。该中频滤波组件216包括多个第二滤波器2161。该第二滤波器2161为双工器。该中频选通器2132具有中频端口以及第二输入端口M0,该中频端口具有第一子端口M4、第二子端口M1、第二子端口M2以及第二子端口M3。该中频选通器2132可选择性地将该第二输入端口M0与该中频端口的多个子端口中的一个子端口接通。该第一子端口M4与一第二滤波器2161连接,该第二子端口M1与一第二滤波器2161连接,该第二子端口M2与一第二滤波器2161连接。其中,中频端口的每一子端口均只连接一第二滤波器2161。
该高频放大器组件214包括高频放大器2141以及高频选通器2142。该高频滤波组件217包括多个第三滤波器2171。该第三滤波器2171为双工器。该高频选通器2142具有高频端口以及第三输入端口H0,其中该高频端口包括至少两个第三子端口,例如该至少两个第三子端口为第三子端口H1、第三子端口H2、第三子端口H3以及第三子端口H4。该高频选通器2142可选择性地将该第三输入端口H0与该至少两个第三子端口H1/H2/H3/H4中的一个第三子端口接通。该至少两个第三子端口H1/H2/H3/H4分别与该多个第三滤波器2171一一对应地连接。
请同时参照图5以及图6,在一些实施例中,该射频开关模组22包括第一开关组件221、第二开关组件222、第三开关组件223以及第四开关组件224。
该前端模组21的低频选通器2122的每一第四子端口均通过一第一滤波器2151与该第一开关组件221连接,该第一开关组件221与该第二合路器24连接。
该前端模组21的中频选通器2132的中频端口的每一第一子端口M4、第二子端口M1以及第二子端口M2均通过一第二滤波器2161与该第三开关组件223连接。
该前端模组21的高频选通器2142的高频端口的每一第三子端口均通过第三滤波器2171与该第三开关组件223连接,该第三开关组件223分别与第一合路器模组23以及第二合路器24连接。
该前端模组21的高频选通器2142的高频端口的每一第三子端口均通过第三滤波器2171与该第四开关组件224连接,该第四开关组件224与该第一合路器模组23连接。
在一些实施例中,该第一合路器模组23包括第三合路器231以及第四合路器232。
该第一开关组件221包括多个第二输入子端口D1/D2/D3/D4以及一第二输出子端口D0,其中,该多个第二输入子端口D1/D2/D3/D4可以为第二输入子端口D1、第二输入子端口D2、第二输入子端口D3、第二输入子端口D4。低频端口的第四子端口L1/L2/L3/L4分别与第二输入子端口D1/D2/D3/D4一一对应地连接,第一开关组件221用于将多个第二输入子端口D1/D2/D3/D4中的一个第二输入子端口与第二输出子端口D0接通。在具体应用中,该第一开关组件221为单刀K掷开关,其中K与第二输入子端口的数量相同。
该第二开关组件222分别与第一子端口M4、第二子端口M1、第二子端口M2、第三合路器231的第一输入端以及第四合路器232的第一输入端连接,第二开关组件222选择性地将第一子端口M4与第四合路器232的第一输入端接通或将第二子端口M1/M2与第三合路器231的第一输入端接通。
具体应用中,该第二开关组件222包括第一单刀单掷开关2221以及第一单刀N掷开关2222。第一单刀单掷开关2221的一端F1与第一子端口M4连接,另一端F0与第三合路器231的第一输入端连接。第一单刀N掷开关2222的N个选通端E1/E2分别与该至少两个第二子端口M1/M2一一对应地连接,第一单刀N掷开关2222的固定端E0与第四合路器232的第一输入端连接,第一单刀N掷开关2222选择性地将该至少两个第二子端口M1/M2中的一个第二子端口与该第四合路器232的第一输入端接通。在本实施例中,该第一单刀N掷开关2222为单刀双掷开关。
该第四开关组件224分别与该多个第三子端口H1/H2/H3/H4、第三合路器231的第二输入端以及第四合路器232的第二输入端连接。第四开关组件224选择性地将该多个第三子端口H1/H2/H3/H4中的一个第三子端口与第三合路器231的第二输入端或第四合路器232的第二输入端接通。
在实际应用中,该第四开关组件224包括第二单刀M掷开关2241以及第三单刀双掷开关2242,其中M为第三子端口的数量。第二单刀M掷开关2241的M个选通端B1/B2/B3/B4分别与该多个第三子端口H1/H2/H3/H4一一对应地连接,在本实施例中,M=4,该M个选通端分别为选通端B1、选通端B2、选通端B3、选通端B4。该选通端B1与第三子端口H1连接,该选通端B2与第三子端口H2连接,选通端B3与第三子端口H3连接,选通端B4与第三子端口H4连接。第二单刀M掷开关的固定端B0与第三单刀双掷开关2242的固定端A0连接,第三单刀双掷开关2242的两个选通端A1/A2分别与第三合路器231的第二输入端以及第四合路器232的第二输入端一一对应地连接。其中,该选通端A1与第三合路器231的第二输入端连接,选通端A2与该第四合路器232的第二输入端连接。
该第三开关组件223包括多个第一输入子端口以及一第一输出子端口C0,该多个第一输入子端口分别与第一子端口M4、至少两个第二子端口M1/M2、至少两个第三子端口H1/H2/H3/H4、第三合路器231的输出端、第四合路器232的输出端一一对应地连接,第一输出子端口C0与第二合路器24的第一输入端连接。第三开关组件223用于选择性地将多个第一输入子端口C1-C10中的一个第一输入子端口与第一输出子端口C0接通。其中,该多个第一输入子端口分别为第一输入子端口C1-C10,共10个。第三开关组件223为单刀L掷开关223,L为大于或等于M+N+3的自然数。
在本实施例中,该第三开关组件223的第一输入子端口C1与第三合路器231的输出端连接,该第一输入子端口C2与第四合路器232的输出端连接,该第一输入子端口C3与该第二子端口M1连接,第一输入子端口C4与与该第二子端口M2连接,第一输入子端口C5与该第二子端口M3连接,第一输入子端口C6与该第一子端口M4连接。第一输入子端口C7与该第三子端口H1连接,第一输入子端口C8与该第三子端口H2连接,第一输入子端口C9与该第三子端口H3连接,第一输入子端口C10与该第三子端口H4连接。
在本实施例中,该M1-M4中的信号分别为中频信号中的第一中频子信号、第二中频子信号、第三中频子信号以及第四中频子信号。该H1-H4中的信号分别为高频信号中的第一高频子信号、第二高频子信号、第三高频子信号以及第四高频子信号。该L1-L4中的信号分别为中频信号中的第一低频子信号、第二低频子信号、第三低频子信号以及第四低频子信号。
当需要将低频信号、高频信号以及中频信号进行载波聚合时,例如,将第一中频子信号、第一高频子信号以及第一低频子信号进行载波聚合时,将第二单刀M掷开关2241的选通端B1与固定端B0接通,同时将第一单刀N掷开关2222的选通端E2与固定端E0接通,并将第三开关组件223的第一输入子端口C2与第一输出子端口C0接通,并将第一开关组件221的第二输入子端口D1与第二输出子端口D0接通,从而使得该第一中频子信号、第一高频子信号在第四合路器232中进行载波聚合后形成的聚合信号与第一低频子信号在该第二合路器24中进行载波聚合。
当需要将低频信号以及中频信号进行载波聚合时,例如,将第一中频子信号以及第一低频子信号进行载波聚合时,将第三开关组件223的第一输入子端口C3与第一输出子端口C0接通,并将第一开关组件221的第二输入子端口D1与第二输出子端口D0接通,从而使得第一中频子信号以及第一低频子信号在该第二合路器24中进行载波聚合。
可以理解地,在另一些实施例中,该第四开关组件224还可以采用其他电路来实现,例如请参照图7,该第四开关组件224包括第二单刀M掷开关2241以及第三单刀M掷开关2243。其中,M=4,当然还可以为其他值。该单刀M掷开关2241的四个选通端B1/B2/B3/B4分别与该四个第三子端口H1/H2/H3/H4一一对应地连接。该第三单刀M掷开关2241的四个选通端G1/G2/G3/G4分别与该四个第三子端口H1/H2/H3/H4一一对应地连接。该第三单刀M掷开关2243与该第二单刀M掷开关2241均为单刀四掷开关。
由上可知,采用以上技术方案,选择性地将低频与中频、低频与高频或者低频、中频以及高频信号进行载波聚合,可以提高载波聚合的可选择性以及多样性。
参考图8,图8为本发明实施例提供的电子设备100的另一结构示意图。电子设备100包括天线装置10、存储器20、显示单元30、电源40以及处理器50。本领域技术人员可以理解,图8中示出的电子设备100的结构并不构成对电子设备100的限定。电子设备100可以包括比图示更多或更少的部件,或者组合某些部件,或者不同的部件布置。
其中,天线装置10包括上述任一实施例中所描述的射频电路200。天线装置10可以通过无线网络与网络设备(例如,服务器)或其他电子设备(例如,智能手机)通信,完成与网络设备或其他电子设备之间的信息收发。
存储器20可用于存储应用程序和数据。存储器20存储的应用程序中包含有可执行程序代码。应用程序可以组成各种功能模块。处理器50通过运行存储在存储器20的应用程序,从而执行各种功能应用以及数据处理。
显示单元30可用于显示由用户输入到电子设备100的信息或提供给用户的信息以及电子设备100的各种图形用户接口。这些图形用户接口可以由图形、文本、图标、视频和其任意组合来构成。显示单元30可包括显示面板。
电源40用于给电子设备100的各个部件供电。在一些实施例中,电源40可以通过电源管理***与处理器50逻辑相连,从而通过电源管理***实现管理充电、放电、以及功耗管理等功能。
处理器50是电子设备100的控制中心。处理器50利用各种接口和线路连接整个电子设备100的各个部分,通过运行或执行存储在存储器20内的应用程序,以及调用存储在存储器20内的数据,执行电子设备100的各种功能和处理数据,从而对电子设备100进行整体监控。
此外,电子设备100还可以包括摄像头模块、蓝牙模块等,在此不再赘述。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本发明。此外,本发明可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本发明提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
Claims (20)
- 一种射频电路,其包括前端模组、射频开关模组、第一合路器模组以及第二合路器,所述前端模组与射频开关模组连接,射频开关模组分别与第一合路器模组以及第二合路器连接;当射频开关模组与第一合路器模组以及第二合路接通时,所述射频开关模组将前端模组输出的高频信号以及中频信号传输给所述第一合路器模组进行载波聚合以形成第一聚合信号,并将该第一聚合信号以及低频信号发送给第二合路器进行载波聚合;当射频开关模组与第一合路器模组断开且与第二合路器接通时,所述射频开关模组将高频信号与中频信号之一以及低频信号发送给第二合路器进行载波聚合。
- 根据权利要求1所述的射频电路,其中,所述射频开关模组包括第一开关组件、第二开关组件、第三开关组件以及第四开关组件,所述前端模组具有低频端口、高频端口以及中频端口;所述低频端口、第一开关组件以及第二合路器依次连接;所述中频端口分别与第二开关组件以及第三开关组件连接,第二开关组件与第一合路器模组连接,第三开关组件分别与第一合路器模组以及第二合路器连接;所述高频端口分别与第三开关组件以及第四开关组件连接,第四开关组件与第一合路器模组连接。
- 根据权利要求2所述的射频电路,其中,所述第一合路器模组包括第三合路器以及第四合路器,所述第二开关组件、第三开关组件以及第四开关组件分别与第三合路器以及第四合路器连接,第三开关组件与第二合路器接通;当第三合路器或第四合路器与第二开关组件以及第四开关组件分别接通时,所述第三合路器或第四合路器将高频信号与中频信号进行载波聚合以形成第一聚合信号,并将该第一聚合信号以及低频信号发送给第二合路器进行载波聚合;当第三合路器以及第四合路器均与第二开关组件以及第四开关组件断开时,第三开关组件将高频信号或中频信号发送给第二合路器,以与低频信号进行载波聚合。
- 根据权利要求3所述的射频电路,其中,所述中频端口具有第一子端口以及第二子端口;所述第二开关组件分别与第一子端口、第二子端口、第三合路器的第一输入端以及第四合路器的第一输入端连接,所述第二开关组件选择性地将第一子端口与第四合路器的第一输入端接通或将第二子端口与第三合路器的第一输入端接通。
- 根据权利要求4所述的射频电路,其中,所述第二子端口的数量为至少两个,所述第二开关组件包括第一单刀单掷开关以及第一单刀N掷开关;第一单刀单掷开关的一端与第一子端口连接,另一端与第三合路器的第一输入端连接。第一单刀N掷开关的N个选通端分别与该至少两个第二子端口一一对应地连接,第一单刀N掷开关的固定端与第四合路器的第一输入端连接,第一单刀N掷开关选择性地将该至少两个第二子端口中的一个第二子端口与该第四合路器的第一输入端接通。
- 根据权利要求4所述的射频电路,其中,所述高频端口具有至少两个第三子端口;所述第四开关组件分别与所述至少两个第三子端口、第三合路器的第二输入端以及第四合路器的第二输入端连接,第四开关组件选择性地将至少两个第三子端口中的一个第三子端口与第三合路器的第二输入端或第四合路器的第二输入端接通。
- 根据权利要求6所述的射频电路,其中,所述第四开关组件包括第二单刀M掷开关以及第三单刀双掷开关,其中M为第三子端口的数量;所述第二单刀M掷开关的M个选通端分别与该至少两个第三子端口一一对应地连接,第二单刀M掷开关的固定端与第三单刀双掷开关的固定端连接,第三单刀双掷开关的两个选通端分别与第三合路器的第二输入端以及第四合路器的第二输入端一一对应地连接。
- 根据权利要求5所述的射频电路,其中,所述高频端口具有至少两个第三子端口;所述第四开关组件分别与所述至少两个第三子端口、第三合路器的第二输入端以及第四合路器的第二输入端连接,第四开关组件选择性地将至少两个第三子端口中的一个第三子端口与第三合路器的第二输入端或第四合路器的第二输入端接通。
- 根据权利要求8所述的射频电路,其中,所述第四开关组件包括第二单刀M掷开关以及第三单刀双掷开关,其中M为第三子端口的数量;所述第二单刀M掷开关的M个选通端分别与该至少两个第三子端口一一对应地连接,第二单刀M掷开关的固定端与第三单刀双掷开关的固定端连接,第三单刀双掷开关的两个选通端分别与第三合路器的第二输入端以及第四合路器的第二输入端一一对应地连接。
- 根据权利要求9所述的射频电路,其中,所述第三开关组件包括多个第一输入子端口以及一第一输出子端口;所述多个第一输入子端口分别与第一子端口、至少两个第二子端口、至少两个第三子端口、第三合路器的输出端、第四合路器的输出端一一对应地连接,输出子端口与第二合路器的第一输入端连接;所述第三开关组件用于选择性地将所述多个第一输入子端口中的一个第一输入子端口与第一输出子端口接通。
- 根据权利要求10所述的射频电路,其中,所述第三开关组件为单刀L掷开关,L≥M+N+3,且L为自然数。
- 根据权利要求10所述的射频电路,其中,所述第一开关组件包括多个第二输入子端口以及一第二输出子端口;所述低频端口具有至少两个第四子端口,每一所述第四子端口分别与一所述第二输入子端口连接,所述第一开关组件用于将所述多个第二输入子端口中的一个第二输入子端口与第二输出子端口接通。
- 根据权利要求12所述的射频电路,其中,所述第一开关组件为单刀K掷开关,其中K与第二输入子端口的数量相同。
- 根据权利要求12所述的射频电路,其中,所述前端模组包括射频收发器、低频放大器组件、中频放大器组件、高频放大器组件、低频滤波组件、中频滤波组件以及高频滤波组件;所述射频收发器、低频放大器组件以及低频滤波组件依次连接;所述射频收发器、中频放大器组件以及中频滤波组件依次连接;所述射频收发器、高频放大器组件以及高频滤波组件依次连接;所述高频滤波组件以及中频滤波组件分别与第三开关组件连接;所述低频滤波组件与第一开关组件连接。
- 根据权利要求14所述的射频电路,其中,所述低频放大器组件包括低频放大器以及低频选通器;所述低频选通器具有一第一输入端口以及所述低频端口,所述低频端口的每一第四子端口分别通过所述低频滤波组件与所述第一开关组件连接;所述低频选通器用于将所述第一输入端口与多个第四子端口中的一个第四子端口接通。
- 根据权利要求15所述的射频电路,其中,所述低频滤波组件包括多个第一滤波器,每一第四子端口分别通过一第一滤波器与所述第一开关组件连接。
- 根据权利要求14所述的射频电路,其中,所述中频放大器组件包括中频放大器以及中频选通器;所述中频选通器具有一第二输入端口以及所述中频端口,所述中频端口的第一子端口以及第二子端口分别通过所述中频滤波组件与所述第三开关组件连接;所述中频选通器用于选择性地将所述第二输入端口与第一子端口以及第二子端口的一个第四子端口中一个子端口接通。
- 根据权利要求17所述的射频电路,其中,所述中频滤波组件包括多个第二滤波器,每一第一子端口以及第二子端口分别通过一第二滤波器与所述第三开关组件连接。
- 一种天线装置,其包括权利要求1所述的射频电路。
- 一种电子设备,其包括壳体和电路板,所述电路板安装在所述壳体内部,所述电路板上设置有射频电路,所述射频电路为权利要求1所述的射频电路。
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