WO2018199507A1 - Electronic component carrier sheet, and adhesion device and thin film forming apparatus using same - Google Patents

Electronic component carrier sheet, and adhesion device and thin film forming apparatus using same Download PDF

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Publication number
WO2018199507A1
WO2018199507A1 PCT/KR2018/004137 KR2018004137W WO2018199507A1 WO 2018199507 A1 WO2018199507 A1 WO 2018199507A1 KR 2018004137 W KR2018004137 W KR 2018004137W WO 2018199507 A1 WO2018199507 A1 WO 2018199507A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
layer
plate
sheet
adhesive sheet
Prior art date
Application number
PCT/KR2018/004137
Other languages
French (fr)
Korean (ko)
Inventor
허진
한규민
이진선
정유섭
양원석
이호철
이민진
Original Assignee
(주) 씨앤아이테크놀로지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020180023865A external-priority patent/KR102102312B1/en
Priority claimed from KR1020180028109A external-priority patent/KR102088356B1/en
Priority claimed from KR1020180040095A external-priority patent/KR102019943B1/en
Application filed by (주) 씨앤아이테크놀로지 filed Critical (주) 씨앤아이테크놀로지
Priority to CN201880027047.3A priority Critical patent/CN110546760A/en
Publication of WO2018199507A1 publication Critical patent/WO2018199507A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves

Definitions

  • the present invention relates to an electronic component carrier sheet, and an adhesive device and a thin film forming apparatus using the same, and more particularly, to form a thin film on the surface of an electronic component while attaching the electronic component to the electronic component carrier sheet and cooling the electronic component.
  • electromagnetic waves are mainly generated from electronic components such as semiconductor packages included in electronic products and devices
  • various technologies have recently been developed to shield electromagnetic waves generated and output mainly from electronic components such as semiconductor packages.
  • the simplest method is a method of covering an electronic component mounted on a substrate with a metal cap, but this method has a problem that the volume of the substrate is greatly increased by the metal cap, and the number of processes and assembly parts is increased.
  • one surface (or lower surface) of the electronic component is attached to the adhesive sheet to form a metal film on the surface of the electronic component.
  • the adhesive sheet since only one surface of the electronic component could be attached, the adhesive sheet alone It was not possible to protect the portions that do not want to be deposited other than one side.
  • a protruding terminal when a protruding terminal is formed on one surface of an electronic component such as a solder ball of a semiconductor package, only an end portion of the protruding terminal may be attached to a conventional adhesive sheet, thereby causing a gap between the conventional adhesive sheet and one surface of the electronic component. As this occurs and the protruding terminals of the electronic components cannot be protected, a technique for protecting electrode portions such as solder balls of semiconductor packages which do not want to deposit metal films is further required.
  • a gap may exist due to a problem of closely contacting and fixing the electronic component when sputtering. Unwanted metal films may be formed on the electrodes.
  • the size of the hole or the groove should be changed accordingly, and the arrangement of the electronic component in the case of forming the hole or groove in the flexible tape or material
  • the degree of freedom is low, and due to the limitation of the distance between the holes and the holes of the electronic parts, it is difficult to arrange and arrange the electronic parts.
  • Thin film formation technology has been used in various fields, and in recent years, techniques for depositing various functional thin films on an object have been developed.
  • the process of forming a thin film is generally performed in a high temperature environment in order to activate the deposition material and improve the deposition rate. Furthermore, when depositing a thin film by the sputtering method which has the advantage of improving the quality of the thin film in depositing the functional thin film, it is much more than the chemical vapor deposition process by the heat generated by the physical impact of the ionized gas on the target. A high temperature environment is created.
  • the objects may be individually seated on a stage to form a thin film, but a plurality of objects may be formed on the stage to form a thin film for process efficiency and the like.
  • the plurality of objects are deposited with a thin film fixed by an adhesive sheet for fixing the plurality of objects.
  • the adhesive sheet and the stage may not be sufficiently in close contact. That is, the adhesive sheet cannot continuously maintain the shape of the plane, and forms a plurality of lifting portions on the stage on which the adhesive sheet is seated.
  • the semiconductor package is inevitably exposed to high temperature, in which case the semiconductor chip disposed in the semiconductor package is damaged by high temperature heat or the semiconductor package is bent. There is a problem in that the manufacturing efficiency and stability of the semiconductor package are greatly reduced.
  • Patent Document 1 Korean Registered Patent Publication No. 10-1590593
  • Patent Document 2 Korean Registered Patent Publication No. 10-1604582
  • Patent Document 3 Korean Registered Patent Publication No. 10-1501735
  • the present invention provides an electronic component carrier sheet and a thin film forming apparatus using the same, which are used for tightly fixing an electronic component and forming a thin film on the surface of the electronic component.
  • the present invention provides a pressure-sensitive adhesive apparatus for supporting an adherend on a first plate and applying pressure to at least one of the adhesive sheet and the adherend to adhere the adherend to the adhesive sheet.
  • the present invention provides a thin film forming apparatus that can effectively cool the deposition target in the process of forming a thin film.
  • Electronic component carrier sheet is an adhesive layer to which the electronic component is attached to one surface; And a strain-retaining layer provided on the other surface of the pressure-sensitive adhesive layer facing the one surface of the adhesive layer and plastically deformed by the pressure to which the electronic component is attached.
  • the adhesive layer may have a thickness of 5 to 100 ⁇ m.
  • the adhesive layer may have an adhesive force of 200 to 1,500 gf / in.
  • the strain holding layer may be made of a metal film.
  • the strain retaining layer may have a thickness of 3 to 60 ⁇ m.
  • the strain holding layer may have an elongation of 10 to 80%.
  • the strain holding layer may have a thermal conductivity of 200 to 450 W / m ⁇ K at room temperature.
  • It may further include a; a magnetic layer provided on the other surface facing one surface of the strain holding layer facing the adhesive layer.
  • the magnetic layer may be formed by dispersing magnetic powder in a binder resin.
  • the magnetic powder may be contained in 30 to 90% by weight based on the total weight of the magnetic layer.
  • the magnetic powder may have an average particle size of 0.1 to 30 ⁇ m.
  • the magnetic layer may have a thickness of 10 to 500 ⁇ m.
  • the base film is provided on the other surface facing the one surface of the strain holding layer facing the adhesive layer, to support the strain holding layer; may further include a.
  • the restoring force of the base film may be equal to or less than a yield value at which plastic deformation of the strain holding layer is possible.
  • At least one of the adhesive layer and the strain holding layer may have magnetic properties.
  • the base film is made of a synthetic resin material, it may contain a magnetic powder.
  • the electronic component carrier sheet may have an elongation of 10 to 80%.
  • the electronic component carrier sheet may have a tensile strength of 25 to 250 N / mm 2.
  • Adhesive device is a support frame on which the adhesive sheet is supported; A pressurizing portion for applying pressure to at least one of the adherend and the pressure-sensitive adhesive sheet provided on the first surface of the pressure-sensitive adhesive sheet; And a first plate disposed in a direction of the first surface of the adhesive sheet and providing a support surface on which the adherend is supported when the pressure is added.
  • a first packing member provided between the first plate and the support frame, wherein the pressing unit forms a negative pressure in a space defined by the first plate, the support frame, and the first packing member. It may include a first pressure forming portion.
  • a second plate provided to face the first plate in a second surface direction of the pressure-sensitive adhesive sheet facing the first surface; And a gap adjusting unit for adjusting a gap between the first plate and the second plate.
  • the second pressure forming portion may further include.
  • An insertion groove is formed, and the support frame may be transferred between the support piece and the other one by adjusting the gap between the first plate and the second plate.
  • a pattern hole may be formed to accommodate the adherend, and the pattern plate may be provided between the first surface of the adhesive sheet and the first plate.
  • the pattern plate may have a thickness thinner than that of the adherend.
  • the adherend is a semiconductor package including at least one protruding terminal on one surface thereof
  • the adhesive sheet includes: an adhesive layer to which the semiconductor package is attached so that the protruding terminal is in contact with one surface thereof; And a strain holding layer provided on the other surface facing the one surface of the adhesive layer and plastically deformed along the protruding terminal by the pressure.
  • the pressure may be equal to or higher than a yield value at which plastic deformation of the strain holding layer is possible.
  • the pressing unit may be provided in a second surface direction of the pressure-sensitive adhesive sheet facing the first surface, and may include a roller in the form of a soft material or a brush to press the second surface of the pressure-sensitive adhesive sheet.
  • a thin film forming apparatus comprising: a deposition material providing unit providing a deposition material for forming a thin film on a deposition target including an adhesive sheet having a magnetic layer; And a susceptor for supporting the deposition target, wherein the susceptor includes: a magnet plate providing an attractive force to the adhesive sheet; And it may include a cooling unit for cooling the adhesive sheet.
  • the magnet plate the stage for supporting the deposition object; And a magnet body layer disposed on the stage, the magnet body layer including a plurality of unit magnets arranged along the stage, wherein the cooling unit is formed in the stage to cool the deposition object. It may include; a cooling passage for providing.
  • the plurality of unit magnets may be arranged such that polarities between adjacent unit magnets cross each other along the stage.
  • the susceptor may further include a first thermoelectric sheet provided on the stage, and the first thermoelectric sheet may be formed of an elastic material.
  • the magnet body layer may be disposed between the first thermoelectric sheet and the stage, and the susceptor may further include a second thermoelectric sheet provided between the magnet body layer and the stage and formed of an elastic material.
  • the stage has a hollow inner space, and the magnet body layer may be installed in the inner space of the stage such that the plurality of unit magnets are arranged at predetermined intervals with respect to adjacent unit magnets, respectively.
  • the cooling passage may include a first cooling passage provided along spaced spaces between the plurality of unit magnets.
  • the cooling passage may further include a second cooling passage formed under the magnet body layer, wherein the first cooling passage and the second cooling passage may communicate with each other.
  • the second cooling channel extends linearly between the refrigerant inlet port and the refrigerant outlet port respectively connected to the second cooling channel to circulate the refrigerant, and the first cooling channel includes the plurality of refrigerants supplied from the second cooling channel. It may be formed radially to diffuse between the unit magnets.
  • the magnet body layer may further include a spacing member disposed between the plurality of unit magnets to maintain a spacing between adjacent unit magnets, respectively.
  • the stage has a hollow inner space, the plurality of unit magnets, a plurality of first unit magnets having a predetermined thickness; And a plurality of second unit magnets having a thickness thinner than that of the first unit magnet, wherein the magnet body layer has an internal space of the stage such that the plurality of second unit magnets are arranged between the plurality of first unit magnets.
  • the cooling passage may be provided along a space in a thickness direction of the plurality of second unit magnets.
  • the cooling passage may be provided such that at least some of the unit magnets of the plurality of unit magnets come into direct contact with the refrigerant.
  • a corrosion prevention layer may be formed on the surfaces of the plurality of unit magnets to prevent corrosion due to contact with the refrigerant.
  • the corrosion protection layer may be formed of a material having magnetic properties.
  • the magnet body layer The magnet body layer,
  • the magnetic plate may be disposed on an upper surface of the inner space of the stage to fix the plurality of unit magnets.
  • the upper surface of the stage may be formed of any one of a convex surface, a concave surface and a curved surface.
  • the adhesive sheet may be an electronic component carrier sheet
  • the deposition target may further include an electronic component attached to the electronic component carrier sheet
  • the thin film forming apparatus may form the thin film on an exposed surface of the electronic component.
  • An electronic component carrier sheet includes a strain holding layer that is plastically deformed by a pressure to which an electronic component is attached, thereby closely fixing at least one surface of the electronic component, thereby forming an electrode of the electronic component without forming a hole or a groove.
  • a portion such as a portion that is not desired to form a thin film may be protected by sealing.
  • the electronic component carrier may be removed without additional processes such as removing the sacrificial layer together with the thin film formed on the surface. Only by adhering to a sheet, the part which does not want thin film formation can be sealed and protected.
  • a thin film may be formed only at a portion where a thin film is not formed at a portion where the thin film is not formed, and a portion of the surface of the electronic component that is not desired to be formed is sealed through the electronic component carrier sheet, thereby selectively selecting the thin film.
  • the thin film may be formed only at the portion where the thin film is desired.
  • the electrode portion of the electronic component may be prevented from being contaminated due to a gap between the electronic component and the electronic component carrier sheet during the thin film forming process.
  • the manufacturing process can be simplified, and the electronic component can be closely fixed to the electronic component carrier sheet regardless of the appearance of the electronic component.
  • the degree of freedom in arranging electronic components may be increased, so that the electronic components may be densely arranged, and the electronic components may be prevented from being damaged or damaged by high temperature heat during a thin film forming process such as sputtering.
  • the electronic component carrier sheet can be in close contact with the magnet plate of the thin film forming apparatus during the thin film forming process. have.
  • heat transferred to the electronic component during the thin film forming process such as sputtering may be transferred to the electronic component carrier sheet and the magnet plate to be effectively cooled through the cooling unit of the thin film forming apparatus.
  • the effective cooling of the electronic component allows the electronic component to be maintained at an acceptable range of temperatures.
  • the pressure-sensitive adhesive device supports at least one of the pressure-sensitive adhesive sheet and the pressure-sensitive adhesive by supporting the adhesive to be provided on the first surface of the pressure-sensitive adhesive sheet on the first plate provided in the direction of the first surface of the pressure-sensitive adhesive sheet.
  • the adherend can be adhered to the adhesive sheet. Thereby, the phenomenon of the gap which arises between the adhesive sheet and the lower surface of a to-be-adhered body can be prevented.
  • the adhesive sheet is prevented from being damaged and the generation of particles such as cracks.
  • the adhesive may be in close contact, and a constant pressure may be added to the entire surface of the adhesive sheet.
  • the adhesive sheet around the adherend can be suppressed or prevented from rising along the side of the adherend, whereby the adhesive sheet is avoided.
  • the area adhering to the side of the adhesive can be minimized.
  • the pressure-sensitive adhesive sheet may be an electronic component carrier sheet including an adhesive layer and a strain holding layer
  • the adhesive may be a semiconductor package including a protruding terminal, and in this case, a pressure equal to or higher than the yield value at which the strain holding layer may be plastically deformed.
  • the lower surface of the semiconductor package with the protruding terminal can also be in close contact with the electronic component carrier sheet, preventing the lifting phenomenon generated between the electronic component carrier sheet and the lower surface of the semiconductor package. can do.
  • the deposition target can be firmly adhered on the susceptor by the magnetic force provided from the magnet body layer including the plurality of unit magnets.
  • a thermoelectric sheet may be provided on the stage to provide a seating surface of the deposition target, thereby increasing an effective contact area between the deposition target and the stage, and circulating the refrigerant through a cooling passage formed in the stage to perform the deposition process. By doing this, heat transmitted from the electronic component to the stage through the adhesive sheet can be effectively released.
  • a cooling flow path is formed along the area between the plurality of unit magnets to cool the stage, and the unit magnets can be cooled at the same time as the refrigerant flows, thereby preventing a decrease in the magnetic force caused by the temperature rise and providing sufficient magnetic force to the deposition target.
  • the magnetic force lines can be densely arranged along the stage, and the stage and unit magnets can be cooled effectively.
  • the semiconductor chip disposed in the semiconductor package is damaged by high temperature heat or the semiconductor package is bent by effectively cooling the semiconductor package in a deposition process formed in a high temperature environment. This can be prevented from occurring, and the manufacturing efficiency and production stability of the semiconductor package can be improved.
  • FIG. 1 is a cross-sectional view showing an electronic component carrier sheet according to an embodiment of the present invention.
  • FIG. 2 is a conceptual diagram illustrating a process of attaching an electronic component to an electronic component carrier sheet according to an embodiment of the present invention.
  • FIG. 3 is a conceptual diagram illustrating a thin film formation on the surface of an electronic component according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view showing an electronic component carrier sheet including a magnetic layer according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing an electronic component carrier sheet including a base film according to an embodiment of the present invention.
  • FIG. 6 is a perspective view showing an adhesive device according to another embodiment of the present invention.
  • FIG. 7 is a conceptual view for explaining the pressure added by the pressing unit according to another embodiment of the present invention.
  • FIG. 8 is a conceptual view for explaining the adhesion of the adhesive sheet and the adherend by the pressure according to another embodiment of the present invention.
  • FIG. 9 is a conceptual view for explaining pressurization through a first air pressure forming unit and a second air pressure forming unit according to another embodiment of the present invention.
  • FIG. 10 is a perspective view showing a pressure-sensitive adhesive device including a support piece and a gap adjusting portion according to another embodiment of the present invention.
  • FIG. 11 is a conceptual view illustrating a support piece and a gap adjusting unit according to another embodiment of the present invention.
  • FIG. 12 is a conceptual view illustrating a pattern plate according to another embodiment of the present invention.
  • FIG. 13 is a schematic view showing a pressure-sensitive adhesive device including a pressing portion in the form of a roller according to another embodiment of the present invention.
  • FIG. 14 is a cross-sectional view showing a thin film forming apparatus in another embodiment of the present invention.
  • FIG. 15 is a schematic view of a thin film forming apparatus according to another embodiment of the present invention.
  • FIG. 16 is a view showing a susceptor according to a first embodiment of the present invention.
  • FIG 17 is a view showing a state in which a cooling passage according to the first embodiment of the present invention is formed.
  • FIG. 18 is a view showing a state of the magnet body layer according to the first embodiment of the present invention.
  • FIG. 19 is a view illustrating a susceptor according to a second embodiment of the present invention.
  • 20 is a view showing a state of the magnet body layer according to the second embodiment of the present invention.
  • 21 is a view showing a susceptor according to a third embodiment of the present invention.
  • FIG. 1 is a cross-sectional view showing an electronic component carrier sheet according to an embodiment of the present invention.
  • an electronic component carrier sheet 100 may include an adhesive layer 110 to which an electronic component 10 is attached to one surface thereof; And a strain holding layer 120 provided on the other surface of the adhesive layer 110 opposite to the one surface thereof and plastically deformed by the pressure to which the electronic component 10 is attached.
  • the electronic component carrier sheet 100 may be formed as a square sheet or a disc, or may be provided in a roll form, and the electronic component 10 may be firmly adhered to one surface (for example, an upper surface). Can play a role of fixing.
  • at least one semiconductor package may be arranged in a compact size in one electronic component carrier sheet 100.
  • the adhesive layer 110 may be attached (or adhered) to the electronic component 10 on one surface thereof, and the electronic component 10 such as the semiconductor package 11 and the multilayer ceramic capacitor (MLCC) 12.
  • the electronic component 10 such as the semiconductor package 11 and the multilayer ceramic capacitor (MLCC) 12.
  • MLCC multilayer ceramic capacitor
  • the electronic component 10 may include a protrusion such as a protruding terminal 11a on one surface (for example, a bottom surface), and the semiconductor package 11 has a plurality of solder balls on one surface thereof in a matrix form.
  • a ball grid array (BGA) or a plurality of metal electrodes in a land form may be included in a land grid array (LGA) package in a matrix form.
  • the adhesive layer 110 may be disposed to face the electronic component 10, and the electronic component 10 may be attached to the adhesive layer 110 using a surface facing the adhesive layer 110 as an adhesive surface. have.
  • the adhesive layer 110 may include an adhesive material, and may be formed by processing a flowable adhesive material having adhesiveness into a film form.
  • the adhesive material may include a silicon-based adhesive material, and the present invention is not limited thereto.
  • the adhesive material constituting the adhesive layer 110 may include various materials in addition to the silicone-based adhesive material.
  • the adhesive layer 110 may have an adhesive force of 200 to 1,500 gf / in.
  • the adhesive force of the adhesive layer 110 is smaller than 200 gf / in, the electronic component 10 may not move while the electronic component 10 is hardly adhesively fixed and the electronic component 10 may move during the movement (or transfer) of the electronic component carrier sheet 100. It may be detached from the electronic component carrier sheet 100.
  • the adhesive force of the adhesive layer 110 is greater than 1,500 gf / in, the electronic component 10 is adhered so firmly that detachment of the electronic component 10 from the electronic component carrier sheet 100 after the thin film forming process is prevented. It may be difficult or the electronic component 10 may not be cleanly separated from the adhesive layer 110, and a portion (or foreign matter) of the adhesive layer 110 may remain on the attachment surface (eg, the lower surface) of the electronic component 10. have.
  • the adhesive layer 110 may have a thickness of 5 to 100 ⁇ m.
  • the thickness of the adhesive layer 110 is thinner than 5 ⁇ m, it is difficult to secure the uniformity of the thickness of the large area, which may cause poor adhesion of the electronic component 10 and some contamination defects on the attachment surface of the electronic component 10.
  • a portion of the adhesive layer 110 may fall and remain on the attachment surface of the electronic component 10 due to cohesion problems such as adhesive of the layer 110.
  • the adhesive layer 110 is very easily torn or broken, handling is very difficult, and the electronic component 10 may not be attached to the torn or broken portion.
  • the thickness of the adhesive layer 110 is thicker than 100 ⁇ m, even if pressure is applied in the process of attaching the electronic component 10 to the adhesive layer 110, the pressing force may not be transmitted to the strain holding layer 120 well. Can be.
  • a thick adhesive layer 110 is interposed between the protruding portions to block the intervening space of the strain holding layer 120, thereby preventing the electronic component ( It may be difficult to change the shape of the strain holding layer 120 according to the shape of 10).
  • the strain holding layer 120 may be provided on the other side of the adhesive layer 110 (for example, the lower portion of the adhesive layer) facing the one surface of the adhesive layer 110 to which the electronic component 10 is attached.
  • the adhesive layer 110 may be bonded (or bonded) to the adhesive layer 110, and may be plastically deformed by a pressure to which the electronic component 10 is attached. That is, the deformation maintaining layer 120 may have a feature that the shape is not restored after plastic deformation by the pressure (or external force) to which the electronic component 10 is attached, and may be a shape restoration prevention film.
  • the strain holding layer 120 may be deformed by a pressure applied to the adhesive layer 110 while the electronic component 10 is attached to the adhesive layer 110, and the shape may be deformed and plastically deformed.
  • the electronic component 10 for example, the protruding terminal of the semiconductor package
  • a part of the electronic component 10 for example, the protruding terminal of the semiconductor package
  • the electronic component carrier sheet 100 may be held and fixed therein. Accordingly, it is possible to prevent the occurrence of a lift between the adhesive layer 110 and the attachment surface of the electronic component 10, and due to the lift phenomenon, deposition contamination occurs on the electrode portion of the electronic component 10. The quality of the electronic component 10 may be deteriorated and the yield may be reduced.
  • the material of the strain holding layer 120 may be important in order to improve the handling while preventing the shape from being restored after the shape of the strain holding layer 120 is deformed, and the strain holding layer 120 may be formed of a metal film ( metal film).
  • the metal film may include a metal sheet or a metal foil having a thin thickness, and may be formed of a metal material having malleability and ductility.
  • the malleability includes both malleability, which is a property that expands under pressure, and ductility, which is a property that is stretched by a tensile force, and may mean a property (ie, plasticity) that is easy to undergo plastic working.
  • it may be formed of aluminum, an aluminum alloy, copper, a copper alloy, and the like, which are rich in ductility and have excellent workability and are easily processed to a very thin thickness.
  • the thickness of the strain holding layer 120 may be important in order to improve the handleability while preventing the shape from being restored after the shape of the strain holding layer 120 is deformed.
  • the strain holding layer 120 may be formed in the form of a metal sheet, a metal film, or a metal foil having a thin thickness. At this time, the strain holding layer 120 may have a thickness of 3 to 60 ⁇ m. When the thickness of the strain holding layer 120 is thinner than 3 ⁇ m, the strain holding layer 120 may be very easily torn or broken, and may be very difficult to handle. It may be difficult to maintain plastically deformed shapes along portions (eg, protruding terminals of the semiconductor package).
  • the thickness of the strain holding layer 120 is greater than 60 ⁇ m, the shape of the recessed portion of the electronic component 10 may be obtained even when pressure is applied in the process of attaching the electronic component 10 to the adhesive layer 110. It may not be effectively deformed along.
  • the strain holding layer 120 is formed of aluminum, it may be formed to a thickness of 5 to 15 ⁇ m (about 9 ⁇ m), and depending on the material (or type of material) of the strain holding layer 120. The thickness of the strain maintaining layer 120 may be changed.
  • the strain holding layer 120 may have an elongation of 10 to 80%.
  • the elongation of the strain holding layer 120 is less than 10%, the electronic component 10 is not easily stretched by the pressure applied in the process of being attached to the adhesive layer 110 so that the plastic strain is not deformed or a large pressing force is applied to plastic deformation. It may be necessary, and even if plastically deformed, it may not be precisely deformed along the shape of the recessed portion of the electronic component 10.
  • the strain holding layer 120 is greater than 80%, the strain holding layer is formed so that the adhesive layer 110 is in close contact with the attachment surface of the electronic component 10 because the adhesive layer 110 extends too well even with a small external force (or external pressure).
  • the pressure-sensitive adhesive layer 110 may not be evenly attached to the attachment surface of the electronic component 10 according to the difference in the pressing force for each region. A gap (or lift) may occur. This may lower the mass stability (stability).
  • FIG. 2 is a conceptual view illustrating a process of attaching an electronic component to an electronic component carrier sheet according to an embodiment of the present invention.
  • FIG. 2 (a) is a view illustrating a semiconductor package attached to an electronic component carrier sheet.
  • (b) is a figure in which the strain holding layer of the electronic component carrier sheet is plastically deformed by the pressure to attach the semiconductor package
  • FIG. 2 (c) is a figure in which the multilayer ceramic capacitor (MLCC) is attached to the electronic component carrier sheet.
  • FIG. 2 (d) is a diagram in which the strain holding layer of the electronic component carrier sheet is plastically deformed by a pressure for attaching a laminated ceramic capacitor (MLCC).
  • MLCC multilayer ceramic capacitor
  • the strain holding layer 120 may be plastically deformed according to the shape of the electronic component 10, and the electronic component carrier sheet 100 or the strain holding layer 120 may be attached to the adhesive layer 110.
  • the plastic deformation may be performed according to the shape of the recessed portion (or the attachment surface of the electronic component) of the electronic component 10 recessed in the.
  • the electronic component 10 such as the semiconductor package 11 is disposed to face the adhesive layer 110 (for example, in the case of the semiconductor package, the protruding terminal is disposed to face the adhesive layer). At least a portion of the electronic component 10 is inserted (or recessed) in the electronic component 10 may be in contact with the adhesive layer 110, the electronic component 10 in the direction toward the adhesive layer 110 As a result, the adhesive layer 110 and the strain holding layer 120 may be pressed by the attachment surface or the contact surface of the electronic component 10 (eg, the protruding terminal of the semiconductor package).
  • the pressure-sensitive adhesive layer 110 and the deformation-retaining layer 120 may be deformed due to the pressurization of the electronic component 10, and thus, at least a part of the electronic component 10 (eg, the protruding terminal) may be attached.
  • the shape of the strain holding layer 120 may not be restored after the plastic deformation of the shape of the strain holding layer 120 by the electronic component 10. have.
  • a pusher such as a soft roller may directly contact the electronic component 10 and pressurize the air.
  • pressure may be used to indirectly apply pressure to the electronic component 10 and / or the electronic component carrier sheet 100.
  • the electronic component 10 is the semiconductor package 11 including at least one protruding terminal 11a on one surface (that is, the attachment surface) attached to the adhesive layer 110
  • the solder ball or the electrode may be used. It may be plastically deformed along the protruding terminal 11a.
  • the electronic component 10 is a laminated ceramic capacitor 12
  • at least a part of the laminated ceramic capacitor 12 is recessed and laminated on the electronic component carrier sheet 100 by a predetermined depth, as shown in FIG. 2 (c).
  • the adhesive layer 110 may be attached to not only the bottom surface of the ceramic capacitor 12 but also at least a portion of the side surface thereof.
  • plastic deformation may be performed according to the shape of at least a portion of the bottom surface and the side surface of the multilayer ceramic capacitor 12 recessed in the electronic component carrier sheet 100.
  • the adhesive layer 110 or the strain holding layer 120 may have a thickness thinner than the height of the recessed portion of the electronic component 10.
  • the adhesive layer 110 or the strain holding layer 120 may have a thickness thinner than the predetermined depth in which the electronic component 10 is recessed, and only the protruding terminal 11a is attached to the electronic component carrier sheet 100. In the case of depression, it may have a thickness thinner than the height of the protruding terminal 11a.
  • the adhesive layer 110 or the strain holding layer 120 has a thickness greater than or equal to the height of the recessed portion of the electronic component 10, the pressure at which the electronic component 10 is attached to the strain holding layer 120 may not be transmitted well.
  • the strain retaining layer 120 does not receive a pressing force greater than the yield value capable of plastic deformation and cannot be plastically deformed or flexibly bent at an edge portion of the electronic component 10 due to a thick thickness, such that the strain retaining layer 120 is not covered by the electronic component. It may not be deformed correctly depending on the shape of the recessed portion of (10).
  • a thick adhesive layer 110 is interposed between the protrusions so that the strain holding layer 120 is disposed. It is not possible to block the intervening space of the c) or due to the thick thickness of the strain holding layer 120, thereby making it difficult to change the shape of the strain holding layer 120 according to the shape of the recessed portion of the electronic component 10.
  • FIG. 3 is a conceptual view illustrating the formation of a thin film on the surface of an electronic component according to an embodiment of the present invention.
  • FIG. 3 (a) is a drawing in which a thin film is formed on the surface of a semiconductor package.
  • FIG. 3 (c) is a diagram in which a thin film is formed on a surface of a multilayer ceramic capacitor (MLCC), and
  • FIG. 3 (d) is a multilayer ceramic capacitor (MLCC) in which a thin film is formed. ) Is a figure detaching from the electronic component carrier sheet.
  • MLCC multilayer ceramic capacitor
  • the electronic component 10 may be a thin film forming process such as sputtering in a state in which the electronic component 10 is adhered to (or tightly fixed to) the electronic component carrier sheet 100.
  • a thin film for example, a metal film or an electromagnetic shielding film for shielding electric waves
  • the thin film 20 may not be formed on the surface of the component carrier sheet 100 that is not exposed to the component carrier sheet 100.
  • a metal film may be formed on side surfaces and an upper surface of the exposed semiconductor package 11, and the protruding terminals 11a such as solder balls or electrodes may be formed.
  • the lower surface of the formed semiconductor package 11 may be sealed by the electronic component carrier sheet 100 so that a metal film may not be formed.
  • a portion of the surface of the electronic component 10 may be formed by sealing a portion of the surface on which the thin film is not desired to be selectively formed only in a portion desired to form the thin film.
  • the electronic component 10 may be adhered (or mounted) to the electronic component carrier sheet 100, and the electronic component carrier sheet 100 on which the electronic component 10 is disposed is attached and transferred to form a thin film to be described later.
  • a thin film forming process on the surface of the electronic component 10 may be performed in the thin film forming apparatus.
  • a sputtering process may be performed in the thin film forming apparatus so that a metal film may be formed on the exposed surface (eg, side surfaces and the top surface of the semiconductor package) of the electronic component 10 to shield electromagnetic waves.
  • a picker 30 picks up the electronic component 10 disposed on the electronic component carrier sheet 100 to perform a subsequent process. Can be transported with.
  • the electronic component carrier sheet 100 when the electronic component carrier sheet 100 is inserted into the thin film forming apparatus and the thin film forming process is performed, the electronic component 10 is exposed to a high temperature environment, and thus, the electronic component such as a semiconductor chip disposed in the semiconductor package 11 ( Rapid cooling of the electronic component 10 is essential because 10) may be damaged by high temperature heat.
  • the strain holding layer 120 may have a thermal conductivity of 200 W / m ⁇ K or more at room temperature. That is, the strain holding layer 120 may have excellent thermal conductivity.
  • a thin film forming process such as sputtering
  • high temperature heat may be generated, and heat dissipation characteristics of the electronic component carrier sheet 100 are also important to prevent the electronic component 10 from being damaged and broken by high temperature heat. Accordingly, the electronic component carrier sheet 100 may also quickly transmit heat provided to the electronic component 10 to the outside during the thin film forming process to quickly dissipate heat provided to the electronic component 10.
  • the strain holding layer 120 may be formed of a metal material having a high thermal conductivity, and may absorb and transfer heat transferred from the electronic component 10 to the susceptor 220 of the thin film forming apparatus. have.
  • the strain holding layer 120 is formed of an aluminum material or a copper material, heat provided to the electronic component 10 may be quickly radiated to the outside. For this reason, the electronic component 10 exposed to a high temperature environment during the thin film formation process, such as sputtering, can be cooled rapidly. Accordingly, the electronic component 10 such as the semiconductor chip disposed in the semiconductor package 11 can be prevented from being damaged by high temperature heat, and the deformation of the electronic component 10 such as the semiconductor package 11 is bent can be prevented. can do.
  • the thermal conductivity of the strain holding layer 120 is less than 200 W / m ⁇ K at room temperature, the amount of heat that is absorbed from the electronic component 10 and transferred to the susceptor 220 of the thin film forming apparatus is absorbed. Due to the limitation, the electronic component 10 may not be rapidly cooled during the thin film formation process such as sputtering, and the electronic component 10 may be damaged by high temperature heat.
  • the strain holding layer 120 may prevent the lifting phenomenon between the adhesive layer 110 and the attachment surface of the electronic component 10, and may have a high thermal conductivity so that heat transferred from the electronic component 10 may be adhered to the adhesive layer. It can be effectively delivered to the susceptor 220 through the (110), it is possible to form a thin film of excellent film quality on the surface of the electronic component (10).
  • the susceptor 220 may include a magnet plate 221 to closely contact the electronic component carrier sheet 100 to the susceptor 220, and the cooling unit 222 may be disposed inside or at the rear of the magnet plate 221. ) May be installed (or disposed) to cool the magnet plate 221 and / or the electronic component carrier sheet 100.
  • the pressure-sensitive adhesive layer 110 and the adhesive layer 110 to generate (or provide) the electronic component carrier sheet 100 by the magnetic force generated in the magnet plate 221 to bring the electronic component carrier sheet 100 into close contact with the susceptor 220.
  • At least one of the strain holding layers 120 may have magnetic properties.
  • the adhesive layer 110 may contain the magnetic powder 132.
  • magnetic powder 132 such as magnetic metal powder in powder form
  • thickness of the adhesive layer 110 can be maintained while maintaining the adhesiveness, similar to that of a magnetic thin film.
  • the adhesive layer 110 containing the magnetic powder 132 may be formed. It may be formed to a thickness of about 50 ⁇ m. However, the thickness of the adhesive layer 110 containing the magnetic powder 132 is not limited thereto, the material of the magnetic powder 132, the size or average particle size of the magnetic powder 132, the magnetic powder 132 It may be adjusted to about 50 ⁇ m or more or about 50 ⁇ m or less, depending on the density thereof.
  • the strain retaining layer 120 when the strain retaining layer 120 is formed of a nonmagnetic metal film processed to a very thin thickness due to rich ductility and workability, the strain retaining layer 120 may be formed of a nonmagnetic metal material through which a magnetic field may pass. Can be.
  • the strain holding layer 120 may be formed of a magnetic metal film.
  • the electronic component carrier sheet 100 may be in close contact with the susceptor 220 by the magnetic force generated in the magnet plate 221, and thus the heat transferred to the electronic component 10 may be transferred to the electronic component carrier sheet ( Through the 100, the magnet plate 221 and / or the cooling unit 222 may be provided to rapidly cool the electronic component 10.
  • the magnetic metal may include iron (Fe), cobalt (Co), nickel (Ni) and the compound thereof.
  • FIG. 4 is a cross-sectional view illustrating an electronic component carrier sheet including a magnetic layer according to an embodiment of the present invention.
  • FIG. 4 (a) illustrates an electronic component carrier sheet including a magnetic layer
  • FIG. 4 (b) includes a magnetic layer. The plastic deformation of the strain holding layer of the electronic component carrier sheet is shown.
  • the electronic component carrier sheet 100 may further include a magnetic layer 130 provided on the other surface of the strain maintaining layer 120 facing the adhesive layer 110.
  • the magnetic layer 130 may be provided on the other surface of the strain holding layer 120 facing one surface of the strain holding layer 120 facing the adhesive layer 110.
  • the magnetic layer 130 may be formed of a magnetic thin film, and may be formed of a magnetic metal film in which magnetic metal powder is formed in a film form.
  • the electronic component carrier sheet 100 may be in close contact with the susceptor 220 by the magnetic force generated by the magnet plate 221. As a result, heat transferred to the electronic component 10 may be provided to the magnet plate 221 and / or the cooling unit 222 through the electronic component carrier sheet 100 to rapidly cool the electronic component 10.
  • the magnetic layer 130 may be formed by dispersing the magnetic powder 132 in the binder resin 131.
  • the magnetic layer 130 may be formed to a thickness capable of stably supporting the strain holding layer 120 according to the thickness of the strain holding layer 120.
  • the binder resin 131 may provide softness and / or elasticity to act as a buffer, thereby limiting a deformation range of the strain holding layer 120, and thus tearing of the strain holding layer 120. And / or breakage may be prevented.
  • the magnetic powder 132 may be contained in 30 to 90% by weight based on the total weight of the magnetic layer 130.
  • the magnetic strength is low so that the electronic component carrier sheet 100 cannot be stably adhered to the susceptor 220.
  • the magnetic powder 132 is contained in more than 90% by weight relative to the total weight of the magnetic layer 130, the adhesive strength with the strain holding layer 120 or the like is inferior or the soft and / or elastic properties of the magnetic layer 130 This decreases and the buffering function cannot be effectively performed.
  • the magnetic powder 132 may have an average particle size (or size) of 0.1 to 30 ⁇ m.
  • the magnetic powder 132 has an average particle size smaller than 0.1 ⁇ m, the magnetic powder 132 is too small in size (or average particle size) so that the magnetic powder 132 is uniformly distributed over the entire region (or the total area) of the magnetic layer 130. ) Is difficult to disperse.
  • the magnetic powder 132 has an average particle size larger than 30 ⁇ m, the number of particles of the magnetic powder 132 that can enter a certain region of the magnetic layer 130 is limited so that the magnetic strength cannot be adjusted or the magnetic body The thickness of the magnetic layer 130 may not be adjusted below the average particle size of the powder 132.
  • the magnetic layer 130 may have a thickness of 10 to 500 ⁇ m.
  • the thickness of the magnetic layer 130 is thinner than 10 ⁇ m, the magnetic strength of the electronic component carrier sheet 100 may not be sufficiently provided to adhere to the susceptor 220, or the buffering of the magnetic layer 130 may be effectively performed. It becomes impossible.
  • the thickness of the magnetic layer 130 is thicker than 500 ⁇ m, the distance from the electronic component 10 to the susceptor 220 may be long, and thus a heat dissipation path may be lengthened and effective heat dissipation may not be achieved.
  • the magnetic layer 130 may replace the role of the base film 140 to be described later, in the case of further comprising the base film 140 as well as the magnetic layer 130, the strain holding layer 120 and the base film 140 It may be substituted for the role of the adhesive 150 to bond.
  • the sum of the thicknesses of the adhesive layer 110, the strain holding layer 120, and the magnetic layer 130 may have a value greater than the height of the recessed portion of the electronic component 10.
  • the sum of the thicknesses of the adhesive layer 110, the strain holding layer 120, and the magnetic layer 130 may have a value greater than the predetermined depth in which the electronic component 10 is recessed, and the protruding terminal 11a may be formed. If only the electronic component carrier sheet 100 is recessed, it may have a value greater than the height of the protruding terminal 11a.
  • the recessed portion of the electronic component 10 is recessed. Since the adhesive layer 110, the strain holding layer 120, and the magnetic layer 130 must all be deformed according to the shape of the recessed portion of the electronic component 10, the electronic component 10 may be applied to the electronic component carrier sheet 100. When attached, the bottom surface (or contact surface in contact with the susceptor) of the electronic component carrier sheet 100 becomes rugged and uneven.
  • the sum of the thicknesses of the adhesive layer 110, the strain holding layer 120, and the magnetic layer 130 has a value greater than the height of the recessed portion of the electronic component 10, at least the magnetic layer.
  • a portion of the 130 may be unaffected or less affected by the shape of the recessed portion of the electronic component 10, the curvature of the bottom surface of the electronic component carrier sheet 100 may be less, and flat Can be. Accordingly, the adhesion between the electronic component carrier sheet 100 and the susceptor 220 may be enhanced, and the cooling effect through the cooling unit 222 of the susceptor 220 may be further improved.
  • FIG. 5 is a cross-sectional view showing an electronic component carrier sheet including a base film according to an embodiment of the present invention
  • Figure 5 (a) shows an electronic component carrier sheet comprising a base film
  • Figure 5 (b) is a base Plastic deformation of the strain holding layer of the electronic component carrier sheet containing the film is shown.
  • the electronic component carrier sheet 100 is provided on the other surface of the strain holding layer 120 facing the adhesive layer 110 to support the strain holding layer 120.
  • the base film 140 may be further included.
  • the base film 140 may be provided on the other surface of the strain retaining layer 120 facing one surface of the strain retaining layer 120 facing the adhesive layer 110, and retains strain by supporting the strain retaining layer 120. It is possible to limit the deformation range of layer 120. Accordingly, it is possible to prevent tearing and breakage of the strain holding layer 120, thereby improving damage prevention and handling of the strain holding layer 120.
  • the base film 140 may prevent physical damage such as damage and tear of the strain holding layer 120, and may prevent contamination of the strain holding layer 120 by external materials.
  • the base film 140 may be disposed on the base film 140 as well as the strain holding layer 120 (eg, on one surface of the base film), the adhesive layer 110, the magnetic layer 130, or the adhesive ( 150 may be supported, and may serve to prevent tearing and damage of the strain maintaining layer 120.
  • the base film 140 may apply a force (or force to adhere to the attachment surface of the electronic component) to tighten the strain holding layer 120 and the adhesive layer 110 so that the strain range of the strain holding layer 120 is limited.
  • a force or force to adhere to the attachment surface of the electronic component
  • the adhesive layer 110 may be in close contact with the attachment surface of the electronic component 10.
  • the restoring force of the base film 140 may be equal to or lower than the yield value (or plastic strain force) at which the plastic deformation of the strain maintaining layer 120 is possible. If the restoring force of the base film 140 is greater than the yield value at which the plastic deformation of the strain holding layer 120 is possible, the restoring force and deformation of the base film 140 to reach the primary plastic strain of the strain holding layer 120. A pressing force equal to or greater than the yield value capable of plastic deformation of the holding layer 120 is required, and even if the deformation holding layer 120 is primarily plastically deformed, the deformation value of the holding layer 120 is greater than the yield value at which the plastic deformation of the holding layer 120 is possible.
  • the restoring force of the large base film 140 may plastically deform the strain holding layer 120 to another shape. Accordingly, the restoring force of the base film 140 may be equal to or less than a yield value at which the strain holding layer 120 may be plastically deformed so that the strain holding layer 120 may maintain its shape.
  • the base film 140 may be made of a synthetic resin material, it may contain a magnetic powder 132.
  • the base film 140 may be made of a synthetic resin material that may be deformed in response to plastic deformation (or shape deformation) of the strain holding layer 120. For example, it may be formed by processing polyethylene terephthalate (PET) into sheets or films.
  • PET polyethylene terephthalate
  • the shape of the base film 140 is not easily deformed and the restoring force is strong, so that the deformation force of the strain holding layer 120 (that is, elastic strain or plastic strain) ) Can be reduced.
  • the thickness of the base film 140 and the strain holding layer 120 may be determined such that the restoring force of the base film 140 is equal to or lower than the yield value at which the strain holding layer 120 may be plastically deformed. That is, the thickness of the base film 140 may be determined by the thickness of the strain holding layer 120. For example, when the thickness of the strain holding layer 120 of aluminum material is about 9 ⁇ m, the base film 140 is set by setting the thickness of the base film 140 of polyethylene terephthalate (PET) material to about 15 ⁇ m. The restoring force can be equal to or less than the yield value at which plastic deformation of the strain holding layer 120 is possible.
  • PET polyethylene terephthalate
  • the thickness of the base film 140 may be determined according to the solder ball size of the semiconductor package 11 or the like, and as the size of the solder ball increases, the thickness of the base film 140 may be thinner.
  • the base film 140 may be processed to a thickness corresponding to solder balls having a size of about 350 ⁇ m.
  • the base film 140 may contain the magnetic powder 132.
  • the magnetic powder 132 may be added to the base film 140 instead of the adhesive layer 110, and the base film 140 may be formed by adding the magnetic powder 132 to a synthetic resin material, or the base film 140.
  • the magnetic powder 132 may be formed on the surface of the film in the form of a film.
  • the electronic component carrier sheet 100 may be in close contact with the susceptor 220 by the magnetic force generated in the magnet plate 221, and thus the heat transferred to the electronic component 10 may be transferred to the electronic component carrier sheet ( Through the 100, the magnet plate 221 and / or the cooling unit 222 may be provided to rapidly cool the electronic component 10.
  • the magnetic powder 132 may have an average particle size of 0.1 to 30 ⁇ m for the same reason as the magnetic powder 132 of the magnetic layer 130.
  • At least one of the adhesive layer 110, the strain holding layer 120, and the base film 140 may have magnetic properties, and the adhesive layer 110 and the strain holding layer 120 may be replaced with the magnetic layer 130. At least one or more of the base film 140 may have magnetic properties.
  • the electronic component carrier sheet 100 of the present invention is provided between the strain holding layer 120 and the base film 140, the adhesive 150 to strengthen the adhesion between the strain holding layer 120 and the base film 140; It may further include.
  • the adhesive 150 may be provided in the form of an adhesive layer between the strain holding layer 120 and the base film 140, and may strengthen the adhesive force between the strain holding layer 120 and the base film 140.
  • the adhesive 150 may be formed on (or under) the other surface of the strain holding layer 120, and the base film 140 may face one side of the adhesive 150 facing the strain holding layer 120. It may be formed (or disposed) on the other surface of the adhesive 150.
  • the adhesive 150 may be a magnetic powder 132 is dispersed in the adhesive material, the magnetic powder 132 may include a metal powder or ferrite powder.
  • the base film 140 may not be deformed without being affected by the shape of the recessed portion of the electronic component 10.
  • the electronic component 10 is pressed in the direction of the adhesive layer 110 after contacting the adhesive layer 110 of the electronic component carrier sheet 100. Therefore, when the adhesive 150 is provided between the strain holding layer 120 and the base film 140, only the recessed portion of the electronic component 10 from the adhesive layer 110 to the adhesive 150 (for example, the Deformation may occur in correspondence with the shape of the protruding terminal of the semiconductor package, and the base film 140 may not be deformed. Accordingly, it may serve to prevent tearing and damage of the strain holding layer 120 which is a thin metal film.
  • the base film 140 When the shape of the base film 140 is not deformed, uneven irregularities are generated on the other surface (eg, the lower surface) of the base film 140 that faces one surface of the base film 140 facing the adhesive 150. You can't. This allows the base film 140 to be in close contact with the susceptor 220 of the thin film forming apparatus, and effectively cools the cooling through the cooling unit 222 when forming the thin film 20 by a thin film forming process such as sputtering. The heat dissipation performance of the electronic component carrier sheet 100 may be further improved.
  • the electronic component carrier sheet 100 may have an elongation of 10 to 80%.
  • the strain holding layer 120 may not be plastically deformed because the electronic component 10 is not easily stretched by the pressure applied during the attachment of the electronic component 10 to the adhesive layer 110. Or a large pressing force may be required to plastically deform, and even if plastically deformed, the strain holding layer 120 may not be accurately deformed along the shape of the recessed portion of the electronic component 10.
  • the adhesive layer 110 is deformed and maintained so that the adhesive layer 110 adheres to the attachment surface of the electronic component 10 too well even with a small external force. Since the handling for plastic deformation of the layer 120 becomes difficult, not only is it difficult to create a pressing condition that causes the adhesive layer 110 to change into a shape that can be in close contact with the attachment surface of the electronic component 10, but also the pressure is uniformly applied throughout. If not, the pressure-sensitive adhesive layer 110 may not be evenly attached to the attachment surface of the electronic component 10 according to the difference in the pressing force for each region, and a gap may occur between the adhesion layer 110 and the attachment surface of the electronic component 10. have.
  • the electronic component carrier sheet 100 may be attached to a hollow support frame (not shown) so that the at least one electronic component 10 may be transported in a state in which the electronic component carrier is adhered, in which case the electronic component carrier is larger than 80%.
  • the high elongation of the sheet 100 may cause the electronic component carrier sheet 100 to slump or deform.
  • the electronic component 10 may be affected by movement or detachment of the electronic component 10, and thus mass production stability may be reduced.
  • the elongation of the electronic component carrier sheet 100 may be preferably 35 to 70%, more preferably 50 to 60% for effective deformation of the strain holding layer 120 and high mass stability.
  • the electronic component carrier sheet 100 may have a tensile strength of 25 to 250 N / mm 2.
  • the electronic component carrier sheet 100 may be torn or damaged by the pressure (or pressing force) to which the electronic component 10 is attached.
  • the strain holding layer 120 is hardly deformed so that it is not plastically deformed or the elastic force (or elastic strain force) of the strain holding layer 120 is prevented.
  • the tensile strength of the electronic component carrier sheet 100 may be 34 to 250 N / mm 2 preferably.
  • the tensile strength of the strain holding layer 120 is high and the tensile strength of 25 to 250 N / mm 2 can be achieved only by the adhesive layer 110 and the strain holding layer 120, the magnetic layer 130 and the base film ( The electronic component carrier sheet 100 may be manufactured (or manufactured) using only the adhesive layer 110 and the strain holding layer 120 without the 140.
  • FIG. 6 is a perspective view showing an adhesive device according to another embodiment of the present invention.
  • Adhesive device 200 includes a support frame 210, the adhesive sheet 100 is supported; A pressing unit 220 for applying pressure to at least one of the adherend 10 and the adhesive sheet 100 provided on the first surface of the adhesive sheet 100; And a first plate 230 disposed in a direction of the first surface of the adhesive sheet 100 to provide a support surface on which the adherend 10 is supported when the pressure is applied.
  • the support frame 210 may be supported by an adhesive sheet 100 such as the electronic component carrier sheet 100 to which the electronic component 10 is attached (or adhered), and may have a plate shape having two surfaces facing each other. The central portion may be opened to be hollow so that a hole (or opening) is formed therein.
  • the adhesive sheet 100 may be attached to the support frame 210 to be supported, and may attach the first surface edge of the adhesive sheet 100 to the bottom surface (or the second surface) of the support frame 210.
  • the adhesive sheet 100 may be attached to the adhesive sheet 100 in advance by cutting the adhesive sheet 100 to a size corresponding to the support frame 210, but the adhesive sheet 100 may be attached to the inner circumference of the support frame 210.
  • the support frame 210 may be a variety of shapes, such as circular, oval, polygonal, the adhesive sheet 100 is stably supported so that the adherend 10 such as the electronic component 10 of the adhesive sheet 100 It is sufficient if it is a shape which can stick well on a 1st surface.
  • the pressing unit 220 may apply pressure to at least one of the adherend 10 and the adhesive sheet 100 provided on the first surface (or adhesive surface) of the adhesive sheet 100.
  • the adherend 10 may be provided corresponding to the central portion of the support frame 210 in which the hole is formed in the first surface of the adhesive sheet 100, and may be configured in plural.
  • the adherend 10 is seated on the first surface of the adhesive sheet 100 at a predetermined interval so that the lower surface (or the second surface) of the adherend 10 is attached to the first surface of the adhesive sheet 100. It may be attachable, it may be desirable to automatically arrange at a predetermined interval through a transfer module (not shown), such as a picker (picker).
  • the pressing unit 220 may be in direct contact with the pressure-sensitive adhesive sheet 100 and / or the adhesive 10, and may be indirectly pressurized by using air pressure. Pressure may be added to (10).
  • the first plate 230 may be disposed (or provided) in the first surface direction (or side) of the adhesive sheet 100, and the adherend 10 may be applied when the pressure is applied by the pressing unit 220.
  • This supporting surface can be provided.
  • the first plate 230 is provided to face at least a portion (eg, an edge) of the support frame 210, such that the support surface of the first plate 230 is provided on the first surface of the adhesive sheet 100.
  • the upper surface (or the first surface) of the adherend 10 may be supported by the support surface of the first plate 230. When the upper surface of the adherend 10 is supported through the first plate 230, the pressure may be well transmitted to the adhesive sheet 100 and / or the adherend 10.
  • the shape of the support surface of the first plate 230 may be a variety of flat (flat), convex, concave shape, etc., the shape of the adhesive sheet 100 is bent by the pressure by the pressing unit 220 It can be determined according to.
  • the adhesive sheet 100 may not have excessive force (or excessive force is applied).
  • the action / reaction force may be well transmitted in the vertical direction between the support surface of the first plate 230 and the top surface of the adherend 10.
  • FIG. 7 is a conceptual diagram illustrating the pressure addition by the pressing unit according to another embodiment of the present invention.
  • FIG. 7 (a) shows before the pressure is added
  • FIG. 7 (b) shows the state where the pressure is added.
  • the adhesive device 200 may further include a first packing member 241 provided between the first plate 230 and the support frame 210.
  • the 220 may include a first air pressure forming unit 221 for forming a negative pressure in a space defined by the first plate 230, the support frame 210, and the first packing member 241. have.
  • the first packing member 241 may be provided between the first plate 230 and the support frame 210, may be in close contact with the first plate 230 and the support frame 210, and the first plate ( It is possible to prevent the occurrence of a gap (gap) that the air can enter and exit between the 230 and the support frame 210.
  • the height of the adherend 10 may be secured between the first plate 230 and the support frame 210.
  • the first air pressure forming unit 221 may form a negative pressure (or vacuum or negative pressure) in a space defined by the first plate 230, the support frame 210, and the first packing member 241.
  • the negative pressure may be a pressure lower than atmospheric pressure (or normal pressure), and may be a suction force applied in a direction of sucking the object on the surface of the object.
  • the first air pressure forming unit 221 may include a vacuum pump, and forms a negative pressure in a space defined by the first plate 230, the support frame 210, and the first packing member 241.
  • the upper surface of the adherend 10 may be supported (or contacted) with the first plate 230, and the pressure-sensitive adhesive sheet 100 is pressed in the direction of the adherend 10 (or the first plate direction). (Or suction force) can be added.
  • FIG. 8 is a conceptual view for explaining the adhesion between the pressure-sensitive adhesive sheet and the adherend according to another embodiment of the present invention, Figure 8 (a) shows before the pressing, Figure 8 (b) the pressure-sensitive adhesive sheet And adhesion of the adherend.
  • the adherend 10 may be formed. ) Is not contacted (or supported) with the first plate 230, but is defined by the first plate 230, the support frame 210 and the first packing member 241 as shown in FIG. After the negative pressure is formed in the space, the upper surface of the adherend 10 may be supported by the first plate 230, and pressure may be added to the adhesive sheet 100 in the direction of the adherend 10.
  • a reaction force due to the adhesion to the first plate 230 is added to the upper surface of the adherend 10, and a pressure is added to the adhesive sheet 100 in the direction of the adherend 10, whereby the adherend 10 is added.
  • the lower surface of 10 may adhere to the first surface of the pressure sensitive adhesive sheet 100.
  • the reaction force by the adhesion to the first plate 230 can be effectively added, the adhesive sheet 100 and / Alternatively, the pressure added to the adherend 10 may be well transmitted in a direction toward each other such that the lower surface of the adherend 10 and the first surface of the adhesive sheet 100 may be in close contact with each other.
  • the adherend 10 may be brought into close contact with the adhesive sheet 100 without generation of particles, and a constant pressure may be applied to the entire surface of the adhesive sheet 100 and / or the entire surface of the adherend 10. Not only may it be added, but may be added at the same time so that the bottom surface of the adherend 10 may be stably (or effectively) adhered to the first side of the adhesive sheet 100.
  • air pressure for example, negative pressure
  • the pressure-sensitive adhesive device 200 of the present invention includes a first vent 281 for venting the space defined by the first plate 230, the support frame 210 and the first packing member 241; It may further include.
  • the first vent 281 may vent the space defined by the first plate 230, the support frame 210, and the first packing member 241.
  • the first plate 230 and the support frame 210 may be vented.
  • the vent may be opened and closed by a valve or the like.
  • the adherend 10 may be formed by performing negative pressure formation and aeration in a space defined by the first plate 230, the support frame 210, and the first packing member 241 (or in an appropriate order, number of times, and time). Lower surface and the first surface of the adhesive sheet 100 can be in close contact.
  • the adherend 10 may include a protrusion such as a protruding terminal 11a on a lower surface (or a contact surface with the adhesive sheet), and a lower surface of the adherend 10 and the first of the adhesive sheet 100.
  • a protrusion such as a protruding terminal 11a on a lower surface (or a contact surface with the adhesive sheet)
  • a lower surface of the adherend 10 and the first of the adhesive sheet 100 When the surface is in close contact with the protrusions on the lower surface of the adherend 10, even if the adhesive sheet 100 can be adhered to be adhered along the protrusion, the adhesive sheet 100 to be deformed along the protrusion It may be.
  • FIG. 9 is a conceptual view illustrating the pressurization through the first air pressure forming unit and the second air pressure forming unit according to another embodiment of the present invention.
  • FIG. 9 (b) shows a proximity state of the first air pressure forming portion and the second air pressure forming portion.
  • the adhesive device 200 may include a second plate 250 provided to face the first plate 230 in a second surface direction of the adhesive sheet 100 facing the first surface. ); And a gap adjusting part 260 for adjusting a gap between the first plate 230 and the second plate 250.
  • the second plate 250 may be provided (or disposed) to face the first plate 230 in the second surface direction (or side) of the adhesive sheet 100, and the first plate 230 and the second plate may be provided.
  • the support frame 210 may be positioned between the 250. Pressure may be applied to the adhesive sheet 100 in the direction of the second surface of the adhesive sheet 100 through the second plate 250, and the lower surface of the adherend 10 and the first surface of the adhesive sheet 100 may be applied. This can be effectively adhered and adhered.
  • the gap adjusting unit 260 may adjust a gap between the first plate 230 and the second plate 250, and closely contact the first plate 230 and the support frame 210 to the first packing member 241.
  • a space defined by the first plate 230, the support frame 210, and the first packing member 241 may be formed.
  • the upper surface of the adherend 10 may or may not be in contact with the first plate 230.
  • the second plate 250 may be in contact with the second surface of the adhesive sheet 100 through the gap adjusting unit 260 to directly press the second surface of the adhesive sheet 100, or the second plate 250 may be used.
  • the support frame 210 may be narrowed to add air pressure (eg, positive pressure) to the second surface of the adhesive sheet 100.
  • the adhesive device 200 may further include a second packing member 242 provided between the second plate 250 and the support frame 210, and the pressing unit 220 may include a second portion.
  • the plate 250, the support frame 210, and the second packing member 242 may include a second air pressure forming unit 222 that forms a positive pressure in a space defined by the second plate member 242.
  • the second packing member 242 may be provided between the second plate 250 and the support frame 210, may be in close contact with the second plate 250 and the support frame 210, and the second plate ( It is possible to prevent the gap between the 250 and the support frame 210 to allow air to enter and exit.
  • the second air pressure forming unit 222 may form a positive pressure in a space defined by the second plate 250, the support frame 210, and the second packing member 242.
  • the positive pressure may be a pressure higher than atmospheric pressure, it may be a pressure acting in the direction to compress the object surface.
  • the second air pressure forming unit 222 may include a gas supply unit supplying a gas such as air to a space defined by the second plate 250, the support frame 210, and the second packing member 242. Pressure may be applied in a direction compressing the second surface of the adhesive sheet 100 by forming a positive pressure in a space defined by the second plate 250, the support frame 210, and the second packing member 242. .
  • the pressure-sensitive adhesive sheet 100 and the adhesive 10 can be brought into close contact with the negative pressure formed in the space defined by the first plate 230, the support frame 210, and the first packing member 241.
  • the pressure may be provided and the second surface of the pressure sensitive adhesive sheet 100 may be pressed to allow air between the pressure sensitive adhesive sheet 100 and the lower surface of the adhesive 10 to escape well, thereby allowing the pressure sensitive adhesive sheet 100 and Fine bubbles may be prevented from occurring between the lower surfaces of the adherend 10, and the adhesive sheet 100 and the adherend 10 may be adhered to each other more effectively.
  • the lower surface of the adherend 10 and the adhesive sheet 100 By bringing the first surface of the sheet into close contact with each other, the lower surface of the adherend 10 can be brought into close contact with the first surface of the adhesive sheet 100 without damaging the adherend 10 such as cracks and generating particles.
  • air pressure for example, negative pressure and positive pressure
  • the pressure-sensitive adhesive device 200 of the present invention further includes a second vent 282 through the space defined by the second plate 250, the support frame 210 and the second packing member 242; can do.
  • the second vent 282 may vent a space defined by the second plate 250, the support frame 210, and the second packing member 242.
  • the second plate 250 and the support frame 210 may be vented.
  • Air (or gas) can be discharged (or exhausted) from the space to be used.
  • the vent may be opened and closed by a valve or the like.
  • the lower surface of the adherend 10 and the adhesive sheet 100 may be formed by appropriately forming positive pressure and aeration in a space defined by the second plate 250, the support frame 210, and the second packing member 242. One side can be stuck more effectively.
  • FIG. 10 is a perspective view showing a pressure-sensitive adhesive device including a support piece and a gap adjusting portion according to another embodiment of the present invention.
  • the pressure-sensitive adhesive device 200 extends toward the other one of the edges of one of the first plate 230 and the second plate 250, and is bent inwardly to support the frame 210.
  • the support piece 243 for supporting) may be further included, and the insertion groove 244 may be formed in the other one corresponding to the support piece 243.
  • the support piece 243 extends toward the other one of the edges of one of the first plate 230 and the second plate 250 and may be bent inward, and may be configured in plural and spaced apart from each other. Can be.
  • the support piece 243 may support the support frame 210 at the time of loading the support frame 210, the support frame 210 and the other one (for example, the second plate).
  • the support piece 243 may support the edge of the support frame 210, and provides a space for the transport device (not shown) such as an end effector to seat and exit the support frame 210. can do.
  • An insertion groove 244 may be formed in the other one corresponding to the support piece 243, and the insertion groove 244 may correspond to the position, the shape, and the size of the support piece 243 and the first plate 230.
  • the support piece 243 may be inserted in the proximity of the second plate 250. Accordingly, the first plate 230 and the support frame 210 may be in close contact with the first packing member 241 without interfering with the support piece 243, and the second plate 250 may be attached to the second packing member 242. ) And the support frame 210 may be in close contact.
  • FIG. 11 is a conceptual view illustrating a support piece and a gap adjusting unit according to another embodiment of the present invention, in which FIG. 11 (a) shows before the second plate is raised and FIG. 11 (b) is after the second plate is raised. Indicates.
  • the support frame 210 may be transferred between (or between) the support piece 243 and the other one by adjusting the gap between the first plate 230 and the second plate 250. That is, when the support piece 243 is inserted into the insertion groove 244 by adjusting the gap between the first plate 230 and the second plate 250, the support frame 210 is formed at the support piece 243. Can be passed to the other. When the first plate 230 and the second plate 250 are close to each other, the support piece 243 may be inserted into the insertion groove 244, and the support piece 243 is inserted into the insertion groove 244. The support frame 210 may be transferred from the support piece 243 onto the other one.
  • the support frame 210 may be transferred onto the first packing member 241 or the second packing member 242 supported by the other one.
  • the first plate 230 and the support frame 210 are in close contact with the first packing member 241 to be defined by the first plate 230, the support frame 210, and the first packing member 241.
  • the second plate 250 and the support frame 210 may be in close contact with the second packing member 242 to the second plate 250, the support frame 210, and the second packing member 242.
  • the space defined by may be formed.
  • the support piece 243 when the support piece 243 is formed at one edge of the first plate 230 and the second plate 250, the lower portion of the first plate 230 and the second plate 250 is formed.
  • the distance between the first plate 230 and the second plate 250 may be adjusted only by the other lifting, and the support frame 210 supported by the support piece 243 may be transferred onto the other one below. Can be.
  • the gap adjusting unit 260 may be configured in the form of a lifting device, as shown in FIGS.
  • the space adjusting unit 260 in the form of a lift device is connected to the second plate 250 to elevate the second plate 250, thereby reducing the distance between the first plate 230 and the second plate 250. I can regulate it.
  • the adhesive device 200 of the present invention includes an upper plate on which one of the first plate 230 and the second plate 250 is supported (or fixed) and a sidewall plate supporting the upper plate.
  • the housing 291 may include the upper plate on which one of the first plate 230 and the second plate 250 is supported, and the sidewall plate supporting the upper plate, and the first plate ( The space between the 230 and the second plate 250 may be adjusted.
  • the upper plate may be supported by any one of the upper of the first plate 230 and the second plate 250, the edge of any one of the upper of the first plate 230 and the second plate 250
  • the support frame 210 may be supported by the support piece 243 formed in the support piece 243.
  • the side wall plate may support the upper plate and may provide a height at which a distance between the first plate 230 and the second plate 250 is adjusted.
  • the support table 292 may support the other one of the lower one of the first plate 230 and the second plate 250 and / or the housing 291, and in the form of an elevator in the center of the support table 292.
  • the gap adjusting part 260 may be provided to elevate the other one of the lower parts of the first plate 230 and the second plate 250.
  • FIG. 12 is a conceptual diagram illustrating a pattern plate according to another embodiment of the present invention.
  • a pattern hole that can accommodate the adherend 10 is formed, and a pattern plate 270 provided between the first surface of the adhesive sheet 100 and the first plate 230. It may further include;
  • the pattern plate 270 may have a pattern hole to accommodate the adherend 10, and may be provided to face the first plate 230 in a first surface direction of the adhesive sheet 100, and may be provided with an adhesive sheet. It may be located between the first surface of the (100) and the first plate 230.
  • the adherend 10 may be accommodated in the pattern hole, and a pattern line of the pattern plate 270 forming the sidewall of the pattern hole may be provided around (or around) the adherend 10.
  • a pattern line of the pattern plate 270 may be provided between the adherends 10.
  • the pattern plate 270 may have a pressure-sensitive adhesive sheet 100 around the adherend 10 on which the adherend 10 is not placed when pressure is applied to the pressure-sensitive adhesive sheet 100 in the direction of the adherend 10. To prevent it from rising. Thereby, the adhesive sheet 100 can be suppressed or prevented from rising up along the side of the adherend 10 and adhering to the side of the adherend 10.
  • an electromagnetic wave shielding film may not be deposited on the side of the adherend 10 to which the adhesive sheet 100 is attached, and is not deposited. In this case, a gap of the electromagnetic wave shielding film is generated so that the electromagnetic wave emitted from the adherend 10 cannot be shielded.
  • a weak pressure is applied to suppress or prevent the adhesion of the adhesive sheet 100 to the side of the adherend 10
  • the adhesion between the lower surface of the adherend 10 and the adhesive sheet 100 is
  • the electromagnetic wave shielding film is deposited on the adherend 10 such as a semiconductor package, the deposition material penetrates into the gap between the bottom edge of the adherend 10 and may be deposited on the bottom surface of the adherend 10. have.
  • the pattern plate 270 may have a thickness thinner than the adherend 10.
  • the pattern plate 270 may be formed on the adhesive sheet 100 at the periphery (or circumference) of the adherend 10. It can prevent the pressure-sensitive adhesive sheet 100 is in close contact with the bottom edge of the adherend 10 by blocking the pressure added in the direction, and thus the adhesion of the adhesive sheet 100 to the bottom edge of the adherend 10 This may not be achieved, and when the electromagnetic wave shielding film or the like is deposited on the adherend 10, such as a semiconductor package, the deposition material may be formed in the gap between the bottom surface of the adherend 10. It may be deposited on the lower surface. In this case, deposition contamination may occur on the lower surface of the adherend 10, so that the quality of the adherend 10, such as a semiconductor package, may be deteriorated, and the yield may be deteriorated.
  • the pattern hole may have a shape spaced apart (or largely processed) by 0.1 to 2 mm (or about 0.5 mm) from the edge of the adherend 10.
  • the interval of the adherend 10 may be 1 to 3 mm (or about 2 mm)
  • the interval of the pattern hole may be 0.5 to 2 mm (or about 1 mm).
  • the size of the pattern hole is the same as the size of the adherend 10, an area to which the adhesive sheet 100 is adhered may disappear, but the pattern hole is 0.1 mm or more from the edge of the adherend 10.
  • precision loading is required to accommodate the adherend 10 in the pattern hole, so that expensive processing equipment for high precision loading or long processing time is required for precision loading. .
  • the pattern line of the pattern plate 270 moves away from the periphery of the adherend 10 and the adherend 10 ).
  • the effect of preventing the adhesive sheet 100 from rising up may be reduced, and the number of the pattern holes that may be formed in one pattern plate 270 is limited to one support frame 210.
  • the number of adherends 10 provided on the supported adhesive sheet 100 may be reduced (or limited).
  • the adherend 10 may be a semiconductor package including at least one protruding terminal 11a on one surface thereof, and the adhesive sheet 100 may be attached to the semiconductor package so that the protruding terminal 11a is in contact with one surface thereof.
  • the adherend 10 may be a semiconductor package including at least one protruding terminal 11a on one surface thereof, and the protruding terminal 11a may be a land-shaped metal electrode or a solder ball.
  • the semiconductor package may include a ball grid array (BGA) in which a plurality of solder balls are arranged in a matrix on a lower surface thereof, or a land grid array in which metal electrodes in a land form are arranged in a matrix form.
  • Array; LGA may be a semiconductor package, a metal film (ie, electromagnetic shielding film) for shielding the electromagnetic wave by a sputtering process or the like may be formed on the side surfaces and the upper surface of the semiconductor package after being adhered to the adhesive sheet 100 have.
  • the adhesive sheet 100 may be an electronic component carrier sheet (eg, a semiconductor package carrier sheet), and may include an adhesive layer 110 and a strain holding layer 120.
  • the electronic component carrier sheet may serve to firmly fix the semiconductor package to a first surface (or an upper surface), and a plurality of the semiconductor packages may be arranged in a compact size in one electronic component carrier sheet.
  • the semiconductor package may be mounted on the transfer tray 40 to perform a sputtering process, and a metal film may be formed on the bottom surface of the semiconductor package by the electronic component carrier sheet. Instead, the metal film may be formed to shield the electromagnetic waves only on the side surfaces and the upper surface of the semiconductor package.
  • the electronic component carrier sheet may include at least one layer having magnetic properties.
  • magnetic means a property of being attached to a magnet body such as an electromagnet, a permanent magnet, and forms a separate magnetic layer on the electronic component carrier sheet or magnetically on at least one of the adhesive layer 110 and the strain holding layer 120. It may contain (or include) a substance (or magnetic powder).
  • the electronic component carrier sheet may be in close contact with the susceptor by the magnetic force provided from the magnet portion of the susceptor in the sputtering apparatus during the sputtering process.
  • the semiconductor layer may be attached (or adhered) to the adhesive layer 110 such that the protruding terminal 11a contacts one surface thereof.
  • the adhesive layer 110 adheres and fixes the ball grid array (BGA) semiconductor package or the land grid array (LGA) semiconductor package until the sputtering process is completed, and after the sputtering process, the electronic component carrier sheet
  • the semiconductor package may be attached to the semiconductor package to facilitate the detachment of the semiconductor package.
  • the adhesive layer 110 may be formed by processing a liquid adhesive material having adhesiveness into a film form.
  • the adhesive material may include a silicon-based adhesive material, and the present invention is not limited thereto.
  • the adhesive material constituting the adhesive layer 110 may include various materials in addition to the silicone-based adhesive material.
  • the strain holding layer 120 may be provided on the other surface of the adhesive layer 110 to which the semiconductor package is attached, and may be bonded to the adhesive layer 110, and may be bonded to the pressure (or external pressure). By this, plastic deformation can be performed along the protruding terminal 11a. That is, the strain holding layer 120 may have a feature in which the shape is not restored after the plastic deformation through the deformation of the shape along the protruding terminal 11a by the pressure through the pressing unit 220.
  • the strain holding layer 120 may be formed of a nonmagnetic metal material which is not restored after being processed, and may be formed in the form of a nonmagnetic metal sheet or a nonmagnetic metal film having a thin thickness.
  • the strain retaining layer 120 may be formed of a non-magnetic metal material that can be easily processed to a very thin thickness due to the ductility and excellent workability, and may pass through a magnetic field.
  • a non-magnetic metal material that can be easily processed to a very thin thickness due to the ductility and excellent workability, and may pass through a magnetic field.
  • the strain holding layer 120 may be deformed by a pressure applied to the adhesive layer 110 while the protrusion terminal 11a of the semiconductor package is tightly fixed to the adhesive layer 110. After plastic deformation, it may not be restored to its original shape. In this case, the material and the thickness of the strain holding layer 120 may be important in order to improve the handling while preventing the shape from being restored after the shape of the strain holding layer 120 is deformed. When the thickness of the strain holding layer 120 is too thin, it may be very easily torn or broken, and handling may be very difficult. On the contrary, when the thickness of the strain holding layer 120 is too thick, the strain holding layer 120 may have a protruding terminal 11a. Even when the pressure is applied thereto, the shape may not be accurately deformed along the shape of the protruding terminal 11a.
  • the pressure may be equal to or higher than the yield value at which the plastic deformation of the strain maintaining layer 120 is possible. That is, the pressing unit 220 may add a pressure equal to or higher than a yield value at which the strain holding layer 120 may be plastically deformed to at least one of the adhesive sheet 100 and the adherend 10.
  • the pressure less than the yield value at which the strain holding layer 120 is plastically deformed is applied to at least one of the adhesive sheet 100 and the adherend 10
  • the yield value at which the plastic deformation is possible at the strain holding layer 120. Since the above pressure is not applied, the strain holding layer 120 may not be plastically deformed, and may be restored to its original shape.
  • the bottom surface of the adherend 10 may not be adhered to the adhesive sheet 100 to be adhered, and a lifting phenomenon may occur between the adhesive sheet 100 and the bottom surface of the adherend 10.
  • deposition contamination occurs on the lower surface of the adherend 10 such as a semiconductor package, so that the quality of the adherend 10 may be deteriorated and the yield may decrease.
  • the pressing unit 220 may apply a pressure equal to or greater than a yield value at which the strain holding layer 120 may be plastically deformed to at least one of the adhesive sheet 100 and the adherend 10, and the protruding terminal 11a.
  • the deformation-retaining layer 120 may be plastically deformed along the shape of the adhesive retaining layer 120 so that the lower surface of the adherend 10 adheres to the adhesive sheet 100 and adheres to the adhesive sheet 100. The lifting phenomenon generated between the bottom surface of the 100 and the adherend 10 can be prevented.
  • FIG. 13 is a schematic view showing a pressure-sensitive adhesive device including a pressing portion in the form of a roller according to another embodiment of the present invention.
  • the pressing unit 220 is provided in a second surface direction of the adhesive sheet 100 facing the first surface, and forms a flexible material or brush that presses the second surface of the adhesive sheet 100. It may include a roller.
  • the roller may be provided to face at least a portion of the first plate 230 and / or the support frame 210 in the second surface direction of the adhesive sheet 100 facing the first surface, and the adhesive sheet 100.
  • the second side of the) may be pressed, and may be made of a soft material or in the form of a brush.
  • the upper surface of the adherend 10 may be supported by the first plate 230.
  • the pressure sensitive adhesive sheet 100 may be torn due to the excessively strong pressing force, such as the protruding terminal 11a of the adherend 10.
  • the adhesive sheet 100 may be made of a flexible material or made of a brush so that the adhesive sheet 100 may be adhered by being adhered to the protruding terminal 11a or the like. Through this, the pressing force for pressing the second surface of the adhesive sheet 100 can be evenly distributed according to the shape of the lower surface (or lower portion) of the adherend 10, whereby the adhesive sheet 100 is stably pressed to protrude. While preventing the adhesive sheet 100 from being torn or broken, the adhesive sheet 100 may be adhered along the protruding terminal 11a or the like to prevent the adhesive sheet 100 from being torn or broken.
  • Adhesive method is a step of supporting the adhesive sheet to the support frame (S100); Attaching the adherend on the first surface of the adhesive sheet (S200); Disposing the support frame such that the first surface of the adhesive sheet faces the first plate (S300); And pressing at least one of the adhesive sheet and the adherend (S400).
  • the adhesive sheet is supported on the support frame (S100).
  • the adhesive sheet may be supported by the support frame, and may be formed in a hollow shape by opening a central portion to form a hole therein.
  • the adhesive sheet may be attached to the support frame to be supported, and the edge of the first surface of the adhesive sheet may be attached to the bottom surface (or the second surface) of the support frame.
  • the adhesive sheet may be attached to a position by cutting the adhesive sheet in advance in a size corresponding to the support frame, but the adhesive frame is attached to fill the inner circumference of the support frame. It may be desirable to cut the outer edge of the adhesive sheet in accordance with the size of the.
  • the adhesive material is temporarily attached on the first surface of the adhesive sheet (S200).
  • the adherend may be temporarily attached onto the first surface of the adhesive sheet, and the adherend may be provided corresponding to a central portion of the support frame in which holes are formed among the first surfaces of the adhesive sheet. Can be configured.
  • the adherend may be seated on the first surface of the pressure-sensitive adhesive sheet at a predetermined interval so that the bottom surface (or the second surface) of the adherend may be temporarily attached to the first surface of the pressure-sensitive adhesive sheet, and the picker It may be desirable to automatically arrange at a predetermined interval through a transfer module (not shown), such as).
  • the support frame is disposed such that the first surface of the adhesive sheet faces the first plate (S300).
  • the support frame may be disposed so that the first surface of the pressure sensitive adhesive sheet faces the first plate, and the upper surface (or the first surface of the pressure sensitive adhesive material so as to transfer pressure well to the pressure sensitive adhesive sheet and / or the adherend. 1 side) can be supported on the first plate.
  • At least one of the adhesive sheet and the adherend is pressed (S400). Pressure may be added (or pressed) to at least one of the adhesive sheet and the adherend in a direction facing each other, thereby allowing the adhesive sheet and the adherend to adhere to each other, The adherend temporarily attached on the first surface may be adhered to the first surface of the adhesive sheet.
  • the adhesion method according to the present invention may further include a step (S361) of closely contacting the first packing member, the first plate, and the support frame provided between the first plate and the support frame.
  • Pressing (S400) may include a step (S410) of forming a negative pressure in the space defined by the first plate, the support frame and the first packing member.
  • the first packing member, the first plate, and the support frame provided between the first plate and the support frame may be in close contact with each other (S361).
  • the first plate and the support frame may be in close contact with the first packing member provided between the first plate and the support frame, and a gap through which air may enter and exit between the first plate and the support frame. (gap) can be prevented from occurring. This may form a space defined by the first plate, the support frame and the first packing member, the height of the adherend between the first plate and the support frame through the first packing member. You can also secure.
  • a negative pressure (or a vacuum or a negative pressure) may be formed in a space defined by the first plate, the support frame, and the first packing member (S410).
  • the negative pressure may be a pressure lower than atmospheric pressure (or normal pressure), and may be a suction force applied in a direction of sucking the object on the surface of the object.
  • a negative pressure may be formed through a vacuum pump, and a negative pressure is formed in a space defined by the first plate, the support frame, and the first packing member, so that an upper surface of the adherend is formed on the first surface. It can be supported by the plate, it can be added to the pressure-sensitive adhesive sheet in the direction of the adherend (or suction force).
  • a reaction force due to the adhesion to the first plate is added to the upper surface of the adherend, and pressure is added to the adherend sheet in the direction of the adherend, whereby the lower surface of the adherend adheres to the first surface of the adhesive sheet. It may be adhered to the surface and adhered.
  • the relatively flat upper surface of the adherend is supported on the first plate, whereby reaction force due to the adhesion to the first plate can be effectively added, and is added to the adhesive sheet and / or the adherend
  • the pressure is well transmitted in the direction toward each other, the lower surface of the adherend and the first surface of the pressure-sensitive adhesive sheet may be in close contact.
  • the adherend may be adhered to the adhesive sheet without damaging the adherend such as cracks and generating particles.
  • the adhesive method according to the present invention may further include adjusting a distance between the second plate and the first plate disposed to face the second surface of the adhesive sheet facing the first surface (S360). .
  • a distance between the second plate and the first plate disposed to face the second surface of the adhesive sheet facing the first surface may be adjusted (S360).
  • the distance between the first plate and the second plate can be adjusted, and the first plate and the support frame are in close contact with the first packing member to be defined by the first plate, the support frame and the first packing member. It can form a space to be.
  • an upper surface of the adherend may contact the first plate, and after contact with the first plate, the upper surface of the adherend may be It may be in contact with the first plate.
  • the second plate may be brought into contact with the second surface of the adhesive sheet by adjusting the gap between the first plate and the second plate to directly press the second surface of the adhesive sheet.
  • An air pressure may be added to the 2nd surface of the said adhesive sheet by narrowing the space
  • the adhesive method according to the present invention further comprises a step (S362) of closely contacting the second packing member, the second plate and the support frame provided between the second plate and the support frame;
  • Process S400 may further include forming a static pressure in a space defined by the second plate, the support frame, and the second packing member (S420).
  • the second packing member, the second plate, and the support frame provided between the second plate and the support frame may be in close contact with each other (S362).
  • the second plate and the support frame may be in close contact with the second packing member provided between the second plate and the support frame, and a gap for allowing air to enter and exit between the second plate and the support frame. This can be prevented from occurring.
  • a static pressure may be formed in a space defined by the second plate, the support frame, and the second packing member (S420).
  • the positive pressure may be a pressure higher than atmospheric pressure, it may be a pressure acting in the direction to compress the object surface.
  • a positive pressure (or air pressure) may be formed through a gas supply unit, and a positive pressure is formed in a space defined by the second plate, the support frame, and the second packing member to compress the second surface of the adhesive sheet. Pressure can be added.
  • This may provide a sufficient pressure to adhere the adhesive sheet and the adherend together with the negative pressure formed in the space defined by the first plate, the support frame and the first packing member, and the adhesive sheet
  • the adhesive method according to the present invention may further include a step (S350) of providing a pattern plate having a pattern hole to accommodate the adherend on the first surface of the adhesive sheet.
  • a pattern plate on which the pattern hole may be accommodated may be provided on the first surface of the adhesive sheet (S350).
  • the pattern plate may have a pattern hole to accommodate the adherend, and may be provided on the first surface of the adhesive sheet to face the first plate, and may be closer to the support frame than the first plate. Can be located.
  • the adherend may be accommodated in the pattern hole, and a pattern line of the pattern plate forming sidewalls of the pattern hole may be provided around the adherend, and the adherend may include a plurality of adherends. In this case, a pattern line of the pattern plate may be provided between the adherends.
  • the pattern plate may prevent the adhesive sheet from rising up around the adherend on which the adherend is not placed when pressure is applied to the adhesive sheet in the direction of the adherend. Accordingly, the pressure-sensitive adhesive sheet can be prevented from being raised along the side of the adherend and adhered to the side of the adherend.
  • the adherend may be a semiconductor package including at least one protruding terminal on one surface thereof, and the adhesive sheet may include an adhesive layer to which the semiconductor package is attached to contact the protruding terminal on one surface thereof; And a strain holding layer provided on the other surface facing the one surface of the adhesive layer and plastically deformed along the protruding terminal by pressure. That is, the adhesion method may be an adhesion method for protecting the electrode of the semiconductor package.
  • the adherend may be a semiconductor package including at least one protruding terminal on one surface thereof, and the protruding terminal may be a metal electrode or a solder ball having a land shape.
  • the semiconductor package may be a ball grid array (BGA) semiconductor package in which a plurality of solder balls are arranged in a matrix on a lower surface, or a land grid array (LGA) semiconductor package in which metal electrodes in a land form are arranged in a matrix.
  • BGA ball grid array
  • LGA land grid array
  • the metal film may be formed on the side surfaces and the upper surface of the semiconductor package after being adhered to the adhesive sheet to shield electromagnetic waves by a sputtering process.
  • the adhesive sheet may be an electronic component carrier sheet (eg, a semiconductor package carrier sheet), and may include the adhesive layer and the strain holding layer.
  • the electronic component carrier sheet may serve to tightly fix the semiconductor package to the first surface, and a plurality of the semiconductor packages may be arranged in a compact size in one electronic component carrier sheet.
  • the semiconductor package may be mounted on the transfer tray 40 to perform a sputtering process, and a metal film may be formed on the bottom surface of the semiconductor package by the electronic component carrier sheet. Instead, the metal film may be formed to shield the electromagnetic waves only on the side surfaces and the upper surface of the semiconductor package.
  • the adhesive layer may be attached (or adhered) to the semiconductor package such that the protruding terminal contacts one surface thereof.
  • the adhesive layer adheres and fixes the ball grid array (BGA) semiconductor package or the land grid array (LGA) semiconductor package until the sputtering process is completed, and after the sputtering process, the semiconductor in the electronic component carrier sheet It may serve to adhere the semiconductor package to facilitate the detachment of the package.
  • the adhesive layer may be formed by processing a flowable adhesive material having adhesiveness into a film form.
  • the adhesive material may include a silicon-based adhesive material, and the present invention is not limited thereto.
  • the adhesive material constituting the adhesive layer may include various materials in addition to the silicone-based adhesive material.
  • the strain holding layer may be provided on the other side of the adhesive layer to which the semiconductor package is adhered, and may be bonded to the adhesive layer, and may be fired along the protruding terminal by pressure (or external pressure). It can be modified. That is, the strain holding layer may have a feature that the shape is not restored after the plastic deformation after the shape is deformed along the protruding terminal by pressure.
  • the strain holding layer is fired by pressing against at least one of the adhesive sheet and the adherend (or pressure for pressing at least one of the adhesive sheet and the adherend) in the pressing step (S400). It can be modified.
  • a pressure equal to or higher than a yield value at which plastic deformation of the strain holding layer is possible may be added to at least one of the adhesive sheet and the adherend.
  • the pressure at least a yield value at which plastic deformation is possible may not be applied to the strain holding layer.
  • the holding layer cannot be plastically deformed and can be restored to its original shape. In this case, the bottom surface of the adherend may not be adhered to the pressure sensitive adhesive sheet, and thus a lifting phenomenon may occur between the pressure sensitive adhesive sheet and the bottom surface of the adherend.
  • a pressure equal to or higher than a yield value at which plastic deformation of the strain retaining layer is possible may be applied to at least one of the adhesive sheet and the adherend, and the strain retaining layer may be plastically deformed along the shape of the protruding terminal, thereby The lower surface of the adhesive may be adhered to the adhesive sheet to be adhered, and the lifting phenomenon generated between the adhesive sheet and the lower surface of the adherend may be prevented.
  • FIG. 14 is a cross-sectional view showing a thin film forming apparatus according to still another embodiment of the present invention.
  • a thin film forming apparatus will be described in detail with reference to FIG. 14, which is described above with reference to an electronic component carrier sheet and an adhesive device according to another embodiment of the present invention. Duplicate parts that are described are omitted.
  • the thin film forming apparatus provides a deposition material 21 for forming the thin film 20 on the deposition target (D) including the adhesive sheet 100 having a magnetic layer is provided.
  • Deposition material providing unit 300 and a susceptor 400 for supporting the deposition target D, wherein the susceptor 400 includes: a magnet plate 410 for providing attraction to the adhesive sheet 100; And it may include a cooling unit 420 for cooling the adhesive sheet 100.
  • the deposition material providing unit 300 may provide a deposition material 21 for forming the thin film 20 on the deposition target D including the adhesive sheet 100 having a magnetic layer.
  • the adhesive sheet 100 may be an electronic component carrier sheet 100 to which the electronic component 10 is attached (or fixed), and may be an electronic component carrier sheet 100 according to an embodiment of the present invention.
  • the deposition material providing unit 300 may include a spray method, a dipping method, a sputtering method, a thermal deposition or a thermal evaporation method, a chemical vapor deposition (CVD); Physical and chemical) such as) may be provided a deposition material 21 for forming the thin film 20 on the deposition target (D) in at least one method selected from all deposition methods.
  • the deposition material providing unit 300 is disposed on the susceptor 400 to provide the deposition material 21 for forming the thin film 20 on the deposition target D including the adhesive sheet 100.
  • the deposition target D may include not only the adhesive sheet 100 but also the electronic component 10 adhered to the adhesive sheet 100, and the deposition material providing unit 300 is exposed to the electronic component 10.
  • the deposition material 21 may be provided on the surface to form the thin film 20.
  • the thin film 20 formed by the deposition material providing unit 300 may be an electromagnetic shield (Electro Magnetic Interference (EMI)) shielding film for shielding the electromagnetic waves emitted from the electronic component 10, the exposure of the electronic component 10
  • EMI Electro Magnetic Interference
  • a metal material may be provided by the deposition material 21 to form a metal film.
  • the deposition material providing unit 300 may release the deposition material 21 from the target made of a metal material by the sputtering method and provide the deposition material 21 on the deposition target D such as the adhesive sheet 100.
  • the deposition material providing unit 300 is sprayed on the deposition material 21 provided on the deposition target (D)
  • the deposition material providing unit 300 may provide the deposition material 21 solution to the container.
  • the thin film 20 may be not only an EMI shielding film but also various coating films selectively formed (or coated) on the surface of the insulating film or the electronic component 10.
  • the susceptor 400 may support the deposition object D to contact the deposition surface 21 of the deposition object D with the deposition material 21 as a chuck module.
  • the susceptor 400 may be disposed under the deposition material providing unit 300 and may seat the deposition target D, such as the adhesive sheet 100.
  • the susceptor 400 may include a magnet plate 410 for providing an attractive force to the adhesive sheet 100 and a cooling unit 420 for cooling the adhesive sheet 100.
  • the magnet plate 410 may provide (or generate) an attractive force to the adhesive sheet 100 having a magnetic layer as a magnetic force generated by a magnet such as an electromagnet or a permanent magnet.
  • the magnetic force generated in the magnet plate 410 may generate attraction force in the magnetic layer (eg, the magnetic layer) of the adhesive sheet 100, whereby the adhesive sheet 100 closely adheres to the susceptor 400. Can be.
  • the cooling unit 420 is the adhesive sheet 100 and / or the magnet plate 410 in close contact with the magnet plate 410 and / or susceptor 400 by the attraction force due to the magnetic force generated in the magnet plate 410 Can be cooled.
  • the cooling unit 420 may be disposed (or installed) in contact with the magnet plate 410 outside the magnet plate 410, or may be installed (or disposed) inside the magnet plate 410.
  • the cooling unit 420 may quickly cool the heat applied to the electronic component 10 during the thin film forming process such as sputtering, and the adhesive sheet 100 adhered to the magnet plate 410 of the susceptor 400. Through this, the electronic component 10 may be cooled.
  • the adhesive sheet 100 may be an electronic component carrier sheet 100, and the deposition target D may further include an electronic component 10 attached to (or adhered to) the electronic component carrier sheet 100,
  • the thin film forming apparatus according to the present invention can form the thin film 20 only on the exposed surface of the electronic component 10. In the present invention, a portion of the surface of the electronic component 10 that is not desired to form the thin film 20 may be sealed by the electronic component carrier sheet 100 so that the thin film 20 may not be formed.
  • the thin film 20 may be selectively formed only on the exposed surface of which the thin film 20 is desired to be formed.
  • the thin film forming apparatus of the present invention may be a sputtering apparatus, and includes a chamber (not shown) for providing an accommodation space in which a sputtering process is performed; A sputtering cathode disposed inside the chamber (not shown); And a plasma generator (not shown) for generating a plasma in the chamber (not shown).
  • a vacuum pressure is formed inside the chamber (not shown) and a high temperature environment for a sputtering process may be formed.
  • the susceptor 400 may be disposed as a chuck module at a lower portion of the chamber (not shown), and the sputtering cathode may be disposed as a deposition material providing unit 300 at an upper portion spaced apart from the susceptor 400.
  • the plasma generation unit may generate a plasma region between the sputtering cathode and the susceptor 400 to form a plasma region, and the ions generated by the plasma strike the target of the sputtering cathode.
  • the deposition material 21 may be separated from the target of the sputtering cathode.
  • the deposition material 21 separated from the target of the sputtering cathode is deposited on the exposed surface of the electronic component 10 attached (or mounted) on the adhesive sheet 100 to form a thin film 20 such as a metal film. Can be.
  • the cooling unit 420 may be disposed on the susceptor 400, and magnetic force may be applied to the upper surface of the cooling unit 420.
  • the generating magnet plate 410 may be disposed.
  • the magnet plate 410 may be a magnetic force generated by a magnetic material irrespective of elasticity and inelasticity, and the magnetic force generated in the magnet plate 410 may generate attraction force in the magnetic layer of the adhesive sheet 100. have.
  • the adhesive sheet 100 may be in close contact with the magnet plate 410 and cooled by the cooling unit 420.
  • the electronic component 10 may be maintained at a temperature of 90 ° C. or less from normal temperature, and the thin film 20 may be deposited.
  • the susceptor 400 may be made of a material having a support surface on which the deposition target D is supported.
  • the adhesion between the contact surface (eg, bottom surface) of the deposition target D, such as the adhesive sheet 100, and the support surface of the susceptor 400 may be improved. Accordingly, heat in the deposition target D may be transferred to the susceptor 400 well, and cooling efficiency through the cooling unit 420 may be improved.
  • the susceptor 400 may further include an elastic layer (not shown) provided between the magnet plate 410 and the deposition target D.
  • the elastic layer (not shown) may be formed of a material having elasticity, and may improve adhesion between the magnet plate 410 and the deposition target D. Accordingly, heat in the deposition target D may be transferred to the susceptor 400 well, thereby improving cooling efficiency through the cooling unit 420.
  • the adhesive sheet 100 is in close contact with the susceptor 400 by the magnetic force by the magnet plate 410, the adhesive sheet 100 and the susceptor 400 by the elasticity of the elastic layer (not shown). The area of the contact surface of can be further increased.
  • the elastic layer (not shown) may be formed of at least one of silicon, an adhesive, a fiber glass sheet, and a graphite sheet.
  • the magnet plate 410 may include a stage 411 for supporting the deposition target (D), and a magnet body layer 412 provided inside the stage.
  • the stage itself may be made of a material having elasticity or the elastic layer (not shown) made of a material having elasticity may be formed on the stage to provide a support surface on which the deposition target D is supported.
  • the magnet plate 410 may be formed by the magnet body layer itself and may have direct elasticity, and the elastic layer (not shown) made of a material having elasticity is formed on the magnet plate 410 to deposit the object (D). It is also possible to provide this supported support surface.
  • the support surface on which the deposition target D of the susceptor 400 is supported may be made of a material having elasticity.
  • FIG. 15 is a schematic view of a thin film forming apparatus according to another embodiment of the present invention.
  • the magnet plate 410 may include a stage 411 for supporting the deposition target D; And a magnet body layer 412 installed on the stage 411 and including a plurality of unit magnets 41 arranged along the stage 411, wherein the cooling unit 420 is formed inside the stage 411. Is formed in, may include a cooling passage 421 for providing a flow path of the refrigerant for cooling the deposition object (D).
  • the adhesive sheet 100 may include a magnetic layer, have at least one magnetic layer, and the electronic component 10 may be attached to an upper surface of the adhesive sheet 100.
  • the adhesive sheet 100 includes an adhesive layer 110 to which the electronic component 10 is attached to the upper surface; And a strain holding layer 120 provided between the adhesive layer 110 and the magnetic layer 130 and plastically deforming by an external pressure (for example, a pressure to which the electronic component is attached). .
  • the adhesive layer 110 is formed by processing a tacky adhesive material in the form of a film.
  • the adhesive layer 110 may be formed of a silicon-based material, and the adhesive layer 110 may be formed on, for example, a LGA (Land Grid Array) semiconductor package having a land-shaped metal electrode on a lower surface thereof.
  • the electronic component 10, such as a ball grid array (BGA) semiconductor package having solder balls, is attached until the deposition process is completed, and the electronic component 10 having the deposition process is completed is an adhesive layer 110. It can be easily separated from.
  • BGA ball grid array
  • the strain holding layer 120 is provided under the adhesive layer 110, and is plastically deformed by external pressure, for example, plastically deformed along the terminal 11a protruding from the semiconductor package 11. That is, after the shape of the strain holding layer 120 is deformed by external pressure, the deformed shape may not be restored.
  • the strain holding layer 120 may be formed of a metal material having malleability, that is, malleability and ductility, and may be formed of aluminum, an aluminum alloy, copper, and a copper alloy having excellent workability.
  • the strain holding layer 120 is pressed by the metal electrode or the solder ball to deform the shape thereof,
  • the deformation retaining layer 120 having the shape deformed in this way is lifted between the adhesive layer 110 and the lower surface of the semiconductor package 11 by holding and fixing the solder ball of the metal electrode of the LGA semiconductor package or the BGA semiconductor package therein ( gap) prevents the occurrence of the phenomenon.
  • the strain holding layer 120 is formed of a metal material having high thermal conductivity, heat transferred from the semiconductor package 11 is absorbed by the strain holding layer 120 to be described later. Will be delivered. That is, the strain holding layer 120 prevents the lifting phenomenon between the adhesive layer 110 and the lower surface of the semiconductor package 11 and has a high thermal conductivity, so that heat generated from the semiconductor package 11 is adhered to the adhesive layer 110. Through) to be effectively transmitted to the magnetic layer 130 and the susceptor 400. Accordingly, the thin film forming apparatus according to the embodiment of the present invention can quickly cool the semiconductor package 11 exposed to a high temperature environment during a deposition process such as a sputtering process, and thus is disposed in the semiconductor package 11. The semiconductor chip can be prevented from being damaged by high temperature heat, and the semiconductor package 11 can be prevented from bending.
  • the magnetic layer 130 is provided below the strain maintaining layer 120, and may further include a base film 140 disposed below the magnetic layer 130 to support the magnetic layer 130.
  • the base film 140 may be a support layer supporting the magnetic layer 130 or the like.
  • the magnetic means a property that is attached to a magnet, such as an electromagnet, a permanent magnet
  • the magnetic layer 130 may be prepared by mixing a magnetic powder having a magnetic powder and a binder, the adhesive layer 110, the strain holding layer 120
  • the magnetic powder may be contained in each layer, or each layer may be formed of a magnetic material.
  • At least one layer of the adhesive layer 110, the strain holding layer 120, and the base film 140 may be formed as a layer having magnetic properties, in which case the magnetic layer according to an embodiment of the present invention.
  • the magnetic layer disposed between the strain holding layer 120 and the base film 140 may be omitted.
  • a structure in which a magnetic layer is disposed between the strain holding layer 120 and the base film 140 will be described as an example.
  • the adhesive sheet 100 is formed to have at least one layer having magnetic properties, and thus, the adhesive sheet is formed by a magnetic force provided from the magnet body layer 412 provided on the stage 411 described later. 100 may be tightly adhered to the susceptor 400. That is, when the adhesive sheet 100 is seated on the susceptor 400 by the magnetic force provided from the magnet body layer 412, the effective contact area between the adhesive sheet 100 and the susceptor 400 is increased, As a result, the heat transferred from the semiconductor package 11 through the adhesive sheet 100 may be effectively transferred to the susceptor 400 to be cooled.
  • the deposition material providing unit 300 is disposed on the susceptor 400, such as a deposition material supply unit spraying the deposition material, to form the thin film 20 on the deposition target D including the adhesive sheet 100.
  • a deposition material 21 Provided is a deposition material 21.
  • the deposition target D includes not only the adhesive sheet 100 but also the semiconductor package 11 fixed to the adhesive sheet 100, and the deposition material providing unit 300 includes the adhesive sheet to which the semiconductor package 11 is fixed.
  • the deposition material may be provided on the 100 to form an electromagnetic shielding film for shielding electromagnetic waves in the semiconductor package 11.
  • the thin film formed by the deposition material providing unit 300 may be an electromagnetic shielding film for shielding the electromagnetic waves emitted from the semiconductor package 11, and deposited to form the electromagnetic shielding film on the semiconductor package 11 by sputtering.
  • the material provider 300 may release the deposition material from the target made of a metal material for shielding electromagnetic waves, and provide the material on the adhesive sheet 100.
  • the susceptor 400 is disposed below the deposition material providing unit 300 to mount the adhesive sheet 100 included in the deposition object.
  • the susceptor 400 includes a stage 411 for supporting the deposition object; A cooling passage 421 formed in the stage 411 to provide a flow path of a refrigerant for cooling the deposition object; And a magnet body layer 412 installed on the stage 411 and including a plurality of unit magnets 41 arranged along the stage 411.
  • stage 411 the cooling passage 421, and the magnet body layer 412 according to each embodiment of the present invention will be described in detail.
  • FIG. 16 is a diagram illustrating a susceptor 400 according to a first embodiment of the present invention.
  • FIG. 17 is a view showing a state in which a cooling passage 421 is formed according to the first embodiment of the present invention
  • FIG. 18 is a view showing a state of the magnet body layer 412 according to the first embodiment of the present invention. to be.
  • the thin film forming apparatus includes a deposition material providing unit 300 and a susceptor 400, wherein the susceptor 400 is a deposition target ( A stage 411 for supporting D); A cooling passage 421 formed in the stage 411 to provide a flow path of a refrigerant for cooling the deposition object D; And a magnet body layer 412 installed on the stage 411 and including a plurality of unit magnets 41 arranged along the stage 411.
  • the susceptor 400 includes a first thermoelectric sheet 430 provided on the stage 411 and formed of an elastic material, and includes a magnet in the thin film forming apparatus according to the first embodiment of the present invention.
  • the body layer 412 is provided between the first thermoelectric sheet 430 and the stage 411, and the susceptor 400 is provided between the magnet body layer 412 and the stage 411 to be formed of an elastic material.
  • the second thermoelectric sheet 440 is further included.
  • the stage 411 is to support a deposition object including the adhesive sheet 100, and may have a circular or polygonal plate shape.
  • the stage 411 has an area larger than that of the adhesive sheet 100, and is connected by a drive unit and a drive shaft for driving the stage 411.
  • FIG. 15 illustrates a state in which one stage 411 is installed above the driving unit, a plurality of stages 411 may be installed above the driving unit.
  • the stage 411 may be disposed to correspond to the transfer tray 40 supporting the support frame 210 attached to the adhesive sheet 100.
  • the upper surface of the stage 411 is formed by convex surfaces projecting upward, concave surfaces recessed below, and convex surfaces and concave surfaces intersected. It may be formed of any one of the curved surfaces.
  • the upper surface of the stage 411 is formed as a convex surface, a concave surface or a curved surface to protect the semiconductor package 11 attached on the adhesive sheet 100. That is, when the upper surface of the stage 411 has a flat surface, when the adhesive sheet 100 is separated in a close contact state by the magnetic force provided from the magnet body layer 412 described later, the semiconductor package 11 is the adhesive sheet ( It is bounced off by the elasticity of 100 and can be moved or damaged to an unwanted position as a result. In addition, the adhesive sheet 100 may sag or sag due to the weight of the semiconductor package 11 attached on the adhesive sheet 100. As a result, adhesion between the adhesive sheet 100 and the lower stage 411 may be relaxed, and thus the heat dissipation effect may be reduced.
  • the upper surface of the stage 411 is formed as a convex surface, a concave surface or a curved surface, and is stepwise from the edge portion of the stage 411 to the center when the adhesive sheet 100 is separated. It is possible to separate, so that the adhesive sheet 100 can be separated from the stage 411 without being bounced.
  • the upper surface of the stage 411 by forming the upper surface of the stage 411 into a convex surface, a concave surface or a curved surface, the upper surface of the stage 411 has an extended surface area, and the adhesive sheet 100 sagging or sagging due to the weight of the semiconductor package 11. ) Can be kept in close contact with.
  • the stage 411 is installed on the drive shaft 50.
  • the driving shaft 50 may be connected to the driving unit (not shown) to rotate, and the stage 411 may be coupled to the upper portion of the driving shaft 50 to interlock the stage 411 by the rotation of the driving shaft 50.
  • Can rotate In addition, a coolant supply pipe 61 and a coolant discharge pipe 62 are formed in the drive shaft 50 to supply the coolant to the cooling channel 421 formed in the stage 411, or circulate along the cooling channel 421.
  • the refrigerant can be discharged.
  • the installation positions of the refrigerant supply pipe 61 and the refrigerant discharge pipe 62 are not limited thereto, and valves or flow regulators for adjusting the flow rate may be installed in the respective pipes, but detailed descriptions thereof will be omitted. Let's do it.
  • the susceptor 400 may further include a first thermoelectric sheet 430 provided on the stage 411, and the first thermoelectric sheet 430 may be formed of an elastic material.
  • the first thermoelectric sheet 430 provides a seating surface on which the deposition target including the adhesive sheet 100 is mounted.
  • the first thermoelectric sheet 430 may be provided on the stage 411 to improve adhesion between the deposition object seated on the first thermoelectric sheet 430 and the stage 411 and to enhance cooling efficiency.
  • the first thermoelectric sheet 430 may be formed of a material having elasticity. That is, when the adhesive sheet 100 is in close contact with the susceptor 400 by the magnetic force provided by the magnet body layer 412, the adhesive sheet 100 and the susceptor may be formed by elasticity of the first thermoelectric sheet 430. The area of the contact surface of 400 can be further increased.
  • the first thermoelectric sheet 430 may be formed of one of silicon, an adhesive, a fiber glass sheet, and a graphite sheet.
  • the cooling passage 421 is formed inside the stage 411 to provide a flow path of the refrigerant for cooling the deposition object. That is, the cooling channel 421 for circulating the refrigerant may be formed in the stage 411.
  • the stage 411 cools the semiconductor package 11 attached to the adhesive sheet 100 seated on the susceptor 400 by the refrigerant circulating along the cooling passage 421.
  • the refrigerant may include a cooling water or a cooling gas, water may be used as the cooling water, and nitrogen, hydrogen, argon, or the like may be used as the cooling gas.
  • the cooling channel 421 may be formed along the stage 411, and may be formed by forming a groove from a lower portion of the stage 411 to a predetermined height and shielding a lower end of the formed groove with the cooling channel cover 424.
  • Various cooling structures for preventing leakage of the refrigerant flowing along the cooling channel 421 may be applied to the cooling channel cover 424.
  • a coolant is supplied through a coolant inlet 422 formed at the center of the stage 411, and the supplied coolant flows helically to be discharged to the coolant outlet 423 adjacent to the coolant inlet 422.
  • the positions of the coolant inlet 422 and the coolant outlet 423 and the shape of the cooling channel 421 are not limited thereto.
  • the magnet body layer 412 is provided on the stage 411 and includes a plurality of unit magnets 41 arranged along the stage 411.
  • the magnet body layer 412 provides magnetic force in the direction toward the susceptor 400 to the adhesive sheet 100 to which the semiconductor package 11 is fixed. That is, as described above, the adhesive sheet 100 has at least one magnetic layer. Accordingly, the magnet body layer 412 provides magnetic force to the magnetic layer included in the adhesive sheet 100, more specifically, the adhesive sheet 100, and thus the adhesive sheet 100 is mounted on the susceptor 400.
  • the sheet 100 may be in close contact with the susceptor 400.
  • the adhesive sheet 100 and the susceptor 400 are firmly adhered to each other by the magnetic force provided by the magnet body layer 412, and the heat transmitted from the semiconductor package 11 through the adhesive sheet 100 is absorbed.
  • the refrigerant circulated along the cooling channel 421 of the stage 411 can be cooled at a high speed.
  • the magnet body layer 412 may be formed such that the plurality of unit magnets 41 are arranged in the same polarity, but may include a plurality of unit magnets 41 arranged to cross the polarities along the stage 411.
  • the magnet body layer 412 includes a plurality of unit magnets 41 arranged in the same polarity, the magnetic force can be improved, but the magnetic force lines emitted from the N pole and introduced into the S pole can minimize the formation path thereof. It is concentrated on the edge of the body layer 412, it is impossible to provide a uniform magnetic force to the adhesive sheet 100.
  • the magnet body layer 412 includes a plurality of unit magnets 41 arranged such that polarities between adjacent unit magnets 41 cross each other along the stage 411, the lines of magnetic force cross-align along the stage 411. Evenly distributed between the N pole and the S pole can be provided to provide a uniform magnetic force to the adhesive sheet (100).
  • the unit magnets 41 are arranged such that the polarities intersect along the stage 411.
  • the unit magnets 41 having different polarities are disposed on the top, bottom, left, and right sides of any one of the unit magnets 41.
  • the plurality of unit magnets 41 to be arranged so as to, and in relation to the first embodiment of the present invention shown in Figure 18 is a plurality of unit magnets 41 are arranged in close contact, spaced at a predetermined interval or Of course, a separate member may be inserted between the plurality of unit magnets 41 spaced apart from each other.
  • an electromagnet, a permanent magnet or a rubber magnet can be used as the unit magnet 41.
  • a magnetic force of 1000 to 2000 gauss (G) is required. That is, when a magnetic force of less than 1000 gauss G is provided from the magnet body layer 412, the adhesive sheet 100 is hardly sufficiently adhered on the susceptor by magnetic force, and 2000 gauss G is removed from the magnet body layer 412.
  • the size, for example, the thickness of the magnet body layer 412 must also be increased in order to provide such a magnetic force, which is generated from the deposition object due to the characteristics of the magnet body layer 412 having a relatively low thermal conductivity. It becomes impossible to effectively transfer the heat to the stage 411.
  • the magnet body layer 412 is disposed on the stage 411 to minimize the gap between the adhesive sheet 100 and the magnet body layer 412, and thus, the adhesive sheet 100. It can provide maximum magnetic force with minimum thickness. Accordingly, the adhesive sheet 100 may be firmly adhered to the susceptor 400, and heat generated from the semiconductor package 11 may be transferred to the stage 411 to be fixed to the adhesive sheet 100. The cooling efficiency of (11) can be improved.
  • the magnet body layer 412 including the plurality of unit magnets 41 arranged along the stage 411 includes the first thermoelectric sheet 430 and the stage ( Installed between the 411, the susceptor 400 may further include a second thermoelectric sheet 440 provided between the magnet body layer 412 and the stage 411 to be formed of an elastic material. That is, in the thin film forming apparatus according to the first embodiment of the present invention, the second thermoelectric sheet 440, the magnet body layer 412, and the first thermoelectric sheet 430 are sequentially stacked on the stage 411.
  • the first thermoelectric sheet 430 serves to improve adhesion between the deposition target and the magnet body layer 412
  • the second thermoelectric sheet 440 adheres between the magnet body layer 412 and the stage 411.
  • the cooling efficiency may be improved, and not only the first thermoelectric sheet 430 but also the second thermoelectric sheet 440 may be formed of an elastic material to form the first thermoelectric sheet 430 and the second thermoelectric sheet 440. Due to the elasticity, the deposition target may effectively transfer heat to the stage 411 through the first thermoelectric sheet 430, the magnet body layer 412, and the second thermoelectric sheet 440, thereby improving cooling efficiency.
  • the first thermoelectric sheet 430 and the second thermoelectric sheet 440 may be formed to have a thickness thinner than that of the magnet body layer 412. That is, the cooling efficiency of the heat emitted from the semiconductor package 11 is greatly affected by the distance between the adhesive flow path 421 formed in the adhesive sheet 100 and the susceptor 400, the adhesive sheet 100 and In order to provide sufficient magnetic force to the adhesive sheet 100 while minimizing a distance from the cooling passage 421, the first thermoelectric sheet 430 and the second thermoelectric sheet 440 may be formed to have a thickness of 0.3 to 1 mm, respectively. It has a thickness thinner than the magnet body layer 412 formed from the unit magnet 41 having a thickness of about 1 to 2 cm.
  • FIG. 19 is a view illustrating a susceptor according to a second embodiment of the present invention
  • FIG. 20 is a view illustrating a magnet body layer according to a second embodiment of the present invention. More specifically, FIG. 19A illustrates a susceptor according to a second embodiment of the present invention, and FIG. 19B illustrates a susceptor according to a modified example of the second embodiment of FIG. It is a figure which shows.
  • the stage 411 has a hollow internal space
  • the magnet body layer 412 has a unit magnet 41 adjacent to a plurality of unit magnets 41.
  • a first cooling flow path 421a provided in an inner space of the stage 411 so as to be spaced apart from each other at predetermined intervals, the cooling flow path being provided along an area between the plurality of unit magnets 41;
  • the stage 411 has a hollow inner space. That is, the stage 411 may include an upper stage 411a and a lower stage 411b, the hollow inner space is formed in the inner region of the upper stage 411a, and the lower stage 411b is the inner space. It may be formed in a structure that shields the bottom.
  • the magnet body layer 412 is arranged so that the polarity between adjacent unit magnets 41 cross each other along the stage 411, and the plurality of unit magnets 41 are spaced apart at predetermined intervals from the adjacent unit magnets 41, respectively. It is installed in the interior space of the stage 411 so that it may be arranged.
  • the magnet body layer 412 may further include a magnetic plate 42 disposed on an upper surface of the internal space of the stage 411 to fix the plurality of unit magnets 41 by magnetic force.
  • the magnetic plate 42 may be formed of, for example, iron (Fe), a ferromagnetic material, and the plurality of unit magnets 41 may be formed on the upper surface of the inner space of the stage 411. ) Is fixed by magnetic force. That is, the plurality of unit magnets 41 may be magnetically attached and fixed to the magnetic plate 42 without a separate process such as fastening or bonding by the magnetic plate 42. Here, if necessary, the process of fastening or bonding may be further performed.
  • the magnet body layers 412 are installed to be spaced apart from each other at predetermined intervals with respect to the adjacent unit magnets 41.
  • the magnet body layer 412 may further include a spacing member (not shown) disposed between the plurality of unit magnets 41 to respectively maintain the spacing between adjacent unit magnets 41.
  • a space keeping member may be configured by inserting a member having a width by a predetermined interval spaced apart from each unit magnet 41 between adjacent unit magnets 41.
  • the cooling flow path may include a first cooling flow path 421a provided along the spaced space between the plurality of unit magnets 41. That is, the first cooling channel 421a may be formed along at least a part of an interregion area formed to be spaced apart from each other with respect to the adjacent unit magnets 41 at predetermined intervals.
  • the first cooling channel 421a embeds a cooling channel tube (not shown) that is bent in a predetermined path along a part of a region between the adjacent unit magnets 41, which are formed to be spaced apart at predetermined intervals, respectively. It may be formed, or may be formed by embedding the cooling flow path tube formed in a lattice shape along the whole of the inter-regions formed to be spaced apart at predetermined intervals with respect to the adjacent unit magnets 41, respectively.
  • first cooling channel 421a may form a spaced space itself between the plurality of unit magnets 41 as the cooling channel 421 instead of embedding the cooling channel.
  • first cooling channel 421a is provided so that the refrigerant and the unit magnet 41 of at least some of the plurality of unit magnets 41 directly contact each other.
  • the refrigerant directly contacts the plurality of unit magnets 41 and thus, not only the stage 411 but also the unit magnets ( 41) can be cooled, and if the temperature generated due to the characteristics of the magnet is increased, it is possible to provide a sufficient magnetic force to the adhesive sheet 100 by preventing the phenomenon that the magnetic force is lowered.
  • a corrosion prevention layer for preventing corrosion due to contact with a refrigerant may be formed on the surfaces of the plurality of unit magnets 41.
  • the anti-corrosion layer may be formed by plating chromium, which is a magnetic material, and may prevent the magnetic force of the unit magnet 41 from being lowered by the anti-corrosion layer using a ferromagnetic or paramagnetic material.
  • the cooling passage may be composed of only the first cooling passage 421a described above, but as shown in FIG. 19B, a second cooling passage formed under the magnet body layer 412. And may further include 421b.
  • the first cooling passage 421a and the second cooling passage 421b may communicate with each other.
  • the unit magnet 41 can be cooled uniformly as a whole.
  • the second cooling channel 421b further includes a second cooling channel 421b formed under the magnet body layer 412, and the second cooling channel 421b is connected to the second cooling channel 421b, respectively. It extends linearly between the coolant discharge port 423 to quickly circulate the coolant, the first cooling channel 421a grating the refrigerant supplied from the second cooling channel 421b between the plurality of unit magnets 41. Radial diffusion to have a shape makes it possible to uniformly cool the stage 411 and the unit magnet 41.
  • 21 is a diagram illustrating a susceptor according to a third embodiment of the present invention.
  • the stage 411 has a hollow internal space
  • the plurality of unit magnets include: a plurality of first unit magnets 41a having a predetermined thickness; And a plurality of second unit magnets 41b having a thickness thinner than that of the first unit magnets 41a, wherein the magnet body layer 412 includes the plurality of second unit magnets 41b.
  • the plurality of first unit magnets are installed in an internal space of the stage 411 to be arranged between the one unit magnets 41a, and the cooling passages 421 are spaced apart by the plurality of second unit magnets 41b. It is provided along the area between 41a.
  • the third embodiment of the present invention is different from the above-described second embodiment of the present invention with respect to the above configuration, except for this, the parts applicable in the same manner as the first and second embodiments of the present invention. Can be applied as it is, the description of the duplicate content will be omitted.
  • the stage 411 has a hollow inner space.
  • the magnet body layer 412 is arranged along the stage 411 so that polarities between adjacent unit magnets cross each other, and the plurality of unit magnets include: a plurality of first unit magnets 41a having a predetermined thickness; And a plurality of second unit magnets 41b having a thickness thinner than that of the first unit magnets 41a.
  • the plurality of first unit magnets 41a may have the same thickness in the up and down direction in the interior space of the stage 411, and the plurality of second unit magnets 41b may be in the up and down direction in the interior space of the stage 411. As such, it may have the same thickness thinner than that of the first unit magnet 41a.
  • the plurality of unit magnets may be installed in the internal space of the stage 411 such that the plurality of second unit magnets 41b are arranged between the plurality of first unit magnets 41a.
  • the magnet body layer 412 is disposed on the upper surface of the internal space of the stage 411, and the magnetic plate 42 for fixing the plurality of first unit magnets 41a and the second unit magnets 41b by magnetic force is provided. It may further include.
  • the cooling channel 421 may include a plurality of first units spaced apart by spaces in the thickness direction of the plurality of second unit magnets 41b, that is, the plurality of second unit magnets 41b. It may be provided along the area between the magnets 41a. That is, the plurality of first unit magnets 41a and the second unit magnets 41b having different thicknesses are disposed on the magnetic plate 42, but the plurality of second unit magnets 41b are disposed in the plurality of first unit magnets. When arranged between the 41a, the lower regions of the plurality of second unit magnets 41b are spaced apart between the first unit magnets 41a. In FIG. 21, the second unit magnets 41b are arranged between the first unit magnets 41a.
  • the present invention is not limited thereto, and the second unit magnets 41b may be disposed between the first unit magnets 41a.
  • the cooling flow path 421 may be provided along an area between the plurality of first unit magnets 41a spaced by the plurality of second unit magnets 41b.
  • the cooling passage 421 may be formed along at least a portion of an area between the plurality of first unit magnets 41a spaced apart from the plurality of second unit magnets 41b, and the lower portion of the second unit magnet 41b may be formed.
  • the cooling channel pipe (not shown) bent in a predetermined path along the arrangement direction of the second unit magnet 41b may be formed by embedding.
  • the cooling passage 421 may be formed by the space itself between the first unit magnets 41a formed under the second unit magnets 41b. In this case, the cooling passage 421 is provided such that the refrigerant and the unit magnets of at least some of the plurality of first unit magnets 41a and the plurality of second unit magnets 41b are in direct contact with each other.
  • the refrigerant may directly contact the plurality of unit magnets to cool not only the stage 411 but also the unit magnet 41.
  • the temperature generated due to the characteristics of the magnet is increased, the magnetic force is prevented from being lowered to provide sufficient magnetic force to the adhesive sheet 100.
  • the unit magnet since the unit magnet is in direct contact with the refrigerant, problems such as corrosion may occur.
  • the cooling passage 421 when the cooling passage 421 is formed along at least a part of an area between the plurality of first unit magnets 41a spaced apart from the plurality of second unit magnets 41b,
  • the first unit magnets 41a and the plurality of second unit magnets 41b provide uniform magnetic force to the pressure-sensitive adhesive sheet 100 and cool not only the stage 411 but also the unit magnets 41. . That is, compared with the second embodiment of the present invention, in the case of the third embodiment of the present invention, the plurality of first unit magnets 41a and the plurality of second unit magnets 41b are sufficient along the stage 411. 18 may be arranged (as shown in FIG.
  • the magnetic plate 42 is magnetized by receiving magnetic force from the plurality of first unit magnets 41a and the plurality of second unit magnets 41b. That is, although the thicknesses of the first unit magnet 41a and the second unit magnet 41b are different from each other, the magnetic force provided from each unit magnet may be unevenly distributed, but the first unit magnet 41a and the second unit may be unevenly distributed. Since the magnetic plate 42 holding the magnet 41b is magnetized by receiving the magnetic force from the plurality of first unit magnets 41a and the plurality of second unit magnets 41b, the magnetic force provided non-uniformly according to the magnetic field induction is canceled. As a result, the adhesive sheet 100 may be provided with a relatively uniform magnetic force.
  • a method of forming a thin film includes: preparing a deposition target including an adhesive sheet 100 having a magnetic layer (S100); Mounting the deposition target D on the susceptor 400 (S200); And depositing a thin film by supplying a deposition material to the deposition target D (S300), and supporting the deposition target D in a process of seating the deposition target D on the susceptor 400.
  • the magnet body layer 412 including a plurality of unit magnets 41 arranged in the stage 411 to provide a magnetic force to the deposition target (D), the adhesive sheet 100 is the susceptor 400
  • the process of depositing the thin film in close contact with the phase is performed while cooling the deposition target D by flowing a refrigerant inside the stage 411.
  • the semiconductor package 11 is fixed to an upper surface of the adhesive sheet 100 having at least one magnetic layer.
  • the adhesive sheet 100 is a magnetic layer, as well as the adhesive layer 110 to which the semiconductor package 11 is attached to the upper surface; And a strain holding layer 120 provided between the adhesive layer 110 and the magnetic layer and plastically deforming along the terminal 11a protruding from the semiconductor package 11 by an external pressure.
  • a process of preparing a deposition target (S100) may include attaching the semiconductor package 11 to an adhesive layer 110 formed on the adhesive sheet 100; And plastic deformation of the strain holding layer 120 formed between the adhesive layer 110 and the magnetic layer by the external pressure along the terminal 11a protruding from the semiconductor package 11. .
  • the bottom surface of the LGA semiconductor package 11 or the BGA semiconductor package 11 on which the terminal 11a, such as a metal electrode or solder ball, protrudes is adhered.
  • An external pressure is applied to at least one of the adhesive sheet 100 and the semiconductor package 11 while being disposed to face the layer 110.
  • the terminal 11a protruding from the lower surface of the semiconductor package 11 is inserted into the adhesive layer 110, and the lower surface of the semiconductor package 11 is attached to the adhesive layer 110.
  • the process of plastically deforming the strain holding layer 120 may include pressing the strain holding layer 120 by a terminal 11a protruding from the bottom surface of the semiconductor package 11 and inserted into the adhesive layer 110 by external pressure. As a result, the shape of the strain holding layer 120 is changed. As a result, the terminal 11a of the metal electrode or the solder ball, which protrudes from the lower surface of the semiconductor package 11, is recessed and fixed to the adhesive layer 110 and is not exposed to the outside.
  • the strain holding layer 120 plastically deformed by external pressure may be formed of a metal material having malleability, that is, malleability and ductility, and has excellent thermal conductivity. Accordingly, the strain holding layer 120 may prevent the floating phenomenon between the adhesive layer 110 and the lower surface of the semiconductor package 11 and have a high thermal conductivity, so that heat generated from the semiconductor package 11 may be adhered to the adhesive layer 110. Through) to be effectively transmitted to the magnetic layer and the susceptor 400. This makes it possible to quickly cool the semiconductor package 11 exposed to a high temperature environment during a deposition process such as a sputtering process, to prevent the semiconductor chip disposed in the semiconductor package 11 from being damaged by high temperature heat, The semiconductor package 11 can be prevented from bending.
  • the adhesive sheet 100 on which the semiconductor package 11 is fixed is transferred into the thin film forming apparatus by the above-described process on the susceptor 400. Settle down.
  • the support frame 210 may be attached to the edge of the adhesive sheet 100, the adhesive sheet 100 to which the support frame 210 is attached is a ring-shaped transfer tray for supporting the support frame 210 from the inside. It may be mounted on the 40 and transported.
  • the adhesive sheet 100 may include a magnet body layer including a plurality of unit magnets 41 arranged in a stage 411 supporting the deposition target. 412 provides magnetic force to the deposition object such that the deposition object is in close contact with the susceptor 400.
  • the magnet body layer 412 is installed on the stage 411 or installed in the internal space of the stage 411, so that the magnet body layer 412 faces the susceptor 400 on the adhesive sheet 100 to which the semiconductor package 11 is fixed.
  • the adhesive sheet 100 is provided by a magnetic force provided from the magnet body layer 412 provided on the stage 411 by providing a magnetic force, and forming the adhesive sheet 100 to have at least one magnetic layer as described above. It is in close contact with the stage 411. Therefore, the effective contact area between the adhesive sheet 100 and the stage 411 is increased, and the heat transferred from the semiconductor package 11 through the adhesive sheet 100 to the stage 411 can be effectively cooled. Will be.
  • the magnet body layer 412 may include a plurality of unit magnets 41 arranged to cross the polarity along the stage 411, in which case the magnetic force lines are the N pole and the S pole arranged along the stage 411. As described above, it is uniformly distributed therebetween, thereby providing a uniform magnetic force to the adhesive sheet 100.
  • the magnetic force provided to the adhesive sheet 100 by the magnet body layer 412 may have a value of 1000 to 2000 gauss (G), in which case it may provide a sufficient magnetic force for close contact with the adhesive sheet 100. Will be.
  • a thin film is deposited by supplying a deposition material onto a deposition target.
  • the deposition material providing unit 300 is provided on the susceptor 400 to provide a deposition material for depositing a thin film on the semiconductor package 11 fixed on the adhesive sheet 100, the deposition material providing unit In operation 300, an electromagnetic wave shielding film may be formed on the semiconductor package 11 by sputtering a target made of a metal material to shield electromagnetic waves to release the deposition material.
  • the process of depositing a thin film is performed while cooling the semiconductor package 11 fixed on the adhesive sheet 100 by circulating a refrigerant inside the stage 411. That is, a cooling passage 421 may be formed in the stage 411 to circulate the refrigerant, and in the process of depositing a thin film, the refrigerant may be formed along the cooling passage 421 formed in the stage 411. By circulating, the semiconductor package 11 can be cooled.
  • the cooling passage 421 may be provided along an area between the plurality of unit magnets 41, or may be provided along a lower area of the magnet body layer 412 communicating with an area between the plurality of unit magnets 41.
  • the second unit magnet 41b having a relatively thin thickness with respect to the first unit magnet 41a may be provided along an area spaced apart from each other by being arranged between the plurality of first unit magnets 41a.
  • the deposition target is not heated by a separate heat source, and is cooled by the circulation of the refrigerant in the stage 411 to effectively discharge heat emitted from the semiconductor package 11.
  • the output is increased during the sputtering process, which increases the amount of physical impact of the target, thereby forming a high temperature internal environment having a temperature of about 90 to 130 ° C.
  • the semiconductor package 11 may be deposited while maintaining the semiconductor package 11 at a temperature of 90 ° C. or lower from room temperature by effective cooling of the semiconductor package.
  • the deposition target can be firmly adhered to the susceptor by the magnetic force provided from the magnet body layer including the plurality of unit magnets.
  • a thermoelectric sheet may be provided on the stage to provide a seating surface of the deposition target, thereby increasing an effective contact area between the deposition target and the stage, and circulating the refrigerant through a cooling passage formed in the stage to perform the deposition process. By performing this, heat transmitted from the semiconductor package 11 to the stage through the adhesive sheet can be effectively released.
  • a cooling flow path is formed along the area between the plurality of unit magnets to cool the stage, and the unit magnets can be cooled at the same time as the refrigerant flows, thereby preventing a decrease in the magnetic force caused by the temperature rise and providing sufficient magnetic force to the deposition target.
  • the magnetic force lines can be densely arranged along the stage, and the stage and unit magnets can be cooled effectively.
  • the thin film forming apparatus and the thin film forming method according to an embodiment of the present invention by cooling the semiconductor package 11 effectively in a deposition process formed in a high temperature environment, the semiconductor chip disposed in the semiconductor package 11 is exposed to high temperature heat. It is possible to prevent a phenomenon such as damage or bending of the semiconductor package 11 to occur, it is possible to improve the manufacturing efficiency and production stability of the semiconductor package 11.
  • At least one surface of the electronic component is tightly fixed, including a strain holding layer plastically deformed by the pressure to which the electronic component is attached, thereby preventing the formation of a thin film such as an electrode part of the electronic component without forming a hole or a groove.
  • the part can be sealed and protected.
  • the electronic component carrier may be removed without additional processes such as removing the sacrificial layer together with the thin film formed on the surface. Only by adhering to a sheet, the part which does not want thin film formation can be sealed and protected.
  • a thin film may be formed only at a portion where a thin film is not formed at a portion where the thin film is not formed, and a portion of the surface of the electronic component that is not desired to be formed is sealed through the electronic component carrier sheet, thereby selectively selecting the thin film.
  • the thin film may be formed only at the portion where the thin film is desired.
  • the electrode portion of the electronic component may be prevented from being contaminated due to a gap between the electronic component and the electronic component carrier sheet during the thin film forming process.
  • the manufacturing process can be simplified, and the electronic component can be closely fixed to the electronic component carrier sheet regardless of the appearance of the electronic component.
  • the degree of freedom in arranging electronic components may be increased, and electronic components may be densely arranged, and the electronic components may be prevented from being damaged or broken by high temperature heat during a thin film forming process such as sputtering.
  • the electronic component carrier sheet can be in close contact with the magnet plate of the thin film forming apparatus during the thin film forming process. have.
  • heat transferred to the electronic component during the thin film forming process such as sputtering may be transferred to the electronic component carrier sheet and the magnet plate to be effectively cooled through the cooling unit of the thin film forming apparatus.
  • the effective cooling of the electronic component allows the electronic component to be maintained at an acceptable range of temperatures.
  • the term “on” refers to a case in which the direct contact is not directly contacted but is positioned opposite to the upper or lower part, and is not only positioned opposite to the entire upper or lower part but also partially. It is also possible to be located opposite, and used to mean facing away from the position or in direct contact with the upper or lower surface. And the numerical characteristics of each component may be a value measured at room temperature.

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Abstract

The present invention provides an electronic component carrier sheet, and an adhesion device and a thin film forming apparatus using the same, the electronic component carrier sheet allowing electronic components to be attached thereto so as to form a thin film on the surface of the electronic component while cooling the electronic component.

Description

전자 부품 캐리어 시트, 및 이를 이용한 점착 장치와 박막 형성장치Electronic component carrier sheet, adhesive device and thin film forming device using same
본 발명은 전자 부품 캐리어 시트, 및 이를 이용한 점착 장치와 박막 형성장치에 관한 것으로, 보다 구체적으로 전자 부품 캐리어 시트에 전자 부품을 부착하여 전자 부품을 냉각시키면서 전자 부품의 표면에 박막을 형성하는 데에 이용하는 전자 부품 캐리어 시트, 및 이를 이용한 점착 장치와 박막 형성장치에 관한 것이다.The present invention relates to an electronic component carrier sheet, and an adhesive device and a thin film forming apparatus using the same, and more particularly, to form a thin film on the surface of an electronic component while attaching the electronic component to the electronic component carrier sheet and cooling the electronic component. An electronic component carrier sheet to be used, and an adhesive device and a thin film forming device using the same.
최근 들어, 인체에 대한 전자파의 위험성이 널리 알려짐에 따라 휴대용 통신기기, 영상표시장치, 게임기 등 다양한 전자 제품으로부터 발생되는 다량의 전자파를 차폐하기 위한 기술이 개발되고 있다.Recently, as the danger of electromagnetic waves to the human body is widely known, a technology for shielding a large amount of electromagnetic waves generated from various electronic products such as a portable communication device, an image display device, and a game machine has been developed.
일반적으로 전자파는 전자 제품 및 기기에 포함된 반도체 패키지 등의 전자 부품에서 주로 발생되기 때문에 최근에는 주로 반도체 패키지 등의 전자 부품에서 발생 및 출력된 전자파를 차폐하기 위한 다양한 기술들이 개발되고 있다.In general, since electromagnetic waves are mainly generated from electronic components such as semiconductor packages included in electronic products and devices, various technologies have recently been developed to shield electromagnetic waves generated and output mainly from electronic components such as semiconductor packages.
가장 간단한 방법으로는 기판에 실장된 전자 부품을 금속 캡(metal cap)으로 덮는 방법이나, 이 방법은 금속 캡에 의하여 기판의 부피가 크게 증가되고 공정 수 및 조립 부품 수가 증가되는 문제점을 갖는다.The simplest method is a method of covering an electronic component mounted on a substrate with a metal cap, but this method has a problem that the volume of the substrate is greatly increased by the metal cap, and the number of processes and assembly parts is increased.
최근에는 전자 부품의 표면 상에 직접 금속막을 형성하여 전자파를 차폐하는 방법이 개발되고 있으며, 이 방법은 주로 스퍼터링(sputtering) 장치를 통해 구현되고 있다. 하지만, 스퍼터링 장치를 이용해 전자 부품의 표면에 금속막을 형성할 경우에 반도체 패키지의 솔더 볼 등의 전극 부위에 금속막이 증착되게 되면, 전극 부위의 스퍼터링 증착 오염으로 전기 쇼트 등이 발생되는 문제점이 있기 때문에 금속막의 증착을 원하지 않는 반도체 패키지의 솔더 볼 등의 전극 부위를 보호하는 기술이 필요하다.Recently, a method of shielding electromagnetic waves by forming a metal film directly on the surface of an electronic component has been developed, and this method is mainly implemented through a sputtering device. However, when forming a metal film on the surface of the electronic component using a sputtering device, if the metal film is deposited on the electrode portion, such as solder balls of the semiconductor package, there is a problem that the electrical short, etc. are generated due to sputter deposition contamination of the electrode portion There is a need for a technique for protecting an electrode portion such as a solder ball of a semiconductor package which does not want to deposit a metal film.
통상적으로 전자 부품의 일면(또는 하부면)을 점착 시트에 부착하여 전자 부품의 표면에 금속막을 형성하고 있으며, 종래의 점착 시트는 전자 부품의 일면만이 부착될 수 있었기 때문에 점착 시트만으로는 전자 부품의 일면 이외의 증착을 원하지 않는 부분을 보호할 수 없었다.Typically, one surface (or lower surface) of the electronic component is attached to the adhesive sheet to form a metal film on the surface of the electronic component. In the conventional adhesive sheet, since only one surface of the electronic component could be attached, the adhesive sheet alone It was not possible to protect the portions that do not want to be deposited other than one side.
특히, 반도체 패키지의 솔더 볼 등 전자 부품의 일면에 돌출 단자가 형성된 경우에는 종래의 점착 시트에 돌출 단자의 단부만이 부착될 수 있어 종래의 점착 시트와 전자 부품의 일면 사이에 들뜸(gap) 현상이 발생하고 전자 부품의 돌출 단자를 보호할 수 없으므로, 금속막의 증착을 원하지 않는 반도체 패키지의 솔더 볼 등의 전극 부위를 보호하는 기술이 더욱 요구된다.In particular, when a protruding terminal is formed on one surface of an electronic component such as a solder ball of a semiconductor package, only an end portion of the protruding terminal may be attached to a conventional adhesive sheet, thereby causing a gap between the conventional adhesive sheet and one surface of the electronic component. As this occurs and the protruding terminals of the electronic components cannot be protected, a technique for protecting electrode portions such as solder balls of semiconductor packages which do not want to deposit metal films is further required.
이에 최근에는 유연 테이프에 홀(hole)을 형성하고 홀에 금속막의 증착을 원하지 않는 반도체 패키지의 솔더 볼 등의 전극 부분이 삽입되도록 바닥면을 걸치게 배치한 후에 스퍼터링을 수행하는 방법이 사용되고 있다.Recently, a method of forming a hole in a flexible tape and disposing the electrode portion such as a solder ball of a semiconductor package which does not want to deposit a metal film in the hole is placed over the bottom surface and then sputtering is used.
그러나 이와 같이 유연 테이프 또는 자재 안착부에 홀 또는 홈을 형성하고 홀 또는 홈에 반도체 패키지 등의 전자 부품을 배치한 후에 스퍼터링을 수행할 경우, 유연 테이프 또는 자재에 홀 또는 홈을 형성하는 공정이 추가되어야 하기 때문에 제조 공정이 복잡해진다.However, when sputtering is performed after forming holes or grooves in the flexible tape or material mounting portion and placing electronic components such as semiconductor packages in the holes or grooves, a process of forming holes or grooves in the flexible tape or material is added. The manufacturing process is complicated because it must be.
또한, 유연 테이프 또는 자재에 형성된 홀 또는 홈에 반도체 패키지 등의 전자 부품을 배치한 후, 스퍼터링을 수행할 때에 전자 부품을 밀착 및 고정하는 문제로 인해 틈이 존재할 수 있어 반도체 패키지의 솔더 볼 등의 전극에 원하지 않는 금속막이 형성될 수 있다.In addition, after placing an electronic component such as a semiconductor package in a hole or a groove formed in a flexible tape or a material, a gap may exist due to a problem of closely contacting and fixing the electronic component when sputtering. Unwanted metal films may be formed on the electrodes.
그리고 전자 부품의 외형 또는 솔더 볼 등의 전극의 간격 및 형상 등이 변경될 경우에 홀 또는 홈의 사이즈도 이에 따라 변경되어야 하며, 유연 테이프 또는 자재에 홀 또는 홈을 형성할 경우에 전자 부품의 배치 자유도가 낮고, 전자 부품의 홀과 홀 사이의 간격 제한으로 인해 전자 부품을 밀집하여 배치하기 어려운 문제점을 갖는다.If the external shape of the electronic component or the spacing and shape of the electrode such as solder balls is changed, the size of the hole or the groove should be changed accordingly, and the arrangement of the electronic component in the case of forming the hole or groove in the flexible tape or material The degree of freedom is low, and due to the limitation of the distance between the holes and the holes of the electronic parts, it is difficult to arrange and arrange the electronic parts.
박막 형성기술은 다양한 분야에서 사용되고 있으며, 최근에는 대상체에 다양한 기능성 박막을 증착하기 위한 기술들이 발전되고 있다.Thin film formation technology has been used in various fields, and in recent years, techniques for depositing various functional thin films on an object have been developed.
일반적으로, 박막을 형성하는 공정은 증착 물질을 활성화시키고, 증착 속도를 향상시키기 위하여 일반적으로 고온의 환경에서 이루어지게 된다. 나아가, 기능성 박막을 증착함에 있어서 박막의 품질을 향상시킬 수 있는 이점이 있는 스퍼터링 방식으로 박막을 증착하는 경우에는 이온화된 가스가 타겟에 물리적으로 충돌함에 의하여 발생되는 열에 의하여 화학적인 증착 공정에 비하여 훨씬 높은 고온의 환경이 조성된다.In general, the process of forming a thin film is generally performed in a high temperature environment in order to activate the deposition material and improve the deposition rate. Furthermore, when depositing a thin film by the sputtering method which has the advantage of improving the quality of the thin film in depositing the functional thin film, it is much more than the chemical vapor deposition process by the heat generated by the physical impact of the ionized gas on the target. A high temperature environment is created.
한편, 대상체는 개별적으로 스테이지 상에 안착되어 박막이 형성될 수 있으나, 공정 효율 등을 위하여 복수 개가 스테이지 상에 안착되어 박막이 형성되는 것으로 구성할 수도 있다. 이 경우, 복수 개의 대상체는 복수 개의 대상체를 고정하기 위한 점착 시트 등에 의하여 고정된 채로 박막이 증착되게 된다.Meanwhile, the objects may be individually seated on a stage to form a thin film, but a plurality of objects may be formed on the stage to form a thin film for process efficiency and the like. In this case, the plurality of objects are deposited with a thin film fixed by an adhesive sheet for fixing the plurality of objects.
그러나, 이와 같이 복수 개의 대상체를 점착 시트 등에 의하여 고정하여 스테이지 상에 안착시키는 경우 점착 시트와 스테이지는 충분하게 밀착되지 못하게 된다. 즉, 점착 시트는 평면의 형상을 지속적으로 유지할 수 없으며, 점착 시트가 안착되는 스테이지 상에서 다수의 들뜸 부분을 형성하게 된다.However, when the plurality of objects are fixed by the adhesive sheet or the like and seated on the stage, the adhesive sheet and the stage may not be sufficiently in close contact. That is, the adhesive sheet cannot continuously maintain the shape of the plane, and forms a plurality of lifting portions on the stage on which the adhesive sheet is seated.
이와 같이, 점착 시트가 스테이지 상에서 밀착되지 못하는 경우, 박막 증착 공정이 진행됨에 따라 점착 시트에 고정된 대상체로부터 발생하는 열은 스테이지로 효과적으로 전달될 수 없게 되며, 이에 따라 대상체의 온도는 계속적으로 증가하게 되고, 결국 대상체가 손상될 수 밖에 없는 문제점이 있었다.As such, when the adhesive sheet is not adhered on the stage, as the thin film deposition process proceeds, heat generated from the object fixed to the adhesive sheet cannot be effectively transferred to the stage, thereby increasing the temperature of the object continuously. In the end, there was a problem that the subject must be damaged.
특히, 전자파 차폐막을 형성하는 공정에서 반도체 패키지는 고온에 지속적으로 노출될 수 밖에 없게 되고, 이 경우 반도체 패키지 내에 배치되는 반도체 칩이 고온의 열에 의하여 손상되거나 반도체 패키지가 휘어지는 등의 현상이 발생하게 되어, 반도체 패키지의 제조 효율 및 안정성이 크게 저하되는 문제점이 있었다.In particular, in the process of forming the electromagnetic wave shielding film, the semiconductor package is inevitably exposed to high temperature, in which case the semiconductor chip disposed in the semiconductor package is damaged by high temperature heat or the semiconductor package is bent. There is a problem in that the manufacturing efficiency and stability of the semiconductor package are greatly reduced.
(특허문헌 1) 한국등록특허공보 제10-1590593호(Patent Document 1) Korean Registered Patent Publication No. 10-1590593
(특허문헌 2) 한국등록특허공보 제10-1604582호(Patent Document 2) Korean Registered Patent Publication No. 10-1604582
(특허문헌 3) 한국등록특허공보 제10-1501735호(Patent Document 3) Korean Registered Patent Publication No. 10-1501735
본 발명은 전자 부품을 밀착 고정하고 전자 부품의 표면에 박막을 형성하는 데에 이용하는 전자 부품 캐리어 시트 및 이를 이용한 박막 형성장치를 제공한다.The present invention provides an electronic component carrier sheet and a thin film forming apparatus using the same, which are used for tightly fixing an electronic component and forming a thin film on the surface of the electronic component.
본 발명은 피점착물을 제1 플레이트 상에 지지시키고 점착 시트와 피점착물 중 적어도 하나에 압력을 부가하여 점착 시트에 피점착물을 밀착시키는 점착 장치를 제공한다.The present invention provides a pressure-sensitive adhesive apparatus for supporting an adherend on a first plate and applying pressure to at least one of the adhesive sheet and the adherend to adhere the adherend to the adhesive sheet.
본 발명은 박막을 형성하는 과정에서 증착 대상물을 효과적으로 냉각시킬 수 있는 박막 형성장치를 제공한다.The present invention provides a thin film forming apparatus that can effectively cool the deposition target in the process of forming a thin film.
본 발명의 일실시예에 따른 전자 부품 캐리어 시트는 전자 부품이 일면에 부착되는 점착층; 및 상기 점착층의 일면과 대향하는 타면 상에 제공되며, 상기 전자 부품이 부착되는 압력에 의하여 소성 변형되는 변형 유지층;을 포함할 수 있다.Electronic component carrier sheet according to an embodiment of the present invention is an adhesive layer to which the electronic component is attached to one surface; And a strain-retaining layer provided on the other surface of the pressure-sensitive adhesive layer facing the one surface of the adhesive layer and plastically deformed by the pressure to which the electronic component is attached.
상기 점착층은 5 내지 100 ㎛의 두께를 가질 수 있다.The adhesive layer may have a thickness of 5 to 100 ㎛.
상기 점착층은 200 내지 1,500 gf/in의 점착력을 가질 수 있다.The adhesive layer may have an adhesive force of 200 to 1,500 gf / in.
상기 변형 유지층은 금속 필름으로 이루어질 수 있다.The strain holding layer may be made of a metal film.
상기 변형 유지층은 3 내지 60 ㎛의 두께를 가질 수 있다.The strain retaining layer may have a thickness of 3 to 60 ㎛.
상기 변형 유지층은 10 내지 80 %의 연신율을 가질 수 있다.The strain holding layer may have an elongation of 10 to 80%.
상기 변형 유지층은 상온에서 200 내지 450 W/m·K의 열전도율을 가질 수 있다.The strain holding layer may have a thermal conductivity of 200 to 450 W / m · K at room temperature.
상기 점착층을 향하는 상기 변형 유지층의 일면과 대향하는 타면 상에 제공되는 자성층;을 더 포함할 수 있다.It may further include a; a magnetic layer provided on the other surface facing one surface of the strain holding layer facing the adhesive layer.
상기 자성층은 바인더 수지에 자성체 분말이 분산되어 형성될 수 있다.The magnetic layer may be formed by dispersing magnetic powder in a binder resin.
상기 자성체 분말은 상기 자성층의 전체 중량에 대하여 30 내지 90 중량%로 함유될 수 있다.The magnetic powder may be contained in 30 to 90% by weight based on the total weight of the magnetic layer.
상기 자성체 분말은 0.1 내지 30 ㎛의 평균 입도를 가질 수 있다.The magnetic powder may have an average particle size of 0.1 to 30 ㎛.
상기 자성층은 10 내지 500 ㎛의 두께를 가질 수 있다.The magnetic layer may have a thickness of 10 to 500 ㎛.
상기 점착층을 향하는 상기 변형 유지층의 일면과 대향하는 타면 상에 제공되어, 상기 변형 유지층을 지지하는 베이스 필름;을 더 포함할 수 있다.The base film is provided on the other surface facing the one surface of the strain holding layer facing the adhesive layer, to support the strain holding layer; may further include a.
상기 베이스 필름의 복원력은 상기 변형 유지층의 소성 변형이 가능한 항복값 이하일 수 있다.The restoring force of the base film may be equal to or less than a yield value at which plastic deformation of the strain holding layer is possible.
상기 점착층 및 상기 변형 유지층 중 적어도 어느 하나는 자성을 가질 수 있다.At least one of the adhesive layer and the strain holding layer may have magnetic properties.
상기 베이스 필름은 합성수지 소재로 이루어지며, 자성체 분말을 함유할 수 있다.The base film is made of a synthetic resin material, it may contain a magnetic powder.
상기 전자 부품 캐리어 시트는 10 내지 80 %의 연신율을 가질 수 있다.The electronic component carrier sheet may have an elongation of 10 to 80%.
상기 전자 부품 캐리어 시트는 25 내지 250 N/㎟의 인장 강도를 가질 수 있다.The electronic component carrier sheet may have a tensile strength of 25 to 250 N / mm 2.
본 발명의 다른 실시예에 따른 점착 장치는 점착 시트가 지지되는 지지 프레임; 상기 점착 시트의 제1 면 상에 제공되는 피점착물과 상기 점착 시트 중 적어도 하나에 압력을 부가하는 가압부; 및 상기 점착 시트의 제1 면 방향에 배치되어 상기 압력의 부가 시에 상기 피점착물이 지지되는 지지면을 제공하는 제1 플레이트;를 포함할 수 있다.Adhesive device according to another embodiment of the present invention is a support frame on which the adhesive sheet is supported; A pressurizing portion for applying pressure to at least one of the adherend and the pressure-sensitive adhesive sheet provided on the first surface of the pressure-sensitive adhesive sheet; And a first plate disposed in a direction of the first surface of the adhesive sheet and providing a support surface on which the adherend is supported when the pressure is added.
상기 제1 플레이트와 상기 지지 프레임의 사이에 제공되는 제1 패킹부재;를 더 포함하고, 상기 가압부는, 상기 제1 플레이트, 상기 지지 프레임 및 상기 제1 패킹부재에 의해 정의되는 공간에 부압을 형성하는 제1 기압 형성부를 포함할 수 있다.And a first packing member provided between the first plate and the support frame, wherein the pressing unit forms a negative pressure in a space defined by the first plate, the support frame, and the first packing member. It may include a first pressure forming portion.
상기 제1 면과 대향하는 상기 점착 시트의 제2 면 방향에 상기 제1 플레이트와 대향하여 제공되는 제2 플레이트; 및 상기 제1 플레이트와 상기 제2 플레이트의 간격을 조절하는 간격조절부;를 더 포함할 수 있다.A second plate provided to face the first plate in a second surface direction of the pressure-sensitive adhesive sheet facing the first surface; And a gap adjusting unit for adjusting a gap between the first plate and the second plate.
상기 제2 플레이트와 상기 지지 프레임의 사이에 제공되는 제2 패킹부재;를 더 포함하고, 상기 가압부는, 상기 제2 플레이트, 상기 지지 프레임 및 상기 제2 패킹부재에 의해 정의되는 공간에 정압을 형성하는 제2 기압 형성부를 더 포함할 수 있다.And a second packing member provided between the second plate and the support frame, wherein the pressing unit forms a positive pressure in a space defined by the second plate, the support frame, and the second packing member. The second pressure forming portion may further include.
상기 제1 플레이트와 상기 제2 플레이트 중 어느 하나의 가장자리에 나머지 하나를 향하여 연장되어 내측으로 절곡되며, 상기 지지 프레임을 지지하는 지지편;을 더 포함하고, 상기 나머지 하나에는 상기 지지편에 대응되어 삽입홈이 형성되며, 상기 지지 프레임은 상기 제1 플레이트와 상기 제2 플레이트의 간격 조절에 의해 상기 지지편과 상기 나머지 하나 간에 전달될 수 있다.A support piece extending toward the other one of the edges of one of the first plate and the second plate and bent inward and supporting the support frame, wherein the other one corresponds to the support piece An insertion groove is formed, and the support frame may be transferred between the support piece and the other one by adjusting the gap between the first plate and the second plate.
상기 피점착물을 수용 가능한 패턴홀이 형성되며, 상기 점착 시트의 제1 면과 상기 제1 플레이트의 사이에 제공되는 패턴 플레이트;를 더 포함할 수 있다.A pattern hole may be formed to accommodate the adherend, and the pattern plate may be provided between the first surface of the adhesive sheet and the first plate.
상기 패턴 플레이트는 상기 피점착물보다 얇은 두께를 가질 수 있다.The pattern plate may have a thickness thinner than that of the adherend.
상기 피점착물은 일면에 적어도 하나의 돌출 단자를 포함하는 반도체 패키지이고, 상기 점착 시트는, 그 일면에 상기 돌출 단자가 접촉되도록 상기 반도체 패키지가 부착되는 점착층; 및 상기 점착층의 일면과 대향하는 타면 상에 제공되며, 상기 압력에 의하여 상기 돌출 단자를 따라 소성 변형하는 변형 유지층을 포함하는 전자 부품 캐리어 시트일 수 있다.The adherend is a semiconductor package including at least one protruding terminal on one surface thereof, and the adhesive sheet includes: an adhesive layer to which the semiconductor package is attached so that the protruding terminal is in contact with one surface thereof; And a strain holding layer provided on the other surface facing the one surface of the adhesive layer and plastically deformed along the protruding terminal by the pressure.
상기 압력은 상기 변형 유지층의 소성 변형이 가능한 항복값 이상일 수 있다.The pressure may be equal to or higher than a yield value at which plastic deformation of the strain holding layer is possible.
상기 가압부는, 상기 제1 면과 대향하는 상기 점착 시트의 제2 면 방향에 제공되며, 상기 점착 시트의 제2 면을 가압하는 연성 재질 또는 브러쉬 형태의 롤러를 포함할 수 있다.The pressing unit may be provided in a second surface direction of the pressure-sensitive adhesive sheet facing the first surface, and may include a roller in the form of a soft material or a brush to press the second surface of the pressure-sensitive adhesive sheet.
본 발명의 또 다른 실시예에 따른 박막 형성장치는 자성을 갖는 층이 구비된 점착 시트를 포함하는 증착 대상물에 박막을 형성하기 위한 증착 물질을 제공하는 증착물질 제공부; 및 상기 증착 대상물을 지지하는 서셉터;를 포함하고, 상기 서셉터는, 상기 점착 시트에 대하여 인력을 제공하는 마그네트 플레이트; 및 상기 점착 시트를 냉각시키는 냉각 유닛을 포함할 수 있다.According to still another aspect of the present invention, there is provided a thin film forming apparatus comprising: a deposition material providing unit providing a deposition material for forming a thin film on a deposition target including an adhesive sheet having a magnetic layer; And a susceptor for supporting the deposition target, wherein the susceptor includes: a magnet plate providing an attractive force to the adhesive sheet; And it may include a cooling unit for cooling the adhesive sheet.
상기 마그네트 플레이트는, 상기 증착 대상물을 지지하는 스테이지; 및 상기 스테이지에 설치되고, 상기 스테이지를 따라 배열되는 복수 개의 단위 자석을 포함하는 자석체층;을 포함하고, 상기 냉각 유닛은 상기 스테이지의 내부에 형성되어, 상기 증착 대상물을 냉각시키기 위한 냉매의 유동 경로를 제공하는 냉각 유로;를 포함할 수 있다.The magnet plate, the stage for supporting the deposition object; And a magnet body layer disposed on the stage, the magnet body layer including a plurality of unit magnets arranged along the stage, wherein the cooling unit is formed in the stage to cool the deposition object. It may include; a cooling passage for providing.
상기 복수 개의 단위 자석은 상기 스테이지를 따라 인접한 단위 자석 간의 극성이 서로 교차하도록 배열될 수 있다.The plurality of unit magnets may be arranged such that polarities between adjacent unit magnets cross each other along the stage.
상기 서셉터는, 상기 스테이지 상에 제공되는 제1 열전 시트;를 더 포함하고, 상기 제1 열전 시트는 탄성을 가지는 물질로 형성될 수 있다.The susceptor may further include a first thermoelectric sheet provided on the stage, and the first thermoelectric sheet may be formed of an elastic material.
상기 자석체층은 상기 제1 열전 시트와 스테이지 사이에 설치되고, 상기 서셉터는, 상기 자석체층과 스테이지 사이에 제공되어 탄성을 가지는 물질로 형성되는 제2 열전 시트;를 더 포함할 수 있다.The magnet body layer may be disposed between the first thermoelectric sheet and the stage, and the susceptor may further include a second thermoelectric sheet provided between the magnet body layer and the stage and formed of an elastic material.
상기 스테이지는 중공형의 내부 공간을 가지며, 상기 자석체층은 상기 복수 개의 단위 자석이 인접한 단위 자석에 대하여 각각 소정 간격으로 이격 배열되도록 상기 스테이지의 내부 공간에 설치될 수 있다.The stage has a hollow inner space, and the magnet body layer may be installed in the inner space of the stage such that the plurality of unit magnets are arranged at predetermined intervals with respect to adjacent unit magnets, respectively.
상기 냉각 유로는, 상기 복수 개의 단위 자석 사이의 이격 공간을 따라 제공되는 제1 냉각 유로;를 포함할 수 있다.The cooling passage may include a first cooling passage provided along spaced spaces between the plurality of unit magnets.
상기 냉각 유로는, 상기 자석체층의 하부에 형성되는 제2 냉각 유로;를 더 포함하고, 상기 제1 냉각 유로와 제2 냉각 유로는 서로 연통될 수 있다.The cooling passage may further include a second cooling passage formed under the magnet body layer, wherein the first cooling passage and the second cooling passage may communicate with each other.
상기 제2 냉각 유로는 상기 제2 냉각 유로에 각각 연결되는 냉매 유입구 및 냉매 배출구 사이에서 선형으로 연장되어 냉매를 순환시키고, 상기 제1 냉각 유로는 상기 제2 냉각 유로로부터 공급되는 냉매를 상기 복수 개의 단위 자석 사이에서 확산시키도록 방사형으로 형성될 수 있다.The second cooling channel extends linearly between the refrigerant inlet port and the refrigerant outlet port respectively connected to the second cooling channel to circulate the refrigerant, and the first cooling channel includes the plurality of refrigerants supplied from the second cooling channel. It may be formed radially to diffuse between the unit magnets.
상기 자석체층은, 상기 복수 개의 단위 자석 사이에 각각 배치되어, 인접한 단위 자석 간의 간격을 각각 유지시키는 간격 유지 부재;를 더 포함할 수 있다.The magnet body layer may further include a spacing member disposed between the plurality of unit magnets to maintain a spacing between adjacent unit magnets, respectively.
상기 스테이지는 중공형의 내부 공간을 가지며, 상기 복수 개의 단위 자석은, 소정 두께를 가지는 복수 개의 제1 단위 자석; 및 상기 제1 단위 자석보다 얇은 두께를 가지는 복수 개의 제2 단위 자석;을 포함하고, 상기 자석체층은 상기 복수 개의 제2 단위 자석이 상기 복수 개의 제1 단위 자석 사이에 배열되도록 상기 스테이지의 내부 공간에 설치되고, 상기 냉각 유로는 상기 복수 개의 제2 단위 자석의 두께 방향의 공간을 따라 제공될 수 있다.The stage has a hollow inner space, the plurality of unit magnets, a plurality of first unit magnets having a predetermined thickness; And a plurality of second unit magnets having a thickness thinner than that of the first unit magnet, wherein the magnet body layer has an internal space of the stage such that the plurality of second unit magnets are arranged between the plurality of first unit magnets. The cooling passage may be provided along a space in a thickness direction of the plurality of second unit magnets.
상기 냉각 유로는 상기 복수 개의 단위 자석 중 적어도 일부의 단위 자석과 냉매가 직접 접촉되도록 제공될 수 있다.The cooling passage may be provided such that at least some of the unit magnets of the plurality of unit magnets come into direct contact with the refrigerant.
상기 복수 개의 단위 자석의 표면에는 냉매와의 접촉에 따른 부식을 방지하기 위한 부식 방지층이 형성될 수 있다.A corrosion prevention layer may be formed on the surfaces of the plurality of unit magnets to prevent corrosion due to contact with the refrigerant.
상기 부식 방지층은 자성을 가지는 물질로 형성될 수 있다.The corrosion protection layer may be formed of a material having magnetic properties.
상기 자석체층은,The magnet body layer,
상기 스테이지의 내부 공간의 상면에 배치되어, 상기 복수 개의 단위 자석을 고정시키는 자성판;을 더 포함할 수 있다.The magnetic plate may be disposed on an upper surface of the inner space of the stage to fix the plurality of unit magnets.
상기 스테이지의 상면은 볼록면, 오목면 및 굴곡면 중 어느 하나로 형성될 수 있다.The upper surface of the stage may be formed of any one of a convex surface, a concave surface and a curved surface.
상기 점착 시트는 전자 부품 캐리어 시트이며, 상기 증착 대상물은 상기 전자 부품 캐리어 시트 상에 부착되는 전자 부품을 더 포함하고, 상기 박막 형성장치는 상기 전자 부품의 노출된 표면에 상기 박막을 형성할 수 있다.The adhesive sheet may be an electronic component carrier sheet, and the deposition target may further include an electronic component attached to the electronic component carrier sheet, and the thin film forming apparatus may form the thin film on an exposed surface of the electronic component. .
본 발명의 실시 형태에 따른 전자 부품 캐리어 시트는 전자 부품이 부착되는 압력에 의하여 소성 변형되는 변형 유지층을 포함하여 전자 부품의 적어도 일면을 밀착 고정시킴으로써, 홀 또는 홈을 형성하지 않고도 전자 부품의 전극 부위 등 박막 형성을 원하지 않는 부분을 실링(sealing)하여 보호할 수 있다. 또한, 전자 부품의 표면 중 박막 형성을 원하지 않는 부분에 희생층을 형성하고 박막 형성공정을 수행한 후에 그 표면 상에 형성된 박막과 함께 희생층을 제거하는 등의 추가적인 공정 없이도 전자 부품을 전자 부품 캐리어 시트에 부착하는 것만으로 박막 형성을 원하지 않는 부분을 실링하여 보호할 수 있다.An electronic component carrier sheet according to an embodiment of the present invention includes a strain holding layer that is plastically deformed by a pressure to which an electronic component is attached, thereby closely fixing at least one surface of the electronic component, thereby forming an electrode of the electronic component without forming a hole or a groove. A portion such as a portion that is not desired to form a thin film may be protected by sealing. In addition, after forming a sacrificial layer on a portion of the surface of the electronic component that is not desired to form a thin film and performing the thin film forming process, the electronic component carrier may be removed without additional processes such as removing the sacrificial layer together with the thin film formed on the surface. Only by adhering to a sheet, the part which does not want thin film formation can be sealed and protected.
이에 박막 형성을 원하지 않는 부분에는 박막이 형성되지 않고 박막 형성을 원하는 부분에만 박막을 형성할 수 있으며, 전자 부품 캐리어 시트를 통해 전자 부품의 표면 중 박막 형성을 원하지 않는 부분을 실링하여 필요에 따라 선택적으로 박막 형성을 원하는 부분에만 박막을 형성할 수 있다. 또한, 전자 부품을 전자 부품 캐리어 시트에 부착하였을 때에 전자 부품과 전자 부품 캐리어 시트 사이에 틈이 발생하는 것을 방지할 수 있다. 이에 따라 박막 형성공정 시에 전자 부품과 전자 부품 캐리어 시트 사이의 틈으로 인해 전자 부품의 전극 부위가 오염되는 것도 방지할 수 있다.Accordingly, a thin film may be formed only at a portion where a thin film is not formed at a portion where the thin film is not formed, and a portion of the surface of the electronic component that is not desired to be formed is sealed through the electronic component carrier sheet, thereby selectively selecting the thin film. As a result, the thin film may be formed only at the portion where the thin film is desired. Further, when the electronic component is attached to the electronic component carrier sheet, it is possible to prevent the occurrence of a gap between the electronic component and the electronic component carrier sheet. Accordingly, the electrode portion of the electronic component may be prevented from being contaminated due to a gap between the electronic component and the electronic component carrier sheet during the thin film forming process.
그리고 전자 부품 캐리어 시트에 홀 또는 홈을 형성하지 않음으로써, 제조 공정이 단순해질 수 있고, 전자 부품의 외형에 상관없이 전자 부품을 전자 부품 캐리어 시트에 밀착 고정할 수 있다. 이로 인해 전자 부품의 배치 자유도가 높아질 수 있어 전자 부품을 밀집하여 배치할 수 있으며, 전자 부품이 스퍼터링(sputtering) 등의 박막 형성공정 중에 고온의 열에 의하여 손상 및 파손되는 것을 방지할 수도 있다.By not forming a hole or a groove in the electronic component carrier sheet, the manufacturing process can be simplified, and the electronic component can be closely fixed to the electronic component carrier sheet regardless of the appearance of the electronic component. As a result, the degree of freedom in arranging electronic components may be increased, so that the electronic components may be densely arranged, and the electronic components may be prevented from being damaged or damaged by high temperature heat during a thin film forming process such as sputtering.
한편, 전자 부품 캐리어 시트에 자성층을 포함하거나, 점착층, 변형 유지층 및 베이스 필름 중 적어도 하나가 자성을 갖도록 함으로써, 전자 부품 캐리어 시트를 박막 형성공정 중에 박막 형성장치의 마그네트 플레이트에 밀착되도록 할 수 있다. 이로 인해 스퍼터링 등의 박막 형성공정 중 전자 부품에 전달된 열이 전자 부품 캐리어 시트와 마그네트 플레이트로 잘 전달되어 박막 형성장치의 냉각 유닛을 통해 효과적으로 냉각될 수 있다. 또한, 전자 부품의 효과적인 냉각에 의하여 전자 부품을 허용 가능한 범위의 온도로 유지시킬 수 있다.On the other hand, by including a magnetic layer in the electronic component carrier sheet, or by having at least one of the adhesive layer, the strain holding layer and the base film has a magnetic, the electronic component carrier sheet can be in close contact with the magnet plate of the thin film forming apparatus during the thin film forming process. have. As a result, heat transferred to the electronic component during the thin film forming process such as sputtering may be transferred to the electronic component carrier sheet and the magnet plate to be effectively cooled through the cooling unit of the thin film forming apparatus. In addition, the effective cooling of the electronic component allows the electronic component to be maintained at an acceptable range of temperatures.
본 발명의 실시 형태에 따른 점착 장치는 점착 시트의 제1 면 상에 제공되는 피점착물을 점착 시트의 제1 면 방향에 제공되는 제1 플레이트 상에 지지시켜 점착 시트와 피점착물 중 적어도 하나에 압력을 부가함으로써, 점착 시트에 피점착물을 밀착시켜 점착시킬 수 있다. 이에 따라 점착 시트와 피점착물의 하면 사이에 발생되는 들뜸(gap) 현상을 방지할 수 있다.The pressure-sensitive adhesive device according to an embodiment of the present invention supports at least one of the pressure-sensitive adhesive sheet and the pressure-sensitive adhesive by supporting the adhesive to be provided on the first surface of the pressure-sensitive adhesive sheet on the first plate provided in the direction of the first surface of the pressure-sensitive adhesive sheet. By adding pressure to the adhesive sheet, the adherend can be adhered to the adhesive sheet. Thereby, the phenomenon of the gap which arises between the adhesive sheet and the lower surface of a to-be-adhered body can be prevented.
그리고 점착 시트와 제1 플레이트 사이의 공간에 부압(또는 진공)을 형성하여 점착 시트와 피점착물에 압력을 부가함으로써, 크랙(crack) 등의 피점착물의 손상 및 파티클의 발생 없이 점착 시트에 피점착물을 밀착시킬 수 있고, 점착 시트의 전체면에 일정한 압력이 부가될 수 있다.In addition, by forming a negative pressure (or vacuum) in the space between the adhesive sheet and the first plate and applying pressure to the adhesive sheet and the adherend, the adhesive sheet is prevented from being damaged and the generation of particles such as cracks. The adhesive may be in close contact, and a constant pressure may be added to the entire surface of the adhesive sheet.
또한, 점착 시트의 제2 면 방향에 제2 플레이트를 추가하고 점착 시트와 제2 플레이트 사이의 공간에 정압을 형성하여 점착 시트에 공기압을 부가함으로써, 점착 시트와 피점착물의 하면 사이에 들어갈 수 있는 미세한 기포(bubble)를 제거할 수 있고, 점착 시트와 피점착물이 보다 효과적으로 밀착될 수 있다.In addition, by adding a second plate in the direction of the second surface of the pressure sensitive adhesive sheet and forming a positive pressure in the space between the pressure sensitive adhesive sheet and the second plate to add air pressure to the pressure sensitive adhesive sheet, it is possible to enter between the lower surface of the pressure sensitive adhesive sheet and the adherend. Fine bubbles can be removed, and the adhesive sheet and the adherend can be adhered more effectively.
그리고 점착 시트의 제1 면 방향에 제공되는 패턴 플레이트를 통해 점착 시트가 가압될 때에 피점착물 주위의 점착 시트가 피점착물의 측면을 따라 올라가는 것을 억제 또는 방지할 수 있고, 이에 따라 점착 시트가 피점착물의 측면에 점착되는 면적을 최소화할 수 있다.And when the adhesive sheet is pressed through the pattern plate provided in the first surface direction of the adhesive sheet, the adhesive sheet around the adherend can be suppressed or prevented from rising along the side of the adherend, whereby the adhesive sheet is avoided. The area adhering to the side of the adhesive can be minimized.
한편, 점착 시트는 점착층과 변형 유지층을 포함하는 전자 부품 캐리어 시트이고, 피점착물은 돌출 단자를 포함하는 반도체 패키지일 수 있으며, 이러한 경우에 변형 유지층의 소성 변형이 가능한 항복값 이상의 압력을 점착 시트와 피점착물 중 적어도 하나에 부가함으로써, 돌출 단자가 있는 반도체 패키지의 하면도 전자 부품 캐리어 시트에 밀착시킬 수 있고, 전자 부품 캐리어 시트와 반도체 패키지의 하면 사이에 발생되는 들뜸 현상을 방지할 수 있다.Meanwhile, the pressure-sensitive adhesive sheet may be an electronic component carrier sheet including an adhesive layer and a strain holding layer, and the adhesive may be a semiconductor package including a protruding terminal, and in this case, a pressure equal to or higher than the yield value at which the strain holding layer may be plastically deformed. Is added to at least one of the adhesive sheet and the adherend, the lower surface of the semiconductor package with the protruding terminal can also be in close contact with the electronic component carrier sheet, preventing the lifting phenomenon generated between the electronic component carrier sheet and the lower surface of the semiconductor package. can do.
본 발명의 실시 형태에 따른 박막 형성장치에 의하면, 복수 개의 단위 자석을 포함하는 자석체층으로부터 제공되는 자력에 의하여 증착 대상물을 서셉터 상에 견고하게 밀착시킬 수 있다. 또한, 스테이지 상에 증착 대상물의 안착 면을 제공하는 열전 시트를 구비하여 증착 대상물과 스테이지 사이의 유효 접촉 면적을 증가시킬 수 있으며, 스테이지의 내부에 형성되는 냉각 유로를 통하여 냉매를 순환시켜 증착 공정을 수행함으로써, 전자 부품으로부터 점착 시트를 통하여 스테이지로 전달되는 열을 효과적으로 방출시킬 수 있다.According to the thin film forming apparatus according to the embodiment of the present invention, the deposition target can be firmly adhered on the susceptor by the magnetic force provided from the magnet body layer including the plurality of unit magnets. In addition, a thermoelectric sheet may be provided on the stage to provide a seating surface of the deposition target, thereby increasing an effective contact area between the deposition target and the stage, and circulating the refrigerant through a cooling passage formed in the stage to perform the deposition process. By doing this, heat transmitted from the electronic component to the stage through the adhesive sheet can be effectively released.
또한, 복수 개의 단위 자석 사이의 영역을 따라 냉각 유로를 형성하여 냉매를 유동시킴으로써 스테이지를 냉각시킴과 동시에 단위 자석까지도 냉각시킬 수 있게 되어, 온도 상승에 따른 자력의 저하를 방지하고 증착 대상물에 충분한 자력을 제공할 수 있다. 뿐만 아니라, 서로 다른 두께를 가지는 단위 자석을 배열하여 냉각 유로를 형성하여 냉매를 유동시킴으로써 스테이지를 따라 자기력선을 밀도있게 배열시킴과 동시에 스테이지 및 단위 자석을 효과적으로 냉각시킬 수도 있다.In addition, a cooling flow path is formed along the area between the plurality of unit magnets to cool the stage, and the unit magnets can be cooled at the same time as the refrigerant flows, thereby preventing a decrease in the magnetic force caused by the temperature rise and providing sufficient magnetic force to the deposition target. Can be provided. In addition, by arranging unit magnets having different thicknesses to form a cooling channel to flow a refrigerant, the magnetic force lines can be densely arranged along the stage, and the stage and unit magnets can be cooled effectively.
즉, 본 발명의 실시 형태에 따른 박막 형성장치에 의하면 고온의 환경으로 형성되는 증착 공정에서 반도체 패키지를 효과적으로 냉각시킴으로써 반도체 패키지 내에 배치되는 반도체 칩이 고온의 열에 의하여 손상되거나 반도체 패키지가 휘어지는 등의 현상이 발생하는 것을 방지할 수 있게 되며, 반도체 패키지의 제조 효율 및 생산 안정성을 향상시킬 수 있다.That is, according to the thin film forming apparatus according to the embodiment of the present invention, the semiconductor chip disposed in the semiconductor package is damaged by high temperature heat or the semiconductor package is bent by effectively cooling the semiconductor package in a deposition process formed in a high temperature environment. This can be prevented from occurring, and the manufacturing efficiency and production stability of the semiconductor package can be improved.
도 1은 본 발명의 일실시예에 따른 전자 부품 캐리어 시트를 나타낸 단면도.1 is a cross-sectional view showing an electronic component carrier sheet according to an embodiment of the present invention.
도 2는 본 발명의 일실시예에 따른 전자 부품 캐리어 시트에 전자 부품을 부착하는 공정을 설명하기 위한 개념도.2 is a conceptual diagram illustrating a process of attaching an electronic component to an electronic component carrier sheet according to an embodiment of the present invention.
도 3은 본 발명의 일실시예에 따른 전자 부품 표면의 박막 형성을 설명하기 위한 개념도.3 is a conceptual diagram illustrating a thin film formation on the surface of an electronic component according to an embodiment of the present invention.
도 4는 본 발명의 일실시예에 따른 자성층을 포함하는 전자 부품 캐리어 시트를 나타낸 단면도.4 is a cross-sectional view showing an electronic component carrier sheet including a magnetic layer according to an embodiment of the present invention.
도 5는 본 발명의 일실시예에 따른 베이스 필름을 포함하는 전자 부품 캐리어 시트를 나타낸 단면도.5 is a cross-sectional view showing an electronic component carrier sheet including a base film according to an embodiment of the present invention.
도 6은 본 발명의 다른 실시예에 따른 점착 장치를 나타낸 사시도.6 is a perspective view showing an adhesive device according to another embodiment of the present invention.
도 7은 본 발명의 다른 실시예에 따른 가압부에 의한 압력 부가를 설명하기 위한 개념도.7 is a conceptual view for explaining the pressure added by the pressing unit according to another embodiment of the present invention.
도 8은 본 발명의 다른 실시예에 따른 가압에 의한 점착 시트와 피점착물의 밀착을 설명하기 위한 개념도.8 is a conceptual view for explaining the adhesion of the adhesive sheet and the adherend by the pressure according to another embodiment of the present invention.
도 9는 본 발명의 다른 실시예에 따른 제1 기압 형성부와 제2 기압 형성부를 통한 가압을 설명하기 위한 개념도.FIG. 9 is a conceptual view for explaining pressurization through a first air pressure forming unit and a second air pressure forming unit according to another embodiment of the present invention; FIG.
도 10은 본 발명의 다른 실시예에 따른 지지편과 간격조절부를 포함하는 점착 장치를 나타낸 사시도.10 is a perspective view showing a pressure-sensitive adhesive device including a support piece and a gap adjusting portion according to another embodiment of the present invention.
도 11은 본 발명의 다른 실시예에 따른 지지편과 간격조절부를 설명하기 위한 개념도.11 is a conceptual view illustrating a support piece and a gap adjusting unit according to another embodiment of the present invention.
도 12는 본 발명의 다른 실시예에 따른 패턴 플레이트를 설명하기 위한 개념도.12 is a conceptual view illustrating a pattern plate according to another embodiment of the present invention.
도 13은 본 발명의 다른 실시예에 따른 롤러 형태의 가압부를 포함하는 점착 장치를 나타낸 개략도.13 is a schematic view showing a pressure-sensitive adhesive device including a pressing portion in the form of a roller according to another embodiment of the present invention.
도 14는 본 발명의 또 다른 실시예에 박막 형성장치를 나타낸 단면도.14 is a cross-sectional view showing a thin film forming apparatus in another embodiment of the present invention.
도 15은 본 발명의 또 다른 실시예에 따른 박막 형성장치를 개략적으로 나타내는 도면.15 is a schematic view of a thin film forming apparatus according to another embodiment of the present invention.
도 16은 본 발명의 제1 실시 예에 따른 서셉터의 모습을 나타내는 도면.16 is a view showing a susceptor according to a first embodiment of the present invention.
도 17은 본 발명의 제1 실시 예에 따른 냉각 유로가 형성되는 모습을 나타내는 도면.17 is a view showing a state in which a cooling passage according to the first embodiment of the present invention is formed.
도 18은 본 발명의 제1 실시 예에 따른 자석체층의 모습을 나타내는 도면.18 is a view showing a state of the magnet body layer according to the first embodiment of the present invention.
도 19는 본 발명의 제2 실시 예에 따른 서셉터의 모습을 나타내는 도면.19 is a view illustrating a susceptor according to a second embodiment of the present invention.
도 20은 본 발명의 제2 실시 예에 따른 자석체층의 모습을 나타내는 도면.20 is a view showing a state of the magnet body layer according to the second embodiment of the present invention.
도 21은 본 발명의 제3 실시 예에 따른 서셉터의 모습을 나타내는 도면.21 is a view showing a susceptor according to a third embodiment of the present invention.
이하에서는 첨부된 도면을 참조하여 본 발명의 실시예를 더욱 상세히 설명하기로 한다. 그러나 본 발명은 이하에서 개시되는 실시예에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 것이며, 단지 본 실시예들은 본 발명의 개시가 완전하도록 하며, 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이다. 설명 중, 동일 구성에 대해서는 동일한 참조부호를 부여하도록 하고, 도면은 본 발명의 실시예를 정확히 설명하기 위하여 크기가 부분적으로 과장될 수 있으며, 도면상에서 동일 부호는 동일한 요소를 지칭한다.Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention, and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. In the description, like reference numerals refer to like elements, and the drawings may be partially exaggerated in size in order to accurately describe embodiments of the present invention, and like reference numerals refer to like elements in the drawings.
도 1은 본 발명의 일실시예에 따른 전자 부품 캐리어 시트를 나타낸 단면도이다.1 is a cross-sectional view showing an electronic component carrier sheet according to an embodiment of the present invention.
도 1을 참조하면, 본 발명의 일실시예에 따른 전자 부품 캐리어 시트(100)는 전자 부품(10)이 일면에 부착되는 점착층(110); 및 상기 점착층(110)의 일면과 대향하는 타면 상에 제공되며, 상기 전자 부품(10)이 부착되는 압력에 의하여 소성 변형되는 변형 유지층(120);을 포함할 수 있다.Referring to FIG. 1, an electronic component carrier sheet 100 according to an embodiment of the present invention may include an adhesive layer 110 to which an electronic component 10 is attached to one surface thereof; And a strain holding layer 120 provided on the other surface of the adhesive layer 110 opposite to the one surface thereof and plastically deformed by the pressure to which the electronic component 10 is attached.
전자 부품 캐리어 시트(100)는 사각 시트(Sheet) 혹은 원판으로 형성될 수도 있고, 롤(roll) 형태로 제공될 수도 있으며, 전자 부품(10)을 일면(예를 들어, 상면)에 견고하게 밀착 고정하는 역할을 할 수 있다. 이때, 하나의 전자 부품 캐리어 시트(100)에는 적어도 하나 이상의 반도체 패키지가 밀집 대형으로 배치될 수 있다.The electronic component carrier sheet 100 may be formed as a square sheet or a disc, or may be provided in a roll form, and the electronic component 10 may be firmly adhered to one surface (for example, an upper surface). Can play a role of fixing. In this case, at least one semiconductor package may be arranged in a compact size in one electronic component carrier sheet 100.
점착층(110)은 그 일면에 전자 부품(10)이 부착(또는 점착)될 수 있으며, 반도체 패키지(11), 적층세라믹콘덴서(Multi Layer Ceramic Condenser; MLCC, 12) 등의 전자 부품(10)을 스퍼터링(sputtering) 등의 박막 형성공정까지는 부착(또는 밀착 고정)하여 전극 부위의 증착 오염을 방지하고, 공정 후에는 전자 부품 캐리어 시트(100)로부터 전자 부품(10)의 탈착이 용이하도록 점착하는 역할을 할 수 있다. 여기서, 전자 부품(10)은 일면(예를 들어, 하면)에 돌출 단자(11a) 등의 돌출부를 포함할 수 있으며, 반도체 패키지(11)는 일면에 복수의 솔더 볼(solder ball)이 매트릭스 형태로 배치된 볼 그리드 어레이(Ball Grid Array; BGA) 혹은 랜드(land) 형태의 복수의 금속 전극이 매트릭스 형태로 배치된 랜드 그리드 어레이(Land Grid Array; LGA) 패키지를 포함할 수 있다. 이때, 점착층(110)은 전자 부품(10)과 마주하게 배치될 수 있고, 전자 부품(10)은 점착층(110)과 마주하는 면을 부착면으로 하여 점착층(110)에 부착될 수 있다.The adhesive layer 110 may be attached (or adhered) to the electronic component 10 on one surface thereof, and the electronic component 10 such as the semiconductor package 11 and the multilayer ceramic capacitor (MLCC) 12. To a thin film forming process such as sputtering to prevent deposition contamination of the electrode portion, and to adhere to the electronic component carrier sheet 100 to facilitate the detachment of the electronic component 10 after the process. Can play a role. Here, the electronic component 10 may include a protrusion such as a protruding terminal 11a on one surface (for example, a bottom surface), and the semiconductor package 11 has a plurality of solder balls on one surface thereof in a matrix form. A ball grid array (BGA) or a plurality of metal electrodes in a land form may be included in a land grid array (LGA) package in a matrix form. In this case, the adhesive layer 110 may be disposed to face the electronic component 10, and the electronic component 10 may be attached to the adhesive layer 110 using a surface facing the adhesive layer 110 as an adhesive surface. have.
또한, 점착층(110)은 점착 물질을 포함할 수 있고, 점착성을 갖는 유동성 점착 물질을 막 형태로 가공하여 형성될 수 있다. 예를 들어, 상기 점착 물질은 실리콘 계열 점착 물질을 포함할 수 있으며, 이에 한정되지 않고, 점착층(110)을 이루는 점착 물질은 실리콘 계열 점착 물질 이외에도 다양한 물질이 사용될 수 있다.In addition, the adhesive layer 110 may include an adhesive material, and may be formed by processing a flowable adhesive material having adhesiveness into a film form. For example, the adhesive material may include a silicon-based adhesive material, and the present invention is not limited thereto. The adhesive material constituting the adhesive layer 110 may include various materials in addition to the silicone-based adhesive material.
그리고 점착층(110)은 200 내지 1,500 gf/in의 점착력을 가질 수 있다. 점착층(110)의 점착력이 200 gf/in보다 작을 경우에는 전자 부품(10)을 견고하게 점착 고정시키지 못하여 전자 부품 캐리어 시트(100)의 이동(또는 이송) 중 전자 부품(10)이 움직이거나 전자 부품 캐리어 시트(100)에서 이탈할 수 있다. 반면에, 점착층(110)의 점착력이 1,500 gf/in보다 클 경우에는 전자 부품(10)이 너무 견고하게 점착되어 박막 형성공정 후에 전자 부품 캐리어 시트(100)로부터 전자 부품(10)의 탈착이 어려워지거나 전자 부품(10)이 점착층(110)으로부터 깨끗하게 분리되지 못하고 점착층(110)의 일부(또는 이물질)가 전자 부품(10)의 부착면(예를 들어, 하면)에 남아있게 될 수 있다.The adhesive layer 110 may have an adhesive force of 200 to 1,500 gf / in. When the adhesive force of the adhesive layer 110 is smaller than 200 gf / in, the electronic component 10 may not move while the electronic component 10 is hardly adhesively fixed and the electronic component 10 may move during the movement (or transfer) of the electronic component carrier sheet 100. It may be detached from the electronic component carrier sheet 100. On the other hand, when the adhesive force of the adhesive layer 110 is greater than 1,500 gf / in, the electronic component 10 is adhered so firmly that detachment of the electronic component 10 from the electronic component carrier sheet 100 after the thin film forming process is prevented. It may be difficult or the electronic component 10 may not be cleanly separated from the adhesive layer 110, and a portion (or foreign matter) of the adhesive layer 110 may remain on the attachment surface (eg, the lower surface) of the electronic component 10. have.
한편, 점착층(110)은 5 내지 100 ㎛의 두께를 가질 수 있다. 점착층(110)의 두께가 5 ㎛보다 얇을 경우에는 대면적의 두께 균일도 확보가 어려워 전자 부품(10)의 부착 불량 및 전자 부품(10)의 부착면에 일부 오염 불량을 야기할 수 있고, 점착층(110)의 접착제 등의 응집력 문제로 점착층(110)의 일부가 떨어져 전자 부품(10)의 부착면에 남을 수 있다. 또한, 점착층(110)이 매우 쉽게 찢어지거나 파손되어 취급이 매우 어려울 뿐만 아니라 찢어지거나 파손된 부분에는 전자 부품(10)이 부착될 수 없다.On the other hand, the adhesive layer 110 may have a thickness of 5 to 100 ㎛. When the thickness of the adhesive layer 110 is thinner than 5 μm, it is difficult to secure the uniformity of the thickness of the large area, which may cause poor adhesion of the electronic component 10 and some contamination defects on the attachment surface of the electronic component 10. A portion of the adhesive layer 110 may fall and remain on the attachment surface of the electronic component 10 due to cohesion problems such as adhesive of the layer 110. In addition, since the adhesive layer 110 is very easily torn or broken, handling is very difficult, and the electronic component 10 may not be attached to the torn or broken portion.
반면에, 점착층(110)의 두께가 100 ㎛보다 두꺼울 경우에는 전자 부품(10)이 점착층(110)에 부착되는 과정에서 압력이 가해지더라도 가압력이 변형 유지층(120)에 잘 전달되지 않을 수 있다. 또한, 반도체 패키지(11)의 돌출 단자(11a) 등 밀집된 다수의 돌출부가 있을 경우에 돌출부의 사이사이에 두꺼운 점착층(110)이 개재되어 변형 유지층(120)의 개재 공간을 막아 전자 부품(10)의 형상에 따른 변형 유지층(120)의 형상 변화를 어렵게 만들 수 있다.On the other hand, when the thickness of the adhesive layer 110 is thicker than 100 μm, even if pressure is applied in the process of attaching the electronic component 10 to the adhesive layer 110, the pressing force may not be transmitted to the strain holding layer 120 well. Can be. In addition, when there are a plurality of protruding portions such as the protruding terminals 11a of the semiconductor package 11, a thick adhesive layer 110 is interposed between the protruding portions to block the intervening space of the strain holding layer 120, thereby preventing the electronic component ( It may be difficult to change the shape of the strain holding layer 120 according to the shape of 10).
변형 유지층(120)은 전자 부품(10)이 부착되는 점착층(110)의 일면과 대향하는 점착층(110)의 타면 상(예를 들어, 상기 점착층의 하부)에 제공될 수 있고, 점착층(110)에 접합(또는 접착)될 수 있으며, 전자 부품(10)이 부착되는 압력에 의하여 소성 변형될 수 있다. 즉, 변형 유지층(120)은 전자 부품(10)이 부착되는 압력(또는 외력)에 의하여 소성 변형된 후에 형상이 복원되지 않는 특징을 가질 수 있으며, 형상 복원 방지 필름일 수 있다. 예를 들어, 변형 유지층(120)은 전자 부품(10)이 점착층(110)에 부착되는 과정에서 점착층(110)에 가해진 압력에 의하여 형상이 변형될 수 있고, 형상이 변형되어 소성 변형된 후에는 원래 형상으로 복원되지 않을 수 있다. 이때, 전자 부품 캐리어 시트(100)에 함몰되는 전자 부품(10)의 일부(예를 들어, 상기 반도체 패키지의 돌출 단자)을 내부에 유지하여 고정할 수 있다. 이에 따라 점착층(110)과 전자 부품(10)의 부착면 사이에 들뜸(gap) 현상이 발생되는 것을 방지할 수 있고, 들뜸 현상으로 인해 전자 부품(10)의 전극 부위에 증착 오염이 발생되어 전자 부품(10)의 품질이 나빠지며 수율이 떨어지는 등의 문제점을 해결할 수 있다.The strain holding layer 120 may be provided on the other side of the adhesive layer 110 (for example, the lower portion of the adhesive layer) facing the one surface of the adhesive layer 110 to which the electronic component 10 is attached. The adhesive layer 110 may be bonded (or bonded) to the adhesive layer 110, and may be plastically deformed by a pressure to which the electronic component 10 is attached. That is, the deformation maintaining layer 120 may have a feature that the shape is not restored after plastic deformation by the pressure (or external force) to which the electronic component 10 is attached, and may be a shape restoration prevention film. For example, the strain holding layer 120 may be deformed by a pressure applied to the adhesive layer 110 while the electronic component 10 is attached to the adhesive layer 110, and the shape may be deformed and plastically deformed. Once restored, it may not be restored to its original shape. In this case, a part of the electronic component 10 (for example, the protruding terminal of the semiconductor package) recessed in the electronic component carrier sheet 100 may be held and fixed therein. Accordingly, it is possible to prevent the occurrence of a lift between the adhesive layer 110 and the attachment surface of the electronic component 10, and due to the lift phenomenon, deposition contamination occurs on the electrode portion of the electronic component 10. The quality of the electronic component 10 may be deteriorated and the yield may be reduced.
이때, 변형 유지층(120)의 형상이 변형된 후에 형상이 복원되지 않도록 하면서 취급성을 향상시키기 위해서는 변형 유지층(120)의 소재가 중요할 수 있으며, 변형 유지층(120)은 금속 필름(metal film)으로 이루어질(또는 형성될) 수 있다. 이때, 상기 금속 필름은 얇은 두께를 갖는 금속 시트(metal sheet) 또는 금속박(metal foil)을 포함할 수 있고, 전연성(malleability and ductility)을 갖는 금속 물질로 형성될 수 있다. 여기서, 상기 전연성은 압력을 받아 넓어지는 성질인 전성(malleability)과 인장력에 의해 신장하는 성질인 연성(ductility)을 모두 포함하는 의미로, 소성 가공을 하기 쉬운 성질(즉, 가소성)을 의미할 수 있다. 예를 들어, 연성이 풍부하고 가공성이 우수하여 매우 얇은 두께로 가공이 용이한 알루미늄, 알루미늄 합금, 구리 및 구리 합금 등으로 형성될 수 있다.In this case, the material of the strain holding layer 120 may be important in order to improve the handling while preventing the shape from being restored after the shape of the strain holding layer 120 is deformed, and the strain holding layer 120 may be formed of a metal film ( metal film). In this case, the metal film may include a metal sheet or a metal foil having a thin thickness, and may be formed of a metal material having malleability and ductility. Here, the malleability includes both malleability, which is a property that expands under pressure, and ductility, which is a property that is stretched by a tensile force, and may mean a property (ie, plasticity) that is easy to undergo plastic working. have. For example, it may be formed of aluminum, an aluminum alloy, copper, a copper alloy, and the like, which are rich in ductility and have excellent workability and are easily processed to a very thin thickness.
또한, 변형 유지층(120)의 형상이 변형된 후에 형상이 복원되지 않도록 하면서 취급성을 향상시키기 위해서는 변형 유지층(120)의 두께가 중요할 수 있다. 예를 들어, 변형 유지층(120)은 얇은 두께를 갖는 금속 시트, 금속 필름 또는 금속박 형태로 형성될 수 있다. 이때, 변형 유지층(120)은 3 내지 60 ㎛의 두께를 가질 수 있다. 변형 유지층(120)의 두께가 3 ㎛보다 얇을 경우에는 매우 쉽게 찢어지거나 파손되어 취급이 매우 어려울 수 있고, 변형 유지층(120)의 소성 변형이 가능한 항복값이 낮아져 전자 부품(10)의 함몰 부분(예를 들어, 상기 반도체 패키지의 돌출 단자)을 따라 소성 변형된 형상을 유지하기 어려워질 수 있다. 반면에, 변형 유지층(120)의 두께가 60 ㎛보다 두꺼울 경우에는 전자 부품(10)이 점착층(110)에 부착되는 과정에서 압력이 가해지더라도 형상이 전자 부품(10)의 함몰 부분의 형상을 따라 효과적으로 변형되지 않을 수 있다. 예를 들어, 변형 유지층(120)이 알루미늄으로 형성될 경우에는 5 내지 15 ㎛(약 9 ㎛)의 두께로 형성될 수 있으며, 변형 유지층(120)의 소재(또는 소재의 종류)에 따라 변형 유지층(120)의 두께가 변경될 수 있다.In addition, the thickness of the strain holding layer 120 may be important in order to improve the handleability while preventing the shape from being restored after the shape of the strain holding layer 120 is deformed. For example, the strain holding layer 120 may be formed in the form of a metal sheet, a metal film, or a metal foil having a thin thickness. At this time, the strain holding layer 120 may have a thickness of 3 to 60 ㎛. When the thickness of the strain holding layer 120 is thinner than 3 μm, the strain holding layer 120 may be very easily torn or broken, and may be very difficult to handle. It may be difficult to maintain plastically deformed shapes along portions (eg, protruding terminals of the semiconductor package). On the other hand, when the thickness of the strain holding layer 120 is greater than 60 μm, the shape of the recessed portion of the electronic component 10 may be obtained even when pressure is applied in the process of attaching the electronic component 10 to the adhesive layer 110. It may not be effectively deformed along. For example, when the strain holding layer 120 is formed of aluminum, it may be formed to a thickness of 5 to 15 μm (about 9 μm), and depending on the material (or type of material) of the strain holding layer 120. The thickness of the strain maintaining layer 120 may be changed.
그리고 변형 유지층(120)은 10 내지 80 %의 연신율을 가질 수 있다. 변형 유지층(120)의 연신율이 10 %보다 작을 경우에는 전자 부품(10)이 점착층(110)에 부착되는 과정에서 가해지는 압력에 의해 잘 늘어나지 않아 소성 변형되지 않거나 소성 변형시키기 위해 큰 가압력이 필요하게 될 수 있고, 소성 변형된다 하더라도 전자 부품(10)의 함몰 부분의 형상을 따라 정확하게 변형되지 않을 수 있다. 반면에, 변형 유지층(120)의 연신율이 80 %보다 클 경우에는 작은 외력(또는 외부 압력)으로도 너무 잘 늘어나 점착층(110)이 전자 부품(10)의 부착면에 밀착되도록 변형 유지층(120)을 소성 변형시키기 위한 핸들링이 어려워지므로, 점착층(110)이 전자 부품(10)의 부착면에 밀착될 수 있는 형상으로 변화되도록 하는 가압 조건을 만들기(또는 유지하기) 어려워질 뿐만 아니라 전체적으로 균일하게 가압하지 않는 경우에는 영역별 가압력의 차이에 따라 점착층(110)이 전자 부품(10)의 부착면에 고르게 부착되지 못하고 점착층(110)과 전자 부품(10)의 부착면 사이에 틈(또는 들뜸 현상)이 발생할 수 있다. 이로 인해 양산 안정성(stability)이 저하될 수 있다.In addition, the strain holding layer 120 may have an elongation of 10 to 80%. When the elongation of the strain holding layer 120 is less than 10%, the electronic component 10 is not easily stretched by the pressure applied in the process of being attached to the adhesive layer 110 so that the plastic strain is not deformed or a large pressing force is applied to plastic deformation. It may be necessary, and even if plastically deformed, it may not be precisely deformed along the shape of the recessed portion of the electronic component 10. On the other hand, when the elongation of the strain holding layer 120 is greater than 80%, the strain holding layer is formed so that the adhesive layer 110 is in close contact with the attachment surface of the electronic component 10 because the adhesive layer 110 extends too well even with a small external force (or external pressure). As the handling for plastic deformation of the 120 becomes difficult, not only it becomes difficult to create (or maintain) the pressurization condition that causes the adhesive layer 110 to change into a shape that can be in close contact with the attachment surface of the electronic component 10. In the case of not pressing uniformly as a whole, the pressure-sensitive adhesive layer 110 may not be evenly attached to the attachment surface of the electronic component 10 according to the difference in the pressing force for each region. A gap (or lift) may occur. This may lower the mass stability (stability).
도 2는 본 발명의 일실시예에 따른 전자 부품 캐리어 시트에 전자 부품을 부착하는 공정을 설명하기 위한 개념도로, 도 2(a)는 반도체 패키지를 전자 부품 캐리어 시트에 부착하는 그림이며, 도 2(b)는 반도체 패키지를 부착하는 압력에 의해 전자 부품 캐리어 시트의 변형 유지층이 소성 변형된 그림이고, 도 2(c)는 적층세라믹콘덴서(MLCC)를 전자 부품 캐리어 시트에 부착하는 그림이며, 도 2(d)는 적층세라믹콘덴서(MLCC)를 부착하는 압력에 의해 전자 부품 캐리어 시트의 변형 유지층이 소성 변형된 그림이다.FIG. 2 is a conceptual view illustrating a process of attaching an electronic component to an electronic component carrier sheet according to an embodiment of the present invention. FIG. 2 (a) is a view illustrating a semiconductor package attached to an electronic component carrier sheet. (b) is a figure in which the strain holding layer of the electronic component carrier sheet is plastically deformed by the pressure to attach the semiconductor package, and FIG. 2 (c) is a figure in which the multilayer ceramic capacitor (MLCC) is attached to the electronic component carrier sheet. FIG. 2 (d) is a diagram in which the strain holding layer of the electronic component carrier sheet is plastically deformed by a pressure for attaching a laminated ceramic capacitor (MLCC).
도 2를 참조하면, 변형 유지층(120)은 전자 부품(10)의 형상에 따라 소성 변형될 수 있으며, 점착층(110)에 부착 시 전자 부품 캐리어 시트(100) 또는 변형 유지층(120)에 함몰되는 전자 부품(10)의 함몰 부분(또는 상기 전자 부품의 부착면)의 형상에 따라 소성 변형될 수 있다.Referring to FIG. 2, the strain holding layer 120 may be plastically deformed according to the shape of the electronic component 10, and the electronic component carrier sheet 100 or the strain holding layer 120 may be attached to the adhesive layer 110. The plastic deformation may be performed according to the shape of the recessed portion (or the attachment surface of the electronic component) of the electronic component 10 recessed in the.
이때, 반도체 패키지(11) 등의 전자 부품(10)은 점착층(110)과 마주보게 배치된 상태(예를 들어, 상기 반도체 패키지의 경우에는 상기 돌출 단자가 상기 점착층과 마주보게 배치된 상태)에서 전자 부품(10)의 적어도 일부가 삽입(또는 함몰)되면서 전자 부품(10)이 점착층(110)과 접촉될 수 있고, 전자 부품(10)을 점착층(110)을 향하는 방향으로 가압함으로써, 전자 부품(10)의 부착면 혹은 접촉면(예를 들어, 상기 반도체 패키지의 돌출 단자)에 의하여 점착층(110) 및 변형 유지층(120)이 가압될 수 있다. 전자 부품(10)의 가압에 의하여 점착층(110) 및 변형 유지층(120)은 형상이 변형될 수 있고, 이로 인해 전자 부품(10)의 적어도 일부(예를 들어, 상기 돌출 단자)는 점착층(110)에 함몰되어 외부로 노출되지 않게 될 수 있으며, 전자 부품(10)에 의하여 변형 유지층(120)의 형상이 소성 변형된 후에는 변형 유지층(120)의 형상이 복원되지 않을 수 있다. 여기서, 전자 부품(10)을 점착층(110)을 향하는 방향으로 가압할 때에 소프트 롤러(soft roller) 등의 푸셔(pusher)가 전자 부품(10)을 직접 접촉하여 가압할 수도 있고, 공기압(air pressure)을 이용하여 간접적으로 전자 부품(10) 및/또는 전자 부품 캐리어 시트(100)에 압력을 부가할 수도 있다.In this case, the electronic component 10 such as the semiconductor package 11 is disposed to face the adhesive layer 110 (for example, in the case of the semiconductor package, the protruding terminal is disposed to face the adhesive layer). At least a portion of the electronic component 10 is inserted (or recessed) in the electronic component 10 may be in contact with the adhesive layer 110, the electronic component 10 in the direction toward the adhesive layer 110 As a result, the adhesive layer 110 and the strain holding layer 120 may be pressed by the attachment surface or the contact surface of the electronic component 10 (eg, the protruding terminal of the semiconductor package). The pressure-sensitive adhesive layer 110 and the deformation-retaining layer 120 may be deformed due to the pressurization of the electronic component 10, and thus, at least a part of the electronic component 10 (eg, the protruding terminal) may be attached. The shape of the strain holding layer 120 may not be restored after the plastic deformation of the shape of the strain holding layer 120 by the electronic component 10. have. Here, when the electronic component 10 is pressed in the direction toward the adhesive layer 110, a pusher such as a soft roller may directly contact the electronic component 10 and pressurize the air. pressure may be used to indirectly apply pressure to the electronic component 10 and / or the electronic component carrier sheet 100.
예를 들어, 전자 부품(10)이 점착층(110)에 부착되는 일면(즉, 부착면)에 적어도 하나의 돌출 단자(11a)를 포함하는 반도체 패키지(11)인 경우에는 솔더 볼 혹은 전극 등의 돌출 단자(11a)를 따라 소성 변형될 수 있다.For example, when the electronic component 10 is the semiconductor package 11 including at least one protruding terminal 11a on one surface (that is, the attachment surface) attached to the adhesive layer 110, the solder ball or the electrode may be used. It may be plastically deformed along the protruding terminal 11a.
또한, 전자 부품(10)이 적층세라믹콘덴서(12)인 경우에는 도 2(c)에서와 같이, 소정 깊이만큼 적층세라믹콘덴서(12)의 적어도 일부가 전자 부품 캐리어 시트(100)에 함몰되어 적층세라믹콘덴서(12)의 하면 뿐만 아니라 측면의 적어도 일부에도 점착층(110)이 부착될 수 있다. 그리고 도 2(d)에서와 같이, 전자 부품 캐리어 시트(100)에 함몰된 적층세라믹콘덴서(12)의 하면 및 측면의 적어도 일부의 형상에 따라 소성 변형될 수 있다.In addition, when the electronic component 10 is a laminated ceramic capacitor 12, at least a part of the laminated ceramic capacitor 12 is recessed and laminated on the electronic component carrier sheet 100 by a predetermined depth, as shown in FIG. 2 (c). The adhesive layer 110 may be attached to not only the bottom surface of the ceramic capacitor 12 but also at least a portion of the side surface thereof. As shown in FIG. 2 (d), plastic deformation may be performed according to the shape of at least a portion of the bottom surface and the side surface of the multilayer ceramic capacitor 12 recessed in the electronic component carrier sheet 100.
여기서, 점착층(110) 또는 변형 유지층(120)은 전자 부품(10)의 함몰 부분의 높이보다 얇은 두께를 가질 수 있다. 예를 들어, 점착층(110) 또는 변형 유지층(120)은 전자 부품(10)이 함몰되는 상기 소정 깊이보다 얇은 두께를 가질 수 있으며, 돌출 단자(11a)만 전자 부품 캐리어 시트(100)에 함몰되는 경우에는 돌출 단자(11a)의 높이보다 얇은 두께를 가질 수 있다.Here, the adhesive layer 110 or the strain holding layer 120 may have a thickness thinner than the height of the recessed portion of the electronic component 10. For example, the adhesive layer 110 or the strain holding layer 120 may have a thickness thinner than the predetermined depth in which the electronic component 10 is recessed, and only the protruding terminal 11a is attached to the electronic component carrier sheet 100. In the case of depression, it may have a thickness thinner than the height of the protruding terminal 11a.
점착층(110) 또는 변형 유지층(120)이 전자 부품(10)의 함몰 부분의 높이 이상의 두께를 가질 경우, 변형 유지층(120)에 전자 부품(10)이 부착되는 압력이 잘 전달되지 않아 변형 유지층(120)이 소성 변형이 가능한 항복값 이상의 가압력을 받지 못하고 소성 변형되지 못하거나 두꺼운 두께로 인해 전자 부품(10)의 모서리 부분 등에서 유연하게 굴곡되지 못하여 변형 유지층(120)이 전자 부품(10)의 함몰 부분의 형상에 따라 정확하게 변형되지 않을 수 있다. 특히, 반도체 패키지(11)의 돌출 단자(11a) 등 전자 부품(10)의 부착면에 밀집된 다수의 돌출부가 있을 경우에 돌출부의 사이사이에 두꺼운 점착층(110)이 개재되어 변형 유지층(120)의 개재 공간을 막거나 변형 유지층(120)의 두꺼운 두께로 인해 개재되지 못하여 전자 부품(10)의 함몰 부분의 형상에 따른 변형 유지층(120)의 형상 변화를 어렵게 만들 수 있다.When the adhesive layer 110 or the strain holding layer 120 has a thickness greater than or equal to the height of the recessed portion of the electronic component 10, the pressure at which the electronic component 10 is attached to the strain holding layer 120 may not be transmitted well. The strain retaining layer 120 does not receive a pressing force greater than the yield value capable of plastic deformation and cannot be plastically deformed or flexibly bent at an edge portion of the electronic component 10 due to a thick thickness, such that the strain retaining layer 120 is not covered by the electronic component. It may not be deformed correctly depending on the shape of the recessed portion of (10). In particular, when there are a plurality of protrusions that are concentrated on the attachment surface of the electronic component 10 such as the protruding terminal 11a of the semiconductor package 11, a thick adhesive layer 110 is interposed between the protrusions so that the strain holding layer 120 is disposed. It is not possible to block the intervening space of the c) or due to the thick thickness of the strain holding layer 120, thereby making it difficult to change the shape of the strain holding layer 120 according to the shape of the recessed portion of the electronic component 10.
도 3은 본 발명의 일실시예에 따른 전자 부품 표면의 박막 형성을 설명하기 위한 개념도로, 도 3(a)는 반도체 패키지의 표면 상에 박막이 형성된 그림이며, 도 3(b)는 박막이 형성된 반도체 패키지를 전자 부품 캐리어 시트로부터 탈착시키는 그림이고, 도 3(c)는 적층세라믹콘덴서(MLCC)의 표면 상에 박막이 형성된 그림이며, 도 3(d)는 박막이 형성된 적층세라믹콘덴서(MLCC)를 전자 부품 캐리어 시트로부터 탈착시키는 그림이다.3 is a conceptual view illustrating the formation of a thin film on the surface of an electronic component according to an embodiment of the present invention. FIG. 3 (a) is a drawing in which a thin film is formed on the surface of a semiconductor package. FIG. 3 (c) is a diagram in which a thin film is formed on a surface of a multilayer ceramic capacitor (MLCC), and FIG. 3 (d) is a multilayer ceramic capacitor (MLCC) in which a thin film is formed. ) Is a figure detaching from the electronic component carrier sheet.
도 3을 참조하면, 전자 부품(10)은 전자 부품 캐리어 시트(100)에 점착(또는 밀착 고정)된 상태에서 스퍼터링 등의 박막 형성공정이 수행될 수 있다. 이로 인해 전자 부품(10)의 표면 중 전자 부품 캐리어 시트(100)에 점착되지 않은 노출된 표면에는 박막(예를 들어, 전차파를 차폐하기 위한 금속막 또는 전자파 차폐막)이 형성될 수 있고, 전자 부품 캐리어 시트(100)에 점착되어 노출되지 않는 표면에는 박막(20)이 형성되지 않을 수 있다. 예를 들어, 전자 부품(10)이 반도체 패키지(11)인 경우, 노출된 반도체 패키지(11)의 측면들 및 상면에는 금속막이 형성될 수 있고, 솔더 볼 혹은 전극 등의 돌출 단자(11a)가 형성된 반도체 패키지(11)의 하면은 전자 부품 캐리어 시트(100)에 의해 실링(sealing)되어 금속막이 형성되지 않을 수 있다. 이를 통해 전자 부품(10)의 표면 중 박막 형성을 원하지 않는 부분을 실링하여 필요에 따라 선택적으로 박막 형성을 원하는 부분에만 박막을 형성할 수 있다.Referring to FIG. 3, the electronic component 10 may be a thin film forming process such as sputtering in a state in which the electronic component 10 is adhered to (or tightly fixed to) the electronic component carrier sheet 100. As a result, a thin film (for example, a metal film or an electromagnetic shielding film for shielding electric waves) may be formed on an exposed surface of the surface of the electronic component 10 that is not adhered to the electronic component carrier sheet 100, and The thin film 20 may not be formed on the surface of the component carrier sheet 100 that is not exposed to the component carrier sheet 100. For example, when the electronic component 10 is the semiconductor package 11, a metal film may be formed on side surfaces and an upper surface of the exposed semiconductor package 11, and the protruding terminals 11a such as solder balls or electrodes may be formed. The lower surface of the formed semiconductor package 11 may be sealed by the electronic component carrier sheet 100 so that a metal film may not be formed. As a result, a portion of the surface of the electronic component 10 may be formed by sealing a portion of the surface on which the thin film is not desired to be selectively formed only in a portion desired to form the thin film.
예를 들어, 전자 부품 캐리어 시트(100)에는 전자 부품(10)이 점착(또는 탑재)될 수 있고, 전자 부품(10)이 배치된 전자 부품 캐리어 시트(100)가 부착 이송되어 후술하는 박막 형성장치로 이송된 후에 박막 형성장치 내에서 전자 부품(10) 표면의 박막 형성공정이 진행될 수 있다. 이때, 박막 형성장치 내에서 스퍼터링 공정이 수행되어 전자 부품(10)의 노출된 표면(예를 들어, 상기 반도체 패키지의 측면들 및 상면)에는 전자파를 차폐하기 위한 금속막이 형성될 수 있다. 박막(20)이 전자 부품(10)의 노출된 표면에 형성되면, 피커(picker, 30)가 전자 부품 캐리어 시트(100)에 배치된 전자 부품(10)을 픽업(pick-up)하여 후속 공정으로 이송할 수 있다.For example, the electronic component 10 may be adhered (or mounted) to the electronic component carrier sheet 100, and the electronic component carrier sheet 100 on which the electronic component 10 is disposed is attached and transferred to form a thin film to be described later. After the transfer to the device, a thin film forming process on the surface of the electronic component 10 may be performed in the thin film forming apparatus. In this case, a sputtering process may be performed in the thin film forming apparatus so that a metal film may be formed on the exposed surface (eg, side surfaces and the top surface of the semiconductor package) of the electronic component 10 to shield electromagnetic waves. When the thin film 20 is formed on the exposed surface of the electronic component 10, a picker 30 picks up the electronic component 10 disposed on the electronic component carrier sheet 100 to perform a subsequent process. Can be transported with.
여기서, 전자 부품 캐리어 시트(100)를 박막 형성장치에 투입하여 박막 형성공정을 진행할 때에 전자 부품(10)은 고온 환경에 노출되고 이로 인해 반도체 패키지(11) 내에 배치되는 반도체 칩 등의 전자 부품(10)이 고온의 열에 의해 손상될 수 있기 때문에 전자 부품(10)의 신속한 냉각은 필수적이다.Here, when the electronic component carrier sheet 100 is inserted into the thin film forming apparatus and the thin film forming process is performed, the electronic component 10 is exposed to a high temperature environment, and thus, the electronic component such as a semiconductor chip disposed in the semiconductor package 11 ( Rapid cooling of the electronic component 10 is essential because 10) may be damaged by high temperature heat.
변형 유지층(120)은 상온에서 200 W/m·K 이상의 열전도율을 가질 수 있다. 즉, 변형 유지층(120)은 우수한 열전도율을 가질 수 있다. 스퍼터링 등의 박막 형성공정에서는 고온의 열이 발생할 수 있으며, 고온의 열에 의하여 전자 부품(10)이 손상 및 파손되는 것을 방지할 수 있도록 전자 부품 캐리어 시트(100)의 방열 특성도 중요하다. 이에 전자 부품 캐리어 시트(100)는 박막 형성공정 도중 전자 부품(10)으로 제공된 열을 신속하게 외부로 전달하여 전자 부품(10)으로 제공된 열을 빠르게 방열하는 역할도 함께 할 수 있다.The strain holding layer 120 may have a thermal conductivity of 200 W / m · K or more at room temperature. That is, the strain holding layer 120 may have excellent thermal conductivity. In a thin film forming process such as sputtering, high temperature heat may be generated, and heat dissipation characteristics of the electronic component carrier sheet 100 are also important to prevent the electronic component 10 from being damaged and broken by high temperature heat. Accordingly, the electronic component carrier sheet 100 may also quickly transmit heat provided to the electronic component 10 to the outside during the thin film forming process to quickly dissipate heat provided to the electronic component 10.
예를 들어, 변형 유지층(120)은 열전도율이 높은 금속 물질로 형성될 수 있으며, 전자 부품(10)으로부터 전달(또는 발생)되는 열을 흡수하여 박막 형성장치의 서셉터(220)로 전달할 수 있다. 이때, 변형 유지층(120)이 알루미늄 소재 또는 구리 소재로 형성될 경우에는 전자 부품(10)으로 제공된 열을 신속하게 외부로 방열할 수 있다. 이로 인해 스퍼터링 등의 박막 형성공정 도중 고온의 환경에 노출되는 전자 부품(10)을 신속하게 냉각시킬 수 있다. 이에 따라 반도체 패키지(11) 내에 배치되는 반도체 칩 등의 전자 부품(10)이 고온의 열에 의하여 손상되는 것을 방지할 수 있고, 반도체 패키지(11)가 휘어지는 등의 전자 부품(10)의 변형을 방지할 수 있다.For example, the strain holding layer 120 may be formed of a metal material having a high thermal conductivity, and may absorb and transfer heat transferred from the electronic component 10 to the susceptor 220 of the thin film forming apparatus. have. In this case, when the strain holding layer 120 is formed of an aluminum material or a copper material, heat provided to the electronic component 10 may be quickly radiated to the outside. For this reason, the electronic component 10 exposed to a high temperature environment during the thin film formation process, such as sputtering, can be cooled rapidly. Accordingly, the electronic component 10 such as the semiconductor chip disposed in the semiconductor package 11 can be prevented from being damaged by high temperature heat, and the deformation of the electronic component 10 such as the semiconductor package 11 is bent can be prevented. can do.
이때, 변형 유지층(120)의 열전도율이 상온에서 200 W/m·K보다 작은 경우에는 전자 부품(10)으로부터 전달되는 열을 흡수하여 박막 형성장치의 서셉터(220)에 전달할 수 있는 열량에 한계가 있어 스퍼터링 등의 박막 형성공정 도중 고온의 환경에 노출되는 전자 부품(10)을 신속하게 냉각시키지 못하고 전자 부품(10)이 고온의 열에 의하여 손상될 수 있다. 변형 유지층(120)의 열전도율은 높으면 높을수록 좋으나, 변형 유지층(120)의 다른 특성을 갖기 위한 재료적 한계로 인해 상한의 열전도율이 상온에서 450 W/m·K일 수 있으며, 바람직하게는 변형 유지층(120)은 상온에서 200 내지 450 W/m·K의 열전도율을 가질 수 있다.At this time, when the thermal conductivity of the strain holding layer 120 is less than 200 W / m · K at room temperature, the amount of heat that is absorbed from the electronic component 10 and transferred to the susceptor 220 of the thin film forming apparatus is absorbed. Due to the limitation, the electronic component 10 may not be rapidly cooled during the thin film formation process such as sputtering, and the electronic component 10 may be damaged by high temperature heat. The higher the thermal conductivity of the strain holding layer 120 is higher, the higher the thermal conductivity of the strain holding layer 120 may be 450 W / m · K at room temperature, preferably due to material limitations to have other characteristics of the strain holding layer 120, The strain holding layer 120 may have a thermal conductivity of 200 to 450 W / m · K at room temperature.
따라서, 변형 유지층(120)은 점착층(110)과 전자 부품(10)의 부착면 사이에 들뜸 현상을 방지할 수 있고, 높은 열전도율을 가지게 되어 전자 부품(10)으로부터 전달되는 열이 점착층(110)을 거쳐 서셉터(220)까지 효과적으로 전달될 수 있도록 하며, 우수한 막질의 박막을 전자 부품(10)의 표면에 형성할 수 있다.Therefore, the strain holding layer 120 may prevent the lifting phenomenon between the adhesive layer 110 and the attachment surface of the electronic component 10, and may have a high thermal conductivity so that heat transferred from the electronic component 10 may be adhered to the adhesive layer. It can be effectively delivered to the susceptor 220 through the (110), it is possible to form a thin film of excellent film quality on the surface of the electronic component (10).
하지만, 전자 부품 캐리어 시트(100)가 서셉터(220)와 밀착되지 않을 경우에는 전자 부품 캐리어 시트(100)로 제공된 열을 방열하기 쉽지 않을 수 있다.However, when the electronic component carrier sheet 100 is not in close contact with the susceptor 220, it may not be easy to dissipate heat provided to the electronic component carrier sheet 100.
이에 점착층(110) 및 변형 유지층(120) 중 적어도 어느 하나는 자성을 가질 수 있다. 이때, 전자 부품 캐리어 시트(100)를 서셉터(220)에 밀착시키기 위해 서셉터(220)는 마그네트 플레이트(221)를 포함할 수 있고, 마그네트 플레이트(221)의 내부 또는 후면에 냉각 유닛(222)이 설치(또는 배치)되어 마그네트 플레이트(221) 및/또는 전자 부품 캐리어 시트(100)를 냉각시킬 수 있다. 마그네트 플레이트(221)에서 발생된 자력으로 전자 부품 캐리어 시트(100)에 인력을 발생시켜(또는 제공하여) 전자 부품 캐리어 시트(100)를 서셉터(220)에 밀착시키기 위해 점착층(110) 및 변형 유지층(120) 중 적어도 어느 하나는 자성을 가질 수 있다.Accordingly, at least one of the adhesive layer 110 and the strain holding layer 120 may have magnetic properties. In this case, the susceptor 220 may include a magnet plate 221 to closely contact the electronic component carrier sheet 100 to the susceptor 220, and the cooling unit 222 may be disposed inside or at the rear of the magnet plate 221. ) May be installed (or disposed) to cool the magnet plate 221 and / or the electronic component carrier sheet 100. The pressure-sensitive adhesive layer 110 and the adhesive layer 110 to generate (or provide) the electronic component carrier sheet 100 by the magnetic force generated in the magnet plate 221 to bring the electronic component carrier sheet 100 into close contact with the susceptor 220. At least one of the strain holding layers 120 may have magnetic properties.
예를 들어, 점착층(110)은 자성체 분말(132)을 함유할 수 있다. 비자성체인 물질로 이루어진 점착층(110)에 분말 형태의 자성체 금속 분말 등의 자성체 분말(132)을 첨가함으로써, 점착층(110)의 점착성은 유지시키면서 두께 조절이 가능할 뿐만 아니라 마치 자성체 박막과 유사한 특성을 가질 수 있다. 즉, 점착층(110)에 자성체 분말(132)을 첨가함으로써, 전자 부품 캐리어 시트(100)가 마그네트 플레이트(221)에서 발생된 자력에 의해 서셉터(220)에 밀착될 수 있다. 이로 인해 전자 부품(10)에 전달된 열은 전자 부품 캐리어 시트(100)를 통해 마그네트 플레이트(221) 및/또는 냉각 유닛(222)에 제공되어 전자 부품(10)을 신속하게 냉각시킬 수 있다. 여기서, 자성체 분말(132)을 점착층(110)에 혼합할 때에 자성체 분말(132)이 자성체 금속막과 유사한 기능을 수행할 수 있도록 하기 위해 자성체 분말(132)이 함유된 점착층(110)은 약 50 ㎛의 두께로 형성될 수 있다. 하지만, 자성체 분말(132)이 함유된 점착층(110)의 두께는 이에 한정되지 않고, 자성체 분말(132)의 소재, 자성체 분말(132)의 크기(size) 또는 평균 입도, 자성체 분말(132)의 밀도 등에 따라 약 50 ㎛ 이상 또는 약 50 ㎛ 이하로 조절될 수도 있다. 한편, 변형 유지층(120)이 풍부한 연성 및 가공성에 의하여 매우 얇은 두께로 가공되는 비자성체 금속 필름으로 형성되는 경우에는 자기장이 통과할 수 있는 비자성체 금속 소재로 변형 유지층(120)을 형성할 수 있다.For example, the adhesive layer 110 may contain the magnetic powder 132. By adding magnetic powder 132 such as magnetic metal powder in powder form to the adhesive layer 110 made of a non-magnetic material, thickness of the adhesive layer 110 can be maintained while maintaining the adhesiveness, similar to that of a magnetic thin film. Can have characteristics. That is, by adding the magnetic powder 132 to the adhesive layer 110, the electronic component carrier sheet 100 may be in close contact with the susceptor 220 by the magnetic force generated in the magnet plate 221. As a result, heat transferred to the electronic component 10 may be provided to the magnet plate 221 and / or the cooling unit 222 through the electronic component carrier sheet 100 to rapidly cool the electronic component 10. Here, in order to enable the magnetic powder 132 to perform a function similar to the magnetic metal film when the magnetic powder 132 is mixed with the adhesive layer 110, the adhesive layer 110 containing the magnetic powder 132 may be formed. It may be formed to a thickness of about 50 μm. However, the thickness of the adhesive layer 110 containing the magnetic powder 132 is not limited thereto, the material of the magnetic powder 132, the size or average particle size of the magnetic powder 132, the magnetic powder 132 It may be adjusted to about 50 μm or more or about 50 μm or less, depending on the density thereof. On the other hand, when the strain retaining layer 120 is formed of a nonmagnetic metal film processed to a very thin thickness due to rich ductility and workability, the strain retaining layer 120 may be formed of a nonmagnetic metal material through which a magnetic field may pass. Can be.
또한, 변형 유지층(120)은 자성체 금속 필름으로 형성될 수 있다. 이러한 경우에도 전자 부품 캐리어 시트(100)가 마그네트 플레이트(221)에서 발생된 자력에 의해 서셉터(220)에 밀착될 수 있고, 이로 인해 전자 부품(10)에 전달된 열은 전자 부품 캐리어 시트(100)를 통해 마그네트 플레이트(221) 및/또는 냉각 유닛(222)에 제공되어 전자 부품(10)을 신속하게 냉각시킬 수 있다. 여기서, 상기 자성체 금속은 철(Fe), 코발트(Co), 니켈(Ni) 및 그 화합물을 포함할 수 있다.In addition, the strain holding layer 120 may be formed of a magnetic metal film. Even in this case, the electronic component carrier sheet 100 may be in close contact with the susceptor 220 by the magnetic force generated in the magnet plate 221, and thus the heat transferred to the electronic component 10 may be transferred to the electronic component carrier sheet ( Through the 100, the magnet plate 221 and / or the cooling unit 222 may be provided to rapidly cool the electronic component 10. Here, the magnetic metal may include iron (Fe), cobalt (Co), nickel (Ni) and the compound thereof.
도 4는 본 발명의 일실시예에 따른 자성층을 포함하는 전자 부품 캐리어 시트를 나타낸 단면도로, 도 4(a)는 자성층을 포함하는 전자 부품 캐리어 시트를 나타내고, 도 4(b)는 자성층을 포함하는 전자 부품 캐리어 시트의 변형 유지층의 소성 변형을 나타낸다.4 is a cross-sectional view illustrating an electronic component carrier sheet including a magnetic layer according to an embodiment of the present invention. FIG. 4 (a) illustrates an electronic component carrier sheet including a magnetic layer, and FIG. 4 (b) includes a magnetic layer. The plastic deformation of the strain holding layer of the electronic component carrier sheet is shown.
도 4를 참조하면, 본 발명에 따른 전자 부품 캐리어 시트(100)는 점착층(110)을 향하는 변형 유지층(120)의 일면과 대향하는 타면 상에 제공되는 자성층(130);을 더 포함할 수 있다. 자성층(130)은 점착층(110)을 향하는 변형 유지층(120)의 일면과 대향하는 변형 유지층(120)의 타면 상에 제공될 수 있다. 예를 들어, 자성층(130)은 자성체 박막으로 형성될 수 있으며, 자성체 금속 분말이 막 형태로 형성된 자성체 금속막으로 형성될 수 있다. 전자 부품 캐리어 시트(100)가 자성층(130)을 포함하는 경우, 전자 부품 캐리어 시트(100)가 마그네트 플레이트(221)에서 발생된 자력에 의해 서셉터(220)에 밀착될 수 있다. 이로 인해 전자 부품(10)에 전달된 열은 전자 부품 캐리어 시트(100)를 통해 마그네트 플레이트(221) 및/또는 냉각 유닛(222)에 제공되어 전자 부품(10)을 신속하게 냉각시킬 수 있다.Referring to FIG. 4, the electronic component carrier sheet 100 according to the present invention may further include a magnetic layer 130 provided on the other surface of the strain maintaining layer 120 facing the adhesive layer 110. Can be. The magnetic layer 130 may be provided on the other surface of the strain holding layer 120 facing one surface of the strain holding layer 120 facing the adhesive layer 110. For example, the magnetic layer 130 may be formed of a magnetic thin film, and may be formed of a magnetic metal film in which magnetic metal powder is formed in a film form. When the electronic component carrier sheet 100 includes the magnetic layer 130, the electronic component carrier sheet 100 may be in close contact with the susceptor 220 by the magnetic force generated by the magnet plate 221. As a result, heat transferred to the electronic component 10 may be provided to the magnet plate 221 and / or the cooling unit 222 through the electronic component carrier sheet 100 to rapidly cool the electronic component 10.
여기서, 자성층(130)은 바인더 수지(131)에 자성체 분말(132)이 분산되어 형성될 수 있다. 이러한 경우, 자성층(130)의 두께를 늘리는 데에 유리할 수 있으며, 자성체 분말(132)의 함량을 조절하여 자성의 강도를 조절할 수 있고, 동일한 강도의 자성을 갖는 상태로 자성층(130)의 두께만을 조절할 수 있어 변형 유지층(120)의 두께 등에 따라 변형 유지층(120)을 안정적으로 지지할 수 있는 두께로 자성층(130)을 형성할 수 있다. 또한, 바인더 수지(131)로 인해 연성 및/또는 탄성을 제공하여 완충(buffer) 역할을 함으로써, 변형 유지층(120)의 변형 범위를 제한할 수도 있으며, 이에 따라 변형 유지층(120)의 찢어짐 및/또는 파손을 방지할 수도 있다.Here, the magnetic layer 130 may be formed by dispersing the magnetic powder 132 in the binder resin 131. In this case, it may be advantageous to increase the thickness of the magnetic layer 130, it is possible to control the strength of the magnetic by controlling the content of the magnetic powder 132, only the thickness of the magnetic layer 130 in the state having the same strength of the magnetic The magnetic layer 130 may be formed to a thickness capable of stably supporting the strain holding layer 120 according to the thickness of the strain holding layer 120. In addition, the binder resin 131 may provide softness and / or elasticity to act as a buffer, thereby limiting a deformation range of the strain holding layer 120, and thus tearing of the strain holding layer 120. And / or breakage may be prevented.
이때, 자성체 분말(132)은 자성층(130)의 전체 중량에 대하여 30 내지 90 중량%로 함유될 수 있다. 자성체 분말(132)이 자성층(130)의 전체 중량에 대하여 30 중량%보다 적게 함유되는 경우에는 자성의 강도가 낮아 전자 부품 캐리어 시트(100)가 서셉터(220)에 안정적으로 밀착될 수 없게 된다. 반면에, 자성체 분말(132)이 자성층(130)의 전체 중량에 대하여 90 중량%보다 많게 함유되는 경우에는 변형 유지층(120) 등과의 접착력이 떨어지거나 자성층(130)의 연성 및/또는 탄성 성질이 저하되어 완충 역할을 효과적으로 수행할 수 없게 된다.In this case, the magnetic powder 132 may be contained in 30 to 90% by weight based on the total weight of the magnetic layer 130. When the magnetic powder 132 is less than 30% by weight based on the total weight of the magnetic layer 130, the magnetic strength is low so that the electronic component carrier sheet 100 cannot be stably adhered to the susceptor 220. . On the other hand, when the magnetic powder 132 is contained in more than 90% by weight relative to the total weight of the magnetic layer 130, the adhesive strength with the strain holding layer 120 or the like is inferior or the soft and / or elastic properties of the magnetic layer 130 This decreases and the buffering function cannot be effectively performed.
또한, 자성체 분말(132)은 0.1 내지 30 ㎛의 평균 입도(또는 크기)를 가질 수 있다. 자성체 분말(132)이 0.1 ㎛보다 작은 평균 입도를 가질 경우에는 자성체 분말(132)의 크기(또는 평균 입도)가 너무 작아 자성층(130)의 전체 영역(또는 전체 면적)에 균일하게 자성체 분말(132)을 분산시키기 어렵게 된다. 반면에, 자성체 분말(132)이 30 ㎛보다 큰 평균 입도를 가질 경우에는 자성층(130)의 일정 영역에 들어갈 수 있는 자성체 분말(132)의 입자수가 제한되게 되어 자성의 강도를 조절할 수 없게 되거나 자성체 분말(132)의 평균 입도 이하로 자성층(130)의 두께를 조절할 수 없게 된다.In addition, the magnetic powder 132 may have an average particle size (or size) of 0.1 to 30 ㎛. When the magnetic powder 132 has an average particle size smaller than 0.1 μm, the magnetic powder 132 is too small in size (or average particle size) so that the magnetic powder 132 is uniformly distributed over the entire region (or the total area) of the magnetic layer 130. ) Is difficult to disperse. On the other hand, when the magnetic powder 132 has an average particle size larger than 30 μm, the number of particles of the magnetic powder 132 that can enter a certain region of the magnetic layer 130 is limited so that the magnetic strength cannot be adjusted or the magnetic body The thickness of the magnetic layer 130 may not be adjusted below the average particle size of the powder 132.
그리고 자성층(130)은 10 내지 500 ㎛의 두께를 가질 수 있다. 자성층(130)의 두께가 10 ㎛보다 얇은 경우에는 전자 부품 캐리어 시트(100)를 서셉터(220)에 밀착시키기 위한 강도의 자성이 충분히 제공되지 못하거나 자성층(130)의 완충 역할을 효과적으로 수행할 수 없게 된다. 반면에, 자성층(130)의 두께가 500 ㎛보다 두꺼운 경우에는 전자 부품(10)으로부터 서셉터(220)까지의 거리가 멀어져 방열 경로가 길어지고 효과적인 방열이 이루어지지 않게 될 수 있다.And the magnetic layer 130 may have a thickness of 10 to 500 ㎛. When the thickness of the magnetic layer 130 is thinner than 10 μm, the magnetic strength of the electronic component carrier sheet 100 may not be sufficiently provided to adhere to the susceptor 220, or the buffering of the magnetic layer 130 may be effectively performed. It becomes impossible. On the other hand, when the thickness of the magnetic layer 130 is thicker than 500 μm, the distance from the electronic component 10 to the susceptor 220 may be long, and thus a heat dissipation path may be lengthened and effective heat dissipation may not be achieved.
한편, 자성층(130)은 후술할 베이스 필름(140)의 역할을 대신할 수도 있으며, 자성층(130)뿐만 아니라 베이스 필름(140)을 더 포함하는 경우에는 변형 유지층(120)과 베이스 필름(140)을 접합시키는 접착제(150)의 역할을 대신할 수도 있다.On the other hand, the magnetic layer 130 may replace the role of the base film 140 to be described later, in the case of further comprising the base film 140 as well as the magnetic layer 130, the strain holding layer 120 and the base film 140 It may be substituted for the role of the adhesive 150 to bond.
또한, 점착층(110), 변형 유지층(120) 및 자성층(130)의 두께의 합은 전자 부품(10)의 함몰 부분의 높이보다 큰 값을 가질 수 있다. 예를 들어, 점착층(110), 변형 유지층(120) 및 자성층(130)의 두께의 합은 전자 부품(10)이 함몰되는 상기 소정 깊이보다 큰 값을 가질 수 있으며, 돌출 단자(11a)만 전자 부품 캐리어 시트(100)에 함몰되는 경우에는 돌출 단자(11a)의 높이보다 큰 값을 가질 수 있다.In addition, the sum of the thicknesses of the adhesive layer 110, the strain holding layer 120, and the magnetic layer 130 may have a value greater than the height of the recessed portion of the electronic component 10. For example, the sum of the thicknesses of the adhesive layer 110, the strain holding layer 120, and the magnetic layer 130 may have a value greater than the predetermined depth in which the electronic component 10 is recessed, and the protruding terminal 11a may be formed. If only the electronic component carrier sheet 100 is recessed, it may have a value greater than the height of the protruding terminal 11a.
점착층(110), 변형 유지층(120) 및 자성층(130)의 두께의 합이 전자 부품(10)의 함몰 부분의 높이 이하의 두께를 가질 경우, 전자 부품(10)의 함몰 부분을 함몰시키기 위해 점착층(110), 변형 유지층(120) 및 자성층(130)이 모두 전자 부품(10)의 함몰 부분의 형상에 따라 변형되어야 하기 때문에 전자 부품(10)이 전자 부품 캐리어 시트(100)에 부착되었을 때에 전자 부품 캐리어 시트(100)의 바닥면(또는 상기 서셉터에 접촉되는 접촉면)이 울퉁불퉁하게 되고, 평탄하지 않게 된다.If the sum of the thicknesses of the adhesive layer 110, the strain holding layer 120, and the magnetic layer 130 has a thickness less than or equal to the height of the recessed portion of the electronic component 10, the recessed portion of the electronic component 10 is recessed. Since the adhesive layer 110, the strain holding layer 120, and the magnetic layer 130 must all be deformed according to the shape of the recessed portion of the electronic component 10, the electronic component 10 may be applied to the electronic component carrier sheet 100. When attached, the bottom surface (or contact surface in contact with the susceptor) of the electronic component carrier sheet 100 becomes rugged and uneven.
하지만, 본 발명에서와 같이, 점착층(110), 변형 유지층(120) 및 자성층(130)의 두께의 합은 전자 부품(10)의 함몰 부분의 높이보다 큰 값을 갖게 되는 경우에는 적어도 자성층(130)의 일부에 전자 부품(10)의 함몰 부분의 형상에 영향을 받지 않거나 덜 받는 부분이 생길 수 있고, 전자 부품 캐리어 시트(100)의 바닥면의 굴곡률이 적어질 수 있고, 평탄하게 될 수 있다. 이에 따라 전자 부품 캐리어 시트(100)와 서셉터(220)의 밀착력이 강화될 수 있고, 서셉터(220)의 냉각 유닛(222)을 통한 냉각 효과가 더욱 향상될 수 있다.However, as in the present invention, the sum of the thicknesses of the adhesive layer 110, the strain holding layer 120, and the magnetic layer 130 has a value greater than the height of the recessed portion of the electronic component 10, at least the magnetic layer. A portion of the 130 may be unaffected or less affected by the shape of the recessed portion of the electronic component 10, the curvature of the bottom surface of the electronic component carrier sheet 100 may be less, and flat Can be. Accordingly, the adhesion between the electronic component carrier sheet 100 and the susceptor 220 may be enhanced, and the cooling effect through the cooling unit 222 of the susceptor 220 may be further improved.
도 5는 본 발명의 일실시예에 따른 베이스 필름을 포함하는 전자 부품 캐리어 시트를 나타낸 단면도로, 도 5(a)는 베이스 필름을 포함하는 전자 부품 캐리어 시트를 나타내고, 도 5(b)는 베이스 필름을 포함하는 전자 부품 캐리어 시트의 변형 유지층의 소성 변형을 나타낸다.5 is a cross-sectional view showing an electronic component carrier sheet including a base film according to an embodiment of the present invention, Figure 5 (a) shows an electronic component carrier sheet comprising a base film, Figure 5 (b) is a base Plastic deformation of the strain holding layer of the electronic component carrier sheet containing the film is shown.
도 5를 참조하면, 본 발명에 따른 전자 부품 캐리어 시트(100)는 점착층(110)을 향하는 변형 유지층(120)의 일면과 대향하는 타면 상에 제공되어, 변형 유지층(120)을 지지하는 베이스 필름(140);을 더 포함할 수 있다. 베이스 필름(140)은 점착층(110)을 향하는 변형 유지층(120)의 일면과 대향하는 변형 유지층(120)의 타면 상에 제공될 수 있고, 변형 유지층(120)을 지지하여 변형 유지층(120)의 변형 범위를 제한할 수 있다. 이에 따라 변형 유지층(120)의 찢어짐 및 파손을 방지하여 변형 유지층(120)의 손상 방지 및 취급성을 개선할 수 있다. 특히, 베이스 필름(140)은 변형 유지층(120)의 손상 및 찢김 등과 같은 물리적 손상을 방지할 수 있고, 외부 물질에 의한 변형 유지층(120)의 오염을 방지할 수 있다. 이때, 베이스 필름(140)은 변형 유지층(120)뿐만 아니라 베이스 필름(140) 상(예를 들어, 상기 베이스 필름의 일면 상)에 배치되는 점착층(110), 자성층(130) 또는 접착제(150)를 지지할 수도 있고, 변형 유지층(120)의 찢어짐 및 파손 방지 역할을 할 수 있다.Referring to FIG. 5, the electronic component carrier sheet 100 according to the present invention is provided on the other surface of the strain holding layer 120 facing the adhesive layer 110 to support the strain holding layer 120. The base film 140 may be further included. The base film 140 may be provided on the other surface of the strain retaining layer 120 facing one surface of the strain retaining layer 120 facing the adhesive layer 110, and retains strain by supporting the strain retaining layer 120. It is possible to limit the deformation range of layer 120. Accordingly, it is possible to prevent tearing and breakage of the strain holding layer 120, thereby improving damage prevention and handling of the strain holding layer 120. In particular, the base film 140 may prevent physical damage such as damage and tear of the strain holding layer 120, and may prevent contamination of the strain holding layer 120 by external materials. In this case, the base film 140 may be disposed on the base film 140 as well as the strain holding layer 120 (eg, on one surface of the base film), the adhesive layer 110, the magnetic layer 130, or the adhesive ( 150 may be supported, and may serve to prevent tearing and damage of the strain maintaining layer 120.
또한, 베이스 필름(140)은 변형 유지층(120)의 변형 범위가 제한되도록 변형 유지층(120) 및 점착층(110)을 조여주는 힘(또는 상기 전자 부품의 부착면에 밀착시키는 힘)을 제공하여 점착층(110)이 전자 부품(10)의 부착면에 보다 밀착되도록 할 수 있다.In addition, the base film 140 may apply a force (or force to adhere to the attachment surface of the electronic component) to tighten the strain holding layer 120 and the adhesive layer 110 so that the strain range of the strain holding layer 120 is limited. By providing the adhesive layer 110 may be in close contact with the attachment surface of the electronic component 10.
베이스 필름(140)의 복원력은 변형 유지층(120)의 소성 변형이 가능한 항복값(또는 소성 변형력) 이하일 수 있다. 베이스 필름(140)의 복원력이 변형 유지층(120)의 소성 변형이 가능한 항복값보다 클 경우에는 변형 유지층(120)의 1차적인 소성 변형에 도달하기 위해 베이스 필름(140)의 복원력과 변형 유지층(120)의 소성 변형이 가능한 항복값을 더한 값 이상의 가압력이 필요하게 되고, 변형 유지층(120)이 1차적으로 소성 변형된다고 하더라도 변형 유지층(120)의 소성 변형이 가능한 항복값보다 큰 베이스 필름(140)의 복원력이 변형 유지층(120)을 다른 형상으로 소성 변형시킬 수 있다. 이에 변형 유지층(120)이 소성 변형되어 그 형상을 유지할 수 있도록 베이스 필름(140)의 복원력은 변형 유지층(120)의 소성 변형이 가능한 항복값 이하일 수 있다.The restoring force of the base film 140 may be equal to or lower than the yield value (or plastic strain force) at which the plastic deformation of the strain maintaining layer 120 is possible. If the restoring force of the base film 140 is greater than the yield value at which the plastic deformation of the strain holding layer 120 is possible, the restoring force and deformation of the base film 140 to reach the primary plastic strain of the strain holding layer 120. A pressing force equal to or greater than the yield value capable of plastic deformation of the holding layer 120 is required, and even if the deformation holding layer 120 is primarily plastically deformed, the deformation value of the holding layer 120 is greater than the yield value at which the plastic deformation of the holding layer 120 is possible. The restoring force of the large base film 140 may plastically deform the strain holding layer 120 to another shape. Accordingly, the restoring force of the base film 140 may be equal to or less than a yield value at which the strain holding layer 120 may be plastically deformed so that the strain holding layer 120 may maintain its shape.
한편, 베이스 필름(140)은 합성수지 소재로 이루어질 수 있고, 자성체 분말(132)을 함유할 수 있다. 베이스 필름(140)은 변형 유지층(120)의 소성 변형(또는 형상 변형)에 대응하여 형상이 변형될 수 있는 합성수지 소재로 이루어질 수 있다. 예를 들어, 폴리에틸렌 테레프탈레이트(PolyEthylene Terephthalate; PET)를 시트 혹은 필름 형태로 가공하여 형성될 수 있다.On the other hand, the base film 140 may be made of a synthetic resin material, it may contain a magnetic powder 132. The base film 140 may be made of a synthetic resin material that may be deformed in response to plastic deformation (or shape deformation) of the strain holding layer 120. For example, it may be formed by processing polyethylene terephthalate (PET) into sheets or films.
베이스 필름(140)의 두께가 변형 유지층(120) 대비 지나치게 두꺼울 경우, 베이스 필름(140)의 형상이 쉽게 변형되지 않고 복원력이 강해져 변형 유지층(120)의 변형력(즉, 탄성 변형력 또는 소성 변형력)을 감소시킬 수 있다.When the thickness of the base film 140 is too thick compared to the strain holding layer 120, the shape of the base film 140 is not easily deformed and the restoring force is strong, so that the deformation force of the strain holding layer 120 (that is, elastic strain or plastic strain) ) Can be reduced.
이로 인해 베이스 필름(140)의 복원력이 변형 유지층(120)의 소성 변형이 가능한 항복값 이하가 되도록 베이스 필름(140)과 변형 유지층(120)의 두께가 결정될 수 있다. 즉, 베이스 필름(140)의 두께는 변형 유지층(120)의 두께에 의해 결정될 수 있다. 예를 들어, 알루미늄 소재의 변형 유지층(120)의 두께가 약 9 ㎛일 때, 폴리에틸렌 테레프탈레이트(PET) 소재의 베이스 필름(140)의 두께를 약 15 ㎛ 정도로 설정함으로써, 베이스 필름(140)의 복원력이 변형 유지층(120)의 소성 변형이 가능한 항복값 이하가 되도록 할 수 있다.Accordingly, the thickness of the base film 140 and the strain holding layer 120 may be determined such that the restoring force of the base film 140 is equal to or lower than the yield value at which the strain holding layer 120 may be plastically deformed. That is, the thickness of the base film 140 may be determined by the thickness of the strain holding layer 120. For example, when the thickness of the strain holding layer 120 of aluminum material is about 9 μm, the base film 140 is set by setting the thickness of the base film 140 of polyethylene terephthalate (PET) material to about 15 μm. The restoring force can be equal to or less than the yield value at which plastic deformation of the strain holding layer 120 is possible.
또한, 베이스 필름(140)의 두께는 반도체 패키지(11) 등의 솔더 볼 크기에 따라 결정될 수도 있으며, 솔더 볼의 크기가 커질수록 베이스 필름(140)의 두께가 얇아질 수 있다. 예를 들어, 약 350 ㎛ 정도 크기의 솔더 볼까지 대응할 수 있는 두께로 베이스 필름(140)을 가공할 수 있다.In addition, the thickness of the base film 140 may be determined according to the solder ball size of the semiconductor package 11 or the like, and as the size of the solder ball increases, the thickness of the base film 140 may be thinner. For example, the base film 140 may be processed to a thickness corresponding to solder balls having a size of about 350 μm.
베이스 필름(140)은 자성체 분말(132)을 함유할 수 있다. 점착층(110) 대신 베이스 필름(140)에 자성체 분말(132)을 첨가할 수 있으며, 합성수지 소재에 자성체 분말(132)을 첨가하여 베이스 필름(140)을 성형할 수도 있고, 베이스 필름(140)의 표면에 자성체 분말(132)을 막 형태로 형성하여도 무방할 수 있다. 이러한 경우에도 전자 부품 캐리어 시트(100)가 마그네트 플레이트(221)에서 발생된 자력에 의해 서셉터(220)에 밀착될 수 있고, 이로 인해 전자 부품(10)에 전달된 열은 전자 부품 캐리어 시트(100)를 통해 마그네트 플레이트(221) 및/또는 냉각 유닛(222)에 제공되어 전자 부품(10)을 신속하게 냉각시킬 수 있다. 이때, 자성층(130)의 자성체 분말(132)과 동일한 이유로 자성체 분말(132)은 0.1 내지 30 ㎛의 평균 입도를 가질 수 있다.The base film 140 may contain the magnetic powder 132. The magnetic powder 132 may be added to the base film 140 instead of the adhesive layer 110, and the base film 140 may be formed by adding the magnetic powder 132 to a synthetic resin material, or the base film 140. The magnetic powder 132 may be formed on the surface of the film in the form of a film. Even in this case, the electronic component carrier sheet 100 may be in close contact with the susceptor 220 by the magnetic force generated in the magnet plate 221, and thus the heat transferred to the electronic component 10 may be transferred to the electronic component carrier sheet ( Through the 100, the magnet plate 221 and / or the cooling unit 222 may be provided to rapidly cool the electronic component 10. In this case, the magnetic powder 132 may have an average particle size of 0.1 to 30 μm for the same reason as the magnetic powder 132 of the magnetic layer 130.
따라서, 점착층(110), 변형 유지층(120) 및 베이스 필름(140) 중 적어도 어느 하나 이상이 자성을 가질 수 있으며, 자성층(130) 대신에 점착층(110), 변형 유지층(120) 및 베이스 필름(140) 중 적어도 어느 하나 이상이 자성을 가질 수 있다.Therefore, at least one of the adhesive layer 110, the strain holding layer 120, and the base film 140 may have magnetic properties, and the adhesive layer 110 and the strain holding layer 120 may be replaced with the magnetic layer 130. At least one or more of the base film 140 may have magnetic properties.
본 발명의 전자 부품 캐리어 시트(100)는 변형 유지층(120)과 베이스 필름(140) 사이에 제공되어 변형 유지층(120)과 베이스 필름(140)의 접착력을 강화시키는 접착제(150);를 더 포함할 수 있다. 접착제(150)는 변형 유지층(120)과 베이스 필름(140) 사이에 접착층의 형태로 제공될 수 있고, 변형 유지층(120)과 베이스 필름(140) 사이에서 접착력을 강화시킬 수 있다. 예를 들어, 접착제(150)는 변형 유지층(120)의 타면 상(또는 하부)에 형성될 수 있고, 베이스 필름(140)은 변형 유지층(120)을 향하는 접착제(150)의 일면과 대향하는 접착제(150)의 타면 상에 형성(또는 배치)될 수 있다. 이때, 접착제(150)는 접착 물질에 자성체 분말(132)이 분산된 것일 수 있고, 자성체 분말(132)은 금속 분말 또는 페라이트 분말을 포함할 수 있다.The electronic component carrier sheet 100 of the present invention is provided between the strain holding layer 120 and the base film 140, the adhesive 150 to strengthen the adhesion between the strain holding layer 120 and the base film 140; It may further include. The adhesive 150 may be provided in the form of an adhesive layer between the strain holding layer 120 and the base film 140, and may strengthen the adhesive force between the strain holding layer 120 and the base film 140. For example, the adhesive 150 may be formed on (or under) the other surface of the strain holding layer 120, and the base film 140 may face one side of the adhesive 150 facing the strain holding layer 120. It may be formed (or disposed) on the other surface of the adhesive 150. At this time, the adhesive 150 may be a magnetic powder 132 is dispersed in the adhesive material, the magnetic powder 132 may include a metal powder or ferrite powder.
한편, 베이스 필름(140)은 전자 부품(10)의 함몰 부분의 형상에 영향을 받지 않고 변형되지 않을 수 있다. 전자 부품(10)은 전자 부품 캐리어 시트(100)의 점착층(110)에 접촉된 후에 점착층(110) 방향으로 눌리게 된다. 이로 인해 변형 유지층(120)과 베이스 필름(140) 사이에 접착제(150)가 제공되는 경우에 점착층(110)부터 접착제(150)까지만 전자 부품(10)의 함몰 부분(예를 들어, 상기 반도체 패키지의 돌출 단자)의 형상과 대응하여 변형이 발생할 수 있으며, 베이스 필름(140)은 변형되지 않을 수 있다. 이에 따라 얇은 금속 필름인 변형 유지층(120)의 찢어짐 및 파손의 방지 역할을 할 수 있다. 베이스 필름(140)의 형상이 변형되지 않을 경우, 접착제(150)를 향하는 베이스 필름(140)의 일면과 대향하는 베이스 필름(140)의 타면(예를 들어, 하부면)에 울퉁불퉁한 요철이 발생하지 않을 수 있다. 이로 인해 베이스 필름(140)이 박막 형성장치의 서셉터(220)에 긴밀하게 밀착될 수 있고, 스퍼터링 등의 박막 형성공정에 의하여 박막(20)을 형성할 때에 냉각 유닛(222)을 통해 효과적으로 냉각될 수 있어 전자 부품 캐리어 시트(100)의 방열 성능을 보다 향상시킬 수 있다.On the other hand, the base film 140 may not be deformed without being affected by the shape of the recessed portion of the electronic component 10. The electronic component 10 is pressed in the direction of the adhesive layer 110 after contacting the adhesive layer 110 of the electronic component carrier sheet 100. Therefore, when the adhesive 150 is provided between the strain holding layer 120 and the base film 140, only the recessed portion of the electronic component 10 from the adhesive layer 110 to the adhesive 150 (for example, the Deformation may occur in correspondence with the shape of the protruding terminal of the semiconductor package, and the base film 140 may not be deformed. Accordingly, it may serve to prevent tearing and damage of the strain holding layer 120 which is a thin metal film. When the shape of the base film 140 is not deformed, uneven irregularities are generated on the other surface (eg, the lower surface) of the base film 140 that faces one surface of the base film 140 facing the adhesive 150. You can't. This allows the base film 140 to be in close contact with the susceptor 220 of the thin film forming apparatus, and effectively cools the cooling through the cooling unit 222 when forming the thin film 20 by a thin film forming process such as sputtering. The heat dissipation performance of the electronic component carrier sheet 100 may be further improved.
본 발명에 따른 전자 부품 캐리어 시트(100)는 10 내지 80 %의 연신율을 가질 수 있다. 전자 부품 캐리어 시트(100)의 연신율이 10 %보다 작을 경우에는 전자 부품(10)이 점착층(110)에 부착되는 과정에서 가해지는 압력에 의해 잘 늘어나지 않아 변형 유지층(120)이 소성 변형되지 않거나 소성 변형시키기 위해 큰 가압력이 필요하게 될 수 있고, 소성 변형된다 하더라도 전자 부품(10)의 함몰 부분의 형상을 따라 변형 유지층(120)이 정확하게 변형되지 않을 수 있다.The electronic component carrier sheet 100 according to the present invention may have an elongation of 10 to 80%. When the elongation of the electronic component carrier sheet 100 is less than 10%, the strain holding layer 120 may not be plastically deformed because the electronic component 10 is not easily stretched by the pressure applied during the attachment of the electronic component 10 to the adhesive layer 110. Or a large pressing force may be required to plastically deform, and even if plastically deformed, the strain holding layer 120 may not be accurately deformed along the shape of the recessed portion of the electronic component 10.
반면에, 전자 부품 캐리어 시트(100)의 연신율이 80 %보다 클 경우에는 작은 외력(또는 외부 압력)으로도 너무 잘 늘어나 점착층(110)이 전자 부품(10)의 부착면에 밀착되도록 변형 유지층(120)을 소성 변형시키기 위한 핸들링이 어려워지므로, 점착층(110)이 전자 부품(10)의 부착면에 밀착될 수 있는 형상으로 변화되도록 하는 가압 조건을 만들기 어려워질 뿐만 아니라 전체적으로 균일하게 가압하지 않는 경우에는 영역별 가압력의 차이에 따라 점착층(110)이 전자 부품(10)의 부착면에 고르게 부착되지 못하고 점착층(110)과 전자 부품(10)의 부착면 사이에 틈이 발생할 수 있다. 또한, 중공형의 지지 프레임(미도시)에 전자 부품 캐리어 시트(100)가 부착되어 적어도 하나 이상의 전자 부품(10)이 점착된 상태로 이송될 수 있으며, 이러한 경우에 80 %보다 큰 전자 부품 캐리어 시트(100)의 높은 연신율로 인해 전자 부품 캐리어 시트(100)가 출렁이게 되거나 변형될 수 있다. 이에 따라 전자 부품(10)이 움직이거나 이탈되는 등 점착된 전자 부품(10)에 영향을 줄 수 있고, 이로 인해 양산 안정성이 저하될 수 있다.On the other hand, when the elongation of the electronic component carrier sheet 100 is greater than 80%, the adhesive layer 110 is deformed and maintained so that the adhesive layer 110 adheres to the attachment surface of the electronic component 10 too well even with a small external force. Since the handling for plastic deformation of the layer 120 becomes difficult, not only is it difficult to create a pressing condition that causes the adhesive layer 110 to change into a shape that can be in close contact with the attachment surface of the electronic component 10, but also the pressure is uniformly applied throughout. If not, the pressure-sensitive adhesive layer 110 may not be evenly attached to the attachment surface of the electronic component 10 according to the difference in the pressing force for each region, and a gap may occur between the adhesion layer 110 and the attachment surface of the electronic component 10. have. In addition, the electronic component carrier sheet 100 may be attached to a hollow support frame (not shown) so that the at least one electronic component 10 may be transported in a state in which the electronic component carrier is adhered, in which case the electronic component carrier is larger than 80%. The high elongation of the sheet 100 may cause the electronic component carrier sheet 100 to slump or deform. As a result, the electronic component 10 may be affected by movement or detachment of the electronic component 10, and thus mass production stability may be reduced.
이때, 전자 부품 캐리어 시트(100)의 연신율은 변형 유지층(120)의 효과적인 변형과 높은 양산 안정성을 위해 바람직하게는 35 내지 70 %일 수 있고, 더욱 바람직하게는 50 내지 60 %일 수 있다.In this case, the elongation of the electronic component carrier sheet 100 may be preferably 35 to 70%, more preferably 50 to 60% for effective deformation of the strain holding layer 120 and high mass stability.
본 발명에 따른 전자 부품 캐리어 시트(100)는 25 내지 250 N/㎟의 인장 강도를 가질 수 있다. 전자 부품 캐리어 시트(100)의 인장 강도가 25 N/㎟보다 작은 경우에는 전자 부품(10)이 부착되는 압력(또는 가압력)에 의해 전자 부품 캐리어 시트(100)가 찢어지거나 손상될 수 있다. 반면에, 전자 부품 캐리어 시트(100)의 인장 강도가 250 N/㎟보다 큰 경우에는 변형 유지층(120)이 잘 변형되지 않게 되어 소성 변형되지 않거나 변형 유지층(120)의 탄성력(또는 탄성 변형력)이 증가되어 소성 변형시키기 위해 큰 가압력이 필요하게 될 수 있고, 소성 변형된다 하더라도 전자 부품(10)의 함몰 부분의 형상을 따라 변형 유지층(120)이 정확하게 변형되지 않을 수 있다. 이때, 전자 부품 캐리어 시트(100)의 인장 강도는 바람직하게는 34 내지 250 N/㎟일 수 있다. 한편, 변형 유지층(120)의 인장 강도가 높아 점착층(110)과 변형 유지층(120)만으로도 25 내지 250 N/㎟의 인장 강도를 달성할 수 있는 경우에는 자성층(130) 및 베이스 필름(140)없이 점착층(110)과 변형 유지층(120)만으로 전자 부품 캐리어 시트(100)를 제작(또는 제조)할 수 있다.The electronic component carrier sheet 100 according to the present invention may have a tensile strength of 25 to 250 N / mm 2. When the tensile strength of the electronic component carrier sheet 100 is smaller than 25 N / mm 2, the electronic component carrier sheet 100 may be torn or damaged by the pressure (or pressing force) to which the electronic component 10 is attached. On the other hand, when the tensile strength of the electronic component carrier sheet 100 is greater than 250 N / mm 2, the strain holding layer 120 is hardly deformed so that it is not plastically deformed or the elastic force (or elastic strain force) of the strain holding layer 120 is prevented. ) May be increased so that a large pressing force may be required to plastically deform, and even if plastically deformed, the strain holding layer 120 may not be accurately deformed along the shape of the recessed portion of the electronic component 10. In this case, the tensile strength of the electronic component carrier sheet 100 may be 34 to 250 N / mm 2 preferably. On the other hand, when the tensile strength of the strain holding layer 120 is high and the tensile strength of 25 to 250 N / mm 2 can be achieved only by the adhesive layer 110 and the strain holding layer 120, the magnetic layer 130 and the base film ( The electronic component carrier sheet 100 may be manufactured (or manufactured) using only the adhesive layer 110 and the strain holding layer 120 without the 140.
도 6은 본 발명의 다른 실시예에 따른 점착 장치를 나타낸 사시도이다.6 is a perspective view showing an adhesive device according to another embodiment of the present invention.
도 6을 참조하여 본 발명의 다른 실시예에 따른 점착 장치를 보다 상세히 살펴보는데, 본 발명의 일실시예에 따른 전자 부품 캐리어 시트와 관련하여 앞서 설명된 부분과 중복되는 사항들은 생략하도록 한다.A detailed description will be given of an adhesive device according to another embodiment of the present invention with reference to FIG. 6, and details overlapping with those described above with respect to the electronic component carrier sheet according to an embodiment of the present invention will be omitted.
본 발명의 다른 실시예에 따른 점착 장치(200)는 점착 시트(100)가 지지되는 지지 프레임(210); 상기 점착 시트(100)의 제1 면 상에 제공되는 피점착물(10)과 상기 점착 시트(100) 중 적어도 하나에 압력을 부가하는 가압부(220); 및 상기 점착 시트(100)의 제1 면 방향에 배치되어 상기 압력의 부가 시에 상기 피점착물(10)이 지지되는 지지면을 제공하는 제1 플레이트(230);를 포함할 수 있다. Adhesive device 200 according to another embodiment of the present invention includes a support frame 210, the adhesive sheet 100 is supported; A pressing unit 220 for applying pressure to at least one of the adherend 10 and the adhesive sheet 100 provided on the first surface of the adhesive sheet 100; And a first plate 230 disposed in a direction of the first surface of the adhesive sheet 100 to provide a support surface on which the adherend 10 is supported when the pressure is applied.
지지 프레임(210)은 전자 부품(10)이 부착(또는 점착)되는 전자 부품 캐리어 시트(100)와 같은 점착 시트(100)가 지지될 수 있으며, 서로 대향하는 두 면을 갖는 판상일 수 있고, 내부에 홀(또는 개구부)이 형성되도록 중앙부가 개구되어 중공형으로 형성될 수 있다. 이때, 점착 시트(100)는 지지 프레임(210)에 부착되어 지지될 수 있고, 지지 프레임(210)의 하면(또는 제2 면)에 점착 시트(100)의 제1 면 가장자리를 부착할 수 있다. 여기서, 점착 시트(100)의 부착은 점착 시트(100)를 지지 프레임(210)에 대응되는 크기로 미리 절단하여 위치에 맞게 부착할 수도 있으나, 점착 시트(100)가 지지 프레임(210)의 내주를 채우도록 부착한 상태에서 지지 프레임(210)의 크기에 맞게 점착 시트(100)의 외곽을 절단처리하는 것이 바람직할 수 있다. 한편, 지지 프레임(210)은 원형, 타원형, 다각형 등 다양한 형상일 수 있으며, 점착 시트(100)가 안정적으로 지지되어 전자 부품(10)과 같은 피점착물(10)이 점착 시트(100)의 제1 면 상에 잘 점착될 수 있는 형상이면 족하다.The support frame 210 may be supported by an adhesive sheet 100 such as the electronic component carrier sheet 100 to which the electronic component 10 is attached (or adhered), and may have a plate shape having two surfaces facing each other. The central portion may be opened to be hollow so that a hole (or opening) is formed therein. In this case, the adhesive sheet 100 may be attached to the support frame 210 to be supported, and may attach the first surface edge of the adhesive sheet 100 to the bottom surface (or the second surface) of the support frame 210. . Here, the adhesive sheet 100 may be attached to the adhesive sheet 100 in advance by cutting the adhesive sheet 100 to a size corresponding to the support frame 210, but the adhesive sheet 100 may be attached to the inner circumference of the support frame 210. It may be desirable to cut the outer edge of the adhesive sheet 100 in accordance with the size of the support frame 210 in the attached state to fill the. On the other hand, the support frame 210 may be a variety of shapes, such as circular, oval, polygonal, the adhesive sheet 100 is stably supported so that the adherend 10 such as the electronic component 10 of the adhesive sheet 100 It is sufficient if it is a shape which can stick well on a 1st surface.
가압부(220)는 점착 시트(100)의 제1 면(또는 점착면) 상에 제공되는 피점착물(10)과 점착 시트(100) 중 적어도 하나에 압력을 부가할 수 있다. 이때, 피점착물(10)은 점착 시트(100)의 제1 면 중 홀이 형성된 지지 프레임(210)의 중앙부에 대응되어 제공될 수 있으며, 복수개로 구성될 수 있다. 여기서, 피점착물(10)을 점착 시트(100)의 제1 면 상에 일정간격으로 안착시켜 피점착물(10)의 하면(또는 제2 면)을 점착 시트(100)의 제1 면에 가부착할 수 있고, 피커(picker)와 같은 이송모듈(미도시)을 통해 일정간격으로 자동 배치하는 것이 바람직할 수 있다. 가압부(220)를 통해 점착 시트(100)와 피점착물(10) 중 적어도 하나에 서로를 향하는 방향으로 압력을 부가함으로써, 서로 밀착되도록 할 수 있고, 점착 시트(100)의 제1 면 상에 가부착된 피점착물(10)을 점착 시트(100)의 제1 면에 점착시킬 수 있다. 가압부(220)는 점착 시트(100) 및/또는 피점착물(10)에 직접 접촉하여 가압할 수도 있고, 공기압(air pressure)을 이용하여 간접적으로 점착 시트(100) 및/또는 피점착물(10)에 압력을 부가할 수도 있다.The pressing unit 220 may apply pressure to at least one of the adherend 10 and the adhesive sheet 100 provided on the first surface (or adhesive surface) of the adhesive sheet 100. In this case, the adherend 10 may be provided corresponding to the central portion of the support frame 210 in which the hole is formed in the first surface of the adhesive sheet 100, and may be configured in plural. Here, the adherend 10 is seated on the first surface of the adhesive sheet 100 at a predetermined interval so that the lower surface (or the second surface) of the adherend 10 is attached to the first surface of the adhesive sheet 100. It may be attachable, it may be desirable to automatically arrange at a predetermined interval through a transfer module (not shown), such as a picker (picker). By applying pressure to at least one of the pressure-sensitive adhesive sheet 100 and the adherend 10 in a direction facing each other through the pressing unit 220, it can be in close contact with each other, and on the first surface of the pressure-sensitive adhesive sheet 100 The to-be-adhered substance 10 temporarily attached to can be adhere | attached on the 1st surface of the adhesive sheet 100. FIG. The pressing unit 220 may be in direct contact with the pressure-sensitive adhesive sheet 100 and / or the adhesive 10, and may be indirectly pressurized by using air pressure. Pressure may be added to (10).
제1 플레이트(230)는 점착 시트(100)의 제1 면 방향(또는 측)에 배치(또는 제공)될 수 있고, 가압부(220)에 의한 상기 압력의 부가 시에 피점착물(10)이 지지되는 지지면을 제공할 수 있다. 이때, 제1 플레이트(230)는 지지 프레임(210)의 적어도 일부(예를 들어, 가장자리)와 대향하여 제공됨으로써, 제1 플레이트(230)의 지지면이 점착 시트(100)의 제1 면에 대향하여 제공될 수 있고, 제1 플레이트(230)의 지지면에는 피점착물(10)의 상면(또는 제1 면)이 지지될 수 있다. 제1 플레이트(230)를 통해 피점착물(10)의 상면을 지지하게 되면, 점착 시트(100) 및/또는 피점착물(10)에 상기 압력이 잘 전달될 수 있다.The first plate 230 may be disposed (or provided) in the first surface direction (or side) of the adhesive sheet 100, and the adherend 10 may be applied when the pressure is applied by the pressing unit 220. This supporting surface can be provided. In this case, the first plate 230 is provided to face at least a portion (eg, an edge) of the support frame 210, such that the support surface of the first plate 230 is provided on the first surface of the adhesive sheet 100. The upper surface (or the first surface) of the adherend 10 may be supported by the support surface of the first plate 230. When the upper surface of the adherend 10 is supported through the first plate 230, the pressure may be well transmitted to the adhesive sheet 100 and / or the adherend 10.
한편, 제1 플레이트(230)의 지지면의 형상은 평평한(flat) 형상, 볼록한 형상, 오목한 형상 등 다양할 수 있으며, 가압부(220)에 의한 상기 압력에 의해 휘어지는 점착 시트(100)의 형태에 따라 결정될 수 있다. 제1 플레이트(230)의 지지면의 형상을 통해 휘어지는 점착 시트(100)의 형태에 따라 피점착물(10)을 지지하는 경우에는 점착 시트(100)에 무리가 가지(또는 무리한 힘이 가해지지) 않을 수 있고, 제1 플레이트(230)의 지지면과 피점착물(10)의 상면 사이에 작용/반작용 힘이 수직 방향으로 잘 전달될 수 있다.On the other hand, the shape of the support surface of the first plate 230 may be a variety of flat (flat), convex, concave shape, etc., the shape of the adhesive sheet 100 is bent by the pressure by the pressing unit 220 It can be determined according to. When supporting the adherend 10 according to the shape of the adhesive sheet 100 that is bent through the shape of the support surface of the first plate 230, the adhesive sheet 100 may not have excessive force (or excessive force is applied). ), The action / reaction force may be well transmitted in the vertical direction between the support surface of the first plate 230 and the top surface of the adherend 10.
도 7은 본 발명의 다른 실시예에 따른 가압부에 의한 압력 부가를 설명하기 위한 개념도로, 도 7(a)는 압력 부가 전을 나타내고, 도 7(b)는 압력이 부가된 상태를 나타낸다.7 is a conceptual diagram illustrating the pressure addition by the pressing unit according to another embodiment of the present invention. FIG. 7 (a) shows before the pressure is added, and FIG. 7 (b) shows the state where the pressure is added.
도 7을 참조하면, 본 발명에 따른 점착 장치(200)는 제1 플레이트(230)와 지지 프레임(210)의 사이에 제공되는 제1 패킹부재(241);를 더 포함할 수 있고, 가압부(220)는 제1 플레이트(230), 지지 프레임(210) 및 제1 패킹부재(241)에 의해 정의되는 공간에 부압(negative pressure)을 형성하는 제1 기압 형성부(221)를 포함할 수 있다.Referring to FIG. 7, the adhesive device 200 according to the present invention may further include a first packing member 241 provided between the first plate 230 and the support frame 210. The 220 may include a first air pressure forming unit 221 for forming a negative pressure in a space defined by the first plate 230, the support frame 210, and the first packing member 241. have.
제1 패킹부재(241)는 제1 플레이트(230)와 지지 프레임(210)의 사이에 제공될 수 있으며, 제1 플레이트(230) 및 지지 프레임(210)과 밀착될 수 있고, 제1 플레이트(230)와 지지 프레임(210) 사이에 공기가 출입할 수 있는 틈(gap)이 발생하는 것을 방지할 수 있다. 또한, 제1 플레이트(230)와 지지 프레임(210)의 사이에서 피점착물(10)의 높이를 확보할 수도 있다.The first packing member 241 may be provided between the first plate 230 and the support frame 210, may be in close contact with the first plate 230 and the support frame 210, and the first plate ( It is possible to prevent the occurrence of a gap (gap) that the air can enter and exit between the 230 and the support frame 210. In addition, the height of the adherend 10 may be secured between the first plate 230 and the support frame 210.
제1 기압 형성부(221)는 제1 플레이트(230), 지지 프레임(210) 및 제1 패킹부재(241)에 의해 정의되는 공간에 부압(또는 진공이나 음압)을 형성할 수 있다. 여기서, 상기 부압은 대기압(또는 상압)보다 낮은 압력일 수 있으며, 물체의 표면에 물체를 흡인하는 방향으로 가해지는 흡인력일 수 있다. 제1 기압 형성부(221)는 진공 펌프(vacuum pump)를 포함할 수 있으며, 제1 플레이트(230), 지지 프레임(210) 및 제1 패킹부재(241)에 의해 정의되는 공간에 부압을 형성하여 피점착물(10)의 상면이 제1 플레이트(230)에 지지(또는 접촉)되도록 할 수 있고, 점착 시트(100)에 피점착물(10) 방향(또는 상기 제1 플레이트 방향)으로 압력(또는 흡인력)을 부가할 수 있다.The first air pressure forming unit 221 may form a negative pressure (or vacuum or negative pressure) in a space defined by the first plate 230, the support frame 210, and the first packing member 241. Here, the negative pressure may be a pressure lower than atmospheric pressure (or normal pressure), and may be a suction force applied in a direction of sucking the object on the surface of the object. The first air pressure forming unit 221 may include a vacuum pump, and forms a negative pressure in a space defined by the first plate 230, the support frame 210, and the first packing member 241. The upper surface of the adherend 10 may be supported (or contacted) with the first plate 230, and the pressure-sensitive adhesive sheet 100 is pressed in the direction of the adherend 10 (or the first plate direction). (Or suction force) can be added.
도 8은 본 발명의 다른 실시예에 따른 가압에 의한 점착 시트와 피점착물의 밀착을 설명하기 위한 개념도로, 도 8(a)는 가압 전을 나타내고, 도 8(b)는 가압에 의한 점착 시트와 피점착물의 밀착을 나타낸다.8 is a conceptual view for explaining the adhesion between the pressure-sensitive adhesive sheet and the adherend according to another embodiment of the present invention, Figure 8 (a) shows before the pressing, Figure 8 (b) the pressure-sensitive adhesive sheet And adhesion of the adherend.
도 8을 참조하면, 도 8(a)와 같이, 제1 플레이트(230), 지지 프레임(210) 및 제1 패킹부재(241)에 의해 정의되는 공간에 부압이 형성되기 전에는 피점착물(10)의 상면이 제1 플레이트(230)에 접촉(또는 지지)되지 않다가 도 8(b)와 같이, 제1 플레이트(230), 지지 프레임(210) 및 제1 패킹부재(241)에 의해 정의되는 공간에 부압이 형성된 후에 피점착물(10)의 상면이 제1 플레이트(230)에 지지될 수 있고, 점착 시트(100)에 피점착물(10) 방향으로 압력이 부가될 수 있다. 이에 따라 피점착물(10)의 상면에는 제1 플레이트(230)로의 밀착력에 의한 반작용 힘이 부가되고, 점착 시트(100)에 피점착물(10) 방향으로 압력이 부가됨으로써, 부가피점착물(10)의 하면이 점착 시트(100)의 제1 면에 밀착되어 점착될 수 있다. 이를 통해 점착 시트(100)와 피점착물(10)의 하면 사이에 발생되는 들뜸(gap) 현상을 방지할 수 있고, 들뜸 현상으로 인해 반도체 패키지 등의 피점착물(10)의 하면에 증착 오염이 발생되어 피점착물(10)의 품질이 나빠지며 수율이 떨어지는 등의 문제점을 해결할 수 있다.Referring to FIG. 8, as shown in FIG. 8A, before the negative pressure is formed in the space defined by the first plate 230, the support frame 210, and the first packing member 241, the adherend 10 may be formed. ) Is not contacted (or supported) with the first plate 230, but is defined by the first plate 230, the support frame 210 and the first packing member 241 as shown in FIG. After the negative pressure is formed in the space, the upper surface of the adherend 10 may be supported by the first plate 230, and pressure may be added to the adhesive sheet 100 in the direction of the adherend 10. As a result, a reaction force due to the adhesion to the first plate 230 is added to the upper surface of the adherend 10, and a pressure is added to the adhesive sheet 100 in the direction of the adherend 10, whereby the adherend 10 is added. The lower surface of 10 may adhere to the first surface of the pressure sensitive adhesive sheet 100. As a result, it is possible to prevent the phenomenon of the gap generated between the adhesive sheet 100 and the lower surface of the adherend 10, and due to the lift phenomenon, deposition contamination on the lower surface of the adherend 10 such as a semiconductor package. This may solve problems such as poor quality of the adherend 10 and a poor yield.
여기서, 상대적으로 평탄한 피점착물(10)의 상면이 제1 플레이트(230)에 지지됨으로써, 제1 플레이트(230)로의 밀착력에 의한 반작용 힘이 효과적으로 부가될 수 있고, 점착 시트(100) 및/또는 피점착물(10)에 부가되는 압력이 서로를 향하는 방향으로 잘 전달되어 피점착물(10)의 하면과 점착 시트(100)의 제1 면이 밀착될 수 있다.Here, since the upper surface of the relatively flat adherend 10 is supported by the first plate 230, the reaction force by the adhesion to the first plate 230 can be effectively added, the adhesive sheet 100 and / Alternatively, the pressure added to the adherend 10 may be well transmitted in a direction toward each other such that the lower surface of the adherend 10 and the first surface of the adhesive sheet 100 may be in close contact with each other.
또한, 공기압(예를 들어, 부압)을 통해 피점착물(10)의 하면과 점착 시트(100)의 제1 면을 밀착시킴으로써, 크랙(crack) 등의 피점착물(10)의 손상 및 파티클(particle)의 발생 없이 점착 시트(100)에 피점착물(10)을 밀착시킬 수 있으며, 점착 시트(100)의 전체면 및/또는 피점착물(10)의 전체(면)에 일정한 압력이 부가될 수 있을 뿐만 아니라 동시에 부가될 수 있어 피점착물(10)의 하면이 점착 시트(100)의 제1 면에 안정적으로(또는 효과적으로) 점착될 수 있다.In addition, by contacting the lower surface of the adherend 10 with the first surface of the adhesive sheet 100 through air pressure (for example, negative pressure), damage and particles of the adherend 10 such as cracks may be caused. The adherend 10 may be brought into close contact with the adhesive sheet 100 without generation of particles, and a constant pressure may be applied to the entire surface of the adhesive sheet 100 and / or the entire surface of the adherend 10. Not only may it be added, but may be added at the same time so that the bottom surface of the adherend 10 may be stably (or effectively) adhered to the first side of the adhesive sheet 100.
한편, 본 발명의 점착 장치(200)는 제1 플레이트(230), 지지 프레임(210) 및 제1 패킹부재(241)에 의해 정의되는 공간을 통기(vent)시키는 제1 통기부(281);를 더 포함할 수 있다. 제1 통기부(281)는 제1 플레이트(230), 지지 프레임(210) 및 제1 패킹부재(241)에 의해 정의되는 공간을 통기시킬 수 있으며, 제1 플레이트(230), 지지 프레임(210) 및 제1 패킹부재(241)에 의해 정의되는 공간과 연통 가능한 통기구(vent)를 포함할 수 있고, 부압이 형성된 제1 플레이트(230), 지지 프레임(210) 및 제1 패킹부재(241)에 의해 정의되는 공간에 공기를 공급할 수 있다. 이때, 상기 통기구는 밸브 등으로 개폐될 수 있다. 제1 플레이트(230), 지지 프레임(210) 및 제1 패킹부재(241)에 의해 정의되는 공간에 부압 형성과 통기를 알맞게 (또는 알맞은 순서와 횟수 및 시간으로) 수행하여 피점착물(10)의 하면과 점착 시트(100)의 제1 면을 밀착시킬 수 있다.On the other hand, the pressure-sensitive adhesive device 200 of the present invention includes a first vent 281 for venting the space defined by the first plate 230, the support frame 210 and the first packing member 241; It may further include. The first vent 281 may vent the space defined by the first plate 230, the support frame 210, and the first packing member 241. The first plate 230 and the support frame 210 may be vented. ) And a vent that can communicate with a space defined by the first packing member 241, and includes a first plate 230, a support frame 210, and a first packing member 241 in which a negative pressure is formed. It is possible to supply air to the space defined by. In this case, the vent may be opened and closed by a valve or the like. The adherend 10 may be formed by performing negative pressure formation and aeration in a space defined by the first plate 230, the support frame 210, and the first packing member 241 (or in an appropriate order, number of times, and time). Lower surface and the first surface of the adhesive sheet 100 can be in close contact.
그리고 피점착물(10)은 하면(또는 상기 점착 시트와의 접촉면)에 돌출 단자(11a) 등의 돌출부를 포함할 수 있으며, 피점착물(10)의 하면과 점착 시트(100)의 제1 면을 밀착시켜 피점착물(10)의 하면에 상기 돌출부가 있는 경우에도 점착 시트(100)가 상기 돌출부를 따라 밀착되어 점착되도록 할 수 있고, 점착 시트(100)가 상기 돌출부를 따라 변형되도록 할 수도 있다.The adherend 10 may include a protrusion such as a protruding terminal 11a on a lower surface (or a contact surface with the adhesive sheet), and a lower surface of the adherend 10 and the first of the adhesive sheet 100. When the surface is in close contact with the protrusions on the lower surface of the adherend 10, even if the adhesive sheet 100 can be adhered to be adhered along the protrusion, the adhesive sheet 100 to be deformed along the protrusion It may be.
도 9는 본 발명의 다른 실시예에 따른 제1 기압 형성부와 제2 기압 형성부를 통한 가압을 설명하기 위한 개념도로, 도 9(a)는 제1 기압 형성부와 제2 기압 형성부의 이격 상태를 나타내고, 도 9(b)는 제1 기압 형성부와 제2 기압 형성부의 근접 상태를 나타낸다.FIG. 9 is a conceptual view illustrating the pressurization through the first air pressure forming unit and the second air pressure forming unit according to another embodiment of the present invention. FIG. 9 (b) shows a proximity state of the first air pressure forming portion and the second air pressure forming portion.
도 9를 참조하면, 본 발명에 따른 점착 장치(200)는 상기 제1 면과 대향하는 점착 시트(100)의 제2 면 방향에 제1 플레이트(230)와 대향하여 제공되는 제2 플레이트(250); 및 제1 플레이트(230)와 제2 플레이트(250)의 간격을 조절하는 간격조절부(260);를 더 포함할 수 있다. 제2 플레이트(250)는 점착 시트(100)의 제2 면 방향(또는 측)에 제1 플레이트(230)와 대향하여 제공(또는 배치)될 수 있으며, 제1 플레이트(230)와 제2 플레이트(250)의 사이에 지지 프레임(210)이 위치할 수 있다. 제2 플레이트(250)를 통해 점착 시트(100)의 제2 면 방향에서도 점착 시트(100)에 압력을 부가할 수 있으며, 피점착물(10)의 하면과 점착 시트(100)의 제1 면이 효과적으로 밀착되어 점착되도록 할 수 있다.Referring to FIG. 9, the adhesive device 200 according to the present invention may include a second plate 250 provided to face the first plate 230 in a second surface direction of the adhesive sheet 100 facing the first surface. ); And a gap adjusting part 260 for adjusting a gap between the first plate 230 and the second plate 250. The second plate 250 may be provided (or disposed) to face the first plate 230 in the second surface direction (or side) of the adhesive sheet 100, and the first plate 230 and the second plate may be provided. The support frame 210 may be positioned between the 250. Pressure may be applied to the adhesive sheet 100 in the direction of the second surface of the adhesive sheet 100 through the second plate 250, and the lower surface of the adherend 10 and the first surface of the adhesive sheet 100 may be applied. This can be effectively adhered and adhered.
간격조절부(260)는 제1 플레이트(230)와 제2 플레이트(250)의 간격을 조절할 수 있으며, 제1 플레이트(230)와 지지 프레임(210)을 제1 패킹부재(241)에 밀착시켜 제1 플레이트(230), 지지 프레임(210) 및 제1 패킹부재(241)에 의해 정의되는 공간을 형성할 수 있다. 제1 플레이트(230)와 지지 프레임(210)이 제1 패킹부재(241)에 밀착되는 경우, 피점착물(10)의 상면이 제1 플레이트(230)에 접촉될 수도 있고, 접촉되지 않았다가 부압이 형성된 후에 피점착물(10)의 상면이 제1 플레이트(230)에 접촉될 수도 있다. 또한, 간격조절부(260)를 통해 제2 플레이트(250)를 점착 시트(100)의 제2 면에 접촉시켜 점착 시트(100)의 제2 면을 직접 가압할 수도 있고, 제2 플레이트(250)와 지지 프레임(210)의 간격을 좁혀 점착 시트(100)의 제2 면에 공기압(예를 들어, 정압)을 부가할 수도 있다.The gap adjusting unit 260 may adjust a gap between the first plate 230 and the second plate 250, and closely contact the first plate 230 and the support frame 210 to the first packing member 241. A space defined by the first plate 230, the support frame 210, and the first packing member 241 may be formed. When the first plate 230 and the support frame 210 are in close contact with the first packing member 241, the upper surface of the adherend 10 may or may not be in contact with the first plate 230. After the negative pressure is formed, the upper surface of the adherend 10 may be in contact with the first plate 230. In addition, the second plate 250 may be in contact with the second surface of the adhesive sheet 100 through the gap adjusting unit 260 to directly press the second surface of the adhesive sheet 100, or the second plate 250 may be used. ) And the support frame 210 may be narrowed to add air pressure (eg, positive pressure) to the second surface of the adhesive sheet 100.
본 발명에 따른 점착 장치(200)는 제2 플레이트(250)와 지지 프레임(210)의 사이에 제공되는 제2 패킹부재(242);를 더 포함할 수 있고, 가압부(220)는 제2 플레이트(250), 지지 프레임(210) 및 제2 패킹부재(242)에 의해 정의되는 공간에 정압(positive pressure)을 형성하는 제2 기압 형성부(222)를 포함할 수 있다.The adhesive device 200 according to the present invention may further include a second packing member 242 provided between the second plate 250 and the support frame 210, and the pressing unit 220 may include a second portion. The plate 250, the support frame 210, and the second packing member 242 may include a second air pressure forming unit 222 that forms a positive pressure in a space defined by the second plate member 242.
제2 패킹부재(242)는 제2 플레이트(250)와 지지 프레임(210)의 사이에 제공될 수 있으며, 제2 플레이트(250) 및 지지 프레임(210)과 밀착될 수 있고, 제2 플레이트(250)와 지지 프레임(210) 사이에 공기가 출입할 수 있는 틈이 발생하는 것을 방지할 수 있다.The second packing member 242 may be provided between the second plate 250 and the support frame 210, may be in close contact with the second plate 250 and the support frame 210, and the second plate ( It is possible to prevent the gap between the 250 and the support frame 210 to allow air to enter and exit.
제2 기압 형성부(222)는 제2 플레이트(250), 지지 프레임(210) 및 제2 패킹부재(242)에 의해 정의되는 공간에 정압을 형성할 수 있다. 여기서, 상기 정압은 대기압보다 높은 압력일 수 있으며, 물체면에 대하여 압축하는 방향으로 작용하는 압력일 수 있다. 제2 기압 형성부(222)는 제2 플레이트(250), 지지 프레임(210) 및 제2 패킹부재(242)에 의해 정의되는 공간에 공기 등의 가스를 공급하는 가스공급부를 포함할 수 있으며, 제2 플레이트(250), 지지 프레임(210) 및 제2 패킹부재(242)에 의해 정의되는 공간에 정압을 형성하여 점착 시트(100)의 제2 면을 압축하는 방향으로 압력을 부가할 수 있다.The second air pressure forming unit 222 may form a positive pressure in a space defined by the second plate 250, the support frame 210, and the second packing member 242. Here, the positive pressure may be a pressure higher than atmospheric pressure, it may be a pressure acting in the direction to compress the object surface. The second air pressure forming unit 222 may include a gas supply unit supplying a gas such as air to a space defined by the second plate 250, the support frame 210, and the second packing member 242. Pressure may be applied in a direction compressing the second surface of the adhesive sheet 100 by forming a positive pressure in a space defined by the second plate 250, the support frame 210, and the second packing member 242. .
이를 통해 제1 플레이트(230), 지지 프레임(210) 및 제1 패킹부재(241)에 의해 정의되는 공간에 형성된 부압과 함께 점착 시트(100)와 피점착물(10)이 밀착될 수 있는 충분한 압력을 제공할 수 있고, 점착 시트(100)의 제2 면을 눌러주어 점착 시트(100)와 피점착물(10)의 하면 사이에 있는 공기가 잘 빠져나가도록 함으로써, 점착 시트(100)와 피점착물(10)의 하면 사이에 미세한 기포(bubble)가 생기는 것을 방지할 수 있으며, 보다 효과적으로 점착 시트(100)와 피점착물(10)이 밀착되어 점착되도록 할 수 있다.Through this, the pressure-sensitive adhesive sheet 100 and the adhesive 10 can be brought into close contact with the negative pressure formed in the space defined by the first plate 230, the support frame 210, and the first packing member 241. The pressure may be provided and the second surface of the pressure sensitive adhesive sheet 100 may be pressed to allow air between the pressure sensitive adhesive sheet 100 and the lower surface of the adhesive 10 to escape well, thereby allowing the pressure sensitive adhesive sheet 100 and Fine bubbles may be prevented from occurring between the lower surfaces of the adherend 10, and the adhesive sheet 100 and the adherend 10 may be adhered to each other more effectively.
또한, 제1 기압 형성부(221)와 제2 기압 형성부(222)를 이용한 공기압(예를 들어, 부압 및 정압)을 통해서만 압력을 부가하여 피점착물(10)의 하면과 점착 시트(100)의 제1 면을 밀착시킴으로써, 크랙 등의 피점착물(10)의 손상 및 파티클의 발생 없이 피점착물(10)의 하면을 점착 시트(100)의 제1 면에 밀착시킬 수 있다.In addition, by applying pressure only through the air pressure (for example, negative pressure and positive pressure) using the first air pressure forming portion 221 and the second air pressure forming portion 222, the lower surface of the adherend 10 and the adhesive sheet 100 By bringing the first surface of the sheet into close contact with each other, the lower surface of the adherend 10 can be brought into close contact with the first surface of the adhesive sheet 100 without damaging the adherend 10 such as cracks and generating particles.
한편, 본 발명의 점착 장치(200)는 제2 플레이트(250), 지지 프레임(210) 및 제2 패킹부재(242)에 의해 정의되는 공간을 통기시키는 제2 통기부(282);를 더 포함할 수 있다. 제2 통기부(282)는 제2 플레이트(250), 지지 프레임(210) 및 제2 패킹부재(242)에 의해 정의되는 공간을 통기시킬 수 있으며, 제2 플레이트(250), 지지 프레임(210) 및 제2 패킹부재(242)에 의해 정의되는 공간과 연통 가능한 통기구를 포함할 수 있고, 정압이 형성된 제2 플레이트(250), 지지 프레임(210) 및 제2 패킹부재(242)에 의해 정의되는 공간으로부터 공기(또는 가스)를 배출(또는 배기)시킬 수 있다. 이때, 상기 통기구는 밸브 등으로 개폐될 수 있다. 제2 플레이트(250), 지지 프레임(210) 및 제2 패킹부재(242)에 의해 정의되는 공간에 정압 형성과 통기를 알맞게 수행하여 피점착물(10)의 하면과 점착 시트(100)의 제1 면을 보다 효과적으로 밀착시킬 수 있다.On the other hand, the pressure-sensitive adhesive device 200 of the present invention further includes a second vent 282 through the space defined by the second plate 250, the support frame 210 and the second packing member 242; can do. The second vent 282 may vent a space defined by the second plate 250, the support frame 210, and the second packing member 242. The second plate 250 and the support frame 210 may be vented. And a vent that can communicate with the space defined by the second packing member 242, and defined by the second plate 250, the support frame 210, and the second packing member 242 in which the static pressure is formed. Air (or gas) can be discharged (or exhausted) from the space to be used. In this case, the vent may be opened and closed by a valve or the like. The lower surface of the adherend 10 and the adhesive sheet 100 may be formed by appropriately forming positive pressure and aeration in a space defined by the second plate 250, the support frame 210, and the second packing member 242. One side can be stuck more effectively.
도 10은 본 발명의 다른 실시예에 따른 지지편과 간격조절부를 포함하는 점착 장치를 나타낸 사시도이다.10 is a perspective view showing a pressure-sensitive adhesive device including a support piece and a gap adjusting portion according to another embodiment of the present invention.
도 10을 참조하면, 본 발명에 따른 점착 장치(200)는 제1 플레이트(230)와 제2 플레이트(250) 중 어느 하나의 가장자리에 나머지 하나를 향하여 연장되어 내측으로 절곡되며, 지지 프레임(210)을 지지하는 지지편(243);을 더 포함할 수 있고, 상기 나머지 하나에는 지지편(243)에 대응되어 삽입홈(244)이 형성될 수 있다. 지지편(243)은 제1 플레이트(230)와 제2 플레이트(250) 중 어느 하나의 가장자리에 나머지 하나를 향하여 연장되어 내측으로 절곡될 수 있으며, 복수개로 구성될 수 있고, 서로 이격되어 배치될 수 있다. 여기서, 지지편(243)은 지지 프레임(210)의 로딩(loading) 시에 지지 프레임(210)을 지지할 수 있으며, 지지 프레임(210)과 상기 나머지 하나(예를 들어, 상기 제2 플레이트)가 이격된 경우에 지지 프레임(210)을 지지할 수 있다. 이때, 지지편(243)은 지지 프레임(210)의 가장자리를 지지할 수 있고, 엔드 이펙터(end-effector) 등의 이송장치(미도시)가 지지 프레임(210)을 안착시키고 빠져나오는 공간을 제공할 수 있다.Referring to FIG. 10, the pressure-sensitive adhesive device 200 according to the present invention extends toward the other one of the edges of one of the first plate 230 and the second plate 250, and is bent inwardly to support the frame 210. The support piece 243 for supporting) may be further included, and the insertion groove 244 may be formed in the other one corresponding to the support piece 243. The support piece 243 extends toward the other one of the edges of one of the first plate 230 and the second plate 250 and may be bent inward, and may be configured in plural and spaced apart from each other. Can be. Here, the support piece 243 may support the support frame 210 at the time of loading the support frame 210, the support frame 210 and the other one (for example, the second plate). When the spaced apart may support the support frame 210. At this time, the support piece 243 may support the edge of the support frame 210, and provides a space for the transport device (not shown) such as an end effector to seat and exit the support frame 210. can do.
상기 나머지 하나에는 지지편(243)에 대응되어 삽입홈(244)이 형성될 수 있으며, 삽입홈(244)은 지지편(243)의 위치, 형상 및 크기에 대응되어 제1 플레이트(230)와 제2 플레이트(250)의 근접 시에 지지편(243)이 삽입되도록 형성될 수 있다. 이에 따라 지지편(243)에 간섭되지 않고 제1 패킹부재(241)에 제1 플레이트(230)와 지지 프레임(210)이 밀착될 수 있으며, 제2 패킹부재(242)에 제2 플레이트(250)와 지지 프레임(210)이 밀착될 수 있다.An insertion groove 244 may be formed in the other one corresponding to the support piece 243, and the insertion groove 244 may correspond to the position, the shape, and the size of the support piece 243 and the first plate 230. The support piece 243 may be inserted in the proximity of the second plate 250. Accordingly, the first plate 230 and the support frame 210 may be in close contact with the first packing member 241 without interfering with the support piece 243, and the second plate 250 may be attached to the second packing member 242. ) And the support frame 210 may be in close contact.
도 11은 본 발명의 다른 실시예에 따른 지지편과 간격조절부를 설명하기 위한 개념도로, 도 11(a)는 제2 플레이트의 상승 전을 나타내고, 도 11(b)는 제2 플레이트의 상승 후를 나타낸다.11 is a conceptual view illustrating a support piece and a gap adjusting unit according to another embodiment of the present invention, in which FIG. 11 (a) shows before the second plate is raised and FIG. 11 (b) is after the second plate is raised. Indicates.
도 11을 참조하면, 지지 프레임(210)은 제1 플레이트(230)와 제2 플레이트(250)의 간격 조절에 의해 지지편(243)과 상기 나머지 하나 간에(또는 사이에서) 전달될 수 있다. 즉, 제1 플레이트(230)와 제2 플레이트(250)의 간격 조절에 의해 지지편(243)이 삽입홈(244)에 삽입되는 경우에, 지지 프레임(210)은 지지편(243)에서 상기 나머지 하나로 전달될 수 있다. 제1 플레이트(230)와 제2 플레이트(250)가 근접하게 되면, 지지편(243)이 삽입홈(244)에 삽입될 수 있고, 지지편(243)이 삽입홈(244)에 삽입되는 경우에 지지 프레임(210)은 지지편(243)에서 상기 나머지 하나 상으로 전달될 수 있다. 이때, 지지 프레임(210)은 상기 나머지 하나에 지지된 제1 패킹부재(241) 또는 제2 패킹부재(242) 상으로 전달될 수 있다. 이를 통해 제1 패킹부재(241)에 제1 플레이트(230)와 지지 프레임(210)이 밀착되어 제1 플레이트(230), 지지 프레임(210) 및 제1 패킹부재(241)에 의해 정의되는 공간이 형성될 수 있고, 제2 패킹부재(242)에 제2 플레이트(250)와 지지 프레임(210)이 밀착되어 제2 플레이트(250), 지지 프레임(210) 및 제2 패킹부재(242)에 의해 정의되는 공간이 형성될 수 있다.Referring to FIG. 11, the support frame 210 may be transferred between (or between) the support piece 243 and the other one by adjusting the gap between the first plate 230 and the second plate 250. That is, when the support piece 243 is inserted into the insertion groove 244 by adjusting the gap between the first plate 230 and the second plate 250, the support frame 210 is formed at the support piece 243. Can be passed to the other. When the first plate 230 and the second plate 250 are close to each other, the support piece 243 may be inserted into the insertion groove 244, and the support piece 243 is inserted into the insertion groove 244. The support frame 210 may be transferred from the support piece 243 onto the other one. In this case, the support frame 210 may be transferred onto the first packing member 241 or the second packing member 242 supported by the other one. As a result, the first plate 230 and the support frame 210 are in close contact with the first packing member 241 to be defined by the first plate 230, the support frame 210, and the first packing member 241. The second plate 250 and the support frame 210 may be in close contact with the second packing member 242 to the second plate 250, the support frame 210, and the second packing member 242. The space defined by may be formed.
여기서, 제1 플레이트(230)와 제2 플레이트(250) 중 상부에 있는 어느 하나의 가장자리에 지지편(243)을 형성하면, 제1 플레이트(230)와 제2 플레이트(250) 중 하부에 있는 나머지 하나의 승강만으로 제1 플레이트(230)와 제2 플레이트(250)의 간격이 조절될 수 있고, 지지편(243)에 지지되어 있던 지지 프레임(210)이 하부에 있는 나머지 하나 상에 전달될 수 있다.Here, when the support piece 243 is formed at one edge of the first plate 230 and the second plate 250, the lower portion of the first plate 230 and the second plate 250 is formed. The distance between the first plate 230 and the second plate 250 may be adjusted only by the other lifting, and the support frame 210 supported by the support piece 243 may be transferred onto the other one below. Can be.
한편, 간격조절부(260)는 도 10 및 11과 같이, 승강장치의 형태로 구성될 수 있다. 예를 들어, 승강장치 형태의 간격조절부(260)가 제2 플레이트(250)에 연결되어 제2 플레이트(250)를 승강시킴으로써, 제1 플레이트(230)와 제2 플레이트(250)의 간격을 조절할 수 있다.On the other hand, the gap adjusting unit 260 may be configured in the form of a lifting device, as shown in FIGS. For example, the space adjusting unit 260 in the form of a lift device is connected to the second plate 250 to elevate the second plate 250, thereby reducing the distance between the first plate 230 and the second plate 250. I can regulate it.
또한, 본 발명의 점착 장치(200)는 제1 플레이트(230)와 제2 플레이트(250) 중 상부에 있는 어느 하나가 지지(또는 고정)되는 상부 플레이트와 상기 상부 플레이트를 지지하는 측벽 플레이트를 포함하는 하우징(291); 및 제1 플레이트(230)와 제2 플레이트(250) 중 하부에 있는 나머지 하나와 하우징(291)을 지지하는 지지 테이블(292);을 더 포함할 수 있다. 하우징(291)은 제1 플레이트(230)와 제2 플레이트(250) 중 상부에 있는 어느 하나가 지지되는 상기 상부 플레이트와 상기 상부 플레이트를 지지하는 상기 측벽 플레이트를 포함할 수 있고, 제1 플레이트(230)와 제2 플레이트(250)의 간격이 조절되는 공간을 제공할 수 있다. 상기 상부 플레이트에는 제1 플레이트(230)와 제2 플레이트(250) 중 상부에 있는 어느 하나가 지지될 수 있고, 제1 플레이트(230)와 제2 플레이트(250) 중 상부에 있는 어느 하나의 가장자리에 형성된 지지편(243)에 지지 프레임(210)이 지지될 수 있다. 상기 측벽 플레이트는 상기 상부 플레이트를 지지할 수 있고, 제1 플레이트(230)와 제2 플레이트(250)의 간격이 조절되는 높이를 제공할 수 있다.In addition, the adhesive device 200 of the present invention includes an upper plate on which one of the first plate 230 and the second plate 250 is supported (or fixed) and a sidewall plate supporting the upper plate. A housing 291; And a support table 292 for supporting the other one of the first plates 230 and the second plate 250 and the housing 291 at a lower portion thereof. The housing 291 may include the upper plate on which one of the first plate 230 and the second plate 250 is supported, and the sidewall plate supporting the upper plate, and the first plate ( The space between the 230 and the second plate 250 may be adjusted. The upper plate may be supported by any one of the upper of the first plate 230 and the second plate 250, the edge of any one of the upper of the first plate 230 and the second plate 250 The support frame 210 may be supported by the support piece 243 formed in the support piece 243. The side wall plate may support the upper plate and may provide a height at which a distance between the first plate 230 and the second plate 250 is adjusted.
지지 테이블(292)은 제1 플레이트(230)와 제2 플레이트(250) 중 하부에 있는 나머지 하나 및/또는 하우징(291)을 지지할 수 있고, 지지 테이블(292)의 중앙에 승강장치 형태의 간격조절부(260)가 제공되어 제1 플레이트(230)와 제2 플레이트(250) 중 하부에 있는 나머지 하나를 승강시킬 수 있다.The support table 292 may support the other one of the lower one of the first plate 230 and the second plate 250 and / or the housing 291, and in the form of an elevator in the center of the support table 292. The gap adjusting part 260 may be provided to elevate the other one of the lower parts of the first plate 230 and the second plate 250.
도 12는 본 발명의 다른 실시예에 따른 패턴 플레이트를 설명하기 위한 개념도이다.12 is a conceptual diagram illustrating a pattern plate according to another embodiment of the present invention.
본 발명에 따른 점착 장치(200)는 피점착물(10)을 수용 가능한 패턴홀이 형성되며, 점착 시트(100)의 제1 면과 제1 플레이트(230)의 사이에 제공되는 패턴 플레이트(270);를 더 포함할 수 있다. 패턴 플레이트(270)는 피점착물(10)을 수용 가능한 패턴홀이 형성될 수 있으며, 점착 시트(100)의 제1 면 방향에 제1 플레이트(230)와 대향하여 제공될 수 있고, 점착 시트(100)의 제1 면과 제1 플레이트(230)의 사이에 위치할 수 있다. 여기서, 상기 패턴홀에는 피점착물(10)이 수용될 수 있으며, 상기 패턴홀의 측벽을 형성하는 패턴 플레이트(270)의 패턴 라인이 피점착물(10)의 둘레(또는 주위)에 제공될 수 있고, 피점착물(10)이 복수개로 구성되는 경우에는 패턴 플레이트(270)의 패턴 라인이 피점착물(10)의 사이사이에 제공될 수 있다. 패턴 플레이트(270)는 점착 시트(100)에 피점착물(10) 방향으로 압력이 부가되는 경우에 피점착물(10)이 놓여지지 않은 피점착물(10)의 둘레에 점착 시트(100)가 솟아 올라오는 것을 막아줄 수 있다. 이에 따라 점착 시트(100)가 피점착물(10)의 측면을 따라 올라가 피점착물(10)의 측면에 점착되는 것을 억제 또는 방지할 수 있다.In the adhesive device 200 according to the present invention, a pattern hole that can accommodate the adherend 10 is formed, and a pattern plate 270 provided between the first surface of the adhesive sheet 100 and the first plate 230. It may further include; The pattern plate 270 may have a pattern hole to accommodate the adherend 10, and may be provided to face the first plate 230 in a first surface direction of the adhesive sheet 100, and may be provided with an adhesive sheet. It may be located between the first surface of the (100) and the first plate 230. Here, the adherend 10 may be accommodated in the pattern hole, and a pattern line of the pattern plate 270 forming the sidewall of the pattern hole may be provided around (or around) the adherend 10. In addition, when the adherend 10 is formed in plural, a pattern line of the pattern plate 270 may be provided between the adherends 10. The pattern plate 270 may have a pressure-sensitive adhesive sheet 100 around the adherend 10 on which the adherend 10 is not placed when pressure is applied to the pressure-sensitive adhesive sheet 100 in the direction of the adherend 10. To prevent it from rising. Thereby, the adhesive sheet 100 can be suppressed or prevented from rising up along the side of the adherend 10 and adhering to the side of the adherend 10.
피점착물(10)의 측면에 점착 시트(100)가 국부적으로 부착되는 경우에는 점착 시트(100)가 부착된 피점착물(10)의 측면에 전자파 차폐막 등이 증착되지 않을 수 있고, 증착되지 않은 부분에서 전자파 차폐막의 틈이 발생되어 피점착물(10)에서 방출되는 전자파를 차폐하지 못하게 된다. 한편, 피점착물(10)의 측면에 점착 시트(100)가 부착되는 것을 억제 또는 방지하기 위해 약한 압력이 가해지게 되는 경우에는 피점착물(10)의 하면과 점착 시트(100)의 밀착력이 떨어져 반도체 패키지 등의 피점착물(10) 상에 전자파 차폐막 등을 증착하는 경우에 피점착물(10)의 하면 가장자리의 틈새로 증착물질이 침투하여 피점착물(10)의 하면에 증착될 수 있다.When the adhesive sheet 100 is locally attached to the side of the adherend 10, an electromagnetic wave shielding film may not be deposited on the side of the adherend 10 to which the adhesive sheet 100 is attached, and is not deposited. In this case, a gap of the electromagnetic wave shielding film is generated so that the electromagnetic wave emitted from the adherend 10 cannot be shielded. On the other hand, when a weak pressure is applied to suppress or prevent the adhesion of the adhesive sheet 100 to the side of the adherend 10, the adhesion between the lower surface of the adherend 10 and the adhesive sheet 100 is When the electromagnetic wave shielding film is deposited on the adherend 10 such as a semiconductor package, the deposition material penetrates into the gap between the bottom edge of the adherend 10 and may be deposited on the bottom surface of the adherend 10. have.
이때, 패턴 플레이트(270)는 피점착물(10)보다 얇은 두께를 가질 수 있다. 패턴 플레이트(270)의 두께가 피점착물(10)의 두께 이상인 경우에는 패턴 플레이트(270)가 피점착물(10)의 주위(또는 둘레)에서 점착 시트(100)에 제1 플레이트(230) 방향으로 부가되는 압력을 막아 점착 시트(100)가 피점착물(10)의 하면 가장자리에 밀착되는 것을 방해할 수 있으며, 이에 따라 피점착물(10)의 하면 가장자리에는 점착 시트(100)의 점착이 잘 이루어지지 않을 수 있고, 반도체 패키지 등의 피점착물(10) 상에 전자파 차폐막 등을 증착하는 경우에 피점착물(10)의 하면 가장자리의 틈새로 증착물질이 피점착물(10)의 하면에 증착될 수 있다. 이러한 경우, 피점착물(10)의 하면에 증착 오염이 발생되어 반도체 패키지 등의 피점착물(10)의 품질이 나빠질 수 있고, 수율이 떨어지는 등의 문제가 발생할 수 있다.In this case, the pattern plate 270 may have a thickness thinner than the adherend 10. When the thickness of the pattern plate 270 is greater than or equal to the thickness of the adherend 10, the pattern plate 270 may be formed on the adhesive sheet 100 at the periphery (or circumference) of the adherend 10. It can prevent the pressure-sensitive adhesive sheet 100 is in close contact with the bottom edge of the adherend 10 by blocking the pressure added in the direction, and thus the adhesion of the adhesive sheet 100 to the bottom edge of the adherend 10 This may not be achieved, and when the electromagnetic wave shielding film or the like is deposited on the adherend 10, such as a semiconductor package, the deposition material may be formed in the gap between the bottom surface of the adherend 10. It may be deposited on the lower surface. In this case, deposition contamination may occur on the lower surface of the adherend 10, so that the quality of the adherend 10, such as a semiconductor package, may be deteriorated, and the yield may be deteriorated.
한편, 상기 패턴홀은 피점착물(10)의 테두리에서 0.1 내지 2 ㎜(또는 약 0.5 ㎜)씩 이격된(또는 크게 가공된) 형상일 수 있다. 이때, 피점착물(10)의 간격은 1 내지 3 ㎜(또는 약 2 ㎜)일 수 있고, 상기 패턴홀의 간격은 0.5 내지 2 ㎜(또는 약 1 ㎜)일 수 있다. 상기 패턴홀이 피점착물(10)의 테두리에서 0.1 내지 2 ㎜씩 이격된 형상인 경우에는 높은 가압에도 피점착물(10)의 측면에 점착 시트(100)가 접착되는 영역(또는 면적)을 최소화할 수 있으며, 정밀도가 높지 않은 장비로도 상기 패턴홀에 피점착물(10)이 수용되도록 할 수 있다. 상기 패턴홀의 크기(size)가 피점착물(10)의 크기와 동일할수록 점착 시트(100)가 접착되는 영역이 없어질 수 있으나, 상기 패턴홀이 피점착물(10)의 테두리에서 0.1 ㎜ 이상씩 크게 형성되지 않는 경우에는 피점착물(10)을 상기 패턴홀에 수용시키기 위해 정밀 로딩이 필요하므로, 정밀 로딩을 위한 정밀도가 높은 고가의 장비를 사용하거나 정밀 로딩을 위해 공정시간이 길어지게 된다.On the other hand, the pattern hole may have a shape spaced apart (or largely processed) by 0.1 to 2 mm (or about 0.5 mm) from the edge of the adherend 10. At this time, the interval of the adherend 10 may be 1 to 3 mm (or about 2 mm), the interval of the pattern hole may be 0.5 to 2 mm (or about 1 mm). When the pattern hole has a shape spaced 0.1 to 2 mm apart from the edge of the adherend 10, a region (or area) to which the adhesive sheet 100 is adhered to the side of the adherend 10 even at high pressure. It may be minimized, and even the equipment with high precision may allow the adherend 10 to be accommodated in the pattern hole. As the size of the pattern hole is the same as the size of the adherend 10, an area to which the adhesive sheet 100 is adhered may disappear, but the pattern hole is 0.1 mm or more from the edge of the adherend 10. In the case of not being formed large, precision loading is required to accommodate the adherend 10 in the pattern hole, so that expensive processing equipment for high precision loading or long processing time is required for precision loading. .
반면에, 상기 패턴홀을 피점착물(10)의 테두리에서 2 ㎜씩보다 더 크게 형성하는 경우에는 패턴 플레이트(270)의 패턴 라인이 피점착물(10)의 둘레에서 멀어져 피점착물(10)의 둘레에 점착 시트(100)가 솟아 올라오는 것을 막아주는 효과가 저하될 수 있고, 하나의 패턴 플레이트(270)에 형성될 수 있는 상기 패턴홀의 개수가 제한되어 하나의 지지 프레임(210)에 지지된 점착 시트(100) 상에 제공되는 피점착물(10)의 수가 적어질(또는 제한될) 수 있다.On the other hand, in the case where the pattern hole is formed larger than 2 mm by the edge of the adherend 10, the pattern line of the pattern plate 270 moves away from the periphery of the adherend 10 and the adherend 10 ), The effect of preventing the adhesive sheet 100 from rising up may be reduced, and the number of the pattern holes that may be formed in one pattern plate 270 is limited to one support frame 210. The number of adherends 10 provided on the supported adhesive sheet 100 may be reduced (or limited).
피점착물(10)은 일면에 적어도 하나의 돌출 단자(11a)를 포함하는 반도체 패키지일 수 있고, 점착 시트(100)는 그 일면에 돌출 단자(11a)가 접촉되도록 상기 반도체 패키지가 부착되는 점착층(110); 및 상기 점착층(110)의 일면과 대향하는 타면 상에 제공되며, 상기 압력에 의하여 돌출 단자(11a)를 따라 소성 변형하는 변형 유지층(120)을 포함하는 전자 부품 캐리어 시트일 수 있다. 즉, 점착 장치(200)는 반도체 패키지의 전극(또는 단자) 보호를 위한 점착 장치일 수 있다.The adherend 10 may be a semiconductor package including at least one protruding terminal 11a on one surface thereof, and the adhesive sheet 100 may be attached to the semiconductor package so that the protruding terminal 11a is in contact with one surface thereof. Layer 110; And a strain holding layer 120 provided on the other surface of the adhesive layer 110 facing the one surface of the adhesive layer 110 and plastically deformed along the protruding terminal 11a by the pressure. That is, the adhesion device 200 may be an adhesion device for protecting an electrode (or terminal) of a semiconductor package.
피점착물(10)은 일면에 적어도 하나의 돌출 단자(11a)를 포함하는 반도체 패키지일 수 있으며, 돌출 단자(11a)는 랜드(land) 형태의 금속 전극 또는 솔더 볼(solder ball)일 수 있다. 예를 들어, 상기 반도체 패키지는 하면에 다수개의 솔더 볼들이 매트릭스 형태로 배치된 볼 그리드 어레이(Ball Grid Array; BGA) 반도체 패키지 혹은 랜드 형태의 금속 전극들이 매트릭스 형태로 배치된 랜드 그리드 어레이(Land Grid Array; LGA) 반도체 패키지일 수 있고, 점착 시트(100)에 점착된 이후에 상기 반도체 패키지의 측면들 및 상면에는 스퍼터링 공정 등으로 전자파를 차폐하기 위한 금속막(즉, 전자파 차폐막)이 형성될 수 있다.The adherend 10 may be a semiconductor package including at least one protruding terminal 11a on one surface thereof, and the protruding terminal 11a may be a land-shaped metal electrode or a solder ball. . For example, the semiconductor package may include a ball grid array (BGA) in which a plurality of solder balls are arranged in a matrix on a lower surface thereof, or a land grid array in which metal electrodes in a land form are arranged in a matrix form. Array; LGA) may be a semiconductor package, a metal film (ie, electromagnetic shielding film) for shielding the electromagnetic wave by a sputtering process or the like may be formed on the side surfaces and the upper surface of the semiconductor package after being adhered to the adhesive sheet 100 have.
점착 시트(100)는 전자 부품 캐리어 시트(예를 들어, 반도체 패키지 캐리어 시트)일 수 있으며, 점착층(110) 및 변형 유지층(120)을 포함할 수 있다. 상기 전자 부품 캐리어 시트는 상기 반도체 패키지를 제1 면(또는 상면)에 견고하게 밀착 고정하는 역할을 할 수 있고, 하나의 상기 전자 부품 캐리어 시트에는 다수개의 상기 반도체 패키지들이 밀집 대형으로 배치될 수 있다. 예를 들어, 상기 반도체 패키지가 상기 전자 부품 캐리어 시트에 밀착 고정된 후에 이송 트레이(40)에 탑재되어 스퍼터링 공정이 수행될 수 있고, 상기 전자 부품 캐리어 시트에 의해 상기 반도체 패키지의 하면에는 금속막이 형성되지 않고, 상기 반도체 패키지의 측면들 및 상면에만 전자파를 차폐하기 위한 금속막이 형성될 수 있다. 한편, 상기 전자 부품 캐리어 시트는 자성을 갖는 적어도 하나의 층을 포함할 수 있다. 여기서, 자성은 전자석, 영구자석 등의 자석체에 부착되는 성질을 의미하며, 상기 전자 부품 캐리어 시트에 별도의 자성층을 형성하거나 점착층(110) 및 변형 유지층(120) 중 적어도 어느 하나에 자성 물질(또는 자성체 분말)을 함유(또는 포함)시킬 수 있다. 이러한 상기 전자 부품 캐리어 시트는 스퍼터링 공정 시에 스퍼터링 장치에서 서셉터의 마그네트부로부터 제공되는 자력에 의해 서셉터와 견고하게 밀착될 수 있다.The adhesive sheet 100 may be an electronic component carrier sheet (eg, a semiconductor package carrier sheet), and may include an adhesive layer 110 and a strain holding layer 120. The electronic component carrier sheet may serve to firmly fix the semiconductor package to a first surface (or an upper surface), and a plurality of the semiconductor packages may be arranged in a compact size in one electronic component carrier sheet. . For example, after the semiconductor package is tightly fixed to the electronic component carrier sheet, the semiconductor package may be mounted on the transfer tray 40 to perform a sputtering process, and a metal film may be formed on the bottom surface of the semiconductor package by the electronic component carrier sheet. Instead, the metal film may be formed to shield the electromagnetic waves only on the side surfaces and the upper surface of the semiconductor package. Meanwhile, the electronic component carrier sheet may include at least one layer having magnetic properties. Here, magnetic means a property of being attached to a magnet body such as an electromagnet, a permanent magnet, and forms a separate magnetic layer on the electronic component carrier sheet or magnetically on at least one of the adhesive layer 110 and the strain holding layer 120. It may contain (or include) a substance (or magnetic powder). The electronic component carrier sheet may be in close contact with the susceptor by the magnetic force provided from the magnet portion of the susceptor in the sputtering apparatus during the sputtering process.
점착층(110)은 그 일면에 돌출 단자(11a)가 접촉되도록 상기 반도체 패키지가 부착(또는 점착)될 수 있다. 예를 들어, 점착층(110)은 볼 그리드 어레이(BGA) 반도체 패키지 혹은 랜드 그리드 어레이(LGA) 반도체 패키지를 스퍼터링 공정이 완료될 때까지 밀착 및 고정하고, 스퍼터링 공정 후에는 상기 전자 부품 캐리어 시트에서 상기 반도체 패키지의 탈착이 용이하도록 상기 반도체 패키지를 점착하는 역할을 할 수 있다. 점착층(110)은 점착성을 갖는 유동성 점착 물질을 막 형태로 가공하여 형성될 수 있다. 예를 들어, 상기 점착 물질은 실리콘 계열 점착 물질을 포함할 수 있으며, 이에 한정되지 않고, 점착층(110)을 이루는 점착 물질은 실리콘 계열 점착 물질 이외에도 다양한 물질이 사용될 수 있다.The semiconductor layer may be attached (or adhered) to the adhesive layer 110 such that the protruding terminal 11a contacts one surface thereof. For example, the adhesive layer 110 adheres and fixes the ball grid array (BGA) semiconductor package or the land grid array (LGA) semiconductor package until the sputtering process is completed, and after the sputtering process, the electronic component carrier sheet The semiconductor package may be attached to the semiconductor package to facilitate the detachment of the semiconductor package. The adhesive layer 110 may be formed by processing a liquid adhesive material having adhesiveness into a film form. For example, the adhesive material may include a silicon-based adhesive material, and the present invention is not limited thereto. The adhesive material constituting the adhesive layer 110 may include various materials in addition to the silicone-based adhesive material.
변형 유지층(120)은 상기 반도체 패키지가 점착되는 점착층(110)의 일면과 대향하는 타면 상에 제공될 수 있고, 점착층(110)에 접합될 수 있으며, 상기 압력(또는 외부 압력)에 의하여 돌출 단자(11a)를 따라 소성 변형할 수 있다. 즉, 변형 유지층(120)은 가압부(220)를 통한 상기 압력에 의하여 돌출 단자(11a)를 따라 형상이 변형되어 소성 변형된 후에 형상이 복원되지 않는 특징을 가질 수 있다. 예를 들어, 변형 유지층(120)은 가공된 후 형상이 복원되지 않는 비자성체 금속 소재로 형성될 수 있으며, 얇은 두께를 갖는 비자성체 금속 시트 또는 비자성체 금속 필름 형태로 형성될 수 있다. 여기서, 변형 유지층(120)은 연성이 풍부하고 가공성이 우수하여 매우 얇은 두께로 가공이 용이하며 자기장이 통과할 수 있는 비자성체 금속 소재로 형성될 수 있으며, 알루미늄 소재, 알루미늄 합금 소재, 구리 소재 및 구리 합금 소재 등으로 형성될 수 있다.The strain holding layer 120 may be provided on the other surface of the adhesive layer 110 to which the semiconductor package is attached, and may be bonded to the adhesive layer 110, and may be bonded to the pressure (or external pressure). By this, plastic deformation can be performed along the protruding terminal 11a. That is, the strain holding layer 120 may have a feature in which the shape is not restored after the plastic deformation through the deformation of the shape along the protruding terminal 11a by the pressure through the pressing unit 220. For example, the strain holding layer 120 may be formed of a nonmagnetic metal material which is not restored after being processed, and may be formed in the form of a nonmagnetic metal sheet or a nonmagnetic metal film having a thin thickness. Here, the strain retaining layer 120 may be formed of a non-magnetic metal material that can be easily processed to a very thin thickness due to the ductility and excellent workability, and may pass through a magnetic field. An aluminum material, an aluminum alloy material, and a copper material And a copper alloy material.
그리고 변형 유지층(120)은 상기 반도체 패키지의 돌출 단자(11a)가 점착층(110)에 밀착 고정되는 과정에서 점착층(110)에 가해진 압력에 의하여 형상이 변형될 수 있고, 형상이 변형되어 소성 변형된 후에는 원래 형상으로 복원되지 않을 수 있다. 이때, 변형 유지층(120)의 형상이 변형된 후에 형상이 복원되지 않도록 하면서 취급성을 향상시키기 위해서는 변형 유지층(120)의 소재 및 두께가 중요할 수 있다. 변형 유지층(120)의 두께가 지나치게 얇을 경우에는 매우 쉽게 찢어지거나 파손되어 취급이 매우 어려울 수 있고, 반대로 변형 유지층(120)의 두께가 지나치게 두꺼울 경우에는 상기 반도체 패키지의 돌출 단자(11a)에 의하여 상기 압력이 가해지더라도 형상이 돌출 단자(11a)의 형상을 따라 정확하게 변형되지 않을 수 있다.In addition, the strain holding layer 120 may be deformed by a pressure applied to the adhesive layer 110 while the protrusion terminal 11a of the semiconductor package is tightly fixed to the adhesive layer 110. After plastic deformation, it may not be restored to its original shape. In this case, the material and the thickness of the strain holding layer 120 may be important in order to improve the handling while preventing the shape from being restored after the shape of the strain holding layer 120 is deformed. When the thickness of the strain holding layer 120 is too thin, it may be very easily torn or broken, and handling may be very difficult. On the contrary, when the thickness of the strain holding layer 120 is too thick, the strain holding layer 120 may have a protruding terminal 11a. Even when the pressure is applied thereto, the shape may not be accurately deformed along the shape of the protruding terminal 11a.
상기 압력은 변형 유지층(120)의 소성 변형이 가능한 항복값 이상(의 압력)일 수 있다. 즉, 가압부(220)는 변형 유지층(120)의 소성 변형이 가능한 항복값 이상의 압력을 점착 시트(100)와 피점착물(10) 중 적어도 하나에 부가할 수 있다. 점착 시트(100)와 피점착물(10) 중 적어도 하나에 변형 유지층(120)의 소성 변형이 가능한 항복값 미만의 압력이 부가되는 경우에는 변형 유지층(120)에 소성 변형이 가능한 항복값 이상의 압력이 가해지지 못하여 변형 유지층(120)이 소성 변형될 수 없고, 원래 형상으로 복원될 수 있다. 이러한 경우, 피점착물(10)의 하면이 점착 시트(100)에 밀착되어 점착되지 못하고 점착 시트(100)와 피점착물(10)의 하면 사이에 들뜸 현상이 발생될 수 있다. 이로 인해 반도체 패키지 등의 피점착물(10)의 하면에 증착 오염이 발생되어 피점착물(10)의 품질이 나빠지며 수율이 떨어질 수 있다.The pressure may be equal to or higher than the yield value at which the plastic deformation of the strain maintaining layer 120 is possible. That is, the pressing unit 220 may add a pressure equal to or higher than a yield value at which the strain holding layer 120 may be plastically deformed to at least one of the adhesive sheet 100 and the adherend 10. When the pressure less than the yield value at which the strain holding layer 120 is plastically deformed is applied to at least one of the adhesive sheet 100 and the adherend 10, the yield value at which the plastic deformation is possible at the strain holding layer 120. Since the above pressure is not applied, the strain holding layer 120 may not be plastically deformed, and may be restored to its original shape. In this case, the bottom surface of the adherend 10 may not be adhered to the adhesive sheet 100 to be adhered, and a lifting phenomenon may occur between the adhesive sheet 100 and the bottom surface of the adherend 10. As a result, deposition contamination occurs on the lower surface of the adherend 10 such as a semiconductor package, so that the quality of the adherend 10 may be deteriorated and the yield may decrease.
따라서, 가압부(220)는 변형 유지층(120)의 소성 변형이 가능한 항복값 이상의 압력을 점착 시트(100)와 피점착물(10) 중 적어도 하나에 부가할 수 있으며, 돌출 단자(11a)의 형상을 따라 변형 유지층(120)을 소성 변형시켜 피점착물(10)의 하면이 점착 시트(100)에 밀착되어 점착되도록 할 수 있고, 하면에 돌출 단자(11a)가 있는 경우에도 점착 시트(100)와 피점착물(10)의 하면 사이에 발생되는 들뜸 현상을 방지할 수 있다.Accordingly, the pressing unit 220 may apply a pressure equal to or greater than a yield value at which the strain holding layer 120 may be plastically deformed to at least one of the adhesive sheet 100 and the adherend 10, and the protruding terminal 11a. The deformation-retaining layer 120 may be plastically deformed along the shape of the adhesive retaining layer 120 so that the lower surface of the adherend 10 adheres to the adhesive sheet 100 and adheres to the adhesive sheet 100. The lifting phenomenon generated between the bottom surface of the 100 and the adherend 10 can be prevented.
도 13은 본 발명의 다른 실시예에 따른 롤러 형태의 가압부를 포함하는 점착 장치를 나타낸 개략도이다.13 is a schematic view showing a pressure-sensitive adhesive device including a pressing portion in the form of a roller according to another embodiment of the present invention.
도 13을 참조하면, 가압부(220)는 상기 제1 면과 대향하는 점착 시트(100)의 제2 면 방향에 제공되며, 점착 시트(100)의 제2 면을 가압하는 연성 재질 또는 브러쉬 형태의 롤러를 포함할 수 있다. 상기 롤러는 상기 제1 면과 대향하는 점착 시트(100)의 제2 면 방향에 제1 플레이트(230) 및/또는 지지 프레임(210)의 적어도 일부와 대향하여 제공될 수 있고, 점착 시트(100)의 제2 면을 가압할 수 있으며, 연성 재질로 이루어지거나 브러쉬 형태일 수 있다. 이때, 피점착물(10)의 상면은 제1 플레이트(230)에 지지될 수 있다. 상기 롤러는 지지 프레임(210)에 지지된 점착 시트(100)의 제2 면을 가압하므로, 너무 강한 가압력에 의해 피점착물(10)의 돌출 단자(11a) 등에 점착 시트(100)가 찢어지거나 파손되는 것을 방지하고, 점착 시트(100)가 돌출 단자(11a) 등에 따라 밀착되어 점착될 수 있도록 연성 재질로 이루어지거나 브러쉬 형태로 이루어질 수 있다. 이를 통해 점착 시트(100)의 제2 면을 가압하는 가압력을 피점착물(10) 하면(또는 하부)의 형상에 따라 골고루 분산시킬 수 있고, 이에 따라 점착 시트(100)가 안정적으로 가압되어 돌출 단자(11a) 등에 점착 시트(100)가 찢어지거나 파손되는 것을 방지하면서 점착 시트(100)가 돌출 단자(11a) 등을 따라 밀착되어 점착되도록 할 수 있다.Referring to FIG. 13, the pressing unit 220 is provided in a second surface direction of the adhesive sheet 100 facing the first surface, and forms a flexible material or brush that presses the second surface of the adhesive sheet 100. It may include a roller. The roller may be provided to face at least a portion of the first plate 230 and / or the support frame 210 in the second surface direction of the adhesive sheet 100 facing the first surface, and the adhesive sheet 100. The second side of the) may be pressed, and may be made of a soft material or in the form of a brush. In this case, the upper surface of the adherend 10 may be supported by the first plate 230. Since the roller presses the second surface of the pressure sensitive adhesive sheet 100 supported by the support frame 210, the pressure sensitive adhesive sheet 100 may be torn due to the excessively strong pressing force, such as the protruding terminal 11a of the adherend 10. The adhesive sheet 100 may be made of a flexible material or made of a brush so that the adhesive sheet 100 may be adhered by being adhered to the protruding terminal 11a or the like. Through this, the pressing force for pressing the second surface of the adhesive sheet 100 can be evenly distributed according to the shape of the lower surface (or lower portion) of the adherend 10, whereby the adhesive sheet 100 is stably pressed to protrude. While preventing the adhesive sheet 100 from being torn or broken, the adhesive sheet 100 may be adhered along the protruding terminal 11a or the like to prevent the adhesive sheet 100 from being torn or broken.
이하에서는 본 발명의 실시 형태에 따른 점착 방법을 보다 상세히 살펴보는데, 본 발명의 일실시예에 따른 점착 장치와 관련하여 앞서 설명된 부분과 중복되는 사항들은 생략하도록 한다.Hereinafter, the adhesion method according to an embodiment of the present invention will be described in more detail, and details overlapping with the above-described parts with respect to the adhesion device according to an embodiment of the present invention will be omitted.
본 발명의 실시 형태에 따른 점착 방법은 점착 시트를 지지 프레임에 지지하는 과정(S100); 상기 점착 시트의 제1 면 상에 피점착물을 가부착하는 과정(S200); 상기 점착 시트의 제1 면이 제1 플레이트를 향하도록 상기 지지 프레임을 배치하는 과정(S300); 및 상기 점착 시트와 상기 피점착물 중 적어도 하나를 가압하는 과정(S400);을 포함하할 수 있다.Adhesive method according to an embodiment of the present invention is a step of supporting the adhesive sheet to the support frame (S100); Attaching the adherend on the first surface of the adhesive sheet (S200); Disposing the support frame such that the first surface of the adhesive sheet faces the first plate (S300); And pressing at least one of the adhesive sheet and the adherend (S400).
먼저, 점착 시트를 지지 프레임에 지지한다(S100). 상기 지지 프레임에는 상기 점착 시트가 지지될 수 있으며, 내부에 홀이 형성되도록 중앙부가 개구되어 중공형으로 형성될 수 있다. 이때, 상기 점착 시트는 상기 지지 프레임에 부착되어 지지될 수 있고, 상기 지지 프레임의 하면(또는 제2 면)에 상기 점착 시트의 제1 면 가장자리를 부착할 수 있다. 여기서, 상기 점착 시트의 부착은 상기 점착 시트를 상기 지지 프레임에 대응되는 크기로 미리 절단하여 위치에 맞게 부착할 수도 있으나, 상기 점착 시트가 상기 지지 프레임의 내주를 채우도록 부착한 상태에서 상기 지지 프레임의 크기에 맞게 상기 점착 시트의 외곽을 절단처리하는 것이 바람직할 수 있다.First, the adhesive sheet is supported on the support frame (S100). The adhesive sheet may be supported by the support frame, and may be formed in a hollow shape by opening a central portion to form a hole therein. In this case, the adhesive sheet may be attached to the support frame to be supported, and the edge of the first surface of the adhesive sheet may be attached to the bottom surface (or the second surface) of the support frame. Here, the adhesive sheet may be attached to a position by cutting the adhesive sheet in advance in a size corresponding to the support frame, but the adhesive frame is attached to fill the inner circumference of the support frame. It may be desirable to cut the outer edge of the adhesive sheet in accordance with the size of the.
다음으로, 상기 점착 시트의 제1 면 상에 피점착물을 가부착한다(S200). 상기 점착 시트의 제1 면 상에 피점착물을 가부착할 수 있으며, 상기 피점착물은 상기 점착 시트의 제1 면 중 홀이 형성된 상기 지지 프레임의 중앙부에 대응되어 제공될 수 있고, 복수개로 구성될 수 있다. 여기서, 상기 피점착물을 상기 점착 시트의 제1 면 상에 일정간격으로 안착시켜 상기 피점착물의 하면(또는 제2 면)을 상기 점착 시트의 제1 면에 가부착할 수 있고, 피커(picker)와 같은 이송모듈(미도시)을 통해 일정간격으로 자동 배치하는 것이 바람직할 수 있다.Next, the adhesive material is temporarily attached on the first surface of the adhesive sheet (S200). The adherend may be temporarily attached onto the first surface of the adhesive sheet, and the adherend may be provided corresponding to a central portion of the support frame in which holes are formed among the first surfaces of the adhesive sheet. Can be configured. Here, the adherend may be seated on the first surface of the pressure-sensitive adhesive sheet at a predetermined interval so that the bottom surface (or the second surface) of the adherend may be temporarily attached to the first surface of the pressure-sensitive adhesive sheet, and the picker It may be desirable to automatically arrange at a predetermined interval through a transfer module (not shown), such as).
그 다음 상기 점착 시트의 제1 면이 제1 플레이트를 향하도록 상기 지지 프레임을 배치한다(S300). 상기 점착 시트의 제1 면이 상기 제1 플레이트를 향하도록 상기 지지 프레임을 배치할 수 있으며, 상기 점착 시트 및/또는 상기 피점착물에 압력이 잘 전달될 수 있도록 상기 피점착물의 상면(또는 제1 면)이 상기 제1 플레이트에 지지될 수 있도록 할 수 있다.Next, the support frame is disposed such that the first surface of the adhesive sheet faces the first plate (S300). The support frame may be disposed so that the first surface of the pressure sensitive adhesive sheet faces the first plate, and the upper surface (or the first surface of the pressure sensitive adhesive material so as to transfer pressure well to the pressure sensitive adhesive sheet and / or the adherend. 1 side) can be supported on the first plate.
그리고 상기 점착 시트와 상기 피점착물 중 적어도 하나를 가압한다(S400). 상기 점착 시트와 상기 피점착물 중 적어도 하나에 서로를 향하는 방향으로 압력을 부가(또는 가압)할 수 있으며, 이를 통해 상기 점착 시트와 상기 피점착물이 서로 밀착되도록 할 수 있고, 상기 점착 시트의 제1 면 상에 가부착된 상기 피점착물을 상기 점착 시트의 제1 면에 점착시킬 수 있다.Then, at least one of the adhesive sheet and the adherend is pressed (S400). Pressure may be added (or pressed) to at least one of the adhesive sheet and the adherend in a direction facing each other, thereby allowing the adhesive sheet and the adherend to adhere to each other, The adherend temporarily attached on the first surface may be adhered to the first surface of the adhesive sheet.
본 발명에 따른 점착 방법은 상기 제1 플레이트와 상기 지지 프레임의 사이에 제공되는 제1 패킹부재, 상기 제1 플레이트 및 상기 지지 프레임을 상호 밀착시키는 과정(S361);을 더 포함할 수 있고, 상기 가압하는 과정(S400)은 상기 제1 플레이트, 상기 지지 프레임 및 상기 제1 패킹부재에 의해 정의되는 공간에 부압을 형성하는 과정(S410)을 포함할 수 있다.The adhesion method according to the present invention may further include a step (S361) of closely contacting the first packing member, the first plate, and the support frame provided between the first plate and the support frame. Pressing (S400) may include a step (S410) of forming a negative pressure in the space defined by the first plate, the support frame and the first packing member.
상기 지지 프레임을 배치하는 과정(S300) 이후에 상기 제1 플레이트와 상기 지지 프레임의 사이에 제공되는 제1 패킹부재, 상기 제1 플레이트 및 상기 지지 프레임을 상호 밀착시킬 수 있다(S361). 상기 제1 플레이트와 상기 지지 프레임의 사이에 제공되는 상기 제1 패킹부재에 상기 제1 플레이트와 상기 지지 프레임이 밀착될 수 있고, 상기 제1 플레이트와 상기 지지 프레임 사이에 공기가 출입할 수 있는 틈(gap)이 발생하는 것을 방지할 수 있다. 이를 통해 상기 제1 플레이트, 상기 지지 프레임 및 상기 제1 패킹부재에 의해 정의되는 공간을 형성할 수 있으며, 상기 제1 패킹부재를 통해 상기 제1 플레이트와 상기 지지 프레임의 사이에서 상기 피점착물의 높이를 확보할 수도 있다.After the process of arranging the support frame (S300), the first packing member, the first plate, and the support frame provided between the first plate and the support frame may be in close contact with each other (S361). The first plate and the support frame may be in close contact with the first packing member provided between the first plate and the support frame, and a gap through which air may enter and exit between the first plate and the support frame. (gap) can be prevented from occurring. This may form a space defined by the first plate, the support frame and the first packing member, the height of the adherend between the first plate and the support frame through the first packing member. You can also secure.
그리고 상기 제1 플레이트, 상기 지지 프레임 및 상기 제1 패킹부재에 의해 정의되는 공간에 부압(또는 진공이나 음압)을 형성할 수 있다(S410). 여기서, 상기 부압은 대기압(또는 상압)보다 낮은 압력일 수 있으며, 물체의 표면에 물체를 흡인하는 방향으로 가해지는 흡인력일 수 있다. 이때, 진공 펌프(vacuum pump)를 통해 부압을 형성할 수 있으며, 상기 제1 플레이트, 상기 지지 프레임 및 상기 제1 패킹부재에 의해 정의되는 공간에 부압을 형성하여 상기 피점착물의 상면이 상기 제1 플레이트에 지지되도록 할 수 있고, 상기 점착 시트에 상기 피점착물 방향으로 압력(또는 흡인력)을 부가할 수 있다.In addition, a negative pressure (or a vacuum or a negative pressure) may be formed in a space defined by the first plate, the support frame, and the first packing member (S410). Here, the negative pressure may be a pressure lower than atmospheric pressure (or normal pressure), and may be a suction force applied in a direction of sucking the object on the surface of the object. In this case, a negative pressure may be formed through a vacuum pump, and a negative pressure is formed in a space defined by the first plate, the support frame, and the first packing member, so that an upper surface of the adherend is formed on the first surface. It can be supported by the plate, it can be added to the pressure-sensitive adhesive sheet in the direction of the adherend (or suction force).
이에 상기 피점착물의 상면에는 상기 제1 플레이트로의 밀착력에 의한 반작용 힘이 부가되고, 상기 점착 시트에 상기 피점착물 방향으로 압력이 부가됨으로써, 상기 부가피점착물의 하면이 상기 점착 시트의 제1 면에 밀착되어 점착될 수 있다. 여기서, 상대적으로 평탄한 상기 피점착물의 상면이 상기 제1 플레이트에 지지됨으로써, 상기 제1 플레이트로의 밀착력에 의한 반작용 힘이 효과적으로 부가될 수 있고, 상기 점착 시트 및/또는 상기 피점착물에 부가되는 압력이 서로를 향하는 방향으로 잘 전달되어 상기 피점착물의 하면과 상기 점착 시트의 제1 면이 밀착될 수 있다. 또한, 공기압을 통해 상기 피점착물의 하면과 상기 점착 시트의 제1 면을 밀착시킴으로써, 크랙 등의 상기 피점착물의 손상 및 파티클의 발생 없이 상기 점착 시트에 상기 피점착물을 밀착시킬 수 있다.Accordingly, a reaction force due to the adhesion to the first plate is added to the upper surface of the adherend, and pressure is added to the adherend sheet in the direction of the adherend, whereby the lower surface of the adherend adheres to the first surface of the adhesive sheet. It may be adhered to the surface and adhered. Here, the relatively flat upper surface of the adherend is supported on the first plate, whereby reaction force due to the adhesion to the first plate can be effectively added, and is added to the adhesive sheet and / or the adherend The pressure is well transmitted in the direction toward each other, the lower surface of the adherend and the first surface of the pressure-sensitive adhesive sheet may be in close contact. In addition, by adhering the lower surface of the adherend and the first surface of the adhesive sheet through air pressure, the adherend may be adhered to the adhesive sheet without damaging the adherend such as cracks and generating particles.
본 발명에 따른 점착 방법은 상기 제1 면과 대향하는 상기 점착 시트의 제2 면을 향하도록 배치되는 제2 플레이트와 상기 제1 플레이트의 간격을 조절하는 과정(S360);을 더 포함할 수 있다.The adhesive method according to the present invention may further include adjusting a distance between the second plate and the first plate disposed to face the second surface of the adhesive sheet facing the first surface (S360). .
상기 지지 프레임을 배치하는 과정(S300) 이후에 상기 제1 면과 대향하는 상기 점착 시트의 제2 면을 향하도록 배치되는 제2 플레이트와 상기 제1 플레이트의 간격을 조절할 수 있다(S360). 상기 제1 플레이트와 상기 제2 플레이트의 간격을 조절할 수 있으며, 상기 제1 플레이트와 상기 지지 프레임을 상기 제1 패킹부재에 밀착시켜 상기 제1 플레이트, 상기 지지 프레임 및 상기 제1 패킹부재에 의해 정의되는 공간을 형성할 수 있다. 상기 제1 플레이트와 상기 지지 프레임이 상기 제1 패킹부재에 밀착되는 경우, 상기 피점착물의 상면이 상기 제1 플레이트에 접촉될 수도 있고, 접촉되지 않았다가 부압이 형성된 후에 상기 피점착물의 상면이 상기 제1 플레이트에 접촉될 수도 있다. 또한, 상기 제1 플레이트와 상기 제2 플레이트의 간격 조절을 통해 상기 제2 플레이트를 상기 점착 시트의 제2 면에 접촉시켜 상기 점착 시트의 제2 면을 직접 가압할 수도 있고, 상기 제2 플레이트와 상기 지지 프레임의 간격을 좁혀 상기 점착 시트의 제2 면에 공기압을 부가할 수도 있다.After the process of arranging the support frame (S300), a distance between the second plate and the first plate disposed to face the second surface of the adhesive sheet facing the first surface may be adjusted (S360). The distance between the first plate and the second plate can be adjusted, and the first plate and the support frame are in close contact with the first packing member to be defined by the first plate, the support frame and the first packing member. It can form a space to be. When the first plate and the support frame are in close contact with the first packing member, an upper surface of the adherend may contact the first plate, and after contact with the first plate, the upper surface of the adherend may be It may be in contact with the first plate. In addition, the second plate may be brought into contact with the second surface of the adhesive sheet by adjusting the gap between the first plate and the second plate to directly press the second surface of the adhesive sheet. An air pressure may be added to the 2nd surface of the said adhesive sheet by narrowing the space | interval of the said support frame.
본 발명에 따른 점착 방법은 상기 제2 플레이트와 상기 지지 프레임의 사이에 제공되는 제2 패킹부재, 상기 제2 플레이트 및 상기 지지 프레임을 상호 밀착시키는 과정(S362);을 더 포함하고, 상기 가압하는 과정(S400)은 상기 제2 플레이트, 상기 지지 프레임 및 상기 제2 패킹부재에 의해 정의되는 공간에 정압을 형성하는 과정(S420)을 더 포함할 수 있다.The adhesive method according to the present invention further comprises a step (S362) of closely contacting the second packing member, the second plate and the support frame provided between the second plate and the support frame; Process S400 may further include forming a static pressure in a space defined by the second plate, the support frame, and the second packing member (S420).
상기 지지 프레임을 배치하는 과정(S300) 이후에 상기 제2 플레이트와 상기 지지 프레임의 사이에 제공되는 제2 패킹부재, 상기 제2 플레이트 및 상기 지지 프레임을 상호 밀착시킬 수 있다(S362). 상기 제2 플레이트와 상기 지지 프레임의 사이에 제공되는 상기 제2 패킹부재에 상기 제2 플레이트 및 상기 지지 프레임이 밀착될 수 있으며, 상기 제2 플레이트와 상기 지지 프레임 사이에 공기가 출입할 수 있는 틈이 발생하는 것을 방지할 수 있다.After the process of arranging the support frame (S300), the second packing member, the second plate, and the support frame provided between the second plate and the support frame may be in close contact with each other (S362). The second plate and the support frame may be in close contact with the second packing member provided between the second plate and the support frame, and a gap for allowing air to enter and exit between the second plate and the support frame. This can be prevented from occurring.
그리고 상기 제2 플레이트, 상기 지지 프레임 및 상기 제2 패킹부재에 의해 정의되는 공간에 정압을 형성할 수 있다(S420). 여기서, 상기 정압은 대기압보다 높은 압력일 수 있으며, 물체면에 대하여 압축하는 방향으로 작용하는 압력일 수 있다. 가스공급부를 통해 정압(또는 공기압)을 형성할 수 있으며, 상기 제2 플레이트, 상기 지지 프레임 및 상기 제2 패킹부재에 의해 정의되는 공간에 정압을 형성하여 상기 점착 시트의 제2 면을 압축하는 방향으로 압력을 부가할 수 있다.In addition, a static pressure may be formed in a space defined by the second plate, the support frame, and the second packing member (S420). Here, the positive pressure may be a pressure higher than atmospheric pressure, it may be a pressure acting in the direction to compress the object surface. A positive pressure (or air pressure) may be formed through a gas supply unit, and a positive pressure is formed in a space defined by the second plate, the support frame, and the second packing member to compress the second surface of the adhesive sheet. Pressure can be added.
이를 통해 상기 제1 플레이트, 상기 지지 프레임 및 상기 제1 패킹부재에 의해 정의되는 공간에 형성된 부압과 함께 상기 점착 시트와 상기 피점착물이 밀착될 수 있는 충분한 압력을 제공할 수 있고, 상기 점착 시트의 제2 면을 눌러주어 상기 점착 시트와 상기 피점착물의 하면 사이에 있는 공기가 잘 빠져나가도록 함으로써, 상기 점착 시트와 상기 피점착물의 하면 사이에 미세한 기포가 생기는 것을 방지할 수 있으며, 보다 효과적으로 상기 점착 시트와 상기 피점착물이 밀착되어 점착되도록 할 수 있다.This may provide a sufficient pressure to adhere the adhesive sheet and the adherend together with the negative pressure formed in the space defined by the first plate, the support frame and the first packing member, and the adhesive sheet By pressing the second side of the air so that the air between the adhesive sheet and the lower surface of the adhered well to escape well, it is possible to prevent the formation of fine bubbles between the adhesive sheet and the lower surface of the adhered, more effectively The adhesive sheet and the adhesive may be in close contact with each other.
본 발명에 따른 점착 방법은 상기 피점착물을 수용 가능한 패턴홀이 형성된 패턴 플레이트를 상기 점착 시트의 제1 면 상에 제공하는 과정(S350);을 더 포함할 수 있다.The adhesive method according to the present invention may further include a step (S350) of providing a pattern plate having a pattern hole to accommodate the adherend on the first surface of the adhesive sheet.
상기 피점착물을 가부착하는 과정(S200) 이후에 상기 피점착물을 수용 가능한 패턴홀이 형성된 패턴 플레이트를 상기 점착 시트의 제1 면 상에 제공할 수 있다(S350). 상기 패턴 플레이트는 상기 피점착물을 수용 가능한 패턴홀이 형성될 수 있으며, 상기 점착 시트의 제1 면 상에 상기 제1 플레이트와 대향하여 제공될 수 있고, 상기 제1 플레이트보다 상기 지지 프레임에 근접하여 위치할 수 있다. 여기서, 상기 패턴홀에는 상기 피점착물이 수용될 수 있으며, 상기 패턴홀의 측벽을 형성하는 상기 패턴 플레이트의 패턴 라인이 상기 피점착물의 둘레에 제공될 수 있고, 상기 피점착물이 복수개로 구성되는 경우에는 상기 패턴 플레이트의 패턴 라인이 상기 피점착물의 사이사이에 제공될 수 있다. 상기 패턴 플레이트는 상기 점착 시트에 상기 피점착물 방향으로 압력이 부가되는 경우에 상기 피점착물이 놓여지지 않은 상기 피점착물의 둘레에 상기 점착 시트가 솟아 올라오는 것을 막아줄 수 있다. 이에 따라 상기 점착 시트가 상기 피점착물의 측면을 따라 올라가 상기 피점착물의 측면에 점착되는 것을 억제 또는 방지할 수 있다.After the process of temporarily attaching the adherend (S200), a pattern plate on which the pattern hole may be accommodated may be provided on the first surface of the adhesive sheet (S350). The pattern plate may have a pattern hole to accommodate the adherend, and may be provided on the first surface of the adhesive sheet to face the first plate, and may be closer to the support frame than the first plate. Can be located. Here, the adherend may be accommodated in the pattern hole, and a pattern line of the pattern plate forming sidewalls of the pattern hole may be provided around the adherend, and the adherend may include a plurality of adherends. In this case, a pattern line of the pattern plate may be provided between the adherends. The pattern plate may prevent the adhesive sheet from rising up around the adherend on which the adherend is not placed when pressure is applied to the adhesive sheet in the direction of the adherend. Accordingly, the pressure-sensitive adhesive sheet can be prevented from being raised along the side of the adherend and adhered to the side of the adherend.
상기 피점착물은 일면에 적어도 하나의 돌출 단자를 포함하는 반도체 패키지일 수 있고, 상기 점착 시트는, 그 일면에 상기 돌출 단자가 접촉되도록 상기 반도체 패키지가 부착되는 점착층; 및 상기 점착층의 일면과 대향하는 타면 상에 제공되며, 압력에 의하여 상기 돌출 단자를 따라 소성 변형하는 변형 유지층을 포함하는 전자 부품 캐리어 시트일 수 있다. 즉, 상기 점착 방법은 반도체 패키지의 전극 보호를 위한 점착 방법일 수 있다.The adherend may be a semiconductor package including at least one protruding terminal on one surface thereof, and the adhesive sheet may include an adhesive layer to which the semiconductor package is attached to contact the protruding terminal on one surface thereof; And a strain holding layer provided on the other surface facing the one surface of the adhesive layer and plastically deformed along the protruding terminal by pressure. That is, the adhesion method may be an adhesion method for protecting the electrode of the semiconductor package.
상기 피점착물은 일면에 적어도 하나의 상기 돌출 단자를 포함하는 반도체 패키지일 수 있으며, 상기 돌출 단자는 랜드 형태의 금속 전극 또는 솔더 볼일 수 있다. 예를 들어, 상기 반도체 패키지는 하면에 다수개의 솔더 볼들이 매트릭스 형태로 배치된 볼 그리드 어레이(BGA) 반도체 패키지 혹은 랜드 형태의 금속 전극들이 매트릭스 형태로 배치된 랜드 그리드 어레이(LGA) 반도체 패키지일 수 있고, 상기 점착 시트에 점착된 이후에 상기 반도체 패키지의 측면들 및 상면에는 스퍼터링 공정 등으로 전자파를 차폐하기 위한 금속막이 형성될 수 있다.The adherend may be a semiconductor package including at least one protruding terminal on one surface thereof, and the protruding terminal may be a metal electrode or a solder ball having a land shape. For example, the semiconductor package may be a ball grid array (BGA) semiconductor package in which a plurality of solder balls are arranged in a matrix on a lower surface, or a land grid array (LGA) semiconductor package in which metal electrodes in a land form are arranged in a matrix. The metal film may be formed on the side surfaces and the upper surface of the semiconductor package after being adhered to the adhesive sheet to shield electromagnetic waves by a sputtering process.
상기 점착 시트는 전자 부품 캐리어 시트(예를 들어, 반도체 패키지 캐리어 시트)일 수 있으며, 상기 점착층 및 상기 변형 유지층을 포함할 수 있다. 상기 전자 부품 캐리어 시트는 상기 반도체 패키지를 제1 면에 견고하게 밀착 고정하는 역할을 할 수 있고, 하나의 상기 전자 부품 캐리어 시트에는 다수개의 상기 반도체 패키지들이 밀집 대형으로 배치될 수 있다. 예를 들어, 상기 반도체 패키지가 상기 전자 부품 캐리어 시트에 밀착 고정된 후에 이송 트레이(40)에 탑재되어 스퍼터링 공정이 수행될 수 있고, 상기 전자 부품 캐리어 시트에 의해 상기 반도체 패키지의 하면에는 금속막이 형성되지 않고, 상기 반도체 패키지의 측면들 및 상면에만 전자파를 차폐하기 위한 금속막이 형성될 수 있다.The adhesive sheet may be an electronic component carrier sheet (eg, a semiconductor package carrier sheet), and may include the adhesive layer and the strain holding layer. The electronic component carrier sheet may serve to tightly fix the semiconductor package to the first surface, and a plurality of the semiconductor packages may be arranged in a compact size in one electronic component carrier sheet. For example, after the semiconductor package is tightly fixed to the electronic component carrier sheet, the semiconductor package may be mounted on the transfer tray 40 to perform a sputtering process, and a metal film may be formed on the bottom surface of the semiconductor package by the electronic component carrier sheet. Instead, the metal film may be formed to shield the electromagnetic waves only on the side surfaces and the upper surface of the semiconductor package.
상기 점착층은 그 일면에 상기 돌출 단자가 접촉되도록 상기 반도체 패키지가 부착(또는 점착)될 수 있다. 예를 들어, 상기 점착층은 볼 그리드 어레이(BGA) 반도체 패키지 혹은 랜드 그리드 어레이(LGA) 반도체 패키지를 스퍼터링 공정이 완료될 때까지 밀착 및 고정하고, 스퍼터링 공정 후에는 상기 전자 부품 캐리어 시트에서 상기 반도체 패키지의 탈착이 용이하도록 상기 반도체 패키지를 점착하는 역할을 할 수 있다. 상기 점착층은 점착성을 갖는 유동성 점착 물질을 막 형태로 가공하여 형성될 수 있다. 예를 들어, 상기 점착 물질은 실리콘 계열 점착 물질을 포함할 수 있으며, 이에 한정되지 않고, 상기 점착층을 이루는 점착 물질은 실리콘 계열 점착 물질 이외에도 다양한 물질이 사용될 수 있다.The adhesive layer may be attached (or adhered) to the semiconductor package such that the protruding terminal contacts one surface thereof. For example, the adhesive layer adheres and fixes the ball grid array (BGA) semiconductor package or the land grid array (LGA) semiconductor package until the sputtering process is completed, and after the sputtering process, the semiconductor in the electronic component carrier sheet It may serve to adhere the semiconductor package to facilitate the detachment of the package. The adhesive layer may be formed by processing a flowable adhesive material having adhesiveness into a film form. For example, the adhesive material may include a silicon-based adhesive material, and the present invention is not limited thereto. The adhesive material constituting the adhesive layer may include various materials in addition to the silicone-based adhesive material.
상기 변형 유지층은 상기 반도체 패키지가 점착되는 상기 점착층의 일면과 대향하는 타면 상에 제공될 수 있고, 상기 점착층에 접합될 수 있으며, 압력(또는 외부 압력)에 의하여 상기 돌출 단자를 따라 소성 변형할 수 있다. 즉, 상기 변형 유지층은 압력에 의하여 상기 돌출 단자를 따라 형상이 변형되어 소성 변형된 후에 형상이 복원되지 않는 특징을 가질 수 있다. 여기서, 상기 변형 유지층은 상기 가압하는 과정(S400)에서 상기 점착 시트와 상기 피점착물 중 적어도 하나에 대한 가압(또는 상기 점착 시트와 상기 피점착물 중 적어도 하나를 가압하는 압력)에 의해 소성 변형될 수 있다.The strain holding layer may be provided on the other side of the adhesive layer to which the semiconductor package is adhered, and may be bonded to the adhesive layer, and may be fired along the protruding terminal by pressure (or external pressure). It can be modified. That is, the strain holding layer may have a feature that the shape is not restored after the plastic deformation after the shape is deformed along the protruding terminal by pressure. Here, the strain holding layer is fired by pressing against at least one of the adhesive sheet and the adherend (or pressure for pressing at least one of the adhesive sheet and the adherend) in the pressing step (S400). It can be modified.
상기 가압하는 과정(S400)에서는 상기 변형 유지층의 소성 변형이 가능한 항복값 이상의 압력을 상기 점착 시트와 상기 피점착물 중 적어도 하나에 부가할 수 있다. 상기 점착 시트와 상기 피점착물 중 적어도 하나에 상기 변형 유지층의 소성 변형이 가능한 항복값 미만의 압력이 부가되는 경우에는 상기 변형 유지층에 소성 변형이 가능한 항복값 이상의 압력이 가해지지 못하여 상기 변형 유지층이 소성 변형될 수 없고, 원래 형상으로 복원될 수 있다. 이러한 경우, 상기 피점착물의 하면이 상기 점착 시트에 밀착되어 점착되지 못하고 상기 점착 시트와 상기 피점착물의 하면 사이에 들뜸 현상이 발생될 수 있다.In the pressing step (S400), a pressure equal to or higher than a yield value at which plastic deformation of the strain holding layer is possible may be added to at least one of the adhesive sheet and the adherend. When a pressure less than the yield value at which plastic deformation of the strain holding layer is applied to at least one of the adhesive sheet and the adherend is not applied, the pressure at least a yield value at which plastic deformation is possible may not be applied to the strain holding layer. The holding layer cannot be plastically deformed and can be restored to its original shape. In this case, the bottom surface of the adherend may not be adhered to the pressure sensitive adhesive sheet, and thus a lifting phenomenon may occur between the pressure sensitive adhesive sheet and the bottom surface of the adherend.
따라서, 상기 변형 유지층의 소성 변형이 가능한 항복값 이상의 압력을 상기 점착 시트와 상기 피점착물 중 적어도 하나에 부가할 수 있으며, 상기 돌출 단자의 형상을 따라 상기 변형 유지층을 소성 변형시켜 상기 피점착물의 하면이 상기 점착 시트에 밀착되어 점착되도록 할 수 있고, 상기 점착 시트와 상기 피점착물의 하면 사이에 발생되는 들뜸 현상을 방지할 수 있다.Therefore, a pressure equal to or higher than a yield value at which plastic deformation of the strain retaining layer is possible may be applied to at least one of the adhesive sheet and the adherend, and the strain retaining layer may be plastically deformed along the shape of the protruding terminal, thereby The lower surface of the adhesive may be adhered to the adhesive sheet to be adhered, and the lifting phenomenon generated between the adhesive sheet and the lower surface of the adherend may be prevented.
도 14는 본 발명의 또 다른 실시예에 박막 형성장치를 나타낸 단면도이다.14 is a cross-sectional view showing a thin film forming apparatus according to still another embodiment of the present invention.
도 14를 참조하여 본 발명의 또 다른 실시예에 따른 박막 형성장치를 보다 상세히 살펴보는데, 본 발명의 일실시예에 따른 전자 부품 캐리어 시트 및 본 발명의 다른 실시예에 따른 점착 장치와 관련하여 앞서 설명된 부분과 중복되는 사항들은 생략하도록 한다.A thin film forming apparatus according to another embodiment of the present invention will be described in detail with reference to FIG. 14, which is described above with reference to an electronic component carrier sheet and an adhesive device according to another embodiment of the present invention. Duplicate parts that are described are omitted.
본 발명의 또 다른 실시예에 따른 박막 형성장치는 자성을 갖는 층이 구비된 점착 시트(100)를 포함하는 증착 대상물(D)에 박막(20)을 형성하기 위한 증착 물질(21)을 제공하는 증착물질 제공부(300); 및 상기 증착 대상물(D)을 지지하는 서셉터(400);를 포함하고, 상기 서셉터(400)는, 상기 점착 시트(100)에 대하여 인력을 제공하는 마그네트 플레이트(410); 및 상기 점착 시트(100)를 냉각시키는 냉각 유닛(420)을 포함할 수 있다.The thin film forming apparatus according to another embodiment of the present invention provides a deposition material 21 for forming the thin film 20 on the deposition target (D) including the adhesive sheet 100 having a magnetic layer is provided. Deposition material providing unit 300; And a susceptor 400 for supporting the deposition target D, wherein the susceptor 400 includes: a magnet plate 410 for providing attraction to the adhesive sheet 100; And it may include a cooling unit 420 for cooling the adhesive sheet 100.
증착물질 제공부(300)는 자성을 갖는 층이 구비된 점착 시트(100)를 포함하는 증착 대상물(D)에 박막(20)을 형성하기 위한 증착 물질(21)을 제공할 수 있다. 여기서, 점착 시트(100)는 전자 부품(10)이 점착(또는 고정)되는 전자 부품 캐리어 시트(100)일 수 있으며, 본 발명의 일실시예에 따른 전자 부품 캐리어 시트(100)일 수 있다. 증착물질 제공부(300)는 스프레이(spray) 방식, 담금(dipping) 방식, 스퍼터링(sputtering) 방식, 열증착(thermal deposition) 또는 열증발(thermal evaporation) 방식, 화학기상증착(Chemical Vapor Deposition; CVD) 방식 등의 물리적 및 화학적 모든 증착방법 중에서 선택된 적어도 하나의 방식으로 증착 대상물(D)에 박막(20)을 형성하기 위한 증착 물질(21)을 제공할 수 있다.The deposition material providing unit 300 may provide a deposition material 21 for forming the thin film 20 on the deposition target D including the adhesive sheet 100 having a magnetic layer. Here, the adhesive sheet 100 may be an electronic component carrier sheet 100 to which the electronic component 10 is attached (or fixed), and may be an electronic component carrier sheet 100 according to an embodiment of the present invention. The deposition material providing unit 300 may include a spray method, a dipping method, a sputtering method, a thermal deposition or a thermal evaporation method, a chemical vapor deposition (CVD); Physical and chemical) such as) may be provided a deposition material 21 for forming the thin film 20 on the deposition target (D) in at least one method selected from all deposition methods.
예를 들어, 증착물질 제공부(300)는 서셉터(400)의 상부에 배치되어 점착 시트(100)를 포함하는 증착 대상물(D)에 박막(20)을 형성하기 위한 증착 물질(21)을 제공할 수 있다. 여기서, 증착 대상물(D)은 점착 시트(100)뿐만 아니라 점착 시트(100)에 점착된 전자 부품(10)을 포함할 수 있고, 증착물질 제공부(300)는 전자 부품(10)의 노출된 표면 상에 증착 물질(21)을 제공하여 박막(20)을 형성할 수 있다. 그리고 증착물질 제공부(300)에 의하여 형성되는 박막(20)은 전자 부품(10)으로부터 방출되는 전자파를 차폐하기 위한 전자파(Electro Magnetic Interference; EMI) 차폐막일 수 있으며, 전자 부품(10)의 노출된 표면 상에 전자파(EMI) 차폐막을 형성하기 위하여 증착 물질(21)로 금속 물질을 제공하여 금속막을 형성할 수 있다. 이때, 증착물질 제공부(300)는 스퍼터링 방식으로 금속 물질로 이루어진 타겟으로부터 증착 물질(21)을 방출시켜 점착 시트(100) 등의 증착 대상물(D) 상에 제공할 수 있다.For example, the deposition material providing unit 300 is disposed on the susceptor 400 to provide the deposition material 21 for forming the thin film 20 on the deposition target D including the adhesive sheet 100. Can provide. Here, the deposition target D may include not only the adhesive sheet 100 but also the electronic component 10 adhered to the adhesive sheet 100, and the deposition material providing unit 300 is exposed to the electronic component 10. The deposition material 21 may be provided on the surface to form the thin film 20. In addition, the thin film 20 formed by the deposition material providing unit 300 may be an electromagnetic shield (Electro Magnetic Interference (EMI)) shielding film for shielding the electromagnetic waves emitted from the electronic component 10, the exposure of the electronic component 10 In order to form an electromagnetic shielding (EMI) shielding film on the surface, a metal material may be provided by the deposition material 21 to form a metal film. In this case, the deposition material providing unit 300 may release the deposition material 21 from the target made of a metal material by the sputtering method and provide the deposition material 21 on the deposition target D such as the adhesive sheet 100.
한편, 스프레이 방식, 스퍼터링 방식, 열증착 또는 열증발 방식, 화학기상증착(CVD) 방식 등의 경우, 증착물질 제공부(300)는 증착 물질(21)을 분사하여 증착 대상물(D) 상에 제공할 수 있고, 담금 방식의 경우, 증착물질 제공부(300)는 용기에 증착 물질(21) 용액을 제공할 수 있다. 그리고 박막(20)은 전자파(EMI) 차폐막뿐만 아니라 절연막 또는 전자 부품(10)의 표면에 선택적으로 형성(또는 코팅)하는 다양한 코팅막일 수도 있다.On the other hand, in the case of a spray method, sputtering method, thermal evaporation or thermal evaporation method, chemical vapor deposition (CVD) method, etc., the deposition material providing unit 300 is sprayed on the deposition material 21 provided on the deposition target (D) In the case of the immersion method, the deposition material providing unit 300 may provide the deposition material 21 solution to the container. The thin film 20 may be not only an EMI shielding film but also various coating films selectively formed (or coated) on the surface of the insulating film or the electronic component 10.
서셉터(400)는 척(chuck) 모듈로서 증착 대상물(D)의 증착면을 증착 물질(21)과 접촉시키기 위해 증착 대상물(D)을 지지할 수 있다. 예를 들어, 서셉터(400)는 증착물질 제공부(300)의 하부에 배치될 수 있고, 점착 시트(100) 등의 증착 대상물(D)을 안착시킬 수 있다.The susceptor 400 may support the deposition object D to contact the deposition surface 21 of the deposition object D with the deposition material 21 as a chuck module. For example, the susceptor 400 may be disposed under the deposition material providing unit 300 and may seat the deposition target D, such as the adhesive sheet 100.
여기서, 서셉터(400)는 점착 시트(100)에 대하여 인력을 제공하는 마그네트 플레이트(410)와 점착 시트(100)를 냉각시키는 냉각 유닛(420)을 포함할 수 있다. 마그네트 플레이트(410)는 전자석, 영구자석 등의 자석에 의해 발생된 자력으로 자성을 갖는 층이 구비된 점착 시트(100)에 대하여 인력을 제공할(또는 발생시킬) 수 있다. 마그네트 플레이트(410)에서 발생된 자력은 점착 시트(100)의 자성을 갖는 층(예를 들어, 자성층)에 인력을 발생시킬 수 있고, 이로 인해 점착 시트(100)는 서셉터(400)에 밀착될 수 있다.Here, the susceptor 400 may include a magnet plate 410 for providing an attractive force to the adhesive sheet 100 and a cooling unit 420 for cooling the adhesive sheet 100. The magnet plate 410 may provide (or generate) an attractive force to the adhesive sheet 100 having a magnetic layer as a magnetic force generated by a magnet such as an electromagnet or a permanent magnet. The magnetic force generated in the magnet plate 410 may generate attraction force in the magnetic layer (eg, the magnetic layer) of the adhesive sheet 100, whereby the adhesive sheet 100 closely adheres to the susceptor 400. Can be.
냉각 유닛(420)은 마그네트 플레이트(410)에서 발생되는 자력에 의한 상기 인력에 의해 마그네트 플레이트(410) 및/또는 서셉터(400)에 밀착되는 점착 시트(100) 및/또는 마그네트 플레이트(410)를 냉각시킬 수 있다. 이때, 냉각 유닛(420)은 마그네트 플레이트(410)의 외부에 마그네트 플레이트(410)와 접하여 배치(또는 설치)될 수도 있고, 마그네트 플레이트(410)의 내부에 설치(또는 배치)될 수도 있다. 냉각 유닛(420)은 스퍼터링 등의 박막 형성공정 도중 전자 부품(10)에 인가되는 열을 신속하게 냉각시킬 수 있으며, 서셉터(400)의 마그네트 플레이트(410)에 밀착된 점착 시트(100)를 통해 전자 부품(10)을 냉각시킬 수 있다.The cooling unit 420 is the adhesive sheet 100 and / or the magnet plate 410 in close contact with the magnet plate 410 and / or susceptor 400 by the attraction force due to the magnetic force generated in the magnet plate 410 Can be cooled. In this case, the cooling unit 420 may be disposed (or installed) in contact with the magnet plate 410 outside the magnet plate 410, or may be installed (or disposed) inside the magnet plate 410. The cooling unit 420 may quickly cool the heat applied to the electronic component 10 during the thin film forming process such as sputtering, and the adhesive sheet 100 adhered to the magnet plate 410 of the susceptor 400. Through this, the electronic component 10 may be cooled.
점착 시트(100)는 전자 부품 캐리어 시트(100)일 수 있으며, 증착 대상물(D)은 전자 부품 캐리어 시트(100) 상에 부착(또는 점착)되는 전자 부품(10)을 더 포함할 수 있고, 본 발명에 따른 박막 형성장치는 전자 부품(10)의 노출된 표면에(만) 박막(20)을 형성할 수 있다. 본 발명에서는 전자 부품(10)의 표면 중 박막(20) 형성을 원하지 않는 부분은 전자 부품 캐리어 시트(100)로 실링(sealing)하여 박막(20)이 형성되지 않도록 할 수 있고, 전자 부품(10)의 표면 중 박막(20) 형성을 원하는 노출된 표면에만 박막(20)을 선택적으로 형성할 수 있다.The adhesive sheet 100 may be an electronic component carrier sheet 100, and the deposition target D may further include an electronic component 10 attached to (or adhered to) the electronic component carrier sheet 100, The thin film forming apparatus according to the present invention can form the thin film 20 only on the exposed surface of the electronic component 10. In the present invention, a portion of the surface of the electronic component 10 that is not desired to form the thin film 20 may be sealed by the electronic component carrier sheet 100 so that the thin film 20 may not be formed. The thin film 20 may be selectively formed only on the exposed surface of which the thin film 20 is desired to be formed.
예를 들어, 본 발명의 박막 형성장치는 스퍼터링 장치일 수 있으며, 스퍼터링 공정이 진행되는 수용 공간을 제공하는 챔버(미도시); 상기 챔버(미도시)의 내부에 배치된 스퍼터링 캐소드(sputtering cathode); 및 상기 챔버(미도시)의 내부에 플라즈마를 생성하는 플라즈마 생성부(미도시);를 포함할 수 있다.For example, the thin film forming apparatus of the present invention may be a sputtering apparatus, and includes a chamber (not shown) for providing an accommodation space in which a sputtering process is performed; A sputtering cathode disposed inside the chamber (not shown); And a plasma generator (not shown) for generating a plasma in the chamber (not shown).
일반적으로 상기 챔버(미도시)의 내부에는 진공압이 형성됨과 동시에 스퍼터링 공정을 위한 고온 환경이 형성될 수 있다. 상기 챔버(미도시)의 하부에는 척 모듈로서 서셉터(400)가 배치될 수 있고, 서셉터(400)와 이격된 상부에는 증착물질 제공부(300)로서 상기 스퍼터링 캐소드가 배치될 수 있다. 그리고 상기 스퍼터링 캐소드와 서셉터(400)의 사이에 상기 플라즈마 생성부(미도시)로 플라즈마를 생성하여 플라즈마 영역을 형성할 수 있고, 상기 플라즈마에 의하여 발생된 이온이 상기 스퍼터링 캐소드의 타겟을 타격하여 상기 스퍼터링 캐소드의 타겟으로부터 증착 물질(21)이 이탈되도록 할 수 있다. 상기 스퍼터링 캐소드의 타겟으로부터 이탈된 증착 물질(21)은 점착 시트(100) 상에 부착(또는 장착)된 전자 부품(10)의 노출된 표면 상에 증착되어 금속막 등의 박막(20)이 형성될 수 있다.In general, a vacuum pressure is formed inside the chamber (not shown) and a high temperature environment for a sputtering process may be formed. The susceptor 400 may be disposed as a chuck module at a lower portion of the chamber (not shown), and the sputtering cathode may be disposed as a deposition material providing unit 300 at an upper portion spaced apart from the susceptor 400. The plasma generation unit may generate a plasma region between the sputtering cathode and the susceptor 400 to form a plasma region, and the ions generated by the plasma strike the target of the sputtering cathode. The deposition material 21 may be separated from the target of the sputtering cathode. The deposition material 21 separated from the target of the sputtering cathode is deposited on the exposed surface of the electronic component 10 attached (or mounted) on the adhesive sheet 100 to form a thin film 20 such as a metal film. Can be.
이때, 전자 부품(10)이 고온에 노출되는 것을 방지하기 위하여 박막 형성장치의 내부 환경의 온도를 낮추게 되면, 전자 부품(10)의 표면에 박막(20)이 형성되기 위한 에너지가 부족하게 될 수 있다. 이로 인해 스퍼터링 과정에서 출력을 증가시키게 되고, 이는 타겟의 물리적 충돌량을 증가시키게 되어 결국 약 90 내지 130 ℃의 온도를 가지는 고온의 내부 환경을 형성하게 된다.In this case, when the temperature of the internal environment of the thin film forming apparatus is lowered to prevent the electronic component 10 from being exposed to high temperature, energy for forming the thin film 20 on the surface of the electronic component 10 may be insufficient. have. This results in an increase in output during the sputtering process, which increases the amount of physical impact of the target, resulting in a high temperature internal environment having a temperature of about 90 to 130 ° C.
여기서, 스퍼터링 공정을 진행하는 도중 전자 부품(10)에 인가되는 열을 신속하게 방열하기 위하여 서셉터(400)에는 냉각 유닛(420)이 배치될 수 있고, 냉각 유닛(420)의 상면에는 자력을 발생시키는 마그네트 플레이트(410)가 배치될 수 있다. 이때, 마그네트 플레이트(410)는 탄성 및 비탄성과 무관하게 자성 물질로 자력이 발생될 수 있고, 마그네트 플레이트(410)에서 발생된 자력은 점착 시트(100)의 자성을 갖는 층에 인력을 발생시킬 수 있다. 이로 인해 점착 시트(100)는 마그네트 플레이트(410)에 밀착되어 냉각 유닛(420)에 의하여 냉각될 수 있다. 또한, 전자 부품(10)의 효과적인 냉각에 의하여 전자 부품(10)을 상온으로부터 90 ℃ 이하의 온도로 유지시키며, 박막(20)을 증착시킬 수 있다.Here, in order to quickly dissipate heat applied to the electronic component 10 during the sputtering process, the cooling unit 420 may be disposed on the susceptor 400, and magnetic force may be applied to the upper surface of the cooling unit 420. The generating magnet plate 410 may be disposed. At this time, the magnet plate 410 may be a magnetic force generated by a magnetic material irrespective of elasticity and inelasticity, and the magnetic force generated in the magnet plate 410 may generate attraction force in the magnetic layer of the adhesive sheet 100. have. As a result, the adhesive sheet 100 may be in close contact with the magnet plate 410 and cooled by the cooling unit 420. In addition, by effectively cooling the electronic component 10, the electronic component 10 may be maintained at a temperature of 90 ° C. or less from normal temperature, and the thin film 20 may be deposited.
서셉터(400)는 증착 대상물(D)이 지지되는 지지면이 탄성을 갖는 물질로 이루어질 수 있다. 이러한 경우, 점착 시트(100) 등의 증착 대상물(D)의 접촉면(예를 들어, 하부면)과 서셉터(400)의 지지면 사이에 밀착력이 향상될 수 있다. 이에 따라 증착 대상물(D)에서의 열이 서셉터(400)로 잘 전달될 수 있고, 냉각 유닛(420)을 통한 냉각 효율이 향상될 수 있다.The susceptor 400 may be made of a material having a support surface on which the deposition target D is supported. In this case, the adhesion between the contact surface (eg, bottom surface) of the deposition target D, such as the adhesive sheet 100, and the support surface of the susceptor 400 may be improved. Accordingly, heat in the deposition target D may be transferred to the susceptor 400 well, and cooling efficiency through the cooling unit 420 may be improved.
예를 들어, 서셉터(400)는 마그네트 플레이트(410)와 증착 대상물(D) 사이에 제공되는 탄성층(미도시)을 더 포함할 수 있다. 상기 탄성층(미도시)은 탄성을 갖는 물질로 형성될 수 있으며, 마그네트 플레이트(410)와 증착 대상물(D) 사이에서 밀착력을 향상시킬 수 있다. 이에 따라 증착 대상물(D)에서의 열이 서셉터(400)로 잘 전달될 수 있어 냉각 유닛(420)을 통한 냉각 효율이 향상될 수 있다. 이때, 마그네트 플레이트(410)에 의한 자력에 의하여 점착 시트(100)가 서셉터(400)에 밀착되는 경우에 상기 탄성층(미도시)의 탄성에 의하여 점착 시트(100)와 서셉터(400)의 접촉면의 면적이 보다 증가될 수 있다. 여기서, 상기 탄성층(미도시)은 실리콘, 점착제, 파이버 글래스 시트 및 그라파이트 시트 중 적어도 어느 하나로 형성될 수 있다.For example, the susceptor 400 may further include an elastic layer (not shown) provided between the magnet plate 410 and the deposition target D. The elastic layer (not shown) may be formed of a material having elasticity, and may improve adhesion between the magnet plate 410 and the deposition target D. Accordingly, heat in the deposition target D may be transferred to the susceptor 400 well, thereby improving cooling efficiency through the cooling unit 420. At this time, when the adhesive sheet 100 is in close contact with the susceptor 400 by the magnetic force by the magnet plate 410, the adhesive sheet 100 and the susceptor 400 by the elasticity of the elastic layer (not shown). The area of the contact surface of can be further increased. Herein, the elastic layer (not shown) may be formed of at least one of silicon, an adhesive, a fiber glass sheet, and a graphite sheet.
한편, 마그네트 플레이트(410)는 증착 대상물(D)을 지지하는 스테이지(411)와, 상기 스테이지의 내부에 설치되는 자석체층(412)을 포함할 수 있다. 이때, 상기 스테이지 자체가 탄성을 갖는 물질로 이루어지거나 상기 스테이지 상에 탄성을 갖는 물질로 이루어진 상기 탄성층(미도시)이 형성되어 증착 대상물(D)이 지지되는 지지면을 제공할 수 있다.On the other hand, the magnet plate 410 may include a stage 411 for supporting the deposition target (D), and a magnet body layer 412 provided inside the stage. In this case, the stage itself may be made of a material having elasticity or the elastic layer (not shown) made of a material having elasticity may be formed on the stage to provide a support surface on which the deposition target D is supported.
또한, 마그네트 플레이트(410)는 상기 자석체층 자체로 형성되어 직접 탄성을 가질 수도 있고, 마그네트 플레이트(410) 상에 탄성을 갖는 물질로 이루어진 상기 탄성층(미도시)이 형성되어 증착 대상물(D)이 지지되는 지지면을 제공할 수도 있다.In addition, the magnet plate 410 may be formed by the magnet body layer itself and may have direct elasticity, and the elastic layer (not shown) made of a material having elasticity is formed on the magnet plate 410 to deposit the object (D). It is also possible to provide this supported support surface.
이를 통해 서셉터(400)의 증착 대상물(D)이 지지되는 지지면이 탄성을 갖는 물질로 이루어질 수 있다.Through this, the support surface on which the deposition target D of the susceptor 400 is supported may be made of a material having elasticity.
도 15는 본 발명의 또 다른 실시예에 따른 박막 형성장치를 개략적으로 나타내는 도면이다.15 is a schematic view of a thin film forming apparatus according to another embodiment of the present invention.
도 15를 참조하면, 마그네트 플레이트(410)는 증착 대상물(D)을 지지하는 스테이지(411); 및 스테이지(411)에 설치되고, 스테이지(411)를 따라 배열되는 복수 개의 단위 자석(41)을 포함하는 자석체층(412)을 포함할 수 있으며, 냉각 유닛(420)은 스테이지(411)의 내부에 형성되어, 증착 대상물(D)을 냉각시키기 위한 냉매의 유동 경로를 제공하는 냉각 유로(421)를 포함할 수 있다.Referring to FIG. 15, the magnet plate 410 may include a stage 411 for supporting the deposition target D; And a magnet body layer 412 installed on the stage 411 and including a plurality of unit magnets 41 arranged along the stage 411, wherein the cooling unit 420 is formed inside the stage 411. Is formed in, may include a cooling passage 421 for providing a flow path of the refrigerant for cooling the deposition object (D).
먼저, 점착 시트(100)는 자성을 갖는 층을 구비할 수 있고, 적어도 하나의 자성층을 가지며, 상기 점착 시트(100)의 상면에는 전자 부품(10)이 부착된다. 여기서, 점착 시트(100)는 전자 부품(10)이 상면에 부착되는 점착층(110); 및 상기 점착층(110)과 자성층(130)의 사이에 제공되고, 외부 압력(예를 들어, 전자 부품이 부착되는 압력)에 의하여 소성 변형하는 변형 유지층(120);을 더 포함할 수 있다.First, the adhesive sheet 100 may include a magnetic layer, have at least one magnetic layer, and the electronic component 10 may be attached to an upper surface of the adhesive sheet 100. Here, the adhesive sheet 100 includes an adhesive layer 110 to which the electronic component 10 is attached to the upper surface; And a strain holding layer 120 provided between the adhesive layer 110 and the magnetic layer 130 and plastically deforming by an external pressure (for example, a pressure to which the electronic component is attached). .
점착층(110)은, 점착성을 가지는 유동성 점착 물질을 막의 형태로 가공하여 형성된다. 이와 같은 점착층(110)은 실리콘 계열의 물질을 사용할 수 있으며, 점착층(110)은 예를 들어 하면에 랜드(land) 형태의 금속 전극을 구비한 LGA(Land Grid Array) 반도체 패키지 또는 하면에 솔더 볼(solder ball)을 구비한 BGA(Ball Grid Array) 반도체 패키지 등의 전자 부품(10)을 증착 공정이 완료될 때까지 부착시키고, 증착 공정이 완료된 전자 부품(10)은 점착층(110)으로부터 용이하게 분리될 수 있다.The adhesive layer 110 is formed by processing a tacky adhesive material in the form of a film. The adhesive layer 110 may be formed of a silicon-based material, and the adhesive layer 110 may be formed on, for example, a LGA (Land Grid Array) semiconductor package having a land-shaped metal electrode on a lower surface thereof. The electronic component 10, such as a ball grid array (BGA) semiconductor package having solder balls, is attached until the deposition process is completed, and the electronic component 10 having the deposition process is completed is an adhesive layer 110. It can be easily separated from.
변형 유지층(120)은 점착층(110)의 하부에 제공되어, 외부 압력에 의하여 소성 변형되며, 예를 들어 반도체 패키지(11)로부터 돌출되는 단자(11a)를 따라 소성 변형된다. 즉, 변형 유지층(120)은 외부 압력에 의하여 그 형상이 변형된 후, 변형된 형상이 복원되지 않는 특징을 가진다. 이와 같은 변형 유지층(120)은 전연성, 즉 전성 및 연성을 가지는 금속 물질로 형성될 수 있으며, 가공성이 우수한 알루미늄, 알루미늄 합금, 구리 및 구리 합금 등으로 형성될 수 있다.The strain holding layer 120 is provided under the adhesive layer 110, and is plastically deformed by external pressure, for example, plastically deformed along the terminal 11a protruding from the semiconductor package 11. That is, after the shape of the strain holding layer 120 is deformed by external pressure, the deformed shape may not be restored. The strain holding layer 120 may be formed of a metal material having malleability, that is, malleability and ductility, and may be formed of aluminum, an aluminum alloy, copper, and a copper alloy having excellent workability.
변형 유지층(120)은, 예를 들어 LGA 반도체 패키지의 금속 전극 또는 BGA 반도체 패키지의 솔더 볼이 점착층(110)에 부착되는 과정에서 금속 전극 또는 솔더 볼에 의하여 가압되어 그 형상이 변형되고, 이와 같이 형상이 변형된 변형 유지층(120)은 LGA 반도체 패키지의 금속 전극 또는 BGA 반도체 패키지의 솔더 볼을 내부에 유지하여 고정함으로써 점착층(110)과 반도체 패키지(11)의 하면 사이에 들뜸(gap) 현상이 발생되는 것을 방지한다.For example, in the process of attaching the solder ball of the metal electrode of the LGA semiconductor package or the BGA semiconductor package to the adhesive layer 110, the strain holding layer 120 is pressed by the metal electrode or the solder ball to deform the shape thereof, The deformation retaining layer 120 having the shape deformed in this way is lifted between the adhesive layer 110 and the lower surface of the semiconductor package 11 by holding and fixing the solder ball of the metal electrode of the LGA semiconductor package or the BGA semiconductor package therein ( gap) prevents the occurrence of the phenomenon.
또한, 전술한 바와 같이 변형 유지층(120)은 열 전도율이 높은 금속 물질로 형성되는 바, 반도체 패키지(11)로부터 전달되는 열은 변형 유지층(120)에 의하여 흡수되어 후술하는 서셉터(400)로 전달되게 된다. 즉, 변형 유지층(120)은 점착층(110)과 반도체 패키지(11)의 하면 사이에 들뜸 현상을 방지하고, 높은 열 전도율을 가지게 되어 반도체 패키지(11)로부터 발생하는 열이 점착층(110)을 거쳐 자성층(130) 및 서셉터(400)까지 효과적으로 전달될 수 있도록 한다. 따라서, 본 발명의 실시 예에 따른 박막 형성장치는 스퍼터링 공정과 같은 증착 공정 도중 고온의 환경에 노출되는 반도체 패키지(11)를 신속하게 냉각시킬 수 있게 되고, 이에 따라 반도체 패키지(11) 내에 배치되는 반도체 칩이 고온의 열에 의하여 손상되는 것을 방지하고, 반도체 패키지(11)가 휘어짐을 방지할 수 있다.In addition, as described above, since the strain holding layer 120 is formed of a metal material having high thermal conductivity, heat transferred from the semiconductor package 11 is absorbed by the strain holding layer 120 to be described later. Will be delivered. That is, the strain holding layer 120 prevents the lifting phenomenon between the adhesive layer 110 and the lower surface of the semiconductor package 11 and has a high thermal conductivity, so that heat generated from the semiconductor package 11 is adhered to the adhesive layer 110. Through) to be effectively transmitted to the magnetic layer 130 and the susceptor 400. Accordingly, the thin film forming apparatus according to the embodiment of the present invention can quickly cool the semiconductor package 11 exposed to a high temperature environment during a deposition process such as a sputtering process, and thus is disposed in the semiconductor package 11. The semiconductor chip can be prevented from being damaged by high temperature heat, and the semiconductor package 11 can be prevented from bending.
상기 변형 유지층(120)의 하부에는 자성층(130)이 제공되며, 이의 지지를 위하여 상기 자성층(130)의 하부에 배치되는 베이스 필름(140)을 더 포함할 수 있다. 이때, 베이스 필름(140)은 자성층(130) 등을 지지하는 지지층일 수 있다. 여기서, 자성은 전자석, 영구자석 등의 자석에 부착되는 성질을 의미하며, 자성층(130)은 자성을 가지는 자성체 분말과 바인더를 혼합하여 제조할 수 있으며, 점착층(110), 변형 유지층(120) 또는 베이스 필름(140)을 자성층(130)으로 형성하기 위하여 각 층에 자성체 분말을 함유시키거나, 각 층을 자성 물질로 형성할 수 있다.The magnetic layer 130 is provided below the strain maintaining layer 120, and may further include a base film 140 disposed below the magnetic layer 130 to support the magnetic layer 130. In this case, the base film 140 may be a support layer supporting the magnetic layer 130 or the like. Here, the magnetic means a property that is attached to a magnet, such as an electromagnet, a permanent magnet, the magnetic layer 130 may be prepared by mixing a magnetic powder having a magnetic powder and a binder, the adhesive layer 110, the strain holding layer 120 In order to form the base film 140 as the magnetic layer 130, the magnetic powder may be contained in each layer, or each layer may be formed of a magnetic material.
여기서, 점착층(110), 변형 유지층(120) 및 베이스 필름(140) 중 적어도 하나의 층은 각각 자성을 가지는 층으로 형성될 수 있으며, 이 경우 해당 층이 본 발명의 실시 예에 따른 자성층으로의 역할을 수행하며, 상기 변형 유지층(120)과 베이스 필름(140) 사이에 배치되는 자성층은 생략 가능하다. 이하에서는, 변형 유지층(120)과 베이스 필름(140) 사이에 자성층이 배치되는 구조를 예로 들어 설명하기로 한다.Here, at least one layer of the adhesive layer 110, the strain holding layer 120, and the base film 140 may be formed as a layer having magnetic properties, in which case the magnetic layer according to an embodiment of the present invention. The magnetic layer disposed between the strain holding layer 120 and the base film 140 may be omitted. Hereinafter, a structure in which a magnetic layer is disposed between the strain holding layer 120 and the base film 140 will be described as an example.
본 발명의 실시 예에 따르면, 점착 시트(100)가 자성을 가지는 적어도 하나의 층을 가지도록 형성함으로써, 후술하는 스테이지(411)에 설치되는 자석체층(412)으로부터 제공되는 자력에 의하여 상기 점착 시트(100)를 서셉터(400)와 견고하게 밀착시킬 수 있다. 즉, 자석체층(412)으로부터 제공되는 자력에 의하여 점착 시트(100)가 서셉터(400) 상에 안착되는 경우 점착 시트(100)와 서셉터(400) 사이의 유효 접촉 면적은 증가하게 되고, 이에 의하여 반도체 패키지(11)로부터 점착 시트(100)를 통해 전달되는 열을 서셉터(400)로 효과적으로 전달하여 냉각시킬 수 있게 된다.According to the exemplary embodiment of the present invention, the adhesive sheet 100 is formed to have at least one layer having magnetic properties, and thus, the adhesive sheet is formed by a magnetic force provided from the magnet body layer 412 provided on the stage 411 described later. 100 may be tightly adhered to the susceptor 400. That is, when the adhesive sheet 100 is seated on the susceptor 400 by the magnetic force provided from the magnet body layer 412, the effective contact area between the adhesive sheet 100 and the susceptor 400 is increased, As a result, the heat transferred from the semiconductor package 11 through the adhesive sheet 100 may be effectively transferred to the susceptor 400 to be cooled.
증착물질 제공부(300)는 증착 물질을 분사하는 증착 물질 공급부와 같이 서셉터(400)의 상부에 배치되어 점착 시트(100)를 포함하는 증착 대상물(D)에 박막(20)을 형성하기 위한 증착 물질(21)을 제공한다. 여기서, 증착 대상물(D)은 점착 시트(100)뿐만 아니라 점착 시트(100)에 고정되는 반도체 패키지(11)를 포함하며, 증착물질 제공부(300)는 반도체 패키지(11)가 고정된 점착 시트(100) 상에 증착 물질을 제공하여 반도체 패키지(11)에 전자파를 차폐하기 위한 전자파 차폐막을 형성할 수 있다. 따라서, 증착물질 제공부(300)에 의하여 형성되는 박막은 반도체 패키지(11)로부터 방출되는 전자파를 차폐하기 위한 전자파 차폐막일 수 있으며, 반도체 패키지(11)에 스퍼터링 방식으로 전자파 차폐막을 형성하기 위하여 증착물질 제공부(300)는 전자파를 차폐하기 위한 금속 물질로 이루어지는 타겟으로부터 증착 물질을 방출시켜 점착 시트(100) 상에 제공할 수 있다. The deposition material providing unit 300 is disposed on the susceptor 400, such as a deposition material supply unit spraying the deposition material, to form the thin film 20 on the deposition target D including the adhesive sheet 100. Provided is a deposition material 21. Here, the deposition target D includes not only the adhesive sheet 100 but also the semiconductor package 11 fixed to the adhesive sheet 100, and the deposition material providing unit 300 includes the adhesive sheet to which the semiconductor package 11 is fixed. The deposition material may be provided on the 100 to form an electromagnetic shielding film for shielding electromagnetic waves in the semiconductor package 11. Accordingly, the thin film formed by the deposition material providing unit 300 may be an electromagnetic shielding film for shielding the electromagnetic waves emitted from the semiconductor package 11, and deposited to form the electromagnetic shielding film on the semiconductor package 11 by sputtering. The material provider 300 may release the deposition material from the target made of a metal material for shielding electromagnetic waves, and provide the material on the adhesive sheet 100.
서셉터(400)는 증착물질 제공부(300)의 하부에 배치되어 증착 대상물에 포함되는 점착 시트(100)를 안착시키기 위한 구성이다. 여기서, 서셉터(400)는 증착 대상물을 지지하는 스테이지(411); 상기 스테이지(411)의 내부에 형성되어, 증착 대상물을 냉각시키기 위한 냉매의 유동 경로를 제공하는 냉각 유로(421); 및 상기 스테이지(411)에 설치되고, 상기 스테이지(411)를 따라 배열되는 복수 개의 단위 자석(41)을 포함하는 자석체층(412);을 포함한다.The susceptor 400 is disposed below the deposition material providing unit 300 to mount the adhesive sheet 100 included in the deposition object. Here, the susceptor 400 includes a stage 411 for supporting the deposition object; A cooling passage 421 formed in the stage 411 to provide a flow path of a refrigerant for cooling the deposition object; And a magnet body layer 412 installed on the stage 411 and including a plurality of unit magnets 41 arranged along the stage 411.
이하에서, 본 발명의 각 실시예에 따른 스테이지(411), 냉각 유로(421) 및 자석체층(412)의 구조에 관하여 상세하게 설명하기로 한다.Hereinafter, the structure of the stage 411, the cooling passage 421, and the magnet body layer 412 according to each embodiment of the present invention will be described in detail.
도 16은 본 발명의 제1 실시 예에 따른 서셉터(400)의 모습을 나타내는 도면이다. 또한, 도 17은 본 발명의 제1 실시 예에 따른 냉각 유로(421)가 형성되는 모습을 나타내는 도면이고, 도 18은 본 발명의 제1 실시 예에 따른 자석체층(412)의 모습을 나타내는 도면이다.16 is a diagram illustrating a susceptor 400 according to a first embodiment of the present invention. FIG. 17 is a view showing a state in which a cooling passage 421 is formed according to the first embodiment of the present invention, and FIG. 18 is a view showing a state of the magnet body layer 412 according to the first embodiment of the present invention. to be.
도 16 내지 도 18을 참조하면, 본 발명의 제1 실시 예에 따른 박막 형성장치는 증착물질 제공부(300) 및 서셉터(400)를 포함하되, 상기 서셉터(400)는, 증착 대상물(D)을 지지하는 스테이지(411); 상기 스테이지(411)의 내부에 형성되어, 증착 대상물(D)을 냉각시키기 위한 냉매의 유동 경로를 제공하는 냉각 유로(421); 및 상기 스테이지(411)에 설치되고, 상기 스테이지(411)를 따라 배열되는 복수 개의 단위 자석(41)을 포함하는 자석체층(412);을 포함한다. 또한, 서셉터(400)는 스테이지(411) 상에 제공되고, 탄성을 가지는 물질로 형성되는 제1 열전 시트(430);를 포함하고, 본 발명의 제1 실시 예에 따른 박막 형성장치에서 자석체층(412)은 상기 제1 열전 시트(430)와 스테이지(411) 사이에 설치되고, 서셉터(400)는 자석체층(412)과 스테이지(411) 사이에 제공되어 탄성을 가지는 물질로 형성되는 제2 열전 시트(440)를 더 포함한다.16 to 18, the thin film forming apparatus according to the first embodiment of the present invention includes a deposition material providing unit 300 and a susceptor 400, wherein the susceptor 400 is a deposition target ( A stage 411 for supporting D); A cooling passage 421 formed in the stage 411 to provide a flow path of a refrigerant for cooling the deposition object D; And a magnet body layer 412 installed on the stage 411 and including a plurality of unit magnets 41 arranged along the stage 411. In addition, the susceptor 400 includes a first thermoelectric sheet 430 provided on the stage 411 and formed of an elastic material, and includes a magnet in the thin film forming apparatus according to the first embodiment of the present invention. The body layer 412 is provided between the first thermoelectric sheet 430 and the stage 411, and the susceptor 400 is provided between the magnet body layer 412 and the stage 411 to be formed of an elastic material. The second thermoelectric sheet 440 is further included.
먼저, 스테이지(411)는 점착 시트(100)를 포함하는 증착 대상물을 지지하기 위한 것으로, 원형 또는 다각형 플레이트의 형상을 가질 수 있다. 스테이지(411)는 점착 시트(100)의 면적보다 큰 면적을 가지며, 스테이지(411)를 구동시키기 위한 구동부와 구동 축에 의하여 연결된다. 또한, 도 15에서는 구동부의 상부에 하나의 스테이지(411)가 설치되는 모습을 도시하였으나, 스테이지(411)는 구동부의 상부에 복수 개로 설치될 수도 있음은 물론이다. 이 경우 스테이지(411)는 점착 시트(100)에 부착된 지지 프레임(210)을 지지하는 이송 트레이(40)에 대응하도록 각각 배치될 수 있다.First, the stage 411 is to support a deposition object including the adhesive sheet 100, and may have a circular or polygonal plate shape. The stage 411 has an area larger than that of the adhesive sheet 100, and is connected by a drive unit and a drive shaft for driving the stage 411. In addition, although FIG. 15 illustrates a state in which one stage 411 is installed above the driving unit, a plurality of stages 411 may be installed above the driving unit. In this case, the stage 411 may be disposed to correspond to the transfer tray 40 supporting the support frame 210 attached to the adhesive sheet 100.
도면에서는 스테이지(411)의 상면이 평탄면을 가지는 구성만이 도시되었으나, 스테이지(411)의 상면은 상부로 돌출되는 볼록면, 하부로 함입되는 오목면 및 볼록면과 오목면이 교차되어 형성되는 굴곡면 중 어느 하나로 형성될 수 있다.In the drawings, only the configuration in which the upper surface of the stage 411 has a flat surface is illustrated, but the upper surface of the stage 411 is formed by convex surfaces projecting upward, concave surfaces recessed below, and convex surfaces and concave surfaces intersected. It may be formed of any one of the curved surfaces.
여기서, 스테이지(411)의 상면이 볼록면, 오목면 또는 굴곡면으로 형성되는 것은 점착 시트(100) 상에 부착되는 반도체 패키지(11)를 보호하기 위한 것이다. 즉, 스테이지(411)의 상면이 평탄면을 가지는 경우 점착 시트(100)가 후술하는 자석체층(412)으로부터 제공되는 자력에 의해 밀착된 상태에서 분리되는 경우, 반도체 패키지(11)는 점착 시트(100)의 탄성에 의해 튕겨지며 결과적으로 원치 않는 위치로 이동되거나 손상될 수 있다. 또한, 점착 시트(100)는 점착 시트(100) 상에 부착된 반도체 패키지(11)의 무게로 인하여 처지거나 늘어질 수 있다. 이로 인하여 점착 시트(100)와 하부의 스테이지(411) 간의 밀착이 이완될 수 있으며 이에 따라 방열 효과가 저하될 수 있다.Here, the upper surface of the stage 411 is formed as a convex surface, a concave surface or a curved surface to protect the semiconductor package 11 attached on the adhesive sheet 100. That is, when the upper surface of the stage 411 has a flat surface, when the adhesive sheet 100 is separated in a close contact state by the magnetic force provided from the magnet body layer 412 described later, the semiconductor package 11 is the adhesive sheet ( It is bounced off by the elasticity of 100 and can be moved or damaged to an unwanted position as a result. In addition, the adhesive sheet 100 may sag or sag due to the weight of the semiconductor package 11 attached on the adhesive sheet 100. As a result, adhesion between the adhesive sheet 100 and the lower stage 411 may be relaxed, and thus the heat dissipation effect may be reduced.
이에, 본 발명의 실시 예에 따른 박막 형성장치에서는 스테이지(411)의 상면을 볼록면, 오목면 또는 굴곡면으로 형성하여 점착 시트(100)의 분리시 스테이지(411)의 가장자리부로부터 중심부로 단계적으로 분리시킬 수 있게 되고, 이에 따라 점착 시트(100)는 튕겨짐 없이 스테이지(411)으로부터 분리될 수 있게 된다. 또한, 스테이지(411)의 상면을 볼록면, 오목면 또는 굴곡면으로 형성함으로써 스테이지(411)의 상면은 확장된 표면적을 가지게 되고, 반도체 패키지(11)의 무게로 인하여 처지거나 늘어진 점착 시트(100)와 긴밀한 밀착 상태를 유지할 수 있게 된다.Therefore, in the thin film forming apparatus according to the embodiment of the present invention, the upper surface of the stage 411 is formed as a convex surface, a concave surface or a curved surface, and is stepwise from the edge portion of the stage 411 to the center when the adhesive sheet 100 is separated. It is possible to separate, so that the adhesive sheet 100 can be separated from the stage 411 without being bounced. In addition, by forming the upper surface of the stage 411 into a convex surface, a concave surface or a curved surface, the upper surface of the stage 411 has an extended surface area, and the adhesive sheet 100 sagging or sagging due to the weight of the semiconductor package 11. ) Can be kept in close contact with.
스테이지(411)는 구동 축(50) 상에 설치된다. 구동 축(50)은 구동부(미도시)에 연결되어 회전할 수 있으며, 구동 축(50)의 상부에는 스테이지(411)가 결합되어 구동 축(50)의 회전에 의하여 스테이지(411)도 연동하여 회전할 수 있다. 또한, 구동 축(50)에는 냉매 공급 배관(61) 및 냉매 배출 배관(62)이 형성되어 스테이지(411)에 형성되는 냉각 유로(421)로 냉매를 공급하거나, 냉각 유로(421)를 따라 순환된 냉매를 배출할 수 있다. 물론 냉매 공급 배관(61) 및 냉매 배출 배관(62)의 설치 위치는 이에 한정되는 것이 아니며, 각 배관들에는 유량을 조절하기 위한 밸브나 유량 조절기 등이 설치될 수 있으나, 이에 대한 구체적인 설명은 생략하기로 한다.The stage 411 is installed on the drive shaft 50. The driving shaft 50 may be connected to the driving unit (not shown) to rotate, and the stage 411 may be coupled to the upper portion of the driving shaft 50 to interlock the stage 411 by the rotation of the driving shaft 50. Can rotate In addition, a coolant supply pipe 61 and a coolant discharge pipe 62 are formed in the drive shaft 50 to supply the coolant to the cooling channel 421 formed in the stage 411, or circulate along the cooling channel 421. The refrigerant can be discharged. Of course, the installation positions of the refrigerant supply pipe 61 and the refrigerant discharge pipe 62 are not limited thereto, and valves or flow regulators for adjusting the flow rate may be installed in the respective pipes, but detailed descriptions thereof will be omitted. Let's do it.
서셉터(400)는 스테이지(411) 상에 제공되는 제1 열전 시트(430);를 더 포함하고, 제1 열전 시트(430)는 탄성을 가지는 물질로 형성될 수 있다. 여기서, 제1 열전 시트(430)는 점착 시트(100)를 포함하는 증착 대상물이 안착되기 위한 안착 면을 제공한다.The susceptor 400 may further include a first thermoelectric sheet 430 provided on the stage 411, and the first thermoelectric sheet 430 may be formed of an elastic material. Here, the first thermoelectric sheet 430 provides a seating surface on which the deposition target including the adhesive sheet 100 is mounted.
제1 열전 시트(430)는 스테이지(411) 상에 제공되어 제1 열전 시트(430) 상에 안착되는 증착 대상물과 스테이지(411) 사이에서 밀착력을 향상시키고, 냉각 효율을 강화하는 역할을 한다. 여기서, 제1 열전 시트(430)는 탄성을 가지는 물질로 형성될 수 있다. 즉, 자석체층(412)에 의하여 제공되는 자력에 의하여 점착 시트(100)가 서셉터(400)에 밀착되는 경우, 제1 열전 시트(430)의 탄성에 의하여 점착 시트(100)와 서셉터(400)의 접촉면의 면적은 보다 증가될 수 있게 된다. 여기서, 제1 열전 시트(430)는 실리콘, 점착제, 파이버 글래스 시트 및 그라파이트 시트 중 하나로 형성될 수 있다.The first thermoelectric sheet 430 may be provided on the stage 411 to improve adhesion between the deposition object seated on the first thermoelectric sheet 430 and the stage 411 and to enhance cooling efficiency. Here, the first thermoelectric sheet 430 may be formed of a material having elasticity. That is, when the adhesive sheet 100 is in close contact with the susceptor 400 by the magnetic force provided by the magnet body layer 412, the adhesive sheet 100 and the susceptor may be formed by elasticity of the first thermoelectric sheet 430. The area of the contact surface of 400 can be further increased. Here, the first thermoelectric sheet 430 may be formed of one of silicon, an adhesive, a fiber glass sheet, and a graphite sheet.
냉각 유로(421)는 스테이지(411)의 내부에 형성되어, 증착 대상물을 냉각시키기 위한 냉매의 유동 경로를 제공한다. 즉, 스테이지(411)의 내부에는 냉매를 순환시키기 위한 냉각 유로(421)가 형성될 수 있다. 스테이지(411)는 냉각 유로(421)를 따라 순환하는 냉매에 의하여 서셉터(400) 상에 안착되는 점착 시트(100)에 부착된 반도체 패키지(11)를 냉각시키게 된다. 여기서, 냉매는 냉각수 또는 냉각 기체를 포함할 수 있으며, 냉각수로는 물을 사용하고, 냉각 기체로는 질소, 수소, 아르곤 등을 사용할 수 있다.The cooling passage 421 is formed inside the stage 411 to provide a flow path of the refrigerant for cooling the deposition object. That is, the cooling channel 421 for circulating the refrigerant may be formed in the stage 411. The stage 411 cools the semiconductor package 11 attached to the adhesive sheet 100 seated on the susceptor 400 by the refrigerant circulating along the cooling passage 421. Here, the refrigerant may include a cooling water or a cooling gas, water may be used as the cooling water, and nitrogen, hydrogen, argon, or the like may be used as the cooling gas.
냉각 유로(421)는 스테이지(411)를 따라 형성되며, 스테이지(411)의 하부로부터 소정의 높이로 홈을 형성하고, 형성된 홈의 하단을 냉각 유로 커버(424)로 차폐하여 형성될 수 있다. 이와 같은 냉각 유로 커버(424)에는 냉각 유로(421)를 따라 흐르는 냉매의 누설을 방지하기 위한 다양한 밀폐 구조가 적용될 수 있음은 물론이다.The cooling channel 421 may be formed along the stage 411, and may be formed by forming a groove from a lower portion of the stage 411 to a predetermined height and shielding a lower end of the formed groove with the cooling channel cover 424. Various cooling structures for preventing leakage of the refrigerant flowing along the cooling channel 421 may be applied to the cooling channel cover 424.
도 17에서는 스테이지(411)의 중심부에 형성되는 냉매 유입구(422)를 통하여 냉매가 공급되고, 공급된 냉매가 나선형으로 유동하여 상기 냉매 유입구(422)에 인접한 냉매 배출구(423)로 배출되는 구조가 도시되었으나, 냉매 유입구(422) 및 냉매 배출구(423)의 위치 및 이에 따른 냉각 유로(421)의 형상은 이에 제한되는 것이 아니다.In FIG. 17, a coolant is supplied through a coolant inlet 422 formed at the center of the stage 411, and the supplied coolant flows helically to be discharged to the coolant outlet 423 adjacent to the coolant inlet 422. Although illustrated, the positions of the coolant inlet 422 and the coolant outlet 423 and the shape of the cooling channel 421 are not limited thereto.
자석체층(412)은 스테이지(411)에 설치되고, 스테이지(411)를 따라 배열되는 복수 개의 단위 자석(41)을 포함한다. 여기서, 자석체층(412)은 반도체 패키지(11)가 고정된 점착 시트(100)에 서셉터(400)를 향하는 방향으로 자력을 제공한다. 즉, 전술한 바와 같이 점착 시트(100)는 적어도 하나의 자성층을 가진다. 따라서, 자석체층(412)은 점착 시트(100), 보다 상세하게는 점착 시트(100)에 포함된 자성층에 자력을 제공하여 점착 시트(100)가 서셉터(400) 상에 안착되는 경우 상기 점착 시트(100)를 서셉터(400)와 견고하게 밀착시킬 수 있다. 이와 같이, 자석체층(412)에 의하여 제공되는 자력에 의하여 점착 시트(100)와 서셉터(400)는 견고하게 밀착되게 되고, 반도체 패키지(11)로부터 점착 시트(100)를 통해 전달되는 열을 스테이지(411)의 냉각 유로(421)를 따라 순환하는 냉매에 의하여 빠른 속도로 냉각시킬 수 있게 된다.The magnet body layer 412 is provided on the stage 411 and includes a plurality of unit magnets 41 arranged along the stage 411. Here, the magnet body layer 412 provides magnetic force in the direction toward the susceptor 400 to the adhesive sheet 100 to which the semiconductor package 11 is fixed. That is, as described above, the adhesive sheet 100 has at least one magnetic layer. Accordingly, the magnet body layer 412 provides magnetic force to the magnetic layer included in the adhesive sheet 100, more specifically, the adhesive sheet 100, and thus the adhesive sheet 100 is mounted on the susceptor 400. The sheet 100 may be in close contact with the susceptor 400. As such, the adhesive sheet 100 and the susceptor 400 are firmly adhered to each other by the magnetic force provided by the magnet body layer 412, and the heat transmitted from the semiconductor package 11 through the adhesive sheet 100 is absorbed. The refrigerant circulated along the cooling channel 421 of the stage 411 can be cooled at a high speed.
자석체층(412)은 복수 개의 단위 자석(41)이 동일한 극성으로 배열되도록 형성될 수도 있으나, 스테이지(411)를 따라 극성이 교차하도록 배열되는 복수 개의 단위 자석(41)을 포함할 수 있다. 자석체층(412)이 동일한 극성으로 배열된 복수 개의 단위 자석(41)을 포함하는 경우 자력은 향상시킬 수 있지만, N극으로부터 방출되어 S극으로 유입되는 자력선은 그 형성 경로를 최소화시킬 수 있는 자석체층(412)의 가장자리부에 집중되게 되어, 점착 시트(100)에 균일한 자력을 제공할 수 없게 된다. 그러나, 자석체층(412)이 스테이지(411)를 따라 인접한 단위 자석(41) 간의 극성이 서로 교차하도록 배열되는 복수 개의 단위 자석(41)을 포함하는 경우, 자력선은 스테이지(411)를 따라 교차 배열되는 N극과 S극 사이에 균일하게 분포하게 되어 점착 시트(100)에 균일한 자력을 제공할 수 있다. 여기서, 단위 자석(41)이 스테이지(411)를 따라 극성이 교차하도록 배열되는 것은 도 18에 도시된 바와 같이 어느 하나의 단위 자석(41)의 상하좌우에 극성이 다른 단위 자석(41)이 배치되도록 복수 개의 단위 자석(41)을 배열하는 것을 의미하며, 본 발명의 제1 실시 예와 관련하여 도 18에는 복수 개의 단위 자석(41)이 밀착 배치되는 모습을 도시하였으나, 소정 간격으로 이격 배열되거나 이격 배열된 복수 개의 단위 자석(41) 사이에 별도의 부재를 삽입할 수도 있음은 물론이다. 또한, 단위 자석(41)으로는 전자석, 영구자석 또는 고무자석 등을 사용할 수 있다.The magnet body layer 412 may be formed such that the plurality of unit magnets 41 are arranged in the same polarity, but may include a plurality of unit magnets 41 arranged to cross the polarities along the stage 411. When the magnet body layer 412 includes a plurality of unit magnets 41 arranged in the same polarity, the magnetic force can be improved, but the magnetic force lines emitted from the N pole and introduced into the S pole can minimize the formation path thereof. It is concentrated on the edge of the body layer 412, it is impossible to provide a uniform magnetic force to the adhesive sheet 100. However, when the magnet body layer 412 includes a plurality of unit magnets 41 arranged such that polarities between adjacent unit magnets 41 cross each other along the stage 411, the lines of magnetic force cross-align along the stage 411. Evenly distributed between the N pole and the S pole can be provided to provide a uniform magnetic force to the adhesive sheet (100). Here, the unit magnets 41 are arranged such that the polarities intersect along the stage 411. The unit magnets 41 having different polarities are disposed on the top, bottom, left, and right sides of any one of the unit magnets 41. It means that the plurality of unit magnets 41 to be arranged so as to, and in relation to the first embodiment of the present invention shown in Figure 18 is a plurality of unit magnets 41 are arranged in close contact, spaced at a predetermined interval or Of course, a separate member may be inserted between the plurality of unit magnets 41 spaced apart from each other. As the unit magnet 41, an electromagnet, a permanent magnet or a rubber magnet can be used.
여기서, 점착 시트(100)를 서셉터(400) 상에 효과적으로 밀착시키기 위하여는 1000 내지 2000 가우스(G)의 자력이 요구된다. 즉, 자석체층(412)으로부터 1000 가우스(G) 미만의 자력이 제공되면, 점착 시트(100)가 자력에 의하여 서셉처 상에서 충분하게 밀착되기 어려우며, 자석체층(412)으로부터 2000 가우스(G)를 초과하는 자력이 제공되는 경우 이와 같은 자력을 제공하기 위하여 자석체층(412)의 크기, 예를 들어 두께 또한 증가하여야 하는바, 상대적으로 낮은 열 전도율을 가지는 자석체층(412)의 특성상 증착 대상물로부터 발생되는 열을 스테이지(411)에 효과적으로 전달할 수 없게 된다.Here, in order to effectively adhere the adhesive sheet 100 on the susceptor 400, a magnetic force of 1000 to 2000 gauss (G) is required. That is, when a magnetic force of less than 1000 gauss G is provided from the magnet body layer 412, the adhesive sheet 100 is hardly sufficiently adhered on the susceptor by magnetic force, and 2000 gauss G is removed from the magnet body layer 412. When the excess magnetic force is provided, the size, for example, the thickness of the magnet body layer 412 must also be increased in order to provide such a magnetic force, which is generated from the deposition object due to the characteristics of the magnet body layer 412 having a relatively low thermal conductivity. It becomes impossible to effectively transfer the heat to the stage 411.
본 발명의 제1 실시 예에 따른 박막 형성장치는 자석체층(412)을 스테이지(411) 상에 설치함으로써 점착 시트(100)와 자석체층(412) 사이의 간격을 최소화하고, 점착 시트(100)에 최소 두께로 최대한의 자력을 제공할 수 있다. 이에, 점착 시트(100)는 서셉터(400) 상에 견고하게 밀착될 수 있게 되고, 반도체 패키지(11)로부터 발생하는 열은 스테이지(411)로 전달되어 점착 시트(100)에 고정된 반도체 패키지(11)의 냉각 효율을 향상시킬 수 있다.In the thin film forming apparatus according to the first exemplary embodiment of the present invention, the magnet body layer 412 is disposed on the stage 411 to minimize the gap between the adhesive sheet 100 and the magnet body layer 412, and thus, the adhesive sheet 100. It can provide maximum magnetic force with minimum thickness. Accordingly, the adhesive sheet 100 may be firmly adhered to the susceptor 400, and heat generated from the semiconductor package 11 may be transferred to the stage 411 to be fixed to the adhesive sheet 100. The cooling efficiency of (11) can be improved.
여기서, 본 발명의 제1 실시 예에 따른 박막 형성장치는 스테이지(411)를 따라 배열되는 복수 개의 단위 자석(41)을 포함하는 자석체층(412)이 상기 제1 열전 시트(430)와 스테이지(411) 사이에 설치되고, 서셉터(400)는 자석체층(412)과 스테이지(411) 사이에 제공되어 탄성을 가지는 물질로 형성되는 제2 열전 시트(440)를 더 포함할 수 있다. 즉, 본 발명의 제1 실시 예에 따른 박막 형성장치는 스테이지(411) 상에 제2 열전 시트(440), 자석체층(412) 및 제1 열전 시트(430)가 순차적으로 적층되어 형성된다.Here, in the thin film forming apparatus according to the first embodiment of the present invention, the magnet body layer 412 including the plurality of unit magnets 41 arranged along the stage 411 includes the first thermoelectric sheet 430 and the stage ( Installed between the 411, the susceptor 400 may further include a second thermoelectric sheet 440 provided between the magnet body layer 412 and the stage 411 to be formed of an elastic material. That is, in the thin film forming apparatus according to the first embodiment of the present invention, the second thermoelectric sheet 440, the magnet body layer 412, and the first thermoelectric sheet 430 are sequentially stacked on the stage 411.
이 경우, 제1 열전 시트(430)는 증착 대상물과 자석체층(412) 사이에서 밀착력을 향상시키는 역할을 하고, 제2 열전 시트(440)는 자석체층(412)과 스테이지(411) 사이에서 밀착력을 향상시키는 역할을 한다. 이에 의하여 냉각 효율이 향상될 수 있으며, 제1 열전 시트(430)뿐만 아니라 제2 열전 시트(440) 또한 탄성을 가지는 물질로 형성되어 제1 열전 시트(430) 및 제2 열전 시트(440)의 탄성에 의하여 증착 대상물은 제1 열전 시트(430), 자석체층(412) 및 제2 열전 시트(440)를 거쳐 스테이지(411)로 효과적으로 열을 전달할 수 있게 되어 냉각 효율을 향상시킬 수 있다.In this case, the first thermoelectric sheet 430 serves to improve adhesion between the deposition target and the magnet body layer 412, and the second thermoelectric sheet 440 adheres between the magnet body layer 412 and the stage 411. Serves to improve As a result, the cooling efficiency may be improved, and not only the first thermoelectric sheet 430 but also the second thermoelectric sheet 440 may be formed of an elastic material to form the first thermoelectric sheet 430 and the second thermoelectric sheet 440. Due to the elasticity, the deposition target may effectively transfer heat to the stage 411 through the first thermoelectric sheet 430, the magnet body layer 412, and the second thermoelectric sheet 440, thereby improving cooling efficiency.
여기서, 제1 열전 시트(430) 및 제2 열전 시트(440)는 각각 자석체층(412)보다 얇은 두께를 가지도록 형성할 수 있다. 즉, 반도체 패키지(11)로부터 방출되는 열의 냉각 효율은 점착 시트(100)와 서셉터(400)에 형성되는 냉각 유로(421)와의 간격에 의하여 크게 영향을 받게 되는 바, 점착 시트(100)와 냉각 유로(421)와의 간격을 최소화하면서도 점착 시트(100)에 충분한 자력을 제공하기 위하여, 제1 열전 시트(430) 및 제2 열전 시트(440)는 각각 0.3 내지 1mm의 두께로 형성될 수 있으며, 약 1 내지 2cm의 두께를 가지는 단위 자석(41)으로부터 형성되는 자석체층(412)보다 얇은 두께를 가지게 된다.Here, the first thermoelectric sheet 430 and the second thermoelectric sheet 440 may be formed to have a thickness thinner than that of the magnet body layer 412. That is, the cooling efficiency of the heat emitted from the semiconductor package 11 is greatly affected by the distance between the adhesive flow path 421 formed in the adhesive sheet 100 and the susceptor 400, the adhesive sheet 100 and In order to provide sufficient magnetic force to the adhesive sheet 100 while minimizing a distance from the cooling passage 421, the first thermoelectric sheet 430 and the second thermoelectric sheet 440 may be formed to have a thickness of 0.3 to 1 mm, respectively. It has a thickness thinner than the magnet body layer 412 formed from the unit magnet 41 having a thickness of about 1 to 2 cm.
도 19는 본 발명의 제2 실시 예에 따른 서셉터의 모습을 나타내는 도면이고, 도 20은 본 발명의 제2 실시 예에 따른 자석체층의 모습을 나타내는 도면이다. 보다 상세하게는, 여기서, 도 19(a)는 본 발명의 제2 실시 예에 따른 서셉터의 모습을 나타내는 도면이고, 도 19(b)는 의 제2 실시 예의 변형 예에 따른 서셉터의 모습을 나타내는 도면이다.FIG. 19 is a view illustrating a susceptor according to a second embodiment of the present invention, and FIG. 20 is a view illustrating a magnet body layer according to a second embodiment of the present invention. More specifically, FIG. 19A illustrates a susceptor according to a second embodiment of the present invention, and FIG. 19B illustrates a susceptor according to a modified example of the second embodiment of FIG. It is a figure which shows.
도 19 및 도 20을 참조하면, 본 발명의 제2 실시 예의 경우 스테이지(411)는 중공형의 내부 공간을 가지며, 자석체층(412)은 복수 개의 단위 자석(41)이 인접한 단위 자석(41)에 대하여 각각 소정 간격으로 이격 배열되도록 상기 스테이지(411)의 내부 공간에 설치되고, 상기 냉각 유로는, 상기 복수 개의 단위 자석(41) 사이의 영역을 따라 제공되는 제1 냉각 유로(421a);를 포함한다. 즉, 본 발명의 제2 실시 예는 상기의 구성에 대하여 전술한 본 발명의 제1 실시 예와 차이가 있으며, 이를 제외하고 본 발명의 제1 실시 예와 동일하게 적용 가능한 부분은 그대로 적용될 수 있는 바, 이에 대한 중복적인 내용의 설명은 생략하기로 한다.19 and 20, in the second embodiment of the present invention, the stage 411 has a hollow internal space, and the magnet body layer 412 has a unit magnet 41 adjacent to a plurality of unit magnets 41. A first cooling flow path 421a provided in an inner space of the stage 411 so as to be spaced apart from each other at predetermined intervals, the cooling flow path being provided along an area between the plurality of unit magnets 41; Include. That is, the second embodiment of the present invention is different from the first embodiment of the present invention described above with respect to the above configuration, except that the same applicable parts as the first embodiment of the present invention can be applied as it is. The description of duplicate contents thereof will be omitted.
본 발명의 제2 실시 예에서 스테이지(411)는 중공형의 내부 공간을 가진다. 즉, 스테이지(411)는 상부 스테이지(411a) 및 하부 스테이지(411b)를 포함할 수 있으며, 중공형의 내부 공간은 상부 스테이지(411a)의 내부 영역에서 형성되고, 하부 스테이지(411b)가 내부 공간을 하부에서 차폐하는 구조로 형성될 수 있다.In the second embodiment of the present invention, the stage 411 has a hollow inner space. That is, the stage 411 may include an upper stage 411a and a lower stage 411b, the hollow inner space is formed in the inner region of the upper stage 411a, and the lower stage 411b is the inner space. It may be formed in a structure that shields the bottom.
여기서, 자석체층(412)은 스테이지(411)를 따라 인접한 단위 자석(41) 간의 극성이 서로 교차하도록 배열되되, 복수 개의 단위 자석(41)은 인접한 단위 자석(41)에 대하여 각각 소정 간격으로 이격 배열되도록 스테이지(411)의 내부 공간에 설치된다. 여기서, 자석체층(412)은 스테이지(411)의 내부 공간의 상면에 배치되어, 복수 개의 단위 자석(41)을 자력에 의해 고정시키는 자성판(42)을 더 포함할 수 있다. 자성판(42)은, 예를 들어 강자성체인 철(Fe)을 그 재질로 하여 형성될 수 있으며, 복수 개의 단위 자석(41)은 스테이지(411)의 내부 공간의 상면에 배치된 자성판(42)에 자력에 의하여 부착되어 고정되게 된다. 즉, 자성판(42)에 의하여 복수 개의 단위 자석(41)은 체결이나 접착 등의 별도의 과정 없이 자성판(42)에 자기적으로 부착되어 고정될 수 있다. 여기서, 필요한 경우 체결이나 접착 등의 과정을 추가로 수행할 수 있음은 물론이다.Here, the magnet body layer 412 is arranged so that the polarity between adjacent unit magnets 41 cross each other along the stage 411, and the plurality of unit magnets 41 are spaced apart at predetermined intervals from the adjacent unit magnets 41, respectively. It is installed in the interior space of the stage 411 so that it may be arranged. Here, the magnet body layer 412 may further include a magnetic plate 42 disposed on an upper surface of the internal space of the stage 411 to fix the plurality of unit magnets 41 by magnetic force. The magnetic plate 42 may be formed of, for example, iron (Fe), a ferromagnetic material, and the plurality of unit magnets 41 may be formed on the upper surface of the inner space of the stage 411. ) Is fixed by magnetic force. That is, the plurality of unit magnets 41 may be magnetically attached and fixed to the magnetic plate 42 without a separate process such as fastening or bonding by the magnetic plate 42. Here, if necessary, the process of fastening or bonding may be further performed.
또한, 본 발명의 제2 실시 예에서 자석체층(412)은 인접한 단위 자석(41)에 대하여 각각 소정 간격으로 이격 배열되도록 설치되는 바, 인접한 단위 자석(41) 사이에서 자력에 의한 인력이 발생하는 경우에도 그 간격을 유지하기 위하여, 자석체층(412)은 복수 개의 단위 자석(41) 사이에 각각 배치되어 인접한 단위 자석(41) 간의 간격을 각각 유지시키는 간격 유지 부재(미도시)를 더 포함할 수 있다. 이와 같은 간격 유지 부재는 각 단위 자석(41)이 이격된 소정 간격만큼의 폭을 가지는 부재를 인접한 단위 자석(41) 사이에 삽입하는 것으로 구성할 수 있다.In addition, in the second embodiment of the present invention, the magnet body layers 412 are installed to be spaced apart from each other at predetermined intervals with respect to the adjacent unit magnets 41. In this case, in order to maintain the spacing, the magnet body layer 412 may further include a spacing member (not shown) disposed between the plurality of unit magnets 41 to respectively maintain the spacing between adjacent unit magnets 41. Can be. Such a space keeping member may be configured by inserting a member having a width by a predetermined interval spaced apart from each unit magnet 41 between adjacent unit magnets 41.
여기서, 도 19(a)에 도시된 바와 같이, 냉각 유로는 복수 개의 단위 자석(41) 사이의 이격 공간을 따라 제공되는 제1 냉각 유로(421a)를 포함할 수 있다. 즉, 제1 냉각 유로(421a)는 인접한 단위 자석(41)에 대하여 각각 소정 간격으로 이격 배열되어 형성되는 사이 영역의 적어도 일부를 따라 형성될 수 있다. 예를 들어, 제1 냉각 유로(421a)는 인접한 단위 자석(41)에 대하여 각각 소정 간격으로 이격 배열되어 형성되는 사이 영역의 일부를 따라 일정 경로로 절곡된 냉각 유로 관(미도시)을 매설하여 형성될 수 있으며, 인접한 단위 자석(41)에 대하여 각각 소정 간격으로 이격 배열되어 형성되는 사이 영역의 전부를 따라 격자 형상으로 형성된 냉각 유로 관을 매설하여 형성될 수도 있다.Here, as shown in FIG. 19A, the cooling flow path may include a first cooling flow path 421a provided along the spaced space between the plurality of unit magnets 41. That is, the first cooling channel 421a may be formed along at least a part of an interregion area formed to be spaced apart from each other with respect to the adjacent unit magnets 41 at predetermined intervals. For example, the first cooling channel 421a embeds a cooling channel tube (not shown) that is bent in a predetermined path along a part of a region between the adjacent unit magnets 41, which are formed to be spaced apart at predetermined intervals, respectively. It may be formed, or may be formed by embedding the cooling flow path tube formed in a lattice shape along the whole of the inter-regions formed to be spaced apart at predetermined intervals with respect to the adjacent unit magnets 41, respectively.
또한, 제1 냉각 유로(421a)는 냉각 유로 관을 매설하는 것이 아니라, 복수 개의 단위 자석(41) 사이의 이격된 공간 자체를 냉각 유로(421)로 형성할 수 있다. 이 경우 제1 냉각 유로(421a)는 복수 개의 단위 자석(41) 중 적어도 일부의 단위 자석(41)과 냉매가 직접 접촉되도록 제공된다. 이와 같이 복수 개의 단위 자석(41) 사이의 이격된 공간 자체를 제1 냉각 유로(421a)로 형성하게 되면, 냉매가 복수 개의 단위 자석(41)과 직접 접촉하여 스테이지(411)뿐만 아니라 단위 자석(41)까지도 냉각시킬 수 있게 되며, 자석의 특성상 발생하는 온도가 상승하면 자력이 저하되는 현상을 방지하여 점착 시트(100)에 충분한 자력을 제공할 수 있게 된다.In addition, the first cooling channel 421a may form a spaced space itself between the plurality of unit magnets 41 as the cooling channel 421 instead of embedding the cooling channel. In this case, the first cooling channel 421a is provided so that the refrigerant and the unit magnet 41 of at least some of the plurality of unit magnets 41 directly contact each other. As such, when the spaces themselves spaced between the plurality of unit magnets 41 are formed as the first cooling passages 421a, the refrigerant directly contacts the plurality of unit magnets 41 and thus, not only the stage 411 but also the unit magnets ( 41) can be cooled, and if the temperature generated due to the characteristics of the magnet is increased, it is possible to provide a sufficient magnetic force to the adhesive sheet 100 by preventing the phenomenon that the magnetic force is lowered.
이 경우, 단위 자석(41)은 냉매와 직접 접촉하게 되므로 부식 등의 문제가 발생할 수 있다. 따라서, 본 발명의 제2 실시 예에 따른 박막 형성장치에서는 복수 개의 단위 자석(41)의 표면에 냉매와의 접촉에 따른 부식을 방지하기 위한 부식 방지층을 형성할 수 있다. 이와 같은 부식 방지층은 자성을 가지는 물질인 크롬 등을 도금하여 형성할 수 있으며, 강자성 또는 상자성의 물질을 사용하여 부식 방지층에 의하여 단위 자석(41)의 자력이 저하되는 것을 방지할 수 있다.In this case, since the unit magnet 41 is in direct contact with the refrigerant, problems such as corrosion may occur. Therefore, in the thin film forming apparatus according to the second exemplary embodiment of the present invention, a corrosion prevention layer for preventing corrosion due to contact with a refrigerant may be formed on the surfaces of the plurality of unit magnets 41. The anti-corrosion layer may be formed by plating chromium, which is a magnetic material, and may prevent the magnetic force of the unit magnet 41 from being lowered by the anti-corrosion layer using a ferromagnetic or paramagnetic material.
본 발명의 제2 실시 예에서 냉각 유로는 전술한 제1 냉각 유로(421a)만으로 구성될 수도 있으나, 도 19(b)에 도시된 바와 같이 자석체층(412)의 하부에 형성되는 제2 냉각 유로(421b)를 더 포함하는 것으로 구성될 수도 있다. 여기서, 제1 냉각 유로(421a)와 제2 냉각 유로(421b)는 서로 연통될 수 있다. 냉각 유로를 전술한 제1 냉각 유로(421a)만으로 구성하여 인접한 단위 자석(41)에 대하여 각각 소정 간격으로 이격 배열되어 형성되는 사이 영역의 전부를 따라 격자 형상으로 형성하는 경우, 스테이지(411) 및 단위 자석(41)을 전체적으로 균일하게 냉각시킬 수 있다. 그러나, 격자형으로 형성되는 제1 냉각 유로(421a)의 경우 냉매의 신속한 순환이 어려울 수 있다. 따라서, 자석체층(412)의 하부에 형성되는 제2 냉각 유로(421b)를 더 포함하여 상기 제2 냉각 유로(421b)는 상기 제2 냉각 유로(421b)에 각각 연결되는 냉매 유입구(422) 및 냉매 배출구(423) 사이에서 선형으로 연장되어 냉매를 신속하게 순환시키고, 상기 제1 냉각 유로(421a)는 상기 제2 냉각 유로(421b)로부터 공급되는 냉매를 복수 개의 단위 자석(41) 사이에서 격자 형상을 가지도록 방사형으로 확산시켜 스테이지(411) 및 단위 자석(41)을 균일하게 냉각시킬 수 있게 된다.In the second embodiment of the present invention, the cooling passage may be composed of only the first cooling passage 421a described above, but as shown in FIG. 19B, a second cooling passage formed under the magnet body layer 412. And may further include 421b. Here, the first cooling passage 421a and the second cooling passage 421b may communicate with each other. The stage 411 and the case in which the cooling passage is formed of only the first cooling passage 421a described above and formed in a lattice shape along all of the interregions formed by being spaced apart at predetermined intervals with respect to the adjacent unit magnets 41, respectively. The unit magnet 41 can be cooled uniformly as a whole. However, in the case of the first cooling channel 421a formed in a lattice shape, rapid circulation of the refrigerant may be difficult. Therefore, the second cooling channel 421b further includes a second cooling channel 421b formed under the magnet body layer 412, and the second cooling channel 421b is connected to the second cooling channel 421b, respectively. It extends linearly between the coolant discharge port 423 to quickly circulate the coolant, the first cooling channel 421a grating the refrigerant supplied from the second cooling channel 421b between the plurality of unit magnets 41. Radial diffusion to have a shape makes it possible to uniformly cool the stage 411 and the unit magnet 41.
도 21은 본 발명의 제3 실시 예에 따른 서셉터의 모습을 나타내는 도면이다.21 is a diagram illustrating a susceptor according to a third embodiment of the present invention.
도 21을 참조하면, 본 발명의 제3 실시 예의 경우 상기 스테이지(411)는 중공형의 내부 공간을 가지며, 상기 복수 개의 단위 자석은, 소정 두께를 가지는 복수 개의 제1 단위 자석(41a); 및 상기 제1 단위 자석(41a)보다 얇은 두께를 가지는 복수 개의 제2 단위 자석(41b);을 포함하고, 상기 자석체층(412)은 상기 복수 개의 제2 단위 자석(41b)이 상기 복수 개의 제1 단위 자석(41a) 사이에 배열되도록 상기 스테이지(411)의 내부 공간에 설치되고, 상기 냉각 유로(421)는 상기 복수 개의 제2 단위 자석(41b)에 의하여 이격되는 상기 복수 개의 제1 단위 자석(41a) 사이의 영역을 따라 제공된다.Referring to FIG. 21, in the third embodiment of the present invention, the stage 411 has a hollow internal space, and the plurality of unit magnets include: a plurality of first unit magnets 41a having a predetermined thickness; And a plurality of second unit magnets 41b having a thickness thinner than that of the first unit magnets 41a, wherein the magnet body layer 412 includes the plurality of second unit magnets 41b. The plurality of first unit magnets are installed in an internal space of the stage 411 to be arranged between the one unit magnets 41a, and the cooling passages 421 are spaced apart by the plurality of second unit magnets 41b. It is provided along the area between 41a.
즉, 본 발명의 제3 실시 예는 상기의 구성에 대하여 전술한 본 발명의 제2 실시 예와 차이가 있으며, 이를 제외하고 본 발명의 제1 실시 예 및 제2 실시 예와 동일하게 적용 가능한 부분은 그대로 적용될 수 있는 바, 이에 대한 중복적인 내용의 설명은 생략하기로 한다.That is, the third embodiment of the present invention is different from the above-described second embodiment of the present invention with respect to the above configuration, except for this, the parts applicable in the same manner as the first and second embodiments of the present invention. Can be applied as it is, the description of the duplicate content will be omitted.
본 발명의 제2 실시 예와 같이 본 발명의 제3 실시 예에서 스테이지(411)는 중공형의 내부 공간을 가진다. 여기서, 자석체층(412)은 스테이지(411)를 따라 인접한 단위 자석 간의 극성이 서로 교차하도록 배열되되, 복수 개의 단위 자석은, 소정 두께를 가지는 복수 개의 제1 단위 자석(41a); 및 상기 제1 단위 자석(41a)보다 얇은 두께를 가지는 복수 개의 제2 단위 자석(41b);을 포함한다. 여기서, 복수 개의 제1 단위 자석(41a)은 스테이지(411)의 내부 공간에서 상하 방향으로 동일한 두께를 가질 수 있으며, 복수 개의 제2 단위 자석(41b)은 스테이지(411)의 내부 공간에서 상하 방향으로 제1 단위 자석(41a)보다 얇은 동일한 두께를 가질 수 있다.Like the second embodiment of the present invention, in the third embodiment of the present invention, the stage 411 has a hollow inner space. Here, the magnet body layer 412 is arranged along the stage 411 so that polarities between adjacent unit magnets cross each other, and the plurality of unit magnets include: a plurality of first unit magnets 41a having a predetermined thickness; And a plurality of second unit magnets 41b having a thickness thinner than that of the first unit magnets 41a. Here, the plurality of first unit magnets 41a may have the same thickness in the up and down direction in the interior space of the stage 411, and the plurality of second unit magnets 41b may be in the up and down direction in the interior space of the stage 411. As such, it may have the same thickness thinner than that of the first unit magnet 41a.
또한, 복수 개의 단위 자석은 복수 개의 제2 단위 자석(41b)이 복수 개의 제1 단위 자석(41a) 사이에 배열되도록 스테이지(411)의 내부 공간에 설치될 수 있다. 이 경우 자석체층(412)은 스테이지(411)의 내부 공간의 상면에 배치되어, 복수 개의 제1 단위 자석(41a) 및 제2 단위 자석(41b)을 자력에 의해 고정시키는 자성판(42)을 더 포함할 수 있다.In addition, the plurality of unit magnets may be installed in the internal space of the stage 411 such that the plurality of second unit magnets 41b are arranged between the plurality of first unit magnets 41a. In this case, the magnet body layer 412 is disposed on the upper surface of the internal space of the stage 411, and the magnetic plate 42 for fixing the plurality of first unit magnets 41a and the second unit magnets 41b by magnetic force is provided. It may further include.
여기서, 도 21에 도시된 바와 같이, 냉각 유로(421)는 복수 개의 제2 단위 자석(41b)의 두께 방향의 공간, 즉 복수 개의 제2 단위 자석(41b)에 의하여 이격되는 복수 개의 제1 단위 자석(41a) 사이의 영역을 따라 제공될 수 있다. 즉, 자성판(42)에 서로 다른 두께를 가지는 복수 개의 제1 단위 자석(41a)과 제2 단위 자석(41b)을 배치하되, 복수 개의 제2 단위 자석(41b)을 복수 개의 제1 단위 자석(41a) 사이에 배열시키게 되면, 복수 개의 제2 단위 자석(41b)의 하부 영역은 제1 단위 자석(41a) 사이에서 이격되게 된다. 도 21에서는 각각의 제1 단위 자석(41a) 사이에 제2 단위 자석(41b)이 배열되는 것으로 도시하였으나, 이에 한정되는 것은 아니고, 제1 단위 자석(41a) 사이에서 제2 단위 자석(41b)을 유로의 형상으로 배열하는 경우, 복수 개의 제2 단위 자석(41b)에 의하여 이격되는 복수 개의 제1 단위 자석(41a) 사이의 영역을 따라 냉각 유로(421)가 제공될 수 있다.Here, as illustrated in FIG. 21, the cooling channel 421 may include a plurality of first units spaced apart by spaces in the thickness direction of the plurality of second unit magnets 41b, that is, the plurality of second unit magnets 41b. It may be provided along the area between the magnets 41a. That is, the plurality of first unit magnets 41a and the second unit magnets 41b having different thicknesses are disposed on the magnetic plate 42, but the plurality of second unit magnets 41b are disposed in the plurality of first unit magnets. When arranged between the 41a, the lower regions of the plurality of second unit magnets 41b are spaced apart between the first unit magnets 41a. In FIG. 21, the second unit magnets 41b are arranged between the first unit magnets 41a. However, the present invention is not limited thereto, and the second unit magnets 41b may be disposed between the first unit magnets 41a. When arranged in the shape of a flow path, the cooling flow path 421 may be provided along an area between the plurality of first unit magnets 41a spaced by the plurality of second unit magnets 41b.
또한, 냉각 유로(421)는 복수 개의 제2 단위 자석(41b) 하부에서 이격되는 복수 개의 제1 단위 자석(41a) 사이 영역의 적어도 일부를 따라 형성될 수 있으며, 제2 단위 자석(41b) 하부에서 제2 단위 자석(41b)의 배열 방향을 따라 일정 경로로 절곡된 냉각 유로 관(미도시)을 매설하여 형성할 수 있다. 또한, 냉각 유로(421)는 제2 단위 자석(41b) 하부에서 형성되는 제1 단위 자석(41a) 사이 공간 자체에 의하여 형성될 수 있다. 이 경우 냉각 유로(421)는 복수 개의 제1 단위 자석(41a) 및 복수 개의 제2 단위 자석(41b) 중 적어도 일부의 단위 자석과 냉매가 직접 접촉되도록 제공된다. 이와 같이 복수 개의 단위 자석 사이의 이격된 공간 자체를 냉각 유로(421)로 형성하게 되면, 냉매가 복수 개의 단위 자석과 직접 접촉하여 스테이지(411) 뿐만 아니라 단위 자석(41)까지도 냉각시킬 수 있게 되며, 자석의 특성상 발생하는 온도가 상승하면 자력이 저하되는 현상을 방지하여 점착 시트(100)에 충분한 자력을 제공할 수 있게 되고, 이 경우, 단위 자석은 냉매와 직접 접촉하게 되므로 부식 등의 문제가 발생하는 것을 방지하기 위하여 복수 개의 제1 단위 자석(41a) 및 제2 단위 자석(41b)의 표면에 냉매와의 접촉에 따른 부식을 방지하기 위한 부식 방지층을 형성할 수 있음은 본 발명의 제2 실시 예에서와 같다.In addition, the cooling passage 421 may be formed along at least a portion of an area between the plurality of first unit magnets 41a spaced apart from the plurality of second unit magnets 41b, and the lower portion of the second unit magnet 41b may be formed. The cooling channel pipe (not shown) bent in a predetermined path along the arrangement direction of the second unit magnet 41b may be formed by embedding. In addition, the cooling passage 421 may be formed by the space itself between the first unit magnets 41a formed under the second unit magnets 41b. In this case, the cooling passage 421 is provided such that the refrigerant and the unit magnets of at least some of the plurality of first unit magnets 41a and the plurality of second unit magnets 41b are in direct contact with each other. As such, when the spaced space itself between the plurality of unit magnets is formed as the cooling channel 421, the refrigerant may directly contact the plurality of unit magnets to cool not only the stage 411 but also the unit magnet 41. When the temperature generated due to the characteristics of the magnet is increased, the magnetic force is prevented from being lowered to provide sufficient magnetic force to the adhesive sheet 100. In this case, since the unit magnet is in direct contact with the refrigerant, problems such as corrosion may occur. In order to prevent this from occurring, it is possible to form a corrosion preventing layer for preventing corrosion due to contact with a refrigerant on the surfaces of the plurality of first unit magnets 41a and the second unit magnets 41b. Same as in the embodiment.
본 발명의 제3 실시 예에서와 같이 냉각 유로(421)를 복수 개의 제2 단위 자석(41b) 하부에서 이격되는 복수 개의 제1 단위 자석(41a) 사이 영역의 적어도 일부를 따라 형성하는 경우, 복수 개의 제1 단위 자석(41a) 및 복수 개의 제2 단위 자석(41b)에 의하여 점착 시트(100)에 균일한 자력을 제공함과 동시에 스테이지(411)뿐만 아니라 단위 자석(41)까지도 냉각시킬 수 있게 된다. 즉, 본 발명의 제2 실시 예와 비교할 때, 본 발명의 제3 실시 예의 경우에는 스테이지(411)를 따라 복수 개의 제1 단위 자석(41a) 및 복수 개의 제2 단위 자석(41b)이 충분하게 배치될 수 있어(도 18에 도시된 바와 동일), 점착 시트(100)에 균일한 자력을 제공할 수 있으며, 냉매와 단위 자석을 직접 접촉하도록 냉각 유로(421)를 형성하여 스테이지(411)를 냉각시킬 수 있을 뿐만 아니라, 단위 자석까지도 냉각시켜 자력이 저하되는 현상을 방지하여 점착 시트(100)에 충분한 자력을 제공할 수 있게 된다.As in the third embodiment of the present invention, when the cooling passage 421 is formed along at least a part of an area between the plurality of first unit magnets 41a spaced apart from the plurality of second unit magnets 41b, The first unit magnets 41a and the plurality of second unit magnets 41b provide uniform magnetic force to the pressure-sensitive adhesive sheet 100 and cool not only the stage 411 but also the unit magnets 41. . That is, compared with the second embodiment of the present invention, in the case of the third embodiment of the present invention, the plurality of first unit magnets 41a and the plurality of second unit magnets 41b are sufficient along the stage 411. 18 may be arranged (as shown in FIG. 18), to provide a uniform magnetic force to the adhesive sheet 100, and to form the cooling channel 421 to directly contact the refrigerant and the unit magnet to form the stage 411. In addition to cooling, it is also possible to provide a sufficient magnetic force to the adhesive sheet 100 by preventing the phenomenon that the magnetic force is lowered by cooling even the unit magnet.
또한, 자성판(42)은 복수 개의 제1 단위 자석(41a) 및 복수 개의 제2 단위 자석(41b)으로부터 자력을 제공받아 자화된다. 즉, 제1 단위 자석(41a) 및 제2 단위 자석(41b)은 그 두께가 서로 상이하여 각 단위 자석으로부터 제공되는 자력은 불균일하게 분포될 수 있으나, 제1 단위 자석(41a) 및 제2 단위 자석(41b)을 고정하는 자성판(42)이 복수 개의 제1 단위 자석(41a) 및 복수 개의 제2 단위 자석(41b)으로부터 자력을 제공받아 자화됨으로써 자기장 유도에 따라 불균일하게 제공되는 자력은 상쇄될 수 있으며, 이에 따라 점착 시트(100)에는 상대적으로 균일한 자력이 제공될 수 있게 된다.In addition, the magnetic plate 42 is magnetized by receiving magnetic force from the plurality of first unit magnets 41a and the plurality of second unit magnets 41b. That is, although the thicknesses of the first unit magnet 41a and the second unit magnet 41b are different from each other, the magnetic force provided from each unit magnet may be unevenly distributed, but the first unit magnet 41a and the second unit may be unevenly distributed. Since the magnetic plate 42 holding the magnet 41b is magnetized by receiving the magnetic force from the plurality of first unit magnets 41a and the plurality of second unit magnets 41b, the magnetic force provided non-uniformly according to the magnetic field induction is canceled. As a result, the adhesive sheet 100 may be provided with a relatively uniform magnetic force.
이하에서, 본 발명의 실시 형태에 따른 박막 형성방법에 대하여 상세하게 설명하기로 한다. 본 발명의 실시 형태에 따른 박막 형성방법을 설명함에 있어 본 발명의 다른 실시예에 따른 박막 형성장치와 관련하여 전술한 내용과 중복되는 설명은 생략하기로 한다.Hereinafter, a thin film forming method according to an embodiment of the present invention will be described in detail. In the description of the method for forming a thin film according to an embodiment of the present invention, a description overlapping with the above description with respect to the thin film forming apparatus according to another embodiment of the present invention will be omitted.
본 발명의 실시 형태에 따른 박막 형성방법은, 자성층을 가지는 점착 시트(100)를 포함하는 증착 대상물을 마련하는 과정(S100); 증착 대상물(D)을 서셉터(400) 상에 안착시키는 과정(S200); 및 증착 대상물(D)에 증착 물질을 공급하여 박막을 증착하는 과정(S300);을 포함하고, 증착 대상물(D)을 서셉터(400) 상에 안착시키는 과정에서, 증착 대상물(D)을 지지하는 스테이지(411)에 배열하여 설치되는 복수 개의 단위 자석(41)을 포함하는 자석체층(412)이, 증착 대상물(D)에 자력을 제공하여 상기 점착 시트(100)가 상기 서셉터(400) 상에 밀착되고, 상기 박막을 증착하는 과정은, 상기 스테이지(411)의 내부에서 냉매를 유동시켜 증착 대상물(D)을 냉각시키면서 이루어진다.According to one or more exemplary embodiments, a method of forming a thin film includes: preparing a deposition target including an adhesive sheet 100 having a magnetic layer (S100); Mounting the deposition target D on the susceptor 400 (S200); And depositing a thin film by supplying a deposition material to the deposition target D (S300), and supporting the deposition target D in a process of seating the deposition target D on the susceptor 400. The magnet body layer 412 including a plurality of unit magnets 41 arranged in the stage 411 to provide a magnetic force to the deposition target (D), the adhesive sheet 100 is the susceptor 400 The process of depositing the thin film in close contact with the phase is performed while cooling the deposition target D by flowing a refrigerant inside the stage 411.
증착 대상물을 마련하는 과정(S100)은, 먼저 적어도 하나의 자성층을 가지는 점착 시트(100)의 상면에 반도체 패키지(11)를 고정시킨다. 여기서, 점착 시트(100)는 자성층뿐만 아니라, 반도체 패키지(11)가 상면에 부착되는 점착층(110); 및 상기 점착층(110)과 자성층의 사이에 제공되고, 외부 압력에 의하여 상기 반도체 패키지(11)로부터 돌출되는 단자(11a)를 따라 소성 변형하는 변형 유지층(120);을 포함할 수 있으며, 증착 대상물을 마련하는 과정(S100)은 상기 점착 시트(100)의 상부에 형성되는 점착층(110)에 상기 반도체 패키지(11)를 부착시키는 과정; 및 외부 압력에 의하여 상기 점착층(110)과 자성층의 사이에 형성되는 변형 유지층(120)을 상기 반도체 패키지(11)로부터 돌출되는 단자(11a)를 따라 소성 변형시키는 과정;을 포함할 수 있다.In the process of preparing a deposition target (S100), first, the semiconductor package 11 is fixed to an upper surface of the adhesive sheet 100 having at least one magnetic layer. Here, the adhesive sheet 100 is a magnetic layer, as well as the adhesive layer 110 to which the semiconductor package 11 is attached to the upper surface; And a strain holding layer 120 provided between the adhesive layer 110 and the magnetic layer and plastically deforming along the terminal 11a protruding from the semiconductor package 11 by an external pressure. A process of preparing a deposition target (S100) may include attaching the semiconductor package 11 to an adhesive layer 110 formed on the adhesive sheet 100; And plastic deformation of the strain holding layer 120 formed between the adhesive layer 110 and the magnetic layer by the external pressure along the terminal 11a protruding from the semiconductor package 11. .
즉, 점착층(110)에 반도체 패키지(11)를 부착시키는 과정은, 금속 전극 또는 솔더 볼 등의 단자(11a)가 돌출되는 LGA 반도체 패키지(11) 또는 BGA 반도체 패키지(11)의 하면을 점착층(110)과 마주보게 배치한 상태에서 점착 시트(100) 및 반도체 패키지(11) 중 적어도 하나에 외부 압력을 인가한다. 이에 의하여, 반도체 패키지(11)의 하면으로부터 돌출되는 단자(11a)는 점착층(110)에 삽입되고, 반도체 패키지(11)의 하면은 점착층(110)에 부착된다.That is, in the process of attaching the semiconductor package 11 to the adhesive layer 110, the bottom surface of the LGA semiconductor package 11 or the BGA semiconductor package 11 on which the terminal 11a, such as a metal electrode or solder ball, protrudes is adhered. An external pressure is applied to at least one of the adhesive sheet 100 and the semiconductor package 11 while being disposed to face the layer 110. As a result, the terminal 11a protruding from the lower surface of the semiconductor package 11 is inserted into the adhesive layer 110, and the lower surface of the semiconductor package 11 is attached to the adhesive layer 110.
변형 유지층(120)을 소성 변형시키는 과정은, 반도체 패키지(11)의 하면으로부터 돌출되어 외부 압력에 의하여 점착층(110)에 삽입되는 단자(11a)에 의하여 변형 유지층(120)은 가압되고, 이에 의하여 변형 유지층(120)은 그 형상이 변형되게 된다. 이에 의하여 반도체 패키지(11)의 하면으로부터 돌출되는 금속 전극 또는 솔더 볼 등의 단자(11a)는 점착층(110)에 함몰되어 유지 고정되고, 외부로 노출되지 않게 된다.The process of plastically deforming the strain holding layer 120 may include pressing the strain holding layer 120 by a terminal 11a protruding from the bottom surface of the semiconductor package 11 and inserted into the adhesive layer 110 by external pressure. As a result, the shape of the strain holding layer 120 is changed. As a result, the terminal 11a of the metal electrode or the solder ball, which protrudes from the lower surface of the semiconductor package 11, is recessed and fixed to the adhesive layer 110 and is not exposed to the outside.
이와 같이, 외부 압력에 의하여 소성 변형되는 변형 유지층(120)은 전연성, 즉 전성 및 연성을 가지는 금속 물질로 형성될 수 있으며, 우수한 열 전도율을 가진다. 따라서, 변형 유지층(120)은 점착층(110)과 반도체 패키지(11)의 하면 사이에 들뜸 현상을 방지하고, 높은 열 전도율을 가지게 되어 반도체 패키지(11)로부터 발생하는 열이 점착층(110)을 거쳐 자성층 및 서셉터(400)까지 효과적으로 전달될 수 있도록 한다. 이에 의하여 스퍼터링 공정과 같은 증착 공정 도중 고온의 환경에 노출되는 반도체 패키지(11)를 신속하게 냉각시킬 수 있게 되고, 반도체 패키지(11) 내에 배치되는 반도체 칩이 고온의 열에 의하여 손상되는 것을 방지하고, 반도체 패키지(11)가 휘어짐을 방지할 수 있다.As described above, the strain holding layer 120 plastically deformed by external pressure may be formed of a metal material having malleability, that is, malleability and ductility, and has excellent thermal conductivity. Accordingly, the strain holding layer 120 may prevent the floating phenomenon between the adhesive layer 110 and the lower surface of the semiconductor package 11 and have a high thermal conductivity, so that heat generated from the semiconductor package 11 may be adhered to the adhesive layer 110. Through) to be effectively transmitted to the magnetic layer and the susceptor 400. This makes it possible to quickly cool the semiconductor package 11 exposed to a high temperature environment during a deposition process such as a sputtering process, to prevent the semiconductor chip disposed in the semiconductor package 11 from being damaged by high temperature heat, The semiconductor package 11 can be prevented from bending.
증착 대상물을 서셉터(400) 상에 안착시키는 과정(S200)은, 전술한 과정에 의하여 반도체 패키지(11)가 고정된 점착 시트(100)를 박막 형성장치 내로 이송하여 서셉터(400) 상에 안착시킨다. 여기서, 점착 시트(100)의 가장자리에는 지지 프레임(210)이 부착될 수 있으며, 지지 프레임(210)이 부착된 점착 시트(100)는 지지 프레임(210)을 내측에서 지지하는 링 형상의 이송 트레이(40)에 탑재되어 이송될 수 있다.In the process (S200) of depositing the deposition object on the susceptor 400, the adhesive sheet 100 on which the semiconductor package 11 is fixed is transferred into the thin film forming apparatus by the above-described process on the susceptor 400. Settle down. Here, the support frame 210 may be attached to the edge of the adhesive sheet 100, the adhesive sheet 100 to which the support frame 210 is attached is a ring-shaped transfer tray for supporting the support frame 210 from the inside. It may be mounted on the 40 and transported.
증착 대상물을 서셉터(400) 상에 안착시키는 과정(S200)에서 점착 시트(100)는 증착 대상물을 지지하는 스테이지(411)에 배열하여 설치되는 복수 개의 단위 자석(41)을 포함하는 자석체층(412)이 증착 대상물에 자력을 제공하여 증착 대상물이 서셉터(400) 상에 밀착된다. 여기서, 자석체층(412)은 스테이지(411) 상에 설치되거나 스테이지(411)의 내부 공간에 설치되어, 반도체 패키지(11)가 고정된 점착 시트(100)에 서셉터(400)를 향하는 방향으로 자력을 제공하며, 전술한 바와 같이 점착 시트(100)가 적어도 하나의 자성층을 가지도록 형성함으로써, 스테이지(411)에 설치되는 자석체층(412)으로부터 제공되는 자력에 의하여 상기 점착 시트(100)는 스테이지(411)와 견고하게 밀착된다. 따라서, 점착 시트(100)와 스테이지(411) 사이의 유효 접촉 면적은 증가하게 되고, 반도체 패키지(11)로부터 점착 시트(100)를 통해 전달되는 열을 스테이지(411)로 전달하여 효과적으로 냉각시킬 수 있게 된다.In the process of mounting the deposition target on the susceptor 400 (S200), the adhesive sheet 100 may include a magnet body layer including a plurality of unit magnets 41 arranged in a stage 411 supporting the deposition target. 412 provides magnetic force to the deposition object such that the deposition object is in close contact with the susceptor 400. Here, the magnet body layer 412 is installed on the stage 411 or installed in the internal space of the stage 411, so that the magnet body layer 412 faces the susceptor 400 on the adhesive sheet 100 to which the semiconductor package 11 is fixed. The adhesive sheet 100 is provided by a magnetic force provided from the magnet body layer 412 provided on the stage 411 by providing a magnetic force, and forming the adhesive sheet 100 to have at least one magnetic layer as described above. It is in close contact with the stage 411. Therefore, the effective contact area between the adhesive sheet 100 and the stage 411 is increased, and the heat transferred from the semiconductor package 11 through the adhesive sheet 100 to the stage 411 can be effectively cooled. Will be.
여기서, 자석체층(412)은 스테이지(411)를 따라 극성이 교차하도록 배열되는 복수 개의 단위 자석(41)을 포함할 수 있으며, 이 경우 자력선은 스테이지(411)를 따라 배열되는 N극과 S극 사이에 균일하게 분포하게 되어 점착 시트(100)에 균일한 자력을 제공할 수 있음은 전술한 바와 같다. 여기서, 자석체층(412)에 의하여 점착 시트(100)에 제공되는 자력은 1000 내지 2000 가우스(G)의 값을 가질 수 있으며, 이 경우 점착 시트(100)와의 밀착을 위한 충분한 자력을 제공할 수 있게 된다.Here, the magnet body layer 412 may include a plurality of unit magnets 41 arranged to cross the polarity along the stage 411, in which case the magnetic force lines are the N pole and the S pole arranged along the stage 411. As described above, it is uniformly distributed therebetween, thereby providing a uniform magnetic force to the adhesive sheet 100. Here, the magnetic force provided to the adhesive sheet 100 by the magnet body layer 412 may have a value of 1000 to 2000 gauss (G), in which case it may provide a sufficient magnetic force for close contact with the adhesive sheet 100. Will be.
박막을 증착하는 과정(S400)은 증착 대상물 상에 증착 물질을 공급하여 박막을 증착한다. 여기서, 증착물질 제공부(300)는 서셉터(400)의 상부에 배치되어 점착 시트(100) 상에 고정된 반도체 패키지(11)에 박막을 증착하기 위한 증착 물질을 제공하며, 증착물질 제공부(300)는 전자파를 차폐하기 위한 금속 물질로 이루어지는 타겟을 스퍼터링하여 증착 물질을 방출시켜 제공함으로써 반도체 패키지(11)에 전자파 차폐막을 형성할 수 있다.In the process of depositing a thin film (S400), a thin film is deposited by supplying a deposition material onto a deposition target. Here, the deposition material providing unit 300 is provided on the susceptor 400 to provide a deposition material for depositing a thin film on the semiconductor package 11 fixed on the adhesive sheet 100, the deposition material providing unit In operation 300, an electromagnetic wave shielding film may be formed on the semiconductor package 11 by sputtering a target made of a metal material to shield electromagnetic waves to release the deposition material.
또한, 박막을 증착하는 과정(S400)은, 스테이지(411)의 내부에서 냉매를 순환 유동시켜 점착 시트(100) 상에 고정된 반도체 패키지(11)를 냉각시키면서 이루어진다. 즉, 스테이지(411)의 내부에는 냉매를 순환시키기 위한 냉각 유로(421)가 형성될 수 있으며, 박막을 증착하는 과정(S400)에서 스테이지(411)의 내부에 형성된 냉각 유로(421)를 따라 냉매를 순환시킴으로써 반도체 패키지(11)를 냉각시킬 수 있게 된다. 여기서, 냉각 유로(421)는 복수 개의 단위 자석(41) 사이의 영역을 따라 제공되거나, 복수 개의 단위 자석(41) 사이의 영역과 연통하는 자석체층(412)의 하부 영역을 따라 제공될 수 있으며, 제1 단위 자석(41a)에 대하여 상대적으로 얇은 두께를 가지는 제2 단위 자석(41b)이 복수 개의 제1 단위 자석(41a) 사이에 배열되어 이격되는 영역을 따라 제공될 수도 있다. 여기서, 증착 대상물은 별도의 열원에 의하여 가열되지 않으며, 스테이지(411) 내에서의 냉매의 순환에 의하여 냉각되어 반도체 패키지(11)로부터 방출되는 열을 효과적으로 방출할 수 있게 된다. 일반적으로, 반도체 패키지(11)가 고온에 노출되는 것을 방지하기 위하여 내부 환경의 온도를 낮추게 되면 반도체 패키지에 박막이 형성되기 위한 에너지가 부족하게 된다. 따라서, 스퍼터링 과정에서 출력을 증가시키게 되고, 이는 타겟의 물리적 충돌량을 증가시키게 되어 결국 약 90 내지 130℃의 온도를 가지는 고온의 내부 환경을 형성하게 된다. 그러나, 본 발명의 실시 예에 따르면 반도체 패키지의 효과적인 냉각에 의하여 반도체 패키지(11)를 상온으로부터 90℃ 이하의 온도로 유지시키며 박막을 증착시킬 수 있게 된다.In addition, the process of depositing a thin film (S400) is performed while cooling the semiconductor package 11 fixed on the adhesive sheet 100 by circulating a refrigerant inside the stage 411. That is, a cooling passage 421 may be formed in the stage 411 to circulate the refrigerant, and in the process of depositing a thin film, the refrigerant may be formed along the cooling passage 421 formed in the stage 411. By circulating, the semiconductor package 11 can be cooled. Here, the cooling passage 421 may be provided along an area between the plurality of unit magnets 41, or may be provided along a lower area of the magnet body layer 412 communicating with an area between the plurality of unit magnets 41. The second unit magnet 41b having a relatively thin thickness with respect to the first unit magnet 41a may be provided along an area spaced apart from each other by being arranged between the plurality of first unit magnets 41a. Here, the deposition target is not heated by a separate heat source, and is cooled by the circulation of the refrigerant in the stage 411 to effectively discharge heat emitted from the semiconductor package 11. In general, when the temperature of the internal environment is lowered to prevent the semiconductor package 11 from being exposed to high temperature, energy for forming a thin film in the semiconductor package is insufficient. Therefore, the output is increased during the sputtering process, which increases the amount of physical impact of the target, thereby forming a high temperature internal environment having a temperature of about 90 to 130 ° C. However, according to the exemplary embodiment of the present invention, the semiconductor package 11 may be deposited while maintaining the semiconductor package 11 at a temperature of 90 ° C. or lower from room temperature by effective cooling of the semiconductor package.
이와 같이, 본 발명의 실시 예에 따른 박막 형성장치 및 박막 형성방법에 의하면, 복수 개의 단위 자석을 포함하는 자석체층으로부터 제공되는 자력에 의하여 증착 대상물을 서셉터 상에 견고하게 밀착시킬 수 있다. 또한, 스테이지 상에 증착 대상물의 안착 면을 제공하는 열전 시트를 구비하여 증착 대상물과 스테이지 사이의 유효 접촉 면적을 증가시킬 수 있으며, 스테이지의 내부에 형성되는 냉각 유로를 통하여 냉매를 순환시켜 증착 공정을 수행함으로써, 반도체 패키지(11)로부터 점착 시트를 통하여 스테이지로 전달되는 열을 효과적으로 방출시킬 수 있다.As described above, according to the thin film forming apparatus and the thin film forming method according to the embodiment of the present invention, the deposition target can be firmly adhered to the susceptor by the magnetic force provided from the magnet body layer including the plurality of unit magnets. In addition, a thermoelectric sheet may be provided on the stage to provide a seating surface of the deposition target, thereby increasing an effective contact area between the deposition target and the stage, and circulating the refrigerant through a cooling passage formed in the stage to perform the deposition process. By performing this, heat transmitted from the semiconductor package 11 to the stage through the adhesive sheet can be effectively released.
또한, 복수 개의 단위 자석 사이의 영역을 따라 냉각 유로를 형성하여 냉매를 유동시킴으로써 스테이지를 냉각시킴과 동시에 단위 자석까지도 냉각시킬 수 있게 되어, 온도 상승에 따른 자력의 저하를 방지하고 증착 대상물에 충분한 자력을 제공할 수 있다. 뿐만 아니라, 서로 다른 두께를 가지는 단위 자석을 배열하여 냉각 유로를 형성하여 냉매를 유동시킴으로써 스테이지를 따라 자기력선을 밀도있게 배열시킴과 동시에 스테이지 및 단위 자석을 효과적으로 냉각시킬 수도 있다.In addition, a cooling flow path is formed along the area between the plurality of unit magnets to cool the stage, and the unit magnets can be cooled at the same time as the refrigerant flows, thereby preventing a decrease in the magnetic force caused by the temperature rise and providing sufficient magnetic force to the deposition target. Can be provided. In addition, by arranging unit magnets having different thicknesses to form a cooling channel to flow a refrigerant, the magnetic force lines can be densely arranged along the stage, and the stage and unit magnets can be cooled effectively.
즉, 본 발명의 실시 예에 따른 박막 형성장치 및 박막 형성방법에 의하면 고온의 환경으로 형성되는 증착 공정에서 반도체 패키지(11)를 효과적으로 냉각시킴으로써 반도체 패키지(11) 내에 배치되는 반도체 칩이 고온의 열에 의하여 손상되거나 반도체 패키지(11)가 휘어지는 등의 현상이 발생하는 것을 방지할 수 있게 되며, 반도체 패키지(11)의 제조 효율 및 생산 안정성을 향상시킬 수 있다.That is, according to the thin film forming apparatus and the thin film forming method according to an embodiment of the present invention, by cooling the semiconductor package 11 effectively in a deposition process formed in a high temperature environment, the semiconductor chip disposed in the semiconductor package 11 is exposed to high temperature heat. It is possible to prevent a phenomenon such as damage or bending of the semiconductor package 11 to occur, it is possible to improve the manufacturing efficiency and production stability of the semiconductor package 11.
이처럼, 본 발명에서는 전자 부품이 부착되는 압력에 의하여 소성 변형되는 변형 유지층을 포함하여 전자 부품의 적어도 일면을 밀착 고정시킴으로써, 홀 또는 홈을 형성하지 않고도 전자 부품의 전극 부위 등 박막 형성을 원하지 않는 부분을 실링하여 보호할 수 있다. 또한, 전자 부품의 표면 중 박막 형성을 원하지 않는 부분에 희생층을 형성하고 박막 형성공정을 수행한 후에 그 표면 상에 형성된 박막과 함께 희생층을 제거하는 등의 추가적인 공정 없이도 전자 부품을 전자 부품 캐리어 시트에 부착하는 것만으로 박막 형성을 원하지 않는 부분을 실링하여 보호할 수 있다. 이에 박막 형성을 원하지 않는 부분에는 박막이 형성되지 않고 박막 형성을 원하는 부분에만 박막을 형성할 수 있으며, 전자 부품 캐리어 시트를 통해 전자 부품의 표면 중 박막 형성을 원하지 않는 부분을 실링하여 필요에 따라 선택적으로 박막 형성을 원하는 부분에만 박막을 형성할 수 있다. 또한, 전자 부품을 전자 부품 캐리어 시트에 부착하였을 때에 전자 부품과 전자 부품 캐리어 시트 사이에 틈이 발생하는 것을 방지할 수 있다. 이에 따라 박막 형성공정 시에 전자 부품과 전자 부품 캐리어 시트 사이의 틈으로 인해 전자 부품의 전극 부위가 오염되는 것도 방지할 수 있다. 그리고 전자 부품 캐리어 시트에 홀 또는 홈을 형성하지 않음으로써, 제조 공정이 단순해질 수 있고, 전자 부품의 외형에 상관없이 전자 부품을 전자 부품 캐리어 시트에 밀착 고정할 수 있다. 이로 인해 전자 부품의 배치 자유도가 높아질 수 있어 전자 부품을 밀집하여 배치할 수 있으며, 전자 부품이 스퍼터링 등의 박막 형성공정 중에 고온의 열에 의하여 손상 및 파손되는 것을 방지할 수도 있다. 한편, 전자 부품 캐리어 시트에 자성층을 포함하거나, 점착층, 변형 유지층 및 베이스 필름 중 적어도 하나가 자성을 갖도록 함으로써, 전자 부품 캐리어 시트를 박막 형성공정 중에 박막 형성장치의 마그네트 플레이트에 밀착되도록 할 수 있다. 이로 인해 스퍼터링 등의 박막 형성공정 중 전자 부품에 전달된 열이 전자 부품 캐리어 시트와 마그네트 플레이트로 잘 전달되어 박막 형성장치의 냉각 유닛을 통해 효과적으로 냉각될 수 있다. 또한, 전자 부품의 효과적인 냉각에 의하여 전자 부품을 허용 가능한 범위의 온도로 유지시킬 수 있다.As described above, in the present invention, at least one surface of the electronic component is tightly fixed, including a strain holding layer plastically deformed by the pressure to which the electronic component is attached, thereby preventing the formation of a thin film such as an electrode part of the electronic component without forming a hole or a groove. The part can be sealed and protected. In addition, after forming a sacrificial layer on a portion of the surface of the electronic component that is not desired to form a thin film and performing the thin film forming process, the electronic component carrier may be removed without additional processes such as removing the sacrificial layer together with the thin film formed on the surface. Only by adhering to a sheet, the part which does not want thin film formation can be sealed and protected. Accordingly, a thin film may be formed only at a portion where a thin film is not formed at a portion where the thin film is not formed, and a portion of the surface of the electronic component that is not desired to be formed is sealed through the electronic component carrier sheet, thereby selectively selecting the thin film. As a result, the thin film may be formed only at the portion where the thin film is desired. Further, when the electronic component is attached to the electronic component carrier sheet, it is possible to prevent the occurrence of a gap between the electronic component and the electronic component carrier sheet. Accordingly, the electrode portion of the electronic component may be prevented from being contaminated due to a gap between the electronic component and the electronic component carrier sheet during the thin film forming process. By not forming a hole or a groove in the electronic component carrier sheet, the manufacturing process can be simplified, and the electronic component can be closely fixed to the electronic component carrier sheet regardless of the appearance of the electronic component. As a result, the degree of freedom in arranging electronic components may be increased, and electronic components may be densely arranged, and the electronic components may be prevented from being damaged or broken by high temperature heat during a thin film forming process such as sputtering. On the other hand, by including a magnetic layer in the electronic component carrier sheet, or by having at least one of the adhesive layer, the strain holding layer and the base film has a magnetic, the electronic component carrier sheet can be in close contact with the magnet plate of the thin film forming apparatus during the thin film forming process. have. As a result, heat transferred to the electronic component during the thin film forming process such as sputtering may be transferred to the electronic component carrier sheet and the magnet plate to be effectively cooled through the cooling unit of the thin film forming apparatus. In addition, the effective cooling of the electronic component allows the electronic component to be maintained at an acceptable range of temperatures.
상기 설명에서 사용한 “~ 상에”라는 의미는 직접 접촉하는 경우와 직접 접촉하지는 않지만 상부 또는 하부에 대향하여 위치하는 경우를 포함하고, 상부면 또는 하부면 전체에 대향하여 위치하는 것뿐만 아니라 부분적으로 대향하여 위치하는 것도 가능하며, 위치상 떨어져 대향하거나 상부면 또는 하부면에 직접 접촉한다는 의미로 사용하였다. 그리고 각 구성의 수치적 특성들은 상온에서 측정된 값일 수 있다.As used in the above description, the term “on” refers to a case in which the direct contact is not directly contacted but is positioned opposite to the upper or lower part, and is not only positioned opposite to the entire upper or lower part but also partially. It is also possible to be located opposite, and used to mean facing away from the position or in direct contact with the upper or lower surface. And the numerical characteristics of each component may be a value measured at room temperature.
이상에서 본 발명의 바람직한 실시예에 대하여 도시하고 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. 따라서, 본 발명의 기술적 보호범위는 아래의 특허청구범위에 의해서 정하여져야 할 것이다.Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the above-described embodiments, and the general knowledge in the field of the present invention belongs without departing from the gist of the present invention as claimed in the claims. Those skilled in the art will appreciate that various modifications and equivalent other embodiments are possible therefrom. Therefore, the technical protection scope of the present invention will be defined by the claims below.

Claims (45)

  1. 전자 부품이 일면에 부착되는 점착층; 및An adhesive layer to which the electronic component is attached to one surface; And
    상기 점착층의 일면과 대향하는 타면 상에 제공되며, 상기 전자 부품이 부착되는 압력에 의하여 소성 변형되는 변형 유지층;을 포함하는 전자 부품 캐리어 시트.And a strain-retaining layer provided on the other surface of the adhesive layer opposite to the one surface and plastically deformed by the pressure to which the electronic component is attached.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 점착층은 5 내지 100 ㎛의 두께를 갖는 전자 부품 캐리어 시트.The adhesive layer is an electronic component carrier sheet having a thickness of 5 to 100 ㎛.
  3. 청구항 1에 있어서,The method according to claim 1,
    상기 점착층은 200 내지 1,500 gf/in의 점착력을 갖는 전자 부품 캐리어 시트.The adhesive layer is an electronic component carrier sheet having an adhesive force of 200 to 1,500 gf / in.
  4. 청구항 1에 있어서,The method according to claim 1,
    상기 변형 유지층은 금속 필름으로 이루어지는 전자 부품 캐리어 시트.The strain holding layer is an electronic component carrier sheet made of a metal film.
  5. 청구항 1에 있어서,The method according to claim 1,
    상기 변형 유지층은 3 내지 60 ㎛의 두께를 갖는 전자 부품 캐리어 시트.The strain holding layer is an electronic component carrier sheet having a thickness of 3 to 60 μm.
  6. 청구항 1에 있어서,The method according to claim 1,
    상기 변형 유지층은 10 내지 80 %의 연신율을 갖는 전자 부품 캐리어 시트.The strain holding layer is an electronic component carrier sheet having an elongation of 10 to 80%.
  7. 청구항 1에 있어서,The method according to claim 1,
    상기 변형 유지층은 상온에서 200 내지 450 W/m·K의 열전도율을 갖는 전자 부품 캐리어 시트.The strain holding layer is an electronic component carrier sheet having a thermal conductivity of 200 to 450 W / m · K at room temperature.
  8. 청구항 1에 있어서,The method according to claim 1,
    상기 점착층을 향하는 상기 변형 유지층의 일면과 대향하는 타면 상에 제공되는 자성층;을 더 포함하는 전자 부품 캐리어 시트.And a magnetic layer provided on the other surface opposite to one surface of the strain holding layer facing the adhesive layer.
  9. 청구항 8에 있어서,The method according to claim 8,
    상기 자성층은 바인더 수지에 자성체 분말이 분산되어 형성되는 전자 부품 캐리어 시트.The magnetic layer is an electronic component carrier sheet formed by dispersing magnetic powder in binder resin.
  10. 청구항 9에 있어서,The method according to claim 9,
    상기 자성체 분말은 상기 자성층의 전체 중량에 대하여 30 내지 90 중량%로 함유되는 전자 부품 캐리어 시트.The magnetic component powder is contained in the electronic component carrier sheet 30 to 90% by weight based on the total weight of the magnetic layer.
  11. 청구항 9에 있어서,The method according to claim 9,
    상기 자성체 분말은 0.1 내지 30 ㎛의 평균 입도를 갖는 전자 부품 캐리어 시트.The magnetic powder is an electronic component carrier sheet having an average particle size of 0.1 to 30 ㎛.
  12. 청구항 8에 있어서,The method according to claim 8,
    상기 자성층은 10 내지 500 ㎛의 두께를 갖는 전자 부품 캐리어 시트.The magnetic layer has an electronic component carrier sheet having a thickness of 10 to 500 ㎛.
  13. 청구항 1에 있어서,The method according to claim 1,
    상기 점착층을 향하는 상기 변형 유지층의 일면과 대향하는 타면 상에 제공되어, 상기 변형 유지층을 지지하는 베이스 필름;을 더 포함하는 전자 부품 캐리어 시트.And a base film provided on the other surface opposite to one surface of the strain holding layer facing the adhesive layer to support the strain holding layer.
  14. 청구항 13에 있어서,The method according to claim 13,
    상기 베이스 필름의 복원력은 상기 변형 유지층의 소성 변형이 가능한 항복값 이하인 전자 부품 캐리어 시트.The restoring force of the said base film is the electronic component carrier sheet | seat below the yield value which can plastically deform the said strain holding layer.
  15. 청구항 1에 있어서,The method according to claim 1,
    상기 점착층 및 상기 변형 유지층 중 적어도 어느 하나는 자성을 갖는 전자 부품 캐리어 시트.At least one of the adhesion layer and the strain holding layer has an electronic component carrier sheet.
  16. 청구항 13에 있어서,The method according to claim 13,
    상기 베이스 필름은 합성수지 소재로 이루어지며, 자성체 분말을 함유하는 전자 부품 캐리어 시트.The base film is made of a synthetic resin material, the electronic component carrier sheet containing a magnetic powder.
  17. 청구항 1에 있어서,The method according to claim 1,
    상기 전자 부품 캐리어 시트는 10 내지 80 %의 연신율을 갖는 전자 부품 캐리어 시트.The electronic component carrier sheet has an elongation of 10 to 80%.
  18. 청구항 1에 있어서,The method according to claim 1,
    상기 전자 부품 캐리어 시트는 25 내지 250 N/㎟의 인장 강도를 갖는 전자 부품 캐리어 시트.The electronic component carrier sheet has an electronic component carrier sheet having a tensile strength of 25 to 250 N / mm2.
  19. 점착 시트가 지지되는 지지 프레임;A support frame on which the adhesive sheet is supported;
    상기 점착 시트의 제1 면 상에 제공되는 피점착물과 상기 점착 시트 중 적어도 하나에 압력을 부가하는 가압부; 및A pressurizing portion for applying pressure to at least one of the adherend and the pressure-sensitive adhesive sheet provided on the first surface of the pressure-sensitive adhesive sheet; And
    상기 점착 시트의 제1 면 방향에 배치되어 상기 압력의 부가 시에 상기 피점착물이 지지되는 지지면을 제공하는 제1 플레이트;를 포함하는 점착 장치.And a first plate disposed in a direction of the first surface of the adhesive sheet and providing a support surface on which the adherend is supported upon the addition of the pressure.
  20. 청구항 19에 있어서,The method according to claim 19,
    상기 제1 플레이트와 상기 지지 프레임의 사이에 제공되는 제1 패킹부재;를 더 포함하고,Further comprising: a first packing member provided between the first plate and the support frame,
    상기 가압부는,The pressing unit,
    상기 제1 플레이트, 상기 지지 프레임 및 상기 제1 패킹부재에 의해 정의되는 공간에 부압을 형성하는 제1 기압 형성부를 포함하는 점착 장치.And a first air pressure forming portion for forming a negative pressure in a space defined by the first plate, the support frame, and the first packing member.
  21. 청구항 20에 있어서,The method of claim 20,
    상기 제1 면과 대향하는 상기 점착 시트의 제2 면 방향에 상기 제1 플레이트와 대향하여 제공되는 제2 플레이트; 및A second plate provided to face the first plate in a second surface direction of the pressure-sensitive adhesive sheet facing the first surface; And
    상기 제1 플레이트와 상기 제2 플레이트의 간격을 조절하는 간격조절부;를 더 포함하는 점착 장치.The adhesive device further comprises; a gap adjusting unit for adjusting the distance between the first plate and the second plate.
  22. 청구항 21에 있어서,The method according to claim 21,
    상기 제2 플레이트와 상기 지지 프레임의 사이에 제공되는 제2 패킹부재;를 더 포함하고,And a second packing member provided between the second plate and the support frame.
    상기 가압부는,The pressing unit,
    상기 제2 플레이트, 상기 지지 프레임 및 상기 제2 패킹부재에 의해 정의되는 공간에 정압을 형성하는 제2 기압 형성부를 더 포함하는 점착 장치.And a second air pressure forming unit for forming a positive pressure in a space defined by the second plate, the support frame, and the second packing member.
  23. 청구항 21에 있어서,The method according to claim 21,
    상기 제1 플레이트와 상기 제2 플레이트 중 어느 하나의 가장자리에 나머지 하나를 향하여 연장되어 내측으로 절곡되며, 상기 지지 프레임을 지지하는 지지편;을 더 포함하고,A support piece extending toward the other one of the edges of one of the first plate and the second plate and bent inward and supporting the support frame;
    상기 나머지 하나에는 상기 지지편에 대응되어 삽입홈이 형성되며,The other one is formed with an insertion groove corresponding to the support piece,
    상기 지지 프레임은 상기 제1 플레이트와 상기 제2 플레이트의 간격 조절에 의해 상기 지지편과 상기 나머지 하나 간에 전달되는 점착 장치.And the support frame is transferred between the support piece and the other one by adjusting a gap between the first plate and the second plate.
  24. 청구항 19에 있어서,The method according to claim 19,
    상기 피점착물을 수용 가능한 패턴홀이 형성되며, 상기 점착 시트의 제1 면과 상기 제1 플레이트의 사이에 제공되는 패턴 플레이트;를 더 포함하는 점착 장치.And a pattern plate having a pattern hole to accommodate the adherend, and a pattern plate provided between the first surface of the pressure sensitive adhesive sheet and the first plate.
  25. 청구항 24에 있어서,The method of claim 24,
    상기 패턴 플레이트는 상기 피점착물보다 얇은 두께를 갖는 점착 장치.And the pattern plate has a thickness thinner than that of the adherend.
  26. 청구항 19에 있어서,The method according to claim 19,
    상기 피점착물은 일면에 적어도 하나의 돌출 단자를 포함하는 반도체 패키지이고,The adherend is a semiconductor package including at least one protruding terminal on one surface thereof,
    상기 점착 시트는,The adhesive sheet,
    그 일면에 상기 돌출 단자가 접촉되도록 상기 반도체 패키지가 부착되는 점착층; 및An adhesive layer to which the semiconductor package is attached such that the protruding terminal contacts one surface thereof; And
    상기 점착층의 일면과 대향하는 타면 상에 제공되며, 상기 압력에 의하여 상기 돌출 단자를 따라 소성 변형하는 변형 유지층을 포함하는 전자 부품 캐리어 시트인 점착 장치.And an electronic component carrier sheet provided on the other surface opposite to one surface of the adhesive layer and including a strain holding layer plastically deformed along the protruding terminal by the pressure.
  27. 청구항 26에 있어서,The method of claim 26,
    상기 압력은 상기 변형 유지층의 소성 변형이 가능한 항복값 이상인 점착 장치.The pressure-sensitive adhesive device wherein the pressure is equal to or more than a yield value at which plastic deformation of the strain holding layer is possible.
  28. 청구항 19에 있어서,The method according to claim 19,
    상기 가압부는,The pressing unit,
    상기 제1 면과 대향하는 상기 점착 시트의 제2 면 방향에 제공되며, 상기 점착 시트의 제2 면을 가압하는 연성 재질 또는 브러쉬 형태의 롤러를 포함하는 점착 장치.A pressure-sensitive adhesive device comprising a roller in the form of a soft material or a brush provided in the direction of the second surface of the pressure-sensitive adhesive sheet facing the first surface, and pressing the second surface of the pressure-sensitive adhesive sheet.
  29. 자성을 갖는 층이 구비된 점착 시트를 포함하는 증착 대상물에 박막을 형성하기 위한 증착 물질을 제공하는 증착물질 제공부; 및A deposition material providing unit providing a deposition material for forming a thin film on a deposition target including an adhesive sheet having a magnetic layer; And
    상기 증착 대상물을 지지하는 서셉터;를 포함하고,And a susceptor for supporting the deposition object.
    상기 서셉터는,The susceptor,
    상기 점착 시트에 대하여 인력을 제공하는 마그네트 플레이트; 및A magnet plate providing an attractive force to the adhesive sheet; And
    상기 점착 시트를 냉각시키는 냉각 유닛을 포함하는 박막 형성장치.Thin film forming apparatus comprising a cooling unit for cooling the adhesive sheet.
  30. 청구항 29에 있어서,The method of claim 29,
    상기 마그네트 플레이트는,The magnet plate,
    상기 증착 대상물을 지지하는 스테이지; 및A stage supporting the deposition object; And
    상기 스테이지에 설치되고, 상기 스테이지를 따라 배열되는 복수 개의 단위 자석을 포함하는 자석체층;을 포함하고,And a magnet body layer disposed on the stage and including a plurality of unit magnets arranged along the stage.
    상기 냉각 유닛은 상기 스테이지의 내부에 형성되어, 상기 증착 대상물을 냉각시키기 위한 냉매의 유동 경로를 제공하는 냉각 유로;를 포함하는 박막 형성장치.And the cooling unit is formed inside the stage and provides a flow path of a refrigerant for cooling the deposition object.
  31. 청구항 30에 있어서,The method of claim 30,
    상기 복수 개의 단위 자석은 상기 스테이지를 따라 인접한 단위 자석 간의 극성이 서로 교차하도록 배열되는 박막 형성장치.And the plurality of unit magnets are arranged along the stage such that polarities between adjacent unit magnets cross each other.
  32. 청구항 30에 있어서,The method of claim 30,
    상기 서셉터는,The susceptor,
    상기 스테이지 상에 제공되는 제1 열전 시트;를 더 포함하고,A first thermoelectric sheet provided on the stage;
    상기 제1 열전 시트는 탄성을 가지는 물질로 형성되는 박막 형성장치.And the first thermoelectric sheet is formed of a material having elasticity.
  33. 청구항 32에 있어서,The method according to claim 32,
    상기 자석체층은 상기 제1 열전 시트와 스테이지 사이에 설치되고,The magnet body layer is provided between the first thermoelectric sheet and the stage,
    상기 서셉터는,The susceptor,
    상기 자석체층과 스테이지 사이에 제공되어 탄성을 가지는 물질로 형성되는 제2 열전 시트;를 더 포함하는 박막 형성장치.And a second thermoelectric sheet provided between the magnet body layer and the stage and formed of an elastic material.
  34. 청구항 30에 있어서,The method of claim 30,
    상기 스테이지는 중공형의 내부 공간을 가지며,The stage has a hollow inner space,
    상기 자석체층은 상기 복수 개의 단위 자석이 인접한 단위 자석에 대하여 각각 소정 간격으로 이격 배열되도록 상기 스테이지의 내부 공간에 설치되는 박막 형성장치.The magnet body layer is a thin film forming apparatus is installed in the interior space of the stage so that the plurality of unit magnets are arranged at a predetermined interval with respect to adjacent unit magnets, respectively.
  35. 청구항 34에 있어서,The method of claim 34, wherein
    상기 냉각 유로는,The cooling passage,
    상기 복수 개의 단위 자석 사이의 이격 공간을 따라 제공되는 제1 냉각 유로;를 포함하는 박막 형성장치.And a first cooling passage provided along the spaced space between the plurality of unit magnets.
  36. 청구항 35에 있어서,The method of claim 35, wherein
    상기 냉각 유로는,The cooling passage,
    상기 자석체층의 하부에 형성되는 제2 냉각 유로;를 더 포함하고,And a second cooling passage formed under the magnet body layer.
    상기 제1 냉각 유로와 제2 냉각 유로는 서로 연통되는 박막 형성장치.And the first cooling channel and the second cooling channel communicate with each other.
  37. 청구항 36에 있어서,The method of claim 36,
    상기 제2 냉각 유로는 상기 제2 냉각 유로에 각각 연결되는 냉매 유입구 및 냉매 배출구 사이에서 선형으로 연장되어 냉매를 순환시키고,The second cooling channel extends linearly between the refrigerant inlet port and the refrigerant outlet port respectively connected to the second cooling channel to circulate the refrigerant,
    상기 제1 냉각 유로는 상기 제2 냉각 유로로부터 공급되는 냉매를 상기 복수 개의 단위 자석 사이에서 확산시키도록 방사형으로 형성되는 박막 형성장치.And the first cooling channel is radially formed to diffuse the refrigerant supplied from the second cooling channel between the plurality of unit magnets.
  38. 청구항 34에 있어서,The method of claim 34, wherein
    상기 자석체층은,The magnet body layer,
    상기 복수 개의 단위 자석 사이에 각각 배치되어, 인접한 단위 자석 간의 간격을 각각 유지시키는 간격 유지 부재;를 더 포함하는 박막 형성장치.And a spacing member disposed between the plurality of unit magnets to respectively maintain a spacing between adjacent unit magnets.
  39. 청구항 30에 있어서,The method of claim 30,
    상기 스테이지는 중공형의 내부 공간을 가지며,The stage has a hollow inner space,
    상기 복수 개의 단위 자석은, 소정 두께를 가지는 복수 개의 제1 단위 자석; 및 상기 제1 단위 자석보다 얇은 두께를 가지는 복수 개의 제2 단위 자석;을 포함하고,The plurality of unit magnets may include a plurality of first unit magnets having a predetermined thickness; And a plurality of second unit magnets having a thickness thinner than that of the first unit magnet.
    상기 자석체층은 상기 복수 개의 제2 단위 자석이 상기 복수 개의 제1 단위 자석 사이에 배열되도록 상기 스테이지의 내부 공간에 설치되고,The magnet body layer is provided in an internal space of the stage such that the plurality of second unit magnets are arranged between the plurality of first unit magnets,
    상기 냉각 유로는 상기 복수 개의 제2 단위 자석의 두께 방향의 공간을 따라 제공되는 박막 형성장치.And the cooling passage is provided along a space in a thickness direction of the plurality of second unit magnets.
  40. 청구항 34에 있어서,The method of claim 34, wherein
    상기 냉각 유로는 상기 복수 개의 단위 자석 중 적어도 일부의 단위 자석과 냉매가 직접 접촉되도록 제공되는 박막 형성장치.And the cooling passage is provided such that the unit magnets of at least some of the plurality of unit magnets are in direct contact with the refrigerant.
  41. 청구항 40에 있어서,The method of claim 40,
    상기 복수 개의 단위 자석의 표면에는 냉매와의 접촉에 따른 부식을 방지하기 위한 부식 방지층이 형성되는 박막 형성장치.The thin film forming apparatus is formed on the surface of the plurality of unit magnets a corrosion protection layer for preventing corrosion due to contact with the refrigerant.
  42. 청구항 41에 있어서,The method of claim 41,
    상기 부식 방지층은 자성을 가지는 물질로 형성되는 박막 형성장치.The corrosion preventing layer is a thin film forming apparatus formed of a magnetic material.
  43. 청구항 34에 있어서,The method of claim 34, wherein
    상기 자석체층은,The magnet body layer,
    상기 스테이지의 내부 공간의 상면에 배치되어, 상기 복수 개의 단위 자석을 고정시키는 자성판;을 더 포함하는 박막 형성장치.And a magnetic plate disposed on an upper surface of the inner space of the stage to fix the plurality of unit magnets.
  44. 청구항 30에 있어서,The method of claim 30,
    상기 스테이지의 상면은 볼록면, 오목면 및 굴곡면 중 어느 하나로 형성되는 박막 형성장치.The upper surface of the stage is formed of any one of convex surface, concave surface and curved surface thin film forming apparatus.
  45. 청구항 29에 있어서,The method of claim 29,
    상기 점착 시트는 전자 부품 캐리어 시트이며,The adhesive sheet is an electronic component carrier sheet,
    상기 증착 대상물은 상기 전자 부품 캐리어 시트 상에 부착되는 전자 부품을 더 포함하고,The deposition object further includes an electronic component attached to the electronic component carrier sheet,
    상기 박막 형성장치는 상기 전자 부품의 노출된 표면에 상기 박막을 형성하는 박막 형성장치.And the thin film forming apparatus forms the thin film on an exposed surface of the electronic component.
PCT/KR2018/004137 2017-04-25 2018-04-09 Electronic component carrier sheet, and adhesion device and thin film forming apparatus using same WO2018199507A1 (en)

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KR1020180023865A KR102102312B1 (en) 2018-02-27 2018-02-27 Laminating apparatus and laminating method
KR10-2018-0023865 2018-02-27
KR1020180028109A KR102088356B1 (en) 2018-03-09 2018-03-09 Thin film deposition apparatus and thin film deposition method
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KR1020180040095A KR102019943B1 (en) 2017-04-25 2018-04-06 Carrier sheet for electronic component and apparatus for thin film formation using the same
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