WO2018196402A1 - 封装装置及显示面板封装方法 - Google Patents

封装装置及显示面板封装方法 Download PDF

Info

Publication number
WO2018196402A1
WO2018196402A1 PCT/CN2017/116454 CN2017116454W WO2018196402A1 WO 2018196402 A1 WO2018196402 A1 WO 2018196402A1 CN 2017116454 W CN2017116454 W CN 2017116454W WO 2018196402 A1 WO2018196402 A1 WO 2018196402A1
Authority
WO
WIPO (PCT)
Prior art keywords
guide wire
rotary table
packaged
container
display panel
Prior art date
Application number
PCT/CN2017/116454
Other languages
English (en)
French (fr)
Inventor
蒋志亮
周桢力
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/075,251 priority Critical patent/US11101452B2/en
Publication of WO2018196402A1 publication Critical patent/WO2018196402A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations

Definitions

  • the present application relates to the field of displays, and in particular, to a packaging device and a display panel packaging method.
  • OLED organic light-emitting display
  • LCD liquid crystal display
  • an OLED device package is performed together with a glass frit and ultraviolet light (Ultraviolet Rays, UV for short).
  • the OLED device is first packaged with glass frit, and the UV adhesive is packaged after the glass frit is completed.
  • the specific process of the UV adhesive package is as follows (taking a square OLED device as an example): fixing the OLED device on the tool to make the OLED The device is coated with either side of the glass material facing the UV glue distribution device located above the tooling; the UV glue distribution device drops the UV glue onto the glass material of the OLED device, and each side of the OLED device is filled, and the UV glue is fully filled into the glass.
  • the OLED device is removed and rotated 90 degrees and then re-fixed. The foregoing steps are repeated until all the four sides of the OLED device are filled with UV glue; the UV glue is irradiated with ultraviolet light to cure, and the package is completed.
  • the above method of dropping the UV glue still has room for improvement in the shape range of the OLED device and the uniformity of coating.
  • the present application provides a packaging device and a display panel packaging method.
  • the technical solution is as follows:
  • At least one embodiment of the present application provides a package device, the device comprising:
  • a guide wire a guide wire, a container for carrying the encapsulant, a rotary table for placing the device to be packaged, and a winding device for driving the movement of the guide wire, the guide wire being mounted on the winding device, A portion of the guide wire is used to be immersed in the encapsulant such that the guide wire to which the encapsulant is attached passes through the rotary table.
  • the winding device includes at least two rotating members, two ends of the guiding wire are connected to each other, and the guiding wire is used for the at least two rotating members.
  • the lower movement is driven, and the container is disposed on the movement path of the guide wire.
  • the rotating table is disposed on a moving path of the guiding line.
  • the apparatus further includes a recycling unit for recovering the encapsulant on the guiding line, and the recycling unit is disposed on a moving path of the guiding line.
  • the recovery unit includes a tank body and two rollers disposed in parallel, and the guide wire is sandwiched between the two rollers, the two rollers The rotation axis of the wheel is perpendicular to the direction of movement of the guide wire as it passes through the recovery unit, and the two rollers are located above the groove body.
  • the at least two rotating members include at least one rotating wheel and at least one guiding wheel, wherein the rotating wheel is used for rotating under the driving of the power unit, and the guiding wheel is used for the guiding wheel Rotating under the guidance of the guide line.
  • the inside of the container is provided with a pulley, and the guide wire bypasses the pulley.
  • the pulley is disposed on a bottom of the container.
  • two sidewalls are oppositely disposed on a sidewall of the container, and the guiding line sequentially passes through one of the two through holes, the pulley, and the The other through hole in the two through holes.
  • the height of the through hole is higher than the liquid level of the encapsulant.
  • the pulley is disposed on a bottom of the container, and a distance of the pulley to a bottom of the container is smaller than a distance of the through hole to a bottom of the container.
  • the guiding line is a wire.
  • the guiding line is a circular line or a flat line.
  • the guiding line when the guiding line is a circular line, the guiding The diameter of the wire is about 0.5 mm; when the guide wire is a flat wire, the width of the guide wire is about 0.5 mm.
  • the apparatus further includes a control unit, and the control unit is configured to control the rotation of the rotary table.
  • control unit is configured to control the rotating table to rotate at a constant speed when the device to be packaged is circular;
  • the rotary table is controlled to rotate intermittently and rotated 90 degrees each time.
  • control unit is further configured to control movement of the winding device to control movement of the guiding line.
  • At least one embodiment of the present application further provides a display panel packaging method, which is implemented by the packaging device according to any one of the first aspects, the method comprising:
  • the display panel to be packaged is placed on the rotary table, and the display panel to be packaged is in contact with the guide line;
  • the display panel to be packaged coated with the encapsulant is treated to cure the encapsulant.
  • controlling the rotation of the rotary table comprises:
  • the rotating table is controlled to rotate at a constant speed
  • the rotary table is controlled to rotate intermittently and rotated 90 degrees each time.
  • the display panel is an organic electroluminescent display panel.
  • FIG. 1 is a schematic structural diagram of a packaging device according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of another packaging device according to an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of another packaging device according to an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of another packaging device according to an embodiment of the present application.
  • FIG. 5 is a flowchart of a method for packaging a display panel according to an embodiment of the present application.
  • the packaging device includes:
  • a guide wire 10 a container 20 for carrying the encapsulant, a rotary table 30 for placing the device 31 to be packaged, and a winding device 40 for driving the movement of the guide wire 10, the guide wire 10 being mounted on the winding device 40,
  • a portion of the guide wire 10 is used to be immersed in the encapsulant 21 so as to pass through the rotary table 30 when the guide wire 10 to which the encapsulant is attached is moved.
  • the packaging device provided by the embodiment of the present application is mainly used for packaging of an OLED device, and may of course be applied to packaging of other devices, that is, the device to be packaged 31 may be an OLED device or other device to be packaged, and the OLED device to be packaged later is used.
  • the package rubber in the container can be replaced with other colloids or liquids according to actual needs.
  • the OLED device to be packaged is disposed on the rotary table, and the guide wire is in contact with the OLED device, and the specific guide wire is in contact with the glass frit of the OLED device to be packaged, when rotating
  • the table rotates and the guide wire moves a part of the guide wire will not enter the encapsulant, and the guide wire will pass through the container carrying the encapsulant during the movement, and the guide wire will adhere to the encapsulant carried in the container after the guide wire passes through the container, when attached
  • the encapsulant is applied to the frit and filled (creep) by the surface tension of the frit; and under the surface tension of the frit, the guide wire and the glass
  • the amount of glue between the materials reaches a state of dynamic balance, achieving uniform coating of the encapsulant, thereby improving the mechanical strength and sealing performance of the packaging of the OLED device.
  • the circular OLED device is placed on a rotary table to complete the package, that is, the package is suitable for a circular OLED device, and of course, it can also be applied to other OLED devices with curved surfaces such as an elliptical OLED device.
  • the encapsulant carried in the container 20 may be a UV glue.
  • an encapsulant 21 is provided in the container 20.
  • a portion of the guide wire 10 is used to be immersed in the encapsulant 21, and another portion of the guide wire 10 is located above the rotary table 30 when the package device is in operation.
  • another portion of the guide wire 10 may also be located at the side or other location of the rotary table 30 as long as the guide wire 10 is capable of contacting the frit of the OLED device to be packaged placed on the rotary table 30.
  • the shape and size relationship between the rotary table 30 and the OLED device to be packaged is different, and the position at which the guide wire 10 is located may be different.
  • the upper surface area of the rotary table 30 is large, and the OLED device to be packaged is disposed at the center of the upper surface of the rotary table 30. At this time, another portion of the guide wire 10 is located directly above the rotary table 30.
  • the sides of the rotating table 30 can be in contact with the frit of the OLED device to be packaged.
  • the winding device 40 may include at least two rotating members 41.
  • the rotating axes of the rotating members 41 are parallel to each other, the two ends of the guiding wire 10 are connected to each other, and the guiding wire 10 is wound around at least two rotations.
  • the guide wire 10 is moved by the winding device 40.
  • the winding wire is formed by winding the wire by means of at least two rotating members, and by controlling the rotation of the rotating member 41, the guiding wire can be rotated cyclically without setting the guiding wire too long, and at the same time facilitating the control of the guiding wire.
  • the inside of the container 20 is provided with a pulley 22, and the guide wire 10 is passed around the pulley 22 to facilitate the direction in which the guide wire 10 enters and exits the container 20, ensuring that the guide wire can carry away the encapsulant from the container 20.
  • the pulley 22 is a fixed pulley fixed in the container 20, and the rotating shaft of the pulley is parallel to the rotating shaft of the rotating member.
  • the guide wire 10 can bypass the pulley 22 from below the pulley 22 while the pulley 22 is in contact with the encapsulant, ensuring that the guide wire 10 is fully in contact with the encapsulant and can be mated with the pulley for smooth access to the container.
  • the pulley 22 can be disposed on the bottom of the container 20 to ensure that the guide wire 10 is in full contact with the encapsulant in the container 20.
  • the container 20 may have various shapes such as a cylindrical shape, a rectangular parallelepiped, etc., and the container may be made of various materials such as plastic, glass, wood, metal, and the like.
  • At least two rotating members may all be rotating wheels.
  • the rotating wheel is used to rotate under the drive of a power unit such as a motor.
  • the device includes five rotating wheels 41A.
  • the winding device 40 includes two or more rotating wheels, the linear velocities of the two or more rotating wheels are the same, thereby ensuring smooth movement of the guide wire.
  • the at least two rotating members include at least one rotating wheel and at least one guiding wheel.
  • the guide wheel is used to rotate under the guidance of the guide wire, that is, the guide wheel is not driven by the power unit, and plays a guiding role. For details, refer to the description of FIG. 2 to FIG. 4 later.
  • FIG. 2 is a schematic structural view of another packaging device according to an embodiment of the present application.
  • the device is different from the packaging device provided in FIG. 1 in that the winding device 40 includes two rotating wheels 41A and two guiding directions.
  • the wheel 41B one of which is disposed between the two rotating wheels 41A, the other of which is disposed on one side of one of the rotating wheels 41A, and the other of which is disposed in a triangular shape with the two rotating wheels 41A.
  • the guide wire 10 is wound around the two rotating wheels 41A and the two guide wheels 41B, and the guide wire is used for moving on the two rotating wheels 41A and the two guide wheels 41B, and the container 20 and the rotary table 30 are disposed on the guide line 10 on the path of motion.
  • the container 20 and the rotary table 30 are each disposed between the two rotating wheels 41A, and the container 20 and the rotary table 30 are sequentially arranged in the moving direction of the guide line.
  • the container 20 is disposed between a rotating wheel 41A and one of the guide wheels 41B
  • the rotary table 30 is disposed between one of the guide wheels 41B and the other of the rotating wheels 41A.
  • the winding device 40 includes only two rotating wheels 41A, has a simple structure, good power performance, small occupied volume, and can meet winding requirements.
  • the rotary table 30 is disposed on the movement path of the guide wire 10, and the OLED device can be packaged without moving the position of the rotary table 30 during operation.
  • FIG. 3 is a schematic structural view of another packaging device according to an embodiment of the present application.
  • the device is different from the packaging device provided in FIG. 2 in that two sidewalls 23 are oppositely disposed on a side wall of the container 20 for guiding.
  • the wire 10 sequentially passes through one of the through holes 23 of the two through holes 23, the pulley 22, and the other through hole 23 of the two through holes 23.
  • Two through holes are formed in the side wall of the container to prevent the guide wire from entering and leaving the container from the container mouth (as shown in FIG. 2, that is, the guide wire enters and exits from the container mouth), the inclination of the guide line is large, and the package glue on the guide line is caused.
  • the height of the through hole is higher than the liquid level of the encapsulant, and the encapsulation glue is prevented from flowing out of the through hole.
  • the pulley 22 is disposed on the bottom of the container 20, and the distance from the pulley 22 to the bottom 20 of the container is smaller than the distance from the through hole 23 to the bottom of the container 20, thereby ensuring that the guide wire 10 is in the container 20. In full contact with the encapsulant.
  • the height of the two through holes 23 (that is, the distance between the through holes and the bottom of the container) is the same, on the one hand, the design of the container is facilitated, and on the other hand, the arrangement of the winding device, that is, the guide wire, is facilitated.
  • FIG. 4 is a schematic structural diagram of another packaging device according to an embodiment of the present application.
  • the device is different from the packaging device provided in FIG. 3 in that the device further includes an encapsulant 21 for recovering the guiding wire 10.
  • the recovery unit 50 and the recovery unit 50 are disposed on the movement path of the guide wire 10. By setting The recycling unit 50 recovers excess glue on the guide line for reuse.
  • the rotary table 30 may be disposed between the container 20 and the recovery unit 50 to recover the encapsulant that has just passed through the rotary table 30 and has not been used.
  • the recovery unit 50 includes a tank body 51 and two rollers 52 arranged in parallel, and the guide wire 10 is sandwiched between the two rollers 52, and the axial directions of the rotation shafts of the two rollers 52 are guided.
  • the direction of movement of the line 10 as it passes through the recovery unit 50 is perpendicular, and the two rollers 52 are located above the tank 51.
  • the two rollers 52 perform relative movement during the movement of the wire. When the wire passes, the two rollers press the wire to recover excess glue on the wire for reuse.
  • the recycling unit has a simple structure and can ensure the recovery of the encapsulant.
  • the guide wire 10 is a wire, and the wire is used as a guide wire, which can achieve adhesion of the sealing glue, and the effect is good.
  • the guide wire 10 may be a circular wire having a diameter of about 0.5 mm.
  • the guide wire 10 may be a flat wire having a width of about 0.5 mm.
  • the distance between the substrate and the cover plate is about 5 ⁇ m, that is, the height of the glass frit is 5 ⁇ m, and the diameter or width of the guide wire 10 is larger than the height of the glass frit of the OLED device, so that the encapsulant on the guide wire can cover the glass. Material to meet packaging needs. Since the diameter or width of the guide wire 10 is greater than the height of the glass frit of the OLED device, the actual application of the adhesive will be applied to the substrate and the cover, which needs to be removed in a subsequent step.
  • the coating thickness of the encapsulant may be about 0.15 mm, and the amount of the encapsulant of one OLED device is 5 ⁇ m*0.15 mm*, and the circumference of the OLED device is taken as an example.
  • the package adhesive can correspond to 20,000 OLED devices.
  • the device may further include a filter for filtering the guide wire.
  • the filter device of the upper part of the encapsulant the filter device may be disposed between the rotary table and the container, or may be disposed on the side wall of the container.
  • the filter device includes a filter plate vertically disposed between the rotary table and the container, the filter plate is provided with a filter hole, and the guide wire passes through the filter hole to thereby scrape a part of the package on the guide wire. Further, a groove is provided at the bottom of the filter plate to recover the encapsulant.
  • the other one of the two through holes 23 on the side wall of the container 20 can also be designed as a filter hole (the filter device only includes the filter hole).
  • the filter hole can be tilted upwards. So that the encapsulant scraped off by the filter hole can be returned to the container.
  • a brush with a hole extending around the center can be arranged in the filter hole, on the one hand, the package glue can be partially scraped off, and on the other hand, the line is not scratched.
  • the device further includes a control unit for controlling the rotation of the rotary table 30 to ensure normal operation of the package device.
  • control unit is configured to control the rotating table 30 to rotate at a constant speed when the OLED device to be packaged is circular; when the OLED device to be packaged is square, the rotary table 30 is controlled to rotate intermittently and each time 90 degrees, to ensure that the package can be applied to different shapes of OLED devices.
  • control unit is further configured to control the movement of the winding device to control the movement of the guide wire.
  • control unit is also used to control the rotational speed of the rotating member to control the speed of the guide wire.
  • control unit is also used to control the power unit that drives the rotating wheel to achieve rotational speed control of the rotating member.
  • the rotation speed of the rotating member, the speed of the rotating table or the intermittent time can be designed according to the coating condition of the actual sealing glue to ensure that the coating amount of the sealing glue is moderate.
  • the rotary table 30 is a movable rotary table, and the movable rotary table can be moved away from or close to the guide line by movement, and when the package of the OLED device is performed, by rotating the rotary table 30
  • the guide line is in contact with the OLED device to be packaged.
  • the movable rotary table can also place different sizes of OLED devices on the rotary table, and different sizes of OLED devices placed on the rotary table can be in contact with the guide lines without causing the OLED device to guide the lines.
  • the pressure is too big.
  • the rotary table is a movable rotary table
  • the control unit controls the rotary table to intermittently rotate, during the interval, the rotary table can also be controlled to be away from the guide line, thereby avoiding the square OLED device to be packaged under When the guide wire is pressed at the corner at the time of one rotation, the guide wire is worn or even broken.
  • FIG. 5 is a flowchart of a method for packaging a display panel according to an embodiment of the present disclosure, which is implemented by using a package device shown in any of FIG. 1-4. Referring to FIG. 5, the method includes:
  • Step 201 Place the display panel to be packaged on the rotary table, and make the display panel to be packaged in contact with the guide line.
  • the display panel is an OLED display panel.
  • the frit of the OLED display panel to be packaged is in contact with the guide line.
  • Step 202 Control the rotation of the rotary table while controlling the movement of the guide wire to apply the encapsulant to the display panel to be packaged.
  • the encapsulant is applied to the frit of the OLED display panel to be packaged.
  • controlling the rotation of the rotary table includes:
  • the rotary table When the display panel to be packaged is circular, the rotary table is controlled to rotate at a constant speed; when the display panel to be packaged is square, the rotary table is controlled to rotate intermittently, and each rotation is 90 degrees. It is guaranteed to be able to adapt to different shapes of display panels.
  • the embodiment of the present application controls the speed of the guide wire by controlling the rotational speed of the rotating member.
  • the control unit is also used to control the power unit that drives the turn to the wheel to effect rotational speed control of the rotating member.
  • the rotation speed of the rotating member, the speed of the rotating table or the intermittent time can be designed according to the coating condition of the actual sealing glue to ensure that the coating amount of the sealing glue is moderate.
  • the rotating table when the rotary table is controlled to intermittently rotate, during the interval, the rotating table can also be controlled to be away from the guiding line, thereby preventing the square OLED device to be packaged from squeezing the guiding line at the corner at the next rotation, thereby causing the guiding line to occur. Worn or even broken.
  • Step 203 Treat the display panel to be packaged with the encapsulant to cure the encapsulant.
  • the encapsulant can be a UV glue.
  • the display panel to be packaged with the encapsulant is processed, for example, by irradiating the display panel to be packaged with the encapsulant to cure the UV adhesive.
  • the display device to be packaged (taking the OLED device package as an example) is disposed on the rotary table, so that the guide wire and the glass frit on the display device to be packaged are in contact with each other when rotating
  • the guide wire passes through the container carrying the adhesive during the movement.
  • the package adhesive carried in the container is attached, and the guide wire portion to which the adhesive is attached passes through the rotary table.
  • the encapsulant is applied to the frit and filled by the surface tension of the frit; and under the surface tension of the frit, the amount of glue between the guide line and the frit reaches a state of dynamic equilibrium.
  • the uniform coating of the encapsulant further enhances the packaging mechanical strength and sealing performance of the OLED device.
  • the circular OLED device is placed on a rotary table to complete the package, that is, the package is suitable for a circular OLED device, and of course, it can also be applied to other OLED devices with curved surfaces such as an elliptical OLED device.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种封装装置及显示面板封装方法，所述装置包括：引导线（10）、用于承载封装胶（21）的容器（20）、用于放置待封装器件（31）的旋转工作台（30）以及用于带动所述引导线（10）运动的绕线装置（40），所述引导线（10）安装在所述绕线装置（40）上，所述引导线（10）的一部分用于没入所述封装胶（21）中，以使附着有所述封装胶（21）的引导线（10）运动时经过所述旋转工作台（30）。工作时，将待封装的显示器件(以OLED器件封装为例)设置在旋转工作台（30）上，使引导线（10）和玻璃料接触，当旋转工作台（30）转动且引导线（10）运动时，引导线（10）经过容器（20）后会附着容器（20）内承载的封装胶（21），当附着有封装胶（21）的引导线（10）部分经过旋转工作台（30）的上方时，封装胶（21）被涂布到玻璃料上，并通过玻璃料表面张力实现封装胶（21）的均匀涂布。

Description

封装装置及显示面板封装方法
本申请要求于2017年04月28日提交国家知识产权局、申请号为201710293818.0、发明名称为“封装装置及显示面板封装方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示器领域，特别涉及一种封装装置及显示面板封装方法。
背景技术
目前，常用的显示器主要包括有机电致发光显示器(英文Organic Light-Emitting Display，简称OLED)和液晶显示器(英文Liquid Crystal Display，简称LCD)两大类。OLED器件对环境中的水与氧非常敏感，氧气和水分会使OLED器件性能劣化，在OLED器件制作过程中，需要对OLED器件进行封装，以避免环境中的水氧侵蚀，因此，OLED器件的封装技术成为了提高OLED器件寿命的关键制程。
在一种OLED器件的封装技术中，采用玻璃料和紫外光(英文Ultraviolet Rays，简称UV)固化胶(简称UV胶)一起进行OLED器件封装。在封装过程中，先采用玻璃料对OLED器件进行封装，玻璃料封装完成后进行UV胶封装，UV胶封装具体过程如下(以方形OLED器件为例)：将OLED器件固定在工装上，使OLED器件涂有玻璃料的任一侧朝向位于工装上方的UV胶分配装置；UV胶分配装置向OLED器件的玻璃料上点滴UV胶，每滴完OLED器件的一侧，待UV胶充分填入玻璃料中之后，拆下OLED器件并转动90度后重新固定，重复前述步骤，直到OLED器件的四侧全部滴有UV胶；采用紫外光照射UV胶，使其固化，完成封装。
然而上述点滴UV胶的方式在OLED器件形状适用范围上以及涂覆均匀性上仍有改善空间。
发明内容
本申请提供了一种封装装置及显示面板封装方法。所述技术方案如下：
本申请至少一实施例提供了一种封装装置，所述装置包括：
引导线、用于承载封装胶的容器、用于放置待封装器件的旋转工作台以及用于带动所述引导线运动的绕线装置，所述引导线安装在所述绕线装置上，所述引导线的一部分用于没入所述封装胶中，以使附着有所述封装胶的引导线运动时经过所述旋转工作台。
在本申请实施例的一种实现方式中，所述绕线装置包括至少两个转动件，所述引导线的两端相互连接，且所述引导线用于在所述至少两个转动件的带动下运动，所述容器设置在所述引导线的运动路径上。
在本申请实施例的另一种实现方式中，所述旋转工作台设置在所述引导线的运动路径上。
在本申请实施例的另一种实现方式中，所述装置还包括用于回收所述引导线上的封装胶的回收单元，所述回收单元设置在所述引导线的运动路径上。
在本申请实施例的另一种实现方式中，所述回收单元包括槽体和两个平行设置的辊轮，所述引导线夹设在所述两个辊轮之间，所述两个辊轮的旋转轴与所述引导线经过所述回收单元时的运动方向垂直，所述两个辊轮位于所述槽体的上方。
在本申请实施例的另一种实现方式中，所述至少两个转动件包括至少一个转动轮和至少一个导向轮，所述转动轮用于在动力单元的驱动下转动，所述导向轮用于在所述引导线的带动下转动。
在本申请实施例的另一种实现方式中，所述容器的内部设有滑轮，所述引导线绕过所述滑轮。
在本申请实施例的另一种实现方式中，所述滑轮设置在所述容器的底部上。
在本申请实施例的另一种实现方式中，所述容器的侧壁上相对设置有两通孔，所述引导线依次经过所述两通孔中的一个通孔、所述滑轮和所述两通孔中的另一个通孔。
在本申请实施例的另一种实现方式中，所述通孔的高度高于封装胶的液面。
在本申请实施例的另一种实现方式中，所述滑轮设置在所述容器的底部上，所述滑轮至所述容器的底部的距离小于所述通孔至所述容器的底部的距离。
在本申请实施例的另一种实现方式中，所述引导线为丝线。
在本申请实施例的另一种实现方式中，所述引导线为圆形线或扁平状线。
在本申请实施例的另一种实现方式中，当所述引导线为圆形线时，所述引 导线的直径约为0.5mm；当所述引导线为扁平状线时，所述引导线的宽度约为0.5mm。
在本申请实施例的另一种实现方式中，所述装置还包括控制单元，所述控制单元用于控制所述旋转工作台转动。
在本申请实施例的另一种实现方式中，所述控制单元，用于当所述待封装器件为圆形时，控制所述旋转工作台匀速转动；
当所述待封装器件为方形时，控制所述旋转工作台间歇性转动，且每次转动90度。
在本申请实施例的另一种实现方式中，所述控制单元，还用于控制所述绕线装置运动，以控制所述引导线的运动。
本申请至少一实施例还提供了一种显示面板封装方法，采用如第一方面任一项所述的封装装置实现，所述方法包括：
将待封装的显示面板放置在旋转工作台上，使待封装的显示面板与引导线接触；
控制所述旋转工作台转动，同时控制所述引导线运动，使封装胶涂覆到所述待封装的显示面板上；
对涂覆有所述封装胶的所述待封装的显示面板进行处理，使所述封装胶固化。
在本申请实施例的一种实现方式中，所述控制所述旋转工作台转动，包括：
当所述待封装的显示面板为圆形时，控制所述旋转工作台匀速转动；
当所述待封装的显示面板为方形时，控制所述旋转工作台间歇性转动，且每次转动90度。
在本申请实施例的另一种实现方式中，所述显示面板为有机电致发光显示面板。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的一种封装装置的结构示意图；
图2是本申请实施例提供的另一种封装装置的结构示意图；
图3是本申请实施例提供的另一种封装装置的结构示意图；
图4是本申请实施例提供的另一种封装装置的结构示意图；
图5本申请实施例提供的一种显示面板封装方法的流程图。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请实施方式作进一步地详细描述。
图1是本申请实施例提供的一种封装装置的结构示意图，参见图1，该封装装置包括：
引导线10、用于承载封装胶的容器20、用于放置待封装器件31的旋转工作台30以及用于带动引导线10运动的绕线装置40，引导线10安装在绕线装置40上，引导线10的一部分用于没入封装胶21中，以使附着有封装胶的引导线10运动时经过旋转工作台30。
本申请实施例提供的封装装置主要用于OLED器件的封装，当然也可以应用与其他器件的封装，即待封装器件31可以为待封装的OLED器件或其他器件，后文以待封装的OLED器件为例进行说明；使用时，容器内的封装胶也可以根据实际需要更换为其他胶体或液体。在采用上述封装装置对OLED器件进行封装时，将待封装的OLED器件设置在旋转工作台上，使引导线和OLED器件接触，具体引导线和待封装的OLED器件的玻璃料接触，当旋转工作台转动且引导线运动时，由于引导线的一部分会没入封装胶，且引导线在运动过程中会经过承载封装胶的容器，引导线经过容器后会附着容器内承载的封装胶，当附着有封装胶的引导线部分经过旋转工作台的上方时，封装胶被涂布到玻璃料上，并通过玻璃料表面张力实现填充(毛细作用)；并且在玻璃料表面张力作用下，引导线与玻璃料之间的胶量达到一个动态平衡的状态，实现封装胶的均匀涂布，进而提升了OLED器件的封装机械强度和密封性能。另外，圆形OLED器件放置在旋转工作台上，能够完成封装胶封装，也即该封装装置适用于圆形OLED器件，当然其也可以适用于椭圆形OLED器件等其他侧面为曲面的OLED器件。
在本申请实施例中，承载在容器20内的封装胶可以是UV胶。
如图1所示，容器20内设有封装胶21。引导线10的一部分用于没入封装胶21中，在封装装置工作时，引导线10的另一部分位于旋转工作台30的上方， 当然在其他实施例中，引导线10的另一部分也可以位于旋转工作台30的侧边或其他位置，只要引导线10能够与放置在旋转工作台30上的待封装的OLED器件的玻璃料接触即可。旋转工作台30和待封装的OLED器件间的形状大小关系不同，引导线10所处的位置可能不同。例如，旋转工作台30的上表面面积较大，待封装的OLED器件设置在旋转工作台30的上表面中心，此时，引导线10的另一部分位于旋转工作台30的正上方即可与待封装的OLED器件的玻璃料接触；而当旋转工作台30的上表面面积较小，待封装的OLED器件的侧壁延伸到旋转工作台30之外时，此时引导线10的另一部分需要位于旋转工作台30的侧边方可与待封装的OLED器件的玻璃料接触。
在本申请实施例中，绕线装置40可以包括至少两个转动件41，这些转动件41的转动轴相互平行，引导线10的两端相互连接，且引导线10缠绕设置于至少两个转动件41上，从而通过绕线装置40带动引导线10运动。采用至少两个转动件形成的绕线装置来缠绕引导线，并通过控制转动件41转动，能够让引导线循环转动，不用将引导线设置的过长，同时方便引导线的控制。
如图1所示，容器20的内部设有滑轮22，引导线10绕过滑轮22，方便引导线10进出容器20的方向设计，保证引导线能够从容器20中经过带走封装胶。其中滑轮22为定滑轮，该定滑轮固定在容器20内，该滑轮的转动轴与转动件的转动轴平行。示例性地，引导线10可以从滑轮22的下方绕过滑轮22，同时滑轮22与封装胶接触，保证引导线10既能够与封装胶充分接触，又能够和滑轮配合实现顺利进出容器。
进一步地，滑轮22可以设置在容器20的底部上，从而保证引导线10在容器20中与封装胶充分接触。
在本申请实施例中，容器20可以为各种形状，如圆柱形、长方体等，容器可以采用各种不同的材料制成，如塑料、玻璃、木材、金属等。
在本申请实施例的一种实现方式中，至少两个转动件可以全部为转动轮。转动轮用于在动力单元(如电机)的驱动下转动。如图1所示，该装置包括5个转动轮41A。当绕线装置40包括两个或两个以上转动轮时，两个或两个以上转动轮的线速度相同，从而保证引导线的平稳运动。
在本申请实施例的另一种实现方式中，至少两个转动件包括至少一个转动轮和至少一个导向轮。导向轮用于在引导线的带动下转动，也即引导轮没有动力单元驱动，起到导向作用，详见后文对于图2-图4的描述。
图2是本申请实施例提供的另一种封装装置的结构示意图，参见图2，该装置与图1提供的封装装置的区别在于，该绕线装置40包括两个转动轮41A和两个导向轮41B，其中一个导向轮41B设置在两个转动轮41A之间，另一个导向轮41B设置在其中一个转动轮41A的一侧，另一个导向轮41B与两个转动轮41A呈三角形布置。引导线10绕设在两个转动轮41A和两个导向轮41B上，且引导线用于在两个转动轮41A和两个导向轮41B上运动，容器20和旋转工作台30设置在引导线10的运动路径上。
如图2所示，容器20和旋转工作台30均设置在两个转动轮41A之间，且容器20和旋转工作台30沿引导线的运动方向依次布置。示例性地，容器20布置在一个转动轮41A和其中一个导向轮41B之间，旋转工作台30设置在其中一个导向轮41B和另一个转动轮41A之间。
在该实现方式中，该绕线装置40仅包括两个转动轮41A，结构简单，动力性能好，占用体积小，且能满足绕线需求。另外，旋转工作台30设置在引导线10的运动路径上，工作时，不需要移动旋转工作台30的位置即可实现对OLED器件的封装。
图3是本申请实施例提供的另一种封装装置的结构示意图，参见图3，该装置与图2提供的封装装置的区别在于，容器20的侧壁上相对设置有两通孔23，引导线10依次经过两通孔23中的一个通孔23、滑轮22和两通孔23中的另一个通孔23。在容器的侧壁上设有两通孔，避免引导线从容器口进出容器(图2所示即为引导线从容器口进出)时，引导线倾斜度较大，造成引导线上的封装胶发生滑动，也就是说通过设置两通孔使得引导线倾斜度小，引导线上的封装胶附着更稳定，保证最终涂覆到玻璃胶上的封装胶的量，进而保证封装效果。
其中，通孔的高度高于封装胶的液面，避免封装胶从通孔流出。
具体的，滑轮22设置在所述容器20的底部上，所述滑轮22至所述容器的底部20的距离小于通孔23至所述容器20的底部的距离，从而保证引导线10在容器20中与封装胶充分接触。
示例性地，两通孔23的高度(也即通孔与容器底部的距离)相同，一方面便于容器的设计制作，另一方面，方便绕线装置即引导线的布置。
图4是本申请实施例提供的另一种封装装置的结构示意图，参见图4，该装置与图3提供的封装装置的区别在于，该装置还包括用于回收引导线10上的封装胶21的回收单元50，回收单元50设置在引导线10的运动路径上。通过设置 回收单元50将引导线上多余的胶回收，实现重复利用。
参见图4，旋转工作台30可以设置在容器20和回收单元50之间，从而将刚经过旋转工作台30且未被使用掉的封装胶回收起来。
参见图4，该回收单元50包括槽体51和两个平行设置的辊轮52，引导线10夹设在两个辊轮52之间，两个辊轮52的旋转轴的轴向均与引导线10经过回收单元50时的运动方向垂直，两个辊轮52位于槽体51的上方。两个辊轮52在丝线运动时，做相对运动，丝线通过时，两个辊轮对丝线进行挤压，从而将丝线上多余的胶回收，实现重复利用。该回收单元结构简单，且能够保证封装胶的回收。
在图1-图4提供的封装装置中，引导线10为丝线，采用丝线作为引导线，能够实现封装胶的附着，且效果好。
进一步地，引导线10可以为圆形线，引导线10的直径约为0.5mm。或者，引导线10可以为扁平状线，引导线10宽度约为0.5mm。在OLED器件中，基板和盖板的间距约为5μm，也即玻璃料的高度为5μm，该引导线10的直径或宽度大于OLED器件玻璃料的高度，使引导线上的封装胶能够覆盖玻璃料，满足封装需求。由于引导线10的直径或宽度大于OLED器件玻璃料的高度，实际涂覆时，封装胶会涂到基板和盖板上，需要在后续步骤除去。
在本申请实施例中，封装胶的涂覆厚度可以为约0.15mm，一个OLED器件的封装胶的用量为5μm*0.15mm*OLED器件的周长，以5.5FHD的量产数据为例，180mL的封装胶能对应20000个OLED器件。
进一步地，如果引导线10上的封装胶较多，造成涂覆到玻璃料上时溢胶，则需要减少引导线上的封装胶，示例性地，该装置还可以包括用于滤除引导线上部分封装胶的滤胶装置，滤胶装置可以设置在旋转工作台和容器之间，也可以设置在容器侧壁上。例如，该滤胶装置包括竖直设置在旋转工作台和容器之间的滤胶板，滤胶板上设有滤胶孔，引导线穿过滤胶孔，从而将引导线上的部分封装胶刮下，进一步地，滤胶板底部设有凹槽，从而回收封装胶。当然，也可以将容器20的侧壁上两通孔23中的另一个孔23设计为滤胶孔(滤胶装置仅包括该滤胶孔)，示例性地，该滤胶孔可以倾斜向上设置，从而使得被滤胶孔刮下的封装胶能够回流到容器内。其中，滤胶孔设计时，可以在滤胶孔内设置有孔四周伸向中心的毛刷，一方面保证封装胶能够部分被刮下，另一方面，保证线不会被刮伤。
在图1-图4提供的封装装置中，该装置还包括控制单元，控制单元用于控制旋转工作台30转动，保证封装装置的正常工作。
进一步地，控制单元，用于当待封装的OLED器件为圆形时，控制旋转工作台30匀速转动；当待封装的OLED器件为方形时，控制旋转工作台30间歇性转动，且每次转动90度，保证封装装置能够适用不同形状OLED器件。
进一步地，控制单元还用于控制绕线装置运动，以控制引导线的运动。示例性地，控制单元还用于控制转动件的转速，从而控制引导线的速度。示例性地，控制单元还用于控制驱动转动轮的动力单元，从而实现对转动件的转速控制。实际控制时，转动件的转速、旋转工作台的速度或者间歇时间，可以根据实际封装胶的涂覆情况设计，以保证封装胶的涂覆量适中。
另外，在本申请实施例中，旋转工作台30为可移动旋转工作台，可移动旋转工作台可以通过移动实现远离或者靠近引导线，当进行OLED器件的封装时，通过移动旋转工作台30使引导线与待封装OLED器件接触。同时，可移动旋转工作台还能够在旋转工作台上放置不同尺寸的OLED器件，且放置在旋转工作台的不同尺寸的OLED器件均能与引导线相接触，且不会造成OLED器件对引导线的压力过大。
进一步地，当旋转工作台为可移动旋转工作台时，在控制单元控制旋转工作台间歇转动时，在间歇期间，还可以控制旋转工作台远离引导线，从而避免方形的待封装的OLED器件在下一次转动时拐角处挤压引导线，导致引导线发生磨损甚至断裂。
图5是本申请实施例提供的一种显示面板封装方法的流程图，采用图1-4任一幅所示封装装置实现，参见图5，该方法包括：
步骤201：将待封装的显示面板放置在旋转工作台上，使待封装的显示面板与引导线接触。
其中，显示面板为OLED显示面板。待封装的OLED显示面板的玻璃料与引导线接触。
步骤202：控制旋转工作台转动，同时控制引导线运动，使封装胶涂覆到待封装的显示面板上。
示例性地，封装胶涂覆到待封装的OLED显示面板的玻璃料上。
在本申请实施例的一种实现方式中，控制旋转工作台转动，包括：
当待封装的显示面板为圆形时，控制旋转工作台匀速转动；当待封装的显示面板为方形时，控制旋转工作台间歇性转动，且每次转动90度。保证能够适用不同形状显示面板。
进一步地，本申请实施例通过控制转动件的转速，从而控制引导线的速度。示例性地，控制单元还用于控制驱动转到轮的动力单元，从而实现对转动件的转速控制。实际控制时，转动件的转速、旋转工作台的速度或者间歇时间，可以根据实际封装胶的涂覆情况设计，以保证封装胶的涂覆量适中。
进一步地，当控制旋转工作台间歇转动时，在间歇期间，还可以控制旋转工作台远离引导线，从而避免方形的待封装的OLED器件在下一次转动时拐角处挤压引导线，导致引导线发生磨损甚至断裂。
步骤203：对涂覆有封装胶的待封装的显示面板进行处理，使封装胶固化。
示例性地，封装胶可以为UV胶。对涂覆有封装胶的待封装的显示面板进行处理，例如可以是对涂覆有封装胶的待封装的显示面板进行光照处理，以使UV胶固化。
本申请实施例提供的封装装置在工作时，将待封装的显示器件(以OLED器件封装为例)设置在旋转工作台上，使引导线和待封装的显示器件上的玻璃料接触，当旋转工作台转动且引导线运动时，引导线在运动过程中会经过承载封装胶的容器，引导线经过容器后会附着容器内承载的封装胶，当附着有封装胶的引导线部分经过旋转工作台的上方时，封装胶被涂布到玻璃料上，并通过玻璃料表面张力实现填充；并且在玻璃料表面张力作用下，引导线与玻璃料之间的胶量达到一个动态平衡的状态，实现封装胶的均匀涂布，进而提升了OLED器件的封装机械强度和密封性能。另外，圆形OLED器件放置在旋转工作台上，能够完成封装胶封装，也即该封装装置适用于圆形OLED器件，当然其也可以适用于椭圆形OLED器件等其他侧面为曲面的OLED器件。
以上仅为本申请的较佳实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (18)

  1. 一种封装装置，所述封装装置包括：
    引导线、用于承载封装胶的容器、用于放置待封装器件的旋转工作台以及用于带动所述引导线运动的绕线装置，所述引导线安装在所述绕线装置上，所述引导线的一部分用于没入所述封装胶中，以使附着有所述封装胶的引导线运动时经过所述旋转工作台。
  2. 根据权利要求1所述的封装装置，其中，所述绕线装置包括至少两个转动件，所述引导线的两端相互连接，且所述引导线用于在所述至少两个转动件的带动下运动，所述容器设置在所述引导线的运动路径上。
  3. 根据权利要求2所述的封装装置，其中，所述旋转工作台设置在所述引导线的运动路径上。
  4. 根据权利要求2所述的封装装置，其中，所述封装装置还包括用于回收所述引导线上的封装胶的回收单元，所述回收单元设置在所述引导线的运动路径上。
  5. 根据权利要求4所述的封装装置，其中，所述回收单元包括槽体和两个平行设置的辊轮，所述引导线夹设在所述两个辊轮之间，所述两个辊轮的旋转轴的长度方向均与所述引导线经过所述回收单元时的运动方向垂直，所述两个辊轮位于所述槽体的上方。
  6. 根据权利要求2至5任一项所述的封装装置，其中，所述至少两个转动件包括至少一个转动轮和至少一个导向轮，所述转动轮用于在动力单元的驱动下转动，所述导向轮用于在所述引导线的带动下转动。
  7. 根据权利要求1至5任一项所述的封装装置，其中，所述容器的内部设有滑轮，所述引导线绕过所述滑轮。
  8. 根据权利要求7所述的封装装置，其中，所述滑轮设置在所述容器的底部上，所述滑轮至所述容器的底部的距离小于所述通孔至所述容器的底部的距离。
  9. 根据权利要求7所述的封装装置，其中，所述容器的侧壁上相对设置有两通孔，所述引导线依次经过所述两通孔中的一个通孔、所述滑轮和所述两通孔中的另一个通孔。
  10. 根据权利要求1至5任一项所述的封装装置，其中，所述引导线为丝 线。
  11. 根据权利要求1至5任一项所述的封装装置，其中，所述引导线为圆形线或扁平状线。
  12. 根据权利要求11所述的封装装置，其中，当所述引导线为圆形线时，所述引导线的直径约为0.5mm；当所述引导线为扁平状线时，所述引导线的宽度约为0.5mm。
  13. 根据权利要求1至5任一项所述的封装装置，其中，所述封装装置还包括控制单元，所述控制单元用于控制所述旋转工作台转动。
  14. 根据权利要求13所述的封装装置，其中，所述控制单元，用于当所述待封装器件为圆形时，控制所述旋转工作台匀速转动；
    当所述待封装器件为方形时，控制所述旋转工作台间歇性转动，且每次转动90度。
  15. 根据权利要求13所述的封装装置，其中，所述控制单元，还用于控制所述绕线装置运动，以控制所述引导线的运动。
  16. 一种显示面板封装方法，采用如权利要求1至15任一项所述的封装装置实现，所述方法包括：
    将待封装的显示面板放置在旋转工作台上，使所述待封装的显示面板与引导线接触；
    控制所述旋转工作台转动，同时控制所述引导线运动，使封装胶涂覆到所述待封装的显示面板上；
    对涂覆有所述封装胶的所述待封装的显示面板进行处理，使所述封装胶固化。
  17. 根据权利要求16所述的方法，其中，所述控制所述旋转工作台转动，包括：
    当所述待封装的显示面板为圆形时，控制所述旋转工作台匀速转动；
    当所述待封装的显示面板为方形时，控制所述旋转工作台间歇性转动，且每次转动90度。
  18. 根据权利要求16或17所述的方法，其中，所述显示面板为有机电致发光显示面板。
PCT/CN2017/116454 2017-04-28 2017-12-15 封装装置及显示面板封装方法 WO2018196402A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/075,251 US11101452B2 (en) 2017-04-28 2017-12-15 Packaging device and display panel packaging method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710293818.0A CN106935534B (zh) 2017-04-28 2017-04-28 封装装置及显示面板封装方法
CN201710293818.0 2017-04-28

Publications (1)

Publication Number Publication Date
WO2018196402A1 true WO2018196402A1 (zh) 2018-11-01

Family

ID=59436910

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/116454 WO2018196402A1 (zh) 2017-04-28 2017-12-15 封装装置及显示面板封装方法

Country Status (3)

Country Link
US (1) US11101452B2 (zh)
CN (1) CN106935534B (zh)
WO (1) WO2018196402A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106935534B (zh) 2017-04-28 2019-11-05 京东方科技集团股份有限公司 封装装置及显示面板封装方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1971972A (zh) * 2005-11-22 2007-05-30 深圳市创欧科技有限公司 有机电致发光显示器件的封装涂胶工艺
CN103855328A (zh) * 2012-12-06 2014-06-11 株式会社日立制作所 有机el密封装置
JP2015135781A (ja) * 2014-01-20 2015-07-27 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子の製造方法
CN105572858A (zh) * 2016-02-24 2016-05-11 南京晶奥微光电技术有限公司 卷对卷的柔性电润湿或微流器件加工设备
CN106935534A (zh) * 2017-04-28 2017-07-07 京东方科技集团股份有限公司 封装装置及显示面板封装方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0153355B1 (ko) * 1993-05-05 1998-11-16 페터 옐리히; 울리히 비블 플레이트 또는 디스크를 래커링 또는 코팅하기 위한 장치
JP4509666B2 (ja) * 2004-06-25 2010-07-21 リンテック株式会社 シート剥離装置及び剥離方法
JP4514722B2 (ja) * 2006-02-20 2010-07-28 富士通セミコンダクター株式会社 フィルム貼り付け方法、フィルム貼り付け装置および半導体装置の製造方法
TWI433331B (zh) * 2011-05-17 2014-04-01 Neo Solar Power Corp 電極膠帶之製作機台
KR102448726B1 (ko) * 2017-08-14 2022-09-28 삼성전자주식회사 라미네이팅 장치 및 그를 이용하는 반도체 패키지 제조 방법
GB2566029B (en) * 2017-08-30 2022-11-02 Pragmatic Printing Ltd Methods and apparatus for manufacturing a plurality of electronic circuits

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1971972A (zh) * 2005-11-22 2007-05-30 深圳市创欧科技有限公司 有机电致发光显示器件的封装涂胶工艺
CN103855328A (zh) * 2012-12-06 2014-06-11 株式会社日立制作所 有机el密封装置
JP2015135781A (ja) * 2014-01-20 2015-07-27 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子の製造方法
CN105572858A (zh) * 2016-02-24 2016-05-11 南京晶奥微光电技术有限公司 卷对卷的柔性电润湿或微流器件加工设备
CN106935534A (zh) * 2017-04-28 2017-07-07 京东方科技集团股份有限公司 封装装置及显示面板封装方法

Also Published As

Publication number Publication date
CN106935534B (zh) 2019-11-05
US20210202919A1 (en) 2021-07-01
CN106935534A (zh) 2017-07-07
US11101452B2 (en) 2021-08-24

Similar Documents

Publication Publication Date Title
CN104972733B (zh) 一种真空贴合一体机和真空贴合方法
CN102305978A (zh) 硅基液晶屏生产***及其生产方法
WO2016061852A1 (zh) 基板的封装方法及封装结构
JP2003270609A (ja) 貼合せ基板製造装置及び貼合せ基板製造方法
CN1404162A (zh) 有机光发射二极管的密封构造、密封方法及密封装置
WO2018196402A1 (zh) 封装装置及显示面板封装方法
CN104916567B (zh) 晶片处理装置以及晶片的处理方法
JP2009265266A (ja) 貼合装置及び貼合方法
CN105478415A (zh) 一种全自动表面处理机
CN1296145C (zh) 基板处理装置、涂敷装置及涂敷方法
JP2011067802A (ja) 接合部材の製造方法及び接合部材製造装置
WO2015027534A1 (zh) 一种玻璃基板的封装方法
WO2010116654A1 (ja) 薄膜形成装置及び薄膜形成方法
CN107424952A (zh) 一种晶圆升降机构
TW201540873A (zh) 鍍膜裝置及鍍膜系統
JP5612043B2 (ja) 接合部材の製造方法及び接合部材製造装置
KR20060134685A (ko) 액정표시패널 제조장치와 이를 이용한 액정표시패널의제조방법
JP2003005194A (ja) シール剤塗布装置、液晶滴下貼り合わせ装置および液晶パネル製造方法
CN204977714U (zh) 一种真空贴合一体机
TWI502217B (zh) 電濕潤顯示器及其基板的製作方法、設備、組立設備與系統
TW202006837A (zh) 封膠設備及封膠方法
CN217730974U (zh) 一种治疗真菌感染的外用液体敷料灌装设备
TW200940189A (en) Glue coating method and apparatus and system thereof
CN206700252U (zh) 一种义齿浸蜡装置
JP2014166664A (ja) 眼鏡レンズ基材用保持装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17906990

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 06/04/2020)

122 Ep: pct application non-entry in european phase

Ref document number: 17906990

Country of ref document: EP

Kind code of ref document: A1