WO2018196063A1 - 连接结构 - Google Patents

连接结构 Download PDF

Info

Publication number
WO2018196063A1
WO2018196063A1 PCT/CN2017/085175 CN2017085175W WO2018196063A1 WO 2018196063 A1 WO2018196063 A1 WO 2018196063A1 CN 2017085175 W CN2017085175 W CN 2017085175W WO 2018196063 A1 WO2018196063 A1 WO 2018196063A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
wire
mounting portion
mounting
row
Prior art date
Application number
PCT/CN2017/085175
Other languages
English (en)
French (fr)
Inventor
徐业友
Original Assignee
东莞市欣元睿创电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 东莞市欣元睿创电子科技有限公司 filed Critical 东莞市欣元睿创电子科技有限公司
Publication of WO2018196063A1 publication Critical patent/WO2018196063A1/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02Soldered or welded connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections

Definitions

  • the present invention relates to the field of circuit board processing, and in particular to a connection structure of a connecting wire and a circuit board.
  • connection line is needed.
  • various connection lines are connected to the board usually by direct soldering.
  • this type of connection requires manual alignment of one wire to the correct position for soldering. If a soldering error occurs, it will affect the performance of the board, or even burn out the board, resulting in high work failure rate and production. low efficiency.
  • a primary object of the present invention is to provide a connection structure for quickly and accurately connecting a wire to a circuit board to improve production efficiency.
  • connection structure of the present invention includes a card, the row card is provided with at least one mounting portion parallel to a surface of the circuit board, and the wire is connected to one end of the mounting portion and is at the mounting portion.
  • the other end of the circuit board is provided with a recess, the circuit board is inserted into the recess, and one end of the wire passing through the mounting portion is connected to the surface of the circuit board.
  • the wire is a data line
  • the data line includes a plurality of wires
  • the mounting portion includes a body and a plurality of mounting holes penetrating the body, each wire penetrating through a mounting hole.
  • the spacing between each of the two mounting holes is 2 mm.
  • each of the wires protrudes from the end of the mounting hole as a connecting end, and the surface of the circuit board is provided with a fixing end corresponding to the connecting end, and each connecting end is soldered to a fixing end.
  • each of the connecting ends is plated with a tin layer.
  • the circuit board is an assembled printed circuit board.
  • the number of the mounting holes is 4-24.
  • the number of rows of the mounting holes is single row, double row or three rows.
  • the row of cards is provided with two oppositely disposed mounting portions, the grooves being located between the two mounting portions.
  • At least one wire passes through one mounting portion and at least one other wire passes through the other mounting portion.
  • the wire and the circuit board are connected by the row card, and the wire is first connected to the mounting part of the card row, and the connection process can be automatically connected by manual or professional equipment, thereby greatly improving the production efficiency. . Then, the row card connected with the wire is directly inserted into the circuit board, and the wire and the circuit board which are worn out through the mounting part can be directly connected without confirming the alignment one by one, thereby ensuring the connection accuracy between the wire and the circuit board, and improving the product. Yield.
  • FIG. 1 is a partial exploded view of an embodiment of a connection structure of the present invention
  • Figure 2 is a plan view of the connecting structure shown in Figure 1;
  • connection structure of a card is a partial schematic view showing an embodiment of a connection structure of a card and a wire in the connection structure of the present invention
  • FIG. 4 is a schematic structural view of an embodiment of a row of cards in the connection structure of the present invention.
  • the terms "connected”, “fixed” and the like should be understood broadly, unless otherwise clearly defined and limited.
  • “fixed” may be a fixed connection, or may be a detachable connection, or may be integrated; It may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may be an internal connection of two elements or an interaction relationship of two elements unless explicitly defined otherwise.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • first, second, and the like in the present invention are used for the purpose of description only, and are not to be construed as indicating or implying their relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • the technical solutions between the various embodiments may be combined with each other, but must be based on the realization of those skilled in the art, and when the combination of the technical solutions is contradictory or impossible to implement, it should be considered that the combination of the technical solutions does not exist. It is also within the scope of protection required by the present invention.
  • the present invention proposes a connection structure for connection between a plurality of wires and a circuit board.
  • the connecting structure includes a row of cards 30.
  • the row of cards 30 is parallel to the surface of the circuit board 50.
  • At least one mounting portion 31 is disposed, and the row of the card 30 faces the surface of the circuit board 50.
  • a recess 33 is defined, and the circuit board 50 is inserted into the recess 33.
  • the wire 10 is connected to one end of the mounting portion 31 and passes through the other end of the mounting portion 31.
  • One end of the wire 10 passing through the mounting portion 31 is connected to the circuit board. 50's surface.
  • the circuit board 50 can be a PCBA (Printed Circuit Board). Assembly, assembly of printed circuit board) boards, which have assembled various electronic devices onto PCB boards through surface mount processes, for example, data collection boards, which mainly include FPGAs (Fields). Programmable Gate Array) PCB board as a semi-custom circuit in the field of ASICs; also includes DSP (Digital Signal) Process) The board of the chip that is used to process the data.
  • the material of the row card 30 is plastic, which can be processed by integral molding technology, which is convenient for mass production and cost saving. Since the shape of the circuit board 50 is generally rectangular, the shape of the recess 33 of the card 30 is matched, and the shape of the opening of the recess 33 is also rectangular.
  • the wire 10 can be composed of one or more wires 11.
  • the wire 10 is a data line.
  • the data line includes a plurality of wires 11 .
  • the mounting portion 31 includes a body 311 and a plurality of mounting holes 313 extending through the body 311 . Each of the wires 11 extends through a mounting hole 313 .
  • the wire is the data wire itself, generally consisting of a wire core, a shielding layer and an outer sheath.
  • the wire core is composed of a plurality of wires 11 which are insulated by a conductor and an outer surface of the conductor. Layer composition.
  • the mounting portion 31 has a substantially rectangular parallelepiped shape, and the center line of the plurality of mounting holes 313 is parallel to the circuit board 50.
  • the mounting hole 313 may be a recessed hole formed in the surface of the mounting portion 31 or a circular hole.
  • each of the wires 11 extends through a mounting hole 313 and passes the end portion out of the mounting hole 313.
  • the connection manner of the wire 11 and the mounting portion 31 is cemented.
  • the side of the wire 11 facing away from the end portion is fixed to the mounting hole 313 by using a special glue.
  • This process can be automated through specialized equipment, which greatly increases production efficiency.
  • the spacing between each two mounting holes 313 is 2 mm.
  • the mounting holes 313 of the row of cards 30 are generally prepared by standard parts. Therefore, the spacing between the two mounting holes 313 has a specific size. In this embodiment, the spacing between each of the two mounting holes 313 is 2 mm. The distance between the two wires 11 is also 2 mm, so that the connection distance between the two wires 11 can be reduced when connecting with the circuit board 50, thereby saving material usage of the PCBA board, thereby saving cost and environmental protection.
  • each connection end 111 is soldered to a fixed end.
  • the connecting end 111 of each of the wires 11 is a conductor for removing the insulating layer.
  • the thickness of each mounting portion 31 of the card 30 is not too large.
  • connection end 111 and the fixed end solder In order to make the connection end 111 and the fixed end solder more stable, a tin layer is plated on the outer surface of each of the connection ends 111.
  • the soldering method of the connecting end 111 and the fixing end is soldering, and the soldering is a soldering method in which the low-melting-point metal solder is heated and melted, and the gap between the metal parts is infiltrated and filled, so that the connecting end 111 is The outer surface is plated with a tin layer.
  • the process uses a soldering iron as a heating tool, and tin is also plated on the fixed end of the circuit board 50. After the tin is melted by using a soldering iron, the connecting end 111 and the fixed end are firmly connected.
  • the number of mounting holes 313 is set to 4 to 24, and the specific number is adjusted according to actual conditions. Specifically, the number of rows of the mounting holes 313 may be single row, double row or three rows.
  • the row card 30 may be provided with two upper and lower opposite mounting portions 31, and the groove 33 is located between the two mounting portions 31.
  • the wire 10 is At least one wire 11 is disposed through a mounting portion 31 , and at least another guide 11 is disposed through the other mounting portion 31 .
  • the wires 10 can be simultaneously connected to both surfaces of the circuit board 50, the space and material of the circuit board 50 can be further saved.
  • the circuit board 50 is required to be a double-sided circuit board.
  • the connection structure also makes the connection of the wire 10 and the circuit board 50 more stable.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

一种连接结构,用于连接线材(10)与电路板(50),该连接结构包括排卡(30),排卡平行于电路板的表面且设有至少一安装部(31),线材连接于安装部的一端并于安装部的另一端穿出,排卡面向电路板的表面还开设有一凹槽(33),电路板插设于凹槽,线材穿出安装部的一端连接于电路板的表面。该连接结构可快速且准确地连接线材与电路板,可提高生产效率。

Description

连接结构
技术领域
本发明涉及电路板加工领域,特别涉及一种连接线材与电路板的连接结构。
背景技术
一些电器与电子设备在制作装配时,通常会需要将各种元器件与主板或电路板进行连接,即需要使用连接线进行连接。目前,各种连接线与电路板的连接方式通常是直接焊接。但是这种连接方式需要人工将一根一根连接线对准正确的位置进行焊接,如果出现一根焊接错误,就会影响电路板的性能,甚至烧坏电路板,做工不良率高,且生产效率低。
发明内容
本发明的主要目的是提供一种连接结构,旨在将线材与电路板快速且准确地进行连接,提高生产效率。
为实现上述目的,本发明提出的连接结构,包括排卡,所述排卡平行于所述电路板的表面设有至少一安装部,所述线材连接于安装部的一端并于该安装部的另一端穿出,所述排卡面向电路板的表面还开设有一凹槽,所述电路板插设于所述凹槽,所述线材穿出安装部的一端连接于所述电路板的表面。
优选地,所述线材为数据线,该数据线包括若干导线,所述安装部包括本体及贯穿于所述本体的若干安装孔,每一导线贯穿一安装孔。
优选地,每两个所述安装孔之间的间距为2mm。
优选地,每一导线凸出于安装孔的端部为连接端,所述电路板的表面设有与连接端对应的固接端,每一连接端焊接于一固接端。
优选地,每一连接端的外表面镀设有锡层。
优选地,所述电路板为装配印刷电路板。
优选地,所述安装孔的个数为4~24。
优选地,所述安装孔的排数为单排、双排或者三排。
优选地,所述排卡设有二个相对设置的安装部,所述凹槽位于两个安装部之间。
优选地,至少一导线穿过一个安装部,至少另一导线穿过另一个安装部。
本发明技术方案中,线材与电路板之间通过排卡进行连接,首先将线材连接于排卡的安装部,该连接过程可以通过人工进行或专业设备进行自动化连接,从而可以大幅度提升生产效率。然后将连接好线材的排卡直接插设于电路板,无需一一进行确认对准就可以直接连接穿出安装部的线材与电路板,保证线材与电路板之间的连接准确性,提高产品良率。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图示出的结构获得其他的附图。
图1为本发明连接结构一实施例的部分***图;
图2为图1所示连接结构的平面示意图;
图3为本发明连接结构中排卡与线材的连接结构一实施例的部分示意图;
图4为本发明连接结构中的排卡一实施例的结构示意图。
附图标号说明:
标号 名称 标号 名称
10 线材 311 本体
11 导线 313 安装孔
111 连接端 33 凹槽
30 排卡 50 电路板
31 安装部
本发明目的的实现、功能特点及优点将结合实施例,参照附图做进一步说明。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
需要说明,本发明实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。
在本发明中,除非另有明确的规定和限定,术语“连接”、“固定”等应做广义理解,例如,“固定”可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电气连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。
另外,在本发明中如涉及“第一”、“第二”等的描述仅用于描述目的,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外,各个实施例之间的技术方案可以相互结合,但是必须是以本领域普通技术人员能够实现为基础,当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在,也不在本发明要求的保护范围之内。
本发明提出一种连接结构,该连接结构用于多种线材与电路板之间的连接。
请结合参照图1至图3,本实施例中,该连接结构包括排卡30,排卡30平行于电路板50的表面设有至少一安装部31,排卡30面向电路板50的表面还开设有一凹槽33,电路板50插设于凹槽33,线材10连接于安装部31的一端并于该安装部31的另一端穿出,线材10穿出安装部31的一端连接于电路板50的表面。
本实施例中,该电路板50可以为PCBA(Printed Circuit Board Assembly,装配印刷电路板)板,是已经将各种电子器件通过表面封装工艺组装到了PCB板上,例如,数据收集板,其主要为包含FPGA(Field Programmable Gate Array)芯片的PCB板,作为专用集成电路领域中的一种半定制电路;还有包含DSP(Digital Signal Process)芯片的电路板,用于对数据进行处理。排卡30的材质为塑料,可通过一体成型技术加工,便于批量化生产与节约成本。因电路板50的形状一般为长方体状,故而排卡30的凹槽33形状与之相匹配,该凹槽33的开口形状也为矩形。线材10可由一根或多根导线11组成。
请结合参照图2至图4,线材10为数据线,该数据线包括若干导线11,安装部31包括本体311及贯穿于本体311的若干安装孔313,每一导线11贯穿一安装孔313。
本实施例中,线材为数据线线本身,一般由线芯、屏蔽层及外被护套组成,线芯即是多根导线11组成的,导线11是由导体与包裹在导体外表面的绝缘层组成。安装部31的形状大致为长方体状,若干安装孔313的中心线平行于电路板50设置,该安装孔313可以为凹槽孔,开设于安装部31的表面,也可以为一圆孔,开设于安装部31的内部,每一导线11贯穿一安装孔313,并将端部穿出安装孔313。这里导线11与安装部31的连接方式为胶固,当导线11穿出安装孔313的端部长度大约为2mm左右时,使用特殊胶体将导线11背离端部的一侧粘固于安装孔313,此过程可以通过专门的设备进行自动化生产,从而大大提高生产效率。当然,也可以通过人工进行连接,连接时可以通过预排列,使得每根导线11连接到准确的位置,从而提高产品的良率。
优选的实施例中,每两个安装孔313之间的间距为2mm。
排卡30上的安装孔313的制作一般为标准件制备,故而两安装孔313之间的间距有特定的尺寸,本实施例中,选择每两个安装孔313之间的间距为2mm,可以使得两导线11之间的距离也为2mm,从而在与电路板50连接时,可以缩小两两导线11之间的连接间距,从而可以节约PCBA板的材料使用,进而有利于节约成本与环保。
为了使线材10与电路板50的连接更加稳固,每一导线11凸出于安装孔313的端部为连接端111,电路板50的表面设有与连接端111对应的固接端(未图示),每一连接端111焊接于一固接端。
本实施例中,每一导线11的连接端111即为除去绝缘层的导体,为保证连接端111与固接端连接方便,排卡30的每一安装部31的厚度不易过大。在排卡30插设于电路板50上时,每一连接端111就与正确的固接端对应起来,从而可直接对连接端111与固接端进行焊接,产品良率提高的同时生产效率也会较高。
为了使连接端111与固接端焊接更加稳固,在每一连接端111的外表面镀设有锡层。
本实施例中,连接端111与固接端的焊接方式为锡焊,锡焊是利用低熔点的金属焊料加热熔化后,渗入并充填金属件连接处间隙的焊接方法,故而,在连接端111的外表面镀设有锡层。该过程使用烙铁作为加热工具,在电路板50的固接端也镀设有锡,使用烙铁将锡熔化后,将连接端111与固接端连接牢固。
为适应各种不同的线材10,安装孔313的个数范围设为4~24,具体个数根据实际情况进行调节变化。具体地,安装孔313的排数可为单排、双排或者三排。
在一实施例中,当安装孔313的排数为双排时,排卡30可以设置上下两个相对的安装部31,凹槽33位于两个安装部31之间,此时,线材10中的至少一导线11穿设于一安装部31,至少有另一导11穿设于另一安装部31。
本实施例中,由于线材10可以同时连接于电路板50的两个表面,从而可以进一步节省电路板50的空间与材料,当然,这种情况需要电路板50为双面电路板。同时,该连接结构也使得线材10与电路板50的连接更加稳固。
以上所述仅为本发明的优选实施例,并非因此限制本发明的专利范围,凡是在本发明的发明构思下,利用本发明说明书及附图内容所作的等效结构变换,或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。

Claims (10)

  1. 一种连接结构,用于连接线材与电路板,其特征在于,该连接结构包括排卡,所述排卡平行于所述电路板的表面设有至少一安装部,所述线材连接于安装部的一端并于该安装部的另一端穿出,所述排卡面向电路板的表面还开设有一凹槽,所述电路板插设于所述凹槽,所述线材穿出安装部的一端连接于所述电路板的表面。
  2. 如权利要求1所述的连接结构,其特征在于,所述线材为数据线,该数据线包括若干导线,所述安装部包括本体及贯穿于所述本体的若干安装孔,每一导线贯穿一安装孔。
  3. 如权利要求2所述的连接结构,其特征在于,每两个所述安装孔之间的间距为2mm。
  4. 如权利要求2所述的连接结构,其特征在于,每一导线凸出于安装孔的端部为连接端,所述电路板的表面设有与连接端对应的固接端,每一连接端焊接于一固接端。
  5. 如权利要求4所述的连接结构,其特征在于,每一连接端的外表面镀设有锡层。
  6. 如权利要求1所述的连接结构,其特征在于,所述电路板为装配印刷电路板。
  7. 如权利要求2所述的连接结构,其特征在于,所述安装孔的个数为4~24。
  8. 如权利要求2所述的连接结构,其特征在于,所述安装孔的排数为单排、双排或者三排。
  9. 如权利要求2至8任一所述的连接结构,其特征在于,所述排卡设有二个相对设置的安装部,所述凹槽位于两个安装部之间。
  10. 如权利要求9所述的连接结构,至少一导线穿过一个安装部,至少另一导线穿过另一个安装部。
PCT/CN2017/085175 2017-04-26 2017-05-19 连接结构 WO2018196063A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201720454301.0U CN207265238U (zh) 2017-04-26 2017-04-26 连接结构
CN201720454301.0 2017-04-26

Publications (1)

Publication Number Publication Date
WO2018196063A1 true WO2018196063A1 (zh) 2018-11-01

Family

ID=61914847

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/085175 WO2018196063A1 (zh) 2017-04-26 2017-05-19 连接结构

Country Status (2)

Country Link
CN (1) CN207265238U (zh)
WO (1) WO2018196063A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112863738B (zh) * 2020-12-31 2022-12-13 株洲菲斯罗克光电科技股份有限公司 焊接线材、其制作方法及其与pcb板的焊接方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1930739A (zh) * 2004-02-02 2007-03-14 莫列斯公司 用于将电缆连接到电路板的电连接器
CN101682136A (zh) * 2007-06-06 2010-03-24 泰科电子公司 板卡边缘电缆连接器
CN201690102U (zh) * 2010-04-23 2010-12-29 贸联电子(昆山)有限公司 一种编线架
CN201797070U (zh) * 2010-08-26 2011-04-13 张方荣 一种印刷电路板的排线连接构造
CN205178060U (zh) * 2015-12-02 2016-04-20 深圳市金洋电子股份有限公司 一种线夹

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1930739A (zh) * 2004-02-02 2007-03-14 莫列斯公司 用于将电缆连接到电路板的电连接器
CN101682136A (zh) * 2007-06-06 2010-03-24 泰科电子公司 板卡边缘电缆连接器
CN201690102U (zh) * 2010-04-23 2010-12-29 贸联电子(昆山)有限公司 一种编线架
CN201797070U (zh) * 2010-08-26 2011-04-13 张方荣 一种印刷电路板的排线连接构造
CN205178060U (zh) * 2015-12-02 2016-04-20 深圳市金洋电子股份有限公司 一种线夹

Also Published As

Publication number Publication date
CN207265238U (zh) 2018-04-20

Similar Documents

Publication Publication Date Title
US4600256A (en) Condensed profile electrical connector
US20130231006A1 (en) Electrical connector incorporating curcuit elements
US8740631B2 (en) Electrical connector assembly
EP2197073B1 (en) High frequency circuit module
CN103490191B (zh) 设有usb连接器的电子设备
KR102229847B1 (ko) 리셉터클 커넥터
WO2018196063A1 (zh) 连接结构
CN106793453A (zh) 一种柔性电路板及移动终端
CN205609814U (zh) 连接器
CN203608454U (zh) 一种大尺寸对接生产的挠性印制电路板
CN211789647U (zh) 一种连接器及电子设备
TW201843892A (zh) 連接器
CN108173019A (zh) 通讯接口结构及电子设备
TW202046580A (zh) 電連接器、電連接器組件以及電連接器模組
CN104064896A (zh) 弯式连接器和连接器组件及通信组件
CN2932725Y (zh) 电连接器
WO2018049732A1 (zh) 排针
CN215073162U (zh) 一种拼接式电路板结构
CN215680273U (zh) 一种柔性热敏电阻
WO2018152974A1 (zh) 相互拼接并进行信号传输的电路板、led显示屏及led屏幕
CN219780477U (zh) 具有智能滤波消抖信号处理电路的嵌入式pcba板
CN213366840U (zh) 一种连接结构及设备
TWM623830U (zh) 高頻接地端子結構及卡緣連接器
US10673194B2 (en) Manufacturing method of connector structure
WO2023077646A1 (zh) 印制电路板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17907886

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17907886

Country of ref document: EP

Kind code of ref document: A1