WO2018181708A1 - Module - Google Patents

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Publication number
WO2018181708A1
WO2018181708A1 PCT/JP2018/013234 JP2018013234W WO2018181708A1 WO 2018181708 A1 WO2018181708 A1 WO 2018181708A1 JP 2018013234 W JP2018013234 W JP 2018013234W WO 2018181708 A1 WO2018181708 A1 WO 2018181708A1
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WO
WIPO (PCT)
Prior art keywords
component
wiring board
heat
module
resin layer
Prior art date
Application number
PCT/JP2018/013234
Other languages
French (fr)
Japanese (ja)
Inventor
喜孝 松川
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2019510121A priority Critical patent/JP6911917B2/en
Publication of WO2018181708A1 publication Critical patent/WO2018181708A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Definitions

  • the present invention relates to a module including a heat dissipation member.
  • modules mounted on portable terminal devices have a plurality of components including an IC mounted on a wiring board and the components are sealed with resin.
  • heat may be generated during use due to heat generated from the mounted components, and problems such as changes in the characteristics of the mounted components and malfunctions may occur.
  • a module having a heat dissipation mechanism has been proposed.
  • a semiconductor element 102 that is a heat generating component and a plurality of chip components 103 such as chip capacitors are mounted on a wiring board 101, and these mountings are performed.
  • Components semiconductor element 102 and a plurality of chip components 103 are sealed in sealing resin layer 104.
  • the upper surface 104 a of the sealing resin layer 104 is covered with a heat radiating conductor layer 105, and the upper surface 102 a of the semiconductor element 102 and the conductor layer 105 are connected by a plurality of conductive posts 106.
  • the semiconductor element 102 is mounted face-down as in the conventional module 100, since the heat generation area is the lower surface 102b on which the circuit is formed, the conductive post 106 is provided on the upper surface 102a away from the heat generation area. In the configuration of connecting and radiating heat, there is a possibility that heat radiation is not sufficiently performed.
  • the present invention has been made in view of the above-described problems, and an object thereof is to provide a module that can efficiently dissipate heat generated from a mounted component.
  • a module of the present invention includes a wiring board, a component mounted on the main surface of the wiring board, a heat dissipation member having a portion in contact with the component, and the main board of the wiring board.
  • a seal that seals the component and the heat dissipating member.
  • the seal includes a contact surface that contacts the surface, a facing surface that faces the contact surface, and a side surface that connects edges of the contact surface and the facing surface.
  • a first resin surface disposed opposite to the main surface of the wiring board; a second surface opposed to the first surface; the first surface and the second surface.
  • the heat radiation member is in contact with at least the side surface of the component.
  • the heat dissipating member since the heat dissipating member is in contact with the part close to the heat generation region of the part, the heat generated from the part can be efficiently dissipated.
  • the heat dissipation member may have a portion exposed from the facing surface of the sealing resin layer. According to this configuration, heat from the component can be radiated from the facing surface side of the sealing resin layer.
  • a shield film that covers the facing surface and the side surface of the sealing resin layer may be further provided, and the heat dissipation member may be connected to the shield film.
  • the heat generated from the components can be radiated from the shield film, the heat radiation characteristics of the module can be improved.
  • the heat radiating member and the shield film may both be made of a conductive material. According to this configuration, the heat dissipation characteristics of the module can be further improved.
  • the heat dissipation member may have a portion exposed from the contact surface of the sealing resin layer.
  • the heat dissipation member may be in contact with an electrode formed on the main surface of the wiring board, and the electrode may be connected to a ground electrode formed on the wiring board.
  • the heat dissipation member is connected to the ground electrode formed with a relatively large area, the heat dissipation characteristics of the heat dissipation member are improved.
  • the ground electrode is connected to a mother board on which the module is mounted. Therefore, the heat generated from the component can be released to the mother board via the ground electrode. Thereby, more efficient heat dissipation of the heat generated from the components can be achieved.
  • the shield film and the ground electrode are connected by a heat radiating member, the heat radiating member can be used as a conductor for grounding the shield film.
  • the heat radiating member may have a portion in contact with the second surface of the component. According to this structure, since the contact area of a heat radiating member and components increases, the heat radiating characteristic by a heat radiating member can be improved.
  • the heat dissipating member includes a plate-shaped portion that contacts the second surface of the component, and a surface of the plate-shaped portion that contacts the second surface of the component.
  • a plurality of legs extending in a direction, and the plurality of legs may be in contact with the side surface of the component.
  • the heat dissipation path to the wiring board side can be formed by the heat dissipation member. Further, since the component is not sealed with the heat radiating member, the sealing performance of the component by the sealing resin layer is improved.
  • the heat dissipating member since the heat dissipating member is in contact with the part close to the heat generating region of the part, the heat generated from the part can be efficiently dissipated.
  • FIG. 2 is a plan view of the module of FIG. 1 with a shield film removed. It is a figure for demonstrating the manufacturing method of the module of FIG. It is a figure which shows the modification of the heat radiating member of FIG. It is sectional drawing of the module concerning 2nd Embodiment of this invention. It is sectional drawing of the module concerning 3rd Embodiment of this invention. It is sectional drawing of the module concerning 4th Embodiment of this invention. It is sectional drawing of the module concerning 5th Embodiment of this invention. It is a perspective view of the heat radiating member of FIG. It is sectional drawing of the module concerning 6th Embodiment of this invention. It is sectional drawing of the conventional module.
  • FIGS. 1 is a cross-sectional view of the module 1a
  • FIG. 2 is a plan view of the module 1a with the shield film 6 removed
  • FIG. 3 is a view for explaining a method of manufacturing the module 1a. (F) shows each process.
  • a module 1a includes a wiring board 2 and a plurality of components 3a mounted on the upper surface 2a of the wiring board 2 (corresponding to the “main surface of the wiring board” of the present invention).
  • 3b the sealing resin layer 4 laminated on the upper surface 2a of the wiring substrate 2, the upper surface 4a and the side surface 4c of the sealing resin layer 4, and the shielding film 6 covering the side surface 2c of the wiring substrate 2,
  • it is mounted on a mother substrate of an electronic device using a high-frequency signal.
  • the wiring board 2 is formed by laminating a plurality of insulating layers made of, for example, a low-temperature co-fired ceramic or glass epoxy resin.
  • a mounting electrode 7a for mounting the components 3a and 3b and a surface layer electrode 7b (corresponding to an “electrode” in the present invention) connected to the heat radiating member 5a are formed on the upper surface 2a of the wiring board 2, a mounting electrode 7a for mounting the components 3a and 3b and a surface layer electrode 7b (corresponding to an “electrode” in the present invention) connected to the heat radiating member 5a are formed.
  • the surface layer electrode 7b is positioned so as to overlap the heat radiating member 5a when viewed from a direction perpendicular to the upper surface 2a of the wiring board 2, and has the same shape as the heat radiating member 5a and has a rectangular outline and surrounds the component 3a. It is formed into a shape.
  • a plurality of external electrodes (not shown) for external connection are formed on the lower surface 2 b of the wiring board 2.
  • Various internal wiring electrodes 8 are formed between adjacent insulating layers, and a plurality of via conductors for connecting the internal wiring electrodes 8 formed in different insulating layers to each other inside the wiring board 2. (Not shown) is formed.
  • the mounting electrode 7a, the surface layer electrode 7b, the external electrode, and the internal wiring electrode 8 are all made of a metal generally adopted as a wiring electrode such as Cu, Ag, or Al. Each via conductor is formed of a metal such as Ag or Cu. Each mounting electrode 7a, surface layer electrode 7b, and external electrode may be plated with Ni / Au.
  • the components 3a and 3b are composed of semiconductor elements formed of a semiconductor such as Si or GaAs, and chip components such as a chip inductor, a chip capacitor, and a chip resistor.
  • the wiring board 2 is formed by a general surface mounting technique such as solder bonding.
  • the component 3a (corresponding to the “component” of the present invention) surrounded by the heat radiating member 5a is constituted by a semiconductor element which is a heat-generating component, and the component 3b is formed by a chip capacitor.
  • the component 3a has a circuit formed on the lower surface 3a2 (corresponding to the “first surface of the component” of the present invention) and is flip-chip mounted face down.
  • the sealing resin layer 4 is laminated on the wiring board 2 so as to cover the components 3a and 3b and the heat dissipation member 5a.
  • the sealing resin layer 4 can be formed of a resin that is generally employed as a sealing resin such as an epoxy resin.
  • the upper surface 4a of the sealing resin layer 4 corresponds to the “opposing surface of the sealing resin layer” of the present invention, and the lower surface 4b corresponds to the “abutting surface of the sealing resin layer” of the present invention.
  • the heat dissipating member 5a is formed of, for example, a conductive paste mainly composed of Ag or Cu, and when viewed from a direction perpendicular to the upper surface 2a of the wiring board 2, the component 3a formed of a semiconductor element. Is disposed in the sealing resin layer 4 so as to surround the. Specifically, the heat dissipation member 5a is formed in a rectangular tube shape, and the inner side surface 5a1 is in contact with all four side surfaces 3a3 of the component 3a. Further, the upper end of the heat radiation member 5 a in the thickness direction of the sealing resin layer 4 is exposed from the upper surface 4 a of the sealing resin layer 4 and is connected to the shield film 6.
  • the lower end of the heat radiation member 5a in the thickness direction of the sealing resin layer 4 is exposed from the lower surface 4b of the sealing resin layer 4 and connected to the surface layer electrode 7b.
  • the surface layer electrode 7b is connected to an internal wiring electrode 8 (ground electrode (not shown)) formed on the wiring substrate 2, and the heat radiation member 5a is connected to the surface layer electrode 7b. Grounding is possible.
  • the shield film 6 can be formed, for example, in a multilayer structure having an adhesion film, a conductive film laminated on the adhesion film, and a protective film laminated on the conductive film.
  • the adhesion film is provided to increase the adhesion strength between the conductive film and the sealing resin layer 4 and can be formed of a metal such as SUS, for example.
  • the conductive film is a layer that bears the substantial shielding function of the shield film 6 and can be formed of, for example, any one of Cu, Ag, and Al.
  • the protective film is provided to prevent the conductive film from being corroded or scratched, and can be formed of, for example, SUS.
  • solder paste application method examples include a printing method using a metal mask, a dispenser method, and the like.
  • the components 3a and 3b are mounted at predetermined positions on the upper surface 2a of the wiring board 2 by a component mounting apparatus such as a mounter, and then soldered in a reflow furnace. After soldering, it is preferable to perform flux cleaning.
  • a sealing resin layer 4 is formed on the upper surface 2 a of the wiring board 2.
  • Examples of the method for forming the sealing resin layer 4 include a dispensing method, a printing method, and a compression mold method.
  • a groove 9 for disposing the heat radiating member 5 a is formed in the sealing resin layer 4.
  • the groove 9 is formed so that the side surface 3a3 of the component 3a is exposed from the sealing resin layer 4.
  • Examples of the groove forming method include laser processing, router processing, and dicing.
  • the groove 9 is filled with a conductive paste mainly composed of Ag or Cu, and cured to form the heat radiating member 5a.
  • a conductive paste mainly composed of Ag or Cu is filled with a conductive paste mainly composed of Ag or Cu, and cured to form the heat radiating member 5a.
  • the shield film 6 covering the upper surface 4a and the side surface 4c of the sealing resin layer 4 and the side surface 2c of the wiring board 2 is formed, and the module 1a is completed.
  • the shield film 6 can be obtained by, for example, forming an adhesion film, a conductive film, and a protective film in this order by sputtering or vacuum deposition, respectively.
  • the heat radiating member 5a is in contact with the side surface 3a3 close to the lower surface 3a2 that is the heat generation region of the component 3a, the upper surface 3a1 of the component 3a (the “second surface of the component” of the present invention).
  • the heat generated from the component 3a can be efficiently radiated as compared with the configuration in which the heat radiating member is in contact with Further, since the entire surface of the side surface 3a3 of the component 3a is in contact with the heat radiating member 5a, heat can be radiated more efficiently.
  • the heat radiating member 5 a is connected to the shield film 6, heat generated from the component 3 a is transmitted to the shield film 6 and can be radiated to the outside air through the shield film 6. Further, since the heat dissipating member 5a is also connected to the surface layer electrode 7b formed on the wiring board 2, the heat generated from the component 3a can be dissipated from the wiring board 2 side having many conductors such as the internal wiring electrode 8. Can do. In addition, when heat is radiated to the mother substrate side on which the module 1a is mounted, the heat radiation path is shortened, so that efficient heat radiation is possible.
  • the internal wiring electrode 8 (ground electrode) of the wiring board 2 and the shield film 6 are connected via the heat radiating member 5a.
  • the connection resistance between the shield film 6 and the internal wiring electrode 8 can be reduced as compared with the configuration in which the internal wiring electrode 8 (ground electrode) is exposed from the side surface 2 c of the wiring substrate 2 and connected to the shield film 6.
  • the heat radiating member 5a can be used as a shield for the component 3a, and the shielding characteristics for the component 3a are improved.
  • the heat radiating member 5a is formed in a rectangular tube shape, and the entire surface of the four side surfaces 3a3 of the component 3a is in contact with the heat radiating member 5a.
  • the structure which contacts may be sufficient.
  • two plate-like heat radiating members 5b may be formed so as to contact only two opposing side surfaces 3a3 among the four side surfaces 3a3 of the component 3a.
  • a plurality of columnar heat radiating members 5c are erected on the wiring board 2 so as to surround the component 3a, and a part of the peripheral side surface of each heat radiating member 5c is part 3a. It may be in contact with the side surface 3a3.
  • FIGS. 4A and 4B are diagrams showing modifications of the heat radiating member, and correspond to FIG.
  • FIG. 5 is a cross-sectional view of the module 1b.
  • the module 1b according to this embodiment differs from the module 1a according to the first embodiment described with reference to FIGS. 1 to 3 in that the configuration of the heat dissipating member is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
  • the heat dissipating member 5d of this embodiment has a portion 5d1 that abuts on the upper surface 3a1 of the component 3a (hereinafter also referred to as the upper surface abutting portion 5d1) in addition to the configuration of the heat dissipating member 5a of the first embodiment.
  • a conductive paste is applied to the upper surface 3a1 of the component 3a to form the upper surface contact portion 5d1, and after forming the sealing resin layer 4 in this state,
  • the remaining part of the heat radiating member 5d is formed by the same method as the method of forming the heat radiating member 5a of the first embodiment.
  • FIG. 6 is a cross-sectional view of the module 1c.
  • the module 1c according to this embodiment differs from the module 1a of the first embodiment described with reference to FIGS. 1 to 3 in that the configuration of the heat dissipating member is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
  • the heat dissipating member 5e of this embodiment is formed so that the upper end is substantially the same height as the upper surface 3a1 of the component 3a, and the heat dissipating member 5e is not exposed from the upper surface 4a of the sealing resin layer 4.
  • a heat dissipation member 5e can be formed, for example, by forming the sealing resin layer 4 in two stages. Specifically, after mounting the components 3a and 3b, the components 3a and 3b are sealed with an epoxy resin (first-stage sealing resin layer), and then the upper surface of the sealing resin layer is polished or ground. The upper surface 3a1 of 3a is exposed.
  • a groove is formed so that the four side surfaces 3a3 of the component 3a are exposed, and the heat dissipation member 5e is filled with a conductive paste in the groove.
  • the sealing resin layer 4 is completed by laminating the sealing resin layer of the second stage on the sealing resin layer of the first stage.
  • the heat generated from the component 3a can be efficiently radiated to the wiring board 2 side.
  • FIG. 7 is a cross-sectional view of the module 1d.
  • the module 1d according to this embodiment is different from the module 1a according to the first embodiment described with reference to FIGS. 1 to 3 in that the configuration of the heat dissipating member is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
  • the heat dissipating member 5f of this embodiment is different from the heat dissipating member 5a of the first embodiment in that the lower end is not exposed from the lower surface 4b of the sealing resin layer 4.
  • the heat radiating member 5f is formed in substantially the same manner as the heat radiating member 5a of the first embodiment, but the groove 9 (see FIG. 3) filled with the conductive paste reaches the lower surface 3a2 of the component 3a. 7b is formed with a depth not exposed.
  • the heat generated from the component 3a can be efficiently radiated to the outside air through the shield film 6.
  • FIGS. 8 is a cross-sectional view of the module 1e
  • FIG. 9 is a perspective view of the heat dissipation member 5g.
  • the module 1e according to this embodiment is different from the module 1a of the first embodiment described with reference to FIGS. 1 to 3 in that the configuration of the heat dissipating member is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
  • the heat radiating member 5g of this embodiment includes a plate-like portion 5g1 (hereinafter referred to as a plate-like portion 5g1) that contacts the upper surface 3a1 of the component 3a, and a component of the plate-like portion 5g1. And a plurality of (four in this embodiment) leg portions 5g2 extending in the direction of the upper surface 2a of the wiring board 2 from the contact surface of the 3a with the upper surface 3a1.
  • the plate-like portion 5g1 is formed in a rectangular shape, and leg portions 5g2 are arranged at the four corners of the plate-like portion 5g1, and the tip portions of the leg portions 5g2 are connected to the surface layer electrodes 7b of the wiring board 2 by soldering.
  • the plate-like portion 5g1 is in contact with the upper surface 3a1 of the component 3a, and the four leg portions 5g2 are in contact with the side surface 3a3 of the component 3a, so that the heat radiating member 5g is disposed so as to cover the component 3a.
  • the heat radiating member 5g can be formed, for example, by bending a plate-shaped metal plate.
  • the heat radiation member 5g can form a heat radiation path for radiating the heat generated from the component 3a to the wiring board 2 side. Moreover, since the heat radiating member 5g is shaped to cover the component 3a, there is a gap between the leg portions 5g2, so even if the sealing resin layer 4 is formed after the heat radiating member 5g is mounted on the wiring board 2, Since the resin of the sealing resin layer 4 can be easily filled between the lower surface 3a2 of the component 3a and the upper surface 2a of the wiring board 2, the sealing performance of the component 3a is improved.
  • FIG. 10 is a cross-sectional view of the module 1f.
  • the module 1f according to this embodiment is different from the module 1a of the first embodiment described with reference to FIGS. 1 to 3 in that the arrangement of the component 3a and the heat dissipating member 5a is different as shown in FIG. It is. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
  • the component 3 a is disposed near the periphery of the upper surface 2 a of the wiring board 2, and a part of the outer surface 5 a 2 of the heat radiating member 5 a is exposed from the side surface 4 c of the sealing resin layer 4 and contacts the shield film 6. is doing.
  • the number of insulating layers and wiring layers constituting the wiring board 2 can be changed as appropriate.
  • the present invention can be applied to various modules including a sealing resin layer that covers a component mounted on a wiring board and a heat dissipation member that dissipates heat generated from the component.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Provided is a module which is capable of efficiently dissipating heat that is generated by a mounted component. A module 1a according to the present invention is provided with: a wiring board 2; a component 3a which is mounted on an upper surface 2a of the wiring board 2; a heat dissipation member 5a having a portion that is in contact with the component 3a; and a sealing resin layer 4 which is laminated on the upper surface 2a of the wiring board 2 so as to seal the component 3a and the heat dissipation member 5a. Incidentally, the heat dissipation member 5a is formed into a square tube; and an inner lateral surface 5a1 is in contact with a lateral surface 3a3 of the component 3a. In addition, the upper end of the heat dissipation member 5a is exposed from an upper surface 4a of the sealing resin layer 4 and is connected to a shield film 6, while the lower end is connected to a surface layer electrode 7b of the wiring board 2.

Description

モジュールmodule
　本発明は、放熱部材を備えるモジュールに関する。 The present invention relates to a module including a heat dissipation member.
　携帯端末装置などに搭載されるモジュールには、配線基板にＩＣを含む複数の部品が実装され、該部品が樹脂で封止されたものがある。この種のモジュールでは、実装部品などからの発熱により使用時に高温となる場合があり、実装部品の特性が変化したり、誤動作が生じたりするなどの不具合が生じる場合がある。そこで、従来、放熱機構を備えたモジュールが提案されている。例えば、図１１に示すように、特許文献１に記載のモジュール１００では、配線基板１０１に、発熱部品である半導体素子１０２と、チップコンデンサなどの複数のチップ部品１０３とが実装され、これらの実装部品（半導体素子１０２、複数のチップ部品１０３）が封止樹脂層１０４に封止される。また、封止樹脂層１０４の上面１０４ａは、放熱用の導体層１０５で被覆され、半導体素子１０２の上面１０２ａと導体層１０５とが複数の導電性ポスト１０６で接続されている。 Some modules mounted on portable terminal devices have a plurality of components including an IC mounted on a wiring board and the components are sealed with resin. In this type of module, heat may be generated during use due to heat generated from the mounted components, and problems such as changes in the characteristics of the mounted components and malfunctions may occur. Thus, conventionally, a module having a heat dissipation mechanism has been proposed. For example, as shown in FIG. 11, in the module 100 described in Patent Document 1, a semiconductor element 102 that is a heat generating component and a plurality of chip components 103 such as chip capacitors are mounted on a wiring board 101, and these mountings are performed. Components (semiconductor element 102 and a plurality of chip components 103) are sealed in sealing resin layer 104. The upper surface 104 a of the sealing resin layer 104 is covered with a heat radiating conductor layer 105, and the upper surface 102 a of the semiconductor element 102 and the conductor layer 105 are connected by a plurality of conductive posts 106.
特許第５１９５９０３号公報（段落００５３～００５５、図１１等参照）Japanese Patent No. 5195903 (see paragraphs 0053 to 0055, FIG. 11, etc.)
　しかしながら、従来のモジュール１００のように、半導体素子１０２がフェイスダウンで実装された場合は、発熱領域は回路が形成された下面１０２ｂであるため、発熱領域から離れた上面１０２ａに導電性ポスト１０６を接続させて放熱する構成では、放熱が十分に行われないおそれがある。 However, when the semiconductor element 102 is mounted face-down as in the conventional module 100, since the heat generation area is the lower surface 102b on which the circuit is formed, the conductive post 106 is provided on the upper surface 102a away from the heat generation area. In the configuration of connecting and radiating heat, there is a possibility that heat radiation is not sufficiently performed.
　本発明は、上記した課題に鑑みてなされたものであり、実装部品から発熱した熱を効率よく放熱することができるモジュールを提供することを目的とする。 The present invention has been made in view of the above-described problems, and an object thereof is to provide a module that can efficiently dissipate heat generated from a mounted component.
　上記した目的を達成するために、本発明のモジュールは、配線基板と、前記配線基板の主面に実装された部品と、前記部品と接触する部分を有する放熱部材と、前記配線基板の前記主面に当接する当接面と、該当接面に対向する対向面と、前記当接面と前記対向面の端縁同士を繋ぐ側面とを有し、前記部品および前記放熱部材を封止する封止樹脂層とを備え、前記部品は、前記配線基板の主面に対向して配置される第１面と、該第１面に対向する第２面と、前記第１面と前記第２面の端縁同士を繋ぐ側面とを有し、前記放熱部材は、少なくとも前記部品の前記側面に接触していることを特徴としている。 In order to achieve the above object, a module of the present invention includes a wiring board, a component mounted on the main surface of the wiring board, a heat dissipation member having a portion in contact with the component, and the main board of the wiring board. A seal that seals the component and the heat dissipating member. The seal includes a contact surface that contacts the surface, a facing surface that faces the contact surface, and a side surface that connects edges of the contact surface and the facing surface. A first resin surface disposed opposite to the main surface of the wiring board; a second surface opposed to the first surface; the first surface and the second surface. And the heat radiation member is in contact with at least the side surface of the component.
　この構成によれば、放熱部材が、部品の発熱領域に近接した箇所に接しているため、部品から発生した熱を効率よく放熱することができる。 According to this configuration, since the heat dissipating member is in contact with the part close to the heat generation region of the part, the heat generated from the part can be efficiently dissipated.
　また、前記放熱部材は、前記封止樹脂層の前記対向面から露出している部分があってもよい。この構成によれば、部品からの熱を封止樹脂層の対向面側から放熱することができる。 Further, the heat dissipation member may have a portion exposed from the facing surface of the sealing resin layer. According to this configuration, heat from the component can be radiated from the facing surface side of the sealing resin layer.
　また、前記封止樹脂層の前記対向面および前記側面を被覆するシールド膜をさらに備え、前記放熱部材が、前記シールド膜に接続されていてもよい。 Further, a shield film that covers the facing surface and the side surface of the sealing resin layer may be further provided, and the heat dissipation member may be connected to the shield film.
　この構成によれば、部品から発生する熱をシールド膜から放熱することができるため、モジュールの放熱特性を向上させることができる。 According to this configuration, since the heat generated from the components can be radiated from the shield film, the heat radiation characteristics of the module can be improved.
　前記放熱部材および前記シールド膜が、いずれも導電性材料で構成されていてもよい。この構成によれば、モジュールの放熱特性をさらに向上させることができる。 The heat radiating member and the shield film may both be made of a conductive material. According to this configuration, the heat dissipation characteristics of the module can be further improved.
　また、前記放熱部材は、前記封止樹脂層の前記当接面から露出している部分があってもよい。 Further, the heat dissipation member may have a portion exposed from the contact surface of the sealing resin layer.
　この構成によれば、放熱部材と配線基板が接触するため、部品から発生した熱を放熱部材を介して配線基板側に放熱することができる。 According to this configuration, since the heat radiating member and the wiring board are in contact, heat generated from the components can be radiated to the wiring board side through the heat radiating member.
　また、前記放熱部材は、前記配線基板の前記主面に形成された電極に接触し、前記電極が、前記配線基板に形成されたグランド電極に接続されていてもよい。 The heat dissipation member may be in contact with an electrode formed on the main surface of the wiring board, and the electrode may be connected to a ground electrode formed on the wiring board.
　この構成によれば、放熱部材が、比較的大面積で形成されるグランド電極に接続されるため、放熱部材による放熱特性が向上する。また、通常、グランド電極は、モジュールが実装されるマザー基板に接続される。そのため、部品から発生した熱をグランド電極を介してマザー基板に放出できる。これにより、部品から発生した熱のより効率的な放熱が可能となる。また、シールド膜とグランド電極とが放熱部材により接続される場合は、放熱部材をシールド膜を接地するための導体として利用できる。 According to this configuration, since the heat dissipation member is connected to the ground electrode formed with a relatively large area, the heat dissipation characteristics of the heat dissipation member are improved. Further, normally, the ground electrode is connected to a mother board on which the module is mounted. Therefore, the heat generated from the component can be released to the mother board via the ground electrode. Thereby, more efficient heat dissipation of the heat generated from the components can be achieved. Further, when the shield film and the ground electrode are connected by a heat radiating member, the heat radiating member can be used as a conductor for grounding the shield film.
　また、前記放熱部材は、前記部品の前記第２面に接触する部分があってもよい。この構成によれば、放熱部材と部品との接触面積が増えるため、放熱部材による放熱特性を向上させることができる。 Further, the heat radiating member may have a portion in contact with the second surface of the component. According to this structure, since the contact area of a heat radiating member and components increases, the heat radiating characteristic by a heat radiating member can be improved.
　また、前記放熱部材は、前記部品の前記第２面に当接する板状の部分と、前記板状の部分の前記部品の前記第２面に当接する面から、前記配線基板の前記主面の方向に延在する複数の脚部とを有し、前記複数の脚部は、前記部品の前記側面に接触していてもよい。 The heat dissipating member includes a plate-shaped portion that contacts the second surface of the component, and a surface of the plate-shaped portion that contacts the second surface of the component. A plurality of legs extending in a direction, and the plurality of legs may be in contact with the side surface of the component.
　この構成によれば、放熱部材により、配線基板側への放熱経路を形成することができる。また、部品が放熱部材で密封されないため、封止樹脂層による部品の封止性が向上する。 According to this configuration, the heat dissipation path to the wiring board side can be formed by the heat dissipation member. Further, since the component is not sealed with the heat radiating member, the sealing performance of the component by the sealing resin layer is improved.
　本発明によれば、放熱部材が、部品の発熱領域に近接した箇所に接しているため、部品から発生した熱を効率よく放熱することができる。 According to the present invention, since the heat dissipating member is in contact with the part close to the heat generating region of the part, the heat generated from the part can be efficiently dissipated.
本発明の第１実施形態にかかるモジュールの断面図である。It is sectional drawing of the module concerning 1st Embodiment of this invention. 図１のモジュールのシールド膜を除いた状態の平面図である。FIG. 2 is a plan view of the module of FIG. 1 with a shield film removed. 図１のモジュールの製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the module of FIG. 図１の放熱部材の変形例を示す図である。It is a figure which shows the modification of the heat radiating member of FIG. 本発明の第２実施形態にかかるモジュールの断面図である。It is sectional drawing of the module concerning 2nd Embodiment of this invention. 本発明の第３実施形態にかかるモジュールの断面図である。It is sectional drawing of the module concerning 3rd Embodiment of this invention. 本発明の第４実施形態にかかるモジュールの断面図である。It is sectional drawing of the module concerning 4th Embodiment of this invention. 本発明の第５実施形態にかかるモジュールの断面図である。It is sectional drawing of the module concerning 5th Embodiment of this invention. 図８の放熱部材の斜視図である。It is a perspective view of the heat radiating member of FIG. 本発明の第６実施形態にかかるモジュールの断面図である。It is sectional drawing of the module concerning 6th Embodiment of this invention. 従来のモジュールの断面図である。It is sectional drawing of the conventional module.
　＜第１実施形態＞
　本発明の第１実施形態にかかるモジュール１ａについて、図１～図３を参照して説明する。なお、図１はモジュール１ａの断面図、図２はシールド膜６を除いた状態のモジュール１ａの平面図、図３はモジュール１ａの製造方法を説明するための図であって、（ａ）～（ｆ）はその各工程を示す。 <First Embodiment>
The module 1a according to the first embodiment of the present invention will be described with reference to FIGS. 1 is a cross-sectional view of the module 1a, FIG. 2 is a plan view of the module 1a with the shield film 6 removed, and FIG. 3 is a view for explaining a method of manufacturing the module 1a. (F) shows each process.
　この実施形態にかかるモジュール１ａは、図１に示すように、配線基板２と、該配線基板２の上面２ａ（本発明の「配線基板の主面」に相当）に実装された複数の部品３ａ、３ｂと、配線基板２の上面２ａに積層された封止樹脂層４と、封止樹脂層４の上面４ａおよび側面４ｃと、配線基板２の側面２ｃとを被覆するシールド膜６と、封止樹脂層４内に設けられた放熱部材５ａとを備え、例えば、高周波信号が用いられる電子機器のマザー基板等に搭載される。 As shown in FIG. 1, a module 1a according to this embodiment includes a wiring board 2 and a plurality of components 3a mounted on the upper surface 2a of the wiring board 2 (corresponding to the “main surface of the wiring board” of the present invention). 3b, the sealing resin layer 4 laminated on the upper surface 2a of the wiring substrate 2, the upper surface 4a and the side surface 4c of the sealing resin layer 4, and the shielding film 6 covering the side surface 2c of the wiring substrate 2, For example, it is mounted on a mother substrate of an electronic device using a high-frequency signal.
　配線基板２は、例えば、低温同時焼成セラミックやガラスエポキシ樹脂などで形成された複数の絶縁層が積層されて成る。配線基板２の上面２ａには、各部品３ａ，３ｂの実装用の実装電極７ａや、放熱部材５ａに接続される表層電極７ｂ（本発明の「電極」に相当）が形成される。表層電極７ｂは、配線基板２の上面２ａに対して垂直な方向から見たときに、放熱部材５ａと重なる位置であって、放熱部材５ａと略同形状の、輪郭が矩形で部品３ａを囲む形状に形成される。配線基板２の下面２ｂには、外部接続用の複数の外部電極（図示省略）が形成される。また、隣接する絶縁層間それぞれに、各種の内部配線電極８が形成されるとともに、配線基板２の内部には、異なる絶縁層に形成された内部配線電極８同士を接続するための複数のビア導体（図示省略）が形成される。 The wiring board 2 is formed by laminating a plurality of insulating layers made of, for example, a low-temperature co-fired ceramic or glass epoxy resin. On the upper surface 2a of the wiring board 2, a mounting electrode 7a for mounting the components 3a and 3b and a surface layer electrode 7b (corresponding to an “electrode” in the present invention) connected to the heat radiating member 5a are formed. The surface layer electrode 7b is positioned so as to overlap the heat radiating member 5a when viewed from a direction perpendicular to the upper surface 2a of the wiring board 2, and has the same shape as the heat radiating member 5a and has a rectangular outline and surrounds the component 3a. It is formed into a shape. A plurality of external electrodes (not shown) for external connection are formed on the lower surface 2 b of the wiring board 2. Various internal wiring electrodes 8 are formed between adjacent insulating layers, and a plurality of via conductors for connecting the internal wiring electrodes 8 formed in different insulating layers to each other inside the wiring board 2. (Not shown) is formed.
　なお、実装電極７ａ、表層電極７ｂ、外部電極および内部配線電極８は、いずれもＣｕやＡｇ、Ａｌ等の配線電極として一般的に採用される金属で形成されている。また、各ビア導体は、ＡｇやＣｕ等の金属で形成されている。なお、各実装電極７ａ、表層電極７ｂ、外部電極には、Ｎｉ／Ａｕめっきがそれぞれ施されていてもよい。 The mounting electrode 7a, the surface layer electrode 7b, the external electrode, and the internal wiring electrode 8 are all made of a metal generally adopted as a wiring electrode such as Cu, Ag, or Al. Each via conductor is formed of a metal such as Ag or Cu. Each mounting electrode 7a, surface layer electrode 7b, and external electrode may be plated with Ni / Au.
　部品３ａ，３ｂは、ＳｉやＧａＡｓ等の半導体で形成された半導体素子や、チップインダクタ、チップコンデンサ、チップ抵抗等のチップ部品で構成され、半田接合などの一般的な表面実装技術により配線基板２に実装される。この実施形態では、放熱部材５ａで囲まれた部品３ａ（本発明の「部品」に相当）は、発熱部品である半導体素子で構成され、部品３ｂがチップコンデンサで形成されている。なお、部品３ａは、下面３ａ２（本発明の「部品の第１面」に相当）に回路が形成されており、フェイスダウンでフリップチップ実装されている。 The components 3a and 3b are composed of semiconductor elements formed of a semiconductor such as Si or GaAs, and chip components such as a chip inductor, a chip capacitor, and a chip resistor. The wiring board 2 is formed by a general surface mounting technique such as solder bonding. To be implemented. In this embodiment, the component 3a (corresponding to the “component” of the present invention) surrounded by the heat radiating member 5a is constituted by a semiconductor element which is a heat-generating component, and the component 3b is formed by a chip capacitor. The component 3a has a circuit formed on the lower surface 3a2 (corresponding to the “first surface of the component” of the present invention) and is flip-chip mounted face down.
　封止樹脂層４は、各部品３ａ，３ｂおよび放熱部材５ａを被覆して配線基板２に積層される。封止樹脂層４は、エポキシ樹脂等の封止樹脂として一般的に採用される樹脂で形成することができる。なお、封止樹脂層４の上面４ａが、本発明の「封止樹脂層の対向面」に相当し、下面４ｂが、本発明の「封止樹脂層の当接面」に相当する。 The sealing resin layer 4 is laminated on the wiring board 2 so as to cover the components 3a and 3b and the heat dissipation member 5a. The sealing resin layer 4 can be formed of a resin that is generally employed as a sealing resin such as an epoxy resin. The upper surface 4a of the sealing resin layer 4 corresponds to the “opposing surface of the sealing resin layer” of the present invention, and the lower surface 4b corresponds to the “abutting surface of the sealing resin layer” of the present invention.
　放熱部材５ａは、例えば、ＡｇやＣｕを主成分とする導電性ペーストで形成されており、配線基板２の上面２ａに対して垂直な方向から見たときに、半導体素子で構成された部品３ａを囲むように封止樹脂層４内に配設される。具体的には、放熱部材５ａは、角筒状に形成されており、内側面５ａ１が部品３ａの４つの側面３ａ３全てに当接している。また、放熱部材５ａにおける封止樹脂層４の厚み方向の上端が、封止樹脂層４の上面４ａから露出し、シールド膜６に接続される。一方、放熱部材５ａにおける封止樹脂層４の厚み方向の下端が、封止樹脂層４の下面４ｂから露出して、表層電極７ｂに接続される。なお、表層電極７ｂは、配線基板２に形成された内部配線電極８（グランド電極（図示省略））に接続されており、放熱部材５ａが表層電極７ｂに接続されることにより、シールド膜６の接地が可能となっている。 The heat dissipating member 5a is formed of, for example, a conductive paste mainly composed of Ag or Cu, and when viewed from a direction perpendicular to the upper surface 2a of the wiring board 2, the component 3a formed of a semiconductor element. Is disposed in the sealing resin layer 4 so as to surround the. Specifically, the heat dissipation member 5a is formed in a rectangular tube shape, and the inner side surface 5a1 is in contact with all four side surfaces 3a3 of the component 3a. Further, the upper end of the heat radiation member 5 a in the thickness direction of the sealing resin layer 4 is exposed from the upper surface 4 a of the sealing resin layer 4 and is connected to the shield film 6. On the other hand, the lower end of the heat radiation member 5a in the thickness direction of the sealing resin layer 4 is exposed from the lower surface 4b of the sealing resin layer 4 and connected to the surface layer electrode 7b. Note that the surface layer electrode 7b is connected to an internal wiring electrode 8 (ground electrode (not shown)) formed on the wiring substrate 2, and the heat radiation member 5a is connected to the surface layer electrode 7b. Grounding is possible.
　シールド膜６は、例えば、密着膜と、密着膜に積層された導電膜と、導電膜に積層された保護膜とを有する多層構造で形成することができる。密着膜は、導電膜と封止樹脂層４との密着強度を高めるために設けられたものであり、例えば、ＳＵＳなどの金属で形成することができる。導電膜は、シールド膜６の実質的なシールド機能を担う層であり、例えば、Ｃｕ、Ａｇ、Ａｌのうちのいずれかの金属で形成することができる。保護膜は、導電膜が腐食したり、傷が付いたりするのを防止するために設けられたものであり、例えば、ＳＵＳで形成することができる。 The shield film 6 can be formed, for example, in a multilayer structure having an adhesion film, a conductive film laminated on the adhesion film, and a protective film laminated on the conductive film. The adhesion film is provided to increase the adhesion strength between the conductive film and the sealing resin layer 4 and can be formed of a metal such as SUS, for example. The conductive film is a layer that bears the substantial shielding function of the shield film 6 and can be formed of, for example, any one of Cu, Ag, and Al. The protective film is provided to prevent the conductive film from being corroded or scratched, and can be formed of, for example, SUS.
　（モジュール１ａの製造方法）
　次に、図３を参照して、モジュール１ａの製造方法の一例について説明する。 (Manufacturing method of module 1a)
Next, an example of a method for manufacturing the module 1a will be described with reference to FIG.
　まず、図３（ａ）に示すように、各種内部配線電極８や実装電極７ａ、表層電極７ｂ、外部電極等が形成された配線基板２を準備し、実装電極７ａに半田ペーストを塗布する。半田ペーストの塗布方法としては、例えば、メタルマスクを用いた印刷方式、ディスペンサ方式などがある。 First, as shown in FIG. 3A, a wiring board 2 on which various internal wiring electrodes 8, mounting electrodes 7a, surface layer electrodes 7b, external electrodes and the like are formed is prepared, and solder paste is applied to the mounting electrodes 7a. Examples of the solder paste application method include a printing method using a metal mask, a dispenser method, and the like.
　次に、図３（ｂ）に示すように、マウンターなどの部品搭載装置により、配線基板２の上面２ａの所定位置に各部品３ａ，３ｂを搭載した後、リフロー炉にて半田接合を行う。半田接合後は、フラックス洗浄を行うのが好ましい。 Next, as shown in FIG. 3B, the components 3a and 3b are mounted at predetermined positions on the upper surface 2a of the wiring board 2 by a component mounting apparatus such as a mounter, and then soldered in a reflow furnace. After soldering, it is preferable to perform flux cleaning.
　次に、図３（ｃ）に示すように、配線基板２の上面２ａに封止樹脂層４を形成する。封止樹脂層４の形成方法としては、ディスペンス方式、印刷方式、コンプレッションモールド方式などがある。 Next, as shown in FIG. 3C, a sealing resin layer 4 is formed on the upper surface 2 a of the wiring board 2. Examples of the method for forming the sealing resin layer 4 include a dispensing method, a printing method, and a compression mold method.
　次に、図３（ｄ）に示すように、封止樹脂層４に放熱部材５ａを配設するための溝９を形成する。このとき、封止樹脂層４から部品３ａの側面３ａ３が露出するような溝９を形成する。溝の形成方法としては、例えば、レーザ加工、ルータ加工、ダイシングなどがある。 Next, as shown in FIG. 3 (d), a groove 9 for disposing the heat radiating member 5 a is formed in the sealing resin layer 4. At this time, the groove 9 is formed so that the side surface 3a3 of the component 3a is exposed from the sealing resin layer 4. Examples of the groove forming method include laser processing, router processing, and dicing.
　次に、図３（ｅ）に示すように、溝９にＡｇやＣｕを主成分とする導電性ペーストを充填し、これを硬化させることにより放熱部材５ａを形成する。これにより、放熱部材５ａの内側面５ａ１が部品３ａの側面３ａ３に当接した状態となる。 Next, as shown in FIG. 3 (e), the groove 9 is filled with a conductive paste mainly composed of Ag or Cu, and cured to form the heat radiating member 5a. Thereby, the inner surface 5a1 of the heat radiating member 5a comes into contact with the side surface 3a3 of the component 3a.
　次に、図３（ｆ）に示すように、封止樹脂層４の上面４ａおよび側面４ｃ、および、配線基板２の側面２ｃを被覆するシールド膜６を形成して、モジュール１ａが完成する。シールド膜６は、例えば、それぞれスパッタ法や真空蒸着法により、密着膜、導電膜、保護膜の順に成膜することで得ることができる。 Next, as shown in FIG. 3F, the shield film 6 covering the upper surface 4a and the side surface 4c of the sealing resin layer 4 and the side surface 2c of the wiring board 2 is formed, and the module 1a is completed. The shield film 6 can be obtained by, for example, forming an adhesion film, a conductive film, and a protective film in this order by sputtering or vacuum deposition, respectively.
　したがって、上記した実施形態によれば、放熱部材５ａが、部品３ａの発熱領域である下面３ａ２に近い側面３ａ３に接しているため、部品３ａの上面３ａ１（本発明の「部品の第２面」に相当）に放熱部材を接触させる構成と比較して、部品３ａから発生した熱を効率よく放熱することができる。また、部品３ａの側面３ａ３の全面が放熱部材５ａに接するため、より効率よく放熱することができる。 Therefore, according to the above-described embodiment, since the heat radiating member 5a is in contact with the side surface 3a3 close to the lower surface 3a2 that is the heat generation region of the component 3a, the upper surface 3a1 of the component 3a (the “second surface of the component” of the present invention). The heat generated from the component 3a can be efficiently radiated as compared with the configuration in which the heat radiating member is in contact with Further, since the entire surface of the side surface 3a3 of the component 3a is in contact with the heat radiating member 5a, heat can be radiated more efficiently.
　また、放熱部材５ａはシールド膜６に接続されているため、部品３ａから発生した熱がシールド膜６に伝わることにより、シールド膜６を介して外気に放熱することができる。また、放熱部材５ａは、配線基板２に形成された表層電極７ｂにも接続されるため、内部配線電極８等の導体が多い配線基板２側からも、部品３ａから発生した熱を放熱することができる。また、モジュール１ａが実装されるマザー基板側に放熱する場合は、その放熱経路が短くなるため、効率的な放熱が可能になる。 Further, since the heat radiating member 5 a is connected to the shield film 6, heat generated from the component 3 a is transmitted to the shield film 6 and can be radiated to the outside air through the shield film 6. Further, since the heat dissipating member 5a is also connected to the surface layer electrode 7b formed on the wiring board 2, the heat generated from the component 3a can be dissipated from the wiring board 2 side having many conductors such as the internal wiring electrode 8. Can do. In addition, when heat is radiated to the mother substrate side on which the module 1a is mounted, the heat radiation path is shortened, so that efficient heat radiation is possible.
　また、配線基板２の内部配線電極８（グランド電極）とシールド膜６とは、放熱部材５ａを介して接続される。この場合、内部配線電極８（グランド電極）を配線基板２の側面２ｃから露出させてシールド膜６と接続させる構成と比較して、シールド膜６と内部配線電極８との接続抵抗を低くできる。 Further, the internal wiring electrode 8 (ground electrode) of the wiring board 2 and the shield film 6 are connected via the heat radiating member 5a. In this case, the connection resistance between the shield film 6 and the internal wiring electrode 8 can be reduced as compared with the configuration in which the internal wiring electrode 8 (ground electrode) is exposed from the side surface 2 c of the wiring substrate 2 and connected to the shield film 6.
　また、部品３ａが放熱部材５ａで囲まれるため、放熱部材５ａを部品３ａのシールドとして利用することができ、部品３ａに対するシールド特性が向上する。 In addition, since the component 3a is surrounded by the heat radiating member 5a, the heat radiating member 5a can be used as a shield for the component 3a, and the shielding characteristics for the component 3a are improved.
　（放熱部材の変形例）
　上記した実施形態では、放熱部材５ａを角筒状に形成して、部品３ａの４つの側面３ａ３の全面が放熱部材５ａに接する場合について説明したが、部品３ａの側面３ａ３の一部が放熱部材に接触する構成であってもよい。例えば、図４（ａ）に示すように、部品３ａの４つの側面３ａ３のうち、対向する２つの側面３ａ３のみに接するように、２つの板状の放熱部材５ｂを形成してもよい。また、図４（ｂ）に示すように、複数の柱状の放熱部材５ｃを、部品３ａを囲むように配線基板２に立設し、各放熱部材５ｃそれぞれの周側面の一部が、部品３ａの側面３ａ３に接するようにしてもよい。なお、図４（ａ）および（ｂ）は、それぞれ放熱部材の変形例を示す図であって、図２に対応する図である。 (Modification of heat dissipation member)
In the above-described embodiment, the heat radiating member 5a is formed in a rectangular tube shape, and the entire surface of the four side surfaces 3a3 of the component 3a is in contact with the heat radiating member 5a. The structure which contacts may be sufficient. For example, as shown in FIG. 4A, two plate-like heat radiating members 5b may be formed so as to contact only two opposing side surfaces 3a3 among the four side surfaces 3a3 of the component 3a. Further, as shown in FIG. 4B, a plurality of columnar heat radiating members 5c are erected on the wiring board 2 so as to surround the component 3a, and a part of the peripheral side surface of each heat radiating member 5c is part 3a. It may be in contact with the side surface 3a3. FIGS. 4A and 4B are diagrams showing modifications of the heat radiating member, and correspond to FIG.
　＜第２実施形態＞
　本発明の第２実施形態にかかるモジュール１ｂについて、図５を参照して説明する。なお、図５はモジュール１ｂの断面図である。 Second Embodiment
A module 1b according to the second embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view of the module 1b.
　この実施形態にかかるモジュール１ｂが、図１～図３を参照して説明した第１実施形態のモジュール１ａと異なるところは、図５に示すように、放熱部材の構成が異なることである。その他の構成は、第１実施形態のモジュール１ａと同じであるため、同一符号を付すことにより説明を省略する。 The module 1b according to this embodiment differs from the module 1a according to the first embodiment described with reference to FIGS. 1 to 3 in that the configuration of the heat dissipating member is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
　この実施形態の放熱部材５ｄは、第１実施形態の放熱部材５ａの構成に加えて、部品３ａの上面３ａ１に当接する部分５ｄ１（以下、上面当接部５ｄ１という場合もある。）を有する。この場合、例えば、各部品３ａ，３ｂを実装した後に、部品３ａの上面３ａ１に導電性ペーストを塗布して上面当接部５ｄ１を形成し、この状態で封止樹脂層４を形成した後、第１実施形態の放熱部材５ａの形成方法と同じ方法で、放熱部材５ｄの残りの部分を形成する。 The heat dissipating member 5d of this embodiment has a portion 5d1 that abuts on the upper surface 3a1 of the component 3a (hereinafter also referred to as the upper surface abutting portion 5d1) in addition to the configuration of the heat dissipating member 5a of the first embodiment. In this case, for example, after mounting the respective components 3a and 3b, a conductive paste is applied to the upper surface 3a1 of the component 3a to form the upper surface contact portion 5d1, and after forming the sealing resin layer 4 in this state, The remaining part of the heat radiating member 5d is formed by the same method as the method of forming the heat radiating member 5a of the first embodiment.
　この構成によれば、部品３ａは、４つの側面３ａ３のみならず、上面３ａ１も放熱部材５ｄに接することになるため、部品３ａから発生した熱の放熱特性がさらに向上する。 According to this configuration, since the component 3a is in contact with the heat radiating member 5d as well as the four side surfaces 3a3, the heat dissipation characteristics of the heat generated from the component 3a are further improved.
　＜第３実施形態＞
　本発明の第３実施形態にかかるモジュール１ｃについて、図６を参照して説明する。なお、図６はモジュール１ｃの断面図である。 <Third Embodiment>
A module 1c according to a third embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view of the module 1c.
　この実施形態にかかるモジュール１ｃが、図１～図３を参照して説明した第１実施形態のモジュール１ａと異なるところは、図６に示すように、放熱部材の構成が異なることである。その他の構成は、第１実施形態のモジュール１ａと同じであるため、同一符号を付すことにより説明を省略する。 The module 1c according to this embodiment differs from the module 1a of the first embodiment described with reference to FIGS. 1 to 3 in that the configuration of the heat dissipating member is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
　この実施形態の放熱部材５ｅは、上端が部品３ａの上面３ａ１と略同じ高さとなるように形成され、放熱部材５ｅが封止樹脂層４の上面４ａから露出しない。このような放熱部材５ｅは、例えば、封止樹脂層４を２段階で形成することにより形成することができる。具体的には、各部品３ａ，３ｂの実装後にエポキシ樹脂で部品３ａ，３ｂを封止した後（１段階目の封止樹脂層）、この封止樹脂層の上面を研磨または研削して部品３ａの上面３ａ１を露出させる。次に、第１実施形態の放熱部材５ａの形成方法と同じ要領で、部品３ａの４つの側面３ａ３が露出するように溝を形成し、該溝に導電性ペーストを充填して放熱部材５ｅを形成する。次に、１段階目の封止樹脂層に２段階目の封止樹脂層を積層して封止樹脂層４が完成する。 The heat dissipating member 5e of this embodiment is formed so that the upper end is substantially the same height as the upper surface 3a1 of the component 3a, and the heat dissipating member 5e is not exposed from the upper surface 4a of the sealing resin layer 4. Such a heat dissipation member 5e can be formed, for example, by forming the sealing resin layer 4 in two stages. Specifically, after mounting the components 3a and 3b, the components 3a and 3b are sealed with an epoxy resin (first-stage sealing resin layer), and then the upper surface of the sealing resin layer is polished or ground. The upper surface 3a1 of 3a is exposed. Next, in the same manner as the method of forming the heat dissipation member 5a of the first embodiment, a groove is formed so that the four side surfaces 3a3 of the component 3a are exposed, and the heat dissipation member 5e is filled with a conductive paste in the groove. Form. Next, the sealing resin layer 4 is completed by laminating the sealing resin layer of the second stage on the sealing resin layer of the first stage.
　この構成によれば、部品３ａから発生した熱を、配線基板２側に効率よく放熱することができる。 According to this configuration, the heat generated from the component 3a can be efficiently radiated to the wiring board 2 side.
　＜第４実施形態＞
　本発明の第４実施形態にかかるモジュール１ｄについて、図７を参照して説明する。なお、図７はモジュール１ｄの断面図である。 <Fourth embodiment>
A module 1d according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 7 is a cross-sectional view of the module 1d.
　この実施形態にかかるモジュール１ｄが、図１～図３を参照して説明した第１実施形態のモジュール１ａと異なるところは、図７に示すように、放熱部材の構成が異なることである。その他の構成は、第１実施形態のモジュール１ａと同じであるため、同一符号を付すことにより説明を省略する。 The module 1d according to this embodiment is different from the module 1a according to the first embodiment described with reference to FIGS. 1 to 3 in that the configuration of the heat dissipating member is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
　この実施形態の放熱部材５ｆは、下端が封止樹脂層４の下面４ｂから露出していないところが第１実施形態の放熱部材５ａと異なる。この放熱部材５ｆは、第１実施形態の放熱部材５ａと略同じ要領で形成するが、導電性ペーストを充填する溝９（図３参照）を、部品３ａの下面３ａ２に到達するが、表層電極７ｂは露出しない深さで形成する。 The heat dissipating member 5f of this embodiment is different from the heat dissipating member 5a of the first embodiment in that the lower end is not exposed from the lower surface 4b of the sealing resin layer 4. The heat radiating member 5f is formed in substantially the same manner as the heat radiating member 5a of the first embodiment, but the groove 9 (see FIG. 3) filled with the conductive paste reaches the lower surface 3a2 of the component 3a. 7b is formed with a depth not exposed.
　この構成によれば、部品３ａから発生した熱を、シールド膜６を介して外気に効率よく放熱することができる。 According to this configuration, the heat generated from the component 3a can be efficiently radiated to the outside air through the shield film 6.
　＜第５実施形態＞
　本発明の第５実施形態にかかるモジュール１ｅについて、図８および図９を参照して説明する。なお、図８はモジュール１ｅの断面図、図９は放熱部材５ｇの斜視図である。 <Fifth Embodiment>
A module 1e according to a fifth embodiment of the present invention will be described with reference to FIGS. 8 is a cross-sectional view of the module 1e, and FIG. 9 is a perspective view of the heat dissipation member 5g.
　この実施形態にかかるモジュール１ｅが、図１～図３を参照して説明した第１実施形態のモジュール１ａと異なるところは、図８に示すように、放熱部材の構成が異なることである。その他の構成は、第１実施形態のモジュール１ａと同じであるため、同一符号を付すことにより説明を省略する。 The module 1e according to this embodiment is different from the module 1a of the first embodiment described with reference to FIGS. 1 to 3 in that the configuration of the heat dissipating member is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
　この実施形態の放熱部材５ｇは、図８および図９に示すように、部品３ａの上面３ａ１に当接する板状の部分５ｇ１（以下、板状部５ｇ１という）と、該板状部５ｇ１の部品３ａの上面３ａ１との当接面から配線基板２の上面２ａの方向に延在する複数（この実施形態では４つ）の脚部５ｇ２とを有する。板状部５ｇ１は矩形状に形成されており、板状部５ｇ１の四隅それぞれに脚部５ｇ２が配置され、脚部５ｇ２それぞれの先端部が配線基板２の表層電極７ｂに半田で接続される。そして、板状部５ｇ１が部品３ａの上面３ａ１に当接し、４つの脚部５ｇ２それぞれが部品３ａの側面３ａ３に接することで、放熱部材５ｇが部品３ａを覆うように配設される。なお、放熱部材５ｇは、例えば、板状の金属板に折り曲げ加工を施すなどして形成することができる。 As shown in FIGS. 8 and 9, the heat radiating member 5g of this embodiment includes a plate-like portion 5g1 (hereinafter referred to as a plate-like portion 5g1) that contacts the upper surface 3a1 of the component 3a, and a component of the plate-like portion 5g1. And a plurality of (four in this embodiment) leg portions 5g2 extending in the direction of the upper surface 2a of the wiring board 2 from the contact surface of the 3a with the upper surface 3a1. The plate-like portion 5g1 is formed in a rectangular shape, and leg portions 5g2 are arranged at the four corners of the plate-like portion 5g1, and the tip portions of the leg portions 5g2 are connected to the surface layer electrodes 7b of the wiring board 2 by soldering. The plate-like portion 5g1 is in contact with the upper surface 3a1 of the component 3a, and the four leg portions 5g2 are in contact with the side surface 3a3 of the component 3a, so that the heat radiating member 5g is disposed so as to cover the component 3a. The heat radiating member 5g can be formed, for example, by bending a plate-shaped metal plate.
　この構成によると、放熱部材５ｇにより、部品３ａから発生した熱を配線基板２側に放熱する放熱経路を形成することができる。また、放熱部材５ｇは、部品３ａを覆う形状でありながら、脚部５ｇ２間には隙間があるため、配線基板２に放熱部材５ｇを搭載した後で封止樹脂層４を形成しても、部品３ａの下面３ａ２と配線基板２の上面２ａとの間に封止樹脂層４の樹脂を容易に充填することができるため、部品３ａの封止性が向上する。 According to this configuration, the heat radiation member 5g can form a heat radiation path for radiating the heat generated from the component 3a to the wiring board 2 side. Moreover, since the heat radiating member 5g is shaped to cover the component 3a, there is a gap between the leg portions 5g2, so even if the sealing resin layer 4 is formed after the heat radiating member 5g is mounted on the wiring board 2, Since the resin of the sealing resin layer 4 can be easily filled between the lower surface 3a2 of the component 3a and the upper surface 2a of the wiring board 2, the sealing performance of the component 3a is improved.
　＜第６実施形態＞
　本発明の第６実施形態にかかるモジュール１ｆについて、図１０を参照して説明する。なお、図１０はモジュール１ｆの断面図である。 <Sixth Embodiment>
A module 1f according to the sixth embodiment of the present invention will be described with reference to FIG. FIG. 10 is a cross-sectional view of the module 1f.
　この実施形態にかかるモジュール１ｆが、図１～図３を参照して説明した第１実施形態のモジュール１ａと異なるところは、図１０に示すように、部品３ａおよび放熱部材５ａの配置が異なることである。その他の構成は、第１実施形態のモジュール１ａと同じであるため、同一符号を付すことにより説明を省略する。 The module 1f according to this embodiment is different from the module 1a of the first embodiment described with reference to FIGS. 1 to 3 in that the arrangement of the component 3a and the heat dissipating member 5a is different as shown in FIG. It is. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.
　この実施形態では、部品３ａが配線基板２の上面２ａの周縁近傍に配置され、放熱部材５ａの外側面５ａ２の一部が、封止樹脂層４の側面４ｃから露出してシールド膜６に接触している。 In this embodiment, the component 3 a is disposed near the periphery of the upper surface 2 a of the wiring board 2, and a part of the outer surface 5 a 2 of the heat radiating member 5 a is exposed from the side surface 4 c of the sealing resin layer 4 and contacts the shield film 6. is doing.
　この構成によれば、放熱部材５ａとシールド膜６との接触面積が増えるため、部品３ａから発生した熱の放熱特性が向上する。また、シールド膜６と内部配線電極８（グランド電極）との接続抵抗も低くなるため、シールド膜６のシールド特性が向上する。 According to this configuration, since the contact area between the heat radiation member 5a and the shield film 6 is increased, the heat radiation characteristic of the heat generated from the component 3a is improved. Further, since the connection resistance between the shield film 6 and the internal wiring electrode 8 (ground electrode) is lowered, the shield characteristics of the shield film 6 are improved.
　なお、本発明は上記した各実施形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて、上記したもの以外に種々の変更を行なうことが可能である。例えば、上記した各実施形態や変形例の構成を組合わせてもよい。 The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention. For example, you may combine the structure of each above-mentioned embodiment and modification.
　また、配線基板２を構成する絶縁層や配線層の層数は、適宜変更することができる。 Further, the number of insulating layers and wiring layers constituting the wiring board 2 can be changed as appropriate.
　また、本発明は、配線基板に実装された部品を被覆する封止樹脂層と、部品から発生した熱を放熱する放熱部材とを備える種々のモジュールに本発明を適用することができる。 In addition, the present invention can be applied to various modules including a sealing resin layer that covers a component mounted on a wiring board and a heat dissipation member that dissipates heat generated from the component.
　１ａ～１ｅ　　モジュール
　２　　配線基板
　２ａ　　配線基板の上面（配線基板の主面）
　２ｃ　　配線基板の側面
　３ａ　　部品
　３ａ１　　部品の上面（第２面）
　３ａ２　　部品の下面（第１面）
　３ａ３　　部品の側面
　４　　封止樹脂層
　４ａ　　封止樹脂層の上面（対向面）
　４ｂ　　封止樹脂層の下面（当接面）
　４ｃ　　封止樹脂層の側面
　５ａ～５ｇ　　放熱部材
　６　　シールド膜
　７ｂ　　表層電極（電極）
　８　　内部配線電極（グランド電極） 1a to 1e Module 2 Wiring board 2a Upper surface of wiring board (main surface of wiring board)
2c Side surface of wiring board 3a Component 3a1 Upper surface of component (second surface)
3a2 Lower surface of the part (first surface)
3a3 Side surface of part 4 Sealing resin layer 4a Top surface of sealing resin layer (opposing surface)
4b The lower surface (contact surface) of the sealing resin layer
4c Side surface of the sealing resin layer 5a to 5g Heat radiation member 6 Shield film 7b Surface layer electrode (electrode)
8 Internal wiring electrode (ground electrode)

Claims (8)

  1. 　配線基板と、
    　前記配線基板の主面に実装された部品と、
    　前記部品と接触する部分を有する放熱部材と、
    　前記配線基板の前記主面に当接する当接面と、該当接面に対向する対向面と、前記当接面と前記対向面の端縁同士を繋ぐ側面とを有し、前記部品および前記放熱部材を封止する封止樹脂層とを備え、
    　前記部品は、前記配線基板の主面に対向して配置される第１面と、該第１面に対向する第２面と、前記第１面と前記第２面の端縁同士を繋ぐ側面とを有し、
    　前記放熱部材は、少なくとも前記部品の前記側面に接触していることを特徴とするモジュール。     A wiring board;
    Components mounted on the main surface of the wiring board;
    A heat dissipating member having a portion in contact with the component;
    A contact surface contacting the main surface of the wiring board; a facing surface facing the contact surface; and a side surface connecting edges of the contact surface and the facing surface. A sealing resin layer for sealing the member,
    The component includes a first surface disposed opposite to the main surface of the wiring board, a second surface opposed to the first surface, and a side surface connecting edges of the first surface and the second surface. And
    The module, wherein the heat dissipating member is in contact with at least the side surface of the component.
  2. 　前記放熱部材は、前記封止樹脂層の前記対向面から露出している部分があることを特徴とする請求項１に記載のモジュール。 2. The module according to claim 1, wherein the heat radiating member has a portion exposed from the facing surface of the sealing resin layer.
  3. 　前記封止樹脂層の前記対向面および前記側面を被覆するシールド膜をさらに備え、
    　前記放熱部材が、前記シールド膜に接続されていることを特徴とする請求項２に記載のモジュール。     A shield film covering the opposing surface and the side surface of the sealing resin layer;
    The module according to claim 2, wherein the heat dissipation member is connected to the shield film.
  4. 　前記放熱部材および前記シールド膜が、いずれも導電性材料で構成されていることを特徴とする請求項３に記載のモジュール。 The module according to claim 3, wherein both the heat radiating member and the shield film are made of a conductive material.
  5. 　前記放熱部材は、前記封止樹脂層の前記当接面から露出している部分があることを特徴とする請求項１ないし４のいずれか１項に記載のモジュール。 The module according to any one of claims 1 to 4, wherein the heat dissipation member has a portion exposed from the contact surface of the sealing resin layer.
  6. 　前記放熱部材は、前記配線基板の前記主面に形成された電極に接触し、
    　前記電極が、前記配線基板に形成されたグランド電極に接続されていることを特徴とする請求項５に記載のモジュール。     The heat radiating member is in contact with an electrode formed on the main surface of the wiring board,
    The module according to claim 5, wherein the electrode is connected to a ground electrode formed on the wiring board.
  7. 　前記放熱部材は、前記部品の前記第２面に接触する部分があることを特徴とする請求項１ないし６のいずれか１項に記載のモジュール。 The module according to any one of claims 1 to 6, wherein the heat radiating member has a portion that contacts the second surface of the component.
  8. 　前記放熱部材は、前記部品の前記第２面に当接する板状の部分と、前記板状の部分の前記部品の前記第２面に当接する面から、前記配線基板の前記主面の方向に延在する複数の脚部とを有し、
    　前記複数の脚部は、前記部品の前記側面に接触していることを特徴とする請求項１に記載のモジュール。     The heat dissipating member is arranged in a direction from the plate-shaped portion that contacts the second surface of the component and the surface of the plate-shaped portion that contacts the second surface of the component toward the main surface of the wiring board. A plurality of extending legs,
    The module according to claim 1, wherein the plurality of legs are in contact with the side surface of the component.
PCT/JP2018/013234 2017-03-31 2018-03-29 Module WO2018181708A1 (en)

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WO2020162614A1 (en) * 2019-02-08 2020-08-13 株式会社村田製作所 Module
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