WO2018157179A3 - Atmospheric robotic end effector - Google Patents
Atmospheric robotic end effector Download PDFInfo
- Publication number
- WO2018157179A3 WO2018157179A3 PCT/US2018/024226 US2018024226W WO2018157179A3 WO 2018157179 A3 WO2018157179 A3 WO 2018157179A3 US 2018024226 W US2018024226 W US 2018024226W WO 2018157179 A3 WO2018157179 A3 WO 2018157179A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- end effector
- flag
- actuator
- robotic end
- protrusion
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A robotic end effector is provided which includes a housing, an end effector blade, and an actuator disposed within the housing. The actuator has a protrusion which advances and retracts along an axis. The protrusion is equipped, on a terminal end thereof, with a resilient mass. The end effector is further equipped with a control unit, and a flag. The flag has a first end which is attached to the actuator, and a second end which is magnetically coupled to the control unit. The flag has a profile which reduces particle generation.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762462934P | 2017-02-24 | 2017-02-24 | |
US62/462,934 | 2017-02-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2018157179A2 WO2018157179A2 (en) | 2018-08-30 |
WO2018157179A3 true WO2018157179A3 (en) | 2018-10-25 |
Family
ID=63253462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2018/024226 WO2018157179A2 (en) | 2017-02-24 | 2018-03-24 | Atmospheric robotic end effector |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2018157179A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020074719A1 (en) * | 2018-10-12 | 2020-04-16 | Syddansk Universitet | A sorting system for sorting objects |
WO2023150732A2 (en) * | 2022-02-03 | 2023-08-10 | Greene, Tweed Technologies, Inc. | End effectors and end effector pads having crosslinked polymers for semiconductor applications to provide improved manufacturing speed and methods of making and using the same |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5765889A (en) * | 1995-12-23 | 1998-06-16 | Samsung Electronics Co., Ltd. | Wafer transport robot arm for transporting a semiconductor wafer |
US20050021177A1 (en) * | 2003-07-23 | 2005-01-27 | Paul Bacchi | Robot end effector position error correction using auto-teach methodology |
US20120044609A1 (en) * | 2009-05-15 | 2012-02-23 | Cooke Richard A | Electrostatic Chuck With Polymer Protrusions |
US20130213169A1 (en) * | 2012-02-17 | 2013-08-22 | Mark K. Tan | Mass damper for semiconductor wafer handling end effector |
US20140265393A1 (en) * | 2013-03-13 | 2014-09-18 | Varian Semiconductor Equipment Associates, Inc. | Wafer handling apparatus |
-
2018
- 2018-03-24 WO PCT/US2018/024226 patent/WO2018157179A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5765889A (en) * | 1995-12-23 | 1998-06-16 | Samsung Electronics Co., Ltd. | Wafer transport robot arm for transporting a semiconductor wafer |
US20050021177A1 (en) * | 2003-07-23 | 2005-01-27 | Paul Bacchi | Robot end effector position error correction using auto-teach methodology |
US20120044609A1 (en) * | 2009-05-15 | 2012-02-23 | Cooke Richard A | Electrostatic Chuck With Polymer Protrusions |
US20130213169A1 (en) * | 2012-02-17 | 2013-08-22 | Mark K. Tan | Mass damper for semiconductor wafer handling end effector |
US20140265393A1 (en) * | 2013-03-13 | 2014-09-18 | Varian Semiconductor Equipment Associates, Inc. | Wafer handling apparatus |
Also Published As
Publication number | Publication date |
---|---|
WO2018157179A2 (en) | 2018-08-30 |
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Legal Events
Date | Code | Title | Description |
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NENP | Non-entry into the national phase |
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