WO2018147694A1 - Flexible transparent led display of led electro-optical panel and method for manufacturing same - Google Patents

Flexible transparent led display of led electro-optical panel and method for manufacturing same Download PDF

Info

Publication number
WO2018147694A1
WO2018147694A1 PCT/KR2018/001805 KR2018001805W WO2018147694A1 WO 2018147694 A1 WO2018147694 A1 WO 2018147694A1 KR 2018001805 W KR2018001805 W KR 2018001805W WO 2018147694 A1 WO2018147694 A1 WO 2018147694A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible transparent
led
metal pattern
transparent film
film metal
Prior art date
Application number
PCT/KR2018/001805
Other languages
French (fr)
Korean (ko)
Inventor
전용선
위인호
Original Assignee
주식회사 에스오엘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 에스오엘 filed Critical 주식회사 에스오엘
Publication of WO2018147694A1 publication Critical patent/WO2018147694A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H05B33/28—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode of translucent electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/81—Electrodes
    • H10K30/82—Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2380/00—Specific applications
    • G09G2380/02—Flexible displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a flexible transparent LED display of the LED electro-optical panel and a method of manufacturing the same, more specifically, does not use a heat sink for dissipating heat of the LED chip without using a substrate PCB, (+) electrode wire,
  • the driver IC and the 1R1G1B LED chip are provided in one basic unit package, which is provided at each point connected to a flexible flexible film film pattern having flexible data lines and three lines of negative electrode lines. Fabricates a flexible transparent film metal pattern assembly of a mounted and continuously assembled structure, and is formed in the same flexible transparent film metal pattern circuit together with a driver IC and a 1R1G1B LED chip to generate an LED chip during operation.
  • PCB-less flexible transparent LED display that dissipates heat quickly to itself It manufactures flexible transparent LED display and has flexibility by using flexible transparent film metal pattern materials such as aluminum (Al) and copper (Cu) with various functions as a city aesthetic, design, visual effect and visual advertisement delivery media.
  • LED Light Emitting Diode
  • a P-type semiconductor is formed of an n-type semiconductor whose majority carrier is an electron and a p-type semiconductor which has a majority carrier is a hole.
  • the signal is output by converting it into light having a wavelength band, and it is mainly used for microcomputer chip built-in LED, indoor lighting equipment, outdoor LED billboard, traffic signal lamp, street light, automobile headlight LED.
  • the LED driving method uses a DC driving circuit, an AC driving circuit, a pulse driving circuit (PWM control) that provides light color and color temperature control by changing the light output by pulse width modulation (PWM) of the LED, or LED
  • PWM control pulse driving circuit
  • the driving IC for controlling the constant voltage, the constant current, and the power factor may be used.
  • LEDs are classified into i) lamp type shell type LEDs, ii) Surface Mounted Device (SMD) packages, and iii) Chip on Board (COB) packages.
  • the outdoor LED billboard is powered by a waterproof microcomputer board.
  • LED signboards are available in single color and RGB tricolor or full color LED signboards.
  • the advertising images are displayed by the LED light of the surface light source, and large buildings, pharmacies / hospitals, restaurants / karaokes / hobby houses, cram schools, beauty salons, and opticians Mainly used in gas stations, gas stations, theaters, etc.
  • PCB printed circuit board
  • the LED signboard of FIG. 1 used for indoor and outdoor use is composed of an image providing controller, an operating PC, a network, and an LED signboard as shown in FIG. 2, and one of them is an oval type RGB (Red, Green, Blue). It is a structure that is equipped with several unit PCB (Printed Circuit Board) constituting the entire large area screen and an Oval type LED Chip (Package) or LED Chip mounted on the board.
  • PCB Print Circuit Board
  • a conventional LED display board uses mostly elliptical LEDs or LED chips, and heatsinks and cooling fans are provided on the rear portion of the PCB to smooth heat dissipation generated during circuit operation.
  • heatsinks and cooling fans are provided on the rear portion of the PCB to smooth heat dissipation generated during circuit operation.
  • Patent Registration No. 10-0992383 discloses a LED driving plate of a dynamic driving method and a driving method thereof capable of minimizing a flicker phenomenon by shortening a lighting traveling distance.
  • An LED display board is a LED display board for driving a plurality of LED elements in a dynamic driving method, the LED module is divided into regions each of the LED elements m x n (where m, n is a natural number of two or more);
  • a control unit for generating a selection control signal for electrically connecting any one LED element to each area at the same time;
  • M x n selectors connected to one LED element per said region and electrically connecting the connected LED elements simultaneously for 1 / m x n periods in response to said selection control signal;
  • an active circuit for supplying driving data to the LED elements electrically connected by the selector.
  • Patent Registration No. 10-1372861 shows that the LED single-panel electronic display panel displays information in both directions, which can reduce its own weight, reduce its thickness, and reduce costs.
  • a bidirectional LED signboard that can be used.
  • Bi-directional LED single panel display case A PCB mounted inside the case; A plurality of LED chips disposed at predetermined intervals on the front and rear surfaces of the PCB; A driving circuit electrically connected to control driving of the LED chip; And a control unit for transmitting a pattern signal to the driving circuit.
  • PCB printed circuit board
  • forced cooling circulation using a fan is used to solve the heat generated by the operation of the device. It uses a heat dissipation system.
  • the size of the LED module that makes up the display screen by connecting controller connection terminals, connectors, and cables for each device driving and signal processing with the unit board of each PCB is very heavy and manufactured. It is damaging and providing a harmful environment for interior design and interior.
  • the LED module for the electronic board has a board PCB and an Oval type LED chip (Package), a rear frame, and an SMPS structure mounted on the board PCB.
  • Package Oval type LED chip
  • a rear frame Oval type LED chip
  • an SMPS structure mounted on the board PCB.
  • the outdoor electronic signboard is essentially equipped with a fan for heat dissipation for each unit board and performs convection by forcibly circulating external air.
  • An object of the present invention for solving the problems of the prior art is generally used by applying a flexible transparent film metal pattern circuit having three lines of (+) electrode line, data line, (-) electrode line
  • the operation circuit for mounting the driver IC and the 1R1G1B LED chip is continuously arranged in series and in parallel.
  • LED electro-optic which does not use heatsink to solve the heat problem that 1R1G1B LED chip generates during operation, and disperses itself in flexible transparent film metal pattern circuit to prolong life of LED chip and maintain brightness It offers panel flexible transparent LED display.
  • Another object of the present invention is to provide a method of manufacturing a flexible transparent LED display of an LED electro-optical panel.
  • the flexible transparent LED display of the LED electro-optical panel uses a conductive flexible transparent film metal pattern material, (+) electrode line, data line, (-) A flexible transparent film metal pattern circuit composed of electrode lines and having flexibility to bend or bend;
  • Each 1R1G1B LED chip mounted by soldering is provided for each unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, and the RGB combinational color signal is transmitted to the data line to drive the 1R1G1B LED chip.
  • Driver IC And supply power to the (+) electrode line of the flexible transparent film metal pattern circuit, ground the ( ⁇ ) electrode line, and transmit the RGB combined color signal to the data line to drive the LED display. Includes a control board to be displayed,
  • the conductive flexible transparent film metal pattern material has an excellent thermal conductivity of the flexible transparent film using an alloy of aluminum, beryllium oxide (BeO), or aluminum oxide (Al 2 O 3 , Aluminum oxide).
  • the flexible transparent film metal pattern circuit emits heat generated when the 1R1G1B LED chip is operated without using a heat sink, and operates without a substrate PCB.
  • a method of manufacturing a flexible transparent LED display of the LED electro-optical panel (a) does not use a substrate PCB, and has a conductive transparent transparent film metal pattern after the artwork (Flexible Transparent Film Metal Pattern) Material) and the surface of each unit package provided at each point of the flexible transparent film metal pattern circuit having flexible flexibility composed of (+) electrode line, data line, (-) electrode line and matrix structure connected to the metal guide line Mounting the driver IC and the 1R1G1B LED chip by mounting technology (SMT); (b) mounting a driver IC and a 1R1G1B LED chip at each point connected to the flexible transparent film metal pattern circuit; (c) A base cover using an acrylic plate or PC (polycarbonate) or glass (glass) is adhered to the lower plate of the completed flexible transparent film metal pattern assembly.
  • artwork Flexible Transparent Film Metal Pattern
  • the conductive flexible transparent film metal pattern material has an excellent thermal conductivity of the flexible transparent film using an alloy of aluminum, beryllium oxide (BeO), or aluminum oxide (Al 2 O 3 , Aluminum oxide).
  • the flexible transparent film metal pattern circuit itself emits heat generated when the 1R1G1B LED chip is operated without using a heat sink, and operates without a substrate PCB.
  • the flexible transparent LED display of the LED electro-optical panel and a method of manufacturing the same according to the present invention are firstly provided with a flexible transparent film metal pattern having three lines of a (+) electrode line, a data line, and a (-) electrode line.
  • the driver IC and the 1R1G1B LED chip are configured in one unit package provided at each point connected to the circuit, and the size of the LED package can be minimized because the volume of devices occupied by three LED chips can be reduced to one within the same volume. Can be.
  • raw materials can be significantly reduced in assembling 1R1G1B LED chips.
  • 1R1G1B LED chips are manufactured by a manufacturing process mounted at each point of a matrix structure in a flexible transparent film metal pattern assembly circuit, thus saving LED PCBs by reducing PCB PCB, ITO pattern, and silver paste.
  • Productivity is improved and production cost is greatly reduced due to manufacturing cost and simplified manufacturing process.
  • the flexible transparent LED display to which the flexible transparent film metal pattern circuit of the present invention is applied has a relatively small line resistance due to the thickness and distance of the line, and has a flexible transparent film metal pattern having flexibility of bending or bending.
  • Transparent Film Metal Pattern material is used, and its structure is simple due to its small size and light weight, and it can be attached and detached anytime and anywhere.
  • the Noise between the metal patterns generated when driving the device can be improved by reducing the number of circuit patterns, and within the control board
  • the signal processing unit to be configured can be miniaturized and the user's convenience can be achieved.
  • Flexible transparent LED display using a flexible flexible film metal pattern circuit is used in media facades, electronic displays, smart glass panels and the like used for information transmission of advertising billboards.
  • FIG. 2 is a configuration diagram of a conventional LED display.
  • FIG. 3 is a configuration diagram of a conventional elliptic (Oval) type LED module.
  • FIG. 4 is a photograph of a flexible transparent film metal pattern artwork according to the present invention.
  • FIG. 5 is a process diagram of a completed flexible transparent film metal pattern circuit.
  • FIG. 6 is a photograph illustrating a process of mounting a driver IC and a 1R1G1B LED chip by a surface mounted technology (SMT) technology in a flexible transparent film metal pattern circuit.
  • SMT surface mounted technology
  • FIG. 7 is a photograph showing a process in which a driver IC and a 1R1G1B LED chip are mounted at each point connected to a flexible transparent film metal pattern circuit, and then a FPCB (Film Printed Circuit Board) for connecting a driver board circuit is mounted.
  • FPCB Flexible Printed Circuit Board
  • FIG. 8A illustrates a flexible transparent film metal pattern assembly in which a driver IC and a 1R1G1B LED chip are mounted by soldering in a unit package provided at each point of a matrix structure connected to a flexible transparent film metal pattern circuit according to the present invention.
  • This is a picture showing a process of testing (Flexible Transparent Film Metal Pattern Assembly) and 1R1G1B LED Chip operation.
  • FIG. 8B is a flexible transparent film metal pattern including three lines of (+) electrode line, data line, and (-) electrode line, and each point of the matrix structure connected to the flexible transparent film metal pattern circuit.
  • the driver IC and the 1R1G1B LED chip are mounted.
  • FIG. 9 is a diagram illustrating a process of connecting a flexible transparent film metal pattern assembly and a driver board to supply and control an electrical signal.
  • FIG. 10 is a bottom cover acrylic plate or polycarbonate according to the present invention assembled from FIG. 9 and window cover acrylic plate or polycarbonate assembled and fabricated, and completed a flexible transparent LED display (Flexible Transparent LED Display) The picture shows the process.
  • FIG. 11 is a configuration diagram showing a flexible transparent LED display manufacturing process to which a flexible transparent film metal pattern circuit according to the present invention is applied.
  • a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied, does not use a substrate PCB and a heat sink, and has three (+) electrode lines, data lines, and (-) electrode lines.
  • an operation circuit diagram of mounting a driver IC and a 1R1G1B LED chip is illustrated.
  • FIG. 13 is an actual driving picture connected to a control board (MCU) of a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied.
  • MCU control board
  • the present invention applies a flexible transparent film metal pattern circuit (hereinafter referred to as a film metal pattern) circuit, and does not use a substrate PCB that is generally used. ), And the operation circuit to install the driver IC and the 1R1G1B LED chip, does not use heatsink to solve the heat problem generated during the operation of the 1R1G1B LED chip, and a plurality of flexible transparent film metal pattern circuit
  • the present invention provides a flexible transparent LED display (LED) of an electro-optical panel and a method of manufacturing the same, which self-disperse heat generated from LED chips to prolong the life of the LED chip and stably maintain brightness.
  • the present invention is applied to media facades, electronic displays, signal processing or transmission and display boards, and smart glass panels, which are used for information transmission to a large number of unspecified public at short distances and long distances.
  • the driver IC and the light source of the 1R1G1B (Red, Green, Blue) LED chip for each point of the matrix structure mounted on the LED panel are The heat dissipation structure of the 1G1G1B LED chip, the flexible transparent film metal pattern circuit structure, and the flexible transparent LED display (Flexible) that smoothly dissipate heat generated when driving the 1R1G1B LED chip for stable, efficient and individual driving. Transparent LED Display) manufacturing method.
  • Flexible Transparent LED Display dissipates heat by applying Flexible Transparent Film Metal Pattern circuits applied to media facades, electronic displays, flexible transparent LED displays, smart panels, etc. No heatsink was used, and a new structure without a substrate PCB was applied. Flexible Transparent Film Metal Patterns are manufactured without a substrate PCB and form the basic circuitry that dissipates heat from the 1R1G1B LED chip itself without the use of heat sinks.
  • FIG. 4 is a photograph of a flexible transparent film metal pattern artwork according to the present invention.
  • FIG. 5 is a photograph of a material showing a completed flexible transparent film metal pattern circuit.
  • FIG. 6 is a photograph illustrating a process of mounting a driver IC and a 1R1G1B LED chip by a surface mounted technology (SMT) technology in a flexible transparent film metal pattern circuit.
  • SMT surface mounted technology
  • FIG. 7 is a photograph showing a process in which a driver IC and a 1R1G1B LED chip are mounted at each point connected to a flexible transparent film metal pattern circuit, and then a FPCB (Film Printed Circuit Board) for connecting a driver board circuit is mounted.
  • FPCB Flexible Printed Circuit Board
  • FIG. 8 is a flexible transparent film metal pattern assembly in which a driver IC and a 1R1G1B LED chip are mounted by soldering in a unit package provided at each point of a matrix structure connected to a flexible transparent film metal pattern circuit according to the present invention.
  • This is a picture showing a process of testing (Flexible Transparent Film Metal Pattern Assembly) and 1R1G1B LED Chip operation.
  • a flexible transparent film metal pattern circuit that does not use a substrate PCB is artwork.
  • the flexible transparent film metal pattern circuit material having the artwork work is manufactured according to the manufacturing process.
  • the driver IC and the 1R1G1B LED are provided in one unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit in which the artwork is completed.
  • the operation circuit for mounting the chip is continuously configured. That is, the surface mount technology (SMT) mounts the driver IC and the 1R1G1B LED chip in each unit package of each point of the matrix structure in the flexible transparent film metal pattern circuit.
  • SMT surface mount technology
  • the area of the flexible transparent film metal pattern increases.
  • the number of 1R1G1B LED chips increases and the number of flexible transparent film metal patterns circuits. If the increase is increased, the transparency, visibility and transmittance difference of the flexible transparent LED display occurs due to the difference in the pixel spacing configured per unit area.
  • the metal pattern circuit 2 includes a positive electrode line 10 connected to an anode of each 1R1G1B LED chip 14 and a data line 11 connected to a driver IC; And three wires including a negative electrode line 12 connected to a cathode of each 1R1G1B LED chip 14.
  • the data line 11 transmits an RGB combined color signal from a control board (MCU).
  • the 1R1G1B LED chip contains one red LED, one green LED, and one blue LED.
  • FIG. 6 is a photograph showing a process of mounting a driver IC and a 1R1G1B LED chip in a flexible transparent film metal pattern circuit by SMT (Surface Mounted Technology) technology.
  • FIG. 7 shows a process in which a driver IC and a 1R1G1B LED chip are mounted at each point connected to a flexible transparent film metal pattern circuit, and then a FPCB (Film Printed Circuit Board) for connecting a driver board circuit is mounted. It is a photograph.
  • FPCB Flexible Printed Circuit Board
  • FIG. 8 shows a flexible transparent film metal having a driver IC and a 1R1G1B LED chip mounted in a unit package provided at each point of a matrix structure connected to a flexible transparent film metal pattern circuit according to the present invention by soldering. This is a picture showing a process of testing the operation of a flexible transparent film metal pattern assembly and a 1R1G1B LED chip.
  • FIG. 9 illustrates a process of connecting a flexible transparent film metal pattern assembly to a driver board for supplying and controlling an electrical signal.
  • FIG. 10 is a bottom cover acrylic plate or polycarbonate according to the present invention assembled in FIG. 9, window cover acrylic plate or polycarbonate assembled and fabricated, completed flexible This is a picture showing the process of Flexible Transparent LED Display.
  • FIG. 11 is a configuration diagram illustrating a manufacturing process of a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied.
  • FIG. 11 is a flexible transparent LED display using a flexible transparent film metal pattern circuit according to the present invention does not use a substrate PCB and a heat sink, (+) electrode line, data line, (-) electrode line
  • One unit package provided at each point of the matrix structure connected to a flexible transparent film metal pattern circuit having three wires of is a circuit diagram of an operation circuit in which a driver IC and a 1R1G1B LED chip are mounted. .
  • Flexible Transparent Film Metal Pattern circuit for flexible transparent LED display emits heat generated when operating 1R1G1B LED chip without using heat sink, and operates without circuit board PCB. It is characterized by the configuration.
  • the flexible transparent film metal pattern circuit can dissipate the heat generated from the 1R1G1B LED chip to preserve the life of the 1R1G1B LED chip due to heat generation, minimize the brightness deterioration problem, and realize a lightweight flexible transparent LED display product.
  • the flexible transparent film metal pattern circuit configures an operation circuit by mounting a 1R1G1B LED chip on a film metal pattern (Film Metal Pattern) by a reflow soldering operation without using a substrate PCB, and is generated when driving a 1R1G1B LED chip. It uses a manufacturing method that does not use a separate heat generating heat sink and does not use a substrate PCB constituting a metal pattern circuit. It is distributed in a flexible transparent film metal pattern having flexibility of bending or bending heat. By implementing a flexible transparent LED display.
  • the method of increasing the number of pixels in a predetermined space is used.
  • the number of 1R1B1G LED chips is increased, power consumption and heat generation amount are increased. This increasing problem is solved and the heat dissipation problem which affects the lifetime and brightness deterioration of 1R1G1B LED chip is improved and presented.
  • the flexible transparent film metal pattern circuit is a flexible transparent film metal pattern material, that is, aluminum (Al) or copper, in which 1R1G1B LED chips transmit heat generated during operation to the outside or radiate in a radiation form. It is a flexible transparent film metal pattern circuit produced by (Cu).
  • FIG. 8B is a flexible transparent film metal pattern including three lines of (+) electrode line, data line, and (-) electrode line, and each point of the matrix structure connected to the flexible transparent film metal pattern circuit.
  • the driver IC and the 1R1G1B LED chip are mounted.
  • Flexible Transparent Film Metal Pattern material is an alloy composed mainly of Aluminum, Beryllium Oxide (BeO) or Aluminum Oxide (Al 2 O 3 )
  • BeO Beryllium Oxide
  • Al 2 O 3 Aluminum Oxide
  • the driver IC and the 1R1G1B LED chip are mounted at each point of the matrix structure and soldered and assembled.
  • FIG. 11 is a configuration diagram showing a flexible transparent LED display manufacturing process to which a flexible transparent film metal pattern circuit according to the present invention is applied.
  • the flexible transparent film metal pattern circuit itself emits heat generated when the 1R1G1B LED chip is operated without using a heat sink, and operates without a substrate PCB.
  • the method is equipped with a driver IC and a 1R1G1B LED chip by soldering in one unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, and the flexible transparent film metal pattern circuit and each 1R1G1B A positive electrode line connected to an anode of the LED; A data line connected to the driver IC; And three wires including a negative electrode line connected to a cathode of each 1R1G1B LED, wherein the data line is configured to transmit an RGB combined color signal from the control board (MCU). It includes more.
  • the method may include an app for controlling the LED light by connecting the control board to a computer for controlling the LED light through an RS-232 serial interface or a wired cable, or by connecting a Wi-Fi or Bluetooth communication with a communication unit.
  • the method further includes communicating with the installed smartphone.
  • Reference numeral 1 denotes a flexible transparent film pattern artwork
  • reference numeral 2 denotes a flexible transparent metal pattern wiring
  • reference numeral 3 denotes a 1R1G1B LED chip
  • reference numeral 4 denotes a flexible 1R1G1B LED Chip mounted on a Flexible Transparent Flim Metal Pattern circuit
  • reference numeral 4.1 denotes a 1R1G1B LED Chip mounted on a flexible transparent film metal pattern
  • 5 denotes a Flexible Transparent Film Metal Pattern assembly.
  • FPCB Flexible Printed Circuit Board
  • 6 Flexible transparent film metal pattern assembly and driver board
  • 7 Flexible assembled from silver acrylic or polycarbonate plates or glass Transparent film LED display
  • 8 is acrylic or polycarbonate, or glass (glass)
  • 9 is window cover acrylic or polycarbonate, glass ).
  • a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied, does not use a substrate PCB and a heat sink, and has three (+) electrodes, data lines, and (-) electrodes.
  • One unit package provided at each point connected to the flexible transparent film metal pattern circuit is an operation circuit configuration for mounting a driver IC and a 1R1G1B LED chip.
  • Electrode line 10 is connected to the anode of each of the R, G, B LED; A data line 11 connected to the driver IC; And three (-) electrode lines 12 connected to the Cathode of each of the R, G, and B LEDs.
  • the data line receives RGB combination color signals from a control board (MCU).
  • the 1R1G1B LED chip contains one red LED, one green LED, and one blue LED.
  • a flexible transparent film metal pattern circuit can comprise a serial / parallel circuit according to a circuit structure.
  • Flexible conductive film using conductive conductive material consisting of (+) electrode line 10, data line 11, (-) electrode line 12, flexible to bend or bend Flexible transparent film metal pattern circuit having a;
  • the 1R1G1B LED chip 14 mounted by soldering for each unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, and the 1R1G1B LED by receiving an RGB combined color signal through the data line.
  • a driver IC 13 for driving a chip; And supply power to the (+) electrode line 10 of the flexible transparent film metal pattern circuit, ground the ( ⁇ ) electrode line 12, and drive the data line 11 to drive the LED display. It includes a control board (control board, MCU) to transmit the RGB combination color signal to display the color,
  • the flexible transparent film metal pattern circuit emits heat generated when the 1R1G1B LED chip is operated without using a heat sink and is a circuit that operates without a PCB.
  • the control board adjusts the duty cycle of the current using LED output control, light brightness control, color temperature control, and pulse width modulation (PWM) for each port to dynamically output the advertising image of the LED. Provides dimming control to scale.
  • PWM pulse width modulation
  • the control board is connected to a computer for controlling the LED light with an RS-232 serial interface or a wired cable, or a smartphone with an app for controlling the LED light with Wi-Fi or Bluetooth communication connected to a communication unit. Can be communicated with.
  • the computer or smartphone may be operated to transmit the LED lighting control signal to the control board to dynamically output the advertising image of the LED.
  • the flexible transparent film metal pattern circuit may include aluminum (Al), which is a flexible transparent film metal pattern material, which serves to transmit heat generated during operation of the 1R1G1B LED chip to the outside or radiate it in a radiant form.
  • Al aluminum
  • Cu copper
  • the conductive film metal pattern material is made of an alloy of aluminum, beryllium oxide (BeO) or aluminum oxide (Al 2 O 3 , Aluminum oxide), which has extremely excellent thermal conductivity. Implement a pattern circuit.
  • FIG. 13 is an actual driving picture connected to a control board (MCU) of a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied.
  • MCU control board
  • the flexible transparent LED display to which the flexible transparent film metal pattern circuit having the flexibility of the present invention is applied has a relatively small line resistance due to the thickness and distance of the line, and has the flexibility to bend or bend the flexible transparent film metal pattern.
  • Pattern) material and small and light weight make the structure simple and detachable at anytime and anywhere.
  • Flexible transparent LED display using a flexible flexible film metal pattern circuit is used in media facades, electronic displays, smart glass panels and the like used for information transmission of advertising billboards.
  • the flexible transparent LED display of the LED electro-optical panel and a method of manufacturing the same according to the present invention are firstly provided with a flexible transparent film metal pattern having three lines of a (+) electrode line, a data line, and a (-) electrode line.
  • the driver IC and the 1R1G1B LED chip are configured in one unit package provided at each point connected to the circuit, and the size of the LED package can be minimized because the volume of devices occupied by three LED chips can be reduced to one within the same volume. Can be.
  • raw materials can be significantly reduced in assembling 1R1G1B LED chips.
  • 1R1G1B LED chips are manufactured by a manufacturing process mounted at each point of a matrix structure in a flexible transparent film metal pattern assembly circuit, thus saving LED PCBs by reducing PCB PCB, ITO pattern, and silver paste.
  • Productivity is improved and production cost is greatly reduced due to manufacturing cost and simplified manufacturing process.
  • the flexible transparent LED display to which the flexible transparent film metal pattern circuit of the present invention is applied has a relatively small line resistance due to the thickness and distance of the line, and has a flexible transparent film metal pattern having flexibility of bending or bending.
  • Transparent Film Metal Pattern material is used, and its structure is simple due to its small size and light weight, and it can be attached and detached anytime and anywhere.
  • the Noise between the metal patterns generated when driving the device can be improved by reducing the number of circuit patterns, and within the control board
  • the signal processing unit to be configured can be miniaturized and the user's convenience can be achieved.
  • Flexible transparent LED display using a flexible flexible film metal pattern circuit is used in media facades, electronic displays, smart glass panels and the like used for information transmission of advertising billboards.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electromagnetism (AREA)

Abstract

A flexible transparent LED display of a LED electro-optical panel and a method for manufacturing the same are disclosed. The flexible transparent LED display of the LED electro-optical panel adopts a flexible transparent film metal pattern circuit equipped with three lines of a (+) electrode line, a data line and a (-) electrode line, in which a substrate PCB is not used, and in one unit package provided at each point of a matrix structure connected to the flexible transparent film metal pattern circuit, an operation circuit equipped with a 1R1G1B LED chip and a driver IC is continuously arranged in series and in parallel. The flexible transparent LED display of the LED electro-optical panel of the present invention does not use a heat sink for solving the heat generation problem generated during the operation of the 1R1G1B LED chip, and performs self-dispersion heat generation in the flexible transparent film metal pattern circuit having flexibility, thereby having an effect of extending the lifetime of the LED chip and stably maintaining the brightness thereof.

Description

LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이 및 그 제조 방법Flexible transparent LED display of LED electro-optical panel and manufacturing method thereof
본 발명은 LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이 및 그 제조 방법에 관한 것으로, 보다 상세하게는 기판 PCB를 사용하지 않고 LED 칩의 열을 방출하기 위한 히트 싱크를 사용하지 않으며, (+)전극선, 데이터 라인, (-)전극선의 3선이 구비되는 유연성을 갖는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로와 연결되는 각 지점 마다 구비되는 기본적인 하나의 단위 패키지들에서는 드라이버 IC와 1R1G1B LED 칩이 장착되고 연속적으로 조립된 구조의 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern Assembly)을 제조하며, 드라이버 IC와 1R1G1B LED 칩과 함께 동일 플렉시블 투명 필름 메탈 패턴 회로 내에 형성하여 LED 칩이 동작 중에 발생하는 열을 자체적으로 신속히 외부로 방출시키는 기판 PCB가 없는 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display)를 제조하며, 도시미관, 디자인, 시각적 효과와 영상광고 전달 매체로 다양한 기능의 알루미늄(Al), 구리(Cu) 등의 플렉시블 투명 필름 메탈 패턴 소재를 사용하여 유연성을 갖는 LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이 및 그 제조 방법에 관한 것이다.The present invention relates to a flexible transparent LED display of the LED electro-optical panel and a method of manufacturing the same, more specifically, does not use a heat sink for dissipating heat of the LED chip without using a substrate PCB, (+) electrode wire, The driver IC and the 1R1G1B LED chip are provided in one basic unit package, which is provided at each point connected to a flexible flexible film film pattern having flexible data lines and three lines of negative electrode lines. Fabricates a flexible transparent film metal pattern assembly of a mounted and continuously assembled structure, and is formed in the same flexible transparent film metal pattern circuit together with a driver IC and a 1R1G1B LED chip to generate an LED chip during operation. PCB-less flexible transparent LED display that dissipates heat quickly to itself It manufactures flexible transparent LED display and has flexibility by using flexible transparent film metal pattern materials such as aluminum (Al) and copper (Cu) with various functions as a city aesthetic, design, visual effect and visual advertisement delivery media. A flexible transparent LED display of an LED electro-optical panel and a method of manufacturing the same.
LED(Light Emitting Diode)는 다수 캐리어가 전자(electron)인 n형 반도체와 다수 캐리어가 정공(hole)인 p형 반도체를 PN 접합된 광전변환 반도체 소자로써, 화합물 반도체의 특성에 의해 전기 신호를 특정 파장 대역을 갖는 빛으로 변환하여 신호가 출력되며, 마이컴 칩 내장 LED, 실내 조명기기, 실외 LED 전광판, 교통 신호등, 가로등, 자동차 전조등 LED에 주로 사용된다. LED 구동 방식은 DC 구동 회로, AC 구동 회로, LED의 펄스폭 변조(PWM, Pulse Width Modulation)에 의해 광 출력을 변화시켜 광색 및 색온도 제어를 제공하는 펄스 구동 회로(PWM 제어)를 사용하거나 또는 LED는 정전압, 정전류, 역률 제어를 하는 구동 IC가 사용될 수 있다. Light Emitting Diode (LED) is a photoelectric conversion semiconductor device in which a P-type semiconductor is formed of an n-type semiconductor whose majority carrier is an electron and a p-type semiconductor which has a majority carrier is a hole. The signal is output by converting it into light having a wavelength band, and it is mainly used for microcomputer chip built-in LED, indoor lighting equipment, outdoor LED billboard, traffic signal lamp, street light, automobile headlight LED. The LED driving method uses a DC driving circuit, an AC driving circuit, a pulse driving circuit (PWM control) that provides light color and color temperature control by changing the light output by pulse width modulation (PWM) of the LED, or LED The driving IC for controlling the constant voltage, the constant current, and the power factor may be used.
LED는 i) 램프 타입 포탄형 LED, ii) 표면실장형(SMD, Surface Mounted Device) 패키지, iii) COB(Chip on Board) 패키지로 분류된다. 옥외 LED 전광판은 방수 처리된 마이컴 보드에 의해 구동된다. LEDs are classified into i) lamp type shell type LEDs, ii) Surface Mounted Device (SMD) packages, and iii) Chip on Board (COB) packages. The outdoor LED billboard is powered by a waterproof microcomputer board.
LED 전광판은 단색과 RGB 3색 또는 풀컬러 LED 전광판이 출시되고 있으며, 면광원의 LED 조명에 의해 광고 이미지가 표시되고, 대형 빌딩, 약국/병원, 식당/노래방/호프집, 학원, 미용실, 안경점, 주유소, 극장 등에 주로 사용된다. LED signboards are available in single color and RGB tricolor or full color LED signboards.The advertising images are displayed by the LED light of the surface light source, and large buildings, pharmacies / hospitals, restaurants / karaokes / hobby houses, cram schools, beauty salons, and opticians Mainly used in gas stations, gas stations, theaters, etc.
기존 LED 전광판은 일반적으로 사용되는 기판 PCB(Printed Circuit Board)를 사용하며 LED 칩이 장착되고, LED 칩이 동작 중에 발생시키는 발열 문제를 해결하기 위해 기판 PCB 후면에 히트싱크(Heatsink)를 사용한다. Existing LED display boards use a printed circuit board (PCB) that is commonly used, and an LED chip is mounted, and heat sinks are used on the back of the PCB to solve the heat problem generated during the operation of the LED chip.
실내, 실외용에서 사용되는 도 1의 LED 전광판은 세부적으로는 도 2와 같이 영상 제공 컨트롤러, 운영 PC, 네트워크, LED 전광판으로 구성되며, 그 하나는 타원(Oval)형 RGB(Red, Green, Blue) LED Module로 대면적 화면 전체를 구성하는 몇 개의 단위 PCB(Printed Circuit Board)와 그 기판 위에 장착되는 타원(Oval)형 LED Chip(Package) 또는 LED Chip을 탑재하는 구조로 되어 있다. The LED signboard of FIG. 1 used for indoor and outdoor use is composed of an image providing controller, an operating PC, a network, and an LED signboard as shown in FIG. 2, and one of them is an oval type RGB (Red, Green, Blue). It is a structure that is equipped with several unit PCB (Printed Circuit Board) constituting the entire large area screen and an Oval type LED Chip (Package) or LED Chip mounted on the board.
도 1을 참조하면, 기존의 LED 전광판은 대부분 타원형 LED 또는 LED 칩을 사용하고, 회로 동작 중 발생하는 열 발산을 원활하게 하기 위해 PCB 후면 부분에 히트씽크(Heatsink) 및 냉각용 팬(fan)을 부착하여 방열하는 방식을 사용하여 그 크기와 무게 등의 면에서 공간적으로 과도한 체적과 하중을 거치대에 부과하게 된다. 따라서, 전광판의 안정적인 거치를 위한 거치대의 크기는 또한 디자인(Design)적인 측면에서 매우 부담을 주는 요소로 작용하고 있다. Referring to FIG. 1, a conventional LED display board uses mostly elliptical LEDs or LED chips, and heatsinks and cooling fans are provided on the rear portion of the PCB to smooth heat dissipation generated during circuit operation. By attaching and dissipating heat, space and excessive volume and load are imposed on the cradle in terms of size and weight. Therefore, the size of the holder for stable mounting of the display board also acts as a very burdensome factor in terms of design.
이와 관련된 선행기술1로써, 특허 등록번호 10-0992383에서는 점등 주행 거리를 단축시켜 플리커 현상을 최소화할 수 있는 다이나믹 구동 방식의 LED 전광판 및 그 구동 방법이 개시되어 있다. LED 전광판은 다수의 LED 소자들을 다이나믹 구동 방식으로 구동하는 LED 전광판에 있어서, 상기 LED 소자들이 m x n(여기서, 상기 m, n은 2 이상의 자연수임)개씩 지역별로 분할 배치된 LED 모듈; 상기 지역마다 어느 하나의 LED 소자를 동시에 전기적으로 연결하기 위한 선택 제어 신호를 발생하는 제어부; 상기 지역마다 1개씩의 LED 소자와 접속되고, 상기 선택 제어 신호에 응답하여, 접속된 LED 소자들을 1/m x n 주기 동안 동시에 전기적으로 연결하는 m x n개의 셀렉터; 및 상기 셀렉터에 의해 전기적으로 연결되는 LED 소자들에 구동 데이터를 공급하는 능동 회로를 포함하고 있다.As a related art 1, Patent Registration No. 10-0992383 discloses a LED driving plate of a dynamic driving method and a driving method thereof capable of minimizing a flicker phenomenon by shortening a lighting traveling distance. An LED display board is a LED display board for driving a plurality of LED elements in a dynamic driving method, the LED module is divided into regions each of the LED elements m x n (where m, n is a natural number of two or more); A control unit for generating a selection control signal for electrically connecting any one LED element to each area at the same time; M x n selectors connected to one LED element per said region and electrically connecting the connected LED elements simultaneously for 1 / m x n periods in response to said selection control signal; And an active circuit for supplying driving data to the LED elements electrically connected by the selector.
이와 관련된 선행기술2로써, 특허 등록번호 10-1372861(등록일자 2014년 03월 03일)에서는 양방향으로 정보를 표시하는 LED의 단일패널 전광판은 자체 중량을 줄일 수 있으며 박형화가 가능하고 원가를 절감할 수 있는 양방향 LED 전광판을 개시한다. 양방향 LED의 단일패널 전광판은 케이스; 상기 케이스의 내부에 장착된 하나의 PCB; 상기 PCB의 전면과 후면에 각각 일정간격을 두고 배치된 다수의 LED 칩; 상기 LED 칩의 구동을 제어하도록 전기적으로 연결된 구동회로; 및 상기 구동회로에 패턴신호를 송출하는 제어부를 포함하고 있다. As a related art 2, Patent Registration No. 10-1372861 (Registration date 03/03/2014) shows that the LED single-panel electronic display panel displays information in both directions, which can reduce its own weight, reduce its thickness, and reduce costs. Disclosed is a bidirectional LED signboard that can be used. Bi-directional LED single panel display case; A PCB mounted inside the case; A plurality of LED chips disposed at predetermined intervals on the front and rear surfaces of the PCB; A driving circuit electrically connected to control driving of the LED chip; And a control unit for transmitting a pattern signal to the driving circuit.
그러나, 소면적 및 대면적 디스플레이용 LED 전광판에 사용되는 타원(Oval)형 패키지의 형태를 사용하여 제작되는 기존의 소면적 및 대면적 디스플레이용 전광판은 타원형의 RGB LED를 개별적으로 사용하여 구성되는 화소(Pixel)의 크기가 매우 커지는 문제가 있기에 고해상도의 대면적 디스플레이 구현에 제약이 많다. However, existing small area and large area display boards manufactured using the shape of an oval-type package used for small area and large area LED display boards are pixels that are formed by individually using elliptical RGB LEDs. (Pixel) has a problem in that the size is very large, there are many limitations in the implementation of high resolution large area display.
게다가, 이를 대면적의 화상으로 구현하기 위해서는 수 천개 이상의 LED 패키지가 단위 PCB(Printed Circuit Board) 상에 장착되기에 이로 인한 소자의 동작에 따른 발열을 해결하기 위해 팬(Fan)을 이용한 강제 냉각 순환 방식의 방열시스템을 사용하고 있다. Furthermore, in order to realize this in a large area image, thousands of LED packages are mounted on a printed circuit board (PCB), and forced cooling circulation using a fan is used to solve the heat generated by the operation of the device. It uses a heat dissipation system.
또한, 각각의 소자 구동 및 신호 처리를 위한 컨트롤러(controller) 연결 단자와 커넥터 및 케이블이 각 PCB의 단위 보드와 연결되어 디스플레이 화면을 구성하는 LED Module의 크기는 매우 무겁고 크게 제작되고 있으며, 도시미관을 저해하고 실내 디자인 및 인테리어에 유해한 환경을 제공하고 있다.In addition, the size of the LED module that makes up the display screen by connecting controller connection terminals, connectors, and cables for each device driving and signal processing with the unit board of each PCB is very heavy and manufactured. It is damaging and providing a harmful environment for interior design and interior.
그러나, 전광판용 LED Module은 기판 PCB와 그 기판 PCB에 장착되는 타원(Oval)형 LED Chip(Package), Rear Frame, SMPS 구조로 되어 있다. 1R1G1B LED Chip 단위 소자가 구동하게 될 때, 그 소비 전력에 따른 열 발산이 크게 문제되지 않지만, 옥외용 전광판처럼 정형적으로 정해진 공간 내에서 매트릭스 구조의 화소(Pixel) 하나하나로 작용하는 수 만개 이상의 1R1G1B LED 칩에서 소모되는 전체적인 전력과 소자가 발생시키는 발열량은 무시할 수 없을 만큼 중요한 문제이다. 옥외용 전광판은 각각의 단위 보드에 대해서는 방열을 위한 팬(Fan)을 필수적으로 장착하고, 외부 공기를 강제 순환하는 방식으로 대류 작용을 하고 있다. However, the LED module for the electronic board has a board PCB and an Oval type LED chip (Package), a rear frame, and an SMPS structure mounted on the board PCB. When the 1R1G1B LED chip unit device is driven, heat dissipation due to its power consumption is not a big problem, but more than tens of thousands of 1R1G1B LEDs acting as one pixel of a matrix structure in a formally defined space such as an outdoor display board The total power consumed by the chip and the amount of heat generated by the device are insignificant. The outdoor electronic signboard is essentially equipped with a fan for heat dissipation for each unit board and performs convection by forcibly circulating external air.
종래 기술의 문제점을 해결하기 위한 본 발명의 목적은 (+)전극선, 데이터 라인, (-)전극선의 3선이 구비되는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로를 적용하여 일반적으로 사용되는 기판 PCB를 사용하지 않고, 플렉시블 투명 필름 메탈 패턴 회로와 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지들에서는 드라이버 IC와 1R1G1B LED 칩을 장착하는 동작회로를 직병렬로 연속적으로 구성하며, 1R1G1B LED 칩이 동작 중에 발생시키는 발열 문제를 해결하기 위한 히트싱크를 사용하지 않으며, 플렉시블 투명 필름 메탈 패턴 회로에서 자체적으로 분산 발열하여 LED 칩의 수명 연장 및 밝기를 안정적으로 유지하는, LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display)를 제공한다. An object of the present invention for solving the problems of the prior art is generally used by applying a flexible transparent film metal pattern circuit having three lines of (+) electrode line, data line, (-) electrode line In the unit packages provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, the operation circuit for mounting the driver IC and the 1R1G1B LED chip is continuously arranged in series and in parallel. LED electro-optic, which does not use heatsink to solve the heat problem that 1R1G1B LED chip generates during operation, and disperses itself in flexible transparent film metal pattern circuit to prolong life of LED chip and maintain brightness It offers panel flexible transparent LED display.
본 발명의 다른 목적은 LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display) 제조 방법을 제공한다.Another object of the present invention is to provide a method of manufacturing a flexible transparent LED display of an LED electro-optical panel.
본 발명의 목적을 달성하기 위해, LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이는 전도성을 갖는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재를 사용하며, (+)전극선, 데이터 라인, (-)전극선으로 구성되고, 휘어지거나 구부러지는 유연성을 갖는 플렉시블 투명 필름 메탈 패턴 회로; 상기 플렉시블 투명 필름 메탈 패턴 회로와 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지마다 Soldering에 의해 장착된 1R1G1B LED 칩과, 상기 데이터 라인에 RGB 조합 색상 신호를 전송받아 상기 1R1G1B LED 칩을 구동하는 드라이버 IC; 및 LED 디스플레이를 구동하기 위해, 상기 플렉시블 투명 필름 메탈 패턴 회로의 상기 (+)전극선에 전원을 공급하며, 상기 (-)전극선을 접지하며, 상기 데이터 라인에 상기 RGB 조합 색상 신호를 전송하여 색상이 표시되도록 하는 제어 보드를 포함하고,In order to achieve the object of the present invention, the flexible transparent LED display of the LED electro-optical panel uses a conductive flexible transparent film metal pattern material, (+) electrode line, data line, (-) A flexible transparent film metal pattern circuit composed of electrode lines and having flexibility to bend or bend; Each 1R1G1B LED chip mounted by soldering is provided for each unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, and the RGB combinational color signal is transmitted to the data line to drive the 1R1G1B LED chip. Driver IC; And supply power to the (+) electrode line of the flexible transparent film metal pattern circuit, ground the (−) electrode line, and transmit the RGB combined color signal to the data line to drive the LED display. Includes a control board to be displayed,
상기 전도성을 갖는 플렉시블 투명 필름 메탈 패턴 소재는 열전도도가 우수한, 알루미늄(Aluminum), 산화베릴륨(BeO, Beryllium oxide)이나 산화알루미늄(Al2O3, Aluminum oxide)의 합금을 사용하여 상기 플렉시블 투명 필름 메탈 패턴 회로를 구현하며, The conductive flexible transparent film metal pattern material has an excellent thermal conductivity of the flexible transparent film using an alloy of aluminum, beryllium oxide (BeO), or aluminum oxide (Al 2 O 3 , Aluminum oxide). Implement a metal pattern circuit,
상기 플렉시블 투명 필름 메탈 패턴 회로는 히트싱크를 사용하지 않고 1R1G1B LED 칩 동작 시 발생되는 열을 방출하며, 기판 PCB 없이 동작하는 것을 특징으로 한다. The flexible transparent film metal pattern circuit emits heat generated when the 1R1G1B LED chip is operated without using a heat sink, and operates without a substrate PCB.
본 발명의 다른 목적을 달성하기 위해, LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이 제조 방법은, (a) 기판 PCB를 사용하지 않으며, 아트워크 후에 전도성을 갖는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재를 사용하며, (+)전극선, 데이터 라인, (-)전극선으로 구성된 유연성을 갖는 플렉시블 투명 필름 메탈 패턴 회로와 메탈 가이드라인에 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지마다 표면실장 기술(SMT)에 의해 드라이버 IC와 1R1G1B LED 칩을 장착하는 단계; (b) 상기 플렉시블 투명 필름 메탈 패턴 회로와 연결된 각 지점 마다 드라이버 IC와 1R1G1B LED 칩을 각각 장착하는 단계; (c) 상기 완성된 플렉시블 투명 필름 메탈 패턴 어셈블리(Flexible Transparent Film Metal Pattern Assembly)를 그 하판에 아크릴판 또는 PC(폴리카보네이트), 또는 글라스(유리;Glass)를 사용한 베이스 커버(Base Cover)를 밀착시켜 고정하여 붙이는 단계; (d) 상기 (c)의 베이스 커버를 뒤집어 상기 베이스 커버의 작업 완료된 앞면에 상판 아크릴판 또는 PC(폴리카보네이트), 또는 글라스(유리;Glass)를 사용한 윈도우 커버(Window Cover)를 하판과 일치되게 조립하는 단계; 및 (e) 상기 플렉시블 투명 메탈 패턴 회로를 갖는 플렉시블 투명 LED 디스플레이가 제작되는 단계를 포함하고, In order to achieve another object of the present invention, a method of manufacturing a flexible transparent LED display of the LED electro-optical panel, (a) does not use a substrate PCB, and has a conductive transparent transparent film metal pattern after the artwork (Flexible Transparent Film Metal Pattern) Material) and the surface of each unit package provided at each point of the flexible transparent film metal pattern circuit having flexible flexibility composed of (+) electrode line, data line, (-) electrode line and matrix structure connected to the metal guide line Mounting the driver IC and the 1R1G1B LED chip by mounting technology (SMT); (b) mounting a driver IC and a 1R1G1B LED chip at each point connected to the flexible transparent film metal pattern circuit; (c) A base cover using an acrylic plate or PC (polycarbonate) or glass (glass) is adhered to the lower plate of the completed flexible transparent film metal pattern assembly. Fixing and pasting; (d) Turn the base cover of (c) upside down so that the window cover using the top plate acrylic plate or PC (polycarbonate) or glass (glass) on the finished front side of the base cover is aligned with the bottom plate. Assembling; And (e) manufacturing a flexible transparent LED display having the flexible transparent metal pattern circuit.
상기 전도성을 갖는 플렉시블 투명 필름 메탈 패턴 소재는 열전도도가 우수한, 알루미늄(Aluminum), 산화베릴륨(BeO, Beryllium oxide)이나 산화알루미늄(Al2O3, Aluminum oxide)의 합금을 사용하여 상기 플렉시블 투명 필름 메탈 패턴 회로를 구현하며, The conductive flexible transparent film metal pattern material has an excellent thermal conductivity of the flexible transparent film using an alloy of aluminum, beryllium oxide (BeO), or aluminum oxide (Al 2 O 3 , Aluminum oxide). Implement a metal pattern circuit,
상기 플렉시블 투명 필름 메탈 패턴 회로는 히트싱크를 사용하지 않고 1R1G1B LED 칩 동작 시 발생되는 열을 자체적으로 방출하며, 기판 PCB 없이 동작하는 것을 특징으로 한다. The flexible transparent film metal pattern circuit itself emits heat generated when the 1R1G1B LED chip is operated without using a heat sink, and operates without a substrate PCB.
본 발명에 따른 LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이 및 그 제조 방법은 첫째, (+)전극선, 데이터 라인, (-)전극선의 3선이 구비되는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로와 연결되는 각 지점 마다 구비되는 하나의 단위 패키지에서 드라이버 IC와 1R1G1B LED 칩이 구성되며, 동일 체적 내에서 3개의 LED Chip이 차지하는 소자의 체적이 1개로 줄어들 수 있기에 LED 패키지의 크기를 최소화할 수 있다. 역으로, 이는 동일한 디스플레이 판넬 상에 장착할 수 있는 LED 패키지의 숫자를 증대시키는 것이 가능하며, 실제로 동일한 공간 내에서 기존의 전광판 대비 더 많은 픽셀(Pixel)의 구현이 가능하므로 고품질, 고해상도의 대면적 LED 판넬 제작이 충분히 가능하다. The flexible transparent LED display of the LED electro-optical panel and a method of manufacturing the same according to the present invention are firstly provided with a flexible transparent film metal pattern having three lines of a (+) electrode line, a data line, and a (-) electrode line. The driver IC and the 1R1G1B LED chip are configured in one unit package provided at each point connected to the circuit, and the size of the LED package can be minimized because the volume of devices occupied by three LED chips can be reduced to one within the same volume. Can be. On the contrary, it is possible to increase the number of LED packages that can be mounted on the same display panel, and in fact, it is possible to realize more pixels in the same space compared to the existing billboards, so that high quality and high resolution are large. LED panel production is possible enough.
둘째, 1R1G1B LED 칩 조립에 소요되는 원부자재의 절감 효과가 상당히 크다고 할 수 있다. 1R1G1B LED 칩들은 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern Assembly) 회로에 매트릭스 구조의 각 지점마다 장착되는 제조공정에 의해 제작되므로, 기판 PCB, ITO Pattern, 은 페이스트(Ag paste) 절감으로 LED 칩 제조 단가 및 제조 공정 단순화로 생산성을 향상시키고, 생산비용 절감 효과가 크다.Second, raw materials can be significantly reduced in assembling 1R1G1B LED chips. 1R1G1B LED chips are manufactured by a manufacturing process mounted at each point of a matrix structure in a flexible transparent film metal pattern assembly circuit, thus saving LED PCBs by reducing PCB PCB, ITO pattern, and silver paste. Productivity is improved and production cost is greatly reduced due to manufacturing cost and simplified manufacturing process.
기존 PCB 기판을 사용하고, 은 페이스트(Ag Paste) 방식의 전도성 잉크를 사용한 기존 메탈 패턴 회로는 선저항(
Figure PCTKR2018001805-appb-I000001
)이 크며, 이와 달리 본 발명의 플렉시블 투명 필름 메탈 패턴 회로를 적용한 플렉시블 투명 LED 디스플레이는 상대적으로 선의 굵기와 거리에 의한 선 저항이 작으며, 휘어지거나 구부러지는 유연성을 갖는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재를 사용하며 소형 경량화로 구조가 간단하며, 언제 어디든지 탈부착이 가능하다.Existing metal pattern circuits using conventional PCB substrates and using silver paste conductive ink have a line resistance (
Figure PCTKR2018001805-appb-I000001
In contrast, the flexible transparent LED display to which the flexible transparent film metal pattern circuit of the present invention is applied has a relatively small line resistance due to the thickness and distance of the line, and has a flexible transparent film metal pattern having flexibility of bending or bending. Transparent Film Metal Pattern) material is used, and its structure is simple due to its small size and light weight, and it can be attached and detached anytime and anywhere.
셋째, 기판 PCB를 사용하지 않는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern)회로를 적용하여 제조공정 단순화 및 자재 수량이 감소하기에 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display) 제조공정에 수반되는 공정의 횟수가 줄어들며, 이로 인한 생산 공정 내의 불량율이 낮아지고, 제품에 대한 신뢰성이 높아지므로 실제 고객의 요구 환경에서 동작할 때에도 제품의 불량 발생에 의해 발생하는 유지 보수와 그 관련 비용이 크게 낮아지게 된다. Third, the process involved in the process of manufacturing a flexible transparent LED display due to the application of a flexible transparent film metal pattern circuit, which does not use a substrate PCB, to simplify the manufacturing process and reduce the number of materials. The number of times is reduced, and as a result, the defective rate in the production process is lowered and the reliability of the product is increased, thereby significantly reducing maintenance and related costs caused by the occurrence of product defects even when operating in a real customer's required environment. .
네번째, 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Patterny)회로를 적용하여 회로 Pattern 수 감소에 의해 소자 구동 시에 발생하는 메탈 패턴 간의 잡음(Noise)을 개선시킬 수 있으며, 제어 보드(control board) 내에 구성되는 신호처리부가 소형화되며, 사용자의 편의를 도모한다. Fourth, by applying the Flexible Transparent Film Metal Patterny circuit, the noise between the metal patterns generated when driving the device can be improved by reducing the number of circuit patterns, and within the control board The signal processing unit to be configured can be miniaturized and the user's convenience can be achieved.
다섯번째, 플레시블 투명 LED 디스플레이(Flexible Transparent LED Display) 제품은 가볍고 얇게 제작될 수 있으며, 기존의 실내 인테리어, 디자인을 해치지 않고 설치하여 투명성, 시인성을 향상하여 이로 인해 유발되는 제품의 높은 선정성은 기존의 유사 제품에 비교하여 가격 대비 성능과 품질 경쟁력이 매우 높아져 고객 만족감이 증대한다. Fifth, Flexible Transparent LED Display products can be made light and thin, and installed without harming the existing interior or design, improving transparency and visibility, resulting in high selectivity of existing products. Compared to similar products, the product has a very high price performance and quality competitiveness, increasing customer satisfaction.
유연성을 갖는 플렉시블 투명 필름 메탈 패턴 회로를 사용한 플렉시블 투명 LED 디스플레이는 광고판의 정보 전달 용도로 사용되는 미디어 파사드(Media facade), 전광판, 스마트 유리 판넬(Smart glass panel) 등에 사용된다. Flexible transparent LED display using a flexible flexible film metal pattern circuit is used in media facades, electronic displays, smart glass panels and the like used for information transmission of advertising billboards.
도 1은 기존의 LED 전광판이다. 1 is a conventional LED sign.
도 2는 기존의 LED 전광판 구성도이다. 2 is a configuration diagram of a conventional LED display.
도 3은 기존의 타원(Oval)형 LED 모듈 구성도이다.3 is a configuration diagram of a conventional elliptic (Oval) type LED module.
도 4는 본 발명에 의한 플렉시블 투명 필름 메탈 패턴 아트워크(Flexible Transparent Film Metal Pattern Artwork)의 사진이다. 4 is a photograph of a flexible transparent film metal pattern artwork according to the present invention.
도 5는 작업 완료된 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로의 공정도이다. FIG. 5 is a process diagram of a completed flexible transparent film metal pattern circuit. FIG.
도 6은 플렉시블 투명 필름 메탈 패턴 회로에 SMT(Surface Mounted Technology) 기술에 의해 드라이버 IC와 1R1G1B LED 칩 장착 공정을 나타낸 사진이다.FIG. 6 is a photograph illustrating a process of mounting a driver IC and a 1R1G1B LED chip by a surface mounted technology (SMT) technology in a flexible transparent film metal pattern circuit.
도 7은 플렉시블 투명 필름 메탈 패턴 회로와 연결된 각 지점 마다 드라이버 IC와 1R1G1B LED 칩 장착 후, 드라이버 보드(Driver Board) 회로 연결용 에프피씨비(FPCB:Film Printed Circuit Board)를 장착한 공정을 나타낸 사진이다. FIG. 7 is a photograph showing a process in which a driver IC and a 1R1G1B LED chip are mounted at each point connected to a flexible transparent film metal pattern circuit, and then a FPCB (Film Printed Circuit Board) for connecting a driver board circuit is mounted. .
도 8a는 본 발명에 의한 플렉시블 투명 필름 메탈 패턴 회로에 연결된 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지에서 드라이버 IC와 1R1G1B LED 칩이 Soldering 작업에 의해 각각 장착되어 완성된 플렉시블 투명 필름 메탈 패턴 어셈블리(Flexible Transparent Film Metal Pattern Assembly) 및 1R1G1B LED Chip 동작을 테스트(Test) 하는 공정을 나타낸 사진이다.8A illustrates a flexible transparent film metal pattern assembly in which a driver IC and a 1R1G1B LED chip are mounted by soldering in a unit package provided at each point of a matrix structure connected to a flexible transparent film metal pattern circuit according to the present invention. This is a picture showing a process of testing (Flexible Transparent Film Metal Pattern Assembly) and 1R1G1B LED Chip operation.
도 8b는 (+)전극선, 데이터 라인, (-)전극선의 3선이 구비되는 플렉시블 투명 필름 메탈 패턴과, 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로와 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지들에서는 드라이버 IC와 1R1G1B LED 칩이 장착된 사진이다.FIG. 8B is a flexible transparent film metal pattern including three lines of (+) electrode line, data line, and (-) electrode line, and each point of the matrix structure connected to the flexible transparent film metal pattern circuit. In one unit package, the driver IC and the 1R1G1B LED chip are mounted.
도 9는 플렉시블 투명 필름 메탈 패턴 어셈블리(Flexible Transparent Film Metal Pattern Assembly)와 전기적 신호를 공급하고 제어하는 드라이버 보드(Driver Board)를 연결하는 공정을 나타낸 도면이다. FIG. 9 is a diagram illustrating a process of connecting a flexible transparent film metal pattern assembly and a driver board to supply and control an electrical signal.
도 10은 본 발명에 의한 Bottom Cover 아크릴(Acrylic)판 또는 폴리카보네이트(Polycarbonate)를 도 9에서 조립하고 Window Cover 아크릴(Acrylic)판 또는 폴리카보네이트(Polycarbonate)를 조립하여 제작, 완성된 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display) 공정을 나타낸 사진이다. FIG. 10 is a bottom cover acrylic plate or polycarbonate according to the present invention assembled from FIG. 9 and window cover acrylic plate or polycarbonate assembled and fabricated, and completed a flexible transparent LED display (Flexible Transparent LED Display) The picture shows the process.
도 11은 본 발명에 의한 플렉시블 투명 필름 메탈 패턴 회로를 적용한 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display) 제작 공정을 나타낸 구성도이다. 11 is a configuration diagram showing a flexible transparent LED display manufacturing process to which a flexible transparent film metal pattern circuit according to the present invention is applied.
도 12는 본 발명에 의한 플렉시블 투명 필름 메탈 패턴 회로를 적용한 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display)에서는 기판 PCB와 히트싱크를 사용하지 않으며, (+)전극선, 데이터 라인, (-)전극선의 3선이 구비되는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로와 연결되는 각 지점 마다 구비되는 하나의 단위 패키지들에서는 드라이버 IC와 1R1G1B LED 칩을 장착하는 동작회로 구성도이다. 12 is a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied, does not use a substrate PCB and a heat sink, and has three (+) electrode lines, data lines, and (-) electrode lines. In one unit package provided at each point connected to a flexible transparent film metal pattern circuit having lines, an operation circuit diagram of mounting a driver IC and a 1R1G1B LED chip is illustrated.
도 13은 본 발명에 의한 플렉시블 투명 필름 메탈 패턴 회로를 적용한 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display)의 제어 보드(control board, MCU)와 연결되어 동작되는 실제 구동 사진이다.FIG. 13 is an actual driving picture connected to a control board (MCU) of a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied.
이하, 본 발명의 바람직한 실시 예를 첨부된 도면을 참조하여 발명의 구성 및 동작을 상세하게 설명한다. Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail the configuration and operation of the invention.
본 발명은 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern, 이하 Film metal pattern 칭함) 회로를 적용하여 일반적으로 사용하고 있는 기판 PCB를 사용하지 않고 플렉시블 투명 필름 메탈 패턴 회로에 매트릭스 구조의 각 지점(화소)에 드라이버 IC와 1R1G1B LED 칩을 장착하는 동작회로를 구성하며, 1R1G1B LED Chip이 동작 중에 발생시키는 발열 문제를 해결하기 위한 히트싱크(Heatsink)를 사용하지 않으며, 플렉시블 투명 필름 메탈 패턴 회로에서 복수의 LED 칩들에서 발생되는 열을 자체적으로 분산 발열하여 LED 칩의 수명 연장 및 밝기를 안정적으로 유지하는 LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display) 및 그 제조 방법을 제공한다. The present invention applies a flexible transparent film metal pattern circuit (hereinafter referred to as a film metal pattern) circuit, and does not use a substrate PCB that is generally used. ), And the operation circuit to install the driver IC and the 1R1G1B LED chip, does not use heatsink to solve the heat problem generated during the operation of the 1R1G1B LED chip, and a plurality of flexible transparent film metal pattern circuit The present invention provides a flexible transparent LED display (LED) of an electro-optical panel and a method of manufacturing the same, which self-disperse heat generated from LED chips to prolong the life of the LED chip and stably maintain brightness.
본 발명은 근거리, 원거리에서 불특정 다수의 대중에게 정보 전달 용도로 사용되는 미디어 파사드(Media facade), 전광판, 신호 처리나 전달 및 표시용 보드(Board), 스마트 유리 판넬(Smart glass panel)등에 적용되는 LED와 그 LED 판넬(Panel)의 구성 및 제작 방법에 관한 것으로, 해당 LED 판넬에 장착되는 매트릭스 구조의 각 지점마다의 드라이버 IC(Driver IC)와 1R1G1B(Red, Green, Blue) LED 칩의 광원이 안정적이고, 효율적이고 개별적으로 구동되도록 1R1G1B LED 칩 구동 시 발생되는 열 발산을 원활하게 하는 1G1G1B LED 칩의 방열 구조와 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로 구조 및 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display) 제작 방법에 관한 것이다.DETAILED DESCRIPTION The present invention is applied to media facades, electronic displays, signal processing or transmission and display boards, and smart glass panels, which are used for information transmission to a large number of unspecified public at short distances and long distances. The configuration and manufacturing method of the LED and its LED panel. The driver IC and the light source of the 1R1G1B (Red, Green, Blue) LED chip for each point of the matrix structure mounted on the LED panel are The heat dissipation structure of the 1G1G1B LED chip, the flexible transparent film metal pattern circuit structure, and the flexible transparent LED display (Flexible) that smoothly dissipate heat generated when driving the 1R1G1B LED chip for stable, efficient and individual driving. Transparent LED Display) manufacturing method.
플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display)는 미디어 파사드, 전광판, 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display), 스마트 판넬 등에 적용되는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로를 적용하여 열 발산을 위한 히트싱크(Heatsink)를 사용하지 않으며, 기판 PCB가 없는 새로운 구조를 적용하였다. 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern)은 기판 PCB 없이 제조되며, 히트싱크를 사용하지 않고 자체적으로 1R1G1B LED 칩의 열을 방출하는 기본 회로를 구성한다.Flexible Transparent LED Display dissipates heat by applying Flexible Transparent Film Metal Pattern circuits applied to media facades, electronic displays, flexible transparent LED displays, smart panels, etc. No heatsink was used, and a new structure without a substrate PCB was applied. Flexible Transparent Film Metal Patterns are manufactured without a substrate PCB and form the basic circuitry that dissipates heat from the 1R1G1B LED chip itself without the use of heat sinks.
도 4는 본 발명에 의한 플렉시블 투명 필름 메탈 패턴 아트워크(Flexible Transparent Film Metal Pattern Artwork)의 사진이다. 4 is a photograph of a flexible transparent film metal pattern artwork according to the present invention.
도 5는 작업 완료된 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로를 나타낸 자재 사진이다. FIG. 5 is a photograph of a material showing a completed flexible transparent film metal pattern circuit. FIG.
도 6은 플렉시블 투명 필름 메탈 패턴 회로에 SMT(Surface Mounted Technology) 기술에 의해 드라이버 IC와 1R1G1B LED 칩 장착 공정을 나타낸 사진이다.FIG. 6 is a photograph illustrating a process of mounting a driver IC and a 1R1G1B LED chip by a surface mounted technology (SMT) technology in a flexible transparent film metal pattern circuit.
도 7은 플렉시블 투명 필름 메탈 패턴 회로와 연결된 각 지점 마다 드라이버 IC와 1R1G1B LED 칩 장착 후, 드라이버 보드(Driver Board) 회로 연결용 에프피씨비(FPCB:Film Printed Circuit Board)를 장착한 공정을 나타낸 사진이다. FIG. 7 is a photograph showing a process in which a driver IC and a 1R1G1B LED chip are mounted at each point connected to a flexible transparent film metal pattern circuit, and then a FPCB (Film Printed Circuit Board) for connecting a driver board circuit is mounted. .
도 8은 본 발명에 의한 플렉시블 투명 필름 메탈 패턴 회로에 연결된 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지에서 드라이버 IC와 1R1G1B LED 칩이 Soldering 작업에 의해 각각 장착되어 완성된 플렉시블 투명 필름 메탈 패턴 어셈블리(Flexible Transparent Film Metal Pattern Assembly) 및 1R1G1B LED Chip 동작을 테스트(Test) 하는 공정을 나타낸 사진이다. 8 is a flexible transparent film metal pattern assembly in which a driver IC and a 1R1G1B LED chip are mounted by soldering in a unit package provided at each point of a matrix structure connected to a flexible transparent film metal pattern circuit according to the present invention. This is a picture showing a process of testing (Flexible Transparent Film Metal Pattern Assembly) and 1R1G1B LED Chip operation.
본 발명에 의한 Flexible Transparent LED Display 제조 방법은Flexible Transparent LED Display manufacturing method according to the present invention
1) 도 4에 도시된 바와 같이, 기판 PCB를 사용하지 않는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로를 아트워크(Artwork)한다.1) As shown in FIG. 4, a flexible transparent film metal pattern circuit that does not use a substrate PCB is artwork.
2) 도 5에 도시된 바와 같이, 아트워크 작업이 완료된 플렉시블 투명 필름 메탈 패턴 회로 자재를 제조 공정에 따라 제작한다. 2) As shown in FIG. 5, the flexible transparent film metal pattern circuit material having the artwork work is manufactured according to the manufacturing process.
3) 도 6에 도시된 바와 같이, 아트워크 작업이 완료된 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로와 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지들에서는 드라이버 IC와 1R1G1B LED 칩을 장착하는 동작회로를 연속적으로 구성한다. 즉, 표면실장 기술(SMT, Surface Mounted Technology)에 의해 플렉시블 투명 필름 메탈 패턴 회로에서 매트릭스 구조의 각 지점의 하나의 단위 패키지마다 드라이버 IC와 1R1G1B LED 칩을 장착한다. 3) As shown in FIG. 6, the driver IC and the 1R1G1B LED are provided in one unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit in which the artwork is completed. The operation circuit for mounting the chip is continuously configured. That is, the surface mount technology (SMT) mounts the driver IC and the 1R1G1B LED chip in each unit package of each point of the matrix structure in the flexible transparent film metal pattern circuit.
단일 면적에 장착되는 1R1G1B LED 칩들의 수량이 증대할수록 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 면적은 증대하게 되는데 1R1G1B LED Chip 수량 증대, 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로 수량이 증대하면 단위 면적당 구성되는 픽셀(Pixel) 간격 차이에 의하여 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display)의 투명도, 시인성 및 투과율 차이가 발생한다. As the number of 1R1G1B LED chips mounted in a single area increases, the area of the flexible transparent film metal pattern increases.The number of 1R1G1B LED chips increases and the number of flexible transparent film metal patterns circuits. If the increase is increased, the transparency, visibility and transmittance difference of the flexible transparent LED display occurs due to the difference in the pixel spacing configured per unit area.
4) 도 12를 참조하면, 플렉시블 투명 필름 메탈 패턴 회로와 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지들에서는 드라이버 IC(13)와 1R1G1B LED 칩(14)이 장착되며, 플렉시블 투명 필름 메탈 패턴 회로(2)는 각각의 1R1G1B LED칩(14)의 애노드(Anode)와 연결되는 (+)전극선(10), 드라이버 IC와 연결되는 데이터 라인(11); 및 각각의 1R1G1B LED 칩(14)의 캐쏘드(Cathode)와 연결되는 (-)전극선(12)을 포함하는 3선이 구비된다. 데이터 라인(11)은 제어 보드(Control Board, MCU)로부터 RGB 조합 색상 신호가 전송된다.4) Referring to FIG. 12, in one unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, the driver IC 13 and the 1R1G1B LED chip 14 are mounted and the flexible transparent film The metal pattern circuit 2 includes a positive electrode line 10 connected to an anode of each 1R1G1B LED chip 14 and a data line 11 connected to a driver IC; And three wires including a negative electrode line 12 connected to a cathode of each 1R1G1B LED chip 14. The data line 11 transmits an RGB combined color signal from a control board (MCU).
1R1G1B LED칩은 하나의 빨강 LED, 하나의 그린 LED, 하나의 파랑 LED를 포함한다.The 1R1G1B LED chip contains one red LED, one green LED, and one blue LED.
5) 도 6은 플렉시블 투명 필름 메탈 패턴 회로에 SMT(Surface Mounted Technology) 기술에 의해 드라이버 IC와 1R1G1B LED 칩 장착 공정을 나타낸 사진이다.5) FIG. 6 is a photograph showing a process of mounting a driver IC and a 1R1G1B LED chip in a flexible transparent film metal pattern circuit by SMT (Surface Mounted Technology) technology.
6) 도 7은 플렉시블 투명 필름 메탈 패턴 회로와 연결된 각 지점 마다 드라이버 IC와 1R1G1B LED 칩 장착 후, 드라이버 보드(Driver Board) 회로 연결용 에프피씨비(FPCB:Film Printed Circuit Board)를 장착한 공정을 나타낸 사진이다. 6) FIG. 7 shows a process in which a driver IC and a 1R1G1B LED chip are mounted at each point connected to a flexible transparent film metal pattern circuit, and then a FPCB (Film Printed Circuit Board) for connecting a driver board circuit is mounted. It is a photograph.
7) 도 8은 본 발명에 의한 플렉시블 투명 필름 메탈 패턴 회로에 연결된 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지에서 드라이버 IC와 1R1G1B LED 칩이 Soldering 작업에 의해 각각 장착되어 완성된 플렉시블 투명 필름 메탈 패턴 어셈블리(Flexible Transparent Film Metal Pattern Assembly) 및 1R1G1B LED Chip 동작을 테스트(Test) 하는 공정을 나타낸 사진이다.7) FIG. 8 shows a flexible transparent film metal having a driver IC and a 1R1G1B LED chip mounted in a unit package provided at each point of a matrix structure connected to a flexible transparent film metal pattern circuit according to the present invention by soldering. This is a picture showing a process of testing the operation of a flexible transparent film metal pattern assembly and a 1R1G1B LED chip.
8) 도 9는 플렉시블 투명 필름 메탈 패턴 어셈블리(Flexible Transparent Film Metal Pattern Assembly)와 전기적 신호를 공급하고 제어하는 드라이버 보드(Driver Board)를 연결하는 공정을 나타낸 도면이다. 8) FIG. 9 illustrates a process of connecting a flexible transparent film metal pattern assembly to a driver board for supplying and controlling an electrical signal.
9) 도 10은 본 발명에 의한 Bottom Cover 아크릴(Acrylic)판 또는 폴리카보네이트(Polycarbonate)를 도 9에서 조립하고, Window Cover 아크릴(Acrylic)판 또는 폴리카보네이트(Polycarbonate)를 조립하여 제작, 완성된 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display) 공정을 나타낸 사진이다. 9) FIG. 10 is a bottom cover acrylic plate or polycarbonate according to the present invention assembled in FIG. 9, window cover acrylic plate or polycarbonate assembled and fabricated, completed flexible This is a picture showing the process of Flexible Transparent LED Display.
10) 도 11은 본 발명에 의한 플렉시블 투명 필름 메탈 패턴 회로를 적용한 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display) 제작 공정을 나타낸 구성도이다. 10) FIG. 11 is a configuration diagram illustrating a manufacturing process of a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied.
11) 도 12는 본 발명에 의한 플렉시블 투명 필름 메탈 패턴 회로를 적용한 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display)에서는 기판 PCB와 히트싱크를 사용하지 않으며, (+)전극선, 데이터 라인, (-)전극선의 3선이 구비되는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로와 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지들에서는 드라이버 IC와 1R1G1B LED 칩을 장착하는 동작회로 구성도이다. 11 is a flexible transparent LED display using a flexible transparent film metal pattern circuit according to the present invention does not use a substrate PCB and a heat sink, (+) electrode line, data line, (-) electrode line One unit package provided at each point of the matrix structure connected to a flexible transparent film metal pattern circuit having three wires of is a circuit diagram of an operation circuit in which a driver IC and a 1R1G1B LED chip are mounted. .
플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display)용 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로는 히트싱크를 사용하지 않고 1R1G1B LED 칩 동작 시 발생되는 열을 방출하며, 기판 PCB 없이 동작하는 회로를 구성하는 것을 특징으로 한다. Flexible Transparent Film Metal Pattern circuit for flexible transparent LED display emits heat generated when operating 1R1G1B LED chip without using heat sink, and operates without circuit board PCB. It is characterized by the configuration.
플렉시블 투명 필름 메탈 패턴 회로는 1R1G1B LED Chip에서 발생하는 발열을 분산시켜 발열에 의한 1R1G1B LED Chip 수명을 보존하며 및 휘도 저하 문제를 최소화하고 경량화된 Flexible Transparent LED Display 제품을 구현할 수 있다.The flexible transparent film metal pattern circuit can dissipate the heat generated from the 1R1G1B LED chip to preserve the life of the 1R1G1B LED chip due to heat generation, minimize the brightness deterioration problem, and realize a lightweight flexible transparent LED display product.
본 발명에 따른 플렉시블 투명 필름 메탈 패턴 회로는 기판 PCB를 사용하지 않고 필름 메탈 패턴(Film Metal Pattern)에 1R1G1B LED 칩을 Reflow Soldering 작업에 의해 장착하여 동작 회로를 구성하고, 1R1G1B LED 칩 구동 시 발생하는 발열을 휘어지거나 구부러지는 유연성을 갖는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal pattern)으로 분산시키며 별도의 발열 히트싱크를 사용하지 않으며, Metal Pattern 회로를 구성하는 기판 PCB도 사용하지 않는 제조방법을 사용하여 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display)를 구현한다. The flexible transparent film metal pattern circuit according to the present invention configures an operation circuit by mounting a 1R1G1B LED chip on a film metal pattern (Film Metal Pattern) by a reflow soldering operation without using a substrate PCB, and is generated when driving a 1R1G1B LED chip. It uses a manufacturing method that does not use a separate heat generating heat sink and does not use a substrate PCB constituting a metal pattern circuit. It is distributed in a flexible transparent film metal pattern having flexibility of bending or bending heat. By implementing a flexible transparent LED display.
고해상도의 전광판이나 스마트 글라스(Smart glass) 또는 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display)의 해상도를 높이기 위해 정해진 공간 내의 Pixel 수를 늘리는 방법을 사용하는데 1R1B1G LED 칩 수량을 증가시키게 되면, 소비전력과 발열량이 증가하여 발생하는 문제점 즉 1R1G1B LED 칩의 수명 및 휘도 저하에 영향을 주는 열 방출 문제를 개선하고 해결책을 제시한다.In order to increase the resolution of high-resolution electronic display board, smart glass, or flexible transparent LED display, the method of increasing the number of pixels in a predetermined space is used. When the number of 1R1B1G LED chips is increased, power consumption and heat generation amount are increased. This increasing problem is solved and the heat dissipation problem which affects the lifetime and brightness deterioration of 1R1G1B LED chip is improved and presented.
도 8a를 참조하면, 드라이버 IC와 1R1G1B LED 칩을 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로에 Soldering 작업을 완료하여 장착한다. 플렉시블 투명 필름 메탈 패턴 회로는 1R1G1B LED 칩들이 동작 중에 발생하는 발열을 외부로 전달하거나 복사 형태로 발산하는 역할을 하는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재 즉, 알루미늄(Al) 또는 구리(Cu)로 제작된 플렉시블 투명 필름 메탈 패턴 회로이다. Referring to FIG. 8A, the driver IC and the 1R1G1B LED chip are completed to be mounted on a flexible transparent film metal pattern circuit. The flexible transparent film metal pattern circuit is a flexible transparent film metal pattern material, that is, aluminum (Al) or copper, in which 1R1G1B LED chips transmit heat generated during operation to the outside or radiate in a radiation form. It is a flexible transparent film metal pattern circuit produced by (Cu).
도 8b는 (+)전극선, 데이터 라인, (-)전극선의 3선이 구비되는 플렉시블 투명 필름 메탈 패턴과, 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로와 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지들에서는 드라이버 IC와 1R1G1B LED 칩이 장착된 사진이다.FIG. 8B is a flexible transparent film metal pattern including three lines of (+) electrode line, data line, and (-) electrode line, and each point of the matrix structure connected to the flexible transparent film metal pattern circuit. In one unit package, the driver IC and the 1R1G1B LED chip are mounted.
플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재는 열전도도가 극히 우수한, 알루미늄(Aluminum), 산화베릴륨(BeO, Beryllium oxide)이나 산화알루미늄(Al2O3, Aluminum oxide)를 주성분으로 하는 합금을 사용하여 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로를 구현하였다. 플렉시블 투명 필름 메탈 패턴 회로에서 매트릭스 구조의 각 지점 마다 드라이버 IC와 1R1G1B LED 칩을 장착한 후 Soldering하여 조립하는 구조로 제작된다. Flexible Transparent Film Metal Pattern material is an alloy composed mainly of Aluminum, Beryllium Oxide (BeO) or Aluminum Oxide (Al 2 O 3 ) A flexible transparent film metal pattern circuit was implemented using. In the flexible transparent film metal pattern circuit, the driver IC and the 1R1G1B LED chip are mounted at each point of the matrix structure and soldered and assembled.
도 11은 본 발명에 의한 플렉시블 투명 필름 메탈 패턴 회로를 적용한 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display) 제작 공정을 나타낸 구성도이다. 11 is a configuration diagram showing a flexible transparent LED display manufacturing process to which a flexible transparent film metal pattern circuit according to the present invention is applied.
본 발명의 LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이 제조 방법은 The flexible transparent LED display manufacturing method of the LED electro-optical panel of the present invention
(a) 기판 PCB를 사용하지 않으며, 아트워크 후에 전도성을 갖는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재를 사용하며, (+)전극선, 데이터 라인, (-)전극선으로 구성된 유연성을 갖는 플렉시블 투명 필름 메탈 패턴 회로와 메탈 가이드라인에 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지마다 표면실장 기술(SMT, Surface Mounted Technology)에 의해 드라이버 IC와 1R1G1B LED 칩을 장착하는 단계; (a) It does not use a substrate PCB, and uses a flexible transparent film metal pattern material having conductivity after artwork, and has flexibility composed of (+) electrode line, data line, and (-) electrode line. Mounting a driver IC and a 1R1G1B LED chip by surface mount technology (SMT) in each unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit and the metal guide line;
(b) 상기 플렉시블 투명 필름 메탈 패턴 회로와 연결된 각 지점 마다 드라이버 IC와 1R1G1B LED 칩을 각각 장착하는 단계; (b) mounting a driver IC and a 1R1G1B LED chip at each point connected to the flexible transparent film metal pattern circuit;
(c) 완성된 상기 플렉시블 투명 필름 메탈 패턴 어셈블리(Flexible Transparent Film Metal Pattern Assembly)를 그 하판에 아크릴판 또는 PC(폴리카보네이트), 또는 글라스(유리;Glass)를 사용한 베이스 커버(Base Cover)를 밀착시켜 고정하여 붙이는 단계;(c) The completed flexible transparent film metal pattern assembly is adhered to the bottom plate of the base plate using an acrylic plate or PC (polycarbonate) or glass (glass). Fixing and pasting;
(d) 상기 (c)의 베이스 커버를 뒤집어 상기 베이스 커버의 작업 완료된 앞면에 상판 아크릴판 또는 PC(폴리카보네이트), 또는 글라스(유리;Glass)를 사용한 윈도우 커버(Window Cover)를 하판과 일치되게 조립하는 단계 및 (d) Turn the base cover of (c) upside down so that the window cover using the top plate acrylic plate or PC (polycarbonate) or glass (glass) on the finished front side of the base cover is aligned with the bottom plate. Assembling step and
(e) 상기 플렉시블 투명 필름 메탈 패턴 회로를 갖는 플렉시블 투명 LED 디스플레이가 제작되는 단계를 포함하며, (e) manufacturing a flexible transparent LED display having the flexible transparent film metal pattern circuit,
상기 플렉시블 투명 필름 메탈 패턴 회로는 히트싱크를 사용하지 않고 1R1G1B LED 칩 동작 시 발생되는 열을 자체적으로 방출하며, 기판 PCB 없이 동작하는 것을 특징으로 한다. The flexible transparent film metal pattern circuit itself emits heat generated when the 1R1G1B LED chip is operated without using a heat sink, and operates without a substrate PCB.
상기 방법은 상기 플렉시블 투명 필름 메탈 패턴 회로와 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지들에서는 Soldering에 의해 드라이버 IC와 1R1G1B LED 칩이 장착되며, 플렉시블 투명 필름 메탈 패턴 회로와 각각의 1R1G1B LED의 애노드(Anode)와 연결되는 (+)전극선; 상기 드라이버 IC와 연결되는 데이터 라인; 및 각각의 1R1G1B LED의 캐쏘드(Cathode)와 연결되는 (-)전극선을 포함하는 3선이 구비되고, 상기 데이터 라인은 상기 제어 보드(Control Board, MCU)로부터 RGB 조합 색상 신호가 전송되는 단계를 더 포함한다. The method is equipped with a driver IC and a 1R1G1B LED chip by soldering in one unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, and the flexible transparent film metal pattern circuit and each 1R1G1B A positive electrode line connected to an anode of the LED; A data line connected to the driver IC; And three wires including a negative electrode line connected to a cathode of each 1R1G1B LED, wherein the data line is configured to transmit an RGB combined color signal from the control board (MCU). It includes more.
상기 방법은 상기 제어 보드가 RS-232 직렬 인터페이스 또는 유선 케이블로 LED 조명을 제어하기 위한 컴퓨터와 연결되거나, 또는 Wi-Fi 또는 블루투스 통신을 통신부와 연결되어 LED 조명을 제어하기 위한 앱(App)이 설치된 스마트폰과 통신되는 단계를 더 포함한다. The method may include an app for controlling the LED light by connecting the control board to a computer for controlling the LED light through an RS-232 serial interface or a wired cable, or by connecting a Wi-Fi or Bluetooth communication with a communication unit. The method further includes communicating with the installed smartphone.
참조부호 1은 플렉시블 투명 필름 메탈 패턴 아트워크(Flexible Transparent Film Pattern Artwork), 참조부호 2는 플렉시블 투명 필름 메탈 패턴 회로(Flexible Transparent Metal Pattern)배선, 참조부호 3은 1R1G1B LED Chip, 참조부호 4는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Flim Metal Pattern) 회로에 1R1G1B LED Chip 장착, 참조부호 4.1은 플렉시블 투명 필름 메탈 패턴에 장착된 1R1G1B LED Chip, 참조부호 5는 플렉시블 투명 필름 메탈 패턴 어셈블리(Flexible Transparent Film Metal Pattern Assembly), 참조부호 5.1은 회로 연결용 에프피씨비(FPCB;Film Printed Circuit Board), 참조부호 6은 플렉시블 투명 필름 메탈 패턴 어셈블리(Flexible Transparent Film Metal Pattern Assembly) 와 드라이버보드(Driver Board), 참조부호 7은 아크릴(Acrylic)판 또는 폴리카보네이트(Polycarbonate)판, 또는 글라스(유리;Glass)에 조립된 플렉시블 투명 필름 LED 디스플레이, 참조부호 8은 하판 아크릴(Acrylic) 또는 폴리카보네이트(Polycarbonate), 또는 글라스(유리;Glass), 참조부호 9는 상판 Window Cover 아크릴(Acrylic) 또는 폴리카보네이트(Polycarbonate), 글라스(Glass)를 나타낸다. Reference numeral 1 denotes a flexible transparent film pattern artwork, reference numeral 2 denotes a flexible transparent metal pattern wiring, reference numeral 3 denotes a 1R1G1B LED chip, reference numeral 4 denotes a flexible 1R1G1B LED Chip mounted on a Flexible Transparent Flim Metal Pattern circuit, reference numeral 4.1 denotes a 1R1G1B LED Chip mounted on a flexible transparent film metal pattern, and 5 denotes a Flexible Transparent Film Metal Pattern assembly. Assembly, reference 5.1 for FPCB (Film Printed Circuit Board), reference 6 for flexible transparent film metal pattern assembly and driver board, reference 7 Flexible assembled from silver acrylic or polycarbonate plates or glass Transparent film LED display, 8 is acrylic or polycarbonate, or glass (glass), 9 is window cover acrylic or polycarbonate, glass ).
도 12은 본 발명에 의한 플렉시블 투명 필름 메탈 패턴 회로를 적용한 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display)는 기판 PCB와 히트싱크를 사용하지 않으며, (+)전극, 데이터 라인, (-)전극 3선이 구비되는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로와 연결되는 각 지점 마다 구비되는 하나의 단위 패키지들에서는 드라이버 IC와 1R1G1B LED 칩을 장착하는 동작회로 구성도이다. 12 is a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied, does not use a substrate PCB and a heat sink, and has three (+) electrodes, data lines, and (-) electrodes. One unit package provided at each point connected to the flexible transparent film metal pattern circuit is an operation circuit configuration for mounting a driver IC and a 1R1G1B LED chip.
플렉시블 투명 필름 메탈 패턴 회로와 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지들에서는 드라이버 IC(13)와 1R1G1B LED 칩(14)이 장착되며, 플렉시블 투명 메탈 패턴 회로와 외곽의 메탈 가이드라인은 각각의 R,G,B LED의 Anode와 연결되는 (+)전극선(10); 드라이버 IC와 연결되는 데이터 라인(11); 및 각각의 R,G,B LED의 Cathode와 연결되는 (-)전극선(12)을 포함하는 3선이 구비된다. 데이터 라인은 제어 보드(Control Board, MCU)로부터 RGB 조합 색상 신호가 전송된다. 1R1G1B LED칩은 하나의 빨강 LED, 하나의 그린 LED, 하나의 파랑 LED를 포함한다. In one unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, the driver IC 13 and the 1R1G1B LED chip 14 are mounted, and the flexible transparent metal pattern circuit and the outer metal guidelines (+) Electrode line 10 is connected to the anode of each of the R, G, B LED; A data line 11 connected to the driver IC; And three (-) electrode lines 12 connected to the Cathode of each of the R, G, and B LEDs. The data line receives RGB combination color signals from a control board (MCU). The 1R1G1B LED chip contains one red LED, one green LED, and one blue LED.
플렉시블 투명 필름 메탈 패턴 회로는 회로 구성에 따라 직병렬 회로를 구성할 수 있다. A flexible transparent film metal pattern circuit can comprise a serial / parallel circuit according to a circuit structure.
본 발명의 LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이는 Flexible transparent LED display of the LED electro-optical panel of the present invention
전도성을 갖는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재를 사용하며, (+)전극선(10), 데이터 라인(11), (-)전극선(12)으로 구성되고, 휘어지거나 구부러지는 유연성을 갖는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로; 상기 플렉시블 투명 필름 메탈 패턴 회로와 연결되는 매트릭스 구조의 각 지점에 구비되는 하나의 단위 패키지마다 Soldering에 의해 장착된 1R1G1B LED 칩(14)과, 상기 데이터 라인에 RGB 조합 색상 신호를 전송받아 상기 1R1G1B LED 칩을 구동하는 드라이버 IC(13); 및 LED 디스플레이를 구동하기 위해, 상기 플렉시블 투명 필름 메탈 패턴 회로의 상기 (+)전극선(10)에 전원을 공급하며, 상기 (-)전극선(12)을 접지하며, 상기 데이터 라인(11)에 상기 RGB 조합 색상 신호를 전송하여 색상이 표시되도록 하는 제어 보드(control board, MCU)를 포함하며, Flexible conductive film using conductive conductive material, consisting of (+) electrode line 10, data line 11, (-) electrode line 12, flexible to bend or bend Flexible transparent film metal pattern circuit having a; The 1R1G1B LED chip 14 mounted by soldering for each unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, and the 1R1G1B LED by receiving an RGB combined color signal through the data line. A driver IC 13 for driving a chip; And supply power to the (+) electrode line 10 of the flexible transparent film metal pattern circuit, ground the (−) electrode line 12, and drive the data line 11 to drive the LED display. It includes a control board (control board, MCU) to transmit the RGB combination color signal to display the color,
상기 플렉시블 투명 필름 메탈 패턴 회로는 히트싱크(Heatsink)를 사용하지 않고 1R1G1B LED 칩 동작 시 발생되는 열을 방출하며, 기판 PCB 없이 동작하는 회로 인 것을 특징으로 한다. The flexible transparent film metal pattern circuit emits heat generated when the 1R1G1B LED chip is operated without using a heat sink and is a circuit that operates without a PCB.
상기 제어 보드는 LED의 광고 이미지를 다이나믹하게 출력되도록 하는 각 포트별 LED 출력 제어, 빛의 밝기 제어, 색온도 제어, 및 펄스폭 변조(PWM)를 사용하여 전류의 듀티 사이클을 조정하여 최대 광출력의 크기를 조절하는 디밍(dimming) 제어를 제공한다. The control board adjusts the duty cycle of the current using LED output control, light brightness control, color temperature control, and pulse width modulation (PWM) for each port to dynamically output the advertising image of the LED. Provides dimming control to scale.
상기 제어 보드는 RS-232 직렬 인터페이스 또는 유선 케이블로 LED 조명을 제어하기 위한 컴퓨터와 연결되거나, 또는 Wi-Fi 또는 블루투스 통신을 통신부와 연결되어 LED 조명을 제어하기 위한 앱(App)이 설치된 스마트폰과 통신될 수 있다. The control board is connected to a computer for controlling the LED light with an RS-232 serial interface or a wired cable, or a smartphone with an app for controlling the LED light with Wi-Fi or Bluetooth communication connected to a communication unit. Can be communicated with.
컴퓨터나 스마트폰은 LED 조명 제어 신호를 상기 제어 보드로 전송하여 LED의 광고 이미지를 다이나믹하게 출력되도록 동작시킬 수 있다. The computer or smartphone may be operated to transmit the LED lighting control signal to the control board to dynamically output the advertising image of the LED.
상기 플렉시블 투명 필름 메탈 패턴 회로는 상기 1R1G1B LED 칩이 동작 중에 발생하는 발열을 외부로 전달하거나 복사 형태로 발산하는 역할을 하는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재 인 알루미늄(Al) 또는 구리(Cu)로 제작된다. The flexible transparent film metal pattern circuit may include aluminum (Al), which is a flexible transparent film metal pattern material, which serves to transmit heat generated during operation of the 1R1G1B LED chip to the outside or radiate it in a radiant form. Made of copper (Cu).
상기 전도성을 갖는 필름 메탈 패턴 소재는 열전도도가 극히 우수한, 알루미늄(Aluminum), 산화베릴륨(BeO, Beryllium oxide)이나 산화알루미늄(Al2O3, Aluminum oxide)의 합금을 사용하여 상기 플렉시블 투명 필름 메탈 패턴 회로를 구현한다. The conductive film metal pattern material is made of an alloy of aluminum, beryllium oxide (BeO) or aluminum oxide (Al 2 O 3 , Aluminum oxide), which has extremely excellent thermal conductivity. Implement a pattern circuit.
도 13는 본 발명에 의한 플렉시블 투명 필름 메탈 패턴 회로를 적용한 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display)의 제어 보드(control board, MCU)와 연결되어 동작되는 실제 구동 사진이다. FIG. 13 is an actual driving picture connected to a control board (MCU) of a flexible transparent LED display to which a flexible transparent film metal pattern circuit according to the present invention is applied.
기존 PCB 기판을 사용하고 은 페이스트(Ag Paste) 방식의 전도성 잉크를 사용한 기존 메탈 패턴 회로는 선저항(
Figure PCTKR2018001805-appb-I000002
)이 크며, 이와 달리 Existing metal pattern circuits using conventional PCB substrates and using silver paste conductive ink have a line resistance (
Figure PCTKR2018001805-appb-I000002
), Which is different
본 발명의 유연성을 갖는 플렉시블 투명 필름 메탈 패턴 회로를 적용한 플렉시블 투명 LED 디스플레이는 상대적으로 선의 굵기와 거리에 의한 선저항이 작으며, 휘어지거나 구부러지는 유연성을 갖는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재를 사용하며 소형 경량화로 구조가 간단하며, 언제 어디든지 탈부착이 가능하다.The flexible transparent LED display to which the flexible transparent film metal pattern circuit having the flexibility of the present invention is applied has a relatively small line resistance due to the thickness and distance of the line, and has the flexibility to bend or bend the flexible transparent film metal pattern. Pattern) material and small and light weight make the structure simple and detachable at anytime and anywhere.
유연성을 갖는 플렉시블 투명 필름 메탈 패턴 회로를 사용한 플렉시블 투명 LED 디스플레이는 광고판의 정보 전달 용도로 사용되는 미디어 파사드(Media facade), 전광판, 스마트 유리 판넬(Smart glass panel) 등에 사용된다. Flexible transparent LED display using a flexible flexible film metal pattern circuit is used in media facades, electronic displays, smart glass panels and the like used for information transmission of advertising billboards.
이상에서 설명한 바와 같이, 본 발명의 바람직한 실시 예를 참조하여 설명하였지만, 해당 기술 분야에서 통상의 지식을 가진자가 하기의 특허 청구범위에 기재된 본 발명의 기술적 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 또는 변형하여 실시할 수 있음을 이해할 수 있을 것이다.As described above, the present invention has been described with reference to a preferred embodiment of the present invention, but the present invention is within the scope not departing from the spirit and scope of the present invention as set forth in the appended claims by those skilled in the art. It will be understood that various modifications or variations may be made.
본 발명에 따른 LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이 및 그 제조 방법은 첫째, (+)전극선, 데이터 라인, (-)전극선의 3선이 구비되는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 회로와 연결되는 각 지점 마다 구비되는 하나의 단위 패키지에서 드라이버 IC와 1R1G1B LED 칩이 구성되며, 동일 체적 내에서 3개의 LED Chip이 차지하는 소자의 체적이 1개로 줄어들 수 있기에 LED 패키지의 크기를 최소화할 수 있다. 역으로, 이는 동일한 디스플레이 판넬 상에 장착할 수 있는 LED 패키지의 숫자를 증대시키는 것이 가능하며, 실제로 동일한 공간 내에서 기존의 전광판 대비 더 많은 픽셀(Pixel)의 구현이 가능하므로 고품질, 고해상도의 대면적 LED 판넬 제작이 충분히 가능하다. The flexible transparent LED display of the LED electro-optical panel and a method of manufacturing the same according to the present invention are firstly provided with a flexible transparent film metal pattern having three lines of a (+) electrode line, a data line, and a (-) electrode line. The driver IC and the 1R1G1B LED chip are configured in one unit package provided at each point connected to the circuit, and the size of the LED package can be minimized because the volume of devices occupied by three LED chips can be reduced to one within the same volume. Can be. On the contrary, it is possible to increase the number of LED packages that can be mounted on the same display panel, and in fact, it is possible to realize more pixels in the same space compared to the existing billboards, so that high quality and high resolution are large. LED panel production is possible enough.
둘째, 1R1G1B LED 칩 조립에 소요되는 원부자재의 절감 효과가 상당히 크다고 할 수 있다. 1R1G1B LED 칩들은 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern Assembly) 회로에 매트릭스 구조의 각 지점마다 장착되는 제조공정에 의해 제작되므로, 기판 PCB, ITO Pattern, 은 페이스트(Ag paste) 절감으로 LED 칩 제조 단가 및 제조 공정 단순화로 생산성을 향상시키고, 생산비용 절감 효과가 크다.Second, raw materials can be significantly reduced in assembling 1R1G1B LED chips. 1R1G1B LED chips are manufactured by a manufacturing process mounted at each point of a matrix structure in a flexible transparent film metal pattern assembly circuit, thus saving LED PCBs by reducing PCB PCB, ITO pattern, and silver paste. Productivity is improved and production cost is greatly reduced due to manufacturing cost and simplified manufacturing process.
기존 PCB 기판을 사용하고, 은 페이스트(Ag Paste) 방식의 전도성 잉크를 사용한 기존 메탈 패턴 회로는 선저항(
Figure PCTKR2018001805-appb-I000003
)이 크며, 이와 달리 본 발명의 플렉시블 투명 필름 메탈 패턴 회로를 적용한 플렉시블 투명 LED 디스플레이는 상대적으로 선의 굵기와 거리에 의한 선 저항이 작으며, 휘어지거나 구부러지는 유연성을 갖는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재를 사용하며 소형 경량화로 구조가 간단하며, 언제 어디든지 탈부착이 가능하다.Existing metal pattern circuits using conventional PCB substrates and using silver paste conductive ink have a line resistance (
Figure PCTKR2018001805-appb-I000003
In contrast, the flexible transparent LED display to which the flexible transparent film metal pattern circuit of the present invention is applied has a relatively small line resistance due to the thickness and distance of the line, and has a flexible transparent film metal pattern having flexibility of bending or bending. Transparent Film Metal Pattern) material is used, and its structure is simple due to its small size and light weight, and it can be attached and detached anytime and anywhere.
셋째, 기판 PCB를 사용하지 않는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern)회로를 적용하여 제조공정 단순화 및 자재 수량이 감소하기에 플렉시블 투명 LED 디스플레이(Flexible Transparent LED Display) 제조공정에 수반되는 공정의 횟수가 줄어들며, 이로 인한 생산 공정 내의 불량율이 낮아지고, 제품에 대한 신뢰성이 높아지므로 실제 고객의 요구 환경에서 동작할 때에도 제품의 불량 발생에 의해 발생하는 유지 보수와 그 관련 비용이 크게 낮아지게 된다. Third, the process involved in the process of manufacturing a flexible transparent LED display due to the application of a flexible transparent film metal pattern circuit, which does not use a substrate PCB, to simplify the manufacturing process and reduce the number of materials. The number of times is reduced, and as a result, the defective rate in the production process is lowered and the reliability of the product is increased, thereby significantly reducing maintenance and related costs caused by the occurrence of product defects even when operating in a real customer's required environment. .
네번째, 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Patterny)회로를 적용하여 회로 Pattern 수 감소에 의해 소자 구동 시에 발생하는 메탈 패턴 간의 잡음(Noise)을 개선시킬 수 있으며, 제어 보드(control board) 내에 구성되는 신호처리부가 소형화되며, 사용자의 편의를 도모한다. Fourth, by applying the Flexible Transparent Film Metal Patterny circuit, the noise between the metal patterns generated when driving the device can be improved by reducing the number of circuit patterns, and within the control board The signal processing unit to be configured can be miniaturized and the user's convenience can be achieved.
다섯번째, 플레시블 투명 LED 디스플레이(Flexible Transparent LED Display) 제품은 가볍고 얇게 제작될 수 있으며, 기존의 실내 인테리어, 디자인을 해치지 않고 설치하여 투명성, 시인성을 향상하여 이로 인해 유발되는 제품의 높은 선정성은 기존의 유사 제품에 비교하여 가격 대비 성능과 품질 경쟁력이 매우 높아져 고객 만족감이 증대한다. Fifth, Flexible Transparent LED Display products can be made light and thin, and installed without harming the existing interior or design, improving transparency and visibility, resulting in high selectivity of existing products. Compared to similar products, the product has a very high price performance and quality competitiveness, increasing customer satisfaction.
유연성을 갖는 플렉시블 투명 필름 메탈 패턴 회로를 사용한 플렉시블 투명 LED 디스플레이는 광고판의 정보 전달 용도로 사용되는 미디어 파사드(Media facade), 전광판, 스마트 유리 판넬(Smart glass panel) 등에 사용된다. Flexible transparent LED display using a flexible flexible film metal pattern circuit is used in media facades, electronic displays, smart glass panels and the like used for information transmission of advertising billboards.

Claims (10)

  1. 전도성을 갖는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재를 사용하며, (+)전극선, 데이터 라인, (-)전극선으로 구성되고, 휘어지거나 구부러지는 유연성을 갖는 플렉시블 투명 필름 메탈 패턴 회로; A flexible transparent film metal pattern circuit using a conductive conductive material, comprising a (+) electrode line, a data line, and a (-) electrode line, and having a flexibility of bending or bending;
    상기 플렉시블 투명 필름 메탈 패턴 회로와 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지마다 Soldering에 의해 장착된 1R1G1B LED 칩과, 상기 데이터 라인에 RGB 조합 색상 신호를 전송받아 상기 1R1G1B LED 칩을 구동하는 드라이버 IC; 및 Each 1R1G1B LED chip mounted by soldering is provided for each unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, and the RGB combinational color signal is transmitted to the data line to drive the 1R1G1B LED chip. Driver IC; And
    LED 디스플레이를 구동하기 위해, 상기 플렉시블 투명 필름 메탈 패턴 회로의 상기 (+)전극선에 전원을 공급하며, 상기 (-)전극선을 접지하며, 상기 데이터 라인에 상기 RGB 조합 색상 신호를 전송하여 색상이 표시되도록 하는 제어 보드를 포함하고, In order to drive an LED display, power is supplied to the (+) electrode line of the flexible transparent film metal pattern circuit, the (-) electrode line is grounded, and the RGB combination color signal is transmitted to the data line to display color. Includes a control board to enable,
    상기 전도성을 갖는 플렉시블 투명 필름 메탈 패턴 소재는 열전도도가 우수한, 알루미늄(Aluminum), 산화베릴륨(BeO, Beryllium oxide)이나 산화알루미늄(Al2O3, Aluminum oxide)의 합금을 사용하여 상기 플렉시블 투명 필름 메탈 패턴 회로를 구현하며,The conductive flexible transparent film metal pattern material has an excellent thermal conductivity of the flexible transparent film using an alloy of aluminum, beryllium oxide (BeO), or aluminum oxide (Al 2 O 3 , Aluminum oxide). Implement a metal pattern circuit,
    상기 플렉시블 투명 필름 메탈 패턴 회로는 히트싱크를 사용하지 않고 1R1G1B LED 칩 동작 시 발생되는 열을 자체적으로 방출하며, 기판 PCB 없이 동작하는, LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이.The flexible transparent film metal pattern circuit itself emits heat generated when operating a 1R1G1B LED chip without using a heat sink, and operates without a substrate PCB, the flexible transparent LED display of the LED electro-optical panel.
  2. 제1항에 있어서, The method of claim 1,
    상기 플렉시블 투명 필름 메탈 패턴 회로는 The flexible transparent film metal pattern circuit
    상기 1R1G1B LED 칩이 동작 중에 발생하는 발열을 외부로 전달하거나 복사 형태로 발산하는 역할을 하는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재 인 알루미늄(Al) 또는 구리(Cu)로 제작되는, LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이.The 1R1G1B LED chip is made of aluminum (Al) or copper (Cu), which is a flexible transparent film metal pattern (Flexible Transparent Film Metal Pattern) material that serves to transfer heat generated during operation to the outside or radiate in a radiation form, Flexible transparent LED display in LED electro-optical panel.
  3. 제1항에 있어서, The method of claim 1,
    상기 플렉시블 투명 필름 메탈 패턴 회로와 연결되는 매트릭스 구조의 각 지점에 구비되는 하나의 단위 패키지들에서는 Soldering에 의해 드라이버 IC와 1R1G1B LED 칩이 장착되며, 플렉시블 투명 필름 메탈 패턴 회로와 외곽의 메탈 가이드라인은 각각의 1R1G1B LED의 애노드(Anode)와 연결되는 (+)전극선; In one unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, the driver IC and the 1R1G1B LED chip are mounted by soldering, and the flexible transparent film metal pattern circuit and the outer metal guideline are A positive electrode line connected to an anode of each 1R1G1B LED;
    상기 드라이버 IC와 연결되는 데이터 라인; 및 A data line connected to the driver IC; And
    각각의 1R1G1B LED의 캐쏘드(Cathode)와 연결되는 (-)전극선을 포함하는 3선이 구비되고, Three wires including a negative electrode line connected to a cathode of each 1R1G1B LED are provided.
    상기 데이터 라인은 상기 제어 보드(Control Board, MCU)로부터 RGB 조합 색상 신호가 전송되는, LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이.The data line is a flexible transparent LED display of the LED electro-optical panel, the RGB combinational color signal is transmitted from the Control Board (MCU).
  4. 제1항에 있어서, The method of claim 1,
    상기 1R1G1B LED칩은 하나의 빨강 LED, 하나의 그린 LED, 하나의 파랑 LED를 포함하는 LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이.The 1R1G1B LED chip is a flexible transparent LED display of an LED electro-optical panel comprising one red LED, one green LED, and one blue LED.
  5. 제1항에 있어서, The method of claim 1,
    상기 제어 보드는 LED의 광고 이미지를 다이나믹하게 출력되도록 하는 각 포트별 LED 출력 제어, 빛의 밝기 제어, 색온도 제어, 및 펄스폭 변조(PWM)를 사용하여 전류의 듀티 사이클을 조정하여 최대 광출력의 크기를 조절하는 디밍(dimming) 제어를 제공하는, LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이.The control board adjusts the duty cycle of the current using LED output control, light brightness control, color temperature control, and pulse width modulation (PWM) for each port to dynamically output the advertising image of the LED. Flexible transparent LED display in LED electro-optical panel that provides dimming control to scale.
  6. 제1항에 있어서, The method of claim 1,
    상기 제어 보드는 RS-232 직렬 인터페이스 또는 유선 케이블로 LED 조명을 제어하기 위한 컴퓨터와 연결되거나, 또는 Wi-Fi 또는 블루투스 통신을 통신부와 연결되어 LED 조명을 제어하기 위한 앱(App)이 설치된 스마트폰과 통신되는, LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이.The control board is connected to a computer for controlling the LED light with an RS-232 serial interface or a wired cable, or a smartphone with an app for controlling the LED light with Wi-Fi or Bluetooth communication connected to a communication unit. In communication with, flexible transparent LED display of LED electro-optical panel.
  7. (a) 기판 PCB를 사용하지 않으며, 아트워크 후에 전도성을 갖는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재를 사용하며, (+)전극선, 데이터 라인, (-)전극선으로 구성된 유연성을 갖는 플렉시블 투명 필름 메탈 패턴 회로와 메탈 가이드라인에 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지마다 표면실장 기술(SMT)에 의해 드라이버 IC와 1R1G1B LED 칩을 장착하는 단계; (a) It does not use a substrate PCB, and uses a flexible transparent film metal pattern material having conductivity after artwork, and has flexibility composed of (+) electrode line, data line, and (-) electrode line. Mounting a driver IC and a 1R1G1B LED chip by surface mount technology (SMT) for each unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit and the metal guide line;
    (b) 상기 플렉시블 투명 필름 메탈 패턴 회로와 연결된 각 지점 마다 드라이버 IC와 1R1G1B LED 칩을 각각 장착하는 단계; (b) mounting a driver IC and a 1R1G1B LED chip at each point connected to the flexible transparent film metal pattern circuit;
    (c) 완성된 상기 플렉시블 투명 필름 메탈 패턴 어셈블리(Flexible Transparent Film Metal Pattern Assembly)를 그 하판에 아크릴판 또는 PC(폴리카보네이트), 또는 글라스(유리;Glass)를 사용한 베이스 커버(Base Cover)를 밀착시켜 고정하여 붙이는 단계;(c) The completed flexible transparent film metal pattern assembly is adhered to the bottom plate of the base plate using an acrylic plate or PC (polycarbonate) or glass (glass). Fixing and pasting;
    (d) 상기 (c)의 베이스 커버를 뒤집어 상기 베이스 커버의 작업 완료된 앞면에 상판 아크릴판 또는 PC(폴리카보네이트), 또는 글라스(유리;Glass)를 사용한 윈도우 커버(Window Cover)를 하판과 일치되게 조립하는 단계; 및 (d) Turn the base cover of (c) upside down so that the window cover using the top plate acrylic plate or PC (polycarbonate) or glass (glass) on the finished front side of the base cover is aligned with the bottom plate. Assembling; And
    (e) 상기 플렉시블 투명 필름 메탈 패턴 회로를 갖는 플렉시블 투명 LED 디스플레이가 제작되는 단계를 포함하고, (e) manufacturing a flexible transparent LED display having the flexible transparent film metal pattern circuit,
    상기 전도성을 갖는 플렉시블 투명 필름 메탈 패턴 소재는 열전도도가 우수한, 알루미늄(Aluminum), 산화베릴륨(BeO, Beryllium oxide)이나 산화알루미늄(Al2O3, Aluminum oxide)의 합금을 사용하여 상기 플렉시블 투명 필름 메탈 패턴 회로를 구현하며,The conductive flexible transparent film metal pattern material has an excellent thermal conductivity of the flexible transparent film using an alloy of aluminum, beryllium oxide (BeO), or aluminum oxide (Al 2 O 3 , Aluminum oxide). Implement a metal pattern circuit,
    상기 플렉시블 투명 필름 메탈 패턴 회로는 히트싱크를 사용하지 않고 1R1G1B LED 칩 동작 시 발생되는 열을 자체적으로 방출하며, 기판 PCB 없이 동작하는, LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이 제조 방법.The flexible transparent film metal pattern circuit itself dissipates heat generated during operation of a 1R1G1B LED chip without using a heat sink, and operates without a substrate PCB.
  8. 제7항에 있어서, The method of claim 7, wherein
    상기 플렉시블 투명 필름 메탈 패턴 회로는 The flexible transparent film metal pattern circuit
    상기 1R1G1B LED 칩이 동작 중에 발생하는 발열을 외부로 전달하거나 복사 형태로 발산하는 역할을 하는 플렉시블 투명 필름 메탈 패턴(Flexible Transparent Film Metal Pattern) 소재 인 알루미늄(Al) 또는 구리(Cu)로 제작되는, LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이 제조 방법.The 1R1G1B LED chip is made of aluminum (Al) or copper (Cu), which is a flexible transparent film metal pattern (Flexible Transparent Film Metal Pattern) material that serves to transfer heat generated during operation to the outside or radiate in a radiation form, Method for manufacturing flexible transparent LED display of LED electro-optical panel.
  9. 제7항에 있어서, The method of claim 7, wherein
    상기 플렉시블 투명 필름 메탈 패턴 회로와 연결되는 매트릭스 구조의 각 지점 마다 구비되는 하나의 단위 패키지들에서는 Soldering에 의해 드라이버 IC와 1R1G1B LED 칩이 장착되며, 상기 플렉시블 투명 필름 메탈 패턴 회로와 외곽의 메탈 가이드라인은 각각의 1R1G1B LED의 애노드(Anode)와 연결되는 (+)전극선; 상기 드라이버 IC와 연결되는 데이터 라인; 및 각각의 1R1G1B LED의 캐쏘드(Cathode)와 연결되는 (-)전극선을 포함하는 3선이 구비되고, 상기 데이터 라인은 제어 보드(Control Board, MCU)로부터 RGB 조합 색상 신호가 전송되는 단계를 더 포함하는, LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이 제조 방법.In one unit package provided at each point of the matrix structure connected to the flexible transparent film metal pattern circuit, a driver IC and a 1R1G1B LED chip are mounted by soldering, and the flexible transparent film metal pattern circuit and the metal guide line of the outer part (+) Electrode line is connected to the anode (Anode) of each 1R1G1B LED; A data line connected to the driver IC; And three wires including a negative electrode line connected to a cathode of each 1R1G1B LED, wherein the data line further includes transmitting an RGB combination color signal from a control board (MCU). A method of manufacturing a flexible transparent LED display of an LED electro-optical panel, comprising.
  10. 제9항에 있어서, The method of claim 9,
    상기 제어 보드는 RS-232 직렬 인터페이스 또는 유선 케이블로 LED 조명을 제어하기 위한 컴퓨터와 연결되거나, 또는 Wi-Fi 또는 블루투스 통신을 통신부와 연결되어 LED 조명을 제어하기 위한 앱(App)이 설치된 스마트폰과 통신되는 단계를 더 포함하는, LED 전기 광학 판넬의 플렉시블 투명 LED 디스플레이 제조 방법.The control board is connected to a computer for controlling the LED light with an RS-232 serial interface or a wired cable, or a smartphone with an app for controlling the LED light with Wi-Fi or Bluetooth communication connected to a communication unit. A method of manufacturing a flexible transparent LED display of an LED electro-optical panel, the method further comprising communicating with.
PCT/KR2018/001805 2017-02-13 2018-02-12 Flexible transparent led display of led electro-optical panel and method for manufacturing same WO2018147694A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2017-0019635 2017-02-13
KR1020170019635A KR101789139B1 (en) 2017-02-13 2017-02-13 Flexible Transparent LED Display of LED electro-optic panel and manufacturing method therefor

Publications (1)

Publication Number Publication Date
WO2018147694A1 true WO2018147694A1 (en) 2018-08-16

Family

ID=60298707

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2018/001805 WO2018147694A1 (en) 2017-02-13 2018-02-12 Flexible transparent led display of led electro-optical panel and method for manufacturing same

Country Status (2)

Country Link
KR (1) KR101789139B1 (en)
WO (1) WO2018147694A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112863353A (en) * 2021-01-21 2021-05-28 深圳市伽弥科技有限公司 Manufacturing method of flexible transparent screen
CN113411990A (en) * 2021-06-16 2021-09-17 珠海中京电子电路有限公司 Manufacturing method of LED transparent screen mainboard

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101942393B1 (en) 2018-01-08 2019-01-29 주식회사 엔앤비 Transparent LED Display and Therefor METHOD
KR102193201B1 (en) * 2018-04-25 2020-12-21 문대식 Display device
KR102364569B1 (en) 2018-08-24 2022-02-17 주식회사 엘지화학 Electrode substrate for transparent light emitting device display and transparent light emitting device display comprising the same
KR102173410B1 (en) 2019-04-29 2020-11-03 위인호 Transparent LED display to display the video content on the transparent LED screen and output digital information
KR102421764B1 (en) * 2021-12-07 2022-07-19 주식회사 일상의진화 Smart trampoline system
KR20230172935A (en) 2022-06-16 2023-12-26 이강 flexible light emitting sheet

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150002451U (en) * 2013-12-16 2015-06-24 전성우 flexible bar type led lighting
KR101557655B1 (en) * 2015-04-16 2015-10-06 김명상 advertisement lighting control system with WiFi
KR20160015110A (en) * 2014-07-30 2016-02-12 류승봉 Transparency Flexible Electrode with Complex Structure
KR20160134963A (en) * 2015-05-14 2016-11-24 송인실 Flexible illumination panel
KR200481943Y1 (en) * 2015-09-16 2016-11-29 주식회사 유래텍 Transparent electronic displaying apparatus of image

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150002451U (en) * 2013-12-16 2015-06-24 전성우 flexible bar type led lighting
KR20160015110A (en) * 2014-07-30 2016-02-12 류승봉 Transparency Flexible Electrode with Complex Structure
KR101557655B1 (en) * 2015-04-16 2015-10-06 김명상 advertisement lighting control system with WiFi
KR20160134963A (en) * 2015-05-14 2016-11-24 송인실 Flexible illumination panel
KR200481943Y1 (en) * 2015-09-16 2016-11-29 주식회사 유래텍 Transparent electronic displaying apparatus of image

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112863353A (en) * 2021-01-21 2021-05-28 深圳市伽弥科技有限公司 Manufacturing method of flexible transparent screen
CN113411990A (en) * 2021-06-16 2021-09-17 珠海中京电子电路有限公司 Manufacturing method of LED transparent screen mainboard

Also Published As

Publication number Publication date
KR101789139B1 (en) 2017-10-23

Similar Documents

Publication Publication Date Title
WO2018147694A1 (en) Flexible transparent led display of led electro-optical panel and method for manufacturing same
KR101156271B1 (en) Lighting equipment and display device using the same
KR101189135B1 (en) Liquid Crystal Display device module
WO2011059178A2 (en) Backlight unit and liquid crystal display including the same
WO2014014170A1 (en) Transparent electronic display board and method for manufacturing same
KR101789142B1 (en) LED billboard of flexible transparent film metal structure to be controlled by smart phone
WO2014014169A1 (en) Transparent electronic display board and method for manufacturing same
CN109658828A (en) Transparent flexible display screen and its transparent circuitry
KR102173410B1 (en) Transparent LED display to display the video content on the transparent LED screen and output digital information
EP2154422B1 (en) Illumination device and display device using the same
CN100469211C (en) Inverter drive and liquid crystal display containing the same
US20200211446A1 (en) Display Panels with Embedded Control System
WO2018084446A1 (en) Transparent light-emitting diode film
EP4107841A1 (en) Display panel module and electronic device including multiple display panel modules
CN110710331A (en) LED apparatus with integrated power supply and method employing the same
CN113724617B (en) Display module, spliced display module, splicing method of spliced display module and display device
WO2020085566A1 (en) Flexible led film module
CN100501808C (en) Double side light emitting diode display
CN104819390A (en) Light source for irradiation and irradiation device
KR20210043997A (en) Display device
WO2014163321A1 (en) Led illumination unit for electronic display board
WO2023282368A1 (en) Light source module and led film comprising same
WO2023101142A1 (en) Display module and display apparatus including same
CN112034665B (en) Flash lamp assembly and electronic equipment
WO2024128368A1 (en) Display device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18751182

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18751182

Country of ref document: EP

Kind code of ref document: A1