WO2018135865A1 - Oled panel lower part protection film, and organic light-emitting display apparatus comprising same - Google Patents

Oled panel lower part protection film, and organic light-emitting display apparatus comprising same Download PDF

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Publication number
WO2018135865A1
WO2018135865A1 PCT/KR2018/000822 KR2018000822W WO2018135865A1 WO 2018135865 A1 WO2018135865 A1 WO 2018135865A1 KR 2018000822 W KR2018000822 W KR 2018000822W WO 2018135865 A1 WO2018135865 A1 WO 2018135865A1
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WO
WIPO (PCT)
Prior art keywords
film
oled panel
protective film
adhesive layer
lower protective
Prior art date
Application number
PCT/KR2018/000822
Other languages
French (fr)
Korean (ko)
Inventor
최영서
김상신
김진혁
박영돈
백영빈
이상우
Original Assignee
삼성디스플레이주식회사
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Application filed by 삼성디스플레이주식회사 filed Critical 삼성디스플레이주식회사
Priority to EP18741293.7A priority Critical patent/EP3573123B1/en
Priority to US16/478,838 priority patent/US11108018B2/en
Priority to CN201880007584.1A priority patent/CN110392942B/en
Publication of WO2018135865A1 publication Critical patent/WO2018135865A1/en
Priority to US17/408,351 priority patent/US11963383B2/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
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    • B32B7/04—Interconnection of layers
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/649—Aromatic compounds comprising a hetero atom
    • H10K85/654—Aromatic compounds comprising a hetero atom comprising only nitrogen as heteroatom
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
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    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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Definitions

  • the present invention relates to an OLED panel lower protective film, and more particularly, the recognition rate of the alignment process is remarkably improved, and anti-static treatment can prevent the occurrence of static electricity and at the same time excellent OLED adhesion with the OLED panel A panel lower protective film and an organic light emitting display device including the same.
  • Such a flat panel display device is a liquid crystal display device (Liquid Crystal Display). Plasma Display Panels and Organic Light Emitting Diodes are typical.
  • the organic light emitting device has advantages such as fast response speed, light and small size, low power consumption, self-light emitting device, and flexibility, and thus the demand for the next generation display device, flexible display, and lighting is increasing.
  • the organic light emitting device is formed by depositing in order of a transparent electrode, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, a metal electrode on a glass substrate, the electrons and holes supplied from both electrodes are recombined in the organic light emitting layer It emits light by using emitted energy.
  • the organic light emitting device may be degraded by external factors such as external moisture, oxygen, or ultraviolet light
  • a packaging technology for sealing the organic light emitting device is important, and in order to be applied to various applications, the organic light emitting diode display is manufactured to be thin. To be required.
  • the lower portion of the OLED panel includes a lower protective film for protecting the OLED panel and preventing static electricity
  • the conventional OLED panel lower protective film has a low reflectance so that errors occur frequently during the alignment process. It was not easy, did not prevent the generation of static electricity, there was a problem that the adhesion with the OLED panel is not good.
  • the recognition rate of the alignment process is remarkably improved, and it is urgent to study the protective film of the OLED panel under which the antistatic treatment can prevent the generation of static electricity and the adhesiveness with the OLED panel is excellent.
  • the technical problem of the present invention is that the recognition rate of the alignment process is significantly improved due to the high reflectance, to prevent the occurrence of static electricity through the antistatic treatment, and at the same time to provide an OLED panel lower protective film having excellent adhesion with the OLED panel. will be.
  • the present invention is a base film comprising a first adhesive layer formed on the upper surface of the first substrate and the second adhesive layer and a lower surface of the second adhesive layer adhered to the lower surface of the first substrate
  • a base-carrier film comprising a carrier film comprising a second substrate adhered thereto; And a liner film adhered by the first adhesive layer, and provides an OLED panel lower protective film satisfying both the following conditions (1) and (2).
  • Reflectivity of OLED panel lower protective film is 12 ⁇ 18% at 400 ⁇ 700nm wavelength
  • the reflectance ratio of the liner film and the base-carrier film at a wavelength of 400-700 nm is 1: 0.3-3.0.
  • the lower protective film of the OLED panel of the present invention has a high reflectance, and the recognition rate of the alignment process is significantly improved, and antistatic treatment can be used to prevent the occurrence of static electricity, and at the same time, the adhesion with the OLED panel is excellent.
  • FIG. 1 is a cross-sectional view of an OLED panel lower protective film according to an embodiment of the present invention.
  • FIG. 2 is an exploded cross-sectional view of an OLED panel lower protective film according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of an organic light emitting display device according to an embodiment of the present invention.
  • the base film including the first adhesive layer formed on the upper surface of the first substrate and the second adhesive layer adhered to the lower surface of the first substrate and the adhesive agent adhered to the lower surface of the second adhesive layer
  • a carrier film comprising two substrates; a base-carrier film comprising; And a liner film adhered by the first adhesive layer, and provides an OLED panel lower protective film satisfying both the following conditions (1) and (2).
  • Reflectivity of OLED panel lower protective film is 12 ⁇ 18% at 400 ⁇ 700nm wavelength
  • the reflectance ratio of the liner film and the base-carrier film at a wavelength of 400-700 nm is 1: 0.3-3.0.
  • the OLED panel lower protective film may satisfy all of the following conditions (1) and (2).
  • Reflectivity of OLED panel lower protective film is 12 ⁇ 16% at 400 ⁇ 700nm wavelength
  • the ratio of reflectances of the liner film and the base-carrier film at a wavelength of 400-700 nm is 1: 0.62 to 2.6.
  • the OLED panel lower protective film may satisfy the following condition (3) at a wavelength of 400 ⁇ 700nm.
  • a is a reflectance deviation (%) of the liner film
  • b is a reflectance deviation (%) of the base-carrier film
  • c is a reflectance deviation (%) of the OLED panel lower protective film.
  • the reflectance may gradually decrease.
  • first substrate and the second substrate may be a PET substrate
  • first adhesive layer the second adhesive layer may be an acrylic adhesive layer
  • the bottom surface of the liner film may be silicon release treatment.
  • the liner film may satisfy all of the following conditions (4) and (5).
  • the liner film may have a reflectance of 5 to 13% at a wavelength of 400 to 700 nm.
  • the base-carrier film may have a reflectance of 8 to 13% at a wavelength of 400 to 700 nm.
  • first adhesive layer and the second adhesive layer may include an antistatic agent, and at least one surface of the liner film, the first substrate, and the second substrate may be antistatically treated.
  • the base film may have a transmittance of 85 to 98% and a haze of 0.2 to 1.0%.
  • the OLED panel lower protective film may have a total haze of 5 to 10%.
  • the first adhesive layer may have a thickness of 10 to 30 ⁇ m, and the first substrate may have a thickness of 65 to 140 ⁇ m.
  • the liner film may have a thickness of 55 to 95 ⁇ m
  • the second adhesive layer may have a thickness of 1 to 10 ⁇ m
  • the second substrate may have a thickness of 20 to 60 ⁇ m.
  • the liner film may have a release force of 5 gf / in or less.
  • the first adhesive layer may have an adhesive force of 250 gf / in or more as measured by the following measuring method.
  • the adhesive force at the time of adhering the first adhesive layer to glass and peeling 180 ° at a rate of 5 mm per second after 24 hours was measured.
  • the peel force between the base film and the carrier film may be 3 ⁇ 10 gf / in.
  • another embodiment of the present invention the step of peeling the liner film in the OLED panel lower protective film; Attaching the base-carrier film having the liner film peeled off to the OLED panel; And peeling the carrier film from the base-carrier film attached to the OLED panel.
  • the OLED panel comprises a substrate, and an organic light emitting device on the substrate, the base film is the substrate and the The adhesive layer may be disposed on an upper surface of the substrate, and the base film may have a transmittance of 85 to 98% and a haze of 0.2 to 1.0%.
  • the adhesive layer may include an antistatic agent.
  • the substrate may be at least one surface of the antistatic treatment.
  • the adhesive layer has a thickness of 10 to 30 ⁇ m
  • the substrate may be a thickness of 65 ⁇ 140 ⁇ m.
  • the adhesive layer may have an adhesive force of 250 gf / in or more measured by the following measuring method.
  • the adhesive force was measured when the adhesive layer was attached to glass and peeled 180 ° at a rate of 5 mm per second after 24 hours.
  • the pressure-sensitive adhesive layer is formed of a first adhesive composition
  • the pressure-sensitive adhesive composition comprises a first main resin and a pyridine-based antistatic agent
  • the pyridine-based antistatic agent is 0.5 to 5 with respect to 100 parts by weight of the first main resin It may be part by weight.
  • an OLED panel lower protective film includes a base film 120 and a first adhesive layer 121 formed on an upper surface of a first substrate 122.
  • a base comprising a carrier film 130 comprising a second adhesive layer 131 adhered to a bottom surface of a first substrate 122 and a second substrate 132 adhered to a bottom surface of the second adhesive layer 131.
  • the OLED panel lower protective film of the present invention Before describing each layer of the OLED panel lower protective film according to the present invention as shown in FIG. 1, the OLED panel lower protective film of the present invention, the liner film 110 and the base-carrier film 200 included therein are as follows. The reason why the condition (1) and the condition (2) must be satisfied is explained first.
  • the protective film When the protective film is attached to the lower part of the OLED panel, when the reflectance is low, an error may occur because the protective film cannot be attached exactly to the OLED panel when the alignment process has a low recognition rate. If the protective film is repeatedly peeled and attached, there is a problem in that there is a residue in the OLED panel or the manufacturing cost and time increase. In addition, even when the protective film is peeled off from the OLED panel when an error occurs, if the recognition rate of the alignment process is low, the peeling of the protective film may not be easy. Accordingly, it is necessary to improve the recognition rate of the alignment process.
  • the lower protective film of the OLED panel according to the present invention satisfies both the following conditions (1) and (2) in order to exhibit an appropriate reflectance to improve the recognition rate of the alignment process.
  • the reflectance of the OLED panel lower protective film at a wavelength of 400 to 700 nm may be 12 to 18%, preferably 12 to 16%, and as a condition (2), a liner film and a base at a wavelength of 400 to 700 nm
  • the reflectance ratio of the carrier film may be 1: 0.3 to 3.0, preferably 0.62 to 2.6.
  • the liner film is peeled off in the process of attaching the OLED panel lower protective film to the lower OLED panel. It is not easy, and thus a problem of increasing a defective rate may occur.
  • the reflectance ratio of the liner film and the base-carrier film at the wavelength (400) to 700nm under the above condition (2) does not satisfy 1: 0.3 to 3.0, in the process of attaching the OLED panel lower protective film to the lower OLED panel Errors can occur because the protective film cannot be attached exactly to the OLED panel.
  • the OLED panel lower protective film may satisfy the following condition (3) at a wavelength of 400 to 700 nm.
  • a is a reflectance deviation (%) of the liner film
  • b is a reflectance deviation (%) of the base-carrier film
  • c is a reflectance deviation (%) of the OLED panel lower protective film.
  • the variation in reflectance according to the wavelength indicates the change of reflectance as the wavelength is changed, and the small deviation means that the reflectance is small as the wavelength is changed. That is, a large deviation means that the change in the reflectance may be large according to the change of the wavelength, and may be excessively low in the reflectance at a specific wavelength, and thus the recognition rate of the alignment process may not be good.
  • the protective film under the OLED panel may have excessive variation in reflectance depending on the wavelength, which may cause frequent errors.
  • the reflectance may gradually decrease.
  • the protective film of the lower OLED panel may be gradually reduced from short wavelength to long wavelength, but is not limited thereto.
  • the OLED panel lower protective film may have a total haze of 5 to 10%, preferably 5.5 to 9.5%. If the haze of the OLED panel lower protective film is out of the above range, the peeling of the liner film is not easy in the process of attaching the OLED panel lower protective film to the lower OLED panel, thereby increasing the defective rate.
  • the liner film 110 serves to protect the base-carrier film 200.
  • the alignment process may be performed in the process of attaching the OLED panel lower protective film according to the present invention to the OLED panel. In this case, after peeling the liner film 110 first, the base-carrier film 200 is applied to the OLED panel. I can attach it.
  • the release force of the liner film 110 may be reduced between the base film 120 and the carrier film 130 so that the peeling between the base film 120 and the carrier film 130 does not occur in the peeling of the liner film 110. It may be relatively smaller than the peel force, preferably the release force of the liner film 110 may be 5 gf / in or less, more preferably 2 ⁇ 4 gf / in. If the release force of the liner film 110 exceeds 5 gf / in, peeling between the base film 120 and the carrier film 130 may occur when the liner film 200 is peeled off from the base-carrier film 200. The failure rate can thus increase significantly.
  • the bottom surface of the liner film 110 may be released (A) in order for the liner film 110 to exhibit the release force as described above.
  • the release treatment may be used without limitation as long as it is a material that can be commonly used in the release treatment in the art, and preferably release treatment with silicon may exhibit an appropriate level of release force.
  • the liner film 110 may satisfy all of the following conditions (4) and (5).
  • the reflectance suitable for the alignment process may be exhibited, and thus the recognition rate of the alignment process may be high. If the above conditions (4) and (5) are not satisfied, an error occurs in the process of checking whether the liner film is removed after peeling, so that a process of attaching a protective film to which the liner is not removed may be performed on the panel. As a result, the defective rate may increase.
  • the liner film 110 may have a reflectance of 5 to 13% and preferably a reflectance of 6 to 12% at a wavelength of 400 to 700 nm in order to satisfy both the conditions (1) and (2). If the reflectance of the liner film 110 does not satisfy the range at a wavelength of 400 to 700 nm, the recognition rate of the alignment process may be lowered, thereby causing a problem in that an error occurs and a defective rate is increased.
  • the liner film 110 according to the present invention may be at least one surface, preferably the upper surface and the lower surface antistatic treatment to prevent the generation of static electricity.
  • the antistatic treatment can prevent static electricity generation and improve the reflectance by reducing the refractive index difference with the base-carrier film, thereby further improving the recognition rate of the alignment process.
  • the liner film 110 may be used without limitation as long as it is a material generally used in a liner film in the art, and preferably, may be a PET substrate.
  • the thickness of the liner film 110 is not usually limited as long as the thickness of the liner film that can be used in the protective film, preferably 55 to 95 ⁇ m, more preferably 60 to 90 ⁇ m, but not limited thereto. It doesn't work.
  • the base-carrier film 200 includes a base film 120 including a first adhesive layer 121 formed on an upper surface of the first substrate 122 and a second adhesive adhered to a lower surface of the first substrate 122.
  • the carrier film 130 includes a layer 131 and a second substrate 132 adhered to a lower surface of the second adhesive layer 131.
  • the carrier film 130 is responsible for protecting the lower portion of the base film 120 directly attached to the OLED panel.
  • an alignment process may be performed.
  • the liner film 110 is first peeled off, and the base-carrier film 200 is attached to the OLED panel.
  • the carrier film 130 may be peeled off from the base-carrier film 200.
  • the peeling force between the base film 120 and the carrier film 130 is a base so that the peeling between the OLED panel and the base film 120 does not occur in the step of peeling the carrier film 130 in the base-carrier film 200
  • the peel force between the base film 120 and the carrier film 130 is 3 ⁇ 10 gf / in, more preferably Preferably 4 to 9 gf / in. If the peel force between the base film 120 and the carrier film 130 does not satisfy the above range, peeling between the base film 120 and the carrier film 130 may occur in the step of peeling the liner film 110. In the peeling of the carrier film 130 from the base film 120, peeling may occur between the OLED panel and the base film 120.
  • the second substrate 132 included in the carrier film 130 according to the present invention may be at least one surface, preferably the bottom surface antistatic treatment to prevent the occurrence of static electricity.
  • the antistatic treatment may prevent the generation of static electricity and improve the reflectance by reducing the difference in refractive index with the second adhesive layer 131 and / or the base film 120.
  • the second substrate 132 may be used without limitation as long as it is a material that can be commonly used in the protective film in the art, preferably, may be a PET substrate.
  • the thickness of the second substrate 132 is not particularly limited as long as the thickness of the substrate that can be used for the protective film, preferably 20 to 60 ⁇ m, more preferably 25 to 55 ⁇ m.
  • the second adhesive layer 131 included in the carrier film 130 may be used without limitation as long as it is a material for forming an adhesive layer in the art, and preferably, may be an acrylic adhesive layer.
  • the thickness of the second adhesive layer 131 is not particularly limited as long as the thickness of the adhesive layer included in the protective film, preferably 1 ⁇ 10 ⁇ m, more preferably 2 ⁇ 9 ⁇ m can be have.
  • the second adhesive layer 131 included in the carrier film 130 according to the present invention may include an antistatic agent to prevent static electricity.
  • an antistatic agent to prevent static electricity.
  • the base film 120 is directly attached to the OLED panel and serves to protect the lower portion of the OLED panel.
  • an alignment process may be performed.
  • the liner film 110 is first peeled off, and the base-carrier film 200 is attached to the OLED panel.
  • the carrier film 130 may be peeled off from the base-carrier film 200 to place the protective film on the lower portion of the OLED panel.
  • the adhesive force of the base film 120 should be large enough so that the protective film formed on the lower portion of the OLED panel is not peeled off.
  • the first adhesive layer has an adhesive force of 250 gf / in or more, more preferably, measured by the following measuring method.
  • the adhesion may be 1000 ⁇ 2300 gf / in.
  • the adhesive force at the time of adhering the first adhesive layer to glass and peeling 180 ° at a rate of 5 mm per second after 24 hours was measured.
  • the base film 120 may be peeled off the OLED panel.
  • the first substrate 122 included in the base film 120 according to the present invention may be at least one surface, preferably the bottom surface antistatic treatment to prevent the occurrence of static electricity.
  • Antistatic treatment may be performed to prevent static electricity, and reflectance may be improved by reducing a difference in refractive index between the first adhesive layer 121 and / or the carrier film 130.
  • the first substrate 122 may be used without limitation as long as it is a material that can be commonly used in the protective film in the art, and preferably, may be a PET substrate.
  • the thickness of the first substrate 122 is not particularly limited as long as the thickness of the substrate that can be used in the protective film, preferably 65 ⁇ 140 ⁇ m, more preferably 70 ⁇ 130 ⁇ m.
  • the first adhesive layer 121 included in the base film 120 may be used without limitation as long as it is a material for forming an adhesive layer in the art, and preferably, may be an acrylic adhesive layer.
  • the thickness of the first adhesive layer 121 is not usually limited as long as the thickness of the adhesive layer included in the protective film, preferably may be 10 ⁇ 30 ⁇ m, more preferably may be 12 ⁇ 26 ⁇ m have.
  • the first adhesive layer 121 included in the base film 120 according to the present invention may include an antistatic agent to prevent static electricity.
  • an antistatic agent to prevent static electricity.
  • first adhesive layer 121 Detailed description of the first adhesive layer 121 will be described through the manufacturing method described below.
  • the base film 120 may have a transmittance of 85 to 98%, preferably a transmittance of 88 to 97%, a haze of 0.2 to 1.0%, and preferably a haze of 0.3 to 0.9%. If the base film 120 does not satisfy the transmittance range and the haze range, it may be difficult to implement a desired reflectivity, and the detection ability of the appearance defect may be degraded during the shipment inspection process of the product, resulting in leakage of the defect. Problems may arise.
  • the base-carrier film 200 may have a reflectance of 8 to 13%, preferably 9 to 12% at a wavelength of 400 to 700 nm in order to satisfy both the conditions (1) and (2). have. If the reflectance of the base-carrier film 200 is less than 8% at a wavelength of 400 to 700 nm, the recognition rate of the alignment process may be lowered, thereby causing a problem in that an error occurs and a defective rate is increased. Specifically, when the base-carrier film 200 attached to the lower portion of the OLED panel is incorrectly attached as the recognition rate of the alignment process is lowered, the OLED panel and the base-carrier film 200 should be peeled off and then attached.
  • the defect rate may be high because there may be a residue under the OLED panel.
  • the recognition rate of the alignment process may be lowered, thereby causing a problem that an error occurs and a defective rate increases.
  • the reflectance at the wavelength of 400 to 700 nm specified in the present invention shows not only the reflectance at a specific wavelength but also the proper reflectance at most wavelengths of the visible light region, the wavelength of most of the visible light region is not limited to the specific wavelength. This means that the recognition rate of the alignment process can be high.
  • the above-described OLED panel lower protective film may be manufactured through the manufacturing method described below, but is not limited thereto.
  • the base film 120 is formed by applying and curing a first adhesive composition including a first main resin on the upper surface of the first substrate 122 to form a first adhesive layer 121.
  • a first adhesive composition including a first main resin on the upper surface of the first substrate 122 to form a first adhesive layer 121.
  • a carrier film 130 by forming a second adhesive layer 131 by applying and curing a second adhesive composition including a second subject resin on an upper surface of the second substrate 132
  • Manufacturing a base-carrier film (200) by laminating the base film (120) on an upper surface of the carrier film (130);
  • manufacturing the OLED panel lower protective film by laminating the liner film 110 on the base carrier film 200.
  • the step of manufacturing the base film 120 by forming a first adhesive layer 121 by applying and curing a first adhesive composition including a first main resin on the upper surface of the first substrate 122 will be described. do.
  • the first adhesive composition may include a first subject resin, and may further include a first hardener, a solvent, and an antistatic agent.
  • the first main resin can be used without limitation as long as it is a resin that can be used to form a pressure-sensitive adhesive layer having a sufficient adhesive force, preferably acrylic resin, more preferably polybutyl methacrylate, more More preferably polybutyl methacrylate having a weight average molecular weight of 200,000 to 1,000,000, most preferably polybutyl methacrylate having a weight average molecular weight of 400,000 to 800,000.
  • acrylic resin more preferably polybutyl methacrylate, more More preferably polybutyl methacrylate having a weight average molecular weight of 200,000 to 1,000,000, most preferably polybutyl methacrylate having a weight average molecular weight of 400,000 to 800,000.
  • the first curing agent may be used without limitation as long as it is a curing agent that can be used to form a pressure-sensitive adhesive layer that usually exhibits sufficient adhesive strength, preferably an epoxy curing agent may be used, and more preferably an epoxy amine curing agent may be used. And even more preferably N, N, N, N'-tetraglycidyl-m-xylenediamine.
  • the first hardener may be included in an amount of 0.02 to 0.08 parts by weight, preferably 0.03 to 0.07 parts by weight, based on 100 parts by weight of the first main resin. If the content of the first hardener is less than 0.02 parts by weight based on 100 parts by weight of the first main resin, the first adhesive layer may not be cured to a desired level. When the content of the first curing agent exceeds 0.08 parts by weight, the first adhesive layer may be excessively hard. It may cause a problem that the adhesive force is lowered.
  • the solvent may be used without limitation so long as it is a solvent that can be used in the pressure-sensitive adhesive composition to form an adhesive layer, preferably, an aqueous solvent, an alcohol solvent, a ketone solvent, an amine solvent, an ester solvent, an acetate solvent, and the like. It may include one or more selected from the group consisting of a solvent, an amide solvent, a halogenated hydrocarbon solvent, an ether solvent, and a furan solvent, and more preferably an alcohol solvent, a ketone solvent, an amine solvent, or an ester solvent. It may include one or more selected from the group consisting of a solvent, an acetate solvent and an ether solvent, most preferably methyl ethyl ketone.
  • the solvent may include 35 to 55 parts by weight, preferably 40 to 50 parts by weight, based on 100 parts by weight of the first subject resin, but is not limited thereto.
  • the antistatic agent may be used without limitation as long as it is a material capable of preventing static electricity.
  • it is easy to use a pyridine-based antistatic agent to improve the reflectance by reducing the antistatic and interlayer refractive index difference.
  • the antistatic agent may include 0.5 to 5 parts by weight, preferably 1 to 4 parts by weight, based on 100 parts by weight of the first main resin. If the antistatic agent does not satisfy the above range, it may not exhibit the desired antistatic effect, the difference in inter-layer refractive index may be large, and thus the reflectance may be lowered and the recognition rate of the alignment process may not be good.
  • the base film 120 may be manufactured by coating and curing the first adhesive composition described above on the upper surface of the first base 122 having an antistatic treatment on the lower surface thereof to form the first adhesive layer 121.
  • the second adhesive composition may include a second main resin, and may further include a second hardener, a solvent, an antistatic agent, and an antistatic agent.
  • the second main resin can be used without limitation as long as it can be used to form a pressure-sensitive adhesive layer having a relatively low adhesive strength than the first adhesive layer, preferably acrylic resin, more preferably polymethyl It may be methacrylate, and more preferably polymethyl methacrylate having a weight average molecular weight of 5,000 to 170,000, most preferably polymethyl methacrylate having a weight average molecular weight of 50,000 to 150,000.
  • the second curing agent may be used without limitation as long as it is a curing agent that can be used to form a pressure-sensitive adhesive layer having a relatively low adhesive strength than the first adhesive layer, preferably an isocyanate-based curing agent can be used.
  • the second hardener may be included in an amount of 2 to 8 parts by weight, preferably 3 to 7 parts by weight, based on 100 parts by weight of the second main resin. If the content of the second hardener is less than 2 parts by weight based on 100 parts by weight of the second main resin, the second adhesive layer may not be cured to a desired level. If the content of the second adhesive agent exceeds 8 parts by weight, the second adhesive layer may be excessively hard. It may cause a problem that the adhesive force is lowered.
  • the solvent may be used without limitation so long as it is a solvent that can be used in the pressure-sensitive adhesive composition to form an adhesive layer, preferably, an aqueous solvent, an alcohol solvent, a ketone solvent, an amine solvent, an ester solvent, an acetate solvent, and the like. It may include one or more selected from the group consisting of a solvent, an amide solvent, a halogenated hydrocarbon solvent, an ether solvent, and a furan solvent, and more preferably an alcohol solvent, a ketone solvent, an amine solvent, or an ester solvent. It may include one or more selected from the group consisting of a solvent, an acetate solvent and an ether solvent, most preferably methyl ethyl ketone.
  • the solvent may include 60 to 80 parts by weight, preferably 65 to 75 parts by weight, based on 100 parts by weight of the second main resin, but is not limited thereto.
  • the antistatic agent may be used without limitation as long as it is a material capable of preventing static electricity.
  • the antistatic agent may be included in an amount of 0.1 to 0.4 parts by weight, preferably 0.15 to 0.35 parts by weight, based on 100 parts by weight of the second main resin. If the antistatic agent does not satisfy the above range, it may not exhibit the desired antistatic effect, the difference in inter-layer refractive index may be large, and thus the reflectance may be lowered and the recognition rate of the alignment process may not be good.
  • the second adhesive composition may further include a leveling agent and a wetting agent.
  • the leveling agent and the wetting agent can be used without limitation as long as it is a material that can be employed when forming a pressure-sensitive adhesive layer in the art.
  • the leveling agent may be polyacrylate, and the humectant may be polyethersiloxane, but is not limited thereto.
  • the leveling agent may be included in an amount of 0.25 to 2.25 parts by weight, preferably 0.5 to 2 parts by weight, based on 100 parts by weight of the second main resin, and the wetting agent is 0.2 to 0.8 parts by weight based on 100 parts by weight of the second main resin. , Preferably it may be included in 0.3 to 0.7 parts by weight, but is not limited thereto.
  • the carrier film 130 may be manufactured by coating and curing the above-described second adhesive composition on the upper surface of the second substrate 132 on which the lower surface is antistatically formed to form the second adhesive layer 131.
  • the base film 120 and the liner film 110 may be used without limitation as long as it is a method and / or conditions commonly used in the art, and preferably may be laminated using a roll laminator at room temperature, but is not limited thereto. It doesn't work.
  • the base-carrier film 200 may be used in the art without limitation if the method and / or conditions that can conventionally laminate the base film 120 and the carrier film 130, preferably using a roll laminator at room temperature It can be laminated using the OLED panel to produce a protective film, but is not limited thereto.
  • the present invention provides a method for applying an OLED panel lower protective film according to the present invention to the OLED panel, the step of peeling the liner film from the OLED panel lower protective film; Attaching the base-carrier film having the liner film peeled off to the OLED panel; And peeling the carrier film from the base-carrier film attached to the OLED panel.
  • the first alignment process may be performed to peel off the liner film from the OLED panel lower protective film.
  • the liner film is lowered from the lower protective film of the OLED panel by detecting light reflected by irradiating light with a wavelength of 400 to 700 nm. Can be peeled off. In this case, if the liner film does not exhibit a proper range of reflectance, an error may occur, thereby increasing process time and / or cost and increasing defective rate.
  • a second alignment process may be performed to attach the base-carrier film from which the liner film is peeled off to the OLED panel, and the base panel is applied to the OLED panel by detecting the reflected light by irradiating light with a wavelength of 400 to 700 nm.
  • the carrier film can be attached.
  • an error may occur because it is not easy to accurately attach the base-carrier film to the OLED panel, and the protective film is repeatedly peeled and attached every time an error occurs. There may be a problem in the OLED panel or an increase in manufacturing cost and time.
  • a third alignment process may be performed in order to peel the carrier film from the base-carrier film attached to the OLED panel, which is irradiated with light having a wavelength of 400 to 700 nm to detect the reflected light and attach it to the OLED panel.
  • the carrier film may be peeled off the base-carrier film. In this case, if the base-carrier film does not exhibit a proper range of reflectance, an error may occur, thereby increasing process time and / or cost and increasing defective rate.
  • the present invention includes an organic light emitting display device 10 including the base film described above.
  • the base film 120 ′′ may be attached to the lower portion of the OLED panel 300.
  • the OLED panel 300 may be a substrate and an organic layer disposed on the substrate.
  • the organic light emitting device may include a first electrode, an intermediate layer including an organic light emitting layer, and a second electrode.
  • the base film 120 ′′ may be disposed below the substrate of the OLED panel 300.
  • the base film 120 "includes a first adhesive layer 121" having sufficient adhesive force and a first substrate 122 "functioning to protect the OLED panel 300. Accordingly, the lower portion of the OLED panel 300 may be protected and static electricity may be prevented from the OLED panel 300.
  • the lower protective film of the OLED panel of the present invention has a high reflectance significantly improves the recognition rate of the alignment process, it is possible to prevent the generation of static electricity through the antistatic treatment and at the same time exhibits an excellent adhesion with the OLED panel. Can be.
  • Polybutyl methacrylate having a weight average molecular weight of 600,000 as the first main resin (Burim Chemical, BA8900), N, N, N, N'-tetraglycidyl as the first hardener based on 100 parts by weight of the first main resin 0.05 parts by weight of -m-xylenediamine (Burim Chemical, 45S), 2.5 parts by weight of pyridine antistatic agent (KOEI, IL-P14-2) as an antistatic agent and 45 parts by weight of methyl ethyl ketone (MEK) as a solvent
  • One adhesive composition was prepared.
  • PEDOT / PSS poly (3,4-ethylenedioxythiophene) polystyrene sulfonate
  • PEDOT / PSS poly (3,4-ethylenedioxythiophene) polystyrene sulfonate
  • the thin film was coated with a silicone release agent and the silicone release treatment liner film was laminated at room temperature using a roll laminator and cured at 50 ° C. for 48 hours to form a base film and a base film on which a first adhesive layer having a thickness of 13 ⁇ m was formed.
  • a liner film laminated on the side was prepared.
  • a polyacrylate BYK, BYK361N
  • TEGO polyethersiloxane
  • MEK methyl ethyl ketone
  • PEDOT / PSS poly (3,4-ethylenedioxythiophene) polystyrene sulfonate
  • the base film and the carrier film laminated with the liner film were laminated at 25 ° C. using a roll laminator to prepare an OLED lower protective film.
  • the reflectance of the liner film, the reflectance of the base-carrier film and the reflectance of the OLED panel lower protective film were measured. Specifically, by using the reflectance measurement mode of the spectrophotometer (Konica Minolta, CM3700A) The reflectance of the liner film, the reflectance of the base-carrier film, and the reflectance average value of the OLED panel lower protective film at wavelengths of 400 nm to 700 nm were measured and shown in Tables 1 to 3 below.
  • the area beyond the OLED panel as the adhered surface is the base- 0.1% or less of the total area of the carrier film- ⁇ , 0.1% of the total area
  • the error of the secondary alignment process was evaluated as -x. Repeatedly performed 100 times, the error occurrence rate of 100 times is shown in Tables 1 to 3 below.
  • Example 1 Example 2
  • Example 3 Example 4
  • Example 5 First adhesive composition Antistatic content (parts by weight) 2.5 One 4 2.5 2.5 Second adhesive composition Antistatic content (parts by weight) 0.25 0.25 0.25 0.15 0.35
  • Antistatic treatment The first ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ The second ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ Liner film top ⁇ ⁇ ⁇ ⁇ ⁇ Liner film ⁇ ⁇ ⁇ ⁇ reflectivity Liner film (%) 8.2 8.2 8.2 8.2 8.2 8.2 Base-carrier film (%) 10.1 11.8 9.3 11.2 9.6 Liner / Base-Carrier Reflectance Ratio 1: 1.23 1: 1.44 1: 1.13 1: 1.37 1: 1.17 OLED panel lower protection film (%) 12.9 15.3 12.1 14.9 12.3 Align process error assessment Primary Alignment (%) One One One One One Second alignment (%) 0 0 2 0 One 3rd alignment (%) 0 0 0 One 0 One 0 One 0 One 0 One 0 One
  • Example 1 in which the lower surface of the first substrate was antistatically treated, had fewer errors in the alignment process than Example 6 in which the antistatic treatment of the lower surface of the first substrate was not.
  • Example 1 in which the lower surface of the second substrate was antistatically treated had fewer errors in the alignment process than Example 7 in which the lower surface of the second substrate was not antistatically treated.
  • Example 1 in which the top and bottom surfaces of the liner film were antistatically treated was compared with Example 8 in which the top surface of the liner film was antistatically treated and Example 9 in which the bottom surface of the liner film was not antistatically treated. There were fewer errors.
  • Examples 1, 4 and 5 in the content of the antistatic agent included in the second adhesive composition is within the preferred range of the present invention, compared to Comparative Examples 3 and 4, which does not satisfy this error in the alignment process significantly You can see little.
  • Example 1 in which the upper and lower surfaces of the liner film were antistatically treated, had significantly fewer errors in the alignment process than Comparative Example 5 in which both the upper and lower surfaces of the liner film were antistatically treated.
  • Example 1 in which the lower surface of the first substrate and the lower surface of the second substrate were antistatically treated, compared to Comparative Example 6 in which the lower surface of the first substrate and the lower surface of the second substrate were not antistatically treated, and the alignment process was in error. was much less.
  • Example 1 which satisfies both the conditions (1) and (2) according to the present invention, had significantly fewer errors in the alignment process than Comparative Example 7 and Comparative Example 8, which did not satisfy the condition (1).
  • the OLED panel lower protective film prepared according to Examples 1 and 10 to 17 was cut to 1 inch width of the OLED panel lower protective film, and then peeled at 180 ° at a speed of 40 mm per second to measure the liner release force.
  • the lower protective film was cut to 1 inch width to remove the liner film, and then the surface was attached to the cleaned glass. After 24 hours, the lower protective film was peeled at 180 ° at a speed of 5 mm per second to measure the adhesive strength of the first adhesive layer.
  • the film was cut to 1 inch wide and the carrier film was peeled off at 180 ° at a speed of 40 mm per second to measure the peel force between the base film and the carrier film and are shown in Tables 4 and 5 below.
  • Example 10 Example 11
  • Example 12 Example 13 Liner film under mold release ⁇ ⁇ ⁇ ⁇ ⁇ Weight average molecular weight of the first major resin 600,000 600,000 100,000 400,000 800,000 Second average resin weight average molecular weight 100,000 100,000 100,000 100,000 100,000 100,000 Liner Film Release Force (gf / in) 3.2 9.8 3.2 3.2 3.2 First adhesive layer adhesion (gf / in) 1680 1680 207 1029 2263 Base Film / Carrier Film Peeling Force (gf / in) 6.6 6.6 6.6 6.6 6.6 6.6 6.6 6.6 6.6 6.6 Workability 1st alignment ⁇ ⁇ ⁇ ⁇ 3rd alignment ⁇ ⁇ ⁇ ⁇ ⁇ Base Film Adhesive Performance ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇
  • Example 15 Example 16 Example 17 Liner film under mold release ⁇ ⁇ ⁇ ⁇ Weight average molecular weight of the first major resin 600,000 600,000 600,000 600,000 Second average resin weight average molecular weight 4,000 50,000 150,000 220,000 Liner Film Release Force (gf / in) 3.2 3.2 3.2 3.2 3.2 First adhesive layer adhesion (gf / in) 1680 1680 1680 1680 Base Film / Carrier Film Peeling Force (gf / in) 1.3 4.1 8.8 12.2 Workability 1st alignment ⁇ ⁇ ⁇ ⁇ 3rd alignment ⁇ ⁇ ⁇ ⁇ Base Film Adhesive Performance ⁇ ⁇ ⁇ ⁇ ⁇
  • Examples 1, 12, 13, 15, and 16 satisfying the weight average molecular weight of the main resin according to the present invention and the presence or absence of a lower surface release treatment of the liner film are in the examples 10, 11, 14, and 17 in which one of them is missing. Compared with the workability of the primary alignment and the tertiary alignment, and the adhesiveness of the base film, it was excellent.
  • Example 1 in which the bottom surface of the liner film was released was superior to Example 10 in which the bottom surface of the liner film was not released.

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Abstract

The present invention relates to a protection film for a lower part of an OLED panel, and more specifically to an OLED panel lower part protection film, wherein the recognition rate of an aligning process thereof is significantly improved, static electricity can be prevented from being generated through an antistatic treatment, and at the same time the film has an excellent adhesive strength to an OLED panel, and an organic light-emitting display apparatus comprising the same.

Description

OLED 패널 하부 보호필름 및 이를 포함하는 유기발광표시장치OLED panel lower protective film and organic light emitting display device including the same
본 발명은 OLED 패널 하부 보호필름에 관한 것으로, 더욱 상세하게는 얼라인(align) 공정의 인식률이 현저히 향상되고, 대전방지 처리를 통해 정전기 발생을 방지할 수 있는 동시에 OLED 패널과의 점착력이 우수한 OLED 패널 하부 보호필름 및 이를 포함하는 유기발광표시장치에 관한 것이다.The present invention relates to an OLED panel lower protective film, and more particularly, the recognition rate of the alignment process is remarkably improved, and anti-static treatment can prevent the occurrence of static electricity and at the same time excellent OLED adhesion with the OLED panel A panel lower protective film and an organic light emitting display device including the same.
최근 정보 통신 기술의 비약적인 발전과 시장의 팽창에 따라 디스플레이 소자로 평판표시소자(Flat Panel Display)가 각광받고 있다. 이러한 평판표시소자로는 액정 표시소자(Liquid Crystal Display). 플라즈마 디스플레이 소자(Plasma Display Panel), 유기발광소자(Organic Light Emitting Diodes) 등이 대표적이다.Recently, with the rapid development of information and communication technology and the expansion of the market, flat panel displays have been in the spotlight as display devices. Such a flat panel display device is a liquid crystal display device (Liquid Crystal Display). Plasma Display Panels and Organic Light Emitting Diodes are typical.
유기발광소자는 빠른 응답속도와 경박단소, 저소비전력, 자발광소자, 유연성 등의 장점을 가지고 있어 최근 차세대 디스플레이소자, 플렉서블 디스플레이뿐만 아니라 조명 등에 그 수요가 증가되고 있다.The organic light emitting device has advantages such as fast response speed, light and small size, low power consumption, self-light emitting device, and flexibility, and thus the demand for the next generation display device, flexible display, and lighting is increasing.
유기발광소자는 유리기판 상에 투명전극, 정공주입층, 정공수송층, 유기발광층, 전자수송층, 전자주입층, 금속전극의 순서로 증착되어 형성되며 양쪽 전극에서 공급된 전자와 정공이 유기발광층에서 재결합하며 방출되는 에너지를 이용해 발광하는 원리이다.The organic light emitting device is formed by depositing in order of a transparent electrode, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, a metal electrode on a glass substrate, the electrons and holes supplied from both electrodes are recombined in the organic light emitting layer It emits light by using emitted energy.
유기 발광 소자는 외부의 수분과 산소 또는 자외선 등의 외적 요인에 의해 열화될 수 있으므로 유기 발광 소자를 밀봉시키는 패키징(packaging) 기술이 중요하며, 다양한 어플리케이션에 적용하기 위해, 유기 발광 표시 장치는 얇게 제조될 것이 요구된다.Since the organic light emitting device may be degraded by external factors such as external moisture, oxygen, or ultraviolet light, a packaging technology for sealing the organic light emitting device is important, and in order to be applied to various applications, the organic light emitting diode display is manufactured to be thin. To be required.
한편, OLED 패널 하부에는 OLED 패널을 보호하고, 정전기 발생을 방지하기 위한 하부 보호필름을 포함하는데, 종래의 OLED 패널 하부 보호필름은 반사율이 낮아서 얼라인 공정에서 오류 발생이 빈번하여 OLED 패널의 제조가 용이하지 않았고, 정전기 발생을 방지하지 못하였으며, OLED 패널과의 점착력이 좋지 못한 문제가 있었다.Meanwhile, the lower portion of the OLED panel includes a lower protective film for protecting the OLED panel and preventing static electricity, and the conventional OLED panel lower protective film has a low reflectance so that errors occur frequently during the alignment process. It was not easy, did not prevent the generation of static electricity, there was a problem that the adhesion with the OLED panel is not good.
이에 반사율이 높아 얼라인(align) 공정의 인식률이 현저히 향상되고, 대전방지 처리를 통해 정전기 발생을 방지할 수 있는 동시에 OLED 패널과의 점착력이 우수한 OLED 패널 하부 보호필름에 대한 연구가 시급한 실정이다.As the reflectance is high, the recognition rate of the alignment process is remarkably improved, and it is urgent to study the protective film of the OLED panel under which the antistatic treatment can prevent the generation of static electricity and the adhesiveness with the OLED panel is excellent.
본 발명의 기술적 과제는 반사율이 높아 얼라인(align) 공정의 인식률이 현저히 향상되고, 대전방지 처리를 통해 정전기 발생을 방지할 수 있는 동시에 OLED 패널과의 점착력이 우수한 OLED 패널 하부 보호필름을 제공하는 것이다.The technical problem of the present invention is that the recognition rate of the alignment process is significantly improved due to the high reflectance, to prevent the occurrence of static electricity through the antistatic treatment, and at the same time to provide an OLED panel lower protective film having excellent adhesion with the OLED panel. will be.
상술한 과제를 해결하기 위해 본 발명은, 제1기재의 상면에 형성된 제1점착층을 포함하는 베이스 필름 및 상기 제1기재의 하면에 점착되는 제2점착층 및 상기 제2점착층의 하면에 점착된 제2기재를 포함하는 캐리어 필름;을 포함하는 베이스-캐리어 필름; 및 상기 제1점착층에 의해 점착되는 라이너 필름;을 포함하고, 하기 조건 (1) 및 조건 (2)를 모두 만족하는 OLED 패널 하부 보호필름을 제공한다.In order to solve the above problems, the present invention is a base film comprising a first adhesive layer formed on the upper surface of the first substrate and the second adhesive layer and a lower surface of the second adhesive layer adhered to the lower surface of the first substrate A base-carrier film comprising a carrier film comprising a second substrate adhered thereto; And a liner film adhered by the first adhesive layer, and provides an OLED panel lower protective film satisfying both the following conditions (1) and (2).
(1) 400 ~ 700㎚ 파장에서 OLED 패널 하부 보호필름의 반사율이 12 ~ 18%(1) Reflectivity of OLED panel lower protective film is 12 ~ 18% at 400 ~ 700nm wavelength
(2) 400 ~ 700㎚ 파장에서 라이너 필름 및 베이스-캐리어 필름의 반사율 비가 1 : 0.3 ~ 3.0 임.(2) The reflectance ratio of the liner film and the base-carrier film at a wavelength of 400-700 nm is 1: 0.3-3.0.
본 발명의 OLED 패널 하부 보호필름은 반사율이 높아 얼라인(align) 공정의 인식률이 현저히 향상되고, 대전방지 처리를 통해 정전기 발생을 방지할 수 있는 동시에 OLED 패널과의 점착력이 우수한 효과가 있다.The lower protective film of the OLED panel of the present invention has a high reflectance, and the recognition rate of the alignment process is significantly improved, and antistatic treatment can be used to prevent the occurrence of static electricity, and at the same time, the adhesion with the OLED panel is excellent.
도 1은 본 발명의 일실시예에 따른 OLED 패널 하부 보호필름의 단면도이다.1 is a cross-sectional view of an OLED panel lower protective film according to an embodiment of the present invention.
도 2는 본 발명의 일실시예에 따른 OLED 패널 하부 보호필름의 분리 단면도이다. 2 is an exploded cross-sectional view of an OLED panel lower protective film according to an embodiment of the present invention.
도 3은 본 발명의 일실시예에 따른 유기발광표시장치의 단면도이다.3 is a cross-sectional view of an organic light emitting display device according to an embodiment of the present invention.
본 발명의 일 실시예는, 제1기재의 상면에 형성된 제1점착층을 포함하는 베이스 필름 및 상기 제1기재의 하면에 점착되는 제2점착층 및 상기 제2점착층의 하면에 점착된 제2기재를 포함하는 캐리어 필름;을 포함하는 베이스-캐리어 필름; 및 상기 제1점착층에 의해 점착되는 라이너 필름;을 포함하고, 하기 조건 (1) 및 조건 (2)를 모두 만족하는 OLED 패널 하부 보호필름을 제공한다.One embodiment of the present invention, the base film including the first adhesive layer formed on the upper surface of the first substrate and the second adhesive layer adhered to the lower surface of the first substrate and the adhesive agent adhered to the lower surface of the second adhesive layer A carrier film comprising two substrates; a base-carrier film comprising; And a liner film adhered by the first adhesive layer, and provides an OLED panel lower protective film satisfying both the following conditions (1) and (2).
(1) 400 ~ 700㎚ 파장에서 OLED 패널 하부 보호필름의 반사율이 12 ~ 18%(1) Reflectivity of OLED panel lower protective film is 12 ~ 18% at 400 ~ 700nm wavelength
(2) 400 ~ 700㎚ 파장에서 라이너 필름 및 베이스-캐리어 필름의 반사율 비가 1 : 0.3 ~ 3.0 임.(2) The reflectance ratio of the liner film and the base-carrier film at a wavelength of 400-700 nm is 1: 0.3-3.0.
본 발명의 일 실시예에 의하면, 상기 OLED 패널 하부 보호필름은 하기 조건 (1) 및 (2)를 모두 만족할 수 있다.According to one embodiment of the present invention, the OLED panel lower protective film may satisfy all of the following conditions (1) and (2).
(1) 400 ~ 700㎚ 파장에서 OLED 패널 하부 보호필름의 반사율이 12 ~ 16%(1) Reflectivity of OLED panel lower protective film is 12 ~ 16% at 400 ~ 700nm wavelength
(2) 400 ~ 700㎚ 파장에서 라이너 필름 및 베이스-캐리어 필름의 반사율의 비가 1 : 0.62 ~ 2.6 임.(2) The ratio of reflectances of the liner film and the base-carrier film at a wavelength of 400-700 nm is 1: 0.62 to 2.6.
또한, 상기 OLED 패널 하부 보호필름은 400 ~ 700㎚ 파장에서 하기 조건 (3)을 만족할 수 있다.In addition, the OLED panel lower protective film may satisfy the following condition (3) at a wavelength of 400 ~ 700nm.
(3)
Figure PCTKR2018000822-appb-I000001
임.(3)
Figure PCTKR2018000822-appb-I000001
being.
단, a는 라이너 필름의 반사율 편차(%), b는 베이스-캐리어 필름의 반사율 편차(%) 및 c는 OLED 패널 하부 보호필름의 반사율 편차(%)를 나타낸다.Where a is a reflectance deviation (%) of the liner film, b is a reflectance deviation (%) of the base-carrier film, and c is a reflectance deviation (%) of the OLED panel lower protective film.
또한, 상기 OLED 패널 하부 보호필름은 파장이 길어짐에 따라 반사율이 점진적으로 감소할 수 있다.In addition, as the wavelength of the OLED panel lower protective film increases, the reflectance may gradually decrease.
또한, 상기 제1기재 및 제2기재는 PET 기재일 수 있고, 상기 제1점착층, 제2점착층은 아크릴계 점착층일 수 있다.In addition, the first substrate and the second substrate may be a PET substrate, the first adhesive layer, the second adhesive layer may be an acrylic adhesive layer.
또한, 상기 라이너 필름은 하면이 실리콘 이형처리될 수 있다.In addition, the bottom surface of the liner film may be silicon release treatment.
또한, 상기 라이너 필름은 하기 조건 (4) 및 (5)를 모두 만족할 수 있다.In addition, the liner film may satisfy all of the following conditions (4) and (5).
(4) 520㎚ 파장에서의 반사율 > 440㎚ 파장에서의 반사율(4) reflectance at 520 nm wavelength> reflectance at 440 nm wavelength
(5) 520㎚ 파장에서의 반사율 > 690㎚ 파장에서의 반사율.(5) Reflectance at 520 nm wavelength> Reflectance at 690 nm wavelength.
또한, 상기 라이너 필름은 400 ~ 700㎚ 파장에서 반사율이 5 ~ 13%일 수 있다.In addition, the liner film may have a reflectance of 5 to 13% at a wavelength of 400 to 700 nm.
또한, 상기 베이스-캐리어 필름은 400 ~ 700㎚ 파장에서 반사율이 8 ~ 13%일 수 있다.In addition, the base-carrier film may have a reflectance of 8 to 13% at a wavelength of 400 to 700 nm.
또한, 상기 제1점착층 및 제2점착층은 대전방지제를 포함할 수 있고, 상기 라이너 필름, 제1기재 및 제2기재는 적어도 일면이 대전방지 처리될 수 있다.In addition, the first adhesive layer and the second adhesive layer may include an antistatic agent, and at least one surface of the liner film, the first substrate, and the second substrate may be antistatically treated.
또한, 상기 베이스 필름은 투과율이 85 ~ 98% 및 헤이즈(Haze)가 0.2 ~ 1.0%일 수 있다.In addition, the base film may have a transmittance of 85 to 98% and a haze of 0.2 to 1.0%.
또한, 상기 OLED 패널 하부 보호필름은 총 헤이즈(Haze)가 5 ~ 10%일 수 있다.In addition, the OLED panel lower protective film may have a total haze of 5 to 10%.
또한, 상기 제1점착층은 두께가 10 ~ 30㎛일 수 있고, 상기 제1기재는 두께가 65 ~ 140㎛일 수 있다.In addition, the first adhesive layer may have a thickness of 10 to 30㎛, and the first substrate may have a thickness of 65 to 140㎛.
또한, 상기 라이너 필름은 두께가 55 ~ 95㎛ 일 수 있고, 상기 제2점착층은 두께가 1 ~ 10㎛ 일 수 있으며, 상기 제2기재는 두께가 20 ~ 60㎛일 수 있다.In addition, the liner film may have a thickness of 55 to 95 μm, the second adhesive layer may have a thickness of 1 to 10 μm, and the second substrate may have a thickness of 20 to 60 μm.
또한, 상기 라이너 필름은 이형력이 5 gf/in 이하일 수 있다.In addition, the liner film may have a release force of 5 gf / in or less.
또한, 상기 제1점착층은 하기 측정방법으로 측정한 점착력이 250 gf/in 이상일 수 있다.In addition, the first adhesive layer may have an adhesive force of 250 gf / in or more as measured by the following measuring method.
[측정방법][How to measure]
제1점착층을 글래스(glass)에 부착하여 24시간 경과 후 초당 5mm의 속도로 180° 박리시킬 때의 점착력을 측정하였다.The adhesive force at the time of adhering the first adhesive layer to glass and peeling 180 ° at a rate of 5 mm per second after 24 hours was measured.
또한, 상기 베이스 필름 및 캐리어 필름 간의 박리력이 3 ~ 10 gf/in 일 수 있다.In addition, the peel force between the base film and the carrier film may be 3 ~ 10 gf / in.
한편, 본 발명의 다른 실시예는, 상기 OLED 패널 하부 보호필름에서 라이너 필름을 박리하는 단계; 라이너 필름을 박리한 베이스-캐리어 필름을 OLED 패널에 부착하는 단계; 및 OLED 패널에 부착한 베이스-캐리어 필름에서 캐리어 필름을 박리하는 단계;를 포함하는 OLED 패널 하부 보호필름의 적용 방법을 제공한다.On the other hand, another embodiment of the present invention, the step of peeling the liner film in the OLED panel lower protective film; Attaching the base-carrier film having the liner film peeled off to the OLED panel; And peeling the carrier film from the base-carrier film attached to the OLED panel.
한편, 본 발명의 또 다른 실시예는, 베이스 필름 및 OLED 패널을 포함하는 유기발광표시장치에 있어서, 상기 OLED 패널은 기판, 및 상기 기판 상의 유기발광소자를 포함하고, 상기 베이스 필름은 기재 및 상기 기재의 상면에 배치된 점착층을 포함하며, 상기 베이스 필름은 투과율이 85 ~ 98% 및 헤이즈(Haze)가 0.2 ~ 1.0%일 수 있다. On the other hand, another embodiment of the present invention, in the organic light emitting display device comprising a base film and an OLED panel, the OLED panel comprises a substrate, and an organic light emitting device on the substrate, the base film is the substrate and the The adhesive layer may be disposed on an upper surface of the substrate, and the base film may have a transmittance of 85 to 98% and a haze of 0.2 to 1.0%.
또한, 상기 점착층은 대전방지제를 포함할 수 있다.In addition, the adhesive layer may include an antistatic agent.
또한, 상기 기재는 적어도 일면이 대전방지 처리될 수 있다.In addition, the substrate may be at least one surface of the antistatic treatment.
또한, 상기 점착층은 두께가 10 ~ 30㎛이고, 상기 기재는 두께가 65 ~ 140㎛ 일 수 있다.In addition, the adhesive layer has a thickness of 10 to 30㎛, the substrate may be a thickness of 65 ~ 140㎛.
또한, 상기 점착층은 하기 측정방법으로 측정한 점착력이 250 gf/in 이상일 수 있다.In addition, the adhesive layer may have an adhesive force of 250 gf / in or more measured by the following measuring method.
[측정방법][How to measure]
상기 점착층을 글래스(glass)에 부착하여 24시간 경과 후 초당 5mm의 속도로 180° 박리시킬 때의 점착력을 측정하였다.The adhesive force was measured when the adhesive layer was attached to glass and peeled 180 ° at a rate of 5 mm per second after 24 hours.
또한, 상기 점착층은 제1점착조성물로 형성되며, 상기 점착조성물은 제1주제수지 및 피리딘계 대전방지제를 포함하며, 상기 피리딘계 대전방지제는 상기 제1주제수지 100 중량부에 대하여 0.5 ~ 5 중량부일 수 있다.In addition, the pressure-sensitive adhesive layer is formed of a first adhesive composition, the pressure-sensitive adhesive composition comprises a first main resin and a pyridine-based antistatic agent, the pyridine-based antistatic agent is 0.5 to 5 with respect to 100 parts by weight of the first main resin It may be part by weight.
이하, 첨부한 도면을 참고로 하여 본 발명의 실시예에 대하여 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 동일 또는 유사한 구성요소에 대해서는 동일한 참조부호를 부가한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. The drawings and description are to be regarded as illustrative in nature and not restrictive. Like reference numerals designate like elements throughout the specification.
도 1에 도시된 것과 같이, 본 발명의 일 실시예에 의한 OLED 패널 하부 보호필름은 제1기재(122)의 상면에 형성된 제1점착층(121)을 포함하는 베이스 필름(120) 및 상기 제1기재(122)의 하면에 점착되는 제2점착층(131) 및 상기 제2점착층(131)의 하면에 점착된 제2기재(132)를 포함하는 캐리어 필름(130)을 포함하는 베이스-캐리어 필름(200) 및 상기 제1점착층(121)에 의해 점착되는 라이너 필름(110)을 포함한다.As shown in FIG. 1, an OLED panel lower protective film according to an embodiment of the present invention includes a base film 120 and a first adhesive layer 121 formed on an upper surface of a first substrate 122. A base comprising a carrier film 130 comprising a second adhesive layer 131 adhered to a bottom surface of a first substrate 122 and a second substrate 132 adhered to a bottom surface of the second adhesive layer 131. And a liner film 110 adhered by the carrier film 200 and the first adhesive layer 121.
도 1과 같이 본 발명에 따른 OLED 패널 하부 보호필름을 이루는 각 층에 대해 설명하기에 앞서서 본 발명의 OLED 패널 하부 보호필름, 이에 포함되는 라이너 필름(110) 및 베이스-캐리어 필름(200)이 하기 조건 (1) 및 조건 (2)를 만족해야 하는 이유에 대해 먼저 설명한다.Before describing each layer of the OLED panel lower protective film according to the present invention as shown in FIG. 1, the OLED panel lower protective film of the present invention, the liner film 110 and the base-carrier film 200 included therein are as follows. The reason why the condition (1) and the condition (2) must be satisfied is explained first.
OLED 패널의 하부에 보호필름을 부착할 때, 반사율이 낮은 경우 얼라인(align) 공정의 인식률이 낮으면 OLED 패널에 정확히 보호필름을 부착할 수 없기 때문에 오류가 발생할 수 있는데, 오류가 발생할 때마다 보호필름 박리 및 부착을 반복할 경우 OLED 패널에 잔사가 있거나 제조 비용 및 시간이 증가하는 문제가 있다. 또한, 오류가 발생하였을 때 OLED 패널에서 보호 필름을 박리하는 경우에도 얼라인 공정의 인식률이 낮은 경우, 보호 필름의 박리 또한 용이하지 않을 수 있다. 이에 따라 얼라인 공정의 인식률을 향상시킬 필요가 있다.When the protective film is attached to the lower part of the OLED panel, when the reflectance is low, an error may occur because the protective film cannot be attached exactly to the OLED panel when the alignment process has a low recognition rate. If the protective film is repeatedly peeled and attached, there is a problem in that there is a residue in the OLED panel or the manufacturing cost and time increase. In addition, even when the protective film is peeled off from the OLED panel when an error occurs, if the recognition rate of the alignment process is low, the peeling of the protective film may not be easy. Accordingly, it is necessary to improve the recognition rate of the alignment process.
이에 따라서 OLED 패널 하부에 보호필름을 부착할 때, 얼라인 공정의 인식률을 높이기 위해서는 적정 반사율을 갖는 것이 중요하다. 본 발명에 따른 OLED 패널 하부 보호필름은 적정 반사율을 나타내서 얼라인 공정의 인식률을 향상시키기 위하여 하기 조건 (1) 및 조건 (2)를 모두 만족한다.Accordingly, when the protective film is attached to the lower portion of the OLED panel, it is important to have an appropriate reflectance to increase the recognition rate of the alignment process. The lower protective film of the OLED panel according to the present invention satisfies both the following conditions (1) and (2) in order to exhibit an appropriate reflectance to improve the recognition rate of the alignment process.
조건 (1)로써 400 ~ 700㎚ 파장에서 OLED 패널 하부 보호필름의 반사율이 12 ~ 18%, 바람직하게는 12 ~ 16%일 수 있고, 조건 (2)로써 400 ~ 700㎚ 파장에서 라이너 필름 및 베이스-캐리어 필름의 반사율 비가 1 : 0.3 ~ 3.0, 바람직하게는 0.62 ~ 2.6일 수 있다.As a condition (1), the reflectance of the OLED panel lower protective film at a wavelength of 400 to 700 nm may be 12 to 18%, preferably 12 to 16%, and as a condition (2), a liner film and a base at a wavelength of 400 to 700 nm The reflectance ratio of the carrier film may be 1: 0.3 to 3.0, preferably 0.62 to 2.6.
만일, 상기 조건 (1)에서 400 ~ 700㎚ 파장에서 OLED 패널 하부 보호필름의 반사율이 12 ~ 18%을 만족하지 못할 경우, OLED 패널 하부 보호필름을 OLED 패널 하부에 부착하는 공정에서 라이너 필름의 박리가 용이하지 않고, 이에 따라 불량률이 증가하는 문제가 발생할 수 있다. 또한, 만일 상기 조건 (2)에서 400 ~ 700㎚ 파장에서 라이너 필름 및 베이스-캐리어 필름의 반사율 비가 1 : 0.3 ~ 3.0을 만족하지 못할 경우, OLED 패널 하부에 OLED 패널 하부 보호필름을 부착하는 공정에서 OLED 패널에 정확히 보호필름을 부착할 수 없기 때문에 오류가 발생할 수 있다.If the reflectance of the OLED panel lower protective film does not satisfy 12 to 18% at a wavelength of 400 to 700 nm under the above condition (1), the liner film is peeled off in the process of attaching the OLED panel lower protective film to the lower OLED panel. It is not easy, and thus a problem of increasing a defective rate may occur. In addition, if the reflectance ratio of the liner film and the base-carrier film at the wavelength (400) to 700nm under the above condition (2) does not satisfy 1: 0.3 to 3.0, in the process of attaching the OLED panel lower protective film to the lower OLED panel Errors can occur because the protective film cannot be attached exactly to the OLED panel.
상기 OLED 패널 하부 보호필름은 400 ~ 700㎚ 파장에서 하기 조건 (3)을 만족할 수 있다. The OLED panel lower protective film may satisfy the following condition (3) at a wavelength of 400 to 700 nm.
(3)
Figure PCTKR2018000822-appb-I000002
임.(3)
Figure PCTKR2018000822-appb-I000002
being.
단, a는 라이너 필름의 반사율 편차(%), b는 베이스-캐리어 필름의 반사율 편차(%) 및 c는 OLED 패널 하부 보호필름의 반사율 편차(%)를 나타낸다.Where a is a reflectance deviation (%) of the liner film, b is a reflectance deviation (%) of the base-carrier film, and c is a reflectance deviation (%) of the OLED panel lower protective film.
파장에 따른 반사율의 편차는 파장이 달라짐에 따라 반사율의 변화를 나타내는 의미이며, 편차가 작다는 것은 파장의 변화에 따라 반사율의 증감이 적다는 의미로, 일정한 얼라인 공정의 인식률을 나타낼 수 있다는 것을 의미하고, 편차가 크다는 것은 파장의 변화에 따라 반사율의 증감이 클 수 있다는 의미로, 특정 파장에서 반사율에 과도하게 낮을 수 있고, 이에 따라 얼라인 공정의 인식률이 좋지 않을 수 있다.The variation in reflectance according to the wavelength indicates the change of reflectance as the wavelength is changed, and the small deviation means that the reflectance is small as the wavelength is changed. That is, a large deviation means that the change in the reflectance may be large according to the change of the wavelength, and may be excessively low in the reflectance at a specific wavelength, and thus the recognition rate of the alignment process may not be good.
상기 조건 (3)에서,
Figure PCTKR2018000822-appb-I000003
가 1을 초과하면 베이스-케리어 필름 및/또는Under the above condition (3),
Figure PCTKR2018000822-appb-I000003
Is greater than 1 base-carrier film and / or
OLED 패널 하부 보호필름이 파장에 따라 반사율의 편차가 과도할 수 있으며, 이에 따라 오류 발생이 빈번한 문제가 발생할 수 있다.The protective film under the OLED panel may have excessive variation in reflectance depending on the wavelength, which may cause frequent errors.
또한, 상기 OLED 패널 하부 보호필름은 파장이 길어짐에 따라 반사율이 점진적으로 감소할 수 있다. 구체적으로, 상기 OLED 패널 하부 보호필름은 단파장에서 장파장으로 갈수록 반사율이 점진적으로 감소할 수 있으나, 이에 제한되지는 않는다.In addition, as the wavelength of the OLED panel lower protective film increases, the reflectance may gradually decrease. Specifically, the protective film of the lower OLED panel may be gradually reduced from short wavelength to long wavelength, but is not limited thereto.
한편, 상기 OLED 패널 하부 보호필름은 총 헤이즈(Haze)가 5 ~ 10%, 바람직하게는 5.5 ~ 9.5%일 수 있다. 만일 OLED 패널 하부 보호필름의 헤이즈가 상기 범위를 벗어나면 OLED 패널 하부 보호필름을 OLED 패널 하부에 부착하는 공정에서 라이너 필름의 박리가 용이하지 않고, 이에 따라 불량률이 증가하는 문제가 발생할 수 있다.Meanwhile, the OLED panel lower protective film may have a total haze of 5 to 10%, preferably 5.5 to 9.5%. If the haze of the OLED panel lower protective film is out of the above range, the peeling of the liner film is not easy in the process of attaching the OLED panel lower protective film to the lower OLED panel, thereby increasing the defective rate.
이하, OELD 패널 하부 보호필름에 구비되는 각 구성에 대해 구체적으로 설명한다.Hereinafter, each configuration provided in the OELD panel lower protective film will be described in detail.
먼저, 라이너 필름(110)에 대하여 설명한다.First, the liner film 110 will be described.
상기 라이너 필름(110)은 베이스-캐리어 필름(200)을 보호하는 기능을 담당한다. OLED 패널에 본 발명에 따른 OLED 패널 하부 보호필름을 부착하는 공정에서 얼라인 공정을 수행할 수 있는데, 이 경우 라이너 필름(110)을 가장 먼저 박리한 후 OLED 패널에 베이스-캐리어 필름(200)을 부착할 수 있다.The liner film 110 serves to protect the base-carrier film 200. The alignment process may be performed in the process of attaching the OLED panel lower protective film according to the present invention to the OLED panel. In this case, after peeling the liner film 110 first, the base-carrier film 200 is applied to the OLED panel. I can attach it.
이때, 라이너 필름(110)을 박리하는 단계에서 베이스 필름(120)과 캐리어 필름(130) 간의 박리가 발생하지 않도록 라이너 필름(110)의 이형력은 베이스 필름(120)과 캐리어 필름(130) 간의 박리력에 비하여 상대적으로 작을 수 있으며, 바람직하게는 라이너 필름(110)의 이형력은 5 gf/in 이하, 보다 바람직하게는 2 ~ 4 gf/in일 수 있다. 만일 라이너 필름(110)의 이형력이 5 gf/in을 초과하면 라이너 필름(200)을 베이스-캐리어 필름(200)에서 박리할 때, 베이스 필름(120)과 캐리어 필름(130)간의 박리가 발생할 수 있고, 이에 따라 불량률이 현저히 증가할 수 있다.In this case, the release force of the liner film 110 may be reduced between the base film 120 and the carrier film 130 so that the peeling between the base film 120 and the carrier film 130 does not occur in the peeling of the liner film 110. It may be relatively smaller than the peel force, preferably the release force of the liner film 110 may be 5 gf / in or less, more preferably 2 ~ 4 gf / in. If the release force of the liner film 110 exceeds 5 gf / in, peeling between the base film 120 and the carrier film 130 may occur when the liner film 200 is peeled off from the base-carrier film 200. The failure rate can thus increase significantly.
도 2에 도시된 것과 같이, 라이너 필름(110)이 상술한 바와 같은 이형력을 나타내기 위해서 상기 라이너 필름(110)의 하면을 이형처리(A) 할 수 있다. 상기 이형처리는 당업계에서 통상적으로 이형처리에 사용할 수 있는 물질이라면 제한 없이 사용할 수 있으며, 바람직하게는 실리콘으로 이형처리 하는 것이 적정 수준의 이형력을 나타낼 수 있다.As illustrated in FIG. 2, the bottom surface of the liner film 110 may be released (A) in order for the liner film 110 to exhibit the release force as described above. The release treatment may be used without limitation as long as it is a material that can be commonly used in the release treatment in the art, and preferably release treatment with silicon may exhibit an appropriate level of release force.
한편, 상술한 바와 같이 라이너 필름(110)의 하면을 이형처리(A)함에 따라 상기 라이너 필름(110)은 하기 조건 (4) 및 (5)를 모두 만족할 수 있다.On the other hand, as described above, as the release process (A) of the lower surface of the liner film 110, the liner film 110 may satisfy all of the following conditions (4) and (5).
(4) 520㎚ 파장에서의 반사율 > 440㎚ 파장에서의 반사율(4) reflectance at 520 nm wavelength> reflectance at 440 nm wavelength
(5) 520㎚ 파장에서의 반사율 > 690㎚ 파장에서의 반사율(5) Reflectance at 520 nm wavelength> Reflectance at 690 nm wavelength
상기 조건 (4) 및 (5)를 모두 만족함에 따라, 얼라인 공정에 적합한 반사율을 나타낼 수 있고, 이에 따라 얼라인 공정의 인식률이 높을 수 있다. 상기 조건 (4) 및 (5)를 만족하지 못할 경우, 라이너 필름의 박리 시킨 후 제거 여부를 확인하는 공정에서 오류가 발생하여 라이너가 제거되지 않은 보호필름을 패널에 부착하는 공정이 수행될 수 있음에 따라 불량률이 증가할 수 있다.As all of the above conditions (4) and (5) are satisfied, the reflectance suitable for the alignment process may be exhibited, and thus the recognition rate of the alignment process may be high. If the above conditions (4) and (5) are not satisfied, an error occurs in the process of checking whether the liner film is removed after peeling, so that a process of attaching a protective film to which the liner is not removed may be performed on the panel. As a result, the defective rate may increase.
또한, 라이너 필름(110)은 상기 조건 (1) 및 조건 (2)를 모두 만족하기 위해서, 400 ~ 700㎚ 파장에서 반사율이 5 ~ 13%, 바람직하게는 반사율이 6 ~ 12%일 수 있다. 만일 400 ~ 700㎚ 파장에서 상기 라이너 필름(110)의 반사율이 상기 범위를 만족하지 못하면 얼라인 공정의 인식률이 저하되고, 이에 따라 오류 발생 및 불량률이 높아지는 문제가 발생할 수 있다.In addition, the liner film 110 may have a reflectance of 5 to 13% and preferably a reflectance of 6 to 12% at a wavelength of 400 to 700 nm in order to satisfy both the conditions (1) and (2). If the reflectance of the liner film 110 does not satisfy the range at a wavelength of 400 to 700 nm, the recognition rate of the alignment process may be lowered, thereby causing a problem in that an error occurs and a defective rate is increased.
한편, 본 발명에 따른 라이너 필름(110)은 정전기 발생을 방지하기 위해 적어도 일면이, 바람직하게는 상면과 하면이 대전방지 처리될 수 있다. 대전 방지처리를 통해 정전기 발생을 방지하고, 베이스-캐리어 필름과의 굴절률 차이를 감소시킴으로써 반사율을 향상시킬 수 있으며, 이에 따라 얼라인 공정의 인식률을 더욱 향상시킬 수 있다.On the other hand, the liner film 110 according to the present invention may be at least one surface, preferably the upper surface and the lower surface antistatic treatment to prevent the generation of static electricity. The antistatic treatment can prevent static electricity generation and improve the reflectance by reducing the refractive index difference with the base-carrier film, thereby further improving the recognition rate of the alignment process.
상기 라이너 필름(110)은 당업계에서 통상적으로 라이너 필름에 사용하는 소재라면 제한 없이 사용할 수 있으며, 바람직하게는 PET 기재일 수 있다. 또한, 상기 라이너 필름(110)의 두께는 통상적으로 보호필름에 사용될 수 있는 라이너 필름의 두께라면 제한되지 않으며, 바람직하게는 55 ~ 95㎛, 보다 바람직하게는 60 ~ 90㎛일 수 있으나, 이에 제한되지 않는다.The liner film 110 may be used without limitation as long as it is a material generally used in a liner film in the art, and preferably, may be a PET substrate. In addition, the thickness of the liner film 110 is not usually limited as long as the thickness of the liner film that can be used in the protective film, preferably 55 to 95㎛, more preferably 60 to 90㎛, but not limited thereto. It doesn't work.
다음으로, 베이스-캐리어 필름(200)에 대하여 설명한다.Next, the base-carrier film 200 will be described.
상기 베이스-캐리어 필름(200)은 제1기재(122)의 상면에 형성된 제1점착층(121)을 포함하는 베이스 필름(120) 및 상기 제1기재(122)의 하면에 점착되는 제2점착층(131) 및 상기 제2점착층(131)의 하면에 점착된 제2기재(132)를 포함하는 캐리어 필름(130)을 포함한다.The base-carrier film 200 includes a base film 120 including a first adhesive layer 121 formed on an upper surface of the first substrate 122 and a second adhesive adhered to a lower surface of the first substrate 122. The carrier film 130 includes a layer 131 and a second substrate 132 adhered to a lower surface of the second adhesive layer 131.
먼저, 상기 캐리어 필름(130)은 OLED 패널에 직접적으로 부착되는 베이스 필름(120)의 하부를 보호하는 기능을 담당한다. OLED 패널에 본 발명에 따른 OLED 패널 하부 보호필름을 부착하는 공정에서 얼라인 공정을 수행할 수 있는데, 이 경우 라이너 필름(110)을 먼저 박리하고, OLED 패널에 베이스-캐리어 필름(200)을 부착한 후 베이스-캐리어 필름(200)에서 캐리어 필름(130)을 박리할 수 있다.First, the carrier film 130 is responsible for protecting the lower portion of the base film 120 directly attached to the OLED panel. In the process of attaching the lower protective film of the OLED panel according to the present invention to the OLED panel, an alignment process may be performed. In this case, the liner film 110 is first peeled off, and the base-carrier film 200 is attached to the OLED panel. After that, the carrier film 130 may be peeled off from the base-carrier film 200.
이때, 베이스-캐리어 필름(200)에서 캐리어 필름(130)을 박리하는 단계에서 OLED 패널과 베이스 필름(120) 간의 박리가 발생하지 않도록 베이스 필름(120) 및 캐리어 필름(130) 간의 박리력은 베이스 필름(120)의 제1점착층(121)의 점착력에 비하여 상대적으로 충분히 작을 수 있으며, 바람직하게는 베이스 필름(120) 및 캐리어 필름(130) 간의 박리력은 3 ~ 10 gf/in, 보다 바람직하게는 4 ~ 9 gf/in일 수 있다. 만일 베이스 필름(120) 및 캐리어 필름(130) 간의 박리력이 상기 범위를 만족하지 못할 경우 라이너 필름(110)을 박리하는 단계에서 베이스 필름(120) 및 캐리어 필름(130) 간의 박리가 발생할 수 있고, 베이스 필름(120)에서 캐리어 필름(130)을 박리하는 단계에서 OLED 패널과 베이스 필름(120) 간의 박리가 발생할 수 있다.At this time, the peeling force between the base film 120 and the carrier film 130 is a base so that the peeling between the OLED panel and the base film 120 does not occur in the step of peeling the carrier film 130 in the base-carrier film 200 Compared to the adhesive force of the first adhesive layer 121 of the film 120 may be relatively small enough, preferably the peel force between the base film 120 and the carrier film 130 is 3 ~ 10 gf / in, more preferably Preferably 4 to 9 gf / in. If the peel force between the base film 120 and the carrier film 130 does not satisfy the above range, peeling between the base film 120 and the carrier film 130 may occur in the step of peeling the liner film 110. In the peeling of the carrier film 130 from the base film 120, peeling may occur between the OLED panel and the base film 120.
한편, 본 발명에 따른 캐리어 필름(130)에 포함되는 제2기재(132)는 정전기 발생을 방지하기 위해 적어도 일면이, 바람직하게는 하면이 대전방지 처리될 수 있다. 대전 방지처리를 통해 정전기 발생을 방지하고, 제2점착층(131) 및/또는 베이스 필름(120)과의 굴절률 차이를 감소시킴으로써 반사율을 향상시킬 수 있다.On the other hand, the second substrate 132 included in the carrier film 130 according to the present invention may be at least one surface, preferably the bottom surface antistatic treatment to prevent the occurrence of static electricity. The antistatic treatment may prevent the generation of static electricity and improve the reflectance by reducing the difference in refractive index with the second adhesive layer 131 and / or the base film 120.
상기 제2기재(132)는 당업계에서 통상적으로 보호필름에 사용할 수 있는 소재라면 제한 없이 사용할 수 있으며, 바람직하게는 PET 기재일 수 있다. 또한, 상기 제2기재(132)의 두께는 통상적으로 보호필름에 사용할 수 있는 기재의 두께라면 제한되지 않으며, 바람직하게는 20 ~ 60㎛, 보다 바람직하게는 25 ~ 55㎛일 수 있다.The second substrate 132 may be used without limitation as long as it is a material that can be commonly used in the protective film in the art, preferably, may be a PET substrate. In addition, the thickness of the second substrate 132 is not particularly limited as long as the thickness of the substrate that can be used for the protective film, preferably 20 to 60㎛, more preferably 25 to 55㎛.
상기 캐리어 필름(130)에 포함되는 제2점착층(131)은 당업계에서 통상적으로 점착층을 형성하기 위한 물질이라면 제한 없이 사용할 수 있으며, 바람직하게는 아크릴계 점착층일 수 있다. 또한, 상기 제2점착층(131)의 두께는 통상적으로 보호필름에 포함되는 점착층의 두께라면 제한되지 않으며, 바람직하게는 1 ~ 10㎛일 수 있고, 보다 바람직하게는 2 ~ 9㎛일 수 있다.The second adhesive layer 131 included in the carrier film 130 may be used without limitation as long as it is a material for forming an adhesive layer in the art, and preferably, may be an acrylic adhesive layer. In addition, the thickness of the second adhesive layer 131 is not particularly limited as long as the thickness of the adhesive layer included in the protective film, preferably 1 ~ 10㎛, more preferably 2 ~ 9㎛ can be have.
본 발명에 따른 캐리어 필름(130)에 포함되는 제2점착층(131)은 정전기 발생을 방지하기 위해 대전방지제를 포함할 수 있다. 대전 방지제를 포함함으로써, 정전기 발생을 방지하고, 제2기재(132) 및/또는 베이스 필름(120)과의 굴절률 차이를 감소시킴으로써 반사율을 향상시킬 수 있다.The second adhesive layer 131 included in the carrier film 130 according to the present invention may include an antistatic agent to prevent static electricity. By including the antistatic agent, it is possible to prevent the generation of static electricity and to improve the reflectance by reducing the difference in refractive index with the second substrate 132 and / or the base film 120.
제2점착층(131)에 대한 상세한 설명은 후술하는 제조방법을 통해 설명하도록 한다.Detailed description of the second adhesive layer 131 will be described through a manufacturing method described below.
다음, 베이스 필름(120)은 OLED 패널에 직접적으로 부착되어 OLED 패널의 하부를 보호하는 기능을 담당한다. OLED 패널에 본 발명에 따른 OLED 패널 하부 보호필름을 부착하는 공정에서 얼라인 공정을 수행할 수 있는데, 이 경우 라이너 필름(110)을 먼저 박리하고, OLED 패널에 베이스-캐리어 필름(200)을 부착한 후 베이스-캐리어 필름(200)에서 캐리어 필름(130)을 박리하여 OLED 패널의 하부에 보호필름을 위치시킬 수 있다.Next, the base film 120 is directly attached to the OLED panel and serves to protect the lower portion of the OLED panel. In the process of attaching the lower protective film of the OLED panel according to the present invention to the OLED panel, an alignment process may be performed. In this case, the liner film 110 is first peeled off, and the base-carrier film 200 is attached to the OLED panel. Then, the carrier film 130 may be peeled off from the base-carrier film 200 to place the protective film on the lower portion of the OLED panel.
이때, OLED 패널의 하부에 형성된 보호필름이 박리되지 않도록 베이스 필름(120)의 점착력이 충분히 커야하며, 바람직하게는 제1점착층은 하기 측정방법으로 측정한 점착력이 250 gf/in 이상, 보다 바람직하게는 점착력이 1000 ~ 2300 gf/in일 수 있다.At this time, the adhesive force of the base film 120 should be large enough so that the protective film formed on the lower portion of the OLED panel is not peeled off. Preferably, the first adhesive layer has an adhesive force of 250 gf / in or more, more preferably, measured by the following measuring method. Preferably the adhesion may be 1000 ~ 2300 gf / in.
[측정방법][How to measure]
제1점착층을 글래스(glass)에 부착하여 24시간 경과 후 초당 5mm의 속도로 180° 박리시킬 때의 점착력을 측정하였다.The adhesive force at the time of adhering the first adhesive layer to glass and peeling 180 ° at a rate of 5 mm per second after 24 hours was measured.
만일 상기 측정방법으로 측정한 베이스 필름(120)의 점착력이 250 gf/in 미만이면, OLED 패널에서 상기 베이스 필름(120)이 박리되는 문제가 발생할 수 있다.If the adhesive strength of the base film 120 measured by the measuring method is less than 250 gf / in, the base film 120 may be peeled off the OLED panel.
한편, 본 발명에 따른 베이스 필름(120)에 포함되는 제1기재(122)는 정전기 발생을 방지하기 위해 적어도 일면이, 바람직하게는 하면이 대전방지 처리될 수 있다. 대전 방지처리를 통해 정전기 발생을 방지하고, 제1점착층(121) 및/또는 캐리어 필름(130) 과의 굴절률 차이를 감소시킴으로써 반사율을 향상시킬 수 있다.On the other hand, the first substrate 122 included in the base film 120 according to the present invention may be at least one surface, preferably the bottom surface antistatic treatment to prevent the occurrence of static electricity. Antistatic treatment may be performed to prevent static electricity, and reflectance may be improved by reducing a difference in refractive index between the first adhesive layer 121 and / or the carrier film 130.
상기 제1기재(122)는 당업계에서 통상적으로 보호필름에 사용할 수 있는 소재라면 제한 없이 사용할 수 있으며, 바람직하게는 PET 기재일 수 있다. 또한, 상기 제1기재(122)의 두께는 통상적으로 보호필름에 사용할 수 있는 기재의 두께라면 제한되지 않으며, 바람직하게는 65 ~ 140㎛, 보다 바람직하게는 70 ~ 130㎛일 수 있다.The first substrate 122 may be used without limitation as long as it is a material that can be commonly used in the protective film in the art, and preferably, may be a PET substrate. In addition, the thickness of the first substrate 122 is not particularly limited as long as the thickness of the substrate that can be used in the protective film, preferably 65 ~ 140㎛, more preferably 70 ~ 130㎛.
상기 베이스 필름(120)에 포함되는 제1점착층(121)은 당업계에서 통상적으로 점착층을 형성하기 위한 물질이라면 제한 없이 사용할 수 있으며, 바람직하게는 아크릴계 점착층일 수 있다. 또한, 상기 제1점착층(121)의 두께는 통상적으로 보호필름에 포함되는 점착층의 두께라면 제한되지 않으며, 바람직하게는 10 ~ 30㎛일 수 있고, 보다 바람직하게는 12 ~ 26㎛일 수 있다.The first adhesive layer 121 included in the base film 120 may be used without limitation as long as it is a material for forming an adhesive layer in the art, and preferably, may be an acrylic adhesive layer. In addition, the thickness of the first adhesive layer 121 is not usually limited as long as the thickness of the adhesive layer included in the protective film, preferably may be 10 ~ 30㎛, more preferably may be 12 ~ 26㎛ have.
본 발명에 따른 베이스 필름(120)에 포함되는 제1점착층(121)은 정전기 발생을 방지하기 위해 대전방지제를 포함할 수 있다. 대전 방지제를 포함함으로써, 정전기 발생을 방지하고, 제1기재(122) 및/또는 캐리어 필름(130)과의 굴절률 차이를 감소시킴으로써 반사율을 향상시킬 수 있다.The first adhesive layer 121 included in the base film 120 according to the present invention may include an antistatic agent to prevent static electricity. By including the antistatic agent, it is possible to prevent the generation of static electricity and to improve the reflectance by reducing the difference in refractive index with the first substrate 122 and / or the carrier film 130.
제1점착층(121)에 대한 상세한 설명은 후술하는 제조방법을 통해 설명하도록 한다.Detailed description of the first adhesive layer 121 will be described through the manufacturing method described below.
상기 베이스 필름(120)은 투과율이 85 ~ 98%, 바람직하게는 투과율이 88 ~ 97%, 헤이즈(Haze)가 0.2 ~ 1.0%, 바람직하게는 헤이즈가 0.3 ~ 0.9%일 수 있다. 만일, 베이스 필름(120)이 상기 투과율 범위 및 헤이즈 범위를 만족하지 못하면 목적하는 반사율을 구현 하는데 어려움이 있을 수 있으며, 또한 제품의 출하 검사 과정에서 외관 불량에 대한 검출 능력이 저하되어 불량이 유출되는 문제가 발생 할 수 있다.The base film 120 may have a transmittance of 85 to 98%, preferably a transmittance of 88 to 97%, a haze of 0.2 to 1.0%, and preferably a haze of 0.3 to 0.9%. If the base film 120 does not satisfy the transmittance range and the haze range, it may be difficult to implement a desired reflectivity, and the detection ability of the appearance defect may be degraded during the shipment inspection process of the product, resulting in leakage of the defect. Problems may arise.
또한, 베이스-캐리어 필름(200)은 상기 조건 (1) 및 조건 (2)를 모두 만족하기 위해서, 400 ~ 700㎚ 파장에서 반사율이 8 ~ 13%, 바람직하게는 반사율이 9 ~ 12%일 수 있다. 만일 400 ~ 700㎚ 파장에서 상기 베이스-캐리어 필름(200)의 반사율이 8% 미만이면 얼라인 공정의 인식률이 저하되고, 이에 따라 오류 발생 및 불량률이 높아지는 문제가 발생할 수 있다. 구체적으로, 얼라인 공정의 인식률이 저하됨에 따라 OLED 패널 하부에 부착되는 베이스-캐리어 필름(200)이 잘못 부착되었을 때, OLED 패널과 베이스-캐리어 필름(200)을 다시 박리한 후 부착하여야 하는데, 이런 공정이 반복됨에 따라 OLED 패널 하부에 잔사가 있을 수 있기 때문에 불량률이 높아질 수 있다. 또한, 만일 반사율이 13%를 초과하면 얼라인 공정의 인식률이 저하되고, 이에 따라 오류 발생 및 불량률이 높아지는 문제가 발생할 수 있다.In addition, the base-carrier film 200 may have a reflectance of 8 to 13%, preferably 9 to 12% at a wavelength of 400 to 700 nm in order to satisfy both the conditions (1) and (2). have. If the reflectance of the base-carrier film 200 is less than 8% at a wavelength of 400 to 700 nm, the recognition rate of the alignment process may be lowered, thereby causing a problem in that an error occurs and a defective rate is increased. Specifically, when the base-carrier film 200 attached to the lower portion of the OLED panel is incorrectly attached as the recognition rate of the alignment process is lowered, the OLED panel and the base-carrier film 200 should be peeled off and then attached. As this process is repeated, the defect rate may be high because there may be a residue under the OLED panel. In addition, if the reflectance exceeds 13%, the recognition rate of the alignment process may be lowered, thereby causing a problem that an error occurs and a defective rate increases.
한편, 본 발명에서 명시하는 400 ~ 700㎚ 파장에서의 반사율은 특정파장에서의 반사율뿐만 아니라, 가시광선 영역 대부분의 파장에서 적정 반사율을 나타내기 때문에, 특정 파장에 국한되지 않고 가시광선 영역 대부분의 파장에서 얼라인 공정의 인식률이 높을 수 있다는 것을 의미한다.On the other hand, since the reflectance at the wavelength of 400 to 700 nm specified in the present invention shows not only the reflectance at a specific wavelength but also the proper reflectance at most wavelengths of the visible light region, the wavelength of most of the visible light region is not limited to the specific wavelength. This means that the recognition rate of the alignment process can be high.
상술한 OLED 패널 하부 보호필름은 후술하는 제조방법을 통해 제조될 수 있으나 이에 제한되는 것을 아니다.The above-described OLED panel lower protective film may be manufactured through the manufacturing method described below, but is not limited thereto.
본 발명에 따른 OLED 패널 하부 보호필름은 제1기재(122)의 상부면에 제1주제수지를 포함하는 제1점착조성물을 도포 및 경화하여 제1점착층(121)을 형성시켜서 베이스 필름(120)을 제조하는 단계; 제2기재(132)의 상부면에 제2주제수지를 포함하는 제2점착조성물을 도포 및 경화하여 제2점착층(131)을 형성시켜서 캐리어 필름(130)을 제조하는 단계; 상기 캐리어 필름(130)의 상부면에 상기 베이스 필름(120)을 합지하여 베이스-캐리어 필름(200)을 제조하는 단계; 및 상기 베이스 캐리어 필름(200)의 상부에 라이너 필름(110)을 합지하여 OLED 패널 하부 보호필름을 제조하는 단계;를 포함하여 제조될 수 있다.In the lower panel of the OLED panel according to the present invention, the base film 120 is formed by applying and curing a first adhesive composition including a first main resin on the upper surface of the first substrate 122 to form a first adhesive layer 121. Preparing); Manufacturing a carrier film 130 by forming a second adhesive layer 131 by applying and curing a second adhesive composition including a second subject resin on an upper surface of the second substrate 132; Manufacturing a base-carrier film (200) by laminating the base film (120) on an upper surface of the carrier film (130); And manufacturing the OLED panel lower protective film by laminating the liner film 110 on the base carrier film 200.
먼저, 제1기재(122)의 상부면에 제1주제수지를 포함하는 제1점착조성물을 도포 및 경화하여 제1점착층(121)을 형성시켜서 베이스 필름(120)을 제조하는 단계에 대해 설명한다.First, the step of manufacturing the base film 120 by forming a first adhesive layer 121 by applying and curing a first adhesive composition including a first main resin on the upper surface of the first substrate 122 will be described. do.
상기 제1점착조성물은 제1주제수지를 포함할 수 있고, 제1경화제, 용매 및 대전방지제를 더 포함할 수 있다.The first adhesive composition may include a first subject resin, and may further include a first hardener, a solvent, and an antistatic agent.
상기 제1주제수지는 통상적으로 충분한 점착력을 갖는 점착층 형성에 사용될 수 있는 수지라면 제한 없이 사용할 수 있으며, 바람직하게는 아크릴계 수지일 수 있고, 보다 바람직하게는 폴리 부틸 메타 아크릴레이트일 수 있으며, 보다 더 바람직하게는 중량평균분자량이 200,000 ~ 1,000,000인 폴리 부틸 메타 아크릴레이트, 가장 바람직하게는 중량평균분자량이 400,000 ~ 800,000인 폴리 부틸 메타 아크릴레이트일 수 있다.The first main resin can be used without limitation as long as it is a resin that can be used to form a pressure-sensitive adhesive layer having a sufficient adhesive force, preferably acrylic resin, more preferably polybutyl methacrylate, more More preferably polybutyl methacrylate having a weight average molecular weight of 200,000 to 1,000,000, most preferably polybutyl methacrylate having a weight average molecular weight of 400,000 to 800,000.
또한, 상기 제1경화제는 통상적으로 충분한 점착력을 나타내는 점착층 형성에 사용될 수 있는 경화제라면 제한 없이 사용할 수 있으며, 바람직하게는 에폭시계 경화제를 사용할 수 있고, 보다 바람직하게는 에폭시 아민계 경화제를 사용할 수 있으며, 보다 더 바람직하게는 N,N,N,N'-테트라글리시딜-m-자일렌디아민일 수 있다. 상기 제1경화제는 제1주제수지 100 중량부에 대하여 0.02 ~ 0.08 중량부로, 바람직하게는 0.03 ~ 0.07 중량부로 포함될 수 있다. 만일 상기 제1경화제의 함량이 제1주제수지 100 중량부에 대하여 0.02 중량부 미만이면, 제1점착층이 목적하는 수준으로 경화되지 않을 수 있고, 0.08 중량부를 초과하면, 제1점착층이 과경화되어 점착력이 저하되는 문제가 발생할 수 있다.In addition, the first curing agent may be used without limitation as long as it is a curing agent that can be used to form a pressure-sensitive adhesive layer that usually exhibits sufficient adhesive strength, preferably an epoxy curing agent may be used, and more preferably an epoxy amine curing agent may be used. And even more preferably N, N, N, N'-tetraglycidyl-m-xylenediamine. The first hardener may be included in an amount of 0.02 to 0.08 parts by weight, preferably 0.03 to 0.07 parts by weight, based on 100 parts by weight of the first main resin. If the content of the first hardener is less than 0.02 parts by weight based on 100 parts by weight of the first main resin, the first adhesive layer may not be cured to a desired level. When the content of the first curing agent exceeds 0.08 parts by weight, the first adhesive layer may be excessively hard. It may cause a problem that the adhesive force is lowered.
또한, 상기 용매는 통상적으로 점착층을 형성하는 점착조성물에 사용될 수 있는 용매라면 제한 없이 사용할 수 있으며, 바람직하게는 수계 용매, 알코올계 용매, 케톤계 용매, 아민계 용매, 에스테르계 용매, 아세테이트계 용매, 아미드계 용매, 할로겐화 탄화수소계 용매, 에테르계 용매 및 퓨란계 용매로 이루어진 군에서 선택된 1종 이상을 포함할 수 있고, 보다 바람직하게는 알코올계 용매, 케톤계 용매, 아민계 용매, 에스테르계 용매, 아세테이트계 용매 및 에테르계 용매로 이루어진 군에서 선택된 1종 이상을 포함할 수 있으며, 가장 바람직하게는 메틸 에틸 케톤일 수 있다. 상기 용매는 제1주제수지 100 중량부에 대하여 35 ~ 55 중량부, 바람직하게는 40 ~ 50 중량부 포함될 수 있으나, 이에 제한되지는 않는다.In addition, the solvent may be used without limitation so long as it is a solvent that can be used in the pressure-sensitive adhesive composition to form an adhesive layer, preferably, an aqueous solvent, an alcohol solvent, a ketone solvent, an amine solvent, an ester solvent, an acetate solvent, and the like. It may include one or more selected from the group consisting of a solvent, an amide solvent, a halogenated hydrocarbon solvent, an ether solvent, and a furan solvent, and more preferably an alcohol solvent, a ketone solvent, an amine solvent, or an ester solvent. It may include one or more selected from the group consisting of a solvent, an acetate solvent and an ether solvent, most preferably methyl ethyl ketone. The solvent may include 35 to 55 parts by weight, preferably 40 to 50 parts by weight, based on 100 parts by weight of the first subject resin, but is not limited thereto.
또한, 상기 대전방지제는 통상적으로 정전기를 방지할 수 있는 물질이라면 제한 없이 사용할 수 있으며, 바람직하게는 피리딘계 대전방지제를 사용하는 것이 정전기 방지 및 층간 굴절율 차이를 감소시켜 반사율을 향상시키기 용이하다. 상기 대전방지제는 제1주제수지 100 중량부에 대하여 0.5 ~ 5 중량부로, 바람직하게는 1 ~ 4 중량부로 포함할 수 있다. 만일 대전방지제가 상기 범위를 만족하지 못하면, 목적하는 정전기 방지 효과를 나타낼 수 없고, 층간 굴절율의 차이가 커질 수 있으며, 이에 따라 반사율이 저하되어 얼라인 공정의 인식률이 좋지 않을 수 있다.In addition, the antistatic agent may be used without limitation as long as it is a material capable of preventing static electricity. Preferably, it is easy to use a pyridine-based antistatic agent to improve the reflectance by reducing the antistatic and interlayer refractive index difference. The antistatic agent may include 0.5 to 5 parts by weight, preferably 1 to 4 parts by weight, based on 100 parts by weight of the first main resin. If the antistatic agent does not satisfy the above range, it may not exhibit the desired antistatic effect, the difference in inter-layer refractive index may be large, and thus the reflectance may be lowered and the recognition rate of the alignment process may not be good.
상기 베이스 필름(120)은 하면이 대전방지 처리된 제1기재(122)의 상부면에 상술한 제1점착조성물을 도포 및 경화하여 제1점착층(121)을 형성함으로써 제조할 수 있다.The base film 120 may be manufactured by coating and curing the first adhesive composition described above on the upper surface of the first base 122 having an antistatic treatment on the lower surface thereof to form the first adhesive layer 121.
다음, 제2기재(132)의 상부면에 제2주제수지를 포함하는 제2점착조성물을 도포 및 경화하여 제2점착층(131)을 형성시켜서 캐리어 필름(130)을 제조하는 단계를 설명한다.Next, a step of manufacturing the carrier film 130 by forming a second adhesive layer 131 by applying and curing a second adhesive composition including a second main resin on the upper surface of the second substrate 132 will be described. .
상기 제2점착조성물은 제2주제수지를 포함할 수 있고, 제2경화제, 용매, 대전방지제 및 대전방지제를 더 포함할 수 있다.The second adhesive composition may include a second main resin, and may further include a second hardener, a solvent, an antistatic agent, and an antistatic agent.
상기 제2주제수지는 통상적으로 제1점착층에 비하여 상대적으로 낮은 점착력을 갖는 점착층 형성에 사용될 수 있는 수지라면 제한 없이 사용할 수 있으며, 바람직하게는 아크릴계 수지일 수 있고, 보다 바람직하게는 폴리 메틸 메타 아크릴레이트일 수 있으며, 보다 더 바람직하게는 중량평균분자량이 5,000 ~ 170,000인 폴리 메틸 메타 아크릴레이트, 가장 바람직하게는 중량평균분자량이 50,000 ~ 150,000인 폴리 메틸 메타 아크릴레이트일 수 있다.The second main resin can be used without limitation as long as it can be used to form a pressure-sensitive adhesive layer having a relatively low adhesive strength than the first adhesive layer, preferably acrylic resin, more preferably polymethyl It may be methacrylate, and more preferably polymethyl methacrylate having a weight average molecular weight of 5,000 to 170,000, most preferably polymethyl methacrylate having a weight average molecular weight of 50,000 to 150,000.
또한, 상기 제2경화제는 통상적으로 제1점착층에 비하여 상대적으로 낮은 점착력을 나타내는 점착층 형성에 사용될 수 있는 경화제라면 제한 없이 사용할 수 있으며, 바람직하게는 이소시아네이트계 경화제를 사용할 수 있다. 상기 제2경화제는 제2주제수지 100 중량부에 대하여 2 ~ 8 중량부로, 바람직하게는 3 ~ 7 중량부로 포함될 수 있다. 만일 상기 제2경화제의 함량이 제2주제수지 100 중량부에 대하여 2 중량부 미만이면, 제2점착층이 목적하는 수준으로 경화되지 않을 수 있고, 8 중량부를 초과하면, 제2점착층이 과경화되어 점착력이 저하되는 문제가 발생할 수 있다.In addition, the second curing agent may be used without limitation as long as it is a curing agent that can be used to form a pressure-sensitive adhesive layer having a relatively low adhesive strength than the first adhesive layer, preferably an isocyanate-based curing agent can be used. The second hardener may be included in an amount of 2 to 8 parts by weight, preferably 3 to 7 parts by weight, based on 100 parts by weight of the second main resin. If the content of the second hardener is less than 2 parts by weight based on 100 parts by weight of the second main resin, the second adhesive layer may not be cured to a desired level. If the content of the second adhesive agent exceeds 8 parts by weight, the second adhesive layer may be excessively hard. It may cause a problem that the adhesive force is lowered.
또한, 상기 용매는 통상적으로 점착층을 형성하는 점착조성물에 사용될 수 있는 용매라면 제한 없이 사용할 수 있으며, 바람직하게는 수계 용매, 알코올계 용매, 케톤계 용매, 아민계 용매, 에스테르계 용매, 아세테이트계 용매, 아미드계 용매, 할로겐화 탄화수소계 용매, 에테르계 용매 및 퓨란계 용매로 이루어진 군에서 선택된 1종 이상을 포함할 수 있고, 보다 바람직하게는 알코올계 용매, 케톤계 용매, 아민계 용매, 에스테르계 용매, 아세테이트계 용매 및 에테르계 용매로 이루진 군에서 선택된 1종 이상을 포함할 수 있으며, 가장 바람직하게는 메틸 에틸 케톤일 수 있다. 상기 용매는 제2주제수지 100 중량부에 대하여 60 ~ 80 중량부, 바람직하게는 65 ~ 75 중량부 포함될 수 있으나, 이에 제한되지는 않는다.In addition, the solvent may be used without limitation so long as it is a solvent that can be used in the pressure-sensitive adhesive composition to form an adhesive layer, preferably, an aqueous solvent, an alcohol solvent, a ketone solvent, an amine solvent, an ester solvent, an acetate solvent, and the like. It may include one or more selected from the group consisting of a solvent, an amide solvent, a halogenated hydrocarbon solvent, an ether solvent, and a furan solvent, and more preferably an alcohol solvent, a ketone solvent, an amine solvent, or an ester solvent. It may include one or more selected from the group consisting of a solvent, an acetate solvent and an ether solvent, most preferably methyl ethyl ketone. The solvent may include 60 to 80 parts by weight, preferably 65 to 75 parts by weight, based on 100 parts by weight of the second main resin, but is not limited thereto.
또한, 상기 대전방지제는 통상적으로 정전기를 방지할 수 있는 물질이라면 제한 없이 사용할 수 있으며, 바람직하게는 피리딘계 대전방지제를 사용하는 것이 정전기 방지 및 층간 굴절율 차이를 감소시켜 반사율을 향상시키기 용이하다. 상기 대전방지제는 제2주제수지 100 중량부에 대하여 0.1 ~ 0.4 중량부로, 바람직하게는 0.15 ~ 0.35 중량부로 포함할 수 있다. 만일 대전방지제가 상기 범위를 만족하지 못하면, 목적하는 정전기 방지 효과를 나타낼 수 없고, 층간 굴절율의 차이가 커질 수 있으며, 이에 따라 반사율이 저하되어 얼라인 공정의 인식률이 좋지 않을 수 있다.In addition, the antistatic agent may be used without limitation as long as it is a material capable of preventing static electricity. Preferably, it is easy to use a pyridine-based antistatic agent to improve the reflectance by reducing the antistatic and interlayer refractive index difference. The antistatic agent may be included in an amount of 0.1 to 0.4 parts by weight, preferably 0.15 to 0.35 parts by weight, based on 100 parts by weight of the second main resin. If the antistatic agent does not satisfy the above range, it may not exhibit the desired antistatic effect, the difference in inter-layer refractive index may be large, and thus the reflectance may be lowered and the recognition rate of the alignment process may not be good.
한편, 상기 제2점착조성물은 레벨링제 및 습윤제를 더 포함할 수 있다. 상기 레벨링제 및 습윤제는 당업계에서 통상적으로 점착층을 형성할 때 채용할 수 있는 물질이라면 제한 없이 사용할 수 있다. 바람직하게는, 상기 레벨링제는 폴리아크릴레이트일 수 있고, 상기 습윤제는 폴리에테르실록산일 수 있으나 이에 제한되지는 않는다. 또한, 상기 레벨링제는 제2주제수지 100 중량부에 대하여 0.25 ~ 2.25 중량부, 바람직하게는 0.5 ~ 2 중량부로 포함될 수 있고, 상기 습윤제는 제2주제수지 100 중량부에 대하여 0.2 ~ 0.8 중량부, 바람직하게는 0.3 ~ 0.7 중량부로 포함될 수 있으나, 이에 제한되지 않는다.On the other hand, the second adhesive composition may further include a leveling agent and a wetting agent. The leveling agent and the wetting agent can be used without limitation as long as it is a material that can be employed when forming a pressure-sensitive adhesive layer in the art. Preferably, the leveling agent may be polyacrylate, and the humectant may be polyethersiloxane, but is not limited thereto. The leveling agent may be included in an amount of 0.25 to 2.25 parts by weight, preferably 0.5 to 2 parts by weight, based on 100 parts by weight of the second main resin, and the wetting agent is 0.2 to 0.8 parts by weight based on 100 parts by weight of the second main resin. , Preferably it may be included in 0.3 to 0.7 parts by weight, but is not limited thereto.
상기 캐리어 필름(130)은 하면이 대전방지 처리된 제2기재(132)의 상부면에 상술한 제2점착조성물을 도포 및 경화하여 제2점착층(131)을 형성함으로써 제조할 수 있다.The carrier film 130 may be manufactured by coating and curing the above-described second adhesive composition on the upper surface of the second substrate 132 on which the lower surface is antistatically formed to form the second adhesive layer 131.
다음, 상기 캐리어 필름(130)의 상부면에 상기 베이스 필름(120)을 합지하여 베이스-캐리어 필름(200)을 제조하는 단계 및 상기 베이스 캐리어 필름(200)의 상부에 라이너 필름(110)을 합지하여 OLED 패널 하부 보호필름을 제조하는 단계에 대해 설명한다.Next, manufacturing the base-carrier film 200 by laminating the base film 120 on the upper surface of the carrier film 130 and laminating the liner film 110 on the base carrier film 200. The manufacturing steps of the OLED panel lower protective film will be described.
상기 베이스 필름(120)과 라이너 필름(110)은 당업계에서 통상적으로 사용할 수 있는 방법 및/또는 조건이라면 제한 없이 사용할 수 있으며, 바람직하게는 상온에서 롤 라미네이터를 이용하여 합지 시킬 수 있으나, 이에 제한되지 않는다.The base film 120 and the liner film 110 may be used without limitation as long as it is a method and / or conditions commonly used in the art, and preferably may be laminated using a roll laminator at room temperature, but is not limited thereto. It doesn't work.
또한 베이스-캐리어 필름(200)은 당업계에서 통상적으로 베이스 필름(120)과 캐리어 필름(130)을 합지할 수 있는 방법 및/또는 조건이라면 제한 없이 사용할 수 있으며, 바람직하게는 상온에서 롤 라미네이터를 이용하여 합지시켜 OLED 패널 하부 보호필름을 제조할 수 있으나, 이에 제한되지 않는다.In addition, the base-carrier film 200 may be used in the art without limitation if the method and / or conditions that can conventionally laminate the base film 120 and the carrier film 130, preferably using a roll laminator at room temperature It can be laminated using the OLED panel to produce a protective film, but is not limited thereto.
본 발명은 OLED 패널에 본 발명에 따른 OLED 패널 하부 보호필름을 적용하기 위한 방법으로, 상술한 OLED 패널 하부 보호필름에서 라이너 필름을 박리하는 단계; 라이너 필름을 박리한 베이스-캐리어 필름을 OLED 패널에 부착하는 단계; 및 OLED 패널에 부착한 베이스-캐리어 필름에서 캐리어 필름을 박리하는 단계;를 포함하는 OLED 패널 하부 보호필름의 적용 방법을 제공한다.The present invention provides a method for applying an OLED panel lower protective film according to the present invention to the OLED panel, the step of peeling the liner film from the OLED panel lower protective film; Attaching the base-carrier film having the liner film peeled off to the OLED panel; And peeling the carrier film from the base-carrier film attached to the OLED panel.
먼저, OLED 패널 하부 보호필름에서 라이너 필름을 박리하기 위하여 1차 얼라인 공정을 수행할 수 있는데, 400 ~ 700㎚ 파장의 빛을 조사하여 반사되는 빛을 감지하여 OLED 패널의 하부 보호필름에서 라이너 필름을 박리할 수 있다. 이때, 라이너 필름이 적정 범위의 반사율을 나타내지 못하면 오류가 발생할 수 있음에 따라, 공정 시간 및/또는 비용이 증가하고 불량률이 증가할 수 있다.First, the first alignment process may be performed to peel off the liner film from the OLED panel lower protective film. The liner film is lowered from the lower protective film of the OLED panel by detecting light reflected by irradiating light with a wavelength of 400 to 700 nm. Can be peeled off. In this case, if the liner film does not exhibit a proper range of reflectance, an error may occur, thereby increasing process time and / or cost and increasing defective rate.
다음, 라이너 필름을 박리한 베이스-캐리어 필름을 OLED 패널에 부착하기 위하여 2차 얼라인 공정을 수행할 수 있는데, 400 ~ 700㎚ 파장의 빛을 조사하여 반사되는 빛을 감지하여 OLED 패널에 베이스-캐리어 필름을 부착할 수 있다. 이때, 베이스-캐리어 필름이 적정 범위의 반사율을 나타내지 못하면 OLED 패널에 베이스-캐리어 필름을 정확히 부착하기 용이하지 않음에 따라 오류가 발생할 수 있고, 오류가 발생할 때마다 보호필름 박리 및 부착을 반복할 경우 OLED 패널에 잔사가 있거나 제조 비용 및 시간이 증가하는 문제가 있을 수 있다.Next, a second alignment process may be performed to attach the base-carrier film from which the liner film is peeled off to the OLED panel, and the base panel is applied to the OLED panel by detecting the reflected light by irradiating light with a wavelength of 400 to 700 nm. The carrier film can be attached. At this time, if the base-carrier film does not exhibit a proper range of reflectance, an error may occur because it is not easy to accurately attach the base-carrier film to the OLED panel, and the protective film is repeatedly peeled and attached every time an error occurs. There may be a problem in the OLED panel or an increase in manufacturing cost and time.
다음, OLED 패널에 부착한 베이스-캐리어 필름에서 캐리어 필름을 박리하기 위하여 3차 얼라인 공정을 수행할 수 있는데, 400 ~ 700㎚ 파장의 빛을 조사하여 반사되는 빛을 감지하여 OLED 패널에 부착한 베이스-캐리어 필름에서 캐리어 필름을 박리할 수 있다. 이때, 베이스-캐리어 필름이 적정 범위의 반사율을 나타내지 못하면 오류가 발생할 수 있음에 따라, 공정 시간 및/또는 비용이 증가하고 불량률이 증가할 수 있다.Next, a third alignment process may be performed in order to peel the carrier film from the base-carrier film attached to the OLED panel, which is irradiated with light having a wavelength of 400 to 700 nm to detect the reflected light and attach it to the OLED panel. The carrier film may be peeled off the base-carrier film. In this case, if the base-carrier film does not exhibit a proper range of reflectance, an error may occur, thereby increasing process time and / or cost and increasing defective rate.
본 발명은 상술한 베이스 필름을 포함하여 구현된 유기발광표시장치(10)를 포함한다.The present invention includes an organic light emitting display device 10 including the base film described above.
도 3과 같이 유기발광표시장치(10)는 상기 베이스 필름(120")이 OLED 패널(300) 하부에 부착될 수 있다. 여기서, OLED 패널(300)은 기판, 및 상기 기판 상에 배치된 유기발광소자를 구비한다. 유기발광소자는 제1전극, 유기발광층을 포함하는 중간층, 제2전극이 적층되어 구비될 수 있다. 상기 베이스 필름(120'')은 OLED 패널(300)의 기판 하부에 부착될 수 있다. 구체적으로 충분한 점착력을 갖는 제1점착층(121") 및 OLED 패널(300)을 보호하는 기능을 하는 제1기재(122")를 포함하는 베이스 필름(120")을 포함함에 따라, OLED 패널(300)의 하부를 보호하며 OLED 패널(300)의 정전기 발생을 방지할 수 있다.As shown in FIG. 3, in the organic light emitting display device 10, the base film 120 ″ may be attached to the lower portion of the OLED panel 300. Here, the OLED panel 300 may be a substrate and an organic layer disposed on the substrate. The organic light emitting device may include a first electrode, an intermediate layer including an organic light emitting layer, and a second electrode. The base film 120 ″ may be disposed below the substrate of the OLED panel 300. Specifically, the base film 120 "includes a first adhesive layer 121" having sufficient adhesive force and a first substrate 122 "functioning to protect the OLED panel 300. Accordingly, the lower portion of the OLED panel 300 may be protected and static electricity may be prevented from the OLED panel 300.
한편, 본 발명의 OLED 패널 하부 보호필름은 반사율이 높아 얼라인(align) 공정의 인식률이 현저히 향상되고, 대전방지 처리를 통해 정전기 발생을 방지할 수 있는 동시에 OLED 패널과의 점착력이 우수한 효과를 나타낼 수 있다.On the other hand, the lower protective film of the OLED panel of the present invention has a high reflectance significantly improves the recognition rate of the alignment process, it is possible to prevent the generation of static electricity through the antistatic treatment and at the same time exhibits an excellent adhesion with the OLED panel. Can be.
하기의 실시예를 통하여 본 발명을 더욱 구체적으로 설명하기로 하지만, 하기 실시예가 본 발명의 범위를 제한하는 것은 아니며, 이는 본 발명의 이해를 돕기 위한 것으로 해석되어야 할 것이다.Although the present invention will be described in more detail with reference to the following examples, the following examples are not intended to limit the scope of the present invention, which will be construed as to aid the understanding of the present invention.
<실시예 1><Example 1>
(1) 베이스 필름 제조 및 라이너 필름 합지(1) base film manufacturing and liner film lamination
제1주제수지로 중량평균분자량이 600,000인 폴리 부틸 메타 아크릴레이트(부림케미칼, BA8900), 상기 제1주제수지 100 중량부에 대하여 제1경화제로 N,N,N,N'-테트라글리시딜-m-자일렌디아민(부림케미칼, 45S) 0.05 중량부, 대전방지제로 피리딘계 대전방지제(KOEI, IL-P14-2) 2.5 중량부 및 용매로 메틸 에틸 케톤(MEK) 45 중량부를 혼합하여 제1점착조성물을 제조하였다.Polybutyl methacrylate having a weight average molecular weight of 600,000 as the first main resin (Burim Chemical, BA8900), N, N, N, N'-tetraglycidyl as the first hardener based on 100 parts by weight of the first main resin 0.05 parts by weight of -m-xylenediamine (Burim Chemical, 45S), 2.5 parts by weight of pyridine antistatic agent (KOEI, IL-P14-2) as an antistatic agent and 45 parts by weight of methyl ethyl ketone (MEK) as a solvent One adhesive composition was prepared.
두께 75㎛의 PET 기재의 하부면에 PEDOT/PSS(폴리(3,4-에틸렌디옥시티오펜) 폴리스티렌 술포네이트)를 박막 도포하여 대전방지 처리한 제1기재 상부면에 상기 제1점착조성물을 도포하여 베이스 필름을 제조하고, 두께 75㎛의 PET 기재의 상부면 및 하부면에 PEDOT/PSS(폴리(3,4-에틸렌디옥시티오펜) 폴리스티렌 술포네이트)를 박막 도포하여 대전방지 처리하고, 하부면을 실리콘 이형제를 박막 도포하여 실리콘 이형처리한 라이너 필름을 상온에서 롤 라미네이터를 이용하여 합지한 후 50℃에서 48시간 동안 경화시켜서, 두께 13㎛의 제1점착층이 형성된 베이스 필름 및 상기 베이스 필름 상부면에 적층된 라이너 필름을 제조하였다.A thin film of PEDOT / PSS (poly (3,4-ethylenedioxythiophene) polystyrene sulfonate) was applied to a lower surface of a PET substrate having a thickness of 75 μm to apply the first adhesive composition to an upper surface of an antistatically treated first substrate. To produce a base film, and a thin film of PEDOT / PSS (poly (3,4-ethylenedioxythiophene) polystyrene sulfonate) was applied to the upper surface and the lower surface of a PET substrate having a thickness of 75 μm to prevent antistatic treatment, and to the lower surface. The thin film was coated with a silicone release agent and the silicone release treatment liner film was laminated at room temperature using a roll laminator and cured at 50 ° C. for 48 hours to form a base film and a base film on which a first adhesive layer having a thickness of 13 μm was formed. A liner film laminated on the side was prepared.
(2) 캐리어 필름 제조(2) carrier film manufacturing
제2주제수지로 중량평균분자량이 100,000인 폴리 메틸 메타 아크릴레이트(수산고분자, SA609), 상기 제2주제수지 100 중량부에 대하여 제2경화제로 폴리이소시아네이트(수산고분자, SAX802) 5 중량부, 대전방지제로 피리딘계 대전방지제(KOEI, IL-P14-2) 0.25 중량부, 레벨링제로 폴리아크릴레이트(BYK, BYK361N) 1.25 중량부, 습윤제로 폴리에테르실록산(TEGO, WET270) 및 용매로 메틸 에틸 케톤(MEK) 70 중량부를 혼합하여 제2점착조성물을 제조하였다.Polymethyl methacrylate having a weight average molecular weight of 100,000 as the second main resin (hydroxyl polymer, SA609), 5 parts by weight of polyisocyanate (hydroxyl polymer, SAX802) as the second hardener based on 100 parts by weight of the second main resin 0.25 parts by weight of a pyridine antistatic agent (KOEI, IL-P14-2) as an inhibitor, 1.25 parts by weight of a polyacrylate (BYK, BYK361N) as a leveling agent, polyethersiloxane (TEGO, WET270) as a wetting agent and methyl ethyl ketone as a solvent ( MEK) 70 parts by weight of the mixture to prepare a second adhesive composition.
두께 38㎛의 PET 기재의 하부면에 PEDOT/PSS(폴리(3,4-에틸렌디옥시티오펜) 폴리스티렌 술포네이트)를 박막 도포하여 대전방지 처리한 제2기재 상부면에 상기 제2점착조성물을 도포하고, 50℃에서 48시간 동안 경화시켜서 두께 5㎛의 제2점착층이 형성된 캐리어 필름을 제조하였다.A thin film of PEDOT / PSS (poly (3,4-ethylenedioxythiophene) polystyrene sulfonate) was applied to the lower surface of the PET substrate having a thickness of 38 μm to apply the second adhesive composition to the upper surface of the second substrate which was antistatically treated. Then, the carrier film was cured at 50 ° C. for 48 hours to form a second adhesive layer having a thickness of 5 μm.
(3) OLED 하부 보호필름 제조(3) OLED lower protective film manufacturing
상기 라이너 필름과 합지된 베이스 필름 및 캐리어 필름을 25℃에서 롤 라미네이터를 이용하여 합지시켜 OLED 하부 보호필름을 제조하였다.The base film and the carrier film laminated with the liner film were laminated at 25 ° C. using a roll laminator to prepare an OLED lower protective film.
<실시예 2 ~ 9 및 비교예 1 ~ 8><Examples 2 to 9 and Comparative Examples 1 to 8>
실시예 1과 동일하게 실시하여 제조하되, 하기 표 1 내지 표 3과 같이 제1점착조성물, 제2점착조성물의 대전방지제 함량, 제1기재, 제2기재 및 라이너 필름의 대전방치 처리 유무 등을 변경하여 표 1 내지 표 3과 같은 OLED 패널 하부 보호필름을 제조하였다.Manufactured in the same manner as in Example 1, the antistatic agent content of the first adhesive composition, the second adhesive composition, the presence of the first substrate, the second substrate and the antistatic treatment of the liner film as shown in Table 1 to Table 3 By changing to prepare a lower protective film of the OLED panel shown in Table 1 to Table 3.
<실험예 1>Experimental Example 1
1. 반사율 측정 1. Reflectance measurement
실시예 및 비교예에 따라 제조된 OLED 패널 하부 보호필름에 대하여, 라이너 필름의 반사율, 베이스-캐리어 필름의 반사율 및 OLED 패널 하부 보호필름의 반사율을 측정하였다. 구체적으로 분광측색계(코니카 미놀타, CM3700A)의 반사율 측정 모드를 이용하여 400nm ~ 700nm 파장에서의 라이너 필름의 반사율, 베이스-캐리어 필름의 반사율 및 OLED 패널 하부 보호필름의 반사율 평균값을 측정하여 하기 표 1 내지 표 3에 나타내었다.For the OLED panel lower protective film prepared according to Examples and Comparative Examples, the reflectance of the liner film, the reflectance of the base-carrier film and the reflectance of the OLED panel lower protective film were measured. Specifically, by using the reflectance measurement mode of the spectrophotometer (Konica Minolta, CM3700A) The reflectance of the liner film, the reflectance of the base-carrier film, and the reflectance average value of the OLED panel lower protective film at wavelengths of 400 nm to 700 nm were measured and shown in Tables 1 to 3 below.
2. 얼라인 공정 오류 평가2. Align process error assessment
실시예 및 비교예에 따라 제조된 OLED 패널 하부 보호필름을 OLED 패널에 얼라인하는 공정에 대하여 하기와 같이 3차례의 얼라인 공정의 오류를 평가하여 하기 표 1 내지 표 3에 나타내었다.For the process of aligning the OLED panel lower protective film prepared according to the Examples and Comparative Examples to the OLED panel, the error of the three alignment process as described below is evaluated in Tables 1 to 3 below.
2-(1) 1차 얼라인 공정 오류 평가2- (1) Primary Alignment Process Error Assessment
실시예 및 비교예에 따라 제조된 OLED 패널 하부 보호필름을 OLED 패널에 얼라인하는 공정 중, OLED 패널 하부 보호필름에서 라이너 필름을 박리하는 단계에서, 1차례 수행하여 박리되는 경우 - ○, 2차례 이상 수행하여 박리되는 경우 - ×로 하여 1차 얼라인 공정의 오류를 평가하였다. 이를 100회 반복 수행하여 100회 중 오류가 발생한 비율을 하기 표 1 내지 표 3에 나타내었다.In the process of aligning the OLED panel lower protective film prepared according to the Examples and Comparative Examples to the OLED panel, in the step of peeling the liner film from the OLED panel lower protective film, it is peeled by performing once-○, 2 times When it peeled off by performing above, the error of the primary alignment process was evaluated as -x. Repeatedly performed 100 times, the error occurrence rate of 100 times is shown in Tables 1 to 3 below.
2-(2) 2차 얼라인 공정 오류 평가2- (2) Secondary Alignment Process Error Assessment
실시예 및 비교예에 따라 제조된 OLED 패널 하부 보호필름을 OLED 패널에 얼라인하는 공정 중, 라이너 필름이 박리된 베이스-캐리어 필름을 부착하는 단계에서, 피착면인 OLED 패널을 벗어나는 면적이 베이스-캐리어 필름의 전체 면적 중 0.1% 이하인 경우 - ○, 전체 면적 중 0.1% 를 초과하는 경우 - ×로 하여 2차 얼라인 공정의 오류를 평가하였다. 이를 100회 반복 수행하여 100회 중 오류가 발생한 비율을 하기 표 1 내지 표 3에 나타내었다.In the process of aligning the OLED panel lower protective film prepared according to the Examples and Comparative Examples to the OLED panel, in the step of attaching the base-carrier film peeled off the liner film, the area beyond the OLED panel as the adhered surface is the base- 0.1% or less of the total area of the carrier film-○, 0.1% of the total area When exceeding, the error of the secondary alignment process was evaluated as -x. Repeatedly performed 100 times, the error occurrence rate of 100 times is shown in Tables 1 to 3 below.
2-(3) 3차 얼라인 공정 오류 평가2- (3) 3rd align process error assessment
실시예 및 비교예에 따라 제조된 OLED 패널 하부 보호필름을 OLED 패널에 얼라인하는 공정 중, 부착된 베이스-캐리어 필름에서 캐리어 필름을 박리하는 단계에서, 1차례 수행하여 박리되는 경우 - ○, 2차례 이상 수행하여 박리되는 경우 - ×로 하여 3차 얼라인 공정의 오류를 평가하였다. 이를 100회 반복 수행하여 100회 중 오류가 발생한 비율을 하기 표 1 내지 표 3에 나타내었다.When peeling the carrier film from the attached base-carrier film during the process of aligning the OLED panel lower protective film prepared according to the embodiment and the comparative example to the OLED panel, once peeled-○, 2 When peeling was performed more than once, the error of the 3rd alignment process was evaluated as -x. Repeatedly performed 100 times, the error occurrence rate of 100 times is shown in Tables 1 to 3 below.
구분division 실시예1Example 1 실시예2Example 2 실시예3Example 3 실시예4Example 4 실시예5Example 5
제1점착 조성물First adhesive composition 대전방지제 함량(중량부)Antistatic content (parts by weight) 2.52.5 1One 44 2.52.5 2.52.5
제2점착 조성물Second adhesive composition 대전방지제 함량(중량부)Antistatic content (parts by weight) 0.250.25 0.250.25 0.250.25 0.150.15 0.350.35
대전방지 처리 유무Antistatic treatment 제1기재 하면The first ○○ ○○ ○○ ○○ ○○
제2기재 하면The second ○○ ○○ ○○ ○○ ○○
라이너 필름 상면Liner film top ○○ ○○ ○○ ○○ ○○
라이너 필름 하면Liner film ○○ ○○ ○○ ○○ ○○
반사율reflectivity 라이너 필름(%)Liner film (%) 8.28.2 8.28.2 8.28.2 8.28.2 8.28.2
베이스-캐리어 필름(%)Base-carrier film (%) 10.110.1 11.811.8 9.39.3 11.211.2 9.69.6
라이너/베이스-캐리어 반사율 비Liner / Base-Carrier Reflectance Ratio 1:1.231: 1.23 1:1.441: 1.44 1:1.131: 1.13 1:1.371: 1.37 1:1.171: 1.17
OLED 패널 하부 보호필름(%)OLED panel lower protection film (%) 12.912.9 15.315.3 12.112.1 14.914.9 12.312.3
얼라인 공정 오류 평가Align process error assessment 1차 얼라인(%)Primary Alignment (%) 1One 1One 1One 1One 1One
2차 얼라인(%)Second alignment (%) 00 00 22 00 1One
3차 얼라인(%)3rd alignment (%) 00 00 1One 00 1One
구분division 실시예6Example 6 실시예7Example 7 실시예8Example 8 실시예9Example 9 비교예1Comparative Example 1 비교예2Comparative Example 2
제1점착 조성물First adhesive composition 대전방지제 함량(중량부)Antistatic content (parts by weight) 2.52.5 2.52.5 2.52.5 2.52.5 0.10.1 77
제2점착 조성물Second adhesive composition 대전방지제 함량(중량부)Antistatic content (parts by weight) 0.250.25 0.250.25 0.250.25 0.250.25 0.250.25 0.250.25
대전방지 처리 유무Antistatic treatment 제1기재 하면The first ×× ○○ ○○ ○○ ○○ ○○
제2기재 하면The second ○○ ×× ○○ ○○ ○○ ○○
라이너 필름 상면Liner film top ○○ ○○ ×× ○○ ○○ ○○
라이너 필름 하면Liner film ○○ ○○ ○○ ×× ○○ ○○
반사율reflectivity 라이너 필름(%)Liner film (%) 8.28.2 8.28.2 3.83.8 4.14.1 8.28.2 8.28.2
베이스-캐리어 필름(%)Base-carrier film (%) 5.45.4 5.85.8 10.110.1 10.110.1 14.114.1 6.86.8
라이너/베이스-캐리어 반사율 비Liner / Base-Carrier Reflectance Ratio 1:0.661: 0.66 1:0.711: 0.71 1:2.651: 2.65 1:2.461: 2.46 1:1.721: 1.72 1:0.831: 0.83
OLED 패널 하부 보호필름(%)OLED panel lower protection film (%) 11.311.3 11.611.6 11.611.6 11.811.8 18.118.1 11.711.7
얼라인 공정 오류 평가Align process error assessment 1차 얼라인(%)Primary Alignment (%) 1One 1One 88 99 1One 1One
2차 얼라인(%)Second alignment (%) 88 77 00 00 55 99
3차 얼라인(%)3rd alignment (%) 66 66 00 00 77 88
구분division 비교예3Comparative Example 3 비교예4Comparative Example 4 비교예5Comparative Example 5 비교예6Comparative Example 6 비교예7Comparative Example 7 비교예8Comparative Example 8
제1점착 조성물First adhesive composition 대전방지제 함량(중량부)Antistatic content (parts by weight) 2.52.5 2.52.5 2.52.5 2.52.5 1One 44
제2점착 조성물Second adhesive composition 대전방지제 함량(중량부)Antistatic content (parts by weight) 0.030.03 1One 0.250.25 0.250.25 0.150.15 0.350.35
대전방지 처리 유무Antistatic treatment 제1기재 하면The first ○○ ○○ ○○ ×× ○○ ○○
제2기재 하면The second ○○ ○○ ○○ ×× ○○ ○○
라이너 필름 상면Liner film top ○○ ○○ ×× ○○ ○○ ○○
라이너 필름 하면Liner film ○○ ○○ ×× ○○ ○○ ○○
반사율reflectivity 라이너 필름(%)Liner film (%) 8.28.2 8.28.2 4.04.0 8.28.2 8.28.2 8.28.2
베이스-캐리어 필름(%)Base-carrier film (%) 13.713.7 6.96.9 10.110.1 2.42.4 19.819.8 5.15.1
라이너/베이스-캐리어 반사율 비Liner / Base-Carrier Reflectance Ratio 1:1.671: 1.67 1:0.841: 0.84 1:2.531: 2.53 1:0.291: 0.29 1:2.411: 2.41 1:0.621: 0.62
OLED 패널 하부 보호필름(%)OLED panel lower protection film (%) 17.917.9 11.811.8 11.611.6 9.99.9 22.122.1 10.910.9
얼라인 공정 오류 비율Align process error rate 1차 얼라인(%)Primary Alignment (%) 1One 1One 1212 1One 1One 1One
2차 얼라인(%)Second alignment (%) 66 77 00 1515 1010 99
3차 얼라인(%)3rd alignment (%) 77 1010 00 1616 99 77
상기 표 1 내지 표 3에서 알 수 있듯이,As can be seen in Tables 1 to 3,
본 발명에 따른 바람직한 대전방지제의 함량 및 대전 방지 처리 유무를 만족하는 실시예 1 ~ 5가, 이 중에서 하나라도 누락된 실시예 6 ~ 9 및 비교예 1 ~ 8에 비하여 얼라인 공정의 오류가 현저히 적은 것을 확인할 수 있다.Examples 1 to 5 satisfying the content of the preferred antistatic agent and the presence or absence of antistatic treatment according to the present invention, the error of the alignment process is remarkably significantly compared to Examples 6 to 9 and Comparative Examples 1 to 8, in which any one of them is missing. You can see little.
구체적으로, 제1기재의 하면을 대전방지 처리한 실시예 1이, 제1기재의 하면의 대전방지 처리하지 않은 실시예 6에 비하여 얼라인 공정의 오류가 적었다. 또한, 제2기재의 하면을 대전방지 처리한 실시예 1이, 제2기재의 하면의 대전방지 처리하지 않은 실시예 7에 비하여 얼라인 공정의 오류가 적었다.Specifically, Example 1, in which the lower surface of the first substrate was antistatically treated, had fewer errors in the alignment process than Example 6 in which the antistatic treatment of the lower surface of the first substrate was not. In addition, Example 1 in which the lower surface of the second substrate was antistatically treated had fewer errors in the alignment process than Example 7 in which the lower surface of the second substrate was not antistatically treated.
또한, 라이너 필름의 상면 및 하면을 대전방지 처리한 실시예 1이, 라이너 필름의 상면을 대전방지 처리하지 않은 실시예 8 및 라이너 필름의 하면을 대전방지 처리하지 않은 실시예 9에 비하여 얼라인 공정의 오류가 적었다. In addition, Example 1 in which the top and bottom surfaces of the liner film were antistatically treated was compared with Example 8 in which the top surface of the liner film was antistatically treated and Example 9 in which the bottom surface of the liner film was not antistatically treated. There were fewer errors.
또한, 제1점착조성물에 포함되는 대전방지제의 함량이 본 발명의 바람직한 범위 내에 있는 실시예 1 ~ 3이, 이를 만족하지 못하는 비교예 1 및 비교예 2에 비하여 얼라인 공정의 오류가 현저히 적은 것을 확인할 수 있다.In addition, Examples 1 to 3 in which the content of the antistatic agent included in the first adhesive composition is within the preferred range of the present invention, the error of the alignment process is significantly smaller than that of Comparative Examples 1 and 2, which does not satisfy this. You can check it.
또한, 제2점착조성물에 포함되는 대전방지제의 함량이 본 발명의 바람직한 범위 내에 있는 실시예 1, 4 및 5가, 이를 만족하지 못하는 비교예 3 및 비교예 4에 비하여 얼라인 공정의 오류가 현저히 적은 것을 확인할 수 있다.In addition, Examples 1, 4 and 5 in the content of the antistatic agent included in the second adhesive composition is within the preferred range of the present invention, compared to Comparative Examples 3 and 4, which does not satisfy this error in the alignment process significantly You can see little.
또한, 라이너 필름의 상면 및 하면을 대전방지 처리한 실시예 1이, 라이너 필름의 상면 및 하면을 모두 대전방지 처리하지 않은 비교예 5에 비하여 얼라인 공정의 오류가 현저히 적은 것을 확인할 수 있다.In addition, it can be seen that Example 1, in which the upper and lower surfaces of the liner film were antistatically treated, had significantly fewer errors in the alignment process than Comparative Example 5 in which both the upper and lower surfaces of the liner film were antistatically treated.
또한, 제1기재의 하면 및 제2기재의 하면을 대전방지 처리한 실시예 1이, 제1기재의 하면 및 제2기재의 하면을 대전방지 처리하지 않은 비교예 6에 비하여 얼라인 공정의 오류가 월등히 적었다.In addition, Example 1 in which the lower surface of the first substrate and the lower surface of the second substrate were antistatically treated, compared to Comparative Example 6 in which the lower surface of the first substrate and the lower surface of the second substrate were not antistatically treated, and the alignment process was in error. Was much less.
또한, 본 발명에 따른 조건 (1) 및 (2)를 모두 만족하는 실시예 1이, 조건 (1)을 만족하지 못하는 비교예 7 및 비교예 8에 비하여 얼라인 공정의 오류가 월등히 적었다.In addition, Example 1, which satisfies both the conditions (1) and (2) according to the present invention, had significantly fewer errors in the alignment process than Comparative Example 7 and Comparative Example 8, which did not satisfy the condition (1).
<실시예 10 ~ 17><Examples 10 to 17>
실시예 1과 동일하게 실시하여 제조하되, 하기 표 4 내지 표 5와 같이 제1주제수지, 제2주제수지의 분자량 및 라이너 필름 하면의 이형처리 유무 등을 변경하여 표 4 및 표 5와 같은 OLED 패널 하부 보호필름을 제조하였다.Manufactured and carried out in the same manner as in Example 1, the OLEDs of Tables 4 and 5 by changing the molecular weight of the first subject resin, the second subject resin and the presence or absence of the release treatment on the bottom surface of the liner film as shown in Table 4 to Table 5 A lower panel protective film was prepared.
<실험예 2>Experimental Example 2
1. 이형력, 점착력 및 박리력 평가1. Evaluation of Release Force, Adhesive Force and Peel Force
실시예 1 및 10 ~ 17에 따라 제조된 OLED 패널 하부 보호필름에 대하여 OLED 패널 하부 보호필름을 1인치 폭으로 재단한 후 초당 40mm의 속도로 180°로 박리시켜 라이너 이형력을 측정하였고, OLED 패널 하부 보호필름을 1인치 폭으로 재단하여 라이너 필름을 제거한 후 표면을 세정한 Glass에 부착하여 24시간 경과 후 초당 5mm의 속도로 180°로 박리 시켜 제1점착층의 점착력을 측정하였으며, 베이스-캐리어 필름을 1인치 폭으로 재단하고 캐리어 필름을 초당 40mm의 속도로 180°로 박리시켜 베이스 필름과 캐리어 필름 간의 박리력을 측정하여 하기 표 4 및 표 5에 나타내었다.The OLED panel lower protective film prepared according to Examples 1 and 10 to 17 was cut to 1 inch width of the OLED panel lower protective film, and then peeled at 180 ° at a speed of 40 mm per second to measure the liner release force. The lower protective film was cut to 1 inch width to remove the liner film, and then the surface was attached to the cleaned glass. After 24 hours, the lower protective film was peeled at 180 ° at a speed of 5 mm per second to measure the adhesive strength of the first adhesive layer. The film was cut to 1 inch wide and the carrier film was peeled off at 180 ° at a speed of 40 mm per second to measure the peel force between the base film and the carrier film and are shown in Tables 4 and 5 below.
2. 얼라인 공정의 작업성 평가 2. Evaluation of workability of alignment process
실시예 1 및 10 ~ 17에 따라 제조된 OLED 패널 하부 보호필름을 OLED 패널에 얼라인하는 공정에 대하여 작업성을 평가하였다.Workability was evaluated for the process of aligning the OLED panel lower protective film prepared according to Examples 1 and 10 to 17 to the OLED panel.
OLED 패널 하부 보호필름에서 라이너 필름을 박리하는 1차 얼라인 공정에서 라이너 필름을 박리할 때 라이너 필름만 박리되는 경우 - ○, 베이스 필름과 캐리어 필름 간의 박리가 발생하는 경우 - ×로 하여, 1차 얼라인 공정의 작업성을 평가하였고, OLED 패널에 부착된 베이스-캐리어 필름에서 캐리어 필름을 박리하는 공정에서 1번 수행하여 캐리어 필름이 박리되는 경우 - ○, 2번 이상 수행하여 캐리어 필름이 박리되는 경우 - ×로 하여, 캐리어 필름 제거 공정(3차 얼라인 공정)의 작업성을 평가하여 하기 표 4 및 표 5에 나타내었다.When only the liner film is peeled off when the liner film is peeled off in the first alignment process of peeling the liner film from the OLED panel lower protective film-○, when the peeling between the base film and the carrier film occurs- When the workability of the alignment process was evaluated, and the carrier film is peeled off by performing one time in the process of peeling the carrier film from the base-carrier film attached to the OLED panel-○, the carrier film is peeled off by performing at least twice In the case of -x, the workability of the carrier film removing step (third alignment step) was evaluated and shown in Tables 4 and 5 below.
3. OLED 패널 하부 보호필름 점착성능 평가3. Evaluation of adhesion performance of protective film under OLED panel
실시예 1 및 10 ~ 17에 따라 제조된 OLED 패널 하부 보호필름에 OLED 패널에 하부 보호필름을 상온에서 롤 라미네이터로 부착한 다음, 24시간 경과시킨 후 온도 60℃ 및 습도 90%의 조건하에 500시간 동안 방치하여 부착된 하부 보호필름이 박리 현상이 일어나는지 여부를 확인하는 방법으로, 박리 현상이 발생하지 않는 경우 - ○, 박리 현상이 발생하는 경우 - ×로 하여 베이스 필름 점착 성능을 평가하였다. 이를 하기 표 4 및 표 5에 나타내었다.After attaching the lower protective film to the OLED panel with a roll laminator at room temperature to the OLED panel lower protective film prepared according to Examples 1 and 10 to 17, and then passed for 24 hours, 500 hours under conditions of temperature 60 ℃ and 90% humidity The base film adhesion performance was evaluated as a method of confirming whether or not the peeling phenomenon of the lower protective film attached by leaving during the peeling phenomenon does not occur-○, when the peeling phenomenon occurs-×. This is shown in Tables 4 and 5 below.
구분division 실시예1Example 1 실시예10Example 10 실시예11Example 11 실시예12Example 12 실시예13Example 13
라이너 필름 하면 이형처리 유무Liner film under mold release ○○ ×× ○○ ○○ ○○
제1주제수지 중량평균분자량Weight average molecular weight of the first major resin 600,000600,000 600,000600,000 100,000100,000 400,000400,000 800,000800,000
제2주제수지 중량평균분자량Second average resin weight average molecular weight 100,000100,000 100,000100,000 100,000100,000 100,000100,000 100,000100,000
라이너 필름이형력(gf/in)Liner Film Release Force (gf / in) 3.23.2 9.89.8 3.23.2 3.23.2 3.23.2
제1점착층점착력(gf/in)First adhesive layer adhesion (gf / in) 16801680 16801680 207207 10291029 22632263
베이스 필름/캐리어 필름 박리력(gf/in)Base Film / Carrier Film Peeling Force (gf / in) 6.66.6 6.66.6 6.66.6 6.66.6 6.66.6
작업성　Workability 1차 얼라인1st alignment ○○ ×× ○○ ○○ ○○
3차 얼라인3rd alignment ○○ ○○ ○○ ○○ ○○
베이스 필름 점착성능　Base Film Adhesive Performance ○○ ○○ ×× ○○ ○○
구분division 실시예14Example 14 실시예15Example 15 실시예16Example 16 실시예17Example 17
라이너 필름 하면 이형처리 유무Liner film under mold release ○○ ○○ ○○ ○○
제1주제수지 중량평균분자량Weight average molecular weight of the first major resin 600,000600,000 600,000600,000 600,000600,000 600,000600,000
제2주제수지 중량평균분자량Second average resin weight average molecular weight 4,0004,000 50,00050,000 150,000150,000 220,000220,000
라이너 필름이형력(gf/in)Liner Film Release Force (gf / in) 3.23.2 3.23.2 3.23.2 3.23.2
제1점착층점착력(gf/in)First adhesive layer adhesion (gf / in) 16801680 16801680 16801680 16801680
베이스 필름/캐리어 필름 박리력(gf/in)Base Film / Carrier Film Peeling Force (gf / in) 1.31.3 4.14.1 8.88.8 12.212.2
작업성　Workability 1차 얼라인1st alignment ×× ○○ ○○ ○○
3차 얼라인3rd alignment ○○ ○○ ○○ ××
베이스 필름 점착성능　Base Film Adhesive Performance ○○ ○○ ○○ ○○
상기 표 4 및 표 5에서 알 수 있듯이,As can be seen in Table 4 and Table 5,
본 발명에 따른 주제수지의 중량평균분자량 및 라이너 필름의 하면 이형처리 유무를 만족하는 실시예 1, 12, 13, 15 및 16이, 이 중에서 하나라도 누락된 실시예 10, 11, 14 및 17에 비하여 1차 얼라인 및 3차 얼라인의 작업성 및 베이스 필름의 점착성능이 우수하였다.Examples 1, 12, 13, 15, and 16 satisfying the weight average molecular weight of the main resin according to the present invention and the presence or absence of a lower surface release treatment of the liner film are in the examples 10, 11, 14, and 17 in which one of them is missing. Compared with the workability of the primary alignment and the tertiary alignment, and the adhesiveness of the base film, it was excellent.
구체적으로, 라이너 필름의 하면을 이형처리한 실시예 1이, 라이너 필름의 하면을 이형처리 하지 않은 실시예 10에 비하여 1차 얼라인 공정의 작업성이 우수하였다.Specifically, Example 1 in which the bottom surface of the liner film was released was superior to Example 10 in which the bottom surface of the liner film was not released.
또한, 제1주제수지의 중량평균분자량이 본 발명의 바람직한 범위를 만족하는 실시예 1, 12 및 13가, 이를 만족하지 못하는 실시예 11에 비하여 베이스 필름의 점착성능이 우수하였다.In addition, Examples 1, 12, and 13, in which the weight average molecular weight of the first subject resin satisfies the preferred range of the present invention, were superior to those of Example 11, which did not satisfy the adhesion of the base film.
또한, 제2주제수지의 중량평균분자량이 본 발명의 바람직한 범위를 만족하는 실시예 1, 15 및 16이, 이를 만족하지 못하는 실시예 14에 비하여 1차 얼라인 공정의 작업성이 우수하였고, 실시예 17에 비하여 3차 얼라인 공정의 작업성이 우수하였다.In addition, Examples 1, 15 and 16, in which the weight average molecular weight of the second subject resin satisfies the preferred range of the present invention, were excellent in workability of the first alignment process, compared to Example 14, which did not satisfy this. Compared to Example 17, the workability of the third alignment process was excellent.
이상에서 본 발명의 일 실시 예에 대하여 설명하였으나, 본 발명의 사상은 본 명세서에 제시되는 실시 예에 제한되지 아니하며, 본 발명의 사상을 이해하는 당업자는 동일한 사상의 범위 내에서, 구성요소의 부가, 변경, 삭제, 추가 등에 의해서 다른 실시 예를 용이하게 제안할 수 있을 것이나, 이 또한 본 발명의 사상범위 내에 든다고 할 것이다.Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiments set forth herein, and those skilled in the art who understand the spirit of the present invention may add components within the scope of the same idea. Other embodiments may be easily proposed by changing, deleting, adding, and the like, but this will also fall within the spirit of the present invention.

Claims (24)

  1. 제1기재의 상면에 형성된 제1점착층을 포함하는 베이스 필름 및 상기 제1기재의 하면에 점착되는 제2점착층 및 상기 제2점착층의 하면에 점착된 제2기재를 포함하는 캐리어 필름;을 포함하는 베이스-캐리어 필름; 및A carrier film including a base film including a first adhesive layer formed on an upper surface of a first substrate, a second adhesive layer adhered to a lower surface of the first substrate, and a second substrate adhered to a lower surface of the second adhesive layer; A base-carrier film comprising a; And
    상기 제1점착층에 의해 점착되는 라이너 필름;을 포함하고,And a liner film adhered by the first adhesive layer.
    하기 조건 (1) 및 조건 (2)를 모두 만족하는 OLED 패널 하부 보호필름:An OLED panel lower protective film satisfying both of the following conditions (1) and (2):
    (1) 400 ~ 700㎚ 파장에서 OLED 패널 하부 보호필름의 반사율이 12 ~ 18%(1) Reflectivity of OLED panel lower protective film is 12 ~ 18% at 400 ~ 700nm wavelength
    (2) 400 ~ 700㎚ 파장에서 라이너 필름 및 베이스-캐리어 필름의 반사율 비가 1 : 0.3 ~ 3.0 임.(2) The reflectance ratio of the liner film and the base-carrier film at a wavelength of 400-700 nm is 1: 0.3-3.0.
  2. 제1항에 있어서,The method of claim 1,
    상기 OLED 패널 하부 보호필름은 하기 조건 (1) 및 (2)를 모두 만족하는 OLED 패널 하부 보호필름:The OLED panel lower protective film is an OLED panel lower protective film satisfying all of the following conditions (1) and (2):
    (1) 400 ~ 700㎚ 파장에서 OLED 패널 하부 보호필름의 반사율이 12 ~ 16%(1) Reflectivity of OLED panel lower protective film is 12 ~ 16% at 400 ~ 700nm wavelength
    (2) 400 ~ 700㎚ 파장에서 라이너 필름 및 베이스-캐리어 필름의 반사율의 비가 1 : 0.62 ~ 2.6 임.(2) The ratio of reflectances of the liner film and the base-carrier film at a wavelength of 400-700 nm is 1: 0.62 to 2.6.
  3. 제1항에 있어서,The method of claim 1,
    상기 OLED 패널 하부 보호필름은 400 ~ 700㎚ 파장에서 하기 조건 (3)을 만족하는 OLED 패널 하부 보호필름:The OLED panel lower protective film is an OLED panel lower protective film satisfying the following condition (3) at a wavelength of 400 ~ 700nm:
    (3)
    Figure PCTKR2018000822-appb-I000004
    임.    (3)
    Figure PCTKR2018000822-appb-I000004
    being.
    단, a는 라이너 필름의 반사율 편차(%), b는 베이스-캐리어 필름의 반사율 편차(%) 및 c는 OLED 패널 하부 보호필름의 반사율 편차(%)를 나타낸다.Where a is a reflectance deviation (%) of the liner film, b is a reflectance deviation (%) of the base-carrier film, and c is a reflectance deviation (%) of the OLED panel lower protective film.
  4. 제1항에 있어서,The method of claim 1,
    상기 OLED 패널 하부 보호필름은 파장이 길어짐에 따라 반사율이 점진적으로 감소하는 OLED 패널 하부 보호필름.The OLED panel lower protective film is an OLED panel lower protective film that gradually decreases the reflectance as the wavelength is longer.
  5. 제1항에 있어서,The method of claim 1,
    상기 제1기재 및 제2기재는 PET 기재이고,The first substrate and the second substrate is a PET substrate,
    상기 제1점착층, 제2점착층은 아크릴계 점착층인 OLED 패널 하부 보호필름.The first adhesive layer, the second adhesive layer is an OLED panel lower protective film is an acrylic adhesive layer.
  6. 제1항에 있어서,The method of claim 1,
    상기 라이너 필름은 하면이 실리콘 이형처리된 OLED 패널 하부 보호필름.The liner film is a lower protective film of the OLED panel is silicon release treatment.
  7. 제1항에 있어서,The method of claim 1,
    상기 라이너 필름은 하기 조건 (4) 및 (5)를 모두 만족하는 OLED 패널 하부 보호필름:The liner film is an OLED panel lower protective film satisfying all of the following conditions (4) and (5):
    (4) 520㎚ 파장에서의 반사율 > 440㎚ 파장에서의 반사율(4) reflectance at 520 nm wavelength> reflectance at 440 nm wavelength
    (5) 520㎚ 파장에서의 반사율 > 690㎚ 파장에서의 반사율.(5) Reflectance at 520 nm wavelength> Reflectance at 690 nm wavelength.
  8. 제1항에 있어서,The method of claim 1,
    상기 라이너 필름은 400 ~ 700㎚ 파장에서 반사율이 5 ~ 13%인 OLED 패널 하부 보호필름.The liner film is an OLED panel lower protective film having a reflectance of 5 to 13% at a wavelength of 400 ~ 700nm.
  9. 제1항에 있어서,The method of claim 1,
    상기 베이스-캐리어 필름은 400 ~ 700㎚ 파장에서 반사율이 8 ~ 13%인 OLED 패널 하부 보호필름.The base-carrier film is an OLED panel lower protective film having a reflectance of 8 to 13% at a wavelength of 400 ~ 700nm.
  10. 제1항에 있어서,The method of claim 1,
    상기 제1점착층 및 제2점착층은 대전방지제를 포함하고,The first adhesive layer and the second adhesive layer comprises an antistatic agent,
    상기 라이너 필름, 제1기재 및 제2기재는 적어도 일면이 대전방지 처리된 OLED 패널 하부 보호필름.The liner film, the first substrate and the second substrate is at least one surface of the OLED panel lower protective film antistatic treatment.
  11. 제1항에 있어서,The method of claim 1,
    상기 베이스 필름은 투과율이 85 ~ 98% 및 헤이즈(Haze)가 0.2 ~ 1.0%인 OLED 패널 하부 보호필름.The base film has a transmittance of 85 to 98% and a haze (Haze) of 0.2 ~ 1.0% OLED panel lower protective film.
  12. 제1항에 있어서,The method of claim 1,
    상기 OLED 패널 하부 보호필름은 총 헤이즈(Haze)가 5 ~ 10%인 OLED 패널 하부 보호필름.The OLED panel lower protective film is an OLED panel lower protective film having a total haze of 5 to 10%.
  13. 제1항에 있어서,The method of claim 1,
    상기 제1점착층은 두께가 10 ~ 30㎛이고, 상기 제1기재는 두께가 65 ~ 140㎛ 인 OLED 패널 하부 보호필름.The first adhesive layer has a thickness of 10 ~ 30㎛, the first substrate is 65 ~ 140㎛ thickness OLED panel lower protective film.
  14. 제1항에 있어서,The method of claim 1,
    상기 라이너 필름은 두께가 55 ~ 95㎛ 이고,The liner film has a thickness of 55 ~ 95㎛,
    상기 제2점착층은 두께가 1 ~ 10㎛ 이며,The second adhesive layer has a thickness of 1 ~ 10㎛,
    상기 제2기재는 두께가 20 ~ 60㎛ 인 OLED 패널 하부 보호필름.The second substrate has a thickness of 20 ~ 60㎛ OLED panel lower protective film.
  15. 제1항에 있어서,The method of claim 1,
    상기 라이너 필름은 이형력이 5 gf/in 이하인 OLED 패널 하부 보호필름.The liner film has a release force of less than 5 gf / in OLED panel lower protective film.
  16. 제1항에 있어서,The method of claim 1,
    상기 제1점착층은 하기 측정방법으로 측정한 점착력이 250 gf/in 이상인 OLED 패널 하부 보호필름.The first adhesive layer is an OLED panel lower protective film having an adhesive force of 250 gf / in or more measured by the following measuring method.
    [측정방법][How to measure]
    제1점착층을 글래스(glass)에 부착하여 24시간 경과 후 초당 5mm의 속도로 180° 박리시킬 때의 점착력을 측정하였다.The adhesive force at the time of adhering the first adhesive layer to glass and peeling 180 ° at a rate of 5 mm per second after 24 hours was measured.
  17. 제1항에 있어서,The method of claim 1,
    상기 베이스 필름 및 캐리어 필름 간의 박리력이 3 ~ 10 gf/in인 OLED 패널 하부 보호필름.Peeling force between the base film and the carrier film is 3 ~ 10 gf / in OLED panel lower protective film.
  18. OLED 패널 하부 보호필름에서 라이너 필름을 박리하는 단계;Peeling the liner film from the OLED panel lower protective film;
    라이너 필름을 박리한 베이스-캐리어 필름을 OLED 패널에 부착하는 단계; 및Attaching the base-carrier film having the liner film peeled off to the OLED panel; And
    OLED 패널에 부착한 베이스-캐리어 필름에서 캐리어 필름을 박리하는 단계;를 포함하며,And peeling the carrier film from the base-carrier film attached to the OLED panel.
    상기 OLED 패널 하부 보호필름은,The OLED panel lower protective film,
    제1기재의 상면에 형성된 제1점착층을 포함하는 베이스 필름 및 상기 제1기재의 하면에 점착되는 제2점착층 및 상기 제2점착층의 하면에 점착된 제2기재를 포함하는 캐리어 필름;을 포함하는 베이스-캐리어 필름; 및A carrier film including a base film including a first adhesive layer formed on an upper surface of a first substrate, a second adhesive layer adhered to a lower surface of the first substrate, and a second substrate adhered to a lower surface of the second adhesive layer; A base-carrier film comprising a; And
    상기 제1점착층에 의해 점착되는 라이너 필름;을 포함하고,And a liner film adhered by the first adhesive layer.
    하기 조건 (1) 및 조건 (2)를 모두 만족하는 OLED 패널 하부 보호필름의 적용 방법:Application method of an OLED panel lower protective film satisfying both of the following conditions (1) and (2):
    (1) 400 ~ 700㎚ 파장에서 OLED 패널 하부 보호필름의 반사율이 12 ~ 18%(1) Reflectivity of OLED panel lower protective film is 12 ~ 18% at 400 ~ 700nm wavelength
    (2) 400 ~ 700㎚ 파장에서 라이너 필름 및 베이스-캐리어 필름의 반사율 비가 1 : 0.3 ~ 3.0 임.(2) The reflectance ratio of the liner film and the base-carrier film at a wavelength of 400-700 nm is 1: 0.3-3.0.
  19. 베이스 필름 및 OLED 패널을 포함하는 유기발광표시장치에 있어서,In an organic light emitting display device comprising a base film and an OLED panel,
    상기 OLED 패널은 기판, 및 상기 기판 상의 유기발광소자를 포함하고,The OLED panel includes a substrate, and an organic light emitting device on the substrate,
    상기 베이스 필름은 기재 및 상기 기재의 상면에 배치된 점착층을 포함하며,The base film includes a substrate and an adhesive layer disposed on the upper surface of the substrate,
    상기 베이스 필름은 투과율이 85 ~ 98% 및 헤이즈(Haze)가 0.2 ~ 1.0%인 유기발광표시장치.The base film has an organic light emitting display device having a transmittance of 85 to 98% and a haze of 0.2 to 1.0%.
  20. 제19항에 있어서,The method of claim 19,
    상기 점착층은 대전방지제를 포함하는, 유기발광표시장치.And the adhesive layer includes an antistatic agent.
  21. 제19항에 있어서,The method of claim 19,
    상기 기재는 적어도 일면이 대전방지 처리된 유기발광표시장치.At least one surface of the substrate is an antistatic treatment.
  22. 제19항에 있어서,The method of claim 19,
    상기 점착층은 두께가 10 ~ 30㎛이고, 상기 기재는 두께가 65 ~ 140㎛ 인 유기발광표시장치.The adhesive layer has a thickness of 10 ~ 30㎛, the substrate is 65 ~ 140㎛ thickness organic light emitting display device.
  23. 제19항에 있어서,The method of claim 19,
    상기 점착층은 하기 측정방법으로 측정한 점착력이 250 gf/in 이상인 유기발광표시장치.The adhesive layer has an adhesive strength of 250 gf / in or more measured by the following measuring method.
    [측정방법][How to measure]
    상기 점착층을 글래스(glass)에 부착하여 24시간 경과 후 초당 5mm의 속도로 180° 박리시킬 때의 점착력을 측정하였다.The adhesive force was measured when the adhesive layer was attached to glass and peeled 180 ° at a rate of 5 mm per second after 24 hours.
  24. 제19항에 있어서,The method of claim 19,
    상기 점착층은 제1점착조성물로 형성되며, The adhesive layer is formed of a first adhesive composition,
    상기 점착조성물은 제1주제수지 및 피리딘계 대전방지제를 포함하며,The adhesive composition includes a first main resin and a pyridine antistatic agent,
    상기 피리딘계 대전방지제는 상기 제1주제수지 100 중량부에 대하여 0.5 ~ 5 중량부인, 유기발광표시장치.The pyridine-based antistatic agent is 0.5 to 5 parts by weight based on 100 parts by weight of the first main resin, an organic light emitting display device.
PCT/KR2018/000822 2017-01-18 2018-01-18 Oled panel lower part protection film, and organic light-emitting display apparatus comprising same WO2018135865A1 (en)

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US16/478,838 US11108018B2 (en) 2017-01-18 2018-01-18 OLED panel lower part protection film, and organic light-emitting display apparatus comprising same
CN201880007584.1A CN110392942B (en) 2017-01-18 2018-01-18 OLED panel lower protective film and organic light emitting display device including the same
US17/408,351 US11963383B2 (en) 2017-01-18 2021-08-20 OLED panel lower part protection film, and organic light-emitting display apparatus comprising same

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KR1020170008519A KR101801688B1 (en) 2017-01-18 2017-01-18 Lower protect film for OLED panel and OLED panel comprising the same
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