WO2018121810A3 - Method and device for treating an object surface by means of a treatment solution - Google Patents
Method and device for treating an object surface by means of a treatment solution Download PDFInfo
- Publication number
- WO2018121810A3 WO2018121810A3 PCT/DE2017/100953 DE2017100953W WO2018121810A3 WO 2018121810 A3 WO2018121810 A3 WO 2018121810A3 DE 2017100953 W DE2017100953 W DE 2017100953W WO 2018121810 A3 WO2018121810 A3 WO 2018121810A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- treatment solution
- treating
- object surface
- electrodes
- relates
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 abstract 3
- 229910052801 chlorine Inorganic materials 0.000 abstract 1
- 239000000460 chlorine Substances 0.000 abstract 1
- -1 chlorine ions Chemical class 0.000 abstract 1
- 238000005868 electrolysis reaction Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B1/00—Electrolytic production of inorganic compounds or non-metals
- C25B1/01—Products
- C25B1/24—Halogens or compounds thereof
- C25B1/26—Chlorine; Compounds thereof
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B15/00—Operating or servicing cells
- C25B15/02—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B9/00—Cells or assemblies of cells; Constructional parts of cells; Assemblies of constructional parts, e.g. electrode-diaphragm assemblies; Process-related cell features
- C25B9/17—Cells comprising dimensionally-stable non-movable electrodes; Assemblies of constructional parts thereof
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B9/00—Cells or assemblies of cells; Constructional parts of cells; Assemblies of constructional parts, e.g. electrode-diaphragm assemblies; Process-related cell features
- C25B9/70—Assemblies comprising two or more cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/12—Etching of semiconducting materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
- C25F3/30—Polishing of semiconducting materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to a method for treating at least a part of an object surface by means of a treatment solution (12), wherein the treatment solution (12) contains water and a source of negatively charged chlorine ions, and wherein chlorine gas (26) is provided in the treatment solution (12) by means of electrolysis. The invention also relates to a device for treating at least a part of an object surface, comprising a process tank (10; 60; 80), in which are arranged a treatment solution (12), chlorine gas dissolved in the treatment solution (12), electrodes (14, 16; 85, 86) of different polarity arranged in the treatment solution (12) and a current source (18) which is connected to the electrodes (14, 16; 85, 86) in an electrically conductive manner.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016125910.1 | 2016-12-30 | ||
DE102016125910 | 2016-12-30 | ||
DE102017110297.3 | 2017-05-11 | ||
DE102017110297.3A DE102017110297A1 (en) | 2016-12-30 | 2017-05-11 | Method and device for treating an object surface by means of a treatment solution |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2018121810A2 WO2018121810A2 (en) | 2018-07-05 |
WO2018121810A3 true WO2018121810A3 (en) | 2018-08-30 |
Family
ID=62567987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2017/100953 WO2018121810A2 (en) | 2016-12-30 | 2017-11-10 | Method and device for treating an object surface by means of a treatment solution |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE102017110297A1 (en) |
TW (1) | TW201825650A (en) |
WO (1) | WO2018121810A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190116266A (en) * | 2017-02-09 | 2019-10-14 | 레나 테크놀로지스 게엠베하 | Methods of texturing surfaces of semiconductor materials and apparatus for performing such methods |
DE102022111209A1 (en) | 2022-05-05 | 2023-11-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Device for introducing in-situ-generated chlorine into wet-chemical cleaning tanks, and method for producing in-situ-generated chlorine gas |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1255444B (en) * | 1964-07-28 | 1967-11-30 | Ibm Deutschland | Process for etching and polishing semiconductors |
US3959098A (en) * | 1973-03-12 | 1976-05-25 | Bell Telephone Laboratories, Incorporated | Electrolytic etching of III - V compound semiconductors |
DE10219688A1 (en) * | 2002-05-02 | 2003-11-20 | Condias Gmbh | Process for the oxidative treatment of surfaces using an electrolyte fluid containing an oxidant used in the microelectronics industry comprises pumping the electrolyte in a cycle |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7943526B2 (en) | 2004-03-22 | 2011-05-17 | Rena Sondermaschinen Gmbh | Process for the wet-chemical treatment of one side of silicon wafers |
DE102013219831A1 (en) | 2013-09-30 | 2015-04-02 | Takata AG | perforator |
DE102013219839B4 (en) | 2013-10-01 | 2018-08-30 | RENA Technologies GmbH | Device for porosification of a silicon substrate |
DE102014001363B3 (en) | 2014-01-31 | 2015-04-09 | Technische Universität Bergakademie Freiberg | Method for producing textures or polishes on the surface of monocrystalline silicon wafers |
-
2017
- 2017-05-11 DE DE102017110297.3A patent/DE102017110297A1/en not_active Withdrawn
- 2017-11-10 WO PCT/DE2017/100953 patent/WO2018121810A2/en active Application Filing
- 2017-11-14 TW TW106139235A patent/TW201825650A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1255444B (en) * | 1964-07-28 | 1967-11-30 | Ibm Deutschland | Process for etching and polishing semiconductors |
US3959098A (en) * | 1973-03-12 | 1976-05-25 | Bell Telephone Laboratories, Incorporated | Electrolytic etching of III - V compound semiconductors |
DE10219688A1 (en) * | 2002-05-02 | 2003-11-20 | Condias Gmbh | Process for the oxidative treatment of surfaces using an electrolyte fluid containing an oxidant used in the microelectronics industry comprises pumping the electrolyte in a cycle |
Also Published As
Publication number | Publication date |
---|---|
TW201825650A (en) | 2018-07-16 |
DE102017110297A1 (en) | 2018-07-05 |
WO2018121810A2 (en) | 2018-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MX2019007194A (en) | Method of desalination and wastewater treatment in a microbial desalination cell reactor. | |
ES2533053T3 (en) | Water purification | |
WO2015191675A3 (en) | Apparatus and methods for treating water and generating electrical power | |
PH12016501746A1 (en) | A system and method for treating water systems with high voltage discharge and ozone | |
PL397081A1 (en) | Method for electrorefining of copper | |
TN2014000440A1 (en) | Electrolytic cell equipped with concentric electrode pairs | |
MX2020006520A (en) | Bipolar electrochemical spacer. | |
WO2018121810A3 (en) | Method and device for treating an object surface by means of a treatment solution | |
WO2018212513A3 (en) | Complex system for water treatment, desalination, and chemical material production | |
IN2014KN01651A (en) | ||
MX2016005106A (en) | Method and apparatus for treating liquid containing iron-group metal ions, method and apparatus for electrodeposition of co and fe, and method and apparatus for decontamination of radioactive waste ion exchange resin. | |
SA517381039B1 (en) | Anode Apparatus to Produce Non-Ferrous Metal | |
PH12018501800A1 (en) | Electrode for capacative deionisation | |
UA117818C2 (en) | Apparatus and method for water treatment mainly by substitution using a dynamic electric field | |
MX2011010862A (en) | Surface treatment apparatus and method using plasma. | |
RU2015146338A (en) | METHOD OF ELECTROLYTE-PLASMA TREATMENT OF PRODUCTS PRODUCED WITH THE APPLICATION OF ADDITIVE TECHNOLOGIES AND DEVICE FOR ITS IMPLEMENTATION | |
MX2017001475A (en) | System and method for the sterilization by electrolysis of the content of closed receptacles in closed receptacles and corresponding post-packaging sterilization receptacle. | |
MX2019010033A (en) | System for water disinfection using electroporation. | |
PL3460101T3 (en) | Electrode for an electrolysis process | |
MX2019005817A (en) | Electrolytic method for extracting tin and/or lead contained in an electrically conductive mixture. | |
WO2012114247A3 (en) | Electrolytic water purification and disinfection system and method of use | |
PL409343A1 (en) | Circuit for the adjustment process courses in biological reactors | |
UA89510U (en) | Electrochloroflotocoagulant with 3d electrodes | |
UA106611U (en) | Method for water purification and decontamination | |
UA89767U (en) | Electrochloroflotocoagulant with volume electrodes |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17811834 Country of ref document: EP Kind code of ref document: A2 |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 17811834 Country of ref document: EP Kind code of ref document: A2 |