WO2018114527A1 - Module de réseau de del - Google Patents

Module de réseau de del Download PDF

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Publication number
WO2018114527A1
WO2018114527A1 PCT/EP2017/082635 EP2017082635W WO2018114527A1 WO 2018114527 A1 WO2018114527 A1 WO 2018114527A1 EP 2017082635 W EP2017082635 W EP 2017082635W WO 2018114527 A1 WO2018114527 A1 WO 2018114527A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting diode
structures
light
color temperature
Prior art date
Application number
PCT/EP2017/082635
Other languages
English (en)
Inventor
Rob Jacques Paul ENGELEN
Frans Hubert KONIJN
Charles Andre SCHRAMA
Emanuel Nicolaas Hermanus Johannes STASSAR
Erno Fancsali
Varun Dev KAKKAR
Nicola Bettina PFEFFER
Original Assignee
Lumileds Holding B.V.
Lumileds Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumileds Holding B.V., Lumileds Llc filed Critical Lumileds Holding B.V.
Priority to EP17825786.1A priority Critical patent/EP3559991B1/fr
Priority to KR1020237000428A priority patent/KR102623866B1/ko
Priority to US16/472,545 priority patent/US10998298B2/en
Priority to CN201780079755.7A priority patent/CN110073489B/zh
Priority to KR1020197021031A priority patent/KR102486428B1/ko
Priority to JP2019533608A priority patent/JP7044785B2/ja
Publication of WO2018114527A1 publication Critical patent/WO2018114527A1/fr
Priority to US17/223,856 priority patent/US11817431B2/en
Priority to JP2022042185A priority patent/JP7236576B2/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Definitions

  • the invention relates to a light emitting diode (LED) array module.
  • the invention further relates to a lighting device comprising one or more LED array modules.
  • the human eye is very sensitive with respect to variations in a light distribution or illumination pattern provided by a light source. Homogeneity of the correlated color temperature of the light distribution provided by a lighting module is therefore an important quality criterion.
  • Especially lighting modules comprising a multitude of light emitters like light emitting diode (LED) structures require a careful selection of these LED structures in order to enable a homogeneous distribution of the color and especially of the correlated color temperature in a defined sector of the space illuminated by the lighting modules.
  • LED light emitters like light emitting diode
  • US 2012/0106145 Al discloses an operating light which includes at least one first radiation source, which is suitable for producing light with locally different, especially radially outwardly decreasing color temperature distribution in a plane extending at right angles to the work area.
  • LED light emitting diode
  • a light emitting diode (LED) array module comprises a plurality of light emitting diode structures.
  • the light emitting diode structures are arranged such that there is an optical cross talk between the light emitting diode structures during operation of the light emitting diode array module.
  • At least a first light emitting diode structure of the plurality of light emitting diode structures is characterized by a first color or flux.
  • At least a second light emitting diode structure of the plurality of light emitting diode structures is characterized by a second color different than the first color.
  • the at least second light emitting diode structure of the plurality of light emitting diode structures may alternatively or in addition be characterized by a second flux different than the first f ux.
  • the first color or the first flux, the second color or the second f ux and the optical cross talk between the light emitting diodes are arranged to provide a predefined light distribution and preferably a predefined color distribution in a reference plane perpendicular to an optical axis of the light emitting diode array module.
  • the reference plane is arranged at a defined distance to the light emitting diode array module.
  • the color of one of the LED structures may be preferably be characterized by the color temperature, correlated color temperature and the like. Especially the correlated color temperature may be preferred to characterize a LED module emitting white light.
  • Classic high-power LED structures are simple surface emitting light sources. However, these structures are getting smaller as time progresses, which is mostly cost-driven. One of the features that are allowing for further cost-down is 5 -sided emission. Where a conventional LED structure would only emit from the top, a 5-sided emitter would also emit from the sides.
  • Such novel emitters have advantages in cost, but also in design flexibility.
  • the LED array module described above avoids or at least reduces the problem of color (flux) variation by taking into account the influence of neighboring LED structures in the LED array module.
  • the LED structures are characterized by different (e.g. first, second, third, fourth etc.) colors or correlated color temperatures and optionally first, second, third, fourth fluxes which are combined in a way that the interaction between the LED structures is taking into account in order to provide the predefined color point and optionally flux distribution.
  • the predefined correlated color temperature distribution may, for example, be a homogeneous or uniform correlated color temperature distribution or it may be a non-uniform color point distribution (e.g. a cool white correlated color temperature in a center and a warm white correlated color temperature at a border of the light distribution provided by means of the LED array module).
  • the correlated colors or color temperature of the LED structures and/or the fluxes may be chosen based on the binning of the different LED structures. That means that LED structures with, for example, different correlated color temperatures and/or fluxes are combined, wherein the difference of the correlated color temperatures and/or fluxes is caused by variations in the production process of the LED structures. Alternatively, LED structures with different semiconductor layers (e.g. composition of active layer) and/or different light conversion structure may be combined in order to enable the predefined distribution of the color and especially the correlated color temperature and/or fluxes of the LED array module.
  • LED structures with different semiconductor layers e.g. composition of active layer
  • different light conversion structure may be combined in order to enable the predefined distribution of the color and especially the correlated color temperature and/or fluxes of the LED array module.
  • the first, second, third etc. color or correlated color temperature and/or fluxes of the LED structures refers to the color, or correlated color temperature of an isolated LED structure without any interaction with neighboring LED structures.
  • At least the first light emitting diode structure of the plurality of light emitting diode structures may be further characterized by a first flux.
  • At least a third light emitting diode structure of the plurality of light emitting diode structures may be characterized by a third flux.
  • the first flux, the third flux and the optical cross talk between the light emitting diodes may be arranged to provide the predefined light distribution in the reference plane.
  • the third LED structure may be the same as the second LED structure or a different LED structure.
  • the third LED structure may be further characterized by a third color or correlated color temperature different than the first and/or second color or correlated color temperature.
  • the predefined light distribution may comprise a predefined color point temperature distribution.
  • the first correlated color temperature and the second correlated color temperature may be arranged to at least partly compensate the optical cross talk between the light emitting diode structures such that a homogeneity of the predefined color point temperature distribution is increased.
  • the optical cross talk between the LED structures may cause an unintended shift of the correlated color temperature of neighboring LED structures. This unintended shift may be compensated by providing 2, 3, 4 or more LED structures with different correlated color temperatures.
  • the light emitting diode structures may be arranged to emit primary light and secondary light.
  • the primary light is characterized by a first center wavelength in a first wavelength range.
  • the secondary light is characterized by a second center wavelength in a second wavelength range.
  • the second wavelength range is in a longer wavelength range than the first wavelength range.
  • the at least first correlated color temperature and the at least second correlated color temperature are determined based on a probability that a light emitting diode structure receives primary light from one or more light emitting diode structures encompassing the light emitting diode structure.
  • the probability may be determined based on a number of the light emitting diode structures encompassing the light emitting diode structure.
  • the probability may alternatively or in addition be determined based on a distance between the light emitting diode structures encompassing the light emitting diode structure and the light emitting diode structure.
  • the probability may alternatively or in addition be determined based on a relative position of the light emitting diode structures encompassing the light emitting diode structure with respect to the light emitting diode structure.
  • the probability of receiving light and especially primary or secondary light is in general determined by the illumination pattern of each single LED structure and the geometric arrangement of the LED structures within the LED array module. Symmetry of the LED structures within the LED array module, varying distances lengths of common border between neighboring LED structures influence the probability that, for example, primary light is received by a light conversion structure of a neighboring (encompassing) LED structure. Furthermore, the arrangement of the LED structures may influence emission of secondary light which may be emitted after conversion of primary light received from a neighboring LED structure. In addition there may be optical structures especially at the border of a LED array module which may be arranged to reflect, for example, primary light emitted by LED structures at the border back to the emitting LED structure or a neighboring LED structure of the emitting LED structure.
  • the optical structure or structures may especially be arranged to approximately mimic a neighboring LED.
  • the optical structure may have in this case the effect that, for example, primary light emitted by a LED structure is reflected such that it appears for the emitting LED structure and neighboring LED structures that there is one or more LED structure at the position of the optical structure.
  • the optical structure or structures provide a kind of image of the LED structures at the border of the LED array module.
  • a correlated color temperature of the light emitting diode structure encompassed by the light emitting structures may be higher the higher the probability of receiving primary light from the encompassing light emitting diode structures is.
  • the probability of receiving, for example, primary light from LED structures by means of a light conversion structure (e.g. phosphor layer) and the probability of conversion of this primary light to secondary light determine the amount of additional secondary light which is emitted by the light conversion structure of the respective LED structure. It may therefore be necessary to shift the correlated color temperature of an LED structure with a high probability of emitting additional secondary light based on the primary light received from encompassing LED structures to higher correlated color temperatures.
  • the higher correlated color temperature may be chosen such that the ratio between primary light and secondary light emitted by the LED structure encompassed by the other LED structures is essentially the same as a ratio of the primary light and secondary light emitted by the encompassing LED structures (taking into account the cross talk between all neighboring LED structures).
  • the predefined correlated color temperature distribution may be flat within a defined distance from the optical axis.
  • the first, second, third, fourth or more different correlated color temperatures of the LED structures may be used to extend the sector of uniform correlated color temperature of a lighting pattern provided by a LED array structure.
  • the predefined correlated color temperature distribution may in this case be flat in the reference plane around the optical axis.
  • the different (lower) correlated color temperature of LED structures at the border of the array may extend the distance from the optical axis in the reference plane in which the predefined correlated color temperature distribution is flat.
  • the light emitting diode array module may comprise a multitude of light emitting diode structures arranged in a regular pattern.
  • the regular pattern of light emitting diode structures comprises a central area and a border area.
  • a correlated color temperature of light emitting diode structures comprised by the border area is arranged to at least partly compensate the optical cross talk in accordance with a correlated color temperature distribution provided by light emitting diode structures comprised by the central area.
  • the light emitting structures of the LED array module may be characterized by, for example sub arrays with different emission characteristics.
  • the correlated color temperature of the LED array module in the central area may, for example, be determined by the intensity provided by the different sub arrays of LED structures.
  • LED structures comprised by the border area of the LED array module are characterized by different correlated color temperatures of the respective sub array in comparison to the central area in order to compensate changes of the correlated color temperature caused by varying optical cross talk caused by the geometric arrangement of encompassing LED structures as described above.
  • a lighting device comprises one, two, three or more light emitting diode array modules as described above.
  • the lighting device further comprises at least one optical device being arranged to distribute light emitted by the at least one light emitting diode array module.
  • the optical device may be a single lens or a complex arrangement of lenses, apertures and the like.
  • a method of emitting light with a homogeneous color point distribution by means of a light emitting diode array module comprising a plurality of light emitting diode structures comprises the steps of:
  • the emitting light of a second correlated color temperature different than the first correlated color temperature by means of at least the second light emitting diode structure of the plurality of light emitting diode structures such that there is an optical cross talk with at least the first light emitting diode structure, wherein the first correlated color temperature and the second correlated color temperature are arranged to at least partly compensate the optical cross talk between the light emitting diode structures such that a homogeneity of a predefined correlated color temperature distribution in a reference plane perpendicular to an optical axis of the light emitting diode array module is increased.
  • Fig. 1 shows a principal sketch of a light emitting diode structure
  • Fig. 2 shows a principal sketch of a light emitting diode array
  • Fig. 3 shows a principal sketch of a first embodiment of a LED array module
  • Fig. 4 shows a principal sketch of a second embodiment of the LED array module
  • Fig. 5 shows a principal sketch of a third embodiment of the LED array module
  • Fig. 6 shows a principal sketch of a cross-section of a fourth embodiment of the LED array module
  • Fig. 7 shows a first embodiment of a predefined correlated color
  • Fig. 1 shows a principal sketch of a cross-section of a light emitting diode (LED) structure 10.
  • the LED structure 10 comprises a n-layer 3 which can be electrically contacted by means of n-contact 5.
  • the n-layer 3 is followed by active layer 4.
  • the active layer 4 may comprise a Quantum Well structure which is arranged to emit light with a wavelength which is determined by the composition of the active layer (e.g., AIInGaN).
  • the active layer 4 is embedded or sandwiched between the n-layer 3 and a p-layer 7.
  • the p-layer 7 can be electrically contacted by means of p-contact 9.
  • n-layer 3, active layer 4, p-layer 9, n-contact 5 and p-contact 9 build a LED die. There may be further support layers which are not shown.
  • a light conversion structure 1 is attached to a top surface of the n-layer 3 which is opposite to surface of the n-layer 3 attached to the active layer 4.
  • the top surface of the n-layer 3 is the light emitting surface of the LED die.
  • the light conversion structure 1 may comprise a phosphor like a Cerium doped phosphor garnet (YAG:Ce).
  • the light conversion structure 1 is arranged to convert primary light 11 (e.g. blue light) emitted by the active layer 4 to secondary light 12 (e.g. yellow light) characterized by a longer wavelength than the primary light 11.
  • a predefined part of the primary light 11 passes light conversion structure 1 without being converted such that the LED structure emits a mixture of primary light 11 and secondary light 12 (white light).
  • the LED structure 10 is arranged to emit at least a major part of the light via a top surface and the side surfaces of the light conversion structure 1 , wherein the top surface is opposite to the surface of the light conversion structure 1 which is attached to the n-layer 3.
  • a LED structure 10 with a rectangular or quadratic cross- section perpendicular to the cross-section shown in Fig. 1 comprises therefore five light emission surfaces.
  • a kind of lid comprising the phosphor material may be arranged around the LED die of the LED structure 10 such that a mixture of primary and secondary light is emitted by means of different sides of the LED structure 10.
  • the LED structure 10 may be embedded in a transparent light distribution structure which is arranged to emit light and essentially all directions of the semi-sphere in the direct direction of light emission of the LED structure 10.
  • Fig. 2 shows a principal sketch of a cross-section of a light emitting diode array 30.
  • the light emitting diode array 30 comprises a number of LED structures 10 (three are shown in the cross-section) attached to a submount 20.
  • the submount 20 comprises a submount chip 21 on which the LED structures 10 are mounted and electrical contact pads 23 by means of which the n-contacts and p-contacts (not shown) of the LED structures 10 can be electrically connected.
  • the LED structures 10 emit primary (blue) light 11 and secondary (yellow) light 12. A part of the primary light 11 emitted by the left and the right LED structure 10 may hit the light conversion structure 1 of the LED structure 10 in the middle. The LED structure 10 in the middle therefore receives more primary light 11 from
  • the relative fraction of secondary light emitted from the light conversion structure 1 of the LED structure 10 in the middle is therefore increased.
  • the correlated color temperature of the LED structure 10 in the middle seems therefore to be lower than the correlated color temperature of the LED structures on the left and the right side provided that all LED structures 10 are arranged to emit in a single arrangement, for example, white light of the same correlated color temperature.
  • Fig. 3 shows a principal sketch of a top view of a first embodiment of a LED array module 30.
  • the LED array module 30 comprises three LED structures 10a, 10b which are arranged along an axis (linear array) in a similar way as described with respect to Fig. 2.
  • a LED structure 10a is arranged between two LED structures 10b.
  • the LED structure 10a in the middle emits white light with a higher first correlated color temperature in order to
  • the second correlated color temperature is chosen such that the amount of additional converted secondary light 12 (see Fig. 2) caused by primary light received by the light conversion structure 1 of the LED structure 10a in the middle is essentially compensated.
  • the correlated color temperature distribution of the light emitting module 30 is therefore more homogeneous or uniform along the axis of the linear array. It is clear that the selection of the first and the second correlated color temperature is determined by the geometric boundary conditions such that a perfect compensation is not possible. The same principal may be used in order to compensate variations of the flux caused by the optical cross talk between neighboring LED structures 10.
  • the flux of the LED structures 10b at the left and the right may, for example, be higher than the optical flux of LED structure 10a in the middle in order to improve homogeneity of the flux of LED array module 30.
  • Fig. 4 shows a principal sketch of a top view of a second embodiment of the LED array module 30.
  • the LED array module 30 comprises a symmetric arrangement of LED structures 10a, 10b, 10c, lOd.
  • the LED array module 30 comprises two symmetry axes both crossing a center point of the LED array module 30. Symmetry with respect to the first symmetry axis is in this case different than the symmetry with respect to the second symmetry axis.
  • the LED structures 10a, 10b, 10c, lOd are arranged such that four LED structures 10a with a first correlated color temperature are arranged in the middle of the LED array module 30.
  • the four LED structures 10a are encompassed by 10 LED structures 10b, 10c, lOd.
  • the correlated color temperatures of the LED structures 10b, 10c, lOd is selected based on the relative position to neighboring LED structures 10a, 10b, 10c, lOd, the number of neighboring LED structures 10a, 10b, 10c, lOd and the distance(s) (the distances may, for example, be different in different directions) between the neighboring LED structures 10a, 10b, 10c, lOd.
  • the geometry of the arrangement of the LED structures 10a, 10b, 10c, lOd in the LED array 30 determines a probability of receiving primary light from neighboring LED structures 10a, 10b, 10c, lOd.
  • the correlated color temperature of the four LED structures 10a in the middle is therefore the highest. It is intended to provide an essentially uniform correlated color temperature distribution across the LED array module 30 because each of the four LED structures 10a is encompassed by seven other LED structures 10a, 10b, 10c, lOd.
  • the second correlated color temperature of LED structures 10b is lower than the correlated color temperature of the LED structures 10a in the center but higher than the correlated color temperatures of LED structures 10c, 10b because four LED structures 10a, 10c, lOd encompass LED structures 10b such that three sides of LED structure have overlap with sides of the encompassing LED structures 10a, 10c, lOd.
  • the LED structures lOd have a lower correlated color temperature than LED structures 10b but at a higher correlated color temperature than LED structure 10c being characterized by the lowest correlated color temperature of the LED array module 30.
  • Fig. 5 shows a principal sketch of a top view of a third embodiment of the LED array module 30.
  • LED array module 30 comprises in this case two sub arrays of LED structures, which are arranged in a checkerboard pattern.
  • the LED structures 17 of the first sub array (bright squares) are arranged to emit light of a first characteristic.
  • the LED structures of the second sub array (dark squares) are arranged to emit light of a second characteristic.
  • Each sub array 17, 18 can be controlled independently from the other sub array.
  • the LED structures 17 of the first sub array may, for example, be arranged to emit light with a first color (e.g. blue).
  • the LED structures 18 of the second sub array may, for example, be arranged to emit light with a second color (e.g yellow).
  • the color of the light emitted by the LED array module 30 can therefore be controlled by means of the relative intensities provided by the two sub arrays.
  • the general problem as discussed with respect to Figures 2, 3 and 4 remains the same.
  • the LED array module 30 comprises a central area 16 wherein the LED structures 17, 18 of the central area 16 are each encompassed by the same number and kind of LED structures 17, 18.
  • the LED array module 30 further comprises a border area 15 in which the number of encompassing LED structures 17, 18 depends on the position within the border area 15.
  • the color of the LED structures 17, 18 of the border area 15 are therefore different than the color of the LED structures 17, 18 of the corresponding central area 16 in order to compensate the different optical crosstalk between the LED structures 17, 18.
  • the color of the LED structures 17, 18 of the border area 15 essentially depends on the number of LED structures 17, 18 encompassing the respective LED structure 17, 18.
  • the area of the LED array module 13 appearing to emit light of the same color and correlated color temperature is thus increased.
  • the border area 15 and the central area 16 are separated by a small gap in Fig. 5 in order to simplify identification of LED structures 17, 18 of the central area 16 and the border area 15. There is no such a gap in the real LED array module 30.
  • Fig. 6 shows a principal sketch of a cross-section of a fourth embodiment of the LED array module 30.
  • the LED array module comprises an array of 5> ⁇ 6 LED structures 10.
  • the cross section shows six LED structures 10 in the third of the five lines of LED structures 10 which are arranged in a regular quadratic pattern.
  • the LED structures 10 are attached to a submount 20 comprising a submount chip 21 and electrical contact pads 23 as discussed with respect to Fig. 2.
  • the LED array module 30 comprises an optical axis 50 which is arranged in the middle of the 5 x 6 LED structures 10.
  • Each of the LED structures 10 emits mixed light 13 comprising primary light 11 and secondary light 12 as discussed with respect to Fig. 2.
  • the mixed light 13 overlaps in reference plane 40 which may, for example, be arranged in a distance preferably between 5 mm and 10 mm in order to detect the impact of the LED structures 10 comprised by the LED module 30.
  • the correlated color temperature of the LED structures 10 of the central area of the LED array module 30 is higher in comparison to the correlated color temperature of the LED structures 10 of the border area of the LED array module 30.
  • the LED structures 10 at the four corners of the LED array module 30 are characterized by the lowest correlated color temperature because these LED structures 10 are encompassed by the lowest number of encompassing LED structures 10.
  • Fig. 7 shows the predefined correlated color temperature distribution 65 of the LED array module 30 shown in Fig. 6 along an axis of reference plane 40.
  • the axis crosses the optical axis 50 and is arranged along the line defined by the LED structures 10 shown in Fig. 6.
  • the abscissa 61 shows the distance to the optical axis 50 in the reference plane 40 and the ordinate 62 shows the correlated color temperature along the axis in the reference plane 40.
  • the predefined correlated color temperature distribution 65 is essentially constant or flat within a predefined range around the optical axis 50 in the reference plane 40.
  • the predefined range within the reference plane 40 is determined by the illumination pattern provided by each LED structure 10, the geometric orientation of the LED structures 10 within the LED array module 30 and the compensation of the optical cross talk by means of the different correlated color temperature of LED structures 10 in the border area of the LED array module 30.
  • the disclosure mainly speaks of correlated color temperature to describe the color of LED structures 10, the invention is not limited to colors of a black body radiator. A person skilled in the art will understand that the invention holds for color compensation in the full color space.
  • the colors mentioned in the disclosure will be along the phosphor load line(s), i.e. the colors one can create by changing the concentration of phosphor in light conversion structure 1 of the corresponding LED structure 10.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un module de réseau de diodes électroluminescentes (30) comprenant une pluralité de structures de diodes électroluminescentes (10a, 10b), les structures de diodes électroluminescentes (10a, 10b) étant agencées de telle sorte qu'il existe une diaphonie optique entre les structures de diodes électroluminescentes (10a, 10b) pendant le fonctionnement du module de réseau de diodes électroluminescentes (30), au moins une première structure de diodes électroluminescentes (10a) de la pluralité de structures de diodes électroluminescentes (10a, 10b) étant caractérisée par une première couleur, et au moins une seconde structure de diodes électroluminescentes (10b) de la pluralité de structures de diodes électroluminescentes (10a, 10b) étant caractérisée par une seconde couleur différente de la première couleur, la première couleur, la seconde couleur et la diaphonie optique entre les diodes électroluminescentes étant agencées pour fournir une distribution de lumière prédéfinie dans un plan de référence (40) perpendiculaire à un axe optique (50) du module de réseau de diodes électroluminescentes (30). L'invention concerne en outre un dispositif d'éclairage comprenant un ou plusieurs modules de réseau de DEL.
PCT/EP2017/082635 2016-12-21 2017-12-13 Module de réseau de del WO2018114527A1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
EP17825786.1A EP3559991B1 (fr) 2016-12-21 2017-12-13 Module de réseau à del
KR1020237000428A KR102623866B1 (ko) 2016-12-21 2017-12-13 Led 어레이 모듈
US16/472,545 US10998298B2 (en) 2016-12-21 2017-12-13 LED array module
CN201780079755.7A CN110073489B (zh) 2016-12-21 2017-12-13 Led阵列模块
KR1020197021031A KR102486428B1 (ko) 2016-12-21 2017-12-13 Led 어레이 모듈
JP2019533608A JP7044785B2 (ja) 2016-12-21 2017-12-13 Ｌｅｄアレイモジュール
US17/223,856 US11817431B2 (en) 2016-12-21 2021-04-06 LED array module
JP2022042185A JP7236576B2 (ja) 2016-12-21 2022-03-17 Ｌｅｄアレイモジュール

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201662437454P 2016-12-21 2016-12-21
US62/437,454 2016-12-21
EP17150666.0 2017-01-09
EP17150666 2017-01-09

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US16/472,545 A-371-Of-International US10998298B2 (en) 2016-12-21 2017-12-13 LED array module
US17/223,856 Continuation US11817431B2 (en) 2016-12-21 2021-04-06 LED array module

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WO2018114527A1 true WO2018114527A1 (fr) 2018-06-28

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10998298B2 (en) 2016-12-21 2021-05-04 Lumileds Llc LED array module
US11631715B2 (en) 2021-03-11 2023-04-18 Lumileds Llc Monolithic multi-color matrix emitter with patterned phosphor layer

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