WO2018108028A1 - High-strength thermally conductive insulation material - Google Patents

High-strength thermally conductive insulation material Download PDF

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WO2018108028A1
WO2018108028A1 PCT/CN2017/115070 CN2017115070W WO2018108028A1 WO 2018108028 A1 WO2018108028 A1 WO 2018108028A1 CN 2017115070 W CN2017115070 W CN 2017115070W WO 2018108028 A1 WO2018108028 A1 WO 2018108028A1
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parts
thermally conductive
insulating material
strength
conductive insulating
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PCT/CN2017/115070
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Chinese (zh)
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顾建强
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顾建强
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/014Additives containing two or more different additives of the same subgroup in C08K
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/04Antistatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Definitions

  • the invention belongs to the technical field of polymer materials, and particularly relates to a high-strength heat-conductive insulating material.
  • the thermally conductive polymer-based composite material is a multi-phase composite system having a certain heat conduction function obtained by using a polymer as a matrix and a thermally conductive substance as a filler. It has both thermal conductivity and many excellent properties of polymer materials. It can adjust the thermal conductivity, electrical conductivity and mechanical properties of materials in a wide range, so it has broad application prospects.
  • thermal materials are mostly metals and metal oxides, as well as other non-metallic materials (such as graphite, carbon black, AlN, SiC, etc.).
  • non-metallic materials such as graphite, carbon black, AlN, SiC, etc.
  • thermal conductive materials With the development of science and technology and industrial production, many special heat conduction occasions put forward higher requirements for thermal conductive materials, and it is expected to have more excellent comprehensive properties, such as light weight, strong chemical resistance, excellent electrical insulation, and impact resistance. Easy processing and so on. Due to the excellent corrosion resistance, mechanical properties and electrical insulation properties of polymer materials, polymer materials are gradually used to replace traditional thermal materials. However, polymer materials are mostly poor conductors of heat, with low thermal conductivity, but with thermal conductivity. After the substance, it will become a heat conductive material.
  • Thermally conductive and insulating polymer matrix composites have received more and more attention and competition research and development due to their excellent comprehensive performance and their special applications in electromagnetic shielding, electronic information, thermal measurement technology, chemical engineering, mechanical engineering and other fields.
  • a high-strength thermal conductive insulating material comprising a thermally conductive insulating material matrix and a high-strength system, wherein the high-strength system is added in an amount of 3.2-3.4% by weight of the thermally conductive insulating material; and the thermally conductive insulating material matrix comprises: alumina 12.5-12.7 parts, 5.5-5.7 parts of magnesium oxide, 2.1-2.3 parts of silicon carbide, 3.1-3.3 parts of silane coupling agent, 2.4-2.6 parts of calcium nitrate, 4.1-4.3 parts of hydroquinone, 3.8-4 parts of nickel acetate , 12-14 parts of ethanol, 14-16 parts of epoxy resin, 5.1-5.3 parts of dimethyl acrylamide, 2.2-2.4 parts of sodium metasilicate, 6.1-6.3 parts of benzotriazole; parts by weight of high strength system Including: 8.7-8.9 parts of nano-silica, 21-33 parts of ethoxylated alkylamine, 61-63 parts of methyl
  • the preparation method of the high-strength thermal conductive insulating material of the invention is:
  • the high-strength thermally conductive insulating material, the toughening agent is one or more of a styrene-butadiene thermoplastic elastomer, a chlorinated polyethylene or an ethylene-vinyl acetate copolymer; and the reactive diluent is an alkyl group.
  • glycidyl ether glycidyl octanoate, trimethylolpropane triglycidyl ether, toluene glycidyl ether, castor oil polyglycidyl ether
  • compatibilizer is maleic anhydride Branch modified polypropylene
  • the coupling agent is one or one of a vinyl tributyl sulfonyl silane coupling agent, a methyl vinyl dichloro silane coupling agent, a methyl tributyl ketone silane coupling agent Above mixture; leveling agent is is isophorone, diacetone alcohol, fluorine modified acrylic acid, phosphate modified acrylic acid, acrylic acid, polydimethylsiloxane, polymethylalkylsiloxane, organic modification One or more mixtures of polysiloxanes.
  • the thermally conductive insulating material provided by the invention has the advantages of high strength and good insulation performance.
  • the experimental results show that the high-strength system of the present invention can effectively enhance the tensile strength, bending strength and notched impact strength of the thermally conductive insulating material, and the tensile strength of the thermally conductive insulating material of the present invention can be obtained when the high-strength system is added to the thermally conductive insulating material substrate.
  • Increase by at least 1.5 times increase bending strength by at least 1.3 times, increase notched impact strength by at least 1.3 times, tensile strength up to 95-98 MPa, flexural strength up to 120-128 MPa, and notched impact strength of 5.5-6 MPa.
  • nano silica ethoxylated alkylamine, methyl hydrogen silicone oil, hydroxy polydimethylsiloxane, vinyl trimethoxysilane, ammonium polyphosphate, chopped glass fiber, nano montmorillonite
  • the structure of the thermally conductive insulating material is damaged and collapsed, and the thermal conductivity is
  • the addition of reactive diluents, compatibilizers, coupling agents, leveling agents and mixed rare earth chlorides can improve the compatibility with the thermally conductive insulating material matrix, and make the structure of the thermal conductive insulating material more regular, thermal conductivity Improved, thermal conductivity of 7.5 ⁇ 7.9.
  • the present invention can improve the tensile strength, bending strength, notched impact strength, thermal conductivity, high temperature resistance and antistatic property of the thermally conductive insulating material by adding a high strength system.
  • This embodiment is a high-strength thermal conductive insulating material comprising a thermally conductive insulating material matrix and a high-strength system.
  • the high-strength system is added in an amount of 3.2% by weight of the thermally conductive insulating material.
  • the parts by weight of the thermally conductive insulating material substrate include: 12.5 parts of alumina, 5.5 parts of magnesium oxide, 2.1 parts of silicon carbide, 3.1 parts of silane coupling agent, 2.4 parts of calcium nitrate, 4.1 parts of hydroquinone, 3.8 parts of nickel acetate, 12 parts of ethanol, 14 parts of epoxy resin, 5.1 parts of dimethyl acrylamide, 2.2 parts of sodium metasilicate, and 6.1 parts of benzotriazole.
  • the parts by weight of the high strength system include: 8.7 parts of nano silica, 21 parts of ethoxylated alkylamine, 61 parts of methyl hydrogen silicone oil, 4.7 parts of hydroxypolydimethylsiloxane, vinyl trimethoxy 8.7 parts of silane, 2.5 parts of ammonium polyphosphate, 3.2 parts of nano montmorillonite, 3.5 parts of fumed silica, 2.6 parts of ⁇ -aminopropyltriethoxysilane, 5.1 parts of alkylphenol ethoxylate Toughener 1.7 parts, reactive diluent 1.1 parts, compatibilizer 2.5 parts, coupling agent 1.2 parts, leveling agent 1.1 parts, mixed rare earth chloride 0.3 parts; nano silica particle size 20nm, nano montmorillonite The particle size is 20 nm.
  • the toughening agent is a styrene-butadiene thermoplastic elastomer
  • the reactive diluent is an alkyl glycidyl ether
  • the compatibilizing agent is a maleic anhydride graft modified polypropylene
  • the coupling agent is vinyltributyl ketone oxime a silane coupling agent
  • the leveling agent is isophorone.
  • the preparation method of the high-strength thermal conductive insulating material of the invention is:
  • This embodiment is a high-strength thermally conductive insulating material comprising a thermally conductive insulating material matrix and a high-strength system, and the high-strength system is added in an amount of 3.3% by weight of the thermally conductive insulating material.
  • the parts by weight of the thermally conductive insulating material substrate include: 12.6 parts of alumina, 5.6 parts of magnesium oxide, 2.2 parts of silicon carbide, 3.2 parts of silane coupling agent, 2.5 parts of calcium nitrate, 4.2 parts of hydroquinone, 3.9 parts of nickel acetate, 13 parts of ethanol, 15 parts of epoxy resin, 5.2 parts of dimethyl acrylamide, 2.3 parts of sodium metasilicate, and 6.2 parts of benzotriazole.
  • the parts by weight of the high strength system include: 8.8 parts of nano silica, 22 parts of ethoxylated alkylamine, 62 parts of methyl hydrogen silicone oil, 4.8 parts of hydroxypolydimethylsiloxane, vinyl trimethoxy 8.8 parts of silane, 2.6 parts of ammonium polyphosphate, 3.3 parts of nano montmorillonite, 3.6 parts of fumed silica, 2.7 parts of ⁇ -aminopropyltriethoxysilane, 5.2 parts of alkylphenol ethoxylate 1.8 parts of toughener, 1.2 parts of reactive diluent, 2.6 parts of compatibilizer, 1.3 parts of coupling agent, 1.2 parts of leveling agent, mixed 0.4 parts of rare earth chloride; particle size of nano-silica is 25nm, nano-montmorillonite The particle size is 25 nm.
  • the toughening agent is chlorinated polyethylene; the reactive diluent is glycidyl octanoate; the compatibilizing agent is maleic anhydride graft modified polypropylene; the coupling agent is methyl vinyl dichlorosilane coupling agent
  • the leveling agent is diacetone alcohol.
  • the preparation method of the high-strength thermal conductive insulating material of the invention is:
  • This embodiment is a high-strength thermally conductive insulating material comprising a thermally conductive insulating material matrix and a high-strength system.
  • the high-strength system is added in an amount of 3.4% by weight of the thermally conductive insulating material.
  • the parts by weight of the thermally conductive insulating material substrate include: 12.7 parts of alumina, 5.7 parts of magnesium oxide, 2.3 parts of silicon carbide, 3.3 parts of silane coupling agent, 2.6 parts of calcium nitrate, 4.3 parts of hydroquinone, 4 parts of nickel acetate, 14 parts of ethanol, 16 parts of epoxy resin, 5.3 parts of dimethyl acrylamide, 2.4 parts of sodium metasilicate, and 6.3 parts of benzotriazole.
  • the parts by weight of the high strength system include: 8.9 parts of nano silica, 33 parts of ethoxylated alkylamine, 63 parts of methyl hydrogen silicone oil, 4.9 parts of hydroxypolydimethylsiloxane, vinyl trimethoxy 8.7 parts of silane, 2.7 parts of ammonium polyphosphate, 3.4 parts of nano montmorillonite, 3.7 parts of fumed silica, 2.8 parts of ⁇ -aminopropyltriethoxysilane, 5.3 parts of alkylphenol ethoxylate Toughener 1.9 parts, reactive diluent 1.3 parts, compatibilizer 2.7 parts, coupling agent 1.4 parts, leveling agent 1.3 parts, mixed rare earth chloride 0.5 parts; nano silica particle size 30nm, nano montmorillonite The particle size is 30 nm.
  • the toughening agent is an ethylene-vinyl acetate copolymer
  • the reactive diluent is trimethylolpropane triglycidyl ether
  • the compatibilizing agent is maleic anhydride graft modified polypropylene
  • the coupling agent is methyl tributyl Keto mercapto silane coupling agent
  • leveling agent is polydimethylsiloxane.
  • the preparation method of the high-strength thermal conductive insulating material of the invention is:

Abstract

A high-strength thermally conductive insulation material, comprising a thermally conductive insulation material base and a high-strength system, the amount of high-strength system added being 3.2-3.4% of the weight of the thermally conductive insulation material; the thermally conductive insulation material base comprises the following components in parts by weight: 12.5-12.7 parts of aluminium oxide, 5.5-5.7 parts of magnesium oxide, 2.1-2.3 parts of silicon carbide, 3.1-3.3 parts of silane coupling agent, 2.4-2.6 parts of calcium nitrate, 4.1-4.3 parts of hydroquinone, 3.8-4 parts of nickel acetate, 12-14 parts of ethanol, 14-16 parts of epoxy resin, 5.1-5.3 parts of dimethyl acrylamide, 2.2-2.4 parts of sodium metasilicate, and 6.1-6.3 parts of benzotriazole. The addition of the high-strength system in the high-strength thermally conductive insulation material improves the tensile strength, bending strength, notched impact strength, thermal conduction coefficient, heat resistance, and anti-static properties of the thermally conductive insulation material.

Description

[根据细则37.2由ISA制定的发明名称] 高强度导热绝缘材料[Name of invention established by ISA in accordance with Rule 37.2] High-strength thermally conductive insulation material 技术领域Technical field
本发明属于高分子材料技术领域,具体涉及一种高强度导热绝缘材料。The invention belongs to the technical field of polymer materials, and particularly relates to a high-strength heat-conductive insulating material.
背景技术Background technique
导热聚合物基复合材料是以聚合物为基体,以导热性物质为填料,经过混均匀分散后而得到的具有一定导热功能的多相复合体系。它既具有导热功能又具有聚合物材料的许多优异特性,可以在较大范围内调节材料的导热、导电及力学性能,因而有广泛的应用前景。The thermally conductive polymer-based composite material is a multi-phase composite system having a certain heat conduction function obtained by using a polymer as a matrix and a thermally conductive substance as a filler. It has both thermal conductivity and many excellent properties of polymer materials. It can adjust the thermal conductivity, electrical conductivity and mechanical properties of materials in a wide range, so it has broad application prospects.
传统导热材料多为金属和金属氧化物,以及其他非金属材料(如石墨、炭黑、AlN、SiC等)。随着科学技术和工业生产的发展,许多特殊导热场合对导热材料提出了更高要求,希望其具有更加优良的综合性能,如质轻、耐化学腐蚀性强、电绝缘性优异、耐冲击、加工成型简便等。由于聚合物材料具有优良的耐腐蚀性能和力学性能及电绝缘性能,因而人们逐渐用聚合物材料代替传统导热材料,但聚合物材料大都是热的不良导体,热导率较低,但加入导热性物质后,又会成为导热材料。Traditional thermal materials are mostly metals and metal oxides, as well as other non-metallic materials (such as graphite, carbon black, AlN, SiC, etc.). With the development of science and technology and industrial production, many special heat conduction occasions put forward higher requirements for thermal conductive materials, and it is expected to have more excellent comprehensive properties, such as light weight, strong chemical resistance, excellent electrical insulation, and impact resistance. Easy processing and so on. Due to the excellent corrosion resistance, mechanical properties and electrical insulation properties of polymer materials, polymer materials are gradually used to replace traditional thermal materials. However, polymer materials are mostly poor conductors of heat, with low thermal conductivity, but with thermal conductivity. After the substance, it will become a heat conductive material.
导热绝缘聚合物基复合材料因其优异的综合性能及其在电磁屏蔽、电子信息、热工测量技术、化工、机械工程等领域的特殊用途,已得到愈来愈多的关注与竞相研究开发。Thermally conductive and insulating polymer matrix composites have received more and more attention and competition research and development due to their excellent comprehensive performance and their special applications in electromagnetic shielding, electronic information, thermal measurement technology, chemical engineering, mechanical engineering and other fields.
发明内容Summary of the invention
本发明所要解决的技术问题是:The technical problem to be solved by the present invention is:
⑴如何通过加入高强度体系来提高导热绝缘材料的拉伸强度、弯曲强度以及缺口冲击强度;(1) How to increase the tensile strength, bending strength and notched impact strength of the thermally conductive insulating material by adding a high-strength system;
⑵如何改善由于加入高强度体系后导致导热绝缘材料导热系数降低的技术问题。(2) How to improve the technical problem of lowering the thermal conductivity of the thermally conductive insulating material due to the addition of the high-strength system.
本发明解决以上技术问题的技术方案是:The technical solution of the present invention to solve the above technical problems is:
一种高强度导热绝缘材料,包括导热绝缘材料基体和高强度体系,高强度体系的加入量为所述导热绝缘材料重量的3.2-3.4%;导热绝缘材料基体的重量份组分包括:氧化铝12.5-12.7份、氧化镁5.5-5.7份、碳化硅2.1-2.3份,硅烷偶联剂3.1-3.3份、硝酸钙2.4-2.6份、对苯二酚4.1-4.3份、乙酸镍3.8-4份、乙醇12-14份、环氧树脂14-16份、二甲基丙烯酰胺5.1-5.3份、偏硅酸钠2.2-2.4份、苯***6.1-6.3份;高强度体系的重量份组分包括:纳米二氧化硅8.7-8.9份,乙氧基化烷基胺21-33份,甲基含氢硅油61-63份,羟基聚二甲基硅氧烷4.7-4.9份,乙烯基三甲氧基硅烷8.7-8.9份,聚磷酸铵2.5-2.7份,纳米蒙脱土3.2-3.4份,气相法白炭黑3.5-3.7份,γ-氨丙基三乙氧基硅烷2.6-2.8份,烷基酚聚 氧乙烯醚5.1-5.3份,增韧剂1.7-1.9份,活性稀释剂1.1-1.3份,相容剂2.5-2.7份,偶联剂1.2-1.4份,流平剂1.1-1.3份,混合氯化稀土0.3-0.5份;纳米二氧化硅的粒径为20-30nm,纳米蒙脱土的粒径为20-30nm。A high-strength thermal conductive insulating material comprising a thermally conductive insulating material matrix and a high-strength system, wherein the high-strength system is added in an amount of 3.2-3.4% by weight of the thermally conductive insulating material; and the thermally conductive insulating material matrix comprises: alumina 12.5-12.7 parts, 5.5-5.7 parts of magnesium oxide, 2.1-2.3 parts of silicon carbide, 3.1-3.3 parts of silane coupling agent, 2.4-2.6 parts of calcium nitrate, 4.1-4.3 parts of hydroquinone, 3.8-4 parts of nickel acetate , 12-14 parts of ethanol, 14-16 parts of epoxy resin, 5.1-5.3 parts of dimethyl acrylamide, 2.2-2.4 parts of sodium metasilicate, 6.1-6.3 parts of benzotriazole; parts by weight of high strength system Including: 8.7-8.9 parts of nano-silica, 21-33 parts of ethoxylated alkylamine, 61-63 parts of methyl hydrogen silicone oil, 4.7-4.9 parts of hydroxypolydimethylsiloxane, vinyl trimethoxy 8.7-8.9 parts of silane, 2.5-2.7 parts of ammonium polyphosphate, 3.2-3.4 parts of nano montmorillonite, 3.5-3.7 parts of fumed silica, 2.6-2.8 parts of γ-aminopropyltriethoxysilane, alkane Phenolic polyoxyethylene ether 5.1-5.3 parts, toughening agent 1.7-1.9 parts, reactive diluent 1.1-1.3 parts, compatibilizer 2.5-2.7 parts, coupling agent 1.2-1.4 parts, leveling agent 1.1-1.3 parts ,mixing 0.3-0.5 parts of a rare earth; nanosilica particle diameter 20-30nm, nanoclays a particle size of 20-30nm.
本发明高强度导热绝缘材料的制备方法为:The preparation method of the high-strength thermal conductive insulating material of the invention is:
㈠以设定的重量份,将氧化铝、氧化镁、碳化硅、硅烷偶联剂、硝酸钙、对苯二酚、乙酸镍、乙醇、环氧树脂、二甲基丙烯酰胺、偏硅酸钠、苯***加入搅拌机中,加热搅拌,冷却至室温;加热温度为40-60℃,搅拌速度为300-500rpm;(1) Alumina, magnesia, silicon carbide, silane coupling agent, calcium nitrate, hydroquinone, nickel acetate, ethanol, epoxy resin, dimethyl acrylamide, sodium metasilicate, in a set by weight , the benzotriazole is added to the mixer, heated and stirred, and cooled to room temperature; the heating temperature is 40-60 ° C, and the stirring speed is 300-500 rpm;
㈡按设定的重量份将高强度体系各组分进行加热搅拌混合均匀得到高强度体系;加热温度为85-87℃,搅拌速度为250-300rpm;(2) heating and stirring the components of the high-strength system according to the set weight parts to obtain a high-strength system; the heating temperature is 85-87 ° C, and the stirring speed is 250-300 rpm;
㈢将导热绝缘材料基体与高强度体系按设定的配比进行混合,在真空条件下加热搅拌,冷却至室温,固化,即得;真空度为0.08-0.1MPa,加热温度为50-70℃。(3) mixing the base of the heat-conducting insulating material with the high-strength system according to the set ratio, heating and stirring under vacuum conditions, cooling to room temperature, curing, that is, obtaining a vacuum degree of 0.08-0.1 MPa, heating temperature of 50-70 ° C .
本发明进一步限定的技术方案是:The technical solution further defined by the present invention is:
前述的高强度导热绝缘材料,增韧剂为苯乙烯-丁二烯热塑性弹性体、氯化聚乙烯或乙烯-醋酸乙烯酯共聚物中的一种或一种以上混合物;活性稀释剂为烷基缩水甘油醚、辛葵酸缩水甘油酯、三羟甲基丙烷三缩水甘油醚、甲苯缩水甘油醚、蓖麻油多缩水甘油醚中的一种或一种以上混合物;相容剂为马来酸酐接枝改性聚丙烯;偶联剂为乙烯基三丁酮肟基硅烷偶联剂、甲基乙烯基二氯硅烷偶联剂、甲基三丁酮肟基硅烷偶联剂中的一种或一种以上混合物;流平剂为异佛尔酮、二丙酮醇、氟改性丙烯酸、磷酸酯改性丙烯酸、丙烯酸、聚二甲基硅氧烷、聚甲基烷基硅氧烷、有机改性聚硅氧烷中的一种或一种以上混合物。The high-strength thermally conductive insulating material, the toughening agent is one or more of a styrene-butadiene thermoplastic elastomer, a chlorinated polyethylene or an ethylene-vinyl acetate copolymer; and the reactive diluent is an alkyl group. One or more mixtures of glycidyl ether, glycidyl octanoate, trimethylolpropane triglycidyl ether, toluene glycidyl ether, castor oil polyglycidyl ether; compatibilizer is maleic anhydride Branch modified polypropylene; the coupling agent is one or one of a vinyl tributyl sulfonyl silane coupling agent, a methyl vinyl dichloro silane coupling agent, a methyl tributyl ketone silane coupling agent Above mixture; leveling agent is isophorone, diacetone alcohol, fluorine modified acrylic acid, phosphate modified acrylic acid, acrylic acid, polydimethylsiloxane, polymethylalkylsiloxane, organic modification One or more mixtures of polysiloxanes.
本发明的有益效果是:本发明提供的导热绝缘材料具有强度高、绝缘性能好的优点。实验结果显示,本发明的高强度体系能有效增强导热绝缘材料的拉伸强度、弯曲强度以及缺口冲击强度,当由高强度体系加入导热绝缘材料基体后,能使本发明导热绝缘材料拉伸强度提高至少1.5倍以上,弯曲强度提高至少1.3倍以上,缺口冲击强度提高至少1.3倍以上,拉伸强度可达95-98MPa,弯曲强度可达120-128MPa,缺口冲击强度可达5.5-6MPa。但“纳米二氧化硅、乙氧基化烷基胺、甲基含氢硅油、羟基聚二甲基硅氧烷、乙烯基三甲氧基硅烷、聚磷酸铵、短切玻璃纤维、纳米蒙脱土、气相法白炭黑、γ-氨丙基三乙氧基硅烷、烷基酚聚氧乙烯醚和增韧剂”组成的高强度体系加入后导热绝缘材料的结构存在破损和塌陷,导热系数有所下降;而加入活性稀释剂、相容剂、偶联剂、流平剂和混合氯化稀土后可以提高其与 导热绝缘材料基体的相容性,使导热绝缘材料的结构更规整,导热系数有所提高,导热系数达到7.5~7.9。综合结果显示,当本发明高强度体系的加入量为导热绝缘材料基体重量的3.2-3.4%时,导热绝缘材料的拉伸强度、弯曲强度、缺口冲击强度以及导热系数能达到一个平衡点,拉伸强度、弯曲强度、缺口冲击强度以及导热系数均较优。另外,实验结果显示,本发明高强度体系的加入还能有效改善导热绝缘材料的耐高温性能,耐热等级可达200-230℃;另外,还能有效提高导热绝缘材料的防静电性能,获得了意想不到的技术效果。综上所述,本发明通过加入高强度体系,可以提高导热绝缘材料的拉伸强度、弯曲强度、缺口冲击强度、导热系数、耐高温性能以及抗静电性能。The beneficial effects of the invention are that the thermally conductive insulating material provided by the invention has the advantages of high strength and good insulation performance. The experimental results show that the high-strength system of the present invention can effectively enhance the tensile strength, bending strength and notched impact strength of the thermally conductive insulating material, and the tensile strength of the thermally conductive insulating material of the present invention can be obtained when the high-strength system is added to the thermally conductive insulating material substrate. Increase by at least 1.5 times, increase bending strength by at least 1.3 times, increase notched impact strength by at least 1.3 times, tensile strength up to 95-98 MPa, flexural strength up to 120-128 MPa, and notched impact strength of 5.5-6 MPa. But "nano silica, ethoxylated alkylamine, methyl hydrogen silicone oil, hydroxy polydimethylsiloxane, vinyl trimethoxysilane, ammonium polyphosphate, chopped glass fiber, nano montmorillonite After the high-strength system consisting of fumed silica, γ-aminopropyltriethoxysilane, alkylphenol ethoxylate and toughening agent, the structure of the thermally conductive insulating material is damaged and collapsed, and the thermal conductivity is The addition of reactive diluents, compatibilizers, coupling agents, leveling agents and mixed rare earth chlorides can improve the compatibility with the thermally conductive insulating material matrix, and make the structure of the thermal conductive insulating material more regular, thermal conductivity Improved, thermal conductivity of 7.5 ~ 7.9. The comprehensive results show that when the high-strength system of the present invention is added in an amount of 3.2-3.4% of the weight of the thermally conductive insulating material, the tensile strength, bending strength, notched impact strength and thermal conductivity of the thermally conductive insulating material can reach an equilibrium point. The tensile strength, bending strength, notched impact strength and thermal conductivity are superior. In addition, the experimental results show that the addition of the high-strength system of the present invention can effectively improve the high temperature resistance of the thermal conductive insulating material, and the heat resistance grade can reach 200-230 ° C; in addition, the antistatic property of the thermal conductive insulating material can be effectively improved, and the obtained Unexpected technical effects. In summary, the present invention can improve the tensile strength, bending strength, notched impact strength, thermal conductivity, high temperature resistance and antistatic property of the thermally conductive insulating material by adding a high strength system.
具体实施方式detailed description
实施例1Example 1
本实施例是一种高强度导热绝缘材料,包括导热绝缘材料基体和高强度体系,高强度体系的加入量为导热绝缘材料重量的3.2%。This embodiment is a high-strength thermal conductive insulating material comprising a thermally conductive insulating material matrix and a high-strength system. The high-strength system is added in an amount of 3.2% by weight of the thermally conductive insulating material.
导热绝缘材料基体的重量份组分包括:氧化铝12.5份、氧化镁5.5份、碳化硅2.1份,硅烷偶联剂3.1份、硝酸钙2.4份、对苯二酚4.1份、乙酸镍3.8份、乙醇12份、环氧树脂14份、二甲基丙烯酰胺5.1份、偏硅酸钠2.2份、苯***6.1份。The parts by weight of the thermally conductive insulating material substrate include: 12.5 parts of alumina, 5.5 parts of magnesium oxide, 2.1 parts of silicon carbide, 3.1 parts of silane coupling agent, 2.4 parts of calcium nitrate, 4.1 parts of hydroquinone, 3.8 parts of nickel acetate, 12 parts of ethanol, 14 parts of epoxy resin, 5.1 parts of dimethyl acrylamide, 2.2 parts of sodium metasilicate, and 6.1 parts of benzotriazole.
高强度体系的重量份组分包括:纳米二氧化硅8.7份,乙氧基化烷基胺21份,甲基含氢硅油61份,羟基聚二甲基硅氧烷4.7份,乙烯基三甲氧基硅烷8.7份,聚磷酸铵2.5份,纳米蒙脱土3.2份,气相法白炭黑3.5份,γ-氨丙基三乙氧基硅烷2.6份,烷基酚聚氧乙烯醚5.1份,增韧剂1.7份,活性稀释剂1.1份,相容剂2.5份,偶联剂1.2份,流平剂1.1份,混合氯化稀土0.3份;纳米二氧化硅的粒径为20nm,纳米蒙脱土的粒径为20nm。The parts by weight of the high strength system include: 8.7 parts of nano silica, 21 parts of ethoxylated alkylamine, 61 parts of methyl hydrogen silicone oil, 4.7 parts of hydroxypolydimethylsiloxane, vinyl trimethoxy 8.7 parts of silane, 2.5 parts of ammonium polyphosphate, 3.2 parts of nano montmorillonite, 3.5 parts of fumed silica, 2.6 parts of γ-aminopropyltriethoxysilane, 5.1 parts of alkylphenol ethoxylate Toughener 1.7 parts, reactive diluent 1.1 parts, compatibilizer 2.5 parts, coupling agent 1.2 parts, leveling agent 1.1 parts, mixed rare earth chloride 0.3 parts; nano silica particle size 20nm, nano montmorillonite The particle size is 20 nm.
其中,增韧剂为苯乙烯-丁二烯热塑性弹性体;活性稀释剂为烷基缩水甘油醚;相容剂为马来酸酐接枝改性聚丙烯;偶联剂为乙烯基三丁酮肟基硅烷偶联剂;流平剂为异佛尔酮。Wherein the toughening agent is a styrene-butadiene thermoplastic elastomer; the reactive diluent is an alkyl glycidyl ether; the compatibilizing agent is a maleic anhydride graft modified polypropylene; and the coupling agent is vinyltributyl ketone oxime a silane coupling agent; the leveling agent is isophorone.
本发明高强度导热绝缘材料的制备方法为:The preparation method of the high-strength thermal conductive insulating material of the invention is:
㈠以设定的重量份,将氧化铝、氧化镁、碳化硅、硅烷偶联剂、硝酸钙、对苯二酚、乙酸镍、乙醇、环氧树脂、二甲基丙烯酰胺、偏硅酸钠、苯***加入搅拌机中,加热搅拌,冷却至室温;加热温度为40℃,搅拌速度为300rpm;(1) Alumina, magnesia, silicon carbide, silane coupling agent, calcium nitrate, hydroquinone, nickel acetate, ethanol, epoxy resin, dimethyl acrylamide, sodium metasilicate, in a set by weight , the benzotriazole is added to the mixer, heated and stirred, and cooled to room temperature; the heating temperature is 40 ° C, and the stirring speed is 300 rpm;
㈡按设定的重量份将高强度体系各组分进行加热搅拌混合均匀得到高强度体系;加热温度为85℃,搅拌速度为250rpm;(2) heating and stirring the components of the high-strength system according to the set weight parts to obtain a high-strength system; the heating temperature is 85 ° C, and the stirring speed is 250 rpm;
㈢将导热绝缘材料基体与高强度体系按设定的配比进行混合,在真空条件下加热搅拌,冷却至室温,固化,即得;真空度为0.08MPa,加热温度为50℃。(3) Mixing the base of the heat-conducting insulating material with the high-strength system according to the set ratio, heating and stirring under vacuum conditions, cooling to room temperature, and solidifying, that is, the vacuum degree is 0.08 MPa, and the heating temperature is 50 °C.
实施例2Example 2
本实施例是一种高强度导热绝缘材料,包括导热绝缘材料基体和高强度体系,高强度体系的加入量为导热绝缘材料重量的3.3%。This embodiment is a high-strength thermally conductive insulating material comprising a thermally conductive insulating material matrix and a high-strength system, and the high-strength system is added in an amount of 3.3% by weight of the thermally conductive insulating material.
导热绝缘材料基体的重量份组分包括:氧化铝12.6份、氧化镁5.6份、碳化硅2.2份,硅烷偶联剂3.2份、硝酸钙2.5份、对苯二酚4.2份、乙酸镍3.9份、乙醇13份、环氧树脂15份、二甲基丙烯酰胺5.2份、偏硅酸钠2.3份、苯***6.2份。The parts by weight of the thermally conductive insulating material substrate include: 12.6 parts of alumina, 5.6 parts of magnesium oxide, 2.2 parts of silicon carbide, 3.2 parts of silane coupling agent, 2.5 parts of calcium nitrate, 4.2 parts of hydroquinone, 3.9 parts of nickel acetate, 13 parts of ethanol, 15 parts of epoxy resin, 5.2 parts of dimethyl acrylamide, 2.3 parts of sodium metasilicate, and 6.2 parts of benzotriazole.
高强度体系的重量份组分包括:纳米二氧化硅8.8份,乙氧基化烷基胺22份,甲基含氢硅油62份,羟基聚二甲基硅氧烷4.8份,乙烯基三甲氧基硅烷8.8份,聚磷酸铵2.6份,纳米蒙脱土3.3份,气相法白炭黑3.6份,γ-氨丙基三乙氧基硅烷2.7份,烷基酚聚氧乙烯醚5.2份,增韧剂1.8份,活性稀释剂1.2份,相容剂2.6份,偶联剂1.3份,流平剂1.2份,混合氯化稀土0.4份;纳米二氧化硅的粒径为25nm,纳米蒙脱土的粒径为25nm。The parts by weight of the high strength system include: 8.8 parts of nano silica, 22 parts of ethoxylated alkylamine, 62 parts of methyl hydrogen silicone oil, 4.8 parts of hydroxypolydimethylsiloxane, vinyl trimethoxy 8.8 parts of silane, 2.6 parts of ammonium polyphosphate, 3.3 parts of nano montmorillonite, 3.6 parts of fumed silica, 2.7 parts of γ-aminopropyltriethoxysilane, 5.2 parts of alkylphenol ethoxylate 1.8 parts of toughener, 1.2 parts of reactive diluent, 2.6 parts of compatibilizer, 1.3 parts of coupling agent, 1.2 parts of leveling agent, mixed 0.4 parts of rare earth chloride; particle size of nano-silica is 25nm, nano-montmorillonite The particle size is 25 nm.
其中,增韧剂为氯化聚乙烯;活性稀释剂为辛葵酸缩水甘油酯;相容剂为马来酸酐接枝改性聚丙烯;偶联剂为甲基乙烯基二氯硅烷偶联剂;流平剂为二丙酮醇。Wherein, the toughening agent is chlorinated polyethylene; the reactive diluent is glycidyl octanoate; the compatibilizing agent is maleic anhydride graft modified polypropylene; the coupling agent is methyl vinyl dichlorosilane coupling agent The leveling agent is diacetone alcohol.
本发明高强度导热绝缘材料的制备方法为:The preparation method of the high-strength thermal conductive insulating material of the invention is:
㈠以设定的重量份,将氧化铝、氧化镁、碳化硅、硅烷偶联剂、硝酸钙、对苯二酚、乙酸镍、乙醇、环氧树脂、二甲基丙烯酰胺、偏硅酸钠、苯***加入搅拌机中,加热搅拌,冷却至室温;加热温度为50℃,搅拌速度为400rpm;(1) Alumina, magnesia, silicon carbide, silane coupling agent, calcium nitrate, hydroquinone, nickel acetate, ethanol, epoxy resin, dimethyl acrylamide, sodium metasilicate, in a set by weight , the benzotriazole is added to the mixer, heated and stirred, and cooled to room temperature; the heating temperature is 50 ° C, and the stirring speed is 400 rpm;
㈡按设定的重量份将高强度体系各组分进行加热搅拌混合均匀得到高强度体系;加热温度为86℃,搅拌速度为280rpm;(2) heating and stirring the components of the high-strength system according to the set weight parts to obtain a high-strength system; the heating temperature is 86 ° C, and the stirring speed is 280 rpm;
㈢将导热绝缘材料基体与高强度体系按设定的配比进行混合,在真空条件下加热搅拌,冷却至室温,固化,即得;真空度为0.09MPa,加热温度为60℃。(3) mixing the base of the heat-conductive insulating material and the high-strength system according to the set ratio, heating and stirring under vacuum conditions, cooling to room temperature, and solidifying, that is, the vacuum degree is 0.09 MPa, and the heating temperature is 60 °C.
实施例3Example 3
本实施例是一种高强度导热绝缘材料,包括导热绝缘材料基体和高强度体系,高强度体系的加入量为导热绝缘材料重量的3.4%。This embodiment is a high-strength thermally conductive insulating material comprising a thermally conductive insulating material matrix and a high-strength system. The high-strength system is added in an amount of 3.4% by weight of the thermally conductive insulating material.
导热绝缘材料基体的重量份组分包括:氧化铝12.7份、氧化镁5.7份、碳化硅2.3份, 硅烷偶联剂3.3份、硝酸钙2.6份、对苯二酚4.3份、乙酸镍4份、乙醇14份、环氧树脂16份、二甲基丙烯酰胺5.3份、偏硅酸钠2.4份、苯***6.3份。The parts by weight of the thermally conductive insulating material substrate include: 12.7 parts of alumina, 5.7 parts of magnesium oxide, 2.3 parts of silicon carbide, 3.3 parts of silane coupling agent, 2.6 parts of calcium nitrate, 4.3 parts of hydroquinone, 4 parts of nickel acetate, 14 parts of ethanol, 16 parts of epoxy resin, 5.3 parts of dimethyl acrylamide, 2.4 parts of sodium metasilicate, and 6.3 parts of benzotriazole.
高强度体系的重量份组分包括:纳米二氧化硅8.9份,乙氧基化烷基胺33份,甲基含氢硅油63份,羟基聚二甲基硅氧烷4.9份,乙烯基三甲氧基硅烷8.9份,聚磷酸铵2.7份,纳米蒙脱土3.4份,气相法白炭黑3.7份,γ-氨丙基三乙氧基硅烷2.8份,烷基酚聚氧乙烯醚5.3份,增韧剂1.9份,活性稀释剂1.3份,相容剂2.7份,偶联剂1.4份,流平剂1.3份,混合氯化稀土0.5份;纳米二氧化硅的粒径为30nm,纳米蒙脱土的粒径为30nm。The parts by weight of the high strength system include: 8.9 parts of nano silica, 33 parts of ethoxylated alkylamine, 63 parts of methyl hydrogen silicone oil, 4.9 parts of hydroxypolydimethylsiloxane, vinyl trimethoxy 8.7 parts of silane, 2.7 parts of ammonium polyphosphate, 3.4 parts of nano montmorillonite, 3.7 parts of fumed silica, 2.8 parts of γ-aminopropyltriethoxysilane, 5.3 parts of alkylphenol ethoxylate Toughener 1.9 parts, reactive diluent 1.3 parts, compatibilizer 2.7 parts, coupling agent 1.4 parts, leveling agent 1.3 parts, mixed rare earth chloride 0.5 parts; nano silica particle size 30nm, nano montmorillonite The particle size is 30 nm.
其中,增韧剂为乙烯-醋酸乙烯酯共聚物;活性稀释剂为三羟甲基丙烷三缩水甘油醚;相容剂为马来酸酐接枝改性聚丙烯;偶联剂为甲基三丁酮肟基硅烷偶联剂;流平剂为聚二甲基硅氧烷。Wherein the toughening agent is an ethylene-vinyl acetate copolymer; the reactive diluent is trimethylolpropane triglycidyl ether; the compatibilizing agent is maleic anhydride graft modified polypropylene; the coupling agent is methyl tributyl Keto mercapto silane coupling agent; leveling agent is polydimethylsiloxane.
本发明高强度导热绝缘材料的制备方法为:The preparation method of the high-strength thermal conductive insulating material of the invention is:
㈠以设定的重量份,将氧化铝、氧化镁、碳化硅、硅烷偶联剂、硝酸钙、对苯二酚、乙酸镍、乙醇、环氧树脂、二甲基丙烯酰胺、偏硅酸钠、苯***加入搅拌机中,加热搅拌,冷却至室温;加热温度为60℃,搅拌速度为500rpm;(1) Alumina, magnesia, silicon carbide, silane coupling agent, calcium nitrate, hydroquinone, nickel acetate, ethanol, epoxy resin, dimethyl acrylamide, sodium metasilicate, in a set by weight , the benzotriazole is added to the mixer, heated and stirred, and cooled to room temperature; the heating temperature is 60 ° C, and the stirring speed is 500 rpm;
㈡按设定的重量份将高强度体系各组分进行加热搅拌混合均匀得到高强度体系;加热温度为87℃,搅拌速度为300rpm;(2) heating and stirring the components of the high-strength system according to the set weight parts to obtain a high-strength system; the heating temperature is 87 ° C, and the stirring speed is 300 rpm;
㈢将导热绝缘材料基体与高强度体系按设定的配比进行混合,在真空条件下加热搅拌,冷却至室温,固化,即得;真空度为0.1MPa,加热温度为70℃。(3) Mixing the heat conductive insulating material substrate with the high strength system according to the set ratio, heating and stirring under vacuum conditions, cooling to room temperature, and solidifying, that is, the vacuum degree is 0.1 MPa, and the heating temperature is 70 °C.
将实施例1-5所得材料进行性能测试,结果如下:The materials obtained in Examples 1-5 were subjected to performance tests, and the results were as follows:
Figure PCTCN2017115070-appb-000001
Figure PCTCN2017115070-appb-000001
除上述实施例外,本发明还可以有其他实施方式。凡采用等同替换或等效变换形成的技术方案,均落在本发明要求的保护范围。Other than the above-described embodiments, the present invention may have other embodiments. Any technical solution formed by equivalent replacement or equivalent transformation falls within the protection scope of the present invention.

Claims (5)

  1. 一种高强度导热绝缘材料,其特征在于:包括导热绝缘材料基体和高强度体系,所述高强度体系的加入量为所述导热绝缘材料重量的3.2-3.4%;A high-strength thermal conductive insulating material, comprising: a thermally conductive insulating material base and a high-strength system, wherein the high-strength system is added in an amount of 3.2-3.4% by weight of the thermally conductive insulating material;
    所述导热绝缘材料基体的重量份组分包括:氧化铝12.5-12.7份、氧化镁5.5-5.7份、碳化硅2.1-2.3份,硅烷偶联剂3.1-3.3份、硝酸钙2.4-2.6份、对苯二酚4.1-4.3份、乙酸镍3.8-4份、乙醇12-14份、环氧树脂14-16份、二甲基丙烯酰胺5.1-5.3份、偏硅酸钠2.2-2.4份、苯***6.1-6.3份;The parts by weight of the thermally conductive insulating material matrix comprises: 12.5-12.7 parts of alumina, 5.5-5.7 parts of magnesium oxide, 2.1-2.3 parts of silicon carbide, 3.1-3.3 parts of silane coupling agent, 2.4-2.6 parts of calcium nitrate, 4.1-4.3 parts of hydroquinone, 3.8-4 parts of nickel acetate, 12-14 parts of ethanol, 14-16 parts of epoxy resin, 5.1-5.3 parts of dimethyl acrylamide, 2.2-2.4 parts of sodium metasilicate, benzene Triazole 6.1-6.3 parts;
    所述高强度体系的重量份组分包括:纳米二氧化硅8.7-8.9份,乙氧基化烷基胺21-33份,甲基含氢硅油61-63份,羟基聚二甲基硅氧烷4.7-4.9份,乙烯基三甲氧基硅烷8.7-8.9份,聚磷酸铵2.5-2.7份,纳米蒙脱土3.2-3.4份,气相法白炭黑3.5-3.7份,γ-氨丙基三乙氧基硅烷2.6-2.8份,烷基酚聚氧乙烯醚5.1-5.3份,增韧剂1.7-1.9份,活性稀释剂1.1-1.3份,相容剂2.5-2.7份,偶联剂1.2-1.4份,流平剂1.1-1.3份,混合氯化稀土0.3-0.5份;所述的纳米二氧化硅的粒径为20-30nm,所述的纳米蒙脱土的粒径为20-30nm。The parts by weight of the high-strength system include: 8.7-8.9 parts of nano-silica, 21-33 parts of ethoxylated alkylamine, 61-63 parts of methyl-containing hydrogen silicone oil, hydroxypolydimethylsiloxane 4.7-4.9 parts of alkane, 8.7-8.9 parts of vinyltrimethoxysilane, 2.5-2.7 parts of ammonium polyphosphate, 3.2-3.4 parts of nano-montmorillonite, 3.5-3.7 parts of fumed silica, γ-aminopropyl three 2.6-2.8 parts of ethoxysilane, 5.1-5.3 parts of alkylphenol ethoxylate, 1.7-1.9 parts of toughening agent, 1.1-1.3 parts of reactive diluent, 2.5-2.7 parts of compatibilizer, 1.2-2.7 coupling agent 1.4 parts, leveling agent 1.1-1.3 parts, mixed rare earth chloride 0.3-0.5 parts; said nano-silica has a particle diameter of 20-30 nm, and said nano-montmorillonite has a particle diameter of 20-30 nm.
  2. 如权利要求1所述的高强度导热绝缘材料,其特征在于:所述增韧剂为苯乙烯-丁二烯热塑性弹性体、氯化聚乙烯或乙烯-醋酸乙烯酯共聚物中的一种或一种以上混合物;所述活性稀释剂为烷基缩水甘油醚、辛葵酸缩水甘油酯、三羟甲基丙烷三缩水甘油醚、甲苯缩水甘油醚、蓖麻油多缩水甘油醚中的一种或一种以上混合物;所述相容剂为马来酸酐接枝改性聚丙烯;所述偶联剂为乙烯基三丁酮肟基硅烷偶联剂、甲基乙烯基二氯硅烷偶联剂、甲基三丁酮肟基硅烷偶联剂中的一种或一种以上混合物;所述流平剂为异佛尔酮、二丙酮醇、氟改性丙烯酸、磷酸酯改性丙烯酸、丙烯酸、聚二甲基硅氧烷、聚甲基烷基硅氧烷、有机改性聚硅氧烷中的一种或一种以上混合物。The high-strength thermally conductive insulating material according to claim 1, wherein the toughening agent is one of a styrene-butadiene thermoplastic elastomer, a chlorinated polyethylene or an ethylene-vinyl acetate copolymer. More than one mixture; the reactive diluent is one of alkyl glycidyl ether, glycidyl octanoate, trimethylolpropane triglycidyl ether, toluene glycidyl ether, castor oil polyglycidyl ether or a mixture of more than one; the compatibilizing agent is a maleic anhydride graft-modified polypropylene; the coupling agent is a vinyltributyl ketone-based silane coupling agent, a methylvinyldichlorosilane coupling agent, One or more mixtures of methyl tributyl ketone silane coupling agents; the leveling agent is isophorone, diacetone alcohol, fluorine modified acrylic acid, phosphate modified acrylic acid, acrylic acid, poly One or more mixtures of dimethylsiloxane, polymethylalkylsiloxane, organomodified polysiloxane.
  3. 如权利要求1或2所述的高强度导热绝缘材料,其特征在于:包括导热绝缘材料基体和高强度体系,所述高强度体系的加入量为所述导热绝缘材料重量的3.2%;The high-strength thermally conductive insulating material according to claim 1 or 2, comprising: a thermally conductive insulating material substrate and a high-strength system, wherein the high-strength system is added in an amount of 3.2% by weight of the thermally conductive insulating material;
    所述导热绝缘材料基体的重量份组分包括:氧化铝12.5份、氧化镁5.5份、碳化硅2.1份,硅烷偶联剂3.1份、硝酸钙2.4份、对苯二酚4.1份、乙酸镍3.8份、乙醇12份、环氧树脂14份、二甲基丙烯酰胺5.1份、偏硅酸钠2.2份、苯***6.1份;The parts by weight of the thermally conductive insulating material substrate include: 12.5 parts of alumina, 5.5 parts of magnesium oxide, 2.1 parts of silicon carbide, 3.1 parts of silane coupling agent, 2.4 parts of calcium nitrate, 4.1 parts of hydroquinone, and 3.8 of nickel acetate. a portion, 12 parts of ethanol, 14 parts of epoxy resin, 5.1 parts of dimethyl acrylamide, 2.2 parts of sodium metasilicate, and 6.1 parts of benzotriazole;
    所述高强度体系的重量份组分包括:纳米二氧化硅8.7份,乙氧基化烷基胺21份,甲基含氢硅油61份,羟基聚二甲基硅氧烷4.7份,乙烯基三甲氧基硅烷8.7份,聚磷酸铵2.5份,纳米蒙脱土3.2份,气相法白炭黑3.5份,γ-氨丙基三乙氧基硅烷2.6份,烷基酚聚氧乙烯醚5.1份,增韧剂1.7份,活性稀释剂1.1份,相容剂2.5份,偶联剂1.2份,流平剂1.1 份,混合氯化稀土0.3份;所述的纳米二氧化硅的粒径为20nm,所述的纳米蒙脱土的粒径为20nm。The parts by weight of the high-strength system include: 8.7 parts of nano-silica, 21 parts of ethoxylated alkylamine, 61 parts of methyl-containing silicone oil, 4.7 parts of hydroxypolydimethylsiloxane, vinyl 8.7 parts of trimethoxysilane, 2.5 parts of ammonium polyphosphate, 3.2 parts of nano-montmorillonite, 3.5 parts of fumed silica, 2.6 parts of γ-aminopropyltriethoxysilane, 5.1 parts of alkylphenol ethoxylate , 1.7 parts of toughening agent, 1.1 parts of reactive diluent, 2.5 parts of compatibilizer, 1.2 parts of coupling agent, 1.1 parts of leveling agent, 0.3 parts of mixed rare earth chloride; the particle size of the nano-silica is 20 nm The nano montmorillonite has a particle diameter of 20 nm.
  4. 如权利要求1或2所述的高强度导热绝缘材料,其特征在于:包括导热绝缘材料基体和高强度体系,所述高强度体系的加入量为所述导热绝缘材料重量的3.3%;The high-strength thermally conductive insulating material according to claim 1 or 2, comprising: a thermally conductive insulating material substrate and a high-strength system, wherein the high-strength system is added in an amount of 3.3% by weight of the thermally conductive insulating material;
    所述导热绝缘材料基体的重量份组分包括:氧化铝12.6份、氧化镁5.6份、碳化硅2.2份,硅烷偶联剂3.2份、硝酸钙2.5份、对苯二酚4.2份、乙酸镍3.9份、乙醇13份、环氧树脂15份、二甲基丙烯酰胺5.2份、偏硅酸钠2.3份、苯***6.2份;The parts by weight of the thermally conductive insulating material matrix comprises: 12.6 parts of alumina, 5.6 parts of magnesium oxide, 2.2 parts of silicon carbide, 3.2 parts of a silane coupling agent, 2.5 parts of calcium nitrate, 4.2 parts of hydroquinone, and 3.9 of nickel acetate. Parts, 13 parts of ethanol, 15 parts of epoxy resin, 5.2 parts of dimethyl acrylamide, 2.3 parts of sodium metasilicate, 6.2 parts of benzotriazole;
    所述高强度体系的重量份组分包括:纳米二氧化硅8.8份,乙氧基化烷基胺22份,甲基含氢硅油62份,羟基聚二甲基硅氧烷4.8份,乙烯基三甲氧基硅烷8.8份,聚磷酸铵2.6份,纳米蒙脱土3.3份,气相法白炭黑3.6份,γ-氨丙基三乙氧基硅烷2.7份,烷基酚聚氧乙烯醚5.2份,增韧剂1.8份,活性稀释剂1.2份,相容剂2.6份,偶联剂1.3份,流平剂1.2份,混合氯化稀土0.4份;所述的纳米二氧化硅的粒径为25nm,所述的纳米蒙脱土的粒径为25nm。The parts by weight of the high-strength system include: 8.8 parts of nano-silica, 22 parts of ethoxylated alkylamine, 62 parts of methyl-containing silicone oil, 4.8 parts of hydroxypolydimethylsiloxane, vinyl 8.8 parts of trimethoxysilane, 2.6 parts of ammonium polyphosphate, 3.3 parts of nano montmorillonite, 3.6 parts of fumed silica, 2.7 parts of γ-aminopropyltriethoxysilane, 5.2 parts of alkylphenol ethoxylate , 1.8 parts of toughening agent, 1.2 parts of reactive diluent, 2.6 parts of compatibilizer, 1.3 parts of coupling agent, 1.2 parts of leveling agent, mixed 0.4 parts of rare earth chloride; the particle size of the nano silica is 25 nm The nano montmorillonite has a particle size of 25 nm.
  5. 如权利要求1或2所述的高强度导热绝缘材料,其特征在于:包括导热绝缘材料基体和高强度体系,所述高强度体系的加入量为所述导热绝缘材料重量的3.4%;The high-strength thermally conductive insulating material according to claim 1 or 2, comprising: a thermally conductive insulating material substrate and a high-strength system, wherein the high-strength system is added in an amount of 3.4% by weight of the thermally conductive insulating material;
    所述导热绝缘材料基体的重量份组分包括:氧化铝12.7份、氧化镁5.7份、碳化硅2.3份,硅烷偶联剂3.3份、硝酸钙2.6份、对苯二酚4.3份、乙酸镍4份、乙醇14份、环氧树脂16份、二甲基丙烯酰胺5.3份、偏硅酸钠2.4份、苯***6.3份;The parts by weight of the thermally conductive insulating material matrix comprises: 12.7 parts of alumina, 5.7 parts of magnesium oxide, 2.3 parts of silicon carbide, 3.3 parts of silane coupling agent, 2.6 parts of calcium nitrate, 4.3 parts of hydroquinone, nickel acetate 4 Parts, 14 parts of ethanol, 16 parts of epoxy resin, 5.3 parts of dimethyl acrylamide, 2.4 parts of sodium metasilicate, 6.3 parts of benzotriazole;
    所述高强度体系的重量份组分包括:纳米二氧化硅8.9份,乙氧基化烷基胺33份,甲基含氢硅油63份,羟基聚二甲基硅氧烷4.9份,乙烯基三甲氧基硅烷8.9份,聚磷酸铵2.7份,纳米蒙脱土3.4份,气相法白炭黑3.7份,γ-氨丙基三乙氧基硅烷2.8份,烷基酚聚氧乙烯醚5.3份,增韧剂1.9份,活性稀释剂1.3份,相容剂2.7份,偶联剂1.4份,流平剂1.3份,混合氯化稀土0.5份;所述的纳米二氧化硅的粒径为30nm,所述的纳米蒙脱土的粒径为30nm。The parts by weight of the high-strength system include: 8.9 parts of nano-silica, 33 parts of ethoxylated alkylamine, 63 parts of methyl-containing silicone oil, 4.9 parts of hydroxypolydimethylsiloxane, vinyl 8.9 parts of trimethoxysilane, 2.7 parts of ammonium polyphosphate, 3.4 parts of nano montmorillonite, 3.7 parts of fumed silica, 2.8 parts of γ-aminopropyltriethoxysilane, 5.3 parts of alkylphenol ethoxylate , 1.9 parts of toughening agent, 1.3 parts of reactive diluent, 2.7 parts of compatibilizer, 1.4 parts of coupling agent, 1.3 parts of leveling agent, mixed 0.5 parts of rare earth chloride; the particle size of the nano-silica is 30 nm The nano montmorillonite has a particle diameter of 30 nm.
PCT/CN2017/115070 2016-12-13 2017-12-07 High-strength thermally conductive insulation material WO2018108028A1 (en)

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